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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>PSMC emerges as key link in Europe's push to bring AI chip research to market</title>
<pubDate>Fri, 3 Apr 2026 08:04:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260403VL201/europe-manufacturing-production-psmc-taiwan.html</link>
<description>&lt;p class="P1" data-start="196" data-end="468"&gt;Europe is stepping up semiconductor ties with Taiwan as it seeks to turn research strength into commercial production, with foundries such as Powerchip Semiconductor Manufacturing Corp. (PSMC) playing a growing role in bridging that gap as the artificial intelligence race intensifies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>PSMC, CEA-Leti strike multi-year deal to ease AI data, power bottlenecks</title>
<pubDate>Fri, 3 Apr 2026 08:03:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260403VL200/psmc-data-france-manufacturing-photonics.html</link>
<description>&lt;p class="P1" data-start="248" data-end="541"&gt;Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) and France's CEA-Leti have signed a multi-year agreement on April 3 aimed at easing one of artificial intelligence's most pressing constraints: rising power consumption and data-transfer bottlenecks inside data centers, executives said in an interview with &lt;em&gt;DIGITIMES Asia&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>2026 USTR Report: landmark 'ART' pact reshapes US-Taiwan trade landscape</title>
<pubDate>Fri, 3 Apr 2026 04:44:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL216/taiwan-2026.html</link>
<description>The Office of the United States Trade Representative (USTR) has designated Taiwan as a highly cooperative and pivotal trading partner in its 2026 National Trade Estimate (NTE) Report.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung Electro-Mechanics lifts FC-BGA prices on AI-driven shortage</title>
<pubDate>Fri, 3 Apr 2026 04:44:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL217/semco-fc-bga-high-end-demand-bga.html</link>
<description>Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA) substrates as demand from artificial intelligence (AI) servers and high-performance computing (HPC) applications continues to outpace supply, according to South Korean media reports and industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>US faces split Asia: allies build 'sovereignty walls' as digital tensions rise</title>
<pubDate>Fri, 3 Apr 2026 04:44:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL218/japan-singapore-south-korea-ai-security-2026.html</link>
<description>&lt;p class="P1" data-path-to-node="3"&gt;The 2026 National Trade Estimate (NTE) Report signals a new era of digital friction between the US and its closest Asian allies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>US-China trade tensions deepen as supply chains fracture despite tariff truce</title>
<pubDate>Fri, 3 Apr 2026 04:44:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL219/china-usa-rare-earth-exports-geopolitics-2026.html</link>
<description>&lt;p class="P1" data-start="85" data-end="402"&gt;The trade environment for US businesses operating in or trading with China deteriorated sharply between 2025 and 2026, according to a comparative analysis of the latest National Trade Estimate (NTE) Reports, underscoring a widening gap between high-level diplomacy and on-the-ground economic realities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>J-mex accelerates IMU motion capture tech to lower robot training costs</title>
<pubDate>Fri, 3 Apr 2026 04:43:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD215/robot-training-data-technology-nvidia.html</link>
<description>The current lack of real-world physical data for humanoid robots means they still require substantial training costs. Recognizing this business opportunity, J-Mex, which specializes in motion capture technology, has in recent years been actively entering the humanoid robot supply chain. It is now a partner in Nvidia's ecosystem and has recently announced a collaboration with Techman Robot to accelerate the deployment of physical AI.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan pushes ahead with AI and tech agenda even as budget deadlock threatens fiscal paralysis</title>
<pubDate>Fri, 3 Apr 2026 04:43:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD221/budget-taiwan-2027-2026-policy.html</link>
<description>Taiwan sits at a rare intersection of economic momentum and political gridlock. The island's economy expanded 8.68% in 2025, exports hit a record US$640.75 billion, and per capita GDP is closing in on the US$40,000 threshold &#38;mdash; largely on the back of booming global demand for AI chips and semiconductor capacity. Yet while Taiwan's technology industry is firing on all cylinders, its legislature remains deadlocked over the government's spending plan.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<title>Software-defined vehicles: Longevity vs. rapid tech change</title>
<pubDate>Fri, 3 Apr 2026 04:38:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD222/automotive-industry-hardware-chips-vehicle-automakers.html</link>
<description>In the era of software-defined vehicles (SDVs), the automotive industry faces a fundamental tension: while a car's mechanical structure can last 15 years or more, its digital computing and communication technologies evolve on a 3-to-5-year cycle.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Taiwan tackles CPO testing bottlenecks to scale SiPh for AI data centers</title>
<pubDate>Fri, 3 Apr 2026 04:37:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD231/siph-cpo-data-taiwan-demand.html</link>
<description>The surge in AI computing power is driving explosive demand for high-speed optical interconnects in data centers. Forecasts show that by 2026, over 50% of data center transceiver sales will come from silicon photonics (SiPh) modules, a sharp rise from 33% in 2024.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Memory stocks rattled by TurboQuant, but demand outlook holds</title>
<pubDate>Fri, 3 Apr 2026 04:37:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401VL220/google-demand-algorithm-data-hardware.html</link>
<description>Google Research's TurboQuant memory-compression algorithm has raised concerns that demand for AI-related memory could weaken, but South Korean experts and analysts say the market reaction may be overblown.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>LG Energy Solution reportedly adopts new battery method for Tesla</title>
<pubDate>Fri, 3 Apr 2026 04:37:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401VL221/lges-tesla-production-equipment-manufacturing.html</link>
<description>LG Energy Solution has introduced a new "double stack" manufacturing process for prismatic batteries to be supplied to Tesla, according to South Korea's &lt;em&gt;The Elec&lt;/em&gt;, as the battery maker expands US production for grid-scale energy storage.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: LG Energy Solution]]></media:description>
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<title>Benefits of CXL in server memory configuration</title>
<pubDate>Thu, 2 Apr 2026 09:50:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260323RS400/cxl-demand-2026-capacity-cost.html?chid=2</link>
<description>General-purpose server demand on the rise in 2026; continuous memory cost increases expected to drive CXL demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Servers</category>
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<title>Wiwynn taps optics chief to deepen CPO push for AI servers</title>
<pubDate>Thu, 2 Apr 2026 08:16:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD236/wiwynn-cpo-optics-ceo-chairman.html</link>
<description>&lt;p class="P1" data-start="147" data-end="385"&gt;Wiwynn has nominated LandMark Optoelectronics chairman and CEO Steven Chang to its 2026 board, reinforcing its push into co-packaged optics (CPO) and signaling deeper alignment with optical interconnect technologies for AI infrastructure.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>SpaceX files for IPO, setting stage for potential US$1.75 trillion valuation</title>
<pubDate>Thu, 2 Apr 2026 07:45:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL204/spacex-elon-musk-ipo-xai-starlink.html</link>
<description>Elon Musk's private rocket company SpaceX, which has fundamentally reshaped modern spaceflight, has confidentially filed for an initial public offering in the US, according to people familiar with the matter. The move could result in the largest stock market listing in history, with a potential valuation exceeding US$1.75 trillion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>IBM and Arm collaborate on dual&#38;#8209;architecture hardware to broaden enterprise AI deployment</title>
<pubDate>Thu, 2 Apr 2026 07:22:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL213/ibm-arm-ai-hardware-performance.html</link>
<description>IBM and Arm announced a collaboration to build dual&#38;#8209;architecture hardware aimed at running AI and data&#38;#8209;intensive workloads with more flexibility, reliability, and security, potentially affecting enterprise infrastructure worldwide by expanding software choice, easing workload portability, and influencing how organizations deploy mission&#38;#8209;critical applications across cloud and on&#38;#8209;premises environments in the near term.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Copper price surge drives quarterly lead frame price hikes</title>
<pubDate>Thu, 2 Apr 2026 07:20:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD228/price-packaging-copper-cwtc-2025.html</link>
<description>Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply, significantly raising raw material costs. At the same time, the inventory reduction cycle within the mature process semiconductor market is nearing completion, prompting customers to ramp up orders.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>South Korea reportedly advances GaAs localization with 95% yield on 4-inch process</title>
<pubDate>Thu, 2 Apr 2026 07:18:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401VL218/gaas-localization-manufacturing-production-design.html</link>
<description>South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to &lt;em&gt;ET News&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Precious metal surge drives price hikes for frequency components at TXC and Tai-Saw</title>
<pubDate>Thu, 2 Apr 2026 07:13:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD233/price-txc-tai-saw-component-demand.html</link>
<description>Rising global economic uncertainty has fueled safe-haven demand alongside strong industrial consumption, pushing precious metal prices higher. In response, Taiwan's leading quartz component maker TXC announced a 5&#38;ndash;10% price increase effective April 1, 2026. Tai-Saw Technology followed suit by raising prices on filters and other frequency parts, while other Taiwanese suppliers have begun negotiating with customers to reflect rising raw material costs, such as gold.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Samsung reportedly supplies Exynos modem chips to Fibocom for 5G module mass production</title>
<pubDate>Thu, 2 Apr 2026 07:11:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD229/samsung-exynos-fibocom-5g-modem.html</link>
<description>Samsung Electronics has supplied its Exynos modem chipset to Chinese wireless module maker Fibocom, marking a notable expansion of its system semiconductor business into external clients, according to&lt;em&gt; inews24&lt;/em&gt; and &lt;em&gt;Greened&lt;/em&gt;.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Taiwan car market shows structural shifts, with Tesla deliveries surging</title>
<pubDate>Thu, 2 Apr 2026 07:11:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD209/taiwan-market-tesla-2026-sales.html</link>
<description>Taiwan's auto market showed strong momentum in March 2026, with total vehicle registrations reaching 39,318 units &#38;mdash; a sharp 78.4% jump from February &#38;mdash; signaling a broad post-Lunar New Year rebound in consumer demand. That explosive monthly growth, alongside first-quarter 2026 totals, highlights significant structural shifts underway.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Electric Vehicles</category>
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<title>South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn</title>
<pubDate>Thu, 2 Apr 2026 07:02:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL205/exports-demand-shipments-2026-logistics.html</link>
<description>South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East conflict disrupted logistics and energy flows. According to the Ministry of Trade, Industry and Energy (MOTIE), the figure was up 48.3% year on year, extending a 10-month run of record monthly exports and lifting the country's trade surplus to US$25.7 billion &#38;mdash; its 14th straight month in the black.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Asia Fund Managers]]></media:description>
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<title>Intel expands SambaNova stake, governance questions surface</title>
<pubDate>Thu, 2 Apr 2026 06:59:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD231/intel-ai-chip-startup-investment-governance.html</link>
<description>&lt;p class="P1" data-start="1314" data-end="1651"&gt;Intel plans to invest a further US$15 million in AI chip startup SambaNova Systems, lifting its stake to about 9% pending regulatory approval, according to &lt;em&gt;Reuters&lt;/em&gt;. The move follows a US$35 million investment in February that raised Intel's ownership to 8.2% from 6.8% a year earlier and formalised a strategic collaboration between the two.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance</title>
<pubDate>Thu, 2 Apr 2026 06:00:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD227/asahi-kasei-ai-chip-fiberglass-cloth-materials-expansion-nittobo.html</link>
<description>Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Samsung ramps Texas fab as engineers gather for 2nm push</title>
<pubDate>Thu, 2 Apr 2026 05:52:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL212/samsung-2nm-equipment-texas-fab-production.html</link>
<description>&lt;p class="P1" data-start="1037" data-end="1414"&gt;Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning from construction to operational setup for 2nm production. More than 3,000 engineers from Samsung and global equipment suppliers have begun gathering at the site, according to &lt;em&gt;ET News&lt;/em&gt;, signaling the start of large-scale ramp-up activities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory</title>
<pubDate>Thu, 2 Apr 2026 04:39:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD235/france-government-prologium-policy-taiwan.html</link>
<description>The French government will provide about EUR1.5 billion (US$1.7 billion) in subsidies to support Taiwanese startup ProLogium Technology's new factory construction in France. According to &lt;em&gt;Nikkei&lt;/em&gt;, this move signals France's accelerated efforts to attract electric vehicle (EV) battery manufacturers and marks a shift from its previous "self-reliance" industrial policy focused on EU-based companies.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Topco maintains stable shipments despite Middle East conflict, builds safety stock as AI demand accelerates</title>
<pubDate>Thu, 2 Apr 2026 04:34:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD223/topco-demand-production-middle-east-2026-shipments.html</link>
<description>As the US-Iran conflict enters its second month, concerns are mounting over potential disruptions to global energy supplies and petrochemical feedstocks. Against this backdrop, Jeffery C.L. Pan, chairman of Taiwan's Topco Scientific, stated that the company's operations remain stable, with shipments unaffected to date and upstream cost pressures largely contained.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Semiconductors</category>
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<title>TCL acquires majority stake in Sony's home entertainment business in a strategic global JV</title>
<pubDate>Thu, 2 Apr 2026 04:19:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401VL209/sony-tcl-business-partnership-joint-venture.html</link>
<description>Sony Corporation and TCL Electronics Holdings Ltd. have finalized agreements to form a strategic partnership in the global home entertainment sector, with TCL acquiring a 51% stake and Sony retaining 49%. The joint venture will operate worldwide, managing product development, design, manufacturing, sales, logistics, and customer service for televisions and home audio equipment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Ajinomoto faces stakeholder pressure to raise ABF prices</title>
<pubDate>Thu, 2 Apr 2026 04:18:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401VL208/bloomberg-price-packaging-business-infrastructure.html</link>
<description>UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor interlayer insulating material. This material is marketed under the name Ajinomoto Build-up Film (ABF).</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Up Young targets double-digit revenue growth in 2026 through business and brand expansion</title>
<pubDate>Thu, 2 Apr 2026 04:16:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD210/2026-commercial-revenue-expansion-growth.html</link>
<description>Taiwan-based air conditioner and commercial laundry machine distributor Up Young Cornerstone plans to focus its 2026 operations on two core strategies: group upgrades, and the development of brands and channels. The company aims to deepen its existing air conditioning and commercial laundry businesses while further integrating agency and proprietary brand resources, advancing toward a diversified business model that supports a target of double-digit revenue growth for the year.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Sustainability</category>
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<title>Nvidia invests US$2 billion in Marvell to integrate NVLink Fusion with ASICs</title>
<pubDate>Thu, 2 Apr 2026 04:02:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD222/nvidia-marvell-investment-asic-technology.html</link>
<description>On March 31, Nvidia announced a US$2 billion investment in Marvell and plans to further integrate its NVLink Fusion technology with Marvell's XPU services for customer use. Although Nvidia revealed partnerships with several ASIC service providers around NVLink Fusion technology earlier in 2025, this direct investment signals a closer collaboration between Nvidia and Marvell. The move raises questions about how the two companies will expand their presence in the cloud AI market and whether ASIC customers will embrace this integrated solution.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Marvell]]></media:description>
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<title>Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM</title>
<pubDate>Thu, 2 Apr 2026 03:55:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402VL209/samsung-sk-hynix-hbm-hybrid-bonding-inspection.html</link>
<description>&lt;p class="P1" data-start="628" data-end="882"&gt;Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory (HBM), as the two memory makers move to secure key packaging technologies for AI-driven demand, according to&lt;em&gt; The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Applied Materialsˇ¦ Kinex hybrid bonding system, developed with BE Semiconductor Industries. Credit: Applied Materials]]></media:description>
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<title>TSMC's US expansion held ransom as JASM takes flight</title>
<pubDate>Thu, 2 Apr 2026 03:53:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD236/tsmc-investment-jasm-chairman-taiwan.html</link>
<description>TSMC is winning quietly in Japan and losing loudly in Washington &#38;mdash; and the reason may have nothing to do with chips.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC Chairman C.C. Wei (R). Credit: DIGITIMES]]></media:description>
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<title>Mobile chip inventory correction weighs on OSAT supply chain</title>
<pubDate>Thu, 2 Apr 2026 03:49:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260402PD221/inventory-osat-supply-chain-smartphone-demand.html</link>
<description>As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this demand correction has cascaded from IC design down to foundry, packaging, and testing &#38;mdash; expected to significantly dampen order growth for Taiwanese OSAT players such as ASE, SPIL, and KYEC heading into the consumer peak season.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
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<title>Samsung raises prices on select 2025 flagship smartphones as chipflation and currency bite</title>
<pubDate>Thu, 2 Apr 2026 03:48:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260401PD237/samsung-2025-galaxy-price-component.html</link>
<description>Samsung Electronics is planning to increase the prices of certain smartphone models released in 2025, marking a rare move amid rising global chip prices and fluctuating exchange rates, which are driving up key component costs.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Communications</category>
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