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Thursday 27 August 2026
Apple pressure on OLED prices squeezes South Korean panel profits
Apple is reportedly negotiating lower unit prices with South Korean OLED panel suppliers as surging prices for high-performance mobile DRAM, NAND flash, and other memory chips threaten...
Thursday 27 August 2026
Research Insight: US humanoid supply chains pivot away from China as Taiwan moves from parts to actuator modules
As the humanoid robot supply chain moves closer to mass-production readiness, Taiwan's precision manufacturing sector is gaining new opportunities to enter the US market, according...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Thursday 27 August 2026
WRC 2026 signals a new humanoid robot race as competition shifts from bodies to embodied AI models
The 2026 World Robot Conference (WRC 2026) has concluded in Beijing. While the commercial prospects of humanoid robots remain a subject of debate, they once again took center stage...
Wednesday 26 August 2026
YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5...
Wednesday 26 August 2026
Bioteq lifts Yilan plant output as it shifts production and eyes 2027 growth
Bioteq is increasing output at its Yilan Science Park plant, a move that could affect supply chains across Asia, Africa, and the Americas. As the company shifts more products and upgrades...
Wednesday 26 August 2026
Foxconn shifts China manufacturing from expansion to upgrade
Foxconn is accelerating the geographic diversification of its global manufacturing capacity as AI server demand surges and supply-chain regionalization continues, with 2026 capex expected...
Wednesday 26 August 2026
SK hynix production union rejects stock-heavy pay deal by 25 votes
SK hynix's production-worker union has rejected the company's tentative 2026 wage and collective bargaining agreement by just 25 votes, sending the two sides back to the negotiating...
Wednesday 26 August 2026
US-Canada trade talks collapse as auto tariffs threaten North American supply chain
The collapse of US-Canada trade talks has put global automakers and suppliers on alert, as tariff disputes now threaten production costs, vehicle prices, and cross-border parts flows...
Wednesday 26 August 2026
Taiwan AI Cloud flags four demands for AI from POC to production
Taiwan AI Cloud General Manager Han-chang Wu said at the 2026 Taiwan Sustainability Summit on August 25 that as open-source models mature, computing power becomes easier to access,...
Wednesday 26 August 2026
MOEA says circular economy output tops NT$1T
Taiwan's circular economy has entered a new stage as the Ministry of Economic Affairs (MOEA) said the sector's output has surpassed NT$1 trillion (US$31.4 billion), while calling for...
Wednesday 26 August 2026
India chip manufacturing push exposes production-test skills gap, NI says
India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...
Wednesday 26 August 2026
Kyocera to ramp up MLCC production for AI servers with JPY60B investment
Japanese components maker Kyocera is making a major push to capture surging AI demand. As part of its mid-term growth strategy toward FY2031, the company plans to begin mass production...
Wednesday 26 August 2026
Samsung Display boosts OLED sales as Galaxy Z panel orders triple
The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display,...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...