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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 10 Sep 2026 06:00:03 GMT</lastBuildDate>
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<title>Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs</title>
<pubDate>Thu, 10 Sep 2026 05:58:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD205/asic-growth-ip-revenue-smart-glasses-2027.html</link>
<description>Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles and smart glasses. The company said edge AI demand is rising even as AI data centers absorb semiconductor capacity and supply-chain resources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth</title>
<pubDate>Thu, 10 Sep 2026 05:57:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL214/tsmc-revenue-growth-demand-2026.html</link>
<description>&lt;p class="P1" data-start="1561" data-end="1929"&gt;TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated revenue reached NT$514.81 billion (US$16.3 billion) in August, up 10.1% month-over-month and 53.3% year-over-year. Revenue for the first eight months of 2026 totaled NT$3.387 trillion, representing a 39.3% year-over-year increase.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs</title>
<pubDate>Thu, 10 Sep 2026 05:54:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD222/gpu-revenue-ai-chip-2026-2025.html</link>
<description>&lt;p class="P1" data-start="2189" data-end="2559"&gt;Chinese AI chipmaker Enflame will list on the STAR Market of the Shanghai Stock Exchange on September 11, 2026, becoming the last of China's "four little GPU dragons" to go public. Enflame is grouped with Moore Threads, MetaX, and Biren Technology as China's "four little GPU dragons," and with Enflame's listing, all four companies will have entered the capital market.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it</title>
<pubDate>Thu, 10 Sep 2026 04:28:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL212/xiaomi-investigation-market-probe-business.html</link>
<description>&lt;p class="P1" data-start="2369" data-end="2762"&gt;A recommended corporate-fraud investigation would reach Xiaomi at the weakest point its India business has known. India's Serious Fraud Investigation Office (SFIO) has proposed a detailed probe into alleged irregularities in the company's business model and its compliance with foreign investment law, according to a government memorandum drafted in May and reported by Reuters on September 9.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China sets clear limits on payment terms to auto suppliers</title>
<pubDate>Thu, 10 Sep 2026 04:28:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD210/china-automakers-government-price-miit.html</link>
<description>China's government is formally imposing rules on long payment terms in the auto supply chain, with the Ministry of Industry and Information Technology (MIIT) and the State Administration for Market Regulation (SAMR) recently issuing a joint notice to standardize automakers' payment deadlines, acceptance procedures, and payment methods to their suppliers.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices</title>
<pubDate>Thu, 10 Sep 2026 04:19:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL206/deepseek-api-ipo-shanghai-startup.html</link>
<description>Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices for its Flash models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Spirox TGV inspection capable of scanning entire substrate in 20 minutes</title>
<pubDate>Thu, 10 Sep 2026 04:18:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD236/spirox-tgv-inspection-packaging-demand.html</link>
<description>As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates are steadily shifting from technology validation to mass production. Spirox chairman Peter Chin said the company has entered advanced packaging inspection with nonlinear optical technology, with TGV aperture sizes now at 4&#38;mu;m and 3&#38;mu;m still under validation, while materials, foundry, memory and packaging companies in Taiwan, Japan, the US and South Korea have already sent samples for testing.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Spirox CEO Paul Yang (L) and chairman Peter Chin. Credit: DIGITIMES]]></media:description>
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<item>
<title>Europe's BEV running costs now 33% below ICE</title>
<pubDate>Thu, 10 Sep 2026 04:18:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD241/bev-ice-europe-cost-germany.html</link>
<description>Daily operating and maintenance costs for battery electric vehicles (BEVs) in Europe are now 33% lower per kilometer than those for comparable internal combustion engine (ICE) cars, according to a new report from the International Council on Clean Transportation (ICCT). For European car owners, driving an EV has become a financial fact.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<title>Hermes Testing ships membrane probe cards, targets SiPh and CPO</title>
<pubDate>Thu, 10 Sep 2026 04:17:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD240/revenue-probe-cpo-transmission-growth.html</link>
<description>Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment engineering services and customized products. The wafer-testing solutions provider also said its in-house Membrane Probe Card has begun contributing revenue as it moves into customer applications, while the company expands into next-gen test applications for high-speed data transmission, silicon photonics and co-packaged optics (CPO).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens</title>
<pubDate>Thu, 10 Sep 2026 04:17:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL211/germany-sk-group-manufacturing-wafer-production-capacity.html</link>
<description>&lt;p class="P1" data-start="400" data-end="651"&gt;Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing relationship to 130nm technology as supply conditions tighten across parts of the 8-inch foundry market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Elmos Semiconductor and SK keyfoundry signed a long-term wafer supply and 130nm technology agreement in Frankfurt am Main. Credit: Elmos]]></media:description>
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<title>AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand</title>
<pubDate>Thu, 10 Sep 2026 04:17:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260908PD216/equipment-ipc-demand-packaging-market.html</link>
<description>AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the global semiconductor equipment market and opening higher-value opportunities for Taiwan's industrial PC (IPC) suppliers.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Samsung SDS partners with OpenAI and Anthropic in AI push</title>
<pubDate>Thu, 10 Sep 2026 04:17:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD246/samsung-openai-anthropic-2026-robot.html</link>
<description>Samsung SDS used its REAL Summit 2026 to unveil a "multi-dimensional AI full stack" strategy, expanding its AI business from enterprise IT and cloud adoption into enterprise AI agents, AI security and physical AI. The company is deepening cooperation with OpenAI and Anthropic as it pushes from AI selection and systems integration into day-to-day operations.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Powerlogic revenue rises for 3rd straight month on niche demand</title>
<pubDate>Thu, 10 Sep 2026 04:17:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD248/powerlogic-revenue-niche-demand-2026.html</link>
<description>Fan maker Powerlogic posted its third straight month of revenue growth in August 2026, with consolidated revenue reaching NT$82 million (US$2.6 million), up 2.47% month-over-month, as niche applications helped support operations in the second half of the year. Cumulative revenue for the first eight months came to NT$707 million, down 41.75% year-over-year.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion</title>
<pubDate>Thu, 10 Sep 2026 04:16:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD250/wistron-revenue-wiwynn-2026-expansion.html</link>
<description>Wistron and Wiwynn both posted record-high monthly revenue in August 2026 as shipments of artificial intelligence (AI) servers continue to expand. Both companies remain highly confident in the continued momentum of AI demand.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>DeepSeek's next AI test is not the model; it's everything around it</title>
<pubDate>Thu, 10 Sep 2026 04:16:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL211/deepseek-api-infrastructure-development.html</link>
<description>&lt;p class="P1" data-start="107" data-end="372"&gt;DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to a shift from pure model development toward the systems needed to support larger-scale AI services, agents, and computing workloads.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Phison pushes in-house AI solutions as August revenue surges to record high</title>
<pubDate>Thu, 10 Sep 2026 04:16:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD251/phison-revenue-demand-taiwan-growth.html</link>
<description>Phison Electronics continues to benefit from the rapid growth in demand for artificial intelligence (AI) infrastructure, AI inference, and enterprise storage, with its Phison AI Data Platform gradually being deployed across industries in Taiwan, said company CEO Khein-seng Pua.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>DB HiTek completes reliability qualification for 8-inch SiC MOSFET process</title>
<pubDate>Thu, 10 Sep 2026 04:16:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PR208/sic-mosfet-silicon-development-market-manufacturing.html</link>
<description>DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation power semiconductors used in electric vehicles, renewable energy systems, and industrial equipment. The company is targeting volume production in 2027 as SiC manufacturers shift toward larger wafers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Firmus, OpenAI strike compute deal for Malaysia AI factories</title>
<pubDate>Thu, 10 Sep 2026 04:16:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PR201/openai-capacity-partnership-infrastructure-australia.html</link>
<description>Firmus and OpenAI have announced a multi-year strategic partnership that will add dedicated AI compute capacity in Malaysia, underscoring how Asia-Pacific is becoming central to global AI infrastructure. The deal could help expand access to advanced computing, lower deployment costs, and accelerate the rollout of AI services across the region and beyond.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Firmus]]></media:description>
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<title>Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze</title>
<pubDate>Thu, 10 Sep 2026 04:16:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260908VL210/data-bandwidth-lenovo.html</link>
<description>AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth within tight power, thermal, and cost limits.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead</title>
<pubDate>Thu, 10 Sep 2026 04:15:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL217/naver-france-nvidia-ceo-infrastructure.html</link>
<description>Naver is trying to export the AI factory model it is building at home, telling French companies and institutions this week that it wants to combine France's energy base with its own AI stack to build data center capacity for European firms and startups.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung SDS broadens AI push from software to factory robots</title>
<pubDate>Thu, 10 Sep 2026 04:15:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL219/samsung-robotics-robot-automation-openai.html</link>
<description>Samsung SDS is using its enterprise AI strategy to move beyond office automation and into factory robotics, betting that its systems-integration experience can turn fragmented robot fleets into centrally managed production tools, according to &lt;em&gt;CHOSUNBIZ&lt;/em&gt; and &lt;em&gt;BusinessKorea&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>JD Cloud plans 100,000-GPU cluster built on Moore Threads chips</title>
<pubDate>Thu, 10 Sep 2026 04:15:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL218/cloud-moore-threads-chips-training-revenue.html</link>
<description>JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic GPUs have gone into a 100,000-card core computing cluster at a leading Chinese AI cloud provider. The plan was announced at JD's 2026 Global Technology Explorers Conference in Beijing, according to &lt;em&gt;Yicai&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SK Hynix says 3D DRAM will borrow from logic foundry playbook</title>
<pubDate>Thu, 10 Sep 2026 04:15:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL220/sk-hynix-3d-dram-design-packaging.html</link>
<description>SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where memory, computing, and advanced packaging are developed as one integrated system, affecting global chip supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape</title>
<pubDate>Thu, 10 Sep 2026 04:15:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL221/2027-sk-telecom.html</link>
<description>South Korea's science ministry has budgeted KRW250 billion (US$184.6 million) for 2027 to run "AI for all," a state-funded program that aims to give every citizen free access to chatbots and AI agents built at least 50% on domestic AI models&#38;mdash;a spending commitment that turns Seoul's sovereign-AI ambitions into a dedicated budget commitment and arrives alongside a far larger KRW4.7 trillion initiative to build a homegrown frontier model.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China gets an early shot at the next SiC power-chip cycle</title>
<pubDate>Thu, 10 Sep 2026 04:15:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL222/sic-shanghai-manufacturing-technology-mosfet.html</link>
<description>&lt;p class="P1" data-start="137" data-end="515"&gt;Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the world's first SiC superjunction MOSFET product. Project leader Hao Yue said it is among the first globally to complete product validation, positioning the company for emerging demand from AI server power supplies and high-voltage direct-current data center architectures.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Alkaidsemi silicon carbide superjunction MOSFET. Credit: Alkaidsemi]]></media:description>
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<title>Beyond the stage, can XPeng's EV playbook scale humanoid robots?</title>
<pubDate>Thu, 10 Sep 2026 04:14:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL227/robotics-manufacturing-xpeng-production-robot.html</link>
<description>As humanoid robotics glides &#38;mdash; in its own distinctive glamour &#38;mdash; toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where humanoid capabilities might fit into the social world has begun to take on a much clearer definition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on</title>
<pubDate>Thu, 10 Sep 2026 04:14:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL229/semco-tgv-glass-substrate-manufacturing-production-tsmc.html</link>
<description>&lt;p class="P1" data-start="446" data-end="749"&gt;Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung Electro-Mechanics facility in South Korea. Credit: Samsung Electro-Mechanics]]></media:description>
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<item>
<title>Samsung trims foundry partner network as remaining DSPs gain momentum</title>
<pubDate>Thu, 10 Sep 2026 04:14:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL230/samsung-design-revenue-production-2025.html</link>
<description>Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure fabless customers, advance design projects, and help convert them into foundry orders.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs</title>
<pubDate>Thu, 10 Sep 2026 04:14:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL231/lges.html</link>
<description>The appeal of lithium-manganese-rich (LMR) batteries has long rested on a difficult proposition: delivering relatively high energy density without carrying the same material costs associated with cobalt-heavy battery chemistries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AI-assisted illustration by DIGITIMES, not an official LGES image.]]></media:description>
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<title>CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap</title>
<pubDate>Thu, 10 Sep 2026 04:14:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL232/cxmt-tsv-hbm3-dram-yield-rate.html</link>
<description>&lt;p class="P1" data-start="92" data-end="358"&gt;China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks</title>
<pubDate>Thu, 10 Sep 2026 04:13:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL234/ar-display-expo-manufacturing-nanoimprint.html</link>
<description>At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR glasses runs through the display industry rather than the semiconductor background, where most AR lens-making equipment comes from.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Apple's iPhone Duo raises the stakes for foldable smartphone cameras</title>
<pubDate>Thu, 10 Sep 2026 04:13:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD215/apple-iphone-foldable-android-camera.html</link>
<description>&lt;p class="P1" data-start="1880" data-end="2237"&gt;Apple's foldable iPhone Duo could reshape the global smartphone market, pushing Android brands to move faster on foldable handsets and camera innovation. Suppliers said the launch may revive competition in a niche still dominated by Android, while underscoring the technical limits, pricing pressure, and profit opportunities facing module makers worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Communications</category>
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<item>
<title>China's 6G race starts before the first 6G phone as satellite links move into the network core</title>
<pubDate>Thu, 10 Sep 2026 04:12:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909VL235/6g-communications-mobile-wireless.html</link>
<description>&lt;p class="P1" data-start="4031" data-end="4189"&gt;China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections into future smartphones.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26</title>
<pubDate>Thu, 10 Sep 2026 04:00:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD224/wiwynn-ai-server-shipments-asic-revenue.html</link>
<description>Wiwynn Corporation said AI server shipments will overtake general-purpose server shipments in the third quarter of 2026, with the two expected to account for roughly half each, while the company also expects a stronger fourth quarter as ASIC momentum builds.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans</title>
<pubDate>Thu, 10 Sep 2026 03:57:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD216/loongson-cpu-gpu-development-technology.html</link>
<description>Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU and GPU technologies. More than CNY1.4 billion is allocated to CPU-related projects, making it the largest investment area in the fundraising plan.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Loongson]]></media:description>
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<item>
<title>Apple just put a US$700 premium on hinges &#38;mdash; seven supply chain takeaways</title>
<pubDate>Thu, 10 Sep 2026 03:51:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL210/apple-iphone-hinge-taiwan.html</link>
<description>These are the seven supply chain takeaways from Apple's announcements on September 10, covering new iPhone models, new AirPods, chips, and upgrades to its ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<item>
<title>Apple's John Ternus puts iPhone at AI center stage</title>
<pubDate>Thu, 10 Sep 2026 03:38:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD223/apple-iphone-john-ternus-ceo-tim-cook.html</link>
<description>&lt;p class="P1" data-start="4086" data-end="4396"&gt;Apple CEO John Ternus used his first major event as chief executive to signal where the company is headed after officially succeeding Tim Cook in September 2026. Speaking at the annual showcase, he framed the iPhone as the personal computing hub for the AI era and suggested Apple is not rushing to replace it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<item>
<title>Apple's A20 Pro pushes mobile chips into the 2nm era &#38;mdash; but AI may be the bigger disruption</title>
<pubDate>Thu, 10 Sep 2026 03:31:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL209/apple-smartphone-2nm-chips-mobile.html</link>
<description>&lt;p class="P1" data-start="4650" data-end="4873"&gt;For years, smartphone processors have competed through a familiar formula: faster CPUs, stronger graphics, and increasingly smaller process nodes. Apple's newly unveiled A20 Pro suggests that formula is beginning to change.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910vl209_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
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<item>
<title>Apple's 100-part iPhone Duo hinge puts spotlight on Chinese suppliers</title>
<pubDate>Thu, 10 Sep 2026 02:56:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL207/apple-foldable-iphone-hinge-display.html</link>
<description>Apple's first foldable iPhone is putting Chinese precision-component makers under closer scrutiny as its complex hinge creates new opportunities in structural parts, metal injection molding and other high-value components.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
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<item>
<title>Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers</title>
<pubDate>Thu, 10 Sep 2026 02:46:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD212/ic-testing-interface-ai-chip-high-end-capacity-demand.html</link>
<description>AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from major testing interface vendors. The squeeze is also pushing Taiwan foundry leader TSMC and related IC design customers to assess diversified supply channels for early-stage R&#38;amp;D validation.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGTIMES]]></media:description>
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<item>
<title>Samsung India reportedly cuts jobs as memory costs squeeze electronics unit</title>
<pubDate>Thu, 10 Sep 2026 02:31:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL205/samsung-india-electronics-smartphone-sales-demand.html</link>
<description>Samsung Electronics' Indian unit has reportedly started cutting jobs in its TV and home-appliance businesses as higher memory-chip prices, currency weakness, and soft consumer demand squeeze margins across its local electronics operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Qualcomm's AWS deal raises stakes for MediaTek and Alchip</title>
<pubDate>Thu, 10 Sep 2026 02:21:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD209/aws-qualcomm-asic-ic-design-alchip-mediatek.html</link>
<description>Qualcomm this week announced a multi-generation collaboration with Amazon to develop custom silicon for AI inference and high-performance optical connectivity for Amazon Web Services (AWS).</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910pd209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Analysis: China chases EUV as chipmakers move to High-NA</title>
<pubDate>Thu, 10 Sep 2026 02:16:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD211/euv-high-na-chipmakers-manufacturing-production.html</link>
<description>The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production in 2028, and TSMC plans to introduce the technology into advanced-node high-volume manufacturing in 2030.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910pd211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: ASML]]></media:description>
</media:content></item>
<item>
<title>Sumitomo, Sakana AI reportedly team up to expand Japan-made AI</title>
<pubDate>Thu, 10 Sep 2026 02:00:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL204/sumitomo-sakana-ai-startup-alliance-technology.html</link>
<description>Sumitomo and its IT subsidiary SCSK are partnering with Japanese AI startup Sakana AI to expand the use of domestically developed AI among Japanese companies, leveraging Sumitomo's broad customer base to reach businesses of various sizes.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910vl204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Europe and US IDM grid-to-core push challenges Taiwan power modules</title>
<pubDate>Thu, 10 Sep 2026 01:54:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD207/taiwan-power-supply-demand-2026.html</link>
<description>Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency power devices. The shift is pushing suppliers toward integrated control, protection, and module solutions, while Taiwan manufacturers weigh how quickly they can adapt.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260910PD207/taiwan-power-supply-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260910pd207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Taiwan hardware strength meets open-source gap</title>
<pubDate>Thu, 10 Sep 2026 01:24:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PD206/taiwan-open-source-software-hardware-supply-chain.html</link>
<description>Taiwan's hardware strength gives it a firm place in the global technology supply chain, but industry leaders say its next opportunity lies in open source. Jonathan Bryce, executive director of cloud and infrastructure at the Linux Foundation, said the most effective way for Taiwan to gain greater influence is for local developers to contribute code and help guide projects.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260910PD206/taiwan-open-source-software-hardware-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260910pd206_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>STMicro sees AI sales accelerating as factory transfers hold key to margin recovery</title>
<pubDate>Thu, 10 Sep 2026 01:17:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL203/sales-stmicroelectronics-2027-infrastructure-revenue.html</link>
<description>STMicroelectronics expects rapidly expanding AI infrastructure sales and stronger automotive demand to support growth into 2027, but its largest gross-margin gains will depend on customer approvals allowing older factories to close, CFO Lorenzo Grandi said at Citi's Global TMT Conference on September 9.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910vl203_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Google plans EUR13 billion Finland investment to expand data centers, clean energy</title>
<pubDate>Thu, 10 Sep 2026 01:08:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PR201/google-finland-investment-data-center-expansion.html</link>
<description>Google said it will invest EUR13 billion (US$15.11 billion) in Finland over the next two years, underscoring how data center growth, clean power, and local skills investment are becoming increasingly intertwined for global technology users, businesses, and energy markets. The company said the expansion will support its core services and deepen its long-running presence in the country.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910pr201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Google]]></media:description>
</media:content></item>
<item>
<title>Analog Devices agrees to buy Alif Semiconductor to expand edge AI push</title>
<pubDate>Thu, 10 Sep 2026 01:04:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910PR200/analog-devices-industrial-data-center-worldwide-on-device-ai.html</link>
<description>Analog Devices has agreed to acquire Alif Semiconductor in a US$1.35 billion all-cash deal, a move that could broaden access to faster, more energy-efficient edge AI systems for industrial, defense, health, and consumer applications worldwide. The deal underscores a shift toward local, real-time computing beyond data centers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260910pr200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Himax launches eDP TDDI for smart cockpit displays</title>
<pubDate>Thu, 10 Sep 2026 00:00:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD239/tddi-himax-automotive-display-smart-cockpit.html</link>
<description>Himax Technologies this week announced an industry-leading automotive touch and display driver integration chip (TDDI) that supports a high-speed eDP interface, combining eDP, touch sensing and display driving on a single chip to meet new-generation smart cockpit demand for large, high-resolution, high-quality displays and real-time touch.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Yageo's August revenue hits record on AI demand</title>
<pubDate>Wed, 9 Sep 2026 23:59:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD238/yageo-revenue-demand-market-growth.html</link>
<description>Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said strong AI-related demand and resilient demand in Asia helped offset holiday effects in Europe and the US.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>How AI and global expansion are reshaping semiconductor recruitment to production, tech integration</title>
<pubDate>Wed, 9 Sep 2026 23:59:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD235/ai-capacity-expansion-demand-expansion-2026-production.html</link>
<description>Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released by 104 Job Bank, monthly job openings in Taiwan's semiconductor sector reached 47,000 in 2026, a year-over-year surge exceeding 20%.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Arm launches second-generation CSS, targets China's AI smartphone market with C2 CPU</title>
<pubDate>Wed, 9 Sep 2026 23:58:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260908PD235/arm-cpu-market-mobile-gpu.html</link>
<description>Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI computing capabilities across the CPU, GPU, and system interconnect while strengthening its presence in the Chinese market.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>Global PMX sees semiconductor parts shipments strengthen</title>
<pubDate>Wed, 9 Sep 2026 23:56:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD227/global-pmx-shipments-revenue-automotive-growth.html</link>
<description>Global PMX, a major maker of automotive power and safety components, said August consolidated revenue rose to NT$802 million (approx. US$25.4 million), up 33.50% year on year and extending the company's growth momentum from July. The company said order visibility for semiconductor products now stretches through 2027, as AI server liquid-cooling parts and high-end semiconductor components ramp up.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>AI server ODMs face widening component mismatches, with shortages reaching 15&#38;ndash;20%</title>
<pubDate>Wed, 9 Sep 2026 23:55:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD226/nvidia-rubin-component-revenue-ai-server.html</link>
<description>Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in August. Industry sources said demand remains robust for both the H-series and GB-series products.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>SuperAlloy advances semiconductor aluminum certification</title>
<pubDate>Wed, 9 Sep 2026 23:55:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD225/superalloy-aluminum-automotive-certification-revenue.html</link>
<description>SuperAlloy Industrial, a global automotive wheel supplier, reported August consolidated revenue of NT$550 million (approx. US$17.4 million), up 2.46% from a year earlier, and NT$5.052 billion for January&#38;ndash;August 2026, up 6.34% year on year. The company said the stronger sales base, along with progress in semiconductor material qualification, is setting up a second growth curve beyond its core auto business.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources</title>
<pubDate>Wed, 9 Sep 2026 23:54:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD222/photonics-inp-silicon-transmission-communications.html</link>
<description>As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications, attracting investment from major industry players.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<title>Taiwan IC design firms seek government subsidies for advanced chip development</title>
<pubDate>Wed, 9 Sep 2026 23:52:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD218/taiwan-ic-design-development-government-subsidies.html</link>
<description>Taiwan's Ministry of Economic Affairs (MOEA) and National Science and Technology Council (NSTC) will hold a joint ministerial meeting in September to discuss subsidy applications submitted by domestic IC design firms for advanced chip development. If the applications are approved, the local IC design sector will receive a boost in its bid to raise the share of IC design industry output value generated by advanced-process chips from 45% to 47%.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<title>Flex's EPC Power deal points to a broader shift in AI infrastructure</title>
<pubDate>Wed, 9 Sep 2026 23:51:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD213/flex-epc-infrastructure-acquisition-competition.html</link>
<description>Flex has recently agreed to buy US power conversion specialist EPC Power for US$4.4 billion, a move that highlights how competition in AI infrastructure is extending beyond servers and racks into grid-side power, cooling, and energy management. The acquisition is expected to deepen Flex's role as rising compute density pushes data centers toward higher-voltage architectures.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Confidence in Germany's auto repair sector slips, even as demand hits record high</title>
<pubDate>Wed, 9 Sep 2026 23:50:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD217/germany-demand-vehicle-automotive.html</link>
<description>The auto repair industry in Germany is facing a contradiction: confidence among industry players has been falling, even though the sector as a whole is seeing repair demand rising alongside average vehicle age, while workshop utilization is at a five-year high.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market</title>
<pubDate>Wed, 9 Sep 2026 23:50:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD214/semes-equipment-hiwin-technologies-market-samsung.html</link>
<description>Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment, signaling a potential opening in South Korea's advanced packaging supply chain. The deal complements Hiwin's push to broaden its co-packaged optics (CPO) business and move into higher-value semiconductor equipment components.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Three open source foundations share one stage in Shanghai</title>
<pubDate>Wed, 9 Sep 2026 23:49:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD210/open-source-ai-applications-shanghai-technology-infrastructure.html</link>
<description>As AI applications move from the lab to large-scale deployment, China's open source ecosystem is increasingly focused on how to connect once-siloed technology layers to improve computing costs and operating efficiency. The KubeCon + CloudNativeCon + OpenInfra Summit + PyTorch Conference China 2026 opened in Shanghai on September 6, marking the first joint appearance of CNCF, OpenInfra, and PyTorch have converged at a single event, with discussions centered on AI infrastructure, AI agent trends, and the Model Context Protocol (MCP).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan virtual asset alliance builds next-gen financial infrastructure</title>
<pubDate>Wed, 9 Sep 2026 23:49:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD209/taiwan-finance-alliance-infrastructure-technology.html</link>
<description>As global digital finance accelerates, stablecoins, real-world asset tokenization, and digital assets are becoming core to the next generation of financial services. With Taiwan's Virtual Asset Services Act passing its third reading in the Legislative Yuan on June 30, 2026, and being promulgated on July 22, Taiwan's digital finance sector has entered a transition toward compliance implementation, opening market opportunities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan courts international talent as special experts qualify for permanent residency in 1 year</title>
<pubDate>Wed, 9 Sep 2026 23:48:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD208/taiwan-talent-2026-government-university.html?chid=10</link>
<description>Taiwan is stepping up efforts to attract and retain foreign talent as its population declines, with the government easing permanent residency rules and offering faster pathways for specialized professionals. The Executive Yuan said its latest policy report aims to improve the immigration environment and ease labor and talent shortages across industries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<title>Taiwan startup ecosystem index jumps as angel fund expands</title>
<pubDate>Wed, 9 Sep 2026 23:47:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD207/startup-taiwan-2026-investment-national-development-council.html?chid=10</link>
<description>StartupBlink, a globally recognized startup ecosystem research platform, has released its "2026 Global Startup Ecosystem Index," ranking Taiwan 20th out of 120 countries and recording the highest annual growth rate among the global top 20. The ranking comes as Taiwan has doubled the National Development Fund's Business Angel Investment Program from NT$5 billion to NT$10 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<title>Song Chuan rides 800V HVDC upgrade wave, posts record 2Q26 sales</title>
<pubDate>Wed, 9 Sep 2026 23:47:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD204/2026-revenue-ev-charging-ai-server-growth.html</link>
<description>Song Chuan Precision said on September 8 that its second-quarter 2026 revenue and gross margin hit record highs, as demand for AI server power supplies, energy storage, and EV charging all rose at the same time. The company also benefited from a richer product mix tilted toward higher-margin new-energy products, lifting second-quarter consolidated revenue and gross margin to record levels and swinging net profit back into the black from a year earlier.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Acer's PC, non-PC businesses drive 13-year revenue high</title>
<pubDate>Wed, 9 Sep 2026 23:47:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD201/revenue-acer-pc-2026-business.html</link>
<description>Acer posted NT$30.18 billion in revenue for August 2026, up 38.4% year-over-year, while cumulative revenue for the first eight months reached NT$214.811 billion, up 25.1%. Both August revenue and first-eight-month revenue hit their highest levels in 13 years, as the company's multi-engine business strategy continued to gain traction.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Chenbro Micom August revenue dips, core projects unchanged</title>
<pubDate>Wed, 9 Sep 2026 23:46:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD200/chenbro-revenue-chassis-2026-demand.html</link>
<description>Server chassis maker Chenbro Micom reported August 2026 revenue of NT$2.46 billion, up 41% year-over-year. Cumulative revenue for the first eight months reached NT$19.85 billion, up 51.7%, as AI-driven demand for data center infrastructure continued to climb.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Apple names 2nm node for the first time since 2024 &#38;mdash; and raises prices on every iPhone it still sells</title>
<pubDate>Wed, 9 Sep 2026 23:06:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL200/apple-iphone-launch-2nm-2026.html</link>
<description>Apple used its 2026 iPhone launch to do two things it had avoided for years: name the process node in its flagship chip, and raise the price of phones already on sale. Both moves point to the same pressure. Memory is expensive, the packaging that binds memory to logic has become the hard part of building a phone chip, and Apple has stopped absorbing the cost.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Apple bets on new sensors and S11 chip to differentiate its 2026 watches</title>
<pubDate>Wed, 9 Sep 2026 23:00:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL202/apple-watch-airpods-hardware-2026.html</link>
<description>Behind the foldable, Apple used the same event to rebuild the sensing hardware in its wearables and to push active noise cancellation down to US$129. Apple announced the Apple Watch Series 12, Apple Watch Ultra 4, and AirPods 5 in Cupertino on 9 September, and the two watches share the key upgrades: an all-new Health Sensing System and the S11 chip, which Apple calls its most powerful wearable silicon.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Apple's first foldable lands at US$1,999, and constraint is the panel</title>
<pubDate>Wed, 9 Sep 2026 22:58:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260910VL201/apple-foldable-iphone-panel-market.html</link>
<description>Apple has entered the foldable market at the top of it. iPhone Duo, announced in Cupertino on 9 September, starts at US$1,999 with 256GB and goes up to 2TB &#38;mdash; above the US$1,899 Samsung charges for the wide-format Galaxy Z Fold8 &#38;mdash; and is priced as a halo product rather than a volume one. The interesting question is not whether Apple can sell it. It is who gets to build it, and how few of them there are.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>AI servers push Asus' August revenue up 51%</title>
<pubDate>Wed, 9 Sep 2026 11:21:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260909PD249/asus-revenue-2026-pc-guidance.html</link>
<description>Asus reported consolidated revenue of NT$94.96 billion (US$3.02 billion) in August 2026, up 12.87% from July and 51.17% from a year earlier &#38;mdash; the second-highest monthly figure in company history. Revenue for the first eight months reached NT$645.19 billion (US$20.5 billion), up 42.3% year over year. The company attributed the gain to AI server and PC demand, with motherboard orders also recovering.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>ICT</category>
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