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Monday 8 June 2026
SpaceX's Google deal highlights shift from AI model ambitions to infrastructure monetization
SpaceX's multibillion-dollar cloud agreement with Google underscores a growing shift in the AI industry from building proprietary models to monetizing computing infrastructure. The...
Monday 8 June 2026
Commentary: Largan shareholder meeting to draw focus on CPO progress and handset demand
Largan Technology is set to hold its annual shareholder meeting on June 9, and investors worldwide will be watching for signals on handset demand, manufacturing capacity, and its push...
Monday 8 June 2026
KT Cloud speeds AI data center builds with modular construction and digital twin ops
KT Cloud is accelerating its artificial intelligence data center rollout in South Korea with modular construction, alternative power sourcing, and a digital twin operations platform...
Monday 8 June 2026
France attracted over EUR110 billion in AI and data center pledges but delivery faces power and approval hurdles
France secured more than EUR110 billion (US$126.8 billion) in artificial intelligence and data center investment commitments at the recent Choose France summit, with the largest single...
Monday 8 June 2026
T3EX expands Northeast Asia air freight to serve electronics and chip supply chains
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global...
Sunday 7 June 2026
Pegatron unit ASRock Rack wins order to supply 587 GPU servers for Thailand AI data center
ASRock Rack, a subsidiary of Pegatron Group's ASRock Inc., has won an order to supply 587 GPU servers equipped with Nvidia B200 accelerators to Japan-based AI infrastructure provider...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain...
Sunday 7 June 2026
Transcend says Samsung DDR4 supply secured through 2027 as memory prices rise

Transcend Information said revenue for April and May combined has already surpassed its first-quarter total, as tight memory supply and...

Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Sunday 7 June 2026
Taiwan Mobile and GMI Cloud sign MOU to expand AI data center services into SEA and beyond
Taiwan Mobile announced at Computex 2026 that it signed a memorandum of understanding (MOU) with GMI Cloud to expand AI data center and high-end compute services across emerging markets...
Saturday 6 June 2026
Phison shifts to system AI solutions with 2027 memory crunch looming
Phison Electronics CEO K.S. Pua said the company is moving beyond its roots as an IC component supplier and repositioning itself as a system solutions provider, warning that AI-driven...
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing...
Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...