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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<title>Intel puts CPU-GPU coordination at center of agentic AI strategy</title>
<pubDate>Thu, 24 Sep 2026 01:37:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260924VL205/intel-data-cpu-training-2026.html</link>
<description>Intel is positioning closer coordination between CPUs, GPUs and other computing resources as a key requirement for the next phase of AI, as agentic AI shifts workloads from model inference toward complex task execution.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus</title>
<pubDate>Thu, 24 Sep 2026 00:20:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL218/nvidia-ascend-huawei-beijing-hardware.html</link>
<description>Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Industrial software giants race to build industry world models</title>
<pubDate>Thu, 24 Sep 2026 00:19:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD231/software-industrial-chatgpt-manufacturing-adoption.html</link>
<description>While generative AI has surged into mainstream consumer use thanks to ChatGPT, the adoption of AI across industrial sectors has progressed at a much slower pace. Industry analysts point out that the primary culprit is the tendency of current AI architectures to "hallucinate," a fatal vulnerability in manufacturing environments where there is no tolerance for error. As industrial AI development cannot rely on large language models (LLMs) alone, attention is rapidly shifting toward industry world models that anchor AI systems in the laws of physics. Recognizing this pivot, global industrial software giants are already aggressively positioning themselves in this space.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Powertech targets quarterly growth in 2026, eyes record high</title>
<pubDate>Thu, 24 Sep 2026 00:18:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD237/2026-powertech-growth-packaging-revenue.html</link>
<description>&lt;p class="P1" data-start="2110" data-end="2584"&gt;Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end through-silicon via (TSV) DDR5 production in the fourth quarter of 2026 to drive sequential growth throughout 2026 and lift revenue to a new record. Its Taiwan fan-out panel-level package (FOPLP) line, already booked by Advanced Micro Devices (AMD), is set to add revenue from 2027 and open another growth chapter for both sales and profit.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>AUO unveils EPS 2030 blueprint linking sustainability to business value</title>
<pubDate>Thu, 24 Sep 2026 00:17:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD232/auo-eps-2030-retail-growth.html</link>
<description>&lt;p class="P1" data-start="3482" data-end="3874"&gt;AUO has set out its EPS 2030 sustainability goals, expanding beyond factory energy saving and carbon reduction to applications including smart mobility, smart healthcare, smart retail, smart manufacturing, and low-carbon digital transformation. The company outlined 31 sustainability targets in total and said it has already achieved all 10 of its 2025 EPS goals, with a 100% completion rate.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Sustainability</category>
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<title>GMI AI compute leasing business sells out in US as big users lock in long contracts</title>
<pubDate>Thu, 24 Sep 2026 00:16:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD213/gmi-technology-electronics-business-2026-technology.html</link>
<description>&lt;p class="P1" data-start="2319" data-end="2666"&gt;GMI Technology, a Taiwan-based electronics component distributor and application solutions provider, said its AI computing rental business is booming, with strong demand from US technology companies for computing power. The company said large users tend to secure computing capacity through long-term contracts, leaving the market short of supply.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<title>SK Hynix Indiana HBM plant faces lawsuit</title>
<pubDate>Thu, 24 Sep 2026 00:16:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD230/sk-hynix-hbm-lawsuit-production-bandwidth.html</link>
<description>&lt;p class="P1" data-start="2232" data-end="2572"&gt;SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race for AI memory capacity intensifies. Local residents in the US are seeking to overturn a land-use change and halt construction, with a trial scheduled for December 2026 and the case drawing market attention.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Trump-Xi pre-summit watch: China charts a sovereignty-first path for frontier AI</title>
<pubDate>Thu, 24 Sep 2026 00:15:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL219/donald-trump-xi-jinping-data-beijing-infrastructure.html</link>
<description>When Donald Trump and Xi Jinping discuss artificial intelligence, the deeper divide may not be over whether AI needs rules, but over what those rules are designed to protect.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>OUCC sees semiconductor chemical shipments ramping up in 2027</title>
<pubDate>Thu, 24 Sep 2026 00:15:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD216/shipments-2027-revenue-capacity-2026.html</link>
<description>Oriental Union Chemical Corporation (OUCC) expects shipments of semiconductor chemicals to ramp up in 2027 as more products complete customer qualification, with the Taiwan-based chemical maker targeting electronic chemicals to account for 10% of revenue by 2028.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use</title>
<pubDate>Thu, 24 Sep 2026 00:14:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD229/microsoft-technology-anthropic-chips-cost.html</link>
<description>&lt;p class="P1" data-start="1663" data-end="2154"&gt;Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity tool into deeper uses in core business workflows. In addition to token consumption and model costs, Microsoft Taiwan general manager Sean Pien points out that corporations are also examining how AI actually benefits workflows and innovation, making return-on-investment (ROI) evaluations harder to judge solely on the basis of time or labor savings.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>ASRock Industrial's game-streaming win signals longer revenue tail, but supply risks remain</title>
<pubDate>Thu, 24 Sep 2026 00:14:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD209/asrock-revenue-2027-component-demand.html</link>
<description>&lt;p class="P1" data-start="1476" data-end="1820"&gt;ASRock Industrial has secured a large North American game-streaming services project that could extend well into 2027, according to chairman James Lee. The industrial PC maker said the deal supports a long-term customer deployment, even as component shortages, rising prices, and staged ordering continue to cloud the near-term revenue picture.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[ASRock Industrial chairman James Lee (R) and president Handsome Tseng (L). Credit: DIGITIMES]]></media:description>
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<title>LSTC links with Rapidus to revive Japan's advanced chipmaking</title>
<pubDate>Thu, 24 Sep 2026 00:13:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD204/lstc-rapidus-design-technology-talent.html</link>
<description>&lt;p class="P1" data-start="2362" data-end="2694"&gt;Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans to mass-produce 2-nanometer chips in 2027, to advance next-generation semiconductor research and talent development and give Japan a unique edge in the global race for advanced process technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO</title>
<pubDate>Thu, 24 Sep 2026 00:13:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD236/amd-intel-openvino-2025-on-device-ai.html</link>
<description>&lt;p class="P1" data-start="5885" data-end="6125"&gt;Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after another, a wave of "keeping lobsters" began to emerge around on-device AI models paired with AI agents.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>US, China diverge on AI guardrails ahead of Trump-Xi summit</title>
<pubDate>Wed, 23 Sep 2026 09:26:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL220/development-technology-ceo.html</link>
<description>&lt;p class="P1" data-start="3032" data-end="3371"&gt;The US and China are moving toward different models for governing increasingly capable artificial intelligence, even as the US proposes a limited safety mechanism with China ahead of President Donald Trump and Chinese President Xi Jinping's September 24 summit in Washington. AI is expected to be among the issues discussed at the meeting.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SKC raises Absolics stake to 82% as glass substrates remain in testing</title>
<pubDate>Wed, 23 Sep 2026 09:07:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL216/absolics-testing-investment-glass-substrate-subsidiary.html</link>
<description>SKC is increasing its investment in its US glass substrate subsidiary Absolics, raising its stake to more than 82%, as the South Korean materials group commits more capital to a business that remains in customer evaluation and testing ahead of volume production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Absolics' embedded glass substrate packaging concept. Credit: SKC]]></media:description>
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<title>Engineering over panic: Jensen Huang's pragmatic vision for the future of AI</title>
<pubDate>Wed, 23 Sep 2026 08:53:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD235/jensen-huang-nvidia-ceo-commercial.html</link>
<description>&lt;p class="P1" data-start="2869" data-end="3126"&gt;In a 46-minute interview on CBS, Nvidia CEO Jensen Huang pushed back against apocalyptic warnings regarding artificial intelligence (AI). He urged the industry to focus on rigorous engineering and safe product delivery rather than apocalyptic fearmongering.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: CBS]]></media:description>
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<item>
<title>Vivo launches camera monitor accessory, stoking panel demand</title>
<pubDate>Wed, 23 Sep 2026 08:46:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD238/vivo-monitor-camera-panel-flagship.html</link>
<description>Vivo officially unveiled its new flagship X500 series smartphones in Shanghai on September 21, along with wearable accessories including smartwatches and earphones. The X500 series is positioned around a broader push to extend image capture from still photography into video recording and content creation. Vivo has further integrated its hardware and software imaging functions, and is now testing whether the camera monitor can become a standard accessory for high-end imaging phones.&lt;br /&gt; &lt;br /&gt;&lt;iframe src="https://www.youtube.com/embed/5MZ3Gutr7QQ#youtubeoptions" width="640" height="360" frameborder="0" class="youtube" allowfullscreen="allowfullscreen" scrolling="no"&gt;&lt;/iframe&gt;</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
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<title>Foxtron maps overseas expansion as customers seek full EV line-up</title>
<pubDate>Wed, 23 Sep 2026 08:10:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD233/foxtron-expansion-market-poland-new-zealand.html</link>
<description>&lt;p class="P1" data-start="2216" data-end="2677"&gt;Foxtron Vehicle Technologies said its overseas expansion is taking shape as exports to New Zealand and Australia enter their final countdown, with a planned Poland factory with ElectroMobility Poland also drawing attention. On September 22, Foxtron Chairman Andy Lee said Europe's strict emissions rules and strong environmental awareness make it a key electric vehicle (EV) market, while localization and shared platforms are central to the company's strategy.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<title>With Xi's Washington visit incoming, trade data show how the tariff war has reshaped US-China tech flows</title>
<pubDate>Wed, 23 Sep 2026 08:04:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL217/war-data-xi-jinping-donald-trump-2026.html</link>
<description>&lt;p class="P1" data-start="2654" data-end="3102"&gt;When Chinese President Xi Jinping meets US President Donald Trump at the White House on September 24, trade will be the most measurable front of their rivalry. Since the first Section 301 tariffs took effect in July 2018, US imports of Chinese technology hardware have fallen sharply. Rare earth magnets are the exception: Washington cannot easily replace them, which gives Beijing leverage as the one-year Busan truce nears its November 10 expiry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>YMTC wins German injunctions against Micron in latest round of NAND patent battle</title>
<pubDate>Wed, 23 Sep 2026 07:59:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD226/micron-ymtc-patent-germany-europe.html</link>
<description>Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement. Industry sources said enforcement of the injunctions could restrict Micron's supply in Germany and reshape the European automotive and industrial-control NAND market.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Automotive display growth shifts to HUDs, passenger screens</title>
<pubDate>Wed, 23 Sep 2026 07:33:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD241/growth-automotive-display-display-panel-market.html</link>
<description>&lt;p class="P1" data-start="2789" data-end="3284"&gt;The global automotive display market is entering a new phase of growth, with demand shifting away from central consoles and instrument clusters toward niche applications such as head-up displays (HUDs) and front-passenger entertainment panels. DIGITIMES Intelligence analyst Jason Yang said the global automotive display shipment compound annual growth rate (CAGR) is expected to reach only about 2.4% from 2026 to 2031, but HUDs and entertainment panels will grow 14.4% and 17.9%, respectively.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<title>LG Electronics, Microsoft enter partnership on AI data centers, physical AI</title>
<pubDate>Wed, 23 Sep 2026 07:24:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL215/microsoft-lg-electronics-partnership-data-lg.html</link>
<description>LG Electronics entered a partnership with Microsoft to cooperate on a range of AI initiatives. The two firms agreed to work together on AI data centers, LG Electronics' AI data transformation, and physical AI as the company known for appliances taps into growing AI-related industries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: LG Electronics' LinkedIn]]></media:description>
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<title>Samsung Display explores halftone black PDL tech to cut OLED production costs</title>
<pubDate>Wed, 23 Sep 2026 07:17:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL214/sdc-production-manufacturing-flagship-samsung.html</link>
<description>&lt;p class="P1" data-start="2236" data-end="2640"&gt;Samsung Display is evaluating a new manufacturing process known as halftone black pixel definition layer (PDL) that could streamline the production of its OLED panels, industry sources disclosed to &lt;em data-start="2434" data-end="2444"&gt;The ELEC&lt;/em&gt; on September 22. By integrating two separate manufacturing steps into a single photolithography process, the display maker aims to reduce costs and boost efficiency for upcoming flagship devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform</title>
<pubDate>Wed, 23 Sep 2026 07:13:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PR200/samsung-mobile-qualcomm-snapdragon-efficiency.html</link>
<description>AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning its new LPDDR6 as a response, with higher bandwidth, lower power use, and improved reliability for next-generation on-device AI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Qualcomm and Google eye Agentic AI, expand partnership to GoogleBook, automotives</title>
<pubDate>Wed, 23 Sep 2026 07:06:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD224/qualcomm-google-2026-snapdragon-partnership.html</link>
<description>During his keynote at Snapdragon Summit 2026, Qualcomm President and CEO Cristiano Amon invited Rick Osterloh, Senior Vice President of Platforms and Devices at Google, on stage to discuss the past year's developments in agentic AI and the strategic direction of their ongoing partnership. Amon emphasized that Google remains an indispensable partner to Qualcomm, noting that the relationship&#38;mdash;built on co-developing the industry's first Android smartphone&#38;mdash;has grown even stronger amid the broader AI transformation.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration</title>
<pubDate>Wed, 23 Sep 2026 07:02:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL211/packaging-capacity-investment-2026-testing.html</link>
<description>&lt;p class="P1" data-start="2442" data-end="2741"&gt;Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ifeng]]></media:description>
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<title>China's BeiDou eyes US$150 billion industry scale with AI, services at the core</title>
<pubDate>Wed, 23 Sep 2026 06:47:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD228/beidou-chips-data-2025-hardware.html</link>
<description>&lt;p class="P1" data-start="2102" data-end="2504"&gt;China's BeiDou satellite navigation industry continues to expand rapidly, with applications spreading from chips and modules to end devices. Emerging technologies including artificial intelligence are increasingly being integrated with BeiDou, while the industry is shifting from hardware sales towards data, platforms, and services. Overseas markets are also emerging as a key source of future growth.</description>
<dc:creator>Levi Li</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>ZDT prices US$800M ECB to expand AI server PCB push</title>
<pubDate>Wed, 23 Sep 2026 06:40:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD227/pcb-zhen-ding-convertible-bond-high-end-development.html</link>
<description>&lt;p class="P1" data-start="2075" data-end="2497"&gt;Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on September 22, raising a total of US$800 million (about NT$25.224 billion). The company plans to issue the bonds on September 29 and list them on the Singapore Exchange, with proceeds to be used entirely to replenish working capital and support technology development for high-end products.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Hotai expands MaaS push with FunNow stake</title>
<pubDate>Wed, 23 Sep 2026 06:33:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD225/alliance-taiwan-partnership-growth-2023.html</link>
<description>&lt;p class="P1" data-start="1661" data-end="1997"&gt;Hotai Motor said it will invest in lifestyle and entertainment booking platform FunNow to deepen its mobility-as-a-service (MaaS) ecosystem. The company plans to inject US$10 million (about NT$318 million) for an approximately 10% stake, while also launching a deep strategic partnership between its ChicTrip travel platform and FunNow.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Taiwan's Master Bus scales 450 kW direct-drive motor for the intercity EV market</title>
<pubDate>Wed, 23 Sep 2026 06:27:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD221/master-trans-taiwan-general-motors-production-2027.html</link>
<description>&lt;p class="P1" data-start="123" data-end="253"&gt;Master Transportation Bus Manufacturing (Master Bus) is deepening its electric-bus strategy around proprietary motors and chassis.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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<title>Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon</title>
<pubDate>Wed, 23 Sep 2026 06:24:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD218/development-taiwan-dassault-performance-data.html</link>
<description>&lt;p class="P1" data-start="2658" data-end="2842"&gt;Taiwanese tire maker Cheng Shin Rubber, best known for its Maxxis brand, is nearing its 60th anniversary and using AI and digital twins to compete in a faster-moving automotive market.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Cheng Shin Rubber CIO Justin Chen (R), CTO Ping-hao Chen (L), and Dassault Syst&#38;#232;mes SIMULIA CEO Michelle Ash (C). Credit: DIGITIMES]]></media:description>
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<title>Hermes-Epitek eyes CPO test revenue in 2027</title>
<pubDate>Wed, 23 Sep 2026 06:14:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923PD223/chairman-cpo-revenue-2027-testing.html</link>
<description>&lt;p class="P1" data-start="3600" data-end="3906"&gt;Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives. The company outlined a major push into silicon photonics (SiPh) co-packaged optics (CPO) testing and said related revenue is expected to begin contributing in 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>LG Energy enters Nvidia's ecosystem as it pivots batteries to data centers</title>
<pubDate>Wed, 23 Sep 2026 05:57:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL213/lg-nvidia-data-market-certification.html</link>
<description>LG Energy's battery energy storage system (BESS) has entered Nvidia's AI Factory ecosystem. Its qualification by the chipmaker comes as LG Energy is reorienting its North American battery plants toward data centers and appears poised to capture fresh demand after the US imposed restrictions on Chinese battery imports.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>DeepSeek, Moonshot, the hidden cost of routing China's AI through Claude</title>
<pubDate>Wed, 23 Sep 2026 05:53:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL212/deepseek-claude-moonshot-data-anthropic.html</link>
<description>&lt;p class="P1" data-start="3721" data-end="4007"&gt;China's internet regulator is reportedly investigating DeepSeek and Moonshot AI over allegations that the two companies routed millions of user interactions, including potentially sensitive government and corporate information, to Anthropic's Claude models without customers' knowledge.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Hygon takes China's CPU ambitions beyond servers, into physical AI</title>
<pubDate>Wed, 23 Sep 2026 05:48:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260923VL207/cpu-industrial-processor-data-embedded.html</link>
<description>&lt;p class="P1" data-start="4476" data-end="4728"&gt;China's Hygon Information Technology is extending its processor ambitions beyond servers and data centers with the launch of its first embedded industrial CPU family, targeting robotics, machine vision, smart manufacturing, and other edge AI workloads.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Hygon]]></media:description>
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