Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product...
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
Infineon Technologies has lined up 8-inch silicon carbide (SiC) wafers from Wolfspeed under an expanded and extended long-term supply agreement. The deal gives the German chipmaker...
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
