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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Global annual AI server shipments, 2025-2026</title>
<pubDate>Fri, 2 Oct 2026 10:10:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001RS400/high-end-ai-server-shipments-2026.html?chid=2</link>
<description>Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Server and HPC</category>
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<title>Anthropic aims for mid-November IPO as it juggles relationship with Trump administration</title>
<pubDate>Fri, 2 Oct 2026 10:01:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL214/anthropic-ipo-ai-regulation-usa-government.html</link>
<description>Anthropic is reportedly eyeing an IPO as early as mid-November that could become the biggest IPO to date. The AI startup's run-up to the listing coincides with a shaky relationship with the US government, calls from its CEO Dario Amodei for more industry regulations, and nationwide public concerns about AI safety.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives</title>
<pubDate>Fri, 2 Oct 2026 09:58:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL215/mediatek-dimensity-galaxy-tab-samsung-2nm.html</link>
<description>MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership between the two companies across Samsung's Galaxy Tab line.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>LG Energy Solution and GM bet LMR can bridge the gap between LFP cost and high-nickel range</title>
<pubDate>Fri, 2 Oct 2026 09:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL219/automakers-lges-general-motors-cost-affordable.html</link>
<description>For years, automakers have grappled with an underlying paradox stemming from persistent EV raw-material pressures, as supply chains worldwide have been constrained by a familiar battery-chemistry trade-off: cost-effectiveness versus high-performance density.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Bull's France factory doubles capacity to capture growing orders as EU pushes AI sovereignty</title>
<pubDate>Fri, 2 Oct 2026 09:03:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL213/capacity-france-eu-europe-supercomputer.html</link>
<description>Supercomputer maker Bull will double its production capacity using an expanded factory that reopened on October 1. The French creator of Europe's fastest supercomputers described unprecedented orders as the continent seeks to catch up to the US and China in AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Climax Technology stays cautious on 2H26 as memory costs rise</title>
<pubDate>Fri, 2 Oct 2026 09:01:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD241/2026-revenue-gross-margin-inventory-earnings.html</link>
<description>Climax Technology said elevated memory prices are pressuring its gross margin in the second half of 2026, while longer customer validation cycles for substitute memory parts are also dampening its outlook. The wireless communications company said its overall second-half outlook remains conservative.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<title>Meta to add Naver Map navigation to AI glasses in South Korea</title>
<pubDate>Fri, 2 Oct 2026 08:54:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD246/meta-naver-2026-samsung-google.html</link>
<description>Meta will link Naver Map's walking-navigation feature to its Ray-Ban Meta and Oakley Meta AI glasses in 2026, as it moves to strengthen its presence in South Korea before rival AI glasses from Google and Samsung Electronics arrive. According to South Korean media outlets &lt;em&gt;Seoul Economic Daily&lt;/em&gt; and &lt;em&gt;ETNews&lt;/em&gt;, the deal would make Naver the first South Korean company to partner with Meta in the AI glasses category.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>iPhone 18 Pro lifts Apple to 33% China share</title>
<pubDate>Fri, 2 Oct 2026 08:48:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD243/apple-iphone-sales-foldable-market.html</link>
<description>Apple's iPhone 18 Pro series lifted first-week sales in China by 12% year over year, giving the soft smartphone market a much-needed boost and pushing Apple to the top of weekly sales with a 33% market share. The strong start underscores the brand loyalty that premium customers continue to show toward Apple's flagship phones, even amid market volatility.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Apple's Ternus pushes management cuts, faster hardware</title>
<pubDate>Fri, 2 Oct 2026 08:46:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD242/apple-hardware-tim-cook-john-ternus-development.html</link>
<description>After succeeding Tim Cook as Apple's chief executive, John Ternus is considering a broad organizational overhaul aimed at strengthening an engineering-centered R&#38;amp;D system, according to &lt;em&gt;Bloomberg&lt;/em&gt; and &lt;em&gt;Reuters&lt;/em&gt;. He is also weighing less reliance on Apple's traditional spring and fall product cycles in favor of more flexible and frequent device launches throughout the year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Huawei hikes flagship prices up to US$200 as memory shortages hit smartphone margins</title>
<pubDate>Fri, 2 Oct 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD233/huawei-smartphone-flagship-price-galaxy.html</link>
<description>Soaring memory procurement costs are pushing smartphone makers to pass expenses on to consumers. As artificial intelligence (AI) infrastructure expansion continues to squeeze global memory supplies, Huawei has officially raised device prices, citing an average US$200 increase in per-unit manufacturing costs. The move follows similar price hikes by Samsung Electronics across its flagship portfolio.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<title>OpenAI fires 3 safety researchers for sharing confidential information</title>
<pubDate>Fri, 2 Oct 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD237/openai-investigation-bloomberg-infrastructure-redwood.html</link>
<description>OpenAI fired three safety researchers after they shared confidential information with a third-party artificial intelligence safety group, according to &lt;em&gt;The Wall Street Journal&lt;/em&gt;, which first reported the news. The case has drawn attention because a person familiar with the matter said some of the material concerned OpenAI's infrastructure architecture.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>BMW to make 20% of senior management redundant with AI</title>
<pubDate>Fri, 2 Oct 2026 08:44:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD244/bmw-management-layoffs-2028.html</link>
<description>BMW AG said at its capital markets day on September 30 that it plans to use artificial intelligence (AI) to help streamline one-fifth of management roles by mid-2027. As BMW pushes to boost organizational agility through more efficient use of AI, the cuts will later extend to frontline ranks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Japanese firms cut China presence 22.4% as trade risks mount</title>
<pubDate>Fri, 2 Oct 2026 08:40:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD240/2026-production-sales-manufacturing-market.html</link>
<description>Japanese companies sharply reduced their footprint in China over the past two years, with the number operating there falling 22.4% from 13,034 to 10,118 as of the end of June 2026, according to a survey released by Teikoku Databank on September 28, 2026. The total was the lowest since the data series began in 2010, and 29.7% below the 2012 peak of 14,394.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform</title>
<pubDate>Fri, 2 Oct 2026 08:34:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD245/testing-cpo-equipment-automation-manufacturing.html</link>
<description>ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly expanding co-packaged optics (CPO) ecosystem. The collaboration will initially focus on the INS-2 test platform, advancing ficonTEC's double-sided wafer-level testing architecture &#38;mdash; with electrical testing from above and optical testing from below &#38;mdash; towards commercialisation and scaled deployment.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[CPOˇ¦s complex 3D integration creates new challenges for wafer-level optoelectronic testing. Credit: DIGITIMES]]></media:description>
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<title>Stellantis to pause four French plants amid EV battery shortages</title>
<pubDate>Fri, 2 Oct 2026 08:27:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD238/stellantis-france-plant-demand-vehicle.html</link>
<description>Stellantis said it will suspend operations at four auto assembly plants in France in October, citing shortages of long-range electric vehicle batteries and the need to control dealer inventories. The cuts come as the automaker adjusts output to match demand, with strong orders for EVs that use longer-range batteries continuing to outpace supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Hitachi and Fanuc launch Physical AI partnership for factory automation</title>
<pubDate>Fri, 2 Oct 2026 08:26:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD239/hitachi-fanuc-partnership-industrial-2026.html</link>
<description>Hitachi and Fanuc announced on September 30, 2026, that they have formed a strategic partnership on Physical AI, with internal testing beginning immediately and customer promotion planned for fiscal 2027. The Japanese industrial companies said they intend to apply the technology in manufacturing and other sectors, including semiconductors, pharmaceuticals and nursing care.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan pledges to help TSMC expand domestic investment amid Singapore rumors</title>
<pubDate>Fri, 2 Oct 2026 08:25:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD234/tsmc-investment-taiwan-government-moea.html</link>
<description>Rumors that TSMC is weighing a new semiconductor investment in Singapore have reignited concerns over its overseas expansion, while the Ministry of Economic Affairs (MOEA) said on October 2, 2026, that the government will help the chipmaker expand investment in Taiwan.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise</title>
<pubDate>Fri, 2 Oct 2026 08:18:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD236/startup-ai-inference-hardware-chips-funding.html</link>
<description>Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks in AI chips. The round, announced on October 1, 2026, and reported by &lt;em&gt;Reuters&lt;/em&gt;, is aimed at breaking through the memory wall that has limited performance in current systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Amazon weighs US$8B chip sale-leaseback to support credit rating</title>
<pubDate>Fri, 2 Oct 2026 08:08:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD235/amazon-chips-vehicle-nvidia-technology.html</link>
<description>Amazon is considering moving about US$8 billion worth of high-end Nvidia chips off its balance sheet through a sale-leaseback structure, according to the &lt;em&gt;Financial Times&lt;/em&gt; and &lt;em&gt;Reuters&lt;/em&gt;. The plan would shift thousands of Nvidia Grace Blackwell chips from data centers in Nevada and Virginia into an external special purpose vehicle, while Amazon would continue using the hardware under lease arrangements.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra</title>
<pubDate>Fri, 2 Oct 2026 07:57:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD228/nvidia-rubin-pcb-testing-ai-server.html</link>
<description>Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for possible use in the Rubin Ultra NVL576 Switch Tray, which is scheduled for mass production in the second half of 2027.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Qbic expands edge AI on Arm, lifts smart access control above 60%</title>
<pubDate>Fri, 2 Oct 2026 07:45:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD220/ipc-arm-market-2026-revenue.html</link>
<description>Industrial computer (IPC) maker Qbic held its pre-IPO presentation for the over-the-counter market on October 1, 2026, highlighting a strategy that differs from that of most Taiwanese IPC peers by centering on the Arm architecture instead of x86. Qbic said smart access control is now its biggest revenue driver, accounting for about 60% of revenue in 2025, while smart retail and edge AI are the next expansion areas.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Life after Meta: Manus regains independence, debuting Manus 2.0 and 'Cue' AI agent</title>
<pubDate>Fri, 2 Oct 2026 07:35:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD226/startup-meta.html</link>
<description>Following its return to independent operations, AI startup Manus unveiled two new products in late September 2026: Manus 2.0 and "Cue," a personal agentic AI application. The product rollouts mark the company's first major strategic moves after its planned acquisition by Meta fell through.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>China turns to 3D packaging to push AI performance beyond front-end scaling limits</title>
<pubDate>Fri, 2 Oct 2026 07:24:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL206/performance-3d-packaging-packaging-manufacturing-transistor.html</link>
<description>Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have historically sat at the summit of semiconductor manufacturing excellence, China has spent years building its own capabilities amid increasingly restricted access to some leading-edge technologies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Micron ramps up HBM capacity at Taiwan's four major sites</title>
<pubDate>Fri, 2 Oct 2026 06:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD224/micron-taiwan-capacity-hbm-2026.html</link>
<description>Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than in 2026. Donghui Lu, vice president of Micron's DRAM front-end manufacturing operations in Asia and chairman of Micron Taiwan, said AI is driving strong memory demand and the company is expanding across its four major manufacturing bases in Taoyuan, Taichung, Tongluo, and Tainan.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Nidec impairment loss far exceeds estimates as auditor withholds opinion</title>
<pubDate>Fri, 2 Oct 2026 06:34:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD246/nidec-electronic-components-loss-2025-2026.html</link>
<description>Japanese motor and electronic components maker Nidec said on September 30 that its long-delayed consolidated financial report for fiscal year 2025 (from April 2025 to March 2026) showed losses from accounting irregularities of JPY632.1 billion (US$3.99 billion), far above earlier estimates. Uncertainty over the company's turnaround also deepened after auditors declined to issue an opinion.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<title>LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals</title>
<pubDate>Fri, 2 Oct 2026 05:58:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL210/data-center-cooling-lg-electronics-capacity-infrastructure.html</link>
<description>South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing: cooling and power delivery. LG is adding chiller capacity in the US and South Korea, while LS Electric has secured a US$133.41 million contract to supply ultra-high-voltage transformers for a hyperscale AI data center project in North America.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Hiroca targets Tier 1 shift, global capacity overhaul</title>
<pubDate>Fri, 2 Oct 2026 05:53:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD223/hiroca-2026-tier-1-capacity-market.html</link>
<description>Auto components maker Hiroca posted a pre-tax loss of NT$146 million (US$4.57 million) in the first half of 2026, owing to weak demand in China's auto market and a number of one-time factors. However, during its earnings call on October 1, the company stressed that gross margin remained at a healthy 23&#38;ndash;24%, and that most losses will be absorbed by the end of 2026, leaving no drag on earnings in 2027.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>California tech exec arrested in US$300M Nvidia AI server smuggling case</title>
<pubDate>Fri, 2 Oct 2026 05:47:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD225/california-nvidia-chips-technology-2023.html</link>
<description>US federal prosecutors on October 1 arrested a 38-year-old California man accused of violating US export controls by smuggling computer servers containing US$300 million worth of Nvidia artificial intelligence chips to China.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>ASE stake, expansion open doors for Machvision</title>
<pubDate>Fri, 2 Oct 2026 05:33:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD242/machvision-ase-equipment-expansion-packaging.html</link>
<description>AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced Semiconductor Engineering's (ASE's) expansion is helping make semiconductors and substrates its fastest-growing product lines.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd242_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AMD bets on AI demand by buying World Labs</title>
<pubDate>Fri, 2 Oct 2026 04:34:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD243/amd-lisa-su-demand-nvidia-market.html</link>
<description>Under Lisa Su's 12-year tenure at Advanced Micro Devices (AMD), the company has gradually moved beyond its role as Intel's challenger in the CPU market. But in the accelerator market for training and running AI models, old rival Nvidia still holds the upper hand.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Tesla cuts AI5, AI6 memory specs to protect Optimus</title>
<pubDate>Fri, 2 Oct 2026 04:21:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD222/tesla-optimus-production-ceo-elon-musk.html</link>
<description>Facing a prolonged memory supply crunch, Tesla CEO Elon Musk has announced steep cuts to the memory specifications of the company's AI5 and AI6 chips to secure enough memory for Optimus mass production. Musk said the downgrades will not affect the humanoid robot's performance.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd222_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Huawei turns to LogicFolding to keep its flagship chip race alive</title>
<pubDate>Fri, 2 Oct 2026 04:20:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL209/huawei-kirin-flagship-foldable-smartphone-performance.html</link>
<description>Huawei Technologies has unveiled its Mate 90 smartphone series, expanding the use of self-developed Kirin processors and HarmonyOS 7 as it looks to sustain flagship performance under US restrictions on access to advanced chipmaking technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002vl209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Google's first Suncatcher satellite reaches orbit to test AI chips in space</title>
<pubDate>Fri, 2 Oct 2026 04:11:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL205/google-satellite-ai-chip-data-center-hardware.html</link>
<description>Google has moved its orbital AI data center ambitions from paper to hardware. A prototype satellite carrying the company's Tensor Processing Units (TPUs) reached orbit on October 1, 2026, and the data it returns over the coming weeks will help decide whether Project Suncatcher's vision of solar-powered compute clusters in low Earth orbit can survive contact with reality. The launch also puts the first real test data behind a concept that a Gartner analyst has said does not make economic sense.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002vl205_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Google]]></media:description>
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<item>
<title>China AI infrastructure spreads to mid-sized firms</title>
<pubDate>Fri, 2 Oct 2026 04:05:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD218/infrastructure-investment-2026-market-sk-hynix.html</link>
<description>China's AI investment is increasingly turning into server purchases and data center construction, and the wave that began with large tech companies is now spreading to mid-sized firms. South Korean media say the expanding China AI demand could open new markets for Samsung Electronics and SK Hynix.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<item>
<title>China financing chain linked to Nvidia Blackwell chips, 32 Asus servers exposed</title>
<pubDate>Fri, 2 Oct 2026 03:58:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD219/chips-nvidia-financing-asus-blackwell.html</link>
<description>A China-backed leasing firm appears to have helped Chinese companies buy restricted Nvidia Blackwell platform chips through financial leasing, according to a recent report. The transactions involved 32 Asus servers equipped with B300 chips, highlighting how US export controls face circumvention risks through finance and supply-chain channels.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<item>
<title>UNEEC shifts ODM focus to racks as L11 rises to 18%</title>
<pubDate>Fri, 2 Oct 2026 03:52:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD217/2026-odm-president-revenue-plant.html</link>
<description>Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth quarter, helping revenue recover toward the company's former monthly level of more than NT$1 billion (US$31.3 million). For January-August 2026, revenue reached NT$7.9 billion, with L11 system integration accounting for 18%.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD217/2026-odm-president-revenue-plant.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks</title>
<pubDate>Fri, 2 Oct 2026 03:47:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL208/tsmc-texas-expansion-manufacturing-arizona.html</link>
<description>TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production hub alongside Arizona as AI chip demand continues to strain advanced-node capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002vl208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<item>
<title>Taiwan government backs 7 semiconductor schools to upgrade equipment</title>
<pubDate>Fri, 2 Oct 2026 03:47:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD209/taiwan-semiconductors-talent-nstc-ntu.html</link>
<description>To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme jointly supported by the National Development Fund (NDF) and contracted companies is deemed insufficient to meet the needs of the semiconductor schools, so the National Science and Technology Council (NSTC) has now promised extra subsidies.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd209_files/2_r.jpg" type="image/jpeg" expression="full">
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<item>
<title>JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities</title>
<pubDate>Fri, 2 Oct 2026 03:44:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL207/jcet-packaging-high-end-manufacturing-silicon.html</link>
<description>JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support to help JCET scale its manufacturing footprint, promoting regional integration and supporting China's semiconductor ecosystem, according to &lt;em&gt;Sina Finance&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002vl207_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Sina Finance]]></media:description>
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<title>DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power &#38;mdash; packaging becomes the next divide</title>
<pubDate>Fri, 2 Oct 2026 03:21:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD215/intel-tsmc-samsung-packaging-accelerator.html</link>
<description>Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500&#38;ndash;4,000W for Rubin Ultra-class products expected in 2027, pushing supply current into the thousands of amperes. In conventional frontside power delivery, current must cross the full metal interconnect stack before reaching the transistors, while power and signal lines compete for routing resources. Intel Foundry estimates that raising a single compute package from 1kW to 5kW increases power delivery network I&#38;sup2;R losses from 89W to 2,222W, cutting the share of input power reaching the transistors from 66.0% to 41.8%.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD215/intel-tsmc-samsung-packaging-accelerator.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd215_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Micron expands global fabs, calls on Taiwanese suppliers to go overseas</title>
<pubDate>Fri, 2 Oct 2026 02:45:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD212/micron-demand-taiwan-fab-capacity.html</link>
<description>AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India. Donghui Lu, vice president of Micron's DRAM Asia frontend operations and head of Micron Taiwan, said the company's capex for construction over the next few years will be enormous, ranking it among the world's biggest construction investors, and stressed the keyword "together" as it works with Taiwanese equipment and materials suppliers to enter overseas markets.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD212/micron-demand-taiwan-fab-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Micron eyes NVHBM profits with TSMC custom HBM push</title>
<pubDate>Fri, 2 Oct 2026 02:42:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD216/micron-hbm-dram-bandwidth-design.html</link>
<description>Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can unlock added value even when manufacturing is outsourced. The move underscores how HBM competition is expanding beyond memory stacks into logic circuitry and system integration.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd216_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop</title>
<pubDate>Fri, 2 Oct 2026 02:42:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL200/broadcom-anthropic-financing-infrastructure-supplier.html</link>
<description>When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and customer begins to blur.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002VL200/broadcom-anthropic-financing-infrastructure-supplier.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002vl200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute</title>
<pubDate>Fri, 2 Oct 2026 02:29:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD214/cambricon-talent-incentives-technology-chairman.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang raising his compensation claim from CNY4.29 billion (US$640 million) to CNY27.83 billion. The Chinese AI chipmaker said on September 30 that the revised claim, more than five times the original amount, has turned the case into one of the most closely watched executive departure disputes in China's semiconductor sector.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD214/cambricon-talent-incentives-technology-chairman.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd214_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Cambricon]]></media:description>
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<title>JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists</title>
<pubDate>Fri, 2 Oct 2026 02:25:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL204/jsr-euv-production-subsidiary-materials.html?chid=10</link>
<description>JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment Zone in Cheongju, North Chungcheong Province. The facility is dedicated to the production of metal oxide resist (MOR), an advanced, metal-based photoresist for extreme ultraviolet (EUV) lithography, marking JSR's first global manufacturing hub for EUV MOR, according to &lt;em&gt;The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002vl204_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>Column: AI benchmarks remain lucrative business</title>
<pubDate>Fri, 2 Oct 2026 02:23:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD207/ai-business-funding-columns.html</link>
<description>New AI models arrive every few weeks, and the question of which is better often comes down to the leaderboard. Behind those rankings, evaluation can look like an academic exercise in setting rules, running tests, and assigning scores. However, public benchmarks&#38;mdash;and strong placement on them&#38;mdash;have long been tied to a lucrative business, with money flowing to different players in different eras.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD207/ai-business-funding-columns.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TSMC, NTU deepen R&#38;amp;D ties through nearly 50 projects a year</title>
<pubDate>Fri, 2 Oct 2026 02:22:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD213/ntu-tsmc-equipment-taiwan-silicon.html</link>
<description>National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening links among universities, industry, and international partners as Taiwan seeks to maintain its edge in an increasingly competitive AI-driven semiconductor sector.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD213/ntu-tsmc-equipment-taiwan-silicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd213_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds</title>
<pubDate>Fri, 2 Oct 2026 02:16:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD208/packaging-equipment-materials-display-chipmakers.html</link>
<description>The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED optical communications move closer to mass production, semiconductor equipment, materials, and optoelectronics suppliers are all moving to capture a share of the emerging market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261002PD208/packaging-equipment-materials-display-chipmakers.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261002pd208_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>FAW, GAC formalize partnership as Toyota's China joint ventures face possible overhaul</title>
<pubDate>Fri, 2 Oct 2026 02:06:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD206/toyota-gac-partnership-industrial-capacity.html</link>
<description>China's state-owned FAW and GAC's controlling shareholder, Guangzhou Automobile Industry Group, have signed a strategic cooperation framework that could reshape Toyota's long-standing two-joint-venture model in the country. The move reflects Beijing's push for industrial consolidation, while global automakers watch for wider implications for capacity, assets, and competition in China's fast-changing auto market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<title>Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse</title>
<pubDate>Fri, 2 Oct 2026 02:05:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD211/chairman-merger-it-data-2025.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over as chairman of Chinese server maker Dawning Information Industry (Sugon) in May 2026, meaning he now chairs both listed companies.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Samsung launches Tab S12, Buds On, SmartTag3</title>
<pubDate>Fri, 2 Oct 2026 02:03:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD204/samsung-galaxy-galaxy-tab-ios-performance.html</link>
<description>Samsung Electronics on October 1 unveiled its next-generation premium Galaxy Tab S12 series, its first clip-on wireless earbuds, the Galaxy Buds On, and the Galaxy SmartTag3, which expands iOS support. The three product lines target large-screen creation and multitasking, open-ear listening, and cross-platform item finding, underscoring Samsung's push to broaden the Galaxy ecosystem through software services and accessories.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle</title>
<pubDate>Fri, 2 Oct 2026 01:56:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD203/toshiba-rohm-2026-mitsubishi-electric-business.html</link>
<description>Japan's three major power semiconductor makers &#38;mdash; Rohm Semiconductor, Toshiba, and Mitsubishi Electric &#38;mdash; have failed to complete integration talks on the original schedule, as leadership disputes and a surge in AI demand slow the effort to boost the competitiveness of Japanese manufacturers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Mitsubishi Electric]]></media:description>
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<title>Chinese automakers' shift to the US may reshape supply chains and supplier margins</title>
<pubDate>Fri, 2 Oct 2026 01:56:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD205/hiroca-automakers-supplier-byd-production.html</link>
<description>Hiroca said two major Chinese automakers are likely to build factories in the US, a move that could redraw supply chains across North America, alter supplier demand patterns, and deepen pressure on parts makers already facing tighter pricing, faster product cycles, and weaker visibility in China's increasingly competitive auto market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd205_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>SK Hynix says Solidigm IPO remains undecided as AI storage demand drives investment</title>
<pubDate>Fri, 2 Oct 2026 01:51:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL203/sk-hynix-solidigm-investment-ipo-demand.html</link>
<description>SK Hynix has reiterated that no decision has been made on a potential US initial public offering (IPO) or other external financing for its Solidigm subsidiary, as the company weighs investment needs driven by growing demand for AI data center storage.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Wi-Fi 8 races ahead of the standard, putting networking chips on a faster 2027 growth track</title>
<pubDate>Fri, 2 Oct 2026 01:48:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD210/wi-fi-2027-chips-adoption-market.html</link>
<description>Wi-Fi 8 adoption is accelerating well ahead of the standard's expected finalization in the first half of 2028, with device brands and chipmakers already moving into early commercial deployment. The first Wi-Fi 8 routers have opened for pre-orders over the past month, while flagship smartphone platforms are beginning to integrate Wi-Fi 8 chips, reinforcing expectations of stronger downstream demand and a faster market ramp in 2027.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>Toshiba reportedly to double HDD production as AI drives storage demand</title>
<pubDate>Fri, 2 Oct 2026 01:41:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002VL202/toshiba-demand-production-hdd-data.html</link>
<description>Toshiba plans to double production capacity for hard disk drives (HDDs) used in AI data centers by fiscal 2027, investing about JPY60 billion (US$379.4 million) to expand its Philippine operations, according to &lt;em&gt;Nikkei Asia&lt;/em&gt;. The expansion will mark Toshiba's first major HDD investment in roughly five years and is intended to strengthen supplies as AI workloads drive demand for high-capacity storage.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Meta hires MongoDB CEO to lead AI enterprise platform</title>
<pubDate>Fri, 2 Oct 2026 01:37:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD202/meta-ceo-business-infrastructure-revenue.html</link>
<description>Meta has launched a new business unit, "Meta Enterprise Platform," to package its artificial intelligence (AI) models, agent tools, and infrastructure for enterprise customers, and has tapped MongoDB chief executive CJ Desai to lead it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Climax Technology sets up AI center, targets 3Q27 sampling</title>
<pubDate>Fri, 2 Oct 2026 01:32:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD201/communications-wireless-technology-development-security.html</link>
<description>Wireless communications company Climax Technology is accelerating its AI push by launching an "AI and Advanced Technology Center," with its first project a next-generation AI sensing platform slated for sampling in the third quarter of 2027 and small-volume shipments in the fourth quarter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>GMI Cloud secures NT$14.05 billion loan for AI factory</title>
<pubDate>Fri, 2 Oct 2026 01:30:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PD200/cloud-taiwan-loan-financing-infrastructure.html</link>
<description>CTBC Bank and GMI Cloud on October 1 announced the closing of an NT$14.05 billion (about US$445 million) syndicated credit facility to fund Taiwan's first AI factory. The deal is the first in Taiwan to fully back GPU financing with a commercial banking syndicate.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261002pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Southern Taiwan Science Park approves three new companies, pushing 2026 investment over NT$100 billion</title>
<pubDate>Fri, 2 Oct 2026 01:29:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD250/southern-taiwan-science-park-investment-2026-taiwan-nanya-technology.html</link>
<description>The Southern Taiwan Science Park (STSP) has approved the entry of three new companies&#38;mdash;Fangsco, Nanya Technology, and South Korea's Hansol Chemical&#38;mdash;pushing the park's cumulative investment to more than NT$100 billion (approx. US$3.13 billion) in 2026. The STSP Bureau said the park system has attracted 21 new companies this year, with total approved investment reaching NT$108.11 billion.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Swancor expands recycled materials, eyes recyclable carbon fiber for drone components</title>
<pubDate>Fri, 2 Oct 2026 01:20:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD249/swancor-materials-carbon-fiber-subsidiary-recycling.html</link>
<description>Swancor Holding subsidiary Swancor Regener is jointly exhibiting with Aeraxa Aerospace Technology at the Taichung AI and Smart Manufacturing Show in Taichung, Taiwan, showcasing products and technologies including recycled raw materials, drone structural components, and smart flight-control core modules.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<item>
<title>Onsemi revises Synaptics takeover deal after rival bid</title>
<pubDate>Fri, 2 Oct 2026 01:15:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261002PR200/onsemi-synaptics-financing-competition-technology.html</link>
<description>Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash transaction offers Synaptics shareholders value certainty, while regulators, customers, and investors now await decisions that may influence AI, sensing, and connected-compute markets worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung SDI's new LFP battery shows how AI is reshaping battery markets beyond EVs</title>
<pubDate>Thu, 1 Oct 2026 23:53:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL215/infrastructure-samsung-sdi-lfp-battery-market-technology.html</link>
<description>The aggressive rollout of large-scale infrastructure projects has brought increasingly visible changes across global economies and major technology supply chains, with much of that transformation now unfolding under the expanding influence of AI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Huawei leads global smartwatch market, but earbuds reveal different competitive picture</title>
<pubDate>Thu, 1 Oct 2026 23:52:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL214/huawei-earphone-smartwatch-tws-2026.html</link>
<description>Huawei has regained momentum across its consumer device business, but its position in the global wearables market is becoming increasingly uneven: the Chinese technology giant has taken the global smartwatch crown, while its wireless earbuds remain a more distant fourth behind Apple, Xiaomi, and Samsung Electronics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Nanya Technology wins approval for Southern 3D packaging plant</title>
<pubDate>Thu, 1 Oct 2026 23:51:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD247/nanya-technology-taiwan-investment-nstc-southern-taiwan-science-park.html</link>
<description>The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's plan to enter the Pingtung area of the Southern Taiwan Science Park and build advanced 3D semiconductor packaging and testing operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era</title>
<pubDate>Thu, 1 Oct 2026 23:51:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD248/asic-ip-design-marvell-silicon.html</link>
<description>Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note that the era of a single design partner handling an ASIC project end-to-end is largely over, replaced by a co-design model where vendors compete for functional silicon footprint within single-chip architectures.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>China car exports to Europe severely underestimated, warns UBS</title>
<pubDate>Thu, 1 Oct 2026 23:49:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD237/europe-exports-automakers-market-tesla.html</link>
<description>According to UBS, nearly twice as many China-made automobiles are being shipped to Europe as are being registered there, partly because trucking shortages delay deliveries from ports to dealers. The gap adds a new wrinkle in the battle for Europe between US and Chinese carmakers. Meanwhile, the vote on EU-wide approval of Tesla's supervised Full Self-Driving (FSD) system is unlikely before December 2026. Even as US and Chinese automakers face short-term challenges in their push in Europe, they continue to put ever-intensifying pressure on European automakers.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd237_files/2_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs</title>
<pubDate>Thu, 1 Oct 2026 23:48:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD239/amd-acquisition-software-2026.html</link>
<description>Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as a dedicated frontier research organization for large language models (LLMs) and spatial intelligence, with founder Fei-Fei Li joining AMD as executive vice president and chief scientist, reporting directly to Chair and CEO Lisa Su.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD239/amd-acquisition-software-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd239_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>A look at the startup winning Nvidia, Intel backing for AI scale-up optics</title>
<pubDate>Thu, 1 Oct 2026 23:48:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD236/startup-silicon-valley-technology-intel-nvidia.html</link>
<description>Silicon Valley data center optical interconnect startup CScale emerged from stealth on September 30 after raising US$145 million in a Series C funding round backed by Nvidia and Intel Capital. The latest financing brings the company's total funding to US$188 million.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD236/startup-silicon-valley-technology-intel-nvidia.html</guid>
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<item>
<title>NextDrive tops Japan HEMS market, speeds IPO push</title>
<pubDate>Thu, 1 Oct 2026 23:44:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD235/market-taiwan-ipo-energy-management-startup.html</link>
<description>Taiwan energy management startup NextDrive said that it has secured the No. 1 market share in Japan's home energy management system (HEMS) segment and has received key support from the Tokyo Stock Exchange for three straight years, adding momentum to its Japan IPO plans.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd235_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>Champ-ray targets Japan drone market with power modules</title>
<pubDate>Thu, 1 Oct 2026 23:43:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD234/market-testing-government-demand-performance.html</link>
<description>Champ-Ray Industrial is stepping up efforts to expand in Japan's drone market, using a recent sponsorship tie-in with the Oita Trinita professional football team in Japan's J2 League to open deeper exchanges with the Oita Prefectural Government and local drone operators. The DC motor and ceiling fan maker said it is mapping local drone industry needs and evaluating whether to submit samples for testing as it moves toward practical cooperation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd234_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Champ-Ray]]></media:description>
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<title>Machvision expands early to chase NT$10B revenue</title>
<pubDate>Thu, 1 Oct 2026 23:43:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD233/machvision-revenue-capacity-demand-production.html</link>
<description>Machvision is expanding capacity earlier than planned to meet rising demand from semiconductors, substrates, and optical modules, while tight computer numerical control (CNC) and machining supply chains have emerged as its biggest operating challenge. The inspection equipment maker is reshaping its Hsinchu and Kunshan facilities and expects the new footprint to support NT$10 billion (US$313.03 million) in revenue starting in 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261001PD233/machvision-revenue-capacity-demand-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261001pd233_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>Samsung's mobile unit faces more than KRW1 trillion loss as memory costs surge</title>
<pubDate>Thu, 1 Oct 2026 23:42:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD231/samsung-loss-mobile-2026-business.html</link>
<description>Samsung Electronics is expected to report another operating loss at its Mobile eXperience and network business in the third quarter of 2026, even as strong Galaxy Z foldable sales support handset demand. The preliminary earnings release is due in early October 2026, with the pressure coming from sharply higher memory prices and limited ability to raise device prices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261001pd231_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>GM begins U.S. battery cell trial runs with South Korean equipment</title>
<pubDate>Thu, 1 Oct 2026 23:41:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001PD229/equipment-general-motors-production-michigan-lithium.html</link>
<description>General Motors (GM) has started trial runs at a new battery cell line in Warren, Michigan, moving into the validation stage of its next-generation mass production plan. The line at the Battery Cell Development Center (BCDC) is being built with main process equipment sourced from South Korean suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Charts: Micron earns its best margins from PCs, phones, not AI</title>
<pubDate>Thu, 1 Oct 2026 09:22:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261001VL218/micron-revenue-market-data-data-center.html</link>
<description>Micron's best margins aren't coming from AI data centers. They come from PCs and smartphones, markets where Micron warns that unit sales could fall.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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