"Electricity is computing power," said Taiwan's Industrial Technology Research Institute (ITRI), predicting that global data center power demand will more than double by 2030. The trend toward hyperscale facilities is accelerating, with each data center in the Americas averaging 100MW of IT capacity, about twice the global average of 50MW. Malaysia has become a key hotspot for US and Chinese tech giants expanding their AI and cloud infrastructure, while Taiwan's average load of just 7MW underscores its lag in large-scale AI development
Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced Packaging Developers Conference (APDC), identifying advanced packaging as one of the fastest-growing areas in the semiconductor industry
Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging Developers Conference (APDC) that the industry must strengthen collaboration and local networks to navigate geopolitical and resource challenges as it moves toward a projected US$1 trillion market by 2030
