<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Tue, 27 Oct 2026 19:00:03 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Jensen and Musk both think aging GPUs are worth more than the books show</title>
<pubDate>Tue, 27 Oct 2026 09:35:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD237/nvidia-gtc-gpu-tesla-berlin.html</link>
<description>Speaking at GTC Berlin and on SpaceX's third-quarter 2026 earnings call, respectively, Nvidia CEO Jensen Huang and Tesla CEO Elon Musk reached a rare consensus on a pivotal topic: GPUs are no longer rapidly depreciating consumables. Instead, their effective operational lifespans far exceed initial market expectations.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD237/nvidia-gtc-gpu-tesla-berlin.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd237_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>Tesla sees Cybercab becoming a new growth bet amid declining auto revenue</title>
<pubDate>Tue, 27 Oct 2026 09:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD241/tesla-revenue-vehicle-automotive-2026.html</link>
<description>Tesla's automotive business weakened in the third quarter of 2026 as lower average vehicle prices and battery shortages pressured revenue and profit, while the company accelerated investment in artificial intelligence and its autonomous vehicle strategy. Total revenue was flat, automotive revenue fell 3% year-over-year to US$20.56 billion, and net income declined 4% to US$1.7 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD241/tesla-revenue-vehicle-automotive-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd241_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Australia's AI build-out hits the grid: how a delayed power line wiped out AUD3 billion</title>
<pubDate>Tue, 27 Oct 2026 09:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD243/data-center-forecast-2027-revenue-development.html</link>
<description>Australia's push to become an AI infrastructure hub for the Asia-Pacific is running into constraints that capital alone cannot solve: the last mile of grid connection, and the consent of the communities that power lines run through. That shift became clear this month when NextDC, one of the country's largest data center operators, cut its fiscal 2027 revenue forecast and reduced capital spending after a power connection delay at its Melbourne M3 facility, a project that already had a hyperscale customer under contract.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD243/data-center-forecast-2027-revenue-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd243_files/5_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Chinese EVs push imported models ahead of South Korean vehicles</title>
<pubDate>Tue, 27 Oct 2026 09:04:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD242/market-2026-automobile-sales.html</link>
<description>Imported electric vehicles captured more than half of South Korea's new electric passenger-car registrations during the first nine months of 2026, marking the first time the share of domestically made models fell below that threshold. About 258,000 new electric passenger cars were registered from January through September, with imported vehicles accounting for 51.3%, or approximately 132,000 units, according to data from the Korea Automobile Manufacturers Association cited by &lt;em&gt;Money Today&lt;/em&gt; and &lt;em&gt;Seoul Economic Daily&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD242/market-2026-automobile-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd242_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Pat Gelsinger warns AI compute efficiency must jump 10,000x amid power, memory, and fab constraints</title>
<pubDate>Tue, 27 Oct 2026 09:01:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD236/silicon-valley-expansion-taiwan-efficiency-wafer.html</link>
<description>Silicon Valley venture capital firm Playground Global has returned to Taiwan alongside a cohort of portfolio companies specializing in memory, power management, optical communications, and advanced packaging to showcase joint technical breakthroughs and commercial strategies. The firm is also hosting an executive dinner with Foxconn Chairman Young Liu, highlighting their deep-seated partnership and ongoing commitment to Taiwan's technology ecosystem.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD236/silicon-valley-expansion-taiwan-efficiency-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd236_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Nvidia DSX POD challenges traditional AI data center construction</title>
<pubDate>Tue, 27 Oct 2026 08:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD235/nvidia-gtc-berlin-data-center-investment.html</link>
<description>At its GTC conference in Berlin, Nvidia discussed the RTX Spark notebook, various implementations and partnerships involving physical AI, AI agents, and CUDA-X, as well as the DSX POD and European sovereign AI. Following its recently announced additional US$2 billion investment, Nvidia has committed nearly US$10 billion to Europe's technology ecosystem. The company said that building Europe's AI economy will require the region not only to consume AI, but also to produce it.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD235/nvidia-gtc-berlin-data-center-investment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd235_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Infineon and ASMedia team up on end-to-end USB 20Gbps setup for AI cameras</title>
<pubDate>Tue, 27 Oct 2026 08:58:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL225/asmedia-usb-infineon-partnership-adoption.html</link>
<description>Infineon Technologies and ASMedia have announced a partnership to speed up the adoption of 20Gbps USB, driven by demand from machine-learning cameras and other physical AI devices that need to move large amounts of data quickly.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL225/asmedia-usb-infineon-partnership-adoption.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl225_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>JIMTOF 2026 draws 94 Taiwan machine tool exhibitors</title>
<pubDate>Tue, 27 Oct 2026 07:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD228/taiwan-manufacturing-2026-automation-technology.html</link>
<description>One of the world's three major machine tool shows, Japan's International Machine Tool Fair (JIMTOF 2026), opened this week, with 94 Taiwan companies exhibiting. The exhibitors are showcasing precision machining, key components and smart automation while deepening manufacturing supply-chain cooperation between Taiwan and Japan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD228/taiwan-manufacturing-2026-automation-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd228_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Anthropic IPO filing shows the US govt is trying to be frontier AI's customer and gatekeeper</title>
<pubDate>Tue, 27 Oct 2026 07:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL220/anthropic-ipo-commercial-technology.html</link>
<description>Anthropic's IPO filing does more than outline the economics of a rapidly scaling AI company. Its risk disclosures show frontier AI developers becoming increasingly exposed to governments that act not only as regulators, but also as customers, procurement authorities, export-control gatekeepers and national-security actors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL220/anthropic-ipo-commercial-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl220_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>AI spending surges, Microsoft opens exit door to 60,000 employees</title>
<pubDate>Tue, 27 Oct 2026 06:54:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD223/microsoft-workforce-investment-business-2026.html</link>
<description>Microsoft launched a time-limited Voluntary Exit Offer (VEO) for approximately 60,000 employees in the US, Canada, the UK and India, as the software and cloud provider reshapes its workforce around rising investment in artificial intelligence. The offer applies to eligible employees in participating teams at Level 70 and below and covers about one-quarter of Microsoft's global workforce of approximately 223,000 employees as of the end of June 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD223/microsoft-workforce-investment-business-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd223_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>SoftBank eyes US$50B Malaysia AI data-center expansion</title>
<pubDate>Tue, 27 Oct 2026 06:51:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD222/investment-ceo-infrastructure-technology-masayoshi-son.html</link>
<description>SoftBank Group founder and CEO Masayoshi Son has selected investment sites in Malaysia and plans to invest US$50 billion in technology, Malaysian Prime Minister Anwar Ibrahim said. Following investments in the US and Europe, the group is expanding its AI infrastructure strategy into Asia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD222/investment-ceo-infrastructure-technology-masayoshi-son.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd222_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>AI data centers drive cooling, power, modular infrastructure demand</title>
<pubDate>Tue, 27 Oct 2026 06:46:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL218/data-center-infrastructure-cooling-ai-server-demand.html</link>
<description>As AI server computing density and server rack power consumption rise, data center construction must also take into account cooling, power distribution, energy management, and electromechanical infrastructure. In light of these trends, the 2026 Taiwan Industry Week trade show features a dedicated section for data centers, with Auras Technology, Walrus Pump, and Teco Electric and Machinery among the exhibitors, a sign that AI data center-related opportunities are expanding to other segments of the industrial supply chain.</description>
<dc:creator>Ysi Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL218/data-center-infrastructure-cooling-ai-server-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl218_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers</title>
<pubDate>Tue, 27 Oct 2026 06:33:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL217/anthropic-ipo-data-infrastructure-capacity.html</link>
<description>Anthropic's IPO filing reveals an infrastructure strategy extending far beyond conventional cloud procurement, as the Claude developer locks in hundreds of billions of dollars of compute capacity across Google, Amazon, Microsoft, Broadcom, and a growing roster of GPU infrastructure providers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL217/anthropic-ipo-data-infrastructure-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl217_files/5_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>PSMC capacity crunch holds back Jeju Semiconductor's growth</title>
<pubDate>Tue, 27 Oct 2026 06:00:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL221/capacity-psmc-growth-manufacturing-wafer.html</link>
<description>South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth as strong memory demand drives up prices and manufacturing costs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL221/capacity-psmc-growth-manufacturing-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Jeju Semiconductor]]></media:description>
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<title>Server CPU shipments to exceed 50 million units in 2027; AMD's server CPU revenue will surpass Intel</title>
<pubDate>Tue, 27 Oct 2026 05:56:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261021RS400/ai-server-cpu-shipments-2027-intel-amd-arm-architecture.html?chid=2</link>
<description>According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261021RS400/ai-server-cpu-shipments-2027-intel-amd-arm-architecture.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20261021rs400_files/12_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases</title>
<pubDate>Tue, 27 Oct 2026 05:56:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL222/broadcom-anthropic-funding-financing-finance.html</link>
<description>Broadcom has reached a deal with several financial firms for them to finance the purchase of US$63 billion worth of its chips for Anthropic. The agreement highlights how the line between supplier and lender is becoming blurred among some chipmakers, as well as Wall Street's growing involvement in funding arrangements as AI infrastructure spending continues to expand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL222/broadcom-anthropic-funding-financing-finance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl222_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Mitsubishi Materials scales thermistor capacity sixfold amid AI boom</title>
<pubDate>Tue, 27 Oct 2026 04:30:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD221/mitsubishi-capacity-production-demand-equipment.html</link>
<description>Mitsubishi Materials will expand production of thermistors, temperature sensors used in optical communications equipment, as the spread of generative AI drives demand for optical transceivers. Its Thailand facility will gradually add equipment and raise monthly capacity to about 12 million units by November 2027, roughly six times its 2025 capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD221/mitsubishi-capacity-production-demand-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd221_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Mitsubishi Materials]]></media:description>
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<title>AI demand squeezes automotive memory, pushing automakers to take control of chip supply</title>
<pubDate>Tue, 27 Oct 2026 04:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD220/automakers-automotive-demand-investment-data.html</link>
<description>Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory (HBM) and server products, automotive memory faces rising prices and tighter supplies, making automakers' direct procurement, long-term partnerships, and in-house chip design increasingly strategic.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD220/automakers-automotive-demand-investment-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>China AI token debate highlights challenge of monetizing compute</title>
<pubDate>Tue, 27 Oct 2026 04:17:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD206/bytedance-data-2026.html</link>
<description>More than half of China's AI token usage is reportedly concentrated in short dramas and video generation, but ByteDance's Doubao has disputed the figure, saying video-generation models account for only about 10% of overall computing resources. The conflicting estimates highlight the difficulty of assessing AI compute consumption and its commercial value.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD206/bytedance-data-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd206_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>The Anthropic IPO filing: 14-fold 1H26 revenue growth behind a US$80.75 billion paper loss</title>
<pubDate>Tue, 27 Oct 2026 04:15:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL210/anthropic-revenue-loss-growth-ipo.html</link>
<description>Anthropic's first public filing for its IPO has opened the books on one of the world's fastest-growing AI companies, revealing extraordinary revenue growth alongside a headline net loss that substantially overstates the deterioration in its underlying operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL210/anthropic-revenue-loss-growth-ipo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl210_files/6_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit</title>
<pubDate>Tue, 27 Oct 2026 04:14:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD214/nvidia-infrastructure-ceo-technology-jensen-huang.html</link>
<description>Nvidia CEO Jensen Huang's visit to Kazakhstan highlighted plans to build an AI computing hub for Europe, with projects spanning GPU clusters, data centers, talent, and physical AI. The initiative depends on power infrastructure, foreign technology, and Kazakhstan's ambition to develop and export its own AI capabilities across Central Asia.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD214/nvidia-infrastructure-ceo-technology-jensen-huang.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>US designates helium as critical material amid Middle East supply shock</title>
<pubDate>Tue, 27 Oct 2026 04:08:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL219/military-infrastructure-manufacturing-supply-chain-semiconductors.html</link>
<description>As military conflict in the Middle East cripples global energy infrastructure, the United States is emerging as the critical anchor for the world's high-tech manufacturing sector. Amid a historic supply crisis for helium, an indispensable element in the production of semiconductors and advanced electronics, as well as in medical imaging, the US Department of Energy has officially designated helium as a critical material under the Energy Act of 2020.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL219/military-infrastructure-manufacturing-supply-chain-semiconductors.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: REUTERS]]></media:description>
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<title>Ennostar's optical push could add new growth engine for 2027 and onward</title>
<pubDate>Tue, 27 Oct 2026 04:06:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD209/ennostar-optical-communications-microled-vcsel-growth-2027.html</link>
<description>Ennostar Holdings is expanding into optical communications as Micro LED and Micro VCSEL products move into customer sample-validation stages. The company expects the business to enter substantive growth in 2027, supported by potential demand for short-distance transmission, active optical cables, and emerging co-packaged optics architectures as industry bandwidth requirements continue rising.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD209/ennostar-optical-communications-microled-vcsel-growth-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AMD, Nvidia target substrate capacity amid 4x expansion constraints</title>
<pubDate>Tue, 27 Oct 2026 03:58:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD218/amd-nvidia-capacity-substrate-expansion.html</link>
<description>AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers are extending competition beyond performance and architecture design to control over critical manufacturing resources.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD218/amd-nvidia-capacity-substrate-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd218_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Fujifilm expands South Korean capacity to meet AI chip demand</title>
<pubDate>Tue, 27 Oct 2026 03:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD205/fujifilm-capacity-demand-materials-production.html</link>
<description>Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek and expanding chemical mechanical polishing (CMP) slurry production in Cheonan. The investments will deepen local support for customers including Samsung Electronics as AI and advanced-process demand grows.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD205/fujifilm-capacity-demand-materials-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd205_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>FANUC raises forecast as AI, automation demand drives record revenue</title>
<pubDate>Tue, 27 Oct 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD217/forecast-revenue-demand-automation-robot.html</link>
<description>Japanese robot maker FANUC raised its fiscal year 2026 revenue forecast on October 23 as demand for AI and automation strengthened, putting sales on track to surpass JPY1 trillion for the first time. The company also expects operating profit and net profit to reach record highs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD217/forecast-revenue-demand-automation-robot.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd217_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Charts: Why German automakers are becoming marginalized in US BEV market</title>
<pubDate>Tue, 27 Oct 2026 03:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD210/sales-market-automakers-bev-production.html</link>
<description>German automakers maintained overall sales in the US during the third quarter, but that momentum came mainly from gasoline-powered vehicles. In the battery electric vehicle (BEV) market, BMW, Mercedes-Benz, Volkswagen, Porsche and Audi face three challenges: falling sales, a shrinking BEV market and diverging brand performance.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD210/sales-market-automakers-bev-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd210_files/7_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nvidia says GPUs last 8 years, unlocking AI financing</title>
<pubDate>Tue, 27 Oct 2026 03:47:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD203/nvidia-financing-gtc-berlin-ceo.html</link>
<description>After the GTC Berlin conference, Nvidia CEO Jensen Huang and Silicon Valley technology investor Gavin Baker spoke with &lt;em&gt;Yahoo Finance&lt;/em&gt; for about half an hour. Huang confirmed Nvidia GPUs can remain in service for up to eight years and said their high residual value could help unlock financing for AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD203/nvidia-financing-gtc-berlin-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd203_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>Malaysia conditionally approves first rare-earth export under new rules</title>
<pubDate>Tue, 27 Oct 2026 03:36:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD202/technology-development-2026-exports-bloomberg.html?chid=10</link>
<description>Malaysia has approved its first export of unprocessed rare earths under a new regulatory framework, with the shipment intended for research and development, although officials did not identify the recipient.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Southeast Asia</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD202/technology-development-2026-exports-bloomberg.html?chid=10</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd202_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Meta launches US$35 billion equity raise, funds US$60 billion at-the-market program for AI build-out</title>
<pubDate>Tue, 27 Oct 2026 03:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PR201/meta-2026-cash-flow-capacity-2027.html</link>
<description>Meta Platforms has launched approximately US$35 billion of concurrent underwritten public offerings and plans an approximately US$60 billion at-the-market (ATM) program, as it funds capex it expects to reach US$135 billion to US$145 billion in 2026. The company said the equity raises complement operating cash flow, investment-grade debt, and strategic partnerships, and will further diversify its funding sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PR201/meta-2026-cash-flow-capacity-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pr201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge</title>
<pubDate>Tue, 27 Oct 2026 03:27:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL216/applied-materials-equipment-demand-dutch-2025.html</link>
<description>Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL216/applied-materials-equipment-demand-dutch-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl216_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Applied Materials and Besi jointly developed the Kinex integrated die-to-wafer hybrid-bonding system. Credit: Applied Materials]]></media:description>
</media:content></item>
<item>
<title>Nvidia's Berlin keynote highlights AI scaling challenges in Europe</title>
<pubDate>Tue, 27 Oct 2026 03:24:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD207/nvidia-gtc-europe-robot-physical-ai.html</link>
<description>Nvidia opened GTC 2026 in Berlin on October 21 with a keynote highlighting AI infrastructure, security architecture, and Physical AI, while a Greenpeace protest briefly interrupted proceedings. A robot demonstration also exposed limits in motion control, instruction comprehension, and execution stability as Europe weighs innovation, energy demand, regulation, and competitiveness.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD207/nvidia-gtc-europe-robot-physical-ai.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd207_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia</title>
<pubDate>Tue, 27 Oct 2026 03:06:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL215/samsung-sk-hynix-hbm4-shipments-nvidia.html</link>
<description>Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, &lt;em&gt;ZDNet Korea&lt;/em&gt; reported on October 26, as the AI chipmaker reassesses its memory strategy for next-generation Rubin Ultra accelerators.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL215/samsung-sk-hynix-hbm4-shipments-nvidia.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl215_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>AWS, Google challenge CUDA as AMD, Intel cut AI switch costs</title>
<pubDate>Tue, 27 Oct 2026 02:53:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD201/aws-google-amd-intel-cuda.html</link>
<description>AWS has launched the open-source TorchNeuron tool, allowing developers to port PyTorch artificial intelligence (AI) applications to its custom Trainium chips without rewriting code. Google has followed with TorchTPU, while AMD and Intel are integrating AI software optimizations as chipmakers challenge Nvidia's market advantage built on the CUDA ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD201/aws-google-amd-intel-cuda.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd201_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Intel]]></media:description>
</media:content></item>
<item>
<title>Inside SKT&#38;rsquo;s push to turn SK Hynix&#38;rsquo;s fabs into an AI business</title>
<pubDate>Tue, 27 Oct 2026 02:51:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD204/sk-telecom-sk-hynix-business-b2b-data.html</link>
<description>South Korean telecommunications provider SK Telecom (SKT) has reportedly established Hy-TF, a task force dedicated to AI collaboration with SK Hynix, to upgrade its digital-twin and data-platform businesses and develop new B2B services.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD204/sk-telecom-sk-hynix-business-b2b-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd204_files/7_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>China supply-chain price hikes strain domestic demand</title>
<pubDate>Tue, 27 Oct 2026 02:42:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD200/price-demand-electronics-recovery-growth.html</link>
<description>China&#38;rsquo;s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to Hygon considering higher CPU and deep computing unit (DCU) prices. The moves reflect rising costs for raw materials, components, and upstream supplies, but whether they can help China escape deflationary pressure remains uncertain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD200/price-demand-electronics-recovery-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd200_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Vietnam's first fab reportedly faces doubts over 2027 target</title>
<pubDate>Tue, 27 Oct 2026 02:40:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL208/fab-wafer-2027-equipment-viettel.html</link>
<description>Vietnam's first wafer fab may miss its 2027 trial-production target, &lt;em&gt;Reuters&lt;/em&gt; reported on October 26, citing concerns about project execution and equipment procurement. Developer Viettel, however, says the project remains on schedule.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL208/fab-wafer-2027-equipment-viettel.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl208_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Fine M-Tec rejects component blame as foldable market outlook remains positive</title>
<pubDate>Tue, 27 Oct 2026 02:31:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD212/foldable-component-hinge-apple-iphone.html</link>
<description>Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and precision mechanisms. The dispute could affect perceptions of the South Korean supplier even as analysts forecast growth from expanding foldable device demand ahead.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD212/foldable-component-hinge-apple-iphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>DRAM price gains fall short as supply shrinks up to 50%</title>
<pubDate>Tue, 27 Oct 2026 02:30:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD211/dram-price-growth-demand-2026.html</link>
<description>DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect DRAM supply from leading manufacturers to shrink by 30% to 50% for the next two to three quarters, widening the supply gap in 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD211/dram-price-growth-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd211_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI data center boom risks squeezing power chip supplies for auto, electronics</title>
<pubDate>Tue, 27 Oct 2026 02:29:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD215/data-data-center-expansion-electronics-chips.html</link>
<description>The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more chips but also more efficient power delivery systems. Power plants and electrical grids outside data centers are also under pressure to close supply gaps, potentially tightening power semiconductor supplies and spreading shortages to other applications.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD215/data-data-center-expansion-electronics-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Weekly news roundup: iPhone Duo shipment target revised upward amid display issues</title>
<pubDate>Tue, 27 Oct 2026 02:20:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261026VL200/2026-technology-demand-iphone-apple.html</link>
<description>This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted its iPhone Duo shipment target after strong preorders, while memory makers faced conflicting forecasts over Chinese capacity and sustained AI demand. Taiwan advanced industrial microgrids and saw its first semiconductor strike, as Texas Instruments reported tightening analog supply. Chinese energy storage suppliers reportedly retreated from the US amid reciprocal technology and ownership restrictions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261026VL200/2026-technology-demand-iphone-apple.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261026vl200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Japan sets JPY100 billion push to commercialize perovskite solar cells</title>
<pubDate>Tue, 27 Oct 2026 02:19:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL213/solar-production-technology-manufacturing-government.html</link>
<description>Japan plans to provide about JPY100 billion (US$634.1 million) over four years to support mass production of next-generation perovskite solar cells, seeking to establish a domestic manufacturing base before China further widens its lead in the emerging technology, according to &lt;em&gt;Nikkei Asia.&lt;/em&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL213/solar-production-technology-manufacturing-government.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl213_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>HCLTech and Rapidus open India centers to support semiconductor engineering</title>
<pubDate>Tue, 27 Oct 2026 02:18:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PR200/india-rapidus-semiconductors-design-development-manufacturing.html</link>
<description>HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities will support advanced chip work, while a planned talent pipeline could connect Indian engineers with Rapidus' manufacturing ambitions in Japan, highlighting the cross-border partnerships shaping semiconductor supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PR200/india-rapidus-semiconductors-design-development-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pr200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>India's smartphone shipments hit a decade low in 3Q26 amid rising prices</title>
<pubDate>Tue, 27 Oct 2026 02:18:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL207/shipments-smartphone-2026-market-price.html</link>
<description>India's smartphone shipments fell 20% year over year in the third quarter of 2026, reaching a decade low as higher memory costs pushed device prices up. The downturn highlights affordability pressures for consumers and could prompt manufacturers to raise prices, reshape portfolios, and rely on premium segments globally.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL207/shipments-smartphone-2026-market-price.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge</title>
<pubDate>Tue, 27 Oct 2026 02:14:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL214/apple-iphone-samsung-foldable-smartphone-display.html</link>
<description>Days after the launch of Apple's US$2,000 iPhone Duo, a wave of reports regarding broken inner screens has surfaced across Reddit, &lt;em&gt;TechCrunch&lt;/em&gt;, and&lt;em&gt; Forbes&lt;/em&gt;. Early buyers reported hearing a loud crunching noise before severe cracking appeared along the hinge. Others experienced complete display malfunctions or "big fat creases down the middle" after just hours or days of use.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL214/apple-iphone-samsung-foldable-smartphone-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl214_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Getty Images]]></media:description>
</media:content></item>
<item>
<title>Intel to acquire quantum computing software firm Classiq</title>
<pubDate>Tue, 27 Oct 2026 02:09:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL212/intel-quantum-computing-software-hardware-manufacturing.html</link>
<description>Intel has entered into a definitive agreement to acquire Classiq, a quantum computing software company, in a move aimed at combining Classiq's quantum algorithm synthesis platform with Intel's silicon-based quantum hardware and semiconductor manufacturing capabilities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL212/intel-quantum-computing-software-hardware-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl212_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk</title>
<pubDate>Tue, 27 Oct 2026 02:03:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL211/ipo-taiwan-anthropic-capacity-chips.html</link>
<description>In its preliminary IPO registration statement filed with the US Securities and Exchange Commission, Anthropic describes how much of its capacity depends on a small group of chip and memory suppliers, most of them in East Asia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027VL211/ipo-taiwan-anthropic-capacity-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027vl211_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Tamil Nadu adds independent chip subsidy route as Indian states vie for investment</title>
<pubDate>Tue, 27 Oct 2026 01:55:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261025VL200/india-semiconductors-incentives-investment-packaging.html</link>
<description>India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure and financial support. Tamil Nadu is now giving semiconductor investors another route.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261025VL200/india-semiconductors-incentives-investment-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261025vl200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: PEXELS.]]></media:description>
</media:content></item>
<item>
<title>OPTOELEC seeks AI data center orders as Himax advances CPO optics</title>
<pubDate>Tue, 27 Oct 2026 01:52:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261024VL202/optics-cpo-data-center-himax-production.html</link>
<description>South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications, a market where Taiwanese suppliers are already moving toward commercial production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261024VL202/optics-cpo-data-center-himax-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261024vl202_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[OPTOELEC displays wafer-level optics samples at FIX 2026 in Daegu, South Korea. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>NT1 plans to assemble Chinese delivery vans in Korea in 2027</title>
<pubDate>Tue, 27 Oct 2026 01:46:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261024VL201/2027-vehicle.html</link>
<description>South Korean autonomous delivery company NT1 plans to begin assembling Chinese-designed delivery vans locally in 2027, gradually adding Korean-made components as it seeks approval to operate the vehicles on public roads.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Leon, NT1 chairmanˇ¦s chief of staff, with an N3 autonomous delivery van at FIX 2026. Credit: Sherri Wang]]></media:description>
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<title>Hyundai supplier SL eyes first overseas robot deployment in US</title>
<pubDate>Tue, 27 Oct 2026 01:38:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261024VL200/robot-supplier-robotics-automotive-hyundai.html</link>
<description>South Korean automotive supplier SL is considering deploying its mobile dual-arm robot at a US factory in 2027 or 2028, potentially marking the system's first overseas deployment, a company representative said in an interview with DIGITIMES at FIX 2026 in Daegu on October 24.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[SL Corporation showcases its robotics and factory automation technologies at FIX 2026 in Daegu, South Korea. Credit: Sherri Wang]]></media:description>
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<title>Tata Communications plans up to US$450 million fibre network linking India's AI hubs</title>
<pubDate>Tue, 27 Oct 2026 01:33:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL209/tata-group-india-data-center-infrastructure-capacity-demand.html</link>
<description>Tata Communications announced on October 26 that it plans to invest US$400-450 million in approximately 10,000 kilometers of long-haul fiber across India, linking data centers and AI hubs as it expands its connectivity business. The network will connect domestic corridors with its global backbone.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>KAR bets on fleet monitoring as South Korea expands robotaxi trials</title>
<pubDate>Tue, 27 Oct 2026 01:32:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023VL224/vehicle-robotaxi-2026-hyundai-software.html</link>
<description>South Korean vehicle engineering company KAR plans to develop a monitoring system for the electronic controls it installs in autonomous vehicles, seeking recurring maintenance revenue as the country expands robotaxi trials.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Amy Choi, strategic planning team lead at KAR, at the company's booth during FIX 2026 in Daegu, South Korea. Credit: Sherri Wang]]></media:description>
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<title>ByteDance denies AI micro-dramas consume over half of China's AI computing power</title>
<pubDate>Tue, 27 Oct 2026 01:23:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261024PD200/bytedance-2026-technology.html</link>
<description>The claim that more than half of China's artificial intelligence (AI) computing power is being used to produce micro-dramas has reignited debate in China's technology sector over whether the country is directing too much of its AI computing resources to entertainment content while neglecting productivity applications.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Amkor turns to customer prepayments as global packaging investment accelerates</title>
<pubDate>Tue, 27 Oct 2026 01:20:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL205/amkor-packaging-investment-expansion-manufacturing.html</link>
<description>Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced packaging outpaces the consumer electronics recovery. Management said those arrangements provide greater visibility for investments that will keep capital spending elevated for several years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI</title>
<pubDate>Tue, 27 Oct 2026 01:12:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL204/cadence-design-openai-synopsys-chipmakers.html</link>
<description>Cadence Design Systems is betting that chipmakers will want AI models trained on its own design tools and run wherever customers choose. That puts it on a different route from rival Synopsys, which is building its specialized model with OpenAI on OpenAI-hosted infrastructure. On October 26, alongside its third-quarter results, Cadence introduced Maestro, a portfolio of domain-specialized AI models that power its AI super agents for chip and system design.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets</title>
<pubDate>Tue, 27 Oct 2026 01:07:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL203/demand-cadence-design-earnings-hardware.html</link>
<description>Cadence Design Systems used its third-quarter earnings call to argue that demand for chip design tools is no longer tied only to the AI hardware buildout. It pointed to analog and memory chipmakers, system companies, and new entrants such as space and finance firms designing their own silicon. Analysts on the October 26 call pressed two questions that will shape the coming year: how much growth comes from agentic AI rather than hardware, and whether Cadence can match the long-term targets rival Synopsys set a month earlier.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>India sets October 2028 target for homegrown smartphone brand</title>
<pubDate>Tue, 27 Oct 2026 00:46:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL206/brand-2028-smartphone-electronics-2026.html</link>
<description>India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded domestically, as New Delhi seeks to move beyond assembling devices for foreign brands.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion</title>
<pubDate>Tue, 27 Oct 2026 00:44:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL202/celestica-revenue-growth-capacity-outlook.html</link>
<description>Celestica's latest results suggest that its next challenge will be expanding production fast enough to serve AI infrastructure customers while keeping cash requirements under control. The company forecast US$40 billion in revenue for 2027, putting manufacturing capacity and growth financing at the center of its outlook.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Cadence raises 2026 outlook as AI design demand drives record backlog</title>
<pubDate>Tue, 27 Oct 2026 00:42:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL201/design-cadence-demand-revenue-outlook.html</link>
<description>Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying growth is hurting profitability. Revenue for the three months ended September 30, 2026, rose 22% from a year earlier, the company said on October 26, but operating income barely moved.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness</title>
<pubDate>Tue, 27 Oct 2026 00:41:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027VL200/amkor-packaging-sales-demand-production.html</link>
<description>Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted the value of the company's production mix, while smartphone and consumer electronics headwinds kept the revenue recovery uneven.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung Executive Chairman reportedly eyes RX unit visit for humanoid robot push</title>
<pubDate>Mon, 26 Oct 2026 23:51:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD238/samsung-humanoid-robot-development-ces.html</link>
<description>Samsung Electronics Executive Chairman Lee Jae-Yong is reportedly set to visit the company's Robotics eXperience (RX) business unit in Seoul's Umyeon-dong by the end of October to review humanoid robot development and preparations for CES 2027. If the visit takes place, it will be Lee's first visit since the organization was established, highlighting Samsung's strategy of commercializing robots through manufacturing applications.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses</title>
<pubDate>Mon, 26 Oct 2026 23:50:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD232/ai-server-power-components-transmission-efficiency-digitimes.html</link>
<description>AI server power architectures are evolving toward high-voltage distribution and point-of-load voltage conversion, according to DIGITIMES Intelligence.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Cheng Mei develops materials for advanced packaging glass substrates</title>
<pubDate>Mon, 26 Oct 2026 23:50:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD229/packaging-materials-large-size-loss-substrate.html</link>
<description>As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film and heat-resistant tape remain in development.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Sunic System wins overseas OLEDoS equipment order</title>
<pubDate>Mon, 26 Oct 2026 23:50:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD205/oledos-equipment-wearable-xr-technology.html</link>
<description>As AI expands into wearable devices, South Korean OLED deposition equipment maker Sunic System has secured another overseas order for OLEDoS (OLED on Silicon) deposition equipment, targeting growth in extended reality (XR) and smart glasses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware</title>
<pubDate>Mon, 26 Oct 2026 02:59:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD234/taiwan-packaging-pcb-manufacturing.html</link>
<description>In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association, AI server motherboards have become the largest, thickest, and most structurally complex PCBs ever manufactured, drawing substrate and PCB makers, which historically reacted to decisions made by chipmakers and packaging clients, into the heart of AI hardware development.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
</channel>
</rss>

