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Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
Monday 5 October 2026
Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
Saturday 3 October 2026
Biren readies BR20X, sharpening China's AI GPU challenge to Nvidia
Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
Friday 2 October 2026
Japanese firms cut China presence 22.4% as trade risks mount
Japanese companies sharply reduced their footprint in China over the past two years, with the number operating there falling 22.4% from 13,034 to 10,118 as of the end of June 2026,...
Friday 2 October 2026
ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Friday 2 October 2026
Hitachi and Fanuc launch Physical AI partnership for factory automation
Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion...
Friday 2 October 2026
Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra
Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for...
Friday 2 October 2026
China turns to 3D packaging to push AI performance beyond front-end scaling limits
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
Friday 2 October 2026
LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals
South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing:...
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Friday 2 October 2026
Tesla cuts AI5, AI6 memory specs to protect Optimus
Facing a prolonged memory supply crunch, Tesla CEO Elon Musk has announced steep cuts to the memory specifications of the company's AI5 and AI6 chips to secure enough memory for Optimus...
Friday 2 October 2026
UNEEC shifts ODM focus to racks as L11 rises to 18%
Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth...
Friday 2 October 2026
TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks
TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production...
Friday 2 October 2026
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
Friday 2 October 2026
JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment...