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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 16 Oct 2026 11:00:02 GMT</lastBuildDate>
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<title>Gemtek partners with Starman to make optical transceivers in US</title>
<pubDate>Fri, 16 Oct 2026 09:10:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD233/gemtek-equipment-partnership-production-manufacturing.html</link>
<description>On October 15, network equipment maker Gemtek Technology announced a strategic partnership with Starman New Photonics, a subsidiary of Starman Holdings, to form a joint venture in the US. The new entity will manufacture advanced optical transceivers to capture demand for optical interconnects driven by hyperscale AI data centers.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Taiwan to build industrial parks in US; Texas site already found</title>
<pubDate>Fri, 16 Oct 2026 09:08:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL218/taiwan-texas-industrial-government-tsmc.html</link>
<description>Taiwan plans to set up industrial parks in the US to help its supplier ecosystem reach customers like Nvidia and other local hardware manufacturers. It is starting with a complex in Texas, which has become a hotspot of expansion plans among Taiwanese tech companies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Project Bromo tests Europe's new industrial policy as Brussels weighs fast track for space champion</title>
<pubDate>Fri, 16 Oct 2026 09:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL213/europe-industrial-market-competition-airbus.html</link>
<description>The global space market has become increasingly dominated by SpaceX, while China continues to press forward with state-backed launch and satellite projects. That shift has sharpened Europe's concerns over strategic dependence and its relatively fragmented industrial base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>South Korea's September ICT Exports Surge Past US$75B on AI Demand</title>
<pubDate>Fri, 16 Oct 2026 08:39:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD242/exports-infrastructure-shipments-2026-growth.html</link>
<description>Driven by expanding global investments in artificial intelligence infrastructure, South Korea's ICT exports shattered previous records in September 2026. Shipments surged past the US$75 billion mark in a single month, anchored by semiconductor exports that topped US$60 billion, accounting for more than 80% of total ICT shipments.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI server tracker: semiconductor testing and design services rally on compute demand</title>
<pubDate>Fri, 16 Oct 2026 07:52:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL215/ic-testing-interface-ic-design-ai-server-demand-revenue-growth.html</link>
<description>Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial intelligence (AI), high-performance computing (HPC), and custom ASIC developments, both sectors demonstrated substantial year-over-year revenue gains as of September 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AZoM]]></media:description>
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<title>Telco giant builds Taiwan's high-speed computing network for AI agent era</title>
<pubDate>Fri, 16 Oct 2026 07:37:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD239/cht-president-data-infrastructure-governance.html</link>
<description>Chunghwa Telecom president Rong-shy Lin said the shift from conversational AI to autonomous AI agents is reshaping enterprise adoption, making data governance, access controls and accountability critical to deployment at scale.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>ASE unveils 18 advanced packaging projects with three universities</title>
<pubDate>Fri, 16 Oct 2026 07:26:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD240/ase-packaging-technology-materials-development.html</link>
<description>ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects on October 16, focusing on advanced packaging integration and the development of critical processes and materials.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ASE]]></media:description>
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<title>Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU</title>
<pubDate>Fri, 16 Oct 2026 07:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL206/gpu-amd-nvidia-startup-manufacturing.html</link>
<description>US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional rendering, challenging Nvidia and AMD in markets beyond AI acceleration.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bolt Graphics]]></media:description>
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<title>Samsung to break ground on second Texas chip fab in November</title>
<pubDate>Fri, 16 Oct 2026 07:01:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL214/samsung-texas-fab-expansion-production.html</link>
<description>Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its first facility prepares to begin operations by the end of the year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF</title>
<pubDate>Fri, 16 Oct 2026 06:57:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD214/samsung-sk-hynix-hbm-data-capacity.html</link>
<description>Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory (HBM) directly above graphics processors and SK Hynix advancing high-bandwidth flash (HBF) to expand memory capacity for AI inference.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
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<title>Delta says AI power gap will drive standalone microgrids</title>
<pubDate>Fri, 16 Oct 2026 06:31:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD238/delta-electronics-electricity-micro-grid-2026.html</link>
<description>Delta Electronics chairman Ping Cheng said at the 2026 Global Views Leaders Forum on October 15, 2026, that the world is entering an era of electrification, with AI data centers and EVs driving electricity demand beyond available supply. Delta is expanding its focus from power consumption to an integrated microgrid architecture spanning generation, transmission, distribution, energy storage and consumption, with solid oxide fuel cells (SOFCs) and solid-state transformers (SSTs) as its key products.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan forecasts 6.04% growth in 2027 on AI-driven exports</title>
<pubDate>Fri, 16 Oct 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD201/taiwan-growth-forecast-2027-2026.html</link>
<description>Taiwan's economy is projected to grow 6.04% in 2027 as expanding global AI-related capital spending boosts the island's exports, despite geopolitical conflicts and trade barriers weighing on global growth, Taiwan's National Development Council (NDC) Minister Yeh Chun-hsien said on October 15.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>FICG eyes 4x optical communications capacity by 2027</title>
<pubDate>Fri, 16 Oct 2026 06:08:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD231/fic-global-optical-communications-capacity-johor-production-2027.html</link>
<description>FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity. Chairman Leo Chien described the next three years as a "frenzied expansion period," with the company's Johor, Malaysia, facility set to increase capacity 4x by the end of 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD231/fic-global-optical-communications-capacity-johor-production-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd231_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Volvo Cars and Nvidia expand partnership on automated driving</title>
<pubDate>Fri, 16 Oct 2026 05:57:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PR201/volvo-nvidia-autonomous-driving-partnership-vehicle.html</link>
<description>Volvo Cars and Nvidia are expanding their partnership to develop automated-driving technology for future Volvo vehicles, with potential implications for drivers worldwide. The system is designed to handle highways, urban streets, and parking while gradually introducing eyes-off and mind-off driving, combining Volvo's safety expertise with Nvidia's sensors, computing, and software.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pr201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>Samsung's chip and device chiefs head to Tokyo during Lee's visit</title>
<pubDate>Fri, 16 Oct 2026 05:52:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL210/samsung-japan-packaging-materials.html</link>
<description>Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman Lee Jae-yong was visiting Japan, bringing together the company's three executive directors and key corporate decision-makers as it expands cooperation with Japanese semiconductor suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue</title>
<pubDate>Fri, 16 Oct 2026 04:54:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD222/holtek-mcu-ai-server-cooling-2027.html</link>
<description>Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and intelligent control, edge AI computing, and general-purpose applications.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Holtek Semiconductor VP Chien-chou Pan. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Supermicro appoints Mark Long as chief financial officer</title>
<pubDate>Fri, 16 Oct 2026 04:30:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PR200/supermicro-management-finance-infrastructure.html</link>
<description>Supermicro Computer has appointed Mark Long as chief financial officer, bringing an experienced technology finance executive to lead the company as it expands its artificial intelligence and IT infrastructure operations. The leadership change at the US-based company could influence its financial execution, capital allocation, and ability to serve customers across markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pr200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Supermicro]]></media:description>
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<title>Analysis: Intel CEO Lip-Bu Tan's power of humility &#38;mdash; how one phone call helped reshape the chip giant's comeback</title>
<pubDate>Fri, 16 Oct 2026 04:23:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD229/intel-ceo-nvidia-packaging-market.html</link>
<description>As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind in the AI race.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>US chipmakers rely more on overseas production than supplier data suggests, SIA finds</title>
<pubDate>Fri, 16 Oct 2026 04:19:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD216/sia-usa-chipmakers-supplier-production.html</link>
<description>The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However, only 68% of those inputs are actually manufactured or assembled in those regions, exposing geographic dependencies that supplier headquarters data can obscure, according to an October 9 report from the Semiconductor Industry Association (SIA).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[An aerial view of Intel's Fab 52 semiconductor manufacturing facility in Arizona. Credit: Intel Corporation]]></media:description>
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<title>Nvidia deepens China gaming push with DLSS 5 partnerships</title>
<pubDate>Fri, 16 Oct 2026 04:14:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD227/nvidia-gaming-market-technology-tencent.html</link>
<description>Nvidia is expanding its presence in China's gaming market by bringing its next-generation Deep Learning Super Sampling (DLSS) 5 neural rendering technology to titles from major Chinese developers, including NetEase, Tencent, Perfect World's Hotta Studio, and Beijing Lingyoufang Network Technology.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD227/nvidia-gaming-market-technology-tencent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd227_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: GeForce RTX]]></media:description>
</media:content></item>
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<title>Myson Century signs 3 AUSA MOUs for defense expansion</title>
<pubDate>Fri, 16 Oct 2026 04:10:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD232/subsidiary-vehicle-partnership-business-2026.html</link>
<description>Myson Century, a subsidiary of Sun Yad Group, signed strategic memorandums of understanding with IXI EW, SafeSky Systems USA, and Global Ordnance Group at the Association of the United States Army's 2026 Annual Meeting and Exposition, or AUSA 2026. The agreements link counter-drone, unmanned vehicle, and defense supply-chain resources, creating opportunities to expand the company's product portfolio and develop markets in Taiwan and the Association of Southeast Asian Nations (ASEAN) region.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd232_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Myson Century]]></media:description>
</media:content></item>
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<title>DIGITIMES Insights: China's automakers pursue three humanoid robot strategies as EV supply chains offer 60% overlap</title>
<pubDate>Fri, 16 Oct 2026 03:58:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD218/china-automakers-humanoid-robot-robotics.html</link>
<description>Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources developed through their automotive businesses, according to DIGITIMES Intelligence.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China</title>
<pubDate>Fri, 16 Oct 2026 03:53:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD220/capacity-globalfoundries-packaging-tsmc-wafer.html</link>
<description>As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand for silicon interposers, through-silicon vias (TSVs), and embedded deep trench capacitors (eDTCs) in advanced packaging is creating a sizable blue-ocean market for mature-node capacity.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>LCD TV panel prices struggle to rise in 4Q26</title>
<pubDate>Fri, 16 Oct 2026 03:48:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD223/lcd-tv-panel-panel-price-tv-lcd.html</link>
<description>LCD TV panel prices face a tug-of-war in the fourth quarter of 2026 as panel makers push for increases while LCD TV brands maintain relatively steady purchasing and contract manufacturers remain cautious. Rising upstream material costs and continued production controls should help prices stabilize, but a broad-based increase remains unlikely.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead</title>
<pubDate>Fri, 16 Oct 2026 03:42:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD228/boe-packaging-production-display-ai-chip.html</link>
<description>Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core substrates, producing 24-layer samples measuring more than 100 &#38;times; 100mm. The samples have been delivered to customers and passed multiple reliability tests, with further validation underway.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's Chun Yuan Steel sees 4Q26 auto surge, expands into AI robotics</title>
<pubDate>Fri, 16 Oct 2026 03:36:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD226/taiwan-robotics-market-growth-sales.html</link>
<description>Chun Yuan Steel expects Taiwan's auto market to deliver its strongest quarter of 2026 in the final three months, lifting full-year new-vehicle sales to 430,000 units from 411,000 in 2025. The steel processor also anticipates fresh growth opportunities as Kuozui Motors begins exporting finished vehicles to Japan, potentially strengthening Taiwan's position in Toyota Motor's global production network.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
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<title>Charts: YMTC bets on premium eSSDs to take on Samsung</title>
<pubDate>Fri, 16 Oct 2026 03:26:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD206/demand-nand-market-ymtc-samsung.html</link>
<description>AI-driven NAND demand is entering a supercycle, positioning Yangtze Memory Technologies Co. (YMTC) as the fastest-growing memory supplier. According to Counterpoint Technology Market Research, YMTC's revenue in 2026 is projected to grow six times faster than that of the overall industry and its peers as it expands aggressively into server-related business.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains</title>
<pubDate>Fri, 16 Oct 2026 03:17:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL209/demand-earnings-price-dram-profit.html</link>
<description>China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand for domestic processors and optical interconnects, and recovering chip markets. However, diverging quarterly results reveal a widening gap between AI-driven growth and the traditional memory pricing cycle.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AIDC white paper flags energy efficiency, power management as key to site selection</title>
<pubDate>Fri, 16 Oct 2026 03:13:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD224/aidc-management-efficiency-capacity-data.html</link>
<description>As the high power density of AI data centers (AIDCs) becomes an increasingly pressing issue, industry experts are highlighting the importance of power management and power usage effectiveness (PUE). To alleviate bottlenecks in grid infrastructure, AIDC projects must assess feeder capacity, matching accuracy for renewable power sources, and power management when selecting sites.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>Japan bets on physical AI as Murata, AWS, Hitachi showcase self-learning robots at CEATEC 2026</title>
<pubDate>Fri, 16 Oct 2026 03:02:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD221/aws-hitachi-2026-ceatec-murata.html?chid=10</link>
<description>Japan is stepping up its push into physical AI, with major technology companies and research institutions showcasing advances in autonomous robot learning, motion sensing, and agricultural automation at CEATEC 2026.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>East Asia</category>
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<title>Nvidia-backed CoreWeave bond spike highlights debt risks in the AI infrastructure boom</title>
<pubDate>Fri, 16 Oct 2026 02:52:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL208/infrastructure-market-nvidia-demand-business.html</link>
<description>A sharp sell-off across artificial intelligence infrastructure stocks has turned a quiet worry about debt into a main concern for Wall Street. The sudden drop in stock and bond prices for CoreWeave, a fast-growing cloud provider backed by Nvidia, has raised questions about whether the heavy borrowing used to fund the AI expansion is becoming too risky.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung's India chip research arm opens quantum lab at IISc</title>
<pubDate>Fri, 16 Oct 2026 02:39:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL204/samsung-india-quantum-workforce.html</link>
<description>Samsung Semiconductor India Research (SSIR), Samsung's semiconductor research and development center in India, and the Indian Institute of Science (IISc) inaugurated a Quantum Research Lab on the IISc campus in Bengaluru on October 15, 2026, aiming to build India's research capabilities in quantum technologies and advanced semiconductors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones</title>
<pubDate>Fri, 16 Oct 2026 02:39:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD215/lg-innotek-2028-glass-substrate-automotive-business.html</link>
<description>LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean components maker seeks to reduce its reliance on smartphone camera modules and expand into automotive technologies.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
</media:content></item>
<item>
<title>AI buyers lock in capacity, driving Taiwan private investment to record NT$6.95T</title>
<pubDate>Fri, 16 Oct 2026 02:34:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD202/taiwan-demand-capacity-investment-infrastructure.html</link>
<description>Strong global demand for AI infrastructure hardware is prompting buyers to secure capacity through advance payments and long-term contracts, driving Taiwan's semiconductor, packaging and testing, memory, substrate, and equipment supply chains to expand aggressively. Private investment in Taiwan is projected to reach a record NT$6.9539 trillion (US$215.4 billion) in 2026 as companies build factories, purchase equipment, import raw materials, and hire workers to meet customer demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD202/taiwan-demand-capacity-investment-infrastructure.html</guid>
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<item>
<title>Chip inflation drives Samsung, LG toward premium TVs</title>
<pubDate>Fri, 16 Oct 2026 02:32:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD205/tv-samsung-lg-market-inflation.html</link>
<description>Global TV market growth is under pressure, but premium models are poised to expand. As rising memory prices fuel "chip inflation" and squeeze margins on budget TVs, Samsung Electronics and LG Electronics are reshaping their product mixes, strengthening OLED and Micro RGB offerings to support pricing through picture quality and feature differentiation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Japan's automakers turn to vehicle-road coordination to advance autonomous driving</title>
<pubDate>Fri, 16 Oct 2026 02:31:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD212/automakers-technology-infrastructure-vehicle-nissan.html</link>
<description>Japan's automakers are presenting autonomous-driving systems that connect vehicles with road infrastructure as a route toward deployment, highlighting a strategic choice beyond vehicle-only artificial intelligence. At Japan Mobility Show Bizweek 2026, Nissan, Subaru, and Toyota are demonstrating technologies that combine onboard systems, cloud data, sensors, and communications to improve safety.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD212/automakers-technology-infrastructure-vehicle-nissan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd212_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>US pushes AI exports as chip industry flags supplier gaps and reshoring costs</title>
<pubDate>Fri, 16 Oct 2026 02:30:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD217/semicon-west-usa-ai-exports-investment-supplier-2026.html</link>
<description>At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made products, and export controls could undermine the country's semiconductor ambitions.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Meta releases Muse Spark Open weights, reversing its closed course with conditions</title>
<pubDate>Fri, 16 Oct 2026 02:27:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL207/meta-display-microsoft-amazon-google-cloud.html</link>
<description>Meta on Thursday released the weights of Muse Spark Open, which it calls the most capable US open-weight model to date. The company said the multimodal model has 816 billion total parameters (42 billion active) and a one-million-token context window, and is built for coding and agentic work. Meta said the weights can be downloaded from Hugging Face, Amazon SageMaker AI, Google Cloud, and Microsoft Foundry. It also said the model received extra safety post-training and met the thresholds of its internal risk framework.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>TSMC deal could slow Musk's Terafab, but US suppliers still see upside</title>
<pubDate>Fri, 16 Oct 2026 02:24:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD211/tsmc-elon-musk-texas-fab-manufacturing.html</link>
<description>The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13&#38;ndash;15 in San Francisco.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD211/tsmc-elon-musk-texas-fab-manufacturing.html</guid>
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<title>Hyundai Motor Group plans US$15.5 billion India investment from 2026</title>
<pubDate>Fri, 16 Oct 2026 02:19:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD210/hyundai-2026-investment-production-growth.html</link>
<description>Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic growth and exports to emerging markets. The commitment could strengthen India's role in the group's mobility strategy and broaden its manufacturing footprint.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD210/hyundai-2026-investment-production-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd210_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit Hyundai Motor]]></media:description>
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<title>CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment</title>
<pubDate>Fri, 16 Oct 2026 02:19:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD208/cxmt-sicarrier-ddr5-dram-equipment.html</link>
<description>China's leading DRAM manufacturer CXMT has disclosed progress in its 4F&#38;sup2; DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end of 2026, drawing renewed attention to the country's development of next-generation memory technologies.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD208/cxmt-sicarrier-ddr5-dram-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd208_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: WESEMiBAY 2026]]></media:description>
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<title>TSMC details pricing, confirms agentic AI boosts CPU demand</title>
<pubDate>Fri, 16 Oct 2026 02:07:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD219/tsmc-demand-cpu-packaging-capacity.html</link>
<description>TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise as overall AI demand remains strong.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD219/tsmc-demand-cpu-packaging-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd219_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>DayOne doubles Johor data center financing to MYR30 billion as billings pass 1GW</title>
<pubDate>Fri, 16 Oct 2026 02:01:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL203/data-center-financing-johor-capacity-investment.html</link>
<description>Singapore-based data center developer DayOne has secured an additional MYR15 billion (US$3.67 billion) in financing from a consortium of seven banks to expand hyperscale data center capacity in Johor, Malaysia, Reuters reported on October 13, 2026. Together with MYR15 billion in multicurrency financing secured in 2025, the platform now stands at MYR30 billion, according to a joint statement from the lenders cited by &lt;em&gt;The Business Times&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Tong Yang sees stronger 4Q26 margins, but shipping, costs remain risks</title>
<pubDate>Fri, 16 Oct 2026 01:53:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD209/shipping-capacity-2026-oem-revenue.html</link>
<description>Tong Yang Industry expects capacity utilization to reach 90%&#38;ndash;95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal peak. But tight container capacity and higher raw-material costs could shape performance, deputy general manager San-Liang Huang said, as shipping remains constrained.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD209/shipping-capacity-2026-oem-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI traffic reshapes e-commerce as Shopline GMV rises 20% in 2026</title>
<pubDate>Fri, 16 Oct 2026 01:47:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD203/e-commerce-genai-2026-data-management.html</link>
<description>As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform Shopline said its gross merchandise value (GMV) grew 20% in 2026 from 2025, 2.5 times the market average, highlighting strong performance amid intense retail competition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD203/e-commerce-genai-2026-data-management.html</guid>
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<title>Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand &#38;mdash; from advanced-node capacity to Musk's Terafab</title>
<pubDate>Fri, 16 Oct 2026 01:36:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD207/tsmc-capacity-production-earnings-manufacturing.html</link>
<description>TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach 44%. Yet supply chain sources say the earnings call carried a more consequential message: TSMC's increasingly explicit assertion of the bargaining power afforded by its lead in advanced process technology and manufacturing scale.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD207/tsmc-capacity-production-earnings-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd207_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[TSMC chairman C.C. Wei. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking</title>
<pubDate>Fri, 16 Oct 2026 00:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL200/huawei-transistor-equipment-packaging-asml.html</link>
<description>China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms, analysts say, the stakes are different: with US export controls limiting access to the tools needed for leading-edge transistor scaling, stacking and connecting chips more densely has become one of the few routes left to narrow the performance gap, an approach Huawei has framed as its Tau scaling law.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261016vl200_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging</title>
<pubDate>Fri, 16 Oct 2026 00:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL201/asml-packaging-2026-wafer-equipment.html</link>
<description>As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be preparing its second move into it. Patent filings analyzed by research firm SemiAnalysis suggest the Dutch lithography leader is building a die-to-wafer (D2W) hybrid bonder, a tool that would pit it against Besi, the current leader, and a growing group of front-end rivals chasing the same market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016VL201/asml-packaging-2026-wafer-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016vl201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>AI investment risks rise as China models gain ground</title>
<pubDate>Fri, 16 Oct 2026 00:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD204/investment-market-development-business-financing.html</link>
<description>As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion to investment returns and long-term debt-servicing capacity. The AI industry continues to attract capital but must also prove that its business models can generate profits.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261016PD204/investment-market-development-business-financing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261016pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear</title>
<pubDate>Fri, 16 Oct 2026 00:23:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL202/intel-cpu-israel-plant-loss.html</link>
<description>Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether production at the site, which makes chips on its capacity-constrained Intel 7 process, has been affected.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Thunder Tiger debuts new loitering munition drone at AUSA 2026</title>
<pubDate>Thu, 15 Oct 2026 23:57:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD200/2026-supply-chain-mobile.html</link>
<description>Thunder Tiger showcased its latest defense systems at AUSA 2026, the Association of the United States Army's annual exhibition in the US, marking its fourth consecutive appearance at the event and its largest booth to date. The Taiwan-based company presented three key products in a bid to capture US defense opportunities.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<title>Nvidia unveils PTFE switch board at OCP, names Taiwan partners</title>
<pubDate>Thu, 15 Oct 2026 23:57:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD227/nvidia-switch-taiwan-transmission-materials.html</link>
<description>Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene (PTFE) and naming seven supply-chain partners. Taiwan's Flexium Interconnect and Taiflex Scientific joined Chinese suppliers Victory Giant Technology, Shennan Circuits, Shenzhen Kinwong Electronic, Shengyi Technology, and US-based TTM Technologies on the partner list.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Samsung SDI targets 2027 LFP BBU battery production</title>
<pubDate>Thu, 15 Oct 2026 23:56:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD228/samsung-sdi-production-2027-demand-lithium.html</link>
<description>Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup batteries by a South Korean battery maker. The move expands the company's product portfolio beyond its traditional focus on ternary batteries as AI data centers drive rapidly growing demand for battery backup units (BBUs).</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Samsung SDI]]></media:description>
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<title>AI power crunch drives data center demand for self-generation</title>
<pubDate>Thu, 15 Oct 2026 23:56:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD230/aidc-capacity-equipment-chips-electricity.html</link>
<description>The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity. As power consumption surges at AI data centers (AIDCs), conventional public grids are increasingly facing bottlenecks, and self-generation and improved grid resilience are now requirements in major data center construction projects worldwide.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>MediaTek ASIC deal with ByteDance would expand data center push</title>
<pubDate>Thu, 15 Oct 2026 23:56:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD232/bytedance-mediatek-asic-chips-business.html</link>
<description>ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the matter. A deal would help ByteDance secure critical chip supplies while expanding MediaTek's data center business and intensifying competition with Qualcomm and other chipmakers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Linde LienHwa tackles hydrogen transport dilemma with HaaS</title>
<pubDate>Thu, 15 Oct 2026 23:56:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD233/taiwan-development-vehicle-2026-industrial.html</link>
<description>As hydrogen development and applications take center stage at Energy Taiwan 2026, industrial gas giant Linde LienHwa Group is introducing an end-to-end "Hydrogen-as-a-Service" (HaaS) business model. To support this push, the company plans to progressively localize vehicle assembly in Taiwan, expecting tangible results as early as 2028, according to Jeffery Shan, vice president and head of Merchant &#38;amp; Clean Energy at Linde LienHwa.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Cloud AI absorbs resources as non-AI semiconductors face prolonged downturn</title>
<pubDate>Thu, 15 Oct 2026 23:55:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD234/data-growth-technology-inflation-hbm.html</link>
<description>Investment in AI data centers remains strong, but semiconductor growth is becoming increasingly concentrated in cloud AI, while the long-running decline in consumer technology prices has come to an abrupt halt. At a SEMICON West 2026 industry outlook session, Duncan Meldrum, an economist at Hilltop Economics, warned that the shift is putting additional pressure on the broader semiconductor market.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSEC focuses overseas solar strategy on Japan rooftops</title>
<pubDate>Thu, 15 Oct 2026 23:53:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD235/tsec-solar-market-expansion-taiwan.html</link>
<description>TSEC is focusing its overseas expansion on Japan's rooftop solar market and expects Taiwan's solar installations to recover in 2027 from a market low point. For the Taiwan-based solar manufacturer, building a solar plant in the US remains an important direction, but it is not an immediate priority, as the company monitors the uncertainty around the US Minimum Import Price (MIP) policy.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Sustainability</category>
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<title>TSMC excludes CPUs from AI accelerator growth forecast</title>
<pubDate>Thu, 15 Oct 2026 23:52:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD251/tsmc-demand-taiwan-accelerator-growth.html</link>
<description>Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI accelerator demand growth. TSMC chairman C.C. Wei said at the company's earnings conference on October 15 that the company is maintaining its original, narrower definition of AI demand, mainly because it is difficult to clearly distinguish whether CPUs are used in traditional servers or AI servers. Actual demand also depends on how customers deploy the technology and configure their products.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Hesai moves beyond lidar as Kosmo targets physical AI's data bottleneck</title>
<pubDate>Thu, 15 Oct 2026 23:52:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL209/hesai-data-robotics-robot.html</link>
<description>As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment &#38;mdash; particularly the extreme variability of physical environments &#38;mdash; are emerging as a subtler configuration challenge in the industry spotlight.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Hesai]]></media:description>
</media:content></item>
<item>
<title>China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking</title>
<pubDate>Thu, 15 Oct 2026 23:52:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL213/euv-technology-commercial-shanghai-development.html</link>
<description>Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization rate, marking progress in China's efforts to develop domestic lithography technology. However, the system remains three to five years from mass production, with output power and long-term stability posing major engineering challenges.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Langdao Silex]]></media:description>
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<title>Manus returns to China's AI agent race with US$500 million reset</title>
<pubDate>Thu, 15 Oct 2026 23:51:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL217/meta-acquisition-startup-financing-tencent.html?chid=10</link>
<description>As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities beyond China left the industry speculating about its next steps after an abrupt regulatory reversal.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<media:description type="plain"><![CDATA[Credit: AI-assisted illustration by DIGITIMES created for editorial purposes; not an official company image.]]></media:description>
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<title>China's YMTC targets 9,600 MT/s with 4F&#38;sup2; DRAM design</title>
<pubDate>Thu, 15 Oct 2026 23:51:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL224/dram-ymtc-design-manufacturing-nand-flash.html</link>
<description>China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F&#38;sup2; DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond NAND flash as the company pursues a CNY33 billion (approx. US$4.93 billion) Shanghai initial public offering.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: YMTC]]></media:description>
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<title>Interview: The AI economy needs US$6T in funding &#38;mdash; but from where?</title>
<pubDate>Thu, 15 Oct 2026 23:49:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL227/economy-funding-language.html</link>
<description>AI is clearly making an enormous impact on the global economy, with capabilities extending from language chatbots to agentic teams and the physical realm within just a few years. A new report by consulting firm Bain takes stock of AI's effects on businesses so far and projects how it could shape the near future.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Bain &#38; Company]]></media:description>
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<title>Samsung's Austin chip workforce shrinks 32% as Taylor 2nm fab nears opening</title>
<pubDate>Thu, 15 Oct 2026 23:48:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL228/samsung-texas-workforce-2nm-2025.html</link>
<description>Samsung Electronics' semiconductor workforce in Austin, Texas, shrank 32% in 2025 as local operating expenditures plunged nearly 75%, contrasting with increased activity at its nearby Taylor foundry, which is preparing to begin operations by the end of 2026 and gradually ramp up 2nm chip production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>LG Innotek eyes 2027 chip substrate growth as Big Tech supply talks continue</title>
<pubDate>Thu, 15 Oct 2026 23:44:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL229/lg-innotek-substrate-2027-growth-fc-bga.html</link>
<description>South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares to enter the high-end AI accelerator market. Under this strategy, the company aims to secure customer commitments before expanding production capacity as it seeks to diversify beyond smartphone camera modules.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl229_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[LG Innotek's AI accelerator substrate (right) is six times larger than its PC substrate (left). Credit: LG Innotek]]></media:description>
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<title>AI server tracker: Optical suppliers' September revenue jumps 90%</title>
<pubDate>Thu, 15 Oct 2026 23:44:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL230/revenue-taiwan-ai-server-growth-communications.html</link>
<description>Taiwan's optical communications suppliers posted a sharp revenue increase in September 2026, far outpacing major power supply manufacturers in percentage growth as demand for faster data center connectivity continued to expand. The six optical suppliers tracked by DIGITIMES reported combined revenue of NT$3.73 billion (approx. US$116 million), up 90.2% year-over-year and 16.4% from August.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[EZconn's 800G QSFP-DD active optical cable is designed for high-speed data center connectivity and AI computing clusters. Credit: EZconn]]></media:description>
</media:content></item>
<item>
<title>LINE Taiwan pushes AI services as it marks 15 years and deepens anti-fraud role</title>
<pubDate>Thu, 15 Oct 2026 23:44:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD217/line-taiwan-ai-cybersecurity.html</link>
<description>LINE Taiwan marked its 15th year in the market with a strategy shift that signals broader ambitions beyond messaging. The company is expanding into AI-powered daily services, aiming to connect users, brands, and merchants through agentic AI tools, while also strengthening account security and anti-fraud defenses.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261014pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition</title>
<pubDate>Thu, 15 Oct 2026 23:43:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD232/qualcomm-ai-agent-chips-silicon-competition-infrastructure.html</link>
<description>Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data center product line in June 2026, the company expanded its business to include multiple hyperscalers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261014pd232_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Anthropic targets low-conflict sites for Australian data centers</title>
<pubDate>Thu, 15 Oct 2026 15:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD248/anthropic-data-australia-government-capacity.html</link>
<description>Anthropic plans to place new data centers in Australia away from densely populated areas, using renewable energy and previously developed sites to reduce conflicts with residents. The US artificial intelligence company is evaluating proposals from state and local governments competing for its investment, while expanding computing capacity in the country.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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