Soaring demand for AI servers has propelled Taiwan's ABF substrate leaders—Unimicron Technology, Kinsus Interconnect Technology, and Nan Ya PCB—to double-digit annual...
In response to the impact of reciprocal tariffs imposed by the United States, PCB, and substrate equipment manufacturer Group Up stated that its product exports to the US are relatively...
Nvidia's high-end AI server, the GB200, is facing challenges due to technical bottlenecks and material supply issues. Industry sources report that key materials used for chip substrates...
The Japan Innovation Network (JIC) has completed the tender offer for shares of Shinko Electric Industries, a Fujitsu subsidiary specializing in IC substrates, and the company is...
Tong Hsing Electronic, a semiconductor packaging service and substrate provider, has forecast a mid single-digit quarter-over-quarter decline in revenue for the first quarter of 2025...
PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic semiconductor packaging. This development follows PanelSemi's...
AI-powered applications reshaped the electronics manufacturing landscape in 2024, driving a resurgence for Taiwan’s leading IC substrate makers. Unimicron, Kinsus, and Zhen...
Leading OSAT firm ASE has teamed up with leading substrate makers, major AI server manufacturer Pegatron, and others to develop an AI visual inspection system, aimed at accelerating...
Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's...
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products...
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
