DIGITIMES news archive

Total: 1,181 items

China's chip equipment makers ride record AI orders into 2027, but new challenges lie ahead

Friday 6 November 2026

Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic manufacturing tools. The...

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V5 Technologies posts 69.7% revenue growth in first 10 months

Friday 6 November 2026

V5 Technologies, a major provider of advanced semiconductor optical inspection and image-processing software, reported consolidated revenue of NT$316 million (US$9.61 million) in October 2026, up 1.67% from September...

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revenue growth equipment inspection software

Murata, Samsung Electro-Mechanics reportedly secure Winbond's silicon capacitor capacity

Thursday 5 November 2026

Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity from Winbond Electronics to meet demand from their end customers, as the Taiwanese memory maker...

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Murata silicon Semco Winbond capacitor

Former Intel packaging chief Navid Shahriari joins MediaTek as senior vice president

Wednesday 4 November 2026

MediaTek announced that Navid Shahriari will join the company on November 9 as Senior Vice President, reporting to the General Manager and Chief Operating Officer.

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MediaTek packaging Intel data center manufacturing

AI demand, resin shock stretch India PCB shortage into 2027

Tuesday 3 November 2026

The printed circuit board (PCB) shortage that Indian electronics makers expect to worsen in the coming months is part of a global squeeze. AI servers are absorbing high-end laminate, glass fiber cloth, and Ajinomoto...

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PCB 2027 demand electronics capacity

Samsung's Lee bets on Japan for AI chip packaging edge

Monday 2 November 2026

Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to...

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Samsung chairman Japan AI chip packaging materials

Ibiden expands AI packaging substrate capacity for Intel from 2029

Saturday 31 October 2026

Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to JPY565 billion. The company also...

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Ibiden substrate packaging 2026 capacity

Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030

Friday 30 October 2026

Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as next-generation AI accelerators ramp...

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Nvidia FC-BGA substrate capacity 2030

ASE expects packaging and testing margins to stay above 30%

Friday 30 October 2026

ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the company move beyond the profitability...

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ASE packaging testing revenue business

Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level

Friday 30 October 2026

Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually dense electronics manufacturing...

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Taiwan manufacturing TSMC labor packaging

GlobalFoundries bets on FD-SOI for robots and cars

Friday 30 October 2026

GlobalFoundries (GF) is betting on specialty semiconductor technologies to capture AI demand beyond advanced processors, targeting opportunities in data center connectivity, power management, automotive electronics and...

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GlobalFoundries FD-SOI data manufacturing president

Skymizer partners with Egis to develop 12nm and 6nm AI accelerators

Wednesday 28 October 2026

Taiwanese startup Skymizer has formally announced a strategic partnership with Egis Technology to develop Flow (T12), a new-generation AI inference chip. Fabricated on TSMC's 12nm node and paired with LPDDR5 memory, the...

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Skymizer startup 12nm 6nm EgisTec

Server CPU shipments to exceed 50 million units in 2027; AMD's server CPU revenue will surpass Intel

Tuesday 27 October 2026

.... TSMC's monthly CoWoS capacity will expand from about 130,000 wafers in the fourth quarter of 2026 to 220,000 wafers...

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AI server CPU shipments 2027 Intel AMD Arm architecture

TSMC advances CoPoS packaging at Taoyuan Longtan site

Friday 23 October 2026

TSMC's Longtan Science Park Phase 3 in Taoyuan is restarting after nearly three years of delays, with Taiwan's National Development Council approving its development plan on September 17, 2026. The 104.65-hectare site...

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TSMC packaging Southern Taiwan Science Park capacity National Development Council

SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

Friday 23 October 2026

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal...

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SK Hynix cooling production materials equipment

Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains

Thursday 22 October 2026

Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product development cycles and...

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Unimicron PCB demand capacity

2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B

Thursday 22 October 2026

The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in orders as it joins the supply chains...

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expansion packaging demand 2026 business

PCB material shortages persist as capacity expansion extends beyond 2029

Wednesday 21 October 2026

Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering an open-ended shortage of...

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PCB materials capacity expansion HPC CCL

AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP

Wednesday 21 October 2026

Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy efficiency. Advancing process nodes...

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performance 3D TSMC demand design

Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking

Wednesday 21 October 2026

AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts to shorten the distance between...

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HBM 3D bandwidth data performance

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