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Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip...

Monday 13 July 2026
Pegatron June revenue rose 15.9% on server shipments and AI expansion
Pegatron reported June revenue of NT$91.296 billion (US$28.43 billion), up 15.9% year over year and down 4.9% from May, as shipments increased on the gradual rollout of its new server...
Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...

Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced...
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...
Monday 13 July 2026
Exclusive: China's notebook ODMs are closing in fast on Taiwan's manufacturing crown

Notebook ODMs enjoyed stronger-than-seasonal demand in the first half of 2026, but the traditional peak season is losing momentum....

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
Monday 13 July 2026
India roundup: India's chip strategy tests its ability to build a competitive ecosystem

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign...

Monday 13 July 2026
SuperAlloy revenue climbs on recycled aluminum and semiconductor certification progress
SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said...
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Monday 13 July 2026
Complex Micro Interconnection sees June sales rise as AI-led device demand lifts orders

Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments...

Monday 13 July 2026
AI era accelerates Foxconn's shift to global 24-hour cybersecurity coverage

Foxconn is using AI and coordinated security teams across Asia, Europe and the Americas to defend against cyberattacks as enterprises...