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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>DeepSeek engineer's warning suggests AI may reshape, not simply eliminate, technical work</title>
<pubDate>Thu, 17 Sep 2026 16:10:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD214/deepseek-development-design.html</link>
<description>&lt;p class="P1" data-start="1766" data-end="2086"&gt;A DeepSeek engineer's viral reflection on AI's rapid progress has reignited debate over whether artificial intelligence will replace human workers or redefine their roles. His comments suggest the immediate risk for software engineers may be less about layoffs and more about a swift shift in how technical work is done.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Winbond's Infineon buyout puts GigaDevice under pressure</title>
<pubDate>Thu, 17 Sep 2026 16:08:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD221/infineon-winbond-gigadevice-acquisition-2027.html</link>
<description>&lt;p class="P1" data-start="2498" data-end="2674"&gt;Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand</title>
<pubDate>Thu, 17 Sep 2026 10:24:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917RS400/automotive-soc-accelerator-autonomous-driving-demand-efficiency.html?chid=2</link>
<description>End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Physical AI</category>
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<title>AMD pivots to China developer ecosystems as Nvidia retreats</title>
<pubDate>Thu, 17 Sep 2026 09:59:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD233/nvidia-amd-high-end-software-accelerator.html?chid=10</link>
<description>&lt;p class="P1" data-start="2867" data-end="3235"&gt;As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>East Asia</category>
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<title>SK Hynix looks beyond HBM as inference workloads diversify</title>
<pubDate>Thu, 17 Sep 2026 09:27:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL225/sk-hynix-hbm-data-capacity-cost.html</link>
<description>SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix showcased PIM, HBF and SALT-KV technologies at AI Infra Summit 2026 in Santa Clara. Credit: SK Hynix]]></media:description>
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<title>Asia's healthcare AI moves from trials to real-world deployment</title>
<pubDate>Thu, 17 Sep 2026 09:18:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL223/healthcare-taiwan-asia-medical-acer-medical.html</link>
<description>At a healthcare AI forum in Wonju on Thursday, September 17, speakers from Taiwan and China argued that AI for hospitals must be built for local patients, local languages, and local clinical guidelines.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications</title>
<pubDate>Thu, 17 Sep 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD229/deloitte-taiwan-robot-industrial-data.html</link>
<description>Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial systems, industry and research leaders said at a Deloitte Taiwan seminar in Taichung on September 15.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<title>Trumpf eyes glass as AI demand drives packaging innovation</title>
<pubDate>Thu, 17 Sep 2026 08:32:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL220/packaging-demand-laser-expo-chips.html</link>
<description>At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser solutions to advanced chip packaging, specifically for drilling holes in glass substrates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung bets on zHBM as 2.5D memory nears its limits</title>
<pubDate>Thu, 17 Sep 2026 08:25:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL221/samsung-hbm-accelerator-dram-data.html</link>
<description>Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung illustrates the shift from 2.5D to 3D memory integration at SEMICON Taiwan 2026. Credit: Sherri Wang]]></media:description>
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<title>Topview sees supply-chain shifts supporting orders as AI investment reshapes its outlook</title>
<pubDate>Thu, 17 Sep 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD205/2026-surveillance-production-equipment-component.html</link>
<description>Topview Optronics said shifts tied to artificial intelligence are helping it secure orders through the end of 2026, even as it continues to contend with memory shortages and rising component costs. The surveillance equipment maker said it is accelerating its adoption of AI and smart factory technology, and expects only slight full-year growth in 2026 compared with 2025.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>CXMT cashes in on the DRAM shortage &#38;mdash; and takes aim at HBM</title>
<pubDate>Thu, 17 Sep 2026 08:19:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL219/cxmt-dram-hbm-supply-chain-emerging-memory.html</link>
<description>ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to expand into LPDDR6 and high-bandwidth memory (HBM) while China's domestic memory supply chain moves further upstream.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership</title>
<pubDate>Thu, 17 Sep 2026 08:11:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD225/tsmc-equipment-12-inch-taiwan-itri.html</link>
<description>TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology Council (NSTC) has not yet approved the related 2027 budget. NSTC Minister Cheng-Wen Wu said the partnership with Taiwan Semiconductor Research Institute (TSRI) and ITRI EOSL remains unchanged, although the location has shifted.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Memory LTAs lock up 50-70% of capacity</title>
<pubDate>Thu, 17 Sep 2026 07:51:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD213/capacity-demand-2026-2027-market.html</link>
<description>The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from three to five years, with many in the industry expecting 2027 to be the tightest year yet. Supply chain sources said Kioxia has about 50% of its LTA capacity tied up, while South Korea's two major vendors reserve about 70% of capacity for LTAs. Micron also has around 60% of its capacity locked into such agreements.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table</title>
<pubDate>Thu, 17 Sep 2026 07:34:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD220/jensen-huang-nvidia-ceo-policy-manufacturing.html</link>
<description>The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects how deeply the AI sector has become intertwined with US-China technology rivalries and domestic manufacturing policies.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<item>
<title>VLEO emerges as next orbital frontier as China warns of critical 2026&#38;ndash;2030 window</title>
<pubDate>Thu, 17 Sep 2026 07:13:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD214/2026-startup-technology.html</link>
<description>&lt;p class="P1" data-start="1753" data-end="1833"&gt;Very low Earth orbit (VLEO) is moving from concept toward real-world deployment.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20260916pd214_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Kreios Space]]></media:description>
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<item>
<title>Humanoid robots could reshape MEMS demand as physical AI advances</title>
<pubDate>Thu, 17 Sep 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD202/mems-demand-sensor-adoption-market.html</link>
<description>Humanoid robots have not yet reached mass adoption, but their sensor needs are already reshaping supply-chain expectations worldwide. Analysts and industry players say the next wave of physical AI could lift demand for MEMS chips, edge computing, and advanced sensing, with broader implications for robotics makers, component suppliers, and global technology markets. Industry players say these systems need several times more sensors than conventional robots, creating a large opportunity for MEMS and sensor suppliers even if unit revenue per robot stays relatively modest.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity</title>
<pubDate>Thu, 17 Sep 2026 06:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD223/sigurd-ardentec-siph-testing-capacity.html</link>
<description>The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance amplifier (TIA) testing as AI data-center networks shift toward faster optical interconnects. Ardentec and Sigurd are among the firms benefiting as a major US customer rushes to reserve capacity.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Tier IV open-sources self-driving AI chip design to challenge Nvidia</title>
<pubDate>Thu, 17 Sep 2026 06:12:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD205/nvidia-autonomous-driving-ai-chip-design-chips.html</link>
<description>&lt;p class="P1" data-start="3533" data-end="3852"&gt;Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open source, allowing semiconductor manufacturers to use them to develop autonomous driving chips. The company aims to break Nvidia's dominant position in the autonomous driving chip market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer</title>
<pubDate>Thu, 17 Sep 2026 05:49:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL217/huawei-infrastructure-2026-data-performance.html</link>
<description>&lt;p class="P1" data-start="2742" data-end="2970"&gt;Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with a petabyte-scale key-value (KV) cache system designed for AI agents and long-context inference.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
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<title>Wiwynn sees strong AI demand offsetting US data center pushback</title>
<pubDate>Thu, 17 Sep 2026 05:14:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD207/wiwynn-demand-growth-revenue-2026.html</link>
<description>&lt;p class="P1" data-start="2184" data-end="2535"&gt;Wiwynn's top executive said demand for artificial intelligence infrastructure is likely to keep the server maker on a strong growth path through the next several years, even as US opposition to data centers builds. The company is still expanding aggressively in North America, citing customer pressure, record revenue, and an improving margin profile.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades</title>
<pubDate>Thu, 17 Sep 2026 05:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD239/samsung-galaxy-flagship-smartphone-camera-display.html</link>
<description>Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate that the newly added Galaxy S27 Pro will substantially narrow the specification gap with the Ultra model. Both high-end smartphones are expected to share top-tier features, including 60W wired fast charging, a 200-megapixel main camera, and the latest M16 OLED display. Samsung will continue to use telephoto cameras, screen sizes, battery capacities, and S Pen support to differentiate the models, establishing a new "dual high-end flagship" hierarchy.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China optical suppliers power smart glasses supply chain</title>
<pubDate>Thu, 17 Sep 2026 04:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD216/smart-glasses-supply-chain-meta-market-2026.html</link>
<description>China's optical suppliers are playing a growing role in the global smart glasses, VR, and AR supply chain as AI glasses demand accelerates worldwide. Industry sources say more than 80% of smart glasses suppliers are from China, with Chinese vendors covering key areas from camera modules and light waveguides to microelectromechanical systems (MEMS) and batteries.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Samsung expands SRAM, IP to speed chip development</title>
<pubDate>Thu, 17 Sep 2026 04:30:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD219/samsung-ip-development-sram-design.html</link>
<description>&lt;p class="P1" data-start="3308" data-end="3737"&gt;Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster AI chip refresh cycles push customers to demand stronger process competitiveness, faster development, and better-prepared infrastructure including IP. Samsung is responding by expanding memory design options, IP, and development tools through its Samsung Advanced Foundry Ecosystem (SAFE) program.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns</title>
<pubDate>Thu, 17 Sep 2026 04:29:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL205/production-electronics-infrastructure-demand-manufacturing.html</link>
<description>&lt;p class="P1" data-start="2404" data-end="2555"&gt;Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Why Taiwan's tech needs better storytelling to win global capital</title>
<pubDate>Thu, 17 Sep 2026 04:26:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD216/taiwan-ceo-itri.html</link>
<description>Taiwan has demonstrated its strong R&#38;amp;D and innovative capabilities in tech, but the challenge remains in propelling these technologies to global markets. In the opinion of Edison Awards CEO Frank Bonafilia, Taiwan is not lacking in innovation, but the real hurdles lie in securing capital and backing from major investment banks, and building partnerships with major global firms to commercialize and scale up Taiwan-developed technologies.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects</title>
<pubDate>Thu, 17 Sep 2026 04:13:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD233/fit-foxconn-subsidiary-communications-2026.html</link>
<description>&lt;p class="P1" data-start="1908" data-end="2358"&gt;Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale: The Next Frontier in Data Center Interconnects," bringing together global leaders from the optical communications, AI, and semiconductor industries to examine the next generation of AI connectivity across light sources, materials, photonics, network architecture, manufacturing, and the broader industry ecosystem.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Foxconn Interconnect Technology chairman Sidney Lu (L) and Foxconn chairman Young Liu. Credit: DIGITIMES]]></media:description>
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<title>Taiwan readies ETS pilot as overseas expansion drives demand</title>
<pubDate>Thu, 17 Sep 2026 04:12:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD236/taiwan-tcx-germany-technology.html</link>
<description>&lt;p class="P1" data-start="3557" data-end="3925"&gt;Taiwan is developing an emissions trading scheme (ETS) alongside its carbon fee system, with the Ministry of Environment planning to issue a pilot-plan draft by the end of 2026 and targeting a pilot launch in 2028 to align with international systems. Minister Chi-Ming Peng said the pilot will cover 20 companies and 126 factories, and participation will be voluntary.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan to pilot ETS by end-2026, experts urge three safeguards</title>
<pubDate>Thu, 17 Sep 2026 04:12:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD234/taiwan-launch-market-net-zero-2026.html</link>
<description>&lt;p class="P1" data-start="4750" data-end="5046"&gt;Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor and technology manufacturers align with international systems. Ministry of Environment adviser and former deputy environment minister Wen-Chen Shih said the ETS design must address three key areas.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Sustainability</category>
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<media:content url="https://img.digitimes.com/newsshow/20260916pd234_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet</title>
<pubDate>Thu, 17 Sep 2026 04:09:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL215/huawei-ascend-2026-roadmap-accelerator.html</link>
<description>Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual accelerators. Huawei said the system is the industry's first supernode to adopt NPO and is designed to support large-scale training and inference for models with up to 10 trillion parameters.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Huawei's deputy chairman of the Board and rotating chairman, David Wang. Credit: Huawei]]></media:description>
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<title>20 of China's OSATs push into advanced packaging amid EUV curbs</title>
<pubDate>Thu, 17 Sep 2026 04:07:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL207/packaging-euv-equipment-osat-development.html</link>
<description>China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's largest outsourced semiconductor assembly and test (OSAT) suppliers to specialist packaging houses and chiplet startups, increasingly targeting AI and high-performance computing (HPC).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>iPhone 18 Pro preorders rise up to 20% in Taiwan as foldable Duo debuts</title>
<pubDate>Thu, 17 Sep 2026 04:04:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD217/apple-iphone-foldable-smartphone-taiwan.html</link>
<description>Apple's iPhone 18 Pro and Pro Max are emerging as the main drivers of Taiwan's premium smartphone upgrade cycle, with preorder demand running ahead of last year despite the debut of the company's first foldable iPhone, iPhone Duo. Data Express, an Apple specialist retailer, said on September 16 that the Pro models remain the preferred choice among consumers, while the foldable device is creating a new source of interest in the premium segment.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20260917pd217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Data Express General Manager Li-jung Huang. Credit: DIGITIMES]]></media:description>
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<title>China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat</title>
<pubDate>Thu, 17 Sep 2026 03:59:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD212/panel-lcd-taiwan-display-lcd-panel.html</link>
<description>China's top three liquid-crystal display (LCD) panel makers have sent written price-increase notices to customers for the first time, as Taiwan's leading panel makers sell factories and China tightens its grip on the global market. With South Korea and Japan already out of the thin-film-transistor LCD (TFT-LCD) market, China now controls more than 70% of LCD TV and monitor panel share, creating an effective oligopoly.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>FIT ramps up optical interconnect push as AI race shifts to connectivity</title>
<pubDate>Thu, 17 Sep 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260916PD244/fit-data-communications-development-2026.html</link>
<description>At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus is shifting from simply pursuing greater computing power to improving the overall efficiency of data centers. He said the key to the next 10 years of AI lies not only in chips and computing performance, but also in whether data can flow smoothly within data centers and across different systems through faster, more stable, and more efficient connectivity.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>SK Hynix weighs US memory options as buyers lock in 2027 supply</title>
<pubDate>Thu, 17 Sep 2026 03:54:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL208/sk-hynix-2027-intel-investment-hbm.html</link>
<description>SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
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<title>Samsung reportedly starts Tesla chip trial production at Taylor fab</title>
<pubDate>Thu, 17 Sep 2026 03:51:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917VL212/samsung-production-tesla-fab-2nm.html</link>
<description>&lt;p class="P1" data-start="3078" data-end="3307"&gt;Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving the US fab into 2nm wafer production and yield verification ahead of full-scale operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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