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Thursday 23 April 2026
SK Hynix to shift over half of NAND output to 321-layer chips
SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.
Thursday 23 April 2026
Tesla's US$25 billion investment push signals shift to AI and automation
Tesla reported steady first-quarter results while outlining an aggressive expansion into artificial intelligence, robotics, and energy — a strategy that executives say will define...
Thursday 23 April 2026
Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges
As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and...
Thursday 23 April 2026
TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV
TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
Thursday 23 April 2026
Google debuts TPU 8t and 8i as AI workloads diverge
Google Cloud Next 2026 kicked off on April 22 in Las Vegas, with Google Cloud CEO Thomas Kurian declaring that the experimental phase of artificial intelligence is over. Nearly 75%...
Thursday 23 April 2026
TSMC targets 2029 production for A13 and A12 as next AI chip nodes
At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...
Thursday 23 April 2026
Zhen Ding will build 10 new factories for global expansion
Taiwan-based PCB maker Zhen Ding Tech has stated that as customers' next-generation product platforms gradually enter mass production starting from the second quarter of 2026, its...
Thursday 23 April 2026
EV outlook revised downward as automakers pull back
Global forecasts of electric vehicle (EV) adoption have been lowered as automakers scale back near-term production and investment plans amid weaker-than-expected demand and mounting...
Thursday 23 April 2026
SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication...
Wednesday 22 April 2026
Brightek posts March loss as Nantong plant ramps up in 2H26
LED packaging maker Brightek reported consolidated revenue of NT$161 million (US$5.1 million) in the first quarter of 2026, down 9.7% year on year, impacted by the transition period...
Wednesday 22 April 2026
Powerchip DRAM foundry price hike to boost June revenue; IPD to drive Intel demand in 2H27
Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook...
Wednesday 22 April 2026
Column: US drone industry learns from Ukraine's low-cost, rapid production
"The drone is not the weapon. The infrastructure to build it is." This statement, made by Ukrainian president Volodymyr Zelenskyy on March 31, 2026, encapsulates the direction of recent...
Wednesday 22 April 2026
How MediaTek will supply Marvell's next three generations of TPUs
Recent market reports indicate that Marvell is in discussions with Google regarding the development of application-specific integrated circuit (ASIC) products, including memory processing...
Wednesday 22 April 2026
Flagship smartphone SoCs upgrade to 2nm drives cost surge and brand procurement shifts
Starting in the second half of 2026, all flagship smartphone SoCs will transition to the 2nm process node. While this promises enhanced performance for flagship devices, it also triggers...
Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product...