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Monday 8 June 2026
Molex expands in Taiwan as AI interconnect demand splits between copper and optics
Molex is building out a dual-track strategy for AI interconnects, backing both copper and optical solutions as customers pursue different deployment paths, while expanding its Taiwan...
Monday 8 June 2026
Bottlenecks for upstream digital camera components pose dilemma for supply chain players amid market renaissance
Digital camera demand has made a striking comeback as younger consumers, social media creators, and the streaming economy inject new momentum into a market many had considered obsolete...
Monday 8 June 2026
Exclusive: The semiconductor battle behind AI data centers and EVs
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
Monday 8 June 2026
Microloops May revenue rises 54% as CSP cooling module shipments start
Cooling module maker Microloops reported May 2026 consolidated revenue of NT$330 million (approx. US$10.45 million), up 54.97% from a month earlier and down 10.76% from a year earlier...
Monday 8 June 2026
India tablet market grows despite memory cost pressure
India's tablet market grew 5% year-over-year in the first quarter of 2026, even as memory prices rose and macroeconomic conditions remained uncertain. For global consumers and manufacturers,...
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Monday 8 June 2026
Dassault Systèmes, QCT, and Nvidia push digital twins for AI factories
Dassault Systèmes, Quanta Cloud Technology, and Nvidia are advancing industrial digital twins for AI factories, a shift that could shape how companies worldwide build, run,...
Monday 8 June 2026
Murata launches smaller MLCC for electric and automated vehicles
Murata Manufacturing said it has begun mass production of a new automotive capacitor designed to help automakers cope with shrinking circuit-board space as electrification, advanced...
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Monday 8 June 2026
CWTC's May revenue hits record high as new plant targets late 2026 launch
Lead frame manufacturer Chang Wah Technology Co. (CWTC) says that as applications such as data centers, AI servers, and industrial control systems continue to grow rapidly, market...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker...

Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Sunday 7 June 2026
While China floods the humanoid market, America's top three are quietly building patent moats
Compared with China's crowded humanoid robot market, where competition is becoming increasingly intense, the US humanoid robot sector is still concentrated among a small number of...
Saturday 6 June 2026
AI demand squeezes mainstream DRAM supply as DDR5, DDR4 prices rise

DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications,...