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Thursday 18 June 2026
BMW opens Neue Klasse reservations early; car business margin forecast unexpectedly cut in half
Although BMW's Neue Klasse BEV lineup is receiving strong market feedback and demand, it is also facing challenges due to weakness in the Chinese auto market and the conflict in the...
Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
Taiyo Yuden to boost AI server MLCC capacity, resists price hikes

Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers...

Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.

Wednesday 17 June 2026
Samsung, SK Hynix suppliers seek war-cost payback after US-Iran shock drains chip materials inventory

Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics,...

Wednesday 17 June 2026
Chip supply chains shift: TSMC's capacity crunch reportedly pushes Google, Tesla, BYD toward Samsung

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain...

Wednesday 17 June 2026
BOE starts production at China's first 8.6G AMOLED line
BOE Technology Group has begun mass production at its Chengdu high-tech zone facility, a move that could reshape the supply of OLED displays for notebooks and tablets, while intensifying...
Wednesday 17 June 2026
Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold...

Wednesday 17 June 2026
Nvidia highlights role of optical networking as Coherent breaks ground on Texas AI chip facility
AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could...