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Thursday 6 August 2026
US curbs on Chinese data-center optics open orders to non-China suppliers
The US Federal Communications Commission is reportedly considering restrictions on new models of Chinese-made optical transceivers used in data centers, potentially exposing suppliers...
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Thursday 6 August 2026
Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
Thursday 6 August 2026
China auto exports shift production and pressure suppliers in the first half of 2026
China’s auto industry shifted sharply in the first half of 2026 as export growth offset weakening domestic demand, pushing production toward export-connected manufacturing hubs...
Thursday 6 August 2026
Chicony Power wins US communications customer as AI server products move toward production
Chicony Power Technology Co. said on Aug. 4 that stronger demand for communication and server power improved its second-quarter 2026 product mix, even as higher raw material costs...
Wednesday 5 August 2026
Mitsubishi Electric, Daikin expand US production to meet data center cooling demand

Mitsubishi Electric is establishing a cooling-equipment production company in Ohio, joining Daikin Industries in bringing manufacturing...

Wednesday 5 August 2026
Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand
Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber...
Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
Wednesday 5 August 2026
AMD says server CPU market to hit US$220B by 2030

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity

China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung...

Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
From factories to consumers: Samsung's long retreat from China enters its final chapters

Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring...