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    China moves to rein in booming energy storage and lithium battery overcapacity
    4h 15min ago
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    4h 15min ago
    Apple's iPhone Duo may lift foldables, but Taiwanese suppliers seek new growth
    4h 15min ago
    How Huawei, Xiaomi and Apple diverge in foldable phones
    4h 15min ago
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    4h 16min ago
    NEWS TAGGED PRODUCTION
    Thursday 10 September 2026
    Murata to stop some MLCC lines as AI server demand strains supply
    Murata Manufacturing said it will gradually end production of several multilayer ceramic capacitor (MLCC) part numbers as AI demand continues to pressure supply chains. The Japanese...
    Thursday 10 September 2026
    Navigating economies of scale: how South Korea and China are reshaping the OLED market
    Economies of scale occur when a company's average cost per unit falls as overall production volume increases. In the competitive display industry, reaching this state relies on either...
    Thursday 10 September 2026
    Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
    Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    China's Nvidia rivals raise prices as HBM shortage bites
    Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

    Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

    Thursday 10 September 2026
    Samsung SDS broadens AI push from software to factory robots
    Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that its systems-integration experience can turn fragmented robot...
    Thursday 10 September 2026
    Beyond the stage, can XPeng's EV playbook scale humanoid robots?
    As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Thursday 10 September 2026
    How AI and global expansion are reshaping semiconductor recruitment to production, tech integration
    Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released...
    1/187 pages
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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Semicon_TW