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    China's solar industryon the brink of collapse as tax policy and technology shifts
    Jan 15, 18:11
    TSMC forecasts rising advanced process costs, consumer SoCs face affordability challenges
    Jan 15, 17:54
    US remote access security act tightens GPU use controls, challenges China's overseas AI deployments
    Jan 15, 17:54
    China's state media signals potential entry for SK Hynix and Samsung amid AI memory boom
    Jan 15, 17:54
    Huawei matches Nvidia's China AI chip market share in 2025, potential to overtake by 2026
    Jan 15, 17:54
    China's solar export tax rebates phase out signals subsidy era end
    Jan 15, 17:54
    Foxconn becomes key hardware partner in Apple's AI strategy from edge to cloud
    Jan 15, 17:54
    NEWS TAGGED PRODUCTION
    Thursday 15 January 2026
    SK Hynix accelerates Yongin fab launch by three months
    SK Hynix plans to bring forward the opening of a new semiconductor factory by three months and will also begin operating another new plant in February 2026, as surging memory demand...
    Thursday 15 January 2026
    Large-scale shipments unlikely for Samsung as 130-inch Micro RGB TV faces polarizer issues
    At CES 2026, Samsung Electronics revealed the R95H, the world's first 130-inch Micro RGB TV, highlighting its integration of AI in R&D, product development, and user experience...
    Thursday 15 January 2026
    Jorjin integrates US and Europe supply chains to target smart glasses
    Dan Cui, head of US business development at Jorjin Technology, stated that as a designer and system integrator for various augmented reality (AR) devices, the company must continuously...
    Thursday 15 January 2026
    UHT, Fong Jaw partner on dual-use VTOL drone for defense and commercial markets

    Taiwan-based advanced materials supplier UHT Unitech has signed a memorandum of understanding with aerospace manufacturer Fong Jaw Aerospace...

    Thursday 15 January 2026
    Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
    Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite...
    Thursday 15 January 2026
    Samsung reportedly files new HBM trademarks as HBM4 advances
    Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.
    Thursday 15 January 2026
    Japan fortifies rare-earth supply chain against China risk
    China has tightened export controls on rare earths and other dual-use materials bound for Japan, prompting Tokyo to formalise a rare-earth stockpiling policy and work with G7 partners...
    Thursday 15 January 2026
    EU implements minimum price mechanism for Chinese electric vehicles, reshaping competition in Europe
    The EU has introduced a minimum price commitment mechanism for Chinese battery electric vehicles (BEVs), fundamentally altering the competitive landscape in Europe. This move shifts...
    Thursday 15 January 2026
    EU minimum-price rule shifts China EV dispute from tariffs to head-to-head competition
    The EU has replaced tariffs on Chinese battery electric vehicles (BEVs) with a "minimum price commitment" mechanism, signaling a shift in the ongoing trade dispute from border barriers...
    Thursday 15 January 2026
    China's WUS to build US$300m optical-electrical PCB hub for AI systems
    WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
    Wednesday 14 January 2026
    SK Hynix to invest in new advanced packaging plant amid AI memory demand
    SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea...
    Wednesday 14 January 2026
    Meta doubles down on AI smart glasses, shuts VR studios

    Meta Platforms is reshaping its hardware and AI strategy. After reports of layoffs at its Reality Labs division, the US tech giant is now...

    Wednesday 14 January 2026
    Gold Circuit Electronics sees record revenue on ASIC server orders, plans Taiwan expansion
    PCB manufacturer Gold Circuit Electronics (GCE) posted a record-high full-year consolidated revenue in 2025, surging more than 50% year-over-year, driven by a ramp-up in ASIC server...
    Wednesday 14 January 2026
    Google reportedly looks to shift high-end Pixel development to Vietnam to address export scrutiny
    Google is reportedly planning to move the New Product Introduction (NPI) process for its high-end Pixel smartphones to Vietnam, a step that could mark a major shift in the tech giant's...
    Wednesday 14 January 2026
    TSMC turns Arizona gamble into goldmine as suppliers ride 10-year wave
    After five years of struggling with double construction timelines and billion-dollar regulatory hurdles, TSMC has quietly transformed its Arizona operations into a profit engine, and...
    1/167 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook