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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex</title>
<pubDate>Fri, 5 Jun 2026 08:59:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD240/qualcomm-equipment-hiwin-technologies-partnership-2026.html</link>
<description>Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Foxconn posts record May revenue as AI rack demand fuels growth</title>
<pubDate>Fri, 5 Jun 2026 08:51:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD239/foxconn-revenue-growth-2026-demand.html</link>
<description>Computex 2026 closed on June 5 with Nvidia CEO Jensen Huang reaffirming the scale of AI infrastructure demand in his keynote &#38;mdash; and Foxconn, as the world's largest electronics contract manufacturer, is among the most direct beneficiaries of that buildout.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>NXP chief says factories will lead robot adoption globally</title>
<pubDate>Fri, 5 Jun 2026 08:50:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD205/nxp-adoption-robot-robotics-market.html</link>
<description>Industrial factories are likely to become the first major market for robots at scale, according to NXP chief executive Rafael Sotomayor, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>US officials explore an AI dividend for American households</title>
<pubDate>Fri, 5 Jun 2026 08:45:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL211/dividend-government-openai-technology-anthropic.html</link>
<description>Senior US officials have begun exploring a highly unconventional idea: taking equity stakes in leading artificial intelligence companies and using the proceeds to share the gains of the AI boom with the American public.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Sambanova challenges GPU dominance in AI inference at Computex</title>
<pubDate>Fri, 5 Jun 2026 08:40:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL220/computex-ai-inference-gpu-2026-intel.html</link>
<description>SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall &#38;mdash; and to demonstrate, live on stage, an alternative architecture it calls disaggregated inference running in a production data center.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>FADU wins new contracts as AI workloads reshape data storage</title>
<pubDate>Fri, 5 Jun 2026 08:38:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD228/ssd-controller-data-storage-infrastructure.html</link>
<description>As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
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<title>From 10kW to 1MW per rack in five years: Flex CTO says the hardest leap is still ahead</title>
<pubDate>Fri, 5 Jun 2026 08:36:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL219/flex-infrastructure-cooling-2030.html</link>
<description>AI rack power density has increased 50 times in five years &#38;mdash; and the next jump may be the hardest yet.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Analysis: How Jensen Huang pays top dollar to keep Nvidia on top</title>
<pubDate>Fri, 5 Jun 2026 08:29:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD215/jensen-huang-nvidia-taipei-labor-samsung.html</link>
<description>When Jensen Huang was asked in Taipei about Samsung Electronics' recent labor dispute, the Nvidia chief executive offered a characteristically direct response.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>ICT</category>
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<title>Global top-3 memory maker status, 2Q 2026: Surging prices and AI demand lock in a strong memory seller's market</title>
<pubDate>Fri, 5 Jun 2026 08:06:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602RS400/2026-revenue-demand-market-dram.html?chid=2</link>
<description>Memory makers' revenues are estimated to hit another record high in the second quarter of 2026; The US, Japan, and South Korea launch new product competitions, while Taiwanese players continue to pursue niche market momentum.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
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<title>Anthropic calls for AI research slowdown as model capabilities accelerate</title>
<pubDate>Fri, 5 Jun 2026 08:03:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL210/anthropic-claude-development-startup.html</link>
<description>Anthropic has warned about the deepening capabilities of AI and called for the world to slow down research in frontier models. The startup said that the quickening pace of AI development may make models difficult to control in the coming years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Huawei's Tau Law stirs debate over China's post-Moore's Law chip path</title>
<pubDate>Fri, 5 Jun 2026 07:54:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD229/huawei-1.4nm-eda-design.html</link>
<description>&lt;p class="P1" data-start="71" data-end="344"&gt;Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed at improving chip performance through optimisation across components, circuits, chips, and systems, even under mature process technologies.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Alibaba opens Qwen to KFC, Luckin Coffee, and airlines in AI agent battle</title>
<pubDate>Fri, 5 Jun 2026 07:47:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL210/alibaba-qwen-ai-agent-llm.html</link>
<description>Alibaba is opening its Qwen AI assistant to external brands and third-party agents, turning the consumer app from a chatbot into a transactional platform for food orders, travel planning, and other everyday services.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Infineon India moves up the value chain as AI data centers boost power-chip demand</title>
<pubDate>Fri, 5 Jun 2026 07:39:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL209/infineon-demand-data-software-iot.html</link>
<description>Infineon Technologies' India operations are moving beyond traditional engineering support into global ownership roles, as rising demand from AI data centers reshapes the power semiconductor market, according to Vinay Shenoy, managing director of Infineon Technologies India.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Vinay Shenoy, Managing Director, Infineon Technologies India. Credit: Infineon.]]></media:description>
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<title>Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business</title>
<pubDate>Fri, 5 Jun 2026 07:35:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL207/nexchip-business-wafer-equipment-management.html</link>
<description>Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core 12-inch wafer foundry platforms.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>AI servers and MLCC recovery drive growth at Ample Electronic</title>
<pubDate>Fri, 5 Jun 2026 07:04:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD226/ample-electronic-ai-server-mlcc-demand-growth-recovery.html</link>
<description>As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most overlooked segments: passive components.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>ICT</category>
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<title>GoldKey Technology sees memory crunch lasting into 2028 as AI demand lifts prices</title>
<pubDate>Fri, 5 Jun 2026 06:50:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD213/ddr5-demand-industrial-control-2028.html</link>
<description>&lt;p class="P1" data-start="611" data-end="815"&gt;GoldKey Technology expects memory shortages to persist into 2028, with AI demand and structural supply constraints set to keep prices rising through the second half of 2026 and into 2027.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>AI demand strains PCB supply chains, lead times stretch past 20 weeks</title>
<pubDate>Fri, 5 Jun 2026 06:21:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD209/demand-pcb-supply-chain-ccl-high-end.html</link>
<description>Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into printed circuit boards, memory, and passive components. Longer lead times and rising prices are adding uncertainty for data center, optical module, and equipment buyers worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>US targets China's PCB grip as AI and defense supply risks mount</title>
<pubDate>Fri, 5 Jun 2026 05:52:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD221/pcb-supply-chain-capacity-security-usa.html</link>
<description>As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Global semiconductor market to hit US$1.5 trillion in 2026 as memory surges 250%, WSTS forecasts</title>
<pubDate>Fri, 5 Jun 2026 04:53:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL208/semiconductor-industry-wsts-growth-forecast-2026.html</link>
<description>The global semiconductor market is on track to nearly double in 2026, reaching US$1.51 trillion &#38;mdash; a 90% year-over-year increase &#38;mdash; driven overwhelmingly by an extraordinary surge in memory chip demand, according to the World Semiconductor Trade Statistics (WSTS) Spring 2026 forecast released on June 2.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia's Jensen Huang to meet South Korean business leaders beyond HBM sector</title>
<pubDate>Fri, 5 Jun 2026 04:49:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL207/nvidia-jensen-huang-south-korea-gaming-robotics-business.html</link>
<description>&lt;p class="P1" data-start="1528" data-end="1783"&gt;Nvidia CEO Jensen Huang is visiting South Korea on June 5 for meetings with major Korean business leaders, as the company's cooperation with local companies broadens beyond high-bandwidth memory into robotics, automobiles, gaming, and cloud infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Infineon sees early quantum computing gains as finance leads adoption</title>
<pubDate>Fri, 5 Jun 2026 04:34:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD210/infineon-quantum-computing-finance-demand-technology.html</link>
<description>Infineon Technologies said its long-running work in quantum computing is beginning to pay off, with early demand strongest in finance, chemistry, and life sciences. For global readers, the company's comments signal that quantum systems are moving closer to commercial relevance, even as the market remains early, crowded, and dependent on wider industry cooperation.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Meta's delayed Muse Spark API raises questions over AI monetization strategy</title>
<pubDate>Fri, 5 Jun 2026 04:20:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605VL201/meta-ai-api-launch-revenue.html</link>
<description>Meta has postponed the public release of the application programming interface (API) for its latest AI model, Muse Spark, multiple times since its April debut, according to a report by &lt;em&gt;The Wall Street Journal.&lt;/em&gt; The delay comes as Meta seeks to turn massive AI investments into sustainable revenue streams and compete more directly with OpenAI, Anthropic, and Google.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>GIS Holding pledges 100% green power across global sites by 2040</title>
<pubDate>Fri, 5 Jun 2026 04:01:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD220/gis-touch-panel-re100-renewable-energy-capacity.html</link>
<description>Touchscreen panel maker GIS Holding announced on World Environment Day, June 5, that it will join the RE100 initiative and aim to source 100% green power across its global operations by 2040. The firm outlined short-, medium-, and long-term plans to expand renewable energy use, and said executives disclosed a mix of measures to reach the target.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Nvidia deepens humanoid robotics role with Unitree and Cosmos 3, secures AI chips</title>
<pubDate>Fri, 5 Jun 2026 03:51:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602VL207/nvidia-robotics-robot-chips-hardware.html</link>
<description>Nvidia is moving deeper into humanoid robotics, combining robot hardware, secure computing, world models and developer platforms as AI shifts from digital workloads to physical AI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China's EV makers are learning that growth comes at a cost</title>
<pubDate>Fri, 5 Jun 2026 03:49:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD215/china-ev-sales-gross-margin-xpeng-li-auto-nio.html</link>
<description>After briefly flirting with profitability late last year, China's leading electric-vehicle (EV) startups have once again slipped into the red, highlighting the mounting challenges facing a sector that is rapidly maturing but remains fiercely competitive.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Electric Vehicles</category>
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<title>Jiin Ming debuts Raven remote controller at Japan Drone 2026</title>
<pubDate>Fri, 5 Jun 2026 03:36:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD238/2026-market-supply-chain-development.html</link>
<description>Taiwanese firm Jiin Ming Industry unveiled its self-developed JMG flight remote controller &#38;mdash; Raven &#38;mdash; at the Japan Drone 2026 exhibition, marking the first time the company has showcased an in-house flight remote controller at an international trade show. The debut highlights its technological progress in drone control systems.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher</title>
<pubDate>Fri, 5 Jun 2026 03:36:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL204/india-pcb-ccl-cost-inflation-production.html</link>
<description>India's PCB industry is facing mounting supply constraints and cost pressures, driven by a combination of raw material inflation, logistics disruptions, and a structural reliance on imports, according to industry associations cited by &lt;em&gt;The Economic Times&lt;/em&gt;, as well as additional media and policy reporting.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>South Korea finalizes US$520 million on-device AI chip budget amid industry doubts</title>
<pubDate>Fri, 5 Jun 2026 03:34:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL215/budget-on-device-ai-chips-development-government.html</link>
<description>South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal, as industry concerns persist over whether the chips developed under the program will reach commercial products, according to &lt;em&gt;The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260604vl215_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit:  Doosan Robotics]]></media:description>
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<title>COMPUTEX 2026: Taiwan optics leaders pivot from smartphone bottlenecks to edge AI supply chain</title>
<pubDate>Fri, 5 Jun 2026 03:33:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD222/optics-taiwan-2026-smartphone-supply-chain.html</link>
<description>Taiwan's optics makers, traditionally absent from PC-focused trade shows, made a landmark appearance at COMPUTEX 2026. Industry leaders including Largan Precision, Ability Opto-Electronics Technology, Altek Corporation, and Ability Enterprise used the event to showcase their latest research and development breakthroughs. Their presence signals a strategic pivot from behind-the-scenes smartphone component suppliers to frontline architects of the rapidly expanding edge AI ecosystem.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260605pd222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Foxconn deepens AI push with Intel on inference racks</title>
<pubDate>Fri, 5 Jun 2026 03:27:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD218/intel-foxconn-ai-inference-design-infrastructure-manufacturing.html</link>
<description>Intel and Foxconn have signed a memorandum of understanding (MoU) to cooperate on AI rack infrastructure, edge AI, physical AI platforms, and custom chip design services. The deal highlights Intel's bid to regain ground in artificial intelligence (AI), while broadening Foxconn's role in the global AI supply chain.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>HBM is too expensive, DRAM can't scale &#38;mdash; Kioxia tells Computex SSDs are the answer for agentic AI</title>
<pubDate>Fri, 5 Jun 2026 03:25:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL218/technology-kioxia-computex-hbm-dram.html</link>
<description>Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems, the next major constraint on AI performance will not be compute power but the ability to move data fast enough to feed it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<title>Compal's server business surges, non-PC revenue eyes 50% by 2027</title>
<pubDate>Fri, 5 Jun 2026 03:09:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD207/compal-business-revenue-pc-2027.html</link>
<description>Compal Electronics is accelerating a shift away from its long-standing PC business as AI servers and other non-PC lines gain momentum. The move could have broad implications for global supply chains, data center capacity, and technology customers seeking more diversified hardware partners across Asia, the US, and Vietnam.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Marvell says SerDes and packaging are key hurdles in switch chip development</title>
<pubDate>Fri, 5 Jun 2026 02:45:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD212/marvell-switch-packaging-development-performance.html</link>
<description>Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging &#38;mdash; issues that affect network capacity, signal quality, and cost across global data centers. The company is advancing its 100T TerraLynx T100 chip while preparing for more complex designs, higher speeds, and tighter integration ahead.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260605PD212/marvell-switch-packaging-development-performance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260605pd212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market</title>
<pubDate>Fri, 5 Jun 2026 02:28:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD211/intel-foxconn-partnership-edge-ai-manufacturing.html</link>
<description>Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly shaped by Nvidia's dominance in AI training and inference.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260605PD211/intel-foxconn-partnership-edge-ai-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260605pd211_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Foxconn]]></media:description>
</media:content></item>
<item>
<title>AI cooling demand is pushing server pumps into sharper focus</title>
<pubDate>Fri, 5 Jun 2026 02:26:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD204/avc-liquid-cooling-demand-design.html</link>
<description>As AI pushes liquid cooling into mainstream server thermal design, suppliers are widening their focus beyond Nvidia's benchmark thermal designs. Industry players say pumps are emerging as a key lever for improving cooling efficiency, alongside flow rate and fluid speed.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260605pd204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert</title>
<pubDate>Fri, 5 Jun 2026 02:17:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD217/cxmt-samsung-sk-hynix-talent-hbm.html</link>
<description>More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies are stepping up talent acquisition, moving from broad outreach to targeted recruitment of core semiconductor R&#38;amp;D personnel in South Korea and the US. Observers say the shift could accelerate the narrowing of the semiconductor technology gap between China and South Korea.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260605pd217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: CXMT]]></media:description>
</media:content></item>
<item>
<title>Commentary: EU tariff barrier may weaken as Japanese automakers lean on China's EV tech</title>
<pubDate>Fri, 5 Jun 2026 01:52:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD213/eu-tariffs-bev-japan-automakers-china.html</link>
<description>Japanese automakers' growing reliance on Chinese EV technology could weaken the EU's tariff strategy and reshape global car trade. As Mazda, Nissan, Honda, and Toyota adjust their electric plans, Europe may face more China-linked vehicles entering through third-country partners, altering competition, costs, and the pace of EV adoption worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260605PD213/eu-tariffs-bev-japan-automakers-china.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260605pd213_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Memory crunch pushes low-end smartphones toward 2026 breaking point</title>
<pubDate>Fri, 5 Jun 2026 01:42:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD200/2026-global-smartphone-market-smartphone-shipments.html</link>
<description>The global smartphone market performed better than expected in the first quarter of 2026 after some brands pulled forward orders, but shipments still fell by about 3.1% from a year earlier, ending nine consecutive quarters of growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20260605pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Commentary: Memory boom driven by DRAM now, but HBM will decide future</title>
<pubDate>Fri, 5 Jun 2026 01:37:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD207/dram-hbm-demand-samsung-sk-hynix.html</link>
<description>AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported strong earnings, prompting the market to reassess the strategic role of memory in AI infrastructure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260605pd207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Arm says Taiwan powers its rise as agentic AI lifts PC growth</title>
<pubDate>Thu, 4 Jun 2026 23:54:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD229/arm-taiwan-growth-pc-ceo.html</link>
<description>Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD229/arm-taiwan-growth-pc-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSMC CEO says rising profits mean greater social responsibility, clarifies bonus considerations</title>
<pubDate>Thu, 4 Jun 2026 23:53:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD237/tsmc-taiwan-ceo-demand-investment.html</link>
<description>Taiwan Semiconductor Manufacturing Company (TSMC) held its shareholders meeting on June 4, during which CEO C.C. Wei addressed recent talk surrounding its employee bonus system. He opened the meeting by preemptively clarifying the issue, saying there are misconceptions in the public discussion.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260604pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<title>TSMC says AI demand is straining entire supply chain, not just chipmakers</title>
<pubDate>Thu, 4 Jun 2026 23:50:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD203/tsmc-demand-supply-chain-chairman-equipment.html</link>
<description>TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment, and upstream suppliers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260605PD203/tsmc-demand-supply-chain-chairman-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260605pd203_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Hiwin targets logistics automation with Dexterity dual-arm robot</title>
<pubDate>Thu, 4 Jun 2026 23:47:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD230/robot-logistics-component-technology-equipment.html</link>
<description>Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules, and system integration. The company also unveiled a dual-arm logistics robot developed in partnership with US logistics firm Dexterity for the first time.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260603pd230_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: HIWIN]]></media:description>
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<title>Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption</title>
<pubDate>Thu, 4 Jun 2026 23:47:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602VL220/shenzhen-wearable-smart-glasses-adoption.html</link>
<description>This year's Global Connect Show (GSC) in Shenzhen, China, has become a medium for local tech brands to showcase AI wearable innovation. Two leading brands at GCS, Rokid and INMO, demoed their feature-packed AI glasses. Many companies featured AI translation as their flagship capability, paired with lightweight hardware, hands-free controls, customizable designs, and flexible model support. While on-site demos proved these up-and-coming brands' AI glasses may outperform dominant players such as Meta and Apple, there are still lingering flaws, such as battery life and privacy ethics, that stand in the way of mainstream mass adoption.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260602vl220_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows</title>
<pubDate>Thu, 4 Jun 2026 23:47:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL217/hanmi-demand-computex-revenue-hbm4.html</link>
<description>Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and gives it a prominent stage for its Computex debut.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260604vl217_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI energy demand drives a shift to vertical power delivery and smaller modules</title>
<pubDate>Thu, 4 Jun 2026 23:46:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL216/demand-industrial-infineon-power-components-silicon-technology.html</link>
<description>As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the centerpiece of presentations by several industry figures at Computex in Taipei, where they presented solutions under development, from raw material innovations to shrinking component sizes.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260604vl216_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Jeff Morroni, VP and head of R&#38;D of Texas Instruments' Kilby Labs. Credit: DIGITIMES]]></media:description>
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<title>SYNergy ScienTech eyes drone market with semi-solid cells</title>
<pubDate>Thu, 4 Jun 2026 23:45:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD236/solid-state-battery-drone-production.html</link>
<description>SYNergy ScienTech is developing semi-solid and all-solid-state cell product lines, with semi-solid cells already in trial production and all-solid-state cells slated for trial production in 2027, both targeting the drone market. President Colin Hsieh said drones will be a key market for the company.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD236/solid-state-battery-drone-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Foxconn, Intel link chips, racks and systems in AI infrastructure push</title>
<pubDate>Thu, 4 Jun 2026 23:45:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD233/foxconn-intel-infrastructure-chips-partnership.html</link>
<description>Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack infrastructure, edge AI, and physical AI platforms. The partnership will also extend to design services for custom ASICs, SoCs, and system integration, combining Intel's processor, silicon photonics, and software ecosystem with Foxconn's global manufacturing scale, system integration capabilities, and AI data center deployment experience.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD233/foxconn-intel-infrastructure-chips-partnership.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd233_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Foxconn chairman Young Liu (left) and Intel CEO Lip-Bu Tan. Credit: Foxconn]]></media:description>
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<title>South Korea's only SRAM-CIM IP firm Articron targets edge AI</title>
<pubDate>Thu, 4 Jun 2026 23:44:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD223/semiconductors-ip-startup-ic-design-sram.html</link>
<description>South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute chip IP "ART" now in testing and aimed at the power- and area-sensitive edge AI device market. The company says it expects to launch a commercial product in about two years.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD223/semiconductors-ip-startup-ic-design-sram.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd223_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Articron]]></media:description>
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<title>RTX Spark rekindles memory shortages, TeamGroup shifts to industrial control</title>
<pubDate>Thu, 4 Jun 2026 23:44:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD219/pc-market-rtx-industrial-control-sales.html</link>
<description>Although PC market sales have slumped amid rising memory prices, Nvidia's "N1X" RTX Spark superchip is also fueling hopes for AI PC potential. TeamGroup General Manager Gerry Chen said the N1X can be configured with up to 128GB of memory, but there is simply not enough memory available right now, meaning supply shortages will grow even more severe.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD219/pc-market-rtx-industrial-control-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd219_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Qualcomm says Wi-Fi 8 prioritizes reliability over speed</title>
<pubDate>Thu, 4 Jun 2026 23:44:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD218/qualcomm-wi-fi-antenna-wi-fi-7-performance.html</link>
<description>Qualcomm recently outlined its vision for Wi-Fi 8, saying the next-generation standard is designed to improve overall reliability, lower latency, and expand coverage. The company said the shift from Wi-Fi 7 to Wi-Fi 8 reflects a broader end-to-end ecosystem approach, from infrastructure to the client side.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
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<title>Foxconn says Nvidia's Vera Rubin AI products remain on track for 2026 shipment</title>
<pubDate>Thu, 4 Jun 2026 23:43:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD206/foxconn-fii-nvidia-rubin-production-2026.html</link>
<description>Foxconn and Foxconn Industrial Internet (FII) said at Computex that production of Nvidia's next-generation AI products is progressing smoothly, with shipments expected before the end of the third quarter of 2026. The outlook matters globally because it signals faster AI hardware deployment, lower computing costs, and wider adoption across consumer, enterprise, and automotive markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD206/foxconn-fii-nvidia-rubin-production-2026.html</guid>
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<title>Ventec wins spillover high-speed CCL orders, revenue rises</title>
<pubDate>Thu, 4 Jun 2026 08:36:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD234/ventec-ccl-revenue-materials-2026.html</link>
<description>Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed material certifications, and record-high sales of non-flow PP sheets. The copper-clad laminate (CCL) maker also benefited from strong demand for high-end drilling applications and a rising European distribution business, lifting revenue across its niche businesses.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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