A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding...
Largan Technology said on October 8 that demand for new smartphone models weakened in September and that its newly completed automated plant will be used entirely for fiber array units,...
Baso Precision Optics held its latest online earnings call on October 7, during which the company acknowledged short-term pressures on its gross margin, due to ongoing adjustments...
Industrial PC (IPC) makers are adding US manufacturing as supply chains regionalize, tariff policy tightens, and government buyers press for local sourcing. For global readers, the...
Novatek reported stronger September and third-quarter 2026 revenue, suggesting seasonal smartphone demand and growth in edge AI chips are supporting the global display and chip supply...
Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as...
Amtran reported September 2026 revenue of NT$3.45 billion (US$107.87 million), up 26.4% month-over-month and 32.5% year-over-year, as higher-end display shipments and stable OLED monitor...
Sysgration posted record monthly consolidated revenue in September 2026 for the third consecutive month, pushing third-quarter revenue above NT$1 billion (approx. US$31.4 million)...
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
