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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Cisco targets zero engineers writing code by end-October</title>
<pubDate>Fri, 4 Sep 2026 10:12:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL214/cisco-software-security-development-supply.html</link>
<description>AI is forcing companies to rethink not only how software is built but how quickly ageing systems must be replaced, with Cisco warning that increasingly capable frontier models are turning technical debt into a board-level cybersecurity concern.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>CPO testing shifts to mid-stage to avoid costly failures, Chroma says</title>
<pubDate>Fri, 4 Sep 2026 09:45:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL219/cpo-testing-optics-equipment-chipmakers.html</link>
<description>&lt;p class="P1" data-start="107" data-end="398"&gt;Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test times and the high cost of downstream failures raise the importance of screening optical engines before final package integration, according to Chroma ATE.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Jeff Lee, president of Chroma ATE's Photonics &#38; Precision business unit, discusses CPO testing challenges at SEMICON Taiwan 2026. Credit: Sherri Wang]]></media:description>
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<title>TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex</title>
<pubDate>Fri, 4 Sep 2026 09:19:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL218/tsmc-inspection-hbm-packaging-design.html</link>
<description>TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while raising concerns over radiation exposure to sensitive memory devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC's Zhihua Zou discusses advanced packaging inspection challenges at SEMICON Taiwan 2026.Credit: Sherri Wang]]></media:description>
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<title>Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives</title>
<pubDate>Fri, 4 Sep 2026 09:06:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD234/apple-vehicle-software-google-automotive-supply-chain.html</link>
<description>When Apple abandoned Project Titan, automotive supply chain insiders predicted the tech giant wouldn't bow out of the smart vehicle market entirely; it would simply approach the market from a different angle. Judging by its recent collaboration with Ford Motor, Apple is pivoting toward software-layer integration and vehicle systems, a move that may represent a preview of the playbook CEO John Ternus will execute.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026</title>
<pubDate>Fri, 4 Sep 2026 09:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD218/drone-semiconductors-government-semicon-taiwan-2026.html</link>
<description>Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026 side forum, defense and industry experts from Taiwan and the US called for stronger production capacity, standardized interfaces, testing infrastructure and predictable government procurement to turn Taiwan's supply chain strengths into a globally trusted base for unmanned systems.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Aerospace</category>
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<title>The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom</title>
<pubDate>Fri, 4 Sep 2026 08:35:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL226/quanta-copper-ai-semicon-taiwan-2026.html</link>
<description>A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future of artificial intelligence (AI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Jerry Chen]]></media:description>
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<item>
<title>How agentic AI and 'AI physics' are reshaping chip design</title>
<pubDate>Fri, 4 Sep 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL227/ai-agent-eda-design-hardware-software-nvidia.html</link>
<description>As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit a wall, a top Nvidia executive warned Tuesday.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Jerry Chen]]></media:description>
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<title>South Korea taps chip windfall for next tech push</title>
<pubDate>Fri, 4 Sep 2026 07:16:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL219/south-korea-technology-budget-infrastructure-2027.html</link>
<description>South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing platform, AI data centers, robotics and the power and water infrastructure needed to support them.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
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<title>Samsung turns to chips, OLED for next phase of Vietnam expansion</title>
<pubDate>Fri, 4 Sep 2026 07:03:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL220/samsung-vietnam-expansion-investment-manufacturing-testing.html</link>
<description>Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&#38;amp;D emerging as the next pillars of its presence in one of its largest global manufacturing bases.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>MSScorps August revenue hits new high on silicon photonics gains</title>
<pubDate>Fri, 4 Sep 2026 06:31:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD200/msscorps-siph-revenue-2026.html</link>
<description>MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies, high-performance computing (HPC), advanced packaging, and high-speed optical interconnects, further raising the importance of semiconductor analysis services.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[MSScorps chairman Chi-lun Liu. Credit: DIGITIMES]]></media:description>
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<item>
<title>Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp</title>
<pubDate>Fri, 4 Sep 2026 06:11:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD201/trusval-fab-revenue-semicon-taiwan-2026.html</link>
<description>Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations, materials constraints and rising costs abroad. Co-CEO Chu-chiao Kung said the company is turning years of high-spec project execution for leading advanced-process customers into global competitiveness.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology</title>
<pubDate>Fri, 4 Sep 2026 05:50:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL212/taiwan-2026-metrology-semiconductor-industry-wafer.html</link>
<description>TAIPEI, Taiwan &#38;mdash; The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM) stacks, and complex hybrid bonding, traditional inspection tools are going blind.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Jerry Chen]]></media:description>
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<item>
<title>G20 approves guidelines calling for more business-friendly AI regulation</title>
<pubDate>Fri, 4 Sep 2026 04:25:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL210/g20-regulation-ceo.html</link>
<description>Delegates to the G20 summit have agreed to support proposed guidelines for a light touch on AI regulation. The framework, proposed by the US, appeared to show a rare moment of consensus as countries race to gain a foothold in the booming AI industry, all while grappling with how to strike a balance between encouraging innovation and preventing harm.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027</title>
<pubDate>Fri, 4 Sep 2026 04:22:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD241/asic-revenue-gpu-2027-demand.html</link>
<description>Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow rapidly and catch up with GPU sales. CEO Shui-Ke Huang said GPU products remain the mainstream in the HPC chip market and the company's main revenue source, with US customers also serving as its largest clients.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Lite-On makes US$170 million strategic investment in DCX for AI cooling push</title>
<pubDate>Fri, 4 Sep 2026 04:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD243/lite-on-liquid-cooling-investment-data-center.html</link>
<description>Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately a 25% stake in DCX upon completion, with a total transaction value of roughly US$176 million.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<item>
<title>India tablet market grows as business demand shifts toward premium devices</title>
<pubDate>Fri, 4 Sep 2026 04:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PR202/india-tablet-business-growth-market.html</link>
<description>India's tablet market posted modest growth in the second quarter of 2026, a sign that enterprise demand and higher-spec devices are gaining importance for buyers worldwide. The shift toward detachable and productivity-focused tablets suggests vendors are adapting to rising costs, changing purchase patterns, and broader demand for more versatile computing options.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>K&#38;amp;S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap</title>
<pubDate>Fri, 4 Sep 2026 04:11:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD212/k--s-cpo-semiconductors-packaging-equipment-demand-shipments.html</link>
<description>Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&#38;amp;S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment and driving shipments to a record high, while the company continues to expand its advanced packaging business.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Kulicke and Soffa senior vice president of global sales &#38; global supply chain, Nelson Wong (centre). Credit: DIGITIMES]]></media:description>
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<item>
<title>China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development</title>
<pubDate>Fri, 4 Sep 2026 04:01:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD220/montage-cxl-development-samsung-sk-hynix.html</link>
<description>&lt;p class="P1" data-start="0" data-end="210"&gt;Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the Chinese interconnect chipmaker deeper in AI data center infrastructure.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Montage Technology]]></media:description>
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<item>
<title>Micron reportedly targets 2&#38;times; HBM capacity by end-2026; Samsung,  SK Hynix keep the scale edge</title>
<pubDate>Fri, 4 Sep 2026 03:58:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL206/micron-hbm-capacity-sk-hynix-samsung.html</link>
<description>Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Micron]]></media:description>
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<title>CPO high-density optical interconnects drive E&#38;amp;R's submicron 2D FAU breakthrough</title>
<pubDate>Fri, 4 Sep 2026 03:56:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD242/cpo-demand-laser-silicon-probe.html</link>
<description>To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures, raising the bar for hole positioning accuracy, micro-hole size, packing density, and process stability. At SEMICON Taiwan 2026, semiconductor equipment maker E&#38;amp;R Engineering unveiled a new ultra-high-precision laser micromachining platform with integrated high-precision motion control, laser drilling, and micromachining technologies.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan to expand AI compute capacity as supercomputer at research institute hits full load</title>
<pubDate>Fri, 4 Sep 2026 03:55:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD213/taiwan-capacity-supercomputer-infrastructure-investment.html</link>
<description>Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According to data provided by the National Science and Technology Council (NSTC), the government-backed mainframe Nano 5 is already fully loaded, while the National Institutes of Applied Research (NIAR) will launch three major investment projects.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Ennostar accelerates AI optical communications with micro LED</title>
<pubDate>Fri, 4 Sep 2026 03:52:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD219/ennostar-communications-taiwan-vcsel-commercial.html</link>
<description>Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai, associate vice president of the company's Advanced R&#38;amp;D Center, said micro LED's short-distance optical transmission advantages have already been proven, with mass production now the main hurdle.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Kyocera completes Nagasaki plant for semiconductor ceramics and packages</title>
<pubDate>Fri, 4 Sep 2026 03:51:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR203/kyocera-plant-growth-manufacturing-equipment.html</link>
<description>Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor its push into semiconductor-related products. Total investment will reach approximately JPY68 billion (US$424.70 million) by the end of March 2029, according to the company's announcement.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China's EUV gap may stretch 10&#38;ndash;15 years, but DUV gains test Western export controls</title>
<pubDate>Fri, 4 Sep 2026 03:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL217/euv-duv-equipment-technology-asml.html</link>
<description>China may remain 10&#38;ndash;15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological gap Beijing still faces in replicating the chipmaking equipment required for leading-edge AI processors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Fujitsu says useful quantum computers may need far fewer qubits than expected</title>
<pubDate>Fri, 4 Sep 2026 03:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL224/fujitsu-quantum-computing-finance-semicon-taiwan-taipei.html</link>
<description>For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told a Taipei audience that the number is coming down sharply, and that its own work is part of the reason.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903VL224/fujitsu-quantum-computing-finance-semicon-taiwan-taipei.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903vl224_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins</title>
<pubDate>Fri, 4 Sep 2026 03:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD236/packaging-testing-oht-kenmec-automation.html</link>
<description>Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with a smart-factory solution combining automated material handling systems (AMHS), overhead hoist transport (OHT), and AI-powered digital twins, allowing packaging and testing facilities to automate without extensive reconstruction.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD236/packaging-testing-oht-kenmec-automation.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd236_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications</title>
<pubDate>Fri, 4 Sep 2026 03:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD238/sic-taisic-substrate-kenmec-materials.html</link>
<description>Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications, including smart grids, rail transportation, and high-power electrical systems.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD238/sic-taisic-substrate-kenmec-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd238_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China Motor unit Greentrans launches Taiwan-made quadruped robots</title>
<pubDate>Fri, 4 Sep 2026 03:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD239/cmc-subsidiary-taiwan-automotive-2026.html</link>
<description>China Motor Corp. subsidiary Greentrans unveiled its next-generation quadruped robots, GT5X and GT3X, at SEMICON Taiwan 2026 amid growing demand for AI applications, smart semiconductor fabs and unmanned operations. The company said the two models are designed to build Taiwan's core robotics technologies and advance local production across the supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD239/cmc-subsidiary-taiwan-automotive-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd239_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains</title>
<pubDate>Fri, 4 Sep 2026 03:05:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD240/taiwan-autonomous-driving-soc-efficiency.html</link>
<description>As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip (SoC) design. DIGITIMES Intelligence analyst Jasper Jiang notes that neural processing units (NPUs), or dedicated AI accelerators, are becoming the core processing engines of next-generation automotive SoCs to satisfy three stringent demands of AI inference in autonomous driving: ultra-low latency, reduced system power consumption, and minimized memory bottlenecks.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903PD240/taiwan-autonomous-driving-soc-efficiency.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903pd240_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing</title>
<pubDate>Fri, 4 Sep 2026 03:00:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD216/xiaomi-europe-germany-vehicle-testing-sales-2027.html</link>
<description>Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements with eight major German dealership groups during IFA 2026 in Berlin, establishing an initial sales and service network ahead of its planned entry into Europe.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PD216/xiaomi-europe-germany-vehicle-testing-sales-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pd216_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Xiaomi]]></media:description>
</media:content></item>
<item>
<title>Processor, memory boom could push chip supply chain out of sync, says Yole</title>
<pubDate>Fri, 4 Sep 2026 02:56:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL223/yole-demand-capacity-investment-wafer.html</link>
<description>Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain "decoupling."</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903VL223/yole-demand-capacity-investment-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903vl223_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Processors and memory dominate semiconductor device revenue through 2027. Credit: Yole Group, Q2 2026.]]></media:description>
</media:content></item>
<item>
<title>Moonshot AI reportedly files for Hong Kong IPO, targets US$3B</title>
<pubDate>Fri, 4 Sep 2026 02:49:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL204/moonshot-startup-ipo-demand-technology.html</link>
<description>Chinese AI startup Moonshot AI has reportedly filed confidentially for an initial public offering in Hong Kong, potentially setting up one of the city's most closely watched technology listings and one of the largest Chinese AI IPOs in recent years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL204/moonshot-startup-ipo-demand-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl204_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground</title>
<pubDate>Fri, 4 Sep 2026 02:46:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL205/cxmt-samsung-hbm-dram-market.html</link>
<description>&lt;p class="P1" data-start="77" data-end="386"&gt;The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for both conventional memory and high-bandwidth memory (HBM), while Chinese supplier ChangXin Memory Technologies (CXMT) rapidly increased its presence.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL205/cxmt-samsung-hbm-dram-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl205_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Silicon Valley overflow fuels semiconductor boom in California's Capital Region</title>
<pubDate>Fri, 4 Sep 2026 02:38:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL228/california-industrial-silicon-valley-region-silicon.html</link>
<description>A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning it as a highly competitive gateway for global tech firms looking to scale beyond an overflowing Silicon Valley.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903VL228/california-industrial-silicon-valley-region-silicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903vl228_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Jerry Chen]]></media:description>
</media:content></item>
<item>
<title>Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds</title>
<pubDate>Fri, 4 Sep 2026 02:35:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD232/acer-e-paper-gaming-pc-industry-ifa.html</link>
<description>Acer used its next@acer global press conference at IFA 2026 in Berlin, Germany, to unveil non-PC products as part of its strategy to enhance resilience. At the event, the company introduced an e-paper display, a foldable screen, an e-scooter, and its latest gaming handheld, with chairman and CEO Jason Chen noting that Acer will continue making new products to wow consumers.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903PD232/acer-e-paper-gaming-pc-industry-ifa.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903pd232_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers</title>
<pubDate>Fri, 4 Sep 2026 02:27:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR204/sumitomo-chemical-inp-production-data-sales.html</link>
<description>Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers and high-speed networks. The move could help ease power and data bottlenecks facing AI infrastructure worldwide, as demand rises for faster, more efficient computing and communications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PR204/sumitomo-chemical-inp-production-data-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pr204_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Sumitomo Chemical]]></media:description>
</media:content></item>
<item>
<title>Silicon photonics testing shift could reshape how CPO suppliers win business</title>
<pubDate>Fri, 4 Sep 2026 02:12:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD209/cpo-siph-wafer-testing.html</link>
<description>As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage, protect yields, and preserve data through final assembly. That change is also pushing equipment makers toward team-based bids, with a single integrator likely to coordinate the system.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PD209/cpo-siph-wafer-testing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab</title>
<pubDate>Fri, 4 Sep 2026 01:57:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL222/expansion-design-packaging-taiwan.html</link>
<description>The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners to dismantle organizational silos or face crippling inefficiencies, top industry executives said at SEMICON Taiwan 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903VL222/expansion-design-packaging-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903vl222_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Jerry Chen]]></media:description>
</media:content></item>
<item>
<title>India's refurbished smartphone market gains as prices push buyers toward premium used devices</title>
<pubDate>Fri, 4 Sep 2026 01:51:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR205/refurbished-smartphone-market-2026.html</link>
<description>India's refurbished smartphone market is expanding as rising handset prices steer consumers toward lower-cost premium models. The trend extends well beyond India, showing how rising device costs, trade-in programs, and formal resale channels could reshape smartphone access, sustainability, and upgrade cycles for buyers in other major markets as well.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PR205/refurbished-smartphone-market-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pr205_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Acer bets on RTX, GoogleBook as on-site AI demand grows</title>
<pubDate>Fri, 4 Sep 2026 01:50:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD210/acer-rtx-demand-chairman-jason-chen.html</link>
<description>Acer chairman and chief executive Jason Chen said artificial intelligence deployment is already underway, with enterprise customers showing a clear preference for running AI on-site rather than in the cloud. He said that trend is opening new business opportunities for Acer in on-premises AI hardware, even as the broader PC market faces inventory and pricing pressure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PD210/acer-rtx-demand-chairman-jason-chen.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pd210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>LB Semicon starts Qualcomm shipments as DDI dependence fades</title>
<pubDate>Fri, 4 Sep 2026 01:47:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PD204/semicon-qualcomm-shipments-ddi-osat.html?chid=10</link>
<description>South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI) and expand into system and power semiconductors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PD204/semicon-qualcomm-shipments-ddi-osat.html?chid=10</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in</title>
<pubDate>Fri, 4 Sep 2026 01:42:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL203/kioxia-dram-ymtc-micron-flash.html</link>
<description>Kioxia's plan to push NAND flash into work that DRAM currently does is less a product launch than an answer to a structural problem. Alone among the leading memory makers, it does not produce DRAM, and in the one market where it does compete, it is being squeezed from both above and below &#38;mdash; by a resurgent Micron and by China's Yangtze Memory Technologies (YMTC), which has closed much of the gap in a single year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL203/kioxia-dram-ymtc-micron-flash.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl203_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nvidia sets an October launch for RTX Spark PCs, gives local AI a router</title>
<pubDate>Fri, 4 Sep 2026 01:33:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR200/nvidia-rtx-launch-ifa-windows.html</link>
<description>Nvidia used IFA 2026 to argue that serious AI work can run locally as well as in the cloud, pairing an October launch date for its RTX Spark Windows PCs with free software that distributes independent inference requests across compatible machines already on a local network.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PR200/nvidia-rtx-launch-ifa-windows.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pr200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>OpenAI says Astra crosses critical cybersecurity threshold, adding tighter safeguards</title>
<pubDate>Fri, 4 Sep 2026 01:29:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR201/openai-cybersecurity-testing-development.html</link>
<description>OpenAI said its Astra model has reached a critical level of cybersecurity capability, warning that advanced tools could help users find and exploit unknown flaws in hardened systems. The designation signals stronger safeguards before release, and it matters globally because such capabilities could reshape both cyber defense and cybercrime across markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PR201/openai-cybersecurity-testing-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pr201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: OpenAI]]></media:description>
</media:content></item>
<item>
<title>Adobe names Anil Chakravarthy as next chief executive</title>
<pubDate>Fri, 4 Sep 2026 01:24:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904PR202/adobe-software-worldwide-business-president.html</link>
<description>Adobe's leadership change signals a broader shift in how major software companies are positioning themselves for an AI-driven market. The move may affect customers, partners, and investors worldwide as the company deepens its focus on agentic software, customer experience tools, and productivity products.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904PR202/adobe-software-worldwide-business-president.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904pr202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Analysts read Nvidia's Hugging Face deal as a hedge, not a software bet</title>
<pubDate>Fri, 4 Sep 2026 01:22:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL201/nvidia-software-business-chips-bloomberg.html</link>
<description>Nvidia's agreement to buy Hugging Face for roughly US$13 billion is being framed by analysts less as a move into software than as insurance against three ways its core business could deteriorate: cheaper open-weight models eroding the frontier labs that buy its chips, those same labs diversifying their silicon, and enterprises pulling workloads out of hyperscaler bundles. On each of those paths, owning the industry's main model repository pays off.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL201/nvidia-software-business-chips-bloomberg.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff</title>
<pubDate>Fri, 4 Sep 2026 00:14:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL202/nvidia-intel-market-technology.html</link>
<description>The mechanics of Nvidia's US$12.93 billion purchase of Hugging Face say as much about the deal's purpose as the strategic case does: a tenth of the consideration is set aside to stop the team from walking, part of the payout goes to Intel and AMD, and the whole transaction is framed against an open-weight model market in which the fastest-moving suppliers are Chinese.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL202/nvidia-intel-market-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl202_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal</title>
<pubDate>Fri, 4 Sep 2026 00:06:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260904VL200/nvidia-silicon.html</link>
<description>Nvidia's agreement to acquire Hugging Face for US$12.93 billion pushes the world's dominant AI chip supplier past silicon and into the layer where developers actually pick their models &#38;mdash; a position that gives it early sight of demand shifts, a structural hedge against customers designing their own accelerators, and a neutrality problem it has already had to answer for in writing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260904VL200/nvidia-silicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260904vl200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>D-Wave, quantum computing's oldest company, is now building a second kind of machine</title>
<pubDate>Fri, 4 Sep 2026 00:01:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL225/quantum-computer-business-taipei-taiwan-semicon-taiwan.html</link>
<description>D-Wave has spent 26 years building one type of quantum computer. This week it told a Taipei audience why it started building another.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260903VL225/quantum-computer-business-taipei-taiwan-semicon-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260903vl225_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>K-Safety Expo 2026: South Korea's safety AI moves from watching danger to acting on it</title>
<pubDate>Fri, 4 Sep 2026 00:00:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL201/expo-2026-industrial-logistics.html</link>
<description>At first glance, many of the technologies spread across the K-Safety Expo 2026 show floor in Busan looked familiar: CCTV cameras, industrial sensors, warning lights and control panels. But after moving from booth to booth on September 2, a more consequential shift became clear. South Korea's emerging safety systems are increasingly being built not simply to record what went wrong, but to recognize risk early enough to intervene.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>K-Safety Expo 2026: Inside Korea's push to make safety smarter, faster, more predictive</title>
<pubDate>Thu, 3 Sep 2026 23:59:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL200/expo-2026-technology-government.html</link>
<description>K-Safety Expo 2026 opened at BEXCO Exhibition Center 1 in Busan on September 2. An hour-long opening ceremony beginning at 11 a.m. brought together South Korean government officials, international organization representatives and industry participants to mark the start of the three-day safety-industry exhibition. The 12th edition is jointly hosted by the Ministry of the Interior and Safety and Busan Metropolitan City.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>India PC shipments rise as channel buying lifts second quarter sales</title>
<pubDate>Thu, 3 Sep 2026 23:59:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PR201/india-pc-demand-market-shipments-2026.html</link>
<description>India's PC market grew steadily in the second quarter of 2026, but the gain appears to reflect stocking by retailers, businesses, and distributors as much as end-user demand. The trend signals how supply pressures and pricing changes can reshape device markets far beyond India.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China's GPU makers found scale as profit came from elsewhere</title>
<pubDate>Thu, 3 Sep 2026 23:58:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903VL209/gpu-profit-revenue-earnings-2026.html</link>
<description>China's domestic GPU industry crossed a commercial threshold in the first half of 2026, but the interim filings of its six listed players show that revenue growth and earnings power have not yet converged. Three of the six reported positive attributable net profit. Only one of those earned it primarily by selling chips. For an industry whose customers are now committing capital on multi-year horizons, that distinction matters more than the headline growth rates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's tech council allocates NT$3.76 billion for quantum host</title>
<pubDate>Thu, 3 Sep 2026 23:57:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD218/taiwan-nstc-quantum-computing-technology-2027.html</link>
<description>Taiwan's National Science and Technology Council (NSTC) has budgeted NT$3.76 billion (US$116.58 million) for a quantum computer system project, while the Industrial Technology Research Institute (ITRI) will spend NT$14.6 billion with support from the Ministry of Economic Affairs (MOEA) on a 2027 technology program that includes building a key quantum computing technology verification platform.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<title>ESA backs European rocket startups to diversify launch supply</title>
<pubDate>Thu, 3 Sep 2026 23:56:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD210/launch-germany-pld-funding-rocket.html</link>
<description>The European Space Agency (ESA) announced on August 27 that it had signed the first contracts under its European Launcher Challenge, signing agreements with European space startups Rocket Factory Augsburg, Isar Aerospace, and PLD Space.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Acer wowed IFA with AI, gaming hardware</title>
<pubDate>Thu, 3 Sep 2026 23:55:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD208/acer-ifa-gaming-2026-brand.html</link>
<description>As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future growth drivers are PCs, smart healthcare, smart living, and sustainability. He said the roadmap underscores Acer's stature as an international brand and its continued ambition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China speed hits brakes as regulators tighten safety rules</title>
<pubDate>Thu, 3 Sep 2026 23:55:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD207/auto-industry-market-development-automakers-miit.html</link>
<description>The global auto industry is being jolted by "China speed," as Chinese regulators move to slow an extreme race to launch vehicles that has crossed quality and safety red lines. The Ministry of Industry and Information Technology (MIIT) and other watchdogs have launched special enforcement actions and tightened rules to prevent carmakers from sacrificing safety in the rush for speed.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>ENE Technology eyes 4Q26 drone scale-up with satellite link</title>
<pubDate>Thu, 3 Sep 2026 23:54:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD206/taiwan-technology-market-2026-manufacturing.html</link>
<description>Microcontroller maker ENE Technology is pushing into the drone market by integrating resources from other group companies and selling complete drone systems. The company expects volume shipments in the fourth quarter of 2026 and is currently focusing on commercial and industrial markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Taiwan to expand industrial land for AI hardware boom</title>
<pubDate>Thu, 3 Sep 2026 23:54:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD205/taiwan-industrial-government-hardware-demand.html</link>
<description>Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027. Premier Jung-tai Cho said the government is already seeing strong demand from companies looking to build more plants in Taiwan, including semiconductor, packaging and testing, memory, substrate, and equipment makers, as well as foreign investors such as Nvidia and Micron Technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nanya, ESMT hit record August revenue on higher contract prices</title>
<pubDate>Thu, 3 Sep 2026 23:54:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD204/revenue-esmt-2026-nanya-technology-growth.html</link>
<description>Memory chip makers continue to post sequential revenue gains, with Nanya Technology and Elite Semiconductor Microelectronics Technology (ESMT) both reporting record consolidated revenue for August 2026. Nanya's revenue rose 1.88% month-over-month, while ESMT's climbed 16.51%, as higher contract prices in the third quarter drove strong revenue growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Young Liu urges 'Made with Taiwan' supply chain rethink</title>
<pubDate>Thu, 3 Sep 2026 23:54:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD203/taiwan-supply-chain-foxconn-young-liu-chairman.html</link>
<description>&lt;p class="P1" data-start="3056" data-end="3510"&gt;Foxconn chairman Young Liu on September 2 called on Taiwan's supply chain to shift from "Made in Taiwan" to "Made with Taiwan," saying the island should become a partner that exports technology and know-how across the global industrial chain. He made the remarks at the closing fireside chat of the SEMICON Taiwan 2026 Masters Forum, alongside MediaTek CEO Rick Tsai, Advanced Semiconductor Engineering (ASE) CEO Tien Wu, and Xinxing chairman C.C. Hsien.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Acer unveils IFA lineup with AI, slim notebooks, sustainability</title>
<pubDate>Thu, 3 Sep 2026 23:53:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD202/acer-ifa-rtx-3d-berlin.html</link>
<description>Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks, e-paper, handheld gaming devices, electric scooters, and the Acer SFF RTX Spark desktop design powered by the NVIDIA RTX Spark superchip.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AUO speeds up asset sales as Singapore plant nears WD deal</title>
<pubDate>Thu, 3 Sep 2026 23:53:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD201/auo-plant-western-digital-2026.html?chid=10</link>
<description>AUO is accelerating its asset-light strategy, and its Singapore plant sale now appears headed to Western Digital's Singapore unit. On September 2, the company announced plans to sell the site to Western Digital Singapore for S$350 million (US$275.4 million) before tax, or about NT$8.753 billion, with the resulting disposal gain to be confirmed after the buyer secures the required local regulatory approvals.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Southeast Asia</category>
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<title>Electroninks, Merck, Qualipoly build advanced packaging ecosystem</title>
<pubDate>Thu, 3 Sep 2026 23:53:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260903PD200/packaging-merck-materials-development-partnership.html</link>
<description>Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly Chemical to offer advanced packaging customers a more complete, faster, and more efficient integrated service.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>CHPT spans wafer to system-level testing</title>
<pubDate>Thu, 3 Sep 2026 09:35:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD245/testing-chpt-test-interface-chips-probe.html</link>
<description>Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory probe cards, high-pin-count probe cards, and a high-power burn-in board for AI ASICs.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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