DIGITIMES: News and Insight of the Global Supply Chain

Sandisk says HBF can match HBM bandwidth with up to 16x the capacity

DIGITIMES — Wed, 2 Sep 2026 09:54:45 GMT

Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory closer to processors as inference workloads strain conventional memory systems.

Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth

DIGITIMES — Wed, 2 Sep 2026 09:41:08 GMT

Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks to new architectures to overcome the widening gap between processor performance and memory bandwidth.

Lam Research exec says automated preventive maintenance key to fabs of the future

DIGITIMES — Wed, 2 Sep 2026 09:03:25 GMT

A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but from pairing collaborative robots with AI-driven predictive maintenance to close a long-standing gap in fab operations.

DRAM giants target 3D stacking to break memory wall and power bottlenecks

Yunnie Cheng — Wed, 2 Sep 2026 08:45:00 GMT

At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching a performance ceiling. Consequently, the industry is transitioning toward 3D vertical stacking architectures to minimize transmission power consumption and leverage wafer-level bonding technologies.

Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale

DIGITIMES — Wed, 2 Sep 2026 08:30:00 GMT

Four days after listing on Nasdaq, Pasqal came to SEMICON Taiwan with an argument aimed squarely at its competitors: the industry's assumption that quantum computing delivers nothing useful before fault tolerance arrives around 2030 is wrong, and the French company intends to sell against it.

EU EV battery recycling still lacks a profitable model

AI bot — Wed, 2 Sep 2026 08:20:00 GMT

The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing, yet a sustainable business model has not emerged.

Taiwan's semiconductor ecosystem has the UK taking notes

Rodney Chan — Wed, 2 Sep 2026 07:55:00 GMT

The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry of Economic Affairs (MOEA) in Taipei on September 1. It is generally believed that government support, close collaboration among industry, academia and research institutions, and corporate long-term vision are key drivers of Taiwan's semiconductor success.

Nvidia and Micron top NT$4.4T in Taiwan investment

Charlene Chen — Wed, 2 Sep 2026 07:50:46 GMT

On the eve of the opening of SEMICON Taiwan 2026, the Ministry of Economic Affairs (MOEA) hosted the Semicon Network Summit, where President Ching-Te Lai said Nvidia invests and procures more than NT$3 trillion (US$94.4 billion) a year in Taiwan. He added that Micron has invested more than NT$1.4 trillion cumulatively, while AMD has expanded its Taiwan R&D and investment to more than NT$300 billion.

Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

Yunnie Cheng — Wed, 2 Sep 2026 07:50:00 GMT

Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver modules, and ultra-high-layer AI server boards with up to 34 layers. The showcase underscores the company's advanced printed circuit board (PCB) engineering capabilities for next-generation AI computing infrastructure, spanning high-speed data transmission to multi-layer board designs.

Samsung, SK Hynix inventories surge as valuation reserves fall

DIGITIMES — Wed, 2 Sep 2026 07:41:00 GMT

Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues to strain available supply.

Semicon Taiwan 2026 to test cloud AI investment boom

Yunnie Cheng — Wed, 2 Sep 2026 07:33:00 GMT

Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon Taiwan 2026 may serve as the ultimate litmus test for this debate.

Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand

Eifeh Strom — Wed, 2 Sep 2026 07:30:00 GMT

Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed transmission cable shipments for artificial intelligence (AI) applications, coupled with strong pull-in momentum from a major US low-Earth-orbit (LEO) satellite customer, drove second-quarter results. The company also said it is expanding capacity in Thailand and Vietnam to capture new opportunities in space data centers and physical AI.

World's first legged robot standard sets global benchmark for humanoids, robot dogs

DIGITIMES — Wed, 2 Sep 2026 07:10:52 GMT

China-led experts have released what CCTV described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots, robot dogs and other machines designed to walk, run, climb slopes and cross obstacles.

Indium CEO: packaging, cooling and power are next AI bottlenecks

Yunnie Cheng — Wed, 2 Sep 2026 06:55:00 GMT

As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and power delivery. With GPUs, high-bandwidth memory (HBM), and advanced packaging pushing power density higher, chipmakers now face challenges that extend well beyond silicon manufacturing, including managing thermal expansion, warpage, heat dissipation, and reliability across heterogeneously integrated materials.

India reportedly readies AI agent payments on UPI, its national payment rails

DIGITIMES — Wed, 2 Sep 2026 06:55:00 GMT

India is preparing a framework that would allow AI agents to make small digital payments without requiring user approval for every transaction, three sources familiar with the matter told Reuters. This would be a step that would put one of the world's largest payment networks behind agentic commerce.

TSMC moves into Baipu Industrial Park, boosts advanced packaging

Charlene Chen — Wed, 2 Sep 2026 06:45:00 GMT

TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by the industry, the move is expected to improve efficiency by 25% to 50% as the company builds a collaborative verification platform with suppliers.

TSMC reportedly asks suppliers to develop 5μm HBM microbumps

DIGITIMES — Wed, 2 Sep 2026 06:40:00 GMT

TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews, signaling that the foundry may continue scaling conventional microbumps rather than shift immediately to hybrid bonding.

Certain Micro targets AI test-interface demand with three Semicon products

DIGITIMES — Wed, 2 Sep 2026 06:35:08 GMT

As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising AI and high-performance computing (HPC) chip testing demand: fine drilling for upper and lower guide plates, probe card structural components, and ATE Stiffener test frames.

China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race

DIGITIMES — Wed, 2 Sep 2026 06:25:00 GMT

Chinese private launch company Galactic Energy Space Technology Co. has successfully flown PALLAS-1, its medium-to-large reusable liquid-fuel rocket, marking its expansion into a dual solid- and liquid-fuel portfolio.

Energy and water: How to tackle the fab resource crunch

DIGITIMES — Wed, 2 Sep 2026 06:19:16 GMT

As artificial intelligence demand drives astronomical growth in advanced chip manufacturing, the semiconductor industry is hitting critical resource bottlenecks. Speaking at SEMICON Taiwan 2026, leaders from Ecolab and Edwards Vacuum warned on September 2 that continuing with current water and energy practices is unsustainable.

IBM's quantum pitch to chip audience: bottleneck is now manufacturing

DIGITIMES — Wed, 2 Sep 2026 05:00:00 GMT

IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount of process scaling closes the gap, and that the constraint on quantum is now a manufacturing problem — one IBM intends to solve with a dedicated 300mm foundry.

Global smartphone industry, 2Q 2026

DIGITIMES — Wed, 2 Sep 2026 04:18:06 GMT

According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Charlene Chen — Wed, 2 Sep 2026 04:16:34 GMT

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after excluding memory, 75% of the cost comes from advanced packaging, assembly and testing. In the single-chip era, that portion barely existed in the cost structure.

Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

DIGITIMES — Wed, 2 Sep 2026 04:05:00 GMT

Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation lightweight mixed-reality headset, codenamed Phoenix, while rival BOE failed to obtain supplier qualification, according to South Korea's The Elec.

Operations shake-up: how SpaceX is reengineering its AI data center strategy

DIGITIMES — Wed, 2 Sep 2026 03:58:55 GMT

Elon Musk has restructured the SpaceX leadership team tasked with constructing the company's AI data centers, replacing several leaders with executives drawn from SpaceX's rocket and satellite internet divisions. The reshuffle follows mounting civil engineering concerns and persistent operational reliability issues at existing data center facilities in Tennessee and Mississippi. During its initial push to establish AI infrastructure rapidly, the company operated clusters for extended periods without backup cooling or power systems, significantly elevating the risk of system outages, sources told The Information.

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Levi Li — Wed, 2 Sep 2026 03:58:48 GMT

Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan 2026.

Manus resumes independent operations after Meta deal collapses

DIGITIMES — Wed, 2 Sep 2026 03:55:00 GMT

Manus has resumed independent operations under its founding team, closing a turbulent chapter that began with Meta Platforms' multibillion-dollar acquisition of the AI agent startup and ended after Chinese regulators ordered the transaction canceled.

Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC

Yunnie Cheng — Wed, 2 Sep 2026 03:51:38 GMT

Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that while the advanced packaging sector offers massive commercial opportunities and a bright outlook, the industry still has critical gaps to address across both hardware and software.

SDC to expand foldable iPhone OLED mass production in September

DIGITIMES — Wed, 2 Sep 2026 03:30:00 GMT

Samsung Display (SDC) is expected to formally expand mass production of OLED panels for Apple's foldable iPhone starting in September 2026. Although the ramp-up for the foldable iPhone had previously been pushed back because production delays hit some components, including the hinge and substrate, the new OLED mass production schedule suggests SDC can still meet its full-year production target.

European chip ambitions hinge on more than subsidies, says TSMC

Jingyue Hsiao — Wed, 2 Sep 2026 03:26:26 GMT

The EU is pressing ahead with the European Chips Act and discussing a second phase, but TSMC says public money alone will not secure a durable semiconductor base. The company argues that long-term demand, operating conditions, and administrative coordination will matter more than incentives if Europe wants lasting manufacturing capacity.

ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants

Levi Li — Wed, 2 Sep 2026 03:21:05 GMT

ByteDance and ZTE are preparing to launch the Nubia NaviX Ultra in September after the AI smartphone received China's network access approval, clearing the regulatory process from large-model filing to device certification.

Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout

DIGITIMES — Wed, 2 Sep 2026 03:13:30 GMT

Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp earnings rebound and record shipments in the first half of 2026.

China moves to curb overseas price wars as automakers accelerate global expansion

DIGITIMES — Wed, 2 Sep 2026 02:41:39 GMT

China has introduced new guidelines aimed at steering its automotive industry toward more orderly competition overseas as domestic automakers and suppliers expand rapidly into international markets.

Taiwan doesn't just want a quantum lab — it wants a quantum fab

DIGITIMES — Wed, 2 Sep 2026 02:30:00 GMT

Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is open now because nobody has claimed the position yet.

TCL CSOT bets on InP laser chips as supply tightens

Sherri Wang — Wed, 2 Sep 2026 02:29:06 GMT

Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand imbalance for InP has become more severe than the shortages seen in DRAM and NAND memory, making the material a potential bottleneck as data centers scale high-speed optical links.

MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments

Levi Li — Wed, 2 Sep 2026 02:15:00 GMT

Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing wafer foundry and packaging and testing capacity, leaving the MCU market undersupplied through the end of 2026.

GoPro to merge with Starman Optical in US$285 million deal, pivoting deeper into AI and defense markets

DIGITIMES — Wed, 2 Sep 2026 02:10:21 GMT

GoPro's planned US$285 million merger with Starman Optical could give the struggling action-camera maker a path to recapitalize its balance sheet and expand into optical transceivers, AI infrastructure, defense, robotics, and aerospace. The deal would repay GoPro's roughly US$92 million in debt while leaving existing shareholders with about 10% of the combined company, potentially marking a major shift in GoPro's business beyond consumer cameras.

AI demand push expands wafer industry's growth outlook

Jingyue Hsiao — Wed, 2 Sep 2026 01:55:00 GMT

AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain. She said the industry is entering a new growth phase driven by AI, advanced packaging, and broader material changes, rather than a simple cyclical rebound.

Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%

DIGITIMES — Wed, 2 Sep 2026 01:45:21 GMT

Anthropic has released Claude Fable 5.1 and Claude Mythos 5.1, betting that cheaper agentic-AI economics and early scientific-research results will differentiate its latest models more than raw benchmark gains alone. The two are the same underlying model at different safeguard levels: Fable 5.1 is generally available now on Anthropic's platform, Amazon Web Services (AWS), Google Cloud, and Microsoft Azure under the API identifier claude-fable-5-1, while Mythos 5.1 is limited to vetted organizations working in cybersecurity and the life sciences, according to Anthropic's announcement.

Taiwan materials makers see new opening in chip packaging shift

Jingyue Hsiao — Wed, 2 Sep 2026 01:45:00 GMT

Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move higher up the global chip supply chain, especially as specifications are still taking shape and adoption decisions remain open among international customers.

TSMC says Europe chip strategy is shifting from plans to demand creation

Jingyue Hsiao — Wed, 2 Sep 2026 01:32:58 GMT

The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because Europe's chip ambitions could influence supply chains for cars, industrial equipment, and future high-performance computing systems far beyond the region.

Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint

Eifeh Strom — Wed, 2 Sep 2026 01:30:00 GMT

Gemtek Technology announced that it is deepening its strategic cooperation with India's Dixon Technologies through their joint venture in India, expanding the manufacturing and market presence of its optical transceivers, bidirectional optical sub-assembly (BOSA), and other high-speed optical connectivity solutions.

Dell says enterprise AI customers accelerated even faster than its record orders suggest

DIGITIMES — Wed, 2 Sep 2026 01:17:29 GMT

Dell Technologies' quarterly results showed record AI server orders and backlog, but executives used the earnings call's question-and-answer session on September 1 to disclose a more detailed point not in the headline numbers: the pace at which enterprise customers, rather than just large cloud and sovereign buyers, are adopting its AI infrastructure.

Dell's AI server boom lifts profitability across its whole business

DIGITIMES — Wed, 2 Sep 2026 01:00:39 GMT

Dell Technologies closed its fiscal second quarter with revenue of US$47.0 billion, up 58% year over year, but the more telling number is what happened below the top line: operating income more than tripled, and the operating margin nearly doubled to 11.5% from 6.0% a year earlier. AI infrastructure did not just add revenue this quarter — it pulled the entire company's profitability up with it.

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

Jingyue Hsiao — Wed, 2 Sep 2026 00:57:29 GMT

Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging, smart fab, quantum technology, and system integration. SEMI said the event reflects how artificial intelligence is reshaping the global semiconductor supply chain.

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

Charlene Chen — Wed, 2 Sep 2026 00:33:04 GMT

As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest contract chipmaker, is expanding its silicon photonics (SiPh) efforts and focusing on thin-film lithium niobate (TFLN) as a core technology for overcoming key bottlenecks, while its SiPh platform has moved into 12-inch production.

Apple's M6 and M5 Ultra break rule tying process to chip strength

Lily Hess — Wed, 2 Sep 2026 00:32:52 GMT

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer process is used only in the entry-level Mac mini, while the 3-nanometer M5 Ultra is officially billed as the "most powerful M-series chip yet."

How Taiwan is closing its semiconductor materials gap — three shifts to watch

Charlene Chen — Wed, 2 Sep 2026 00:25:08 GMT

Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute exposed a structural risk: even as Taiwan concentrated manufacturing at home, key raw materials remained controlled by overseas suppliers.

Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears

Yunnie Cheng — Wed, 2 Sep 2026 00:24:54 GMT

ChangXin Memory Technologies (CXMT) has escalated its defense against the US government, shifting from supply-chain and technological competition into a full-scale courtroom battle. On August 28, 2026, the Chinese memory leader disclosed a stellar first-half financial report following its IPO and announced on the same day that it was suing the US Department of Defense (DoD).

Micro LED maker PlayNitride targets Micro LED optical communications within two years

Levi Li — Wed, 2 Sep 2026 00:24:41 GMT

Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two years, expanding beyond displays into AI devices, data center optical transmission, silicon photonics and co-packaged optics (CPO).

Innolux targets advanced packaging with debut of Chip Last tech

Yunnie Cheng — Wed, 2 Sep 2026 00:24:24 GMT

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous integration. This transition is accelerating global demand for advanced packaging.

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

Charlene Chen — Wed, 2 Sep 2026 00:24:10 GMT

Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC substrate materials. Some items will rise by as much as 30%, with the new pricing taking effect on shipments starting September 1.

AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks

Charlene Chen — Wed, 2 Sep 2026 00:23:52 GMT

On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on September 1.

US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles

Yunnie Cheng — Wed, 2 Sep 2026 00:02:42 GMT

The US is rapidly reshaping the cost structure of its solar supply chain under Section 232 of the Trade Expansion Act of 1962. According to a recent webinar hosted by Intertek CEA, the US-based solar advisory arm of British multinational group Intertek, new minimum import prices (MIP) and tariffs are driving up the cost of imported modules, paving the way for domestic manufacturers to achieve market dominance by 2027.

China memory-module makers report surging profits, strained cash flow

DIGITIMES — Wed, 2 Sep 2026 00:01:47 GMT

Seven listed Chinese memory-module and memory-distribution companies have filed first-half 2026 results, and the headline numbers are the largest the tier has ever reported. The more useful number is further down each statement: four of the seven reported negative operating cash flow, as inventory purchases and other working-capital demands absorbed cash even as profits rose.

LG fights Chinese brands with innovation, business model shifts

DIGITIMES — Tue, 1 Sep 2026 23:55:00 GMT

LG Electronics is bolstering sales of home appliances, TVs and other consumer products through innovation and product segmentation. On the 1st, LG said it will launch new air purifiers and edge purifiers to meet air-care demand in small homes and other diverse living spaces.

Commentary: Malaysia wants foreign automotive investment to leave more behind

DIGITIMES — Tue, 1 Sep 2026 23:52:10 GMT

The 2026 Global Automotive and Technology Expo (GATE 2026), held August 26-28 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, was ostensibly about the future of mobility. But the stronger message from the three-day event was about something more fundamental: Malaysia wants foreign automakers to build an industrial ecosystem, not simply sell cars.

Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference

DIGITIMES — Tue, 1 Sep 2026 23:49:51 GMT

China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory dies, chips, modules, 2U trays, and racks.

Qisda builds physical AI ecosystem from land to space

Rodney Chan — Tue, 1 Sep 2026 23:49:23 GMT

Qisda has been expanding its display, commercial, and industrial businesses beyond traditional desktop monitors into medical, rugged, automotive, unmanned vehicle, drone, and low-Earth-orbit (LEO) satellite applications. Its Commercial and Industrial Group (CIG) has now made physical AI a core priority. CIG aims to extend Qisda's products from underwater, across land, and into the sky and outer space, building a full physical AI ecosystem.

Nvidia pushes into HBM base dies as NVHBM battle heats up

DIGITIMES — Tue, 1 Sep 2026 23:49:11 GMT

The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its NVHBM architecture, the fight is shifting toward who gets to define the base die — now emerging as the control center of next-generation HBM.

'Chinamaxxing' fuels China tech tourism as visitors flood Huaqiangbei

DIGITIMES — Tue, 1 Sep 2026 23:48:47 GMT

In the summer of 2026, the term "Chinamaxxing" has gone viral on overseas social media, reflecting a trend among young people, especially Gen Z in the West, who openly praise China and a China-style way of life. The trend is drawing foreign visitors to sites such as Xiaomi's EV superfactory, Wenchang Beach rocket launches, and Shenzhen's Huaqiangbei, where they shop for "Made in China" tech.

Taiwan eyes satellite communications to cut sea cable reliance

DIGITIMES — Tue, 1 Sep 2026 23:48:37 GMT

More than 90% of Taiwan's external communications rely on subsea cables, raising concerns over resilience and pushing policymakers and experts to call for satellite communications to be brought onshore as a backup. At a forum on July 31, the Ministry of Digital Affairs said the island's 4G and 5G networks together cover 99% of the population, but its international connectivity remains vulnerable to cable cuts.

Global quantum industry accelerates as Taiwan eyes Asia hub

DIGITIMES — Tue, 1 Sep 2026 23:48:17 GMT

As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international cooperation, and capital. On August 31, the Taiwan Association of Quantum Computing and Information Technology (TAQCIT), SEMI, and the Taiwan Institute of Economic Research invited representatives from eight countries based in Taiwan to share details of the upcoming "2026 Taiwan Quantum Forum" and discuss whether Taiwan can become such a hub.

Tmytek to list on Innovation Board in September on antenna module growth

DIGITIMES — Tue, 1 Sep 2026 23:48:07 GMT

Millimeter-wave phased-array solutions provider Tmytek is set to list on the Innovation Board in September. Although the company has yet to turn profitable, its revenue mix has been shifting rapidly in recent years as antenna modules take a larger share, raising hopes that earnings will improve as upcoming projects scale up.

Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration

Eifeh Strom — Tue, 1 Sep 2026 23:45:59 GMT

Gudeng Precision Industrial chairman Bill Chiu said on August 31 that the company has begun building out its global manufacturing footprint. Its Japan plant is expected to complete further expansion in the second half of 2027 and gradually enter mass production, while the company has begun using an existing leased facility in the US for basic processing and manufacturing preparations.

Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese

DIGITIMES — Tue, 1 Sep 2026 16:05:00 GMT

Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.

Taiwan carbon fee joins UK CBAM qualifying list

DIGITIMES — Tue, 1 Sep 2026 08:56:00 GMT

Taiwan's carbon fee has been formally included in the UK government's list of Qualifying Carbon Pricing Schemes (QCPS) under its Carbon Border Adjustment Mechanism (CBAM), alongside major carbon pricing systems in the EU, Japan, South Korea and Singapore. The Ministry of Environment said the move shows Taiwan's carbon pricing framework is now aligned with international systems and will help export industries respond to global carbon border measures while maintaining competitiveness.