CONNECT WITH US
NEWS TAGGED PRODUCTION
Tuesday 8 September 2026
TSMC, ASML target 12-inch photomask pilot line by 2031, production by 2033
TSMC and ASML have formed an industry-wide initiative to move extreme ultraviolet lithography from 6-inch photomasks to 12-inch formats, with a pilot mask line targeted for 2031 and...
Tuesday 8 September 2026
Samsung allocates more than half of 4nm foundry capacity to HBM4
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
Tuesday 8 September 2026
Infineon COO leaves a US fab open, says GlobalFoundries and ESMC already cover it
Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In...
Tuesday 8 September 2026
India's IndieSemiC targets 3 to 5 million Wi-Fi camera modules as local CCTV rules spur demand
Indian chip design company IndieSemiC is targeting shipments of 3 to 5 million locally made Wi-Fi modules in FY27-28, betting that security requirements for CCTV equipment will encourage...
Tuesday 8 September 2026
Black Sesame, Horizon Robotics unveil China's smart driving chip race

China's intelligent driving market continues to surge, with Black Sesame Technologies and Horizon Robotics both reporting solid top-line...

Monday 7 September 2026
STMicroelectronics says humanoid robots must clear a trio of hurdles
STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and...
Monday 7 September 2026
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum...
Monday 7 September 2026
China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D
China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built...
Monday 7 September 2026
Chicony Power's August revenue dips as AI server and satellite demand strengthens
Chicony Power Technology Co. said its August revenue slipped as a memory shortage hit demand for notebook power supplies. Still, stronger orders for AI server and satellite communications...
Monday 7 September 2026
China NEV imports sink as local brands crowd out foreign cars
China’s new energy vehicle import market continued to shrink in July, hitting its lowest level since 2026, as foreign automakers localize production and Chinese brands keep expanding...
Sunday 6 September 2026
BenQ Materials targets CPO in semiconductor push
BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...