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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>HBM4 battle shifts to cooling as hybrid bonding slips</title>
<pubDate>Mon, 20 Jul 2026 09:03:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717PD226/hbm4-hbm-cooling-shipments-nvidia.html</link>
<description>Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major memory makers over stable mass production and supply. Industry sources say the next wave of high-capacity HBM will be decided by one core issue: how effectively vendors solve heat dissipation.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>China's AI smartphone race pits ZTE, StepFun, and Honor against limits of agentic computing</title>
<pubDate>Mon, 20 Jul 2026 08:48:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL210/china-ai-agent-smartphone-waic-honor-zte.html</link>
<description>&lt;p class="P1" data-start="91" data-end="321"&gt;China's smartphone industry is turning agentic AI into its next growth narrative, with ZTE's Nubia, StepFun and Honor presenting sharply different visions of how phones should plan tasks, coordinate apps and process personal data.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[2026 WAIC. Credit: Leikeji]]></media:description>
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<title>Alibaba open-sources AI chip software, launches Zhenwu cloud supernode service</title>
<pubDate>Mon, 20 Jul 2026 08:28:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL219/alibaba-ai-chip-software-t-head-design.html</link>
<description>Alibaba Group's chip design unit, T-Head, has open-sourced the software stack behind its Zhenwu AI processors while extending the platform from individual accelerators into rack-scale supernodes and public-cloud computing services.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Alibaba Cloudˇ¦s Panjiu AL128 supernode integrates AI accelerators and ALink switching hardware in a rack-scale system. Credit: Alibaba Cloud]]></media:description>
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<item>
<title>Oracle's New Mexico data center reportedly hits cost overruns</title>
<pubDate>Mon, 20 Jul 2026 08:12:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL217/data-center-oracle-new-mexico-electricity-infrastructure.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:361;118-478"&gt;Oracle's US$165 billion data center project in New Mexico is running into higher-than-expected costs due to local concerns about its energy requirements. This case is one of several showing how the build-out of AI infrastructure in the US has become a politically charged issue at the local level due to worries over electricity needs and other issues.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Samsung to cut over 800 US jobs amid market headwinds</title>
<pubDate>Mon, 20 Jul 2026 08:04:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL221/samsung-electronics-market-mobile-texas.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:273;111-383"&gt;Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division, part of Samsung Group, is facing a challenging market this year, in contrast to the soaring performance of its chip unit.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Musk brands US$52 billion SpaceX-Foxconn Nvidia server order 'fake news'</title>
<pubDate>Mon, 20 Jul 2026 08:04:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL220/spacex-elon-musk-foxconn-nvidia-ai-server-2026.html</link>
<description>Elon Musk has publicly rejected reports that SpaceX placed a roughly US$52 billion order with Foxconn for Nvidia GB300 AI servers, calling the widely circulated claim "fake news" in a post on X on July 20.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Memory is becoming a national security priority, SK chair warns</title>
<pubDate>Mon, 20 Jul 2026 07:54:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL215/security-chairman-cxmt-2026-market.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:253;106-358"&gt;The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and Chinese newcomers such as ChangXin Memory Technologies (CXMT) emerging as a credible alternative to incumbent leaders.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Commentary: China's DRAM comes of age with CXMT's IPO &#38;mdash; but a trio of hurdles remains</title>
<pubDate>Mon, 20 Jul 2026 07:52:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717PD221/cxmt-ipo-dram-hbm-technology.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:283;144-426"&gt;CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved China can manufacture DRAM, the memory chip maker must now compete directly with Samsung Electronics, SK Hynix, and Micron in the global memory market.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Rapidus taps Cadence AI agents to speed 2nm chip design</title>
<pubDate>Mon, 20 Jul 2026 06:58:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL211/rapidus-cadence-2nm-design-technology.html</link>
<description>Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned 2nm manufacturing service.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Rapidus president Atsuyoshi Koike. Credit: AFP]]></media:description>
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<item>
<title>US and Chinese AI labs are quietly building on each other's models, even as distillation fight rages</title>
<pubDate>Mon, 20 Jul 2026 06:31:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL216/china-usa-ai-training-competition-moonshot-openai.html</link>
<description>The distillation dispute between US and Chinese AI labs has been framed as a one-way street: American firms accuse Chinese rivals of copying their models. However, a run of recent launches shows the borrowing goes both ways, with prominent US developers now building products on top of Chinese open models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Smart glasses race enters new phase as AI ecosystems eclipse hardware specs</title>
<pubDate>Mon, 20 Jul 2026 06:23:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD206/smart-glasses-ai-hardware-meta-bytedance-2026.html</link>
<description>The global smart glasses market is entering a decisive new stage in the second half of 2026, with competition expanding well beyond Meta's early dominance. Industry attention is rapidly shifting from hardware specifications to AI capabilities, ecosystem integration and everyday usability, while mounting pricing pressure and growing regulatory scrutiny are reshaping the competitive landscape.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Compeq acquires Guanyin site for NT$2.09 billion to expand optical and space data center PCB capacity</title>
<pubDate>Mon, 20 Jul 2026 05:50:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD200/compeq-manufacturing-demand-plant-capacity-2026.html</link>
<description>HDI PCB maker Compeq Manufacturing has approved the acquisition of a new manufacturing site in Taoyuan's Guanyin Industrial Park for approximately NT$2.09 billion (US$64.5 million), positioning itself to support customers developing next-generation optical modules and satellite applications. The facility is intended to provide additional manufacturing capacity for optical interconnects and space data center applications in line with customers' product development and mass-production schedules between 2027 and 2028.</description>
<dc:creator>AI bot</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>Commentary: Apple sues OpenAI, but Trump holds the whistle</title>
<pubDate>Mon, 20 Jul 2026 04:35:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD238/apple-openai-hardware-partnership-legal.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:378;104-481"&gt;Apple has filed a sharp antitrust-style complaint against OpenAI, turning a once-celebrated AI partnership into a legal clash over strategy, supply chains, and future hardware control. Behind the lawsuit lies a broader contest over who will shape the next wave of AI devices, and whether the Trump administration's "America First" agenda can help both sides find common ground.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Grenergy listing could sharpen group's role in AI and power supply markets</title>
<pubDate>Mon, 20 Jul 2026 04:32:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD218/grenergy-power-supply-demand-market-manufacturing.html</link>
<description>Grenergy Enterprise is set to list on the emerging stock board on July 21, in a move that could highlight how its parent, Changs Ascending Enterprise, is dividing the group's lithium iron battery businesses to capture demand from AI data centers and industrial power systems. Changs Ascending will hold about 55% of Grenergy and will continue to license the core LFP cathode material patent technology.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260716PD218/grenergy-power-supply-demand-market-manufacturing.html</guid>
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<media:description type="plain"><![CDATA[Grenergy chairman Cheng-chiang Sun. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand</title>
<pubDate>Mon, 20 Jul 2026 04:20:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL218/samsung-equipment-fab-investment-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:259;118-376"&gt;Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory capacity while raising a broader question about what is driving one of the industry's most aggressive fab expansion strategies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins</title>
<pubDate>Mon, 20 Jul 2026 04:16:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD235/intel-packaging-manufacturing-2026-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:551;116-666"&gt;Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia. Supply-chain sources said the company has relaunched its worldwide manufacturing sites, pushing ahead with Intel 18A mass production, 14A and high-NA EUV development, and advanced packaging programs including EMIB, EMIB-T, Foveros, and hybrid bonding (HB). The goal is to build an end-to-end manufacturing platform spanning advanced process nodes, chiplets, heterogeneous integration, and backend assembly and testing.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Edge AI becomes China's next battleground as ModelBest tops US$2.8 billion valuation</title>
<pubDate>Mon, 20 Jul 2026 04:15:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715VL231/investment-industrial-automotive-financing.html</link>
<description>China's latest wave of investment in edge AI signals a shift toward large-scale commercialization as the country accelerates the deployment of on-device AI across consumer and industrial hardware.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>South Korea links physical AI, AI-RAN and data centers in export strategy</title>
<pubDate>Mon, 20 Jul 2026 04:06:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717VL210/data-government-industrial-semiconductors-equipment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:178;107-284"&gt;South Korea is combining physical AI, domestic semiconductors, AI-RAN networks, and gigawatt-scale data centers to turn intelligent industrial systems into a new export category.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Sedaily]]></media:description>
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<title>Star Fusion to acquire electrical engineering contractors</title>
<pubDate>Mon, 20 Jul 2026 04:03:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717PD228/gaming-revenue-competitiveness-2026-plant.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:272;109-380"&gt;Star Fusion Group announced on July 15 that it plans to spend NT$252 million (US$7.8 million) to strategically acquire Chao Lung Electrical Engineering and Chin Yao Electrical Engineering, in a move aimed at boosting the group's competitiveness and long-term development.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Tai-Saw leverages frequency-component portfolio to expand into optical communications, LEO satellites and drones</title>
<pubDate>Mon, 20 Jul 2026 04:01:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717PD216/tai-saw-communications-leo-capacity-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:451;161-611"&gt;As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies across its diversified product portfolio to expand into optical communications, low Earth orbit (LEO) satellites and drone supply chains. Tight industry capacity and rising raw material costs, however, have extended lead times for some products to 10&#38;ndash;12 weeks, prompting the company to gradually expand production.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Angel Liu]]></media:description>
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<item>
<title>Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models</title>
<pubDate>Mon, 20 Jul 2026 03:55:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL214/photonics-silicon-hbm-competition-chips.html</link>
<description>&lt;p class="P1" data-start="0" data-end="241" data-is-last-node="" data-is-only-node=""&gt;AI competition is widening from chips to connectivity, memory, talent, patents, and model access, with governments and suppliers tightening control across the stack. Below are the most-read &lt;em&gt;DIGITIMES&lt;/em&gt; stories from the week of July 13-19, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Powered by AI]]></media:description>
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<title>Taiwan-US 'co-make' white paper debuts amid investment boom</title>
<pubDate>Mon, 20 Jul 2026 03:53:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260719PD200/taiwan-investment-tsmc-manufacturing-technology.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:507;123-629"&gt;Taiwan Semiconductor Manufacturing Company's (TSMC) announcement of an additional US$100 billion investment into US manufacturing has brought renewed attention to manufacturing in the US. The International Artificial Intelligence and Law Research Foundation (IAILRF) released the 2026 US-Taiwan Co-Make and Protection Strategy White Paper on July 17. Foundation secretary-general Wesley Chu said that for Taiwanese companies, investing in the US is no longer a question of whether to go, but how to go.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>OpenRouter's rumored sale shows the value of AI 'middle layer'</title>
<pubDate>Mon, 20 Jul 2026 03:50:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL203/startup-software.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:299;117-415"&gt;OpenRouter, a startup whose software lets app developers reach hundreds of AI models through a single interface, has discussed selling itself to a larger technology company in a deal that could value it at several billion dollars, &lt;em&gt;The Information&lt;/em&gt; reported, citing people familiar with the matter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI boom pushes PCB, passive component lead times into a new normal</title>
<pubDate>Mon, 20 Jul 2026 03:47:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD228/component-passive-pcb-data-center-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:298;121-418"&gt;The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component industries. However, shortages of critical materials and insufficient capacity expansion have created new bottlenecks, sharply lengthening product lead times.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Interview: AI race is now a financing race, and Compute Labs wants to bankroll GPUs</title>
<pubDate>Mon, 20 Jul 2026 03:37:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL200/gpu-chips-financing-infrastructure-nvidia.html</link>
<description>As AI's bottleneck shifts from chips to capital, Compute Labs pitches GPUs as financeable assets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720vl200_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credi: Albert Zhang's LinkedIn]]></media:description>
</media:content></item>
<item>
<title>3GPP sets 6G Release 21 timeline as industry begins preparing for next-gen networks</title>
<pubDate>Mon, 20 Jul 2026 03:32:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL212/3gpp-6g-development-wi-fi.html</link>
<description>&lt;p class="P1" data-start="96" data-end="337"&gt;The global race toward 6G has entered a new phase after the 3rd Generation Partnership Project (3GPP) finalized the development timeline for Release 21&#38;mdash;the first official 6G standards release&#38;mdash;at its plenary meeting in Singapore in June 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Qualcomm]]></media:description>
</media:content></item>
<item>
<title>TSMC expansion strengthens Arizona's talent pull as advanced manufacturing shifts west</title>
<pubDate>Mon, 20 Jul 2026 03:24:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD202/tsmc-arizona-talent-manufacturing-expansion.html</link>
<description>TSMC's ability to attract talent extends beyond Taiwan to the US, as its additional US$100 billion investment in Arizona for advanced manufacturing facilities is expected to further expand the state's semiconductor cluster and reshape domestic workforce migration, with local estimates suggesting that around 100,000 people are relocating to Arizona each year.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Meta, Anthropic in talks over potential US$10 billion compute deal</title>
<pubDate>Mon, 20 Jul 2026 03:14:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL206/meta-anthropic-capacity-infrastructure-amazon.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:228;104-331"&gt;Meta Platforms is in early talks to lease computing power to Anthropic in a potential deal worth up to US$10 billion over two years, as the social media company considers generating revenue from its expanding AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Merck ramps up AI semiconductor materials push as Level Up nears completion</title>
<pubDate>Mon, 20 Jul 2026 03:06:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD231/materials-merck-competition-equipment-packaging.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:469;179-647"&gt;AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated technologies, equipment, services, and system solutions. Merck said that as chip manufacturing advances from 2nm toward 1.4nm, the industry is moving closer to atomic-scale production, where competition will hinge on the broader ecosystem spanning materials, process technology, advanced packaging, and co-packaged optics (CPO).</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716pd231_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Exclusive Interview: Inside VSMC's Singapore fab, where silicon interposers and power chips underpin AI growth</title>
<pubDate>Mon, 20 Jul 2026 03:03:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD205/tsmc-fab-silicon-chips-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:651;160-810"&gt;TSMC raised its 2026 capital expenditure forecast to US$60&#38;ndash;64 billion during its second-quarter earnings conference, with a substantial share earmarked for the US. Although Singapore tried to attract a TSMC fab, the chipmaker ultimately chose not to commit. Vanguard International Semiconductor Corporation (VIS), however, has received strong backing from TSMC for VisionPower Semiconductor Manufacturing Company (VSMC), its joint venture with NXP Semiconductors. VSMC's new 12-inch foundry in Singapore is scheduled to formally open in late September. &lt;em&gt;DIGITIMES&lt;/em&gt; was granted an exclusive early look inside the facility.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720pd205_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Julian Ho]]></media:description>
</media:content></item>
<item>
<title>SpaceX reportedly eyes Pentagon AI infrastructure deal as defense demand for computing accelerates</title>
<pubDate>Mon, 20 Jul 2026 03:03:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL209/spacex-defense-ai-data-center-infrastructure-capacity-military.html</link>
<description>SpaceX is in talks with the US Department of Defense (DoD) to provide billions of dollars' worth of data center capacity for artificial intelligence (AI) workloads, marking a potential expansion of the company's role from launch services and satellite communications into AI infrastructure. The discussions remain ongoing and could still fall through, according to &lt;em&gt;The Wall Street Journal.&lt;/em&gt;</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260720VL209/spacex-defense-ai-data-center-infrastructure-capacity-military.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260720vl209_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Jensen Huang's week in Tokyo: what Nvidia's Japan trip reveals about future partners</title>
<pubDate>Mon, 20 Jul 2026 02:54:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL205/jensen-huang-japan-government-robotics-supply-chain.html</link>
<description>Nvidia founder and CEO Jensen Huang spent last week in Tokyo meeting government officials, robotics makers and dozens of supply chain executives, as the company deepens its push into Japan's manufacturing and AI ecosystem, according to a &lt;a href="https://blogs.nvidia.com/blog/japan-ecosystem-2026/"&gt;blog post &lt;/a&gt;published on Nvidia's website and its official newsroom release.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720vl205_files/6_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>China pushes AI agent interoperability and space computing at WAIC 2026</title>
<pubDate>Mon, 20 Jul 2026 02:40:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL208/china-ai-agent-cloud-development-infrastructure-2026.html</link>
<description>&lt;p class="P1" data-start="77" data-end="339"&gt;China unveiled two major AI initiatives at the 2026 World AI Conference (WAIC) in Shanghai, highlighting efforts to standardize AI agent collaboration while laying the groundwork for space-based computing infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720vl208_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Networking demand remains resilient, but component shortages threaten shipment schedules</title>
<pubDate>Mon, 20 Jul 2026 02:37:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD224/demand-component-data-center-expansion-ddr.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:320;138-457"&gt;AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry enters the second half of 2026, supplies of key components&#38;mdash;including memory, printed circuit boards (PCBs) and passive components&#38;mdash;remain tight, with lead times extending significantly.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shihmin Fu]]></media:description>
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<item>
<title>CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month</title>
<pubDate>Mon, 20 Jul 2026 02:35:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL204/dram-cxmt-capacity-ipo-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:308;106-413"&gt;Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing network following its A-share subscription on July 16. The moves have placed its capacity expansion and next-generation memory roadmap under closer scrutiny from the industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720vl204_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: CXMT]]></media:description>
</media:content></item>
<item>
<title>Nvidia grappling with internal compute needs amid GPU shortages</title>
<pubDate>Mon, 20 Jul 2026 02:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD203/nvidia-gpu-chips-tsmc-earnings.html</link>
<description>TSMC recently posted strong earnings, helped in large part by Nvidia orders, but both companies are grappling with chips inside their own operations: TSMC says they are too expensive, while Nvidia says there are not enough to go around.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720pd203_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung struggles to secure AI chip substrates, report says</title>
<pubDate>Mon, 20 Jul 2026 02:21:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715VL228/samsung-ai-chip-fc-bga-production-ibiden.html</link>
<description>&lt;p class="P1" data-start="430" data-end="675"&gt;Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers seek purchase guarantees, advance payments or direct procurement by end customers before allocating capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260715vl228_files/5_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung Electro-Mechanics]]></media:description>
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<item>
<title>Holtek sees customers prioritize supply stability over pricing as optical communications gains are expected in 2027</title>
<pubDate>Mon, 20 Jul 2026 02:03:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD220/holtek-mcu-communications-revenue-taiwan-2026.html</link>
<description>Microcontroller (MCU) supplier Holtek Semiconductor reported June 2026 revenue of NT$351 million (approx. US$12 million), up 12.62% month-over-month and 30.93% year-over-year. Revenue for the first half of 2026 reached NT$1.81 billion, an increase of 11.58% from a year earlier.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260715PD220/holtek-mcu-communications-revenue-taiwan-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260715pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>Alibaba pitches Qwen3.8 Max as 'second only to Fable 5' &#38;mdash; without the benchmarks to prove it</title>
<pubDate>Mon, 20 Jul 2026 01:36:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL202/alibaba-qwen-flagship-ai-design.html</link>
<description>Alibaba's decision to rank its newest flagship directly against a single American system &#38;mdash; describing Qwen3.8 Max as "second only to" Anthropic's Claude Fable 5 &#38;mdash; underscores how narrowly China's leading AI labs now measure themselves against the US frontier, even as they release almost nothing to back it up.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720vl202_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Moonshot reportedly eyes IPO after Kimi K3 success forces cap on new users</title>
<pubDate>Mon, 20 Jul 2026 01:28:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720VL201/ipo-launch-demand-anthropic.html</link>
<description>Moonshot AI's latest model launch is rapidly reshaping perceptions of China's artificial intelligence (AI) industry, with overwhelming demand forcing the company to suspend new consumer subscriptions only days after introducing its flagship Kimi K3 model. The move has also intensified debate over whether Western AI companies can maintain their technological lead as Chinese developers narrow the performance gap while scaling commercial adoption.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>BYD targets Japan's Kei-car stronghold with low-cost EV challenge</title>
<pubDate>Mon, 20 Jul 2026 01:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260720PD201/byd-market-niche-automakers-sales.html</link>
<description>BYD is pressing ahead with plans to enter Japan's all-electric kei-car market, stepping up promotional activity and appointing a brand ambassador in a sign of growing confidence about its formal expansion into one of the world's most specialised automotive segments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:content url="https://img.digitimes.com/newsshow/20260720pd201_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Beyond Taipower: AI, semiconductors, and overseas grids reshape Taiwan's electromechanical supply chain</title>
<pubDate>Mon, 20 Jul 2026 00:03:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD221/taiwan-taiwan-power-company-revenue-growth-demand.html</link>
<description>Taiwan's heavy-electrical and electromechanical industry is entering a new growth phase as demand expands beyond its long-standing reliance on Taiwan Power (Taipower). While Taipower's grid modernization remains the sector's foundation, semiconductor investments, AI data center construction, and overseas infrastructure projects are creating multiple growth drivers. At the same time, project-based business models are making revenue recognition increasingly uneven despite record order backlogs.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260715pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nvidia shrugs off HBM shortage, bets on AI infrastructure to sustain explosive growth</title>
<pubDate>Mon, 20 Jul 2026 00:03:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD213/nvidia-growth-infrastructure-hbm-ceo.html</link>
<description>Nvidia CEO Jensen Huang has delivered a clear message ahead of his trip to Japan: the chipmaker's growth is still accelerating, even with quarterly revenue approaching US$100 billion.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260715PD213/nvidia-growth-infrastructure-hbm-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260715pd213_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Nvidia CEO Jensen Huang. Credit: DIGITIMES]]></media:description>
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<item>
<title>Interview: AI's rise is pushing Singapore and ASEAN firms toward multicloud and security bets</title>
<pubDate>Mon, 20 Jul 2026 00:03:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD207/asean-security-infrastructure-data-google.html</link>
<description>As AI moves from experimentation to deployment, enterprises in Singapore and across ASEAN are shifting their focus from cloud adoption to multicloud integration, cybersecurity, and sovereign data control. Cloudmile chief commercial officer Jeremy Heng said the next phase of AI will be defined less by model hype than by the infrastructure needed to make systems secure, flexible, and commercially useful.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260715PD207/asean-security-infrastructure-data-google.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260715pd207_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Cloud competition in SEA shifts toward AI, sovereignty, and cost</title>
<pubDate>Mon, 20 Jul 2026 00:02:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD206/cloud-competition-cost-asia-adoption.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:305;137-441"&gt;Singapore's relatively neutral stance on cloud adoption is helping make performance, compliance, and value the main factors in global companies' decision-making. As AI moves from pilot projects to production, businesses across ASEAN are rethinking which cloud, model, and location best fit each workload.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260715PD206/cloud-competition-cost-asia-adoption.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260715pd206_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply</title>
<pubDate>Mon, 20 Jul 2026 00:02:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD237/demand-micron-globalwafers-12-inch-data.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:383;120-502"&gt;Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon wafers and critical materials. Micron and GlobalWafers recently announced a 10-year agreement, with Micron also providing US$500 million in support, marking the longest and potentially largest long-term supply agreement in GlobalWafers' history.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260716PD237/demand-micron-globalwafers-12-inch-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260716pd237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Huahsu expands capacity to tap AI and advanced packaging demand</title>
<pubDate>Mon, 20 Jul 2026 00:02:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD230/wahlee-capacity-demand-materials-packaging-supplier.html</link>
<description>Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for AI, HPC, and advanced semiconductor packaging accelerates. The company recently held a completion ceremony for its second high-resolution dry film photoresist processing plant.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260716PD230/wahlee-capacity-demand-materials-packaging-supplier.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260716pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Wah Lee]]></media:description>
</media:content></item>
<item>
<title>Hotai Leasing plans August listing as mobility business expands</title>
<pubDate>Mon, 20 Jul 2026 00:01:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD210/expansion-2026-vehicle-revenue-2025.html</link>
<description>Hotai Leasing Co., Ltd. plans to list its shares in early August 2026 as the Taiwan-based vehicle leasing provider expands its mobility and used-car businesses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms</title>
<pubDate>Mon, 20 Jul 2026 00:01:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717VL208/hanmi-hbm-usa-demand-equipment.html</link>
<description>South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that demand could outstrip supply from 2027, a bottleneck that would ripple across the AI chip buildout now being funded by the likes of Micron, SK Hynix, and TSMC.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>India roundup: India deepens semiconductor and AI ambitions as local ecosystem expands beyond fabs and assembly</title>
<pubDate>Mon, 20 Jul 2026 00:01:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717VL205/india-roundup-applied-materials-electronics-equipment-hp-subsidies.html</link>
<description>India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as it seeks a larger role in global electronics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack</title>
<pubDate>Mon, 20 Jul 2026 00:01:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717PD230/mitac-subsidiary-amd-gpu-liquid-cooling-2026.html</link>
<description>MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<title>Interview: The pragmatic playbook behind Agility Robotics' rise</title>
<pubDate>Sun, 19 Jul 2026 00:58:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260717VL216/industrial-tdk-president-robot-robotics.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:314;140-453"&gt;Humanoid robots are very hyped these days. They are performing ever more impressive feats, from pulling off coordinated dance performances to running half-marathons. Yet one investor believes that the robots ultimately winning the commercial race will be the "boring" ones with solid, real-world market potential.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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