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Friday 2 January 2026
China's CXMT moves toward IPO with global DRAM share nearing 4%
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to...
Friday 2 January 2026
Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...
Friday 2 January 2026
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...
Friday 2 January 2026
SanDisk, Micron vie for PSMC's Tongluo fab capacity
Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo,...
Friday 2 January 2026
China demand pushes Nvidia to seek more H200 capacity from TSMC
Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...
Friday 2 January 2026
AGI Repositions Storage for AI Era at CES 2026

As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time...

Friday 2 January 2026
Server ODMs remain bullish through the end of 2026 despite bubble concerns
Although AI bubble concerns persist, server ODMs remain optimistic about 2026. Nvidia's GB300 began shipping in the fourth quarter of 2025, and the new Vera Rubin architecture expected...
Thursday 1 January 2026
China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the strongest price support. However, market conditions...
Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
E-paper is turning colorful, and the supply chain is scaling fast
With the shift from black-and-white to color boosting pull-in demand, ESG, and AI, e-paper terminals are thriving. Both E Ink Holdings, the leading global e-paper materials supplier,...
Wednesday 31 December 2025
TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona...

Wednesday 31 December 2025
BOE 8.6G AMOLED production line in Chengdu to begin production early
BOE announced on December 30 that its first 8.6G AMOLED production line in Chengdu, China, has begun early production, five months ahead of the original schedule, shifting from construction...
Wednesday 31 December 2025
YMTC goes full speed toward HBF next
Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology...
Wednesday 31 December 2025
Taiwan OSATs boost spending as CoWoS supply tightens

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

Wednesday 31 December 2025
Wah Lee acquires Jing De Gases to enter semiconductor specialty gas blending market
Driven by the expansion of artificial intelligence (AI) and semiconductor capacity, demand for specialty gases is rising. To secure a position in the local supply chain, high-tech...