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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>The Tata Electronics leak is overwhelmingly an Apple data set, file index shows</title>
<pubDate>Sat, 27 Jun 2026 08:38:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260627VL200/apple-data-component-technology.html</link>
<description>Tata Electronics, the Indian contract manufacturer that assembles iPhones and supplies other global technology companies, has confirmed a cybersecurity incident after the extortion group World Leaks published more than 630 gigabytes of data taken from the company's systems. The cache, posted on the group's dark-web leak site, contains 204,341 files and folders drawn from Tata Electronics' internal file servers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>JCET's US$1.1bn expansion shows where China's AI chip crunch is moving</title>
<pubDate>Sat, 27 Jun 2026 08:30:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL206/ai-chip-packaging-jcet-expansion-testing.html</link>
<description>&lt;p class="P1" data-start="0" data-end="182"&gt;China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity</title>
<pubDate>Sat, 27 Jun 2026 08:30:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260624PD226/apple-1.4nm-capacity-smartphone-flagship.html</link>
<description>Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>Hanmi targets advanced packaging market with FC Bonder 3.5</title>
<pubDate>Sat, 27 Jun 2026 08:30:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL211/packaging-hanmi-equipment-market-hbm.html</link>
<description>&lt;p class="P1" data-start="96" data-end="414"&gt;Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers,&lt;em&gt; ETNews&lt;/em&gt; and &lt;em&gt;Yonhap&lt;/em&gt; reported.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>US backs I-Pulse's $250M plan to use pulsed power for geothermal drilling</title>
<pubDate>Sat, 27 Jun 2026 08:30:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PR202/award-technology-geothermal-funding-security.html</link>
<description>A US$250 million award for I-Pulse's semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply chains used by industries worldwide. The funding is aimed at domestic capacity, but the technologies being developed may shape global competition and access.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>ShunSin sees CPO potential, adds TSMC veterans as independents</title>
<pubDate>Sat, 27 Jun 2026 08:30:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD230/shunsin-cpo-testing-packaging-tsmc.html</link>
<description>ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan motorcycle maker SYM's profit falls in 2025 despite record market share</title>
<pubDate>Sat, 27 Jun 2026 08:29:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD216/sym-2025-2026-profit-taiwan.html</link>
<description>SYM said its 2025 results held up despite global tariff shifts and supply-chain disruption, highlighting resilient motorcycle sales in Taiwan and overseas. For global readers, the outlook signals how trade policy uncertainty is reshaping demand, while also showing how companies are leaning on product launches and disciplined management to support growth.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<item>
<title>LG pushes robot strategy from home to factory; data shortage remains a challenge</title>
<pubDate>Sat, 27 Jun 2026 08:29:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD221/data-robot-lg-lg-electronics-robotics.html</link>
<description>LG Electronics has in recent years expanded its push into physical AI, building an end-to-end robotics value chain under its "One LG" strategy comprising other units across the group, with products ranging from the CLOiD home robot to the LG AXIUM robotic actuator. However, the lack of robot motion data remains its biggest bottleneck.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<item>
<title>AI-driven chip demand tightens air and sea freight capacity and lifts rates</title>
<pubDate>Sat, 27 Jun 2026 08:29:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD200/demand-capacity-shipments-fuel-2026.html</link>
<description>AI and semiconductor shipments are tightening global freight markets, with air cargo space in short supply and US-bound sea routes crowded. Lower fuel surcharges may ease some costs, but strong export demand from technology supply chains is expected to keep shipping prices firm through the peak season.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>DrayTek's revenue slide drags into 2026, company pins hopes on Wi-Fi 7 and cybersecurity</title>
<pubDate>Fri, 26 Jun 2026 18:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD232/revenue-taiwan-wi-fi-7-2026-cybersecurity.html</link>
<description>Taiwan networking equipment maker DrayTek held its shareholders' meeting on June 26, acknowledging its 2025 business and financial reports along with its profit distribution plan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<item>
<title>MediaTek frames orbit compute and NTN as next strategic R&#38;amp;D priorities</title>
<pubDate>Fri, 26 Jun 2026 18:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260624PD241/mediatek-satellite-communications-design-communications-2026.html</link>
<description>MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining forward-looking R&#38;amp;D priorities in AI, satellite communications and next-generation connectivity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Zettabyte urges new standard for quality AI compute as demand surges over two years</title>
<pubDate>Fri, 26 Jun 2026 18:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260624PD237/infrastructure-taiwan-cost-gpu-capacity.html</link>
<description>AI infrastructure firm Zettabyte said AI token generation exploded more than 330-fold over two years and urged that compute be measured by delivered useful work rather than raw hardware specs or hourly price. According to Alphabet's Google, monthly AI token generation grew from about 9.7 trillion to more than 3.2 quadrillion, and Zettabyte presented its quality-compute framework at a seminar hosted by Taiwan's Industrial Technology Research Institute.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>SK On completes China battery joint-venture restructuring with Eve Energy</title>
<pubDate>Fri, 26 Jun 2026 18:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260624VL203/sk-on-eve-energy-joint-venture-vehicle-battery-production.html</link>
<description>South Korean battery maker SK On has completed a share swap with China's Eve Energy, giving it full ownership of a battery manufacturing joint venture in Yancheng, Jiangsu province, as the company continues efforts to streamline operations and ease financial pressure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Samsung SDI targets US battery supply chains with US$20M Forge Nano investment</title>
<pubDate>Fri, 26 Jun 2026 09:16:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL212/samsung-sdi-battery-manufacturing-materials-military-usa.html</link>
<description>Samsung SDI, a battery and electronic materials manufacturer, has entered an agreement to help US-based Forge Nano build a 3 GWh per year battery manufacturing site in Morrisville, North Carolina. The deal capitalizes on both Samsung's desire to avoid US tariffs and the American military's goal to develop non-China supply chains, including in batteries.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<item>
<title>SK Hynix fluorine leaks trigger safety inspections at 25 South Korean chip plants</title>
<pubDate>Fri, 26 Jun 2026 08:35:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD222/sk-hynix-industrial-fire-economy-semiconductor-industry.html</link>
<description>South Korea's Ministry of Employment and Labor has launched chemical safety inspections at 25 semiconductor manufacturers, including SK Hynix, after a series of fluorine gas leaks at chip plants raised fresh concerns over industrial accidents.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Inside Corning: a century of R&#38;amp;D bets, and why optical fiber is paying off again</title>
<pubDate>Fri, 26 Jun 2026 07:15:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD217/corning-2026-materials-digitimes-asia-2022.html?chid=12</link>
<description>&lt;p class="R1"&gt;Preface</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Column</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Taiwan IPC maker IEI Integration's margin fell to 28% in Q1, but rebound is coming</title>
<pubDate>Fri, 26 Jun 2026 07:08:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD212/iei-integration-high-end-production-component-shipments.html</link>
<description>IEI Integration said its first-quarter margin was squeezed by higher component costs and a changing product mix, but it expects a second-quarter rebound as high-end video conferencing shipments ramp up. The outlook matters for global industrial and enterprise technology buyers facing tighter supply, shifting production, and uneven demand across markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[IEI Integration president Jong-liang Jiang. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Acer's distribution arm bets on MacBook Neo, software to offset weak PC demand</title>
<pubDate>Fri, 26 Jun 2026 07:06:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD223/acer-pc-weblink-growth-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="176"&gt;Acer channel arm Weblink International remains upbeat on the second half of 2026, even as the PC industry looks increasingly likely to see weaker demand than in the first half.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260626pd223_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Weblink chairman Dave Lin. Credit: DIGITIMES]]></media:description>
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<item>
<title>Samsung eyes Gwangju chip site as SK Hynix weighs regional and overseas options</title>
<pubDate>Fri, 26 Jun 2026 07:03:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL208/samsung-investment-sk-hynix-government-industrial.html</link>
<description>&lt;p class="P1" data-start="220" data-end="508"&gt;South Korea's plan to push semiconductor investment beyond the greater Seoul area is taking clearer shape, with Samsung Electronics reportedly moving closer to a new chip hub in Gwangju while SK Hynix continues to weigh a site in South Jeolla Province against overseas investment options.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>Qualcomm HBC takes aim at HBM costs in AI data centers</title>
<pubDate>Fri, 26 Jun 2026 06:57:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD219/qualcomm-hbm-data-data-center-technology.html</link>
<description>&lt;p class="P1" data-start="64" data-end="301"&gt;Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls High Bandwidth Compute, or HBC, as a key weapon in its challenge to Nvidia, AMD and AI chip startups.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Qualcomm]]></media:description>
</media:content></item>
<item>
<title>Agility Robotics IPO strengthens Foxconn's long-term robotics ambitions</title>
<pubDate>Fri, 26 Jun 2026 06:51:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD211/robotics-foxconn-ipo-manufacturing-investment.html</link>
<description>&lt;p class=Image&gt;Humanoid robotics and physical AI pioneer Agility Robotics has announced plans to pursue a public listing, drawing significant attention from global capital markets and the technology industry. Behind the IPO, however, lies a notable Taiwanese supply-chain presence that adds broader strategic significance to the company's public market debut.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>Seres' US$25bn wipeout tests the price of Huawei's EV halo</title>
<pubDate>Fri, 26 Jun 2026 06:44:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL202/seres-huawei-price-market-2025.html</link>
<description>Seres Group, once the clearest listed proxy for Huawei's EV ambitions, has lost more than CNY180 billion (US$25 billion) in A-share market value from its peak, despite strong sales and profit.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Z.ai's HK$1tn rally tests China AI boom: model leap or market mirage?</title>
<pubDate>Fri, 26 Jun 2026 06:43:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL201/z.ai-market-startup-anthropic-revenue.html</link>
<description>Chinese AI startup Z.ai, also known as Zhipu AI, has turned GLM-5.2 into the clearest test yet of China's frontier AI gap with Anthropic and OpenAI. Its stock surge is now raising a second question: whether investors are pricing a real technology shift or a thin-float capital-market fever.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: VCG]]></media:description>
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<title>Global intelligent eyewear market surges as AR and smart glasses gain ground</title>
<pubDate>Fri, 26 Jun 2026 06:41:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PR201/smart-glasses-demand-market-ar-shipments.html</link>
<description>Global demand for intelligent eyewear is rising fast, with shipments jumping 83% in the first quarter of 2026, according to Counterpoint Research. For readers worldwide, the shift signals a faster move toward AI-enabled wearables, while VR headsets continue to struggle with weak demand and slower product refreshes.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AuthenX targets AI data center interconnects with plug-and-play FAU for CPO</title>
<pubDate>Fri, 26 Jun 2026 06:35:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625PD231/data-center-cpo-expansion-silicon-packaging.html</link>
<description>AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array units (FAU) and external laser sources (ELS).</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Groundhog Technologies wins world's first telecom GenAI order, eyes LEO satellite optimization market</title>
<pubDate>Fri, 26 Jun 2026 05:59:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625PD225/groundhog-technologies-leo-satellite-optimization-telecom.html</link>
<description>Groundhog Technologies is eyeing opportunities in low Earth orbit (LEO) satellite applications by targeting the satellite resource optimization market, according to chairman David Chiou at the company's latest shareholders' meeting on June 24. Chiou also announced that Groundhog has won the first generative AI order worldwide in the field of telecom engineering, with Singapore Telecommunications (Singtel) as its client.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Groundhog Technologies chairman David Chiou. Credit: DIGITIMES]]></media:description>
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<title>AIDC showcases advanced composite materials for next-gen aircraft, drones</title>
<pubDate>Fri, 26 Jun 2026 05:54:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625PD241/aidc-drone-aircraft-composite-material-manufacturing-taiwan.html</link>
<description>To meet the aerospace industry's push for lighter, more environmentally sustainable next-generation aircraft, Taiwan's Aerospace Industrial Development Corporation (AIDC) has stepped up research and development of thermoplastic composite materials in recent years.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260625PD241/aidc-drone-aircraft-composite-material-manufacturing-taiwan.html</guid>
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<media:description type="plain"><![CDATA[Credit: AIDC]]></media:description>
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<title>Taiwan to draft new drone budget after defense bill cuts</title>
<pubDate>Fri, 26 Jun 2026 05:47:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260624PD233/taiwan-drone-national-defense-budget-supply-chain.html</link>
<description>Taiwan's Executive Yuan has decided to draft a separate special bill to support drone development and procurement after the Legislative Yuan cut relevant items from the NT$1.25 trillion (approx. US$39 billion) special budget for national defense, with the Executive Yuan citing national security concerns and the need to build an autonomous industrial supply chain. The move comes as a delegation of lawmakers, led by Speaker Daniel K.Y. Han, returns from a visit to TSMC's Arizona plant and meetings with US lawmakers, yet it remains unclear whether that trip will help win opposition support for the drone bill.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>OpenAI to release GPT 5.6 model on staggered basis in face of US regulatory uncertainty</title>
<pubDate>Fri, 26 Jun 2026 04:44:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL210/openai-usa-government-ai-regulation-anthropic.html</link>
<description>OpenAI CEO Sam Altman told staff that its latest model, GPT 5.6, would be released on a staggered basis, with a small group of entities first gaining preview access to it after approval by the US government. The case highlights the regulatory uncertainty many local AI developers are facing after US President Donald Trump announced a voluntary review system before the release of frontier models, with the industry remaining concerned that it is not so voluntary after all.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung's reported US$648 billion plan shifts focus to South Korea's chip belt</title>
<pubDate>Fri, 26 Jun 2026 04:31:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626VL207/samsung-south-korea-data-investment-production-region.html</link>
<description>&lt;p class="P1" data-start="116" data-end="464"&gt;Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29, when South Korean President Lee Jae-myung chairs a public briefing at the presidential office in Seoul on what his administration is calling the country's "three mega-projects for a great leap forward," &lt;em&gt;Maeil Business Newspaper&lt;/em&gt; reported.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Exclusive: SK Hynix races to build Yongin memory megasite as supply crunch deepens</title>
<pubDate>Fri, 26 Jun 2026 04:08:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD209/sk-hynix-memory-chips-fab-capacity-demand.html</link>
<description>&lt;p class="P1" data-start="574" data-end="848"&gt;The global memory market is facing a structural supply-demand imbalance that shows little sign of easing. Micron's stronger-than-expected quarterly results have drawn fresh attention from investors and the technology industry, while the broader supply picture remains tight.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Siu Han]]></media:description>
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<title>Taiwan revives NT$210 billion drone procurement plan amid industry hopes and concerns</title>
<pubDate>Fri, 26 Jun 2026 03:59:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260626PD213/taiwan-drone-development-budget-2026.html</link>
<description>Taiwan's Ministry of National Defense has revived a NT$210 billion (approx. US$6.6 billion) special bill for unmanned vehicle procurement after the Legislative Yuan in May 2026 stripped out all domestic-industry-friendly items from an earlier defense special budget, leaving only arms purchases. The Executive Yuan has now approved the draft, raising hopes and concerns across the drone industry.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Aerospace</category>
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<title>Teradyne expands India focus with new country manager</title>
<pubDate>Fri, 26 Jun 2026 03:56:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625VL222/teradyne-testing-equipment-india-manufacturing-supplier.html</link>
<description>US-based automated test equipment supplier Teradyne plans to expand its presence in India and has appointed Alpa Sood as India Manager, as the company seeks to deepen engagement in a semiconductor ecosystem moving toward manufacturing scale.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Alpa Sood, India Manager, Teradyne. Credit: Teradyne.]]></media:description>
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<title>Corning weighs South Korea site as chip packaging race turns to glass</title>
<pubDate>Fri, 26 Jun 2026 03:54:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625VL220/corning-packaging-manufacturing-business-meta.html</link>
<description>&lt;p class="P2" data-start="106" data-end="368"&gt;Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Academia Sinica readies Taiwan-made quantum chip for engineering push</title>
<pubDate>Fri, 26 Jun 2026 03:53:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260625PD236/academia-sinica-chips-taiwan-equipment-quantum.html</link>
<description>Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible manufacturing system. Chii-Dong Chen, executive director of Academia Sinica's Center for Quantum Computer, says Taiwan's quantum chip effort is moving into that engineering battleground.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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