Intel is accelerating work on its long-delayed US semiconductor manufacturing projects, with equipment installation underway at its Fab 62 facility in Arizona and construction progressing...

Tesla's Robotaxi expansion is entering a new phase as the company increases unsupervised autonomous mileage, deploys its purpose-built Cybercab and works to expand fleet operations...

Nvidia is positioning the expansion of artificial intelligence as an infrastructure and industrial shift, not simply a software trend. At GTC Berlin, CEO Jensen Huang described an...

Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...

China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips...

Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...

As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking...

Syscom Computer Engineering is expanding its portfolio in edge AI and its broader enablement ecosystem, with the company showcasing its latest products at the 2026 AIoT Taiwan exhibition,...

The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...

What began as a satellite broadband service is increasingly becoming SpaceX's platform for connecting homes, aircraft, mobile devices, and government networks.

Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic...

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...

Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...