News tagged capacity at DIGITIMES

NEWS TAGGED CAPACITY

Monday 5 January 2026

Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

Monday 5 January 2026

NAFCO posts record December revenue and is optimistic for 2026

The National Aerospace Fasteners Corporation (NAFCO) revenue for December 2025 hit a new record of NT$405 million (approx. US$12.9 million), up 7.84% month-over-month and 19.61% year-over-year...

Monday 5 January 2026

SK On slows investment and delays Seosan factory expansion with EV market uncertainty

SK On, a battery unit of SK Innovation, has scaled back its investment plans and postponed the expansion of its new factory in Seosan, Chungcheongnam-do, South Korea, due to a slowdown...

Monday 5 January 2026

TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...

Monday 5 January 2026

Taiwan ramps up drone procurement in 2026, testing mass-production capacity

Taiwan is set to dramatically scale up its military drone production starting in 2026 as the Ministry of National Defense prepares to order nearly 50,000 units, a move intended to...

Monday 5 January 2026

India roundup: OSAT players claim legacy packaging price parity

Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

Saturday 3 January 2026

Chang Wah accelerates Asia expansion as chip packaging booms

Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...

Friday 2 January 2026

Memory shortages to persist through 2026 as AI server demand surges

Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

Friday 2 January 2026

IC substrates and networking PCBs grow; materials and equipment face shortages

The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...

Friday 2 January 2026

China's CXMT moves toward IPO with global DRAM share nearing 4%

China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...

Friday 2 January 2026

Samsung reportedly seals land deal, paving way for Yongin semiconductor complex

Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...

Friday 2 January 2026

Smartphones and notebook prices could increase as memory lead times extend

Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...

Friday 2 January 2026

SanDisk, Micron vie for PSMC's Tongluo fab capacity

Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo,...

Friday 2 January 2026

China demand pushes Nvidia to seek more H200 capacity from TSMC

Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...

Friday 2 January 2026

AGI Repositions Storage for AI Era at CES 2026

As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time...

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