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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Apple's iPhone growth meets a tougher test on costs</title>
<pubDate>Mon, 2 Nov 2026 23:33:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261103VL200/apple-growth-iphone-revenue-demand.html</link>
<description>Apple enters the holiday selling season with stronger demand for its core products, but its latest results show that expanding sales do not automatically translate into faster operating profit growth. Record September-quarter iPhone revenue and an all-time high for Services supported the business as research spending increased and tariff refunds helped reported margins.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Marvell pays up for Lumentum, 33 times forward earnings, to match Broadcom on lasers</title>
<pubDate>Mon, 2 Nov 2026 23:32:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261103VL201/marvell-broadcom-earnings-inp.html</link>
<description>Marvell Technology's agreement to buy Lumentum Holdings would give the custom chip designer its own supply of indium phosphide (InP) lasers, one of the scarcest components in AI data center networking, and make it one of the few suppliers spanning both the electrical and optical sides of the link. The deal positions Marvell more directly against Broadcom as connections inside AI clusters move from copper toward optics packaged alongside processors and switches.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix ramps up SOCAMM2 as material shortages push up PCB prices</title>
<pubDate>Mon, 2 Nov 2026 23:31:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL215/sk-hynix-pcb-production-materials-nvidia.html</link>
<description>SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform, while shortages of copper-clad laminate (CCL) and other materials are pushing up substrate prices, South Korea's &lt;em&gt;Dealsite&lt;/em&gt; reported on October 30.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix's SOCAMM2 memory module, designed for Nvidia's Vera Rubin AI platform. Credit: SK Hynix]]></media:description>
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<title>Beyond the robots: Three companies to watch at FIX 2026</title>
<pubDate>Mon, 2 Nov 2026 23:30:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261030VL233/2026-software-vehicle-data-automotive.html</link>
<description>Humanoid robots and self-driving cars were hard to miss at South Korea's Future Innovation Tech Expo (FIX 2026) in Daegu. But some of the less flashy technologies on display were just as interesting.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AVING]]></media:description>
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<item>
<title>Samsung Electro-Mechanics starts mass production of ADAS MLCCs</title>
<pubDate>Mon, 2 Nov 2026 23:30:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL218/semco-adas-mlcc-automotive-production.html</link>
<description>Samsung Electro-Mechanics (Semco) has begun mass production of a miniature, ultra-high-capacitance multilayer ceramic capacitor (MLCC) for advanced driver assistance systems (ADAS), as increasingly powerful automotive processors drive demand for smaller components capable of maintaining stable power supplies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung Electro-Mechanics' new ADAS MLCC. Credit: Samsung Electro-Mechanics]]></media:description>
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<title>Samsung reportedly in talks with Nidec to develop robot motors</title>
<pubDate>Mon, 2 Nov 2026 23:30:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL216/samsung-robot-nidec-robotics-development.html</link>
<description>Samsung Electronics is reportedly in talks with Japanese motor maker Nidec to jointly develop robot motors as the South Korean company expands its humanoid robotics business and pushes to automate its factories.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Nidec's Smart-FLEXWAVE precision reducer integrates sensors for robotic motion control. Credit: Nidec]]></media:description>
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<item>
<title>Nuvoton expects BMC shipments to expand in 2027 as CSPs, startups join</title>
<pubDate>Mon, 2 Nov 2026 23:30:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD232/nuvoton-bmc-shipments-demand-2027.html</link>
<description>Nuvoton expects its baseboard management controller (BMC) business to grow faster in 2027 than in 2026, driven by strong AI demand, higher orders from existing customers, and new customers entering mass production. The company said new customers, including cloud service providers (CSPs) and startups, will expand its BMC shipment base.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>DIGITIMES Insight: Intel's retreat from low-margin industrial chips opens edge AI market to AMD and Arm rivals</title>
<pubDate>Mon, 2 Nov 2026 23:29:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD230/intel-industrial-chips-amd-arm.html</link>
<description>As edge AI applications and AI agents move toward real-world deployment, industrial control and embedded processors are undergoing a structural upgrade in computing capabilities.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Powerchip Investment Holding files suit over NT$13.6B share-buying bid</title>
<pubDate>Mon, 2 Nov 2026 10:14:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD234/acquisition-management-market.html</link>
<description>Powerchip Investment Holding has filed a complaint over an alleged plan by unidentified buyers to acquire a 20% stake through coordinated share sales for more than NT$13.6 billion (US$417.4 million), raising concerns over the legality of the offer and the source of the funds.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>China's self-improving AI advances towards AGI, but Z.ai founder warns of limits and risks</title>
<pubDate>Mon, 2 Nov 2026 09:29:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL217/z.ai-agi-development-training-tsinghua-university.html</link>
<description>Z.ai co-founder Tang Jie has identified recursive self-improvement (RSI) as a critical pathway towards artificial general intelligence (AGI), arguing that AI systems capable of improving their own development processes could transform research while creating new risks for human oversight.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan aims to train 60,000 IC specialists by 2030</title>
<pubDate>Mon, 2 Nov 2026 09:13:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD235/taiwan-team-nstc-ieee-design.html</link>
<description>Taiwan is aggressively pursuing a core strategy of "Team Taiwan to Team Global," according to Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC). Wu noted that when AI chips are manufactured in Taiwan, local tech companies are the first to understand their application scenarios and strengths&#38;mdash;giving domestic industries a head start in integrating advanced AI into their own manufacturing processes.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>AI, geopolitics make Taiwan Thailand's third-largest trade partner in 1H26</title>
<pubDate>Mon, 2 Nov 2026 08:47:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD231/taiwan-2026-fdi-investment-growth.html</link>
<description>Taiwan became Thailand's third-largest trade partner in the first half of 2026 as AI growth and geopolitical shifts accelerate Taiwanese investment in the country, Taiwan Representative to Thailand Peter Lan said. Around 200,000 Taiwanese businesspeople are now based in Thailand, with the pace accelerating under the China+1 trend.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>US backs Anderon, GF quantum foundries as Intel targets QPUs with 18A process</title>
<pubDate>Mon, 2 Nov 2026 08:31:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD228/intel-globalfoundries-funding-manufacturing-policy.html</link>
<description>The US Department of Commerce is leveraging federal funding and policy initiatives to bolster America's global competitiveness in quantum technology. Its core strategy centers on consolidating fragmented industry demand by backing shared manufacturing platforms through public subsidies and government equity stakes. The Trump administration maintains that developing the domestic quantum sector requires more than just algorithms, chip design, and system-level R&#38;amp;D&#38;mdash;it also demands dedicated manufacturing infrastructure capable of serving diverse market players.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Intel]]></media:description>
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<title>Jinpao taps robotics contest to deepen Thailand ties, develop AI talent</title>
<pubDate>Mon, 2 Nov 2026 08:12:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD233/talent-competition-automation-education-smart-manufacturing.html</link>
<description>JPP Holding's Thai operating arm, Jinpao Precision Industry, joined Praksa subdistrict authorities in Samut Prakan Province, Thailand, on October 31 to hold the finals of the Jinpao&#38;ndash;Praksa automation and robotics innovation competition, strengthening its efforts to develop AI and smart-manufacturing talent locally. Chairman Chung Kuo-sung said corporate philanthropy should involve long-term engagement with local communities rather than one-time donations.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Murata to invest JPY1 trillion in expanding MLCC capacity across Asia plants</title>
<pubDate>Mon, 2 Nov 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL214/murata-mlcc-capacity-asia-demand.html</link>
<description>Murata Manufacturing announced plans to invest around JPY1 trillion (US$6.3 billion) in expanding multilayer ceramic capacitor (MLCC) capacity by 2030. Booming demand from data centers and AI applications has pushed up orders for MLCC makers. MLCCs are a crucial component in managing power demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Denso sees profits hit by memory costs, seeks price pass-through</title>
<pubDate>Mon, 2 Nov 2026 07:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD227/denso-auto-components-profit-2026.html</link>
<description>Denso, Japan's largest auto parts maker, reported falling profits for the first half of fiscal 2026 as surging memory and other component costs, driven partly by the AI boom, offset revenue growth. The company said it will pass some costs on to customers when necessary while securing supplies through long-term contracts.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TEL sees 90% profit surge as AI chip demand stays strong</title>
<pubDate>Mon, 2 Nov 2026 07:39:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD229/tokyo-electron-demand-forecast-profit-equipment.html</link>
<description>Tokyo Electron (TEL) forecasts nearly 90% annual operating-profit growth as chipmakers accelerate capital spending to meet demand for AI hardware, despite mounting concerns over an AI bubble. The company also announced a JPY150 billion share buyback program.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<item>
<title>AMOLED advances, hitting IT LCD panels</title>
<pubDate>Mon, 2 Nov 2026 07:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD225/amoled-digitimes-large-size-shipments-tft-lcd.html</link>
<description>DIGITIMES forecasts that global large-size TFT LCD shipments will reach 910 million units by 2031 as supply expansion slows and panel capacity continues to be restructured. While TV demand remains relatively stable, IT applications face growing substitution pressure from AMOLED, with TV and IT products expected to account for 27.1% and 50.1% of shipments, respectively.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI data center demand fuels THEIL's optical communications rebound, 4Q26 to buck seasonal downtrend</title>
<pubDate>Mon, 2 Nov 2026 07:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261101PD201/theil-optical-communications-data-center-demand.html</link>
<description>Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor materials, and image sensors, during an earnings call on October 30.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>BenQ Materials targets premium displays and medical growth, seeks semiconductor materials breakthrough</title>
<pubDate>Mon, 2 Nov 2026 07:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD211/benq-materials-medical-oled-panel-materials-growth.html</link>
<description>BenQ Materials is targeting higher-value, faster-growing segments across its display, medical and semiconductor materials businesses. Chairman ZC Chen said the company's transformation centres on identifying stronger growth opportunities, with medical products expanding steadily and semiconductor materials expected to make progress in customer qualification during the fourth quarter.</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[BenQ Materials chairman Dr ZC Chen (L) and president Ray Liu. Credit: DIGITIMES]]></media:description>
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<title>Macronix wins IEEE Milestone &#38;mdash; chair reveals how sNOVA transformed Taiwan's chipmaking</title>
<pubDate>Mon, 2 Nov 2026 06:20:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD226/taiwan-ieee-macronix-international-chairman-manufacturing.html</link>
<description>Memory chipmaker Macronix International Co. has become Taiwan's first semiconductor company to receive an IEEE Milestone, in recognition of its pioneering sNOVA engineering data analysis system and its contribution to semiconductor manufacturing automation.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI data center boom in Taiwan faces power, high-voltage line hurdles</title>
<pubDate>Mon, 2 Nov 2026 06:06:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD212/taiwan-data-center-power-supply-electricity-capacity.html</link>
<description>As AI data centers expand, Taiwan is facing challenges in securing power supply, battery backup, and cooling systems, with the state-run Taiwan Power Company (Taipower) requiring about two years to build dedicated 161 kV high-voltage lines. The island's limited land and growing industrial and population demand in northern Taiwan are raising concerns over whether electricity availability will keep pace with the expansion of AI computing capacity.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<title>Samsung to buy TCL CSOT stake from its own display unit for US$960 million</title>
<pubDate>Mon, 2 Nov 2026 05:47:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL213/samsung-sdc-tcl-csot-acquisition-display.html</link>
<description>Samsung Electronics plans to acquire Samsung Display's entire 10.16% stake in China's TCL CSOT for KRW1.2718 trillion (approx. US$960 million), moving the investment from its OLED-focused subsidiary to the parent company, whose TV business continues to rely on Chinese LCD panel suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Samsung Display previously operated TCL CSOT's LCD plant in Suzhou, China. Credit: TCL CSOT]]></media:description>
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<title>South Korea builds SMR ecosystem as SK Innovation advances Natrium tech, Samsung C&#38;amp;T pushes modular construction</title>
<pubDate>Mon, 2 Nov 2026 05:32:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD219/samsung-sk-innovation-technology-commercial-electricity.html</link>
<description>South Korean energy and engineering companies are positioning themselves for the emerging small modular reactor (SMR) market, with SK Innovation (SKI) seeking to build expertise through US demonstration and early commercial projects before pursuing domestic deployment, while Samsung C&#38;amp;T is focusing on modular construction to shorten project timelines, reduce costs, and accelerate commercialization.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Sustainability</category>
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<title>Iluvatar CoreX Tiangai 300 tops Nvidia H200 in select AI inference tests, with long-context and MoE gains</title>
<pubDate>Mon, 2 Nov 2026 04:45:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD208/china-gpu-ai-inference-performance-nvidia.html</link>
<description>Chinese AI chipmaker Iluvatar CoreX has released benchmarks showing its next-generation Tiangai 300 general-purpose GPU outperforming Nvidia's H200 in selected large language model (LLM) inference, long-context processing and multimodal generation workloads.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Iluvatar CoreX]]></media:description>
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<title>RichWave sees Wi-Fi 7 reaching 50% share in 2027</title>
<pubDate>Mon, 2 Nov 2026 04:41:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD224/design-wi-fi-7-richwave-rf-ic-2027.html</link>
<description>Radio frequency (RF) IC design house RichWave Technology stated at its recent investor conference that memory supply constraints, rather than end demand, are curbing networking equipment shipments despite resilient overall market demand. The company expects Wi-Fi 7 to capture half of its Wi-Fi market share in 2027 as telecom operators and retail router customers accelerate upgrade cycles.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd224_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Schneider and Foxconn accelerate modular AI factory deployment as token usage surges 60-Fold</title>
<pubDate>Mon, 2 Nov 2026 04:33:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD222/foxconn-data-center-demand-capacity-cooling.html</link>
<description>The boom in generative AI is rapidly driving demand for data center construction, making power supply, cooling, and energy management central challenges for AI infrastructure. Speaking at Hon Hai Tech Day 2026 (HHTD 26), Himanshu Prasad, Senior Vice President at Schneider Electric, projected that global data center capacity will reach 300 GW over the next four to five years, with roughly 65% of all new capacity dedicated to AI workloads.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Foxconn takes AI beyond clinical software with hospital partnerships and medical robotics</title>
<pubDate>Mon, 2 Nov 2026 04:31:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD223/foxconn-medical-robotics-hospital-healthcare.html</link>
<description>Foxconn is expanding its AI capabilities into clinical workflows, medical robotics and healthcare manufacturing, working with hospitals, equipment makers and technology partners to build an integrated smart healthcare ecosystem. Its strategy follows an ecosystem-to-clinical deployment framework spanning products, edge-cloud computing and software-hardware integration, reflecting Nvidia's five-layer AI architecture.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>MediaTek pins second ASIC project and customer to 2028</title>
<pubDate>Mon, 2 Nov 2026 04:23:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD217/mediatek-asic-2028-market-earnings.html</link>
<description>MediaTek's latest earnings call focused heavily on its data-center ASIC business, as CEO Rick Tsai and CFO David Ku addressed market rumors about delays to its second AI accelerator ASIC project, EMIB packaging yields, and the identity of its second customer. The company said its major customer's second-generation project remains on track for mass production in the first quarter of 2028, while the second customer will also begin contributing revenue in 2028.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung partners with PXPay to bolster Samsung Wallet in Taiwan</title>
<pubDate>Mon, 2 Nov 2026 04:10:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD220/mobile-samsung-samsung-electronics-taiwan-sales-smartphone.html</link>
<description>Samsung Electronics Taiwan is partnering with local mobile payment platform PXPay as part of its expansion of Samsung Wallet applications. The move, announced on October 30 with services beginning on November 1, follows the earlier integration of tap-and-pay EasyCard functions into Samsung Wallet and aims to strengthen Samsung's competitiveness in Taiwan's mobile payment market. It forms part of a key strategy focused on the value of the company's proprietary applications as surging memory prices continue to impact smartphone sales numbers.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd220_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Samsung's Lee bets on Japan for AI chip packaging edge</title>
<pubDate>Mon, 2 Nov 2026 04:09:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL212/samsung-chairman-japan-ai-chip-packaging-materials.html</link>
<description>Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to strengthen its advanced packaging capabilities for AI processors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102vl212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
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<title>DIGITIMES chairman: Taiwan-South Korea cooperation beats competition in AI race</title>
<pubDate>Mon, 2 Nov 2026 04:06:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD218/taiwan-competition-chairman-digitimes-industrial.html</link>
<description>Artificial intelligence (AI) is rapidly expanding global semiconductor demand, prompting Taiwan and South Korea to shift from straightforward competition toward cooperation as the AI chip supply chain grows more complex. Colley Hwang, chairman and CEO of DIGITIMES, said Taiwan's semiconductor success stems not only from TSMC, but also from an ecosystem built on specialization, industrial clusters, talent, and capital markets.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102pd218_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Exclusive: How Germany's fast-follower economy reshapes the AI PC race as local AI awaits killer app</title>
<pubDate>Mon, 2 Nov 2026 04:06:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL206/ai-pc-germany-market-hardware.html</link>
<description>As AI PC configurations reach new technological heights amid a broader push toward higher-spec machines, the market is moving steadily toward wider adoption of AI-capable hardware.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261102vl206_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee; AI-assisted background modification by DIGITIMES.]]></media:description>
</media:content></item>
<item>
<title>Lite-On boosts 2027 capex as AI race raises stakes for CSPs</title>
<pubDate>Mon, 2 Nov 2026 03:55:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102PD216/lite-on-2027-capex-revenue-high-end.html</link>
<description>Lite-On Technology will continue increasing capital expenditure in 2027 as cloud service providers (CSPs) pour money into the artificial intelligence (AI) infrastructure race, president Anson Chiu said. He warned that CSPs that stop investing to secure market share will pay an even higher price for falling behind in the irreversible AI era.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Sam Altman meets with Samsung, SK as memory crunch deepens</title>
<pubDate>Mon, 2 Nov 2026 03:53:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261102VL211/openai-sam-altman-samsung-sk-hynix-memory-chips-demand.html</link>
<description>OpenAI CEO Sam Altman met with executives from Samsung Group and SK Group during a brief visit to South Korea on October 31, as tightening memory supplies and growing commitments to major AI customers raise the stakes for the company's semiconductor and data center partnerships.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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