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    Memory price hikes squeeze Samsung smartphone HDI supply
    3h 27min ago
    Samsung foundry S5 shift to DRAM faces major hurdles
    3h 27min ago
    Chinese smartphone price hikes hit Southeast Asia shipments
    3h 27min ago
    China semiconductor equipment makers expand localization into advanced packaging
    3h 27min ago
    Analysis: can Taiwan’s research institutes follow imec’s EUV model?
    3h 28min ago
    South Korea confirms US request for expanded semiconductor investment
    3h 28min ago
    NEWS TAGGED EXPANSION
    Monday 7 September 2026
    Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market
    Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...
    Monday 7 September 2026
    JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
    JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
    Monday 7 September 2026
    Anthropic IPO set to put AI governance under public-market scrutiny
    Anthropic is moving toward a potential blockbuster stock-market debut this fall, but the company's unusual governance structure could become an important issue for investors alongside...
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Sunday 6 September 2026
    Tongtai doubles semiconductor orders on AI data-center demand
    Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
    Sunday 6 September 2026
    Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
    In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
    Saturday 5 September 2026
    Micron looks to lock in Taiwanese construction capacity with long-term deals
    The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
    Friday 4 September 2026
    Samsung turns to chips, OLED for next phase of Vietnam expansion
    Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
    Friday 4 September 2026
    Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
    Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
    Friday 4 September 2026
    China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

    Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

    Friday 4 September 2026
    Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
    Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Friday 4 September 2026
    Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
    The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
    Thursday 3 September 2026
    AI substrate shortages widen as Unimicron signals capacity support through 2029
    Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
    Thursday 3 September 2026
    China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
    AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
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