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Tuesday 15 September 2026
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
Tuesday 15 September 2026
Panasonic Energy eyes JPY1 trillion yen AI storage revenue by 2028

Panasonic Energy, the battery unit of Panasonic Holdings, is betting big on energy storage for AI data centers as demand for backup...

Tuesday 15 September 2026
Samsung Display deepens ties with Vivo's iQOO through dedicated OLED line

Samsung Display is deepening its technology partnership with Vivo's iQOO brand, with the two companies jointly developing display technology...

Tuesday 15 September 2026
XPeng's Turing chip expands beyond cars
XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
Tuesday 15 September 2026
China reshapes cockpit display race, set to produce 84% of global AR-HUDs by 2031

S&P Global Mobility senior research analyst for connected cars and user experience in Asia-Pacific Quan Zhang shared the latest...

Tuesday 15 September 2026
Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

Tuesday 15 September 2026
Swiss drone maker shifts production to Taiwan

Shinkong Synthetic Fibers Corporation (SSFC) is working with Swiss drone company Jedsy through its investment in Earthbook, bringing...

Tuesday 15 September 2026
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency,...
Monday 14 September 2026
AI demand lifts UMC, VIS, PSMC revenue

After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power...

Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
Monday 14 September 2026
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
Monday 14 September 2026
China optical firms target photonics with mixed high-end, lower-cost push
The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest...
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...