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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Chinese display makers reportedly double down on large LCDs and OLED expansion</title>
<pubDate>Mon, 3 Aug 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL210/display-lcd-market-production-tv.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:228;122-349"&gt;China's leading display manufacturers are stepping up investments across both LCD and OLED technologies, targeting larger TV panels and expanding into the fast-growing notebook OLED market as they seek new growth opportunities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography</title>
<pubDate>Mon, 3 Aug 2026 07:48:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL216/asml-euv-accelerator.html</link>
<description>Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme ultraviolet systems, offering a new route beyond ASML's EUV architecture.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%</title>
<pubDate>Mon, 3 Aug 2026 07:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL215/intel-emib-packaging-fab-production-technology.html</link>
<description>Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Lite-On adds two major CSP customers as AI revenue tops 30%, targets 30% margin longer term</title>
<pubDate>Mon, 3 Aug 2026 07:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD215/lite-on-revenue-csp-data-production.html</link>
<description>&lt;p class="P1" data-sourcepos="9:1-9:346;306-651"&gt;Lite-On Technology delivered record profitability in the second quarter of 2026, with gross margin reaching 27.2%, up 5.1% from a year earlier. President Anson Chiu said the company has secured two additional cloud service provider (CSP) customers in 2026 and remains highly confident that second-half performance will exceed the first half.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix</title>
<pubDate>Mon, 3 Aug 2026 06:57:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL211/cxmt-lpddr-development-production-samsung-sk-hynix.html</link>
<description>CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TCL Technology to take full ownership of TCL CSOT</title>
<pubDate>Mon, 3 Aug 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL213/tcl-csot-acquisition-display-revenue-2025.html</link>
<description>TCL Technology Group plans to pay CNY9.32 billion (approx. US$1.38 billion) for the 45% of China Star Optoelectronics Semiconductor Display Technology it does not already own, according to the registration-stage draft of the company's share-issue-and-cash asset purchase report, dated July 2026. The sellers are three Guangdong state-linked shareholders: Hengjian Investment (25.00%), Chengfa Investment (7.50%) and Science City Investment (12.50%).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>MA-tek sells Shanghai unit, expands AI market push in Japan and the US</title>
<pubDate>Mon, 3 Aug 2026 06:51:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD223/ma-tek-shanghai-market-2026-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:395;128-522"&gt;MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Drone delivery goes mainstream as Shenzhen becomes a robot hub</title>
<pubDate>Mon, 3 Aug 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD204/shenzhen-meituan-robot-robotics-supply-chain.html</link>
<description>Meituan's drone delivery service can reach customers within 3 kilometers in about 15 minutes, rain or shine, and its daily use in Shenzhen is highlighting why the city has become a key launchpad for commercializing unmanned delivery. The city's dense supply chain, talent base, and innovation culture are helping turn robotics into a practical business.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>AI infrastructure orders extend PCB expansion race</title>
<pubDate>Mon, 3 Aug 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD217/pcb-demand-capacity-expansion.html</link>
<description>Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL) materials are already in short supply, and land, plant space, and machinery are also becoming scarce resources.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Commentary: AUO's stalled transformation comes under fire after Frank Ko's sudden exit</title>
<pubDate>Mon, 3 Aug 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD218/auo-president-market-panel-earnings.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:240;125-364"&gt;AUO, Taiwan's largest display panel maker, has spent recent years shifting away from consumer LCD panels toward higher-value markets such as automotive, healthcare and industrial displays. That transformation is now under intense scrutiny.</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[AUO chairman Paul Peng. Credit: DIGITIMES]]></media:description>
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<item>
<title>Merry Electronics cites costs and overseas ramp-up as 2026 profit risks</title>
<pubDate>Mon, 3 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD220/merry-headphones-speaker-profit-revenue-growth-2026.html</link>
<description>Merry Electronics said rising costs, foreign exchange swings and slower efficiency gains at new overseas plants were the main variables for profit growth in 2026. At a recent earnings call, the audio components maker said the third quarter should benefit from seasonal demand, but visibility for the fourth quarter remained limited as customers turned cautious amid Middle East tensions and uncertainty over US interest rate policy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Renesas plans to phase out Takasaki factory production and expand R&#38;amp;D focus</title>
<pubDate>Mon, 3 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PR202/renesas-production-development-manufacturing-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:335;115-449"&gt;Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>xLight bets on EUV light source, eyes ASML deal</title>
<pubDate>Mon, 3 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD219/semiconductor-industry-euv-asml-demand-chips.html</link>
<description>The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization stress and manufacturing costs. xLight says it aims to ease that pressure by reinventing light transmission and turning it from a single-machine function into a utility-scale service.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Apple's supply squeeze raises costs, reshapes sourcing and could widen iPhone 18 price gap</title>
<pubDate>Mon, 3 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD205/apple-iphone-earnings-price-demand.html</link>
<description>Apple's latest earnings showed robust demand, but a weaker outlook for the coming quarter pointed to a supply-driven squeeze with implications for prices, suppliers, and device launches worldwide. The company's final results under Tim Cook also highlighted how memory shortages are reshaping Apple's supply chain while leaving investors cautious after hours.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>TSMC Kumamoto fab faces first major quake test with chip-material supplies secured</title>
<pubDate>Mon, 3 Aug 2026 03:55:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD221/earthquake-kumamoto-fab-tsmc-taiwan.html</link>
<description>A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant, Sony, and other local semiconductor facilities.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan auto market braces for second-half sales push as new models arrive</title>
<pubDate>Mon, 3 Aug 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD201/taiwan-market-sales-demand-automakers.html</link>
<description>Taiwan's auto market is entering its traditional second-half sales season with a wave of new models, but expectations for 2026 remain divided. Mainstream automakers are betting that demand delayed by uncertainty in 2025 will be released later this year, while suppliers and some import distributors are warning that the rebound may not fully offset earlier losses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>German carmakers turn defensive in China as sales and margins fall</title>
<pubDate>Mon, 3 Aug 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD203/germany-sales-automakers-market-2026.html</link>
<description>Germany's three biggest automakers have taken a cautious stance on China after reporting second-quarter 2026 results, as the market that once generated outsized profits becomes harder to defend. Volkswagen, Mercedes-Benz, and BMW all face weaker sales, rising competition from Chinese brands, and a broader industry shift toward electronics and electrification.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>South Korea accelerates LEO satellite ambitions, targets sovereign communications network by 2035</title>
<pubDate>Mon, 3 Aug 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD211/leo-satellite-6g-ntn-communications-oneweb-starlink.html</link>
<description>As Starlink's subscriber base has surpassed 12 million and rivals such as OneWeb and Amazon's Project Kuiper continue expanding their constellations, South Korea only officially launched its low-Earth orbit (LEO) satellite communications initiative in July 2026.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<title>SK On posts record quarterly profit as South Korea battery makers recover</title>
<pubDate>Mon, 3 Aug 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD200/profit-operating-profit-production-revenue-lges.html</link>
<description>SK On, the South Korean battery maker, reported the second quarter of 2026 being its highest quarterly profit since its 2021 spinoff from SK Innovation. The company posted revenue of about KRW2.95 trillion (US$1.995 billion) and operating profit of KRW821.8 billion, while &lt;em&gt;The Elec&lt;/em&gt; and Bizwatch said LG Energy Solution and Samsung SDI also returned to profit in the same period.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>MA-tek sells 80% stake in Shanghai subsidiary to accelerate global expansion</title>
<pubDate>Mon, 3 Aug 2026 03:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260802PD200/ma-tek-semiconductors-testing-shanghai-subsidiary-xiamen.html</link>
<description>Semiconductor testing company Materials Analysis Technology (MA-tek) approved the sale of an 80% stake in its Chinese subsidiary MA-tek Technology Testing (Shanghai), as it moves to accelerate its global footprint in the US, Japan, Europe, and Southeast Asia. The transaction is expected to complete all procedures and close by the end of 2026.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Apple says advanced-node capacity tightens amid 2nm race</title>
<pubDate>Mon, 3 Aug 2026 03:36:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD214/apple-capacity-2nm-2026-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:283;105-387"&gt;Apple reported its best-ever third-quarter results for fiscal 2026, but its guidance for the fourth quarter showed much slower growth than in the prior quarter. CEO Tim Cook said the shortage of advanced-node capacity for mobile SoCs is the biggest limit on the company's expansion.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Xiaomi raises flagship phone prices as memory and chip costs climb</title>
<pubDate>Mon, 3 Aug 2026 03:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD212/xiaomi-flagship-smartphone-demand-cost.html</link>
<description>Xiaomi raised prices on several flagship smartphones in China on August 2, including the REDMI Turbo 5, K90 series, and Xiaomi 17 series, according to Xiaomi Store. The move adds CNY300 to CNY500 (US$44.46 to US$74.10) to each individual product depending on price positioning, with the largest increase reaching more than 10%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Ferrari's Luce sells out 2025 quota two months after launch</title>
<pubDate>Mon, 3 Aug 2026 03:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD202/ferrari-launch-demand-design-brand.html</link>
<description>Ferrari's first all-electric sports car, Luce, sold out its annual quota of 500 units just two months after its May launch, according to the source material. The strong response, including demand from China, came as luxury automakers continue to struggle with electrification strategies that protect brand value while supporting sales.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>OpenAI reportedly expands probe after finding additional AI agent containment escapes</title>
<pubDate>Mon, 3 Aug 2026 02:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL208/openai-ai-agent-testing-infrastructure-investigation-anthropic.html</link>
<description>&lt;p class="P1" data-start="80" data-end="468"&gt;OpenAI has uncovered additional instances of autonomous AI agents escaping their intended testing environments as it broadens an investigation sparked by the high-profile Hugging Face security incident, according to &lt;em&gt;Reuters.&lt;/em&gt; The newly discovered cases were reportedly limited in scope and, based on current findings, none of the agents are believed to have left OpenAI's internal network.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan manufacturing business climate improves in June, headlined by electronics sector</title>
<pubDate>Mon, 3 Aug 2026 02:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260801PD201/taiwan-manufacturing-business-electronics-demand.html</link>
<description>Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research (TIER), which released its individual industry business climate indicators for June on July 31.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push</title>
<pubDate>Mon, 3 Aug 2026 02:49:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL207/packaging-osat-manufacturing-plant-investment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:258;137-394"&gt;India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp</title>
<pubDate>Mon, 3 Aug 2026 02:38:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD210/mediatek-asic-2028-intel-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:467;109-575"&gt;MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803PD210/mediatek-asic-2028-intel-production.html</guid>
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<title>India expands chip talent pipeline amid surging global chip demand</title>
<pubDate>Mon, 3 Aug 2026 02:32:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PR201/government-workforce-training-semicon-design.html</link>
<description>India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply chains are global, and shortages in skilled engineers, fab workers, and packaging specialists can slow production, innovation, and investment worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803PR201/government-workforce-training-semicon-design.html</guid>
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<item>
<title>IBM and Sarvam team up on India's sovereign AI push</title>
<pubDate>Mon, 3 Aug 2026 02:26:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PR200/ibm-governance-worldwide-security-language.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:332;96-427"&gt;IBM and Sarvam have announced a collaboration to advance sovereign AI technologies in India, a move that could influence how governments and regulated industries worldwide deploy trusted artificial intelligence. The effort focuses on secure, governed systems designed to support local control over data, operations, and compliance.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803PR200/ibm-governance-worldwide-security-language.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260803pr200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: IBM]]></media:description>
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<item>
<title>Dixon sees mobile, IT hardware, and component push lift export and margin outlook</title>
<pubDate>Mon, 3 Aug 2026 02:22:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL204/hardware-mobile-dixon-component-camera.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:351;142-492"&gt;Dixon Technologies said its push into displays, camera modules, SSDs, and telecom hardware could deepen domestic value addition, even as near-term margins stay under pressure from input costs and the end of mobile PLI 1 incentives. The company expects joint venture-led expansion with Vivo and Inventec, plus PLI 2 and exports, to support growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803VL204/hardware-mobile-dixon-component-camera.html</guid>
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<item>
<title>Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project</title>
<pubDate>Mon, 3 Aug 2026 02:19:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803PD209/pat-gelsinger-euv-equipment-policy-intel-tsmc.html</link>
<description>US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After previously urging Apple, AMD, Nvidia and Qualcomm to support Intel Foundry as part of a broader US manufacturing revival, Gelsinger is now backing xLight, a start-up seeking to challenge one of ASML's most entrenched advantages in extreme ultraviolet (EUV) lithography.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803PD209/pat-gelsinger-euv-equipment-policy-intel-tsmc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260803pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Former Intel CEO Pat Gelsinger, now xLight chairman. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Rising component costs, new Indian incentives, and export push shape Dixon's outlook</title>
<pubDate>Mon, 3 Aug 2026 01:44:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL203/dixon-ems-localization-incentives-mobile-component.html</link>
<description>Dixon Technologies said rising component prices pressured margins in the first quarter of fiscal 2027. Still, strong order inflows, a shift toward higher-value manufacturing, and new policy support could help offset the hit. The company sees mobile volumes improving, exports rising, and component localization deepening across its expanding portfolio.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803VL203/dixon-ems-localization-incentives-mobile-component.html</guid>
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<title>Samsung's GaN rumored setbacks threaten foundry launch, leaving it racing to close reliability gap</title>
<pubDate>Mon, 3 Aug 2026 01:32:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL202/samsung-gan-launch-gallium-production.html</link>
<description>Samsung Electronics' gallium nitride (GaN) foundry effort has reportedly suffered another setback, with high-temperature reliability failures potentially pushing mass production into 2027. The delay follows earlier problems securing device customers and abandoning a government-backed project, underscoring the technical and strategic challenges of entering a market already served by established rivals.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>OpenAI says next-generation model solved 10 longstanding math problems</title>
<pubDate>Mon, 3 Aug 2026 01:27:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL205/openai-ai-2026.html</link>
<description>OpenAI said an internal version of its next-generation Astra model produced new results for 10 longstanding mathematical problems, including several conjectures and questions that had seen little or no progress for at least a decade. The company is positioning the work as evidence that increasingly capable AI systems can contribute to advanced mathematical research.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803VL205/openai-ai-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260803vl205_files/2_2b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices</title>
<pubDate>Mon, 3 Aug 2026 01:11:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL206/intel-tsmc-2nm-ddr4-samsung.html</link>
<description>AI-driven chip shortages, rising memory costs and intensifying foundry competition dominated the technology sector, with Intel reviving DDR4 platforms, Qualcomm raising prices, Samsung challenging TSMC at 2nm and Beijing accelerating domestic chip adoption. Below are the most-read &lt;em&gt;DIGITIMES&lt;/em&gt; stories from the week of July 27- August 2, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift</title>
<pubDate>Mon, 3 Aug 2026 01:11:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL201/doosan-sk-siltron-acquisition-wafer-materials.html</link>
<description>Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer manufacturing, while giving SK Group additional resources for its AI semiconductor strategy. The deal also highlights how rising AI demand is reshaping wafer valuations, investment priorities, and industry consolidation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803VL201/doosan-sk-siltron-acquisition-wafer-materials.html</guid>
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<title>Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027</title>
<pubDate>Mon, 3 Aug 2026 01:04:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260803VL200/semco-glass-substrate-2027-production-earnings.html</link>
<description>Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply contracts, higher capital spending, and a newly formalized glass substrate venture as evidence that demand from hyperscalers and chipmakers is outrunning what the industry can supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260803VL200/semco-glass-substrate-2027-production-earnings.html</guid>
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<title>FCC robot restrictions cast uncertainty over Unitree and China's consumer robotics exports</title>
<pubDate>Mon, 3 Aug 2026 00:10:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL218/fcc-unitree-robot-robotics-usa-sales.html</link>
<description>&lt;p class="P1" data-start="94" data-end="415"&gt;Chinese robotics companies are assessing the impact of new US regulatory measures after the US Federal Communications Commission (FCC) added foreign-manufactured advanced robotic equipment and connected power inverters to its Covered List, raising concerns that future products may be blocked from entering the US market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731VL218/fcc-unitree-robot-robotics-usa-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731vl218_files/2_r.jpg" type="image/jpeg" expression="full">
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<title>ROEC eyes AI optical communications without competing</title>
<pubDate>Mon, 3 Aug 2026 00:10:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD230/radiant-communications-market-demand-optics.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:266;106-371"&gt;Radiant Opto-Electronics (ROEC) is moving into AI optical communications through acquisitions. Chairman Yu-Chao Wang is targeting the medium- to long-term miniaturized optical communications market, aiming to give ROEC a completely different solution in the sector.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD230/radiant-communications-market-demand-optics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd230_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Column: AI agents are advancing rapidly, but the automation map remains smaller than expected</title>
<pubDate>Mon, 3 Aug 2026 00:10:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD210/automation-2026-labor-investment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:504;150-653"&gt;Token prices are falling while overall AI usage continues to surge &#38;mdash; a trend this column examined in March 2026 and one that has only accelerated since. The next generation of frontier models is increasingly being built around the AI agent paradigm. In recent months, competition among leading AI labs has intensified, with successive releases demonstrating the ability to plan tasks, delegate work, use multiple tools and skills, and directly interact with computer interfaces &#38;mdash; all at declining costs.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD210/automation-2026-labor-investment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd210_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>India roundup: R&#38;amp;D hubs, domestic tooling, OSAT investments, and AI hubs are powering India&#38;rsquo;s chip push</title>
<pubDate>Mon, 3 Aug 2026 00:09:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL211/infrastructure-expansion-design-packaging-manufacturing.html</link>
<description>&lt;p class="P1" data-start="143" data-end="413" data-is-last-node="" data-is-only-node=""&gt;India is expanding its semiconductor ambitions through new R&#38;amp;D centers, indigenous design tools, packaging facilities and AI infrastructure investments, aiming to strengthen domestic capabilities and reshape global technology supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731VL211/infrastructure-expansion-design-packaging-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731vl211_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Flexible PCB maker Flexium sees AI server shipments doubling after 2Q margin turns positive</title>
<pubDate>Mon, 3 Aug 2026 00:09:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD236/flexium-pcb-ai-server-loss-revenue-shipments.html</link>
<description>Flexium Interconnect said its second-quarter operating loss narrowed from the previous quarter as new flexible printed circuit products entered mass production for a US customer's latest notebooks, while smart glasses and AI server products began small-volume shipments.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD236/flexium-pcb-ai-server-loss-revenue-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd236_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Liteon lifts 2026 capex after AI data center demand sends 2Q profit up 126%</title>
<pubDate>Mon, 3 Aug 2026 00:08:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD233/profit-2026-data-demand-revenue.html</link>
<description>Liteon Technology posted record profit and margins for the second quarter of 2026, fueled by surging demand for AI data center power infrastructure. The company raised its full-year capex plan from NT$13 billion to NT$18 billion and expects AI-related products to account for more than 30% of annual revenue.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD233/profit-2026-data-demand-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd233_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>C.C.P. Contact Probes teams with chipmaker on MEMS probes and test-cleaning sheets</title>
<pubDate>Mon, 3 Aug 2026 00:08:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD237/mems-development-testing-growth-2026.html</link>
<description>C.C.P. Contact Probes said it has expanded its presence in the AI sector through a joint development project with a major semiconductor company covering microelectromechanical systems probes and probe-cleaning sheets. The products will be introduced into customer designs after development is completed.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD237/mems-development-testing-growth-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>FICG launches Singapore-Malaysia dual-core strategy</title>
<pubDate>Mon, 3 Aug 2026 00:08:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD240/singapore-malaysia-dual-core-industrial-manufacturing-supply-chain.html</link>
<description>FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions provider. FICG also signed an MOU with JTC, Singapore's government agency for industrial master planning and infrastructure development.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD240/singapore-malaysia-dual-core-industrial-manufacturing-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd240_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>AI server demand revives long-term MLCC supply agreements as shortages intensify</title>
<pubDate>Mon, 3 Aug 2026 00:07:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD228/demand-mlcc-passive-capacity-2026.html</link>
<description>Surging demand for AI servers is tightening global capacity for high-end passive components, prompting customers to once again pursue long-term supply agreements (LTSAs) as they seek to secure future deliveries.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD228/demand-mlcc-passive-capacity-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd228_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Elevated Materials names Jay Wang as chief revenue officer</title>
<pubDate>Mon, 3 Aug 2026 00:07:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD222/revenue-market-technology-lithium-materials.html</link>
<description>Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter for customers worldwide, as demand rises for faster-charging, longer-lasting batteries across electric vehicles, consumer devices, artificial intelligence infrastructure, and defense applications.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD222/revenue-market-technology-lithium-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd222_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Elevated Materials]]></media:description>
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<title>Holtek raises MCU prices by up to 20% as wafer and OSAT costs continue climbing</title>
<pubDate>Mon, 3 Aug 2026 00:07:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD218/mcu-wafer-holtek-osat-supplier.html</link>
<description>Microcontroller unit (MCU) supplier Holtek Semiconductor has confirmed a broad price increase across its entire microcontroller portfolio, marking its first company-wide adjustment since the COVID-19 pandemic.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD218/mcu-wafer-holtek-osat-supplier.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd218_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>Beijing's AI 'golden circle' draws Moonshot, Z.ai, US$14B in funding</title>
<pubDate>Mon, 3 Aug 2026 00:06:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD217/beijing-z.ai-moonshot-competition-language.html</link>
<description>Beijing is emerging as one of China's most prominent artificial intelligence clusters as competition in large language models intensifies. Moonshot AI's recently released open-source Kimi K3 model has climbed global open-source rankings, while Z.ai, DeepSeek, and other companies continue to expand. With talent, capital, policy support and technical resources increasingly concentrated around China's political decision-making center, Beijing is rapidly taking shape as a major AI hub.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Agentic AI exposes urgent legal accountability gaps, South Korean scholar warns</title>
<pubDate>Mon, 3 Aug 2026 00:06:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD216/legal-taiwan.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:387;127-513"&gt;Agentic AI is reshaping how work is delegated among intelligent systems, yet legal frameworks have failed to keep pace with the growing autonomy of AI agents. Legal loopholes involving responsibility and authority must be addressed urgently, South Korean legal scholar Hyesun Yoon warned at an academic forum hosted by Taiwan's National Science and Technology Council (NSTC) on July 30.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<title>Realtek sees broad 2026 growth despite cost pressure and uneven demand</title>
<pubDate>Mon, 3 Aug 2026 00:05:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD208/realtek-demand-2026-cost-ic-design.html</link>
<description>Taiwanese IC design house Realtek said on July 29 that it expects all of its product lines to grow year-on-year in 2026, even as tight supply in memory, substrates, and mature-node manufacturing continues to weigh on costs. The company said pricing actions, product mix improvements, and demand in automotive, networking, and AI-related applications should help offset margin pressure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan steps up investment in AI startups, compute infrastructure</title>
<pubDate>Mon, 3 Aug 2026 00:05:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD206/taiwan-investment-infrastructure-development-moda.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:471;113-583"&gt;The AI boom has been lifting Taiwan's upstream, midstream and downstream supply chains, but the country's application development remains a key area that still needs work. The Ministry of Digital Affairs (MODA) said Taiwan must accelerate the development of AI applications, services and software ecosystems, in addition to its existing strengths in semiconductors and hardware supply chains, if it wants to build a more favorable environment for AI industry growth.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<title>CATL rises to No. 3 as electrification reshapes global auto suppliers</title>
<pubDate>Mon, 3 Aug 2026 00:05:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD201/catl-2026-vehicle-tier-1-bosch.html</link>
<description>According to &lt;em&gt;Automotive News&lt;/em&gt;' newly released 2026 Top 100 Suppliers ranking, China's CATL climbed from No. 5 to No. 3 as power batteries gained more weight in the global Tier 1 supplier landscape. The annual list showed that electrification and smart vehicle technologies continued to shift value toward batteries, intelligent electronics, and systems integration, while established suppliers such as Bosch and Denso still held leading positions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>MiniMax H3 pairs 2K video with native stereo audio in China's multimodal AI race</title>
<pubDate>Sat, 1 Aug 2026 23:33:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL210/stereo-competition-language.html</link>
<description>Chinese AI start-up MiniMax launched MiniMax H3 on July 31, expanding its position in multimodal generative AI as competition among China's model developers spreads beyond large language models into video, audio, and AI agents.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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