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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 30 Oct 2026 13:00:03 GMT</lastBuildDate>
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<title>Honda targets Level 4 autonomy by 2027, AI maps by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD241/honda-2027-2030-autonomous-driving-technology.html</link>
<description>Honda Motor plans to achieve Level 4 autonomous driving around 2027 and replace high-definition maps with AI technology around 2030, enabling Level 4 vehicles to navigate the narrow roads and mountain routes common in Asia, said Yuji Yasui, a fellow at Honda R&#38;amp;D, at Hon Hai Tech Day 2026 (HHTD26).</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<title>Micron says 700-plus Taiwan fab workers earned five years' salary in a single year</title>
<pubDate>Fri, 30 Oct 2026 09:34:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL229/micron-taiwan-salary-fab-2026.html</link>
<description>Micron Technology paid its fiscal 2026 bonuses to Taiwan employees on October 30. The company said more than 700 production-line workers earned at least five years' worth of monthly salary in total pay for the year. The payout comes while the union at its Taoyuan fab is still rejecting the company's pay offer.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Realtek targets 30% AI revenue share by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD239/realtek-revenue-2030-business-2027.html</link>
<description>Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue&#38;mdash;including automotive and robotics applications&#38;mdash;to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>HHTD 26: Mitsubishi Electric Mobility to join Foxconn in 2027, targeting JPY1T revenue by 2030</title>
<pubDate>Fri, 30 Oct 2026 09:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD243/mitsubishi-electric-foxconn-2027-revenue-cybersecurity.html</link>
<description>Speaking at Hon Hai Tech Day (HHTD 26), Kazunori Tanaka, Representative Director and President of Mitsubishi Electric Mobility, emphasized that the company's core competitiveness in EV platforms has decisively pivoted toward software&#38;mdash;spanning electric powertrains, autonomous driving, and in-cabin intelligence. Tanaka announced that Mitsubishi Electric Mobility will officially join the Foxconn family in October 2027, leveraging complementary strengths to target JPY1 trillion (approx. US$6.4 billion) in annual revenue by 2030.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Electric Vehicles</category>
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<title>Holtek lands major server cooling contract, AI thermal demand soars</title>
<pubDate>Fri, 30 Oct 2026 09:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD234/holtek-server-cooling-demand-mcu-shipments.html</link>
<description>Microcontroller unit (MCU) major Holtek Semiconductor has secured a substantial order for brushless DC (BLDC) motors, with adoption in Taiwanese server cooling fans slated to begin in 2027, paving the way for steep year-over-year growth. In addition, the company's optical communication products, specifically storage area network (SAN) disk arrays tailored for AI servers, are scheduled to enter mass production in the first quarter of 2027.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>China smartphone market and industry, 3Q 2026</title>
<pubDate>Fri, 30 Oct 2026 09:10:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029RS400/china-market-smartphone-shipments-digitimes-2026.html?chid=2</link>
<description>According to DIGITIMES observations and analysis, smartphone memory contract prices in the first half of 2026 often rose 50% to 80% quarter-over-quarter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Personal Computing</category>
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<title>HHTD 26: The year robots share the stage with AI infrastructure</title>
<pubDate>Fri, 30 Oct 2026 09:05:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD237/infrastructure-robotics-2026-tdk-robot.html</link>
<description>Hon Hai Tech Day 2026 (HHTD 26) continued to focus on next-generation AI infrastructure. Although the event featured slightly fewer robots than in 2025, it still maintained a dedicated robotics exhibition area where Foxconn and its partners showcased the latest developments in smart manufacturing technology. Participants included KUKA, ABB, and Yaskawa, which are among the four major robotics families, as well as Japanese passive-component manufacturer TDK. Taiwan-based companies including Hiwin, TM Robot, and TECO also joined the exhibition.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Eutelsat eyes EUR10B revenue from IRIS2 as EU seeks homegrown answer to Starlink</title>
<pubDate>Fri, 30 Oct 2026 08:58:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL226/revenue-eu-starlink-leo-2027.html</link>
<description>Eutelsat said that it predicts at least EUR10 billion (US$11.2 billion) in revenue from 2032 to 2040 as it leads the EU's low Earth orbit (LEO) network initiative IRIS2. The European satellite player is viewed by the EU to be a homegrown alternative to SpaceX's Starlink satellite service and a key to reducing technological reliance on the US.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments</title>
<pubDate>Fri, 30 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD243/taiwan-shipments-national-development-council-2026-growth.html</link>
<description>Taiwan's economy has stayed in "booming" territory for a record 10th consecutive month, according to the monitoring indicator compiled by the National Development Council (NDC), the government's monthly gauge of the business cycle. The streak, which began in December 2025, reflects continued strength in shipments of electronic and information and communications technology (ICT) products, and surpasses the previous high of nine straight months set from February to October 2021.&lt;img src="./20261029PD243_files/2.jpg" border="0" alt="Credit: Jerry Chen" width="2000" height="1240" /&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>C Sun Mfg invests in Nemstek to expand advanced packaging equipment</title>
<pubDate>Fri, 30 Oct 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD235/equipment-packaging-investment-automation-technology.html</link>
<description>C Sun Mfg announced on October 30 that it would subscribe for 1,900 lots of Nemstek's privately placed common shares as a strategic investor, giving it an expected stake of approximately 4.68% upon completion. The investment is intended to combine the companies' plasma treatment, thermal processing and automation capabilities as advanced packaging moves toward higher-density integration.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix taps HBM veteran to lead new American unit</title>
<pubDate>Fri, 30 Oct 2026 08:48:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL227/sk-hynix-hbm-development-americas-technology.html</link>
<description>SK Hynix has appointed its AI memory development chief to lead a newly established Americas unit based in the US, putting a technology veteran closer to major US customers as the industry shifts toward customized high-bandwidth memory (HBM) and deeper collaboration with chip developers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix development chief Ahn Hyun will take charge of the company's new Americas unit. Credit: SK Hynix]]></media:description>
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<title>Google, Foxconn aims to cut AI infrastructure deployment to six months</title>
<pubDate>Fri, 30 Oct 2026 08:37:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD242/google-foxconn-infrastructure-partnership-manufacturing.html</link>
<description>Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>HHTD 26: Foxconn unveils three new EVs, expanding Model A and K platforms</title>
<pubDate>Fri, 30 Oct 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD232/foxconn-2026-vehicle-design-investment.html</link>
<description>Foxconn Technology Group Chief Strategy Officer Jun Seki unveiled three new electric vehicles (EVs) at Hon Hai Tech Day 2026 (HHTD 26): the Model A+, an SUV derived from the Model A platform; the Model K, a light-duty truck built on a new compact platform; and the Model K+, a small SUV based on the Model K.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Foxconn, TECO showcase factory-built infrastructure for AI data center expansion</title>
<pubDate>Fri, 30 Oct 2026 08:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD224/teco-foxconn-data-center-infrastructure-2026.html</link>
<description>Hon Hai (Foxconn) and TECO Electric &#38;amp; Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure. The 40-foot container integrates computing, cooling, power, energy management, and fire protection systems, as the companies target rising global demand for AI computing capacity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Foxconn argues it is more than a box mover in AI hardware</title>
<pubDate>Fri, 30 Oct 2026 08:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD225/foxconn-design-chairman-manufacturing-young-liu.html</link>
<description>Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image as a simple "Box Mover." At its 2026 Hon Hai Tech Day, Liu described an end-to-end model spanning design, components, assembly, software integration, and global logistics.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>China's memory module bellwethers post record profits as 3Q26 momentum fades</title>
<pubDate>Fri, 30 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL212/memory-module-profit-revenue-sina-inventory.html</link>
<description>China's listed memory module makers, whose results offer an early read on how the global memory upcycle is reaching the country's storage supply chain, reported net profit gains of more than 300-fold at the top end for the first nine months of 2026. Yet several of the largest players also posted sharp sequential profit declines in the third quarter, suggesting the windfall from low-cost inventory meeting surging contract prices is narrowing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung SDI posts 12-quarter high in 3Q26 operating profit</title>
<pubDate>Fri, 30 Oct 2026 08:12:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD207/samsung-sdi-operating-profit-2026-lfp-battery-materials.html</link>
<description>Samsung SDI, a major South Korean battery maker, posted strong results in the third quarter of 2026 as rising energy storage system (ESS) battery demand lifted operating profit to its highest level in 12 quarters. The company is also expanding into emerging applications, advancing the commercialization of all-solid-state batteries and securing new cylindrical battery customers in aerospace and humanoid robotics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>VinFast aims to make India one of its two largest markets as overseas sales trail target</title>
<pubDate>Fri, 30 Oct 2026 07:31:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL216/vinfast-sales-vehicle-asia-nikkei.html</link>
<description>Vietnamese electric vehicle maker VinFast aims to make India one of its two largest markets alongside Vietnam, Tapan Ghosh, CEO of VinFast Asia, told &lt;em&gt;Nikkei Asia&lt;/em&gt; in an interview published on October 28. The Nasdaq-listed company expects Asia, including Vietnam, to account for 90% of its global sales by 2030.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030</title>
<pubDate>Fri, 30 Oct 2026 07:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD226/nvidia-fc-bga-substrate-capacity-2030.html</link>
<description>Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as next-generation AI accelerators ramp up. The move comes as the global packaging substrate market is projected to grow from US$14.9 billion in 2025 to US$40.2 billion in 2030, while demand for advanced ABF build-up materials is expected to exceed supply from 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>BYD sees 28% profit growth for 3Q26, but still falls short of forecasts</title>
<pubDate>Fri, 30 Oct 2026 07:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL221/byd-profit-europe-growth-2026.html</link>
<description>BYD reported rising profits for the third quarter of 2026, but its performance fell short of analysts' forecasts. The result stems from the challenges China's automakers face, navigating price wars at home while pushing to expand to higher-margin overseas markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>HHTD 26: Foxconn Chairman highlights processing and vertical integration strengths</title>
<pubDate>Fri, 30 Oct 2026 06:46:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD227/foxconn-vertical-integration-young-liu-2026-design.html</link>
<description>Foxconn Chairman Young Liu said at the opening of Hon Hai Tech Day 2026 (HHTD26) on October 30 that the company's core competitive strengths lie in its "processing capabilities" and "vertical integration," as the company seeks to dispel the perception that it is merely a "box mover" handling basic system assembly.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Jinpao targets power cabinets, BBUs in AI-related expansion</title>
<pubDate>Fri, 30 Oct 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD212/expansion-manufacturing-high-end-supply-chain-demand.html</link>
<description>Thailand-based precision sheet-metal manufacturer Jinpao Precision has entered the supply chain of a leading Thailand-based power-management company on the strength of its resilient manufacturing capabilities and highly adaptable product layout strategy. The company is accelerating its expansion in Thailand to capture growing AI demand as it furthers its efforts in high-end power cabinets, backup battery unit (BBU) systems, and energy-storage components.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>ASE expects packaging and testing margins to stay above 30%</title>
<pubDate>Fri, 30 Oct 2026 06:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD214/ase-packaging-testing-revenue-business.html</link>
<description>ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the company move beyond the profitability ceiling that has historically constrained the industry.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Commentary: Why Marvell's rumored Lumentum buy may be hard to pull off but harder to pass up</title>
<pubDate>Fri, 30 Oct 2026 05:52:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD218/marvell-communications-laser-technology-acquisition.html</link>
<description>Marvell is reportedly in advanced talks to acquire Lumentum, a major laser supplier, in a deal that could be announced as early as next week if no other technology giant intervenes. Based on Lumentum's current market capitalization of approximately US$83 billion, the transaction would be Marvell's largest acquisition ever.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261030pd218_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers</title>
<pubDate>Fri, 30 Oct 2026 05:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL215/kla-inspection-equipment-semicon-manufacturing-india.html</link>
<description>KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the country's Semicon 2.0 incentive scheme, &lt;em&gt;The Economic Times&lt;/em&gt; reported on October 29, citing people familiar with the developments. KLA did not respond to the newspaper's queries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL215/kla-inspection-equipment-semicon-manufacturing-india.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl215_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>HyperAccel, Rebellions look beyond chips to AI data center systems</title>
<pubDate>Fri, 30 Oct 2026 04:29:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL218/data-center-ai-chip-hardware-testing-training.html</link>
<description>South Korean AI chip developers HyperAccel and Rebellions are moving beyond standalone accelerators to develop integrated data center systems, seeking to combine domestic processors, memory, and networking technologies into infrastructure capable of handling different AI workloads at lower cost.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL218/data-center-ai-chip-hardware-testing-training.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl218_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: HyperAccel]]></media:description>
</media:content></item>
<item>
<title>Nvidia dominates AI robot chips with 69% market share</title>
<pubDate>Fri, 30 Oct 2026 04:17:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD219/robotics-nvidia-development-robot-software.html</link>
<description>The rapid development of AI robotics applications is driving a sharp increase in semiconductor computing requirements. According to DIGITIMES Intelligence, Nvidia is set to dominate the 2026 AI robotics computing IC market with a 69% share, far outpacing Intel (11%), Qualcomm (5%), and AMD (2%). Beyond raw computing power, Nvidia's comprehensive software ecosystem is the critical factor leaving competitors in its wake.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD219/robotics-nvidia-development-robot-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Amazon 3Q26 earnings call: AWS targets 40%-plus growth through 2028 as satellite costs weigh on near-term profit</title>
<pubDate>Fri, 30 Oct 2026 04:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL214/amazon-aws-leo-satellite-profit-growth-2028.html</link>
<description>Amazon expects its cloud unit to keep growing faster than 40% a year through 2028, even as costs from its satellite internet project hold back fourth-quarter profit.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL214/amazon-aws-leo-satellite-profit-growth-2028.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl214_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Intel tells Taiwan's chip suppliers to build service capacity early</title>
<pubDate>Fri, 30 Oct 2026 04:14:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL219/intel-taiwan-equipment-materials-semi.html</link>
<description>Intel told Taiwanese chip equipment and materials suppliers that they need spare parts and service capability in place early if they want its business. The company said this at a supplier forum held by industry group SEMI in San Francisco ahead of the SEMICON West trade show.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL219/intel-taiwan-equipment-materials-semi.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SEMI]]></media:description>
</media:content></item>
<item>
<title>Nvidia weighs credit support for Nscale as data center, IPO face pressure</title>
<pubDate>Fri, 30 Oct 2026 04:14:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD220/nvidia-data-center-ipo-financing-uk.html</link>
<description>Nvidia is reportedly evaluating billions of dollars in credit support for UK neocloud provider Nscale to help cover power and construction costs for a data center in West Virginia. Nscale faces simultaneous pressure to accelerate the launch of the Nvidia chip-powered campus, which is expected to be used by AI startup Anthropic, while preparing for an initial public offering (IPO), underscoring how AI infrastructure competition is expanding from chip supply to financing and construction capabilities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD220/nvidia-data-center-ipo-financing-uk.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd220_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Jensen Huang calls Megaspeed ties normal amid Washington's spy probe</title>
<pubDate>Fri, 30 Oct 2026 04:10:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD221/new-york-times-nvidia-jensen-huang-government-investigation.html</link>
<description>After &lt;em&gt;The New York Times&lt;/em&gt; reported that a female executive at Singapore-based Megaspeed International was under investigation for allegedly conducting espionage activities for China, Nvidia CEO Jensen Huang said the company's dealings with Megaspeed were normal and involved no irregularities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD221/new-york-times-nvidia-jensen-huang-government-investigation.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd221_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<item>
<title>Sandisk sees 60&#38;ndash;90GB of NAND per CPU in AI agent workloads</title>
<pubDate>Fri, 30 Oct 2026 03:49:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL217/nand-cpu-demand-qlc-nand-flash.html</link>
<description>Sandisk sees demand for roughly 60 to 90 gigabytes of NAND flash per CPU in certain AI inference and agent-orchestration applications, as customers rethink how they use different memory and storage technologies across their AI systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL217/nand-cpu-demand-qlc-nand-flash.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl217_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Sandisk Vice President Rajeev Nagabhirava discusses HBF-based KV cache management at the SEMICON Taiwan 2026 Memory Summit. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Yageo plans 10-15% capacity expansion in 2027 as AI demand pushes utilization above 95%</title>
<pubDate>Fri, 30 Oct 2026 03:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD210/yageo-demand-2027-component-capacity-expansion.html</link>
<description>Passive component manufacturer Yageo said robust AI demand is driving shipments of multilayer ceramic capacitors (MLCCs) and tantalum capacitors, pushing AI-related applications to nearly 20% of its total revenue in the third quarter of 2026, up from 16% in the preceding quarter.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD210/yageo-demand-2027-component-capacity-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shihmin Fu]]></media:description>
</media:content></item>
<item>
<title>Delta Electronics approves Penang manufacturing base to expand global capacity</title>
<pubDate>Fri, 30 Oct 2026 03:43:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD247/delta-electronics-manufacturing-capacity-production-development.html</link>
<description>Delta Electronics approved plans on October 28 to establish a large manufacturing base in Penang, Malaysia, as the power and thermal management company expands overseas production to support customer demand. The site is expected to ramp up to capacity comparable to that of Delta's Thailand operations over five years, with space reserved for process research and development and a potential future R&#38;amp;D center.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD247/delta-electronics-manufacturing-capacity-production-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd247_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Intel's server surge faces a supply setback as PC weakness persists</title>
<pubDate>Fri, 30 Oct 2026 03:42:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL200/intel-pc-business-demand-revenue.html</link>
<description>Intel's growing server business is strengthening its operating recovery, but a factory disruption and a prolonged PC downturn threaten its ability to convert demand into near-term sales. Its third-quarter results show why the turnaround now depends as much on supplying data centers as on reviving the client business that has long anchored the company.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL200/intel-pc-business-demand-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Analysis: Oracle backs Cerebras as AI cloud shifts to multi-architecture compute</title>
<pubDate>Fri, 30 Oct 2026 03:41:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD216/oracle-cerebras-cloud-computing-chips-demand-2027.html</link>
<description>Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer. Although the companies did not disclose Oracle's planned Cerebras hardware purchases, the deal highlights the shift toward diversified AI compute resources as inference demand accelerates.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD216/oracle-cerebras-cloud-computing-chips-demand-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd216_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Cerebras]]></media:description>
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<item>
<title>Trump targets foreign robotics imports under Section 232, citing national security risks</title>
<pubDate>Fri, 30 Oct 2026 03:40:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL213/security-robotics-industrial-infrastructure-production.html</link>
<description>Citing a grave threat to national security and the vulnerability of American critical infrastructure, President Donald J. Trump has directed the Secretary of Commerce and the US Trade Representative to initiate immediate trade negotiations regarding foreign imports of industrial machinery, robotics, and their components.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL213/security-robotics-industrial-infrastructure-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl213_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Getty Images]]></media:description>
</media:content></item>
<item>
<title>In-cabin sensing emerges as automakers' next value-added frontier</title>
<pubDate>Fri, 30 Oct 2026 03:30:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD213/market-automakers-expansion-vehicle-growth.html</link>
<description>The in-cabin sensing market is entering a rapid expansion phase. Global Market Insights estimates that the market for in-cabin sensing, including biometric identification and driver monitoring systems (DMS), will grow from US$5.3 billion in 2025 to US$31.7 billion in 2035, representing a compound annual growth rate (CAGR) of 18.4%, with Asia-Pacific being the largest market, driven primarily by European Commission (EC) regulations and the European New Car Assessment Program (Euro NCAP) requirements.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD213/market-automakers-expansion-vehicle-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd213_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Doosan Enerbility expands AI power push with US gas turbine orders, next-gen nuclear</title>
<pubDate>Fri, 30 Oct 2026 03:26:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD211/doosan-nuclear-manufacturing-market-electricity.html</link>
<description>Doosan Enerbility is strengthening its position in the AI-driven power infrastructure market, backed by 12 gas turbine orders in the US and an expanding nuclear energy portfolio. At Smart Energy Plus (SEP) 2026 in South Korea, the company showcased technologies spanning gas turbines, large nuclear reactors, small modular reactors (SMRs), and offshore wind, highlighting delivery speed, manufacturing capacity, and long-term maintenance as increasingly critical competitive factors.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD211/doosan-nuclear-manufacturing-market-electricity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>ACM Shanghai ships first 310&#38;times;310mm panel-level plating tool as order backlog surges 88%</title>
<pubDate>Fri, 30 Oct 2026 03:08:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD208/shanghai-acm-ai-chip-equipment-packaging.html</link>
<description>As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD208/shanghai-acm-ai-chip-equipment-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: ACM Research]]></media:description>
</media:content></item>
<item>
<title>Sandisk says customers are coming back for more NAND</title>
<pubDate>Fri, 30 Oct 2026 03:01:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL211/nand-infrastructure-revenue-demand-data.html</link>
<description>Sandisk says AI infrastructure customers are returning to secure more NAND flash after underestimating their storage requirements, even as its pipeline of prospective long-term supply agreements exceeds planned output through the end of the decade.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL211/nand-infrastructure-revenue-demand-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl211_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Sandisk Vice President Rajeev Nagabhirava discusses enterprise SSDs for AI data centers at the SEMICON Taiwan 2026 Memory Summit. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Amazon 3Q26 earnings call: TSMC capacity behind AWS's choice to start selling its own AI chips</title>
<pubDate>Fri, 30 Oct 2026 02:59:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL208/amazon-aws-chips-capacity-tsmc.html</link>
<description>Amazon Web Services (AWS) saw its revenue grow 39.3% year-over-year in the third quarter of 2026. That was the cloud unit's fastest pace in nearly five years and its sixth straight quarter of acceleration. Segment sales reached US$46.0 billion, which puts AWS at a US$184 billion annualized run rate. Operating income rose 55% to US$17.8 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL208/amazon-aws-chips-capacity-tsmc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl208_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Dowoo Insys develops rollable OLED UTG for vehicles</title>
<pubDate>Fri, 30 Oct 2026 02:48:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD206/utg-automotive-smartphone-technology-development.html</link>
<description>South Korean ultra-thin glass (UTG) maker Dowoo Insys is expanding its smartphone glass technology into the automotive market, developing protective glass for rollable OLED displays with a major South Korean automotive electronics company. The product could enter commercial production as early as the second half of 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD206/utg-automotive-smartphone-technology-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd206_files/3_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Dowoo Insys]]></media:description>
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<title>HBM4 cycle faces squeeze as capacity, specs become critical</title>
<pubDate>Fri, 30 Oct 2026 02:37:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD217/hbm4-capacity-chipmakers-performance-development.html</link>
<description>AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean supply chain. Major AI semiconductor customers are already pushing HBM4E development, potentially shortening HBM4's mass-production cycle, while suppliers' development and manufacturing capabilities, thermal management, and customer validation remain decisive.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD217/hbm4-capacity-chipmakers-performance-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd217_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Luxury EVs face a status test, rivals retreat from full electrification</title>
<pubDate>Fri, 30 Oct 2026 02:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD209/commercial-ferrari-bev-market.html</link>
<description>Luxury carmakers are moving ahead with new battery-electric models even as others delay, cancel, or rebalance electrification plans. Ferrari, Bentley, and Jaguar are pursuing different approaches, highlighting uncertainty over whether electric vehicles can preserve exclusivity, emotional appeal, and profitability. Their strategies also face uneven demand, particularly in China and below.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD209/commercial-ferrari-bev-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>FCC to bar Chinese testing labs from certifying electronics for US market</title>
<pubDate>Fri, 30 Oct 2026 02:22:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL210/usa-fcc-testing-security.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;The US Federal Communications Commission (FCC) has adopted rules that will effectively bar Chinese laboratories from testing electronic devices intended for the US market, expanding Washington's restrictions on Chinese technology companies and supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL210/usa-fcc-testing-security.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Taiwan manufacturing demand rises as bank property loans decline</title>
<pubDate>Fri, 30 Oct 2026 02:17:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD205/demand-taiwan-ai-applications-production-manufacturing.html</link>
<description>Strong demand for AI applications and cloud services is driving investment in high-performance computing chips and AI servers, prompting Taiwan manufacturers to expand capacity and borrow from banks while retaining cash. At the same time, banks' property-related loan balances continue to decline as credit resources flow into production and the real economy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD205/demand-taiwan-ai-applications-production-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd205_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Episil-Precision fire hits under 10% of capacity, 6- and 8-inch lines to restart within two weeks</title>
<pubDate>Fri, 30 Oct 2026 02:13:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD200/capacity-plant-production-fire-equipment.html</link>
<description>Semiconductor epitaxy maker Episil-Precision said a localized fire broke out on October 28 at its plant on Innovation First Road in Hsinchu Science Park, but caused no injuries or trapped personnel. The affected facility is one of the company's five production sites and accounts for less than 10% of its total output value and production capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030PD200/capacity-plant-production-fire-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>JPP Holding wins Airbus certification, targets A350 structural parts</title>
<pubDate>Fri, 30 Oct 2026 02:08:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD204/airbus-certification-manufacturing-equipment-ai-server.html</link>
<description>Thailand-based precision sheet-metal manufacturer JPP Holding (jpp-KY) has secured more than 20 aerospace special-process certifications from Airbus, including certifications for A350 cockpit structural parts and related subprojects, formally entering the aircraft maker's high-end structural-component supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>STMicroelectronics rides AI and satellite demand, but margin recovery awaits fab overhaul</title>
<pubDate>Fri, 30 Oct 2026 02:01:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL209/stmicroelectronics-satellite-guidance-revenue-demand-2026.html</link>
<description>STMicroelectronics (ST) reported third-quarter 2026 revenue of US$3.76 billion, above the midpoint of its guidance, as AI data center and low Earth orbit (LEO) satellite demand lifted communication equipment and computer peripheral sales by 64% year-over-year. Gross margin reached 37.3%, up 410 basis points from a year earlier, and non-US GAAP earnings per share came in at US$0.37. Free cash flow was US$351 million.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Anthropic's multi-platform AI strategy pressures Nvidia pricing power</title>
<pubDate>Fri, 30 Oct 2026 01:58:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD201/anthropic-nvidia-software-capacity-market.html</link>
<description>Anthropic's "multi-platform resource pool" strategy, disclosed in its S-1 filing, is sending an important signal to the AI chip industry. The company uses Amazon Trainium, Google tensor processing units (TPUs), Nvidia GPUs, and Advanced Micro Devices (AMD) GPUs, integrating computing capacity from different partners into a unified resource pool through software and allocating it across chip platforms based on task requirements.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261030pd201_files/3_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>CoreIntelligence sees in-car projection demand jump 60&#38;ndash;70% in 2027</title>
<pubDate>Fri, 30 Oct 2026 01:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD232/demand-2027-shipments-revenue-high-end.html</link>
<description>Taiwan-based CoreIntelligence Holdings Corporation (CiHC) expects demand for its in-car projection products to grow 60% to 70% in 2027, as high-end projection solutions and immersive applications emerge as potential growth drivers.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Power shortages slow AI data-center builds as Delta expands HVDC, SOFC</title>
<pubDate>Fri, 30 Oct 2026 01:52:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD202/taiwan-equipment-capacity-demand-delta-electronics.html</link>
<description>Power shortages and a shortage of high-voltage direct-current (HVDC) technicians in the US are slowing AI data center construction and making delivery schedules harder to predict, Delta Electronics chairman Ping Cheng said at an investor conference on October 29. Delta will continue developing HVDC and solid oxide fuel cell (SOFC) systems to pursue opportunities in data center power supply and energy efficiency.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>US Drone Dominance Program raises AI supply-chain stakes</title>
<pubDate>Fri, 30 Oct 2026 01:48:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030PD203/taiwan-drone-supply-chain-usa-2027.html</link>
<description>As the US Drone Dominance Program (DDP) expands procurement, orders exceeding 10,000 units will generate significant economies of scale across the drone supply chain. The program's third phase, scheduled to begin in early 2027 and dubbed the industry's "final boss," will raise both procurement volumes and technical requirements, creating an opening for Taiwan suppliers to secure positions in the edge AI supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level</title>
<pubDate>Fri, 30 Oct 2026 01:39:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029VL225/taiwan-manufacturing-tsmc-labor-packaging.html</link>
<description>Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually dense electronics manufacturing base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261029vl225_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[The panel was moderated by NYCU Vice President Jack Sun and joined by executives from TSMC, MediaTek, ASE, and Hermes-Epitek. Credit: Scarlett Yu]]></media:description>
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<item>
<title>Delta Electronics expects 4Q26 to outpace 3Q26 as customer pull-ins drive inventory, profit</title>
<pubDate>Fri, 30 Oct 2026 01:32:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD248/delta-electronics-inventory-2026-demand-materials.html</link>
<description>Delta Electronics expects fourth-quarter 2026 operations to improve from the third quarter, supported by artificial intelligence (AI) data center construction, said chairman Ping Cheng during an earnings call on October 29. However, material shortages are making customer construction and equipment delivery schedules harder to predict, prompting Delta to secure material supplies, maintain buffer inventory, and coordinate delivery plans with customers.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<item>
<title>Intel increases equipment orders as server demand exceeds supply</title>
<pubDate>Fri, 30 Oct 2026 01:29:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL205/intel-equipment-demand-capacity-production.html</link>
<description>Intel's server expansion is drawing equipment and materials suppliers into a capacity push, but the benefits will arrive in stages. Management's October 29 earnings-call comments identified three distinct constraints: wafer production, packaging substrates, and lost output from its disrupted Israel factory. Resolving them and bringing additional manufacturing capacity online will take time.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261030vl205_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Eternal Materials posts record revenue in advanced packaging, precision equipment</title>
<pubDate>Fri, 30 Oct 2026 01:28:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD249/eternal-materials-revenue-equipment-packaging-materials.html</link>
<description>Eternal Materials posted earnings before taxes (EBT) of NT$388 million (approx. US$11.92 million) in September 2026, surging 158.28% year-over-year and up 44.47% from August, as revenue from semiconductor advanced packaging materials and precision equipment both reached record highs for a single month.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD249/eternal-materials-revenue-equipment-packaging-materials.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd249_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Sandisk's data center expansion widens the gap with consumer storage</title>
<pubDate>Fri, 30 Oct 2026 01:23:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL202/sandisk-expansion-data-center-revenue-demand.html</link>
<description>Sandisk's latest quarter showed enterprise storage as a stronger growth engine while its consumer business contracted. This divergence is central to interpreting the company's expansion: data center demand is supporting a much larger, more profitable business, but the performance should not be read as a uniform recovery across flash storage markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Amazon's cloud acceleration lifts profitability as AI spending absorbs cash</title>
<pubDate>Fri, 30 Oct 2026 00:14:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL201/amazon-growth-expansion-infrastructure-aws.html</link>
<description>Amazon's third quarter showed its cloud expansion translating into stronger operating profitability, while the cash demands of building AI infrastructure kept rising. The result sharpens the company's central operating challenge: sustaining rapid AWS growth while bringing new capacity into service and maintaining the economics of its much larger retail business.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Alibaba, Tencent, ByteDance reportedly seek 10-year DRAM deals</title>
<pubDate>Fri, 30 Oct 2026 00:12:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261028VL228/alibaba-tencent-bytedance-dram-samsung.html</link>
<description>Alibaba, Tencent, and ByteDance are reportedly seeking long-term server DRAM supply agreements with Samsung Electronics and SK Hynix, with some requests extending through 2035, as Chinese cloud service providers (CSPs) join US technology giants in competing for future memory capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261028VL228/alibaba-tencent-bytedance-dram-samsung.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261028vl228_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[SK Hynix's DDR5 server memory modules on display at HPE Discover 2026. Credit: SK Hynix]]></media:description>
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<item>
<title>STMicroelectronics' recovery gains momentum, but power chips lag</title>
<pubDate>Fri, 30 Oct 2026 00:12:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL203/stmicroelectronics-recovery-demand-revenue-communications.html</link>
<description>STMicroelectronics is turning a demand recovery into stronger factory economics, with communications and embedded-processing products driving the improvement. Yet the widening loss in its power semiconductor business shows that higher sales have not restored portfolio-wide profitability, leaving manufacturing utilization and product mix central to the next stage of the recovery.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261030vl203_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Intel slashes 18A costs by 40% as foundry posts US$1.9 billion loss</title>
<pubDate>Fri, 30 Oct 2026 00:11:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL204/intel-manufacturing-loss-revenue-production.html</link>
<description>Intel is cutting manufacturing costs for its newest processors, but the gains are reaching individual products and its foundry business at different speeds. Its October 29 earnings call showed improving factory execution alongside unfinished work on product margins and external customer programs, making process progress an incomplete measure of the manufacturing turnaround.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL204/intel-manufacturing-loss-revenue-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Intel's AI PCs are selling, but the wider PC recovery is still missing</title>
<pubDate>Fri, 30 Oct 2026 00:10:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL206/intel-pc-ai-pc-sales-demand.html</link>
<description>Intel's growing AI PC sales are coexisting with a shrinking PC market, as memory constraints weaken purchases and computer makers reduce processor inventories. The distinction matters for the company's manufacturing response: a better product mix can support Intel's position without restoring overall PC demand, while capacity released by weaker client sales takes time to become server supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261030VL206/intel-pc-ai-pc-sales-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261030vl206_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Samsung, SK Hynix say memory crunch could drag on for years despite spending surge</title>
<pubDate>Fri, 30 Oct 2026 00:09:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029VL221/samsung-sk-hynix-investment-demand-production.html</link>
<description>Samsung Electronics and SK Hynix expect memory shortages to persist for years despite rising investment in chip factories, as surging AI demand and increasingly complex manufacturing processes limit how quickly new capacity can come online.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029VL221/samsung-sk-hynix-investment-demand-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029vl221_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Samsung Electronics' Pyeongtaek semiconductor complex (left) and SK Hynix's Icheon and Cheongju facilities (right). Credit: Samsung and SK Hynix]]></media:description>
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<item>
<title>Taiwan semiconductor output to hit NT$9.1 trillion as TSIA urges stable power</title>
<pubDate>Fri, 30 Oct 2026 00:07:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD242/tsia-taiwan-2026-equipment-development.html</link>
<description>The Taiwan Semiconductor Industry Association (TSIA) expects its members' total output to exceed NT$9.1 trillion (US$279.5 billion) in 2026, a 40.9% year-over-year increase driven by growing AI semiconductor demand. TSIA chairman and TSMC deputy co-chief operating officer Cliff Hou also called for stable power supplies and support for reassessing nuclear plant restarts, provided that regulations and safety requirements are met.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD242/tsia-taiwan-2026-equipment-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd242_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Japan's Nidec reports update on restated financial reports, audit status, and corporate governance reform</title>
<pubDate>Fri, 30 Oct 2026 00:06:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029VL219/nidec-legal-governance-management-2026.html</link>
<description>Nidec Corporation has provided an update on its ongoing efforts to resolve the grounds for the disclaimer of opinion issued on its financial statements, missing its initial target to submit restated reports by October 28, 2026. Despite completing several remedial measures, the company continues to address additional verification procedures requested by its independent auditor.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029VL219/nidec-legal-governance-management-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nikkei Asia]]></media:description>
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<title>Samsung secures Faraday 2nm ASIC order, broadening AI and HPC footprint</title>
<pubDate>Fri, 30 Oct 2026 00:05:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD245/samsung-2nm-faraday-asic-hpc.html</link>
<description>Samsung Electronics has secured a 2nm foundry order from Taiwan-based ASIC design house Faraday Technology. This win expands the application scope of Samsung's 2nm process from mobile devices to cloud AI and high-performance computing (HPC), and is expected to help broaden its advanced-process customer base and strengthen the competitiveness of its foundry business.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD245/samsung-2nm-faraday-asic-hpc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd245_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AUO returns to a third-quarter loss as panel demand weakens</title>
<pubDate>Fri, 30 Oct 2026 00:05:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD239/loss-demand-panel-revenue-electronics.html</link>
<description>AUO reported a consolidated net loss attributable to its parent-company owners in the third quarter of 2026 as cautious panel purchasing and weaker consumer electronics demand reduced revenue. The display maker posted revenue of NT$66.88 billion (US$2.06 billion) for the quarter, down 5.7% quarter-over-quarter and 4.3% year-over-year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD239/loss-demand-panel-revenue-electronics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd239_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Memory price surge clouds peak season; Chinese brands' 4Q26 smartphone shipments to drop over 35%</title>
<pubDate>Fri, 30 Oct 2026 00:05:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD234/smartphone-shipments-apple-oppo-huawei.html</link>
<description>Despite new smartphone launches from Apple, Huawei, Oppo, Vivo, and Xiaomi, rising memory prices are weakening sales momentum and prompting Chinese smartphone brands to adjust their product mix. DIGITIMES Intelligence senior analyst Luke Lin expects smartphone shipments in China to fall more than 13.5% year-over-year in the fourth quarter of 2026, and total shipments by Chinese brands to decline more than 35% year-over-year.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD234/smartphone-shipments-apple-oppo-huawei.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd234_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>GlobalFoundries bets on FD-SOI for robots and cars</title>
<pubDate>Fri, 30 Oct 2026 00:04:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD233/globalfoundries-fd-soi-data-manufacturing-president.html</link>
<description>GlobalFoundries (GF) is betting on specialty semiconductor technologies to capture AI demand beyond advanced processors, targeting opportunities in data center connectivity, power management, automotive electronics and humanoid robots as artificial intelligence moves into physical applications.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD233/globalfoundries-fd-soi-data-manufacturing-president.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd233_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Texas Instruments, NXP point to data centers and robots as industrial chips rebound</title>
<pubDate>Fri, 30 Oct 2026 00:00:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD238/industrial-texas-instruments-nxp-data-chips.html</link>
<description>Texas Instruments (TI) and NXP Semiconductors both reported 40% to 50% year-over-year growth in their industrial businesses during their latest earnings calls for the third quarter of 2026, citing AI data-center construction and robotics as key growth drivers. TI's industrial revenue reached its highest level in four years, while NXP's industrial and IoT business grew 39% year-over-year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261029PD238/industrial-texas-instruments-nxp-data-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261029pd238_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Intel CEO sees quantum computing as third pillar</title>
<pubDate>Fri, 30 Oct 2026 00:00:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD244/intel-quantum-computing-ceo-technology-software.html</link>
<description>Intel has agreed to acquire Israeli quantum software company Classiq, as CEO Lip-Bu Tan positions quantum computing as a "third pillar" alongside CPUs and GPUs. The deal, whose price has not been disclosed, is reportedly valued at about US$2.3 billion and is expected to close in the first half of 2027, according to Reuters.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>BYD eyes ultra-luxury sedan priced above CNY2 million</title>
<pubDate>Thu, 29 Oct 2026 23:58:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD229/byd-brand-vehicle-technology-market.html</link>
<description>BYD's premium Yangwang brand has named its ultra-luxury flagship sedan "Altior," with the model expected to sell for more than CNY2 million (US$300,027.8). Developed over approximately three years, the sedan is set to debut in the United Arab Emirates as Yangwang seeks to compete with Mercedes-Maybach, Rolls-Royce, and Bentley.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Yangwang]]></media:description>
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<title>Silicon Motion posts fourth straight revenue record, eyes 100% 2026 growth</title>
<pubDate>Thu, 29 Oct 2026 23:58:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD228/revenue-2026-silicon-motion-growth-gross-margin.html</link>
<description>Silicon Motion Technology reported third-quarter 2026 revenue of about US$560 million, marking a record high for the fourth consecutive quarter. Revenue rose 24% quarter-over-quarter and surged 131% year-over-year, putting the company on track to achieve record full-year revenue in 2026, up more than 100% from 2025.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China AI stock bubble bursts as STAR 50 plunges 40%, erasing billions in market value</title>
<pubDate>Thu, 29 Oct 2026 23:57:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD225/beijing-stock-market-ai-robotics-demand.html</link>
<description>Chinese AI, robotics, and semiconductor stocks have suffered a steep sell-off in less than four months, casting a shadow over Beijing's push to achieve global technology leadership. According to &lt;em&gt;Reuters&lt;/em&gt;, the Shanghai STAR 50 Index has fallen about 40% from its June peak, wiping out approximately US$480 billion in market value across AI and semiconductor components.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Taiflex, E Ink accelerate PTFE development for AI connectivity materials</title>
<pubDate>Thu, 29 Oct 2026 23:57:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD224/materials-taiflex-development-e-ink-fccl.html</link>
<description>Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings (EIH) to jointly develop AI high-speed connectivity materials. The partnership combines E Ink's expertise in base-material development and manufacturing with Taiflex's circuit-board material capabilities and industry experience to address demand for high-performance materials, mass-production capacity, and stable supply.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Elite Material posts record 3Q26 revenue on AI demand</title>
<pubDate>Thu, 29 Oct 2026 23:57:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD223/emc-elite-material-revenue-demand-ccl.html</link>
<description>Elite Material Co. (EMC), a copper-clad laminate (CCL) maker, reported record third-quarter 2026 revenue of NT$60.88 billion (US$1.875 billion), driven by strong demand for high-end materials used in AI products and fully loaded production capacity. Revenue rose 28.8% quarter-over-quarter and 142% year-over-year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Analysis: Can Kazakhstan really be Europe's AI factory?</title>
<pubDate>Thu, 29 Oct 2026 23:56:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD211/europe-nvidia-infrastructure-ceo-jensen-huang.html</link>
<description>Nvidia CEO Jensen Huang's visit to Kazakhstan highlights a widening contest over AI computing capacity, as Europe seeks alternatives to infrastructure concentrated in the US and Asia. Kazakhstan, with 21 million people, is developing data centers and pursuing Nvidia partnerships that could position it as a supplier to Europe.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>ASE Holdings raises 2026 capex to US$11.5 billion after profit surge</title>
<pubDate>Thu, 29 Oct 2026 16:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD246/ase-profit-2026-electronics-revenue.html</link>
<description>ASE Technology Holding reported net profit of NT$26.996 billion (US$831 million) for the third quarter of 2026, a 28% increase from the previous quarter and a 148% gain from a year earlier. The result marked the semiconductor packaging and electronics manufacturing services provider's highest profit in nearly 19 quarters. ASE also increased its 2026 capital expenditure budget by US$1 billion to US$11.5 billion and said spending is expected to rise again in 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>LandMark orders surpass 2026 revenue; capacity to expand sixfold</title>
<pubDate>Thu, 29 Oct 2026 15:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261029PD235/revenue-capacity-2026-demand-silicon.html</link>
<description>AI is driving strong demand for silicon photonics, but LandMark Optoelectronics' planned sixfold capacity expansion over two years still falls short of customer requirements. The optical communications epitaxy supplier posted third-quarter 2026 net income of NT$621 million (US$19.1 million), up 33% quarter-over-quarter and 5.28 times year-over-year, while major customers have already placed orders covering more than six months.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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