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Wednesday 1 October 2025
China's 12-inch SiC leap: SICC, Jingsheng in spotlight
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
Sunday 28 September 2025
Taiwan's E-Chem expands footprint in semiconductor chemicals, targets global growth

As global demand for advanced semiconductor packaging surges, Taiwanese specialty chemicals and materials maker E-Chem is investing aggressively...

Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...
Thursday 18 September 2025
Hanwha E-ssential challenges Ajinomoto's ABF monopoly with 2026 launch
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Thursday 11 September 2025
Beijing's barriers fail to deter China's SiC players from risky push into 8-inch wafer race
China's SiC industry, once viewed as a critical front in global tech rivalry, has been transformed over the past two years. Breakthroughs in domestic SiC materials and mass production...
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivot
In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns...
Thursday 4 September 2025
Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy
Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling...
Friday 29 August 2025
Niching's AI-driven cooling technology drives revenue surge amid advanced packaging shifts
On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
Tuesday 26 August 2025
Taiwan Glass enters AI server supply chain amid transformation challenges
Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to...
Monday 25 August 2025
Intel shifts glass substrate strategy, from would-be rival to potential buyer
Intel is reportedly preparing to license its glass core substrate (GCS) technology, reversing course from its earlier plan to commercialize the technology in-house. The pivot could...
Thursday 14 August 2025
China's leading SiC epitaxy plants see quarterly order surge, signaling market bottom
China's SiC industry faces oversupply as 6-inch substrate prices plunge, prompting a strategic pivot to 8-inch wafers
Monday 11 August 2025
Phison Electronics reports record July revenue despite substrate shortage
Phison Electronics announced consolidated revenue of NT$5.688 billion (approx. US$191 million) for July 2025, representing a 21% increase compared to July 2024 and setting a new high...
Thursday 7 August 2025
AP Memory optimistic on IoTRAM and IPC growth despite FX losses
Memory IC design house AP Memory reported a net loss for the second quarter of 2025, due to approximately NT$980 million (US$32.7 million) in foreign exchange losses caused by the...
Wednesday 30 July 2025
From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Monday 21 July 2025
AI server growth lifts ABF market, while BT substrates struggle with supply constraints

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain...