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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Commentary: Balancing national defense needs with industrial development &#38;mdash; Taiwan's electronics giants are not the only answer</title>
<pubDate>Tue, 28 Jul 2026 02:56:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD200/taiwan-defense-development-electronics-industrial-war.html</link>
<description>The Russia-Ukraine war has fundamentally reshaped the nature of modern asymmetric warfare. Unmanned systems have evolved from auxiliary equipment into core combat assets capable of conducting reconnaissance, precision strikes, attrition and sustained operations.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Aerospace</category>
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<title>Eiso raises NT$300M to accelerate AI, aerospace, defense PCB expansion</title>
<pubDate>Tue, 28 Jul 2026 02:44:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD228/pcb-eiso-expansion-high-end-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:321;167-487"&gt;Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for future operations, repay bank loans, and enhance its financial structure, the company launched a cash capital increase and issued its second domestic unsecured convertible bonds in 2026.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Eiso]]></media:description>
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<title>Cadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver</title>
<pubDate>Tue, 28 Jul 2026 02:31:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728VL203/cadence-revenue-intel-outlook-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:321;128-448"&gt;Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook to 19%, citing broad demand for its AI-driven chip design tools and a landmark new agreement with Intel that executives described as a historic shift in the two companies' relationship.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Smart glasses ignite AI device battle as China nears 80% global brand share</title>
<pubDate>Tue, 28 Jul 2026 02:27:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD213/smart-glasses-chips-demand-china.html</link>
<description>Smart glasses are emerging as a major next-generation consumer device as breakthroughs in generative AI and large language models (LLMs) reshape the wearable market. Once constrained by bulky designs and limited use cases, smart glasses are now drawing investment from global tech giants and hardware startups alike, while also redrawing the supply chain.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Anthropic seeks SK Hynix supply for AI chips, SK chair says</title>
<pubDate>Tue, 28 Jul 2026 02:27:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD201/anthropic-sk-hynix-chips-chairman-ceo.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:363;113-475"&gt;Anthropic has asked SK Hynix to help supply chips for its own in-house AI chip production, SK Group chairman Chey Tae-won said. He made the remarks at a recent AI summit in San Francisco, where he also disclosed that South Korea's three new investment plans in semiconductor expansion, AI data centers and physical AI would total more than US$3 trillion.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Anthropic CEO denies seeking open-weights ban, outlines national security priorities</title>
<pubDate>Tue, 28 Jul 2026 02:17:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728VL200/anthropic-ceo-ban-security-nvidia.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:232;183-414"&gt;Anthropic CEO Dario Amodei pushed back Monday against accusations that his company has lobbied to ban open-weights AI models, clarifying the firm's position amid a heated industry debate over proposed US restrictions on Chinese AI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Robot boom heats up as Taiwan chipmakers race to catch up</title>
<pubDate>Tue, 28 Jul 2026 02:16:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD210/ic-design-robot-cloud-ai-chip-taiwan.html</link>
<description>Cloud AI chip giants are stepping up investment in robot applications, putting robots back at the center of industry debate. For Taiwanese chipmakers, the broad range of robot use cases is clearly becoming a major strategic focus, in contrast to the narrower gatekeeping of cloud AI.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia leads new Open Secure AI Alliance to build shared cybersecurity defenses</title>
<pubDate>Tue, 28 Jul 2026 02:16:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728VL201/cybersecurity-nvidia-alliance-security-technology.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:252;215-466"&gt;More than 40 technology companies launched the Open Secure AI Alliance on Sunday, a new initiative to develop open-source tools and techniques for AI-powered cybersecurity defense, while pushing back against calls to restrict access to open AI models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment</title>
<pubDate>Tue, 28 Jul 2026 02:08:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728VL202/china-asml-duv-equipment-chipmakers-manufacturing.html</link>
<description>China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor industry free from Western equipment controls.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge</title>
<pubDate>Tue, 28 Jul 2026 02:07:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD211/nvidia-taiwan-genai-asia-electronics.html</link>
<description>Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and applications.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung, SK Hynix race to secure chipmaking tools before equipment lead times hit one year</title>
<pubDate>Tue, 28 Jul 2026 01:58:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD202/samsung-sk-hynix-ic-manufacturing-equipment-fab-investment.html</link>
<description>Samsung Electronics and SK Hynix are considering placing semiconductor equipment orders earlier as a global wave of fab investment stretches delivery times for key chipmaking tools to as much as twice their previous levels.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>China display giant BOE rejects low-price race, turns to innovation to lift panel value</title>
<pubDate>Tue, 28 Jul 2026 01:52:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728PD212/boe-display-technology-market-sdc.html</link>
<description>BOE, the world's largest display-panel maker and one of China's leading technology companies, is moving away from low-price competition and plans to raise the value of Chinese display products through technological innovation.</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20260728pd212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: BOE]]></media:description>
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<title>Column: Titan Batteries joins US defense effort to secure domestic drone supply chains with traceable battery solutions</title>
<pubDate>Mon, 27 Jul 2026 23:55:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD220/military-manufacturing-supplier-production-bms.html</link>
<description>Idaho-based Titan Batteries has emerged as a key supplier in the US Drone Dominance Program (DDP), providing customized battery solutions for military drones as the Pentagon accelerates efforts to build a secure and resilient domestic supply chain. The company's focus on localized manufacturing, cybersecurity, and end-to-end traceability aligns with the US Department of Defense's (DoD) drive to reduce dependence on foreign suppliers for critical defense technologies.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260727PD220/military-manufacturing-supplier-production-bms.html</guid>
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<media:description type="plain"><![CDATA[Credit: Titan Batteries]]></media:description>
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<item>
<title>LG Energy Solution sues EVE Energy in US over cylindrical battery patents</title>
<pubDate>Mon, 27 Jul 2026 23:54:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL219/lges-patent-patent-infringement-lithium-ion-battery-licensing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:290;111-400"&gt;LG Energy Solution has filed patent infringement proceedings against Chinese battery maker EVE Energy in the US over cylindrical lithium-ion battery technologies, seeking relief through both the US International Trade Commission and the US District Court for the Eastern District of Texas.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[LG Energy Solution cylindrical lithium-ion battery cells. Credit: LG Energy Solution]]></media:description>
</media:content></item>
<item>
<title>Zeiss races to break ASML's EUV optics bottleneck for the AI chip boom</title>
<pubDate>Mon, 27 Jul 2026 23:54:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL213/euv-asml-optics-germany-production-capacity.html</link>
<description>Zeiss Semiconductor Manufacturing Technology is expanding production capacity in Germany to relieve a critical constraint on ASML's lithography output, with AI data center investment accelerating demand for advanced logic and memory chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727vl213_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Apple, Micron's clash over CXMT puts White House in the middle</title>
<pubDate>Mon, 27 Jul 2026 23:54:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL215/apple-micron-cxmt-chips-smartphone.html</link>
<description>Apple and Micron are fighting over whether the smartphone maker can buy memory chips from Chinese manufacturer ChangXin Memory Technologies (CXMT) for non-US devices, a move opposed by Micron. Both companies are lobbying the administration of US President Donald Trump, which could force him to make an uncomfortable choice between his goals of cheaper prices or domestic chip production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Moonshot AI opens Kimi K3 weights, challenging US closed-model economics</title>
<pubDate>Mon, 27 Jul 2026 23:53:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD226/moonshot-kimi-k3-api-language-president.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:157;119-275"&gt;Moonshot AI officially released the model weights for its Kimi K3 large language model on July 27, allowing developers to download, fine-tune, and deploy it.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260727PD226/moonshot-kimi-k3-api-language-president.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260727pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Nvidia's Vera targets AI server growth, with CSP adoption the key test</title>
<pubDate>Mon, 27 Jul 2026 23:52:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD222/nvidia-cpu-ai-server-market-amd.html</link>
<description>Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing systems provider. But the company still needs cloud service providers (CSPs) to embrace the platform at scale if it wants to challenge Intel and AMD in servers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727pd222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race</title>
<pubDate>Mon, 27 Jul 2026 23:52:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL217/sk-hynix-anthropic-silicon-hardware-chips-design.html</link>
<description>The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies related to producing its own chips, spanning early design planning and key component procurement.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>EYEQ Lab completes 200mm SiC line validation with yield above 90%</title>
<pubDate>Mon, 27 Jul 2026 23:51:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL222/power-semiconductors-sic-200mm-production-2025-wafer.html</link>
<description>&lt;p class="P1" data-start="105" data-end="346"&gt;South Korean power semiconductor maker EYEQ Lab has completed mass-production validation of its dedicated 8-inch, or 200mm, silicon carbide (SiC) line in Busan, achieving an average yield above 90%, &lt;em&gt;ET News&lt;/em&gt; reported, citing industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727vl222_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Memory module maker Apacer warns 2027 DRAM supply could fall 70%</title>
<pubDate>Mon, 27 Jul 2026 23:51:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD221/dram-price-2027-apacer-market.html</link>
<description>Memory price increases are expected to moderate in the second half of 2026, but shortages will remain severe, particularly for DRAM, according to Apacer CEO C.K. Chang.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Energy storage unicorn expands in Baotou as China's industry chain accelerates integration</title>
<pubDate>Mon, 27 Jul 2026 23:50:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD219/inner-mongolia-development-production-beijing-subsidiary.html</link>
<description>Inner Mongolia HyperStrong Technology is a major production subsidiary established by Beijing HyperStrong Technology in Baotou, Inner Mongolia. Its development offers a useful case study as competition intensifies among China's battery energy storage system integrators.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727pd219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: HyperStrong]]></media:description>
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<title>Young Optics sees revenue growth, but margin pressure underscores transition to higher-value products</title>
<pubDate>Mon, 27 Jul 2026 23:49:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD216/young-optics-revenue-shipments-growth-automotive.html</link>
<description>Young Optics said second-quarter revenue rose sequentially, but gross margin narrowed as newer products stayed in early production and the product mix shifted. The company expects shipments to remain broadly stable in the third quarter, even as it deepens its presence in optical communications, automotive optics, and AR glasses components.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>China's Yunnan Germanium wins long-term InP wafer order as AI optical demand rises</title>
<pubDate>Mon, 27 Jul 2026 23:49:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD215/inp-demand-wafer-data-center-capacity.html</link>
<description>Yunnan Germanium has secured a major supply deal for indium phosphide (InP) wafers, underscoring how AI data center buildouts are reshaping global demand for high-speed optical parts. The contract could bolster the company's revenue base, but execution risks, capacity expansion, and market swings will determine how much benefit reaches investors and customers worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260727pd215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Yunnan Germanium]]></media:description>
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<title>Optics remain hardest technological hurdle for smart glasses, says Jorjin chairman</title>
<pubDate>Mon, 27 Jul 2026 23:49:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD214/jorjin-chairman-smart-glasses-technology-smartphone.html</link>
<description>Jorjin Technology chairman Wen-lung Liang believes that smart glasses that combine AI with spatial computing are the next smartphone-killers, going beyond mere hardware upgrades to launch a far-reaching revolution in human-computer interaction (HCI).</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>Smart glasses with color displays could enter mass production by 2028</title>
<pubDate>Mon, 27 Jul 2026 23:48:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD213/taiwan-smart-glasses-production-2028-supply-chain.html</link>
<description>Taiwan's smart glasses supply chain urgently needs to break down technical silos and move first, according to industry executives speaking at a forum on July 24 on the outlook for AI+XR and the next phase of wearable computing. Smart glasses with full-color displays are likely to reach mass production around 2028, and Taiwan's ecosystem must solve system integration bottlenecks to stay competitive.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Displays</category>
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<title>China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused</title>
<pubDate>Mon, 27 Jul 2026 23:48:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD212/capacity-infrastructure-software-chips-performance.html</link>
<description>China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption is driving shortages of advanced computing capacity. At the same time, portions of the country's installed lower- and mid-tier capacity remain underutilized because of software compatibility issues, weak coordination between supply and demand, and inadequate resource scheduling.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan urged to move beyond hardware role in AI glasses race</title>
<pubDate>Mon, 27 Jul 2026 23:47:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD209/taiwan-hardware-ar-vr-spatial-computing.html</link>
<description>As global tech giants push into AR, VR, and spatial computing, Taiwan's chip and hardware strength could help it shape the next wave of AI glasses for users worldwide. But that opportunity depends on moving beyond contract manufacturing and into product design, software integration, and ecosystem leadership, industry executives say.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs</title>
<pubDate>Mon, 27 Jul 2026 09:16:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL218/amd-software-infrastructure-government-2026.html</link>
<description>South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks to give its AI chip industry practical reference models and a path into the global AI computing supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Apple reportedly delays smart glasses launch to late 2027 due to privacy risks</title>
<pubDate>Mon, 27 Jul 2026 09:16:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL221/apple-smart-glasses-camera-data-privacy-2027.html</link>
<description>Apple plans to present its first smart glasses during its Worldwide Developers Conference (WWDC) in June 2027 before opening them for sale later in the year. This timeline has reportedly been set back from an original introduction this year due to work being done to figure out how to balance users' privacy with the many AI functions the products are set to offer.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Samsung converts AMD and OpenAI ties into HBM4 supply wins</title>
<pubDate>Mon, 27 Jul 2026 09:10:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL220/samsung-amd-openai-hbm4-infrastructure.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:267;386-652"&gt;Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships that could strengthen its position in the next-generation HBM4 ecosystem after ceding early ground in AI memory to rival SK hynix.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Singapore startup Acrab claims 7.5x speed edge over Mac Mini M4 Pro with new AI chip</title>
<pubDate>Mon, 27 Jul 2026 08:05:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL211/startup-processor-language.html</link>
<description>A Singapore-based chip startup called Acrab on July 22 unveiled its first AI processor, claiming it can run large language models locally at speeds that outpace Apple's Mac Mini M4 Pro by a factor of 7.5 on certain benchmarks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung to use 2nm process for HBM5 base die as heat challenge grows</title>
<pubDate>Mon, 27 Jul 2026 08:05:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL216/samsung-2nm-hbm-performance-hbm4.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:243;106-348"&gt;Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process, as faster high-bandwidth memory raises pressure on logic performance, power efficiency and heat management.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>CXMT tops A-share market cap on IPO debut</title>
<pubDate>Mon, 27 Jul 2026 07:48:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727PD225/cxmt-ipo-shanghai-stock-exchange-dram.html</link>
<description>Chinese DRAM maker ChangXin Memory Technologies (CXMT) listed on the STAR Market of the Shanghai Stock Exchange on July 27, with its market capitalization briefly topping CNY3.6 trillion (approx. US$533.1 billion) on the first day of trading, surpassing Industrial and Commercial Bank of China and becoming the largest listed company in the A-share market.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>CATL profit climbs 42%, but storage price pressure tests its global lead</title>
<pubDate>Mon, 27 Jul 2026 06:45:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260727VL214/catl-profit-price-2026-capacity.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:224;106-329"&gt;CATL reported a 42% rise in first-half 2026 net profit as electric-vehicle and energy-storage battery shipments surged, although weaker margins and intense storage pricing highlighted the cost of sustaining its global lead.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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