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Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...
Saturday 4 July 2026
Samsung and SK Hynix seek substrate price cuts for the second half of 2026
Samsung Electronics and SK Hynix are reportedly pressing South Korean semiconductor substrate suppliers to lower prices for the second half of 2026, even as memory demand remains in...
Friday 3 July 2026
Apple plans five iPhone launches to capture market share amid component shortages

Apple is reportedly planning to launch at least five new models by this time next year, with the company expanding its foldables' production...

Friday 3 July 2026
Chinese NOR Flash supplier Giantec raises prices 25% as memory market risks persist

China's memory price rally continues to gather momentum. Giantec Semiconductor Corporation, a Chinese NOR flash supplier, recently...

Friday 3 July 2026
China's polarizer makers seek price hikes as material bottlenecks bite

Chinese polarizer film suppliers are seeking higher prices from panel makers after raw-material and logistics costs rose in the second...

Friday 3 July 2026
CSCC expands Pingnan plant to lift carbon materials output
China Steel Chemical Corporation (CSCC) is expanding its Pingnan plant to increase development capacity for advanced carbon materials and graphite blocks. The Taiwan-based subsidiary...
Friday 3 July 2026
Turvo shifts North America production as robot revenue target rises before 2029
Turvo International said it has expanded its manufacturing footprint across Taiwan, China and the US to reduce exposure to tariffs and geopolitical risk, while preparing for a bigger...
Friday 3 July 2026
Samsung's HBM4E yield tops 70%, sharpening AI memory race with SK Hynix and Micron
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening...
Friday 3 July 2026
Cheng Mei accelerates semiconductor shift as polarizer market faces cost pressure

Cheng Mei Materials is expanding into semiconductor materials to support supply chain adjustments for outsourced chip assembly and...

Thursday 2 July 2026
Micron and GM strike long-term memory supply deal for vehicles
Micron Technology and General Motors (GM) have signed a strategic customer agreement to secure a long-term supply of memory and storage products for vehicle production. The deal underscores...
Thursday 2 July 2026
Taiwan's Eurocharm eyes peak 2026 on North American powersports cycle, Vietnam EV shift, and server rack entry
Taiwan's major precision parts maker Eurocharm Holdings is forecasting a record-breaking 2026, driven by robust North American SUV-related demand, a structural shift toward electric...
Thursday 2 July 2026
Samsung courts AI chipmakers with 2nm roadmap amid firming foundry demand

Samsung Electronics used its annual foundry ecosystem event on July 1 to signal that its contract chipmaking business is regaining momentum,...

Thursday 2 July 2026
LG Electronics moves into ASIC design services as TSMC ties draw attention
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company...
Thursday 2 July 2026
Techman Robot upgrades automotive production lines at Quanta Computer Germany plant with AI cobots
Techman Robot announced its artificial intelligence (AI) collaborative robots (cobots) have been successfully deployed at parent company Quanta Computer's automotive computer and automotive...