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Thursday 4 June 2026
Formosa Chemicals moves into AI data center materials and DUV photoresist precursors
Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The...
Thursday 4 June 2026
TSMC sees no sign of capex slowdown as demand stays strong
TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US,...
Thursday 4 June 2026
MiTAC Computing confident in 2026 growth amid AI server expansion
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, has no doubt that operations will grow in 2026, according to company president Rick Hwang. The company has two new US facilities...
Thursday 4 June 2026
BOE races Samsung for Gen 8.6 OLED title despite low yield

BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display...

Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company...
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment...
Wednesday 3 June 2026
Nvidia to accelerate Vera Rubin production; Quanta Computer to add three US plants by end of 2026
Quanta Computer executive vice president and Quanta Cloud Technology (QCT) president Mike Yang said GPU applications are expanding across training, edge computing, and storage, as...
Wednesday 3 June 2026
xMEMS sees 2027 debut for cooling chips as AI glasses, SSDs face heat limits

xMEMS Labs is preparing to move its MEMS-based µCooling technology toward commercial production in 2027, with AI glasses and data-center...

Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
Wednesday 3 June 2026
Largan makes first Computex appearance with CPO push for AI data centers
Largan Precision's debut at Computex 2026 signals a broader push into optical communications that could matter for AI data center supply chains worldwide. The Taiwan company is seeking...
Wednesday 3 June 2026
GSEO sees CPO business as potential second growth engine from 2027 to 2028
Genius Electronic Optical Co. (GSEO) said on May 29 that its co-packaged optics (CPO) business is moving toward rapid growth in 2027 and 2028, with shipments that could eventually...
Tuesday 2 June 2026
SK Hynix reportedly preparing Dalian fab for 200-layer FG NAND to capture AI storage demand
SK Hynix is reportedly preparing to mass-produce a new generation of 200-layer-class NAND flash memory based on floating-gate (FG) architecture at its Dalian Phase 2 facility in China,...
Tuesday 2 June 2026
Advantech and Nvidia roll out agentic AI factory brain to automate real-time operations
Advantech on June 1 said it deepened its strategic partnership with Nvidia and launched an AI-native factory architecture centered on an agentic multi-agent system called AI Factory...
Tuesday 2 June 2026
Pixverse AI exhibits fast, affordable AI video generation; ethical concerns persist
During Global Connect Show (GCS) 2026 in Shenzhen, China, Pixverse AI presented and demoed its AI video platform, reflecting the exceptional rate at which AI video is transforming...