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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Mon, 19 Oct 2026 01:05:06 GMT</lastBuildDate>
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<title>Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says</title>
<pubDate>Mon, 19 Oct 2026 01:04:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL201/nvidia-hbm-tsmc-samsung-3nm.html</link>
<description>Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC. Samsung Electronics, which has made every part of its HBM stacks in-house, has agreed after an internal review to use TSMC's 3nm process for the base die of NVHBM, Nvidia's next-generation custom HBM, the &lt;em&gt;Seoul Economic Daily&lt;/em&gt; reported on October 18, citing industry sources. The newspaper said it would be the first time the two companies have worked together at the HBM manufacturing stage.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands</title>
<pubDate>Mon, 19 Oct 2026 00:15:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL205/fab-packaging-launch-hardware-technology.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and infrastructure investments accelerating across the country's domestic technology ecosystem rapidly.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Semiconductor equipment demand rises as risks curb AI bubble</title>
<pubDate>Mon, 19 Oct 2026 00:14:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD237/semi-equipment-demand-fab-12-inch.html</link>
<description>SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However, Clark Tseng, senior director of market intelligence at SEMI, said external constraints involving funding, electricity, and politics are emerging as potential downside risks. He added that this could prevent the AI-driven expansion from overheating.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Lite-On showcases 800VDC power technology at Nvidia MGX event</title>
<pubDate>Mon, 19 Oct 2026 00:14:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD235/lite-on-nvidia-infrastructure-2026-data.html</link>
<description>Lite-On Technology was invited to participate in the Nvidia MGX Ecosystem Ceremony at the 2026 Open Compute Project (OCP) Global Summit, joining Nvidia and global ecosystem partners to highlight advances in AI infrastructure. During the OCP exhibition, Lite-On showcased its 800VDC Power Rack and 800V-to-50V Power Brick, underscoring its capabilities in next-generation AI power infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Lite-On Technology]]></media:description>
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<title>EU bet on minimum import prices risks repeating solar mistakes in EV battle</title>
<pubDate>Mon, 19 Oct 2026 00:13:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD236/solar-price-policy.html</link>
<description>From historic trade barriers targeting solar photovoltaics to current import restrictions on new energy vehicles, the minimum import price mechanism has once again surfaced as a core policy instrument. Western governments are using it to shield domestic markets from low-priced Chinese competition.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Sustainability</category>
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<title>ByteDance Seed launches AI safety team, global recruitment drive</title>
<pubDate>Mon, 19 Oct 2026 00:13:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD234/bytedance-testing-development-governance-competition.html</link>
<description>ByteDance's AI research unit Seed has established an Alignment &#38;amp; Preparedness department and is recruiting 10 researchers in Beijing, Shanghai, and San Jose, California, to focus on advanced-model safety, AI alignment, and emerging risks. The move underscores the growing importance of AI safety as competition expands beyond model capabilities, computing power, and product applications to governance and reliable large-scale deployment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Space solar outsourcing heats up as Taiwan targets non-SpaceX players</title>
<pubDate>Mon, 19 Oct 2026 00:12:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD230/solar-outsourcing-technology-taiwan-leo.html</link>
<description>As advances in aerospace technology lower the barriers to launching and building low-Earth orbit (LEO) satellites, emerging satellite operators worldwide are driving demand for outsourced space solar cells and modules. Supply-chain sources say the trend is creating new opportunities for Taiwan's solar industry beyond SpaceX, which is led by Tesla CEO Elon Musk.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>South Korea's TelePIX wins global satellite contracts, targets 2027 launch of AI-powered optical payload</title>
<pubDate>Mon, 19 Oct 2026 00:12:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD225/south-korea-ai-solutions-space-tech-2027.html</link>
<description>South Korean space AI solutions provider TelePIX is accelerating the development of high-resolution optical payloads and onboard AI technologies, with plans to launch its next-generation system into space for validation in 2027.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
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<title>Taiwan seeks international quantum collaboration in critical 5-year push</title>
<pubDate>Mon, 19 Oct 2026 00:11:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD213/taiwan-nstc-eu-quantum-computing.html</link>
<description>Taiwan's National Science and Technology Council (NSTC) has opened applications for the country's second five-year quantum technology program lasting from 2027 to 2031, with international collaboration being a main focus.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Shangjr Gwo, convener of the government task force Quantum Taiwan (L). Credit: DIGITIMES]]></media:description>
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<title>Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains</title>
<pubDate>Sat, 17 Oct 2026 18:39:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD215/manufacturing-equipment-packaging-testing-silicon.html</link>
<description>Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability, according to Zeng Yi Wong, assistant managing director for manufacturing at Enterprise Singapore (EnterpriseSG).</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>TSMC&#38;rsquo;s 3nm Kumamoto plan wins Japan&#38;rsquo;s approval, qualifying for up to $4.1 billion in aid</title>
<pubDate>Sat, 17 Oct 2026 09:59:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261017VL200/fab-tsmc-chips-kumamoto-production.html</link>
<description>Japan's Ministry of Economy, Trade and Industry (METI) on Oct. 16 approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3-nanometer logic chips at its second fab in Kumamoto Prefecture, on the southern island of Kyushu. 3nm is one of the most advanced chip processes in commercial production. The plan replaces the 6nm and 12nm production approved in February 2024.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>E Ink Kaleido 4 doubles color gamut, boosts contrast 50%</title>
<pubDate>Sat, 17 Oct 2026 00:09:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD241/e-ink-color-e-paper-display-technology-hanvon.html</link>
<description>E-paper giant E Ink Holdings has officially launched its next-generation color e-paper technology, E Ink Kaleido 4. Chinese e-reader brand Hanvon Technology is the first to adopt the display, integrating it into its second-generation M10C smart e-paper notebook, making it the world's first commercial device powered by Kaleido 4.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd241_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: E Ink Holdings]]></media:description>
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<title>CATL targets 70GWh in sodium-ion ESS orders with European push</title>
<pubDate>Sat, 17 Oct 2026 00:09:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD243/sodium-ion-catl-market-technology-shipments.html</link>
<description>Chinese battery giant CATL is deploying sodium-ion technology to expand into Europe's energy storage system (ESS) market. The company recently signed a strategic agreement with German system integrator Intilion to deploy up to 3GWh of energy storage projects over the next five years, drawing renewed market focus to the commercialization potential of sodium-ion batteries.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: CATL]]></media:description>
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<title>Taiwan Mask targets Japan's Kyushu chip expansion with US$4.75 million TCK acquisition</title>
<pubDate>Sat, 17 Oct 2026 00:08:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD244/taiwan-mask-acquisition-equipment-photomask-revenue.html</link>
<description>Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask manufacturing to equipment assembly and engineering support in Japan's growing Kyushu semiconductor market.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd244_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>XPeng's Paris push turns China's full-stack EV know-how into exportable AI engineering business</title>
<pubDate>Sat, 17 Oct 2026 00:07:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL212/xpeng-technology-automotive-vehicle-automakers.html</link>
<description>Chinese EV giant and AI mobility manufacturer XPeng has made a major appearance at the Paris Automotive Summit by bringing not just its automotive expertise into the European collaborative space, but a broader technology stack built on the automaker's existing strengths in EV manufacturing and humanoid robotics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016vl212_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: XPeng]]></media:description>
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<title>Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints</title>
<pubDate>Sat, 17 Oct 2026 00:07:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL216/equipment-semco-expansion-production-substrate.html</link>
<description>Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production for AI servers, as machinery manufacturers struggle with component shortages and longer delivery times. The South Korean company maintains that its investment is proceeding as planned. No production delay has been confirmed.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung Electro-Mechanics]]></media:description>
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<title>Tesla Roadster turns SpaceX rocket tech into halo product for Musk's physical-AI empire</title>
<pubDate>Sat, 17 Oct 2026 00:06:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL217/tesla-spacex-rocket-technology-vehicle.html</link>
<description>The engineering fusion of SpaceX and Tesla's flagship technologies is making a dramatic showcase through Tesla's next-generation Roadster reveal, held at SpaceX's McGregor, Texas test site on October 15.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Tesla]]></media:description>
</media:content></item>
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<title>TECO targets AI data center growth with energy storage, transformers</title>
<pubDate>Sat, 17 Oct 2026 00:06:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD201/teco-data-center-ess-taiwan.html</link>
<description>TECO Electric and Machinery participated in Energy Taiwan on October 14, showcasing its smart microgrid solutions and outlining the future development of its power and energy business group.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[TECO president Fei-yuan Kao. Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Singapore's AI bet shifts from model race to deployment, resilience and trusted adoption</title>
<pubDate>Fri, 16 Oct 2026 18:38:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261013VL211/singapore-ai-adoption-government-infrastructure.html</link>
<description>Singapore is moving its AI strategy beyond pilot-heavy experimentation toward a more deployment-focused model centered on enterprise adoption, sector transformation and resilient access to compute.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain</title>
<pubDate>Fri, 16 Oct 2026 17:53:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD238/semi-supply-chain-2035-ceo-taiwan.html</link>
<description>The semiconductor industry reached the US$1 trillion revenue milestone several years earlier than originally forecast, and with growth driven by AI and quantum computing, reaching US$2 trillion by 2035 is entirely achievable, SEMI President and CEO Ajit Manocha told &lt;em&gt;DIGITIMES&lt;/em&gt; in an exclusive interview at SEMICON West 2026.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Gemtek partners with Starman to make optical transceivers in US</title>
<pubDate>Fri, 16 Oct 2026 09:10:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD233/gemtek-equipment-partnership-production-manufacturing.html</link>
<description>On October 15, network equipment maker Gemtek Technology announced a strategic partnership with Starman New Photonics, a subsidiary of Starman Holdings, to form a joint venture in the US. The new entity will manufacture advanced optical transceivers to capture demand for optical interconnects driven by hyperscale AI data centers.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan to build industrial parks in US; Texas site already found</title>
<pubDate>Fri, 16 Oct 2026 09:08:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL218/taiwan-texas-industrial-government-tsmc.html</link>
<description>Taiwan plans to set up industrial parks in the US to help its supplier ecosystem reach customers like Nvidia and other local hardware manufacturers. It is starting with a complex in Texas, which has become a hotspot of expansion plans among Taiwanese tech companies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Project Bromo tests Europe's new industrial policy as Brussels weighs fast track for space champion</title>
<pubDate>Fri, 16 Oct 2026 09:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL213/europe-industrial-market-competition-airbus.html</link>
<description>The global space market has become increasingly dominated by SpaceX, while China continues to press forward with state-backed launch and satellite projects. That shift has sharpened Europe's concerns over strategic dependence and its relatively fragmented industrial base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AI-assisted illustration by DIGITIMES]]></media:description>
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<title>South Korea's September ICT Exports Surge Past US$75B on AI Demand</title>
<pubDate>Fri, 16 Oct 2026 08:39:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD242/exports-infrastructure-shipments-2026-growth.html</link>
<description>Driven by expanding global investments in artificial intelligence infrastructure, South Korea's ICT exports shattered previous records in September 2026. Shipments surged past the US$75 billion mark in a single month, anchored by semiconductor exports that topped US$60 billion, accounting for more than 80% of total ICT shipments.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI server tracker: semiconductor testing and design services rally on compute demand</title>
<pubDate>Fri, 16 Oct 2026 07:52:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL215/ic-testing-interface-ic-design-ai-server-demand-revenue-growth.html</link>
<description>Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial intelligence (AI), high-performance computing (HPC), and custom ASIC developments, both sectors demonstrated substantial year-over-year revenue gains as of September 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Telco giant builds Taiwan's high-speed computing network for AI agent era</title>
<pubDate>Fri, 16 Oct 2026 07:37:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD239/cht-president-data-infrastructure-governance.html</link>
<description>Chunghwa Telecom president Rong-shy Lin said the shift from conversational AI to autonomous AI agents is reshaping enterprise adoption, making data governance, access controls and accountability critical to deployment at scale.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>ASE unveils 18 advanced packaging projects with three universities</title>
<pubDate>Fri, 16 Oct 2026 07:26:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD240/ase-packaging-technology-materials-development.html</link>
<description>ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects on October 16, focusing on advanced packaging integration and the development of critical processes and materials.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ASE]]></media:description>
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<title>Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU</title>
<pubDate>Fri, 16 Oct 2026 07:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL206/gpu-amd-nvidia-startup-manufacturing.html</link>
<description>US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional rendering, challenging Nvidia and AMD in markets beyond AI acceleration.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bolt Graphics]]></media:description>
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<title>Samsung to break ground on second Texas chip fab in November</title>
<pubDate>Fri, 16 Oct 2026 07:01:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL214/samsung-texas-fab-expansion-production.html</link>
<description>Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its first facility prepares to begin operations by the end of the year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF</title>
<pubDate>Fri, 16 Oct 2026 06:57:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD214/samsung-sk-hynix-hbm-data-capacity.html</link>
<description>Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory (HBM) directly above graphics processors and SK Hynix advancing high-bandwidth flash (HBF) to expand memory capacity for AI inference.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
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<title>Delta says AI power gap will drive standalone microgrids</title>
<pubDate>Fri, 16 Oct 2026 06:31:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD238/delta-electronics-electricity-micro-grid-2026.html</link>
<description>Delta Electronics chairman Ping Cheng said at the 2026 Global Views Leaders Forum on October 15, 2026, that the world is entering an era of electrification, with AI data centers and EVs driving electricity demand beyond available supply. Delta is expanding its focus from power consumption to an integrated microgrid architecture spanning generation, transmission, distribution, energy storage and consumption, with solid oxide fuel cells (SOFCs) and solid-state transformers (SSTs) as its key products.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Taiwan forecasts 6.04% growth in 2027 on AI-driven exports</title>
<pubDate>Fri, 16 Oct 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD201/taiwan-growth-forecast-2027-2026.html</link>
<description>Taiwan's economy is projected to grow 6.04% in 2027 as expanding global AI-related capital spending boosts the island's exports, despite geopolitical conflicts and trade barriers weighing on global growth, Taiwan's National Development Council (NDC) Minister Yeh Chun-hsien said on October 15.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>FICG eyes 4x optical communications capacity by 2027</title>
<pubDate>Fri, 16 Oct 2026 06:08:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD231/fic-global-optical-communications-capacity-johor-production-2027.html</link>
<description>FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity. Chairman Leo Chien described the next three years as a "frenzied expansion period," with the company's Johor, Malaysia, facility set to increase capacity 4x by the end of 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Volvo Cars and Nvidia expand partnership on automated driving</title>
<pubDate>Fri, 16 Oct 2026 05:57:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PR201/volvo-nvidia-autonomous-driving-partnership-vehicle.html</link>
<description>Volvo Cars and Nvidia are expanding their partnership to develop automated-driving technology for future Volvo vehicles, with potential implications for drivers worldwide. The system is designed to handle highways, urban streets, and parking while gradually introducing eyes-off and mind-off driving, combining Volvo's safety expertise with Nvidia's sensors, computing, and software.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>Samsung's chip and device chiefs head to Tokyo during Lee's visit</title>
<pubDate>Fri, 16 Oct 2026 05:52:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL210/samsung-japan-packaging-materials.html</link>
<description>Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman Lee Jae-yong was visiting Japan, bringing together the company's three executive directors and key corporate decision-makers as it expands cooperation with Japanese semiconductor suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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