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Tuesday 29 September 2026
Mercedes-Benz and ProLogium expand solid-state battery testing partnership
ProLogium Technology said it has signed a joint testing agreement with Mercedes-Benz, giving the automaker priority access to evaluate the battery maker's latest Gen4 cells. The companies...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
Tuesday 29 September 2026
Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
Tuesday 29 September 2026
AIDC sees NT$30 billion military maintenance boost, eyes drones
As the last Brave Eagle advanced trainer rolls off the line in September 2026, Aerospace Industrial Development Corporation (AIDC) says its military business is not ending with the...
Tuesday 29 September 2026
RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...
Tuesday 29 September 2026
Foxtron writes a new chapter in Taiwan auto history
Taiwan's auto market has faced plenty of challenges in recent years, from broader industry headwinds to continued scrutiny of domestic car production. Against that backdrop, Foxconn-backed...
Tuesday 29 September 2026
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...
Tuesday 29 September 2026
GlobalFoundries eyes GaN expansion to challenge TSMC in AI

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 29 September 2026
Taiwan's Brave Eagle reaches 55% domestic content, bringing 200 suppliers into aerospace

Taiwan's Brave Eagle advanced jet trainer program officially concluded its production phase in 2026, but the capabilities developed...

Tuesday 29 September 2026
HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
Tuesday 29 September 2026
South Korea looks beyond high-nickel NCM in battery push
South Korea is broadening its battery strategy beyond high-nickel NCM, stepping up investment in sodium-ion, all-solid-state and lower-cost technologies after acknowledging that its...
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Apple's foldable iPhone Duo faces low yields ahead of October launch
Apple's first foldable handset, the iPhone Duo, is nearing launch in October, but reports from China said production remains constrained by low yields in final assembly, panels, and...