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Monday 7 September 2026
STMicroelectronics says humanoid robots must clear a trio of hurdles
STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and...
Monday 7 September 2026
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum...
Monday 7 September 2026
China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D
China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.
Monday 7 September 2026
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built...
Monday 7 September 2026
Chicony Power's August revenue dips as AI server and satellite demand strengthens
Chicony Power Technology Co. said its August revenue slipped as a memory shortage hit demand for notebook power supplies. Still, stronger orders for AI server and satellite communications...
Monday 7 September 2026
China NEV imports sink as local brands crowd out foreign cars
China’s new energy vehicle import market continued to shrink in July, hitting its lowest level since 2026, as foreign automakers localize production and Chinese brands keep expanding...
Sunday 6 September 2026
BenQ Materials targets CPO in semiconductor push
BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
Sunday 6 September 2026
I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales
I-Chiun Precision Industry is accelerating its shift from LED lead frames into high-end thermal solutions, with thermal products now accounting for 40-45% of revenue. The company expects...
Sunday 6 September 2026
Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...
Saturday 5 September 2026
Samsung SDI nears solid-state battery mass production, eyes China supply chain
Reports that Samsung SDI's procurement team recently visited the Chinese production facilities of battery material maker Tinci Materials have drawn significant attention within China's...
Saturday 5 September 2026
Google TPU splits training, inference as CPU becomes next focus
As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president...
Saturday 5 September 2026
Jmem Tek's PQC security chip nears mass production
Taiwanese IC design startup Jmem Tek showcased its in-house physical unclonable function (PUF) and post-quantum cryptography (PQC) hardware security technologies at SEMICON Taiwan...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...