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Thursday 5 November 2026
Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...
Thursday 5 November 2026
SK Hynix leads HBM4 yield at 60%, expands DRAM supply
SK Hynix's sixth-generation high-bandwidth memory (HBM4) yield has reportedly reached the mid-60% range, the highest in the industry. Analysts say improved yield has lifted production...
Thursday 5 November 2026
Winbond approves US$2.2 billion fab expansion, seeks long-term deals with 10 customers
Winbond's board has approved approximately NT$73.1 billion (approx. US$2.23 billion) in capital spending to expand its Kaohsiung wafer fab, as the Taiwanese memory chipmaker prepares...
Thursday 5 November 2026
CXMT prepayments surge 16x with DRAM shortage lifting market share
Global memory supply constraints are creating opportunities for Chinese DRAM maker CXMT to expand its market share. As major international manufacturers prioritise high-bandwidth memory...
Thursday 5 November 2026
Corning starts optical connectivity output in western India, plans larger adjacent plant for 2027
Corning's move to begin making optical connectivity products in Pune and add a larger adjacent plant by 2027 shows the AI-driven surge in data center fiber demand, so far strongest...
Thursday 5 November 2026
FPT starts chip-testing plant trials in northern Vietnam, plans packaging expansion
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Thursday 5 November 2026
Airoha targets multibillion growth as 100G ramps, 200G tapes out
Airoha, a MediaTek subsidiary, expects its optical communications business to deliver another multiple-fold increase in 2027 as 100G pulse-amplitude modulation (PAM4) digital signal...
Thursday 5 November 2026
AI chips need 1.5 years to move beyond cloud: HCLTech
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...
Thursday 5 November 2026
Murata, Samsung Electro-Mechanics reportedly secure Winbond's silicon capacitor capacity
Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity from Winbond Electronics to meet demand from their end customers,...
Wednesday 4 November 2026
Why defense's blue ocean is no smooth sailing for automakers
Although the defense market has emerged as a new blue ocean for the auto industry, entering it is far from smooth sailing. The main concern remains the national security sensitivities...
Wednesday 4 November 2026
Samsung to reportedly make AMD, Nvidia HBM base dies at second Texas fab
Samsung Electronics plans to produce high-bandwidth memory (HBM) base dies for AMD at its second foundry plant in Taylor, Texas, with the US chipmaker accounting for most of the facility's...
Wednesday 4 November 2026
Explosion at Panasonic CCL plant in Taiwan injures five, two missing
Panasonic Industrial Devices Materials Taiwan's Hukou plant experienced an explosion and fire early on November 4, injuring five employees and leaving two others unaccounted for. The...
Wednesday 4 November 2026
High-speed optical communications drive demand for mSAP competition among Taiwan PCB makers
As AI computing clusters continue to expand, data centers are demanding higher transmission speeds and greater bandwidth. To overcome the manufacturing bottlenecks of traditional high-density...
Wednesday 4 November 2026
Apple eyes sputtered HMO process for next-gen OLED
Apple is reportedly developing high-mobility oxide (HMO) technology for next-generation OLED displays and evaluating it at its own research facilities in Taiwan. Although the mass-production...
Wednesday 4 November 2026
Darfon to consolidate China, Southeast Asia capacity, shift resources to AIDC components
PC component maker Darfon Electronics is consolidating its production capacity in China and Southeast Asia, while simultaneously shifting some of its resources for IT peripherals toward...