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    China's optical supply chain gains ground in smart glasses
    7h 3min ago
    Exclusive: China's CAS microelectronics institute unveils DUV-based 3nm GAA development path
    7h 3min ago
    Samsung expands SRAM and IP support as memory shortages reshape chip design
    7h 3min ago
    AMD shifts China strategy from chips to developer ecosystems as Nvidia retreats
    7h 3min ago
    SK Hynix passes new performance bonus plan with cash and stock split evenly
    7h 3min ago
    NEWS TAGGED 2026
    Thursday 17 September 2026
    TSMC's C.C. Wei says to solve problems, put customers first
    TSMC chairman C.C. Wei and co-COO Y.J. Mii joined a forum on September 15, 2026, where Wei shared lessons from school, R&D and corporate management with National Taiwan University...
    Thursday 17 September 2026
    Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

    Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being...

    Thursday 17 September 2026
    Charts: Memory chip designers carry Taiwan's IC design rebound
    Taiwan's IC design sector is growing fast, but the gains are concentrated in memory. Combined January–August 2026 revenue at the 105 listed chip designers tracked by DIGITIMES...
    Wednesday 16 September 2026
    Samsung advances jump 70% amid shift to long-term memory deals

    Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers...

    Wednesday 16 September 2026
    DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

    DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

    Wednesday 16 September 2026
    Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
    Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the...
    Wednesday 16 September 2026
    Samsung Exynos regains share as Galaxy phones test 2nm

    Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

    Wednesday 16 September 2026
    Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

    Artificial intelligence is moving beyond software and into physical systems, and Ennoconn Technology says that shift could create a...

    Wednesday 16 September 2026
    Samsung reportedly weighs Micron's newest memory for Galaxy S27
    Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, as rising costs around next-generation mobile DRAM...
    Wednesday 16 September 2026
    Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
    Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just...
    Wednesday 16 September 2026
    Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
    Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
    Wednesday 16 September 2026
    Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead

    Introduction

    Wednesday 16 September 2026
    MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

    MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

    Wednesday 16 September 2026
    Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
    MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...
    Wednesday 16 September 2026
    DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
    DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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