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    China humanoid robot chips shift focus from raw compute to coordination efficiency
    6h 48min ago
    Russia drives ICE exports as Europe masks NEV transshipment demand
    6h 49min ago
    China tightens grip on LCD panels as TV share nears 80% and monitor share tops 70%
    6h 49min ago
    Samsung’s HBM comeback is only the beginning, exec warns
    6h 49min ago
    Commentary: AMD’s Taalas acquisition signals a shift toward ASIC-based AI inference
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    NEWS TAGGED PRODUCTION
    Monday 17 August 2026
    SK keyfoundry expands 8-inch capacity as China demand strains supply

    SK keyfoundry has approved KRW90 billion (approx. US$64 million) in capital spending to expand its 8-inch foundry capacity, a rare...

    Monday 17 August 2026
    China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
    Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing...
    Monday 17 August 2026
    Samsung weighs Giheung R&D line for 2nm HBM foundry capacity

    Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung...

    Monday 17 August 2026
    Samsung Electro-Mechanics, LG Innotek substrate lines near full capacity as AI demand rises

    Samsung Electro-Mechanics (SEMCO) and LG Innotek pushed their semiconductor package substrate operations close to full capacity in...

    Monday 17 August 2026
    OCI thins solar wafers to boost Vietnam output 39%
    OCI Holdings is turning to thinner solar wafers to raise output from its Vietnam operations by nearly 40% without adding production lines, as demand from US customers outpaces existing...
    Monday 17 August 2026
    FSC plans MLPC trial production by end-2026 in passive component push
    FS said it plans to begin trial production and shipments of high-end MLPC stacked solid-state capacitors by the end of 2026 as it expands beyond plastic injection molding machines...
    Monday 17 August 2026
    Toppan eyes FC-BGA substrate price hikes as new line fills up
    Japan's Toppan is negotiating price increases for FC-BGA substrates with customers as its new FC-BGA substrate plant ramps up, lifting the operating margin of its electronics business...
    Monday 17 August 2026
    Sigurd tops NT$2B in July revenue as AI testing demand surges
    Sigurd Microelectronics, an IC testing and packaging company, reported record July 2026 revenue and said demand from AI and AI connectivity markets drove the result. The company said...
    Saturday 15 August 2026
    Research Insight: Unitree IPO reveals humanoid robot commercialization still in early innings
    Chinese humanoid robot maker Unitree Robotics has drawn significant market attention with its IPO. Based on DIGITIMES' review of the company's three-hour IPO roadshow and Q&A session...
    Saturday 15 August 2026
    Lotes sees tight supply, says demand remains intact

    Connector maker Lotes is deepening its server business, with its server quick disconnect (QD) line set to enter mass production in July,...

    Saturday 15 August 2026
    MicroIP sees second-half revenue lift as board approves cash raise
    MICROIP, which focuses on AI software design services and ASIC design services, said its first-half 2026 financial report showed continued investment in core technologies and key IP...
    Friday 14 August 2026
    Research insight: Delta, Lite-on raise capex to 9% of revenue in AI data center power race
    The speed of AI data center deployment is raising the bar for power and cooling suppliers. Chipmakers such as Nvidia and AMD are refreshing platforms annually, with each generation...
    Friday 14 August 2026
    SK hynix scouts US memory fab sites as customers seek local supply
    SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production...
    Friday 14 August 2026
    South Korea chip cluster could expand to nine fabs as SK plans new investment
    South Korea's planned southwestern semiconductor cluster could eventually expand from four fabs to as many as nine as the government accelerates land, power, and infrastructure work...
    Friday 14 August 2026
    Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
    Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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