<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 24 Jul 2026 06:00:11 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>AMD advances telecom AI with AT&#38;amp;T and Microsoft</title>
<pubDate>Fri, 24 Jul 2026 05:45:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD228/amd-telecom-ai-at_t-microsoft-2026.html</link>
<description>AMD unveiled a next-generation open-source telecom large language model (LLM), OTel 2.0, with AT&#38;amp;T and Microsoft at its Advancing AI 2026 conference, completing a training pipeline of more than 1 trillion tokens. AT&#38;amp;T used AMD Instinct GPUs and Microsoft Azure Foundry compute for post-training, pushing the Open Telco AI initiative from proof of concept toward commercial deployment.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD228/amd-telecom-ai-at_t-microsoft-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd228_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AMD launches ROCm.ai to accelerate agentic AI development, reporting up to 3.3x inference gains</title>
<pubDate>Fri, 24 Jul 2026 05:17:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD227/amd-development-hardware-software-optimization.html</link>
<description>Alongside its expanding AI hardware portfolio, AMD is stepping up efforts to strengthen its AI software ecosystem in a bid to challenge NVIDIA's CUDA dominance. At its Advancing AI 2026 event, the company unveiled ROCm.ai, a new AI-native development platform that integrates AI coding assistants, deployment tools, and automated optimization capabilities to simplify AI application development and accelerate model deployment on AMD hardware.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD227/amd-development-hardware-software-optimization.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd227_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Monica Chen]]></media:description>
</media:content></item>
<item>
<title>AMD says AI shift to inference and agents will reshape data centers</title>
<pubDate>Fri, 24 Jul 2026 05:17:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD222/amd-data-training-software-market.html</link>
<description>AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents, and physical AI. At its Advancing AI 2026 event, the company introduced new server, accelerator, and rack-scale products to power the next generation of AI infrastructure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD222/amd-data-training-software-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan, Czech chamber ink MOU to fuel Eastern Europe drone hub</title>
<pubDate>Fri, 24 Jul 2026 04:23:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723PD237/taiwan-czech-republic-eastern-europe-production-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:513;116-628"&gt;Taiwan's Commerce Development Research Institute (CDRI) signed a memorandum of understanding (MOU) with the Taiwan Chamber of Commerce in the Czech Republic (TCCCZ) on July 23 to jointly build a Taiwan-Central and Eastern Europe industrial cooperation platform, linking Taiwan with the Czech Republic and Central and Eastern European markets. The CDRI said the two sides will focus on areas such as drones, technology, and talent exchanges, as well as international market promotion and business matchmaking.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723PD237/taiwan-czech-republic-eastern-europe-production-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260723pd237_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>US moves to curb Chinese humanoid robots, opening a new front in the AI rivalry</title>
<pubDate>Fri, 24 Jul 2026 04:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL211/technology-security-chips-commercial-robotics.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:232;107-338"&gt;Washington is opening a new front in its technology contest with China, moving beyond chips and artificial intelligence models to target humanoid robots and other autonomous systems over national security and data privacy concerns.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL211/technology-security-chips-commercial-robotics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up</title>
<pubDate>Fri, 24 Jul 2026 04:19:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD223/tsmc-arizona-fab-packaging-expansion.html</link>
<description>Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout has entered a new phase after five years of construction, with the company's first 4nm fab now ramping production and contributing to profits. The second fab is set to enter equipment move-in in the fourth quarter of 2026, the third fab is scheduled for move-in in September 2027, and the fourth has already begun site preparation.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD223/tsmc-arizona-fab-packaging-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AMD Advancing AI 2026: Gorgon Halo brings 300-billion-parameter models to local AI with Cisco governance</title>
<pubDate>Fri, 24 Jul 2026 04:05:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD225/amd-cisco-ai-agent-governance-2026.html</link>
<description>Agentic AI is spreading rapidly across personal computers and enterprise endpoints, prompting AMD to expand its local AI strategy with a new platform capable of running significantly larger models on-device.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD225/amd-cisco-ai-agent-governance-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd225_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Rapidus expands Hokkaido chip hub with packaging and analysis</title>
<pubDate>Fri, 24 Jul 2026 03:56:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL210/rapidus-packaging-development-production-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:223;99-321"&gt;Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis and advanced packaging capabilities alongside a front-end pilot line for 2nm logic chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL210/rapidus-packaging-development-production-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Rapidus¡¦ IIM-1 semiconductor facility in Chitose, Hokkaido, Japan. Credit: AFP]]></media:description>
</media:content></item>
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<title>AI-driven DRAM surge hits EV costs, forcing Chinese automakers to rethink pricing</title>
<pubDate>Fri, 24 Jul 2026 03:32:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD217/automakers-vehicle-dram-demand.html</link>
<description>&lt;p class="P1" data-start="0" data-end="220"&gt;Surging AI server demand is reshaping supply and demand across the global memory market. With DRAM prices rising sharply over the past year, the resulting cost pressure is beginning to spill into the automotive industry.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD217/automakers-vehicle-dram-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>NAN GreenMet to invest US$130M in India's first integrated rare earth magnet plant</title>
<pubDate>Fri, 24 Jul 2026 03:32:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL205/plant-production-manufacturing-technology-government.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:434;122-555"&gt;NAN GreenMet Pvt. Ltd. has launched NAN MagneTech Pvt. Ltd. to develop what it says will be India's first fully integrated manufacturing facility for high-performance Neodymium-Iron-Boron (NdFeB) rare earth magnets. The company plans to invest INR12.5 billion (US$130 million) in the project, which will be located at the Naidupeta Industrial Park in Andhra Pradesh, with commercial production targeted for the first quarter of 2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL205/plant-production-manufacturing-technology-government.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl205_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>STMicroelectronics lifts data center target as AI optical demand outruns supply, but margin recovery waits on 2027 reshaping</title>
<pubDate>Fri, 24 Jul 2026 03:21:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL204/stmicroelectronics-data-center-recovery-revenue-2027.html</link>
<description>STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings call that the full profitability recovery hinges on a manufacturing overhaul that will not finish before the end of 2027, and that its near-term ceiling is supply rather than demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL204/stmicroelectronics-data-center-recovery-revenue-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China's Xi'an Eswin tops 1 million monthly 12-inch wafer sales and output, targets 1.8 million capacity</title>
<pubDate>Fri, 24 Jul 2026 03:16:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD218/12-inch-wafer-capacity-sales-silicon-wafer.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:238;191-428"&gt;China's 12-inch silicon wafer maker Xi'an Eswin Material Technology said monthly output and sales of its 12-inch electronic-grade silicon wafers have both exceeded 1 million units, marking a further increase in its mass-production scale.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD218/12-inch-wafer-capacity-sales-silicon-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Xi'an Eswin Material Technology]]></media:description>
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<title>AMD redraws server chip strategy as AI workloads evolve</title>
<pubDate>Fri, 24 Jul 2026 03:07:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD221/amd-cpu-data-center-processor.html</link>
<description>AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping its roadmap for a world where AI workloads are spreading from training models to enterprise agents. The shift matters globally because it signals that data centers may need more balanced upgrades to CPU, GPUs, and networking.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD221/amd-cpu-data-center-processor.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd221_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Intel reportedly considers SK Hynix for Ohio fab partnership</title>
<pubDate>Fri, 24 Jul 2026 02:50:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL209/intel-sk-hynix-partnership-acquisition.html</link>
<description>&lt;p class="P1" data-start="739" data-end="954"&gt;Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the South Korean memory maker formally denied pursuing an acquisition of the site.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL209/intel-sk-hynix-partnership-acquisition.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl209_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[An aerial view shows construction at Intel¡¦s Ohio One semiconductor campus in New Albany, Ohio. Credit: Intel]]></media:description>
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<title>India approves two electronics manufacturing clusters in Tamil Nadu</title>
<pubDate>Fri, 24 Jul 2026 02:49:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL206/electronics-manufacturing-government-exports-semicon.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:529;107-635"&gt;India's central government has approved two Electronics Manufacturing Clusters (EMCs) in Tamil Nadu, at Manallur and Pillapaikkam, with a combined project cost of INR10.12 billion (US$104.75 million), in a move aimed at strengthening the state's electronics ecosystem and advancing the country's self-reliance drive. Union Minister for Electronics and Information Technology Ashwini Vaishnaw announced the approvals in a written reply in the Lok Sabha on July 22, 2026, according to &lt;em&gt;Project Monitor&lt;/em&gt; and &lt;em&gt;Trade Brains&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL206/electronics-manufacturing-government-exports-semicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl206_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: Wistron's Texas AI factory shows why US manufacturing still needs Taiwan</title>
<pubDate>Fri, 24 Jul 2026 02:45:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD219/wistron-texas-electronics-manufacturing-taiwan-usa.html</link>
<description>Wistron's opening of its D1 AI smart factory in &lt;strong&gt;Fort Worth&lt;/strong&gt;, Texas, marks a new milestone for Taiwan's downstream electronics manufacturers. The plant will support the first US mass production of Nvidia GB300 compute boards, a development with far-reaching implications for Taiwan, the US and the global AI industry.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD219/wistron-texas-electronics-manufacturing-taiwan-usa.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Mobileye founder Amnon Shashua to step down as CEO after nearly three decades</title>
<pubDate>Fri, 24 Jul 2026 02:34:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL208/mobileye-ceo-autonomous-driving-technology-earnings.html</link>
<description>&lt;p class="P1" data-start="83" data-end="308"&gt;Amnon Shashua will step down as CEO of autonomous driving technology supplier Mobileye once the company appoints a successor, marking the biggest leadership transition since he co-founded the Israeli firm in 1999.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL208/mobileye-ceo-autonomous-driving-technology-earnings.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TGV still faces technical barriers; CoPoS commercialization not likely until 2030</title>
<pubDate>Fri, 24 Jul 2026 02:29:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721RS400/copos-glass-substrate-packaging-through-silicon-via-tsmc-2030.html?chid=2</link>
<description>TGV still faces technical barriers; CoPoS commercialization not likely until 2030</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductor</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260721RS400/copos-glass-substrate-packaging-through-silicon-via-tsmc-2030.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260721rs400_files/15_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Stripe reportedly eyes OpenRouter in potential US$10B AI infrastructure deal</title>
<pubDate>Fri, 24 Jul 2026 02:20:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL207/infrastructure-startup-acquisition-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:450;116-565"&gt;Stripe is in talks to acquire AI model-routing startup OpenRouter in a deal that could value the company at around US$10 billion, according to &lt;em&gt;The Wall Street Journal&lt;/em&gt;, which cited people familiar with the matter. The report said an agreement could be announced soon, although negotiations could still collapse or another bidder could emerge. The acquisition would significantly expand Stripe's ambitions beyond payments into AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL207/infrastructure-startup-acquisition-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl207_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Stripe]]></media:description>
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<title>Intel says supply, not demand, is its ceiling as it lifts 2026 capex above US$20 billion</title>
<pubDate>Fri, 24 Jul 2026 02:16:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL203/intel-2026-demand-capex-earnings.html</link>
<description>Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts it will raise capital spending, push its 18A and 14A process nodes forward, and expand a fast-growing custom-silicon business &#38;mdash; even as it warned it will still be short of chips through the fourth quarter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL203/intel-2026-demand-capex-earnings.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724vl203_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center</title>
<pubDate>Fri, 24 Jul 2026 02:11:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD212/amd-cpu-data-center-chips-tsmc.html</link>
<description>AMD unveiled its sixth-generation EPYC 9006 server processors, widening its push into AI data centers with chips designed for agentic AI, cloud computing, enterprise workloads, and high-performance computing. The launch suggests CPUs may continue to gain importance even as much of the market remains focused on GPUs.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD212/amd-cpu-data-center-chips-tsmc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Japan, Korea, and Taiwan face fresh 10-12.5% US tariffs under forced-labor Section 301 action</title>
<pubDate>Fri, 24 Jul 2026 01:57:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PR202/asia-manufacturing-usa-tariffs-taiwan-2026.html</link>
<description>Much of Asia's manufacturing base is now subject to new US import duties of 10% to 12.5% after the White House finalized a Section 301 action against 60 economies, citing their failure to prohibit or effectively enforce a ban on goods made with forced labor. The presidential memorandum, dated July 23, 2026, took effect at 12:01 a.m. on July 24, according to the&lt;em&gt; Los Angeles Times&lt;/em&gt; and the &lt;em&gt;New York Post&lt;/em&gt;, and lands squarely on the region's textile, electronics, and assembly exporters.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PR202/asia-manufacturing-usa-tariffs-taiwan-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pr202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Intel's blowout quarter wins over the bulls, but analysts stay split on the foundry turnaround</title>
<pubDate>Fri, 24 Jul 2026 01:54:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL202/intel-demand-revenue-profit-outlook.html</link>
<description>Intel's second-quarter results have shifted the Wall Street debate from whether chief executive Lip-Bu Tan's turnaround is working to how durable the AI-driven compute demand behind it will prove, with the sharpest disagreement now centering on the still-unprofitable foundry business and a valuation that has already more than tripled this year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724VL202/intel-demand-revenue-profit-outlook.html</guid>
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<title>AMD sees AI demand broadening beyond chips, as Helios ramps toward shipment</title>
<pubDate>Fri, 24 Jul 2026 01:52:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD214/amd-lisa-su-anthropic-openai-demand.html</link>
<description>AMD CEO Lisa Su said demand from cloud service providers and enterprise customers continued to climb rapidly, reinforcing AMD's view that the artificial intelligence (AI) market still has substantial room to grow. The CEO said AI adoption is now moving beyond efficiency gains and into new products, services, and business models.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>AMD unveils Helios rack-scale AI platform to target hyperscale buildouts</title>
<pubDate>Fri, 24 Jul 2026 01:47:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD213/amd-training-infrastructure-performance-bandwidth.html</link>
<description>AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers. The system is designed to boost compute density, lower deployment complexity, and offer an open alternative to competing rack-scale architectures for training and inference worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>AI server demand powers Intel's fastest growth since 2011, but foundry proof still pending</title>
<pubDate>Fri, 24 Jul 2026 01:47:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL201/intel-growth-demand-2011-2026.html</link>
<description>Intel's second-quarter 2026 results suggest the AI data-center buildout is beginning to pull the chipmaker's long-delayed turnaround forward, even as the payoff from its costliest bet &#38;mdash; the contract manufacturing business &#38;mdash; remains unproven.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>AMD splits next-generation data center GPUs for specialized AI demand</title>
<pubDate>Fri, 24 Jul 2026 01:43:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD215/amd-data-center-hbm4-demand-chips.html</link>
<description>AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the move signals how AI infrastructure is becoming more specialized, with implications for cloud builders, governments, researchers, and supercomputing operators worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260724PD215/amd-data-center-hbm4-demand-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260724pd215_files/2_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Amkor, Nvidia widen AI packaging partnership as US capacity expands</title>
<pubDate>Fri, 24 Jul 2026 01:39:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PR200/amkor-nvidia-partnership-packaging-capacity.html</link>
<description>Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. The agreement includes a prepayment from Nvidia to support expanded US capacity, highlighting how global demand for AI infrastructure is reshaping supply chains and manufacturing priorities worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260724pr200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Taiwan manufacturers advance OT security under supply chain pressure</title>
<pubDate>Fri, 24 Jul 2026 01:28:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD205/taiwan-manufacturers-technology-cybersecurity-security-supply-chain.html</link>
<description>Taiwanese companies are strengthening operational technology cybersecurity as smart manufacturing and critical infrastructure become increasingly digital, with manufacturers generally further ahead than other industries because of international supply chain audit requirements.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260724pd205_files/1_2b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Taiwan turns to AI and robotics to build senior-tech industry for super-aged era</title>
<pubDate>Fri, 24 Jul 2026 01:22:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724PD206/taiwan-revenue-government-2025-medical.html</link>
<description>Taiwan is turning to artificial intelligence, robotics and connected-care systems to manage one of the world's fastest demographic transitions, while seeking to turn the challenge into a new growth industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260724pd206_files/1_2b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Wistron says growth is strong, but transformation remains incomplete</title>
<pubDate>Thu, 23 Jul 2026 22:31:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723PD219/wistron-growth-revenue-manufacturing-profit.html</link>
<description>Wistron said its revenue and profit continue to rise, and its global manufacturing platform is opening new growth avenues for readers watching the electronics, AI, and industrial supply chains. The Taiwan-based company is pushing into higher-margin businesses while demand remains strong across key markets worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260723pd219_files/1_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp</title>
<pubDate>Thu, 23 Jul 2026 22:30:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723PD209/nvidia-production-forecast-2027-market.html</link>
<description>SemiAnalysis recently forecast that large-scale deployment of Nvidia's native single-ended 800V high-voltage direct current power architecture could slip from the market's previous expectation of 2027 to beyond 2028, raising concerns over growth prospects for the AI power supply chain.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723PD209/nvidia-production-forecast-2027-market.html</guid>
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<item>
<title>Chinese AI labs close gap with Anthropic after Claude Code leak</title>
<pubDate>Thu, 23 Jul 2026 22:29:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL209/claude-anthropic-moonshot-kimi-k3-alibaba.html</link>
<description>A springtime source-code exposure reframed the AI race around "harness" and memory engineering rather than raw model scale &#38;mdash; and a wave of Chinese models built around exactly those ideas has since arrived within striking distance of Anthropic's flagship.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723VL209/claude-anthropic-moonshot-kimi-k3-alibaba.html</guid>
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<item>
<title>Kimi K3 under fire, part 3: China's AI industry questions success story</title>
<pubDate>Thu, 23 Jul 2026 22:29:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL215/kimi-k3-moonshot-ai-performance-china.html</link>
<description>Chinese officials have embraced Kimi K3 as evidence of indigenous innovation and a maturing open-model ecosystem. Some Chinese developers and technology commentators are far less convinced.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723VL215/kimi-k3-moonshot-ai-performance-china.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260723vl215_files/2_b.jpg" type="image/jpeg" expression="full">
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</media:content></item>
<item>
<title>Realme exits China smartphone market, Oppo hands domestic focus to OnePlus</title>
<pubDate>Thu, 23 Jul 2026 22:29:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL221/realme-oppo-oneplus-market-smartphone.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:211;112-322"&gt;Realme has stopped producing smartphones for China and will launch no new models there, ending its domestic expansion as parent company Oppo consolidates overlapping brands and redirects resources overseas.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<item>
<title>China's AI chip share tops 50%, but Nvidia still rules frontier training</title>
<pubDate>Thu, 23 Jul 2026 22:29:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL229/nvidia-ai-chip-training-huawei-infrastructure.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:208;106-313"&gt;China's AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba's T-Head Semiconductor, Cambricon and Hygon a larger role in a market once dominated by Nvidia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Samsung to break ground on Onyang HBM expansion in October, targets 2029 production</title>
<pubDate>Thu, 23 Jul 2026 22:28:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL230/samsung-expansion-hbm-production-investment.html</link>
<description>Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting high-bandwidth memory (HBM) mass production in May 2029.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723VL230/samsung-expansion-hbm-production-investment.html</guid>
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<item>
<title>OpenAI compute spending to reportedly rise from US$600B to US$750B</title>
<pubDate>Thu, 23 Jul 2026 22:28:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL232/openai-data-center-data-2030-oracle.html</link>
<description>OpenAI has increased its projected spending on compute from US$600 billion to US$750 billion by 2030. The 25% increase is meant to give its models an edge during a time of intense competition for compute power, although some worry about that the start-up's investments are oversized.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723VL232/openai-data-center-data-2030-oracle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260723vl232_files/2_2b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Apple prepares sweeping Mac refresh, betting on AI-driven demand</title>
<pubDate>Thu, 23 Jul 2026 22:28:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL233/apple-demand-14-inch-chips-macbook.html</link>
<description>Apple is gearing up for a broad update to its entire Mac lineup, aiming to ride the wave of demand for high-performance computers driven by AI. New versions of nearly every Mac model are expected to roll out between this fall and next year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<item>
<title>DeepSeek's Liang Wenfeng says China trails US AI by up to 18 months, with compute the decisive gap</title>
<pubDate>Thu, 23 Jul 2026 22:27:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723VL224/deepseek-ai-chips-nvidia-software-efficiency.html</link>
<description>DeepSeek founder Liang Wenfeng says China's AI industry trails the US by six to 18 months mainly because of limited computing power, not talent.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260723VL224/deepseek-ai-chips-nvidia-software-efficiency.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260723vl224_files/2_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>AI data centers emerge as dynamic loads, posing new challenges for power grids</title>
<pubDate>Thu, 23 Jul 2026 22:27:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD236/data-electricity-adoption-demand-capacity.html</link>
<description>As generative AI adoption accelerates, AI data centers are becoming one of the fastest-growing sources of electricity demand worldwide. Unlike conventional data centers, however, AI facilities exhibit highly variable power consumption driven by intensive GPU workloads, creating new challenges for grid operators while raising the bar for the reliability of on-site power systems.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD236/data-electricity-adoption-demand-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd236_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>South Korea's mandatory ESG disclosures loom: How Samsung Display and LG Display are preparing</title>
<pubDate>Thu, 23 Jul 2026 22:27:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD225/lg-display-sdc-data-2028-2025.html</link>
<description>South Korea has finalized plans to bring climate-related information under statutory disclosure requirements beginning in 2028, advancing the timetable and widening the scope compared with a draft released in February 2026.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD225/lg-display-sdc-data-2028-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd225_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
</media:content></item>
<item>
<title>Alibaba Cloud founder: next-gen foundation models need scientific data</title>
<pubDate>Thu, 23 Jul 2026 22:27:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD234/data-language-llm-development-agi.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:407;134-540"&gt;For the past three years, large language model (LLM) development has moved along the same track: models have gotten bigger, parameter counts have climbed, reasoning has improved, AI agents have matured, and long-context windows have kept breaking records. The industry's debate has also centered on model capability, computing scale, and how far the field is from artificial general intelligence (AGI).</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD234/data-language-llm-development-agi.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd234_files/5_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Analysis: Why Nvidia is betting Japan's manufacturing data will power physical AI</title>
<pubDate>Thu, 23 Jul 2026 22:26:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD221/nvidia-data-manufacturing-industrial-ceo.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:415;133-547"&gt;Nvidia CEO Jensen Huang's whirlwind visit to Japan in mid-July extended well beyond product announcements and public appearances. Alongside a joint event with gaming giant Sega Corporation, Huang used the trip to promote what he has repeatedly described as Nvidia's next major AI frontier&#38;mdash;physical AI&#38;mdash;sparking renewed discussion across Japan's industrial sector about the country's role in the emerging technology.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD221/nvidia-data-manufacturing-industrial-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd221_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>German automakers reset strategy with AI, powertrain, and alliances</title>
<pubDate>Thu, 23 Jul 2026 22:26:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD238/volkswagen-automakers-mercedes-benz-bmw-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:334;117-450"&gt;Volkswagen, BMW, and Mercedes-Benz are reshaping their growth strategies as the global auto market enters a low-growth era, with profitability under pressure and EV demand slowing. Instead of chasing volume, the three German automakers are focusing on multi-powertrain platforms, deeper AI integration, and cross-border partnerships.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD238/volkswagen-automakers-mercedes-benz-bmw-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd238_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Trumpf builds EUV moat with 40 years of chip tech</title>
<pubDate>Thu, 23 Jul 2026 22:22:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD240/euv-demand-technology-laser-asml.html</link>
<description>AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key supplier of CO2 laser light sources for ASML's EUV exposure tools, says its EUV technology was the result of more than 40 years of sustained R&#38;amp;D and more than 20 years of collaboration with ASML to industrialize EUV.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD240/euv-demand-technology-laser-asml.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd240_files/2_b.jpg" type="image/jpeg" expression="full">
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</media:content></item>
<item>
<title>Arizona lures chip boom with three key advantages</title>
<pubDate>Thu, 23 Jul 2026 22:22:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD243/arizona-tsmc-investment-manufacturing-water.html</link>
<description>As TSMC expands its investment in Arizona to US$265 billion, the global semiconductor supply chain is accelerating its move into the state, transforming the long-known "Sunshine State" into a new US hub for semiconductors and AI. Arizona has also become a focal point for companies looking to tap into the next wave of growth around advanced manufacturing, data centers, and related services.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD243/arizona-tsmc-investment-manufacturing-water.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd243_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Zhen Ding expands Thailand capacity, deepens industry-academia ties to develop PCB, chip talent</title>
<pubDate>Thu, 23 Jul 2026 22:21:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722PD244/pcb-zhen-ding-talent-production-development.html</link>
<description>Major printed circuit board (PCB) manufacturer Zhen Ding Technology Group has been actively developing its manufacturing base in Thailand. The investment was launched in 2023 and began production in the third quarter of 2025, while also accelerating industry-academia collaboration and local talent development in the country.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260722PD244/pcb-zhen-ding-talent-production-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260722pd244_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Zhen Ding Tech]]></media:description>
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<item>
<title>EcoPro BM targets 2027 mass production of solid-state electrolyte as it builds a full battery-materials value chain</title>
<pubDate>Thu, 23 Jul 2026 22:21:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722VL204/production-2027-materials-roadmap-samsung-sdi.html</link>
<description>South Korea's EcoPro BM said it aims to begin mass production of sulfide-based solid electrolytes, a core material for all-solid-state batteries, as early as 2027, laying out a roadmap to supply the full slate of materials the next-generation cells will require. The plan was disclosed at a corporate briefing in Yeouido, Seoul, on July 16 and formalized in a roadmap announcement on July 19.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI memory crunch hits smartphones and PCs, splitting winners from losers</title>
<pubDate>Thu, 23 Jul 2026 22:20:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722VL205/demand-smartphone-pc-sales-xiaomi.html</link>
<description>&lt;p class="P1" data-start="78" data-end="260"&gt;AI-driven memory demand is raising smartphone and PC costs, weakening mass-market sales and widening the gap between premium brands and manufacturers reliant on lower-priced devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Mitsubishi Electric seeks September deal on power-chip merger with Toshiba, ROHM</title>
<pubDate>Thu, 23 Jul 2026 22:19:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260722VL229/mitsubishi-electric-toshiba-business-government-development.html</link>
<description>&lt;p class="P1" data-start="913" data-end="1168"&gt;Mitsubishi Electric is seeking an agreement with Toshiba and ROHM by September on combining semiconductor operations centered on power devices, as the three Japanese suppliers negotiate product scope and corporate control while seeking government support.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Mitsubishi Electric CEO Kei Uruma. Credit: Bloomberg]]></media:description>
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<title>AI champions help companies overcome employee resistance to AI adoption</title>
<pubDate>Thu, 23 Jul 2026 22:19:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD203/adoption-technology.html</link>
<description>&lt;p class=Image&gt;</description>
<dc:creator>AI bot</dc:creator>
<category>ICT</category>
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<title>Taiwan EV subsidies lag as buyers weigh gasoline, hybrid, and electric cars</title>
<pubDate>Thu, 23 Jul 2026 22:19:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD206/taiwan-subsidies-vehicle-market-europe.html</link>
<description>Taiwan's electric vehicle market is moving more slowly than expected as long-stagnant subsidies leave buyers with a difficult choice between internal combustion engine, hybrid electric, and battery electric vehicle models. According to PG Union, the delay reflects both a softer economy and a broader shift in consumer decision-making as purchase options become more complex.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>PG Union bets on new models as Taiwan auto market weakens</title>
<pubDate>Thu, 23 Jul 2026 22:19:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD207/market-taiwan-2026-2025-sales.html</link>
<description>PG Union is counting on new vehicle launches to navigate a weakening Taiwan auto market in the second half of 2026, after demand in the first seven months fell short of industry expectations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Techzone sees stronger 2026 demand as semiconductor waste processing tightens</title>
<pubDate>Thu, 23 Jul 2026 22:18:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD219/demand-2026-production-taiwan-capacity.html</link>
<description>Techzone said growing AI demand and continued ramp-up of advanced semiconductor production have increased both the volume and complexity of specialty solvents, pushing hazardous waste processing needs above Taiwan's overall treatment capacity. The company said that gap is supporting its resource recycling business and is expected to lift profits in the first half of 2026, with revenue likely to reach a new high in the second half.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Global Tek expands into AI liquid cooling and robotics to drive second-half growth</title>
<pubDate>Thu, 23 Jul 2026 22:18:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD227/liquid-cooling-robotics-industrial-revenue-growth-2026.html</link>
<description>Global Tek Industrial said on July 20 that it is moving deeper into AI liquid cooling, humanoid robots and aerospace as it targets stronger operating momentum in the second half of 2026. The Taiwan-based industrial supplier said those three segments are becoming its next growth engines as it works to lift revenue and broaden its customer base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Global Tek president Yah-hsing Huang. Credit: DIGITIMES]]></media:description>
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<title>AI data centers push liquid cooling into core infrastructure</title>
<pubDate>Thu, 23 Jul 2026 22:18:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD233/data-liquid-cooling-infrastructure-demand-cooling.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:178;109-286"&gt;Rising computing demand in AI data centers is turning liquid cooling from a premium option into a core infrastructure element for high-power AI racks and newly built facilities.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<title>TEEMA advances Mexico science park plan as Sonora offers visa and policy support</title>
<pubDate>Thu, 23 Jul 2026 22:18:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260721PD246/taiwan-science-park-mexico-investment-government.html</link>
<description>The Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) moved its event promoting investment in science parks forward on July 21 in Taipei, with Mexico's Sonora state emerging as a key focus. The gathering highlighted new support from Sonora officials and fresh details on TEEMA's "Science Park 3.0" plan, giving Taiwanese companies a clearer view of the proposed overseas base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>After SDA: How the Pentagon is rebuilding military space&#38;mdash;and why Taiwan's satellite industry should pay attention</title>
<pubDate>Thu, 23 Jul 2026 22:17:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD214/roadmap-2027-capella-airbus-hybrid.html</link>
<description>The proposal to dissolve the US Space Development Agency (SDA) in the Fiscal Year 2027 National Defense Authorization Act (NDAA) has attracted attention largely as a government restructuring measure. Yet focusing solely on the agency's future risks overlooking the far more consequential story unfolding behind it.</description>
<dc:creator>AI bot</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: United States Space Force]]></media:description>
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<title>AMD goes all-in on ecosystem strategy to challenge Nvidia</title>
<pubDate>Thu, 23 Jul 2026 22:14:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260724VL200/amd-2026-hardware-infrastructure-launch.html</link>
<description>AMD used its Advancing AI 2026 conference in San Francisco this week to do more than launch new hardware &#38;mdash; it put its entire AI ecosystem strategy on display in a direct challenge to NVIDIA's grip on the AI infrastructure market.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Monica Chen]]></media:description>
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<item>
<title>BMW Group names Benjamin Nagel to lead Hong Kong, Macau and Taiwan</title>
<pubDate>Thu, 23 Jul 2026 09:05:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260723PD235/bmw-taiwan-macau-business-management.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:252;115-366"&gt;BMW Group has appointed Benjamin Nagel as managing director of BMW Group's importer markets in Hong Kong, Macau and Taiwan, effective Sept. 1, 2026. He will succeed Raymond Tan Chor Ann, who will become managing director and CEO of BMW Group Malaysia.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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</media:content></item>
</channel>
</rss>

