DIGITIMES: News and Insight of the Global Supply Chain

DeepSeek updates V4.1 Flash to improve AI agent performance

DIGITIMES — Mon, 19 Oct 2026 09:29:00 GMT

DeepSeek released an updated version of its V4.1 Flash artificial intelligence (AI) model on October 17, improving coding and reasoning performance while reducing task execution time and output length. The DeepSeek-V4.1-Flash-1017 update arrived five weeks after the previous version and was designed to make AI agents more efficient across software development and other task-based applications.

Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips

DIGITIMES — Mon, 19 Oct 2026 08:55:00 GMT

Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing efforts are raising pressure on Samsung to improve application processor (AP) performance, manufacturing yields and cost competitiveness as it seeks to reduce its reliance on Qualcomm and MediaTek.

DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge

Levi Li — Mon, 19 Oct 2026 08:55:00 GMT

Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging strategies in AI chip development and advanced packaging.

Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal

DIGITIMES — Mon, 19 Oct 2026 08:47:46 GMT

Anthropic is offering Blackstone a total return of more than 10% to help finance a US$60 billion artificial intelligence (AI) chip procurement package, as higher infrastructure financing costs make expanding computing capacity more expensive. The proposed arrangement, reportedly code-named Project North Star, would fund purchases of Google tensor processing units (TPUs) with a combined capacity of approximately 1.5 GW.

Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if

Rodney Chan — Mon, 19 Oct 2026 08:20:00 GMT

Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades earlier, as a graduate student, he was invited by Intel co-founder Andy Grove to join Intel, and turned him down.

Weblink International secures AvePoint agency rights to expand AI governance

DIGITIMES — Mon, 19 Oct 2026 07:54:09 GMT

Acer Inc. subsidiary Weblink International Inc. has secured agency rights for AvePoint in Taiwan and the Asia-Pacific region, expanding its enterprise solutions portfolio amid accelerating cloud and AI adoption and the growing importance of data governance and information security.

Action cameras gain momentum as camera demand fragments

Lily Hess — Mon, 19 Oct 2026 07:45:00 GMT

After two years of recovery, the digital camera market is slowing in 2026, with action cameras and handheld smart cameras taking over as the next growth engines. Optical industry observers say consumers no longer expect one camera to cover every scenario, instead choosing specialized devices for specific uses—a shift that has made action cameras the clearest winner.

Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power

DIGITIMES — Mon, 19 Oct 2026 07:43:43 GMT

Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic random-access memory (DRAM) shortage. His remarks suggest that China's expanding capacity could offer major technology buyers alternative sources of supply and potentially ease memory costs.

ACM Research bets on panel-level packaging and overseas growth as adoption risks persist

Jingyue Hsiao — Mon, 19 Oct 2026 07:38:00 GMT

ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in South Korea and Oregon. The company expects overseas operations to grow faster than its China revenue, although technology adoption, packaging-size standards, and US-China tensions could affect its plans.

Canon Taiwan sees strong global camera demand in 2026 and 2027

Lily Hess — Mon, 19 Oct 2026 07:33:11 GMT

Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate a new generation of photography enthusiasts. He also expressed optimism about 2027, as Canon and other brands prepare to launch more new models and capitalize on market momentum.

Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success

Kevin Wang — Mon, 19 Oct 2026 07:29:04 GMT

The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break through the 25nm physical limit. Among those who answered it was Chenming (Calvin) Hu, then a professor at UC Berkeley, who would go on to become TSMC's first chief technology officer in 2001.

From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years

Willis Ke — Mon, 19 Oct 2026 06:59:52 GMT

Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now, after three decades of boom-and-bust cycles, its leading manufacturers are seeking a new future beyond screens, leveraging their expertise in precision manufacturing to enter automotive electronics, advanced semiconductor packaging and AI-related technologies.

SiC powering the future: market scaling meets IDM synergies

DIGITIMES — Mon, 19 Oct 2026 06:59:00 GMT

The global silicon carbide (SiC) market stands at a critical juncture of industrial scaling, driven by rising demand across the automotive, AI data center, and renewable energy sectors.

Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models

Scarlett Yu — Mon, 19 Oct 2026 06:21:29 GMT

Toyota plans to transition its entire lineup of approximately 50 vehicle models to software-defined vehicles (SDVs) by 2030, equipping them with advanced software capabilities that allow owners to upgrade vehicle functions through over-the-air (OTA) updates after purchase.

China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition

DIGITIMES — Mon, 19 Oct 2026 06:20:00 GMT

The rapid advancement of energy-storage technologies in China is enabling the country to capture a formidable share of the global market, with the domestic industry continuing to post record levels of capacity growth.

Sanan Optoelectronics faces corp governance turmoil amid Micro LED breakthroughs

DIGITIMES — Mon, 19 Oct 2026 06:18:00 GMT

Sanan Optoelectronics Co., a leading player in China's compound semiconductor and LED chip industry, finds itself at a critical juncture, marked by severe corporate governance challenges at the shareholder level alongside major technological developments in next-generation display technologies.

Foxconn, Mitsubishi Electric form alliance in automotive equipment business

Eifeh Strom — Mon, 19 Oct 2026 06:13:41 GMT

Foxconn announced on October 16 that it has formed a strategic alliance with Mitsubishi Electric through its investment management subsidiary Lin Yin International Investment. The two companies will jointly operate an automotive equipment business and develop next-generation mobility solutions under a "Made in/by Japan" concept aimed at supporting the sustainable growth of Japan's automotive industry.

IBM and Siemens collaborate to advance nanostack chip architecture

DIGITIMES — Mon, 19 Oct 2026 06:01:56 GMT

IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance, energy efficiency, and artificial-intelligence computing worldwide, as the companies seek to address design, simulation, lithography, and production challenges beyond the 7-angstrom node.

Von Ardenne's flexible equipment targets unsettled panel-level packaging market

Jingyue Hsiao — Mon, 19 Oct 2026 05:55:00 GMT

German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions remains unresolved. Its tray-based systems can handle different substrate sizes without a new platform, potentially reducing equipment risk as manufacturers and customers worldwide weigh standards for advanced packaging and glass-based processes.

Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years

Scarlett Yu — Mon, 19 Oct 2026 04:42:23 GMT

Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor foundries.

Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027

DIGITIMES — Mon, 19 Oct 2026 04:25:45 GMT

Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese suppliers. The automaker also plans to produce the next-generation Corolla in China from 2028 using a common platform compatible with multiple powertrain systems.

China probes Huawei-JAC Maextro V800 over brake pedal failure

Yunnie Cheng — Mon, 19 Oct 2026 04:24:20 GMT

China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei and JAC Motors, has sparked widespread public debate over vehicle safety and testing standards after its V800 MPV suffered consecutive brake pedal bracket fractures during dynamic braking tests.

Anthropic opens Singapore office, signs AI cooperation agreement

DIGITIMES — Mon, 19 Oct 2026 04:19:47 GMT

Anthropic has opened its fifth Asia-Pacific office in Singapore and signed a memorandum of understanding with the city-state's digital ministry, broadening cooperation on AI safety, security, evaluation, and adoption. The move expands the company's presence in a market where Claude use is among the highest in the world, with implications for governance.

Taiwan launches first proof-of-concept project for green-power time shifting

Jingyue Hsiao — Mon, 19 Oct 2026 03:59:00 GMT

Taiwan has launched its first proof-of-concept project for shifting renewable electricity through energy storage, a move that could give companies worldwide a model for managing mismatches between green-power generation and consumption. The initiative may improve renewable-energy utilization, support corporate net-zero targets, and test how grid operators handle flexible electricity demand.

Terafab exposes Tesla's growing tensions with Samsung and TSMC

Jingyue Hsiao — Mon, 19 Oct 2026 03:50:00 GMT

Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates. Allegations by an engineer, which neither Tesla nor Samsung has confirmed, include pricing pressure, requests for sensitive information, and the recruitment of Samsung employees for Tesla's Terafab project.

Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027

Levi Li — Mon, 19 Oct 2026 03:27:00 GMT

Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor Manufacturing Optics (SMO), told DIGITIMES in an exclusive interview that demand for 2026 and 2027 is already clearly defined, with production capacity at Zeiss and some other manufacturers fully booked for the coming years.

SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits

Scarlett Yu — Mon, 19 Oct 2026 03:21:54 GMT

SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges for conventional semiconductor inspection technologies.

Shipments of high-end cloud AI accelerators, 2027

DIGITIMES — Mon, 19 Oct 2026 03:21:16 GMT

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.

Lens Technology enters AI server cooling market with US$25 million PMG takeover

DIGITIMES — Mon, 19 Oct 2026 03:19:51 GMT

China's precision manufacturing giant Lens Technology is expanding into AI server infrastructure through a proposed US$25 million acquisition of a controlling stake in PMG International, gaining access to server rack manufacturing and liquid-cooling technologies. The transaction marks a further diversification beyond the company's established consumer electronics and automotive components businesses.

Anthropic signs first Canada data center lease

DIGITIMES — Mon, 19 Oct 2026 03:11:59 GMT

Anthropic has signed its first data center lease in Canada, taking capacity at the Point Tupper data center campus planned by energy company EverWind Fuels in Nova Scotia. The facility will be built in two phases, with the first 95-megawatt phase scheduled to open by the end of 2027.

Taiwan plans 25 gas-fired units to secure power for 10 years

DIGITIMES — Mon, 19 Oct 2026 03:04:48 GMT

Taiwan's Ministry of Economic Affairs plans to add 25 gas-fired power units with a combined capacity of 26GW to meet rising electricity demand from the semiconductor industry and AI data centers, aiming to ensure adequate power supplies for at least the next 10 years.

iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise

Levi Li — Mon, 19 Oct 2026 02:58:12 GMT

Taiwan-based iBase Solution is expanding from industrial computers (IPCs) and energy storage into liquid-cooled prefabricated modular data centers, targeting AI infrastructure construction and engineering, procurement, and construction (EPC) contracts. The company aims to leverage its energy storage expertise, system integration capabilities, and customer relationships to capture opportunities in power, cooling, and data center development as global AI investment grows.

Memory giants lock in up to 70% of capacity under long-term deals as AI demand reshapes industry cycles

Scarlett Yu — Mon, 19 Oct 2026 02:53:44 GMT

AI-driven memory demand is growing exponentially, pushing the industry into a structural supply shortage. As supply tightens and contract prices surge in 2026, major AI companies and cloud service providers (CSPs) are increasingly signing long-term agreements (LTAs) lasting three to five years with memory manufacturers to secure supply and manage soaring costs.

AUO, Largan Micro LED debate highlights optical communications uncertainty

Jingyue Hsiao — Mon, 19 Oct 2026 02:50:00 GMT

AUO chairman Paul Peng said Micro LED remains a potential option for optical communications, despite Largan Technology's doubts about pairing it with multimode fiber in co-packaged optics. The comments underscore an unsettled market, where rising AI data-center bandwidth needs are driving competing approaches, while customers continue testing technologies before adoption.

DIGITIMES Insights: SpaceX moves closer to independent mobile network as Starlink expands spectrum holdings beyond satellites

Scarlett Yu — Mon, 19 Oct 2026 02:43:37 GMT

SpaceX announced on October 8, 2026, that it would acquire US 800MHz low-band spectrum licenses held by Grain Management, covering up to 14MHz of paired bandwidth. The transaction remains subject to approval by the Federal Communications Commission (FCC).

China proposes tighter export controls on AI and solar technologies

DIGITIMES — Mon, 19 Oct 2026 02:41:08 GMT

China is moving to tighten oversight of technology transfers that support its companies' overseas expansion, proposing export bans and licensing requirements for artificial intelligence (AI), biomedicine, and solar manufacturing, and requiring exporters to register covered transactions immediately.

CXMT eyes nearly US$20 billion profit as AI-driven DRAM shortages fuel earnings turnaround

DIGITIMES — Mon, 19 Oct 2026 02:38:54 GMT

China's leading DRAM manufacturer, ChangXin Memory Technologies (CXMT), expects to report net profit of CNY131 billion to CNY132.5 billion (≈ US$19.58 billion to US$19.8 billion) for the first nine months of 2026, reversing a year-earlier loss as surging AI computing demand fuels memory chip shortages and higher prices.

Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup

Levi Li — Mon, 19 Oct 2026 02:35:00 GMT

South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027. The company also introduced five 2.5D packaging systems designed to accommodate increasingly large AI chip packages.

AUO expands AI businesses as it seeks its next growth curve

Jingyue Hsiao — Mon, 19 Oct 2026 02:30:37 GMT

AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor packaging. The display maker has secured board approval for NT$24 billion (US$739.92 million) in planned investment for 2026, as chairman and CEO Paul Peng positions the initiatives as a route to growth and supply-chain relevance.

TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D

Levi Li — Mon, 19 Oct 2026 02:25:00 GMT

South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development and strengthen its advanced process and packaging capabilities through its Taiwan R&D center. Memory controller projects remain its primary revenue source, supporting its expansion into AI chip mass production and overseas markets.

TECO shifts toward integrated solutions as AI drives demand for power, infrastructure

Jingyue Hsiao — Mon, 19 Oct 2026 02:24:57 GMT

TECO Electric & Machinery is shifting from a motor-focused manufacturer to a platform-based provider of integrated power, energy, drive-system, and AI infrastructure solutions, as chairman Morris Li says artificial intelligence is accelerating demand for autonomous power, microgrids, virtual power plants, and faster data center construction worldwide.

Nvidia backs OpenClaw, putting robotics potential, agent security in focus

Jingyue Hsiao — Mon, 19 Oct 2026 02:22:41 GMT

OpenClaw is drawing renewed attention after Nvidia CEO Jensen Huang endorsed the open-source AI agent framework as a foundation for future technology, especially robotics. His remarks also highlighted the security challenges of autonomous systems, including behavioral drift, and Nvidia's efforts to contain agents through sandboxing, permissions, monitoring, and hardware-based controls.

Malaysia unveils six locally designed chips, but commercial adoption is the real test

DIGITIMES — Mon, 19 Oct 2026 02:14:39 GMT

Malaysia's push to move from assembling chips to owning the designs behind them has reached the point where it must find buyers. On October 16, the government unveiled six semiconductor innovations developed by local companies, putting their combined sales potential at MYR300 million (approximately US$73.5 million), while Economy Minister Akmal Nasrullah Mohd Nasir said winning customers and passing industry qualification were still ahead.

Micron develops robot memory as Samsung, SK Hynix target physical AI

DIGITIMES — Mon, 19 Oct 2026 02:10:05 GMT

Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating within battery power limits. The companies are pursuing both memory designs and storage products for robots and autonomous vehicles.

Infineon extends Wolfspeed wafer deal to 8-inch silicon carbide

DIGITIMES — Mon, 19 Oct 2026 02:08:25 GMT

Infineon Technologies has lined up 8-inch silicon carbide (SiC) wafers from Wolfspeed under an expanded and extended long-term supply agreement. The deal gives the German chipmaker another source of the larger substrates it needs to convert its SiC fabs. It gives the US materials supplier a commitment from a top-tier customer about a year after its financial restructuring.

US defense startups turn to Taiwan for local production partnerships

DIGITIMES — Mon, 19 Oct 2026 02:04:35 GMT

US defense companies are increasingly setting up partnerships in Taiwan, moving beyond component procurement to joint development, system integration, local manufacturing, maintenance support, and joint production for the US and its allies. The shift is strengthening Taiwan's role in the defense supply chain while helping local companies build military manufacturing and sustainment capabilities.

Hyundai creates RX team to accelerate Atlas humanoid robot production

DIGITIMES — Mon, 19 Oct 2026 01:59:00 GMT

Hyundai Motor Group is accelerating plans to mass-produce and sell its Atlas humanoid robot while establishing an RX Business Strategy Team to oversee its global robotics strategy under the banner "Robotics Everything." The move signals a restructuring aimed at putting the group's robotics business on a more systematic growth path.

Memory squeeze leaves Brightek short on chips; Chinese automakers line up for Nantong plant

Levi Li — Mon, 19 Oct 2026 01:56:24 GMT

LED packaging manufacturer Brightek Optoelectronic expects its automotive revenue share to exceed 60%, up from around 50%, following the opening of its Nantong plant and higher shipments. Its third-quarter 2026 gross margin is projected to recover to 30%, although tight mature-node logic IC supplies, constrained by foundries prioritising higher-margin memory products, have complicated its efforts to meet growing automotive orders.

EU eyes AI defense as it tests China's open-weight models

DIGITIMES — Mon, 19 Oct 2026 01:50:22 GMT

The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing Chinese open-weight AI models to assess the capabilities and limitations of different technologies.

Beyond displays: AUO eyes co-packaged optics, glass core substrates for AI-era growth

Jingyue Hsiao — Mon, 19 Oct 2026 01:48:39 GMT

AUO is positioning its growth around artificial intelligence, diversification, and cooperation across the group as the display technology company marks its 30th anniversary. Chairman and CEO Paul Peng said the company will build on three established businesses while seeking fourth and fifth growth pillars through technologies and partnerships.

Chenming Hu urges universities to 'find the solutions', targets world-class Taiwan semiconductor sector

DIGITIMES — Mon, 19 Oct 2026 01:46:02 GMT

Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman Morris Chang. Hu, who has worked in both academia and industry, said universities' ability to conduct thorough testing could help the semiconductor industry overcome technological bottlenecks.

AI data-center expansion shifts focus to time-to-power

Jingyue Hsiao — Mon, 19 Oct 2026 01:44:46 GMT

Artificial intelligence data-center expansion is intensifying a global race for electricity, as cloud providers increasingly prioritize how quickly power can be secured over cost and decarbonization. As grids struggle to keep pace with computing growth, companies are considering on-site generation, batteries, and direct-current systems to speed deployment while managing emissions and efficiency.

AI memory demand lifts Samsung, SK Hynix 2027 outlook

DIGITIMES — Mon, 19 Oct 2026 01:37:20 GMT

AI data center investment continues to expand, keeping the global memory market undersupplied in the fourth quarter of 2026. Rising DRAM and NAND Flash contract prices are boosting expectations for Samsung Electronics and SK Hynix in 2027, although weak consumer demand and long-term agreement (LTA) price caps will limit further increases.

Exclusive: Chinese energy storage giants reportedly exit US as two-way tech restrictions open door for non-Chinese suppliers

Scarlett Yu — Mon, 19 Oct 2026 01:35:50 GMT

Major Chinese energy storage system suppliers that once dominated the US market have reportedly withdrawn almost entirely from US operations in 2026, amid mounting regulatory restrictions, overlapping tariffs, and stringent ownership scrutiny, according to US supply chain sources.

Amazon Leo tops 400Mbps in test, targets Starlink market

DIGITIMES — Mon, 19 Oct 2026 01:33:11 GMT

Amazon recently demonstrated its low Earth orbit communications satellite network, Amazon Leo, at a test site in Aberdeen, Maryland, testing high-speed connectivity in a tactical environment with the US Army. During the demonstration, a notebook transmitted data through a ground-based Leo Pro antenna, with peak download speeds exceeding 400Mbps as the satellite passed overhead, signaling Amazon’s push to challenge SpaceX’s Starlink in the satellite broadband market.

TECO's modular data center validation nears completion

Eifeh Strom — Mon, 19 Oct 2026 01:28:35 GMT

TECO Electric and Machinery chairman Morris Li said the company has entered the final stage of testing its modular data center (MDC) solution. The company is targeting opportunities in the artificial intelligence (AI) data center market and seeks to help customers complete construction projects in nine months.

Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback

DIGITIMES — Mon, 19 Oct 2026 01:23:32 GMT

This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies. Tata's Dholera fab has early customer commitments but must convert them into qualified, recurring wafer production while facing shareholder scrutiny. Intel is rebuilding through process execution, partnerships, and advanced packaging. Micron and TSMC are expanding AI-related capacity in Taiwan and Japan, while companies including Murata, AWS, Hitachi, and XPeng advance physical AI, robotics, and engineering exports.

Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says

DIGITIMES — Mon, 19 Oct 2026 01:04:27 GMT

Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung Electronics, which has made every part of its HBM stacks in-house, has agreed after an internal review to use TSMC's 3nm process for the base die of NVHBM, Nvidia's next-generation custom HBM, the Seoul Economic Daily reported on October 18, citing industry sources. The newspaper said it would be the first time the two companies have worked together at the HBM manufacturing stage.

India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands

DIGITIMES — Mon, 19 Oct 2026 00:15:19 GMT

Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and infrastructure investments accelerating across the country's domestic technology ecosystem rapidly.

Semiconductor equipment demand rises as risks curb AI bubble

Lily Hess — Mon, 19 Oct 2026 00:14:55 GMT

SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However, Clark Tseng, senior director of market intelligence at SEMI, said external constraints involving funding, electricity, and politics are emerging as potential downside risks. He added that this could prevent the AI-driven expansion from overheating.

Lite-On showcases 800VDC power technology at Nvidia MGX event

DIGITIMES — Mon, 19 Oct 2026 00:14:20 GMT

Lite-On Technology was invited to participate in the Nvidia MGX Ecosystem Ceremony at the 2026 Open Compute Project (OCP) Global Summit, joining Nvidia and global ecosystem partners to highlight advances in AI infrastructure. During the OCP exhibition, Lite-On showcased its 800VDC Power Rack and 800V-to-50V Power Brick, underscoring its capabilities in next-generation AI power infrastructure.

EU bet on minimum import prices risks repeating solar mistakes in EV battle

Yunnie Cheng — Mon, 19 Oct 2026 00:13:55 GMT

From historic trade barriers targeting solar photovoltaics to current import restrictions on new energy vehicles, the minimum import price mechanism has once again surfaced as a core policy instrument. Western governments are using it to shield domestic markets from low-priced Chinese competition.

ByteDance Seed launches AI safety team, global recruitment drive

DIGITIMES — Mon, 19 Oct 2026 00:13:02 GMT

ByteDance's AI research unit Seed has established an Alignment & Preparedness department and is recruiting 10 researchers in Beijing, Shanghai, and San Jose, California, to focus on advanced-model safety, AI alignment, and emerging risks. The move underscores the growing importance of AI safety as competition expands beyond model capabilities, computing power, and product applications to governance and reliable large-scale deployment.

Space solar outsourcing heats up as Taiwan targets non-SpaceX players

Lily Hess — Mon, 19 Oct 2026 00:12:39 GMT

As advances in aerospace technology lower the barriers to launching and building low-Earth orbit (LEO) satellites, emerging satellite operators worldwide are driving demand for outsourced space solar cells and modules. Supply-chain sources say the trend is creating new opportunities for Taiwan's solar industry beyond SpaceX, which is led by Tesla CEO Elon Musk.

South Korea's TelePIX wins global satellite contracts, targets 2027 launch of AI-powered optical payload

Scarlett Yu — Mon, 19 Oct 2026 00:12:24 GMT

South Korean space AI solutions provider TelePIX is accelerating the development of high-resolution optical payloads and onboard AI technologies, with plans to launch its next-generation system into space for validation in 2027.

Taiwan seeks international quantum collaboration in critical 5-year push

Rodney Chan — Mon, 19 Oct 2026 00:11:58 GMT

Taiwan's National Science and Technology Council (NSTC) has opened applications for the country's second five-year quantum technology program lasting from 2027 to 2031, with international collaboration being a main focus.

Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains

Levi Li — Sat, 17 Oct 2026 18:39:00 GMT

Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability, according to Zeng Yi Wong, assistant managing director for manufacturing at Enterprise Singapore (EnterpriseSG).