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Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
Friday 4 September 2026
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

Friday 4 September 2026
Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements...
Friday 4 September 2026
AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

Friday 4 September 2026
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
Thursday 3 September 2026
AI substrate shortages widen as Unimicron signals capacity support through 2029
Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
Thursday 3 September 2026
China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility...
Wednesday 2 September 2026
Indium CEO: packaging, cooling and power are next AI bottlenecks
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
Wednesday 2 September 2026
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp...
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion

China has introduced new guidelines aimed at steering its automotive industry toward more orderly competition overseas as domestic automakers...

Wednesday 2 September 2026
TCL CSOT bets on InP laser chips as supply tightens
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Wednesday 2 September 2026
Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Tuesday 1 September 2026
BYD widens overseas lead over Geely, but profits still lag
BYD and Geely Auto were nearly neck and neck in vehicle sales in the first quarter of 2026, raising expectations of a close contest between China's two leading new-energy vehicle makers...
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...