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    Analysis: Meta's US$10B Google Cloud deal highlights reliance amid chip and AI struggles
    2min ago
    NEWS TAGGED SUBSTRATE
    Tuesday 26 August 2025
    Taiwan Glass enters AI server supply chain amid transformation challenges
    Traditional glass manufacturer Taiwan Glass has invested its resources in AI fiberglass cloth, successfully transforming and penetrating the AI server supply chain led by Nvidia to...
    Monday 25 August 2025
    Intel shifts glass substrate strategy, from would-be rival to potential buyer
    Intel is reportedly preparing to license its glass core substrate (GCS) technology, reversing course from its earlier plan to commercialize the technology in-house. The pivot could...
    Thursday 14 August 2025
    China's leading SiC epitaxy plants see quarterly order surge, signaling market bottom
    China's SiC industry faces oversupply as 6-inch substrate prices plunge, prompting a strategic pivot to 8-inch wafers
    Monday 11 August 2025
    Phison Electronics reports record July revenue despite substrate shortage
    Phison Electronics announced consolidated revenue of NT$5.688 billion (approx. US$191 million) for July 2025, representing a 21% increase compared to July 2024 and setting a new high...
    Thursday 7 August 2025
    AP Memory optimistic on IoTRAM and IPC growth despite FX losses
    Memory IC design house AP Memory reported a net loss for the second quarter of 2025, due to approximately NT$980 million (US$32.7 million) in foreign exchange losses caused by the...
    Wednesday 30 July 2025
    From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
    As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
    Monday 21 July 2025
    AI server growth lifts ABF market, while BT substrates struggle with supply constraints

    A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain...

    Saturday 19 July 2025
    Nvidia explores SOCAMM deployment for next-gen AI systems
    Nvidia is reportedly preparing to enter a new phase in the memory market by planning to deploy between 600,000 and 800,000 SOCAMM modules in 2025. This initiative positions SOCAMM...
    Wednesday 9 July 2025
    T-Glass shortage chokes CoWoS substrate supply, Nittobo delays ramp-up
    Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
    Friday 27 June 2025
    Niching sees strong growth ahead as AI boosts demand for advanced packaging
    As artificial intelligence continues to accelerate the adoption of advanced semiconductor packaging, Taiwan-based materials supplier Niching is riding a wave of momentum. The company...
    Friday 27 June 2025
    Race for T-Glass heats up as AI giants lock in supply from Japan's Nittobo amid mounting shortages
    Senior executives from Nvidia, AMD, and Microsoft have frequently visited Japanese manufacturer Nitto Boseki to secure a critical raw material for AI servers: low coefficient of thermal...
    Tuesday 24 June 2025
    Aurona Industries anticipates sales growth except for China
    Aurona Industries, a PCB substrate manufacturer, reported a 1.2% revenue growth in May, driven by higher orders from the electronics industry following a temporary US tariff grace...
    Monday 23 June 2025
    NAND flash prices to stay high in 2H25 with substrate shortage to hit soon, says Phison CEO

    Strong demand in the memory market is expected to keep NAND Flash prices at elevated levels in the second half of 2025, according to...

    Friday 20 June 2025
    Unimicron bets on AI boom as substrate demand set to surge

    Unimicron, a leading manufacturer of IC substrates, is gearing up for the strong rebound in 2025, driven by surging demand for high-end...

    Thursday 19 June 2025
    BOE ventures into advanced packaging with glass substrate pilot production line
    BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
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    SpecialReports
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    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES