The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
Chinese foundries have prioritized orders from domestic customers, resulting in limited availability of fab capacity for others particularly Taiwan-based ones targeting the Chinese...
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
NAND Flash memory suppliers are gearing up for robust demand driven by AI smartphones in the third quarter. Some sources suggest that production lines may already be experiencing...
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Taiwan's ICT supply chain believes that regardless of the outcome of the upcoming US presidential election, trade tensions between the US and China will not improve.
According to a Bloomberg analysis, ASML's orders grew by 23.7% in the second quarter of 2024, indicating smooth progress in TSMC's N2 process development, which may accelerate capacity...
Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...
Mobile phone manufacturers are concerned about the increasing competition among chip vendors for advanced process capacity, despite the more optimistic demand forecasts.
Chinese firms in the solar power industry are accelerating their expansions into the Middle East, establishing an ecosystem covering both upstream and downstream sectors.
The monthly output of 3nm chips at TSMC will climb to 125,000 wafers in the second half of this year, up from 100,000 units currently, according to industry sources. The output ramp-up...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
