Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a dated, customer-by-customer deployment schedule running into...
AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility...
The most consequential figures on HPE's fiscal third-quarter earnings call on September 2 were not the results but the commitments standing behind them. According to Bloomberg's transcript...
Hewlett Packard Enterprise's fiscal third-quarter results, reported on September 2, are the point at which the Juniper Networks deal and the enterprise AI cycle stopped being a cost...
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at Semicon Taiwan...
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA,...
Taiwan's carbon fee has been formally included in the UK government's list of Qualifying Carbon Pricing Schemes (QCPS) under its Carbon Border Adjustment Mechanism (CBAM), alongside...
