DIGITIMES: News and Insight of the Global Supply Chain

South Korea's FIX 2026 to feature robots from HD Hyundai, Doosan

DIGITIMES — Mon, 19 Oct 2026 16:15:00 GMT

South Korea's Future Innovation Tech Expo (FIX 2026) will open in Daegu on October 21, with HD Hyundai Robotics and Doosan Robotics among the industrial robot makers exhibiting. The four-day show will also feature self-driving vehicles and technologies for manufacturing, logistics, and transportation.

IT panel market struggles to pass on costs: monitors hold flat, notebooks slide

Yunnie Cheng — Mon, 19 Oct 2026 16:03:00 GMT

Sluggish end-market recovery, cautious procurement by brand customers, and persistently high upstream material costs are frustrating panel makers' efforts to implement price hikes for IT panels. In October, quotes for mainstream LCD monitor panels held flat, while notebook panel prices continued a slight downward drift due to weak demand and slow inventory digestion.

OCP 2026 shifts AI competition from chips to rack-scale systems

Lily Hess — Mon, 19 Oct 2026 16:01:00 GMT

The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization is now expanding into system-level co-design for AI factories.

DeepSeek updates V4.1 Flash to improve AI agent performance

DIGITIMES — Mon, 19 Oct 2026 09:29:00 GMT

DeepSeek released an updated version of its V4.1 Flash artificial intelligence (AI) model on October 17, improving coding and reasoning performance while reducing task execution time and output length. The DeepSeek-V4.1-Flash-1017 update arrived five weeks after the previous version and was designed to make AI agents more efficient across software development and other task-based applications.

DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge

Levi Li — Mon, 19 Oct 2026 08:55:00 GMT

Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging strategies in AI chip development and advanced packaging.

Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips

DIGITIMES — Mon, 19 Oct 2026 08:55:00 GMT

Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing efforts are raising pressure on Samsung to improve application processor (AP) performance, manufacturing yields and cost competitiveness as it seeks to reduce its reliance on Qualcomm and MediaTek.

Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal

DIGITIMES — Mon, 19 Oct 2026 08:47:46 GMT

Anthropic is offering Blackstone a total return of more than 10% to help finance a US$60 billion artificial intelligence (AI) chip procurement package, as higher infrastructure financing costs make expanding computing capacity more expensive. The proposed arrangement, reportedly code-named Project North Star, would fund purchases of Google tensor processing units (TPUs) with a combined capacity of approximately 1.5 GW.

Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if

Rodney Chan — Mon, 19 Oct 2026 08:20:00 GMT

Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades earlier, as a graduate student, he was invited by Intel co-founder Andy Grove to join Intel, and turned him down.

Weblink International secures AvePoint agency rights to expand AI governance

DIGITIMES — Mon, 19 Oct 2026 07:54:09 GMT

Acer Inc. subsidiary Weblink International Inc. has secured agency rights for AvePoint in Taiwan and the Asia-Pacific region, expanding its enterprise solutions portfolio amid accelerating cloud and AI adoption and the growing importance of data governance and information security.

Action cameras gain momentum as camera demand fragments

Lily Hess — Mon, 19 Oct 2026 07:45:00 GMT

After two years of recovery, the digital camera market is slowing in 2026, with action cameras and handheld smart cameras taking over as the next growth engines. Optical industry observers say consumers no longer expect one camera to cover every scenario, instead choosing specialized devices for specific uses—a shift that has made action cameras the clearest winner.

Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power

DIGITIMES — Mon, 19 Oct 2026 07:43:43 GMT

Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic random-access memory (DRAM) shortage. His remarks suggest that China's expanding capacity could offer major technology buyers alternative sources of supply and potentially ease memory costs.

ACM Research bets on panel-level packaging and overseas growth as adoption risks persist

Jingyue Hsiao — Mon, 19 Oct 2026 07:38:00 GMT

ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in South Korea and Oregon. The company expects overseas operations to grow faster than its China revenue, although technology adoption, packaging-size standards, and US-China tensions could affect its plans.

Canon Taiwan sees strong global camera demand in 2026 and 2027

Lily Hess — Mon, 19 Oct 2026 07:33:11 GMT

Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate a new generation of photography enthusiasts. He also expressed optimism about 2027, as Canon and other brands prepare to launch more new models and capitalize on market momentum.

Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success

Kevin Wang — Mon, 19 Oct 2026 07:29:04 GMT

The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break through the 25nm physical limit. Among those who answered it was Chenming (Calvin) Hu, then a professor at UC Berkeley, who would go on to become TSMC's first chief technology officer in 2001.

From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years

Willis Ke — Mon, 19 Oct 2026 06:59:52 GMT

Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now, after three decades of boom-and-bust cycles, its leading manufacturers are seeking a new future beyond screens, leveraging their expertise in precision manufacturing to enter automotive electronics, advanced semiconductor packaging and AI-related technologies.

SiC powering the future: market scaling meets IDM synergies

DIGITIMES — Mon, 19 Oct 2026 06:59:00 GMT

The global silicon carbide (SiC) market stands at a critical juncture of industrial scaling, driven by rising demand across the automotive, AI data center, and renewable energy sectors.

Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models

Scarlett Yu — Mon, 19 Oct 2026 06:21:29 GMT

Toyota plans to transition its entire lineup of approximately 50 vehicle models to software-defined vehicles (SDVs) by 2030, equipping them with advanced software capabilities that allow owners to upgrade vehicle functions through over-the-air (OTA) updates after purchase.

China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition

DIGITIMES — Mon, 19 Oct 2026 06:20:00 GMT

The rapid advancement of energy-storage technologies in China is enabling the country to capture a formidable share of the global market, with the domestic industry continuing to post record levels of capacity growth.

Sanan Optoelectronics faces corp governance turmoil amid Micro LED breakthroughs

DIGITIMES — Mon, 19 Oct 2026 06:18:00 GMT

Sanan Optoelectronics Co., a leading player in China's compound semiconductor and LED chip industry, finds itself at a critical juncture, marked by severe corporate governance challenges at the shareholder level alongside major technological developments in next-generation display technologies.

Foxconn, Mitsubishi Electric form alliance in automotive equipment business

Eifeh Strom — Mon, 19 Oct 2026 06:13:41 GMT

Foxconn announced on October 16 that it has formed a strategic alliance with Mitsubishi Electric through its investment management subsidiary Lin Yin International Investment. The two companies will jointly operate an automotive equipment business and develop next-generation mobility solutions under a "Made in/by Japan" concept aimed at supporting the sustainable growth of Japan's automotive industry.

IBM and Siemens collaborate to advance nanostack chip architecture

DIGITIMES — Mon, 19 Oct 2026 06:01:56 GMT

IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance, energy efficiency, and artificial-intelligence computing worldwide, as the companies seek to address design, simulation, lithography, and production challenges beyond the 7-angstrom node.

Von Ardenne's flexible equipment targets unsettled panel-level packaging market

Jingyue Hsiao — Mon, 19 Oct 2026 05:55:00 GMT

German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions remains unresolved. Its tray-based systems can handle different substrate sizes without a new platform, potentially reducing equipment risk as manufacturers and customers worldwide weigh standards for advanced packaging and glass-based processes.

Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years

Scarlett Yu — Mon, 19 Oct 2026 04:42:23 GMT

Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor foundries.

Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027

DIGITIMES — Mon, 19 Oct 2026 04:25:45 GMT

Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese suppliers. The automaker also plans to produce the next-generation Corolla in China from 2028 using a common platform compatible with multiple powertrain systems.

China probes Huawei-JAC Maextro V800 over brake pedal failure

Yunnie Cheng — Mon, 19 Oct 2026 04:24:20 GMT

China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei and JAC Motors, has sparked widespread public debate over vehicle safety and testing standards after its V800 MPV suffered consecutive brake pedal bracket fractures during dynamic braking tests.

Anthropic opens Singapore office, signs AI cooperation agreement

DIGITIMES — Mon, 19 Oct 2026 04:19:47 GMT

Anthropic has opened its fifth Asia-Pacific office in Singapore and signed a memorandum of understanding with the city-state's digital ministry, broadening cooperation on AI safety, security, evaluation, and adoption. The move expands the company's presence in a market where Claude use is among the highest in the world, with implications for governance.

Taiwan launches first proof-of-concept project for green-power time shifting

Jingyue Hsiao — Mon, 19 Oct 2026 03:59:00 GMT

Taiwan has launched its first proof-of-concept project for shifting renewable electricity through energy storage, a move that could give companies worldwide a model for managing mismatches between green-power generation and consumption. The initiative may improve renewable-energy utilization, support corporate net-zero targets, and test how grid operators handle flexible electricity demand.

Terafab exposes Tesla's growing tensions with Samsung and TSMC

Jingyue Hsiao — Mon, 19 Oct 2026 03:50:00 GMT

Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates. Allegations by an engineer, which neither Tesla nor Samsung has confirmed, include pricing pressure, requests for sensitive information, and the recruitment of Samsung employees for Tesla's Terafab project.

Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027

Levi Li — Mon, 19 Oct 2026 03:27:00 GMT

Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor Manufacturing Optics (SMO), told DIGITIMES in an exclusive interview that demand for 2026 and 2027 is already clearly defined, with production capacity at Zeiss and some other manufacturers fully booked for the coming years.

SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits

Scarlett Yu — Mon, 19 Oct 2026 03:21:54 GMT

SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges for conventional semiconductor inspection technologies.

Shipments of high-end cloud AI accelerators, 2027

DIGITIMES — Mon, 19 Oct 2026 03:21:16 GMT

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.

Lens Technology enters AI server cooling market with US$25 million PMG takeover

DIGITIMES — Mon, 19 Oct 2026 03:19:51 GMT

China's precision manufacturing giant Lens Technology is expanding into AI server infrastructure through a proposed US$25 million acquisition of a controlling stake in PMG International, gaining access to server rack manufacturing and liquid-cooling technologies. The transaction marks a further diversification beyond the company's established consumer electronics and automotive components businesses.

Anthropic signs first Canada data center lease

DIGITIMES — Mon, 19 Oct 2026 03:11:59 GMT

Anthropic has signed its first data center lease in Canada, taking capacity at the Point Tupper data center campus planned by energy company EverWind Fuels in Nova Scotia. The facility will be built in two phases, with the first 95-megawatt phase scheduled to open by the end of 2027.

Taiwan plans 25 gas-fired units to secure power for 10 years

DIGITIMES — Mon, 19 Oct 2026 03:04:48 GMT

Taiwan's Ministry of Economic Affairs plans to add 25 gas-fired power units with a combined capacity of 26GW to meet rising electricity demand from the semiconductor industry and AI data centers, aiming to ensure adequate power supplies for at least the next 10 years.

iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise

Levi Li — Mon, 19 Oct 2026 02:58:12 GMT

Taiwan-based iBase Solution is expanding from industrial computers (IPCs) and energy storage into liquid-cooled prefabricated modular data centers, targeting AI infrastructure construction and engineering, procurement, and construction (EPC) contracts. The company aims to leverage its energy storage expertise, system integration capabilities, and customer relationships to capture opportunities in power, cooling, and data center development as global AI investment grows.