<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 1 Oct 2026 11:00:06 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Charts: Micron earns its best margins from PCs, phones, not AI</title>
<pubDate>Thu, 1 Oct 2026 09:22:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL218/micron-revenue-market-data-data-center.html</link>
<description>Micron's best margins aren't coming from AI data centers. They come from PCs and smartphones, markets where Micron warns that unit sales could fall.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL218/micron-revenue-market-data-data-center.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl218_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Topco opens Fukuoka office to link Japan chip hubs</title>
<pubDate>Thu, 1 Oct 2026 09:02:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD244/topco-kumamoto-subsidiary-expansion-demand.html</link>
<description>Topco Scientific said its Japanese subsidiary, Shunkawa, officially opened its Fukuoka office on October 1, making it the company&#38;rsquo;s third base in Japan alongside its Tokyo headquarters and Kumamoto office. The move is designed to leverage Fukuoka&#38;rsquo;s location and industrial clustering to strengthen real-time technical support and new business development in Kyushu&#38;rsquo;s semiconductor hub.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD244/topco-kumamoto-subsidiary-expansion-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd244_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan aligns green certifications with Japan and EPEAT to speed electronics market entry</title>
<pubDate>Thu, 1 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD214/taiwan-electronics-market-certification-equipment.html</link>
<description>Taiwan is moving to align its Green Mark ecolabel with international certification systems in an effort to reduce green trade barriers and shorten time to market for electronics products.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD214/taiwan-electronics-market-certification-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd214_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Angel Liu]]></media:description>
</media:content></item>
<item>
<title>China ramps up Micro OLED capacity ahead of proven smart glasses demand</title>
<pubDate>Thu, 1 Oct 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD211/smart-glasses-capacity-demand-market-production.html</link>
<description>As smart glasses draw growing market attention, Chinese suppliers including BOE, SeeYA Technology and Sidtek are expanding Micro OLED production. Display industry sources caution, however, that demand for the panels remains uncertain and that capacity coming online ahead of proven demand could leave the market oversupplied.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD211/smart-glasses-capacity-demand-market-production.html</guid>
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</media:content></item>
<item>
<title>Infineon opens new backend chip plant in Thailand, eyes growth to up to five modules</title>
<pubDate>Thu, 1 Oct 2026 08:20:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL217/infineon-manufacturing-plant-growth-bangkok.html</link>
<description>Infineon Technologies officially inaugurated a new backend manufacturing site in Samut Prakan, south of Bangkok, on October 1, expanding the German chipmaker's production network in Southeast Asia starting with an initial investment of over EUR100 million (US$113.1 million).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL217/infineon-manufacturing-plant-growth-bangkok.html</guid>
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<media:description type="plain"><![CDATA[Credit: Infineon]]></media:description>
</media:content></item>
<item>
<title>ASE expands smart OSAT push with six university research partnerships</title>
<pubDate>Thu, 1 Oct 2026 08:17:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD241/ase-osat-technology-equipment-automation.html</link>
<description>Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six Taiwanese universities as it works to advance smart outsourced semiconductor assembly and test (OSAT) and digital manufacturing. The projects were designed to support semiconductor factory efficiency, quality control, resilience, and climate adaptation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD241/ase-osat-technology-equipment-automation.html</guid>
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</media:content></item>
<item>
<title>Taiwan extends fuel freeze, seeks extra subsidies for CPC, Taipower</title>
<pubDate>Thu, 1 Oct 2026 08:13:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD240/taiwan-taiwan-power-company-subsidies-fuel-2026.html?chid=10</link>
<description>Taiwan's Executive Yuan has moved to extend price controls and seek additional subsidies for CPC Corporation and Taiwan Power Company as Middle East conflict has lifted global oil and gas costs. The government said the extra budget is intended to keep fuel, electricity, and bottled gas prices stable for households and businesses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD240/taiwan-taiwan-power-company-subsidies-fuel-2026.html?chid=10</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd240_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Executive Yuan]]></media:description>
</media:content></item>
<item>
<title>Shinko Electric acquires JDI's Mobara Fab to expand AI packaging capacity</title>
<pubDate>Thu, 1 Oct 2026 08:07:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PR202/shinko-electric-jdi-capacity-packaging-demand.html</link>
<description>Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction is intended to establish a new core production hub dedicated to high-end semiconductor packaging, addressing surging global demand for AI accelerators and data center applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PR202/shinko-electric-jdi-capacity-packaging-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pr202_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shinko Electric Industries]]></media:description>
</media:content></item>
<item>
<title>SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure</title>
<pubDate>Thu, 1 Oct 2026 08:02:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260929RS400/sic-substrate-market-demand-inverter.html?chid=2</link>
<description>DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260929RS400/sic-substrate-market-demand-inverter.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260929rs400_files/8_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>DB HiTek raises foundry prices by up to 30% as Chinese demand strains 200mm capacity</title>
<pubDate>Thu, 1 Oct 2026 07:34:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL216/capacity-demand-price-2026-revenue.html</link>
<description>DB HiTek has raised foundry prices by as much as 30%, with Chinese customers facing the steepest increases as rising orders push the South Korean foundry's 8-inch capacity close to full utilization, according to &lt;em&gt;The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL216/capacity-demand-price-2026-revenue.html</guid>
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<media:description type="plain"><![CDATA[Credit: DB HiTek]]></media:description>
</media:content></item>
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<title>Ascend now ahead of Nvidia in China, with domestic supply driving AI chip substitution, says Huawei chairman</title>
<pubDate>Thu, 1 Oct 2026 07:22:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD232/huawei-ascend-ai-chip-china-nvidia.html</link>
<description>Huawei rotating chairman Eric Xu said the company's Ascend AI accelerators have surpassed Nvidia in both sales and market share in China, highlighting how US export controls on advanced AI chips are accelerating the shift of China's data center and AI industries toward domestic suppliers.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD232/huawei-ascend-ai-chip-china-nvidia.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd232_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Eric Xu said Huawei still lacks the capacity for large-scale overseas expansion and has no near-term plan to challenge Nvidia globally. Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Meta's Muse lifts server CPU demand, with AMD EPYC orders extending into 2028</title>
<pubDate>Thu, 1 Oct 2026 07:09:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL213/cpu-meta-demand-amd-2028.html</link>
<description>Meta's rapid rollout of its Muse AI agent is emerging as an early test of how agentic AI could reshape server infrastructure demand, with CPU suppliers already seeing longer lead times and AMD's latest EPYC processors reportedly booked deep into 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL213/cpu-meta-demand-amd-2028.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl213_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>China's 'BEST' fusion reactor enters the engineering endgame</title>
<pubDate>Thu, 1 Oct 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL210/plasma-supply-chain.html</link>
<description>China's next-generation fusion programme has entered a new engineering phase with the formal opening of the campus for the Burning Plasma Experimental Superconducting Tokamak (BEST) and the start of critical main-device assembly in Hefei, Anhui.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL210/plasma-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Chinaˇ¦s Compact Fusion Energy Experimental Device (BEST) campus in Hefei has officially opened. Credit: CCTV]]></media:description>
</media:content></item>
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<title>Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move</title>
<pubDate>Thu, 1 Oct 2026 05:56:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD230/ai-chip-tsmc-corning-tgv-agc.html</link>
<description>As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510&#38;times;515mm format. The tight alignment strongly suggests that Taiwan Semiconductor Manufacturing Co. (TSMC) is eyeing this exact specification for its post-2030 glass substrate platform.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD230/ai-chip-tsmc-corning-tgv-agc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd230_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development</title>
<pubDate>Thu, 1 Oct 2026 05:48:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL212/synopsys-amazon-silicon-ip-development.html</link>
<description>Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and support the development of more complex AI-powered products and cloud infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL212/synopsys-amazon-silicon-ip-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl212_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Synopsys]]></media:description>
</media:content></item>
<item>
<title>China's share of global solar module demand falls below 40% as Europe, India gain ground</title>
<pubDate>Thu, 1 Oct 2026 05:26:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD221/solar-module-demand-europe-market-2026.html</link>
<description>The global solar module market is undergoing a significant geographic shift in 2026. China remains the world's largest source of module demand, but its share of global shipments is set to fall below 40%, down 12 percentage points year-over-year, while Europe and India continue to gain ground.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD221/solar-module-demand-europe-market-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion</title>
<pubDate>Thu, 1 Oct 2026 04:15:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD218/china-data-center-capex-capacity-expansion.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above that level by the end of 2026, making China the world's second-largest data center market after the US.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD218/china-data-center-capex-capacity-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[ByteDance holds about one-fifth of Chinaˇ¦s delivered data center capacity, driving AI infrastructure growth. Credit: AFP]]></media:description>
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<title>China's chip-tool localization accelerates: ACM Research backlog jumps 88%</title>
<pubDate>Thu, 1 Oct 2026 04:13:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL211/acm-equipment-revenue-2026-expansion.html</link>
<description>ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries while AI-related capacity investment and localization continue to support demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL211/acm-equipment-revenue-2026-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: China Securities Journal]]></media:description>
</media:content></item>
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<title>Samsung raises Galaxy S26 prices in South Korea seven months after launch</title>
<pubDate>Thu, 1 Oct 2026 04:09:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD226/samsung-galaxy-price-iphone-256gb.html</link>
<description>Under pressure from rising memory prices, Samsung Electronics has raised the South Korean launch prices of its Galaxy S26 series about seven months after release. Most models went up by KRW149,600(US$110), while the top-end Galaxy S26 Ultra 1TB rose to KRW2.8215 million.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD226/samsung-galaxy-price-iphone-256gb.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd226_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up</title>
<pubDate>Thu, 1 Oct 2026 04:07:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD227/osat-packaging-cloud-ai-asic-2026.html</link>
<description>As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants&#38;mdash;including Huawei, Cambricon, and Alibaba&#38;mdash;are entering volume production. These chips are being routed to Chinese OSAT providers such as JCET Group, Tongfu Microelectronics, and SJ Semiconductor (SJSemi), driving a steady expansion in Chinese OSATs' share of the global cloud AI accelerator market.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD227/osat-packaging-cloud-ai-asic-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd227_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Huawei makes Mate 90 showcase for its Tau chip strategy</title>
<pubDate>Thu, 1 Oct 2026 04:06:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD228/huawei-smartphone-hardware-kirin-chips.html</link>
<description>Huawei unveiled its Mate 90 smartphone series on October 1, with Richard Yu, Huawei executive director and chairman of the Consumer BG, introducing the new devices alongside a new generation of in-house chips and imaging hardware. Every model in the Mate 90 lineup, from the standard version to the flagship tier, uses Huawei's latest self-developed Tau (&#38;tau;) chip platform.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd228_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
</media:content></item>
<item>
<title>TCC Group targets Ukraine's postwar rebuild with cement acquisition</title>
<pubDate>Thu, 1 Oct 2026 04:02:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD224/tcc-ukraine-dutch-subsidiary-revenue.html</link>
<description>Taiwan Cement recently authorized its Dutch subsidiary, TCC Group EMEA Holdings B.V., to acquire 100% of Ukrainian cement materials maker Ivano-Frankivskcement (IFCEM), roofing materials company Ivano-Frankivsk-Dakh, gypsum products maker KRU Gips, and dry-mix mortar company KRU Mix for a corporate value of up to EUR750 million (US$849.3 million). Taiwan Cement has moved into Ukraine to capture postwar reconstruction demand, while Taiwan Cement shareholder Chia Hsin Cement said the acquisition is likely to boost market positioning and profitability.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD224/tcc-ukraine-dutch-subsidiary-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Neweb Information targets late-October listing on Taipei Exchange</title>
<pubDate>Thu, 1 Oct 2026 04:01:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD210/taipei-revenue-business-2025-2026.html</link>
<description>Neweb Information, a Taiwan-based IT systems integrator, is targeting a late-October listing on the Taipei Exchange. Long focused on enterprise core systems, the company has expanded in recent years into AI GPU computing platforms and AI infrastructure, with AI-related revenue in the first half of 2026 already exceeding the level recorded for all of 2025.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD210/taipei-revenue-business-2025-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd210_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Neweb Information chairman Kuo Ting-chun (left) and general manager Yang Ai-ru. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>MG Taiwan details recall after MG ZS scores zero stars in TNCAP test</title>
<pubDate>Thu, 1 Oct 2026 03:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD243/taiwan-recall-2026-inspection.html</link>
<description>The Taiwan New Car Assessment Program (TNCAP) on September 30 released its third-quarter ratings, publishing the MG ZS assessment under its second-edition protocol, which gave the model an overall zero-star rating. MG Taiwan responded with a formal statement, saying the model is locally produced, meets Taiwan's vehicle safety inspection standards, and carries a safety inspection certificate along with multiple active and passive safety systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD243/taiwan-recall-2026-inspection.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd243_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Focus: The hidden price of Nvidia's AI agent security play</title>
<pubDate>Thu, 1 Oct 2026 03:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD222/nvidia-security-hardware-infrastructure.html</link>
<description>Nvidia's new AI agent security platform puts hardware at the centre of agent control, but it also forces enterprises to weigh stronger protection against higher infrastructure costs and deeper dependence on Nvidia's stack.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD222/nvidia-security-hardware-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[BlueField DPU demand is expected to rise with AI adoption, with Nvidia increasingly pitching security alongside networking. Credit: AFP]]></media:description>
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<title>BOE eyes closer ties with Samsung, LG as it pushes into chip packaging</title>
<pubDate>Thu, 1 Oct 2026 03:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930VL222/boe-samsung-lg-packaging-display.html</link>
<description>China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260930vl222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: BOE]]></media:description>
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<title>Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years</title>
<pubDate>Thu, 1 Oct 2026 03:43:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD223/machvision-growth-substrate-equipment-pcb.html</link>
<description>Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise. The company said visibility for semiconductor and substrate orders has stretched to as long as 3 years in some cases.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd223_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Volvo Taiwan sees AI wealth lift economy, but not yet car demand</title>
<pubDate>Thu, 1 Oct 2026 03:37:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD201/volvo-taiwan-economy-demand-market.html</link>
<description>Volvo Car Taiwan acting president Eric Lin said on Sept. 30 that Taiwan's economy is improving on the back of the AI boom, but that the wealth gains are unlikely to translate into stronger car sales in the near term. He said the market is expected to stay flat in 2026 and turn more cautious in 2027.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd201_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Google skips Gemini 3.5 Pro, launches Gemini 4 Argon at US$2/$10 per million tokens</title>
<pubDate>Thu, 1 Oct 2026 03:23:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL209/google-gemini-openai-software-anthropic.html</link>
<description>Google has unveiled Gemini 4 Argon, its new top-tier AI model, after months of delays and the cancellation of Gemini 3.5 Pro, launching it at introductory prices of US$2 per million input tokens and US$10 per million output tokens as competition with OpenAI and Anthropic intensifies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001vl209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Google unveiled Gemini 4 Argon on September 30, positioning the model for coding, enterprise knowledge work and cybersecurity defense. Credit: Google]]></media:description>
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<item>
<title>MediaTek TPU orders rise as chip capacity war intensifies</title>
<pubDate>Thu, 1 Oct 2026 03:17:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD216/mediatek-tpu-capacity-google-revenue.html</link>
<description>MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers (CSPs) battle for semiconductor output in Taiwan's Hsinchu Science Park. MediaTek has also denied market rumors that its TPU orders have slipped.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking</title>
<pubDate>Thu, 1 Oct 2026 03:13:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL208/samsung-ai-agent-robotics-development-2026.html</link>
<description>Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver measurable business value across enterprise workflows, device-side applications, and semiconductor design and manufacturing.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL208/samsung-ai-agent-robotics-development-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001vl208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Tata Electronics leans on INR612.8 billion in guarantees to fund iPhone, chip expansion</title>
<pubDate>Thu, 1 Oct 2026 02:59:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930VL204/iphone-manufacturing-apple-loss-2026.html</link>
<description>Tata Electronics, Apple's contract manufacturing partner, provided INR612.8 billion (US$6.38 billion) in corporate guarantees on behalf of its subsidiaries in fiscal 2026 as it expanded iPhone manufacturing and semiconductor projects, &lt;em&gt;The Economic Times&lt;/em&gt; reported.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260930vl204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts</title>
<pubDate>Thu, 1 Oct 2026 02:56:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL206/micron-hbm-2027-dram-growth.html</link>
<description>Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract prices left HBM largely outside the memory price surge.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit:AFP]]></media:description>
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<title>Taiwan launches joint cybersecurity audits for government IT service providers</title>
<pubDate>Thu, 1 Oct 2026 02:52:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD207/taiwan-government-cybersecurity-moda-chairman.html</link>
<description>Taiwan's Ministry of Digital Affairs (MODA) has launched a joint cybersecurity audit initiative aiming to reduce repeated inspections on vendors that provide the government with IT services, while strengthening government information security. MODA will expand the joint audit program in 2027.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD207/taiwan-government-cybersecurity-moda-chairman.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd207_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Ministry of Digital Affairs]]></media:description>
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<title>OpenAI claims to thwart model distillation attack tied to Moonshot</title>
<pubDate>Thu, 1 Oct 2026 02:51:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD219/openai-moonshot-startup-claude.html</link>
<description>OpenAI said it detected and blocked an organized adversarial distillation attack, with some activity linked to Chinese AI startup Moonshot AI. The company said it first spotted the effort on July 1 and saw a peak on July 24 and 25, when it detected about 16,000 related requests from more than 4,000 users.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD219/openai-moonshot-startup-claude.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd219_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>US unveils South Korea's US$20B nuclear, Alaska LNG investment</title>
<pubDate>Thu, 1 Oct 2026 02:47:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD220/investment-nuclear-government-development-power-plant.html</link>
<description>The US has unilaterally announced South Korea's investment package in the US, including Alaska LNG development and the construction of eight large nuclear power plants. Seoul had previously listed those two projects as issues to be negotiated later, but Washington has already presented them as a done deal.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Qualcomm, Samsung redesign chip packaging as heat limits phone performance</title>
<pubDate>Thu, 1 Oct 2026 02:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930VL220/qualcomm-samsung-packaging-performance-processor.html</link>
<description>Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling capacity of mobile devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260930vl220_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Qualcomm]]></media:description>
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<item>
<title>Nvidia ties AI agent security to BlueField-4, Vera CPU</title>
<pubDate>Thu, 1 Oct 2026 02:17:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD215/nvidia-security-cpu-hardware-software.html</link>
<description>Over the past year, Nvidia has repeatedly observed AI agents drifting beyond approved workflows. In some cases, agents quietly escalated read permissions to write access, sent requests to unauthorized endpoints, or clicked unauthorized CAPTCHA-bypass links.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD215/nvidia-security-cpu-hardware-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd215_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Nvidia is tightly linking AI agent security to BlueField-4 DPU and Vera CPU, pushing customers toward ˇ§full standardizationˇ¨ on Nvidia chips. AFP]]></media:description>
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<title>Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking</title>
<pubDate>Thu, 1 Oct 2026 02:12:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL207/jabil-data-center-cooling-revenue-price-2027.html</link>
<description>Jabil's plan for fiscal 2027 puts a price tag on its move from building servers to building the power, cooling, and networking systems around them. The company expects about US$17.5 billion of cloud and data-center infrastructure revenue, up about 52%. That business sits inside an Intelligent Infrastructure segment forecast at about US$25.6 billion, up about 43%. Management laid out the roadmap segment by segment at its fourth-quarter earnings call and ninth annual investor briefing on September 30, 2026, according to a &lt;em&gt;Bloomberg&lt;/em&gt; transcript.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001vl207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion</title>
<pubDate>Thu, 1 Oct 2026 02:04:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL205/synopsys-growth-revenue-2027-ip.html</link>
<description>Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September 30, 2026, the design software and IP company raised its long-term revenue goal to mid-teens annual growth through fiscal 2030, lifted its operating margin objective to about 50%, and issued fiscal 2027 guidance roughly two and a half months earlier than usual, anchored by a US$1 billion IP license with Amazon and a new model partnership with OpenAI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001vl205_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push</title>
<pubDate>Thu, 1 Oct 2026 01:58:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD252/applied-materials-kioxia-3d-packaging-2026.html</link>
<description>Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate on developing advanced memory cells and structures, multi-chip stacking architectures, and new materials engineering technologies to improve the memory density and performance required in the artificial intelligence (AI) era.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD252/applied-materials-kioxia-3d-packaging-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd252_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Applied Materials CEO Gary Dickerson. Credit: DIGITIMES]]></media:description>
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<item>
<title>Honor joins Taiwan foldable phone race with Magic V6</title>
<pubDate>Thu, 1 Oct 2026 01:56:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD212/honor-taiwan-foldable-foldable-smartphone-smartphone.html</link>
<description>Honor launched its first foldable smartphone in Taiwan, the Magic V6, on September 30, about six months after formally entering the local smartphone market in April 2026. The company hopes the premium flagship will strengthen its brand while helping increase its market share and revenue in Taiwan.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nextronics sees AI, robotics, medical demand reshaping revenue mix</title>
<pubDate>Thu, 1 Oct 2026 01:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD202/revenue-2026-medical-robotics-demand.html</link>
<description>Connector maker Nextronics Engineering said its humanoid robot-related products began shipping in 2026, while North American customers are preparing for mass production and have set a 2027 production target. The company expects those programs, alongside AI-related communications, to lift revenue sharply in 2027 and further shift its business mix toward higher-growth segments.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD202/revenue-2026-medical-robotics-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd202_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Netronics chairman Stephen Hsu. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>HPE secures US$1.2 B order from Vultr for first AMD Helios AI rack systems</title>
<pubDate>Thu, 1 Oct 2026 01:52:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PR201/hpe-amd-infrastructure-juniper-ceo.html</link>
<description>&lt;p class="P1" data-path-to-node="1"&gt;Hewlett Packard Enterprise announced a major US$1.2 billion order from Vultr, which HPE describes as the world's largest privately held cloud infrastructure company, on September 30. The agreement marks HPE's inaugural order for the AMD Helios&#38;trade; AI Rack by HPE, which will be deployed across Vultr's US cloud data centers to power large-scale model training and inference workloads for global enterprises and service providers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PR201/hpe-amd-infrastructure-juniper-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pr201_files/5_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: HPE]]></media:description>
</media:content></item>
<item>
<title>China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems</title>
<pubDate>Thu, 1 Oct 2026 01:48:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD213/robot-materials-industrial-development-partnership.html</link>
<description>China Rare Earth Innovation Technology and Beijing-based Direct Drive Tech signed a strategic cooperation agreement on September 29 to jointly develop high-performance magnetic materials for direct-drive motors, including neodymium-iron-boron magnets, flux-concentrating rings, and radially oriented magnetic rings, linking upstream rare-earth resources with robot drive modules.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD213/robot-materials-industrial-development-partnership.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd213_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Google to test AI computing in space with first orbital TPU launch</title>
<pubDate>Thu, 1 Oct 2026 01:46:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD209/google-tpu-data-chips-accelerator.html</link>
<description>Google is preparing to send its in-house AI accelerator, the Tensor Processing Unit (TPU), into low Earth orbit for the first time as it explores whether AI computing can eventually expand beyond terrestrial data centers and into space. CEO Sundar Pichai recently announced that Project Suncatcher will begin its first in-orbit test on October 1, with computing power roughly equivalent to that of a single ground-based server.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD209/google-tpu-data-chips-accelerator.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>ProLogium advances Dunkirk superfactory, deepens Europe battery autonomy</title>
<pubDate>Thu, 1 Oct 2026 01:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD250/prologium-lithium-battery-europe-infrastructure.html</link>
<description>ProLogium, a maker of inorganic lithium ceramic batteries, said construction and infrastructure work at its Dunkirk superfactory in France has started in phases, including power infrastructure and grid connection work, with a target to energize the construction site in early October 2026. The company is also pressing ahead with engineering design, certification of local suppliers in France and Europe, technology localization and talent development.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD250/prologium-lithium-battery-europe-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd250_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Micron sees no end to the memory shortage, even after new fabs open in 2028</title>
<pubDate>Thu, 1 Oct 2026 01:39:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL204/micron-2028-2027-dram-demand.html</link>
<description>Micron told investors on September 30 that it cannot say when memory supply will catch up with demand. It expects the shortage to get worse over the next two years, even though additional cleanroom space is expected from late 2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001vl204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>China's humanoid robot lead widens, with domestic vendors supplying over 95% of global shipments</title>
<pubDate>Thu, 1 Oct 2026 01:37:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD208/robot-shipments-market-2026-idc.html</link>
<description>China's humanoid robot market continued to expand rapidly in the first half of 2026, with shipments exceeding 19,000 units and accounting for about 77.9% of the global total. Chinese suppliers, meanwhile, represented more than 95% of worldwide shipments, underscoring China's position as both the largest humanoid robot market and the industry's dominant source of supply.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd208_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>Unimicron expands ABF substrate capacity with NT$10B Hukou land deal</title>
<pubDate>Thu, 1 Oct 2026 01:36:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD200/unimicron-capacity-abf-substrate-taiwan-demand.html</link>
<description>Unimicron has moved again to ease tight ABF substrate supply, buying a Hukou site from Bridgestone Taiwan for more than NT$10 billion (US$313.65 million). The deal highlights how AI chip demand is reshaping capacity plans, as customers worldwide race to secure advanced substrate supply for the next several years.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration</title>
<pubDate>Thu, 1 Oct 2026 01:35:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD204/tsmc-cowos-performance-packaging-technology.html</link>
<description>TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems. The shift could reshape semiconductor competition, as demand for compute, bandwidth, power delivery, and cooling rises in tandem. The company outlined the trend at its heterogeneous integration forum during SEMICON Taiwan 2026, saying AI computing transistors in a single CoWoS package are set to rise more than 48-fold by 2029 from 2024 levels, while total HBM bandwidth is expected to increase more than 34-fold.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Nio, Geely turn battery swapping into shared infrastructure as China's EV rivalry changes course</title>
<pubDate>Thu, 1 Oct 2026 01:28:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930VL223/infrastructure-geely-automotive-battery-swap-policy.html</link>
<description>For years, China's EV makers pursued aggressive energy infrastructure expansion, racing to offer faster charging and denser networks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Note: AI-assisted illustration by DIGITIMES, created for editorial purposes to visualize NIO-Geelyˇ¦s battery-swapping infrastructure deal.]]></media:description>
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<title>GPS-free indoor drones target high-rack inspection as smart warehouses expand</title>
<pubDate>Thu, 1 Oct 2026 01:23:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD205/inspection-market-commercial-logistics-demand.html</link>
<description>The drone market is expanding beyond military applications as commercial demand gains momentum. Following the rollout of drone logistics services for Taiwan's outlying islands, industry players see firefighting, disaster response, and inspection in areas that are difficult or dangerous for humans to access as among the first commercial applications poised for adoption.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd205_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote</title>
<pubDate>Thu, 1 Oct 2026 01:15:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD251/ase-plant-expansion-strike-relocation.html</link>
<description>ASE Technology Holding (ASEH) announced on July 30 that it would spend roughly NT$5.67 billion (approx. US$177.97 million) to acquire land and factory buildings in the Zhongli Industrial Park from Taiwanese snack maker Kuai Kuai, a move meant to support future capacity expansion at its Zhongli plant. The deal, however, has unexpectedly become a flashpoint, with the Kuai Kuai union recently holding a strike vote and protesting outside ASE's Zhongli facility.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD251/ase-plant-expansion-strike-relocation.html</guid>
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<title>AWS Trainium 3 shipments stall as supply chain sees turnaround</title>
<pubDate>Thu, 1 Oct 2026 01:14:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD206/aws-shipments-supply-chain-growth-demand.html</link>
<description>AWS's latest Trainium 3 shipments appear to be running behind expectations, but the strain reflects broader pressures that global readers will recognize across the AI hardware supply chain. Suppliers cited parts shortages, assembly complexity, and rapid demand growthas the main bottlenecks, which could affect cloud costs, capacity, and competition worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD206/aws-shipments-supply-chain-growth-demand.html</guid>
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<title>Applied Materials and Kioxia team up on AI-era memory tech</title>
<pubDate>Thu, 1 Oct 2026 01:13:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PR200/kioxia-applied-materials-silicon-valley-materials-efficiency.html</link>
<description>Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration underscores efforts to boost memory density, speed, and energy efficiency, which are increasingly important as global demand for data-intensive computing and advanced chip packaging rises.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Memory shortages deepen as AI demand keeps server prices climbing</title>
<pubDate>Thu, 1 Oct 2026 01:09:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD203/demand-market-price-2026-ddr5.html</link>
<description>The memory market is entering the fourth quarter of 2026 with a widening split between weak consumer demand and intense server buying, underscoring how artificial intelligence workloads are reshaping supply. Spot prices for DDR5 server modules continue to rise, while some lower-grade products are softening in the channel.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD203/demand-market-price-2026-ddr5.html</guid>
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<title>SG Semiconductor builds brand and talent for Singapore chip industry</title>
<pubDate>Thu, 1 Oct 2026 01:02:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD239/talent-brand-technology-equipment-manufacturing.html</link>
<description>Singapore has launched the SG Semiconductor brand to strengthen its semiconductor profile and attract talent, aiming to create a globally recognizable industry identity beyond its existing R&#38;amp;D system. Yee-Chia Yeo, A*STAR vice president for innovation and enterprise, said the initiative is not just a website or information platform, but a way to connect Singapore's wafer manufacturing, equipment, materials, research institutes, and universities into a more visible ecosystem.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD239/talent-brand-technology-equipment-manufacturing.html</guid>
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<title>Apple Pay arrives in India with a limited card rollout</title>
<pubDate>Thu, 1 Oct 2026 00:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL203/apple-launch-market.html</link>
<description>Apple's entry into India's payments market gives its device users a new way to pay by card, but its initial reach will depend on bank and merchant integrations in a country where a domestic real-time system already dominates digital transactions. The service launched on September 30 for eligible Axis Bank Visa and Mastercard credit cardholders, placing Apple's wallet alongside, rather than replacing, India's Unified Payments Interface (UPI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Jabil targets 24% growth in FY27 as AI hardware ramp reshapes business</title>
<pubDate>Thu, 1 Oct 2026 00:43:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL201/jabil-business-hardware-2027-revenue.html</link>
<description>Jabil's fourth quarter of fiscal 2026 marked the point at which AI data-center hardware became the clear center of gravity for the US contract manufacturer. Revenue for the three months ended August 31 rose 29% from a year earlier to US$10.6 billion. The GAAP operating margin widened to 5.7% from 4.1% as new capacity came online faster than planned and more hyperscale customers moved into volume production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Synopsys and OpenAI to share revenue from AI model built to run chip design tools</title>
<pubDate>Thu, 1 Oct 2026 00:38:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL202/synopsys-design-openai-eda-2026.html</link>
<description>Synopsys is betting that the surest way to keep generative AI from eroding its electronic design automation (EDA) franchise is to build the model together with the AI developer and share the proceeds. The chip design software maker said on September 30, 2026, that it has signed a multi-year agreement with OpenAI to jointly develop GPT-Synopsys, a specialized model optimized to operate Synopsys' EDA tools, under an arrangement that Synopsys CEO Sassine Ghazi told &lt;em&gt;Reuters&lt;/em&gt; was structured so that "it will not be cannibalizing our business."</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL202/synopsys-design-openai-eda-2026.html</guid>
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<title>Micron's record quarter rests on pricing power as customers lock in 2027 supply</title>
<pubDate>Thu, 1 Oct 2026 00:37:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL200/micron-2027-revenue-dram-price.html</link>
<description>Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure supply. Revenue for the three months ended September 3, 2026, reached US$54.2 billion, up 31% from the previous quarter, and GAAP gross margin widened to 86.8%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001VL200/micron-2027-revenue-dram-price.html</guid>
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<title>Samsung Foundry gets boost from HBM4 as 2nm push continues</title>
<pubDate>Thu, 1 Oct 2026 00:17:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930VL221/samsung-foundry-hbm4-2nm-business-demand.html</link>
<description>Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260930vl221_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>Jensen Huang wins Van Fleet Award as Nvidia, South Korea trio reunites</title>
<pubDate>Thu, 1 Oct 2026 00:16:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD249/nvidia-jensen-huang-ceo-samsung-sk-group-partnership.html</link>
<description>Nvidia CEO Jensen Huang attended the Korea Society's annual dinner in New York on September 28 local time and received the 2026 Van Fleet Award, with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won on hand to congratulate him. The appearance underscored how Nvidia's ties with South Korea's semiconductor makers have expanded from memory supply into AI manufacturing, creating a two-way relationship in products and technology.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD249/nvidia-jensen-huang-ceo-samsung-sk-group-partnership.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd249_files/2_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Qualcomm says PC chip shortages are manageable; price swings hit harder</title>
<pubDate>Thu, 1 Oct 2026 00:16:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD247/qualcomm-president-snapdragon-ai-chip-price.html</link>
<description>Qualcomm's senior vice president and general manager of the compute and gaming business, Kedar Kondap, said the biggest challenge facing the PC industry is not component shortages, but the unusually large price swings in memory and other parts. Speaking to the media during Snapdragon Summit 2026, he said that volatility is affecting the PC market.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD247/qualcomm-president-snapdragon-ai-chip-price.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd247_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>AI boom drives Southern Taiwan Science Park revenue past NT$1.7 trillion in 1H26</title>
<pubDate>Thu, 1 Oct 2026 00:13:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260929PD252/southern-taiwan-science-park-revenue-2026-taiwan-demand.html</link>
<description>The Southern Taiwan Science Park (STSP) posted revenue of NT$1.77 trillion (approx. US$55.66 billion) in the first half of 2026, up 28.57% from the same period in 2025. Growth was mainly driven by the rapid development of the global artificial intelligence (AI) boom, coupled with Taiwan's leading role in the semiconductor industry, enabling the science park to maintain steady expansion momentum and further consolidate its position at the core of the global high-tech supply chain.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260929PD252/southern-taiwan-science-park-revenue-2026-taiwan-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260929pd252_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>Lip-Bu Tan calls TSMC a partner rather than a rival</title>
<pubDate>Thu, 1 Oct 2026 00:11:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD246/intel-lip-bu-tan-tsmc-partnership.html</link>
<description>Intel CEO Lip-Bu Tan stated that Intel's relationship with TSMC is built on partnership rather than rivalry. He noted that a collaborative mindset guides key industry leaders, including TSMC Chairman C.C. Wei and Nvidia CEO Jensen Huang, as they navigate the ongoing artificial intelligence (AI) transformation.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD246/intel-lip-bu-tan-tsmc-partnership.html</guid>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>How a TSMC veteran is steering Singapore's lab-to-fab chip strategy</title>
<pubDate>Thu, 1 Oct 2026 00:11:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD241/tsmc-packaging-president-equipment-manufacturing.html</link>
<description>Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing the city-state's semiconductor R&#38;amp;D and industry development. He is helping build a semiconductor model that differs from Taiwan's, with a focus on linking research more closely to manufacturing needs.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD241/tsmc-packaging-president-equipment-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd241_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality</title>
<pubDate>Thu, 1 Oct 2026 00:07:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD238/ai-inference-ai-agent-capacity-demand-digitimes.html</link>
<description>DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of creating content, and toward a broader shift into the agentic AI era in 2027. Agentic AI is expected to multiply compute demand, while multi-step reasoning introduces new risks to task quality. Efficient control of total token consumption and reliable task-quality management will therefore become critical to commercial deployment.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD238/ai-inference-ai-agent-capacity-demand-digitimes.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd238_files/3_b.jpg" type="image/jpeg" expression="full">
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<title>ASIC shipments top GPUs in 2027 as ABF substrate bottlenecks shift</title>
<pubDate>Thu, 1 Oct 2026 00:07:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD237/asic-abf-substrate-cloud-ai-gpu-2027.html</link>
<description>The high-end cloud AI accelerator market will see a structural shift in 2027, with total ASIC shipments surpassing GPU shipments for the first time, driven by rising output from Google, Amazon, and Huawei. The market will move into a landscape of "dual competition between Nvidia and Google, with multiple players racing to catch up."</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD237/asic-abf-substrate-cloud-ai-gpu-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd237_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>Trump-Xi talks leave chip policies unchanged; US guards AI advantage while China pursues self-reliance</title>
<pubDate>Thu, 1 Oct 2026 00:06:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD231/donald-trump-xi-jinping-ai-chip-policy.html</link>
<description>Following the summit between US President Donald Trump and Chinese President Xi Jinping, market observers broadly agreed that the talks yielded few surprises. The meeting produced limited substantive progress on economic, trade, or diplomatic fronts, making significant shifts in high-stakes technology policy even less likely.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD231/donald-trump-xi-jinping-ai-chip-policy.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd231_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>ChainSea targets fourth-quarter OTC listing as AI transformation business takes shape</title>
<pubDate>Thu, 1 Oct 2026 00:06:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD207/business-taiwan-revenue-outsourcing-2026.html</link>
<description>Digital transformation integrator ChainSea Information Integration plans to list on Taiwan's over-the-counter (OTC) market in the fourth quarter of 2026, with the process expected to take about a month. The listing would make ChainSea Taiwan's first OTC-listed company focused primarily on business process outsourcing (BPO).</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD207/business-taiwan-revenue-outsourcing-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd207_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>Nvidia pushes full-stack AI agent security as OpenAI sits out partner roster</title>
<pubDate>Thu, 1 Oct 2026 00:05:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD204/nvidia-security-openai-software-technology.html</link>
<description>Amid growing concerns over increasingly autonomous AI systems, Nvidia CEO Jensen Huang has repeatedly argued that AI agent jailbreaks are fundamentally an "engineering problem" that can be addressed without slowing AI development.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD204/nvidia-security-openai-software-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260930pd204_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>'I tell myself every day it'll ease': Phison CEO sees years of memory shortage</title>
<pubDate>Wed, 30 Sep 2026 10:09:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260930PD248/phison-ceo-demand-dram-acer.html</link>
<description>Phison Electronics CEO Pua Khein-Seng says he tells himself every day that the memory shortage will ease tomorrow. In reality, he says, AI-driven demand has opened a gap between memory supply and demand that could take many years to close.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260930PD248/phison-ceo-demand-dram-acer.html</guid>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
</channel>
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