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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Taiwan's September export orders jump 62.4% on AI demand</title>
<pubDate>Wed, 21 Oct 2026 01:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021PD201/taiwan-moea-2026-growth-data.html</link>
<description>Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic Affairs (MOEA) on October 20. After seasonal adjustment, orders rose 1.1%. Compared with September 2025, export orders increased US$42.87 billion, or 62.4%, while growth in New Taiwan dollar terms reached 69.5%.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>Nvidia's Vera CPU signals a broader shift in AI infrastructure</title>
<pubDate>Wed, 21 Oct 2026 00:45:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021PD218/nvidia-cpu-infrastructure-gpu-component.html</link>
<description>Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for fast serial processing. The company says CPU resources are gaining importance alongside GPUs, while declining GPU-to-CPU ratios signal a potential redesign of AI computing architectures.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T</title>
<pubDate>Wed, 21 Oct 2026 00:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021PD206/semco-packaging-2027-2026-silicon.html</link>
<description>Samsung Electro-Mechanics (SEMCO) has signed a long-term supply agreement worth KRW360.487 billion (approximately US$260 million) with a major global company for memory packaging substrates, with shipments scheduled to begin in 2027. The company did not disclose the customer or specific application, but the deal expands its long-term contract coverage from multilayer ceramic capacitors (MLCCs) and silicon capacitors into substrates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Contrel, FSE combine laser and plasma processes for advanced packaging</title>
<pubDate>Wed, 21 Oct 2026 00:37:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021PD203/contrel-laser-packaging-high-end-dual-core.html</link>
<description>Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing. The companies' solutions span key processes from surface treatment and residue removal to laser trimming, debonding, grooving, and cutting.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan promotes Hsinchu science-park model to Mexico and Poland</title>
<pubDate>Wed, 21 Oct 2026 00:36:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021PD214/taiwan-mexico-poland-development-investment.html</link>
<description>Taiwan is promoting its science-park development model as Mexico's Sonora state and Poland explore partnerships to attract investment and build industrial hubs. The effort could shape how regions worldwide develop global supply chains by combining research, manufacturing, infrastructure, talent, and sustainability, while Taiwan's companies seek opportunities beyond established overseas clusters.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain</title>
<pubDate>Wed, 21 Oct 2026 00:35:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL220/substrate-pcb-supply-chain-wistron-hpc.html</link>
<description>Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board integration becomes a growing technical bottleneck, industry executives said at IMPACT 2026 in Taipei.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Robot hands get cheaper, but factories still want proof</title>
<pubDate>Wed, 21 Oct 2026 00:35:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL216/industrial-robotics-hardware-2026-hyundai.html</link>
<description>Competition among Chinese suppliers is driving down prices for dexterous robotic hands, but cheaper hardware has yet to resolve a bigger challenge for humanoid developers: proving that multi-finger systems can perform industrial tasks reliably and at a competitive cost.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Tesollo's dexterous robotic hand demonstrates object manipulation as suppliers seek to expand industrial applications. Credit: Tesollo]]></media:description>
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<title>Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles</title>
<pubDate>Wed, 21 Oct 2026 00:35:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL209/catl-battery-swap-infrastructure-vehicle-business.html</link>
<description>Chinese battery giant CATL is giving its battery-service business a distinctive boost through a three-party battery-swapping agreement linking Huawei-affiliated Yinwang Intelligent Technology, CATL, and CATL's battery-swapping subsidiary, Contemporary Amperex Energy Service Technology (CAES).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Foreign suppliers stand to gain first as India's chemical makers chase Tata's chip fab</title>
<pubDate>Wed, 21 Oct 2026 00:34:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL208/india-commercial-fab-materials-production.html</link>
<description>India's first commercial chip fab is opening a long-awaited new market for the country's chemical makers, but the companies best placed to profit in the near term are Japanese, South Korean, and European materials suppliers that already have the purification know-how and customer trust that chipmakers demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Amazon open-sources TorchNeuron to bridge PyTorch, AWS Trainium</title>
<pubDate>Wed, 21 Oct 2026 00:34:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PR202/amazon-hardware-aws-adoption-software.html</link>
<description>To lower AI hardware adoption barriers and offer alternative compute choices, Amazon has announced TorchNeuron&#38;mdash;a native backend allowing existing PyTorch code to run directly on AWS Trainium chips with minimal code changes. The tool enters public beta under the Apache 2.0 open-source license today at the PyTorch Conference North America.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Japan plans JPY400 billion boost for Rapidus 2nm push</title>
<pubDate>Wed, 21 Oct 2026 00:33:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD240/rapidus-2nm-2027-government-investment.html</link>
<description>Japan plans to provide an additional JPY400 billion (US$2.5 billion) to support Rapidus' advanced semiconductor production between fiscal 2027 and fiscal 2029, as the government seeks to achieve mass production of 2nm chips in fiscal 2027. Japan's Ministry of Economy, Trade and Industry (METI) presented the latest policy on October 19, according to reports from Reuters, &lt;em&gt;Nikkei Asia&lt;/em&gt;, and &lt;em&gt;BigGo Finance&lt;/em&gt;. The funding would be provided as an industrial investment between April 2027 and March 2030.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>SpaceX returns to operating profit in 3Q26; Super Intelligence revenue overtakes Connectivity</title>
<pubDate>Wed, 21 Oct 2026 00:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021VL200/spacex-revenue-operating-profit-business-starlink.html</link>
<description>SpaceX's third quarter of 2026 reshaped the business. Its Super Intelligence (SI) segment, the compute and AI unit previously reported as Artificial Intelligence, generated more revenue than the Starlink-led Connectivity segment, reversing the previous quarter's order, and the group posted an operating profit after losses in each of the four preceding quarters. The quarter also showed what the shift costs: capital spending again ran ahead of revenue, and most of it went into compute.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>AI infrastructure faces four hurdles: Power, construction, technology, funding</title>
<pubDate>Tue, 20 Oct 2026 17:01:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD238/funding-semicon-west-2026-infrastructure-outlook.html</link>
<description>At last week's SEMICON West 2026 industry outlook forum, research firms said investment in US AI data centers continues to accelerate, but the industry still faces multiple hurdles before it can turn demand into operational computing capacity. Constraints now extend beyond chips to power and the grid, construction speed, immature technologies, and funding pressure behind capital spending, all of which could slow expansion.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Musk and Anthropic test rival models for sharing AI wealth with the public</title>
<pubDate>Tue, 20 Oct 2026 16:01:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL217/anthropic-spacex-technology-infrastructure.html</link>
<description>The advent of artificial intelligence (AI) is best understood as revolutionary in modern society, transforming industries and reshaping daily life as successive rounds of rapid growth push AI deeper into nearly every aspect of social and economic activity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Unimicron chairman sees substrate sizes reaching 14x current scale by 2030</title>
<pubDate>Tue, 20 Oct 2026 10:09:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD247/unimicron-substrate-tpca-2026.html</link>
<description>TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling. Advanced packaging and heterogeneous integration technologies must be introduced in parallel, significantly raising the technical requirements for the PCB and substrate industries.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Jensen Huang urges Germany to embrace physical AI at Berlin summit</title>
<pubDate>Tue, 20 Oct 2026 09:22:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD246/nvidia-germany-jensen-huang-berlin-manufacturing.html</link>
<description>German Chancellor Friedrich Merz and Nvidia CEO Jensen Huang urged German businesses to embrace AI at an industry summit in Berlin on October 19, aiming to revive the economy and modernize industry. Huang specifically called on Germany's automotive and industrial machinery sectors to adopt physical AI by leveraging the country's extensive manufacturing data and expertise.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>Samsung eyes six foldables for 2027, including a rollable phone</title>
<pubDate>Tue, 20 Oct 2026 09:09:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD245/samsung-galaxy-2027-foldable-smartphone-foldable.html</link>
<description>Samsung Electronics is reportedly planning its largest-ever foldable smartphone lineup in 2027, expanding the Galaxy Z series to as many as six models. The broader portfolio, alongside improvements in battery performance, thickness, and weight, could accelerate foldable adoption beyond its current niche-market status.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
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<title>Japan's MMX mission launches successfully, gains edge over China in race for first Mars system sample return</title>
<pubDate>Tue, 20 Oct 2026 09:05:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD234/jaxa-rocket-launch.html</link>
<description>Japan has successfully launched a spacecraft bound for the moons of Mars, gaining an early advantage over China in the international race to become the first country to return samples from Mars or its satellites.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<title>Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities</title>
<pubDate>Tue, 20 Oct 2026 09:05:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD244/production-liquid-cooling-2026-plant-growth.html?chid=10</link>
<description>Global Tek Industrial held an opening ceremony on the 20th for its Super Smart Manufacturing Park in Chonburi, Thailand. Spanning 177,600 square meters, the facility is the group's largest single production base. Having entered trial production in the third quarter of 2026, the plant will expand beyond existing automotive orders to incorporate high-value-added products such as AI liquid cooling and aerospace components, fulfilling customer demand for non-China supply chains.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Southeast Asia</category>
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<title>Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking</title>
<pubDate>Tue, 20 Oct 2026 08:58:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL221/intel-ban-fcc-robot-security.html</link>
<description>Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates, which could hinder its ability to produce semiconductors in the US. The request comes after the US banned imports of foreign-made robots in July.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Chief Telecom starts NT$3.3 billion AI data center in Taiwan</title>
<pubDate>Tue, 20 Oct 2026 08:51:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD243/chief-telecom-data-center-taiwan-infrastructure-capacity.html</link>
<description>Chief Telecom broke ground on a new AI data center at the Central Taiwan Science Park on the 20th, committing approximately NT$3.3 billion (US$101.7 million) to a facility expected to begin operations in the second half of 2028. The project is intended to extend the company's data center growth, as its Lianyun AI Intelligent Data Center is projected to reach full capacity in 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Wistron Medical Technology and Chang Gung University expand AI elder-care training</title>
<pubDate>Tue, 20 Oct 2026 08:48:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD242/wistron-training-technology-partnership-university.html</link>
<description>Wistron Medical Technology and Chang Gung University of Science and Technology signed a memorandum of understanding at the university's Linkou campus to advance an AI-enabled training program for the aging and health industries. The partnership will combine industry expertise with academic resources to address rising demand for smart health, digital health and elder-care capabilities as societies move toward super-aged populations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI server demand lifts Tongtai drilling orders through 2027</title>
<pubDate>Tue, 20 Oct 2026 08:02:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD241/tongtai-demand-2027-ai-server-pcb.html</link>
<description>Tongtai Machine &#38;amp; Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure on high-end board production. The Taiwan-based machine tool maker presented its latest solutions at the Taiwan Printed Circuit Association Show 2026, highlighting CCD high-precision drilling machines and an unmanned drilling-station system for AI server boards and IC substrates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>US firms eye Malaysia to diversify rare earth supply chains</title>
<pubDate>Tue, 20 Oct 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL219/technology-investment-competition-edge.html</link>
<description>More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to secure supplies of critical minerals.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AUO selects glass substrate specs for semiconductor processes, not size rivalry</title>
<pubDate>Tue, 20 Oct 2026 07:38:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD237/auo-substrate-lcd-packaging-osat.html</link>
<description>AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman and CEO Paul Peng. The company aims to leverage its glass-processing expertise to supply critical components and technologies to outsourced semiconductor assembly and test (OSAT) leaders such as ASE Technology Holding and Powertech Technology.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan anchors US chip revival, SEMICON West spotlights trusted partners</title>
<pubDate>Tue, 20 Oct 2026 07:08:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD231/taiwan-semicon-west-2026-investment-equipment.html</link>
<description>SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting Taiwan as a critical partner in rebuilding US semiconductor manufacturing. Taiwan's role spans investment, process technology, supply-chain expertise, and talent development.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>AI servers drive TVS and ESD demand for Yea Shin Tech</title>
<pubDate>Tue, 20 Oct 2026 06:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD239/demand-esd-capacity-power-components-eris-tech.html</link>
<description>AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Thermaltake expands AI workstation lineup on edge AI demand</title>
<pubDate>Tue, 20 Oct 2026 06:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD232/thermaltake-workstation-gaming-market-revenue.html</link>
<description>Thermaltake is targeting the growing edge AI market with a new workstation lineup. Chairman Kenny Lin said the company has transformed from a gaming components maker into an AI PC and workstation systems provider. The company plans to launch three product lines in the second half of 2026 and aims for AI-related products to contribute 5% to 10% of revenue in 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives</title>
<pubDate>Tue, 20 Oct 2026 06:40:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL218/samsung-cxmt-dram-hbm4.html</link>
<description>Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position while China's ChangXin Memory Technologies (CXMT) expands capacity and attracts attention from US tech companies seeking alternative DRAM suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>BYD's China EV battery market share slips as overseas installations surge 66.5%</title>
<pubDate>Tue, 20 Oct 2026 06:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD229/byd-market-share-ev-battery-power-battery-data.html</link>
<description>BYD is facing declining market share in China's domestic electric vehicle (EV) battery market, even as its overseas business continues to expand, highlighting a growing divergence between its domestic and international performance.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
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<title>Daeduck Electronics targets 2029 ceramic substrates for AI packaging</title>
<pubDate>Tue, 20 Oct 2026 06:33:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD235/substrate-packaging-development-production-performance.html</link>
<description>South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029, with ceramic cores serving as a material alternative to glass cores for next-generation large-area packages.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Genius Electronic Optical partners with 3M on EBO development</title>
<pubDate>Tue, 20 Oct 2026 06:31:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD236/3m-gseo-partnership-production-optical-components.html</link>
<description>Genius Electronic Optical (GSEO), a leading manufacturer of optical lenses and precision optical components, has entered into a strategic partnership with 3M to develop, manufacture and expand production capacity for 3M's Expanded Beam Optical (EBO) solutions. As part of the deal, 3M will invest NT$4.8 billion (US$147.1 million) through a private placement and is expected to complete the transaction in the fourth quarter of 2026.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump</title>
<pubDate>Tue, 20 Oct 2026 06:21:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL213/revenue-ai-chip-demand-earnings-growth.html</link>
<description>China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and AI computing chips. Yet slower quarterly growth, mounting R&#38;amp;D expenditure and a steep share-price correction have highlighted the gap between the company's operating performance and market expectations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Powertip Technology transitions into a solutions provider as demand and costs rise</title>
<pubDate>Tue, 20 Oct 2026 06:06:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020PD233/powertip-technology-design-demand-manufacturing-2026.html</link>
<description>Powertip Technology is transitioning from a module design and supply company to a solutions provider. The company has seen rising demand in the first half of 2026 as the electronics and manufacturing industries faced higher material costs, which it aims to control by negotiating price adjustments with its customers. Although such negotiations are difficult due to intense market competition, the company notes that failure to deal with the situation properly could impact future operations; similar circumstances previously occurred during the pandemic.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>South Korea's US$1.66 billion humanoid robot push puts auto suppliers in focus</title>
<pubDate>Tue, 20 Oct 2026 06:00:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL215/south-korea-humanoid-robot-investment-automotive-2026.html</link>
<description>South Korean automotive and machinery component makers are among 12 companies identified in a KRW2.2 trillion (approx. US$1.66 billion) private investment plan to develop a domestic humanoid robot supply chain in Daegu, as the region seeks to turn its automotive manufacturing base into a source of actuators, motors and other robot components.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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