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Thursday 17 September 2026
SK Hynix reportedly eyes Intel Ohio plant for US memory production
SK Hynix is reportedly lining up US memory chip production and is in talks with Intel over possible cooperation, including leasing part of Intel's Ohio facilities. The move would give...
Thursday 17 September 2026
Physical AI targets factory assembly pain points

Deloitte Taiwan has warned that only 3% of companies have broadly integrated physical AI into operations, while just 5% say it has already...

Thursday 17 September 2026
Kinpo's push into higher-margin products, quantum control signals a wider industrial pivot

Kinpo Electronics said it is reshaping its business toward higher-margin products and expanding factory capacity across several countries...

Thursday 17 September 2026
SK Hynix shifts supply chain planning for AI capex boom

AI-driven capacity expansion is pushing up demand for semiconductor equipment, and SK Hynix is strengthening supply chain management...

Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
Why Wiwynn chose El Paso for its first US plant

Wiwynn held the grand opening for its first US factory on September 14 local time, choosing El Paso, Texas, over larger cities such...

Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
EV batteries cannot simply power humanoid robots, with energy density and costs posing key hurdles
Power battery technology has reached maturity in the new energy vehicle (NEV) market, but transferring it to humanoid robots presents two major barriers: the need for significant technological...
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses,...

Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
Wednesday 16 September 2026
Micron unveils 512GB DDR5 RDIMM for next-gen servers

Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Exclusive: Wiwynn expands US, Mexico plants, aiming to double capacity by 2027
Wiwynn has officially kicked off mass production at its first US manufacturing facility. Departing from its previous strategy of leasing facilities in North America, the company is...