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NEWS TAGGED MURATA
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Monday 2 August 2021
TSMC, Amkor to process IPD chips for new Apple devices
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
Friday 25 June 2021
Zhen Ding, Flexium enjoy strong Apple orders for antenna modules
Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
Tuesday 25 May 2021
Murata, Cooler Master announce ultra-thin vapor chamber
Murata Manufacturing and Cooler Master have jointly developed a vapor chamber with thickness of only 200um for electronics devices.
Wednesday 24 February 2021
High-capacitance MLCC prices set to rise
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
Thursday 14 January 2021
Fire strikes Walsin MLCC plant in China
A fire broke out at Taiwanese passive component maker Walsin Technology's factory site in Dongguan, China on January 13, but the company estimates no material impact from the accid...
Friday 8 January 2021
Chilisin sees order visibility for molding chokes extended
Chilisin Electronics has seen order visibility for molding chokes extended to more than four months, and is also expected to ramp up its shipments of LTCC (low temperature co-fired...
Thursday 19 November 2020
Apple may rely more on Taiwan PCB suppliers in 2021
Apple is expected to ramp up flexible PCB (FPCB) demand for its 2021 devices, and is looking to work more closely with its Taiwan-based suppliers including Zhen Ding Technology, Compeq...
Wednesday 18 November 2020
LTCC device maker ACX to ready new capacity in 3Q21
Advanced Ceramic X (ACX), which specializes in LTCC (low-temperature co-fired ceramic) modules, has disclosed plans to build additional capacity that will come online in the third...
Thursday 3 September 2020
New iPhones to stoke demand for LCP FPCB modules
Demand for LCP (liquid crystal polymer)-based flexible PCBs is expected to pick up significantly as they will be featured in 5G iPhones' mmWave antenna modules and in other high-speed...
Tuesday 7 April 2020
Taiwan MLCC, resistor makers see mostly orders with short lead time
Taiwan-based passive component makers have landed mostly short lead time orders recently from clients seeking to replenish their inventory, with order visibility clear just one month...
Thursday 27 February 2020
Yageo sees MLCC, chip resistor inventory hit 10-year low
Passive components maker Yageo has seen its inventory for MLCCs and chip resistors hit the lowest levels in nearly 10 years and will properly raise prices to reflect increased costs,...
Tuesday 25 February 2020
Taiwan flexible PCB firms aggressive in 5G antenna deployments
Taiwan-based flexible PCB makers including Flexium Interconnect and Career Technology continue to step up their deployments in the 5G antenna board segment with optimism that market...
Tuesday 25 February 2020
MLCC, chip resistor prices set to rise through 2020
Prices for MLCCs and chip resistors are expected to rise through the fourth quarter of 2020 as supply will increasingly fall short of demand for 5G applications while fallouts of...
Friday 21 February 2020
USI may enter backend supply chain of AirPods Pro series
Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...