<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Wed, 16 Sep 2026 03:00:10 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Global top-3 memory maker status, 3Q 2026: AI servers drive record memory revenue; SSD, LPDDR upgrades ahead</title>
<pubDate>Wed, 16 Sep 2026 02:55:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260914RS401/memory-chips-demand-growth-ssd-revenue-2026.html?chid=2</link>
<description>DIGITIMES observes that major memory suppliers posted record-high revenue in the second quarter of 2026, with yearover-year growth remaining in the triple digits. Driven by AI demand, SSDs and LPDDR are emerging as key competitive&lt;br&gt;battlegrounds. &lt;br&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260914RS401/memory-chips-demand-growth-ssd-revenue-2026.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260914rs401_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Sharp opens orders for Foxconn-built Nvidia AI servers, targeting JPY250 billion by fiscal 2030</title>
<pubDate>Wed, 16 Sep 2026 02:48:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916VL204/sharp-nvidia-2030-foxconn-manufacturing.html</link>
<description>Sharp Corporation began taking orders in Japan on September 15 for AI servers procured from its Taiwanese parent, Foxconn, and equipped with Nvidia processors, giving the display and consumer electronics maker a route into domestic AI infrastructure at a moment when GPU supply remains tight. The company said commercial sales are planned for fiscal 2027, and it is targeting revenue of around JPY250 billion (about US$1.6 billion) in fiscal 2030, according to &lt;em&gt;Kyodo News&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916VL204/sharp-nvidia-2030-foxconn-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916vl204_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Huawei reportedly scales back AITO role as Seres takes greater control</title>
<pubDate>Wed, 16 Sep 2026 02:25:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD218/huawei-seres-ev-brand-high-end-sales.html</link>
<description>Huawei and Seres, a Chongqing-based premium manufacturer of high-end electric NEVs, are reportedly adjusting their smart vehicle partnership in the AITO brand. Huawei would shift toward a more asset-light role, and Seres would take greater control over AITO's product, marketing, sales, and service operations.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916PD218/huawei-seres-ev-brand-high-end-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916pd218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Seres]]></media:description>
</media:content></item>
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<title>Apple, Intel links sharpen focus on Lens Technology's next glass growth markets</title>
<pubDate>Wed, 16 Sep 2026 02:22:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916VL202/growth-intel-apple-foldable-business.html</link>
<description>Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via (TGV) substrates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916VL202/growth-intel-apple-foldable-business.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916vl202_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>US-based Teradyne opens Bengaluru office to support India's semiconductor push</title>
<pubDate>Wed, 16 Sep 2026 02:18:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PR200/teradyne-manufacturing-demand-government-india-semiconductor-mission.html</link>
<description>Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives the US test-equipment maker a local base in one of Asia's fastest-growing technology hubs, where demand is rising across the semiconductor industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916PR200/teradyne-manufacturing-demand-government-india-semiconductor-mission.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916pr200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Advanced processes have no ready-made answers, says TSMC's COO</title>
<pubDate>Wed, 16 Sep 2026 02:09:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD200/tsmc-taiwan-chairman-technology.html</link>
<description>&lt;p class="P1" data-start="2414" data-end="2944"&gt;Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and Answers for the AI Era" forum on September 15. Students asked how TSMC determines whether a technology is worth long-term investment when information is incomplete and the technological direction remains unclear, as well as how people can develop the ability to judge whether answers generated by artificial intelligence (AI) are true or false in the AI era.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916PD200/tsmc-taiwan-chairman-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916pd200_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Interview: Forget transistors &#38;mdash; speed is what's choking the chip supply chain, says Qnity exec</title>
<pubDate>Wed, 16 Sep 2026 02:09:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD225/demand-materials-packaging-3d-manufacturing.html</link>
<description>The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking transistors. The industry is moving toward a "shrink and stack" model that combines continued scaling with increasingly complex 3D integration.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD225/demand-materials-packaging-3d-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd225_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale</title>
<pubDate>Wed, 16 Sep 2026 01:58:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD212/electronics-manufacturing-growth-revenue-demand.html</link>
<description>&lt;p class="P1" data-start="4282" data-end="4655"&gt;Where will China's electronics manufacturing industry find growth over the next five years? The answer is taking shape in the 15th Five-Year Plan for the sector, released by the Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC): industry revenue is targeted to exceed CNY30 trillion (US$4.47 trillion) by 2030.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916PD212/electronics-manufacturing-growth-revenue-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI</title>
<pubDate>Wed, 16 Sep 2026 01:53:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD211/mediatek-dimensity-2nm-mobile-software.html</link>
<description>MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform adopts a 2+3+3 all-big-core CPU configuration, upgrades its cache architecture, and doubles its NPU resources with a dual-NPU design to support increasingly demanding AI workloads.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916PD211/mediatek-dimensity-2nm-mobile-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916pd211_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge</title>
<pubDate>Wed, 16 Sep 2026 01:51:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916VL200/tsmc-hbm-samsung-sk-hynix-intel.html</link>
<description>&lt;p class="P1" data-start="1945" data-end="2512"&gt;The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory. Within weeks, SK Hynix has been reported to be weighing Intel alongside TSMC, Samsung Electronics has been reported to be pairing its own foundry with TSMC, and Micron has confirmed that TSMC will manufacture its next-generation base die. What began as a single-vendor arrangement is turning into a multi-front sourcing contest &#38;mdash; and the assumption that a second source automatically means a cheaper one is already being challenged.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260916VL200/tsmc-hbm-samsung-sk-hynix-intel.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260916vl200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>FSC teams with South Korean maker on TGV equipment for glass substrates</title>
<pubDate>Wed, 16 Sep 2026 01:43:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD237/equipment-injection-molding-packaging-taiwan-market.html</link>
<description>Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture Zhongke Xianfeng on through-glass via (TGV) equipment for glass substrates, used in next-generation advanced packaging. The two sides signed a cooperation agreement on September 14, initially targeting major printed circuit board (PCB), IC substrate, and OSAT makers in Taiwan and Southeast Asia.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD237/equipment-injection-molding-packaging-taiwan-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd237_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors</title>
<pubDate>Wed, 16 Sep 2026 01:43:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD238/fcs-2027-market-growth-equipment.html</link>
<description>High-end multilayer polymer capacitors (MLPCs) &#38;mdash; increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs &#38;mdash; have historically been dominated by Japan's Panasonic, which has held over 90% of the market. Now, a Taiwan-based machinery maker is aiming to challenge that grip.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD238/fcs-2027-market-growth-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd238_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan can power its AI chip boom &#38;mdash; but not with green energy</title>
<pubDate>Wed, 16 Sep 2026 00:37:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD232/taiwan-electricity-digitimes-demand-renewable-energy.html</link>
<description>DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have enough electricity to support continued semiconductor expansion driven by AI, and whether that electricity will come from renewable sources.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD232/taiwan-electricity-digitimes-demand-renewable-energy.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd232_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>South Korean NPU startups face validation hurdle in push for global sales</title>
<pubDate>Wed, 16 Sep 2026 00:36:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD218/npu-sales-development-commercial-cost.html</link>
<description>&lt;p class="P1" data-start="3487" data-end="3695"&gt;South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience operating at scale remains a major hurdle to winning global customers.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD218/npu-sales-development-commercial-cost.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Rebellions CEO Sunghyun Park. Credit: Daniel Chiang]]></media:description>
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<title>Apple's foldable phone faces durability test as suppliers eye crease risks</title>
<pubDate>Wed, 16 Sep 2026 00:36:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD202/apple-foldable-design-hinge-worldwide.html</link>
<description>&lt;p class="P1" data-start="1958" data-end="2295"&gt;Apple's first foldable phone is drawing worldwide attention because its design choices could shape how future bendable devices are built and priced. But suppliers say one of the industry's oldest durability issues remains unresolved: whether the protective film over the inner display can lift over time, especially at the center crease.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD202/apple-foldable-design-hinge-worldwide.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd202_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>Star Shining launches IPO plan as renewable energy assets reach 676MW</title>
<pubDate>Wed, 16 Sep 2026 00:31:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD240/ipo-renewable-energy-auo-taiwan-2025.html</link>
<description>&lt;p class="P1" data-start="2855" data-end="3156"&gt;Star Shining, an AUO Group affiliate, signed an IPO advisory agreement with Cathay Securities on September 15, formally starting its capital markets process in Taiwan. The renewable energy developer said it is targeting a listing in 2028 after building and managing 676MW of renewable energy capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD240/ipo-renewable-energy-auo-taiwan-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd240_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>ITRI showcases AI robots, drones to push commercialization in southern Taiwan</title>
<pubDate>Wed, 16 Sep 2026 00:30:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD239/itri-taiwan-technology-industrial-development.html</link>
<description>&lt;p class="P1" data-start="2511" data-end="2933"&gt;The Industrial Technology Research Institute (ITRI) held its ITRI Innovation Day on September 15 in Tainan, Taiwan, bringing together research groups and startup teams to highlight 25 cross-disciplinary technologies in AI, smart robotics, and unmanned vehicles. The event was designed to move more research and development results into industrial use through demonstrations, business matchmaking, and an innovation market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915PD239/itri-taiwan-technology-industrial-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915pd239_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>China's humanoid robot race, Part 2: Upstream profits gather around dexterous hands</title>
<pubDate>Wed, 16 Sep 2026 00:30:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL210/robot-cost-production-revenue-2026.html</link>
<description>Humanoid robot makers are cutting prices and scaling production, yet much of the industry remains unprofitable. Upstream suppliers are starting to show a different economics &#38;mdash; especially in dexterous robotic hands.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915VL210/robot-cost-production-revenue-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915vl210_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI server tracker: BMC, cable, case suppliers post August 2026 gains</title>
<pubDate>Wed, 16 Sep 2026 00:30:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL217/ai-server-taiwan-revenue-bmc-growth.html</link>
<description>&lt;p class="P1" data-start="1489" data-end="1710"&gt;Taiwan's AI server supply chain continued to show strong year-over-year growth in August, although performance varied significantly across baseboard management controller (BMC), cable/connector, and server-case suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915VL217/ai-server-taiwan-revenue-bmc-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915vl217_files/4_2b.jpg" type="image/jpeg" expression="full">
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<title>DeepSeek to hire its first CFO as it aims for public listing, expands workforce</title>
<pubDate>Wed, 16 Sep 2026 00:29:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL219/deepseek-workforce-venture-capital-chips-startup.html</link>
<description>&lt;p class="P1" data-start="5135" data-end="5461"&gt;DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes place, it would happen at an important time for the Chinese AI startup as it seeks to go public, begins a large expansion of its workforce, and invests in chipmaking and computing capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915VL219/deepseek-workforce-venture-capital-chips-startup.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>Apple exits Musk's AI lawsuit, but the fight over iPhone AI access is only getting bigger</title>
<pubDate>Wed, 16 Sep 2026 00:29:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL226/apple-lawsuit-iphone-antitrust-openai.html</link>
<description>The recent AI antitrust case between two of the high-tech landscape's most powerful camps appears to have quietly ended following Elon Musk's legal retreat from Apple. But the battle over AI distribution control is far from settled, as pointed accusations from SpaceXAI and X regarding Apple's behind-the-scenes role in constraining generative-AI competition have left the broader industry unsettled over questions of AI access and app visibility amid Apple's increasingly open, multi-model ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915VL226/apple-lawsuit-iphone-antitrust-openai.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915vl226_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[AI-assisted illustration by DIGITIMES, created from visual references supplied for editorial context.]]></media:description>
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<title>As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics</title>
<pubDate>Wed, 16 Sep 2026 00:28:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL227/silicon-photonics-globalfoundries-data-expo.html</link>
<description>At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations in the industry amid the AI boom.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260915VL227/silicon-photonics-globalfoundries-data-expo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260915vl227_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>NVHBM is not a memory revolution; Nvidia seeks to platformize cHBM, dominate custom AI architectures</title>
<pubDate>Wed, 16 Sep 2026 00:28:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260914PD218/nvidia-digitimes-hbm-technology-memory-controller.html</link>
<description>&lt;p class="P1" data-start="2565" data-end="3157"&gt;DIGITIMES observed that Nvidia's newly announced NVHBM is not a brand-new memory technology, but rather an extension of existing custom HBM (cHBM). It is a managed cHBM design that moves the memory controller, which originally sat on the XPU, into the HBM logic base die, and pairs it with custom physical-layer (PHY) and die-to-die (D2D) interfaces. In strategic terms, Nvidia is extending its moat from GPUs to the memory architecture of custom ASICs, and is trying to define how future custom AI chips connect to memory, hook into scale-up networks, and come together as complete AI racks.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260914PD218/nvidia-digitimes-hbm-technology-memory-controller.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260914pd218_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound</title>
<pubDate>Wed, 16 Sep 2026 00:25:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260914PD219/taiwan-ic-design-digitimes-demand-revenue.html</link>
<description>&lt;p class="P1" data-start="1809" data-end="2108"&gt;Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend. DIGITIMES said higher prices and early customer buying lifted sales, even as consumer demand remained soft. The second half now looks exposed to weaker momentum.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260914pd219_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>AR glasses target 2 billion myopia users as China supply chain eyes doubling shipments</title>
<pubDate>Tue, 15 Sep 2026 20:31:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD231/ar-glasses-supply-chain-shipments-market-smart-glasses.html</link>
<description>&lt;p class="P1" data-start="3349" data-end="3733"&gt;Suppliers in China's AR glasses supply chain see the approximately 2 billion people worldwide with myopia as a potential market and said shipments are set to double year after year, even as the industry continues to sift winners from losers. At this year's China International Optoelectronic Exposition (CIOE), smart glasses remained a standout theme alongside optical communications.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Chip revenue heads to US$2.4 trillion on price, not volume, Yole says</title>
<pubDate>Tue, 15 Sep 2026 17:34:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL208/yole-revenue-shipping-silicon-hbm.html</link>
<description>The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity, the defining variable of the AI buildout.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260915vl208_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>AI data centers give idle EV battery capacity a second life</title>
<pubDate>Tue, 15 Sep 2026 17:32:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260914PD233/north-america-capacity-data-growth-automakers.html</link>
<description>&lt;p class="P1" data-start="3790" data-end="4183"&gt;Slowing EV growth in North America, tariffs, and policy restrictions are pushing automakers and battery suppliers to repurpose idle capacity. At the same time, surging power demand and grid volatility from generative AI data centers are lifting demand for battery energy storage systems (BESS), making energy storage a key diversification market alongside defense, drones, and humanoid robots.</description>
<dc:creator>Levi Li</dc:creator>
<category>Sustainability</category>
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<title>Research Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck</title>
<pubDate>Tue, 15 Sep 2026 16:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD216/google-tpu-taiwan-2026-chips.html?chid=12</link>
<description>&lt;p class="P1" data-start="4282" data-end="4743"&gt;At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well beyond its next-generation TPU. Rather than focusing on a single chip, Google described how it links large numbers of TPUs into an integrated computing system spanning compute clusters, data centers, and ultimately multiple data centers, while also addressing the power constraints that emerge as the system continues to scale.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Research Insights</category>
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<media:content url="https://img.digitimes.com/newsshow/20260915pd216_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>Amodei's AI slowdown call is unlikely to dent chip demand, industry sources say</title>
<pubDate>Tue, 15 Sep 2026 16:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD219/ceo-demand-anthropic-development-sam-altman.html</link>
<description>&lt;p class="P1" data-start="2494" data-end="2824"&gt;Anthropic CEO Dario Amodei's call to slow frontier AI development has stirred debate over safety, but chip industry sources say global demand for AI infrastructure is likely to keep rising. For readers worldwide, the larger issue is not whether AI spending stops, but how quickly it spreads across clouds, devices, and industries.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>iPhone Duo's identity shapes Apple's foldable strategy</title>
<pubDate>Tue, 15 Sep 2026 16:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD203/foldable-apple-iphone-sales-mobile.html</link>
<description>&lt;p class="P1" data-start="1959" data-end="2288"&gt;Apple's first foldable iPhone, the iPhone Duo, is drawing close attention as analysts forecast shipments of 5 million to 6 million units by year-end. The device could make Apple the world's second-largest foldable phone supplier, behind Samsung Electronics, and shape how global consumers and rivals view future foldable screens.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
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<title>Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months</title>
<pubDate>Tue, 15 Sep 2026 16:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL221/digitimes-2026-2021-asic-materials.html</link>
<description>&lt;p class="P1" data-start="4656" data-end="4924"&gt;Of the 94 listed Taiwanese semiconductor companies DIGITIMES tracks, 80 grew year-over-year in August 2026 and 14 declined. Median year-over-year growth was 27%. Sixty-three of the 94 posted faster year-over-year growth in August than in July, when the median was 21%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies</title>
<pubDate>Tue, 15 Sep 2026 16:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260914PD224/sk-hynix-intel-tsmc-hbm-price.html</link>
<description>&lt;p class="P1" data-start="3017" data-end="3283"&gt;SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory</title>
<pubDate>Tue, 15 Sep 2026 13:30:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915VL218/astera-labs-memory-controller-cpu-ai-inference-dram.html</link>
<description>Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops: the key-value cache outgrows the HBM on the accelerator, and the usual fallback makes things worse.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Airbus weighs supplier stakes to relieve aerospace parts bottlenecks</title>
<pubDate>Tue, 15 Sep 2026 12:57:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD242/airbus-supplier-production-plant-supply-chain.html</link>
<description>Airbus is monitoring parts lead times across its supply chain and said direct equity stakes in, or takeovers of, subcontractors could be used in extreme cases to prevent supply disruptions. The comments came as the global aerospace industry continues to face bottlenecks in engines, cabin interiors and other critical components.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>The Boring lands US$3 billion from UAE investors, fueling Musk's underground transit dream</title>
<pubDate>Tue, 15 Sep 2026 11:01:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260915PD241/uae-funding-financing-2022-development.html</link>
<description>Even as he leads SpaceX through the largest IPO in history and rolls out Tesla's Cybercab robotaxi fleet in Austin, Texas, Elon Musk has not let go of his ambitions for underground tunnel transportation, continuing to push forward the tunnel-drilling business of his company The Boring.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20260915pd241_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
</channel>
</rss>

