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Thursday 3 September 2026
SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
Wednesday 2 September 2026
EU EV battery recycling still lacks a profitable model
The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Wednesday 2 September 2026
Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation...

Wednesday 2 September 2026
SDC to expand foldable iPhone OLED mass production in September
Samsung Display (SDC) is expected to formally expand mass production of OLED panels for Apple's foldable iPhone starting in September 2026. Although the ramp-up for the foldable iPhone...
Wednesday 2 September 2026
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Wednesday 2 September 2026
Innolux targets advanced packaging with debut of Chip Last tech
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
Wednesday 2 September 2026
Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC...
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

Wednesday 2 September 2026
Tmytek to list on Innovation Board in September on antenna module growth
Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the company has yet to turn profitable, its revenue mix has been...
Wednesday 2 September 2026
Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration
Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete...
Tuesday 1 September 2026
Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...