CONNECT WITH US
NEWS TAGGED CAPACITY
Tuesday 25 August 2026
AI's power crunch hits Taiwan: foundry capacity tightens, chip prices climb into 2H26
AI data centres are becoming a new stress point for the global power and semiconductor supply chain. As facilities shift towards megawatt-scale architectures, demand is rising for...
Tuesday 25 August 2026
Toyota and Honda's US manufacturing push could reshape market share, not just tariffs
Toyota and Honda are accelerating US manufacturing as tariffs, local-content rules, and policy shifts reshape the auto industry. The move is defensive, but it is also a growth strategy...
Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
Tuesday 25 August 2026
Samsung Display resumes A7 construction as foldable demand rebounds

Samsung Display has resumed construction at its second campus in Asan, South Chungcheong Province, reviving a long-dormant OLED project...

Tuesday 25 August 2026
Inergy server share hits 47% on cooling, BBU demand

Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Monday 24 August 2026
Europe's struggling auto industry turns to China, drawing US scrutiny

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through...

Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
India weighs new capital subsidies to build domestic polysilicon capacity
India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar...
Monday 24 August 2026
Notebook brands shift production back to China as Southeast Asia costs rise
Notebook brands that rushed into Southeast Asia for manufacturing are moving production back to China, as the cost gap remains too wide and the impact of substitute tariffs has proved...
Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
Monday 24 August 2026
AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26
The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...