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Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026
Google weighs Samsung's role in next AI chip as TSMC capacity tightens
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply...
Friday 12 June 2026
Taiwan OSAT firms gain from AI chip demand and foundry spillover
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
Wednesday 10 June 2026
Taiwan reportedly weighs tougher AI chip export curbs as US lawmakers push for tighter China controls
Taiwan is considering significantly tougher restrictions on exports of advanced AI chips to China, a move that would bring the island's regulations closer to those of the US and strengthen...
Tuesday 9 June 2026
Tencent takes dual-track AI chip route with Canghai V2 and domestic partnerships
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
Cooling parts maker Global PMX wins AI server liquid-cooling supply and expects high-margin shipments in second half
Automotive power and safety parts manufacturer Global PMX said it secured placements in the supply chains of leading AI chip and rack makers and expected a wave of high-margin liquid-cooling...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron,...
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
Tuesday 2 June 2026
TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
Tuesday 2 June 2026
Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration
Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...