中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Airbus sees profit nearly double by 2029 as production capacity rises
    10h 34min ago
    Google raised capex outlook as compute demand stayed tight, boosting Foxconn
    10h 34min ago
    Xi'an Eswin Materials tops 1 million 12-inch wafer sales and output per month
    10h 34min ago
    Rapidus builds a full semiconductor ecosystem in Hokkaido
    10h 34min ago
    TSMC’s Arizona expansion moved past its initial hurdles as fabs and packaging ramped up
    10h 34min ago
    Rising DRAM prices squeeze EV supply chains as Chinese automakers face cost pressure
    10h 52min ago
    NEWS TAGGED 2027
    Thursday 23 July 2026
    D-Link robot line starts in 3Q26; care model due in 2027
    Networking brand D-Link has set up a subsidiary, D-Link Robotics, and is officially entering the service robot market. The new unit will focus on two niche applications, "smart companionship"...
    Thursday 23 July 2026
    STMicroelectronics raises AI data center ambition as second-quarter revenue rebounds 26%
    STMicroelectronics (ST) has raised its revenue ambition for AI data centers to above US$1 billion in 2026 and well above US$2 billion in 2027, staking a larger claim on the AI infrastructure...
    Thursday 23 July 2026
    D-Link wins sole-source Starlink switch contract through 2027
    Taiwanese networking equipment vendor D-Link has officially entered SpaceX's supply chain and will begin shipping network switches for Starlink data-switching nodes in September 20...
    Thursday 23 July 2026
    Fitch sees AI investment momentum holding, with no signs of supply downturn

    Fitch Ratings has adjusted its Taiwan GDP growth forecasts for 2026 and 2027 to 9.4% and 4.8% respectively, up from its earlier estimates...

    Thursday 23 July 2026
    SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion
    SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging...
    Thursday 23 July 2026
    01.AI targets Hong Kong IPO in 2027 with enterprise AI pivot
    01.AI, the Chinese startup founded by former Google Greater China chief Lee Kai-fu, said it is aiming for a Hong Kong initial public offering in 2027 after restructuring its offshore...
    Thursday 23 July 2026
    Alphabet 2Q26: Cloud backlog hits $514B as AI demand outpaces capacity
    Alphabet's second-quarter 2026 results, reported on July 22, have shifted the market conversation about the company from whether its massive artificial-intelligence build-out is affordable...
    Wednesday 22 July 2026
    TSMC raises 2027 chip prices, giving Intel fresh pricing room

    TSMC's planned 2027 wafer price increases are reinforcing confidence that AI chip demand remains strong while prompting fresh discussion...

    Wednesday 22 July 2026
    Memory shortage to worsen in 2027 as AI inference strains supply, Silicon Motion CEO says
    The global memory shortage will worsen in 2027 and may not begin to ease until the second half of 2028, with prices likely to remain elevated for the next two to three years, according...
    Wednesday 22 July 2026
    Academia Sinica quantum chip platform targets production by end of 2026
    Academia Sinica said its quantum chip fabrication platform in Tainan is moving through equipment calibration and is expected to start producing quantum chips by the end of 2026. The...
    Tuesday 21 July 2026
    Elite Material, TUC race ahead in AI CCL push

    As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

    Tuesday 21 July 2026
    Samsung could overtake SK Hynix in the HBM market by 2027
    Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...
    Monday 20 July 2026
    Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
    South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
    Friday 17 July 2026
    Taiwan's 2027 tech budget rises 6.2% to NT$176.8 billion, targeting AI and space

    Taiwan plans to increase its technology budget by 6.2% in 2027 to accelerate investment in artificial intelligence (AI), space technology...

    Friday 17 July 2026
    Japan's ACSL eyes Taiwan drone supply chain expansion, commits to TADTE 2027
    Japanese industrial drone maker ACSL is open to expanding procurement from Taiwan as it strengthens its international supply chain strategy, with the company accepting an invitation...
    1/31 pages
    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    AI Summit Seoul