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    Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
    4min ago
    SEMI launches alliance to ride semiconductor materials boom
    13min ago
    AI chip roadmaps force faster changes in data-center design, Cadence says
    16min ago
    Interview: Inside Foxconn's playbook for the sovereign AI data center race
    29min ago
    Taiwan speeds chip materials push with consumables, ITRI says
    34min ago
    Shanghai accepts YMTC's STAR Market listing application
    37min ago
    ASE's Huang urges AI profits to fund R&D for CPO, PLP
    43min ago
    Taiwan semiconductor materials team up to build local supply chain
    51min ago
    NEWS TAGGED PRODUCTION
    Monday 24 August 2026
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
    Monday 24 August 2026
    Xiaomi unveils second-generation humanoid robot at Beijing conference

    Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first...

    Saturday 22 August 2026
    Automation Taipei 2026: If AI is advancing so fast, why is the factory floor still so hard to automate?
    For all the extraordinary progress made by artificial intelligence, the physical world remains stubbornly difficult to automate.
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
    Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
    Friday 21 August 2026
    SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
    SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
    Friday 21 August 2026
    Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
    South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won,...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    Honor Robot Phone moves from concept to mass production

    With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

    Friday 21 August 2026
    SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
    SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    800VDC adoption in AI data centers is set to reshape power chip demand
    A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
    Friday 21 August 2026
    Nitto Denko to expand HDD baseboard capacity for AI data center demand
    Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by...
    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
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    BIZ FOCUS
    Aug 20, 11:00
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
    Thursday 20 August 2026
    Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape
    Thursday 20 August 2026
    Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film
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