ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028...
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure...
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens...
As AI cluster sizes grow, networking systems face challenges beyond higher bandwidth, including power consumption, cooling, cross-site coordination, and large-scale device operations...
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early...
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under...
China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected...
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
NTT Data and Anthropic are in final-stage negotiations to develop a data center in Osaka, Japan, with power capacity of up to 500MW, according to Nikkei. The project would...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
