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Friday 6 November 2026
SuperAlloy enters semiconductor pilot production in 3Q26
SuperAlloy reported strong third-quarter 2026 results, with consolidated revenue rising 18.5% year-over-year to NT$2.016 billion (US$61.4 million) as demand from international supercar...
Friday 6 November 2026
Nscale's US$35 billion IPO faces fresh uncertainty after Microsoft rejects Texas AI capacity expansion
UK-based AI computing infrastructure startup Nscale, backed by Nvidia, is planning a US$35 billion initial public offering (IPO) in 2026. However, Microsoft, one of its major customers,...
Friday 6 November 2026
TI targets next semiconductor supercycle as humanoid robots surge
Humanoid robots require at least US$2,000 worth of semiconductors per unit—twice the content of an EV—and could drive the next semiconductor supercycle, Texas Instruments...
Thursday 5 November 2026
Taiwan tech firms' Texas factory commitments total US$2.9 billion
Eight Taiwanese electronics manufacturers have disclosed approximately US$2.9 billion in factory-related asset transactions and investment plans in Texas since January 2024, accounting...
Thursday 5 November 2026
The 346-GW question: Will anti-data-center votes slow America's AI buildout?
US voters favored restrictions on data center development in 40 of 41 local ballot measures across 10 states on November 3, signaling growing opposition to AI infrastructure expansion...
Thursday 5 November 2026
NAND prices face pressure as end demand freezes in 4Q26
Memory prices have surged for several consecutive quarters, leaving consumer applications grappling with cooling buying interest and weak demand. Kioxia has taken a more conservative...
Thursday 5 November 2026
Chipmakers rush to secure equipment for 2029 as lead times top two years
Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
Thursday 5 November 2026
EU launches EUR525 million push to close chip design gap
The European Union has launched a EUR525 million (approx. US$590 million) initiative to strengthen its semiconductor design industry, seeking to narrow the gap with the US and China...
Thursday 5 November 2026
Cirrus Logic rides iPhone content wave, but backend squeeze, PC slump cloud the path ahead
Cirrus Logic reported revenue of US$559.5 million for its fiscal second quarter ended September 26, up 22% sequentially and roughly flat year-on-year. Non-GAAP earnings per share came...
Thursday 5 November 2026
China's Big Fund III pivots to 12-inch chip fabs, equipment acquisitions to close semiconductor supply chain gaps
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Thursday 5 November 2026
Commentary: AOI locks in China's InP substrates for AI optics, but export controls threaten supply
AI data centers are accelerating demand for high-speed optical communications, extending competition in the optical transceiver market beyond chips and module manufacturing to critical...
Thursday 5 November 2026
US pressure on overseas AI compute squeezes Chinese tenants and Southeast Asian data centers as Beijing pushes domestic chips
Chinese AI developers are losing a key route to advanced US chips, renting them in data centers outside China, as Washington and US companies stretch American controls over compute...
Thursday 5 November 2026
Memory surge leaves 8GB iPad Pro behind on AI
Apple's memory requirements for its new Apple Intelligence features have sparked debate after the launch of iOS 27 and iPadOS 27, with some older or lower-spec devices excluded from...
Thursday 5 November 2026
SK Hynix leads HBM4 yield at 60%, expands DRAM supply
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
Thursday 5 November 2026
Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...