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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Huawei's Aito M9 turns the luxury SUV into a rolling AI platform</title>
<pubDate>Sat, 30 May 2026 23:53:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528VL211/huawei-vehicle.html</link>
<description>In aerodynamics, the Aito M9 underwent more than 100 engineering refinements, achieving a drag coefficient of just 0.249 Cd &#38;mdash; among the lowest ever recorded for a full-size sport utility vehicle.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Yageo eyes AI liquid-cooling dealmaking, targets protection components</title>
<pubDate>Sat, 30 May 2026 23:53:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528PD222/yageo-taiwan-chairman-technology-market.html</link>
<description>Yageo chairman Pierre Chen, who has become Taiwan's richest man, reiterated at the company's recent shareholders meeting that the group will not sit out opportunities in the AI applications market. He said Yageo will continue its long-running merger-and-acquisition strategy to drive transformation, raise product technology levels, and expand its full-spectrum integrated solutions.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Silicon Motion lays out AI-focused storage roadmap for edge, enterprise and automotive</title>
<pubDate>Sat, 30 May 2026 23:53:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD207/silicon-motion-automotive-embedded-ssd-controller-infrastructure.html</link>
<description>Silicon Motion Technology (SMI) has released a portfolio of AI-optimized storage controllers and products ahead of Ccmputex 2026, targeting edge inference, AI PCs, enterprise AI infrastructure and automotive AI systems. The company said it will demonstrate new Edge SSD controllers, embedded UFS and eMMC controllers, enterprise NVMe solutions and automotive-grade storage aimed at improving data movement, latency and sustained workload performance for AI deployments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI demand and chip investment lift Taiwan exports and business outlook</title>
<pubDate>Sat, 30 May 2026 23:53:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD203/taiwan-outlook-demand-business-investment.html</link>
<description>Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development Council (NDC) said on May 28. The council reported gains in both its leading and coincident business climate indicators, signaling steady growth momentum for the island's export-oriented economy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>60% of smart factories underperform as South Korea expert eyes tacit knowledge for manufacturing AX</title>
<pubDate>Sat, 30 May 2026 23:52:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD211/manufacturing-data-smart-factory-technology-competitiveness.html</link>
<description>South Korea is treating AI transformation as a future test of manufacturing competitiveness. The challenge now is not only installing smart systems, but converting frontline workers' tacit knowledge into standardized data that machines can use. For global industries, the outcome could shape how factories raise quality, productivity, and resilience.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Pentagon funding talks put US drone startups on wartime footing</title>
<pubDate>Sat, 30 May 2026 23:52:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529VL208/military-drone-funding-usa-production-capacity-low-cost.html</link>
<description>The Trump administration is in talks to provide funding to several US drone companies, in a move that would mark a stronger federal push to expand domestic drone manufacturing and reduce the cost of battlefield systems that have become central to modern warfare.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[US President Donald Trump listens as Defense Secretary Pete Hegseth speaks at a White House cabinet meeting on May 27, 2026. Credit: AFP]]></media:description>
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<title>Winbond accelerates custom memory transition</title>
<pubDate>Sat, 30 May 2026 23:52:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD248/winbond-capacity-market-demand-taiwan.html</link>
<description>Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply shortage. He expects the current shortage will be difficult to ease in the near term, and said capacity constraints might not be resolved until the second half of 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan Mobile sets sights on NT$1 trillion revenue as AI and enterprise services drive growth</title>
<pubDate>Sat, 30 May 2026 23:51:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD242/revenue-twm-growth-technology-expansion.html</link>
<description>Taiwan Mobile outlined plans to pursue a NT$1 trillion (US$31.88 billion) revenue target as it shifts emphasis to AI, enterprise services, and new technology businesses, executives said after the company's shareholders' meeting on May 29. Shareholders approved the 2025 financial report and a cash dividend of about NT$4.8 per share, while leadership framed the push into AI-enabled enterprise solutions as the next stage of growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Nan Ya Plastics targets three new business pillars to lift electronic materials to 60% by 2026</title>
<pubDate>Sat, 30 May 2026 23:51:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD236/nan-ya-plastics-materials-2026-business-revenue.html</link>
<description>Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas &#38;mdash; medical materials, semiconductor materials, and comprehensive power solutions &#38;mdash; as part of a broader transformation planned for 2026 and 2027. Chairman Chia-Chau Wu said the move aims to raise the share of electronic materials in group revenue from just over 50% today to about 60% by 2026, driven by demand from AI infrastructure and high-performance computing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>LinkerBot deal brings AI bionic hands closer to mass market</title>
<pubDate>Sat, 30 May 2026 23:51:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528VL214/china-robotics-technology-production.html</link>
<description>LinkerBot, a leading Chinese developer of robotic dexterous hands, has acquired Jingling Zhikang in a strategic move that could push AI-powered bionic hands from high-cost rehabilitation devices into a broader assistive technology market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Sohu]]></media:description>
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<title>Nvidia, Microsoft and Arm hint at 'new era of PC' ahead of Computex</title>
<pubDate>Sat, 30 May 2026 23:51:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260531PD202/nvidia-arm-microsoft-pc-computex.html</link>
<description>Nvidia, Microsoft and Arm posted identical messages on X on Friday, each displaying the words "A New Era of PC" alongside the geographic coordinates of Taipei &#38;mdash; a coordinated tease that has sent the market speculating about what the three companies plan to announce at Computex 2026, which opens next week.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>ICT</category>
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<title>E Ink to unveil color e-paper platforms and large-format signage at Computex 2026</title>
<pubDate>Sat, 30 May 2026 03:54:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD202/e-ink-color-e-paper-2026-signage-retail.html</link>
<description>E Ink Holdings said it will showcase multiple color e-paper technologies and complete solutions at Computex 2026, presenting products aimed at outdoor and indoor advertising, smart retail and product-surface design. The exhibit will open around a premium shopping mall theme to demonstrate how e-paper can be applied across spatial and object surfaces for retail media networks and commercial signage.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AUO Micro LED CPO enters sampling stage</title>
<pubDate>Sat, 30 May 2026 03:54:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD218/auo-cpo-optics-technology-growth.html</link>
<description>AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical communication modules as a future driver of revenue and profits.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Xpeng plays the long game: South Korea on hold, Europe in sight</title>
<pubDate>Sat, 30 May 2026 00:37:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529VL216/manufacturing-expansion-europe-tesla-zeekr.html</link>
<description>Xpeng Motors, often described as "China's Tesla," is advancing on two very different international fronts &#38;mdash; cautious and measured in South Korea, but increasingly strategic in Europe &#38;mdash; while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI server testing firm Wendell prepares IPO for high-power lab unit on surging rack equipment demand</title>
<pubDate>Sat, 30 May 2026 00:37:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260527PD243/ai-server-testing-equipment-ipo-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="293"&gt;Wendell Industrial Co. held its 2026 annual shareholders' meeting on May 26, where chairman Kao Chih-hung said shareholders approved a proposal for its subsidiary, Wendell Electrical Testing, to apply for an IPO. The plan is expected to be carried out in the fourth quarter or in 2027.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Wendell Industrial chairman Kao Chih-hung. Credit: DIGITIMES]]></media:description>
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<title>Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU</title>
<pubDate>Fri, 29 May 2026 23:53:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260530VL200/manufacturing-intel-mou-packaging-glass-substrate.html</link>
<description>India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Ashwini Vaishnaw's X]]></media:description>
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<title>AI boom strains optical supply chain as Nvidia, Corning expand fiber output</title>
<pubDate>Fri, 29 May 2026 23:33:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260527VL218/nvidia-corning-supply-chain-data-chips.html</link>
<description>The global AI boom is pushing supply-chain pressure beyond memory chips and CPUs into optical communications, creating shortages across a less visible but increasingly critical layer of data-center infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Corning]]></media:description>
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<title>Innolux turns to packaging, smart cockpits in higher-margin push</title>
<pubDate>Fri, 29 May 2026 23:32:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528PD214/innolux-packaging-2026-technology-automotive.html</link>
<description>Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: Innolux]]></media:description>
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<title>Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing</title>
<pubDate>Fri, 29 May 2026 23:31:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528VL218/spacex-ipo-chips-manufacturing-design.html</link>
<description>SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Pegatron Chairman says Taiwan's AI rally has not yet peaked</title>
<pubDate>Fri, 29 May 2026 23:31:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528PD240/pegatron-ai-stock-market-taiwan.html</link>
<description>As Taiwan's equity markets continue to surge on enthusiasm surrounding artificial intelligence (AI), concerns about a potential AI-driven bubble have grown louder among investors and analysts.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>'You're so rich now': Jensen Huang toasts Taiwan supply chain partners as Vera Rubin ramp begins</title>
<pubDate>Fri, 29 May 2026 23:31:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD249/nvidia-rubin-jensen-huang-taiwan-supply-chain-production.html</link>
<description>At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Samsung, SK Hynix trail Micron as automotive memory demand rises</title>
<pubDate>Fri, 29 May 2026 23:19:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260527VL213/samsung-automotive-sk-hynix-micron-demand.html</link>
<description>Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Micron]]></media:description>
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<title>TSMC's test arm Xintec ramps wafer testing capacity for 2H26 growth</title>
<pubDate>Fri, 29 May 2026 18:47:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD214/testing-packaging-tsmc-csp-capacity.html</link>
<description>Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Google-backed robot startup tests E Ink electronic paper for humanoid skin</title>
<pubDate>Fri, 29 May 2026 17:48:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528PD239/e-ink-e-paper-humanoid-robot-display-technology.html</link>
<description>The humanoid robotics industry is looking beyond mechanical structures for its next wave of innovation, with materials emerging as a potential focus for new market opportunities. A Google-backed humanoid robot startup is exploring electronic paper as a next-generation display technology for robot skin, with Taiwan-based E Ink Holdings (EIH) entering the supply chain.</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: Apptronik]]></media:description>
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<title>Analysis: Who's who at the trillion-dollar feast&#38;mdash; Jensen Huang's Taipei dinners map AI's supply chain</title>
<pubDate>Fri, 29 May 2026 16:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529VL219/jensen-huang-taiwan-ceo-taipei-tsmc.html</link>
<description>When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X &#38;mdash; night markets, fried food, and family. By the time he hosted more than 30 executives at a brick-walled restaurant six days later, the week had traced something much larger than a Computex schedule. It had mapped, dinner by dinner and post by post, the anatomy of the world's most consequential AI supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>'Hardware is sexy again': Plug and Play CEO says AI boom has finally fulfilled his 2006 semiconductor dream</title>
<pubDate>Fri, 29 May 2026 16:17:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528VL228/pnp-summit-ai-infrastructure-silicon-valley-startup.html</link>
<description>The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication plant here in Sunnyvale, California, employing 8,000 people at its peak. Then, like much of America's chip manufacturing base, it moved to Asia &#38;mdash; to Taiwan, to Korea, to the supply chains that would come to define the global electronics industry for the next three decades.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Commentary: Five trends that stood out at Plug and Play's Silicon Valley May Summit</title>
<pubDate>Fri, 29 May 2026 09:11:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260528VL225/silicon-valley-trends-taiwan-technology-data-center.html</link>
<description>Three days at Plug and Play's Silicon Valley May summit left me with a clear takeaway: the technology industry is undergoing a structural shift, not just another hype cycle. Here are the five trends that stood out from the conversations, keynotes, and startup pitches I observed on the ground.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging</title>
<pubDate>Fri, 29 May 2026 07:38:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD219/china-resources-power-semiconductors-plp-packaging-hpc.html</link>
<description>Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Airoha deepens focus on networking and wireless edge AI</title>
<pubDate>Fri, 29 May 2026 07:25:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD232/airoha-edge-ai-chips-wireless-infrastructure-development.html</link>
<description>Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Tariff relief tips the scales toward Taiwan over SEA in US auto parts sourcing</title>
<pubDate>Fri, 29 May 2026 07:24:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD216/taiwan-automakers-asia-worldwide.html</link>
<description>The US has formally reduced tariffs on Taiwan-made auto parts shipped to the country, a move that could reshape sourcing decisions for automakers and suppliers worldwide. The change lowers landed costs for US buyers, strengthens Taiwan's price position against Southeast Asia, and may redirect more orders to Taiwanese manufacturers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<title>Foxconn to break ground on France chip-packaging plant, pursues Africa sovereign-AI</title>
<pubDate>Fri, 29 May 2026 07:18:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD244/foxconn-france-plant-africa-chairman.html</link>
<description>Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Compal accelerates server push with Texas plant and aims for 40% non-PC revenue</title>
<pubDate>Fri, 29 May 2026 07:16:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD237/compal-ai-server-texas-plant-revenue-2026.html</link>
<description>Compal Electronics said it was scaling up its server business and expects server revenue to reach 8-10% of total sales in 2026 as AI server rack-scale systems ramp and a new Texas plant begins operations in the second half. The company reported that server sales rose to 5% of revenue in the first quarter of 2026 from less than 1% previously, driven by a shift from printed circuit board (PCB) assembly to rack-level and full-system solutions that increase revenue per project.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity</title>
<pubDate>Fri, 29 May 2026 07:11:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD246/arm-taiwan-cybersecurity-investment-design.html</link>
<description>Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>MediaTek weighs price hikes, reaffirms TSMC partnership</title>
<pubDate>Fri, 29 May 2026 07:10:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529PD234/mediatek-tsmc-price-2026-outlook.html</link>
<description>MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 2026.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>BYD unveils 4nm autonomous driving chip, expanding 'God's Eye' intelligent driving strategy</title>
<pubDate>Fri, 29 May 2026 07:06:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260529VL205/byd-4nm-technology-launch-vehicle.html</link>
<description>On May 28, BYD held a major technology launch event to strengthen consumer trust in intelligent driving and accelerate adoption of its three-tier "God's Eye" assisted-driving system &#38;mdash; a push that comes as the world's largest EV maker faces mounting price competition, slowing domestic demand, and declining profitability.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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