Vanguard International Semiconductor said a fire broke out late on August 27 on the roof of its Wafer Fab 3 in Taoyuan City, Taiwan, but the incident caused no major impact on production...
LG Innotek said it will mass produce and supply automotive camera modules for Zoox, Amazon's autonomous vehicle unit. The deal marks the Korean component maker's first mass production...
IntelliEPI said on August 27 that revenue in the second quarter of 2026 was pressured after a Japanese substrate supplier shut down for nearly three weeks during the Golden Week holiday,...
Capital interest in China has become unusually concentrated on robotics following a state-backed commitment to redirect sizable portions of tech-related incentives from a perfectly...
Wah Lee Industrial is targeting the second quarter of 2027 to move its Physical AI push into an ODM development phase, signaling an effort to capture more value beyond supplying materials,...
As strong AI demand continues to soak up semiconductor capacity, some ICs and passive components are seeing shortages and longer lead times. Qisda's display maker Data Image has stepped...
P-Duke Technology, a manufacturer of specialized niche power supplies, said during its earnings call on August 26 that it remains optimistic about its outlook for second-half and full-year...
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Kioxia Holdings is weighing construction of a new manufacturing building at its Kitakami plant in northern Japan, as rising NAND demand pushes the memory maker toward its next phase...
Hon Hai Technology Group, better known as Foxconn, is expanding its global manufacturing footprint through new land acquisitions, factory development, and capacity upgrades as demand...
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
Ablecom Technology said it had joined a private placement for Jochu Technology and become the listed company's largest shareholder, giving the Taiwan-based chassis and thermal solutions...
