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Wednesday 16 September 2026
Micron unveils 512GB DDR5 RDIMM for next-gen servers

Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is...
Wednesday 16 September 2026
Aleees locks in Tainan plant for 20-year North America order

Lithium iron phosphate (LFP) cathode materials maker Aleees said its new precursor plant will be built in Tainan, with trial production...

Wednesday 16 September 2026
Kepler bets HBM can scale without EUV — chip giants are buying in

US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a...

Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
Wednesday 16 September 2026
Taiwan can power its AI chip boom — but not with green energy
DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...

Wednesday 16 September 2026
China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands
Humanoid robot makers are cutting prices and scaling production, yet much of the industry remains unprofitable. Upstream suppliers are starting to show a different economics —...
Wednesday 16 September 2026
AI data centers give idle EV battery capacity a second life

Slowing EV growth in North America, tariffs, and policy restrictions are pushing automakers and battery suppliers to repurpose idle...

Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Tuesday 15 September 2026
Airbus weighs supplier stakes to relieve aerospace parts bottlenecks
Airbus is monitoring parts lead times across its supply chain and said direct equity stakes in, or takeovers of, subcontractors could be used in extreme cases to prevent supply disruptions...