DIGITIMES: News and Insight of the Global Supply Chain

Western Digital argues AI's longer payoff lies in stored data, not compute

DIGITIMES — Fri, 23 Oct 2026 01:59:00 GMT

Western Digital argues that demand for hard drives depends less on the current wave of AI spending than investors fear. On its fiscal first-quarter earnings call on October 22, the company said demand for disk storage now comes from four separate sources: cloud services, model training, inference and AI agents, and physical AI. Each, it said, could offset weakness in the others. The company is also trying to move hard drives into faster AI workloads that are currently served by flash memory.

AI cuts chip R&D cycles to 9 months, says Etron chair

Lily Hess — Fri, 23 Oct 2026 01:55:00 GMT

AI-driven growth will push the semiconductor industry past the US$1.6 trillion mark in 2026, while accelerating chip development cycles to one new product every nine months, Etron Chairman Nicky Lu said. He warned that the next 3 to 5 years will be critical for Taiwan, which risks facing intense competition unless it builds stronger software, system, and architecture advantages.

DeepSeek reportedly raises US$15B as IPO plans gather pace

DIGITIMES — Fri, 23 Oct 2026 01:54:48 GMT

Chinese artificial intelligence (AI) startup DeepSeek has raised about US$15 billion in its latest private funding round, giving it substantially more financial firepower as it prepares for a potential initial public offering (IPO) and intensifies its challenge to leading US AI developers.

LG Display returns to profit as OLED mix offsets chipflation drag

DIGITIMES — Fri, 23 Oct 2026 01:41:06 GMT

LG Display (LGD) returned to an operating profit in the third quarter of 2026, showing how far its OLED shift now drives earnings, and how little room it leaves when currency and component costs turn against it. Operating profit was KRW250.6 billion (approx. US$188.96 million), compared with a loss in the second quarter, on revenue of KRW6.28 trillion, up 12% from the previous quarter but down 10% from a year earlier, according to the company's preliminary filing on October 22.

Unitree's cumulative G1 humanoid robot output reaches 10,000–20,000 units

Eifeh Strom — Fri, 23 Oct 2026 01:35:08 GMT

Unitree Robotics continues to expand production of its humanoid robots but still faces challenges in production capacity and artificial intelligence (AI) technology as it works to scale up production for widespread adoption.

LG Display pitches mask-free FLiPP as its answer to rivals' 8.6G OLED lines

DIGITIMES — Fri, 23 Oct 2026 01:33:30 GMT

LG Display is presenting FLiPP, its new OLED patterning process, as its answer to competitors' large IT OLED factories, but it has not yet committed to building a line. On its third-quarter earnings call on October 22, executives outlined the process's advantages and said, "the size or the timing of such investment and production have not been finalized yet."

Western Digital widens margins on pricing and exabyte growth

DIGITIMES — Fri, 23 Oct 2026 01:31:05 GMT

Western Digital's fiscal first quarter showed a hard-drive business turning demand into profit faster than into sales. Revenue for the three months ended October 2, 2026 rose 55% from a year earlier to US$4.38 billion, while GAAP gross margin climbed to 57.8% from 43.5%, according to the results release the company filed with the US Securities and Exchange Commission on October 22. Its guidance indicates margins will widen further in the December quarter.

Why is TSMC suddenly looking at Texas?

Yunnie Cheng — Fri, 23 Oct 2026 00:50:57 GMT

TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess expansion opportunities. TSMC is also discussing cooperation with Elon Musk's Terafab, on the condition that it keeps operational control. Together, the moves could shift TSMC's US strategy from expanding existing sites to choosing new locations and exploring capacity partnerships.

Interview: TI sees liquid cooling shift to tray-level control in AI data centers

Jingyue Hsiao — Fri, 23 Oct 2026 00:45:13 GMT

Liquid cooling in AI data centers is moving toward more granular control architectures. Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), told DIGITIMES that as next-generation GPU computing power and rack power continue to rise, thermal management will shift from centralized control by a CDU to independent control for each server tray, a shift that will increase the use of sensors, drivers, MCUs, and other components within each rack.

India's CleanMax partners with Apple, Meta to supply green power for AI data centers

Jingyue Hsiao — Fri, 23 Oct 2026 00:45:02 GMT

CleanMax's partnerships with Apple, Meta, and other technology companies highlight how artificial intelligence (AI) data centers are intensifying global demand for renewable power.

Elan targets drone market with solutions contributing revenue in 2026 and 2027

Lily Hess — Fri, 23 Oct 2026 00:44:49 GMT

Elan Microelectronics is pursuing drone opportunities across multiple applications, showcasing a broad range of solutions at the 2026 TAITRONICS expo. Solutions developed with Taiwanese drone maker Thunder Tiger stood out at the company's exhibition area, with several offerings expected to begin contributing to revenue in 2026 and 2027.

LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing

Yunnie Cheng — Fri, 23 Oct 2026 00:44:32 GMT

LG Electronics is expanding its artificial intelligence (AI) footprint on two fronts: in-house appliance chips and GPU compute services. On one hand, the company is scaling up the deployment of custom AI chips in its home appliances to boost product differentiation. On the other hand, PADO, a startup incubated and spun off by LG NOVA (LG's North American Innovation Center), is entering the GPU compute leasing and brokerage market to explore data center opportunities.

Salesforce Taiwan targets double-digit growth as AI adoption accelerates

Kevin Wang — Fri, 23 Oct 2026 00:43:49 GMT

Salesforce has seen sustained growth in both revenue and new customer count, as the company's Taiwan office approaches its first anniversary. According to Salesforce Taiwan general manager Chia-shen Hsu, Agentforce and Data 360 deployments account for roughly 40% of newly signed deals, showing that local companies are moving from evaluating AI technology to applying it in real business scenarios.

CHT launches AI imaging unit, targets IPO

DIGITIMES — Fri, 23 Oct 2026 00:38:01 GMT

Chunghwa Telecom (CHT) has established Chunghwa Yaocih Technology to expand into AI and intelligent imaging, holding its inauguration and unveiling ceremony on October 22. The new company will focus on AI, image recognition, and smart security as CHT deepens its digital transformation services for businesses and government agencies.

Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles

Scarlett Yu — Fri, 23 Oct 2026 00:37:31 GMT

Tesla's three new Roadster variants could face different regulatory pathways before they are allowed on public roads—or take to the skies.

Samsung Foundry targets automotive, edge AI chips with 8LPU+

Lily Hess — Fri, 23 Oct 2026 00:37:06 GMT

Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform in 2026. The move targets demand for automotive electronics, robots, and edge AI chips while leveraging existing deep ultraviolet (DUV) production lines to control wafer costs.

AUO reshapes businesses with 'quasi-holding company' model

Charlene Chen — Fri, 23 Oct 2026 00:36:51 GMT

AUO is entering the next chapter of its transformation as Chairman and CEO Paul Peng establishes a "quasi-holding company" model, turning its three major operating pillars into separate corporate entities to sharpen performance evaluations and resource allocation while distinguishing core from noncore businesses.

UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging

Levi Li — Fri, 23 Oct 2026 00:36:39 GMT

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench capacitor (DTC) technology and wafer manufacturing capabilities with AP Memory's silicon capacitor design and system integration expertise. The collaboration comes as rising power consumption in AI and high-performance computing (HPC) chips accelerates the shift towards near-chip power delivery and advanced packaging integration.

Oppo targets premium smartphone growth with global Find X10 launch

DIGITIMES — Fri, 23 Oct 2026 00:36:20 GMT

Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move marked the company's latest effort to strengthen premium smartphone shipments as competition intensifies and overall demand remains under pressure.

Taiwan, UK expand offshore wind, CCUS energy cooperation

DIGITIMES — Fri, 23 Oct 2026 00:36:09 GMT

Taiwan and the UK deepened cooperation on offshore wind, carbon capture, and energy security at two bilateral meetings held recently in Taipei. The 21st Taiwan-UK Renewable Energy Exchange Conference brought together about 80 government, industry, and research representatives to discuss energy policy, technical practices, and collaboration on low-carbon technologies. The eighth Taiwan-UK Energy Dialogue Conference followed that afternoon.

Lam Research sees WFE topping US$200 billion in 2027

Charlene Chen — Fri, 23 Oct 2026 00:35:36 GMT

Lam Research reported third-quarter 2026 revenue of US$8.2 billion, up 22% quarter-over-quarter, and forecast fourth-quarter revenue of US$8.6 billion, plus or minus US$400 million. The semiconductor equipment maker expects the wafer fabrication equipment (WFE) market to reach the mid-US$150 billion range in 2026 and initially forecasts more than US$200 billion in 2027, with percentage growth led by DRAM.

PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion

Charlene Chen — Fri, 23 Oct 2026 00:32:18 GMT

Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business and evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint ventures with customers. Its product portfolio includes integrated passive devices (IPDs), interposers, wafer-on-wafer (WoW) technology, and post-wafer finish (PWF) services, with demand for IPDs expected to remain visible through 2028 as AI server power consumption rises.

Compal and Verda expand AI cloud infrastructure partnership

Lily Hess — Fri, 23 Oct 2026 00:32:03 GMT

Verda and Compal Electronics have expanded their partnership to support Verda's rapidly growing AI infrastructure footprint, combining Verda's AI cloud expertise with Compal's expanding global manufacturing network and advanced AI server engineering capabilities. The companies showcased the results of their collaboration at GTC Berlin 2026 as demand for AI computing continues to rise across Europe and global markets.

Midea's Clivet targets AI cooling market with compressor redesign

DIGITIMES — Fri, 23 Oct 2026 00:31:52 GMT

Clivet, the Italian climate-control company owned by Midea, is applying its refrigeration expertise to the AI data center market, introducing a redesigned compressor as part of a broader cooling portfolio. The push builds on established air-conditioning technologies while addressing demands for efficient operation and uninterrupted cooling in high-density computing facilities.

SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

DIGITIMES — Fri, 23 Oct 2026 00:31:36 GMT

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.

AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking

DIGITIMES — Fri, 23 Oct 2026 00:26:04 GMT

China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research and manufacturing customer, marking a step forward in China's efforts to develop indigenous equipment for next-generation 3D chips.

Micron overhauls pay in Taiwan as unions push for profit sharing

DIGITIMES — Thu, 22 Oct 2026 12:59:37 GMT

Micron is overhauling how it pays employees, promising quarterly profit-sharing bonuses and better pay and benefits for its Taiwan staff. The changes follow a labor dispute with the company's unions in Taiwan.

PSMC raises mature-node prices again, targets 20% increase in 2027

Charlene Chen — Thu, 22 Oct 2026 10:28:24 GMT

Powerchip Semiconductor Manufacturing (PSMC) reported third-quarter 2026 revenue of NT$21.3 billion (US$654.3 million), up 23% quarter-over-quarter, as higher foundry prices, a stronger average selling price (ASP) and improved capacity utilization lifted gross margin from 28% to 48% and drove net profit to NT$6.5 billion. With AI servers fueling demand for memory, power-management ICs and advanced packaging, PSMC expects double-digit revenue growth in the fourth quarter and has indicated that foundry prices will rise another 10% to 20% in 2027.

Taiwan-France semiconductor alliance strengthens with CPU pact between SiPearl and Egis Group

DIGITIMES — Thu, 22 Oct 2026 10:26:35 GMT

Highlighting the deepening industrial synergies between Europe and Asia, the Egis Group TechDay Taiwan-France Strategic CPU Partnership Signing Ceremony hosted the official signing between Egis Group and SiPearl. The landmark ceremony unveiled a joint initiative to build a Mobius 100 CPU and UCIe chiplet-based marketplace, establishing a cooperative framework for sovereign AI and high-performance computing (HPC) data center infrastructure.

ADEPT Taiwan holds inaugural in-person meeting as PLP and substrate standardization efforts gain momentum

Scarlett Yu — Thu, 22 Oct 2026 08:36:11 GMT

The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.

U-Power listing highlights Taiwan's growing need for high-speed EV charging

Jingyue Hsiao — Thu, 22 Oct 2026 08:20:00 GMT

U-Power, Taiwan's ultra-fast electric vehicle (EV) charging operator, has applied to list on the Taipei Exchange as the country's expanding EV population supports expectations for sustained charging demand. The company, which plans an emerging-stock listing in early November, reported higher first-half revenue but remained unprofitable as it continues investing in infrastructure.

MIPI expands beyond smartphones into AR glasses and humanoid robots

Lily Hess — Thu, 22 Oct 2026 07:39:08 GMT

The MIPI Alliance held this year's MIPI Demo Day Taipei at the Grand Hyatt Taipei this week, where 16 member companies demonstrated working products to more than 200 developers and engineers. Founded in 2003 to standardize camera and display interfaces for smartphones, the alliance now serves automotive, IoT, industrial, medical, and PC applications, with AI driving its next expansion into AR glasses and humanoid robots.

Infineon, Nvidia push gallium nitride power for 800-volt AI data centers

DIGITIMES — Thu, 22 Oct 2026 07:26:46 GMT

Infineon Technologies is expanding its work with Nvidia on 800-volt direct current power architectures for AI data centers, with a focus on gallium nitride (GaN) chips in the intermediate bus converter (IBC), the company said on October 21.

Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B

Charlene Chen — Thu, 22 Oct 2026 07:19:07 GMT

As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology is expanding its role in Arizona, from core facility systems and equipment hook-up to materials supply. Chi Yi Hsin Technology said its backlog reached NT$4.476 billion (US$137.5 million) as of the end of September 2026, with projects scheduled for execution through around 2028 and overall order visibility extending to 2030.

Apex Science & Engineering expands automotive and medical display push

Jingyue Hsiao — Thu, 22 Oct 2026 07:19:00 GMT

Apex Science & Engineering is expanding its optoelectronics business in automotive and medical markets, with booked but undelivered orders worth approximately NT$105.7 million (US$3.24 million). Exports have accounted for 73% of the division's sales since the start of 2026, highlighting its exposure to international demand as it develops display modules for industrial, consumer, and public-sector applications worldwide.