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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Leadsun Greentech enters EV charging with three DC fast-charging sites</title>
<pubDate>Mon, 12 Oct 2026 06:43:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD228/vehicle-taiwan-electricity-demand-equipment.html</link>
<description>Leadsun Greentech has entered Taiwan's electric vehicle charging market by acquiring equipment at three supercharging sites in Hsinchu, Taichung and Yunlin, expanding its renewable energy business into end-user charging services. The sites, which have begun operations, provide a combined 24 charging guns, as growing battery electric vehicle adoption increases demand for DC fast-charging infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Samsung could unseat SK Hynix as HBM leader in 2027</title>
<pubDate>Mon, 12 Oct 2026 06:31:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL220/samsung-sk-hynix-hbm-hbm4-2027.html</link>
<description>Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited DRAM production capacity, according to forecasts presented at an October 6 semiconductor industry forum in Seoul.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Cook makes first post-CEO visit to China, lauds Guangdong's role in Apple supply chain</title>
<pubDate>Mon, 12 Oct 2026 05:53:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL219/tim-cook-guangdong-apple-iphone-supply-chain.html</link>
<description>Apple Executive Chairman Tim Cook made his first visit to China since stepping down as Apple CEO. He visited Guangdong Province, a manufacturing hub that contains much of the iPhone maker's supply chain ecosystem as it rolls out the iPhone 18 Pro series and its first foldable smartphones.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Taiwan exports soar as shipments to the US top US$200 billion in first nine months</title>
<pubDate>Mon, 12 Oct 2026 04:37:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD254/taiwan-exports-usa-growth-2026.html</link>
<description>Taiwan's exports hit a single-month record high of US$87.22 billion in September 2026, lifting the year-to-date total for the first nine months of the year to US$661.55 billion, according to customs import and export statistics released by Taiwan's Ministry of Finance (MOF) on October 8. Exports to the US totaled US$207.78 billion in the first nine months, a level the ministry called "unprecedented."</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>Audi's defense pivot mirrors Taiwan supply chain's AI shift</title>
<pubDate>Mon, 12 Oct 2026 04:29:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD214/audi-automotive-taiwan-supply-chain-talent-data.html</link>
<description>German automaker Audi has launched a flexible workforce program allowing employees to voluntarily transfer to aerospace and defense companies such as Airbus, with Audi reporting strong employee interest. The move reflects how automotive talent is breaking through industry boundaries and echoes Taiwan's supply chain transformation from computers, communications, and consumer electronics (3C) to automotive applications and now AI data centers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Taiwan semiconductor industry eyes landmark geothermal power deal exceeding 20MW</title>
<pubDate>Mon, 12 Oct 2026 04:26:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD211/geothermal-taiwan-electricity-development-market.html</link>
<description>Taiwan's geothermal energy market could be approaching a major breakthrough as the semiconductor industry seeks new sources of reliable renewable electricity amid surging AI-driven power demand.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<title>Apple's iPhone 18 order cuts expose widening divide in premium demand</title>
<pubDate>Mon, 12 Oct 2026 04:21:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL210/apple-iphone-demand-launch-component.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;Apple's iPhone 18 Pro lineup is showing mixed demand signals weeks after launch. Reports of component order cuts suggest weaker-than-expected sales, while Chinese supply-chain sources point to stronger demand for the pricier Pro Max and foldable iPhone Duo. The divergence highlights growing pressure on Apple's premium strategy as rising memory costs drive smartphone prices higher.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Taiwan's UMT extends 50%-plus revenue growth streak as LEO satellite deployments accelerate</title>
<pubDate>Mon, 12 Oct 2026 04:21:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD213/umt-revenue-growth-leo-2026.html</link>
<description>Taiwan-based Universal Microwave Technology (UMT) reported September 2026 revenue of NT$292 million (US$9.15 million), up 52.49% year-over-year, extending its streak of monthly year-over-year revenue growth exceeding 50% to six consecutive months. The performance underscores sustained demand for millimeter-wave communications components as global low-Earth orbit (LEO) satellite operators accelerate constellation deployments and capacity expansion.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Aerospace</category>
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<title>AI racks approach megawatt power levels as SiC, GaN, silicon divide power delivery roles</title>
<pubDate>Mon, 12 Oct 2026 04:15:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD210/gan-sic-silicon-expansion-infrastructure.html</link>
<description>The rapid expansion of AI infrastructure is driving demand for higher power and voltage levels, pushing power semiconductor development toward greater efficiency, higher power density, and tighter integration.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Shihmin Fu]]></media:description>
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<title>ELAN Microelectrics's 3Q26 PC momentum stalls on shortages, inventory overhang</title>
<pubDate>Mon, 12 Oct 2026 04:04:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD206/ic-inventory-pc-2026-revenue.html</link>
<description>Touch IC leader Elan Microelectronics recently announced its September 2026 consolidated revenue of NT$602 million (approx. US$18.9 million), down 18.74% month-over-month and 46.9% year-over-year. Third-quarter revenue slid 30.7% quarter-over-quarter to NT$2.221 billion (US$69.6 million), down 33.0% year-over-year, marking a sharp decline during what is traditionally a peak season.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?</title>
<pubDate>Mon, 12 Oct 2026 03:59:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD209/rapidus-government-tsmc-funding-alliance.html</link>
<description>Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys, on October 5. The partnership aims to expand its potential customer base by helping companies develop custom chips.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>India's festive smartphone sales may slow as memory costs lift prices</title>
<pubDate>Mon, 12 Oct 2026 03:53:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PR200/smartphone-sales-market-financing-competition.html</link>
<description>India's key festive smartphone season is set to matter far beyond its borders, as higher memory costs reshape pricing, buying habits, and brand competition in a major emerging market. Counterpoint Research expects unit sales to fall, even as market value rises, highlighting a global shift toward pricier, more selective device upgrades.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>SK Hynix's US$299 billion chip plan faces military base hurdle</title>
<pubDate>Mon, 12 Oct 2026 03:53:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL212/sk-hynix-expansion-manufacturing-development.html</link>
<description>SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production capacity: the planned manufacturing site includes military facilities used by US forces, complicating construction timelines as competition intensifies with Micron Technology and Chinese chipmakers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Group Chairman Chey Tae-won visits the Gwangju semiconductor site on October 9, 2026. Credit: Jeonnam-Gwangju Metropolitan Government]]></media:description>
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<title>AI's next hiring wave is shifting from model makers to onsite problem solvers</title>
<pubDate>Mon, 12 Oct 2026 03:48:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD208/technology-business-data-2026.html</link>
<description>Global technology companies and South Korean system integrators are widening their artificial intelligence hiring beyond model researchers to frontline engineers who work inside customer operations. The shift reflects a growing view that AI only creates value when it is adapted to real workflows, integrated with existing systems, and tied to measurable business outcomes.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang</title>
<pubDate>Mon, 12 Oct 2026 03:37:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL202/materials-plant-subsidiary-investment-packaging.html</link>
<description>PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial Park 3 (BKIP3) in Penang, Malaysia, and plans to create more than 1,000 jobs. Penang Chief Minister Kon Yeow Chow announced the investment on October 7, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: Largan plays defense in phones, presses CPO offensive</title>
<pubDate>Mon, 12 Oct 2026 03:27:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD219/smartphone-cpo-ceo-2027-production.html</link>
<description>Largan chairman Adam Lin spoke about the company's cautious smartphone outlook while taking a more aggressive stance on co-packaged optics (CPO) during a recent online earnings briefing. His comments on order trends, gross margins, and 2026 visibility highlight three simultaneous pressures facing the smartphone camera-lens industry.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
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<title>Taiwan manufacturers to showcase AI data center hardware at OCP summit in San Jose</title>
<pubDate>Mon, 12 Oct 2026 03:17:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD220/hardware-data-center-data-liquid-cooling-infrastructure.html</link>
<description>The Open Compute Project (OCP) Global Summit 2026 will be held in San Jose, the US, from October 12 to 15, drawing several Taiwan-based manufacturers planning to present hardware for next-generation AI data centers.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Samsung, SK Hynix accept ASML's 10% price hike in parts, report says</title>
<pubDate>Mon, 12 Oct 2026 03:12:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL211/samsung-sk-hynix-asml-equipment-revenue.html</link>
<description>Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries starting in January 2027, &lt;em&gt;The Elec&lt;/em&gt; reported on October 11, citing industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ASML]]></media:description>
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<title>Nvidia, Reflection AI, the strategic pivot to open-weight ecosystems</title>
<pubDate>Mon, 12 Oct 2026 03:10:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL213/nvidia-investment-performance.html</link>
<description>The&lt;em&gt; Financial Times&lt;/em&gt; recently reported that Nvidia is in early-stage talks to acquire or significantly deepen its investment in the US$25 billion open-weight AI startup Reflection AI. To dodge lengthy antitrust regulatory reviews, Nvidia is considering an "acqui-hire" framework to bring on key staff and license technology while expanding its strategic position in open-weight models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential</title>
<pubDate>Mon, 12 Oct 2026 03:06:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD204/tsmc-asml-high-na-euv-12-inch-manufacturing.html</link>
<description>Advanced semiconductor manufacturing is progressing toward 2nm and angstrom-era nodes (&#38;Aring;; where 1 nm equals 10 &#38;Aring;), bringing high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into focus.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[ASML, TSMC target 12-inch High-NA EUV photomask trials in 2031 and equipment deployment in 2033. Credit: DIGITIMES]]></media:description>
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<title>LG Display unveils maskless OLED technology, targeting more efficient IT displays</title>
<pubDate>Mon, 12 Oct 2026 03:05:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL209/lg-display-technology-manufacturing-display-production.html</link>
<description>LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing costs as it prepares to expand into the information technology display market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Lumentum says AI laser capacity is sold out into 2029 as hyperscalers help fund expansion</title>
<pubDate>Mon, 12 Oct 2026 02:48:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL201/capacity-laser-inp-data-center-2028.html</link>
<description>The shortage of indium phosphide (InP) lasers that feed AI data center optics is lengthening, not easing. Lumentum now says its capacity is spoken for into early 2029, and its largest customers are starting to share the financial risk of building more. The shift points to a bottleneck in AI networking at a handful of laser chipmakers, whose new capacity takes years to bring online.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity</title>
<pubDate>Mon, 12 Oct 2026 02:33:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD205/testing-communications-sigurd-demand-winstek.html</link>
<description>Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising for co-packaged optics (CPO) and related transition technologies, with more profitable optical testing expected to help double optical communications revenue by 2027.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Former iPhone display plant in Japan reportedly to enter AI chip supply chain</title>
<pubDate>Mon, 12 Oct 2026 02:19:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL206/iphone-display-supply-chain-ai-chip-plant.html</link>
<description>A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production base for semiconductor package substrates used in artificial intelligence (AI) applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Commentary: Could a 65% US-content rule redraw China's 3.2T optical supply chain?</title>
<pubDate>Mon, 12 Oct 2026 02:16:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD207/supply-chain-data-manufacturing-capacity-component.html</link>
<description>AI data centers are shifting toward faster networking architectures, with optical transceivers advancing from 800G and 1.6T toward 3.2T. Yet China's ability to retain its position in the global AI data center supply chain may increasingly depend on more than technology and manufacturing capacity. Potential US supply-chain restrictions are emerging as another critical variable.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012PD207/supply-chain-data-manufacturing-capacity-component.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012pd207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[A potential 65% US-content rule could restrict Chinese CPO manufacturersˇ¦ component sourcing. Photo by DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Kawasaki Heavy Industries bets JPY550 billion on physical AI, robotics</title>
<pubDate>Mon, 12 Oct 2026 02:09:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD202/kawasaki-robotics-physical-ai-robot-industrial.html</link>
<description>Kawasaki Heavy Industries is betting on physical AI as part of a multibillion-dollar growth plan to modernize factories, address labor shortages, and expand robotics across shipbuilding, aerospace, and healthcare. The move signals how one of Japan's major industrial groups plans to compete in a global market where automation is increasingly central to productivity, resilience, and long-term growth.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012PD202/kawasaki-robotics-physical-ai-robot-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012pd202_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Kawasaki Heavy]]></media:description>
</media:content></item>
<item>
<title>CyberTAN enters 1.6T AI switch race with Marvell-backed platform</title>
<pubDate>Mon, 12 Oct 2026 02:07:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD203/switch-cybertan-data-center-marvell-demand.html</link>
<description>CyberTAN Technology is moving into the fast-growing AI data center switch market, joining Marvell Technology on a new 3nm Pallas 1.6T platform. The effort underscores rising global demand for high-speed networking, while tight chip supply and cooling demands remain key hurdles for operators and customers worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012PD203/switch-cybertan-data-center-marvell-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012pd203_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Mistral unveils ML4 open-weight model, touts edge over Chinese rivals</title>
<pubDate>Mon, 12 Oct 2026 02:02:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD201/startup-anthropic-performance-2026-openai.html</link>
<description>French AI startup Mistral has launched a public preview of Mistral Large 4 (ML4), a 1-trillion-parameter AI model whose weights are scheduled for public release in late October 2026, saying its performance can rival some Chinese open-weight models.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012PD201/startup-anthropic-performance-2026-openai.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012pd201_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>CXMT targets 2026 debut of 4F&#38;sup2; DDR5 RDIMM in bid to challenge server DRAM rivals</title>
<pubDate>Mon, 12 Oct 2026 01:59:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL204/cxmt-dram-ddr5-2026-manufacturing.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F&#38;sup2; DRAM architecture by the end of 2026, advancing its efforts to increase memory density and compete in the higher-value server market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012VL204/cxmt-dram-ddr5-2026-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012vl204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[CXMT president Mark Cao. Credit: Chinastarmarket.cn]]></media:description>
</media:content></item>
<item>
<title>MediaTek flagship AP share to surpass Samsung as TSMC boosts Dimensity</title>
<pubDate>Mon, 12 Oct 2026 01:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012PD200/market-ap-samsung-mediatek-global-smartphone.html</link>
<description>As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into the flagship market, putting greater pressure on Samsung Electronics, which is promoting 2-nanometer Exynos chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012PD200/market-ap-samsung-mediatek-global-smartphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012pd200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: MediaTek]]></media:description>
</media:content></item>
<item>
<title>Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation</title>
<pubDate>Mon, 12 Oct 2026 01:46:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL200/2026-samsung-intel-tsmc-pcb.html</link>
<description>This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces manufacturing, packaging, printed circuit board (PCB) yield, partnership, and governance questions, while Intel remains involved and TSMC's role may be limited. Samsung reportedly advances HBM4E high-bandwidth memory validation and glass interposer testing. Vicor expands patent litigation over AI server power systems. Taiwan restricts China-made fiberglass sleeves, and China's new five-year plan prioritizes advanced PCBs, materials, equipment, and domestic investment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012VL200/2026-samsung-intel-tsmc-pcb.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012vl200_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Booked before launch, Tata's Dholera fab faces test of turning commitments into wafer volume</title>
<pubDate>Mon, 12 Oct 2026 01:45:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261011VL201/fab-wafer-production-capacity-demand.html</link>
<description>Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding offtake commitments, as the company works to secure demand well before production begins.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261011VL201/fab-wafer-production-capacity-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261011vl201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: PEXELS.]]></media:description>
</media:content></item>
<item>
<title>Asian AI server suppliers play down impact of US patent probe</title>
<pubDate>Mon, 12 Oct 2026 01:41:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261012VL203/ai-server-patent-foxconn-hardware-2026.html</link>
<description>The US International Trade Commission's (USITC) decision on October 9 to investigate 20 suppliers of AI server power systems, most of them Taiwanese or Chinese companies and their affiliates, adds a patent front to a series of US measures in 2026 that reward companies for building AI hardware in America and raise the cost of shipping it in from Asia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261012VL203/ai-server-patent-foxconn-hardware-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261012vl203_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan GDP growth hits 11% as government plan for AI dividend advances</title>
<pubDate>Mon, 12 Oct 2026 01:34:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261010PD200/taiwan-gdp-growth-government-dividend.html</link>
<description>Taiwan's gross domestic product (GDP) growth is projected to reach 11.05% in 2026, a 39-year high, driven by its technological advantage in artificial intelligence (AI), semiconductors, and high-performance computing (HPC), and boosting government tax revenue. Consequently, Taiwan's Executive Yuan outlined plans on October 8 to distribute NT$10,000 (approx. US$313) in cash handouts to the public via an "AI dividend" with the first recipients potentially receiving payments as early as January 26, 2027, before the Lunar New Year, subject to budget approval.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261010PD200/taiwan-gdp-growth-government-dividend.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261010pd200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Executive Yuan]]></media:description>
</media:content></item>
<item>
<title>Memory wall reshapes chip performance as large-capacity SRAM becomes a focal point in autonomous driving SoC design</title>
<pubDate>Mon, 12 Oct 2026 01:30:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD246/autonomous-driving-sram-digitimes-design-performance.html</link>
<description>DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role of memory vendors into co-design partners for integrated circuit (IC) design. To address this challenge, Micron, a global memory leader, said that increasing bandwidth, expanding capacity, and enhancing cooling will be the three pillars supporting high-performance AI computing, while advanced packaging will be the key method for enabling IC manufacturing to break through physical limits.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD246/autonomous-driving-sram-digitimes-design-performance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd246_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>India roundup: AI data center buildout accelerates as semiconductor push continues to broaden</title>
<pubDate>Sun, 11 Oct 2026 23:45:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008VL217/ai-data-center-infrastructure-ip-packaging.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing alongside data center expansion, high-density computing, optical connectivity and GPU deployments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008VL217/ai-data-center-infrastructure-ip-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008vl217_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Largan shifts new plant to FAU production as smartphone orders soften</title>
<pubDate>Sun, 11 Oct 2026 23:44:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD251/smartphone-production-plant-demand-2027.html</link>
<description>Largan Technology said on October 8 that demand for new smartphone models weakened in September and that its newly completed automated plant will be used entirely for fiber array units, or FAUs, for co-packaged optics applications. The optical lens maker said the move comes as customers are asking it to deliver the finished FAU product directly.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD251/smartphone-production-plant-demand-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd251_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI doubles Aker differential oscillator mix; 312.5MHz sample set for 4Q26</title>
<pubDate>Sun, 11 Oct 2026 23:44:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD247/2026-automotive-revenue-vehicle-demand.html</link>
<description>Aker Technology said AI and electric vehicle demand are driving faster shipments, with automotive products accounting for 51.88% of sales in the first half of 2026. The quartz component maker also said its 312.5MHz product is scheduled to sample in the fourth quarter of 2026.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD247/2026-automotive-revenue-vehicle-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd247_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Episil chairman says SiC is not yet shifting from 6-inch to 8-inch</title>
<pubDate>Sun, 11 Oct 2026 23:44:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD244/episil-sic-6-inch-capacity-2026.html</link>
<description>Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand keeps rising in 2027, the company will add capacity through 8-inch production. That has raised questions over whether the industry is entering a new wafer-size transition and whether 6-inch wafers are being phased out.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD244/episil-sic-6-inch-capacity-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd244_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>MAtek September 2026 revenue hits record for 7th straight month</title>
<pubDate>Sun, 11 Oct 2026 23:43:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD243/semiconductors-testing-revenue-demand-2026.html</link>
<description>MAtek, a leading semiconductor testing company, reported September 2026 revenue of NT$569 million (approx. US$17.8 million), up 12.31% year-over-year. Revenue for the first nine months reached NT$4.765 billion, rising 16.99% year-over-year, while third-quarter revenue climbed 16.14% year-over-year to NT$1.697 billion, a record for the period.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD243/semiconductors-testing-revenue-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd243_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Baso Optical eyes steady performance in 2027 with focus on high-margin AOI, semiconductor, aerospace applications</title>
<pubDate>Sun, 11 Oct 2026 23:43:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD242/baso-precision-optics-online-aoi-earnings-2027.html</link>
<description>Baso Precision Optics held its latest online earnings call on October 7, during which the company acknowledged short-term pressures on its gross margin, due to ongoing adjustments to its product mix, resulting in higher upfront costs and initial production yields that could still see improvement. Looking ahead to 2027, the company expects generally stable revenue and gross margin, with potential for additional growth depending on the validation of new products or pilot production breakthroughs in the semiconductor and automated optical inspection (AOI) segments.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD242/baso-precision-optics-online-aoi-earnings-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd242_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Neweb Information lifts 2Q26 net profit 118% on IT upgrade demand</title>
<pubDate>Sun, 11 Oct 2026 23:42:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD241/profit-revenue-demand-2026-cybersecurity.html</link>
<description>System integration provider Neweb Information, which is set to list on October 23, reported September 2026 revenue of NT$77.02 million (approx. US$2.41 million), up 33.48% year-over-year, as demand rose for enterprise core system replacements, network and cybersecurity upgrades, and AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD241/profit-revenue-demand-2026-cybersecurity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd241_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>ICT inflation impact limited as supply shock falls short</title>
<pubDate>Sun, 11 Oct 2026 23:42:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD237/electronic-components-inflation-taiwan-copper-foil-2026.html</link>
<description>Prices for electronic components such as memory, advanced copper foil, glass fiber cloth, and ABF substrates have been rising for some time as makers pass on costs amid tight supply. For the US, even if Apple raises retail prices for its core products, the impact on the Consumer Price Index (CPI) is limited and the supply-side shock has been less severe than expected.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD237/electronic-components-inflation-taiwan-copper-foil-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd237_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>DIGITIMES Insight: Why AI is shifting telecom traffic to the uplink</title>
<pubDate>Sun, 11 Oct 2026 23:41:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD234/telecom-ericsson-growth-2030-mobile.html</link>
<description>AI is changing the logic of telecom traffic growth, with Ericsson and industry researchers warning that mobile networks must now handle not only more data, but also more uplink traffic, real-time interaction, and connected-on-the-move usage. As generative AI, agentic AI, and multimodal interactions spread, telecom operators are being pushed to rethink network investment beyond downlink capacity.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD234/telecom-ericsson-growth-2030-mobile.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd234_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Winmate rolls out rugged edge AI platform for drones, robotics</title>
<pubDate>Sun, 11 Oct 2026 23:41:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD230/2026-revenue-robotics-demand-semiconductors.html</link>
<description>Winmate posted September 2026 revenue of NT$535 million (approx. US$16.8 million), up 31.8% month-on-month and 95.9% year-on-year, driven by strong end-market demand in defense, semiconductors, and edge AI. The industrial PC maker said robust orders in those segments are powering sales growth and expects overall operations to hit another record in 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD230/2026-revenue-robotics-demand-semiconductors.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd230_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nanya Plastics deepens push into power engineering as AI infrastructure demand rises</title>
<pubDate>Sun, 11 Oct 2026 23:40:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261008PD217/infrastructure-demand-taiwan-equipment-design.html</link>
<description>Nanya Plastics Corporation is expanding into heavy electrical equipment and power engineering, a move that could ripple beyond Taiwan as global demand for AI data centers, grid upgrades, and energy transition projects rises. The company's strategy signals growing competition in a sector increasingly critical to digital infrastructure worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261008PD217/infrastructure-demand-taiwan-equipment-design.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261008pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Vicor widens AI server power patent fight, seeking new US import ban on Foxconn, Quanta and Delta</title>
<pubDate>Sun, 11 Oct 2026 07:37:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261011VL200/ai-server-foxconn-quanta-ban-hardware.html</link>
<description>Vicor Corporation is trying for the second time this year to get AI server power hardware from Taiwan's largest server makers barred from the US. It has won such a ban before.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261011VL200/ai-server-foxconn-quanta-ban-hardware.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261011vl200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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