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    Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
    5min ago
    Chicony Power's August revenue dips as AI server and satellite demand strengthens
    11min ago
    Foxconn revenue climbs on AI server demand, outlook improves
    17min ago
    NEWS TAGGED EXPANSION
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Sunday 6 September 2026
    Tongtai doubles semiconductor orders on AI data-center demand
    Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
    Sunday 6 September 2026
    Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
    In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
    Saturday 5 September 2026
    Micron looks to lock in Taiwanese construction capacity with long-term deals
    The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
    Friday 4 September 2026
    Samsung turns to chips, OLED for next phase of Vietnam expansion
    Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
    Friday 4 September 2026
    Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
    Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
    Friday 4 September 2026
    China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

    Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

    Friday 4 September 2026
    Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
    Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    Friday 4 September 2026
    Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
    The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
    Thursday 3 September 2026
    AI substrate shortages widen as Unimicron signals capacity support through 2029
    Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
    Thursday 3 September 2026
    China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
    AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
    Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp...
    Wednesday 2 September 2026
    China moves to curb overseas price wars as automakers accelerate global expansion

    China has introduced new guidelines aimed at steering its automotive industry toward more orderly competition overseas as domestic automakers...

    1/63 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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