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Saturday 1 August 2026
MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027
MediaTek held an investor conference on July 31, 2026, with CEO Rick Tsai reiterating that ASIC revenue will reach US$2 billion in 2026. He also said the total addressable market for...
Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
Saturday 1 August 2026
Tandem OLED clears key automotive qualification hurdle, wider adoption expected after 2030

LCD panels still account for more than 90% of automotive display shipments, but OLED has now crossed a critical qualification threshold...

Saturday 1 August 2026
Elite Material posts record 2Q result on strong AI-related demand
Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...
Friday 31 July 2026
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Thunder Tiger calls for budget clarity as Taiwan pushes uncrewed surface vessel development
Taiwanese drone manufacturer Thunder Tiger demonstrated an uncrewed surface vessel (USV) equipped with mission autonomy software in collaboration with US-based defense technology startup...
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
India's first telecom manufacturing zone to land in Madhya Pradesh

India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and...

Friday 31 July 2026
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
Montage Announces Industry-First Trial Production of CXL 3.2 MXC

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...