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    SMIC reenters advanced packaging with major team expansion in Shanghai
    3h 31min ago
    Taiwan govt courts Foxconn to invest in AI computing centers with tax incentives
    3h 31min ago
    Zhen Ding invests CNY40 billion in Huai'an to expand high-end PCB capacity for AI supply chain
    3h 31min ago
    SK Hynix reinforced collab with TSMC at North America technology forum
    3h 31min ago
    Google leads ASIC server growth with rising Taiwan foundry involvement
    3h 31min ago
    Chip assembly and testing supply tightness drives major cost pressure for chipmakers
    3h 31min ago
    NEWS TAGGED 2027
    Thursday 23 April 2026
    Asia Vital Components eyes liquid cooling growth while testing space-ready thermal plates
    Asia Vital Components' push into liquid cooling and space-ready thermal solutions signals a broader shift in data center design and supply chains, with implications for hyperscalers...
    Tuesday 21 April 2026
    Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

    Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit...

    Tuesday 21 April 2026
    Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
    Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM)...
    Friday 17 April 2026
    TSMC revises advanced process and packaging strategy
    TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue...
    Friday 17 April 2026
    Analysis: ASML lifts 2026 guidance on strong EUV demand
    ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company...
    Friday 17 April 2026
    ASML extends Low NA EUV to 2031, ramps up High NA production
    ASML's confirmation that memory-chip demand underpinned its stronger-than-expected results for the first quarter of 2026 — along with its updated EUV roadmaps — has broad...
    Thursday 16 April 2026
    Renesas reports accelerated MRDIMM adoption in China
    As AI servers rapidly increase demand for high bandwidth and large-capacity memory, Renesas Electronics noted that, driven by strong demand in China and expanding capacity, its Memory...
    Wednesday 15 April 2026
    Taiwan, Japan team up on advanced materials to power next-gen chips and clean energy
    Japan dominates the global market for semiconductor equipment and materials — a strategic chokepoint that its neighbors and partners have long sought to learn from, not just...
    Tuesday 14 April 2026
    AI infrastructure boom triggers NAND shortage, memory profits seen rising 2–3x, Silicon Motion says
    Silicon Motion's president, Wallace Kou, said the memory industry is undergoing an irreversible structural shift driven by AI infrastructure growth. Since August 2025, NAND flash prices...
    Monday 13 April 2026
    Apple reportedly tests four smart glasses designs ahead of 2027 launch

    Apple is accelerating development of next-generation wearable hardware, with plans to launch its first smart glasses as early as 2027,...

    Monday 13 April 2026
    Interview: AI compute expands into space, Ramon.Space and Ingrasys team up for 2027 commercial deployment
    As demand for AI computing continues to surge, terrestrial data centers are facing mounting constraints in power supply, thermal management, and land availability. As a result, the...
    Monday 13 April 2026
    Exclusive: Apple's foldable iPhone faces production delay, but 2026 launch still in sight

    The timing of mass production for Apple's first foldable iPhone has become a focal point of industry scrutiny. According to sources within...

    Friday 10 April 2026
    Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
    High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
    Friday 10 April 2026
    CXMT targets 12-layer HBM production by 2027, closing gap with Korea
    China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated...
    Friday 10 April 2026
    MetaOptics reshapes consumer electronics with AI-driven optical innovation
    MetaOptics' pivot from lenses to intelligent processing stands to reshape mobile imaging, security, and wearable devices globally, lowering hardware costs while enabling new contactless...
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    AsiaBAN
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook