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    Nvidia H200 China sales stall, with US$400M inventory charge
    1min ago
    Nvidia's inventory build shifts upstream as memory costs bite
    5min ago
    Chart: Nvidia's segment split tells only half the AI demand story
    15min ago
    Nvidia buys Hugging Face for US$12.9 billion, tying open-source AI to chip dominance
    17min ago
    China shifts autonomous driving liability to automakers in draft traffic law
    27min ago
    China's AI software strategy gains scale as OpenHarmony ecosystem tops 1.35 billion devices
    28min ago
    CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
    32min ago
    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    Aug 26, 19:17
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    Aug 26, 19:17
    NEWS TAGGED 2027
    Thursday 27 August 2026
    AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
    Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
    Thursday 27 August 2026
    HTSI targets AI chip demand with SiPh, CPO, packaging push
    Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
    Thursday 27 August 2026
    Lambda eyes US$3B funding ahead of 2027 IPO
    Lambda, the Nvidia-backed neocloud provider, is seeking to raise as much as US$3 billion before a planned 2027 listing, with its valuation potentially reaching US$12 billion, according...
    Wednesday 26 August 2026
    YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
    Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5...
    Wednesday 26 August 2026
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
    Wednesday 26 August 2026
    Bioteq lifts Yilan plant output as it shifts production and eyes 2027 growth
    Bioteq is increasing output at its Yilan Science Park plant, a move that could affect supply chains across Asia, Africa, and the Americas. As the company shifts more products and upgrades...
    Wednesday 26 August 2026
    Trump weighs Apple China chip deal as CXMT runs full
    Apple is seeking to diversify its supply chain to ease pressure from rising memory costs and has reportedly sought US government clearance to buy memory from blacklisted Chinese chipmaker...
    Wednesday 26 August 2026
    Nvidia earnings hinge on Rubin ramp and Vera CPU
    Nvidia will release its fiscal second-quarter 2027 financial results on August 26, US time. Given Nvidia's performance pattern in recent quarters, Wall Street has come to expect a...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    Foxconn scales AI server production in US and Mexico, keeps Asia expansion diversified
    AI server demand and the continued regionalisation of global supply chains are keeping Foxconn's capital spending on an upward trajectory in 2026, with the company maintaining its...
    Tuesday 25 August 2026
    Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

    Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
    Monday 24 August 2026
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

    Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

    Monday 24 August 2026
    Taiwan's Iron Force shifts airbag output to Poland, targets AI server component ramp in 2027
    Taiwan-based Iron Force Industrial is reshaping its manufacturing footprint as pressure on its traditional auto-parts business weighs on earnings. The company plans to expand its Poland...
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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
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