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Wednesday 18 March 2026
The signature on the wafer: Samsung, Nvidia, and Groq close loop on AI inference
The most telling moment of Nvidia's GTC 2026 did not unfold on the main stage of the SAP Center, but inside a glass display case at Booth 1207.
Wednesday 18 March 2026
IBM completes Confluent acquisition to power real-time AI data
On March 17, IBM completed its acquisition of Confluent, Inc., the data streaming platform used by more than 6,500 enterprises — including 40% of the Fortune 500 — to power...
Wednesday 18 March 2026
Nvidia secures approvals and orders for H200 in China, restarts supply chain production

During the GTC 2026 conference, Nvidia CEO Jensen Huang told global media that the company has made new progress in the China market.

Wednesday 18 March 2026
India's Agnit Semiconductors raises US$2.6 million to commercialise GaN chips for telecom and power
Agnit Semiconductors has raised US$2.6 million in a seed extension round led by Shastra VC, with existing investors 3one4 Capital and Zephyr Peacock participating. The Economic...
Wednesday 18 March 2026
Ultraband at Satellite 2026: Modular Tech for Multi-Orbit Satellite Era

As the global satellite communications industry rapidly advances toward a multi-orbit, multi-band architecture, the flexibility and scalability of ground terminal equipment...

Wednesday 18 March 2026
AI data center optics boom lifts Ezconn; orders seen through 3Q26, margin floor set at 50%
Surging global investment in AI data centers is accelerating growth for optical communications supplier Ezconn, which posted record revenue in 2025 after surpassing NT$10 billion for...
Wednesday 18 March 2026
Foxconn sees AI server market splitting GPU-ASIC 8:2 as CSP demand surges
Buoyed by sustained high capital expenditure by global cloud service providers (CSPs), AI servers and data center infrastructure have become the ICT supply chain's primary growth drivers...
Wednesday 18 March 2026
Chipbond sets sights on SiPh and LPO for next phase of growth
Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...
Tuesday 17 March 2026
InterBattery 2026: Solid-state battery commercialization accelerates as Posco and EcoPro set mass production targets by year-end
As major battery manufacturers accelerate the commercialization of solid-state batteries (SSBs), South Korea's battery materials industry is also speeding up product development and...
Tuesday 17 March 2026
Samsung Electronics reports shifts in raw material costs and production output in fiscal 2025
Samsung Electronics has released comprehensive operational data for fiscal 2025, revealing a complex picture of shifting raw material costs and high production efficiency. Despite...
Tuesday 17 March 2026
Samsung cautious on memory expansion amid concerns over 2028 supply glut
Samsung Electronics' semiconductor division is concerned that the current memory supercycle, driven by supply shortages, could last only one to two years before the market turns downward...
Tuesday 17 March 2026
Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...
Tuesday 17 March 2026
eMMC shortage sends NAND prices soaring, with further gains ahead
Supply disruptions in low-capacity eMMC are driving sharp price increases for SLC and MLC NAND as major global memory manufacturers exit older production nodes. Contract prices for...
Tuesday 17 March 2026
Nvidia GTC 2026: Samsung unveils HBM4E, showcasing comprehensive AI solutions, Nvidia partnership, and vision
Samsung Electronics outlined the full range of AI computing technologies it will present at Nvidia GTC 2026 in San Jose, California, March 16-19, highlighting memory, logic, foundry,...
Tuesday 17 March 2026
China's Hua Hong reportedly develops 7nm process — breakthrough or bottleneck?
Chinese foundry Hua Hong Semiconductor is reportedly preparing a 7nm chip manufacturing process, a development that could mark a significant shift for China's second-largest contract...