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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Samsung transfers 126 technologies free of charge to 99 smaller Korean firms</title>
<pubDate>Tue, 20 Oct 2026 00:34:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261020VL201/samsung-mobile-technology-display-iot.html</link>
<description>Samsung Electronics has transferred 126 of its mobile, display, and home appliance technologies free of charge to 99 small and midsize companies this year, with mobile technologies making up the bulk of the handover, according to South Korea's Ministry of Trade, Industry and Resources, which hosted the 2026 technology-sharing event with Samsung at L Tower in Seoul's Yangjae-dong on October 19, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die</title>
<pubDate>Mon, 19 Oct 2026 23:23:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD243/packaging-design-genai-cooling-copper.html</link>
<description>Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt (kW) scale. Heat sink specialist Jentech Precision points out that package lids are evolving beyond conventional solid-state heat conduction toward phase-change heat spreading and microchannel liquid cooling, with TIM-less architectures representing the next horizon.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Taiwanese server makers deepen Mexico investments amid US AI spending boom</title>
<pubDate>Mon, 19 Oct 2026 23:22:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL214/mexico-electronics-exports-investment-development.html</link>
<description>Taiwanese electronics makers are deepening their presence in Mexico's Chihuahua state, drawn by surging US demand for AI servers, officials and business leaders told a seminar in Taipei on October 19. The pace of foreign investment is driven by the state's access to the US market, even as Chihuahua seeks to transition from a manufacturing base into a research and design hub.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Ulises Fern&#38;#225;ndez Gamboa, Secretary of Innovation and Economic Development of the State of Chihuahua. Credit: DIGITIMES]]></media:description>
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<title>SK Hynix moves AI data centers from processor-centric to memory-centric design</title>
<pubDate>Mon, 19 Oct 2026 23:22:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL213/sk-hynix-data-center-capacity-cxl-gpu.html</link>
<description>SK Hynix has presented the Memory-Centric AI Rack System (MARS) at the Open Compute Project (OCP) Global Summit. The architecture separates memory from individual servers and pools it at the rack level over Compute Express Link (CXL) fabrics. The company says this addresses the capacity and cost limits that are constraining the growth of large AI models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Analysis: US backing grows, but Intel insists turnaround remains independently run</title>
<pubDate>Mon, 19 Oct 2026 23:21:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL212/intel-manufacturing-business-government-investment.html</link>
<description>The economics of the foundry business have always carried a particular contradiction: semiconductor manufacturing demands enormous upfront capital and years of sustained investment, yet the companies making those investments are expected to preserve enough strategic independence to respond quickly to technology cycles and customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Exclusive: US energy storage supply chain faces mounting pressure as import restrictions and manufacturing bottlenecks disrupt deliveries</title>
<pubDate>Mon, 19 Oct 2026 23:20:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD248/energy-storage-production-supply-chain-usa-government.html</link>
<description>As geopolitical tensions reshape global supply chains, US regulations governing energy and battery energy storage systems (BESS) are undergoing rapid and unpredictable changes.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>AI dividend drives Taiwan's memory makers from trough to transformation</title>
<pubDate>Mon, 19 Oct 2026 23:20:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD238/taiwan-dividend-dram-demand.html</link>
<description>The AI wave is triggering a surge in memory demand that extends from cloud data centers to edge applications. This surge has not only delivered a substantial dividend to relevant supply chains but is also driving a fundamental structural shift across the broader memory ecosystem.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Research: Renewable energy bottlenecks in South Korea, Taiwan, Singapore slow memory chipmakers' RE100 progress</title>
<pubDate>Mon, 19 Oct 2026 23:07:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD237/renewable-energy-electricity-re100-taiwan-manufacturing.html</link>
<description>The world's three largest memory manufacturers&#38;mdash;Samsung Electronics, SK Hynix, and Micron Technology&#38;mdash;along with Taiwan-based Nanya Technology, Winbond Electronics, and Macronix International, face significant obstacles in their transition to renewable energy.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Commentary: China's EV brands own the Paris Motor Show floor, but still yet to land on Macron's guest list</title>
<pubDate>Mon, 19 Oct 2026 22:06:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD229/automakers-europe-manufacturing-automotive-byd.html</link>
<description>The 91st Paris Motor Show opened on October 12, drawing dense crowds to Chinese automaker booths, with brands like BYD and Xpeng taking center stage for media and industry observers alike.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AI illustration]]></media:description>
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<title>Huawei-Chery Luxeed gains independent EV license</title>
<pubDate>Mon, 19 Oct 2026 21:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD234/huawei-chery-brand-vehicle-manufacturing.html?chid=10</link>
<description>China&#38;rsquo;s Luxeed EV brand, jointly developed by Chery Auto and Huawei, has obtained independent vehicle manufacturing qualifications and plans to pursue a standalone listing. Production capacity will be transferred from Chery, with no additional capacity planned, according to Chinese media outlet &lt;em&gt;Yicai&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<title>South Korea's FIX 2026 to feature robots from HD Hyundai, Doosan</title>
<pubDate>Mon, 19 Oct 2026 16:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL211/hyundai-2026-hd-doosan-robot.html</link>
<description>South Korea's Future Innovation Tech Expo (FIX 2026) will open in Daegu on October 21, with HD Hyundai Robotics and Doosan Robotics among the industrial robot makers exhibiting. The four-day show will also feature self-driving vehicles and technologies for manufacturing, logistics, and transportation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[HD Hyundai Robotics' HDC-series collaborative robots, set for display at FIX 2026. Credit: HD Hyundai Robotics.]]></media:description>
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<title>IT panel market struggles to pass on costs: monitors hold flat, notebooks slide</title>
<pubDate>Mon, 19 Oct 2026 16:03:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD244/panel-brand-market-recovery-demand.html</link>
<description>Sluggish end-market recovery, cautious procurement by brand customers, and persistently high upstream material costs are frustrating panel makers' efforts to implement price hikes for IT panels. In October, quotes for mainstream LCD monitor panels held flat, while notebook panel prices continued a slight downward drift due to weak demand and slow inventory digestion.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>OCP 2026 shifts AI competition from chips to rack-scale systems</title>
<pubDate>Mon, 19 Oct 2026 16:01:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD241/ocp-2026-chips-infrastructure-competition-cooling.html</link>
<description>The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization is now expanding into system-level co-design for AI factories.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AMD]]></media:description>
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<title>DeepSeek updates V4.1 Flash to improve AI agent performance</title>
<pubDate>Mon, 19 Oct 2026 09:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD246/deepseek-performance-api-software-opus.html</link>
<description>DeepSeek released an updated version of its V4.1 Flash artificial intelligence (AI) model on October 17, improving coding and reasoning performance while reducing task execution time and output length. The DeepSeek-V4.1-Flash-1017 update arrived five weeks after the previous version and was designed to make AI agents more efficient across software development and other task-based applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips</title>
<pubDate>Mon, 19 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD247/samsung-exynos-kirin-huawei-chips.html</link>
<description>Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing efforts are raising pressure on Samsung to improve application processor (AP) performance, manufacturing yields and cost competitiveness as it seeks to reduce its reliance on Qualcomm and MediaTek.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge</title>
<pubDate>Mon, 19 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD235/microsoft-tsmc-2nm-intel-digitimes.html</link>
<description>Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging strategies in AI chip development and advanced packaging.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal</title>
<pubDate>Mon, 19 Oct 2026 08:47:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD245/anthropic-financing-ai-chip-capacity-finance.html</link>
<description>Anthropic is offering Blackstone a total return of more than 10% to help finance a US$60 billion artificial intelligence (AI) chip procurement package, as higher infrastructure financing costs make expanding computing capacity more expensive. The proposed arrangement, reportedly code-named Project North Star, would fund purchases of Google tensor processing units (TPUs) with a combined capacity of approximately 1.5 GW.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if</title>
<pubDate>Mon, 19 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD218/intel-taiwan-academia-sinica-tsmc-electronics.html</link>
<description>Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades earlier, as a graduate student, he was invited by Intel co-founder Andy Grove to join Intel, and turned him down.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Weblink International secures AvePoint agency rights to expand AI governance</title>
<pubDate>Mon, 19 Oct 2026 07:54:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD242/weblink-acer-governance-subsidiary-data.html</link>
<description>Acer Inc. subsidiary Weblink International Inc. has secured agency rights for AvePoint in Taiwan and the Asia-Pacific region, expanding its enterprise solutions portfolio amid accelerating cloud and AI adoption and the growing importance of data governance and information security.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Action cameras gain momentum as camera demand fragments</title>
<pubDate>Mon, 19 Oct 2026 07:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD239/market-camera-recovery-growth-shipments.html</link>
<description>After two years of recovery, the digital camera market is slowing in 2026, with action cameras and handheld smart cameras taking over as the next growth engines. Optical industry observers say consumers no longer expect one camera to cover every scenario, instead choosing specialized devices for specific uses&#38;mdash;a shift that has made action cameras the clearest winner.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power</title>
<pubDate>Mon, 19 Oct 2026 07:43:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL210/elon-musk-dram-tesla-2028-samsung.html</link>
<description>Tesla CEO Elon Musk has predicted a surge in Chinese memory chip production by 2028, raising questions over Samsung Electronics and SK Hynix's pricing power during an AI-driven dynamic random-access memory (DRAM) shortage. His remarks suggest that China's expanding capacity could offer major technology buyers alternative sources of supply and potentially ease memory costs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Tesla CEO Elon Musk. Credit: AFP]]></media:description>
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<title>ACM Research bets on panel-level packaging and overseas growth as adoption risks persist</title>
<pubDate>Mon, 19 Oct 2026 07:38:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD231/acm-packaging-equipment-adoption-growth.html</link>
<description>ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in South Korea and Oregon. The company expects overseas operations to grow faster than its China revenue, although technology adoption, packaging-size standards, and US-China tensions could affect its plans.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ACM Research]]></media:description>
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<title>Canon Taiwan sees strong global camera demand in 2026 and 2027</title>
<pubDate>Mon, 19 Oct 2026 07:33:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD240/canon-taiwan-camera-demand-2027.html</link>
<description>Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate a new generation of photography enthusiasts. He also expressed optimism about 2027, as Canon and other brands prepare to launch more new models and capitalize on market momentum.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success</title>
<pubDate>Mon, 19 Oct 2026 07:29:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD236/tsmc-launch-finfet-technology-patent.html</link>
<description>The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break through the 25nm physical limit. Among those who answered it was Chenming (Calvin) Hu, then a professor at UC Berkeley, who would go on to become TSMC's first chief technology officer in 2001.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Semiconductors</category>
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<title>From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years</title>
<pubDate>Mon, 19 Oct 2026 06:59:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD224/auo-innolux-display-lcd-manufacturing-ic-packaging-taiwan.html</link>
<description>Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now, after three decades of boom-and-bust cycles, its leading manufacturers are seeking a new future beyond screens, leveraging their expertise in precision manufacturing to enter automotive electronics, advanced semiconductor packaging and AI-related technologies.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20261019pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>SiC powering the future: market scaling meets IDM synergies</title>
<pubDate>Mon, 19 Oct 2026 06:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL211/sic-silicon-market-data-center-industrial.html</link>
<description>The global silicon carbide (SiC) market stands at a critical juncture of industrial scaling, driven by rising demand across the automotive, AI data center, and renewable energy sectors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261019vl211_files/4_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: EE Times China]]></media:description>
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<title>Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models</title>
<pubDate>Mon, 19 Oct 2026 06:21:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD233/toyota-vehicle-2030-sales-software.html</link>
<description>Toyota plans to transition its entire lineup of approximately 50 vehicle models to software-defined vehicles (SDVs) by 2030, equipping them with advanced software capabilities that allow owners to upgrade vehicle functions through over-the-air (OTA) updates after purchase.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261019PD233/toyota-vehicle-2030-sales-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261019pd233_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition</title>
<pubDate>Mon, 19 Oct 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL209/beijing-data-competition-price-capacity.html</link>
<description>The rapid advancement of energy-storage technologies in China is enabling the country to capture a formidable share of the global market, with the domestic industry continuing to post record levels of capacity growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261019vl209_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AI-assisted illustration based on an original image by Michael Lee.]]></media:description>
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<title>Sanan Optoelectronics faces corp governance turmoil amid Micro LED breakthroughs</title>
<pubDate>Mon, 19 Oct 2026 06:18:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019VL207/sanan-optoelectronics-governance-market-xiamen-display.html</link>
<description>Sanan Optoelectronics Co., a leading player in China's compound semiconductor and LED chip industry, finds itself at a critical juncture, marked by severe corporate governance challenges at the shareholder level alongside major technological developments in next-generation display technologies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261019VL207/sanan-optoelectronics-governance-market-xiamen-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261019vl207_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: newton.com.tw]]></media:description>
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<title>Foxconn, Mitsubishi Electric form alliance in automotive equipment business</title>
<pubDate>Mon, 19 Oct 2026 06:13:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261017PD201/foxconn-mitsubishi-electric-automotive-business-alliance.html</link>
<description>Foxconn announced on October 16 that it has formed a strategic alliance with Mitsubishi Electric through its investment management subsidiary Lin Yin International Investment. The two companies will jointly operate an automotive equipment business and develop next-generation mobility solutions under a "Made in/by Japan" concept aimed at supporting the sustainable growth of Japan's automotive industry.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261017PD201/foxconn-mitsubishi-electric-automotive-business-alliance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261017pd201_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Foxconn chairman Young Liu (L) and Mitsubishi Electric CEO Kei Uruma (R). Credit: Foxconn]]></media:description>
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<title>IBM and Siemens collaborate to advance nanostack chip architecture</title>
<pubDate>Mon, 19 Oct 2026 06:01:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PR201/ibm-siemens-design-manufacturing-performance.html</link>
<description>IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance, energy efficiency, and artificial-intelligence computing worldwide, as the companies seek to address design, simulation, lithography, and production challenges beyond the 7-angstrom node.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261019pr201_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Von Ardenne's flexible equipment targets unsettled panel-level packaging market</title>
<pubDate>Mon, 19 Oct 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD232/equipment-packaging-market-panel-technology.html</link>
<description>German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions remains unresolved. Its tray-based systems can handle different substrate sizes without a new platform, potentially reducing equipment risk as manufacturers and customers worldwide weigh standards for advanced packaging and glass-based processes.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261019PD232/equipment-packaging-market-panel-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261019pd232_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Von Ardenne]]></media:description>
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<title>Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years</title>
<pubDate>Mon, 19 Oct 2026 04:42:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD220/interview-wafer-metrology-startup-adoption-spain.html</link>
<description>Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor foundries.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261019PD220/interview-wafer-metrology-startup-adoption-spain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261019pd220_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Wooptix co-founder and COO Javier Elizalde. Credit: Wooptix]]></media:description>
</media:content></item>
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<title>Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027</title>
<pubDate>Mon, 19 Oct 2026 04:25:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD230/toyota-plant-shanghai-technology-2027.html?chid=10</link>
<description>Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese suppliers. The automaker also plans to produce the next-generation Corolla in China from 2028 using a common platform compatible with multiple powertrain systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<media:content url="https://img.digitimes.com/newsshow/20261019pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>China probes Huawei-JAC Maextro V800 over brake pedal failure</title>
<pubDate>Mon, 19 Oct 2026 04:24:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261019PD226/vehicle-market-huawei-brand-testing.html</link>
<description>China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei and JAC Motors, has sparked widespread public debate over vehicle safety and testing standards after its V800 MPV suffered consecutive brake pedal bracket fractures during dynamic braking tests.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261019PD226/vehicle-market-huawei-brand-testing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261019pd226_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
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