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Monday 21 September 2026
Taiwan firms keen on investing in US manufacturing

A recent survey found that 36% of nearly 120 US manufacturers have already reshored or are actively reshoring production, while more than...

Monday 21 September 2026
Taiwan drone makers pursue dual-track growth on domestic defense orders, US market expansion

Following the Legislative Yuan's passage of the Act on Strengthening Defense Autonomy and Developing the Unmanned Vehicles Industry...

Monday 21 September 2026
Rebellions chips process over 4 billion tokens a day for SK Telecom
South Korean AI chipmaker Rebellions has expanded its neural processing units (NPUs) across four commercial SK Telecom services, with the infrastructure now processing about 14 million...
Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Monday 21 September 2026
First Solar withdraws 337 case, shifts TOPCon patent fight

US-based First Solar, best known for thin-film solar production, plans to withdraw its Section 337 complaint under the Tariff Act of...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move...

Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
CXMT closes in on DRAM leaders with G5 process breakthrough

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the...

Monday 21 September 2026
AMAX expands liquid-cooled data center in push beyond hardware

Amax is expanding its self-built liquid-cooled data center as the company moves beyond hardware into infrastructure and engineering...

Monday 21 September 2026
US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground

The US is reportedly pressuring Mexico to tighten rules of origin for AI hardware to limit the use of components produced outside North...

Monday 21 September 2026
HEC Compucase AI server products drive 2026 revenue growth

HEC Compucase's AI server-related rollout continues to gain traction as AI racks, cooling modules, and high-end power supplies move...

Monday 21 September 2026
Samsung reportedly cuts QD TV output 80% as Neo QLED phaseout looms

Samsung Electronics will reportedly slash quantum-dot (QD) LCD TV production in 2026 to 2 million to 3 million units, down as much as...