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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Wed, 1 Jul 2026 00:00:03 GMT</lastBuildDate>
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<title>Walmart signs first nuclear power agreement to secure 176 MW of zero-emission supply</title>
<pubDate>Tue, 30 Jun 2026 10:06:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD240/nuclear-electricity-plant-infrastructure.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:360;111-470"&gt;Walmart and Constellation Energy announced on June 23 that the retailer signed its first nuclear power purchase agreement, securing about 176 MW of zero-emission electricity from the Dresden Clean Energy Center in Illinois. The deal comprises two 15-year contracts that include 30 MW of new generation capacity and are scheduled to begin in 2029 and 2030.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Asia Neo Tech and Brooks sign 15-year FOUP deal</title>
<pubDate>Tue, 30 Jun 2026 09:56:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD237/asia-technology-equipment-market-licensing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:271;97-367"&gt;Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Ability Opto-Electronics targets CPO growth with V-groove and MT lines</title>
<pubDate>Tue, 30 Jun 2026 09:25:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD224/ability-enterprise-cpo-optics-ability-opto-electronics-technology-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:503;121-623"&gt;Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a relatively limited impact, since the company mainly supplies high-end business notebook cameras.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>TSMC fast-tracks CoPoS&#38;mdash;whole supply chain under gag order</title>
<pubDate>Tue, 30 Jun 2026 09:18:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD239/tsmc-supply-chain-cowos-packaging-equipment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:288;105-392"&gt;TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>Semiconductors</category>
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<title>TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers</title>
<pubDate>Tue, 30 Jun 2026 09:09:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD235/equipment-tsmc-fuel-demand-cowos.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:396;120-515"&gt;As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Lenovo warns elevated memory prices could become the new norm beyond 2030</title>
<pubDate>Tue, 30 Jun 2026 09:04:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD230/lenovo-price-2030-inflation-component.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:255;125-379"&gt;Memory price inflation has emerged as one of the biggest challenges facing the consumer electronics industry, with Apple, Microsoft, and Nintendo all having signaled product price increases as widening supply-demand gaps continue to drive up memory costs.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Fulltech Fiber Glass to lift cloth prices as much as 30% from July</title>
<pubDate>Tue, 30 Jun 2026 08:56:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD234/fulltech-demand-transportation-2026-materials.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:389;125-513"&gt;Fulltech Fiber Glass is raising prices for its glass fiber cloth lines amid higher raw material, energy, transportation, and manufacturing costs that are squeezing margins. The move underscores broader pressure across global electronics supply chains, where demand for advanced materials tied to AI servers, satellites, and high-speed networking continues to reshape pricing and capacity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Fulltech chairman Yuan-Pin Chang. Credit: DIGITIMES]]></media:description>
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<title>Local backlash led to more than 300 US data center bans and moratoriums since 2023</title>
<pubDate>Tue, 30 Jun 2026 08:53:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD204/data-center-2023-2026-development-incentives.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:376;158-533"&gt;Local opposition to AI data center development surged in 2026, driving more than 300 temporary and permanent bans or moratoriums across the US since 2023, according to &lt;em&gt;The Information&lt;/em&gt;. The wave of restrictions was concentrated in the Midwest and South, with the vast majority enacted in 2026 as communities paused projects to reassess policy and negotiate benefits.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Huawei OpenHarmony targets China's humanoid robot race with 1.3 billion-device ecosystem</title>
<pubDate>Tue, 30 Jun 2026 08:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL212/huawei-openharmony-robot-hardware-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:206;122-327"&gt;Huawei's OpenHarmony is becoming a key variable in China's consumer humanoid robot race, pushing the sector beyond hardware demos toward connected use across smartphones, smart homes, and education devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
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<title>Samsung Electro-Mechanics targets AI server growth with MLCC talks, substrate push</title>
<pubDate>Tue, 30 Jun 2026 08:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL208/semco-substrate-ai-server-mlcc-capacitor.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:304;120-423"&gt;Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for AI servers, while also expanding substrate production capacity and securing a separate silicon capacitor contract, according to Korean media reports and company statements.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung Electro-Mechanics]]></media:description>
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<title>TBI Motion taps humanoid robot demand with small-batch shipments</title>
<pubDate>Tue, 30 Jun 2026 07:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD213/demand-shipments-robot-shipping-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:328;116-443"&gt;TBI Motion has begun shipping parts for humanoid robots as the global race to commercialize the technology gathers pace. The move highlights how suppliers, from Asia to Europe, are positioning for new industrial demand while also seeking growth in automotive and medical markets amid intense price pressure and competition.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes</title>
<pubDate>Tue, 30 Jun 2026 07:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD227/packaging-investment-taiwan-cooling-cpo.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:456;176-631"&gt;As Taiwan becomes the core of the global AI hardware supply chain, Qnity &#38;mdash; the century-old company spun off from US chemicals giant DuPont and separately listed &#38;mdash; is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president Dennis Chen said in an interview with &lt;em&gt;DIGITIMES&lt;/em&gt; that future investment will center closely on three main battlegrounds: advanced processes, advanced packaging, and thermal management.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>China unveils national AI agent standards to accelerate interoperable AI ecosystem</title>
<pubDate>Tue, 30 Jun 2026 07:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL210/development-industrial.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:316;114-429"&gt;China has released seven national standards for AI agent interconnection, establishing a unified framework for how AI agents identify themselves, discover one another, collaborate, and invoke external tools as artificial intelligence advances from content generation toward autonomous decision-making and execution.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Ubtech]]></media:description>
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<item>
<title>Corning's East Coast edge: IP, manufacturing depth, and AI-era return of optical fiber</title>
<pubDate>Tue, 30 Jun 2026 07:02:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD220/colley-hwang-corning-manufacturing-patent.html</link>
<description>Protecting patents around the world is a core value for any R&#38;amp;D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly 400 patent applications and close to 1,000 international applications. Its active patent portfolio now totals around 11,400 patents worldwide.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Taiwan's Chief Telecom says raid over alleged AI server smuggling has no financial impact</title>
<pubDate>Tue, 30 Jun 2026 06:55:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD233/chief-telecom-data-center-equipment-macau-high-end.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:340;162-501"&gt;Chief Telecom Inc. said a June 29 search by prosecutors and investigators over an alleged illegal smuggling case involving high-end AI servers bound for Hong Kong, Macau, and China has not materially affected its finances or operations. The case highlights growing global scrutiny of AI hardware supply chains and data center controls.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
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<title>Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab</title>
<pubDate>Tue, 30 Jun 2026 06:40:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL213/samsung-fab-packaging-capacity-region.html</link>
<description>Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>HKC IPO gives China's display sector a third heavyweight</title>
<pubDate>Tue, 30 Jun 2026 06:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL202/hkc-display-ipo-shenzhen-equipment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:267;88-354"&gt;HKC Corporation has debuted on the Shenzhen Stock Exchange main board, cementing a three-way leadership structure in China's display panel industry alongside BOE and TCL CSOT while securing fresh capital to expand OLED, oxide semiconductor, and Mini LED technologies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Memory suppliers lock down buyers as contract prices continue surging in 2H26</title>
<pubDate>Tue, 30 Jun 2026 05:59:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD218/dram-electronics-2026-price-flash.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:646;165-810"&gt;Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products to virtually all memory categories. Industry sources expect pricing increases to vary by product segment, but the long-term upward trend remains intact, with overall memory prices potentially rising another 60&#38;ndash;75% in the second half of the year.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Apple faces iPhone 18 Pro price pressure as memory crunch tests AI upgrade strategy</title>
<pubDate>Tue, 30 Jun 2026 05:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD225/apple-iphone-price-dram-hardware.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:216;124-339"&gt;Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten to raise hardware expenses just as the company pushes deeper into on-device AI.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: AI memory boom rewrites chip pricing power, leaving Apple searching for leverage with CXMT</title>
<pubDate>Tue, 30 Jun 2026 04:49:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD215/apple-cxmt-micron-business-price.html</link>
<description>&lt;p class="P1" data-start="159" data-end="467"&gt;For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down memory and component costs before turning hardware upgrades into high-margin revenue. The AI-driven boom in HBM and DRAM is now challenging that strategy.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>IC design firms brace for uncertain peak season as prices rise</title>
<pubDate>Tue, 30 Jun 2026 04:35:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD211/ic-design-demand-price-2026.html</link>
<description>The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are rising, demand is hard to gauge, and companies are preparing for customer stockpiling that could keep chip orders elevated into the third quarter.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>New GPU and ASIC platforms to drive stronger server shipments in 2H26</title>
<pubDate>Tue, 30 Jun 2026 04:24:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD226/gpu-asic-server-shipments-infrastructure-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:252;122-373"&gt;The AI infrastructure order boom is spilling into the second half of 2026, and server supply-chain players are turning increasingly upbeat about demand as Nvidia Vera Rubin, AMD Helios, AWS Trainium 3, and Google TPU all move into mass production.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Networking demand stays resilient in 3Q26, but component shortages and price hikes cloud outlook</title>
<pubDate>Tue, 30 Jun 2026 04:20:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD219/network-equipment-component-demand-outlook-price-2026.html</link>
<description>The networking industry is entering its traditional third-quarter peak season, with demand remaining robust in 2026 as AI infrastructure upgrades and the adoption of Wi-Fi 7 continue to drive orders. However, tightening supplies and rising prices for memory, passive components, and other key parts are beginning to disrupt customers' procurement schedules, emerging as one of the industry's most significant variables for the second half of the year.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<title>Optiemus, Quectel launch India manufacturing tie-up for automotive and connectivity modules</title>
<pubDate>Tue, 30 Jun 2026 04:11:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PR201/quectel-optiemus-partnership-automotive-telecom-manufacturing-india.html</link>
<description>Optiemus Electronics and Quectel have launched a manufacturing partnership in India to localize advanced wireless modules for vehicles, telecom networks, and industrial systems. The tie-up could improve supply chain resilience, accelerate product launches, and expand access to next-generation connectivity across global markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide</title>
<pubDate>Tue, 30 Jun 2026 04:07:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD222/tsmc-demand-2026-capacity-packaging.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:367;104-470"&gt;AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Samsung revives 1.4nm foundry push as 2029 timeline takes shape</title>
<pubDate>Tue, 30 Jun 2026 03:55:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL211/samsung-1.4nm-equipment-development-2nm.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:174;105-278"&gt;Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, &lt;em&gt;The Bell&lt;/em&gt; reported, citing industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung Electronics¡¦ NRD-K semiconductor R&#38;D complex in Giheung, South Korea. Credit: Samsung Electronics]]></media:description>
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<title>SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity</title>
<pubDate>Tue, 30 Jun 2026 03:54:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL201/sk-hynix-hbm-wafer-fab-capacity.html</link>
<description>SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 &#38;#8203;billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix Cheongju Campus P&#38;T7 (Artist¡¦s rendering). Credit: SK Hynix]]></media:description>
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<title>AI super cycle lifts semiconductors, but China chip group warns of a distorted boom</title>
<pubDate>Tue, 30 Jun 2026 03:42:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL204/semiconductor-industry-capacity-demand-growth-hbm.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:293;117-409"&gt;AI has pushed the global semiconductor industry into a new "super cycle," but the AI boom is also creating distorted demand, tighter capacity, soaring memory prices, and overheated capital spending, according to China Semiconductor Industry Association executive secretary-general Wang Junjie.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China's third-largest pure-play foundry's HK filing shows growth, but also rising risks</title>
<pubDate>Tue, 30 Jun 2026 03:40:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL205/nexchip-growth-policy-2025-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:336;148-483"&gt;Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Notebook supply chains brace for weaker 2026 peak season</title>
<pubDate>Tue, 30 Jun 2026 03:39:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD208/2026-shipments-price-component-pc.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:329;107-435"&gt;Notebook supply chains are preparing for a softer-than-usual 2026 peak season, with shipments expected to ease from the third quarter of 2026 as early replacement buying fades. For global readers, the shift points to higher device costs, slower demand later in the year, and broader pressure across PC and component markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>South Korea looks to Taiwan as model for semiconductor decentralization</title>
<pubDate>Tue, 30 Jun 2026 03:17:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL207/samsung-sk-group-south-korea-semiconductors-investment-taiwan.html</link>
<description>South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Rocket Lab challenges SpaceX with US$8 billion Iridium deal to build fully integrated space company</title>
<pubDate>Tue, 30 Jun 2026 03:01:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630VL203/rocket-launch-satellite-communications-acquisition.html</link>
<description>&lt;p class="P1" data-start="107" data-end="641"&gt;Rocket Lab is taking a major step toward competing more directly with SpaceX, announcing an agreement to acquire satellite communications provider Iridium Communications in an approximately US$8 billion cash-and-stock transaction. The deal transforms Rocket Lab from a launch and spacecraft manufacturer into a fully vertically integrated space company with its own global satellite communications network, a strategy widely viewed by the market as mirroring SpaceX's integrated business model.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: Rocket Lab]]></media:description>
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<item>
<title>DRAM price surge tests South Korean memory makers' HBM4 push</title>
<pubDate>Tue, 30 Jun 2026 02:49:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD217/dram-hbm4-sk-hynix-production-price.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:218;110-327"&gt;Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Daniel Chiang]]></media:description>
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<item>
<title>Analysis: Will 3Q26 be peak season? Cloud AI stands alone; demand signals become distorted</title>
<pubDate>Tue, 30 Jun 2026 02:45:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD214/cloud-ai-demand-electronics-price-2026.html</link>
<description>As the electronics industry enters the second half of 2026, it is approaching what has traditionally been the peak season for demand. However, macroeconomic and geopolitical factors have disrupted normal business cycles across many applications, making seasonal patterns far less predictable. According to industry sources, this season is particularly uncertain. Rising component prices and supply shortages have made downstream procurement behavior and end-market consumption patterns more difficult to predict than in the past. Demand signals that the industry once relied upon have become distorted.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
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<title>Taiwan optics sector heads into peak season as Apple demand, camera orders rise</title>
<pubDate>Tue, 30 Jun 2026 02:35:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260630PD212/taiwan-optics-demand-apple-camera.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:320;134-453"&gt;Taiwan's optics industry is entering its traditional peak period, with global smartphone demand, Apple's new-device cycle, and rising camera shipments expected to support revenue into late 2026 and beyond for leading suppliers. Firms also see AI-related shifts and new business lines adding to longer-term momentum.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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