Taiwan's economy is projected to grow 6.04% in 2027 as expanding global AI-related capital spending boosts the island's exports, despite geopolitical conflicts and trade barriers weighing...
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
Global TV market growth is under pressure, but premium models are poised to expand. As rising memory prices fuel "chip inflation" and squeeze margins on budget TVs, Samsung Electronics...
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup...
TSEC is focusing its overseas expansion on Japan's rooftop solar market and expects Taiwan's solar installations to recover in 2027 from a market low point. For the Taiwan-based solar...
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
Toyota Motor Corp. plans to sell 1,000 units of its compact electric bus, the e-Palette, within five to six years as it prepares to introduce a Level 4 autonomous driving version in...
Optical communications maker Luxnet reported a September 2026 net profit attributable to parent-company owners of NT$103 million (US$3.21 million), up 110.2% year-over-year, with earnings...
TSMC Chairman and CEO C.C. Wei announced that, driven by relentless AI momentum and strong demand for advanced process technologies, the company has raised its full-year 2026 US dollar...
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Micron Technology on October 15 opened Micron Advanced Assembly and Test Taiwan 2 (AATT2) in Taichung, its second advanced assembly and test facility in Taiwan. The plant expands the...
