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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Lite-On unveils 800 VDC power and liquid cooling for AI data centers</title>
<pubDate>Thu, 15 Oct 2026 00:15:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD251/lite-on-data-liquid-cooling-efficiency-power-supply.html</link>
<description>Lite-On Technology is showcasing an 800 VDC power architecture, NVIDIA Vera Rubin-compatible power racks and integrated liquid-cooling systems at the 2026 Open Compute Project (OCP) Global Summit. The portfolio is designed to help data-center operators improve power efficiency, manage rising AI rack densities and integrate backup power with thermal management.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Commentary: AI power demand pushes Taiwan's energy industry toward integrated systems</title>
<pubDate>Thu, 15 Oct 2026 00:15:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL226/taiwan-2026-electricity-demand-solar.html</link>
<description>Energy Taiwan 2026 showcases an energy industry increasingly focused on integration, flexibility, and real-world deployment, as Taiwan balances its net-zero ambitions with rising electricity demand from artificial intelligence (AI), high-performance computing, and advanced manufacturing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>AI server tracker: Rail-kit growth turns uneven as cooling suppliers sustain expansion</title>
<pubDate>Thu, 15 Oct 2026 00:14:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL223/growth-revenue-taiwan-expansion-cooling.html</link>
<description>Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked companies grew both monthly and January&#38;ndash;September revenue from a year earlier, while four recorded declines from August. The results suggest that platform transitions and component availability continue to influence how AI infrastructure demand translates into revenue.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth</title>
<pubDate>Thu, 15 Oct 2026 00:13:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD256/applied-materials-capacity-equipment-cleanroom-growth.html</link>
<description>Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom construction and supply chain capacity. The company added more than 10 projects in each quarter, indicating that global fab development and future cleanroom availability were still expanding.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Applied Materials targets AI-driven semiconductor equipment growth through 2030</title>
<pubDate>Thu, 15 Oct 2026 00:13:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD255/applied-materials-2030-equipment-growth-manufacturing.html</link>
<description>Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030. The semiconductor equipment maker expects advanced logic, DRAM and advanced packaging to generate about 75% of wafer fab equipment (WFE) market growth from 2025 to 2030. By 2030, it is also targeting more than 2pp of additional WFE market share, along with non-GAAP gross and operating margins of approximately 54% and 40%, respectively.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Fujifilm to expand Arizona semiconductor materials output</title>
<pubDate>Thu, 15 Oct 2026 00:12:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PR201/fujifilm-materials-arizona-production-manufacturing.html</link>
<description>Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to strengthen supply for makers in the US and beyond, while supporting new packaging technologies and faster commercialization worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>HiSilicon expands DDI push across all display sizes</title>
<pubDate>Thu, 15 Oct 2026 00:12:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD254/hisilicon-ddi-display-huawei.html</link>
<description>&lt;p class="P1" data-path-to-node="4"&gt;Huawei subsidiary HiSilicon is actively expanding its display chip footprint, with its display driver IC (DDIC) development once again capturing market attention. Kun Luo, CEO of HiSilicon Display, recently disclosed key milestones for its DDR-free display solution. Developed through co-optimization across chip architectures, panel designs, and algorithms, the solution increased panel effective light-transmission area by nearly 25%, enabling two collaborative products to reach million-unit shipments a year ahead of schedule.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<title>Pegatron chair opposes Taipei airport relocation for AI park, proposes alternative</title>
<pubDate>Thu, 15 Oct 2026 00:12:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD253/pegatron-taipei-tung-tzu-hsien-industrial-development.html</link>
<description>Pegatron Chairman Tung Tzu-Hsien expressed opposition to a proposal to relocate Taipei Songshan Airport and redevelop the site into an AI industrial park, arguing that major capital cities should retain smaller airports to support regional air travel and business connectivity.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry</title>
<pubDate>Thu, 15 Oct 2026 00:11:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD250/samsung-galaxy-ddi-demand-umc-globalfoundries.html</link>
<description>Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that was ultimately turned down. As a result, Samsung scaled back its September 2026 component production volume by 10%. Amid persistent capacity tightness at mature process nodes, Samsung is now evaluating GlobalFoundries (GF) as a secondary foundry partner for its OLED smartphone DDIs, with potential adoption set for late 2027 at the earliest.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<title>SEMI sees glass substrates entering market by 2028</title>
<pubDate>Thu, 15 Oct 2026 00:11:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD242/semi-market-2028-expansion-adoption.html</link>
<description>The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two years earlier than she previously expected. Beth Keser, SEMI's vice president of technology coalitions, said package dimensions are growing too quickly for the industry to wait until around 2030, her earlier forecast.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan solar manufacturers turn to US market as domestic approvals stall, low-cost imports intensify</title>
<pubDate>Thu, 15 Oct 2026 00:10:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD237/solar-taiwan-market-low-cost-manufacturing.html</link>
<description>Taiwan's solar manufacturers are increasingly looking to the US market as slowing approvals for large-scale domestic solar projects, limited rooftop installation capacity, and competition from low-cost imports threaten the industry's long-term prospects.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<title>Topco eyes Idaho base as North American chip expansion accelerates</title>
<pubDate>Thu, 15 Oct 2026 00:10:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD249/topco-expansion-manufacturing-technology-micron.html</link>
<description>Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company already operates service bases in Phoenix, Arizona, and Dallas, Texas, and plans to strengthen its local technology, engineering, and supply chain capabilities to pursue memory and advanced-process opportunities.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>US solar import price floor faces four challenges as December deadline approaches</title>
<pubDate>Thu, 15 Oct 2026 00:08:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD243/solar-price-competitiveness-market-investment.html</link>
<description>The US is seeking to improve the competitiveness of domestic solar manufacturers and attract overseas investment through minimum import price requirements for solar products. However, supply chain sources cautioned that frequent changes in US policies and regulations could complicate implementation.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<title>Taiwan suppliers target OCP power, cooling, 1.6T integration</title>
<pubDate>Thu, 15 Oct 2026 00:07:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD238/cooling-taiwan-2026-liquid-cooling-infrastructure.html</link>
<description>The Open Compute Project (OCP) Global Summit 2026 recently took place in San Jose, California, as Taiwan suppliers joined the global AI infrastructure race with offerings spanning power systems, servers, connectors, networking, and optical communications. The event highlighted a shift from standalone server performance to integrated systems focused on 800VDC power, liquid cooling, and 1.6T networking.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Hiroca sees overseas revenue share top 50%, eyes strong pull-in momentum for 4Q26</title>
<pubDate>Thu, 15 Oct 2026 00:06:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD235/hiroca-revenue-2026-automakers-supplier.html</link>
<description>Automotive parts supplier Hiroca saw an increase in overseas contributions for the first three quarters of 2026, with international markets accounting for more than 50% of the company's revenue during the period, up from the roughly 45% in the same period of 2025. This offset weakness in the auto industry resulting from the traditional third-quarter off-peak season, as well as a volatile baseline for September. The company continues to expand operations in Dongguan, China, and its overseas bases in North America, Mexico, Japan, and South Korea, which will bring sustained mid- to long-term growth momentum. Moreover, the company expects performance in the second half of 2026 to outpace the first half, as automakers ramp up orders for the traditional peak season in the fourth quarter.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>Sluggish demand keeps smartphone panel prices under pressure</title>
<pubDate>Thu, 15 Oct 2026 00:06:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD228/demand-smartphone-panel-prices-panel-amoled.html</link>
<description>As the fourth quarter begins, smartphone panel demand remains sluggish, with purchasing momentum from end-market brands showing no clear signs of recovery. Market activity throughout October remains at a low ebb.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<title>Murata eyes earlier MLCC expansion as AI server demand surges</title>
<pubDate>Thu, 15 Oct 2026 00:05:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD224/murata-expansion-demand-mlcc-investment.html</link>
<description>Murata Manufacturing is considering additional investment and an earlier expansion of multilayer ceramic capacitor (MLCC) capacity as demand from AI servers accelerates. The company plans to finalize the investment amount, expansion sites, and schedule before releasing its midterm financial results in late October.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Dell CEO urges AI growth without sacrificing safety</title>
<pubDate>Thu, 15 Oct 2026 00:03:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD223/dell-investment-ceo-growth-demand.html</link>
<description>As AI investment continues to expand, concerns are mounting over whether capital spending can translate into real revenue and whether data center construction is becoming excessive. Dell Technologies CEO Michael Dell said AI development should not hit the brakes over safety disputes or bubble concerns, arguing that businesses and governments should build safeguards together while managing risks and maintaining technological competitiveness.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Yulon Nissan sees Taiwan auto market holding at 420,000 units through 2027 amid EV, import growth</title>
<pubDate>Thu, 15 Oct 2026 00:02:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD222/yulon-nissan-market-president-taiwan.html</link>
<description>Yulon Nissan Motor president Chen-hsiang Yao expects Taiwan's auto market to remain at approximately 420,000 vehicles in 2026, excluding heavy vehicles, supported by growing demand for luxury cars and new energy vehicles (NEVs). While market saturation and shifting consumer preferences pose challenges, a potential resolution of US tariff issues could provide additional momentum.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
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<title>Star Asia Vision targets digital out-of-home market with new products, Nichia partnership</title>
<pubDate>Thu, 15 Oct 2026 00:00:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD200/asia-nichia-display-market-partnership.html</link>
<description>Star Asia Vision (SAVC), a display and systems integrator under Taiwan-Asia Semiconductor, is focusing on growth in the digital out-of-home (DOOH) advertising market by expanding software-hardware integration and high-end customization, while deepening its strategic partnership with global LED materials leader Nichia. The company is optimistic about growth momentum across its three main product lines and expects project expansions in 2027 to drive operating growth.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Displays</category>
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<title>Energy Taiwan 2026 opens with record international participation</title>
<pubDate>Wed, 14 Oct 2026 15:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL222/taiwan-2026-electricity-government-demand.html</link>
<description>Energy Taiwan 2026 opened on October 14, bringing together more than 430 exhibitors across nearly 1,400 booths as the island seeks to strengthen energy resilience and accelerate decarbonization amid rising electricity demand from artificial intelligence (AI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>300mm fab equipment spending to hit US$227 billion by 2029, SEMI says</title>
<pubDate>Wed, 14 Oct 2026 09:18:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL216/300mm-equipment-semi-fab-2026.html</link>
<description>Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates and reach US$227 billion in 2029, SEMI said in its latest 300mm Fab Outlook, released October 13 at SEMICON West in San Francisco.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling</title>
<pubDate>Wed, 14 Oct 2026 09:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD246/avc-cooling-liquid-cooling-demand-technology.html</link>
<description>Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October 12&#38;ndash;15 in San Jose, US. The company is expanding liquid cooling beyond AI GPUs and CPUs to support rising AI computing demand and increasingly heat-intensive data-center racks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders</title>
<pubDate>Wed, 14 Oct 2026 09:11:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL215/boe-glass-substrate-production-ipad.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising concerns about production stability as the display maker seeks approval to supply panels for Apple's iPads.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Tata's flagship chip fab faces pressure from its own shareholders</title>
<pubDate>Wed, 14 Oct 2026 08:50:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL218/tata-group-90nm-fab-investment.html</link>
<description>Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses for quicker returns on capital-intensive bets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AI computing demand drives water management integration at Tianyi</title>
<pubDate>Wed, 14 Oct 2026 08:40:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD229/demand-water-management-capacity-expansion-equipment.html</link>
<description>Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key components of the green transformation of high-tech plants. Lealea Group's Tianyi Water &#38;amp; Energy Solutions is integrating water management, renewable power and AI-enabled smart maintenance. The company has also been selected for the AquaImpact Sustainable Water Mark at the 2026 Taiwan International Water Week (TIWW).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>ASE expands PowerSiP platform to improve AI data center power efficiency</title>
<pubDate>Wed, 14 Oct 2026 08:38:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PR202/ase-efficiency-data-center-3d-2026.html</link>
<description>ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems. The move could matter globally as demand for AI infrastructure rises, since more efficient power delivery may help lower energy losses, support denser computing, and ease the strain on rapidly expanding digital infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Wiwynn unveils CPO compute system with GUC and Ayar Labs</title>
<pubDate>Wed, 14 Oct 2026 08:38:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD247/cpo-guc-wiwynn-laser.html</link>
<description>Wiwynn Corporation, CPO solutions provider Ayar Labs and Global Unichip Corp. (GUC) will stage the first live demonstration of an integrated compute system with real-time telemetry monitoring at the 2026 OCP Global Summit, marking a new milestone in their strategic partnership.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Tsang Yow's semiconductor revenue share reaches 12%</title>
<pubDate>Wed, 14 Oct 2026 08:26:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD240/tsang-yow-revenue-equipment-2026-demand.html</link>
<description>Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year as demand from the Americas aftermarket temporarily slowed. Supported by its semiconductor business, consolidated revenue reached NT$269 million in the third quarter of 2026, up 7.5% year-over-year, while revenue for the first nine months rose 4.04% year-over-year to NT$824 million.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs</title>
<pubDate>Wed, 14 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD230/cerebras-data-capacity-openai-nvidia.html</link>
<description>Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman said at TechCrunch Disrupt 2026.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026</title>
<pubDate>Wed, 14 Oct 2026 07:58:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD200/kingboard-ccl-pcb-price-increase-2026.html</link>
<description>Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg (PP) made with style 2116 or thinner fiberglass fabrics.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Ubiqconn satellite revenue jumps 175% as 3Q26 operations recover</title>
<pubDate>Wed, 14 Oct 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD239/revenue-ubiqconn-2026-market-shipments.html</link>
<description>Ubiqconn Technology reported September 2026 consolidated revenue of NT$142 million (US$4.4 million), up 32.4% month-on-month and 6.7% year-on-year. Third-quarter revenue rose 9.6% sequentially to NT$432 million but fell 10.5% year on year. Revenue for the first three quarters totaled NT$1.373 billion, down 15.7% year on year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>China's smartphone slump: Can Apple's new lineup light a spark?</title>
<pubDate>Wed, 14 Oct 2026 07:54:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL214/apple-iphone-china-smartphone-market-sales.html</link>
<description>China's smartphone market faces dual pressures as weakening consumer spending and rising component costs continue to weigh on the handset sector. According to third-quarter data from market research firm IDC, nationwide smartphone shipments dropped 15.4% year-over-year to 57.9 million units, underscoring broader macroeconomic headwinds across the country.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Largan chairman casts doubt on Micro LED links for AI data centers</title>
<pubDate>Wed, 14 Oct 2026 07:39:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD227/largan-precision-microled-transmission-data-center-communications.html</link>
<description>Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission efficiency. Industry sources interviewed by DIGITIMES counter that while individual Micro LEDs transmit data more slowly than lasers, using hundreds of parallel channels could reduce overall system power consumption by simplifying the transmission architecture.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Communications</category>
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<title>SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027</title>
<pubDate>Wed, 14 Oct 2026 07:25:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL213/equipment-hbm4-sk-hynix-2027-investment.html</link>
<description>Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising questions about the chipmaker's expansion plans as rising conventional DRAM prices create competing opportunities for capital spending.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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