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Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Monday 24 August 2026
Europe's struggling auto industry turns to China, drawing US scrutiny

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through...

Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
India weighs new capital subsidies to build domestic polysilicon capacity
India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar...
Monday 24 August 2026
Notebook brands shift production back to China as Southeast Asia costs rise
Notebook brands that rushed into Southeast Asia for manufacturing are moving production back to China, as the cost gap remains too wide and the impact of substitute tariffs has proved...
Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
Monday 24 August 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...
Saturday 22 August 2026
America's launch boom runs into a capacity problem as White House targets 1,000 annual space launches
The US commercial space sector is entering a phase in which launching more rockets is no longer the only test of industrial scale. As flight cadence rises and multiple providers push...
Saturday 22 August 2026
Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
Friday 21 August 2026
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
Friday 21 August 2026
Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
Friday 21 August 2026
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026
Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks
Aircraft and spacecraft may be judged by thrust, payload capacity, and range, but the German Industry Solutions Session held at Automation Taipei 2026 on August 20 suggested that some...