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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032</title>
<pubDate>Tue, 22 Sep 2026 04:38:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD224/alibaba-data-infrastructure-chips-qwen.html</link>
<description>Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group chairman Joe Tsai made a rare appearance at the opening ceremony and said AI is moving from frontier exploration toward real-world deployment and large-scale applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>BOE looks beyond displays with glass substrates for AI packaging</title>
<pubDate>Tue, 22 Sep 2026 04:30:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD225/boe-display-packaging-business-growth.html</link>
<description>Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that the company's glass substrates are undergoing customer validation, marking a shift from technology development toward customer adoption.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[BOE chairman Chen Yanshun. Credit: BOE]]></media:description>
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<item>
<title>Samsung weighs 4nm expansion as HBM4 demand strains capacity</title>
<pubDate>Tue, 22 Sep 2026 04:28:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL209/samsung-4nm-hbm4-capacity-demand.html</link>
<description>&lt;p class="P1" data-start="2012" data-end="2324"&gt;Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full utilization, South Korea's &lt;em data-start="2173" data-end="2186"&gt;Money Today&lt;/em&gt; reported on September 21. The company is also reviewing whether to build a new 2nm production line for base dies in future HBM5 products.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>TSMC and ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung</title>
<pubDate>Tue, 22 Sep 2026 03:58:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD212/packaging-tsmc-ase-kaohsiung-demand.html</link>
<description>&lt;p class="P1" data-start="2054" data-end="2508"&gt;Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park in Kaohsiung, where construction has formally begun on what is billed as Taiwan's first advanced packaging supply-chain cluster. Led by TSMC, the park's first phase has already been fully allocated, and a groundbreaking ceremony on September 21 drew more than 20 semiconductor companies, including TSMC, Foxconn, and ASE.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Escalating risks, evolving safeguards: a chronological look at OpenAI's safety strategy</title>
<pubDate>Tue, 22 Sep 2026 03:51:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL208/openai-anthropic-testing-security-api.html</link>
<description>&lt;p class="P1" data-start="2977" data-end="3344"&gt;As artificial intelligence advances toward greater autonomy, balancing capabilities with safety has become a central challenge for industry leaders. Emerging model behaviors and high-profile security incidents have prompted a continuous evolution of safety initiatives, internal engineering adjustments, and proposed joint testing efforts between major AI developers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Chinese AMOLED material suppliers set for revenue gains as Gen 8 fabs boost localization</title>
<pubDate>Tue, 22 Sep 2026 03:29:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PR200/amoled-revenue-localization-growth-forecast.html</link>
<description>Chinese AMOLED material suppliers are poised to gain market share as new 8G OLED fabs expand capacity in China. The shift could reshape supply chains for global display buyers, while also accelerating global demand for materials used in notebooks, premium panels, and future OLED Macs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Googlebook opens preorders at US$899 for AI laptops</title>
<pubDate>Tue, 22 Sep 2026 03:26:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD218/google-gemini-android-apps-desktop.html</link>
<description>&lt;p class="P1" data-start="2821" data-end="3171"&gt;Google has opened preorders for the first Googlebook models, with prices starting at US$899, as it pushes Gemini AI deeper into the notebook experience and links phones, apps, and desktop workflows through a new operating system that blends Android and ChromeOS elements. The launch targets Android users, developers, and the premium notebook market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout</title>
<pubDate>Tue, 22 Sep 2026 03:15:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL203/semicon-plant-production-commercial-chips.html</link>
<description>Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September 17, alongside CDIL Semiconductor's assembly, testing, marking, and packaging unit in Mohali, Punjab. The two start-ups bring the number of semiconductor projects in commercial production in India to five, according to &lt;em&gt;The New Indian Express&lt;/em&gt;, joining Micron, Kaynes Semicon, and CG Semi at Sanand in Gujarat.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries</title>
<pubDate>Tue, 22 Sep 2026 03:14:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD216/sic-capacity-demand-wafer-silicon.html</link>
<description>&lt;p class="P1" data-start="2048" data-end="2462"&gt;China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers. The surge in orders has tightened SiC wafer capacity in China, and some offshore companies seeking foundry partners there have reportedly been turned away, pushing spillover business toward Taiwan, where Episil, HYS, and Diodes are among the names cited as potential beneficiaries.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<item>
<title>MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices</title>
<pubDate>Tue, 22 Sep 2026 03:06:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PR201/mediatek-dimensity-performance-wireless-gemini.html</link>
<description>&lt;p class="P1" data-start="1185" data-end="1526"&gt;MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery life, and wireless performance could shape consumer computing worldwide. The Dimensity CX C10 Max is built for thinner systems, faster multitasking, and privacy-focused Gemini features in markets beyond Asia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: MediaTek]]></media:description>
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<item>
<title>Meta's rumored Luna smart glasses may go camera-free for lighter design</title>
<pubDate>Tue, 22 Sep 2026 03:00:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD213/meta-smart-glasses-2026-camera-market.html</link>
<description>&lt;p class="P1" data-start="2167" data-end="2442"&gt;Meta Connect 2026 is set to begin on September 23, with the next generation of AI smart glasses expected to be a key focus. Among the products drawing particular industry attention is a device internally code-named "Luna," which is reportedly being designed without a camera.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<item>
<title>Taiwan advances major science park expansion to support AI, semiconductor growth</title>
<pubDate>Tue, 22 Sep 2026 02:54:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD217/expansion-taiwan-growth-science-park-development.html</link>
<description>&lt;p class="P1" data-start="3218" data-end="3479"&gt;Demand from high-tech companies for new research and manufacturing sites remains strong, prompting Taiwan to advance plans to expand Longtan Science Park by 104 hectares as the government seeks to accommodate continued growth in AI and semiconductor industries.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<title>Apple's reported AI server push could reshape its role in enterprise infrastructure</title>
<pubDate>Tue, 22 Sep 2026 02:49:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD205/apple-infrastructure-ai-inference-market-chips.html</link>
<description>&lt;p class="P1" data-start="2005" data-end="2334"&gt;Apple is reportedly developing an enterprise AI inference server powered by its in-house M8 Ultra chips. This move could mark its return to the enterprise server market after more than a decade. If the project reaches market, it may also reshape Apple's infrastructure strategy, supplier relationships, and place in AI computing.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Brussels will put a public efficiency grade on Europe's data centers before it decides what to require of them</title>
<pubDate>Tue, 22 Sep 2026 02:36:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL201/europe-data-center-data-capacity-efficiency.html</link>
<description>&lt;p class="P1" data-start="2616" data-end="3145"&gt;Europe intends to triple its data center capacity within five to seven years. On September 21, the European Commission set out how it plans to monitor that expansion: a common EU rating scheme that will attach a public electronic label, covering energy and water use, to every data center in the bloc with at least 500kW of installed IT power demand. The label provides ratings; it does not yet impose requirements. Binding minimum performance standards are a separate proposal, and the consultation on them opened only that day.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Huaqin challenges Quanta for Steam Deck ODM order</title>
<pubDate>Tue, 22 Sep 2026 02:16:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD215/steam-deck-odm-huaqin-quanta-gaming.html</link>
<description>&lt;p class="P1" data-start="2988" data-end="3242"&gt;Industry sources say Valve is expected to launch a new Steam Deck in 2027, setting up a tougher contest for Taiwanese original design manufacturer (ODM) Quanta as China's Huaqin moves to win the manufacturing order. The winner has not yet been confirmed.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<item>
<title>Taiwanese auto industry eyes 2027 for zero-tariff US cars</title>
<pubDate>Tue, 22 Sep 2026 02:11:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD206/taiwan-auto-industry-2027-outlook-ceo.html</link>
<description>&lt;p class="P1" data-start="2081" data-end="2387"&gt;Taiwan's auto industry is watching closely as tariff talks between Taiwan and the US continue to shape the sector's outlook. PG Union CEO Ray Wu said in an interview on September 21 that the two sides are still negotiating the new policy, and the process must clear three hurdles before it can take effect.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Microsoft Taiwan to double data centers as AI computing demand exceeds supply</title>
<pubDate>Tue, 22 Sep 2026 02:05:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD200/data-microsoft-taiwan-demand-microsoft-taiwan.html</link>
<description>&lt;p class="P1" data-start="2963" data-end="3287"&gt;Microsoft is expanding its data center footprint in Taiwan from two facilities to four as global demand for artificial intelligence (AI) computing power continues to surge and industry players step up data center expansion. Microsoft Taiwan general manager Sean Pien said the new facilities will prioritize Taiwan customers.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>ASML opens India operations but ties any scale-up to Tata's Dholera fab</title>
<pubDate>Tue, 22 Sep 2026 01:56:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL202/asml-fab-12-inch-2026-president.html</link>
<description>ASML has begun operations in India with an initial team of 20-30 engineering graduates, and has made clear that any expansion beyond that depends on Tata Electronics delivering the country's first 12-inch wafer fab on time.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's Hai Kun submarine in final testing stages, eyes October delivery</title>
<pubDate>Tue, 22 Sep 2026 01:55:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD237/taiwan-testing-kaohsiung-national-defense.html</link>
<description>&lt;p class="P1" data-start="2416" data-end="2825"&gt;Taiwan's first domestically built submarine, the Hai Kun, was seen leaving Kaohsiung Port on September 21 for its 21st sea trial and 15th diving test. The vessel has remained out of public view for nearly two months since setting sail on July 30. The project is now entering the final stretch, following a period of in-depth adjustments, raising the possibility that it could be delivered as early as October.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<title>China puts AI computing into orbit with first integrated satellite launch</title>
<pubDate>Tue, 22 Sep 2026 01:51:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL205/launch-data-commercial-infrastructure-development.html</link>
<description>China has taken another step toward deploying artificial intelligence (AI) computing infrastructure in space after a commercial rocket launched nine satellites, including the country's first integrated "rocket-and-satellite" AI computing project.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Nscale seeks New York listing as AI infrastructure demand tests investor appetite</title>
<pubDate>Tue, 22 Sep 2026 01:46:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD203/infrastructure-demand-nyse-2026-nvidia.html</link>
<description>British neocloud provider Nscale has filed to list on the New York Stock Exchange, seeking up to US$3 billion in a deal that could value the company at US$30 billion to US$35 billion. The offering will serve as a test of global investor appetite for AI infrastructure, data centers, and compute capacity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>YMTC's capital arm enters FD-SOI &#38;mdash; China's 12-inch SOI build-out gathers pace</title>
<pubDate>Tue, 22 Sep 2026 01:45:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD211/soi-fd-soi-12-inch-investment-ymtc.html</link>
<description>&lt;p class="P1" data-start="3719" data-end="4109"&gt;China's FD-SOI supply chain is taking shape through a new round of investment. Changcun Capital, the investment platform backed by YMTC, participated in a strategic investment in FD-SOI developer Ruili Pingxin Microelectronics in August, drawing attention to whether Chinese semiconductor capital is expanding beyond memory manufacturing into specialty logic and wafer foundry technologies.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: 2026 International RF-SOI Forum]]></media:description>
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<title>China's memory race turns inward &#38;mdash; CXMT, YMTC head toward patent showdown</title>
<pubDate>Tue, 22 Sep 2026 01:33:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD210/ymtc-cxmt-patent-dram-nand.html</link>
<description>&lt;p class="P1" data-start="3001" data-end="3294"&gt;Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and NAND flash have risen sharply, while China's two flagship memory makers, CXMT and YMTC, are preparing to break from their long-standing division of the market.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Xpeng plans to license tech to more foreign automakers</title>
<pubDate>Tue, 22 Sep 2026 01:25:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922PD202/technology-automakers-volkswagen-revenue-software.html</link>
<description>&lt;p class="P1" data-start="3053" data-end="3271"&gt;Chinese EV maker Xpeng is planning to offer its technology to foreign automakers beyond Volkswagen, according to people familiar with the matter, as technology licensing emerges as a new revenue engine for the company.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook</title>
<pubDate>Tue, 22 Sep 2026 00:23:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260922VL204/mediatek-dimensity-3nm-chips-npu.html</link>
<description>MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Tesla speeds up Optimus mass production with China supply chain visits</title>
<pubDate>Mon, 21 Sep 2026 23:20:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD235/tesla-production-optimus-robot-supply-chain.html</link>
<description>Tesla is reportedly making new progress toward mass production of its Optimus humanoid robots, with the company's robot team conducting intensive supplier audits across China's Yangtze River Delta last week. The visits covered Ningbo, Hangzhou, and Shanghai and included potential suppliers Tuopu Group, Sanhua Holding Group, and Joyson Electronics, all of which are existing Tesla automotive suppliers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD235/tesla-production-optimus-robot-supply-chain.html</guid>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Acer founder urges talent, trust, and innovation in AI era</title>
<pubDate>Mon, 21 Sep 2026 23:19:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD236/acer-talent-governance-taiwan-technology.html</link>
<description>As the global order is being reshaped and AI is rapidly transforming economic and governance systems, Acer founder and StanShih Foundation chairman Stan Shih said leadership competitiveness no longer depends on how much technology a company controls, but on what governance values it chooses.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260921pd236_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Analysis: Will AI glasses replace the iPhone? &#38;mdash;Cook and Ternus see it differently</title>
<pubDate>Mon, 21 Sep 2026 23:14:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD230/apple-iphone-tim-cook-john-ternus-ceo.html?chid=12</link>
<description>Following Apple's executive transition, former CEO Tim Cook and new chief John Ternus have presented contrasting visions for the next generation of mobile devices, spotlighting a key strategic divide as the company prepares for the post-iPhone era.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Commentary</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AirTAC sees pneumatic demand cycle extending through 2027 on China automation growth</title>
<pubDate>Mon, 21 Sep 2026 23:13:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD228/demand-airtac-international-automation-2027-revenue.html</link>
<description>&lt;p class="P1" data-start="2256" data-end="2610"&gt;AirTAC International Group said demand for pneumatic components in China's automation market has entered a more gradual expansion phase, and executives said the current upturn could last through 2027. The outlook came as the Taiwanese pneumatic equipment maker reported strong results for the first half of 2026 and an even faster rise in August revenue.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260921pd228_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nvidia Rubin architecture drives high-end MLCC demand, solidifying Murata, SEMCO leadership</title>
<pubDate>Mon, 21 Sep 2026 23:13:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD217/mlcc-market-murata-nvidia-demand.html</link>
<description>&lt;p class="P1" data-start="2671" data-end="3096"&gt;While market focus surrounding AI infrastructure has centered primarily on core computing components&#38;mdash;such as GPUs, CPUs, high-bandwidth memory (HBM), and networking hardware&#38;mdash;rising chip performance, power consumption, and rack density are rapidly elevating the need for power stability. As a result, high-end multilayer ceramic capacitors (MLCCs) are emerging as critical passive components in next-generation AI deployments.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD217/mlcc-market-murata-nvidia-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd217_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>EZconn eyes 2027 high-core fiber ramp as shortages persist</title>
<pubDate>Mon, 21 Sep 2026 23:12:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD221/ezconn-2027-demand-2026-data-center.html</link>
<description>&lt;p class="P1" data-start="3396" data-end="3826"&gt;EZconn said global fiber and optical cable supplies remain tight as AI data center demand overtakes demand from traditional telecom applications, pushing up raw material prices and boosting costs for optical passive components. The company expects the shortage to ease gradually from the second half of 2026 into 2027 as upstream suppliers add capacity, while it negotiates for larger allocations and longer-term supply contracts.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD221/ezconn-2027-demand-2026-data-center.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>AI inference demand surges as training slowdown talk fades</title>
<pubDate>Mon, 21 Sep 2026 23:12:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD226/training-demand-ai-inference-infrastructure-ceo.html</link>
<description>Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout is aimed at AI inference, not training. The event, held from September 15 to 17, became a broad response to Anthropic CEO Dario Amodei's September 12 essay urging frontier AI labs to slow the pace of capability gains.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD226/training-demand-ai-inference-infrastructure-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>China carmakers lean on exports as domestic sales stall</title>
<pubDate>Mon, 21 Sep 2026 23:11:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD219/exports-sales-auto-industry-market-growth.html</link>
<description>&lt;p class="P1" data-start="3094" data-end="3517"&gt;China's auto industry is increasingly relying on exports to sustain growth as domestic demand remains weak, industry sources said, ahead of a possible visit by Chinese President Xi Jinping to the US for a summit with US President Donald Trump. Online reports that Beijing may include BYD in a business delegation have fueled speculation the EV maker could use the trip to ease trade frictions and protect overseas momentum.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD219/exports-sales-auto-industry-market-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027</title>
<pubDate>Mon, 21 Sep 2026 23:10:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD213/ar-glasses-shipments-2027-2026-adoption.html</link>
<description>&lt;p class="P1" data-start="1699" data-end="2475"&gt;The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like ordinary eyewear. The China International Optoelectronic Exposition (CIOE) 2026 showed how differently the two critical component groups &#38;mdash; microdisplays and waveguides &#38;mdash; are responding to that constraint. Microdisplay makers are trading away a modest amount of resolution for smaller Micro LED panel areas, pushing light engines below 0.1cc, and pairing those engines with geometric, surface-relief, and volume-holographic waveguides from multiple suppliers to demonstrate complete near-eye modules and, in some cases, complete glasses. Taken together, the show indicates that AR display technology has reached a workable level of maturity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD213/ar-glasses-shipments-2027-2026-adoption.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd213_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>US iPhone 18 Pro Max teardown reveals Qualcomm modem, suggesting prior supply-chain commitments</title>
<pubDate>Mon, 21 Sep 2026 23:09:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD211/apple-iphone-modem-qualcomm-flagship.html</link>
<description>Apple's latest flagship iPhone 18 Pro series is now shipping, and the choice of modem chip has drawn close market attention. A newly released teardown report has revealed an unexpected exception: the US iPhone 18 Pro Max still uses Qualcomm's Snapdragon X80 rather than Apple's newly announced in-house C2 chip.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Loyalty Founder Enterprise sees AI server expansion lifting growth outlook</title>
<pubDate>Mon, 21 Sep 2026 23:06:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD200/founder-growth-expansion-production-supplier.html</link>
<description>&lt;p class="P1" data-start="1784" data-end="2117"&gt;Loyalty Founder Enterprise's push into AI servers, storage, and networking is beginning to boost scale and profitability, with implications for global data center supply chains. As demand for AI infrastructure stays strong and new overseas capacity nears launch, the company is positioning itself for broader growth in 2027 and 2028.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD200/founder-growth-expansion-production-supplier.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Bill Wang, chairman of Compuse Enterprise, Loyalty Founder Enterprise's parent. Credit: DIGITIMES]]></media:description>
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<item>
<title>Trade, AI, rare earths, and Iran shape Xi-Trump 2.0 talks</title>
<pubDate>Mon, 21 Sep 2026 17:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD229/beijing.html</link>
<description>US Treasury Secretary Scott Bessent and Chinese Vice Premier Li-Feng He held talks in New York on September 20, 2026, joined by US Trade Representative Jamieson Greer and China International Trade Representative Cheng-Gang Li, as Beijing and Washington prepared for the summit between US President Donald Trump and Chinese President Jin-Ping Xi on September 24 in Washington.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260921PD229/beijing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260921pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Microsoft CEO expected at Trump-Xi dinner amid rising AI debate</title>
<pubDate>Mon, 21 Sep 2026 12:43:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260921PD232/microsoft-ceo-apple-nvidia-xi-jinping.html</link>
<description>Microsoft CEO Satya Nadella was expected to attend this week's White House state dinner for Chinese President Xi Jinping, joining top executives from Apple, OpenAI, Nvidia and Qualcomm, according to people familiar with the matter. The dinner comes as the Trump-Xi summit puts AI policy, trade and technology ties under heightened scrutiny.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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