Energy Taiwan 2026 opened on October 14, bringing together more than 430 exhibitors across nearly 1,400 booths as the island seeks to strengthen energy resilience and accelerate decarbonization...
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses...
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year...
Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg...
Ubiqconn Technology reported September 2026 consolidated revenue of NT$142 million (US$4.4 million), up 32.4% month-on-month and 6.7% year-on-year. Third-quarter revenue rose 9.6%...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Microsoft's lease commitments that have not yet commenced reached US$329.1 billion in the fourth quarter of fiscal 2026, which ended in June, according to its latest regulatory filing...
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure...
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
The AI accelerator market is set to reach US$1.4 trillion by 2030, up 150% from Bloomberg Intelligence's January 2026 estimate of US$560 billion, as higher prices—not just shipment...
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
