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Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Friday 23 January 2026
TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price...
Friday 23 January 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Friday 23 January 2026
NAND shortages help Phison to enter US server supply chain
Severe NAND flash shortages driven by AI servers have emerged, but have become a growth opportunity for Phison Electronics. Company CEO K.S. Pua said that the shortage is enabling...
Thursday 22 January 2026
PSMC to upgrade DRAM processes as demand strengthens

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update...

Thursday 22 January 2026
Commentary: China's NPI edge comes under pressure
Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond...
Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...
Thursday 22 January 2026
Nanya expects memory shortage through 1H27 amid surging demand
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust...
Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South...
Thursday 22 January 2026
BTL capitalizes on AI server testing capacity shortage
To strengthen computing power reserves, the capexs of the four major cloud service providers (CSPs) are expected to remain strong in 2026 and support industry development. These investments...
Wednesday 21 January 2026
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked...

Wednesday 21 January 2026
Thailand emerges as ASEAN PCB hub with Zhen Ding Tech's US$2.1B investment
Thailand's Board of Investment (BOI) recently approved a major investment plan led by Zhen Ding Tech (ZDT), the world's largest printed circuit board (PCB) manufacturer, in partnership...
Wednesday 21 January 2026
Nvidia challenges Apple's longtime TSMC priority

Apple is losing the preferential access it held for more than a decade at TSMC as surging demand for AI chips shifts the balance of power...