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Saturday 12 September 2026
Murata targets mass production of its AI power substrate next year
Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
Saturday 12 September 2026
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Saturday 12 September 2026
Luxshare eyes AR glasses breakthrough through car HUD model

At the 2026 China International Optoelectronic Exposition (CIOE), Luxshare and its lens module unit Luxvisions jointly showcased multiple...

Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
Innolux factory shift could reshape InnoCare's supply chain and growth mix
InnoCare Optoelectronics is preparing for a major supply-chain adjustment as Innolux Corporation restructures its factories, with the parent company's second plant scheduled to close...
Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
Micron brings forward record pay amid Taiwan strike threat
Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based...
Friday 11 September 2026
SK Hynix raises cash portion of bonuses after 25-vote union rejection

SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers...

Friday 11 September 2026
ASPEED plans December BMC price hikes to fuel server security footprint

As demand for AI servers intensifies and supply chain bottlenecks continue to ease, shipment momentum for baseboard management controller...

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
Friday 11 September 2026
Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry...

Thursday 10 September 2026
Murata to stop some MLCC lines as AI server demand strains supply
Murata Manufacturing said it will gradually end production of several multilayer ceramic capacitor (MLCC) part numbers as AI demand continues to pressure supply chains. The Japanese...
Thursday 10 September 2026
Navigating economies of scale: how South Korea and China are reshaping the OLED market
Economies of scale occur when a company's average cost per unit falls as overall production volume increases. In the competitive display industry, reaching this state relies on either...
Thursday 10 September 2026
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.