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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Marvell says SerDes and packaging are key hurdles in switch chip development</title>
<pubDate>Fri, 5 Jun 2026 02:45:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD212/marvell-switch-packaging-development-performance.html</link>
<description>Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging &#38;mdash; issues that affect network capacity, signal quality, and cost across global data centers. The company is advancing its 100T TerraLynx T100 chip while preparing for more complex designs, higher speeds, and tighter integration ahead.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market</title>
<pubDate>Fri, 5 Jun 2026 02:28:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD211/intel-foxconn-partnership-edge-ai-manufacturing.html</link>
<description>Foxconn and Intel have announced a strategic partnership focused on AI racks, Edge AI, and Physical AI. The move signals Intel's effort to rebuild competitiveness in a market increasingly shaped by Nvidia's dominance in AI training and inference.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Foxconn]]></media:description>
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<title>AI cooling demand is pushing server pumps into sharper focus</title>
<pubDate>Fri, 5 Jun 2026 02:26:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD204/avc-liquid-cooling-demand-design.html</link>
<description>As AI pushes liquid cooling into mainstream server thermal design, suppliers are widening their focus beyond Nvidia's benchmark thermal designs. Industry players say pumps are emerging as a key lever for improving cooling efficiency, alongside flow rate and fluid speed.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert</title>
<pubDate>Fri, 5 Jun 2026 02:17:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD217/cxmt-samsung-sk-hynix-talent-hbm.html</link>
<description>More than 200 South Korean engineers are conservatively estimated to be working at CXMT, China's leading DRAM maker, according to industry sources. Chinese semiconductor companies are stepping up talent acquisition, moving from broad outreach to targeted recruitment of core semiconductor R&#38;amp;D personnel in South Korea and the US. Observers say the shift could accelerate the narrowing of the semiconductor technology gap between China and South Korea.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: CXMT]]></media:description>
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<title>Commentary: EU tariff barrier may weaken as Japanese automakers lean on China's EV tech</title>
<pubDate>Fri, 5 Jun 2026 01:52:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD213/eu-tariffs-bev-japan-automakers-china.html</link>
<description>Japanese automakers' growing reliance on Chinese EV technology could weaken the EU's tariff strategy and reshape global car trade. As Mazda, Nissan, Honda, and Toyota adjust their electric plans, Europe may face more China-linked vehicles entering through third-country partners, altering competition, costs, and the pace of EV adoption worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Memory crunch pushes low-end smartphones toward 2026 breaking point</title>
<pubDate>Fri, 5 Jun 2026 01:42:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD200/2026-global-smartphone-market-smartphone-shipments.html</link>
<description>The global smartphone market performed better than expected in the first quarter of 2026 after some brands pulled forward orders, but shipments still fell by about 3.1% from a year earlier, ending nine consecutive quarters of growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Commentary: Memory boom driven by DRAM now, but HBM will decide future</title>
<pubDate>Fri, 5 Jun 2026 01:37:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD207/dram-hbm-demand-samsung-sk-hynix.html</link>
<description>AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported strong earnings, prompting the market to reassess the strategic role of memory in AI infrastructure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Arm says Taiwan powers its rise as agentic AI lifts PC growth</title>
<pubDate>Thu, 4 Jun 2026 23:54:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD229/arm-taiwan-growth-pc-ceo.html</link>
<description>Arm CEO Rene Haas told the COMPUTEX keynote on June 2 that Taiwan has been inseparable from Arm's growth over the past 30 years, while Nvidia CEO Jensen Huang said that agentic AI will trigger the biggest PC industry transformation in 40 years and could expand the global PC market by 10 times.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>TSMC CEO says rising profits mean greater social responsibility, clarifies bonus considerations</title>
<pubDate>Thu, 4 Jun 2026 23:53:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD237/tsmc-taiwan-ceo-demand-investment.html</link>
<description>Taiwan Semiconductor Manufacturing Company (TSMC) held its shareholders meeting on June 4, during which CEO C.C. Wei addressed recent talk surrounding its employee bonus system. He opened the meeting by preemptively clarifying the issue, saying there are misconceptions in the public discussion.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>TSMC says AI demand is straining the entire supply chain, not just chipmakers</title>
<pubDate>Thu, 4 Jun 2026 23:50:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260605PD203/tsmc-demand-supply-chain-chairman-equipment.html</link>
<description>TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment, and upstream suppliers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Hiwin targets logistics automation with Dexterity dual-arm robot</title>
<pubDate>Thu, 4 Jun 2026 23:47:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260603PD230/robot-logistics-component-technology-equipment.html</link>
<description>Motion control component maker Hiwin made its first cross-sector appearance at COMPUTEX 2026, showcasing a full technology stack spanning precision transmission, actuator modules, and system integration. The company also unveiled a dual-arm logistics robot developed in partnership with US logistics firm Dexterity for the first time.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: HIWIN]]></media:description>
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<title>Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption</title>
<pubDate>Thu, 4 Jun 2026 23:47:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602VL220/shenzhen-wearable-smart-glasses-adoption.html</link>
<description>This year's Global Connect Show (GSC) in Shenzhen, China, has become a medium for local tech brands to showcase AI wearable innovation. Two leading brands at GCS, Rokid and INMO, demoed their feature-packed AI glasses. Many companies featured AI translation as their flagship capability, paired with lightweight hardware, hands-free controls, customizable designs, and flexible model support. While on-site demos proved these up-and-coming brands' AI glasses may outperform dominant players such as Meta and Apple, there are still lingering flaws, such as battery life and privacy ethics, that stand in the way of mainstream mass adoption.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows</title>
<pubDate>Thu, 4 Jun 2026 23:47:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL217/hanmi-demand-computex-revenue-hbm4.html</link>
<description>Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and gives it a prominent stage for its Computex debut.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI energy demand drives a shift to vertical power delivery and smaller modules</title>
<pubDate>Thu, 4 Jun 2026 23:46:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL216/demand-industrial-infineon-power-components-silicon-technology.html</link>
<description>As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the "AI factories" of the future. This concern was the centerpiece of presentations by several industry figures at Computex in Taipei, where they presented solutions under development, from raw material innovations to shrinking component sizes.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Jeff Morroni, VP and head of R&#38;D of Texas Instruments' Kilby Labs. Credit: DIGITIMES]]></media:description>
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<title>SYNergy ScienTech eyes drone market with semi-solid cells</title>
<pubDate>Thu, 4 Jun 2026 23:45:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD236/solid-state-battery-drone-production.html</link>
<description>SYNergy ScienTech is developing semi-solid and all-solid-state cell product lines, with semi-solid cells already in trial production and all-solid-state cells slated for trial production in 2027, both targeting the drone market. President Colin Hsieh said drones will be a key market for the company.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20260604pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Foxconn, Intel link chips, racks and systems in AI infrastructure push</title>
<pubDate>Thu, 4 Jun 2026 23:45:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD233/foxconn-intel-infrastructure-chips-partnership.html</link>
<description>Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack infrastructure, edge AI, and physical AI platforms. The partnership will also extend to design services for custom ASICs, SoCs, and system integration, combining Intel's processor, silicon photonics, and software ecosystem with Foxconn's global manufacturing scale, system integration capabilities, and AI data center deployment experience.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Foxconn chairman Young Liu (left) and Intel CEO Lip-Bu Tan. Credit: Foxconn]]></media:description>
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<title>South Korea's only SRAM-CIM IP firm Articron targets edge AI</title>
<pubDate>Thu, 4 Jun 2026 23:44:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD223/semiconductors-ip-startup-ic-design-sram.html</link>
<description>South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute chip IP "ART" now in testing and aimed at the power- and area-sensitive edge AI device market. The company says it expects to launch a commercial product in about two years.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Articron]]></media:description>
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<title>RTX Spark rekindles memory shortages, TeamGroup shifts to industrial control</title>
<pubDate>Thu, 4 Jun 2026 23:44:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD219/pc-market-rtx-industrial-control-sales.html</link>
<description>Although PC market sales have slumped amid rising memory prices, Nvidia's "N1X" RTX Spark superchip is also fueling hopes for AI PC potential. TeamGroup General Manager Gerry Chen said the N1X can be configured with up to 128GB of memory, but there is simply not enough memory available right now, meaning supply shortages will grow even more severe.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Qualcomm says Wi-Fi 8 prioritizes reliability over speed</title>
<pubDate>Thu, 4 Jun 2026 23:44:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD218/qualcomm-wi-fi-antenna-wi-fi-7-performance.html</link>
<description>Qualcomm recently outlined its vision for Wi-Fi 8, saying the next-generation standard is designed to improve overall reliability, lower latency, and expand coverage. The company said the shift from Wi-Fi 7 to Wi-Fi 8 reflects a broader end-to-end ecosystem approach, from infrastructure to the client side.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
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<title>Foxconn says Nvidia's Vera Rubin AI products remain on track for 2026 shipment</title>
<pubDate>Thu, 4 Jun 2026 23:43:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD206/foxconn-fii-nvidia-rubin-production-2026.html</link>
<description>Foxconn and Foxconn Industrial Internet (FII) said at Computex that production of Nvidia's next-generation AI products is progressing smoothly, with shipments expected before the end of the third quarter of 2026. The outlook matters globally because it signals faster AI hardware deployment, lower computing costs, and wider adoption across consumer, enterprise, and automotive markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Ventec wins spillover high-speed CCL orders, revenue rises</title>
<pubDate>Thu, 4 Jun 2026 08:36:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD234/ventec-ccl-revenue-materials-2026.html</link>
<description>Ventec International said May 2026 revenue kept growing, driven by sustained demand for high-margin aerospace polyimide (PI) materials, the start of mass production after high-speed material certifications, and record-high sales of non-flow PP sheets. The copper-clad laminate (CCL) maker also benefited from strong demand for high-end drilling applications and a rising European distribution business, lifting revenue across its niche businesses.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Foxconn, SK Group eye deeper AI infrastructure ties in Asia</title>
<pubDate>Thu, 4 Jun 2026 08:34:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD231/foxconn-sk-group-data-center-infrastructure.html</link>
<description>&lt;p class="P1" data-start="293" data-end="464"&gt;Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<title>Samsung's rumored CIS production shift highlights industry debate over fab ownership</title>
<pubDate>Thu, 4 Jun 2026 08:24:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260602VL200/samsung-lsi-cis-manufacturing-production.html</link>
<description>Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether chip designers should own manufacturing capacity or rely on external foundries as competition intensifies across smartphones, automotive systems, and AI-enabled devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TSMC chairman dismisses rival cluster pushes, says Taiwan's supply chain remains unmatched</title>
<pubDate>Thu, 4 Jun 2026 08:10:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD232/tsmc-chairman-c.-c.-wei-supply-chain-taiwan-2026.html</link>
<description>TSMC chairman C.C. Wei spoke at a media briefing on June 4, 2026, after the company's shareholders' meeting. South Korea's push to build a semiconductor cluster, Arizona's efforts to establish a supply chain ecosystem, and Nvidia CEO Jensen Huang's recent trip to South Korea were all topics of discussion.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Tripo AI raises nearly US$200 million to expand 3D and world model research</title>
<pubDate>Thu, 4 Jun 2026 08:08:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PR200/ai-startup-financing-3d-development.html</link>
<description>Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Tripo AI]]></media:description>
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<title>Chenbro targets server rack global leadership in 3 years</title>
<pubDate>Thu, 4 Jun 2026 07:38:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD205/chenbro-servers-chassis-business.html</link>
<description>Server chassis maker Chenbro is continuing to evolve, aiming to perfect the craftsmanship of mechanical components to become the world's top rack supplier, according to company CEO Corona Chen.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Chenbro CEO Corona Chen (L) and chairperson Maggi Chen (R). Credit: DIGITIMES]]></media:description>
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<title>Adlink ramps robotics and edge AI expansion as US market drives growth</title>
<pubDate>Thu, 4 Jun 2026 07:21:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD200/adlink-robotics-edge-ai-revenue-growth-2026.html</link>
<description>Adlink Technologies said it pushed into a growth phase for robotics, edge AI, and vertical markets in 2026 as the US became its largest revenue engine, accounting for more than 30% of sales. The industrial PC maker reported broad-based demand across healthcare, transportation, defense, energy, and industrial automation and said design-in projects will start contributing shipments from 2026 into 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Anduril and Taiwan sign drone cooperation MOU to deepen AI-autonomy and localize supply chains</title>
<pubDate>Thu, 4 Jun 2026 07:14:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD221/taiwan-anduril-drone-manufacturing-localization.html</link>
<description>Anduril Industries and Taiwan's Metal Industries Research and Development Center signed a memorandum of understanding to deepen collaboration on unmanned aerial vehicle key technologies, executives announced during a recent visit that included a stop at Computex 2026. The agreement targets AI autonomous systems, drone manufacturing, supply-chain localization, and the construction of non-red supply chains to boost Taiwan's international cooperation and global competitiveness in the drone sector.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: Metal Industries Research and Development Center]]></media:description>
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<title>Nvidia's Jensen Huang courts Korean giants in robotics expansion</title>
<pubDate>Thu, 4 Jun 2026 07:07:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL213/nvidia-jensen-huang-south-korea-robotics-doosan.html</link>
<description>&lt;p class="P1" data-start="316" data-end="557"&gt;Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates beyond semiconductors and into robotics, autonomous driving, and industrial automation, &lt;em&gt;ETNews&lt;/em&gt; reported.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus</title>
<pubDate>Thu, 4 Jun 2026 06:53:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL214/tsmc-capacity-demand-roadmap-2026.html</link>
<description>TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year in which the world's largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>LG Innotek targets Intel EMIB substrate chain with SK Hynix samples</title>
<pubDate>Thu, 4 Jun 2026 06:47:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL211/lg-innotek-fc-bga-intel-emib-supply-chain.html</link>
<description>&lt;p class="P1" data-start="195" data-end="438"&gt;LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to&lt;em&gt; ZDNet Korea&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: Wired or wireless, connectivity steals the spotlight at Computex 2026</title>
<pubDate>Thu, 4 Jun 2026 06:42:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD227/nvidia-transmission-wireless-chips-computex-2026.html</link>
<description>Computex 2026 was again dominated by the latest computing chips, with Nvidia's RTX Spark drawing heavy attention and debate. Yet another theme is moving closer to the centre of the show: connectivity.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan test interface maker CHPT rides AI chip orders to record May revenue</title>
<pubDate>Thu, 4 Jun 2026 06:41:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD226/chpt-revenue-test-interface-supplier-2026.html</link>
<description>Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from major AI chipmakers as global demand for AI applications continued to rise. Overall operations in the second quarter of 2026 remained on a growth track, the company said.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Apple's MacBook Neo shines amid PC market memory crunch</title>
<pubDate>Thu, 4 Jun 2026 04:54:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604PD225/pc-apple-market-macbook-shipments.html</link>
<description>Global PC shipments are forecast to fall by 11.3% in 2026, as the PC market worldwide suffers under a memory crunch that is not expected to ease until the end of 2027. However, Apple has emerged as the only company to shine amid the bleak landscape, driven by surprisingly strong demand for its MacBook Neo.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
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<title>HBM4 supply in focus as SK's Chey meets TSMC's Wei</title>
<pubDate>Thu, 4 Jun 2026 04:50:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260604VL212/tsmc-hbm4-chairman-sk-group-sk-hynix.html</link>
<description>SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
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