High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
China's largest memory maker CXMT is targeting mass production of 12-layer high-bandwidth memory (HBM) by 2027, positioning itself to challenge mainstream specifications long dominated...
MetaOptics' pivot from lenses to intelligent processing stands to reshape mobile imaging, security, and wearable devices globally, lowering hardware costs while enabling new contactless...
Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According...
Samsung Electronics plans to introduce a new "Pro" model in its 2027 Galaxy S27 series, expanding its flagship lineup. Industry analysts believe this move aims to broaden consumer...
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
Silicon Motion said AI-driven NAND supply constraints are causing structural shifts in the memory industry and warned the imbalance will worsen in 2027 as cloud service provider demand...
Kioxia Holdings, Japan's NAND flash memory producer, is exploring the possibility of paying its first dividend since listing in December 2024, reflecting confidence in its growing...
Taiwan sits at a rare intersection of economic momentum and political gridlock. The island's economy expanded 8.68% in 2025, exports hit a record US$640.75 billion, and per capita...
Fujitsu plans to develop a 1.4nm artificial intelligence (AI) chip and outsource its production to Rapidus in Japan, according to Nikkei. The chip is designed for use in servers...
Sony Honda Mobility has scrapped plans to launch its Afeela 1 electric vehicle in the US in 2026, halting both development and commercialization of the model. The decision also cancels...
Elite Material (EMC), a leading Taiwanese copper-clad laminate (CCL) manufacturer, announced the completion of capacity expansions at its Huangshi and Zhongshan plants in China and...
Samsung Electronics is aiming to launch its 1nm semiconductor process by 2030 as part of a direct technological competition with rival TSMC. The move seeks to secure leadership in...
As generative AI (GenAI) shifts from large-model training to large-scale inference, Japanese NAND giant Kioxia forecasts continued price increases for NAND and SSD products. Despite...
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...
