DIGITIMES: News and Insight of the Global Supply Chain

Energy Taiwan 2026 opens with record international participation

DIGITIMES — Wed, 14 Oct 2026 15:59:00 GMT

Energy Taiwan 2026 opened on October 14, bringing together more than 430 exhibitors across nearly 1,400 booths as the island seeks to strengthen energy resilience and accelerate decarbonization amid rising electricity demand from artificial intelligence (AI).

300mm fab equipment spending to hit US$227 billion by 2029, SEMI says

DIGITIMES — Wed, 14 Oct 2026 09:18:42 GMT

Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates and reach US$227 billion in 2029, SEMI said in its latest 300mm Fab Outlook, released October 13 at SEMICON West in San Francisco.

AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling

DIGITIMES — Wed, 14 Oct 2026 09:15:00 GMT

Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October 12–15 in San Jose, US. The company is expanding liquid cooling beyond AI GPUs and CPUs to support rising AI computing demand and increasingly heat-intensive data-center racks.

BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

DIGITIMES — Wed, 14 Oct 2026 09:11:06 GMT

China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising concerns about production stability as the display maker seeks approval to supply panels for Apple's iPads.

Tata's flagship chip fab faces pressure from its own shareholders

DIGITIMES — Wed, 14 Oct 2026 08:50:17 GMT

Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses for quicker returns on capital-intensive bets.

AI computing demand drives water management integration at Tianyi

DIGITIMES — Wed, 14 Oct 2026 08:40:08 GMT

Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key components of the green transformation of high-tech plants. Lealea Group's Tianyi Water & Energy Solutions is integrating water management, renewable power and AI-enabled smart maintenance. The company has also been selected for the AquaImpact Sustainable Water Mark at the 2026 Taiwan International Water Week (TIWW).

ASE expands PowerSiP platform to improve AI data center power efficiency

DIGITIMES — Wed, 14 Oct 2026 08:38:50 GMT

ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems. The move could matter globally as demand for AI infrastructure rises, since more efficient power delivery may help lower energy losses, support denser computing, and ease the strain on rapidly expanding digital infrastructure.

Wiwynn unveils CPO compute system with GUC and Ayar Labs

DIGITIMES — Wed, 14 Oct 2026 08:38:13 GMT

Wiwynn Corporation, CPO solutions provider Ayar Labs and Global Unichip Corp. (GUC) will stage the first live demonstration of an integrated compute system with real-time telemetry monitoring at the 2026 OCP Global Summit, marking a new milestone in their strategic partnership.

Tsang Yow's semiconductor revenue share reaches 12%

DIGITIMES — Wed, 14 Oct 2026 08:26:00 GMT

Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year as demand from the Americas aftermarket temporarily slowed. Supported by its semiconductor business, consolidated revenue reached NT$269 million in the third quarter of 2026, up 7.5% year-over-year, while revenue for the first nine months rose 4.04% year-over-year to NT$824 million.

Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs

Levi Li — Wed, 14 Oct 2026 08:20:00 GMT

Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman said at TechCrunch Disrupt 2026.

Kingboard Laminates raises thin-cloth laminates, prepreg prices 15% in eighth hike of 2026

Eifeh Strom — Wed, 14 Oct 2026 07:58:30 GMT

Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg (PP) made with style 2116 or thinner fiberglass fabrics.

Ubiqconn satellite revenue jumps 175% as 3Q26 operations recover

DIGITIMES — Wed, 14 Oct 2026 07:55:00 GMT

Ubiqconn Technology reported September 2026 consolidated revenue of NT$142 million (US$4.4 million), up 32.4% month-on-month and 6.7% year-on-year. Third-quarter revenue rose 9.6% sequentially to NT$432 million but fell 10.5% year on year. Revenue for the first three quarters totaled NT$1.373 billion, down 15.7% year on year.

China's smartphone slump: Can Apple's new lineup light a spark?

DIGITIMES — Wed, 14 Oct 2026 07:54:59 GMT

China's smartphone market faces dual pressures as weakening consumer spending and rising component costs continue to weigh on the handset sector. According to third-quarter data from market research firm IDC, nationwide smartphone shipments dropped 15.4% year-over-year to 57.9 million units, underscoring broader macroeconomic headwinds across the country.

Largan chairman casts doubt on Micro LED links for AI data centers

Sherri Wang — Wed, 14 Oct 2026 07:39:17 GMT

Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission efficiency. Industry sources interviewed by DIGITIMES counter that while individual Micro LEDs transmit data more slowly than lasers, using hundreds of parallel channels could reduce overall system power consumption by simplifying the transmission architecture.

SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027

DIGITIMES — Wed, 14 Oct 2026 07:25:32 GMT

Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising questions about the chipmaker's expansion plans as rising conventional DRAM prices create competing opportunities for capital spending.

Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027

DIGITIMES — Wed, 14 Oct 2026 07:23:22 GMT

Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on smaller process nodes. Its next-generation Kirin chip, scheduled for 2027, has entered testing, with initial results meeting expectations.

Microsoft adds US$132.5 billion in lease commitments—but AI capacity takes years to build

Levi Li — Wed, 14 Oct 2026 07:08:47 GMT

Microsoft's lease commitments that have not yet commenced reached US$329.1 billion in the fourth quarter of fiscal 2026, which ended in June, according to its latest regulatory filing. The total rose US$132.5 billion, or more than 67%, from the previous quarter, marking the company's largest quarterly increase on record.

ASML's record 3Q26 sales expose a capacity gap for AI chip demand through 2028

DIGITIMES — Wed, 14 Oct 2026 06:52:05 GMT

ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028 would fall short of customer demand. Growing AI investment is prompting the lithography equipment supplier to explore a larger capacity expansion for 2028, with some customers expressing interest in placing orders for 2029 and 2030.

Nvidia's share of China's AI chips falls by a third while Huawei gains

DIGITIMES — Wed, 14 Oct 2026 06:32:11 GMT

Nvidia's share of AI chips in China's data center market has fallen by 34% in the first half of this year, according to a new report. The drop follows months of US restrictions on advanced chip sales to the country, Chinese authorities' push to rely less on Nvidia imports, and domestic players like Huawei moving to fill in this supply gap.

Elon Musk says Micron is 'reasonable' on memory prices while others are 'extortionate'

DIGITIMES — Wed, 14 Oct 2026 06:19:58 GMT

Elon Musk has criticized memory chip suppliers for charging what he called "extortionate" prices while praising Micron Technology's approach to future pricing, highlighting tensions between chipmakers and customers as prolonged supply shortages strengthen manufacturers' bargaining power.

Taiwan IC substrate maker Xinxing halts some machinery after fatal workplace accident

DIGITIMES — Wed, 14 Oct 2026 05:50:09 GMT

IC substrate maker Xinxing experienced a fatal workplace accident at its Yangmei plant on October 13, prompting the Taoyuan City Labor Inspection Office to order a partial shutdown in the affected area. The company said the incident has not affected production or operations so far and that it will cooperate fully with the investigation and implement preventive measures.

JCET redirects Korean factories towards AI to counter weak smartphone growth

DIGITIMES — Wed, 14 Oct 2026 05:17:58 GMT

JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure demand. The company expects benefits from the transformation of its South Korean operations to emerge from the second half of 2026 and to become more pronounced in 2027 and 2028, according to a recently released investor relations activity record.

Google unveils Gemini 4 Argon, balancing frontier capabilities with rigorous safety standards

DIGITIMES — Wed, 14 Oct 2026 04:44:44 GMT

The debut of Google's Gemini 4 family marks a major milestone in frontier artificial intelligence, and Gemini 4 Argon is set to lead this next-generation launch. As autonomous AI capabilities scale rapidly, security incidents across the tech landscape highlight why robust containment controls have become the industry's top priority.

OpenAI in talks to buy cybersecurity firm Trail of Bits, report says

DIGITIMES — Wed, 14 Oct 2026 04:34:36 GMT

OpenAI is in early talks to acquire Trail of Bits, a cybersecurity research firm specializing in software vulnerabilities and open-source security, The Information reported on October 13, as the ChatGPT maker expands its push into enterprise cybersecurity.

AI chip competition shifts to data-center efficiency as memory, interconnect limits bite

Jingyue Hsiao — Wed, 14 Oct 2026 04:14:35 GMT

As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers. Nvidia, Broadcom, and Qualcomm executives said memory bandwidth, chip interconnects, power use, and heat management are now among the biggest constraints on AI performance, forcing closer coordination across chips, memory, packaging, and system design.

Broadcom executive says chipmakers must tackle packaging, power limits together

Jingyue Hsiao — Wed, 14 Oct 2026 04:11:30 GMT

Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that die size, packaging, power delivery, and cooling are becoming major constraints as workloads evolve, making faster coordination essential for future system performance.

Samsung, AMD validate CXL memory for AI servers

DIGITIMES — Wed, 14 Oct 2026 04:04:18 GMT

Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens its AI infrastructure strategy beyond high-bandwidth memory (HBM) to memory pooling and enterprise storage.

LG, Bosch team up on automotive chiplets

DIGITIMES — Wed, 14 Oct 2026 03:58:43 GMT

LG Electronics is reportedly working with Bosch to develop automotive chiplets, a move that would mark LG's formal entry into the automotive semiconductor market if the technology reaches production and wins customers. The business could also create synergies with the LG Group's broad automotive electronics operations.

LGD's KRW104.1B auto LCD module sale collapses

DIGITIMES — Wed, 14 Oct 2026 03:46:49 GMT

LG Display (LGD) has canceled the planned sale of its automotive LCD module business at its Nanjing subsidiary, losing a potential KRW104.1 billion (about US$72 million) payment and delaying plans to improve production efficiency.

TSMC and MediaTek alumni lead Taiwan's new wave of deep tech startups

DIGITIMES — Wed, 14 Oct 2026 03:39:39 GMT

At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups made the case that Taiwan's next wave of innovation is being built by chip-industry veterans who are tackling problems faced by the world's biggest tech companies.

Cisco expands AI networking with new chips, SONiC, cross-site deployment

DIGITIMES — Wed, 14 Oct 2026 03:30:49 GMT

As AI cluster sizes grow, networking systems face challenges beyond higher bandwidth, including power consumption, cooling, cross-site coordination, and large-scale device operations. Cisco is expanding its AI data center technology strategy from high-bandwidth switch chips to cross-site networking, open network operating systems, and device management.

Cisco, Nvidia target high-speed optical interconnects with 4x USFP density

DIGITIMES — Wed, 14 Oct 2026 03:25:27 GMT

Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s electrical signals per lane, targeting AI data centers' demand for higher bandwidth density, greater energy efficiency, and high-speed interconnects.

AI accelerator growth shifts toward value as custom ASICs move upmarket

Lily Hess — Wed, 14 Oct 2026 03:11:19 GMT

The AI accelerator market is set to reach US$1.4 trillion by 2030, up 150% from Bloomberg Intelligence's January 2026 estimate of US$560 billion, as higher prices—not just shipment growth—drive the market. Annual revenue is expected to surpass US$1 trillion in 2028, growing at a compound annual growth rate (CAGR) of 38% from 2026 to 2030.

Hua Hong forges strategic alliances with four Chinese chip equipment giants

DIGITIMES — Wed, 14 Oct 2026 02:55:55 GMT

Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in Shanghai, strengthening cooperation on domestic manufacturing technologies. The event also showcased advances in chipmaking equipment, AI accelerators, and electronic design automation (EDA).

CyberTAN sells Hsinchu site in US$68B deal to fund strategy shift

Jingyue Hsiao — Wed, 14 Oct 2026 02:55:00 GMT

CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may reshape how the Taiwanese company deploys capital, and it underscores continued global demand for data center, enterprise, and telecommunications equipment.

TOK expands Koriyama photoresist capacity as AI chip demand rises

DIGITIMES — Wed, 14 Oct 2026 02:54:18 GMT

Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials market, particularly photoresists. The company announced on October 8 that a new facility at its Koriyama plant had been completed and that it plans to expand the site further.

Applied Materials CEO says AI race hinges on technology and capacity

Sherri Wang — Wed, 14 Oct 2026 02:47:58 GMT

The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging and system interconnects simultaneously to keep pace with demand, Applied Materials President and CEO Gary Dickerson said.

Memory bottlenecks drive HBM shift to 8-layer stacks

Yunnie Cheng — Wed, 14 Oct 2026 02:35:20 GMT

As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec high-bandwidth memory (HBM) configurations for their next-generation architectures. Severely constrained supply is expected to drive a pivot toward 8-layer HBM in the second half of 2027. This move will not only boost memory makers' yields but, more importantly, enable a higher volume of finished systems to ship smoothly.

HBM capacity shift sends DDR4 contract prices rising faster than DDR5

Levi Li — Wed, 14 Oct 2026 02:25:41 GMT

DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted memory manufacturers to expand high-bandwidth memory (HBM) production while scaling back legacy DRAM capacity, tightening DDR4 supply and lifting contract prices.

Taiwan's export boom shifts toward AI servers, raising concentration risks

Jingyue Hsiao — Wed, 14 Oct 2026 02:23:51 GMT

Taiwan's export surge is increasingly tied to high-value AI servers and pricier memory chips, a shift with implications far beyond the island. As exports climb, the outlook underscores both the global demand for artificial intelligence hardware and the risks of relying heavily on one fast-growing sector.

KYEC, Nvidia eye Texas site for US AI chip testing plant

Lily Hess — Wed, 14 Oct 2026 02:17:31 GMT

King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early access to AI chip testing capacity in the US. The move further clarifies KYEC's plans to invest in the US, with Fort Worth, Texas, reportedly emerging as the likely site of its operations in the country.

Adani and Jabil plan 50:50 JV to make AI data center hardware in India

DIGITIMES — Wed, 14 Oct 2026 02:13:52 GMT

A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up may help meet rising demand for data center hardware, lower supply risks, and widen access to AI infrastructure worldwide.

CEATEC 2026 showcases physical AI, smart infrastructure

DIGITIMES — Wed, 14 Oct 2026 01:48:26 GMT

Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, bringing together 821 companies and organizations from Japan and overseas to showcase Physical AI, smart infrastructure maintenance, and disaster-prevention simulations. The four-day event runs through October 16 and highlights how AI is moving beyond generative tools to control robots and connected devices across industry and daily life.

Yaskawa targets 2030 humanoid robot rollout as AI lifts forecast

DIGITIMES — Wed, 14 Oct 2026 01:39:18 GMT

Japan's Yaskawa Electric plans to launch humanoid robots within the next one to two years and expects AI-powered humanoid robots to enter widespread use around 2030. The company also raised its revenue and net profit forecasts for fiscal 2026, citing a weaker yen, while lowering its operating profit forecast.

CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?

Levi Li — Wed, 14 Oct 2026 01:35:10 GMT

China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and SK Hynix. The announcement has fuelled speculation that China's memory technology is approaching or surpassing South Korean capabilities, while positioning CXMT for an early entry into the emerging 3D DRAM market.

Qualcomm says edge AI faces power, cost, and scale hurdles

Jingyue Hsiao — Wed, 14 Oct 2026 01:35:00 GMT

Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC Center, the company said its memory-and-logic stacking work could sharply reduce energy use, although thermal, materials, and manufacturing challenges remain globally.

KYEC signs advanced payment deal with Nvidia for US testing expansion

Eifeh Strom — Wed, 14 Oct 2026 01:31:15 GMT

Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under the arrangement, Nvidia will make advance payments to support KYEC and its US subsidiary AeternZ Semiconductor Testing in building local testing capacity, while securing capacity for Nvidia. The payments will be gradually offset through the provision of testing services.

Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling

DIGITIMES — Wed, 14 Oct 2026 01:22:51 GMT

Samsung Electronics and LG Electronics showcased their AI strategies at KES 2026 in South Korea, with Samsung focusing on smartphones, TVs, and home appliances while emphasizing an integrated AI ecosystem for everyday life. LG highlighted smart factories, robotic components, and data center cooling systems, demonstrating how its manufacturing and heating, ventilation, and air-conditioning (HVAC) expertise is expanding into AI-related industries.

AP Memory completes US$415.5M GDR offering, boosts three product lines

Yunnie Cheng — Wed, 14 Oct 2026 01:16:42 GMT

Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15 per unit, representing approximately NT$897.61 per common share based on an exchange rate of NT$31.972 per US dollar. Scheduled to list on the Luxembourg Stock Exchange on October 15, the proceeds will be used to bolster working capital and satisfy foreign-currency raw material procurement needs.

Chinese automakers face three hidden barriers in European expansion

Yunnie Cheng — Wed, 14 Oct 2026 01:16:23 GMT

China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected in their domestic market cannot be seamlessly replicated in Europe. Currently, at least three hidden barriers test their cross-border adaptability.

Apple's new home devices tie Siri AI to subscriptions and newer iPhones

DIGITIMES — Wed, 14 Oct 2026 01:15:00 GMT

The smart home hardware Apple unveiled on October 13 is priced as premium equipment, but the fine print points to two larger goals. The first is to put Siri AI, Apple's new generative assistant, on more screens and speakers around the home. The second is to turn those devices into a channel for recurring services revenue. Many of the most capable features also require a recent iPhone.

LGES diversifies ESS equipment suppliers after Daejin Machinery default, court rehabilitation

Charlene Chen — Wed, 14 Oct 2026 01:14:30 GMT

LG Energy Solution (LGES) is reportedly restructuring its energy storage system (ESS) battery equipment supply chain after major partner Daejin Machinery entered financial difficulties and began court-led rehabilitation proceedings. LGES is transferring some orders to existing equipment suppliers while seeking new partners to reduce the risk of supply disruptions.

China’s NEV export rebate cut puts budget EV makers under margin pressure

Levi Li — Wed, 14 Oct 2026 01:13:06 GMT

China will reduce its export tax rebate for new energy vehicles (NEVs) from 13% to 9% on April 1, 2027, increasing cost pressure on automakers, particularly those selling lower-priced models with thin profit margins. The Ministry of Finance and State Taxation Administration announced the four-percentage-point reduction on October 12.

Apple launches HomeView display, rebuilding home lineup around Siri AI

DIGITIMES — Wed, 14 Oct 2026 01:12:27 GMT

Apple is betting that its new Siri AI assistant can revive a business in which, according to Reuters, the company "has tinkered for a decade without major success." At its "Welcome Home" launch in New York on October 13, 2026, Apple introduced HomeView, a new smart display, alongside a new HomePod mini, a faster Apple TV 4K, and a range of cameras, a smart lock, and thermostats made by LG Electronics and Schneider Electric.

MiTAC spotlights liquid cooling, open platforms for AI infrastructure

Yunnie Cheng — Wed, 14 Oct 2026 01:09:44 GMT

MiTAC Computing Technology featured a comprehensive suite of full-stack AI infrastructure at the Open Compute Project (OCP) Global Summit in San Jose, California, centered around the theme "Scaling Open AI Infra with Full-Stack Innovation." The company demonstrated integrated solutions spanning compute, storage, liquid-cooled servers, firmware, operating systems, and management software.

SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration

Levi Li — Wed, 14 Oct 2026 01:09:30 GMT

AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling, chip interconnects, and system integration through advanced packaging.

TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration

Levi Li — Wed, 14 Oct 2026 01:09:01 GMT

Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research models, at the October 12 opening of Applied Materials' Equipment and Process Innovation and Commercialization (EPIC) Center in the US.

Geely enters Canada, plans first vehicles for 2027

Charlene Chen — Wed, 14 Oct 2026 01:08:44 GMT

China's Geely has officially entered the Canadian market and plans to launch its first vehicles there in 2027, expanding its North American footprint. Geely has completed its Canadian corporate registration and begun operations while building local sales and after-sales service networks.

TCC wins approval for Europe listing plan

DIGITIMES — Wed, 14 Oct 2026 01:08:14 GMT

TCC Group Holdings (TCC) shareholders approved a plan on October 13 for subsidiary Cimpor International Holdings to pursue an initial public offering (IPO) and listing on a European securities market. The resolution received 4,287,569,701 votes in favor, representing 94.74% of voting rights represented at the vote, as the company sought to create a new funding channel for its European operations while maintaining Taiwan-based control of the business.

SEMICON West makes three-year commitment to Phoenix, home to over US$200B in chip investment

Scarlett Yu — Wed, 14 Oct 2026 01:05:05 GMT

SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas confirmed at a pre-show press conference that the organization has signed a three-year agreement with Phoenix to host SEMICON West.

Pegatron showcases rack-scale AI infrastructure at OCP Global Summit

DIGITIMES — Wed, 14 Oct 2026 01:04:55 GMT

Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering development to large-scale cluster deployment. The Taiwanese electronics manufacturer presented rack-scale AI systems, liquid-cooling technologies, and integrated deployment capabilities as demand grows for infrastructure that can support increasingly complex AI workloads.

China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems

Levi Li — Wed, 14 Oct 2026 01:01:21 GMT

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D packaging for greater power efficiency, optical interconnects for faster data transmission, and open software ecosystems for easier adoption—will determine whether Chinese GPUs can advance from standalone accelerators to large-scale AI computing clusters.

GlobalFoundries revives 7nm-class ambitions with an EUV-free FD-SOI bet on physical AI

DIGITIMES — Wed, 14 Oct 2026 00:59:27 GMT

GlobalFoundries' plan to build a 7nm-class chip process in Dresden without extreme ultraviolet (EUV) lithography tests how a second-tier foundry can stay relevant while TSMC holds most of the AI data center market. Instead of competing on transistor size, GF is competing on integration, power efficiency, and location, and it is making European supply security part of its pitch.

Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal

DIGITIMES — Wed, 14 Oct 2026 00:58:17 GMT

Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast for wafer fab equipment (WFE) spending, the industry-wide figure that drives demand for its tools.

Analysis: China's EV rebate cut pushes exporters from volume to value

Jingyue Hsiao — Wed, 14 Oct 2026 00:56:53 GMT

China's planned cut to export tax rebates for new energy vehicles could ripple through global auto markets, intensifying pressure on low-cost exporters while reshaping trade tensions with Europe. The move signals a wider rollback of industry support and may accelerate consolidation among weaker carmakers and raise prices for some overseas buyers.

Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit

DIGITIMES — Wed, 14 Oct 2026 00:55:34 GMT

Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery, and liquid cooling. The portfolio included Ingrasys Technology's Nvidia Vera Rubin NVL72 platform and connectivity, power, and thermal-management systems from Foxconn Interconnect Technology (FIT) as Foxconn expanded its offering from components and Compute Trays to complete AI racks.

NTT Data, Anthropic negotiate Japan data center with up to 500MW

DIGITIMES — Wed, 14 Oct 2026 00:55:20 GMT

NTT Data and Anthropic are in final-stage negotiations to develop a data center in Osaka, Japan, with power capacity of up to 500MW, according to Nikkei. The project would be Anthropic's first dedicated data center in Japan and one of the country's largest facilities, supporting the AI model developer's expanding infrastructure requirements.

Apple COO visits Foxconn as iPhone Duo production ramps up

Charlene Chen — Wed, 14 Oct 2026 00:55:04 GMT

Days before preorders open for Apple's first foldable smartphone, the iPhone Duo, Apple Chief Operating Officer Sabih Khan visited China to inspect its supply chain. On October 11, Khan and Foxconn rotating CEO Michael Chiang toured Foxconn's Zhengzhou technology park in Henan, focusing on iPhone Duo production, iPhone 18 Pro rear-camera modules, anodizing for exterior midframes, and chip-level surface-sputtering manufacturing.

TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM

Charlene Chen — Wed, 14 Oct 2026 00:51:56 GMT

GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem. The US$2 billion, five-year agreement will expand advanced packaging capacity and support growing demand for artificial intelligence (AI) and high-performance computing (HPC) technologies.

Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects

Charlene Chen — Wed, 14 Oct 2026 00:51:39 GMT

As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy are driving an unprecedented hardware renaissance. Gelsinger recently joined a16z's latest interview program, where he discussed chip design, memory innovation, and optical interconnects with Raghu Raghuram and Guido Appenzeller.

Shield AI delivers first V-BAT drone to Taiwan Coast Guard

Lily Hess — Wed, 14 Oct 2026 00:51:16 GMT

US defense technology company Shield AI has delivered its first V-BAT vertical takeoff and landing unmanned aircraft to Taiwan's Coast Guard Administration after winning a contract. The company expects to deliver 12 aircraft in the coming months and will work with Taiwan's Aerospace Industrial Development Corporation (AIDC) to support logistics, maintenance, training, autonomous systems integration, deployment, and scaled operations in Taiwan.

Starlink moves from satellite overlay to mobile challenger as SpaceX builds hybrid network

DIGITIMES — Wed, 14 Oct 2026 00:50:59 GMT

From constellation-scale satellite deployment to terrestrial network expansion, SpaceX is deepening Starlink's reach across the connectivity stack. The latest moves suggest the company is no longer positioning direct-to-device (D2D) merely as a way to fill cellular dead zones, but as a foundation for a broader hybrid mobile network capable of competing more directly with US carriers.

AI memory boom pushes smartphone market into premium-first reset

DIGITIMES — Wed, 14 Oct 2026 00:49:54 GMT

While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory sector, where supply has tightened as vendors prioritize higher-margin AI workloads.

IonQ pushes beyond quantum computing as US$1.3 billion Elisity deal targets cyber defense

DIGITIMES — Wed, 14 Oct 2026 00:49:43 GMT

IonQ is extending its quantum ambitions beyond processors and networking into enterprise cybersecurity, agreeing to acquire zero-trust security provider Elisity in an all-stock transaction valued at up to US$1.3 billion.

PMIC vendors diverge as PC exposure drives revenue gap

Lily Hess — Wed, 14 Oct 2026 00:45:43 GMT

Taiwanese power management IC (PMIC) vendors reported their September and third-quarter 2026 revenue, with results diverging as PC exposure widened the performance gap. Global Mixed-mode Technology and Leadtrend posted both quarter-over-quarter and year-over-year growth in the third quarter, while Anpec Electronics and uPI Semiconductor reported declines from the previous quarter, amid weak PC supply-chain demand.

Huawei accelerates ASEAN data center hardware supply as Kunpeng chip exports surge

Yunnie Cheng — Wed, 14 Oct 2026 00:45:31 GMT

Leveraging Singapore as its regional hub, Huawei has expanded hardware deployments, such as servers, across data centers in the Association of Southeast Asian Nations (ASEAN) region. Following the US revocation of certain Intel chip export licenses to Huawei in 2024, the Chinese tech giant has aggressively adopted its proprietary Kunpeng chipsets, resulting in a dramatic increase in Kunpeng shipments to ASEAN data centers and telecom base stations, according to DIGITIMES Intelligence.

Smartphone costs surge as brands take divergent action

Charlene Chen — Wed, 14 Oct 2026 00:42:38 GMT

Memory prices have surged 4–5x in recent years, and smartphone brands' efforts to pass those costs on to consumers have already hurt sales of new devices in 2026. With large-scale AI deployments continuing to drive strong demand, the memory shortage is expected to persist, putting further pressure on smartphone prices in 2027.

Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand

Levi Li — Wed, 14 Oct 2026 00:42:21 GMT

Flexible printed circuit board (FPCB) manufacturer Complex Micro Interconnection (CMI) reported September 2026 revenue of NT$163 million (≈ US$5.1 million), down 15.43% year-on-year, bringing consolidated revenue for the first nine months to NT$1.718 billion, a decline of 7.52%. The company attributed the weaker September performance to memory and CPU shortages, which dampened customer orders for components used in commercial and consumer notebooks.

Linde LienHwa links HaaS ecosystem to drive industrial decarbonization

Charlene Chen — Wed, 14 Oct 2026 00:42:05 GMT

Industrial gas supplier Linde LienHwa is expanding its industrial decarbonization applications, with oxygen-enriched combustion technology adopted by Taiwan Cement, Walsin Lihwa, Jin Lian Cheng Resources, and LoToun Steel, among other major companies. The technology cuts exhaust volumes and improves combustion efficiency, increasing production capacity by more than 50% and reducing fuel consumption by up to 50%; the company is also joining partners across the logistics, transportation, and hydrogen industries to advance a hydrogen-as-a-service (HaaS) model.

Y.S. Tech reports liquid-cooling orders secured through early 2028

DIGITIMES — Wed, 14 Oct 2026 00:41:30 GMT

Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance computing (HPC) cooling businesses. The company reported consolidated revenue of NT$306 million (US$9.6 million) in September 2026, bringing revenue for the first three quarters to NT$3.162 billion.

India's Tessolve raises US$75 million from Vector Line Capital to fund chip-services acquisitions

DIGITIMES — Wed, 14 Oct 2026 00:41:09 GMT

Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions over the next couple of quarters, as the Hero Electronix company pushes deeper into designing AI and high-performance computing chips.

Amazon's Decart talks point to a broader push from custom silicon to world models

DIGITIMES — Wed, 14 Oct 2026 00:28:18 GMT

As custom AI silicon proliferates alongside growing demand for heterogeneous compute, the ability to move and optimize workloads across different accelerators is becoming an increasingly important capability for AI developers.

China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration

DIGITIMES — Wed, 14 Oct 2026 00:27:58 GMT

Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external magnetic field. The development offers a potential route towards integrating wireless energy-harvesting devices into conventional semiconductor manufacturing processes.

Engineering salaries deepen Taiwan's doctoral talent shortage

DIGITIMES — Tue, 13 Oct 2026 15:55:00 GMT

Taiwan's semiconductor and information and communications technology industries are drawing engineering graduates into high-paying jobs, intensifying a shortage of doctoral students and raising concerns about the country's basic research capacity. National Taiwan University (NTU) leadership and Taiwan's Ministry of Education highlighted the issue on October 12, saying universities and the government were expanding efforts to keep more research talent in academia.