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Wednesday 15 July 2026
PSMC lifts DRAM foundry prices 45% as 3D AI Foundry targets 20% revenue share
Major cloud service providers (CSPs) have front-loaded purchases of future DRAM capacity, and the global memory supply-demand gap is expected to last through 2027. Powerchip Semiconductor...
Wednesday 15 July 2026
ASML raises 2026 sales outlook as AI-fueled logic and memory demand accelerates
Dutch lithography giant ASML reported total net sales of EUR9.3 billion for the second quarter of 2026, exceeding its own guidance, as customers accelerated capacity expansion plans...
Wednesday 15 July 2026
SK Hynix reportedly starts ordering equipment for Yongin fab, plans 20,000 wafers a month

SK Hynix has begun placing orders with major suppliers for advanced DRAM manufacturing equipment for the first phase of its Yongin...

Wednesday 15 July 2026
AI computing demand lifts fiber prices and volume

AI data-center buildouts are driving global demand for high-speed optical interconnects and triggering a new round of capacity expansion...

Wednesday 15 July 2026
Taiwan and Japan expand all-photonic network ties for AI and research
Taiwan and Japan are expanding deployment of the IOWN all-photonic network to improve research connectivity and provide backup AI computing capacity. The effort comes as Taiwan promotes...
Wednesday 15 July 2026
Tower Semiconductor bets on Japan to ride the AI data center shift from copper to light
Tower Semiconductor is placing a roughly US$3 billion wager that the artificial-intelligence buildout will force data centers to move data with light rather than electricity, anchoring...
Wednesday 15 July 2026
South Korea moves to secure power for new chip cluster

South Korea is accelerating plans to supply electricity to a new semiconductor cluster in the country's southwest by 2030, potentially...

Wednesday 15 July 2026
CXMT's US$4.3B IPO powers China's HBM challenge to global memory giants

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

Tuesday 14 July 2026
Taiwan AI suppliers ride global demand as substrate, and CCL markets tighten
Taiwan's AI hardware supply chain remained strong in June, as substrate and CCL makers posted sharp annual gains driven by demand for AI servers, ASICs, and high-performance computing...
Tuesday 14 July 2026
Rambus unveils DDR5 9600 chipset for next-generation AI servers
Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...
Tuesday 14 July 2026
Six-inch SiC substrate price rebounds as supply tightens

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for...

Tuesday 14 July 2026
Google reportedly ramps up TPU push to court Nvidia-backed cloud providers

Google is intensifying its effort to expand adoption of its in-house Tensor Processing Units (TPUs), taking direct aim at Nvidia's...

Tuesday 14 July 2026
AI demand pushes global ABF substrate market into shortage, with pressure seen through 2028

The AI boom is tightening an important but often overlooked part of the chip supply chain, with global readers likely to feel the effects...

Tuesday 14 July 2026
GigaDevice director maps memory's next three years: capacity, AI demand, and the race for new applications

AI computing demand continues to fuel growth in the global memory market, but the industry's attention is shifting beyond short-term price...

Tuesday 14 July 2026
Intel concentrates its European chipmaking in Ireland with EUR5 billion Leixlip expansion
Intel is doubling down on Ireland as the anchor of its European manufacturing base, committing EUR5 billion (US$5.7 billion) to expand its Leixlip campus barely a year after scrapping...