DIGITIMES: News and Insight of the Global Supply Chain

DS Technology shifts from custom automation to modular systems, eyes Brazil and Mexico

DIGITIMES — Fri, 21 Aug 2026 08:55:55 GMT

Taiwanese automation integrator DS Technology is shifting more of its highly customized robotic automation work toward standardized, modular systems as it seeks to make its technology easier to sell and deploy overseas, with prospective partners in Brazil and Mexico among its latest expansion targets.

China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up

DIGITIMES — Fri, 21 Aug 2026 08:45:00 GMT

Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving economies of scale.

Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push

DIGITIMES — Fri, 21 Aug 2026 08:20:00 GMT

Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to expand its role in the rapidly growing AI infrastructure market, according to Bloomberg.

Vecow eyes robotics growth as North America, EMEA account for 65% of business

DIGITIMES — Fri, 21 Aug 2026 08:16:53 GMT

Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for 65% of its business, Executive Vice President Joseph Huang said at Automation Taipei 2026 on August 21.

Ubtech expands humanoid push as Nvidia executives quietly visit WRC booth

Scarlett Yu — Fri, 21 Aug 2026 08:00:12 GMT

As the first publicly listed humanoid robot company, Ubtech Robotics is often referred to in China as the sector's "first humanoid robot stock." At the 2026 World Robot Conference (WRC) in Beijing, the company found itself sharing the spotlight with recently listed Unitree Robotics, as both showcased their latest humanoid platforms.

Top 4 CSPs boost AI infrastructure; volume ramping of 800G switches fuels Accton's growth

Yunnie Cheng — Fri, 21 Aug 2026 08:00:00 GMT

Major global cloud service providers (CSPs) continue to scale up investments in AI infrastructure. According to the latest DIGITIMES research report, combined capital expenditures from Amazon, Microsoft, Alphabet, and Meta are projected to reach a record high of US$745 billion in 2026.

Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens

Yunnie Cheng — Fri, 21 Aug 2026 07:55:00 GMT

Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across Taiwan and China for validation. Meanwhile, the timeline for its dual-arm logistics robot, originally scheduled for small-batch shipment in 2026, has been adjusted due to customer requirement changes. Hiwin expects to submit revised samples for testing in November.

Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM

Levi Li — Fri, 21 Aug 2026 07:55:00 GMT

Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation platform targeting large-model training and inference while improving programmability, ease of use, performance, power efficiency and chip area.

Huawei, China power giant Huaneng explore AI compute-power coordination

Levi Li — Fri, 21 Aug 2026 07:50:00 GMT

China Huaneng Group said on August 20 that chairman Wen Shugang and president Zhong Guodong recently visited Huawei in Shenzhen, where they met Huawei founder Ren Zhengfei to discuss potential cooperation in artificial intelligence, computing power and "compute-power coordination."

SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders

Charlene Chen — Fri, 21 Aug 2026 07:40:00 GMT

SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized to the market for the pace of memory chip price increases, saying the rapid rise is fueling chip inflation across the industry.

Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus

DIGITIMES — Fri, 21 Aug 2026 06:32:37 GMT

South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won, at a time when semiconductor investment, artificial intelligence and US demands for more local manufacturing are becoming increasingly intertwined.

Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge

Jingyue Hsiao — Fri, 21 Aug 2026 06:24:31 GMT

The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES, the three largest upstream memory chip makers are headed for a more than threefold jump in combined DRAM and NAND revenue in 2026, with supply constraints likely to keep pricing firm until new capacity arrives in 2027.

CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth

Levi Li — Fri, 21 Aug 2026 06:20:00 GMT

Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation Exhibition, held from August 19 to 22.

Taiwan automation shifts from hardware specs to AI platforms and open robot architectures

Willis Ke — Fri, 21 Aug 2026 05:45:00 GMT

Taiwan's automation industry is moving beyond the traditional race over robot-arm payload, servo precision, and sensor resolution. At the 2026 Automation Taipei and Taiwan Automation Intelligence and Robot Show, held August 19-22 at the Taipei Nangang Exhibition Center, the industry's major players all put the spotlight on AI software-hardware integration platforms and open robot architectures as the technologies will determine the next phase of competition.

Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

Charlene Chen — Fri, 21 Aug 2026 04:17:03 GMT

Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement with Google on July 29 to develop custom chips. The move has drawn close attention across Taiwan's chip supply chain, especially to the impact on IC design leader MediaTek and networking chip giant Broadcom.

Automation Taipei 2026: The invisible joint — why aerospace lightweighting is rewriting how parts are built

DIGITIMES — Fri, 21 Aug 2026 04:14:52 GMT

The aerospace industry's pursuit of lighter structures has long centered on advanced alloys, composites and additive manufacturing. But as aircraft and spacecraft shed weight, another manufacturing challenge becomes harder to ignore: the interface between the materials themselves.

Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

Yunnie Cheng — Fri, 21 Aug 2026 04:08:47 GMT

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and financial executives gathered to discuss the industry's next frontier. During the event, DIGITIMES deputy director Jason Tsai pointed out that as electricity supply struggles to keep pace with soaring compute demands, energy efficiency per unit of compute power will dictate the future fate of AI data centers.

Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy

DIGITIMES — Fri, 21 Aug 2026 04:08:08 GMT

Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.

JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

DIGITIMES — Fri, 21 Aug 2026 04:02:43 GMT

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance computing lifting capacity utilization and accelerating the shift toward higher-value advanced packaging.

Honor Robot Phone moves from concept to mass production

Kevin Wang — Fri, 21 Aug 2026 04:00:46 GMT

With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers are redefining product design. Many have lauded Honor for its ability to pack a mechanically stabilized gimbal into a phone, and moreover move the device from concept showcase to a mass-produced product that consumers can actually buy. In addition, the device serves as a reference for future products in integrating imaging functionality and AI interactivity.

Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks

DIGITIMES — Fri, 21 Aug 2026 03:46:43 GMT

Aircraft and spacecraft may be judged by thrust, payload capacity, and range, but the German Industry Solutions Session held at Automation Taipei 2026 on August 20 suggested that some of aerospace manufacturing's most consequential advances are taking place somewhere far less visible: inside connectors, bonded joints, laser-processed surfaces, dispensing paths, and robotic assembly cells.

Apple's VR retreat deepens with rumored layoffs in its Vision team

DIGITIMES — Fri, 21 Aug 2026 03:35:09 GMT

Apple's spatial computing ambitions are narrowing rather than disappearing, but the direction is increasingly clear: fewer people are building VR headsets, and more are building AI-driven smart glasses.

SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final

DIGITIMES — Fri, 21 Aug 2026 03:27:33 GMT

SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision has been finalized.

AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand

Yunnie Cheng — Fri, 21 Aug 2026 03:22:19 GMT

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES, industry experts highlighted that the massive volume of tokens consumed by AI services has become a growing financial burden for companies relying on AI integration. Meanwhile, although AI usage among US consumers is widespread, only 3% are paying users, with an average expenditure of around US$20. Taiwanese manufacturers should closely analyze the underlying implications of this shift.

Research Insight: 2028 key year for optical interconnects in AI racks

Lily Hess — Fri, 21 Aug 2026 03:16:24 GMT

Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale drives demand for faster data transfer, lower latency, and higher-bandwidth interconnects.

Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays

Eifeh Strom — Fri, 21 Aug 2026 03:12:09 GMT

Iris Optronics, a manufacturer of cholesteric liquid crystal display (ChLCD) e-paper, announced upgrades to its Infinity solar-powered ChLCD e-paper series, including a mass-producible 31.5-inch large-format outdoor commercial display. It has also developed an embedded perovskite-powered ChLCD e-paper solution for indoor commercial display applications.

HP Korea localizes AI strategy with Upstage in healthcare, finance

Rodney Chan — Fri, 21 Aug 2026 03:12:03 GMT

HP Korea is sharpening its localized AI strategy through a partnership with large language model (LLM) startup Upstage, and has already moved into AI transformation (AX), eyeing demand from document-heavy industries such as healthcare and finance. Built around high-performance AI workstations, the company is offering an end-to-end pipeline from scanning and inference to printing, helping HP break out of its image as only a PC supplier in the South Korean market.

Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's

Yunnie Cheng — Fri, 21 Aug 2026 02:44:44 GMT

As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent financial analysis, however, suggests that South Korea may face fewer side effects from single-industry reliance than Taiwan.

Goertek reports higher revenue and profit in 1H26

DIGITIMES — Fri, 21 Aug 2026 02:37:30 GMT

Chinese electronics manufacturer Goertek reported higher revenue and profit for the first half of 2026, supported by growth in its smart acoustic products and continued investment in R&D.

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Levi Li — Fri, 21 Aug 2026 02:33:15 GMT

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus as a next-generation packaging technology that converts traditional round wafer formats into rectangular panels, offering potential gains in both production efficiency and cost.

Chinese robots pivot to AI models as Unitree, UBTECH shift hardware focus to 'brains'

Yunnie Cheng — Fri, 21 Aug 2026 02:23:00 GMT

The battlefield for Chinese humanoid robotics is shifting from motors, joints, and mechanical structures toward AI large models. As embodied AI models begin handling perception, task planning, and motion control, manufacturers are working to deploy a single AI capability across diverse robots and application scenarios, effectively decoupling the robot's "brain" from its "body."

Anthropic venture acquires Casper Studios to expand enterprise AI services

DIGITIMES — Fri, 21 Aug 2026 02:21:08 GMT

Ode with Anthropic, an Anthropic venture arm, said it has acquired Casper Studios, a move that expands its enterprise artificial intelligence services as companies worldwide look for practical ways to deploy AI inside existing workflows. The deal underscores growing demand for partners that can turn experimentation into measurable business gains across global operations.

China's new solid-state battery standards could reshape the industry

Jingyue Hsiao — Fri, 21 Aug 2026 02:14:13 GMT

China has introduced the world's first national standards for automotive solid-state batteries, setting off market speculation that most of the country's more than 320 players may ultimately fail to meet the new bar. The rules tighten definitions, safety testing, and mass-production expectations, shifting competition from concept claims to engineering proof and industrial readiness.

Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains

Jingyue Hsiao — Fri, 21 Aug 2026 02:01:47 GMT

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.

800VDC adoption in AI data centers is set to reshape power chip demand

Jingyue Hsiao — Fri, 21 Aug 2026 01:56:55 GMT

A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors are preparing related products for 2026, as rising AI workloads push power systems toward a new scale. The trend may accelerate adoption across gallium nitride (GaN), silicon carbide (SiC), and Vertical Power Delivery (VPD) technologies.

TIER IV and Renesas team up on open AI-native computing platform for autonomous vehicles

DIGITIMES — Fri, 21 Aug 2026 01:46:46 GMT

A new collaboration between TIER IV and Renesas could shape how self-driving and software-defined vehicles are built worldwide, as automakers seek more flexible platforms for AI-driven features. The effort aims to combine open-source software, advanced chips, and scalable tools that may accelerate safer mobility across markets from Asia to Europe to North America.

Taiwan export orders near US$98 billion in July, with US as top buyer

Eifeh Strom — Fri, 21 Aug 2026 01:45:00 GMT

Taiwan's export orders climbed by US$207.3 billion, or 52.5%, in the first seven months of 2026 compared with the same period in 2025, according to data released on August 20 by the Department of Statistics (DOS) under Taiwan's Ministry of Economic Affairs (MOEA). From January to July 2026, orders placed by the US reached US$235.7 billion, accounting for 39.1% of the total US$602 billion in orders, rising more than 70% year over year and making the US Taiwan's largest buyer.

Stripe weighs US$7 billion OpenRouter deal to expand AI model routing

DIGITIMES — Fri, 21 Aug 2026 01:43:23 GMT

Stripe is in acquisition talks to buy AI startup OpenRouter for more than US$7 billion, according to reporting by Bloomberg and Axios. The price would be more than five times the US$1.3 billion valuation OpenRouter reached in a funding round in May 2026.

Alibaba's 45% AI cloud jump masked by 75% capex surge and margin squeeze

DIGITIMES — Fri, 21 Aug 2026 01:40:25 GMT

Alibaba Group's June quarter is the clearest statement yet that the company now runs as an AI infrastructure business with an e-commerce cash engine attached, rather than the other way around. Revenue rose 9% year-over-year to CNY268.95 billion (US$39.64 billion), but the composition of that growth, and the cost of buying it, matter more than the headline.

SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

DIGITIMES — Fri, 21 Aug 2026 01:31:42 GMT

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory (HBM) to compete not just on individual chip performance but on how memory, processors, and networking are designed together as AI computing systems scale.

Unitree chief says humanoid robots are not yet ready for mass real-world work

Jingyue Hsiao — Fri, 21 Aug 2026 01:30:00 GMT

Unitree Technology's soaring debut underscored investor enthusiasm for humanoid robots, but the company's founder said the industry still faces key limits before machines can perform everyday work in homes and factories.

Alibaba guides AI cloud revenue toward US$10 billion run-rate next quarter

DIGITIMES — Fri, 21 Aug 2026 01:24:05 GMT

Alibaba is signaling that its most capital-intensive bet yet — a three-year, CNY380 billion (US$56.33 billion) buildout of AI compute — is starting to compound into a self-reinforcing growth cycle, even as the near-term cost of that buildout shows up in a sharp swing in capital spending and a steep drop in group profitability.

Micron launches long-horizon research hub to push memory and AI development

DIGITIMES — Fri, 21 Aug 2026 01:15:50 GMT

Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort targets breakthroughs in memory, advanced packaging, and new compute architectures that may shape global technology supply chains, energy use, and access to smarter devices.

Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up

DIGITIMES — Thu, 20 Aug 2026 22:17:33 GMT

Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.

US ban on robot dogs clears the way for Taiwan's Swancor

Charlene Chen — Thu, 20 Aug 2026 22:17:13 GMT

To safeguard national security and the development of the AI supply chain, the US has banned imports of advanced humanoid robots. Against that backdrop, Taiwan-based Swancor unveiled its first "Taiwan AI robot ecosystem" at Automation Taipei 2026, joining with more than 10 Taiwanese industry, technology, and academic partners to showcase applications ranging from smart inspection and public safety to smart construction, AI education platforms, commercial interaction, and long-term care companionship.

JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

DIGITIMES — Thu, 20 Aug 2026 22:16:36 GMT

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities towards denser 2.5D and 3D integration.

Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers

DIGITIMES — Thu, 20 Aug 2026 22:16:01 GMT

Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring across company filings.

Elice to build South Korea's first warm-water-cooled AI data center, unveils coding agent

Sherri Wang — Thu, 20 Aug 2026 22:15:40 GMT

South Korean AI infrastructure provider Elice Group is expanding on two fronts, adding enterprise AI transformation (AX) solutions while building what it says will be the country's first AI data center to use warm-water cooling above 40°C.

Korean display makers step up OLED patent push as China narrows technology gap

DIGITIMES — Thu, 20 Aug 2026 22:15:08 GMT

Korean display makers are stepping up patent licensing and cross-border enforcement as Chinese rivals have sharply narrowed the technology and market-share gap in OLED since 2020, just as competition expands into higher-value panels for notebooks and monitors.

Nitto Denko to expand HDD baseboard capacity for AI data center demand

DIGITIMES — Thu, 20 Aug 2026 22:14:36 GMT

Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by 40% from fiscal 2025 levels. The move is aimed at meeting demand driven by AI-related data center growth.

China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump

DIGITIMES — Thu, 20 Aug 2026 22:14:21 GMT

National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued R&D spending, currency movements and inventory impairments widened its net loss.

Samsung holds off on High-NA EUV until 1nm production

DIGITIMES — Thu, 20 Aug 2026 22:13:56 GMT

Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier hoped to introduce the technology at the 2nm and 1.4nm nodes.

China's humanoid robot shipments hit 40,000 in the first half of 2026

DIGITIMES — Thu, 20 Aug 2026 22:12:49 GMT

China shipped more than 40,000 humanoid robots in the first half of 2026, lifting its share of global shipments to 97%, according to a development report released on August 20 at the 2026 World Robot Conference in Beijing. The figure marked the highest share ever recorded in the report's historical data and underscored China's growing role in the global humanoid robot supply chain.

TXC pivots to AI infrastructure as 1.6T optical modules surge

Charlene Chen — Thu, 20 Aug 2026 22:12:24 GMT

Quartz component leader TXC is targeting AI and automotive applications as demand grows for faster data transmission, with 1.6T optical modules expected to see explosive growth in the second half of 2026. The company aims to lift AI revenue to 20% by the end of 2026, with roughly 20-30% of that coming from optical module applications.

DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

Lily Hess — Thu, 20 Aug 2026 22:10:38 GMT

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy," DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan's AI data center capacity is about one-sixth of South Korea's.

Longcheer and Luxshare move into robot ODM

Charlene Chen — Thu, 20 Aug 2026 22:10:16 GMT

China consumer electronics ODMs are extending their R&D, supply chain integration and mass production capabilities into the embodied AI robot market. Longcheer announced on August 19 that it had signed an agreement with the Nanchang High-tech Zone in Jiangxi, officially establishing an embodied AI robot R&D and manufacturing base. The company said it will build end-to-end capabilities from product definition and R&D design to engineering delivery, offering ODM solutions for embodied AI products.

How credit allocation is becoming part of the AI supply chain

Yunnie Cheng — Thu, 20 Aug 2026 22:09:50 GMT

As artificial intelligence (AI) evolves, shifting bottlenecks reflect the maturity of the AI boom. Initial constraints emerged at the semiconductor level with GPUs, high bandwidth memory (HBM), and advanced packaging. Next came system-level challenges around networking, power, and thermal management. More recently, infrastructure limits, including transformers, grid connections, and overall power capacity, took center stage.

Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate

Scarlett Yu — Thu, 20 Aug 2026 22:09:26 GMT

High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO Jensen Huang has described as the industry's "five-layer cake," but also a concrete manifestation of the idea that computing power ultimately depends on electrical power.

Kenmec surges on AI, advanced packaging to record orders, revenue

Yunnie Cheng — Thu, 20 Aug 2026 22:09:03 GMT

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec Mechanical Engineering, a subsidiary of Kenmec Group, has seen its order backlog surge to nearly NT$6.661 billion (approx. US$209.1 million). Driven by this momentum, both the subsidiary and the group overall are on track to hit historic highs in revenue and order intake in 2026.

Charts: Foxconn is losing share of Taiwan's EMS revenue as Quanta and Wistron near double

DIGITIMES — Thu, 20 Aug 2026 22:08:13 GMT

The sub-sector's dominant supplier grew 37.9% year to date and still ranks only seventh of 20, while the other 19 companies grew 56.9% between them.

Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26

DIGITIMES — Thu, 20 Aug 2026 09:21:53 GMT

In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentu