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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Apple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing</title>
<pubDate>Mon, 13 Jul 2026 02:54:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713VL206/apple-ai-chip-roadmap-development.html</link>
<description>&lt;p class="P1" data-start="92" data-end="279"&gt;Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen its position in the AI era.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains</title>
<pubDate>Mon, 13 Jul 2026 02:48:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713VL204/tsmc-cowos-capacity-hbm-weekly-news-roundup.html</link>
<description>&lt;p class="P1" data-start="0" data-end="176"&gt;AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China's Nvidia H200 pivot reveals why CUDA still rules AI</title>
<pubDate>Mon, 13 Jul 2026 02:46:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713VL205/nvidia-beijing-market-software-chips.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:245;91-335"&gt;China is preparing to allow a limited number of Nvidia H200 AI accelerators into the country, giving Alibaba, ByteDance, and DeepSeek access to advanced computing power while preserving Beijing's broader campaign for semiconductor self-reliance.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Nvidia's HVDC shift could reshape data center power chains worldwide</title>
<pubDate>Mon, 13 Jul 2026 02:25:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD203/nvidia-power-components-design-data-center-rubin.html</link>
<description>Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift aims to cut energy losses and improve efficiency, but it also raises questions about safety, design, and the supply chain that may determine which technologies gain the fastest adoption.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>India opens first CMP pad technology hub in Hyderabad</title>
<pubDate>Mon, 13 Jul 2026 02:09:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713VL203/cmp-hyderabad-telangana-manufacturing.html</link>
<description>India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local chipmaking capabilities, reduce dependence on imports, and deepen India's role in a sector that supports electronics production worldwide, from phones to data centers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's Jiin Ming joins Japan-Ukraine Drone Cluster talks on drone systems</title>
<pubDate>Mon, 13 Jul 2026 02:03:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260712PD200/drone-supply-chain-taiwan-japan-ukraine-development.html</link>
<description>Taiwanese drone manufacturer Jiin Ming Industry attended the launch press conference for the Japan-Ukraine Drone Cluster (JUDC) at the Foreign Correspondents' Club of Japan (FCCJ) in Tokyo. This marks the company's latest step in expanding its international footprint following its entry into the European market.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: Jiin Ming]]></media:description>
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<item>
<title>Europe, UK, and US financial sectors respond differently as advanced AI reshapes industry and regulation</title>
<pubDate>Mon, 13 Jul 2026 01:56:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD205/europe-ecb-uk-usa-ai-cybersecurity.html</link>
<description>Advanced artificial intelligence (AI) is becoming a growing focus for financial regulators and technology companies across Europe, the UK, and the US, with authorities placing increasing attention on cybersecurity, consumer protection, and industry expansion.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<item>
<title>MediaTek revenue beat lifts second-quarter outlook as seasonal demand builds</title>
<pubDate>Mon, 13 Jul 2026 00:08:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD202/revenue-mediatek-2026-demand-growth.html</link>
<description>MediaTek reported June 2026 revenue of NT$58.012 billion (US$1.81 billion), up 22.30% month over month and 2.80% year over year, and said second-quarter revenue reached NT$152.183 billion. The Taiwan chip designer's result came in above the top end of its forecast, reinforcing expectations for seasonal growth in the second half of the year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>KYEC approves US$1.4 billion US plant to expand chip testing capacity</title>
<pubDate>Mon, 13 Jul 2026 00:06:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD201/king-yuan-testing-plant-investment-manufacturing.html</link>
<description>King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing. The semiconductor testing company said the project would be its largest overseas expansion and was aimed at addressing a growing US gap in backend packaging and testing capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Acer posts 13-year second-quarter revenue high on PC and diversified growth</title>
<pubDate>Mon, 13 Jul 2026 00:06:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD200/revenue-acer-pc-growth-business.html</link>
<description>Acer reported June consolidated revenue of NT$27.818 billion (US$864.8 million), up 6.3% from May, as the Taiwanese PC maker posted its strongest second-quarter revenue in 13 years. Second-quarter consolidated revenue reached NT$85.296 billion, rising 28.2% year on year, while first-half revenue climbed 23.3% to NT$157.727 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>India roundup: India's chip strategy tests its ability to build a competitive ecosystem</title>
<pubDate>Sun, 12 Jul 2026 23:54:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710VL215/india-roundup-semiconductors-electronics-funding-investment-plant.html</link>
<description>&lt;p class="P1" data-start="1054" data-end="1263" data-is-last-node="" data-is-only-node=""&gt;India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>SuperAlloy revenue climbs on recycled aluminum and semiconductor certification progress</title>
<pubDate>Sun, 12 Jul 2026 23:53:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD225/revenue-superalloy-aluminum-certification-2026.html</link>
<description>SuperAlloy Industrial posted June consolidated revenue of NT$749 million (US$23.36 million), up 17.93% from May and 21.46% from a year earlier. The Taiwan-based materials maker said the increase helped lift second-quarter 2026 revenue to NT$1.98 billion, a 15.45% rise from a year earlier, while first-half 2026 revenue reached NT$3.852 billion, up 6.02%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Sitronix sees zero-capacitance TDDI and automotive DDI drive growth</title>
<pubDate>Sun, 12 Jul 2026 23:52:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD251/sitronix-tddi-automotive-ddi-growth-revenue.html</link>
<description>Sitronix Technology said this week that zero-capacitance touch with display driver integration (TDDI) and automotive display drive IC (DDI) will drive its growth in 2026, as the chipmaker reported strong June and second-quarter revenue and said demand should remain positive into the second half of the year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<title>AI buildouts accelerate MLCC shortages; Taiwan firms eye 2H26 spillover orders</title>
<pubDate>Sun, 12 Jul 2026 23:52:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD250/ai-server-taiwan-revenue-mlcc-market.html</link>
<description>As AI server supply chains move into the component stocking phase, the market for high-end passive components has heated up sharply, with tight supply of multilayer ceramic capacitors (MLCCs) drawing close attention across the industry. Taiwan passive-component makers posted strong revenue in the second quarter of 2026, and with order backlogs at major MLCC suppliers in Japan and South Korea rising rapidly, Taiwan firms are expected to capture spillover orders from AI server applications in the second half of the year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<item>
<title>Trio revenue rises on AI server battery backup demand in June</title>
<pubDate>Sun, 12 Jul 2026 23:51:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD240/revenue-demand-2026-high-power-infrastructure.html</link>
<description>Trio Technology said June 2026 revenue rebounded on stronger stocking demand for battery backup units used in AI servers, even as the broader second quarter remained pressured by tight global memory supply. The Taiwan-based supplier also said downstream notebook and PC customers kept some inventory restocking demand in play, which pushed part of the consumer electronics shipment schedule into June.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Trio chairman Huo-li Lin. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Global defense boom unlocks new paths for automakers</title>
<pubDate>Sun, 12 Jul 2026 23:51:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD243/automakers-military-worldwide-certification-policy.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:371;100-470"&gt;The rise in global defense budgets has led to new opportunities for mainstream automakers as they seek to diversify their operations, yet the move into military and defense-related manufacturing presents another set of hurdles to overcome. These include lengthy certification cycles, highly fragmented specifications, and uncertainties surrounding policy continuity.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>SK Hynix hybrid bonding push signals next phase of HBM packaging race</title>
<pubDate>Sun, 12 Jul 2026 23:51:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710VL210/hbm-packaging-hbm4-bandwidth-equipment.html</link>
<description>SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging density, thermal control, and tighter integration with AI accelerators.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Hanwha Semitechˇ¦s SHB2 Nano hybrid bonder undergoes evaluation at an SK Hynix production line. Credit: Hanwha Semitech]]></media:description>
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<item>
<title>Largan ramps variable aperture lens in 3Q as smartphone demand rebounds</title>
<pubDate>Sun, 12 Jul 2026 23:50:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD245/largan-precision-demand-high-end-smartphone-revenue.html</link>
<description>Optical leader Largan Precision said on July 9 that customer demand for new smartphones is picking up in the second half, while Chairman En-Ping Lin highlighted that strong technology and yield remain the decisive edge in a tougher market. He also said the company's high-end variable aperture lens will ramp in the third quarter, and periscope lens upgrades are set for 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
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<title>AI shifts toward 'slow thinking' as agent era approaches, says Google DeepMind's VP of research</title>
<pubDate>Sun, 12 Jul 2026 23:50:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD229/google-deepmind-ai-agent-llm.html</link>
<description>Ed Chi, vice president of research at Google DeepMind, said AI's next milestone will be its evolution from the fast, pattern-recognition-oriented thinking associated with System 1 toward the deeper reasoning capabilities of System 2. As large language models evolve into large reasoning models, the industry is now entering a new era of AI agents.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs</title>
<pubDate>Sun, 12 Jul 2026 23:49:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD234/cpu-arm-infrastructure-demand-ceo.html</link>
<description>GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory (HBM), advanced packaging, and liquid-cooled server racks. As the industry races to expand computing capacity, GPUs have largely defined the conversation. That dynamic, however, may be beginning to change as CPUs diverge from the rims of AI narration, and increasingly emerge as a critical component of AI infrastructure.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>AI infrastructure demand lifts WPG, WT Microelectronics to record Q2 revenue</title>
<pubDate>Sun, 12 Jul 2026 23:49:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD238/wt-wpg-revenue-infrastructure-sales.html</link>
<description>&lt;p class=Image&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260710pd238_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Egis sells part of iCatch stake as ASMedia becomes largest shareholder</title>
<pubDate>Sun, 12 Jul 2026 23:49:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD241/asmedia-icatch-technology-ic-design-efficiency-market.html</link>
<description>Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was intended to improve capital efficiency and optimize its ownership structure, while Egis remained an important shareholder with about 12% of iCatch after the transaction.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Complex Micro Interconnection sees June sales rise as AI-led device demand lifts orders</title>
<pubDate>Sun, 12 Jul 2026 23:48:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD233/complex-micro-cmi-electronics-revenue-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:356;115-470"&gt;Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments increased, even as shortages in automotive components and notebook memory continued to affect customers. The company also reported second-quarter revenue of NT$597 million (US$18.55 million), up 3.6% from the prior quarter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>ChainSea Information Integration lifts first-half revenue to record on AI customer service demand</title>
<pubDate>Sun, 12 Jul 2026 23:48:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD222/revenue-digital-transformation-demand-government-2026.html</link>
<description>ChainSea Information Integration Information, a digital transformation integration services provider, reported consolidated revenue of NT$622 million (US$19.39 million) in the first half of 2026, up 11.28% year on year and a record for the period. The company said the increase reflected stronger demand from government outsourcing work and enterprise AI customer service applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI era accelerates Foxconn's shift to global 24-hour cybersecurity coverage</title>
<pubDate>Sun, 12 Jul 2026 23:48:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD231/foxconn-cybersecurity-security-asia-americas.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:270;122-391"&gt;Foxconn is using AI and coordinated security teams across Asia, Europe and the Americas to defend against cyberattacks as enterprises increasingly adopt AI. Chief Information Security Officer Wei-Bin Lee said that the company's global footprint makes it a prime target.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>AI's new gatekeepers: US and China tighten grip on frontier models</title>
<pubDate>Sun, 12 Jul 2026 23:47:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710VL212/anthropic-chips-data-openai-beijing.html</link>
<description>&lt;p class="P1" data-start="0" data-end="256"&gt;The world's most powerful AI models are encountering a new constraint beyond chips, data and engineering talent: governments increasingly want a say in when frontier systems are released, who may access them and which capabilities should remain restricted.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity</title>
<pubDate>Sun, 12 Jul 2026 23:46:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260709PD200/ma-tek-testing-revenue-cpo-demand.html</link>
<description>Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over year, marking a record high for four consecutive months. Second-quarter 2026 revenue reached NT$1.64 billion, a record high for a single quarter, while first-half 2026 revenue totaled NT$3.07 billion, an increase of 17.47% from the same period in 2025.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Western automakers tap defense manufacturing to absorb idle capacity as military spending surges</title>
<pubDate>Sun, 12 Jul 2026 23:46:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD219/automakers-capacity-military-manufacturing.html</link>
<description>Global automakers are accelerating their expansion into defense manufacturing as geopolitical tensions fuel record military spending and persistent challenges in the automotive sector leave production capacity underutilized. Industry leaders, including General Motors (GM), Volkswagen, Mercedes-Benz, Renault, and Ford, are leveraging their large-scale manufacturing expertise to tap growing demand for military vehicles, logistics platforms, and defense systems.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
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<title>Musk assembles Intel, SpaceX talent for Tesla wafer fab ambitions</title>
<pubDate>Sun, 12 Jul 2026 23:45:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD218/tesla-spacex-intel-talent-elon-musk.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:149;116-264"&gt;Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns into reality.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Tesla CEO Elon Musk. Credit: AFP]]></media:description>
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<title>Column: Steel industry shifts from capacity to performance</title>
<pubDate>Sun, 12 Jul 2026 23:45:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD211/infrastructure-capacity-performance-materials-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:456;118-573"&gt;As infrastructure upgrades, rail decarbonization, and the reshaping of critical materials supply chains accelerate, the steel industry is moving away from mass production and into a new competitive stage that combines high-performance materials, smart manufacturing, and low-carbon development. What once centered on capacity, cost, and supply is now defined by material performance, process precision, carbon management, and international certifications.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Infinitix signs Sarawak AI pact to expand Southeast Asia cloud services</title>
<pubDate>Sun, 12 Jul 2026 02:32:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD221/infrastructure-asia-government-software-gpu.html</link>
<description>Taiwan-based AI infrastructure software provider Infinitix signed a memorandum of understanding with Sarawak Information Systems Sdn. Bhd. (SAINS) to jointly promote AI infrastructure, GPU private cloud and AI cloud services in Malaysia and across Southeast Asia. The agreement was announced as both sides outlined plans to build a sovereign AI and AI Cloud ecosystem centered on a new computing model called a Token Factory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Coretronic's second quarter revenue topped NT$10 billion as display weakness persisted</title>
<pubDate>Sun, 12 Jul 2026 02:32:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD220/revenue-coretronic-shipments-electronics-monitor.html</link>
<description>Coretronic's latest sales update signals a mixed picture for the global electronics market, with demand improving in energy-saving products but lingering weakness in imaging. For international readers, the results highlight how tariffs, exchange-rate swings, and geopolitical risks continue to shape supply chains and customer demand across devices worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Column: Compute is no longer the AI bottleneck. Memory is &#38;mdash; and suppliers know it</title>
<pubDate>Sun, 12 Jul 2026 02:32:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD213/market-2026-capacity-demand-growth.html</link>
<description>After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked. This analysis examines the sustainability of the AI semiconductor boom, the outlook for memory and ASICs, and the geopolitical risks reshaping global supply chains.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Palo Alto Networks says AI agents are driving demand for identity security</title>
<pubDate>Sun, 12 Jul 2026 02:31:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260710PD204/palo-alto-networks-cybersecurity-security-expansion-software.html</link>
<description>AI agents are changing enterprise operations and raising new cybersecurity risks, with identity authentication emerging as a key concern for IT teams. According to Palo Alto Networks, 99% of companies are now using autonomous, conversational and generative AI tools, while machine identities in corporate networks have already outnumbered human employees.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure</title>
<pubDate>Sun, 12 Jul 2026 02:31:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260709PD217/expansion-language-data-center-photonics-demand.html</link>
<description>The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the next major battlegrounds in AI infrastructure.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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