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Monday 20 April 2026
Odisha to break ground on India's first advanced 3D chip packaging unit
Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
Monday 20 April 2026
SDC's 8.6-gen OLED approaches 90% yield, expected to supply 2 million panels to Apple in 2026
According to industry sources cited by The Elec, Samsung Display's (SDC) 8.6G OLED line has recently surpassed an 85% yield rate, approaching the industry's "golden yield"...
Monday 20 April 2026
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry...
Monday 20 April 2026
As 2D NAND fades, UMC faces steep hurdles to enter a shrinking market

The global retreat from 2D NAND flash production is no longer a possibility but an emerging certainty. As major memory makers exit the segment,...

Saturday 18 April 2026
TSMC's Q1 2026 earnings call: five signals hidden in plain sight
TSMC's first-quarter 2026 earnings call delivered the expected headline numbers — $35.9 billion in revenue, a 66.2% gross margin, and full-year revenue growth guidance raised...
Saturday 18 April 2026
Largan expects full capacity in 2H26; FAU customer details remain undisclosed
Leading optical lens manufacturer Largan Precision held its first-quarter 2026 earnings call on April 16, reporting consolidated revenue of NT$15.54 billion (approx. US$492.37 million)...
Saturday 18 April 2026
Commentary: AI drives CPU crunch, lifting data center demand and pricing

The global AI boom is shifting infrastructure bottlenecks from GPUs to CPUs, as inference-heavy and agentic AI workloads push compute demands...

Saturday 18 April 2026
Musk lines up chip suppliers, accelerates Terafab AI fab plan

Elon Musk is reportedly accelerating plans to build a vertically integrated AI chip complex, reaching out across the semiconductor supply...

Friday 17 April 2026
Honda plans deeper China capacity cuts, targets Guangzhou and Wuhan plants
Struggling with weak sales, Honda has decided to significantly scale back its vehicle production capacity in China, with cuts targeting plants in Guangzhou and Wuhan.
Friday 17 April 2026
Accelerating enterprise AI: Hardware advancements and compute architecture transformation
As generative AI moves from research and development into enterprise-scale deployment, the underlying AI infrastructure is undergoing a structural realignment driven by a new phase...
Friday 17 April 2026
Evalue launches 640kW ultra-fast charger, expanding fast-charging capacity
Taiwan's Fortune Electric Value Company (Evalue) has launched a 640kW ultra-fast DC charger capable of charging 800V EVs in 15–20 minutes, with support for up to five simultaneous...
Friday 17 April 2026
Memory module maker Apacer beats full-year 2025 profit in first quarter, inventory climbs

Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue reaching...

Friday 17 April 2026
Topoint bond deal signals wider supply risk for global AI hardware makers
The surge in AI-grade high-speed computing is pushing printed circuit board manufacturing toward thicker, higher-layer designs, creating a strategic, global shortage of advanced coated...
Friday 17 April 2026
UMC signals 2026 wafer price adjustment amid tightening demand and capacity pressure
United Microelectronics Corp. (UMC) is expected to raise wafer foundry prices in the second half of 2026, as demand for logic and memory-related applications remains resilient and...