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Friday 18 September 2026
Z.ai's next growth engine starts where compute scarcity ends

Chinese AI developer Z.ai has raised its 2026 year-end annual recurring revenue (ARR) target by 25% to US$3 billion after fresh financing...

Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...

Friday 18 September 2026
Nan Ya accelerates AI materials shift with major capacity expansion

Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making...

Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
CXMT cashes in on the DRAM shortage — and takes aim at HBM
ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
Thursday 17 September 2026
Memory LTAs lock up 50-70% of capacity
The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from...
Thursday 17 September 2026
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...

Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

Thursday 17 September 2026
Samsung reportedly starts Tesla chip trial production at Taylor fab

Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving...

Thursday 17 September 2026
Kinpo's push into higher-margin products, quantum control signals a wider industrial pivot

Kinpo Electronics said it is reshaping its business toward higher-margin products and expanding factory capacity across several countries...

Thursday 17 September 2026
SK Hynix shifts supply chain planning for AI capex boom

AI-driven capacity expansion is pushing up demand for semiconductor equipment, and SK Hynix is strengthening supply chain management...

Thursday 17 September 2026
Intel CEO warns of 2027 memory crunch and tighter CPU supply
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...