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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Taiwan carbon fee joins UK CBAM qualifying list</title>
<pubDate>Tue, 1 Sep 2026 08:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD233/taiwan-uk-carbon-pricing-government-price.html</link>
<description>Taiwan's carbon fee has been formally included in the UK government's list of Qualifying Carbon Pricing Schemes (QCPS) under its Carbon Border Adjustment Mechanism (CBAM), alongside major carbon pricing systems in the EU, Japan, South Korea and Singapore. The Ministry of Environment said the move shows Taiwan's carbon pricing framework is now aligned with international systems and will help export industries respond to global carbon border measures while maintaining competitiveness.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge</title>
<pubDate>Tue, 1 Sep 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD209/taiwan-aidc-cooling-data-center-demand.html</link>
<description>Taiwan's limited land and heavy dependence on imported energy have made power a scarce and strategic resource in the compute era, putting AI data center (AIDC) site selection on the radar of industry and government. Taoyuan's Department of Economic Development chief Chang Cheng said on August 31 that the city is positioning itself as a northern AIDC demonstration base, with Tatan Power Plant and CPC Corp.'s Third Liquefied Natural Gas Receiving Terminal serving as key advantages.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SK Hynix touts up to 5.15x inference gains with custom HBM</title>
<pubDate>Tue, 1 Sep 2026 08:53:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL220/sk-hynix-hbm-capacity-performance-ai-agent-semicon-taiwan.html</link>
<description>&lt;p class="P1" data-start="401" data-end="695"&gt;SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions in the base die could improve large language model inference performance by up to 5.15 times as data movement becomes a growing constraint on computing performance.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix Senior Vice President and Fellow Hoshik Kim presents the company's custom HBM concept at SEMICON Taiwan 2026. Credit: Sherri Wang]]></media:description>
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<title>Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain</title>
<pubDate>Tue, 1 Sep 2026 08:18:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL218/samsung-production-performance-2027-hbm.html</link>
<description>Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as the memory giant broadens its portfolio beyond HBM.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung showcased its LPDDR5X-PIM performance at SEMICON Taiwan 2026. Credit: Sherri Wang]]></media:description>
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<title>Safety rewired: AI, robots on the front line at K-Safety Expo 2026</title>
<pubDate>Tue, 1 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL221/expo-fire-2026-technology-policy.html</link>
<description>Hard hats and fire extinguishers will certainly have their place at K-Safety Expo 2026, but visitors arriving at BEXCO in Busan from September 2&#38;ndash;4 may find that the modern safety industry increasingly speaks the language of AI, robots, sensors and connected infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Autonomous driving expands into Physical AI, creating new openings for Taiwan firms</title>
<pubDate>Tue, 1 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD223/autonomous-driving-taiwan-vehicle-otobrite-technology.html</link>
<description>The autonomous driving industry is gaining momentum as advances in AI, sensing and semiconductor technologies expand opportunities in vehicle computing, machine vision and Physical AI. At Taiwan-based Turing Drive's eighth-anniversary press event, longtime partners Vecow and oToBrite shared their perspectives on the evolution of autonomous vehicles, in-vehicle computing and robotics.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains</title>
<pubDate>Tue, 1 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL217/materials-taiwan-demand-tsmc-capacity.html</link>
<description>Japanese semiconductor materials suppliers Ajinomoto and Daikin Industries are expanding their presence in Taiwan as the AI boom fuels demand for advanced chip materials and encourages closer cooperation between suppliers and manufacturers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing</title>
<pubDate>Tue, 1 Sep 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD241/skytech-tsmc-equipment-taiwan-development.html</link>
<description>Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic semiconductor equipment supply chain.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC R&#38;D VP Simon Jang (6th from left), with Skytech founder Carl Luo, chairman Paul Huang, CEO George Yi (4th, 5th, 8th from left). Credit: Skytech]]></media:description>
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<title>Imec CEO: AI era pushes broader ties between chip, model and CSP players</title>
<pubDate>Tue, 1 Sep 2026 07:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD236/ceo-taiwan-ic-design-2026-materials.html</link>
<description>Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond IC design firms to include model developers and cloud service providers as AI reshapes how computing systems are built and connected. Vandenameele said Imec is well positioned because what is happening in AI aligns with the organization's core mission, but its role has also changed significantly.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI server demand lifts Japanese capacitor shipments by 22% in first half of 2026</title>
<pubDate>Tue, 1 Sep 2026 07:40:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD227/shipments-2026-component-demand-ai-server.html</link>
<description>Japanese electronic component shipments rose in the first half of 2026 as demand from AI servers drove strong growth in capacitors and other parts. According to &lt;em&gt;Nikkei&lt;/em&gt; and &lt;em&gt;Dempa&lt;/em&gt;, the Japan Electronics and Information Technology Industries Association (JEITA) said on August 31 that global shipments by about 50 member companies increased 4% from a year earlier to JPY2.2865 trillion (US$15.45 billion) in the first six months of 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>ASE CEO describes AI resource squeeze as a short-term problem</title>
<pubDate>Tue, 1 Sep 2026 07:02:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD239/taiwan-ase-ceo-growth-talent.html</link>
<description>AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology CEO and SEMI Global Board Executive Committee Chair Tien Wu said. He made the remarks at a pre-show conference on August 31 ahead of SEMICON Taiwan 2026, which runs from September 2 to 4.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Micron opens Tainan plant after 6.5 months amid labor dispute</title>
<pubDate>Tue, 1 Sep 2026 06:55:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD228/micron-plant-labor-taiwan-auo.html</link>
<description>Micron's plant at the Southern Taiwan Science Park, which it purchased from AUO for NT$7.4 billion (US$233.8 million) in August 2024, is now officially in operation, marking a key milestone in the transformation of its Tainan site. The move comes as Micron posts record revenue and profit, while a labor dispute at its Taiwan operations has raised strike concerns.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Micron]]></media:description>
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<title>Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers</title>
<pubDate>Tue, 1 Sep 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD231/marvell-cpo-siph-adoption-semicon-taiwan.html</link>
<description>Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the AI data center era has shifted firmly to power consumption. He noted that the acceleration of co-packaged optics (CPO) adoption is primarily driven by two critical bottlenecks: power and unit density.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Chinese smartphone brands raise prices as component costs climb</title>
<pubDate>Tue, 1 Sep 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD225/smartphone-component-huawei-xiaomi-sina.html</link>
<description>Several Chinese smartphone brands raised prices across entry-level and premium models on September 1, citing IT Home, Antutu, MyDrivers and Sina. The increases coincided with the start of the back-to-school buying season in China and reflected the pass-through of higher component costs to end customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>South Korea CCL exports surge 42% on AI demand</title>
<pubDate>Tue, 1 Sep 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD208/ccl-exports-demand-2026-revenue.html</link>
<description>South Korea's copper-clad laminate, or CCL, exports jumped sharply in the first seven months of 2026 as AI infrastructure investment and larger semiconductor packaging lifted demand, boosting revenue at suppliers including Doosan Electronic BG, LG Chem and Lotte Energy Materials.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand</title>
<pubDate>Tue, 1 Sep 2026 06:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL211/semco-mlcc-sales-2027-2026.html</link>
<description>Samsung Electro-Mechanics disclosed on September 1 that it has concluded a single sales and supply contract worth KRW1.072 trillion (about US$778.9 million) for MLCCs, equal to 9.5% of the company's most recent annual revenue.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Tim Cook concludes 15-year Apple tenure, John Ternus takes over</title>
<pubDate>Tue, 1 Sep 2026 06:42:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD237/apple-tim-cook-ceo-john-ternus-hardware.html</link>
<description>Tim Cook's tenure as Apple CEO has officially drawn to a close after nearly 15 years. Cook stepped down as CEO and became Executive Chairman, while Senior Vice President of Hardware Engineering John Ternus took over as CEO. The move marks Apple's first major leadership transition since Cook succeeded Steve Jobs in 2011.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies</title>
<pubDate>Tue, 1 Sep 2026 06:34:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PR200/expo-2026-maritime-business-industrial.html</link>
<description>K-Safety Expo 2026, one of South Korea's leading exhibitions dedicated to the safety industry, will open September 2 at BEXCO in Busan, bringing together companies, government agencies, research institutions, and overseas buyers across disaster prevention, industrial safety, public security, fire and rescue, and transportation and maritime safety.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Foxlink, Yongwei to sell Shinfox stake, cede control</title>
<pubDate>Tue, 1 Sep 2026 06:34:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD201/foxlink.html</link>
<description>Foxlink and Yongwei Investment Holdings each held board meetings on the 31st and decided to participate in the tender offer for Shinfox Energy, planning to dispose of their Shinfox shares at NT$0.05 per share. The move would strip the Foxlink Group of control over Shinfox and reduce the financial drag from the renewable energy company's losses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground</title>
<pubDate>Tue, 1 Sep 2026 06:34:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD214/smic-deepseek-2026-2025-manufacturing.html</link>
<description>&lt;em&gt;TIME&lt;/em&gt; unveiled its 2026 TIME100 AI list on August 27 with a notable change in its China lineup. DeepSeek founder Wenfeng Liang, named among the "Leaders" in 2025, disappeared from this year's list, while Semiconductor Manufacturing International Corporation (SMIC) co-CEO Mong-song Liang made a rare appearance.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Powered by AI]]></media:description>
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<title>Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan</title>
<pubDate>Tue, 1 Sep 2026 06:33:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD206/semco-taiwan-packaging-glass-substrate-materials.html</link>
<description>As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first appearance at Semicon Taiwan 2026, with advanced packaging and glass substrate expert Gang Duan traveling to Taiwan to unveil the company's roadmap for next-generation advanced packaging substrates aimed at AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>BYD's overseas business overtakes China for the first time as price war erodes domestic margins</title>
<pubDate>Tue, 1 Sep 2026 06:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL212/byd-business-revenue-2026-vehicle.html</link>
<description>BYD sold more abroad than at home in the first half of 2026, a threshold the company crossed for the first time and the clearest signal yet that the center of gravity of its car business has moved offshore. Overseas revenue reached CNY181.3 billion (US$26.88 billion), compared with CNY163.5 billion in China, according to the geographic breakdown in the interim report released on 28 August. A year earlier, the split ran the other way, by a wide margin.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>BYD widens overseas lead over Geely, but profits still lag</title>
<pubDate>Tue, 1 Sep 2026 06:20:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD218/byd-geely-sales-vehicle-revenue.html</link>
<description>BYD and Geely Auto were nearly neck and neck in vehicle sales in the first quarter of 2026, raising expectations of a close contest between China's two leading new-energy vehicle makers. The gap widened sharply in the second quarter, however, largely because BYD sold more vehicles overseas. Even so, stronger international sales have yet to reverse the company's profit decline.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>ASML says High NA EUV has reached its first high-volume logic product</title>
<pubDate>Tue, 1 Sep 2026 06:13:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL216/asml-euv-taiwan-performance-wafer.html</link>
<description>ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which 0.55 NA lithography moves from qualification into production service.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL216/asml-euv-taiwan-performance-wafer.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl216_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: ASML]]></media:description>
</media:content></item>
<item>
<title>Trymax lands multi-year AOI order as InP laser capacity race tightens</title>
<pubDate>Tue, 1 Sep 2026 06:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL215/inp-laser-dutch-equipment.html</link>
<description>Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for its Sugar Land, Texas wafer fab, in a deal Trymax describes as worth several million US dollars.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL215/inp-laser-dutch-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl215_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Tmytek moves toward Taiwan listing as millimeter-wave demand nears mass production</title>
<pubDate>Tue, 1 Sep 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD212/taiwan-production-demand-manufacturing-communications.html</link>
<description>Tmytek is preparing to list on the Taiwan Innovation Board as its millimeter-wave platforms approach commercial scale. For global telecom, satellite, and defense customers, the timing may matter because it could shape supply availability, manufacturing capacity, and the speed at which next-generation connectivity reaches the market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD212/taiwan-production-demand-manufacturing-communications.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Tmytek co-founders Shu-Wei Chang (L) and Ethan Lin (R). Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables</title>
<pubDate>Tue, 1 Sep 2026 05:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD215/digitimes-cpo-copper-switch-bandwidth.html</link>
<description>DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually inter-data-center connections.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD215/digitimes-cpo-copper-switch-bandwidth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd215_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>SEMI lifts 2028 wafer fab equipment forecast to US$220 billion</title>
<pubDate>Tue, 1 Sep 2026 04:24:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL214/semicon-taiwan-wafer-fab-equipment-forecast-semi.html</link>
<description>SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced logic and memory pushes the semiconductor capital spending cycle higher.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL214/semicon-taiwan-wafer-fab-equipment-forecast-semi.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl214_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[SEMI Market Intelligence senior director Clark Tseng presents an updated wafer fab equipment forecast at SEMICON Taiwan 2026. Credit: Sherri Wang]]></media:description>
</media:content></item>
<item>
<title>Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs</title>
<pubDate>Tue, 1 Sep 2026 04:07:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD224/z.ai-ai-training-chips-infrastructure-cost.html</link>
<description>Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to overseas cloud deployment.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD224/z.ai-ai-training-chips-infrastructure-cost.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd224_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Chinese court freezes US$318M in Nexperia assets, further escalating corp rift</title>
<pubDate>Tue, 1 Sep 2026 04:06:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL213/nexperia-dutch-2025-equipment-ceo.html</link>
<description>A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment division. The decision marks the latest escalation in an ongoing legal and geopolitical debate between the Netherlands-based chipmaker and its Chinese parent company, Wingtech Technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL213/nexperia-dutch-2025-equipment-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl213_files/8_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Caixin Global]]></media:description>
</media:content></item>
<item>
<title>Imec maps chip scaling to 2040, says AI's next gains need full-stack integration</title>
<pubDate>Tue, 1 Sep 2026 03:56:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD229/roadmap-design-cmos-hardware-ceo.html</link>
<description>Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and system architecture.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD229/roadmap-design-cmos-hardware-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd229_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China's memory chipmakers post a record 1H &#38;mdash; but not all of it came from chips</title>
<pubDate>Tue, 1 Sep 2026 03:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL205/profit-revenue-cxmt-dram-2026.html</link>
<description>Nine listed Chinese memory and memory-adjacent chip companies have now filed their first-half 2026 results, and together they measure the depth of the current DRAM and NAND upcycle more precisely than any forecast. They also show how differently each company reached its number: some rode pricing, one rode an acquisition, another rode a stake revaluation, and the largest of them simply arrived at a scale nobody in the sector previously operated at.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL205/profit-revenue-cxmt-dram-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl205_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>LG Energy Solution secures long-term US lithium supply</title>
<pubDate>Tue, 1 Sep 2026 03:52:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PR201/lithium-carbonate-lges-lithium-demand-2026.html</link>
<description>LG Energy Solution has signed a long-term supply agreement with Smackover Lithium for battery-grade lithium carbonate, a move that could strengthen supply chains for energy storage systems and electric vehicles at a time when global demand for critical minerals remains tight.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PR201/lithium-carbonate-lges-lithium-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pr201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple reshuffles leadership, shifts Schiller out of App Store</title>
<pubDate>Tue, 1 Sep 2026 03:50:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD226/apple-app-store-management-ceo-president.html</link>
<description>Apple has made another major management shake-up. After Tim Cook stepped down as CEO and was succeeded by John Ternus, formerly head of hardware engineering, veteran Phil Schiller is also stepping back from day-to-day operations, giving up responsibilities tied to the App Store and product launch events while remaining at Apple as an Apple Fellow to work on undisclosed projects.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD226/apple-app-store-management-ceo-president.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd226_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TSMC delays CoWoS orders as CoPoS plans take shape</title>
<pubDate>Tue, 1 Sep 2026 03:38:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD219/tsmc-cowos-equipment-packaging-capacity.html</link>
<description>TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers say CoWoS demand has not weakened, and TSMC's real challenge is instead how to mass-produce its next stage of ultra-large packaging while reallocating capacity and capex between CoWoS expansion and next-generation CoPoS. The recent shift in equipment-order timing may reflect TSMC's reassessment of its advanced packaging roadmap for the next 2-3 years.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD219/tsmc-cowos-equipment-packaging-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd219_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers</title>
<pubDate>Tue, 1 Sep 2026 03:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL210/anthropic-nvidia-chips-capacity-texas.html</link>
<description>Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease, The &lt;em&gt;Wall Street Journal&lt;/em&gt; reported, citing people familiar with the deal. The site is being developed by Hut 8, a bitcoin miner turned data-center builder, in Nueces County, Texas, and Nvidia signed an agreement with Hut 8 a few weeks ago to secure capacity, according to the Journal.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL210/anthropic-nvidia-chips-capacity-texas.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl210_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race</title>
<pubDate>Tue, 1 Sep 2026 03:00:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL204/cxmt-dram-profit-hbm-market.html</link>
<description>China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle. The more consequential question is what it does with the windfall.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL204/cxmt-dram-profit-hbm-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts</title>
<pubDate>Tue, 1 Sep 2026 02:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL201/packaging-demand-jcet-2026-capex.html</link>
<description>JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift could influence supply chains beyond China, as more AI and automotive chips rely on the back-end processes it is now prioritizing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL201/packaging-demand-jcet-2026-capex.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6</title>
<pubDate>Tue, 1 Sep 2026 02:41:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL223/cxl-startup-samsung-intel-xeon.html</link>
<description>South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device at Hot Chips 2026 while expanding its work with Samsung Electronics on a rack-scale system.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260831VL223/cxl-startup-samsung-intel-xeon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260831vl223_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: XCENA]]></media:description>
</media:content></item>
<item>
<title>Samsung locks 70% of memory output as HBM spot prices soar</title>
<pubDate>Tue, 1 Sep 2026 02:34:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD222/samsung-hbm-sk-hynix-production-price.html</link>
<description>Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high bandwidth memory (HBM) tightens the broader chip shortage. In some cases, spot prices for memory products are now as much as 5 times the LTA contract price.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD222/samsung-hbm-sk-hynix-production-price.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd222_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Cisco: CPO is ready for mass deployment amid surging AI data-center demand</title>
<pubDate>Tue, 1 Sep 2026 02:29:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD213/cpo-cisco-demand-optics-commercial.html</link>
<description>For global cloud operators and network vendors, Cisco said co-packaged optics (CPO) is moving from lab promise to commercial necessity as AI data centers strain power budgets and bandwidth limits. The company said pluggable modules, near-packaged optics, and co-packaged optics will coexist, but the shift could reshape how hyperscale infrastructure is built worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD213/cpo-cisco-demand-optics-commercial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd213_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&#38;amp;D toll</title>
<pubDate>Tue, 1 Sep 2026 02:26:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL208/huawei-harmonyos-ascend-chips-profit-revenue.html</link>
<description>Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning AI chips, smartphones, operating systems and computing infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL208/huawei-harmonyos-ascend-chips-profit-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
</media:content></item>
<item>
<title>South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain</title>
<pubDate>Tue, 1 Sep 2026 02:23:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL207/materials-joint-venture-plant-supply-chain-2025.html</link>
<description>A South Korean-Indian joint venture has completed a semiconductor materials plant in South Korea, aiming to strengthen regional supply chains for photoresist materials and reduce reliance on Chinese raw materials.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL207/materials-joint-venture-plant-supply-chain-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale</title>
<pubDate>Tue, 1 Sep 2026 02:20:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL202/cxmt-hbm3e-chipmakers-dram-production.html</link>
<description>China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI chip industry. US export controls have restricted Chinese access to advanced high-bandwidth memory (HBM), making local supply increasingly critical to scaling homegrown AI processors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL202/cxmt-hbm3e-chipmakers-dram-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Powered by AI]]></media:description>
</media:content></item>
<item>
<title>China's humanoid robot cost cuts run into three bottlenecks</title>
<pubDate>Tue, 1 Sep 2026 02:20:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD220/robot-price-industrial-market-share-taiwan.html</link>
<description>Humanoid robot scaling is still constrained by price, and Chinese humanoid robots &#38;mdash; which command the largest global market share &#38;mdash; show a sharp gap between consumer and industrial models. Industrial versions demand high load, high precision, and strong stability, making several precision transmission parts a key battleground for Chinese players and Taiwan suppliers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PD220/robot-price-industrial-market-share-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>India expands chip ambitions with full Semicon 2.0 notification</title>
<pubDate>Tue, 1 Sep 2026 02:16:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PR200/semicon-design-policy-talent-chip-supply.html</link>
<description>India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims to deepen local design and manufacturing capacity, while giving multinational companies and developers a larger role in one of technology's most strategic sectors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901PR200/semicon-design-policy-talent-chip-supply.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901pr200_files/3_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: PIB India]]></media:description>
</media:content></item>
<item>
<title>China reportedly moves space computing from concept towards commercial deployment</title>
<pubDate>Tue, 1 Sep 2026 01:42:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL206/infrastructure-shanghai-data.html</link>
<description>China's push to build computing infrastructure in orbit is moving beyond experimental projects, with several initiatives this year pointing towards a more coordinated effort to develop space-based AI and data-processing capabilities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL206/infrastructure-shanghai-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl206_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&#38;amp;D worldwide</title>
<pubDate>Tue, 1 Sep 2026 01:41:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901VL200/lam-research-subsidiary-investment-taiwan-2026.html</link>
<description>Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan, with the funds earmarked for research, development, and design work on critical equipment used in advanced semiconductor manufacturing processes. The Department of Investment Review cleared the case on August 31 as one of six major investments, according to &lt;em&gt;the Taipei Times&lt;/em&gt;, citing a ministry statement. The session approved two inbound foreign investments totaling NT$12.835 billion and four outbound investments worth US$358.36 million.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260901VL200/lam-research-subsidiary-investment-taiwan-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260901vl200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan's G2C+ Alliance members target global markets</title>
<pubDate>Tue, 1 Sep 2026 01:28:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD237/taiwan-equipment-chips-packaging-laser.html</link>
<description>Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun, Gallant Precision Machining (GPM), Gallant Micro Machining (GMM), and Contrel Technology (CT), focuses on advanced packaging, AI smart manufacturing, and global markets.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts</title>
<pubDate>Tue, 1 Sep 2026 01:16:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD216/taiwan-2026-market-technology-materials.html</link>
<description>Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry. At an August 31 pre-event briefing, the group said the changes are accelerating work in AI computing, advanced process technology, heterogeneous integration, and quantum computing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia's MediaTek investment signals broader push to shape AI infrastructure</title>
<pubDate>Tue, 1 Sep 2026 00:54:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD210/nvidia-mediatek-investment-infrastructure-partnership.html</link>
<description>Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure strategy as cloud giants and model developers expand their use of custom silicon and rack-scale systems.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption</title>
<pubDate>Tue, 1 Sep 2026 00:44:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260901PD211/nvidia-mediatek-data-center-adoption-partnership.html</link>
<description>Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely bought by Nvidia, signals a deeper strategic tie that may affect supply chains, customer choices, and competition worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>China's Xenomi LLM brings quantum computing into AI agent decision-making</title>
<pubDate>Mon, 31 Aug 2026 23:42:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL206/quantum-computing-testing-llm-language-beijing.html</link>
<description>China is testing a new route for combining quantum computing with generative AI, moving beyond model training toward the decision layer used by AI agents. Beijing Guoguang Liangchao Technology has introduced &lt;strong&gt;Xenomi&lt;/strong&gt;, a family of large language models that uses quantum annealing for selected routing, tool-selection, and task-decision workloads while leaving language understanding to conventional AI models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Buima returns to profit in the second quarter on battery module demand</title>
<pubDate>Mon, 31 Aug 2026 23:42:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD235/buima-profit-demand-2026-revenue.html</link>
<description>Buima swung back to profitability in the second quarter of 2026 as a recovery in its battery module shipments and gains from asset disposal lifted results. The company said demand tied to low Earth orbit satellites, wearable devices, and other applications helped improve profitability, while margin measures and earnings per share reached quarterly records.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Commentary: Why America fell behind on Open models &#38;mdash; and how Nvidia plans to close the gap</title>
<pubDate>Mon, 31 Aug 2026 23:41:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD234/deepseek-nvidia-2025-moonshot-openai.html</link>
<description>When DeepSeek burst onto the scene in early 2025, it wiped nearly US$600 billion from Nvidia's market value in a single day. By the summer of 2026, Moonshot AI's Kimi K3 had triggered another wave of anxiety, sharpening divisions in Silicon Valley over the growing strength of China's open models.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<title>Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion</title>
<pubDate>Mon, 31 Aug 2026 23:40:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD231/nvidia-hbm-asic-infrastructure.html</link>
<description>As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration across compute, memory, interconnects, and thermal management. To bypass traditional hardware constraints, Nvidia announced NVHBM, its next-generation custom HBM technology, and integrated it into the NVLink Fusion ecosystem.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan workplace AI use reaches 96% as employers push skills upgrades</title>
<pubDate>Mon, 31 Aug 2026 23:40:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD228/taiwan-talent-data.html</link>
<description>Ninety-six percent of professionals in Taiwan use AI in the workplace, topping the Asia-wide average of 93%, according to a new survey released by Robert Walters. The report, which covered nearly 5,000 professionals and employers across 10 Asian markets, showed that Taiwanese companies are already using AI far beyond basic tasks and are preparing for broader changes in job design and skills.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung weighs HBM4 bonuses as memory, foundry teams align</title>
<pubDate>Mon, 31 Aug 2026 23:40:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD226/samsung-team-hbm4-management-performance.html</link>
<description>Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly established Device Solutions (DS) special management performance bonus system. Labor and management are now negotiating detailed payout rules to clarify how One Team participants and some contract workers will be rewarded and to prevent employees from being disadvantaged because they belong to different units.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team</title>
<pubDate>Mon, 31 Aug 2026 23:39:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD222/nidec-capacity-cooling-ai-server-cci.html</link>
<description>Nidec Chaun-Choung Technology plans to establish a dedicated liquid-cooling team and deepen cooperation with major cloud service providers, citing rising thermal-management demand from AI servers. The company also plans to expand cooling capacity beyond its existing operations in Kunshan, China, to Hanoi, Vietnam, with mass production and shipments expected to begin in 2028.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Humanoid robots gain a sense of touch, lifting tactile sensor adoption above 60%</title>
<pubDate>Mon, 31 Aug 2026 23:38:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD219/sensor-robot-data-market-2026.html</link>
<description>If vision serves as a robot's eyes, tactile sensors function as its skin and peripheral nerves. In China, leading dexterous-hand makers have increasingly begun treating tactile sensing as a standard feature. The shift was particularly visible at the 2026 World Robot Conference, where queues formed throughout the day at tactile-glove demonstration areas as visitors took turns grasping objects and watching real-time changes in touch data. According to Chinese market research estimates, tactile-sensor penetration in dexterous robotic hands has risen from about 20% in early 2025 to more than 60% in 2026.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Taiwan manufacturing moves into the prosperity zone as US export growth slows</title>
<pubDate>Mon, 31 Aug 2026 23:38:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD214/taiwan-manufacturing-growth-demand-expansion.html</link>
<description>Taiwan&#38;rsquo;s manufacturing business-climate indicator moved into the index&#38;rsquo;s red &#38;ldquo;prosperity&#38;rdquo; category in July, with the Taiwan Institute of Economic Research (TIER) saying on August 31 that a sharper rise in optimism among local manufacturers lifted its operating environment index. At the same time, year-over-year export growth to the US fell to 28.0% from 267.6% in January, the lowest level since February 2025.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Acme sees years of SiC growth as data center demand builds</title>
<pubDate>Mon, 31 Aug 2026 23:37:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD213/sic-demand-growth-materials-data.html</link>
<description>Capex by the world's nine largest cloud service providers (CSPs) is expected to rise about 90% year over year in 2026, while AI servers are growing faster than conventional servers, increasing demand for power and energy-management solutions.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>OpenAI compresses Jalapeno design to 9 months</title>
<pubDate>Mon, 31 Aug 2026 23:37:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD212/openai-design-performance-2026-ai-chip.html</link>
<description>OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300, but how unusually fast it moved from design to tape-out.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Luxnet eyes orders through 2028, DCI revenue set to double in 2027</title>
<pubDate>Mon, 31 Aug 2026 23:11:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD224/2027-revenue-2028-demand-2026.html</link>
<description>AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming online in 2027, revenue from data center interconnect (DCI) products is expected to multiply, driving a leap in overall operations, while 1.6T optical modules are slated to enter mass production in the second half of 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect</title>
<pubDate>Mon, 31 Aug 2026 23:10:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260828PD230/demand-resistor-price-revenue-2026.html</link>
<description>Kaimei Electronics, a Yageo Group company, said order visibility remains strong for the second half of 2026 as AI server demand continues to ramp and automotive and industrial-control markets recover. Across its three major product lines, the average book-to-bill (B/B) ratio reached 1.2 in June and July, while pricing pressure has eased significantly, supporting a more optimistic operating outlook.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<title>Silergy data center business surges as new products scale up</title>
<pubDate>Mon, 31 Aug 2026 23:10:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD227/silergy-business-data-center-revenue-growth.html</link>
<description>Silergy said at a recent earnings call that most of its applications, excluding its computing product line, posted quarter-over-quarter growth of more than 20% in the second quarter of 2026. Automotive revenue rose about 50% year-over-year, industrial revenue increased 49.7%, and data center-related applications grew nearly 90% year-over-year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>LGD launches PFAS exit roadmap, targets full phaseout by 2035</title>
<pubDate>Mon, 31 Aug 2026 23:10:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD203/lg-display-roadmap-eu-component-sdc.html</link>
<description>LG Display (LGD) has introduced a new "PFAS-free" component verification process for suppliers as it prepares for expected European Union (EU) restrictions on PFAS, aiming to eliminate the so-called "forever chemicals" across all products by 2035.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push</title>
<pubDate>Mon, 31 Aug 2026 23:10:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD215/samsung-nvidia-hbm-bandwidth-market.html</link>
<description>Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM platform. According to &lt;em&gt;Seoul Economic Daily&lt;/em&gt;, the shift could give Samsung an early position in the next-generation artificial intelligence memory market if development moves ahead smoothly.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story</title>
<pubDate>Mon, 31 Aug 2026 23:09:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL201/profit-packaging-earnings-demand-revenue.html</link>
<description>Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%, yet the figures that strip out one-off items reveal a far more uneven recovery &#38;mdash; one in which two companies are carrying most of the operating improvement, one is still losing money on its core business, and the sector's capital commitments now run well ahead of what it currently earns.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform</title>
<pubDate>Mon, 31 Aug 2026 23:09:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL214/apple-mac-mini-hardware-infrastructure-silicon.html</link>
<description>Apple's AI hardware momentum is forcing an enterprise question it did not plan for. Mac mini and Mac Studio are increasingly being used as local AI infrastructure, but Apple's business remains built primarily around consumer devices and services.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics</title>
<pubDate>Mon, 31 Aug 2026 23:09:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL211/xmc-3d-silicon-photonics-growth.html</link>
<description>Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting a fourfold increase in production capacity while building a broader semiconductor ecosystem around Wuhan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Optics Valley of China (OVC)]]></media:description>
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<title>SK Hynix explores Intel as second source for HBM base dies</title>
<pubDate>Mon, 31 Aug 2026 23:09:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831VL222/sk-hynix-hbm-intel-manufacturing-accelerator.html</link>
<description>SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as the logic layer beneath HBM becomes increasingly important to cost, performance and accelerator design.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>John Ternus takes over an Apple with one growth engine, no obvious second</title>
<pubDate>Mon, 31 Aug 2026 23:08:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260827VL215/apple-john-ternus-growth-2025-revenue.html</link>
<description>John Ternus becomes Apple's chief executive on September 1 with comfortable near-term numbers and an uncomfortable medium-term question. Apple's June quarter was a record. Its largest business has not sold materially more units in a decade, its newest hardware category is shrinking, and the technology reordering the industry runs, for now, on someone else's model.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Analysis: Tim Cook hands Ternus a slower-growing but far richer Apple than the one Steve Jobs left him</title>
<pubDate>Mon, 31 Aug 2026 23:08:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260827VL212/apple-john-ternus-tim-cook-steve-jobs-revenue.html</link>
<description>When John Ternus becomes chief executive on September 1, the company he inherits will be measured on a scorecard Tim Cook wrote, not the one Steve Jobs left behind. Fifteen years of accounts show two different machines wearing the same logo: Jobs ran a company that accelerated, Cook ran one that compounded. The distinction matters for Ternus, because the growth rates Cook normalized are the ones he now has to beat.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond</title>
<pubDate>Mon, 31 Aug 2026 14:25:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260831PD238/mediatek-nvidia-silicon-financing-taiwan.html</link>
<description>MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's capital market. Nvidia subscribed for US$3.5 billion of it &#38;mdash; roughly 90% of the offering.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Semiconductors</category>
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