DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have...
Taiwan-based Ta Liang Technology, a printed circuit board (PCB) equipment manufacturer, said its order visibility for PCB and semiconductor equipment extends through 2027, with its...
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine)...
As global foundry capacity expands and market dynamics shift, competitive pressures have intensified significantly across major manufacturing regions, particularly in mature process...
Samsung Display, BOE Technology Group, and Tianma Microelectronics are considering lower-cost OLED panels for entry-level smartphones as falling handset sales put pressure on display...
Apple and Samsung Electronics are working with suppliers on a new foldable glass design that could improve screen durability while maintaining flexibility, with potential adoption...
US silicon carbide (SiC) giant Wolfspeed will re-enter the gallium nitride (GaN) market through a vertically integrated model and expand into the GaN-on-silicon (GaN-on-Si) power device...
Mitsui Kinzoku will invest about JPY190 billion (approx. US$1.2 billion) to build a copper foil plant near its existing Malaysia site, targeting demand from optical communications...
China’s HKC has again stalled its OLED expansion, with equipment orders for its Gen 6 OLED line in Mianyang, Sichuan, yet to be placed despite plans for deposition equipment...
Hon Hai Precision Industry (Foxconn) will hold its third-quarter 2026 investor briefing in person at the Mandarin Oriental, Taipei, on November 12, as investors seek clarity on 2027...
Advanced Lithium Electrochemistry (Aleees) plans to make lithium iron phosphate (LFP) cathode material precursors in Taiwan and process them in the US under a North American customer...
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Asia Vital Components (AVC) expects all GPU- and ASIC-based AI servers to adopt liquid cooling by the end of 2027, with customers increasingly turning to double-sided cold plates to...
Jiangsu HISI Semiconductor (HISIGK) has prepared 14 automated lithography systems for delivery across 300mm, 200mm and 150mm wafer platforms, expanding its specialty semiconductor...
Some server buyers are asking for barebones systems and planning to purchase memory separately as component shortages complicate deliveries, according to independent electronic components...
