DIGITIMES: News and Insight of the Global Supply Chain

SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration

Joseph Chen — Mon, 24 Aug 2026 04:55:00 GMT

Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management, power consumption and packaging have emerged as the new bottlenecks. At Hot Chips 2026, SK Hynix laid out its advanced packaging roadmap in detail, moving from hybrid bonding to Intel's EMIB and ultimately toward 3D integration.

Europe's struggling auto industry turns to China, drawing US scrutiny

Kevin Wang — Mon, 24 Aug 2026 04:17:09 GMT

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through the vicious cycle of weak demand, rising costs, and low capacity utilization, as well as difficulties in their transition to electric vehicles (EVs). However, the fact that Europe is utilizing subsidies and collaborative efforts to expand production with Chinese carmakers while confronting overcapacity issues on its home turf is, in the eyes of the US, an absurd situation, and Washington has not ruled out the possibility of further tariffs or import restrictions on European cars.

Analysis: SK Hynix pushes beyond HBM with HBF and CPO

Sherri Wang — Mon, 24 Aug 2026 04:08:26 GMT

SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.

Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

DIGITIMES — Mon, 24 Aug 2026 03:57:05 GMT

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips and data centers providing a stronger-than-expected tailwind, CEO Atsuyoshi Koike told Reuters.

Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand

DIGITIMES — Mon, 24 Aug 2026 03:33:42 GMT

Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising global demand for AI chips. For readers worldwide, the move underscores how chip supply chains are adapting to support data centers, connected devices, and next-generation computing.

India weighs new capital subsidies to build domestic polysilicon capacity

DIGITIMES — Mon, 24 Aug 2026 03:22:53 GMT

India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar supply chain.

Notebook brands shift production back to China as Southeast Asia costs rise

Lily Hess — Mon, 24 Aug 2026 03:09:24 GMT

Notebook brands that rushed into Southeast Asia for manufacturing are moving production back to China, as the cost gap remains too wide and the impact of substitute tariffs has proved limited, according to supply chain sources. The shift is expected to affect Taiwan original device manufacturers (ODMs) serving new customer lines in Vietnam and Thailand.

Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026

DIGITIMES — Mon, 24 Aug 2026 03:06:18 GMT

The 2026 World Robot Conference (WRC) opened in Beijing on August 19, and the biggest change on this year's show floor was not the larger number of humanoid robots — it was that robots started working on site. From coffee making and retail service to printed circuit board (PCB) handling, logistics sorting, auto parts loading and unloading, and even home organizing, laundry, and table clearing, robot makers are no longer just showing robots walking, dancing, and boxing.

Nvidia server prices to rise up to 17% as memory costs climb

DIGITIMES — Mon, 24 Aug 2026 03:05:00 GMT

Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and other component costs feed through to next-generation data center infrastructure.

Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration

DIGITIMES — Mon, 24 Aug 2026 02:57:35 GMT

DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning, and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks.

SEMI launches alliance to ride semiconductor materials boom

DIGITIMES — Mon, 24 Aug 2026 02:48:25 GMT

SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its position as the world's largest semiconductor materials consumer for a 16th straight year.

AI chip roadmaps force faster changes in data-center design, Cadence says

DIGITIMES — Mon, 24 Aug 2026 02:45:00 GMT

Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according to Cadence Design Systems. This is narrowing a gap that once separated semiconductor development from facility engineering.

Interview: Inside Foxconn's playbook for the sovereign AI data center race

Jingyue Hsiao — Mon, 24 Aug 2026 02:32:36 GMT

Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers design and procure computing capacity.

Taiwan speeds chip materials push with consumables, ITRI says

DIGITIMES — Mon, 24 Aug 2026 02:27:09 GMT

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value physical materials, Taiwan's Industrial Technology Research Institute (ITRI) said on August 21. Kuo-chan Chiou, director of ITRI's Material and Chemical Research Laboratories, said the island's materials supply chain is strengthening its capabilities as competition intensifies among Taiwan, Japan, and the US.

Shanghai accepts YMTC's STAR Market listing application

DIGITIMES — Mon, 24 Aug 2026 02:24:27 GMT

China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises, US export controls bite, and memory markets remain highly cyclical, raising questions about whether its rapid profit surge can last.

ASE's Huang urges AI profits to fund R&D for CPO, PLP

DIGITIMES — Mon, 24 Aug 2026 02:17:53 GMT

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.

Taiwan semiconductor materials team up to build local supply chain

DIGITIMES — Mon, 24 Aug 2026 02:10:47 GMT

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies continue to evolve. Despite geopolitical headwinds, stronger local supply-chain resilience is accelerating the push toward materials self-sufficiency.

India-based Raana Semiconductors in talks to raise US$10.4 million Series A for crystal-growth expansion

DIGITIMES — Mon, 24 Aug 2026 01:57:53 GMT

According to Inc42, Indian semiconductor startup Raana Semiconductors is in advanced discussions to raise about INR100 crore (US$10.44 million) in a Series A funding round, as the company seeks to expand its work in semiconductor and advanced-material crystal growth.

Jeilin shifts upmarket as high-end image SoCs drive margins higher

Jingyue Hsiao — Mon, 24 Aug 2026 01:56:47 GMT

Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers worldwide. The Taiwan-based chip designer said new products, tighter cost controls, and broader market reach are helping it compete in a consolidating industry.

Robots shift from POC to ROI as logistics, manufacturing lead

DIGITIMES — Mon, 24 Aug 2026 01:43:40 GMT

The 2026 World Robot Conference (WRC 2026) ran from Aug. 19 to 23 in Beijing, and one question dominated the show floor: whether robots are truly ready for real work settings and whether customers can calculate a clear return on investment (ROI).

USITC opens cylindrical battery probe as China-Korea competition intensifies

DIGITIMES — Mon, 24 Aug 2026 01:43:21 GMT

The US International Trade Commission (USITC) has opened a trade investigation into certain cylindrical batteries and related products. This case could affect battery supply chains spanning Asia, Europe, and North America. The move adds uncertainty for manufacturers, automakers, and consumers worldwide who depend on imported energy-storage components.

Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design

DIGITIMES — Mon, 24 Aug 2026 01:34:40 GMT

Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell, SK Hynix, Micron, Samsung, and Taiwan's chipmakers. Below are the most-read DIGITIMES stories from the week of August 17-23, 2026.

Half of GenAI projects stall at PoC as data gaps widen

DIGITIMES — Mon, 24 Aug 2026 01:33:39 GMT

As generative AI spreads rapidly across enterprise operations, gaps in data foundations and governance are emerging as a key dividing line in how quickly AI projects move forward. Anna Yen, chairman of the Taiwan Data Management Association, said financial firms are currently more mature in data governance, while manufacturing still lags, especially among small and medium-sized enterprises and traditional industries.

Jinpao Precision anticipates 2H26 growth from AI orders, aerospace progress

Eifeh Strom — Mon, 24 Aug 2026 01:31:13 GMT

Thailand-based precision sheet metal manufacturer Jinpao Precision Industry delivered strong results in the second quarter of 2026. Fueled by orders for artificial intelligence (AI) server racks, power cabinets, and energy storage-related structural components, second-quarter consolidated revenue hit NT$1.20 billion (approx. US$37.71 million), while gross margin improved to 42.1%, both reaching new highs. Earnings per share (EPS) for the quarter were NT$4.41.

AI packaging demand exposes supply-chain gaps for Taiwan materials makers

DIGITIMES — Mon, 24 Aug 2026 01:22:23 GMT

AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned that capacity for the next three years is already largely booked, underscoring pressure on Taiwan's materials makers to accelerate R&D and local production.

India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme

DIGITIMES — Mon, 24 Aug 2026 01:20:11 GMT

India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward higher domestic value addition, indigenous product design, and locally owned intellectual property.

MIT study finds AI image attribution weakens as training data grows

DIGITIMES — Mon, 24 Aug 2026 01:12:40 GMT

MIT researchers said a larger training set makes it harder to trace an AI image back to a specific source, a pattern they call attribution decay. The findings, reported in connection with diffusion models, could complicate copyright disputes and regulatory scrutiny over generative AI.

Alibaba plans HKD80 billion share placement to fund AI expansion

DIGITIMES — Mon, 24 Aug 2026 00:48:14 GMT

Alibaba Group Holding said it plans to raise HKD80 billion (US$10.2 billion) through the placement of newly issued shares to non-US investors outside the US, a move that could bolster its artificial intelligence ambitions and shape competition in global cloud and AI markets. The company said the proceeds would be used entirely to expand its AI capabilities and infrastructure.

India advances Wi-Fi mmWave FWA trial as Gemtek eyes 100x shipments

DIGITIMES — Mon, 24 Aug 2026 00:13:25 GMT

Gemtek has made new progress in its India-based Wi-Fi mmWave fixed wireless access (FWA) rollout after India's Telecommunication Engineering Centre (TEC), under the Department of Telecommunications (DoT), formally issued a Provisional Generic Requirement on August 14 for Wi-Fi technology in the licensed 26 GHz (n258) band. The standard, TEC 21150:2026, is seen as a boost for Gemtek's 5G mmWave FWA business in India.

AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

DIGITIMES — Sun, 23 Aug 2026 23:42:45 GMT

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint expects more than 130 million GPUs and AI ASICs to shift toward advanced-packaged on-compute memory over the next five years, as the industry braces for nearly US$2 trillion in compute revenue and an intensifying battle over packaging capacity.

Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

Joseph Chen — Sun, 23 Aug 2026 23:42:25 GMT

Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting from the fab to the materials that feed it.

AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030

Scarlett Yu — Sun, 23 Aug 2026 23:41:50 GMT

Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang's five-layer "cake."

AMRA expands robot testing standard to cover legged systems

DIGITIMES — Sun, 23 Aug 2026 23:41:27 GMT

The Autonomous Mobile Robot Alliance (AMRA), formed by Taiwan's Industrial Technology Research Institute and industry, academia, and research partners, has released a new standard that adds legged robots to its testing framework. The update aims to speed commercialization and deployment of autonomous mobile robots by giving manufacturers and buyers a unified way to assess performance across real-world environments.

India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test

DIGITIMES — Sun, 23 Aug 2026 23:40:36 GMT

India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer yields and labor rules to materials, equipment, rare earth magnets and emerging technologies, the country is expanding its ambitions as it seeks a deeper role in the global chip supply chain.

AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26

Scarlett Yu — Sun, 23 Aug 2026 23:40:11 GMT

The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability in the second quarter of 2026, as stronger demand for advanced materials drove sharp operating profit growth. With customers expected to expand capacity from 2027 onward, the sector could see another wave of revenue growth.

Xiaomi unveils second-generation humanoid robot at Beijing conference

DIGITIMES — Sun, 23 Aug 2026 23:39:47 GMT

Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first public appearance and performed gestures for attendees. The demonstration highlighted the company's latest push into humanoid robotics, with the robot able to follow live commands and recognize scenes through a large model.

Taiwan lifts 2027 tech budget, studies new TTA site in BSTP

DIGITIMES — Sun, 23 Aug 2026 23:39:29 GMT

Taiwan's Executive Yuan approved a larger 2027 technology budget of NT$229.2 billion (approx. US$7.2 billion), an increase of NT$25.9 billion from 2026, as the government also raised funding for the Ten Major AI Infrastructure Projects to NT$40.6 billion. The move came as Premier Cho said Taiwan Tech Arena (TTA) needs more space and asked the National Science and Technology Council to study a new TTA location in Beitou-Shilin Technology Park (BSTP).

Samsung DX hits first quarterly loss on chip inflation

Charlene Chen — Sun, 23 Aug 2026 23:39:08 GMT

Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit by chip inflation. Despite the worsening profitability, DX chief Tae-Moon Roh is responding with a strategy centered on expanding market share.

Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Lily Hess — Sun, 23 Aug 2026 23:38:39 GMT

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category is now moving toward a three-tier hardware architecture of the brain, cerebellum, and peripheral nerves. He said the shift is reshaping the market and setting the stage for rapid growth through 2030.

Galbot's fast rise marks new wave in China's humanoid robot race

Joseph Chen — Sun, 23 Aug 2026 23:38:13 GMT

Beyond established players such as Unitree Robotics, AgiBot and UBTech Robotics, a new wave of challengers is emerging quickly in China's humanoid robot sector. Among them is Galbot, which, despite being only three years old, closed a CNY2.5 billion (approx. US$350 million) funding round in March 2026 that lifted its post-money valuation above CNY20 billion. It is also the only embodied AI company that investor CATL has backed twice, and has vaulted into the first tier of China's humanoid robot makers.

MediaTek wins Google TPU deal on three key strengths

Charlene Chen — Sun, 23 Aug 2026 23:37:49 GMT

Taiwan's IC design industry is set to keep growing strongly in 2026, with revenue expected to rise 10%, driven mainly by companies involved in AI and AI ASIC projects such as MediaTek, Global Unichip Corporation (GUC), Alchip, Phison, and Silicon Motion, DIGITIMES analyst Jim Chien said.

Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory

Lily Hess — Sun, 23 Aug 2026 23:37:11 GMT

ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.

CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst

Lily Hess — Sun, 23 Aug 2026 23:36:41 GMT

Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August 20 at a semiconductor industry forum in Taipei. He said demand for AI cluster interconnects continues to expand, driving exponential growth in the output value of optical communications.

AI memory windfall: Samsung to hand back up to US$79 billion in 2026

DIGITIMES — Sat, 22 Aug 2026 01:38:49 GMT

Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest ever by a Korean firm.