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NEWS TAGGED 2027
Wednesday 14 October 2026
300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Wednesday 14 October 2026
SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
Wednesday 14 October 2026
Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
Wednesday 14 October 2026
ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028
ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028...
Wednesday 14 October 2026
Memory bottlenecks drive HBM shift to 8-layer stacks
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
Wednesday 14 October 2026
China’s NEV export rebate cut puts budget EV makers under margin pressure
China will reduce its export tax rebate for new energy vehicles (NEVs) from 13% to 9% on April 1, 2027, increasing cost pressure on automakers, particularly those selling lower-priced...
Wednesday 14 October 2026
Geely enters Canada, plans first vehicles for 2027
China's Geely has officially entered the Canadian market and plans to launch its first vehicles there in 2027, expanding its North American footprint. Geely has completed its Canadian...
Wednesday 14 October 2026
SEMICON West makes three-year commitment to Phoenix, home to over US$200B in chip investment
SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas...
Wednesday 14 October 2026
Analysis: China's EV rebate cut pushes exporters from volume to value
China's planned cut to export tax rebates for new energy vehicles could ripple through global auto markets, intensifying pressure on low-cost exporters while reshaping trade tensions...
Tuesday 13 October 2026
CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
Tuesday 13 October 2026
Samsung sends yield engineers to Texas ahead of 2nm production ramp
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas, foundry ahead of planned 2nm chip volume production in 2027, South...
Tuesday 13 October 2026
Malaysian states team up to back homegrown chip firms
The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
Tuesday 13 October 2026
AI server tracker: Supply, not demand, caps BMC growth as Aspeed's 2027 orders top this year's revenue
Taiwan-based server management chip supplier Aspeed Technology reported consolidated revenue of NT$1.636 billion (approx. US$51.16 million) for September 2026, up 100.93% year-over-year...
Tuesday 13 October 2026
Huawei car brands face trust test: Maextro brakes draw scrutiny, AITO's Europe bid uncertain
Huawei's automotive partnerships are accelerating their overseas expansion while facing growing scrutiny over product safety and brand trust. AITO is reportedly planning to enter the...
Tuesday 13 October 2026
Microsoft's 2nm Maia 300 completes cloud AI ASIC lineup, setting up 2027 server supply-chain boom
Microsoft has unveiled its latest in-house AI application-specific integrated circuit (ASIC), Maia 300, and accompanying server rack, with its compute chiplets manufactured using TSMC's...