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NEWS TAGGED 2026
Friday 16 October 2026
Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue
Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
Friday 16 October 2026
Myson Century signs 3 AUSA MOUs for defense expansion
Myson Century, a subsidiary of Sun Yad Group, signed strategic memorandums of understanding with IXI EW, SafeSky Systems USA, and Global Ordnance Group at the Association of the United...
Friday 16 October 2026
LCD TV panel prices struggle to rise in 4Q26
LCD TV panel prices face a tug-of-war in the fourth quarter of 2026 as panel makers push for increases while LCD TV brands maintain relatively steady purchasing and contract manufacturers...
Friday 16 October 2026
Taiwan's Chun Yuan Steel sees 4Q26 auto surge, expands into AI robotics
Chun Yuan Steel expects Taiwan's auto market to deliver its strongest quarter of 2026 in the final three months, lifting full-year new-vehicle sales to 430,000 units from 411,000 in...
Friday 16 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market...
Friday 16 October 2026
Japan bets on physical AI as Murata, AWS, Hitachi showcase self-learning robots at CEATEC 2026
Japan is stepping up its push into physical AI, with major technology companies and research institutions showcasing advances in autonomous robot learning, motion sensing, and agricultural...
Friday 16 October 2026
LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
Friday 16 October 2026
AI buyers lock in capacity, driving Taiwan private investment to record NT$6.95T
Strong global demand for AI infrastructure hardware is prompting buyers to secure capacity through advance payments and long-term contracts, driving Taiwan's semiconductor, packaging...
Friday 16 October 2026
US pushes AI exports as chip industry flags supplier gaps and reshoring costs
At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made...
Friday 16 October 2026
Hyundai Motor Group plans US$15.5 billion India investment from 2026
Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic...
Friday 16 October 2026
TSMC details pricing, confirms agentic AI boosts CPU demand
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
Friday 16 October 2026
Tong Yang sees stronger 4Q26 margins, but shipping, costs remain risks
Tong Yang Industry expects capacity utilization to reach 90%–95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal...
Friday 16 October 2026
AI traffic reshapes e-commerce as Shopline GMV rises 20% in 2026
As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform...
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Friday 16 October 2026
Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...