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Friday 16 October 2026
Gemtek partners with Starman to make optical transceivers in US
On October 15, network equipment maker Gemtek Technology announced a strategic partnership with Starman New Photonics, a subsidiary of Starman Holdings, to form a joint venture in...
Friday 16 October 2026
Taiwan to build industrial parks in US; Texas site already found
Taiwan plans to set up industrial parks in the US to help its supplier ecosystem reach customers like Nvidia and other local hardware manufacturers. It is starting with a complex in...
Friday 16 October 2026
Samsung to break ground on second Texas chip fab in November
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
Friday 16 October 2026
FICG eyes 4x optical communications capacity by 2027
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Friday 16 October 2026
US chipmakers rely more on overseas production than supplier data suggests, SIA finds
The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However,...
Friday 16 October 2026
Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
Friday 16 October 2026
LCD TV panel prices struggle to rise in 4Q26
LCD TV panel prices face a tug-of-war in the fourth quarter of 2026 as panel makers push for increases while LCD TV brands maintain relatively steady purchasing and contract manufacturers...
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Friday 16 October 2026
Hyundai Motor Group plans US$15.5 billion India investment from 2026
Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic...
Friday 16 October 2026
TSMC details pricing, confirms agentic AI boosts CPU demand
TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise...
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Friday 16 October 2026
Nvidia unveils PTFE switch board at OCP, names Taiwan partners
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
Friday 16 October 2026
Samsung SDI targets 2027 LFP BBU battery production
Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup...
Friday 16 October 2026
AI power crunch drives data center demand for self-generation
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
Friday 16 October 2026
TSMC excludes CPUs from AI accelerator growth forecast
Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...