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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips</title>
<pubDate>Sun, 20 Sep 2026 00:28:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL220/equipment-taiwan-growth-testing-revenue.html</link>
<description>&lt;p class="P1" data-start="3020" data-end="3241"&gt;Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers they serve, and most of that growth traces back to one step in the production flow: test.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>OpenAI, Microsoft filings intensify copyright fight over AI training</title>
<pubDate>Sun, 20 Sep 2026 00:28:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD230/openai-microsoft-copyright-training-new-york-times.html</link>
<description>&lt;p class="P1" data-start="2998" data-end="3366"&gt;New court filings from &lt;em data-start="3021" data-end="3041"&gt;The New York Times&lt;/em&gt; and other news organizations have put OpenAI and Microsoft's internal comments on AI and journalism at the center of a widening copyright dispute in the US. The documents, cited by &lt;em data-start="3223" data-end="3240"&gt;Financial Times&lt;/em&gt; and Reuters, are being used to challenge the companies' fair use defense in a case that has stretched for nearly three years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>BYD plans four Europe factories as EU tariff pressure rises</title>
<pubDate>Sun, 20 Sep 2026 00:27:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD229/byd-europe-manufacturing-vehicle-spain.html</link>
<description>&lt;p class="P1" data-start="1355" data-end="1670"&gt;BYD is planning four factories in Europe over the long term as it works to meet local manufacturing rules and expand its customer base. The Chinese electric vehicle maker wants three vehicle assembly plants and one EV battery plant, according to company adviser and former Fiat Chrysler executive Alfredo Altavilla.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>AI capacity crunch drives up consumer tech costs, deepening China's deflation</title>
<pubDate>Sun, 20 Sep 2026 00:27:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD225/demand-ai-server-capacity-electronics-smartphone.html</link>
<description>Surging AI server demand is reshaping consumer electronics. Memory costs have risen sharply this year, prompting Huawei, Oppo, Xiaomi and Apple to raise prices on some smartphones. A senior Chinese technology industry source said the increase reflects memory suppliers prioritising capacity and investment for AI products rather than stronger handset demand, which is squeezing smartphone memory supply.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign</title>
<pubDate>Sun, 20 Sep 2026 00:27:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD216/wiwynn-testing-manufacturing-plant-cooling.html</link>
<description>&lt;p class="P1" data-start="2814" data-end="3165"&gt;Wiwynn is introducing collaborative robots (cobots) at its El Paso, Texas, facility and third plant in Mexico, alongside a central heat exchange system designed to support liquid-cooled server rack testing. The upgrades reflect the company's efforts to modernize manufacturing as AI servers become more complex and demand for liquid cooling increases.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership</title>
<pubDate>Sun, 20 Sep 2026 00:27:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD205/vehicle-commercial-foxconn-partnership-industrial.html</link>
<description>&lt;p class="P1" data-start="1624" data-end="2007"&gt;German commercial vehicle company Quantron and China's Hongjing Drive have formally agreed to establish a joint venture, Quantron China, to develop a China-Europe technology and industrial platform for next-generation zero-emission commercial vehicles. Foxconn will serve as the industrial manufacturing partner for truck and bus platforms, supporting their international deployment.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Quantron]]></media:description>
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<title>Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease</title>
<pubDate>Sun, 20 Sep 2026 00:27:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260920PD200/pc-acer-jason-chen-component-chairman.html</link>
<description>PC component shortages are easing, Acer chairman and CEO Jason Chen said, with memory tight only at the high end of DDR5 and CPUs no longer in short supply. Suppliers across the bill of materials are still pushing through price increases, he said, some of them hard to justify. He expects PC prices to keep climbing before reversing in the second half of 2027.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Semiconductors</category>
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<title>Amazon Leo clears Taiwan's NCC review, with commercial launch pointed at 2027</title>
<pubDate>Fri, 18 Sep 2026 23:21:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260919PD200/amazon-taiwan-2027-ncc-commercial.html</link>
<description>FarEasTone Telecommunications has cleared four of the six regulatory steps required to bring Amazon Leo to Taiwan, but commercial service will not start until 2027 at the earliest, in line with Amazon's own timetable.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Aerospace</category>
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<title>Power grids can't keep pace with AI data center boom in EU, US</title>
<pubDate>Fri, 18 Sep 2026 23:20:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD206/aidc-eu-cost-supply-chain-electricity.html</link>
<description>According to supply chain players, most AI data center cost models used by analysts in both China and the West only count electricity consumption when estimating the cost of AI data centers or tokens, but do not take into account the cost of power generation, transmission, or grid infrastructure. As a result, actual AI data center build-out costs vary greatly by country and region, due to the vast differences in power mix, grid capacity, and energy policies.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit AFP]]></media:description>
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<title>Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27</title>
<pubDate>Fri, 18 Sep 2026 23:19:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD217/materials-niching-packaging-revenue-testing.html</link>
<description>&lt;p class="P1" data-start="2240" data-end="2807"&gt;Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial officer Chih Fang Chiu stated that full-year 2026 revenue is projected to grow by 20% to 30%. Beyond the consolidation benefits of acquiring Ming Chun Yuan Micro Precise Technology in July 2026, growth momentum remains robust across heat spreaders, solid-state drive (SSD) enclosures, and IC substrates, alongside ongoing expansion in thermally conductive adhesives. The company aims to double total revenue within three years.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>MediaTek, Vivo bring 30B MoE models on-device in next AI phone race</title>
<pubDate>Fri, 18 Sep 2026 23:18:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD224/mediatek-vivo-dimensity-smartphone-flagship.html</link>
<description>&lt;p class="P1" data-start="3791" data-end="4162"&gt;MediaTek's new Dimensity 9600 Pro puts agentic AI at the center of its flagship smartphone strategy, supporting on-device mixture-of-experts (MoE) models with up to 30 billion parameters. Vivo, among the first Chinese handset makers to adopt the platform, has followed with an expanded AI software stack spanning BlueLM, BlueLM Copilot, and a system-level BlueLM Harness.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Interview: Advanced packaging shifts toward system-level co-design for AI</title>
<pubDate>Fri, 18 Sep 2026 23:18:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD215/packaging-taiwan-2026-technology-materials.html</link>
<description>&lt;p class="P1" data-start="4965" data-end="5219"&gt;Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Dr Shin-Puu Jeng, president of IMAPS Taiwan. Credit: DIGITIMES]]></media:description>
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<title>Thailand plans to swap EV subsidies for import taxes to defend its production base</title>
<pubDate>Fri, 18 Sep 2026 23:18:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL204/subsidies-production-policy-asia-vehicle.html</link>
<description>&lt;p class="P1" data-start="2192" data-end="2600"&gt;Thailand is preparing to abandon the subsidy-led policy that made it Southeast Asia's fastest-growing electric vehicle market, replacing it with a tax structure built to penalize carmakers that import rather than build. Finance Minister Ekniti Nitithanprapas said the excise tax on fully imported EVs could rise to around 30%, from 10% today &#38;mdash; the first time the government has attached a number to the levy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Beyond Volkswagen, XPeng seeks to turn automotive R&#38;amp;D into a global tech enterprise</title>
<pubDate>Fri, 18 Sep 2026 23:17:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL219/technology-automotive-xpeng-business-volkswagen.html</link>
<description>It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development of proprietary technologies in the automotive sector has strengthened their differentiation within a highly competitive landscape.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight</title>
<pubDate>Fri, 18 Sep 2026 23:17:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL221/taiwan-tsmc-revenue-chipmakers-demand.html</link>
<description>&lt;p class="P1" data-start="3489" data-end="3624"&gt;Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does not.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Ams OSRAM takes an automotive-qualified force sensor into robotic hands</title>
<pubDate>Fri, 18 Sep 2026 23:16:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL222/sensor-production-automotive.html</link>
<description>Ams OSRAM is pushing its optical force sensor line into robotic hands on the argument that incumbent piezoelectric solutions cannot hold a reading, and it is using automotive qualification as the entry credential.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>CXL adds memory capacity, but HBM retains its bandwidth edge</title>
<pubDate>Fri, 18 Sep 2026 23:15:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL224/cxl-hbm-capacity-bandwidth-data.html</link>
<description>&lt;p class="P1" data-start="3139" data-end="3432"&gt;Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory. But engineers from OpenAI and Intel see limits to using the interconnect as a substitute for high-bandwidth memory (HBM) where bandwidth remains critical.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung Electronics' CXL-based Memory Expander 2.0. Credit: Samsung Electronics]]></media:description>
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<title>Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders</title>
<pubDate>Fri, 18 Sep 2026 23:15:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260917PD235/expansion-ccl-ventec-kunshan-laminate.html</link>
<description>&lt;p class="P1" data-start="2173" data-end="2703"&gt;Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11 million) to lease and convert an idle factory in Kunshan, Jiangsu Province, China, as it moves to capture spillover demand for artificial intelligence (AI) and high-density interconnect (HDI) materials. The expansion budget is to be invested in three phases. Depending on future growth demand, the company will proceed with further capacity expansion investments in the second and third phases.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Compal takes Compal Broadband Networks private to fold networking into its edge AI stack</title>
<pubDate>Fri, 18 Sep 2026 23:15:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260919PD201/compal-compal-broadband-business-wireless-manufacturing.html</link>
<description>Compal Electronics is buying out the shares of its listed networking arm, Compal Broadband Networks (CBN), in a cash deal that will end CBN's public listing and give Compal full control of a router and gateway business it wants to pair with its edge AI hardware.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Solidigm weighs first US NAND fab, explores upstate New York</title>
<pubDate>Fri, 18 Sep 2026 08:41:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL223/solidigm-nand-sk-hynix-manufacturing-fab.html</link>
<description>&lt;p class="P1" data-start="88" data-end="264"&gt;Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate New York emerging as a leading candidate.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Solidigm]]></media:description>
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<title>Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management</title>
<pubDate>Fri, 18 Sep 2026 08:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD222/ai-chip-management-miit-it-materials.html</link>
<description>China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials, including gallium oxide (Ga&#38;#8322;O&#38;#8323;) and synthetic diamond, in their draft development plan for the electronic information manufacturing sector.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Winbond cements server NOR lead with Infineon deal</title>
<pubDate>Fri, 18 Sep 2026 08:08:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD228/winbond-infineon-automotive-market-capacity.html</link>
<description>Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it to the top of the automotive NOR market while strengthening its position in AI data center and server NOR supply.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Corning to raise display glass substrate prices 15% from 4Q26</title>
<pubDate>Fri, 18 Sep 2026 07:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD226/corning-glass-substrate-display-panel-price.html</link>
<description>Corning, the US glass substrate supplier, will raise prices for its yen-denominated display glass substrate products by 15% or more worldwide starting in the fourth quarter of 2026, according to industry sources. The company confirmed the move amid persistent cost pressure across the electronics supply chain.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20260918pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>CXMT eyes NAND amid global shortage, taking aim at YMTC</title>
<pubDate>Fri, 18 Sep 2026 07:10:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL218/cxmt-nand-dram-ymtc-nand-flash.html</link>
<description>&lt;p class="P1" data-start="2580" data-end="2871"&gt;ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM supplier closer to the core market of domestic rival Yangtze Memory Technologies (YMTC) as enterprise storage becomes a bigger part of the memory growth story.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Doosan commits KRW968 billion to CCL expansion as demand strains capacity</title>
<pubDate>Fri, 18 Sep 2026 06:43:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL217/doosan-ccl-demand-capacity-expansion.html</link>
<description>Doosan is investing KRW968.4 billion (approx. US$701 million) to expand high-end copper-clad laminate (CCL) production in South Korea and China, its largest-ever investment in the business, as growing demand for AI accelerators, network switches and optical modules pushes key production lines beyond full utilization.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Doosan]]></media:description>
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<title>China's AI data center token costs hinge on access to advanced GPUs</title>
<pubDate>Fri, 18 Sep 2026 06:31:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD219/cost-data-center-chips-data-high-end.html</link>
<description>China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent &lt;em&gt;Caijing&lt;/em&gt; analysis. The report said restricted access to high-end GPUs has become the most critical cost burden in China's AI era.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test</title>
<pubDate>Fri, 18 Sep 2026 05:56:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL210/hbm-nand-dram-cxmt-samsung.html</link>
<description>&lt;p class="P1" data-start="4906" data-end="5288"&gt;AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>CoreWeave launches US$3 billion bond sale amid growing revenue, debt</title>
<pubDate>Fri, 18 Sep 2026 05:44:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL216/revenue-capacity-infrastructure-bloomberg-2030.html</link>
<description>&lt;p class="P1" data-start="4568" data-end="4926"&gt;CoreWeave launched a debt sale worth US$3 billion in convertible bonds, which would allow buyers to turn their bonds into shares. The neocloud, which has sharply ramped up its infrastructure spending over the past year, has secured a growing customer base but faces concerns over financial sustainability amid intense competition and fears of an AI slowdown.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>High-end GPUs may be slowing China's AI compute expansion</title>
<pubDate>Fri, 18 Sep 2026 04:29:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD211/expansion-high-end-2025-data-center-2026.html</link>
<description>China's wide gap in token costs stems largely from domestic companies' difficulty in accessing Nvidia high-end GPUs, forcing them to squeeze more value from each token to recoup costs. But supply-chain sources say the scale of China and US AI compute investment may actually be roughly comparable, despite US hyperscalers' far larger 2025 capex.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market</title>
<pubDate>Fri, 18 Sep 2026 04:27:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD210/market-lges-samsung-sdi-capacity-production.html</link>
<description>As energy storage system (ESS) battery orders continue to accumulate at South Korean manufacturers, expectations are growing that market conditions could improve further. The outlook follows the US government's declaration of a national emergency over electric grid security, signaling a move to restrict Chinese-made batteries, while China has begun curbing new battery capacity expansion.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: LGES]]></media:description>
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<title>Chip equipment makers face waits of up to 40 months for critical parts</title>
<pubDate>Fri, 18 Sep 2026 03:56:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL212/equipment-capacity-demand-supply-chain-chipmakers.html</link>
<description>The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate fab investment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ASML]]></media:description>
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<title>Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage</title>
<pubDate>Fri, 18 Sep 2026 03:45:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL214/samsung-startup-development-samsung-foundry-dutch.html</link>
<description>&lt;p class="P1" data-start="3225" data-end="3475"&gt;Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip stage at Samsung Foundry, adding a manufacturing dimension to Samsung's recent investment in the two-year-old company.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>King Charles tests AI's safety consensus as Nvidia keeps its foot on the accelerator</title>
<pubDate>Fri, 18 Sep 2026 03:41:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918VL213/nvidia-google-openai-development-deepmind.html</link>
<description>&lt;p class="P1" data-start="2953" data-end="3197"&gt;King Charles III has stepped into the intensifying debate over artificial intelligence, urging executives from Nvidia, Google DeepMind, OpenAI, and Anthropic to keep AI under human control and ensure the technology serves people and the planet.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[King Charles III (L) walks with Nvidia CEO Jensen Huang at an AI leaders' conference at Dumfries House in Scotland on September 17, 2026. Credit: AFP]]></media:description>
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<title>CPO raises PCB downgrade concerns but switches stick with M8 CCL</title>
<pubDate>Fri, 18 Sep 2026 03:07:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD208/pcb-cpo-ccl-materials-copper.html</link>
<description>&lt;p class="P1" data-start="2431" data-end="2712"&gt;As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that wider adoption of co-packaged optics (CPO) could reduce high-speed transmission requirements for AI server motherboard printed circuit boards (PCBs).</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>iPhone 18 Pro sellouts across Taiwan as foldable Duo looms</title>
<pubDate>Fri, 18 Sep 2026 03:05:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260918PD203/iphone-apple-taiwan-demand-e-commerce.html</link>
<description>Apple's iPhone 18 Pro series will go on sale on September 18, and Taiwan's major e-commerce platforms and telecom carriers have released preorder results ahead of launch. Data show that demand for premium iPhone models remains strong, with most channels selling out quickly and reservation volumes rising one to two times from the same period in 2025.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Communications</category>
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