Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: me...

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second...

Delta Electronics expects capital spending to rise to roughly NT$70 billion in 2026 from NT$46.1 billion in 2025, driven by growing...

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands...

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined...