At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
As offshore wind power advances into phase 3.1, coastal wind farm sites are gradually reaching saturation, underscoring the growing importance of precise site selection. Industry...
As the US-China conflict continues to intensify, Samsung Electronics' NAND Flash plant in Xi'an, China, is increasingly stuck in a process upgrade dilemma. On the one hand, with the...
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of...
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
China and India have both contributed to the initial production volumes of the iPhone 15 series but the share from China is still larger than that from India with the latter still...
Given the global trend towards net-zero emissions and the ongoing implementation of carbon tax mechanisms, how to more effectively utilize power has become one of the most critical...
Infineon Technologies is expanding its production capacity to meet the rising demand for semiconductors used in electric vehicles (EV) and other automotive applications over the next...
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
As the applications for microLED expand, it is being challenged by the relationship between cost, production capacity, and market demand that new technologies face when entering the...
Solar cell and PV module maker TSEC on August 28 announced to have obtained NT$3 billion (US$93.3 million) worth of orders for PV modules that will be established on fish farms in...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has raised its revenue forecast for 2023 from US$800 million to between US$900 million and US$950 million.
PCB manufacturer Dynamic Electronics expects to post flat or slight revenue growth in the second half of this year compared to the first, with a higher gross margin thanks to improved...
