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Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Hiroca Holdings 2Q26 loss narrows as China plant consolidation supports recovery
Automotive components manufacturer Hiroca Holdings stated on August 27 that although losses were still recorded in the second quarter of 2026 due to weak pull-ins from China's domestic...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
SK Hynix weighs closer ties with Kioxia in NAND
SK Hynix is weighing closer cooperation with Japan's Kioxia Holdings in NAND flash, extending the strategic message from its newly launched US HBM expansion into a memory segment where...
Friday 28 August 2026
YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
Friday 28 August 2026
Vanguard says Taoyuan fab fire did not disrupt production
Vanguard International Semiconductor said a fire broke out late on August 27 on the roof of its Wafer Fab 3 in Taoyuan City, Taiwan, but the incident caused no major impact on production...
Friday 28 August 2026
SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM
SK hynix broke ground on August 27 on a US$4 billion advanced packaging plant in Purdue Research Park, its first US high-bandwidth memory (HBM) site.
Friday 28 August 2026
LG Innotek wins Zoox camera module order for robotaxi production
LG Innotek said it will mass produce and supply automotive camera modules for Zoox, Amazon's autonomous vehicle unit. The deal marks the Korean component maker's first mass production...
Friday 28 August 2026
IntelliEPI says Japan substrate outage hit 2Q26 revenue
IntelliEPI said on August 27 that revenue in the second quarter of 2026 was pressured after a Japanese substrate supplier shut down for nearly three weeks during the Golden Week holiday,...
Friday 28 August 2026
China's humanoid boom hits its next bottleneck: making robots measurable, interoperable, safe
Capital interest in China has become unusually concentrated on robotics following a state-backed commitment to redirect sizable portions of tech-related incentives from a perfectly...
Friday 28 August 2026
Wah Lee targets 2Q27 ODM phase as robotics push moves beyond components
Wah Lee Industrial is targeting the second quarter of 2027 to move its Physical AI push into an ODM development phase, signaling an effort to capture more value beyond supplying materials,...
Friday 28 August 2026
AI chip demand squeezes capacity, Data Image secures 1-year supply
As strong AI demand continues to soak up semiconductor capacity, some ICs and passive components are seeing shortages and longer lead times. Qisda's display maker Data Image has stepped...
Friday 28 August 2026
P-Duke Technology optimistic on 2H26 growth as demand surges across three niche markets
P-Duke Technology, a manufacturer of specialized niche power supplies, said during its earnings call on August 26 that it remains optimistic about its outlook for second-half and full-year...
Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...