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Monday 31 August 2026
Taiwan vendors chase India's wireless broadband opportunity, with Alpha Networks in the lead
India's market for Wi-Fi millimeter-wave (mmWave) fixed wireless access (FWA) remains at an early stage, with formal commercial standards still dependent on operators completing field...
Monday 31 August 2026
MetaX posts first-half profit while China's AI GPU rivals split
MetaX posted its first half-year profit since listing, with rising GPU shipments and the mass production of its C600 accelerator strengthening its commercial position while China's...
Monday 31 August 2026
Samsung Galaxy Z Fold8 demand surges, straining UMC 22nm DDI supply
Samsung Electronics' first passport-style foldable, the Galaxy Z Fold8, is reportedly facing tight display driver IC (DDI) supply as demand exceeds expectations. Samsung has continued...
Monday 31 August 2026
CXMT starts LPDDR6 mass production for Xiaomi 18 Fold, claiming global first
China's CXMT has begun mass production of its LPDDR6 memory and will supply the first batch to Xiaomi's upcoming 18 Fold flagship, marking what the company says is the first commercial...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Monday 31 August 2026
China optical display investment shrinks 80% in 1H26
China's optical display industry is cooling after years of aggressive panel fab construction that has reshaped the global display landscape. Investments in China's optical display...
Monday 31 August 2026
USI advances optical interconnect push with ELSFP laser module
Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds...
Monday 31 August 2026
Repon to ship Vera Rubin rails in August, ramp ASIC in September
Server rail maker Repon began shipping Nvidia's Vera Rubin rack products in August 2026, with ASIC server rack rails set for mass production in September. The higher average selling...
Sunday 30 August 2026
Humanoid robot shipments top 22,000 in 1H26 as industrial use gains ground
As embodied intelligence takes physical form amid widespread production-capacity expansion in the humanoid robot sector, it is becoming increasingly possible to envision a society...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Friday 28 August 2026
ASIC makers see CSP orders stay strong through 2028
The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Hiroca Holdings 2Q26 loss narrows as China plant consolidation supports recovery
Automotive components manufacturer Hiroca Holdings stated on August 27 that although losses were still recorded in the second quarter of 2026 due to weak pull-ins from China's domestic...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...