<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Sat, 31 Oct 2026 07:00:03 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Nvidia moves beyond GPUs as Meta's Muse agent stack pulls it deeper into AI infrastructure</title>
<pubDate>Fri, 30 Oct 2026 23:35:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261028VL216/meta-infrastructure-nvidia-launch-security.html</link>
<description>The launch of Muse in September across Meta's expanding agent ecosystem has highlighted how quickly AI agents are evolving beyond conventional chatbot architectures, bringing more complex operating requirements and increasingly diversified roles into the definition of what an AI agent can do.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261028VL216/meta-infrastructure-nvidia-launch-security.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261028vl216_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>TSIA 30: The manpower problem behind Taiwan's semiconductor resilience</title>
<pubDate>Fri, 30 Oct 2026 23:34:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL224/taiwan-tsia-manufacturing-talent-technology.html</link>
<description>Taiwan's semiconductor industry has earned its reputation for chip dominance through decades of sustained investment in solving some of the world's hardest technological challenges. That persistence has helped build a manufacturing ecosystem whose industrial density, specialization, and resilience remain difficult for competitors to replicate.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL224/taiwan-tsia-manufacturing-talent-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl224_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Executives from TSMC, MediaTek, Hermes-Epitek, and ASE join a panel discussion at TSIA's 30th anniversary forum. Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>TSIA 30: Taiwan builds the AI backbone &#38;mdash; but can it capture the AI economy?</title>
<pubDate>Fri, 30 Oct 2026 23:34:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL222/taiwan-infrastructure-packaging-manufacturing-technology.html</link>
<description>Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly can all be sourced through an unusually dense industrial base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL222/taiwan-infrastructure-packaging-manufacturing-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl222_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[TSMC VP Lipen Yuan (left) and MediaTek President and COO Joe Chen join a panel discussion at TSIAˇ¦s 30th anniversary forum. Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Marvell-Lumentum talks put optical supply chain in focus</title>
<pubDate>Fri, 30 Oct 2026 23:33:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD240/marvell-acquisition-communications-supply-chain-apple.html</link>
<description>Marvell is reportedly in talks to acquire Lumentum, drawing attention across the optical communications supply chain. The deal would offer strong strategic synergies, particularly through Lumentum's expertise in critical optical transceiver components, but Lumentum's size and its contracts with major customers, including Apple, could make the acquisition difficult.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD240/marvell-acquisition-communications-supply-chain-apple.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd240_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Radiant targets next-gen CPO above 6.4T, eyes 2028 mass production</title>
<pubDate>Fri, 30 Oct 2026 23:32:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD236/radiant-cpo-production-2028-backlight.html</link>
<description>Radiant Opto-Electronics, a major backlight module maker, is expanding into new businesses and targeting next-generation optical communications architecture, particularly co-packaged optics (CPO) applications above 6.4T. Chairman and General Manager Yu-Chao Wang said the company plans to provide samples to selected customers in 2027 and could enter mass production as early as 2028.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD236/radiant-cpo-production-2028-backlight.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AUO targets major revenue contribution from optical engines, glass core substrates within 2 to 3 years</title>
<pubDate>Fri, 30 Oct 2026 23:32:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD233/auo-revenue-communications-packaging-transmission.html</link>
<description>AUO is accelerating its strategic push into optical communications and advanced semiconductor packaging, establishing optical engines and glass core substrates (GCS) as its two primary technological pillars. According to AUO chairman and CEO Paul Peng, while these technologies are still in their early phases and specific operational targets have yet to be finalized, they are projected to make significant contributions to overall revenue within two to three years.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD233/auo-revenue-communications-packaging-transmission.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd233_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: Elon Musk, Jensen Huang clash over neocloud survival</title>
<pubDate>Fri, 30 Oct 2026 23:31:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD229/elon-musk-jensen-huang-outlook-demand-ceo.html</link>
<description>The outlook for AI neocloud providers has sparked a clash between Tesla CEO Elon Musk, who warned that more than 200 such companies could face large-scale failures or consolidation, and Nvidia CEO Jensen Huang, who said during an interview at the GTC Berlin conference that demand for neocloud services has exceeded expectations and current funding shortages will eventually be resolved.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD229/elon-musk-jensen-huang-outlook-demand-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd229_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>Global smartphone shipments fall 14% as brands launch more 5G models</title>
<pubDate>Fri, 30 Oct 2026 23:30:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD228/smartphone-shipments-5g-2026-demand.html</link>
<description>Global smartphone shipments fell an estimated 14% year-over-year in the first three quarters of 2026, even as the number of new 5G smartphone models rose 18.4%, according to DIGITIMES Intelligence. The figures show a divergence between new model launches and actual shipment volumes.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD228/smartphone-shipments-5g-2026-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd228_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>MediaTek raises ASIC outlook as fourth-quarter revenue could jump 32%</title>
<pubDate>Fri, 30 Oct 2026 23:30:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD245/revenue-mediatek-asic-outlook-2026.html</link>
<description>MediaTek reported third-quarter 2026 revenue of NT$168.06 billion (US$5.17 billion), up 10.4% quarter-over-quarter (QoQ) and 18.3% year-over-year, and projected fourth-quarter revenue growth of as much as 32% on accelerating shipments of AI accelerator application-specific integrated circuits (ASICs). The Taiwanese IC design company disclosed the results and outlook at an investor conference on October 30, citing stronger-than-expected customer demand, improved capacity availability, and new smart-device platforms entering mass production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD245/revenue-mediatek-asic-outlook-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd245_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TSIA 30: AI is breaking the sequential supply chain &#38;mdash; Taiwan may be built for what comes next</title>
<pubDate>Fri, 30 Oct 2026 23:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL220/taiwan-supply-chain-tsia-hardware-development.html</link>
<description>The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether dozens of specialized suppliers can move fast enough together.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL220/taiwan-supply-chain-tsia-hardware-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl220_files/3_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[TSMC Vice President of Business Development Lipen Yuan speaks during a panel discussion at TSIAˇ¦s 30th anniversary forum. Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Compeq plans sustained investment as AI infrastructure, LEO satellite demand grows</title>
<pubDate>Fri, 30 Oct 2026 23:29:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD230/compeq-manufacturing-demand-infrastructure-revenue-capacity.html</link>
<description>&lt;p&gt;Compeq Manufacturing is reshaping its product portfolio and expanding capacity in Taiwan and overseas as demand rises for AI data center infrastructure and next-generation low Earth orbit satellite products. It plans annual capex above NT$20 billion (US$616.96 million) from 2026 through 2028, as revenue reaches record levels across its key markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD230/compeq-manufacturing-demand-infrastructure-revenue-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd230_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Ibiden expands AI packaging substrate capacity for Intel from 2029</title>
<pubDate>Fri, 30 Oct 2026 23:29:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD223/ibiden-substrate-packaging-2026-capacity.html</link>
<description>Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to JPY565 billion. The company also announced an additional JPY151 billion in capital investment to expand advanced IC packaging substrate capacity for generative AI servers and CPUs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD223/ibiden-substrate-packaging-2026-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd223_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Ibiden]]></media:description>
</media:content></item>
<item>
<title>Renesas expands AI data center capacity, targets 33.2% margin in 2026</title>
<pubDate>Fri, 30 Oct 2026 23:28:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD222/renesas-2026-revenue-capacity-demand.html</link>
<description>Japan&#38;rsquo;s Renesas Electronics expects strong demand for AI data centers, industrial applications, and automotive semiconductors to drive 2026 revenue to JPY1.6668 trillion (US$10.55 billion), up 26.4% year-over-year, with its operating margin rising to 33.2%, according to its third-quarter 2026 earnings report.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD222/renesas-2026-revenue-capacity-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Infineon's 300mm GaN push turns Europe's power-chip strength into an AI infrastructure bet</title>
<pubDate>Fri, 30 Oct 2026 23:28:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261028VL223/gan-300mm-infineon-infrastructure-europe.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;The aggressive deployment of infrastructure-scale AI projects is rapidly driving up compute demand as chip architectures continue to scale across an expanding ecosystem of data-center racks. At the same time, sustaining those massive buildouts is pushing one of the industry's most critical bottlenecks beyond raw compute toward power delivery and thermal efficiency.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261028VL223/gan-300mm-infineon-infrastructure-europe.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261028vl223_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Caption: A bird's-eye view shot of the site in Villach, Austria. Credit: Infineon Technologies]]></media:description>
</media:content></item>
<item>
<title>DIGITIMES Insight: Arm extends from IP licensing to server CPU products, with strong growth potential in China</title>
<pubDate>Fri, 30 Oct 2026 18:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD227/ai-server-cpu-arm-ip-licensing-digitimes.html</link>
<description>Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI) applications. Meta is a co-developer and primary customer, while OpenAI also plans to adopt the products. Customers can purchase processors directly, reducing the time and cost required to develop and deploy their own chips, while Arm can increase its chip sales revenue.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD227/ai-server-cpu-arm-ip-licensing-digitimes.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd227_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Interview: Why this Taiwan mmWave maker chose to sidestep SpaceX and look to niche markets for demand</title>
<pubDate>Fri, 30 Oct 2026 16:41:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261027PD227/communications-mmwave-market-demand-technology.html</link>
<description>Millimeter-wave (mmWave) technology was previously used mainly in military and aerospace applications, where costs were extremely high. Now, as high-frequency communications and non-terrestrial network (NTN) technologies gain momentum, new opportunities are opening up across the communications industry.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261027PD227/communications-mmwave-market-demand-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261027pd227_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>From living neurons to enterprise AI: TBC pursues faster video generation with AWS</title>
<pubDate>Fri, 30 Oct 2026 14:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL207/ai-startup-video-aws-cost.html</link>
<description>The Biological Computing Co. (TBC), a San Francisco startup that grows living neurons in its lab to find ways to make AI models more efficient, launched its first publicly available product on October 30: mischief 1, an image-to-video model the company says generates video five times faster than the open-weight model it is built on. The release moves TBC's technology from an early-access program to self-serve developer marketplaces and puts a price on the company's argument that biology can be a source of AI efficiency distinct from the standard optimization toolkit.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL207/ai-startup-video-aws-cost.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl207_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: TBC]]></media:description>
</media:content></item>
<item>
<title>Honda targets Level 4 autonomy by 2027, AI maps by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD241/honda-2027-2030-autonomous-driving-technology.html</link>
<description>Honda Motor plans to achieve Level 4 autonomous driving around 2027 and replace high-definition maps with AI technology around 2030, enabling Level 4 vehicles to navigate the narrow roads and mountain routes common in Asia, said Yuji Yasui, a fellow at Honda R&#38;amp;D, at Hon Hai Tech Day 2026 (HHTD26).</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD241/honda-2027-2030-autonomous-driving-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd241_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Micron says 700-plus Taiwan fab workers earned five years' salary in a single year</title>
<pubDate>Fri, 30 Oct 2026 09:34:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL229/micron-taiwan-salary-fab-2026.html</link>
<description>Micron Technology paid its fiscal 2026 bonuses to Taiwan employees on October 30. The company said more than 700 production-line workers earned at least five years' worth of monthly salary in total pay for the year. The payout comes while the union at its Taoyuan fab is still rejecting the company's pay offer.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL229/micron-taiwan-salary-fab-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl229_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Realtek targets 30% AI revenue share by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD239/realtek-revenue-2030-business-2027.html</link>
<description>Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue&#38;mdash;including automotive and robotics applications&#38;mdash;to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD239/realtek-revenue-2030-business-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd239_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD243/mitsubishi-electric-foxconn-2027-revenue-cybersecurity.html</link>
<description>Speaking at Hon Hai Tech Day (HHTD 26), Kazunori Tanaka, Representative Director and President of Mitsubishi Electric Mobility, emphasized that the company's core competitiveness in EV platforms has decisively pivoted toward software&#38;mdash;spanning electric powertrains, autonomous driving, and in-cabin intelligence. Tanaka announced that Mitsubishi Electric Mobility will officially join the Foxconn family in October 2027, leveraging complementary strengths to target JPY1 trillion (approx. US$6.4 billion) in annual revenue by 2030.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD243/mitsubishi-electric-foxconn-2027-revenue-cybersecurity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd243_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Holtek lands major server cooling contract, AI thermal demand soars</title>
<pubDate>Fri, 30 Oct 2026 09:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD234/holtek-server-cooling-demand-mcu-shipments.html</link>
<description>Microcontroller unit (MCU) major Holtek Semiconductor has secured a substantial order for brushless DC (BLDC) motors, with adoption in Taiwanese server cooling fans slated to begin in 2027, paving the way for steep year-over-year growth. In addition, the company's optical communication products, specifically storage area network (SAN) disk arrays tailored for AI servers, are scheduled to enter mass production in the first quarter of 2027.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD234/holtek-server-cooling-demand-mcu-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd234_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China smartphone market and industry, 3Q 2026</title>
<pubDate>Fri, 30 Oct 2026 09:10:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029RS400/china-market-smartphone-shipments-digitimes-2026.html?chid=2</link>
<description>According to DIGITIMES observations and analysis, smartphone memory contract prices in the first half of 2026 often rose 50% to 80% quarter-over-quarter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Personal Computing</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029RS400/china-market-smartphone-shipments-digitimes-2026.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029rs400_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>HHTD 26: The year robots share the stage with AI infrastructure</title>
<pubDate>Fri, 30 Oct 2026 09:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD237/infrastructure-robotics-2026-tdk-robot.html</link>
<description>Hon Hai Tech Day 2026 (HHTD 26) continued to focus on next-generation AI infrastructure. Although the event featured slightly fewer robots than in 2025, it still maintained a dedicated robotics exhibition area where Foxconn and its partners showcased the latest developments in smart manufacturing technology. Participants included KUKA, ABB, and Yaskawa, which are among the four major robotics families, as well as Japanese passive-component manufacturer TDK. Taiwan-based companies including Hiwin, TM Robot, and TECO also joined the exhibition.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD237/infrastructure-robotics-2026-tdk-robot.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd237_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Eutelsat eyes EUR10B revenue from IRIS2 as EU seeks homegrown answer to Starlink</title>
<pubDate>Fri, 30 Oct 2026 08:58:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL226/revenue-eu-starlink-leo-2027.html</link>
<description>Eutelsat said that it predicts at least EUR10 billion (US$11.2 billion) in revenue from 2032 to 2040 as it leads the EU's low Earth orbit (LEO) network initiative IRIS2. The European satellite player is viewed by the EU to be a homegrown alternative to SpaceX's Starlink satellite service and a key to reducing technological reliance on the US.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL226/revenue-eu-starlink-leo-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl226_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>C Sun Mfg invests in Nemstek to expand advanced packaging equipment</title>
<pubDate>Fri, 30 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD235/equipment-packaging-investment-automation-technology.html</link>
<description>C Sun Mfg announced on October 30 that it would subscribe for 1,900 lots of Nemstek's privately placed common shares as a strategic investor, giving it an expected stake of approximately 4.68% upon completion. The investment is intended to combine the companies' plasma treatment, thermal processing and automation capabilities as advanced packaging moves toward higher-density integration.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD235/equipment-packaging-investment-automation-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd235_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments</title>
<pubDate>Fri, 30 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD243/taiwan-shipments-national-development-council-2026-growth.html</link>
<description>Taiwan's economy has stayed in "booming" territory for a record 10th consecutive month, according to the monitoring indicator compiled by the National Development Council (NDC), the government's monthly gauge of the business cycle. The streak, which began in December 2025, reflects continued strength in shipments of electronic and information and communications technology (ICT) products, and surpasses the previous high of nine straight months set from February to October 2021.&lt;img src="./20261029PD243_files/2.jpg" border="0" alt="Credit: Jerry Chen" width="2000" height="1240" /&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD243/taiwan-shipments-national-development-council-2026-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd243_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>SK Hynix taps HBM veteran to lead new American unit</title>
<pubDate>Fri, 30 Oct 2026 08:48:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL227/sk-hynix-hbm-development-americas-technology.html</link>
<description>SK Hynix has appointed its AI memory development chief to lead a newly established Americas unit based in the US, putting a technology veteran closer to major US customers as the industry shifts toward customized high-bandwidth memory (HBM) and deeper collaboration with chip developers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL227/sk-hynix-hbm-development-americas-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl227_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[SK Hynix development chief Ahn Hyun will take charge of the company's new Americas unit. Credit: SK Hynix]]></media:description>
</media:content></item>
<item>
<title>Google, Foxconn aims to cut AI infrastructure deployment to six months</title>
<pubDate>Fri, 30 Oct 2026 08:37:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD242/google-foxconn-infrastructure-partnership-manufacturing.html</link>
<description>Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD242/google-foxconn-infrastructure-partnership-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd242_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms</title>
<pubDate>Fri, 30 Oct 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD232/foxconn-2026-vehicle-design-investment.html</link>
<description>Foxconn Technology Group Chief Strategy Officer Jun Seki unveiled three new electric vehicles (EVs) at Hon Hai Tech Day 2026 (HHTD 26): the Model A+, an SUV derived from the Model A platform; the Model K, a light-duty truck built on a new compact platform; and the Model K+, a small SUV based on the Model K.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD232/foxconn-2026-vehicle-design-investment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd232_files/5_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Foxconn, TECO showcase factory-built infrastructure for AI data center expansion</title>
<pubDate>Fri, 30 Oct 2026 08:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD224/teco-foxconn-data-center-infrastructure-2026.html</link>
<description>Hon Hai (Foxconn) and TECO Electric &#38;amp; Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure. The 40-foot container integrates computing, cooling, power, energy management, and fire protection systems, as the companies target rising global demand for AI computing capacity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD224/teco-foxconn-data-center-infrastructure-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Foxconn argues it is more than a box mover in AI hardware</title>
<pubDate>Fri, 30 Oct 2026 08:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD225/foxconn-design-chairman-manufacturing-young-liu.html</link>
<description>Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image as a simple "Box Mover." At its 2026 Hon Hai Tech Day, Liu described an end-to-end model spanning design, components, assembly, software integration, and global logistics.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD225/foxconn-design-chairman-manufacturing-young-liu.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd225_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China's memory module bellwethers post record profits as 3Q26 momentum fades</title>
<pubDate>Fri, 30 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL212/memory-module-profit-revenue-sina-inventory.html</link>
<description>China's listed memory module makers, whose results offer an early read on how the global memory upcycle is reaching the country's storage supply chain, reported net profit gains of more than 300-fold at the top end for the first nine months of 2026. Yet several of the largest players also posted sharp sequential profit declines in the third quarter, suggesting the windfall from low-cost inventory meeting surging contract prices is narrowing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL212/memory-module-profit-revenue-sina-inventory.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl212_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung SDI posts 12-quarter high in 3Q26 operating profit</title>
<pubDate>Fri, 30 Oct 2026 08:12:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD207/samsung-sdi-operating-profit-2026-lfp-battery-materials.html</link>
<description>Samsung SDI, a major South Korean battery maker, posted strong results in the third quarter of 2026 as rising energy storage system (ESS) battery demand lifted operating profit to its highest level in 12 quarters. The company is also expanding into emerging applications, advancing the commercialization of all-solid-state batteries and securing new cylindrical battery customers in aerospace and humanoid robotics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD207/samsung-sdi-operating-profit-2026-lfp-battery-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>VinFast aims to make India one of its two largest markets as overseas sales trail target</title>
<pubDate>Fri, 30 Oct 2026 07:31:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL216/vinfast-sales-vehicle-asia-nikkei.html</link>
<description>Vietnamese electric vehicle maker VinFast aims to make India one of its two largest markets alongside Vietnam, Tapan Ghosh, CEO of VinFast Asia, told &lt;em&gt;Nikkei Asia&lt;/em&gt; in an interview published on October 28. The Nasdaq-listed company expects Asia, including Vietnam, to account for 90% of its global sales by 2030.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL216/vinfast-sales-vehicle-asia-nikkei.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
</channel>
</rss>

