<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Sun, 26 Apr 2026 00:51:17 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES Asia</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/NewWLogo.gif</url>
</image>
<item>
<title>BMW's color-changing car is no longer a concept &#38;mdash; E Ink says it's ready for mass production</title>
<pubDate>Sun, 26 Apr 2026 00:44:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD232/e-ink-automotive-e-paper-bmw.html</link>
<description>E-paper manufacturer E Ink stated that the BMW iX3 Flow Edition equipped with E Ink Prism technology was officially released at the Auto China 2026. This represents a major breakthrough in automotive surface innovation technology. The BMW iX3 Flow Edition has become the world's first vehicle to adopt E Ink Prism electronic paper technology and move toward mass production, marking a new stage in which electronic paper vehicle-body technology has officially transitioned from concept demonstrations to practical applications.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD232/e-ink-automotive-e-paper-bmw.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd232_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: E Ink]]></media:description>
</media:content></item>
<item>
<title>Harman hits KRW15.78 trillion in revenue 10 years after Samsung acquisition</title>
<pubDate>Sun, 26 Apr 2026 00:41:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD230/samsung-harman-revenue-adas.html</link>
<description>Samsung Electronics executive chairman Lee Jae-yong's bold acquisition of premium audio brand Harman for KRW9.4 trillion (approx. US$6.3 billion) a decade ago has paid off, with the American subsidiary of Samsung posting historic highs in both revenue and operating profit.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD230/samsung-harman-revenue-adas.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AI data centers hit interconnect limits, boosting optical module demand</title>
<pubDate>Sun, 26 Apr 2026 00:41:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL212/data-demand-infrastructure-growth-2026.html</link>
<description>&lt;p class="P1" data-start="76" data-end="240"&gt;The surge in optical module stocks reflects a deeper shift in AI infrastructure: the bottleneck is no longer computing power alone, but how that power is connected.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL212/data-demand-infrastructure-growth-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SCMP]]></media:description>
</media:content></item>
<item>
<title>Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens</title>
<pubDate>Sun, 26 Apr 2026 00:40:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL217/samsung-kingston-ssd-price-inventory.html</link>
<description>&lt;p class="P1" data-start="1831" data-end="2089"&gt;Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state drive (SSD) product lines, according to &lt;em&gt;IT Home&lt;/em&gt;, citing supply chain sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL217/samsung-kingston-ssd-price-inventory.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl217_files/4_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>ASML cuts management layers due to restructuring; TSMC stance affects High-NA outlook</title>
<pubDate>Sun, 26 Apr 2026 00:40:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL218/asml-management-tsmc-high-na-outlook.html</link>
<description>&lt;p class="P1" data-start="318" data-end="551"&gt;ASML is moving to eliminate a wide range of management roles as part of a broader effort to simplify its organization and improve execution, according to internal documents viewed by &lt;em&gt;Business Insider&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL218/asml-management-tsmc-high-na-outlook.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl218_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling</title>
<pubDate>Sun, 26 Apr 2026 00:40:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL219/samsung-dram-sk-hynix-hbm-development.html</link>
<description>Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to &lt;em&gt;The Elec&lt;/em&gt;. SK Hynix, meanwhile, is preparing to sample its next-generation high-bandwidth memory product as memory makers accelerate their product roadmaps.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL219/samsung-dram-sk-hynix-hbm-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>Nvidia and OpenAI both make US$20 billion bets on AI chip startups: what's the common factor?</title>
<pubDate>Sun, 26 Apr 2026 00:40:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD200/openai-2026-nvidia-cerebras-ai-chip.html</link>
<description>2026 has become a major year for IPO fundraising among leading AI players. At the end of 2025, Nvidia CEO Jensen Huang spent US$20 billion to acquire the IP and talent of AI chip startup Groq. In April 2026, &lt;em&gt;The Information &lt;/em&gt;reported that OpenAI will purchase more than US$20 billion worth of chips from AI chip startup Cerebras. These two amounts are nearly identical; Nvidia for acquisition, OpenAI for procurement. Although seemingly isolated events, they are symmetrical moves.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD200/openai-2026-nvidia-cerebras-ai-chip.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>JDI accelerates exit from LTPS, reshaping automotive display panel landscape</title>
<pubDate>Sun, 26 Apr 2026 00:39:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD214/jdi-ltps-panel-automotive-automotive-display.html</link>
<description>Japan Display Inc. (JDI) is accelerating its withdrawal from the low-temperature polycrystalline silicon panel market by selling its Tottori plant to Yahata Toei Real Estate, a deal expected to close by September 30, 2026. The Tottori factory stopped production in March 2025, following the closure of the Mobara plant in November 2025.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD214/jdi-ltps-panel-automotive-automotive-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BizLink expands optical interconnect push, sees uncertain CPO ramp timing</title>
<pubDate>Sun, 26 Apr 2026 00:39:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD220/demand-bizlink-cpo-data-hardware.html</link>
<description>&lt;p class="P1" data-start="1015" data-end="1517"&gt;The artificial intelligence boom continues to drive demand for related hardware, particularly as server power delivery and high-speed data transmission requirements increase. Against this backdrop, BizLink has shifted its business mix toward high-performance computing and semiconductor applications, which now account for more than 50% of revenue, transforming the company from a traditional cable supplier into a provider of integrated power and high-speed connectivity solutions for AI data centers.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD220/demand-bizlink-cpo-data-hardware.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung bets its HBM leverage can hold Nvidia's LPU orders &#38;mdash; but TSMC is pushing back</title>
<pubDate>Sun, 26 Apr 2026 00:39:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD221/tsmc-samsung-nvidia-2026-ceo.html</link>
<description>The AI era has officially shifted from training to inference and agent-centric computing, prompting Nvidia's strategic acquisition of Groq to integrate LPUs into its own platform. This move not only eliminates a strong competitor but also sparks a fierce battle between Samsung Electronics and TSMC over LPU foundry orders.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD221/tsmc-samsung-nvidia-2026-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Commentary: Sodium batteries reset EV cost structure and supply chain balance</title>
<pubDate>Sun, 26 Apr 2026 00:39:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD223/cost-supply-chain-technology-market-power-battery.html</link>
<description>&lt;p class="P1" data-start="89" data-end="497"&gt;For more than a decade, lithium-ion batteries have defined the global power battery market, concentrating technology, capital and supply chains along a single trajectory. That model is now under pressure. Sharp swings in lithium carbonate prices have exposed structural vulnerabilities, forcing the industry to confront a long-ignored question: what happens when the core input cost is no longer predictable?</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD223/cost-supply-chain-technology-market-power-battery.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES, powered by AI]]></media:description>
</media:content></item>
<item>
<title>LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand</title>
<pubDate>Sat, 25 Apr 2026 06:00:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD225/siph-demand-equipment-6-inch-photonics.html</link>
<description>Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD225/siph-demand-equipment-6-inch-photonics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd225_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>The Taiwan startup that Qualcomm helped build the agentic OS for edge AI</title>
<pubDate>Sat, 25 Apr 2026 02:11:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL211/pepper-hardware-staff-taiwan.html</link>
<description>When the avocado has two hours left, the AI takes over.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL211/pepper-hardware-staff-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl211_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
</media:content></item>
<item>
<title>China's Horizon Robotics aims at Tesla with new self-driving platform</title>
<pubDate>Sat, 25 Apr 2026 01:57:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD237/tesla-competition-horizon-robotics-autonomous-driving-chips.html</link>
<description>&lt;p class="P1" data-start="51" data-end="348"&gt;As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon Robotics is mounting an ambitious strategic push &#38;mdash; one that places it in more direct competition with Tesla.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD237/tesla-competition-horizon-robotics-autonomous-driving-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Horizon Robotics]]></media:description>
</media:content></item>
<item>
<title>Taiwan's industrial production surges on AI infrastructure demand</title>
<pubDate>Sat, 25 Apr 2026 01:56:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD240/taiwan-production-industrial-moea-infrastructure.html</link>
<description>Data released by Taiwan's Ministry of Economic Affairs (MOEA) on April 23 showed that major global cloud service providers continue to expand procurement of artificial intelligence (AI) hardware as countries worldwide build out AI infrastructure. As a result, industrial production of computer, electronic, and optical products &#38;mdash; primarily AI servers &#38;mdash; surged 146.32% in March 2026. Cumulatively, output from January to March rose 131.77% compared with the same period in 2025.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423PD240/taiwan-production-industrial-moea-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423pd240_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>India's solar growth faces policy tension between local manufacturing push and rapid capacity expansion</title>
<pubDate>Sat, 25 Apr 2026 01:56:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423VL218/solar-manufacturing-policy-growth-capacity-expansion.html</link>
<description>India's push to localize solar manufacturing while rapidly expanding capacity is creating a structural bottleneck, as stricter domestic sourcing rules risk constraining supply just as renewable deployment accelerates. Industry groups warn that the mismatch between solar cell production and demand could delay projects, even as the government accelerates its clean energy transition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423VL218/solar-manufacturing-policy-growth-capacity-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423vl218_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Chinese AI firms push into deployment, shift focus to inference at GITEX Asia</title>
<pubDate>Sat, 25 Apr 2026 01:55:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423VL223/asia-gitex-training-demand-infrastructure.html</link>
<description>&lt;p class="P1" data-start="404" data-end="591"&gt;Chinese artificial intelligence companies are reshaping global AI deployment strategies, accelerating a shift toward inference-driven, commercially viable applications at GITEX Asia 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260423VL223/asia-gitex-training-demand-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260423vl223_files/6_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Hon Hai and Mitsubishi Electric sign MOU on joint automotive equipment venture</title>
<pubDate>Fri, 24 Apr 2026 10:50:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL220/mitsubishi-electric-foxconn-automotive-equipment-industrial.html</link>
<description>Foxconn eyes 50% stake in Mitsubishi Electric Mobility as it deepens push into EV-related hardware.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL220/mitsubishi-electric-foxconn-automotive-equipment-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl220_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Foxconn]]></media:description>
</media:content></item>
<item>
<title>Chipmakers face higher cost pressure as packaging outpaces foundry price hikes</title>
<pubDate>Fri, 24 Apr 2026 08:58:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD229/chipmakers-packaging-price-capacity-osat.html</link>
<description>In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD229/chipmakers-packaging-price-capacity-osat.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure</title>
<pubDate>Fri, 24 Apr 2026 08:33:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD205/google-cloud-google-tpu-training-chips.html</link>
<description>At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for training and the TPU v8i for inference. The move is intended to boost performance and energy efficiency by optimizing each chip for its specific role.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD205/google-cloud-google-tpu-training-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd205_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Google]]></media:description>
</media:content></item>
<item>
<title>M31 and TSMC complete eUSB2V2 tapeout on N2P process</title>
<pubDate>Fri, 24 Apr 2026 08:15:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD228/m31-tsmc-ip-2nm-design.html</link>
<description>IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD228/m31-tsmc-ip-2nm-design.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd228_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Memory price surge reshapes global notebook competition in 2026</title>
<pubDate>Fri, 24 Apr 2026 08:10:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260422PD213/notebook-panel-competition-price-shipments-2026.html</link>
<description>The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260422PD213/notebook-panel-competition-price-shipments-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260422pd213_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>DeepSeek previews V4 models with Huawei integration, signaling shift in China's AI stack</title>
<pubDate>Fri, 24 Apr 2026 08:09:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL216/deepseek-huawei-startup-development-competition.html</link>
<description>Chinese artificial intelligence startup DeepSeek has released preview versions of its latest models &#38;mdash; DeepSeek-V4-Pro and V4-Flash &#38;mdash; marking a closer integration with domestic chipmaker Huawei and intensifying competition with US developers, including OpenAI and Google.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL216/deepseek-huawei-startup-development-competition.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl216_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow</title>
<pubDate>Fri, 24 Apr 2026 07:57:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL214/euv-photoresist-materials-middle-east-disruption-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="267"&gt;Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through the global semiconductor supply chain, threatening shortages of a critical chipmaking material: photoresists.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL214/euv-photoresist-materials-middle-east-disruption-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl214_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shin-Etsu Chemical]]></media:description>
</media:content></item>
<item>
<title>STMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027</title>
<pubDate>Fri, 24 Apr 2026 07:50:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL215/stmicroelectronics-revenue-data-center-guidance-2026.html</link>
<description>STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics and computing helped offset continued softness in automotive and industrial markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL215/stmicroelectronics-revenue-data-center-guidance-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker</title>
<pubDate>Fri, 24 Apr 2026 07:46:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD215/tsmc-equipment-packaging-taiwan-ase.html</link>
<description>The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD215/tsmc-equipment-packaging-taiwan-ase.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset</title>
<pubDate>Fri, 24 Apr 2026 07:19:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD225/lite-on-edge-ai-demand-startup-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="368"&gt;Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing human-machine co-creation and real-world industrial deployment.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD225/lite-on-edge-ai-demand-startup-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd225_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Liteon]]></media:description>
</media:content></item>
<item>
<title>EU targets Android access rules, putting Gemini integration edge at risk</title>
<pubDate>Fri, 24 Apr 2026 06:58:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD227/eu-google-gemini-android.html</link>
<description>European regulators are preparing to push Google to open up core Android operating system functions, potentially allowing rival AI assistants such as ChatGPT and Claude to access the platform on the same terms as Gemini, according to people familiar with the matter.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD227/eu-google-gemini-android.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd227_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Microsoft and Meta announce workforce reductions amid heavy AI investment</title>
<pubDate>Fri, 24 Apr 2026 06:01:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL213/meta-microsoft-staff-layoffs-ai-2025.html</link>
<description>Microsoft and Meta have recently announced job cuts or buyouts impacting possibly 23,000 jobs. The staff reductions come as the tech giants funnel massive resources into building out their AI capacity, a trade-off that has become common across the industry in recent months.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL213/meta-microsoft-staff-layoffs-ai-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl213_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Heran's three-brand strategy targets all appliance segments, with Yamada brand driving 2026 growth</title>
<pubDate>Fri, 24 Apr 2026 04:29:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD206/home-appliance-market-growth-price-2026.html</link>
<description>Taiwan-based appliance maker Heran's shift to a multi-brand, multi-product strategy signals that mature appliance markets can still expand by segmenting price tiers; global consumers and competitors may see stronger low-end volume, steady air-conditioner demand, and measured pricing pressure from raw-material and currency volatility, as well as market responses.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD206/home-appliance-market-growth-price-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd206_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Tesla's hidden US$2 billion AI hardware deal points to deeper chip, compute ambitions</title>
<pubDate>Fri, 24 Apr 2026 04:14:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL209/tesla-ai-acquisition-fsd-robotaxi-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="244"&gt;Tesla has quietly taken a significant step deeper into artificial intelligence (AI), disclosing a US$2 billion acquisition of an unnamed AI hardware company in a single sentence buried in its latest regulatory filing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL209/tesla-ai-acquisition-fsd-robotaxi-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>White House accuses China of 'industrial-scale' AI theft, signals crackdown</title>
<pubDate>Fri, 24 Apr 2026 04:08:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL210/development-technology-deepseek.html</link>
<description>The White House has accused China of conducting "industrial-scale" theft of US artificial intelligence intellectual property, a development that could escalate tensions in the ongoing technology rivalry between the two countries, according to the &lt;em&gt;Financial Times&lt;/em&gt;, &lt;em&gt;Reuters,&lt;/em&gt; and &lt;em&gt;CNN&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL210/development-technology-deepseek.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl210_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>FSET eyes local battery recycling and storage by 2027</title>
<pubDate>Fri, 24 Apr 2026 03:45:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD207/demand-recycling-formosa-smart-energy-tech-electricity-2027.html</link>
<description>Amid rising electricity demand driven by geopolitical tensions and AI growth, Formosa Smart Energy Tech (FSET) is advancing its battery recycling and energy storage strategy to build a localized circular supply chain. The company plans to establish Taiwan's first waste battery recycling line in Changhua County, targeting completion by the fourth quarter of 2027 with an initial capacity of 720 tons.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD207/demand-recycling-formosa-smart-energy-tech-electricity-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd207_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Commentary: DeepSeek rethinks funding strategy under talent drain and AI race</title>
<pubDate>Fri, 24 Apr 2026 03:35:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD211/deepseek-funding-talent-tencent-2025.html</link>
<description>The trajectory of DeepSeek has drawn scrutiny, but its latest move marks a clear inflection point. According to a report by &lt;em&gt;The Information&lt;/em&gt;, the company is seeking external funding for the first time, triggering strong interest from China's major tech groups. Four sources familiar with the matter said Tencent and Alibaba are in discussions to invest.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424PD211/deepseek-funding-talent-tencent-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424pd211_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration</title>
<pubDate>Fri, 24 Apr 2026 03:25:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL208/sk-hynix-tsmc-hbm4-dram.html</link>
<description>&lt;p class="P1" data-start="146" data-end="400"&gt;SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260424VL208/sk-hynix-tsmc-hbm4-dram.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260424vl208_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[SK Hynix Chief Development Officer (CDO) Ahn Hyun delivering the keynote address. Credit: SK Hynix]]></media:description>
</media:content></item>
</channel>
</rss>

