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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    5h 1min ago
    High-end GPUs may be slowing China’s AI compute expansion
    5h 1min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    5h 1min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    5h 1min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    5h 1min ago
    NEWS TAGGED 2027
    Thursday 17 September 2026
    TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
    TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology...
    Thursday 17 September 2026
    Memory LTAs lock up 50-70% of capacity
    The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from...
    Thursday 17 September 2026
    Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
    Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate...
    Thursday 17 September 2026
    SK Hynix weighs US memory options as buyers lock in 2027 supply
    SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional...
    Thursday 17 September 2026
    Samsung reportedly starts Tesla chip trial production at Taylor fab

    Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving...

    Thursday 17 September 2026
    Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
    Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
    Thursday 17 September 2026
    South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

    South Korea's semiconductor boom is spilling over from corporate profits into government tax revenue. Corporate tax revenue for fiscal...

    Thursday 17 September 2026
    Intel CEO warns of 2027 memory crunch and tighter CPU supply
    AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
    Thursday 17 September 2026
    DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
    DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
    Wednesday 16 September 2026
    Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
    Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the...
    Wednesday 16 September 2026
    Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
    Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just...
    Wednesday 16 September 2026
    Glass substrates, TGV set to reshape 2027 advanced packaging race
    As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
    Wednesday 16 September 2026
    Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
    Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is...
    Wednesday 16 September 2026
    Aleees locks in Tainan plant for 20-year North America order

    Lithium iron phosphate (LFP) cathode materials maker Aleees said its new precursor plant will be built in Tainan, with trial production...

    Wednesday 16 September 2026
    A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
    High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Semicon_TW