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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Mitsubishi Electric, Daikin expand US production to meet data center cooling demand</title>
<pubDate>Wed, 5 Aug 2026 09:22:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL226/mitsubishi-electric-data-center-cooling-demand-production.html</link>
<description>&lt;p class="P1" data-start="1232" data-end="1490"&gt;Mitsubishi Electric is establishing a cooling-equipment production company in Ohio, joining Daikin Industries in bringing manufacturing closer to US data center customers as delivery times, tariffs and local service become more important competitive factors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Mitsubishi Electric¡¦s Mason, Ohio campus, where MEHITS US will manufacture and test cooling equipment. Credit: Mitsubishi Electric Automotive America.]]></media:description>
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<title>Foxconn revenue tops nearly US$30B for first time, with 3Q growth in sight</title>
<pubDate>Wed, 5 Aug 2026 09:16:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD244/revenue-foxconn-growth-2026-electronics.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:360;148-507"&gt;Foxconn reported consolidated revenue of NT$946.51 billion (approx. US$29.37 billion) for July 2026, up 15.18% from the previous month and 54.19% from a year earlier. The result marked a record monthly high and the first time the group's revenue exceeded NT$900 billion. In US dollar terms, July revenue rose about 13.6% month on month and 43.1% year on year.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Infineon sees AI demand outpacing supply as customers lock in long-term capacity</title>
<pubDate>Wed, 5 Aug 2026 09:06:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL225/infineon-data-center-capacity-demand-revenue.html</link>
<description>&lt;p class="P1" data-start="86" data-end="383"&gt;Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign multi-year capacity reservation agreements that give the chipmaker greater visibility while securing future supply for hyperscale AI deployments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China halts US-based factory audits for CCC certification amid raging tech feud</title>
<pubDate>Wed, 5 Aug 2026 09:02:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD245/certification-supply-chain-technology-equipment-telecom.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:152;135-286"&gt;The US-China technology and supply chain conflict has spread to product certification, opening a new front beyond semiconductors and telecom equipment.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>ICT</category>
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<title>China launches 15th Five-Year 'leader' awards on low-carbon credentials</title>
<pubDate>Wed, 5 Aug 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD226/efficiency-miit-it-certification-aluminum.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:541;125-665"&gt;China's State Council has launched a new recommendation program for "leader" companies in energy efficiency and carbon efficiency, with the Ministry of Industry and Information Technology (MIIT), the National Development and Reform Commission (NDRC), and the State Administration for Market Regulation jointly issuing the notice on August 4, 2026. The program is designed to push heavy industry to cut energy use and emissions, as low-carbon certification increasingly becomes a key credential for future market competition.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Foldable smartphone shipments are set to rise 20% as Apple enters the market</title>
<pubDate>Wed, 5 Aug 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD209/shipments-market-foldable-smartphone-apple-2026.html</link>
<description>Global foldable smartphone shipments are expected to increase 20% in 2026 from 2025, according to industry players cited in the source, even as the broader handset market faces tighter supply of upstream logic chips and higher memory prices. Samsung Electronics is expected to keep its market lead, while Apple, Huawei, and other brands are set to help drive the category, with the fourth quarter of 2026 described as the most important sales period.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand</title>
<pubDate>Wed, 5 Aug 2026 08:38:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PR201/production-capacity-data-center-demand-capacity-growth.html</link>
<description>Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber cables, citing sustained growth in demand for high-quality optical fiber cables driven by hyperscale data center buildouts.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>LG Electronics posts strong second quarter as new businesses drive growth</title>
<pubDate>Wed, 5 Aug 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD210/lg-electronics-revenue-lg-operating-profit-home-appliance.html</link>
<description>LG Electronics reported consolidated revenue of KRW23.83 trillion (US$16.7 billion) and operating profit of KRW1.58 trillion (US$1.1 billion) in the second quarter of 2026 as AI cooling, automotive, and subscription businesses expanded. The South Korean company said the results reflected efforts to move beyond its traditional appliance base and into broader smart life solutions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Foldable phone demand shifts as wider models challenge flip designs</title>
<pubDate>Wed, 5 Aug 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD208/demand-market-samsung-foldable-2026.html</link>
<description>Foldable phone makers are facing a more segmented market as wider book-style devices gain ground and Samsung Electronics expands its lineup, with the next major demand test expected in the fourth quarter of 2026. The changes are already reshaping how foldables are designed, positioned, and sold, while an expected Apple entry could further accelerate the shift.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Fanuc raises fiscal 2026 outlook as costs and supply bottlenecks weigh on profits</title>
<pubDate>Wed, 5 Aug 2026 08:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD211/fanuc-2026-outlook-operating-profit-forecast.html?chid=10</link>
<description>Fanuc said first-quarter orders for fiscal 2026 surged 37% year-on-year to a record JPY281.9 billion, even as the industrial robot maker drew market concern for raising its full-year operating profit forecast by only about 3%. The update came after its July 31 earnings briefing and highlighted strong demand alongside persistent cost pressure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<title>Taiwan approves NT$27B plan to commercialize 6G, satellite, and all-optical AI networks</title>
<pubDate>Wed, 5 Aug 2026 08:01:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD221/taiwan-6g-communications-iown-development.html</link>
<description>Taiwan is moving from early-stage research into commercialization of next-generation communications technologies after the Executive Yuan approved a NT$27 billion (US$833 million) development program running from 2025 to 2030. The initiative will support commercialization of 6G and satellite applications, deployment of test networks and expansion of the domestic communications ecosystem, building on groundwork completed in 2025.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Ming-Der Shieh. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Naver taps Brookfield for up to US$9 billion in data center financing</title>
<pubDate>Wed, 5 Aug 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL212/naver-data-center-financing-nvidia-infrastructure.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:267;107-373"&gt;Naver is considering an asset-light structure for a US$10 billion data center expansion under which a Brookfield-led investment vehicle would own GPUs and other infrastructure. At the same time, a Naver subsidiary would sell computing capacity and related services to customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Naver¡¦s GAK Sejong data center will host the first phase of its planned 200MW expansion. Credit: Naver]]></media:description>
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<item>
<title>Samsung, SK Hynix expansion puts Korea's chip supply chain to the test</title>
<pubDate>Wed, 5 Aug 2026 07:22:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL221/samsung-expansion-sk-hynix-production-investment.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:269;113-381"&gt;Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second major expansion announcement this year, &lt;em&gt;Seoul Economic Daily&lt;/em&gt; reported, citing a regulatory filing with South Korea's Financial Supervisory Service.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant</title>
<pubDate>Wed, 5 Aug 2026 07:13:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL222/sk-hynix-packaging-plant-hbm-production.html</link>
<description>SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands its ability to serve US customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: SK Hynix America]]></media:description>
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<item>
<title>Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure</title>
<pubDate>Wed, 5 Aug 2026 07:09:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PR200/kioxia-sandisk-qlc-flash-infrastructure.html</link>
<description>Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global data centers, cloud providers, and AI developers manage surging data demand while easing energy and cooling pressures across infrastructure markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Airoha optical comms revenue doubles as broadband lands CSPs</title>
<pubDate>Wed, 5 Aug 2026 06:59:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD215/airoha-broadband-wireless-revenue-growth.html</link>
<description>Airoha sees faster growth ahead as AI infrastructure, optical networking, and wireless edge products expand across global supply chains. The chip designer said its 2026 product mix is shifting structurally, with addressable markets broadening in wired and wireless businesses. Revenue momentum is being driven by demand from cloud providers, telecom operators, and enterprise customers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Analysis: Musk's empire closes in on China &#38;mdash; from orbit to the factory floor</title>
<pubDate>Wed, 5 Aug 2026 06:58:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL213/spacex-growth-hardware-revenue-tesla.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:536;106-641"&gt;SpaceX's rapid growth in AI, satellite connectivity, and space infrastructure is widening the strategic challenge for China beyond any single industry, as Musk's companies increasingly compete across sectors Beijing considers priorities. The combination of Starlink's expanding orbital footprint, SpaceX's accelerating AI business, and Tesla's manufacturing scale could give Musk an unusually integrated platform spanning technologies central to China's efforts to build competing capabilities and reduce dependence on foreign systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Anthropic's scramble for compute is reshaping how AI labs finance their chips</title>
<pubDate>Wed, 5 Aug 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL205/anthropic-chips-infrastructure-startup-capacity.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:244;117-360"&gt;Anthropic's US$10 billion computing agreement with seven-month-old startup Volta Infra Holdings Ltd. is the latest sign that the Claude developer is treating compute procurement less like a vendor relationship and more like a hedging strategy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805VL205/anthropic-chips-infrastructure-startup-capacity.html</guid>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Infineon raises 2026 outlook as AI demand drives record quarterly revenue</title>
<pubDate>Wed, 5 Aug 2026 06:30:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL220/revenue-demand-infineon-2026-outlook.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:247;117-363"&gt;Infineon Technologies reported record quarterly revenue for its fiscal third quarter ended June 30, fueled by booming demand for power semiconductors used in AI data centers, and raised its full-year guidance on stronger-than-expected growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>AMD says server CPU market to hit US$220B by 2030</title>
<pubDate>Wed, 5 Aug 2026 06:23:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL219/amd-market-2030-cpu-earnings.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:289;94-382"&gt;AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate of more than US$120 billion three months earlier, as the company sees agentic artificial intelligence (AI) creating a new class of CPU-intensive workloads.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs</title>
<pubDate>Wed, 5 Aug 2026 06:02:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL218/amec-etching-equipment-samsung-sk-hynix.html</link>
<description>Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese factories, &lt;em&gt;Reuters&lt;/em&gt; reported on August 5, citing three people familiar with the matter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix¡¦s semiconductor manufacturing campus in Wuxi, China. Credit: SK Hynix]]></media:description>
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<item>
<title>Taiwan fund launches US$800M guarantee plan for US investment</title>
<pubDate>Wed, 5 Aug 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD207/taiwan-investment-financing-funding-management.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:337;98-434"&gt;Taiwan's National Development Fund said it will commit US$800 million to a financing guarantee mechanism aimed at helping local companies invest in the US. The program is designed to lower funding barriers, share lending risk with banks, and support overseas expansion, according to a news release from the National Development Council.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook</title>
<pubDate>Wed, 5 Aug 2026 05:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL208/huawei-nvidia-performance-software-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:230;99-328"&gt;Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture, faster data movement and tighter coordination between chips, software and AI models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Starlink prepares terrestrial mobile push as SpaceX targets US carrier market</title>
<pubDate>Wed, 5 Aug 2026 05:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL216/starlink-spacex-mobile-market-broadband.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:278;119-396"&gt;Starlink is preparing to move beyond satellite broadband and direct-to-device coverage into a broader mobile communications business, as SpaceX seeks to combine its orbital network with terrestrial infrastructure and challenge the dominance of established US telecom operators.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>From rockets to data centers: SpaceX's US$15.8B AI bet reshapes its post-IPO investment story</title>
<pubDate>Wed, 5 Aug 2026 04:51:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL214/spacex-investment-data-revenue-capacity.html</link>
<description>SpaceX's first quarterly report as a public company revealed that its fastest-growing business is no longer confined to rockets or satellite broadband. Instead, artificial intelligence has emerged as the company's largest investment priority, absorbing most of its capital expenditure while rapidly developing into a new source of cloud infrastructure revenue.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Macroblock returns to profit as display demand and new products support outlook</title>
<pubDate>Wed, 5 Aug 2026 04:48:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD218/macroblock-display-profit-demand-2026.html</link>
<description>Macroblock's return to profitability in the second quarter points to a steadier recovery in the LED display supply chain, with implications for customers and competitors across Asia, Europe, and North America. The Taiwanese chip designer said improving product mix, new validations, and a planned cost-competitive product line could help second-half results outperform the first half.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD218/macroblock-display-profit-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd218_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Open weight models excluded from US frontier model review</title>
<pubDate>Wed, 5 Aug 2026 04:41:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL217/usa-government-ai-security-anthropic-openai.html</link>
<description>Open weight models made by US companies are reportedly exempt from new guidelines by the US Trump administration overseeing the safety of new frontier models. The White House also currently has no plans to publicly release the framework of the review process, which is supposed to be voluntary.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Memory crunch deepens PC slump as Apple, Nvidia emerge as rare bright spots</title>
<pubDate>Wed, 5 Aug 2026 04:22:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD237/ai-pc-notebooks-recovery-apple-asus.html</link>
<description>After a brief recovery in 2025, the PC supply chain had hoped the market would return to sustained growth. Instead, AI server demand has squeezed memory production capacity, driving sharp increases in DRAM and NAND prices while also tightening CPU supply, causing overall PC demand to weaken once again.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260804PD237/ai-pc-notebooks-recovery-apple-asus.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260804pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Apple seeks injunction against OpenAI as trade secrets battle over AI hardware intensifies</title>
<pubDate>Wed, 5 Aug 2026 04:03:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL209/apple-openai-hardware-legal-lawsuit.html</link>
<description>&lt;p class="P1" data-start="96" data-end="404"&gt;Apple has asked a US federal judge to issue a preliminary injunction preventing OpenAI and two former Apple employees from accessing, using, or disclosing what the iPhone maker says are its confidential trade secrets, escalating a legal fight that could shape competition in the emerging AI hardware market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AI chip demand revives co-investment deals as ABF substrate capacity fills through 2028</title>
<pubDate>Wed, 5 Aug 2026 03:28:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD222/demand-ai-chip-capacity-2028-abf-substrate.html</link>
<description>AI chip demand is tightening supply of IC substrates, prompting Nvidia, AMD, and hyperscalers to lock in Ajinomoto Build-up Film (ABF) capacity through 2028 and press suppliers to begin planning additional expansion for 2029 and 2030.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD222/demand-ai-chip-capacity-2028-abf-substrate.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd222_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>CXMT-SK Hynix LPDDR6 race shifts to yields, customers and capacity</title>
<pubDate>Wed, 5 Aug 2026 03:26:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL204/cxmt-capacity-production-2026-sk-hynix.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:195;100-294"&gt;China's CXMT is preparing limited production of LPDDR6 smartphone memory around the end of 2026, narrowing a technology gap with Samsung Electronics, SK Hynix and Micron that once spanned years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AMD says US$30 billion estimate for 2027 Instinct revenue may be too low</title>
<pubDate>Wed, 5 Aug 2026 03:23:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL211/amd-revenue-2027-data-center-ceo.html</link>
<description>&lt;p class="P1" data-start="501" data-end="745"&gt;AMD CEO Lisa Su indicated during the company's second-quarter 2026 earnings call that an estimate of roughly US$30 billion in 2027 Instinct revenue may be too conservative, telling analysts that the data center AI figure was "probably too low."</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl211_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[AMD CEO Lisa Su presents the company¡¦s Helios rack-scale platform during her CES 2026 keynote. Credit: Lisa Su/X]]></media:description>
</media:content></item>
<item>
<title>SpaceX revenue surges 92% as Starlink and AI offset widening rocket investments</title>
<pubDate>Wed, 5 Aug 2026 03:19:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL207/spacex-starlink-revenue-loss-infrastructure.html</link>
<description>SpaceX posted stronger-than-expected second-quarter results this year as rapid growth in Starlink connectivity and AI infrastructure revenue helped narrow losses, even as heavy investment in Starship continued to weigh on the company's core space business.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl207_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Vanguard International Semiconductor sees AI demand lift mature-node prices through 2027</title>
<pubDate>Wed, 5 Aug 2026 02:59:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD200/vis-ai-demand-equipment-management-2027.html</link>
<description>Demand for power management ICs (PMICs) driven by artificial intelligence (AI) servers continues to grow, accelerating the recovery of mature-node processes. Vanguard International Semiconductor (VIS) said AI-driven demand is not a short-term trend but an irreversible structural growth, and expects the mature process market to remain in short supply through 2027.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD200/vis-ai-demand-equipment-management-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: AMD and Nvidia take opposite paths to capture next wave of AI infrastructure spending</title>
<pubDate>Wed, 5 Aug 2026 02:42:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL210/amd-nvidia-ai-infrastructure-earnings-revenue.html</link>
<description>Two earnings calls three months apart show AMD and Nvidia converging on the same AI infrastructure boom from opposite directions. AMD is building a single rack-scale platform, Helios, aimed squarely at the handful of frontier labs and hyperscalers who can commit to gigawatt-scale deployments. Nvidia, already dominant with those same customers, is restructuring its own disclosures and business model to capture the much larger, more fragmented tier of capital-constrained startups and neoclouds beneath them.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl210_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Vanguard International Semiconductor lifts 2Q26 profit on AI server chip demand</title>
<pubDate>Wed, 5 Aug 2026 02:27:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD206/vis-ai-server-demand-profit-2026.html</link>
<description>Vanguard International Semiconductor (VIS) reported stronger second-quarter 2026 results on higher demand for AI server power management ICs, customer restocking and higher average selling prices, and said conditions should continue improving in the third quarter. The foundry said revenue, profit and margins all advanced as shipments rose and its product mix shifted toward higher-value offerings.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD206/vis-ai-server-demand-profit-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd206_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production</title>
<pubDate>Wed, 5 Aug 2026 02:22:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD244/psmc-taiwan-intel-production-packaging.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:415;156-570"&gt;Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially bring the company in as an investor has grown, as the US government and companies like Intel have actively sought partnerships with Taiwanese chipmakers in recent years. Intel and Taiwan's United Microelectronics (UMC) are currently collaborating on a 12-nanometer process platform.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260804PD244/psmc-taiwan-intel-production-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260804pd244_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>US reportedly expands AI infrastructure security push with planned restrictions on Chinese optical transceivers</title>
<pubDate>Wed, 5 Aug 2026 02:19:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL206/usa-fcc-transceiver-module-cybersecurity-equipment-infrastructure.html</link>
<description>&lt;p class="P1" data-start="106" data-end="331"&gt;The Trump administration is preparing new restrictions on Chinese-made optical transceivers used in AI data centers, broadening Washington's efforts to reduce reliance on Chinese technology in critical digital infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805VL206/usa-fcc-transceiver-module-cybersecurity-equipment-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805vl206_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Smartphone makers brace for lower volumes, higher prices, and deeper market split</title>
<pubDate>Wed, 5 Aug 2026 02:00:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD214/smartphone-price-apple-mediatek-qualcomm.html</link>
<description>Apple, Qualcomm, and MediaTek delivered similar warnings last week: the global smartphone market is entering a more expensive, more polarized phase. For users, this means fewer affordable devices, fewer upgrade options, and greater pressure on smartphone prices until memory supply improves and chip costs ease.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD214/smartphone-price-apple-mediatek-qualcomm.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Taiwan launches NT$10B fund to back biotech commercialization</title>
<pubDate>Wed, 5 Aug 2026 01:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD242/taiwan-biotech-investment-government-national-development-council.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:412;98-509"&gt;Taiwan's National Development Fund Management Committee on the 4th approved a new NT$10 billion (US$308 million) investment program for the country's biomedical industry. The 10-year initiative aims to support firms with innovative technology, strong clinical application value and international market potential, as the government looks to link Taiwan's biotech sector more closely with global markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260804pd242_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Apple's India breakthrough highlights a market betting on premium over volume</title>
<pubDate>Wed, 5 Aug 2026 01:33:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL203/apple-market-growth-smartphone-business.html</link>
<description>Apple's India business crossing US$10 billion in annual sales for the first time is less a story about smartphone growth than about where growth is still possible in a market that, by unit count, is shrinking.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260805vl203_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nanya Technology July revenue hits record as DDR4 contract prices surge</title>
<pubDate>Wed, 5 Aug 2026 01:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD241/nanya-technology-revenue-ddr4-2026-ddr5.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:353;96-448"&gt;Nanya Technology Corporation reported July 2026 revenue of NT$43.868 billion(US$1.353 billion), up 49.27% from June and marking a new monthly record, as stronger DDR4 contract prices lifted memory sales in the third quarter. The Taiwan memory chip maker also said revenue for the first seven months of 2026 reached NT$175.504 billion, up 660.87% from a year earlier.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260804PD241/nanya-technology-revenue-ddr4-2026-ddr5.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260804pd241_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list</title>
<pubDate>Wed, 5 Aug 2026 01:26:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD217/memory-chips-hbm-2026-cxmt-micron-samsung-sk-hynix.html</link>
<description>FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention because the event helps shape global memory trends, supply chains, and equipment demand for readers across technology markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD217/memory-chips-hbm-2026-cxmt-micron-samsung-sk-hynix.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Manz opens Tainan R&#38;amp;D center for advanced packaging equipment</title>
<pubDate>Wed, 5 Aug 2026 01:20:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD205/manz-equipment-packaging-tainan-science-park-southern-taiwan-science-park.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:392;90-481"&gt;Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&#38;amp;D center there for advanced packaging equipment and systems integration solutions, according to the Southern Taiwan Science Park Bureau. The move is aimed at developing next-generation tools for markets including artificial intelligence, high-performance computing, and panel-level packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD205/manz-equipment-packaging-tainan-science-park-southern-taiwan-science-park.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd205_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Manz]]></media:description>
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<item>
<title>Wistron sees AI demand widening as Taiwan ODMs gain pricing power</title>
<pubDate>Wed, 5 Aug 2026 01:16:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805PD216/taiwan-demand-wistron-shipments-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:323;116-438"&gt;AI demand is giving Taiwan's contract manufacturers a rare opening, and Wistron expects the opportunity to broaden in the second half of the year as new customers and products arrive. For global tech buyers, the shift signals tighter supply, firmer prices, and stronger leverage for a small group of server makers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805PD216/taiwan-demand-wistron-shipments-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805pd216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging</title>
<pubDate>Wed, 5 Aug 2026 01:06:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731RS400/osat-capacity-expansion-packaging-supply-chain-taiwan-ase.html?chid=2</link>
<description>Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731RS400/osat-capacity-expansion-packaging-supply-chain-taiwan-ase.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731rs400_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>SpaceX's first earnings as a public company show an AI bet outrunning its cash generation</title>
<pubDate>Tue, 4 Aug 2026 23:55:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL202/spacex-earnings-revenue-business-loss.html</link>
<description>SpaceX's debut quarterly report as a listed company laid out the scale of the wager it is making on artificial intelligence compute, a business now large enough to reshape the group's finances just seven weeks after its Nasdaq debut.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260805VL202/spacex-earnings-revenue-business-loss.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260805vl202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips</title>
<pubDate>Tue, 4 Aug 2026 23:53:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL201/amd-nvidia-chips-2026-revenue.html</link>
<description>AMD used its second-quarter 2026 results to reinforce a broader argument: that it can replicate in AI accelerators the market-share gains it has already made in server central processing units (CPUs), according to the latest results released on August 4.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China steps up challenge to Starlink: targets annual satellite output of 7,360 in major ramp-up of commercial space industry</title>
<pubDate>Tue, 4 Aug 2026 23:02:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD223/commercial-launch-manufacturing-beijing-communications.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:343;153-495"&gt;China's commercial space ambitions are entering a new phase as Beijing accelerates efforts to build an integrated space industry capable of supporting everything from satellite manufacturing and launch services to low Earth orbit (LEO) communications, according to a recent report by the Center for Strategic and International Studies (CSIS).</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<title>Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026</title>
<pubDate>Tue, 4 Aug 2026 23:02:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260805VL200/samsung-2026-nand-dram-3d.html</link>
<description>Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models &#38;mdash; zHBM and zNAND-O &#38;mdash; and disclosing a 400-plus-layer NAND built on wafer bonding for the first time.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Waymo weighs ending Uber robotaxi role as app control battle intensifies</title>
<pubDate>Tue, 4 Aug 2026 22:22:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD207/waymo-uber-robotaxi-partnership-austin.html</link>
<description>Waymo is considering leaving its robotaxi partnership with Uber as it seeks to bring ride-hailing service in Austin and Atlanta under the Waymo App starting in 2028. The shift would end Uber&#38;rsquo;s exclusive role in those markets when the current contract is expected to expire in May 2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Everlight files third US patent suit over LED flip chip technology</title>
<pubDate>Tue, 4 Aug 2026 22:21:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD226/patent-everlight-technology-nichia-patent-infringement.html</link>
<description>Everlight Electronics filed a new US patent infringement lawsuit against Nichia on July 30 in the Southern Division of the US District Court for the Eastern District of Michigan. The LED packaging maker said Nichia's high-power LED products infringed Everlight's US flip chip patent No. 7,554,126.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Cloud AI chipmakers race to secure capacity with long-term deals</title>
<pubDate>Tue, 4 Aug 2026 22:20:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD229/cloud-ai-ai-chip-capacity-chipmakers-demand.html</link>
<description>Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no longer enough; the ability to secure stable, sufficient capacity has become a key factor in supplier selection.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>US dominates world's largest AI data centers as China places three in global top 60</title>
<pubDate>Tue, 4 Aug 2026 22:20:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD230/data-epoch-investment-capacity-data-center.html</link>
<description>The global race to build AI data centers is accelerating. According to Epoch AI's latest AI Data Centers report, more than 60 hyperscale AI data centers have either entered operation or are under construction worldwide as of July 2026. Collectively, they represent computing capacity equivalent to approximately 12 million Nvidia H100 GPUs, accounting for roughly 27% of the world's deployed AI compute.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply</title>
<pubDate>Tue, 4 Aug 2026 22:20:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD232/samsung-demand-business-capacity-2026.html</link>
<description>Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&#38;amp;A session. DIGITIMES Intelligence said its review of the call points to three takeaways: AI is broadening high-end memory demand into a wider product mix, supply tightness will last through 2028, and long-term agreements (LTAs) are reshaping supply and operations.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Hanwha Semitech expands packaging tools as TCB turns profitable</title>
<pubDate>Tue, 4 Aug 2026 22:20:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD233/hanwha-equipment-packaging-revenue-foplp.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:419;112-530"&gt;South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Roborock breaks free from Xiaomi to lead robot vacuums</title>
<pubDate>Tue, 4 Aug 2026 22:19:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD234/xiaomi-robot-revenue-technology-market.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:325;104-428"&gt;Roborock Technology, which started out in Xiaomi's ecosystem, has staged a comeback to become the global leader in robot vacuums. After launching its own brand in 2017, the company has spent nine years shedding the label of a Xiaomi contract manufacturer, and now holds a 27% global market share, far ahead of Xiaomi's 8.3%.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26</title>
<pubDate>Tue, 4 Aug 2026 22:19:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD238/aurona-shipments-materials-demand-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:276;179-454"&gt;Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second quarter of 2026. Stronger demand for CCL-related products helped lift quarterly revenue to NT$420 million (US$13 million), up 24.2% year-over-year.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<item>
<title>China robot capital surges past US in global VC boom</title>
<pubDate>Tue, 4 Aug 2026 22:19:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD239/venture-capital-investment-robot-robotics-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:331;100-430"&gt;Global venture capital has rebounded on the AI boom after the pandemic freeze, with total investment in the first half of 2026 already topping full-year 2025. But the recovery is coming with a warning sign: capital is becoming highly concentrated in AI, while China is pouring money into robotics and drawing scrutiny from the US.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Powerchip says family succession plan remains unchanged</title>
<pubDate>Tue, 4 Aug 2026 22:18:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804PD243/management-chairman-2026-president-legal.html</link>
<description>Powerchip Semiconductor Manufacturing Corporation said on August 4, 2026, that the death of chairman Frank Huang has not changed the group's ownership structure, management team, or overall strategy. The company said Huang's personal and family shareholdings will be handled under the law, while the Huang family will continue supporting the existing management team.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>From factories to consumers: Samsung's long retreat from China enters its final chapters</title>
<pubDate>Tue, 4 Aug 2026 22:17:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804VL213/samsung-smartphone-manufacturing-retail-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:348;126-473"&gt;Samsung Electronics' latest move to scale back its smartphone retail network in China marks another milestone in a years-long restructuring. The shift has steadily reduced the company's footprint across manufacturing and consumer businesses, highlighting how changing market dynamics have reshaped the Korean technology giant's China strategy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>South Korea's KRW500B SiC push stalls as low returns deter major companies</title>
<pubDate>Tue, 4 Aug 2026 22:16:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804VL214/sic-development-government-power-semiconductors-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:300;117-416"&gt;South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors is struggling to move beyond the planning stage because the government has not secured a major anchor company to drive demand and support commercialization, according to &lt;em&gt;ETNews&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era</title>
<pubDate>Tue, 4 Aug 2026 22:16:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL236/ocp-taiwan-apac-cpo-infrastructure.html</link>
<description>&lt;em&gt;Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global standards leadership. He also warns that proprietary management interfaces are delaying AI infrastructure deployment and leaving a meaningful share of large GPU fleets in a degraded state.&lt;/em&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth</title>
<pubDate>Tue, 4 Aug 2026 09:49:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260804VL212/sk-hynix-bandwidth-capacity-technology-hbm.html</link>
<description>SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and bandwidth of up to 3TB/s.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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