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Wednesday 4 March 2026
Samsung expands AI chip push with Pyeongtaek P5 and Texas foundry ramp

Samsung Electronics is accelerating the expansion of its Pyeongtaek semiconductor campus in South Korea, aiming to establish the site...

Wednesday 4 March 2026
TSMC leads foundry price hikes as second-tier firms see profit rebound
The global semiconductor industry is undergoing a new wave of structural reshuffling driven by the AI boom. In the wafer foundry sector, mature node foundry prices are finally breaking...
Wednesday 4 March 2026
Apacer eyes 2-2.5x memory ASP rise to boost 2026 revenue and profit
Memory module maker Apacer delivered strong results in 2025, with CEO Chia-Kun Chang stating that the memory industry will see no price reversal in 2026. With average selling prices...
Wednesday 4 March 2026
TSMC dominates global foundry rankings while four Chinese players enter top 10
ChipInsights data shows the combined revenue of 29 pure-play foundries worldwide reached CNY1.149 trillion in 2025, up 25.46% year-on-year and exceeding the CNY1 trillion mark for...
Wednesday 4 March 2026
ASML seeks new growth in AI packaging beyond EUV monopoly

ASML dominates extreme ultraviolet (EUV) lithography, the technology used to manufacture the world's most advanced logic chips. Decades...

Wednesday 4 March 2026
Global OSAT industry, 2026

Introduction

Tuesday 3 March 2026
Yageo subsidiary Kemet hikes tantalum capacitor prices for third time as strong AI server demand continues
As artificial intelligence (AI) server applications consume large amounts of tantalum polymer capacitors, the supply-demand gap in the market continues to widen. Kemet, a subsidiary...
Tuesday 3 March 2026
AI server boom strains tantalum capacitors; MLCC substitution falls short
The global expansion of AI computing infrastructure is accelerating, but supply shortages across the component supply chain continue to widen. Alongside constrained supply of memory...
Monday 2 March 2026
Hiwin local production positioned as key supplier for South Korea semiconductor and AI-driven equipment upgrades
Hiwin Technologies has spent more than a decade building direct manufacturing and service capacity in South Korea, evolving from component sales to integrated mechatronic solutions...
Monday 2 March 2026
Samsung Electronics and SK Hynix reportedly plan large DRAM price increases, deepening supplier advantage for big buyers
Samsung Electronics and SK Hynix have notified customers of plans to raise DRAM prices in the second quarter of 2026 and have begun price negotiations, South Korean outlet SEDaily...
Sunday 1 March 2026
Taiwan's Fitipower eyes stronger year as AI and edge chips gain traction
Fitipower, a Taiwanese driver IC and semiconductor supplier, offered a cautiously optimistic outlook for 2026 during its February 25 investor briefing. Chairman Young Lin said the...
Sunday 1 March 2026
OpenAI's US$110 billion raise signals shift toward capital endurance and ecosystem diversification
OpenAI's newly announced US$110 billion funding round underscores a structural shift in the AI industry, where long-term capital endurance and ecosystem diversification may increasingly...
Friday 27 February 2026
Yageo sees strong 1Q26 on AI orders; memory shortage yet to hit demand

Yageo CEO David Wang said that although seasonal factors reduced working days from the previous quarter, capacity utilization is expected...

Friday 27 February 2026
Lite-on doubles down on AI power as consumer markets dim
Lite‑on Technology reported strong 2025 operational results and forecast sustained double‑digit quarterly growth for 2026, while flagging consumer and ICT demand headwinds...
Thursday 26 February 2026
Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab
Samsung Electronics will halt 2D NAND flash production at its Hwaseong Line 12 and convert the facility into a 1c DRAM end fab, formally exiting planar NAND manufacturing and reallocating...