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Tuesday 3 November 2026
TSMC's next US chip plant could land in Sherman
Sherman, a city north of Dallas, has emerged as a possible site for TSMC's next US chip plant, with Texas development documents describing a proposed US$45 billion investment in two...
Tuesday 3 November 2026
Samsung to exit 8-inch foundry business by 2030, report says
Samsung Electronics plans to shut down its remaining 8-inch foundry lines by the end of 2030, forcing South Korean chip designers to seek alternative manufacturing capacity as competing...
Tuesday 3 November 2026
AI demand, resin shock stretch India PCB shortage into 2027
The printed circuit board (PCB) shortage that Indian electronics makers expect to worsen in the coming months is part of a global squeeze. AI servers are absorbing high-end laminate,...
Tuesday 3 November 2026
SK Hynix ramps up SOCAMM2 as material shortages push up PCB prices
SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform,...
Tuesday 3 November 2026
Samsung Electro-Mechanics starts mass production of ADAS MLCCs
Samsung Electro-Mechanics (Semco) has begun mass production of a miniature, ultra-high-capacitance multilayer ceramic capacitor (MLCC) for advanced driver assistance systems (ADAS),...
Monday 2 November 2026
US backs Anderon, GF quantum foundries as Intel targets QPUs with 18A process
The US Department of Commerce is leveraging federal funding and policy initiatives to bolster America's global competitiveness in quantum technology. Its core strategy centers on consolidating...
Monday 2 November 2026
Murata to invest JPY1 trillion in expanding MLCC capacity across Asia plants
Murata Manufacturing announced plans to invest around JPY1 trillion (US$6.3 billion) in expanding multilayer ceramic capacitor (MLCC) capacity by 2030. Booming demand from data centers...
Monday 2 November 2026
Denso sees profits hit by memory costs, seeks price pass-through
Denso, Japan's largest auto parts maker, reported falling profits for the first half of fiscal 2026 as surging memory and other component costs, driven partly by the AI boom, offset...
Monday 2 November 2026
AMOLED advances, hitting IT LCD panels
DIGITIMES forecasts that global large-size TFT LCD shipments will reach 910 million units by 2031 as supply expansion slows and panel capacity continues to be restructured. While TV...
Monday 2 November 2026
Samsung's Lee bets on Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...
Monday 2 November 2026
Sam Altman meets with Samsung, SK as memory crunch deepens
OpenAI CEO Sam Altman met with executives from Samsung Group and SK Group during a brief visit to South Korea on October 31, as tightening memory supplies and growing commitments to...
Monday 2 November 2026
What CXMT's 3Q26 earnings reveal about DRAM shortages, DDR5 momentum, and 2027 growth strategy
China's leading DRAM manufacturer CXMT expects revenue to continue growing through 2027, supported by tight memory supply, AI server demand and an expanding portfolio of higher-value...
Monday 2 November 2026
Dixon maps AI hardware expansion through Inventec, Gemtek, prospective packaging partners
Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing,...
Monday 2 November 2026
Dixon turns to joint ventures, components as price-led growth leaves margins thin
Dixon Technologies is counting on smartphone joint ventures, expanding IT hardware production, and locally made components to turn a sharp sales increase into stronger earnings, as...
Monday 2 November 2026
Exclusive: Metal adhesion poses challenge for aluminum nitride in AI optics
As AI and large-scale data center buildouts drive up data transmission speeds, heat is becoming increasingly concentrated in key components. This has drawn attention to ceramic substrates...