<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Wed, 2 Sep 2026 23:37:11 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant</title>
<pubDate>Wed, 2 Sep 2026 23:35:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL209/vinfast-plant-asia-2025.html</link>
<description>VinFast has suspended plans to manufacture three electric vehicles in India and ordered suppliers to halt work while it reassesses costs, according to two sources and a company memo reviewed by Reuters. The pause stalls the localization push the Vietnamese automaker had placed at the center of its India strategy, barely a year after opening its first factory outside Vietnam.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL209/vinfast-plant-asia-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl209_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>CPO material race widens as Taiwan eyes key role</title>
<pubDate>Wed, 2 Sep 2026 23:34:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD244/2026-taiwan-semicon-marvell-cpo.html</link>
<description>At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan Semiconductor Industry Association (TSIA) discussed the future of silicon photonics (SiPh). They said the industry's bottlenecks have shifted from materials to packaging precision, materials platform selection, and the manufacturing tools needed to support both.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD244/2026-taiwan-semicon-marvell-cpo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd244_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028</title>
<pubDate>Wed, 2 Sep 2026 23:34:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD234/cooling-auras-production-revenue-2027.html</link>
<description>Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers, with chairman Steve Lin highlighting sustained progress in projects for major international cloud service providers (CSP) such as AWS and Meta.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD234/cooling-auras-production-revenue-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd234_files/6_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations</title>
<pubDate>Wed, 2 Sep 2026 23:33:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD232/alpha-networks-equipment-itri-taiwan-communications.html</link>
<description>Network equipment maker Alpha Networks said it has teamed up with Taiwan's Industrial Technology Research Institute (ITRI) and Chen Lung Technology to jointly advance the "B5G/Pre-6G public network Massive Antenna Radio Unit project."</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD232/alpha-networks-equipment-itri-taiwan-communications.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd232_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times</title>
<pubDate>Wed, 2 Sep 2026 23:33:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD226/jpc-demand-2027-infrastructure-2026.html</link>
<description>JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed transmission, and high-power products. The connector and cable maker said visibility now stretched into 2027, and in some cases into 2028, even as tight supply and longer lead times for key components continued to constrain near-term delivery.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD226/jpc-demand-2027-infrastructure-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Column: From automation to autonomy&#38;mdash;what robotics still needs to make the leap</title>
<pubDate>Wed, 2 Sep 2026 23:32:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD218/automation-robotics-2026-taipei-robot.html</link>
<description>I visited Automation Taipei 2026 in mid-August, where the show looked lively and occupied a footprint 7% larger than in 2025. Physical AI and vision-language-action (VLA) models dominated the venue. Yet most robots on display still repeated fixed motions behind barriers, highlighting how far robotics has to go to move from automation to autonomy.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD218/automation-robotics-2026-taipei-robot.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd218_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>SB Energy eyes US listing as Nvidia commits US$1.5 billion</title>
<pubDate>Wed, 2 Sep 2026 23:32:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD228/data-center-infrastructure-ipo-nvidia.html</link>
<description>SB Energy, the data center and power infrastructure company under SoftBank Group, filed for an IPO with the US Securities and Exchange Commission (SEC) on September 1, planning to list under the ticker "SBE" on Nasdaq and Nasdaq Texas. The deal could value the company at more than US$50 billion, while Nvidia's promised US$1.5 billion investment has emerged as the most prominent backing for the offering.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD228/data-center-infrastructure-ipo-nvidia.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd228_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: India's fast-growing FWA market may widen, but suppliers still face margin pressure</title>
<pubDate>Wed, 2 Sep 2026 23:31:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD217/market-fwa-wireless-broadband-5g.html</link>
<description>India's fixed wireless access (FWA) market is expanding quickly as 5G rollouts accelerate and policymakers push local manufacturing, but Taiwanese networking suppliers say the opportunity comes with familiar risks. Telecom demand in the country remains strong, yet vendors with experience in India warn that growth does not automatically translate into profit.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD217/market-fwa-wireless-broadband-5g.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>PlayNitride sees 3.2T AI links opening a new front for Micro LED, but auto weakness weighs on 2H26</title>
<pubDate>Wed, 2 Sep 2026 23:31:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD210/playnitride-2026-communications-shipments-commercial.html</link>
<description>Micro LED is moving beyond displays into AI optical communications, with PlayNitride targeting commercial deployment within two years if industry standards and supply-chain integration progress as planned.</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD210/playnitride-2026-communications-shipments-commercial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too</title>
<pubDate>Wed, 2 Sep 2026 23:31:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD208/semco-price-mlcc-2026-market.html</link>
<description>Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors (MLCCs) sold to OEMs and ODMs in the fourth quarter of 2026, while ABF substrate prices are also climbing. With supply constrained and demand for AI servers strong, further price increases are likely in the near term.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD208/semco-price-mlcc-2026-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd208_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>SK Hynix wafer purchases jump 104% on AI demand</title>
<pubDate>Wed, 2 Sep 2026 23:30:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD207/sk-hynix-wafer-demand-2026-silicon-wafer.html</link>
<description>SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising wafer prices and surging AI demand. The increase drew more attention than Samsung Electronics' modest rise over the same period.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD207/sk-hynix-wafer-demand-2026-silicon-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Global smartphone outlook cut again as foldables shine</title>
<pubDate>Wed, 2 Sep 2026 23:30:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD206/smartphone-shipments-2025-foldable-global-smartphone.html</link>
<description>Global smartphone shipments are facing renewed downside pressure in 2026 as memory prices rise, handset makers pass on higher costs, and brands trim low-end models to protect margins. Forecasts for this year have also been cut repeatedly, with the most bearish view suggesting global smartphone shipments will fall nearly 17% from 2025.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD206/smartphone-shipments-2025-foldable-global-smartphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd206_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Thailand AiPASS unlocks premium AI after lessons</title>
<pubDate>Wed, 2 Sep 2026 23:29:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD204/data-chatgpt-claude.html</link>
<description>Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such as ChatGPT and Claude and offering them free to citizens. The move aims to expand AI access while addressing the country's widening AI usage gap.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD204/data-chatgpt-claude.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung to add 1,612 new equipment units at Vietnam chip plant</title>
<pubDate>Wed, 2 Sep 2026 23:29:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD203/samsung-equipment-production.html</link>
<description>Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai Nguyen province. Industry analysts say the move shows Samsung is accelerating efforts to turn Vietnam into a major semiconductor back-end manufacturing base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD203/samsung-equipment-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd203_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>LCY Advanced Materials launches wet chemicals for AI chip packaging</title>
<pubDate>Wed, 2 Sep 2026 23:29:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD201/lcy-packaging-manufacturing-2026-materials.html</link>
<description>LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit, as AI and high-performance computing rapidly push semiconductor manufacturing toward system-level scaling centered on advanced packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD201/lcy-packaging-manufacturing-2026-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Macronix boosts sustainability spending to NT$780 million</title>
<pubDate>Wed, 2 Sep 2026 23:28:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD200/2025-macronix-international-water-2024-fab.html</link>
<description>Macronix (MXIC) said in its latest sustainability report for 2025 that greenhouse gas emissions fell 19.8% from 2024 and 32% from the business-as-usual (BAU) baseline, beating its original 20% reduction target. The memory chip maker also said it invested about NT$780 million (approx. US$24.66 million) in environmental, safety, and health initiatives in 2025.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD200/2025-macronix-international-water-2024-fab.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>MiniMax, Z.ai revenues surge on API demand but adjusted losses widen</title>
<pubDate>Wed, 2 Sep 2026 16:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL221/demand-z.ai-revenue-api-technology.html</link>
<description>Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains a much harder problem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL221/demand-z.ai-revenue-api-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl221_files/6_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: MiniMax and Z.ai; AI-generated illustration]]></media:description>
</media:content></item>
<item>
<title>TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus</title>
<pubDate>Wed, 2 Sep 2026 16:36:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD212/2026-z.ai-ceo-technology.html</link>
<description>&lt;em&gt;TIME&lt;/em&gt; recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese entrepreneurs spanning AI models, humanoid robots, and AI agents, highlighting how China's AI industry is expanding beyond large language models into a broader range of technologies and applications.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD212/2026-z.ai-ceo-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing</title>
<pubDate>Wed, 2 Sep 2026 16:33:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD221/demand-robot-2026-taiwan-sensor.html</link>
<description>The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON Taiwan 2026 said robots will need increasingly diverse sensing capabilities to perceive, interpret, and respond to complex real-world environments in real time.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD221/demand-robot-2026-taiwan-sensor.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI</title>
<pubDate>Wed, 2 Sep 2026 16:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL224/microsoft-semiconductor-industry-yield-rate-silicon-infrastructure-semicon-taiwan.html</link>
<description>Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL224/microsoft-semiconductor-industry-yield-rate-silicon-infrastructure-semicon-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl224_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Sandisk says HBF can match HBM bandwidth with up to 16x the capacity</title>
<pubDate>Wed, 2 Sep 2026 09:54:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL225/hbm-bandwidth-capacity-technology-flash.html</link>
<description>Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory closer to processors as inference workloads strain conventional memory systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL225/hbm-bandwidth-capacity-technology-flash.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl225_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Sandisk says its HBF can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth</title>
<pubDate>Wed, 2 Sep 2026 09:41:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL223/micron-dram-hbm-bandwidth-nand.html</link>
<description>Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks to new architectures to overcome the widening gap between processor performance and memory bandwidth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL223/micron-dram-hbm-bandwidth-nand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl223_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Micron says tightly coupled DRAM could deliver more than 10 times HBM bandwidth. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Lam Research exec says automated preventive maintenance key to fabs of the future</title>
<pubDate>Wed, 2 Sep 2026 09:03:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL222/lam-research-fab-manufacturing-data.html</link>
<description>A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but from pairing collaborative robots with AI-driven predictive maintenance to close a long-standing gap in fab operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL222/lam-research-fab-manufacturing-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>DRAM giants target 3D stacking to break memory wall and power bottlenecks</title>
<pubDate>Wed, 2 Sep 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD241/dram-bandwidth-3d-data-demand-semicon-taiwan.html</link>
<description>At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching a performance ceiling. Consequently, the industry is transitioning toward 3D vertical stacking architectures to minimize transmission power consumption and leverage wafer-level bonding technologies.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD241/dram-bandwidth-3d-data-demand-semicon-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd241_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale</title>
<pubDate>Wed, 2 Sep 2026 08:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL215/taiwan-photonics-nasdaq-manufacturing-quantum-computing.html</link>
<description>Four days after listing on Nasdaq, Pasqal came to SEMICON Taiwan with an argument aimed squarely at its competitors: the industry's assumption that quantum computing delivers nothing useful before fault tolerance arrives around 2030 is wrong, and the French company intends to sell against it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL215/taiwan-photonics-nasdaq-manufacturing-quantum-computing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl215_files/7_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>EU EV battery recycling still lacks a profitable model</title>
<pubDate>Wed, 2 Sep 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD205/recycling-ev-battery-eu-production-vehicle.html</link>
<description>The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing, yet a sustainable business model has not emerged.</description>
<dc:creator>AI bot</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD205/recycling-ev-battery-eu-production-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd205_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's semiconductor ecosystem has the UK taking notes</title>
<pubDate>Wed, 2 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD219/uk-taiwan-government-academia-moea.html</link>
<description>The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry of Economic Affairs (MOEA) in Taipei on September 1. It is generally believed that government support, close collaboration among industry, academia and research institutions, and corporate long-term vision are key drivers of Taiwan's semiconductor success.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD219/uk-taiwan-government-academia-moea.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Nvidia and Micron top NT$4.4T in Taiwan investment</title>
<pubDate>Wed, 2 Sep 2026 07:50:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD237/taiwan-micron-nvidia-investment-2026.html</link>
<description>On the eve of the opening of SEMICON Taiwan 2026, the Ministry of Economic Affairs (MOEA) hosted the Semicon Network Summit, where President Ching-Te Lai said Nvidia invests and procures more than NT$3 trillion (US$94.4 billion) a year in Taiwan. He added that Micron has invested more than NT$1.4 trillion cumulatively, while AMD has expanded its Taiwan R&#38;amp;D and investment to more than NT$300 billion.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD237/taiwan-micron-nvidia-investment-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand </title>
<pubDate>Wed, 2 Sep 2026 07:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD240/zhen-ding-ai-server-infrastructure-pcb.html</link>
<description>Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver modules, and ultra-high-layer AI server boards with up to 34 layers. The showcase underscores the company's advanced printed circuit board (PCB) engineering capabilities for next-generation AI computing infrastructure, spanning high-speed data transmission to multi-layer board designs.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD240/zhen-ding-ai-server-infrastructure-pcb.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd240_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung, SK Hynix inventories surge as valuation reserves fall</title>
<pubDate>Wed, 2 Sep 2026 07:41:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL216/samsung-sk-hynix-inventory-demand-production.html</link>
<description>Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues to strain available supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL216/samsung-sk-hynix-inventory-demand-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl216_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
</media:content></item>
<item>
<title>Semicon Taiwan 2026 to test cloud AI investment boom</title>
<pubDate>Wed, 2 Sep 2026 07:33:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD235/2026-cloud-taiwan-cloud-ai-investment.html</link>
<description>Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon Taiwan 2026 may serve as the ultimate litmus test for this debate.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD235/2026-cloud-taiwan-cloud-ai-investment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd235_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand</title>
<pubDate>Wed, 2 Sep 2026 07:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD246/wonderful-hi-tech-capacity-data-center-demand-cables.html</link>
<description>Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed transmission cable shipments for artificial intelligence (AI) applications, coupled with strong pull-in momentum from a major US low-Earth-orbit (LEO) satellite customer, drove second-quarter results. The company also said it is expanding capacity in Thailand and Vietnam to capture new opportunities in space data centers and physical AI.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD246/wonderful-hi-tech-capacity-data-center-demand-cables.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd246_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>World's first legged robot standard sets global benchmark for humanoids, robot dogs</title>
<pubDate>Wed, 2 Sep 2026 07:10:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL220/robot-performance-inspection.html</link>
<description>China-led experts have released what &lt;em&gt;CCTV&lt;/em&gt; described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots, robot dogs and other machines designed to walk, run, climb slopes and cross obstacles.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL220/robot-performance-inspection.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl220_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>India reportedly readies AI agent payments on UPI, its national payment rails</title>
<pubDate>Wed, 2 Sep 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902VL207.html</link>
<description>India is preparing a framework that would allow AI agents to make small digital payments without requiring user approval for every transaction, three sources familiar with the matter told &lt;em&gt;Reuters&lt;/em&gt;. This would be a step that would put one of the world's largest payment networks behind agentic commerce.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902VL207.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902vl207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Indium CEO: packaging, cooling and power are next AI bottlenecks</title>
<pubDate>Wed, 2 Sep 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260902PD231/packaging-cooling-ceo-hpc-materials.html</link>
<description>As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and power delivery. With GPUs, high-bandwidth memory (HBM), and advanced packaging pushing power density higher, chipmakers now face challenges that extend well beyond silicon manufacturing, including managing thermal expansion, warpage, heat dissipation, and reliability across heterogeneously integrated materials.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260902PD231/packaging-cooling-ceo-hpc-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260902pd231_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
</channel>
</rss>

