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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 22 May 2026 22:00:04 GMT</lastBuildDate>
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<title>Taiwan broadband CPE industry, 1Q 2026: 10G upgrades drive volume but pricing pressures linger</title>
<pubDate>Fri, 22 May 2026 08:27:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260520RS400/broadband-cpe-2026-10g-taiwan.html?chid=2</link>
<description>Global broadband CPE shipments in the second quarter of 2026 are estimated to see a yearly growth of 3.4%, with PON CPE supporting shipment growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>AIoT</category>
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<title>AMD's Lisa Su says memory is becoming another pressure point for AI chips</title>
<pubDate>Fri, 22 May 2026 07:56:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD237/amd-lisa-su-cowos-packaging-memory-chips.html</link>
<description>&lt;p class="P1" data-start="300" data-end="474"&gt;AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>AMD's Lisa Su says AI demand is 'absolutely real' as CPUs return to focus</title>
<pubDate>Fri, 22 May 2026 07:05:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD236/amd-lisa-su-ai-demand.html</link>
<description>&lt;p class="P1" data-start="422" data-end="587"&gt;AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Trump calls off executive order for AI safety due to concerns about inhibiting growth</title>
<pubDate>Fri, 22 May 2026 06:45:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL204/usa-donald-trump-ai-security.html</link>
<description>&lt;p class="P1" data-path-to-node="1"&gt;US President Donald Trump abruptly called off a highly anticipated White House signing ceremony for a sweeping executive order intended to establish a federal safety vetting framework for advanced artificial intelligence (AI) models.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>China's tech grip forces India's renewable energy ambitions into structural dependence on Beijing's battery supply chains</title>
<pubDate>Fri, 22 May 2026 06:34:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260520VL210/reliance-renewable-energy-catl-battery-manufacturing.html</link>
<description>Reliance's pivot from domestic manufacturing to component procurement reveals the geopolitical constraints reshaping India's clean energy transition and raising questions about supply chain resilience in critical infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Anthropic reportedly eyes Microsoft Maia chips to cut Nvidia reliance</title>
<pubDate>Fri, 22 May 2026 06:17:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL211/anthropic-microsoft-chips-infrastructure-nvidia.html</link>
<description>&lt;p class="P1" data-start="82" data-end="442"&gt;Microsoft is in early discussions to provide AI servers powered by its in-house Maia chips to Anthropic, deepening ties between the two companies as cloud providers race to reduce dependence on Nvidia hardware and secure a stronger position in the AI infrastructure market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Anthropic CEO Dario Amodei. Credit: AFP]]></media:description>
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<item>
<title>EverDisplay appoints former Hua Hong executive as chairman in board overhaul</title>
<pubDate>Fri, 22 May 2026 05:28:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD234/amoled-panel-chairman-market-technology.html</link>
<description>China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: EverDisplay]]></media:description>
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<item>
<title>Amkor expands Arizona semiconductor packaging campus with additional 67 acres</title>
<pubDate>Fri, 22 May 2026 05:24:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL206/amkor-arizona-packaging-expansion-investment.html</link>
<description>&lt;p class="P1" data-start="0" data-end="211"&gt;Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AMD deepens China packaging alliance with TF-AMD expansion in Suzhou</title>
<pubDate>Fri, 22 May 2026 04:47:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL210/amd-packaging-expansion-lisa-su-ceo.html</link>
<description>AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[AMD CEO Lisa Su. Credit: AFP]]></media:description>
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<item>
<title>Taiwan moves to govern AI across risk, talent, and education</title>
<pubDate>Fri, 22 May 2026 04:45:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD231/taiwan-development-talent-governance-government.html</link>
<description>Taiwan's cabinet approved three sweeping AI policy initiatives in a single sitting on May 21, signaling a rare moment of whole-of-government alignment on artificial intelligence. The measures span regulation, workforce certification, and school-level education &#38;mdash; a coordinated bet that getting the governance right now will determine who leads in AI later.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<item>
<title>AIC expands analog ICs into fiber optics; orders reach 1Q27</title>
<pubDate>Fri, 22 May 2026 04:42:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD215/aic-expansion-2026-2027-growth.html</link>
<description>AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub</title>
<pubDate>Fri, 22 May 2026 04:41:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PR202/broadcom-applied-materials-globalfoundries-meta-synopsys-california-semiconductors.html</link>
<description>Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globally.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: UCLA]]></media:description>
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<item>
<title>Tesla ramps up hiring for self-driving team in China</title>
<pubDate>Fri, 22 May 2026 04:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL203/ev-mobility.html</link>
<description>Tesla has begun recruiting for driver-assistance roles in China as it pushes ahead to bring its full self-driving (FSD) system to market. The move comes after repeated delays and amid growing pressure from local competitors &#38;mdash; including Xpeng Motors, Xiaomi Auto, and Huawei Technologies &#38;mdash; on the US electric vehicle (EV) maker's market share.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit:Bloomberg]]></media:description>
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<item>
<title>WPG Holdings flags server supply gaps amid memory price hikes, 800V shift</title>
<pubDate>Fri, 22 May 2026 04:23:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260520PD241/wpg-price-demand-revenue-growth.html</link>
<description>Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Japan, South Korea deepen energy ties: LNG, supply chains and AI security top summit agenda</title>
<pubDate>Fri, 22 May 2026 04:21:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260520VL212/south-korea-japan-industrial-security-supply-chain.html</link>
<description>&lt;p class="P1" data-start="0" data-end="279"&gt;Japan and South Korea have agreed to deepen cooperation on energy security and supply chain resilience, placing crude oil, petroleum products, LNG, and critical industrial materials at the centre of a wider effort to manage geopolitical shocks from the Middle East to North Korea.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Japanese Prime Minister Sanae Takaichi (L) and South Korean President Lee Jae-myung. Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Win Win Precision pivots to semiconductors and overseas renewables</title>
<pubDate>Fri, 22 May 2026 04:20:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD217/win-win-precision-business-demand-renewable-energy-solar.html</link>
<description>Win Win Precision is reshaping its business around semiconductor consumables and overseas renewable energy, a strategic pivot that could tighten global supply chains and accelerate green energy deployment. Investors, manufacturers, and policymakers worldwide stand to be affected by its capacity expansion, raw-material strategies, and growing presence in Europe, Australia, and Taiwan's green-power market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Taiwan rides chip-led export boom to bankroll industrial overhaul</title>
<pubDate>Fri, 22 May 2026 04:06:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD210/taiwan-demand-industrial-tsmc-government.html</link>
<description>AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02 trillion) in 2026.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Taiwan Presidential Office]]></media:description>
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<item>
<title>NIO posts operating profit and strong revenue growth in Q1 of 2026</title>
<pubDate>Fri, 22 May 2026 03:57:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL209/2026-revenue-growth-operating-profit-vehicle.html</link>
<description>Nio reported a return to operating profitability in the first quarter of 2026, marking its second consecutive profitable quarter as revenue and deliveries surged on stronger demand and an improved product mix.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Emerging Display Technologies pivots to UMI, targets 2026 growth</title>
<pubDate>Fri, 22 May 2026 03:54:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD211/edt-2026-growth-2025-revenue.html</link>
<description>Emerging Display Technologies is repositioning around integrated user-machine interface solutions, with plans to expand outside China and ramp up R&#38;amp;D investment as it navigates forecast revenue and profit declines in 2025 before targeting a return to growth in 2026.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Forcelead Technology bets on stable 2026 as it expands into TDDI and new automotive displays</title>
<pubDate>Fri, 22 May 2026 03:53:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD218/automotive-display-tddi-growth-2026.html</link>
<description>Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Xiaomi expands YU7 lineup with new GT model and entry-level variant</title>
<pubDate>Fri, 22 May 2026 03:50:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL208/xiaomi-beijing-launch-performance-automotive.html</link>
<description>On May 21 in Beijing, Xiaomi held its "Human&#38;ndash;Car&#38;ndash;Home" ecosystem product launch event, where founder, chairman, and CEO Lei Jun unveiled the updated Xiaomi YU7 family, introducing two new variants: the YU7 GT and the YU7 Standard Edition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Tata's Assam OSAT plant nears production as India expands chip manufacturing ambitions</title>
<pubDate>Fri, 22 May 2026 03:44:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL200/production-plant-manufacturing-tata-group-development.html</link>
<description>Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26</title>
<pubDate>Fri, 22 May 2026 03:32:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD201/ap-memory-capacitor-design-production-intel-emib.html</link>
<description>Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced packaging solution, as shipments gain strong momentum.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>China's Wuhan optics hub bets big on AI with 12.8T module debut</title>
<pubDate>Fri, 22 May 2026 03:32:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD226/adoption-optics-language-data-center-chips.html</link>
<description>The rapid adoption of generative AI, large language models, and AI agents is accelerating global data center construction and driving a new growth cycle in optical communications. Wuhan East Lake High-Tech Development Zone, also known as Optics Valley of China, has re-emerged as a focal point in China's optoelectronics industry.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Huagong Tech]]></media:description>
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<title>Samsung's GaN setback puts foundry shift in focus</title>
<pubDate>Fri, 22 May 2026 03:12:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL205/samsung-gan-semiconductors-sic-business.html</link>
<description>&lt;p class="P1" data-start="302" data-end="541"&gt;Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to&lt;em&gt; The Elec&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260522vl205_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>Memory shortage reaches smartphone OLED market as shipments fall 12%</title>
<pubDate>Fri, 22 May 2026 02:51:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522VL202/smartphone-oled-panel-shipments-dai-nippon-printing-sdc-lg-display.html</link>
<description>&lt;p class="P1" data-start="109" data-end="313"&gt;A global memory shortage is spreading into the smartphone OLED market, cutting handset production and adding pressure on display makers and their component suppliers, according to&lt;em&gt; ETNews&lt;/em&gt; and UBI Research.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522VL202/smartphone-oled-panel-shipments-dai-nippon-printing-sdc-lg-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522vl202_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Nvidia's rapid AI iteration cycle strains supply chain partners</title>
<pubDate>Fri, 22 May 2026 02:31:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD214/nvidia-supply-chain-demand-auras-revenue.html</link>
<description>Nvidia's record revenue, profit, and margins are masking growing strain across its supply chain, as increasingly compressed product cycles and surging AI demand force suppliers to accelerate development, boost spending, and manage rising quality risks, according to executives and industry observers tracking preparations for the company's next-generation AI platforms.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD214/nvidia-supply-chain-demand-auras-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC</title>
<pubDate>Fri, 22 May 2026 02:23:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD213/samsung-tsmc-taiwan-mediatek-chairman.html</link>
<description>Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD213/samsung-tsmc-taiwan-mediatek-chairman.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd213_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AMD backs Taiwan EFB packaging chain to cut CoWoS reliance</title>
<pubDate>Fri, 22 May 2026 02:19:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD228/amd-packaging-cowos-taiwan-tsmc.html</link>
<description>&lt;p class="P1" data-start="80" data-end="357"&gt;AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on an &lt;strong&gt;elevated fanout bridge&lt;/strong&gt; (&lt;strong&gt;EFB&lt;/strong&gt;) &lt;strong&gt;packaging ecosystem&lt;/strong&gt;.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD228/amd-packaging-cowos-taiwan-tsmc.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd228_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[AMD is reportedly building a non-CoWoS AI chip packaging supply chain in Taiwan. Pictured is AMD CEO Lisa Su. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China telcos launch token billing, AI inference goes mass-market</title>
<pubDate>Fri, 22 May 2026 02:13:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD204/telecom-china-telecom-2025-china-mobile-china-unicom.html?chid=10</link>
<description>China's three major telecom operators introduced token-based billing plans in May as they packaged large-model inference resources into standardized products for consumers, developers, and enterprises, signaling a shift toward mass-market AI compute services. China Telecom rolled out a nationwide group-level token package on May 17 with tiered plans for individual and household users, developers, small and medium-sized enterprises, and ecosystem partners; its lowest-priced individual plan costs CNY9.9 (US$1.46) per month for access to 10 million tokens.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD204/telecom-china-telecom-2025-china-mobile-china-unicom.html?chid=10</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Kian-Shen sees electric bus orders surge as BMW battery box trials set for fourth quarter</title>
<pubDate>Fri, 22 May 2026 02:10:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD210/electric-bus-bmw-revenue-production-vehicle.html</link>
<description>Kian-Shen Industrial, a vehicle frame and platform maker under Yulon Motor Group, reported at its first-quarter 2026 earnings briefing that electric bus frame orders surged and that trial production of battery boxes for BMW was scheduled to begin in the fourth quarter, with the main financial impact expected in 2028. Executives said two new products were progressing toward trial production and mass production, and the company signaled plans to scale manufacturing to meet rising demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD210/electric-bus-bmw-revenue-production-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd210_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: Samsung deal prevents walkout but deepens internal rifts over compensation</title>
<pubDate>Fri, 22 May 2026 02:10:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD221/samsung-business-labor-strike-talent.html</link>
<description>Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD221/samsung-business-labor-strike-talent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>South Korea aims for 50% domestic defense semiconductor supply by 2029</title>
<pubDate>Fri, 22 May 2026 02:08:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD208/semiconductors-security-production-chips-government.html</link>
<description>South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national security. The initiative, unveiled at the 2026 Advanced Strategic Semiconductor Innovation Conference, covers research and development, manufacturing, ecosystem building and workforce training and follows the recent passage of the Defense Semiconductor Act by the National Assembly on May 7, 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD208/semiconductors-security-production-chips-government.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd208_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Auto cyber losses topped US$20 billion in 2025 as carmakers tighten defenses</title>
<pubDate>Fri, 22 May 2026 02:05:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD211/2025-software-security-europe-infrastructure.html</link>
<description>Automakers and their suppliers faced more than US$20 billion in damage from software flaws and cyberattacks in 2025 as the industry accelerated toward software-defined vehicles, according to an analysis released by the Center of Automotive Management in March 2026. The report said rising connectivity and increasingly complex electronic architectures expanded attack surfaces and intensified national security concerns across Europe, the US, and China.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD211/2025-software-security-europe-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd211_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Hotai Motor to trial hydrogen buses and weighs US-made SUVs and pickups as revenue hits record</title>
<pubDate>Fri, 22 May 2026 02:01:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD209/2026-ev-market-share-revenue-sales-taiwan.html</link>
<description>Hotai Motor Co. said it evaluated importing US-made large SUVs and pickup trucks and announced trial operations for a hydrogen bus fleet in southern Taiwan in the third quarter of 2026, as the automotive group reported record revenue for April and for the first four months of 2026. The company attributed the revenue highs to strong domestic deliveries and the first-time consolidation of five newly acquired Hino dealerships in Japan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD209/2026-ev-market-share-revenue-sales-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd209_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>InPsytech taps former Altera and Intel executive as senior strategy adviser to drive global expansion</title>
<pubDate>Fri, 22 May 2026 01:59:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD203/inpsytech-altera-expansion-egis-technology-growth.html</link>
<description>InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support global market expansion and large-scale growth. The firm said the appointment aims to leverage the adviser's semiconductor leadership experience to guide worldwide strategy and help scale the company's business in international markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD203/inpsytech-altera-expansion-egis-technology-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd203_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Vsora]]></media:description>
</media:content></item>
<item>
<title>Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption</title>
<pubDate>Fri, 22 May 2026 01:49:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD223/lam-research-plp-panel-production-process-control-equipment.html</link>
<description>Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&#38;amp;D or alliances and that several customers could start trial production within the next one to two years.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD223/lam-research-plp-panel-production-process-control-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AUO ditches panel era with three new business lines for next decade</title>
<pubDate>Fri, 22 May 2026 01:36:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD224/auo-panel-business-2026-display.html</link>
<description>Looking ahead to 2026, AUO said the global economy is stabilizing and returning to growth, but that international trade disputes and regional conflicts still pose risks. It added that the consumer electronics market is also being weighed down by AI-driven inflation and weak demand, creating more uncertainty for an industry recovery.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD224/auo-panel-business-2026-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd224_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan to launch AI strategy committee for coordinating AI governance</title>
<pubDate>Fri, 22 May 2026 01:34:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD224/ai-development-governance-government-nstc-taiwan.html</link>
<description>Taiwan's Executive Yuan will formally establish a special committee on national strategies in AI, which will be headed by the Premier and tasked with coordinating, promoting and overseeing AI policy nationwide. In addition, the National Science and Technology Council (NSTC) will take the lead in drafting Taiwan's first guidelines for national AI development, which will be submitted to the strategy committee for review.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD224/ai-development-governance-government-nstc-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd224_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Taiwan's Executive Yuan]]></media:description>
</media:content></item>
<item>
<title>BenQ Qisda Group to spotlight AI deployments at COMPUTEX 2026</title>
<pubDate>Fri, 22 May 2026 01:32:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD200/benq-qisda-computex-2026-infrastructure.html</link>
<description>BenQ Qisda Group will participate in COMPUTEX 2026 under the theme "AI In Action," showcasing how artificial intelligence (AI) is being applied in real-world deployments. BenQ Qisda will bring together group companies to showcase a comprehensive AI portfolio ranging from computing infrastructure to industry solutions.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD200/benq-qisda-computex-2026-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd200_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Qisda]]></media:description>
</media:content></item>
<item>
<title>TSMC supply chain material maker AMC rides AI packaging yield boom</title>
<pubDate>Fri, 22 May 2026 01:30:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD201/materials-tsmc-packaging-production-2026.html</link>
<description>&lt;p class="P1" data-start="75" data-end="375"&gt;Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260522PD201/materials-tsmc-packaging-production-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260522pd201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Tech Forum 2026: As notebook and smartphone sales slow, AI devices take a larger share</title>
<pubDate>Fri, 22 May 2026 01:29:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD217/smartphone-2026-shipments-sales-market.html</link>
<description>&lt;p class="P1" data-start="312" data-end="521"&gt;Global notebook and smartphone shipments are expected to weaken in 2026, but AI-enabled devices are set to take a larger share of both markets as component shortages and rising chip prices reshape the outlook.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD217/smartphone-2026-shipments-sales-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd217_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BOE, Corning target glass substrates for AI chip packaging</title>
<pubDate>Fri, 22 May 2026 01:28:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD228/boe-packaging-corning-ai-chip-display.html</link>
<description>&lt;p class="P1" data-start="121" data-end="494"&gt;BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD228/boe-packaging-corning-ai-chip-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd228_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[BOE chairman Chen Yanshun. Credit: BOE]]></media:description>
</media:content></item>
<item>
<title>AI memory crunch pushes Nanya Technology toward 2027 fab ramp</title>
<pubDate>Fri, 22 May 2026 01:27:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD233/nanya-technology-fab-2027-2026-dram.html</link>
<description>&lt;p class="P1" data-start="81" data-end="456"&gt;Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD233/nanya-technology-fab-2027-2026-dram.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd233_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>As AI reshapes data center power, Liteon bets on silicon photonics</title>
<pubDate>Fri, 22 May 2026 01:21:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260520PD235/photonics-silicon-data-center-2026-revenue.html</link>
<description>&lt;p class="P1" data-start="1786" data-end="1996"&gt;Liteon Technology is positioning 2026 as a reset year after marking its 50th anniversary in 2025, as the company pushes deeper into AI data center power systems and begins developing silicon photonics products.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260520PD235/photonics-silicon-data-center-2026-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260520pd235_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Foxtron pushes into consumer EVs with Bria and Cavira launches</title>
<pubDate>Fri, 22 May 2026 01:19:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD227/foxtron-foxconn-vehicle-brand-development.html</link>
<description>&lt;p class="P1" data-start="0" data-end="172"&gt;Foxtron has moved quickly to expand its electric-vehicle lineup, signaling an acceleration of Foxconn's ambitions in the global auto industry.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD227/foxtron-foxconn-vehicle-brand-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd227_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Global corporates take the pitch stage at Plug and Play Silicon Valley May Summit 2026</title>
<pubDate>Fri, 22 May 2026 01:17:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521VL228/silicon-valley-2026-data-industrial-technology.html</link>
<description>At Plug and Play Silicon Valley May Summit 2026, 12 global corporate leaders took the stage for a "Corporate Reverse Pitch," inviting potential partners to co-create solutions for the next decade of industry challenges.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521VL228/silicon-valley-2026-data-industrial-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521vl228_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI agents reshape enterprise computing, Lisa Su and Kai-Fu Lee say</title>
<pubDate>Fri, 22 May 2026 01:17:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD214/amd-lisa-su-2026-shanghai-ceo.html</link>
<description>At AMD AI DevDay 2026 in Shanghai, AMD CEO Lisa Su and 01.AI founder Kai-Fu Lee outlined what could become the next major shift in artificial intelligence: the transition from generative AI chatbots to autonomous AI agent systems. Their discussion focused on AI agents, multi-agent collaboration, open-source ecosystems and next-generation AI computing infrastructure, signalling a broader industry shift from "question-and-answer" AI towards systems capable of independently executing enterprise goals.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260521PD214/amd-lisa-su-2026-shanghai-ceo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260521pd214_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Lisa Su (R) and Kai-Fu Lee speak at AMD AI DevDay in Shanghai on May 19, discussing AI agents and open-source ecosystems. Credit: 01.AI]]></media:description>
</media:content></item>
<item>
<title>Khgears to expand into humanoid robots in 2026 while pursuing Japan Tier 1 alliance</title>
<pubDate>Fri, 22 May 2026 00:37:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD206/2026-robotics-robot-alliance-industrial.html</link>
<description>Khgears International said it would intensify a robotics push in 2026 by expanding from industrial robot gears into humanoid robot components and by seeking a strategic alliance with a Tier 1 supplier tied to one of Japan's four major robot families, executives said after a shareholders' meeting on May 21. The precision gearmaker reported that smart transmission products accounted for a record 12% of revenue in the first quarter of 2026 and expects smart transmissions to represent more than 10% of full-year revenue in 2026, up from about 7% in 2025.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taobao pivots to AI-driven localization to boost repeat purchases in over 200 markets</title>
<pubDate>Fri, 22 May 2026 00:34:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD205/demand-algorithms-market.html</link>
<description>Taobao is shifting its cross-border strategy from low-priced transactions to customer lifetime value by using artificial intelligence to surface latent demand and improve localized recommendations, the platform announced as it expanded into more than 200 markets and saw rapid growth in overseas downloads. Executives said the app ranked No. 1 in downloads across 16 overseas markets in April 2025 and that the overseas business had entered a phase of rapid growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>French AION consortium to bid for EU funding to build ?10B AI data center campus</title>
<pubDate>Fri, 22 May 2026 00:23:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD212/data-center-eu-funding-capacity-2025.html</link>
<description>A French consortium called AION said it would bid for EU AI infrastructure funding to build a large AI data center campus in France worth as much as EUR10 billion (US$11.6 billion). The group formed in 2025 and is pursuing the project as part of the EU's effort to boost domestic AI capacity and reduce reliance on US technology, executives said.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>UiPath offers on-premises Agentic AI to help regulated firms meet security and compliance needs</title>
<pubDate>Fri, 22 May 2026 00:20:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD207/security-data.html</link>
<description>UiPath announced an on-premises Agentic AI deployment service and Automation Suite designed to help regulated industries adopt AI while maintaining data security and compliance. The vendor said the move, revealed in late May, targeted sectors including banking, financial services, insurance, healthcare, and the public sector in Taiwan and Greater China, where strict data residency and governance rules have limited cloud-only AI adoption.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>E Ink unveils new controller architecture to boost large-format e-paper video performance</title>
<pubDate>Fri, 22 May 2026 00:18:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD202/e-paper-e-ink-performance-display-development.html</link>
<description>E Ink Holdings said it launched a new-generation e-paper controller architecture centered on its color e-paper timing controller chip, T2000, to improve video playback smoothness on large-format e-paper displays and enable retail advertising screens to run ad video in sync. The company announced the development ahead of its COMPUTEX 2026 showcase in Taipei and positioned the architecture as a step toward more interactive, dynamic e-paper applications for signage and consumer devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>AMD deepens Taiwan supply chain ties with US$10B-plus push</title>
<pubDate>Thu, 21 May 2026 19:09:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260522PD200/amd-taiwan-taiwan-supply-chain-tsmc-ceo.html</link>
<description>AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate AI infrastructure buildout.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>US-Japan cooperation could protect Taiwan '99%', defense investors told at Silicon Valley summit</title>
<pubDate>Thu, 21 May 2026 18:17:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521VL229/taiwan-silicon-valley-military-technology-semiconductor-industry.html</link>
<description>Taiwan's semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play Silicon Valley May Summit, as investors and defense technology executives described a geopolitical environment that is fundamentally reshaping where capital flows and why.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Intel's foundry reset: 14A, 10A and tougher engineering rules</title>
<pubDate>Thu, 21 May 2026 18:16:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD235/intel-ceo-high-na-euv-development-tsmc.html</link>
<description>Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Intel CEO Lip-Bu Tan. Credit: AFP]]></media:description>
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<title>Far EasTone eyes 2027 Amazon Leo launch to strengthen Taiwan network resilience</title>
<pubDate>Thu, 21 May 2026 18:16:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD236/amazon-taiwan-2027-launch-mobile.html</link>
<description>Far EasTone has secured Taiwan distribution rights for Amazon Leo, Amazon's low Earth orbit (LEO) satellite internet service formerly known as Project Kuiper, positioning the telecom operator to add satellite connectivity as a backup layer for its mobile and fixed-line networks.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Far EasTone president Chee Ching. Credit: DIGITIMES]]></media:description>
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<title>Lam Research launches PLP Center of Excellence, replacing wafers with panels</title>
<pubDate>Thu, 21 May 2026 18:16:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD237/packaging-lam-research-technology-manufacturing-chips.html</link>
<description>Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at strengthening PLP process R&#38;amp;D capabilities and driving scalable manufacturing solutions to meet advanced packaging demands in the AI era.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Tech Forum 2026: AI agents drive Arm CPU demand surge; 2026 shipments expected to exceed 6 million units</title>
<pubDate>Thu, 21 May 2026 18:15:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD238/2026-shipments-demand-cpu-arm.html</link>
<description>On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications." In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens</title>
<pubDate>Thu, 21 May 2026 18:14:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521VL222/nvidia-niche-silicon-accelerator-hardware.html</link>
<description>Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market adoption remains constrained by structural limitations in throughput and memory capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026</title>
<pubDate>Thu, 21 May 2026 18:13:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521VL226/pnp-summit-2026-semiconductor-industry-startup-data-security.html</link>
<description>At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for AI, and AI-driven quality engineering. Startups, including Enclave Semiconductor, Bedrock Semiconductor, and Lattice, presented solutions aimed at securing and optimizing the global electronics ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Two-year-old Chinese robotics firm claims to supply nine of world's top ten tech giants</title>
<pubDate>Thu, 21 May 2026 18:13:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521VL230/robotics-robot-hardware-commercial-amazon.html</link>
<description>Wayne Wang, senior director of commercialization at Robot Era, used the 5th Mobis Mobility Day in Sunnyvale to present a two-year-old Chinese robotics company that has already supplied hardware to nine of the world's top ten technology companies &#38;mdash; including Apple, Nvidia, Amazon and Microsoft.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Tech Forum 2026: Starlink dominates LEO internet market as telecoms shift strategy</title>
<pubDate>Thu, 21 May 2026 18:12:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD229/digitimes-leo-internet-starlink-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="245"&gt;At DIGITIMES' Tech Forum 2026 this week, analysts said satellite-based internet services are rapidly emerging as one of the most fiercely contested frontiers in the global connectivity market, with SpaceX's Starlink at the center of the battle.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Aerospace</category>
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<title>AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output</title>
<pubDate>Thu, 21 May 2026 14:20:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260521PD239/amd-taiwan-lisa-su.html</link>
<description>Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial intelligence (AI) infrastructure. The announcement was made during her visit to Taiwan, where she also disclosed the latest progress in collaborations with Taiwan Semiconductor Manufacturing Company (TSMC), backend packaging and testing, substrate, and AI server supply chains.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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