<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 4 Jun 2026 07:00:04 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES Asia</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/NewWLogo.gif</url>
</image>
<item>
<title>TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus</title>
<pubDate>Thu, 4 Jun 2026 06:53:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL214/tsmc-capacity-demand-roadmap-2026.html</link>
<description>TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year in which the world's largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL214/tsmc-capacity-demand-roadmap-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl214_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>LG Innotek targets Intel EMIB substrate chain with SK Hynix samples</title>
<pubDate>Thu, 4 Jun 2026 06:47:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL211/lg-innotek-fc-bga-intel-emib-supply-chain.html</link>
<description>&lt;p class="P1" data-start="195" data-end="438"&gt;LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to&lt;em&gt; ZDNet Korea&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL211/lg-innotek-fc-bga-intel-emib-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl211_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Commentary: Wired or wireless, connectivity steals the spotlight at COMPUTEX 2026</title>
<pubDate>Thu, 4 Jun 2026 06:42:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD227/2026-wireless-transmission-chips-nvidia.html</link>
<description>COMPUTEX 2026 was again dominated by the latest computing chips, with Nvidia's RTX Spark drawing heavy attention and debate. Yet another theme is moving closer to the centre of the show: connectivity.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD227/2026-wireless-transmission-chips-nvidia.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd227_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan test interface maker CHPT rides AI chip orders to record May revenue</title>
<pubDate>Thu, 4 Jun 2026 06:41:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD226/chpt-revenue-test-interface-supplier-2026.html</link>
<description>Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from major AI chipmakers as global demand for AI applications continued to rise. Overall operations in the second quarter of 2026 remained on a growth track, the company said.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD226/chpt-revenue-test-interface-supplier-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Apple's MacBook Neo shines amid PC market memory crunch</title>
<pubDate>Thu, 4 Jun 2026 04:54:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD225/pc-apple-market-macbook-shipments.html</link>
<description>Global PC shipments are forecast to fall by 11.3% in 2026, as the PC market worldwide suffers under a memory crunch that is not expected to ease until the end of 2027. However, Apple has emerged as the only company to shine amid the bleak landscape, driven by surprisingly strong demand for its MacBook Neo.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD225/pc-apple-market-macbook-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd225_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
</media:content></item>
<item>
<title>HBM4 supply in focus as SK's Chey meets TSMC's Wei</title>
<pubDate>Thu, 4 Jun 2026 04:50:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL212/tsmc-hbm4-chairman-sk-group-sk-hynix.html</link>
<description>SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL212/tsmc-hbm4-chairman-sk-group-sk-hynix.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl212_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
</media:content></item>
<item>
<title>TSMC chair says CoPoS could scale within years while downplaying risk from Terafab</title>
<pubDate>Thu, 4 Jun 2026 04:50:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD224/tsmc-copos-investment-fab-taiwan.html</link>
<description>Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and operating burden. Chairman C.C. Wei said the company's long-term edge still rests on technology, manufacturing efficiency, and customer trust.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD224/tsmc-copos-investment-fab-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Nvidia's RTX Spark reveals Jensen Huang's bigger AI agent fight with Apple and Google</title>
<pubDate>Thu, 4 Jun 2026 04:27:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD210/nvidia-rtx-jensen-huang-ai-agent.html</link>
<description>Nvidia CEO Jensen Huang introduced RTX Spark, co-developed with MediaTek, at Nvidia GTC Taipei, with PC brands expected to launch products in the third quarter of 2026. While widely seen as Nvidia's return to Windows on Arm after a 15-year absence and a challenge to Qualcomm, RTX Spark points to a larger fight over AI-era endpoints.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD210/nvidia-rtx-jensen-huang-ai-agent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd210_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[From the RTX Spark perspective, Jensen Huang's real rivals may not be Qualcomm, but Apple and even Google. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Formosa Chemicals moves into AI data center materials and DUV photoresist precursors</title>
<pubDate>Thu, 4 Jun 2026 04:11:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD202/materials-data-center-photoresist-duv-production.html</link>
<description>Formosa Chemicals &#38;amp; Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The company said it has shipped a high-RTI flame-retardant polycarbonate material for backup battery modules and cooling fans since 2025, is developing deep ultraviolet photoresist precursor materials, and is advancing a high-purity low-carbon hydrogen project to support semiconductor fabs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD202/materials-data-center-photoresist-duv-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd202_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BYD joins race to build humanoid robots</title>
<pubDate>Thu, 4 Jun 2026 04:10:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL209/byd-humanoid-robot-robotics-manufacturing-hardware.html</link>
<description>BYD is quietly developing humanoid robots, according to people familiar with the matter, signaling that China's largest electric vehicle (EV) maker is preparing to extend its ambitions beyond automobiles and into one of technology's most closely watched emerging industries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL209/byd-humanoid-robot-robotics-manufacturing-hardware.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom</title>
<pubDate>Thu, 4 Jun 2026 04:08:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD234/southern-taiwan-science-park-revenue-2026-semiconductor-industry-taiwan.html</link>
<description>Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026, up 21.3% compared with the same period in 2025, surpassing the NT$1 trillion mark. This performance not only underscores the park's strong expansion momentum but has also reinforced its position at the core of the global high-tech supply chain.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD234/southern-taiwan-science-park-revenue-2026-semiconductor-industry-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd234_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle</title>
<pubDate>Thu, 4 Jun 2026 03:55:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD216/passive-components-high-end-mlcc-demand.html</link>
<description>AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing utilization rates return to high or full-capacity levels. The market is now showing signs of a renewed boom for the first time since the 2018 "super cycle."</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD216/passive-components-high-end-mlcc-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TSMC sees no sign of capex slowdown as demand stays strong</title>
<pubDate>Thu, 4 Jun 2026 03:52:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD220/tsmc-capex-high-na-euv-demand-production.html</link>
<description>TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US, and growing interest in robots and autonomous vehicles.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD220/tsmc-capex-high-na-euv-demand-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd220_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows</title>
<pubDate>Thu, 4 Jun 2026 03:37:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL208/applied-materials-southeast-asia-singapore-workforce-packaging.html</link>
<description>&lt;p class="P1" data-start="273" data-end="561"&gt;Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, &lt;em&gt;Nikkei Asia&lt;/em&gt; reported.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL208/applied-materials-southeast-asia-singapore-workforce-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl208_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>The 'Wintel' of robotics? Nvidia allies with Unitree to standardize AI humanoid development</title>
<pubDate>Thu, 4 Jun 2026 03:01:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD214/nvidia-unitree-robot-robotics-hardware-development.html</link>
<description>In a move set to reshape the global robotics landscape, Nvidia announced at GTC Taipei that it will partner with Chinese humanoid robot pioneer Unitree Robotics to launch the world's first open humanoid robot reference design. By deeply integrating advanced AI with physical hardware, the collaboration aims to drastically lower development barriers across the industry.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD214/nvidia-unitree-robot-robotics-hardware-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Kentec challenges traditional data centers with modular AI data center orders</title>
<pubDate>Thu, 4 Jun 2026 03:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD232/kentec-data-center-aidc-demand-data.html</link>
<description>Global AI computing demand is sweeping through the infrastructure market. Kentec, the AI data center (AIDC) system integrator and turnkey solution provider under Kenmec Mechanical Engineering, expects first-half 2026 revenue to rise more than 200% year on year, with the real surge concentrated in the second half of the year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD232/kentec-data-center-aidc-demand-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd232_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Laster posts April profit as it refocuses automotive orders and eyes Mexico plant</title>
<pubDate>Thu, 4 Jun 2026 02:49:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD217/laster-automotive-profit-mexico-plant.html</link>
<description>LED automotive module maker Laster reported a return to profitability in April after restructuring its order mix to emphasize higher-value products. The company announced consolidated April revenue of NT$687 million (US$21.84 million), down 15% year-over-year, and a pre-tax gain of about NT$26 million; net profit after tax was about NT$29 million, with earnings per share of NT$0.24, a 152% increase year-over-year and a marked improvement from a first quarter loss per share of NT$0.67.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD217/laster-automotive-profit-mexico-plant.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Ability wins surprise Japanese OEM camera order, to boost fourth-quarter 2026 revenue</title>
<pubDate>Thu, 4 Jun 2026 02:47:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD201/ability-enterprise-camera-2026-oem-revenue.html</link>
<description>Ability said it secured a new OEM order from a long-established Japanese camera brand for the second half of the year, a deal the company expects will begin ramping in the fourth quarter of 2026 and provide a significant revenue boost. The company announced the order alongside a major presence at COMPUTEX 2026, where it highlighted AIoT edge computing, smart city deployments, smart retail, and commercial robotics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD201/ability-enterprise-camera-2026-oem-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd201_files/3_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure</title>
<pubDate>Thu, 4 Jun 2026 02:45:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL205/european-commission-europe-semiconductors-ai-cloud-infrastructure.html</link>
<description>The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL205/european-commission-europe-semiconductors-ai-cloud-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl205_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan's defense institute unveils 3 military robot dogs built on Ghost Robotics platform</title>
<pubDate>Thu, 4 Jun 2026 02:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD233/robot-taiwan-military-technology-supply-chain.html</link>
<description>Taiwan's state-owned defense research body, the National Chung-Shan Institute of Science &#38;amp; Technology (NCSIST), has unveiled three military robot dog variants developed on a platform from US firm Ghost Robotics, highlighting its ability to integrate mission payload systems. The showcase underscores Taiwan-US technology cooperation and NCSIST's push to build a non-red supply chain.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD233/robot-taiwan-military-technology-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd233_files/4_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: National Chung-Shan Institute of Science &#38; Technology]]></media:description>
</media:content></item>
<item>
<title>Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging</title>
<pubDate>Thu, 4 Jun 2026 02:39:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD204/huawei-ai-chip-glass-substrate-3d-packaging.html</link>
<description>Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route for China to extend AI chip performance in the post-Moore's Law era.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD204/huawei-ai-chip-glass-substrate-3d-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: HKC]]></media:description>
</media:content></item>
<item>
<title>Exclusive: How China's subsidized SiC boom is driving global prices to the floor</title>
<pubDate>Thu, 4 Jun 2026 02:36:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD203/sic-substrate-silicon.html</link>
<description>China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping the global compound semiconductor industry.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD203/sic-substrate-silicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd203_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Qualcomm says Snapdragon C fills entry-level AI PC gap, not tied to Apple</title>
<pubDate>Thu, 4 Jun 2026 02:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD211/qualcomm-snapdragon-apple-ai-pc-market.html</link>
<description>Qualcomm's new entry-level Snapdragon C lineup is not directly tied to Apple, according to Kedar Kondap, senior vice president and general manager of compute and gaming at Qualcomm. The company launched the product line to fill a gap in its entry-level portfolio while maintaining its emphasis on low power consumption and high performance.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD211/qualcomm-snapdragon-apple-ai-pc-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Huawei's MineHarmony OS links 935 mining devices in China's smart mining push</title>
<pubDate>Thu, 4 Jun 2026 02:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603VL205/huawei-industrial-equipment-harmony-software.html</link>
<description>Huawei's MineHarmony (Mine Harmony OS), a mining-focused industrial Internet of Things operating system jointly developed with China Energy Group, has surpassed 200 ecosystem partners and 935 certified devices, highlighting the growing adoption of domestically developed industrial software in China's mining sector.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603VL205/huawei-industrial-equipment-harmony-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603vl205_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
</media:content></item>
<item>
<title>Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers</title>
<pubDate>Thu, 4 Jun 2026 02:10:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD209/sic-price-compound-semiconductor-data-center-infrastructure-2026.html</link>
<description>At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a compound semiconductor material whose ability to handle high voltages and large currents has made it a critical enabler of the industry's shift toward 800-volt high-voltage direct current (HVDC) power systems.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD209/sic-price-compound-semiconductor-data-center-infrastructure-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd209_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Delta Electronics pushes 800V HVDC systems as AI rack power nears megawatt levels</title>
<pubDate>Thu, 4 Jun 2026 02:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD217/delta-electronics-ai-server.html</link>
<description>Delta Electronics warned that existing AC-DC power architectures will face fundamental challenges within the next one to two years as AI server rack power approaches megawatt levels, and said high-voltage direct current power designs are emerging as the key solution. The company announced the PowerCycle MW-class HVDC supply that supports 800V and &#38;plusmn;400V architectures and uses flexible rack deployment of power and battery backup modules to optimize space, cooling, resilience, and scalability.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD217/delta-electronics-ai-server.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd217_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>SK and TSMC deepen HBM, advanced packaging tie-up</title>
<pubDate>Thu, 4 Jun 2026 01:54:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD211/tsmc-sk-hynix-hbm-packaging.html</link>
<description>SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed how to shape the future of the AI ecosystem. The meeting underscored closer ties between the two companies, which plan further to strengthen cooperation in next-generation HBM and advanced packaging.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604PD211/tsmc-sk-hynix-hbm-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604pd211_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
</media:content></item>
<item>
<title>xMEMS tackles data center heat with chip-level cooling tech</title>
<pubDate>Thu, 4 Jun 2026 01:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602PD241/cooling-demand-technology-data-performance.html</link>
<description>Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related slowdowns are becoming a growing bottleneck for both computing performance and data-transfer efficiency.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260602PD241/cooling-demand-technology-data-performance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260602pd241_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: xMEMS]]></media:description>
</media:content></item>
<item>
<title>MiTAC Computing confident in 2026 growth amid AI server expansion</title>
<pubDate>Thu, 4 Jun 2026 01:44:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD235/mitac-subsidiary-ai-server-growth-2026.html</link>
<description>MiTAC Computing Technology, a subsidiary of MiTAC Holdings, has no doubt that operations will grow in 2026, according to company president Rick Hwang. The company has two new US facilities scheduled to begin operations by the end of the third quarter of 2026, while a new plant in Vietnam started mass production in April.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD235/mitac-subsidiary-ai-server-growth-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd235_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[MiTAC Computing president Rick Hwang. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Pegatron sees AI server expansion accelerating as organizational overhaul nears completion</title>
<pubDate>Thu, 4 Jun 2026 01:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD204/pegatron-ai-server-market-expansion-2026.html</link>
<description>Pegatron is betting that the AI server market will keep expanding, even though it entered later than some peers. The company said 2026 will mark the start of a full-speed push as generative AI shifts toward inference and both agentic and physical AI begin real-world deployment.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD204/pegatron-ai-server-market-expansion-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Broadcom says AI chip revenue on track to exceed US$100 billion in 2027, rules out rack business</title>
<pubDate>Thu, 4 Jun 2026 01:18:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL201/broadcom-revenue-business-earnings-2027.html</link>
<description>At the earnings call on June 3, Broadcom said its AI semiconductor business continued to accelerate in the fiscal second quarter, with revenue reaching a record US$10.8 billion, up 143% from a year earlier, and bookings exceeding US$30 billion. CEO Hock Tan said demand for custom accelerators and networking remained "simply insatiable," adding that the company expects AI semiconductor revenue to double in the second half of fiscal 2026 from the first half.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL201/broadcom-revenue-business-earnings-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Broadcom advances OpenAI custom chip program, expands Anthropic AI compute initiative</title>
<pubDate>Thu, 4 Jun 2026 01:18:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL202/broadcom-anthropic-openai-revenue-2026.html</link>
<description>Broadcom said its AI semiconductor business remained in an "insatiable" demand environment on its second quarter of fiscal 2026 earnings call on June 3, as it outlined progress with its six core customers, including Google, OpenAI, Meta, Anthropic, and Apollo-backed programs. Chief Executive Hock Tan said the company's AI semiconductor revenue reached a record US$10.8 billion in the quarter, up 143% year on year, and added that networking made up almost 40% of AI revenue. He also said bookings topped US$30 billion, while shipments totaled US$10.8 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL202/broadcom-anthropic-openai-revenue-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Meta expands AI push with Business Agent rollout as pricing speculation and enterprise competition intensify</title>
<pubDate>Thu, 4 Jun 2026 01:17:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL203/meta-competition-business-openai-anthropic.html</link>
<description>Meta Platforms has unveiled its Meta Business Agent, an artificial intelligence tool designed to help businesses automate customer interactions and expand into what it describes as "agentic" workflows, according to its official press release dated June 3, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL203/meta-competition-business-openai-anthropic.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl203_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Broadcom forecasts strong third-quarter growth, but AI revenue outlook misses elevated expectations</title>
<pubDate>Thu, 4 Jun 2026 00:56:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL200/broadcom-revenue-outlook-growth-forecast.html</link>
<description>Broadcom reported record second-quarter revenue and raised expectations for the current quarter, but its outlook for artificial intelligence (AI) semiconductor sales fell short of elevated market expectations, prompting a sharp decline in the company's shares in after-hours trading.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260604VL200/broadcom-revenue-outlook-growth-forecast.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260604vl200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>800VDC could reshape data center power markets as regulation and supply chains lag</title>
<pubDate>Wed, 3 Jun 2026 23:11:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260601PD221/data-center-gpu-cooling-regulation.html</link>
<description>Data center power systems are nearing a major transition as GPU rack densities rise toward the 600 kW range. A new report from&lt;em&gt; SemiAnalysis&lt;/em&gt; said 800VDC direct-current distribution is moving beyond hyperscale trials and could alter how data centers are built, powered, and regulated.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260601PD221/data-center-gpu-cooling-regulation.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260601pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BOE races Samsung for Gen 8.6 OLED title despite low yield</title>
<pubDate>Wed, 3 Jun 2026 23:11:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602VL218/boe-sdc-oled-panel-efficiency-ai-pc.html</link>
<description>&lt;p class="P1" data-start="552" data-end="795"&gt;BOE is preparing to hold a mass-production shipment ceremony for its Gen 8.6 IT OLED line in mid-June, positioning the Chinese display maker to claim a first-mover title even as its production yield remains below 30%, according to &lt;em&gt;ZDNet Korea&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260602VL218/boe-sdc-oled-panel-efficiency-ai-pc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260602vl218_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek</title>
<pubDate>Wed, 3 Jun 2026 23:10:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD226/cpo-amd-siph-mediatek-photonics.html</link>
<description>Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026&#38;ndash;2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD226/cpo-amd-siph-mediatek-photonics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's green energy industry shifts from manufacturing race to resilience strategy</title>
<pubDate>Wed, 3 Jun 2026 23:10:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260601PD222/taiwan-green-energy-solar-hardware-industrial.html</link>
<description>Taiwan's green energy industry is emerging from more than two decades of boom, retreats, and shakeouts with a different strategic focus. What began as a contest in hardware manufacturing has become a test of industrial sovereignty, financial discipline, and geopolitical adaptation.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260601PD222/taiwan-green-energy-solar-hardware-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260601pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Goldkey targets NT$10B funding to lock in memory supply as prices surge</title>
<pubDate>Wed, 3 Jun 2026 23:10:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260601PD234/industrial-control-revenue-2026-ddr4-gross-margin.html</link>
<description>Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising contract prices fuel a memory supercycle. The company also plans to accelerate a shift into higher-value segments such as industrial control, AI, and edge computing after posting a 30% gross margin and 27.4% operating margin in the first quarter of 2026.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260601PD234/industrial-control-revenue-2026-ddr4-gross-margin.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260601pd234_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Japan's robotics legacy faces a new challenge: commercial success</title>
<pubDate>Wed, 3 Jun 2026 23:08:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602PD221/robotics-industrial.html</link>
<description>At the close of his keynote address at the Humanoids Summit in Tokyo, Hiroshi Ishiguro &#38;mdash; one of the pioneers of humanoid robotics &#38;mdash; offered a candid assessment of the industry's progress: despite decades of investment and research, Japan has yet to produce a truly transformative, mass-market application for robotics.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260602PD221/robotics-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260602pd221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Chip test equipment makers hit by FPGA, CPU supply crunch</title>
<pubDate>Wed, 3 Jun 2026 23:07:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260601VL218/chips-testing-equipment-cpu-fpga-demand.html</link>
<description>&lt;p class="P1" data-start="565" data-end="809"&gt;Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to &lt;em&gt;The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260601VL218/chips-testing-equipment-cpu-fpga-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260601vl218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Intel]]></media:description>
</media:content></item>
<item>
<title>RISC-V will be 'default ISA of choice' for all new chip designs, architecture's CEO predicts</title>
<pubDate>Wed, 3 Jun 2026 23:07:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603VL217/risc-v-ceo-software-mips-computex-2026.html</link>
<description>Andrea Gallo, CEO of RISC-V International, used his appearance at the MIPS Forum during Computex 2026 to declare that RISC-V has completed its transition from academic project to industrial standard &#38;mdash; and that its dominance in physical AI is no longer a future prediction but a present reality.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603VL217/risc-v-ceo-software-mips-computex-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603vl217_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
</media:content></item>
<item>
<title>Kioxia weighs new NAND fab as AI demand drives long-term expansion plans</title>
<pubDate>Wed, 3 Jun 2026 23:06:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603VL214/kioxia-nand-fab-expansion.html</link>
<description>Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company prepares for sustained growth in AI-driven storage demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603VL214/kioxia-nand-fab-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603vl214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan courts the world's AI startups in a bid to secure chip future</title>
<pubDate>Wed, 3 Jun 2026 23:06:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD219/taiwan-design-development-hardware-ic.html</link>
<description>Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its world-leading chip ecosystem.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD219/taiwan-design-development-hardware-ic.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd219_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Innodisk, Qualcomm and Formosa Plastics roll out GenAI-powered industrial safety vision</title>
<pubDate>Wed, 3 Jun 2026 23:05:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD225/display-system-qualcomm-formosa-plastics-innodisk-genai-industrial.html</link>
<description>Innodisk announced a strategic partnership with Qualcomm and Formosa Plastics Group to launch an AI industrial safety vision solution that upgrades surveillance into intelligent video monitoring and decision-making tools. The collaboration combines Qualcomm Insight Platform AI imaging software, Innodisk's edge AI servers and computing platforms, and Formosa Plastics' field deployment and systems integration capabilities to deliver GenAI search and natural-language conversation features for industrial sites.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD225/display-system-qualcomm-formosa-plastics-innodisk-genai-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd225_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>As satellite networks expand, telecom operators gain influence</title>
<pubDate>Wed, 3 Jun 2026 23:05:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602PD236/telecom-taiwan-broadband-market.html</link>
<description>The race to build space-based internet networks is accelerating. But as thousands of low-Earth orbit satellites enter orbit, a more fundamental question is taking shape: who will control access to the customer?</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260602PD236/telecom-taiwan-broadband-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260602pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Interview: Andhra Pradesh moves to become India's semiconductor packaging hub</title>
<pubDate>Wed, 3 Jun 2026 23:04:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603VL215/india-pcb-packaging-semiconductors-computex.html</link>
<description>Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&#38;amp;C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway &#38;mdash; with four PCB manufacturers having already begun operations, according to him.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603VL215/india-pcb-packaging-semiconductors-computex.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603vl215_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's Walsin Technology gains pricing power from AI demand</title>
<pubDate>Wed, 3 Jun 2026 23:03:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD231/walsin-mlcc-price-electronics-demand.html</link>
<description>&lt;p class="P1" data-start="784" data-end="900"&gt;Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will raise prices on resistors and selected capacitor products beginning June 1, citing mounting cost pressures and robust demand from AI-related applications. The move makes Walsin one of the first Taiwanese MLCC suppliers to formally implement a new round of price increases, and a sign that the inflationary effects of the artificial intelligence (AI) boom are spreading deeper into the electronics supply chain.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD231/walsin-mlcc-price-electronics-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd231_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools</title>
<pubDate>Wed, 3 Jun 2026 23:02:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD220/eda-huawei-design-performance-software.html</link>
<description>Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal transmission time constant, known as &#38;tau;, through multi-layer optimization across devices, circuits, architectures, systems, and algorithms.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD220/eda-huawei-design-performance-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd220_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>E Ink and BMW advance automotive color-changing tech toward market readiness</title>
<pubDate>Wed, 3 Jun 2026 23:01:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD218/market-e-ink-bmw-technology-automotive.html</link>
<description>Taiwan-based electronic paper leader E Ink Holdings is preparing to bring its color-changing vehicle technology to market after overcoming key regulatory and technical hurdles with BMW. The milestone marks a significant step in the company's strategy to extend e-paper beyond displays and into vehicle exteriors, consumer products, and large-scale architectural surfaces.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603PD218/market-e-ink-bmw-technology-automotive.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603pd218_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Notebook shipment update, April 2026</title>
<pubDate>Wed, 3 Jun 2026 09:58:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603RS400/2026-shipments-2025-lenovo-acer.html?chid=2</link>
<description>Affected by weakened channel stocking momentum and a high base period, shipments of the top five notebook brands fell 33% sequentially in April 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Notebooks</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260603RS400/2026-shipments-2025-lenovo-acer.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260603rs400_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
</channel>
</rss>

