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Tuesday 27 January 2026
TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
Tuesday 27 January 2026
TPCA predicts 13.9% rise in global PCB market in 2026 amid AI-driven capacity shift
The rapid expansion of artificial intelligence (AI) computing is fueling a new wave of structural growth in the global printed circuit board (PCB) industry.
Tuesday 27 January 2026
Apple, Qualcomm rethink heavy reliance on TSMC as costs rise

Even as TSMC retains a clear technological lead in advanced process nodes, Apple and Qualcomm are reassessing how heavily they rely...

Tuesday 27 January 2026
Nvidia pours US$2 billion into CoreWeave for AI infrastructure expansion
Nvidia and cloud computing firm CoreWeave have announced an expanded partnership to build more than 5 gigawatts of AI "factories" by 2030, aiming to support the rapid growth of artificial...
Tuesday 27 January 2026
TSMC's capex surprise reveals blind spots in semiconductor forecasting
TSMC's recently announced capex surpassed market expectations by US$6 billion to US$8 billion, driven by factors that analysts had previously overlooked, DIGITIMES analyst Luke Lin...
Monday 26 January 2026
Blue Origin's new satellite network eye enterprise and govt sectors
Blue Origin announced plans to deploy TeraWave, a new satellite communication network designed to provide up to 6Tbps of global data transmission capacity, starting in the fourth quarter...
Monday 26 January 2026
Pegatron eyes triple-digit AI server growth in 2026, targets ASIC opportunities
Pegatron is poised to continue its strong expansion in the artificial intelligence (AI) server market as it enters its fourth year, with expectations of sustaining triple-digit revenue...
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Friday 23 January 2026
TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price...
Friday 23 January 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Friday 23 January 2026
NAND shortages help Phison to enter US server supply chain
Severe NAND flash shortages driven by AI servers have emerged, but have become a growth opportunity for Phison Electronics. Company CEO K.S. Pua said that the shortage is enabling...
Thursday 22 January 2026
PSMC to upgrade DRAM processes as demand strengthens

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update...

Thursday 22 January 2026
Commentary: China's NPI edge comes under pressure
Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond...