Yankey Engineering’s order backlog reached a record NT$57.1 billion (US$1.74 billion) as of the end of September, with its subcontracting project for the second wafer fab in Kumamoto, Japan, expected to contribute revenue from 2027. The company said strong global AI infrastructure demand, advanced semiconductor processes, advanced packaging, and memory expansion drove its revenue and profit to record levels in the first three quarters of 2026.

Vanguard International Semiconductor (VIS) said its Singapore wafer fab is expected to become a growth driver in 2027, with capacity nearly sold out, customer commitments secured, and artificial-intelligence interposers projected to generate about half of revenue. The expansion could accelerate, but rising depreciation and fixed costs are expected to pressure profitability.

Tong Hsing Electronic Industries (THEIL), a semiconductor packaging company under the YAGEO Group, said its board has approved the acquisition of a 100% stake in Singapore-listed Global Testing Corporation for approximately SGD76.71 million (US$59.88 million). The deal will take Global Testing private and is intended to transform Tong Hsing from a traditional packaging manufacturer into a comprehensive packaging and testing service provider.

FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging technologies. The facility has six production lines and a maximum designed capacity of 300 million chips annually, the company said in a November 3 release.

Google's plan to invest US$15 billion in Malaysia over 2027 and 2028 deepens its bet on what AFP calls Southeast Asia's fastest-growing data center hub, and ties the expansion to commitments on power, water, and skills as Malaysian authorities scrutinize the facilities' demands on national resources.

Taiwan-based Horngyu Electric is leveraging manufacturing in Vietnam to meet rising demand for electrical equipment from AI data centers (AIDCs), Taiwan makers investing in the US, and new-energy projects. Horngyu's Vietnam plant is scheduled to begin trial production by the end of 2026 and enter mass production in 2027.

Malaysia is attaching tougher conditions to its data center boom, pairing a newly approved renewable energy quota with stricter screening of power and water requests and pressure on operators to supply more of their own electricity.

Taiwan became Thailand's third-largest trade partner in the first half of 2026 as AI growth and geopolitical shifts accelerate Taiwanese investment in the country, Taiwan Representative to Thailand Peter Lan said. Around 200,000 Taiwanese businesspeople are now based in Thailand, with the pace accelerating under the China+1 trend.

Delta Electronics approved plans on October 28 to establish a large manufacturing base in Penang, Malaysia, as the power and thermal management company expands overseas production to support customer demand. The site is expected to ramp up to capacity comparable to that of Delta's Thailand operations over five years, with space reserved for process research and development and a potential future R&D center.

Thailand-based precision sheet-metal manufacturer JPP Holding (jpp-KY) has secured more than 20 aerospace special-process certifications from Airbus, including certifications for A350 cockpit structural parts and related subprojects, formally entering the aircraft maker's high-end structural-component supply chain.

South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands SOCAMM2 production and builds capacity to retain its position in the high-end memory module substrate market.

SoftBank Group founder and CEO Masayoshi Son has selected investment sites in Malaysia and plans to invest US$50 billion in technology, Malaysian Prime Minister Anwar Ibrahim said. Following investments in the US and Europe, the group is expanding its AI infrastructure strategy into Asia.

Mitsubishi Materials will expand production of thermistors, temperature sensors used in optical communications equipment, as the spread of generative AI drives demand for optical transceivers. Its Thailand facility will gradually add equipment and raise monthly capacity to about 12 million units by November 2027, roughly six times its 2025 capacity.

Malaysia has approved its first export of unprocessed rare earths under a new regulatory framework, with the shipment intended for research and development, although officials did not identify the recipient.

Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer Viettel, however, says the project remains on schedule.