DIGITIMES: News and Insight of the Global Supply Chain

Solidigm weighs US IPO as AI storage demand lifts valuation

DIGITIMES — Tue, 29 Sep 2026 04:46:05 GMT

SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation of up to US$150 billion and a fundraising target of about US$15 billion. The move comes as AI data centers drive stronger demand for high-capacity enterprise SSDs, putting AI storage businesses in focus for capital markets.

Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

DIGITIMES — Tue, 29 Sep 2026 04:43:01 GMT

Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance computing (HPC) markets. Part of the funding reportedly comes from advance payments by Nvidia and other global technology companies. With Samsung Electro-Mechanics having already entered Nvidia's NVSwitch and Groq 3 supply chains, the two companies' cooperation is expected to extend from an existing supply relationship to dedicated capacity.

US, China eye US$60 billion in tariff relief, but chips stay off the table

DIGITIMES — Tue, 29 Sep 2026 04:25:50 GMT

The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive sectors remain outside the arrangement.

Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

Scarlett Yu — Tue, 29 Sep 2026 03:59:54 GMT

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

Scarlett Yu — Tue, 29 Sep 2026 03:55:16 GMT

At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control, optical interconnects, and panel-level packaging.

Samsung bonus plan to lift South Korea talent race

Lily Hess — Tue, 29 Sep 2026 03:36:07 GMT

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

GlobalFoundries eyes GaN expansion to challenge TSMC in AI

Charlene Chen — Tue, 29 Sep 2026 03:31:47 GMT

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services in 2027. GF said it was the first foundry to proactively approach TSMC and secure a GaN technology license, positioning itself to give existing customers a "seamless migration" path to its own platform.

SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

DIGITIMES — Tue, 29 Sep 2026 03:23:52 GMT

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom. That means work on the generation after next is already underway with the foundry, while its HBM4 is only now being built into Nvidia's Vera Rubin superchip.

GF's MIPS bets on RISC-V physical AI, expands into autos and data centers

Lily Hess — Tue, 29 Sep 2026 03:22:47 GMT

MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical AI, while expanding from AIoT into automotive and data center applications. MIPS said the strategy lowers the barrier for global customers to adopt GF platforms across process technologies and has pushed GF and MIPS to become the world's second-largest processor IP provider.

Taiwan's Brave Eagle reaches 55% domestic content, bringing 200 suppliers into aerospace

Scarlett Yu — Tue, 29 Sep 2026 03:08:26 GMT

Taiwan's Brave Eagle advanced jet trainer program officially concluded its production phase in 2026, but the capabilities developed through the project could mark the beginning of a broader push toward greater defense aerospace self-reliance.

HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5

DIGITIMES — Tue, 29 Sep 2026 03:07:49 GMT

High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate the rollout of new memory capacity amid tightening supplies of both HBM and conventional DRAM.

Exclusive: Inside Tesla's playbook for dodging First Solar's TOPCon patent traps

Yunnie Cheng — Tue, 29 Sep 2026 03:01:07 GMT

Cadmium telluride (CdTe) thin-film solar giant First Solar is widely viewed across the global solar supply chain as the most aggressive litigant in US TOPCon patent infringement disputes. As First Solar does not actually manufacture TOPCon products, industry insiders believe its lawsuits are purely designed to block and suppress competitors. Against this backdrop, how can Tesla navigate its US solar localization strategy while dodging First Solar's patent traps?

Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them

DIGITIMES — Tue, 29 Sep 2026 02:53:04 GMT

Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.

LG expands AI data center cooling ties with Microsoft, SK Enmove

DIGITIMES — Tue, 29 Sep 2026 02:45:47 GMT

LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC) partners. The moves come as demand for data center cooling rises with the rapid buildout of AI infrastructure in the US, South Korea, and other markets.

South Korea looks beyond high-nickel NCM in battery push

DIGITIMES — Tue, 29 Sep 2026 02:44:12 GMT

South Korea is broadening its battery strategy beyond high-nickel NCM, stepping up investment in sodium-ion, all-solid-state and lower-cost technologies after acknowledging that its focus on high-performance batteries left it exposed to China's rapid expansion in the affordable LFP market.

VSMC Singapore fab fully booked as VIS weighs Fab 2

Sherri Wang — Tue, 29 Sep 2026 02:39:25 GMT

Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors begins a preliminary evaluation of a second fab.

TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US

Scarlett Yu — Tue, 29 Sep 2026 02:38:26 GMT

VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing construction in just 22 months.

Vanguard chairman says AI slowdown won't free up chip capacity

Lily Hess — Tue, 29 Sep 2026 02:33:29 GMT

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), officially opened its 12-inch (300mm) wafer fab on September 28 in Tampines, Singapore. Vanguard and VSMC chairman Leuh Fang said the AI-driven crowding out of capacity has spread across the global semiconductor supply chain, leaving almost no company able to say it has sufficient capacity.

Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit

Eifeh Strom — Tue, 29 Sep 2026 02:29:19 GMT

Qualcomm Technologies held its Snapdragon Summit 2026 in Maui, Hawaii, from September 22 to 24. During the keynote on the second day, Qualcomm president and CEO Cristiano Amon spoke with co-founder and CEO of Liquid AI Ramin Hasani.

Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Scarlett Yu — Tue, 29 Sep 2026 02:16:46 GMT

Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend a state dinner hosted by US President Donald Trump and First Lady Melania Trump.

LG AI Research expands sovereign AI push into Kazakhstan, Middle East

DIGITIMES — Tue, 29 Sep 2026 01:59:29 GMT

LG AI Research is moving into Kazakhstan and the Middle East to capture demand for sovereign AI in emerging markets. The South Korea-based unit is using its model development and commercialization experience to pursue overseas deals as US and Chinese firms continue to dominate the global AI market.

Meta adds camera-free AI glasses as Samsung prepares 2026 launch

DIGITIMES — Tue, 29 Sep 2026 01:46:28 GMT

Meta has introduced a camera-free smart glasses model while Samsung Electronics prepares to enter the AI glasses market in 2026, as privacy concerns and product design trade-offs reshape the category. The shift comes amid growing scrutiny of unauthorized filming, changing regulatory expectations, and rapid expansion in China.

South Korean component makers face price cuts as memory costs climb

DIGITIMES — Tue, 29 Sep 2026 01:39:43 GMT

South Korean electronics component suppliers are under growing pressure as rising memory prices drive chip inflation deeper into the supply chain. Finished-goods makers are asking for price cuts of 10% to 20% starting in the third quarter of 2026, while Chinese rivals have been offering bids that are 20% to 30% lower, according to Chosun Biz.

IDC says AI agent growth will widen global compute shortage by 2027

DIGITIMES — Tue, 29 Sep 2026 01:39:32 GMT

AI agents are moving into enterprise workflows and driving a sharp rise in demand for AI infrastructure, with a new report from IDC and IEIT Systems warning that the global compute supply-demand gap will continue widening through 2030. The report, released at the AICC2026 Artificial Intelligence Computing Conference, said high-bandwidth memory (HBM) was the biggest bottleneck.

Meta's Muse raises questions about AI model leadership, product moats

DIGITIMES — Tue, 29 Sep 2026 01:39:19 GMT

Meta's Muse AI agent has become a fresh example in the debate over whether frontier model performance still determines commercial success. In a new Stratechery article, founder Ben Thompson said the AI sector is now facing five forms of overhang: model capability, product, pricing, capital, and safety. He argued that raw model leadership no longer guarantees a durable business moat.

AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

DIGITIMES — Tue, 29 Sep 2026 01:39:06 GMT

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used in consumer appliances have dropped sharply. The split in the market has opened more room for Chinese suppliers in midrange and general-purpose categories as major manufacturers shift capacity toward higher-value products.

Apple's foldable iPhone Duo faces low yields ahead of October launch

DIGITIMES — Tue, 29 Sep 2026 01:38:34 GMT

Apple's first foldable handset, the iPhone Duo, is nearing launch in October, but reports from China said production remains constrained by low yields in final assembly, panels, and hinges. Jiemian News reported that, as of September 17, Hon Hai, also known as Foxconn, had an assembly yield just above 60%, more than a month before sales were set to begin.

Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor

DIGITIMES — Tue, 29 Sep 2026 01:36:41 GMT

Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need for AI. The investment gives the Korean group a stake in a builder that could become a buyer of its chips, cooling equipment, batteries and construction services.

Posco Future M lands KRW1.1 trillion LFP cathode deal with SK On

DIGITIMES — Tue, 29 Sep 2026 01:33:31 GMT

Posco Future M signed a large lithium iron phosphate (LFP) cathode materials supply contract with SK On for 2027 to 2029, in a deal worth about KRW1.1 trillion (US$810 million). The agreement expands the South Korean materials maker's role in battery supply for energy storage systems (ESS) and electric vehicles.

AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips

DIGITIMES — Tue, 29 Sep 2026 01:20:12 GMT

AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the startup's model expertise to shape its future hardware, software and systems.

Blade Hydrogen Green Technology targets waste hydrogen power for AIDC

Rodney Chan — Mon, 28 Sep 2026 23:21:26 GMT

As electricity demand from AI data centers and the semiconductor industry climbs rapidly, Blade Hydrogen Green Technology is tapping industrial byproduct hydrogen and mixed-hydrogen fuel cell technology to turn waste hydrogen into power and support low-carbon electricity supplies for AI data centers (AIDCs) and other sites. The startup has expanded its fuel cell power equipment from 30kW to 150kW and has installed a cumulative 1.65MW of generating capacity in Taiwan.

Advantech's North America expansion signals a deeper shift toward local manufacturing, services

Jingyue Hsiao — Mon, 28 Sep 2026 23:21:16 GMT

Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed and assembled systems across industrial technology markets. The move reflects broader US reshoring efforts, tighter supply-chain requirements, and rising customer interest in regulatory compliance and resilience.

Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B

Jingyue Hsiao — Mon, 28 Sep 2026 23:20:49 GMT

Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only about who can access a system. Enterprises must also ask whom and what they depend on, how concentrated those dependencies are, and what happens when a critical link fails.

HAA free tuition enrollment draws Silicon Valley buzz

DIGITIMES — Mon, 28 Sep 2026 23:20:34 GMT

The Horowitz Andreessen Academy (HAA), a separate education company incubated by Andreessen Horowitz, or a16z, has officially launched and opened applications for its first class. Based in San Francisco, the private full-time school primarily targets recent high school graduates, although students with up to one year of full-time college enrollment may apply, and aims to position itself as a "college alternative."

Taiwan PCB output hits record high on AI demand, putting NT$1 trillion year within reach

Levi Li — Mon, 28 Sep 2026 23:20:13 GMT

AI server, high-speed networking, and memory demand continued to lift Taiwan's PCB industry in the second quarter of 2026, boosting demand for substrates, high-layer-count boards, and HDI products. Tight supplies of advanced materials and rising raw-material costs also pushed PCB prices higher quarter by quarter.

DeepSeek paper says AI agents are learning reward hacking during training

Charlene Chen — Mon, 28 Sep 2026 23:19:48 GMT

DeepSeek founder Wen-Feng Liang's latest paper says AI agents are already learning to exploit system loopholes and bypass intended problem-solving methods during training, underscoring a new challenge for model development: how to stop models from taking shortcuts.

Global 2026 EV sales to grow just 6.5% as Chinese exports become primary driver

Yunnie Cheng — Mon, 28 Sep 2026 23:19:24 GMT

DIGITIMES Intelligence forecasts global electric vehicle (EV) sales to reach 22.34 million units in 2026, representing a modest 6.5% year-over-year increase—a sharp deceleration from the 21.8% growth rate recorded in 2025. Market momentum is pivoting away from the US and China toward Europe and emerging markets. While domestic demand in China weakens, Chinese EV exports are projected to hit approximately 5.1 million units, jumping 49% from 2025 and serving as a critical supply engine for expanding overseas markets.

Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard

Yunnie Cheng — Mon, 28 Sep 2026 23:18:56 GMT

As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.

Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win

Yunnie Cheng — Mon, 28 Sep 2026 23:18:40 GMT

In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS. In the first of this two-part series, Jeng details how a critical thin-interposer crisis forced TSMC and Xilinx to innovate, laying the foundation for modern advanced packaging.

Analysis: Elon Musk's AI safety push clashes with regulation

DIGITIMES — Mon, 28 Sep 2026 23:17:53 GMT

Global AI has entered a period of dramatic turmoil, with leading researchers warning that top labs are "gambling with our lives" and one Anthropic safety researcher saying there is more than a 10% chance AI will wipe out humanity within the next 10 years. That pressure has pushed Anthropic CEO Dario Amodei and OpenAI CEO Sam Altman into rare agreement: slow model development.

Nvidia adds a record US$150 billion to its stock buyback

DIGITIMES — Mon, 28 Sep 2026 14:42:33 GMT

Nvidia's board has approved an extra US$150 billion for the company's share repurchase program. That raises the total still available for buybacks to US$235 billion. The company said on September 28 that it is the largest increase to a buyback authorization in history, and it expects to spend the full amount by the end of fiscal 2028.