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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Microsoft to invest US$10B in Middle East AI infrastructure, despite war risks</title>
<pubDate>Thu, 24 Sep 2026 10:38:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL223/microsoft-infrastructure-war-region-data.html</link>
<description>Microsoft announced that it will invest US$10 billion in expanding AI infrastructure in the Middle East by 2030. The commitment directs funding to a region facing threats from the war in Iran, where data center construction has continued despite the ongoing conflict.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Microsoft]]></media:description>
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<item>
<title>Anduril's Taiwan supply chain to grow 15-fold in 2026</title>
<pubDate>Thu, 24 Sep 2026 10:05:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD239/anduril-taiwan-2026-taiwan-supply-chain-unicorn.html</link>
<description>US defense tech unicorn Anduril plans to expand its overall investment in Taiwan, with procurement from its Taiwan supply chain expected to grow 15-fold in 2026, founder Palmer Luckey said at the International Forum of the Whole-of-Society Defense Resilience Committee.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
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<title>Taiwan's homegrown trainer program ends with 66 Brave Eagles delivered</title>
<pubDate>Thu, 24 Sep 2026 09:28:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD237/aidc-production-aircraft-taiwan-training.html</link>
<description>AIDC's Brave Eagle advanced jet trainer, a flagship "made-in-Taiwan" defense program, completed development and mass production on September 24, with AIDC chairman Chin-Pin Tsao personally leading the final delivery. The handover means all 66 production aircraft have now been delivered, marking a new chapter for Taiwan's defense aviation supply chain.&lt;br /&gt; &lt;br /&gt;&lt;iframe src="https://www.youtube.com/embed/sF8ZRq3oW84#youtubeoptions" width="640" height="360" frameborder="0" class="youtube" allowfullscreen="allowfullscreen" scrolling="no"&gt;&lt;/iframe&gt;</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Aerospace</category>
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<title>Honda eyes Ohio hybrid plant amid pivot to North America</title>
<pubDate>Thu, 24 Sep 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD235/honda-plant-production-vehicle-demand.html</link>
<description>Honda Motor Co. is planning to invest JPY300 billion to JPY400 billion (about US$1.9 billion to US$2.5 billion) in a new hybrid electric vehicle plant in Ohio, with production targeted to begin as early as 2030. According to &lt;em&gt;Nikkei&lt;/em&gt;, the project has entered final negotiations as Honda moves hybrids to the center of its North American rebound after reviewing its electric vehicle strategy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Grab turns Taiwan into a launchpad for Southeast Asia expansion</title>
<pubDate>Thu, 24 Sep 2026 08:51:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL221/grab-taiwan-expansion-asia-market.html</link>
<description>Grab is expanding the scope of its Taiwan strategy beyond food delivery, launching an overseas expansion programme for merchants aimed at helping Taiwanese food and beverage (F&#38;amp;B) brands enter Southeast Asian markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Grab Group CEO Anthony Tan meets with Paul Wu, ACFPT chairman. Credit: Grab]]></media:description>
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<item>
<title>ASRock Industrial revenue jumps 95% in 1H26 on North America deal</title>
<pubDate>Thu, 24 Sep 2026 08:11:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD241/asrock-revenue-ipc-north-america-demand.html</link>
<description>ASRock Industrial, the industrial PC (IPC) arm of ASRock, posted a 95.4% year-over-year surge in first-half 2026 revenue after winning a major North American streaming services contract. The company is also expanding into robotics, entertainment, cybersecurity and edge computing as the IPC sector rebounds and shifts toward new applications.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM</title>
<pubDate>Thu, 24 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL219/dram-cxmt-samsung-hbm-capacity.html</link>
<description>China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory (HBM), tightening conventional memory supply and giving the Chinese supplier more room to expand without competing primarily on price.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: CXMT]]></media:description>
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<item>
<title>LG sharpens focus on data centers, robotics, chip materials</title>
<pubDate>Thu, 24 Sep 2026 07:43:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL221/lg-data-materials-robotics-nvidia.html</link>
<description>&lt;p class="P1" data-start="3798" data-end="4037"&gt;LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate refines how it allocates capital across businesses moving toward commercialization at different speeds.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[LG Group chairman Koo Kwang-mo, right, meets Nvidia CEO Jensen Huang at Nvidia headquarters in Santa Clara, California. Credit: LG]]></media:description>
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<item>
<title>AI drives Episil GeSi, PMIC growth</title>
<pubDate>Thu, 24 Sep 2026 07:14:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD236/episil-demand-growth-silicon-photonics.html</link>
<description>&lt;p class="P1" data-start="3911" data-end="4273"&gt;Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth engines. Demand for silicon photonics optical communication modules is driving a surge in germanium silicon (GeSi) epitaxy demand, with the sector projected to grow 3.5- to 4-fold in 2027 and demand visibility extending to 2028.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>China AI's new moat: low-cost models meet a rapidly localising hardware stack</title>
<pubDate>Thu, 24 Sep 2026 07:11:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD216/hardware-equipment-competition-2025-2026.html</link>
<description>China's AI industry is moving beyond policy-driven technological catch-up into a new phase centered on commercialization and ecosystem competition. Localization is no longer confined to replacing individual components; it is evolving towards full-stack, system-level optimization.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Peking University Dean's rare Intel China appearance hails AI-plus edge adoption</title>
<pubDate>Thu, 24 Sep 2026 06:57:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD228/intel-development-industrial-manufacturing.html</link>
<description>&lt;p class="P1" data-start="2536" data-end="3016"&gt;Chinese macroeconomist Justin Lin, dean of Peking University's Institute of New Structural Economics, made a rare appearance at a tech industry event on September 22, speaking at the 2026 Intel Technology Innovation and Industry Ecosystem Conference about the AI revolution from an economic development perspective. Intel China used the event to showcase AI applications spanning edge AI, enterprise AI, and physical AI, underscoring its push to accelerate AI deployment in China.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD228/intel-development-industrial-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd228_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Intel China]]></media:description>
</media:content></item>
<item>
<title>Yusin Malaysia plant to fully ramp up by 4Q26</title>
<pubDate>Thu, 24 Sep 2026 06:50:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD205/plant-2026-revenue-volkswagen-2025.html</link>
<description>&lt;p class="P1" data-start="5123" data-end="5656"&gt;Brake system parts maker Yusin said at an investor conference on September 23 that key equipment at its new Malaysia plant is expected to be installed by the fourth quarter of 2026, with production targeted at 557,500 sets in 2027. Chairman Ching-te Chi said the company was hit by the restructuring of its largest customer, First Brands Group (FBG), which pushed Yusin into a loss in 2025 and sharply cut first-half 2026 revenue, but July and August sales have returned to year-over-year growth, suggesting early signs of a rebound.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>United Renewable Energy eyes US plant, space-based solar power in revenue push</title>
<pubDate>Thu, 24 Sep 2026 06:38:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD232/solar-ureco-plant-revenue-production.html</link>
<description>&lt;p class="P1" data-start="4277" data-end="5025"&gt;Solar cell manufacturer and systems integrator United Renewable Energy (URE) is still awaiting a final decision on the location of its US solar module plant, a joint venture with Sino-American Silicon Products (SAS), although production has now been set to begin in the third quarter of 2027. The upcoming US plant is expected to lift overseas revenue in its solar power business, which accounts for 70% of the company's total revenue; overseas sales currently account for roughly 20% of revenue in this segment and could double in 2027 amid strong demand. Moreover, the company is actively developing and testing solar power products for use in low Earth orbit (LEO) satellites with an eye on future growth, according to company chairman Sam Hong.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Chinese foundry CanSemi seeks US$918M ChiNext listing</title>
<pubDate>Thu, 24 Sep 2026 06:38:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL215/cansemi-wafer-shenzhen-ipo-revenue.html</link>
<description>Guangzhou-based wafer foundry CanSemi Technology has set its initial public offering (IPO) price at CNY12.01 per share on Shenzhen's ChiNext board. The company aims to raise CNY6.16 billion (approx. US$917.9 million) by issuing 512.6 million new shares.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: TechNews]]></media:description>
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<item>
<title>Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production</title>
<pubDate>Thu, 24 Sep 2026 06:26:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL216/synopsys-design-tsmc-production-certification.html</link>
<description>&lt;p class="P1" data-start="2748" data-end="2983"&gt;Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem for the foundry's next full node ahead of risk production in 2027 and volume production in 2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Synopsys]]></media:description>
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<item>
<title>Alibaba Cloud accelerates AI infrastructure buildout with 20GW target, eight-market expansion</title>
<pubDate>Thu, 24 Sep 2026 06:14:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD219/cloud-alibaba-infrastructure-expansion-data-center.html</link>
<description>&lt;p class="P1" data-start="4481" data-end="4824"&gt;AI adoption is accelerating, prompting global cloud providers to step up data center investment. Alibaba Cloud, the cloud computing arm of Alibaba, announced a new round of global infrastructure expansion at the 2026 Apsara Conference, with plans to broaden its data center footprint across eight countries and regions over the next 12 months.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder</title>
<pubDate>Thu, 24 Sep 2026 05:56:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL214/bytedance-brand-uk-2025-chips.html</link>
<description>Nscale, the UK AI cloud company preparing a US listing at a reported US$35 billion valuation, got nearly three-quarters of its 2025 sales from a Singapore company. Singapore and US records reviewed by DIGITIMES show that company's parent owns the trademarks for ByteDance's AI models and products outside China.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Nscale]]></media:description>
</media:content></item>
<item>
<title>Meta stretches its glasses lineup from US$249 to US$1,299.99 as rivals close in</title>
<pubDate>Thu, 24 Sep 2026 05:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL208/meta-2026-market-vr-idc.html</link>
<description>Meta Platforms used its Connect 2026 conference on September 23 to push its eyewear lineup toward both ends of the market, adding a camera-free audio model aimed at privacy-conscious buyers and a US$1,299.99 virtual reality (VR) device that fits headset-class hardware into a frame of about 100 grams. The range now runs from a US$249 Meta Adventurer to the new Meta VR Glasses, and the expansion comes as Samsung and Google prepare to launch their own glasses later this fall.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Meta]]></media:description>
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<item>
<title>ASML system sales in Europe remain at zero as EU debates Chips Act 2.0</title>
<pubDate>Thu, 24 Sep 2026 05:43:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL212/asml-sales-eu-europe-investment.html</link>
<description>&lt;p class="P1" data-start="3302" data-end="3722"&gt;European Union industry ministers are set to debate the proposed Chips Act 2.0 in Brussels on September 24, days after a senior ASML executive said the company is currently selling no chipmaking systems in Europe, highlighting the gap between the bloc's semiconductor ambitions and where industry investment is flowing. The policy debate is scheduled for about 11:30 a.m. Brussels time at the EU Competitiveness Council.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
</media:content></item>
<item>
<title>South Korea chip, panel lines stay on as AI, iPhone demand surges</title>
<pubDate>Thu, 24 Sep 2026 05:41:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD226/demand-iphone-panel-production-display.html</link>
<description>&lt;p class="P1" data-start="2097" data-end="2451"&gt;South Korea's major semiconductor, display, and electronics parts factories are staying open through the Chuseok holiday as AI-driven memory demand and new Apple iPhone panel production keep lines running. Samsung Electronics and SK Hynix are continuing output at key plants, while display and MLCC makers are also maintaining round-the-clock operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips</title>
<pubDate>Thu, 24 Sep 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL209/beijing-risc-v-chips-industrial-growth.html</link>
<description>Beijing Eswin Computing Technology has cleared its Hong Kong Stock Exchange listing hearing, moving closer to becoming the market's first listed RISC-V-focused chip company.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[At 68, BOE founder Wang Dongsheng makes third attempt at Hong Kong IPO. Credit: BigGo]]></media:description>
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<title>Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push</title>
<pubDate>Thu, 24 Sep 2026 04:52:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL210/qualcomm-tsmc-snapdragon-samsung-2nm.html</link>
<description>Qualcomm is sticking with TSMC for both of its newly launched 2nm Snapdragon flagship processors, extending the Taiwan foundry's hold on Qualcomm's top-tier mobile chips even as Samsung Electronics ramps its second-generation 2nm process and steps up efforts to win advanced-node customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Qualcomm]]></media:description>
</media:content></item>
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<title>Qualcomm splits flagship mobile SoCs into more tiers</title>
<pubDate>Thu, 24 Sep 2026 04:47:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD218/qualcomm-flagship-mobile-snapdragon-2026.html</link>
<description>Qualcomm is launching two flagship platforms in 2026&#38;mdash;the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6&#38;mdash;signaling a new era of finer-grained flagship mobile SoC segmentation. The move has raised questions about whether pricier flagship phones are on the way.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>IEI sees network security, video growth through 2028</title>
<pubDate>Thu, 24 Sep 2026 04:29:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD220/growth-pc-security-iei-integration-2028.html</link>
<description>&lt;p class="P1" data-start="0" data-end="272"&gt;Industrial PC maker IEI Integration said on September 23 that it remains upbeat on full-year 2026 revenue, expecting double-digit growth from 2025 as network security and high-end video systems ramp and visibility in medical and edge-computing orders extends to 2027-2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD220/growth-pc-security-iei-integration-2028.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd220_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: IEI Integration]]></media:description>
</media:content></item>
<item>
<title>Commentary: Apple's M8 Ultra AI server plan could pull Apple Silicon into Nvidia's enterprise infrastructure game</title>
<pubDate>Thu, 24 Sep 2026 04:23:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD213/apple-nvidia-ai-server-infrastructure-market.html</link>
<description>&lt;p class="P1" data-start="3968" data-end="4282"&gt;After more than a decade away, Apple may be preparing to return to the enterprise server market. According to &lt;em data-start="4078" data-end="4095"&gt;The Information&lt;/em&gt;, as reported by Reuters, the company is developing an enterprise AI server powered by its planned M8 Ultra chip and has discussed adopting Nvidia's NVLink Fusion interconnect technology.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD213/apple-nvidia-ai-server-infrastructure-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd213_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding</title>
<pubDate>Thu, 24 Sep 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL206/samsung-dram-roadmap-technology-development.html</link>
<description>Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process while moving its vertical-channel-transistor (VCT) design to a separate D0a-V derivative.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL206/samsung-dram-roadmap-technology-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl206_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>Xi-Trump summit masks AI rift as Chinese AI leaders stay away</title>
<pubDate>Thu, 24 Sep 2026 03:25:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD200/xi-jinping-security-chips-deepseek-2015.html</link>
<description>Chinese President Xi Jinping is set to make his first state visit to the US since 2015, with the Trump administration rolling out high-level welcoming ceremonies, a state dinner and other diplomatic pomp. But industry observers and think tanks say the real goal is not to settle structural disputes over trade, AI, rare earths and Taiwan in one shot, but to keep US-China competition from spiraling further out of control.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD200/xi-jinping-security-chips-deepseek-2015.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Huawei founder Zhengfei Ren reappears in Shenzhen &#38;mdash; Dongfeng smart vehicle alliance moves into focus</title>
<pubDate>Thu, 24 Sep 2026 03:24:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD223/huawei-vehicle-shenzhen-dongfeng-motor-development.html</link>
<description>&lt;p class="P1" data-start="2013" data-end="2338"&gt;Huawei founder Zhengfei Ren made a public appearance in Shenzhen on September 22 for talks with Dongfeng Motor general manager Changjun Feng that also included other Huawei executives. The two sides discussed deeper strategic cooperation in smart vehicles, alongside coordinated product development and technology innovation.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD223/huawei-vehicle-shenzhen-dongfeng-motor-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd223_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Dongfeng Motor Group executive director Changjun Feng (L) and Huawei founder Zhengfei Ren. Credit: Dongfeng Motor]]></media:description>
</media:content></item>
<item>
<title>Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge</title>
<pubDate>Thu, 24 Sep 2026 03:13:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD222/qualcomm-snapdragon-linux-pc-2026.html</link>
<description>&lt;p class="P1" data-start="4985" data-end="5346"&gt;Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux support for the Snapdragon X2 Series while highlighting Googlebook laptops powered by the Snapdragon X Elite. The moves signal growing momentum for Qualcomm's PC business across operating systems and new AI-focused form factors.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD222/qualcomm-snapdragon-linux-pc-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>LG Display scraps Nanjing automotive LCD module sale to Top Run</title>
<pubDate>Thu, 24 Sep 2026 03:11:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL207/lg-display-automotive-nanjing-lcd-module-business.html</link>
<description>LG Display has scrapped the planned sale of its automotive LCD module business in Nanjing, China, to Top Run Total Solution after the companies failed to reach a final agreement on transaction terms, derailing a plan to shift the operation from in-house production to outsourcing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL207/lg-display-automotive-nanjing-lcd-module-business.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl207_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Top Run Total Solution's TRCN facility in Nanjing, China. Credit: Top Run Total Solution]]></media:description>
</media:content></item>
<item>
<title>TSMC locks in 3-6% wafer out price hikes for 2027</title>
<pubDate>Thu, 24 Sep 2026 03:09:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD214/tsmc-wafer-price-2027-demand.html</link>
<description>&lt;p class="P1" data-start="3038" data-end="3379"&gt;TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD214/tsmc-wafer-price-2027-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Skoda's top earner CEO jumps to Volvo, rattling Volkswagen Group</title>
<pubDate>Thu, 24 Sep 2026 03:03:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD204/volkswagen-ceo-volvo-sales-porsche.html</link>
<description>&lt;p class="P1" data-start="3635" data-end="4004"&gt;Skoda CEO Klaus Zellmer, long seen as one of Volkswagen Group's top-performing brand executives, will leave the company and become president and CEO of Swedish luxury carmaker Volvo Cars no later than October 1, 2027. The surprise move has jolted the global auto industry and adds pressure to Volkswagen Group as it navigates painful transformation and profit warnings.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD204/volkswagen-ceo-volvo-sales-porsche.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise</title>
<pubDate>Thu, 24 Sep 2026 03:02:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD244/eternal-materials-earnings-packaging-equipment-shipments.html</link>
<description>Eternal Materials reported unaudited earnings before taxes (EBT) of NT$269 million (approx. US$8.47 million) in August 2026, up 28.05% from August 2025, with pre-tax earnings per share (EPS) of NT$0.23. Cumulative EBT for January through August totaled NT$2.3 billion, up 37.31% from a year earlier, with pre-tax EPS of NT$1.96.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260923PD244/eternal-materials-earnings-packaging-equipment-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260923pd244_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Qualcomm bets on earphones as the voice gateway for personal AI</title>
<pubDate>Thu, 24 Sep 2026 03:01:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD221/qualcomm-snapdragon-gateway-2026-smartphone.html</link>
<description>Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers and device makers, the shift could redefine how people access assistants, services, and cloud-connected tools on the move.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD221/qualcomm-snapdragon-gateway-2026-smartphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Anthropic joins OpenAI, Google DeepMind in Singapore</title>
<pubDate>Thu, 24 Sep 2026 02:55:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD202/anthropic-openai-google-deepmind-talent.html</link>
<description>&lt;p class="P1" data-start="3390" data-end="3696"&gt;Anthropic will open its Singapore office in October, making it the company's fifth office in the Asia-Pacific region after Tokyo, Bengaluru, Seoul, and Sydney. The move underscores the AI company's push into Singapore as demand for Claude surges across startups, large enterprises, and government agencies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD202/anthropic-openai-google-deepmind-talent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's Yusin pivots China OE brake pad business from BYD to JV automakers</title>
<pubDate>Thu, 24 Sep 2026 02:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD217/automakers-byd-volkswagen-honda-market.html</link>
<description>Taiwan-listed Yusin Holding Corp. said on September 23 that its Chinese subsidiary Fuzhou Assured Brake Systems is reducing its reliance on BYD and shifting its China original-equipment (OE) brake pad business toward joint-venture automakers including Volkswagen, Nissan and Honda. The subsidiary is targeting an 11% share of China's OE brake pad market by 2027.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD217/automakers-byd-volkswagen-honda-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd217_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Anthropic brings in Accenture to audit AI safety</title>
<pubDate>Thu, 24 Sep 2026 02:50:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD201/anthropic-staff-development-2026-embedded.html</link>
<description>&lt;p class="P1" data-start="3329" data-end="3674"&gt;Anthropic has announced a third-party on-site evaluation program, bringing in staff from Faculty, the AI company owned by Accenture, to test model safety measures with near-employee access. The two sides have each committed at least US$1 billion over the next five years to build what Anthropic calls a third-party embedded evaluation mechanism.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD201/anthropic-staff-development-2026-embedded.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC</title>
<pubDate>Thu, 24 Sep 2026 02:42:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD215/qualcomm-soc-packaging-flagship-snapdragon.html</link>
<description>Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&#38;amp;A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris Patrick said the new package still falls under existing Package on Package (PoP) technology, but the memory is no longer stacked directly above the die and is shifted to the side to create a thermal path.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD215/qualcomm-soc-packaging-flagship-snapdragon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd215_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Xi's US visit stirs alarm over a possible Chinese auto push into America</title>
<pubDate>Thu, 24 Sep 2026 02:34:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD207/automakers-xi-jinping-auto-industry-worldwide-mexico.html</link>
<description>&lt;p class="P1" data-start="3922" data-end="4269"&gt;Chinese President Xi Jinping's visit to the US is heightening anxiety across the global auto industry, where suppliers, dealers, and lawmakers fear it could open the door to Chinese carmakers in America. For readers worldwide, the issue matters because it could reshape EV pricing, supply chains, jobs, and trade tensions far beyond the US market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD207/automakers-xi-jinping-auto-industry-worldwide-mexico.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Garmin drops Micro LED after 1 year, returns to OLED</title>
<pubDate>Thu, 24 Sep 2026 02:25:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD239/garmin-commercial-display-technology-adoption.html</link>
<description>&lt;p class="P1" data-start="2608" data-end="3061"&gt;The commercial adoption of Micro LED display technology is facing another major setback. Just one year after making waves with the world's first commercial Micro LED smartwatch, Garmin has dropped the technology from its latest lineup. The newly announced Fenix 9 series, unveiled in August 2026, uses AMOLED and memory-in-pixel (MiP) solar display options instead, highlighting the persistent technical and economic hurdles facing Micro LED deployment.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260923PD239/garmin-commercial-display-technology-adoption.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260923pd239_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Garmin]]></media:description>
</media:content></item>
<item>
<title>India reportedly probes LG, Samsung over duties on OLED TV display parts</title>
<pubDate>Thu, 24 Sep 2026 02:24:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL204/samsung-display-lg-lg-electronics-tv.html</link>
<description>India's Directorate of Revenue Intelligence (DRI) is investigating LG Electronics and Samsung Electronics over whether they underpaid import duties on display parts for OLED televisions, &lt;em&gt;Reuters&lt;/em&gt; reported on September 23, citing five unnamed sources. The probe puts a tariff classification question at the center of a premium TV segment both South Korean companies are counting on to grow in India.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL204/samsung-display-lg-lg-electronics-tv.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap</title>
<pubDate>Thu, 24 Sep 2026 02:18:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924PD212/alibaba-nvidia-huawei-ascend-ai-chip.html</link>
<description>Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's most powerful AI chip to date." The V900 is intended to fill part of the computing gap left by restrictions on access to Nvidia's high-end accelerators.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924PD212/alibaba-nvidia-huawei-ascend-ai-chip.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks</title>
<pubDate>Thu, 24 Sep 2026 02:11:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL200/supermicro-nvidia-rubin-shipping-infrastructure.html</link>
<description>Supermicro has begun shipping Nvidia's next-generation Vera Rubin NVL72 systems, moving the rack-scale platform from product demonstrations into customer deployments as AI infrastructure increasingly requires integrated computing, power, and liquid-cooling systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL200/supermicro-nvidia-rubin-shipping-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Qualcomm's PickNik deal brings robotics software to its edge AI push</title>
<pubDate>Thu, 24 Sep 2026 02:02:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL203/qualcomm-software-robotics-arduino-acquisition.html</link>
<description>MoveIt's integration with Qualcomm's Dragonwing and Arduino platforms could give robot builders a more direct route from on-device AI to motion planning and control, while also testing whether the open-source project can retain its cross-platform standing under new ownership.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL203/qualcomm-software-robotics-arduino-acquisition.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl203_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Qualcomm]]></media:description>
</media:content></item>
<item>
<title>Intel puts CPU-GPU coordination at center of agentic AI strategy</title>
<pubDate>Thu, 24 Sep 2026 01:37:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL205/intel-data-cpu-training-2026.html</link>
<description>Intel is positioning closer coordination between CPUs, GPUs and other computing resources as a key requirement for the next phase of AI, as agentic AI shifts workloads from model inference toward complex task execution.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260924VL205/intel-data-cpu-training-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260924vl205_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus</title>
<pubDate>Thu, 24 Sep 2026 00:20:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL218/nvidia-ascend-huawei-beijing-hardware.html</link>
<description>Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260923VL218/nvidia-ascend-huawei-beijing-hardware.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260923vl218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Industrial software giants race to build industry world models</title>
<pubDate>Thu, 24 Sep 2026 00:19:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD231/software-industrial-chatgpt-manufacturing-adoption.html</link>
<description>While generative AI has surged into mainstream consumer use thanks to ChatGPT, the adoption of AI across industrial sectors has progressed at a much slower pace. Industry analysts point out that the primary culprit is the tendency of current AI architectures to "hallucinate," a fatal vulnerability in manufacturing environments where there is no tolerance for error. As industrial AI development cannot rely on large language models (LLMs) alone, attention is rapidly shifting toward industry world models that anchor AI systems in the laws of physics. Recognizing this pivot, global industrial software giants are already aggressively positioning themselves in this space.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260923PD231/software-industrial-chatgpt-manufacturing-adoption.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260923pd231_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Powertech targets quarterly growth in 2026, eyes record high</title>
<pubDate>Thu, 24 Sep 2026 00:18:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD237/2026-powertech-growth-packaging-revenue.html</link>
<description>&lt;p class="P1" data-start="2110" data-end="2584"&gt;Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end through-silicon via (TSV) DDR5 production in the fourth quarter of 2026 to drive sequential growth throughout 2026 and lift revenue to a new record. Its Taiwan fan-out panel-level package (FOPLP) line, already booked by Advanced Micro Devices (AMD), is set to add revenue from 2027 and open another growth chapter for both sales and profit.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AUO unveils EPS 2030 blueprint linking sustainability to business value</title>
<pubDate>Thu, 24 Sep 2026 00:17:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD232/auo-eps-2030-retail-growth.html</link>
<description>&lt;p class="P1" data-start="3482" data-end="3874"&gt;AUO has set out its EPS 2030 sustainability goals, expanding beyond factory energy saving and carbon reduction to applications including smart mobility, smart healthcare, smart retail, smart manufacturing, and low-carbon digital transformation. The company outlined 31 sustainability targets in total and said it has already achieved all 10 of its 2025 EPS goals, with a 100% completion rate.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>GMI AI compute leasing business sells out in US as big users lock in long contracts</title>
<pubDate>Thu, 24 Sep 2026 00:16:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD213/gmi-technology-electronics-business-2026-technology.html</link>
<description>&lt;p class="P1" data-start="2319" data-end="2666"&gt;GMI Technology, a Taiwan-based electronics component distributor and application solutions provider, said its AI computing rental business is booming, with strong demand from US technology companies for computing power. The company said large users tend to secure computing capacity through long-term contracts, leaving the market short of supply.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>SK Hynix Indiana HBM plant faces lawsuit</title>
<pubDate>Thu, 24 Sep 2026 00:16:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD230/sk-hynix-hbm-lawsuit-production-bandwidth.html</link>
<description>&lt;p class="P1" data-start="2232" data-end="2572"&gt;SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race for AI memory capacity intensifies. Local residents in the US are seeking to overturn a land-use change and halt construction, with a trial scheduled for December 2026 and the case drawing market attention.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI</title>
<pubDate>Thu, 24 Sep 2026 00:15:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL219/donald-trump-xi-jinping-data-beijing-infrastructure.html</link>
<description>When Donald Trump and Xi Jinping discuss artificial intelligence, the deeper divide may not be over whether AI needs rules, but over what those rules are designed to protect.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>OUCC sees semiconductor chemical shipments ramping up in 2027</title>
<pubDate>Thu, 24 Sep 2026 00:15:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD216/shipments-2027-revenue-capacity-2026.html</link>
<description>Oriental Union Chemical Corporation (OUCC) expects shipments of semiconductor chemicals to ramp up in 2027 as more products complete customer qualification, with the Taiwan-based chemical maker targeting electronic chemicals to account for 10% of revenue by 2028.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use</title>
<pubDate>Thu, 24 Sep 2026 00:14:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD229/microsoft-technology-anthropic-chips-cost.html</link>
<description>&lt;p class="P1" data-start="1663" data-end="2154"&gt;Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity tool into deeper uses in core business workflows. In addition to token consumption and model costs, Microsoft Taiwan general manager Sean Pien points out that corporations are also examining how AI actually benefits workflows and innovation, making return-on-investment (ROI) evaluations harder to judge solely on the basis of time or labor savings.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>ASRock Industrial's game-streaming win signals longer revenue tail, but supply risks remain</title>
<pubDate>Thu, 24 Sep 2026 00:14:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD209/asrock-revenue-2027-component-demand.html</link>
<description>&lt;p class="P1" data-start="1476" data-end="1820"&gt;ASRock Industrial has secured a large North American game-streaming services project that could extend well into 2027, according to chairman James Lee. The industrial PC maker said the deal supports a long-term customer deployment, even as component shortages, rising prices, and staged ordering continue to cloud the near-term revenue picture.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260923PD209/asrock-revenue-2027-component-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260923pd209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[ASRock Industrial chairman James Lee (R) and president Handsome Tseng (L). Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>LSTC links with Rapidus to revive Japan's advanced chipmaking</title>
<pubDate>Thu, 24 Sep 2026 00:13:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD204/lstc-rapidus-design-technology-talent.html</link>
<description>&lt;p class="P1" data-start="2362" data-end="2694"&gt;Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans to mass-produce 2-nanometer chips in 2027, to advance next-generation semiconductor research and talent development and give Japan a unique edge in the global race for advanced process technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO</title>
<pubDate>Thu, 24 Sep 2026 00:13:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD236/amd-intel-openvino-2025-on-device-ai.html</link>
<description>&lt;p class="P1" data-start="5885" data-end="6125"&gt;Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after another, a wave of "keeping lobsters" began to emerge around on-device AI models paired with AI agents.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260922PD236/amd-intel-openvino-2025-on-device-ai.html</guid>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>US, China diverge on AI guardrails ahead of Trump-Xi summit</title>
<pubDate>Wed, 23 Sep 2026 09:26:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL220/development-technology-ceo.html</link>
<description>&lt;p class="P1" data-start="3032" data-end="3371"&gt;The US and China are moving toward different models for governing increasingly capable artificial intelligence, even as the US proposes a limited safety mechanism with China ahead of President Donald Trump and Chinese President Xi Jinping's September 24 summit in Washington. AI is expected to be among the issues discussed at the meeting.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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