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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 16 Oct 2026 03:00:03 GMT</lastBuildDate>
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<title>Nvidia-backed CoreWeave bond spike highlights debt risks in the AI infrastructure boom</title>
<pubDate>Fri, 16 Oct 2026 02:52:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL208/infrastructure-market-nvidia-demand-business.html</link>
<description>A sharp sell-off across artificial intelligence infrastructure stocks has turned a quiet worry about debt into a main concern for Wall Street. The sudden drop in stock and bond prices for CoreWeave, a fast-growing cloud provider backed by Nvidia, has raised questions about whether the heavy borrowing used to fund the AI expansion is becoming too risky.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung's India chip research arm opens quantum lab at IISc</title>
<pubDate>Fri, 16 Oct 2026 02:39:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL204/samsung-india-quantum-workforce.html</link>
<description>Samsung Semiconductor India Research (SSIR), Samsung's semiconductor research and development center in India, and the Indian Institute of Science (IISc) inaugurated a Quantum Research Lab on the IISc campus in Bengaluru on October 15, 2026, aiming to build India's research capabilities in quantum technologies and advanced semiconductors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones</title>
<pubDate>Fri, 16 Oct 2026 02:39:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD215/lg-innotek-2028-glass-substrate-automotive-business.html</link>
<description>LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean components maker seeks to reduce its reliance on smartphone camera modules and expand into automotive technologies.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>Chip inflation drives Samsung, LG toward premium TVs</title>
<pubDate>Fri, 16 Oct 2026 02:32:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD205/tv-samsung-lg-market-inflation.html</link>
<description>Global TV market growth is under pressure, but premium models are poised to expand. As rising memory prices fuel "chip inflation" and squeeze margins on budget TVs, Samsung Electronics and LG Electronics are reshaping their product mixes, strengthening OLED and Micro RGB offerings to support pricing through picture quality and feature differentiation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Japan's automakers turn to vehicle-road coordination to advance autonomous driving</title>
<pubDate>Fri, 16 Oct 2026 02:31:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD212/automakers-technology-infrastructure-vehicle-nissan.html</link>
<description>Japan's automakers are presenting autonomous-driving systems that connect vehicles with road infrastructure as a route toward deployment, highlighting a strategic choice beyond vehicle-only artificial intelligence. At Japan Mobility Show Bizweek 2026, Nissan, Subaru, and Toyota are demonstrating technologies that combine onboard systems, cloud data, sensors, and communications to improve safety.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<title>US pushes AI exports as chip industry flags supplier gaps and reshoring costs</title>
<pubDate>Fri, 16 Oct 2026 02:30:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD217/semicon-west-usa-ai-exports-investment-supplier-2026.html</link>
<description>At SEMICON West 2026, US officials and lawmakers promoted domestic manufacturing and AI export policies, while industry executives warned that supplier shortages, the premium for US-made products, and export controls could undermine the country's semiconductor ambitions.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Meta releases Muse Spark Open weights, reversing its closed course with conditions</title>
<pubDate>Fri, 16 Oct 2026 02:27:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL207/meta-display-microsoft-amazon-google-cloud.html</link>
<description>Meta on Thursday released the weights of Muse Spark Open, which it calls the most capable US open-weight model to date. The company said the multimodal model has 816 billion total parameters (42 billion active) and a one-million-token context window, and is built for coding and agentic work. Meta said the weights can be downloaded from Hugging Face, Amazon SageMaker AI, Google Cloud, and Microsoft Foundry. It also said the model received extra safety post-training and met the thresholds of its internal risk framework.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>TSMC deal could slow Musk's Terafab, but US suppliers still see upside</title>
<pubDate>Fri, 16 Oct 2026 02:24:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD211/tsmc-elon-musk-texas-fab-manufacturing.html</link>
<description>The feasibility of Terafab's proposed construction was a major topic of discussion among semiconductor suppliers during SEMICON West 2026, held October 13&#38;ndash;15 in San Francisco.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>Hyundai Motor Group plans US$15.5 billion India investment from 2026</title>
<pubDate>Fri, 16 Oct 2026 02:19:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD210/hyundai-2026-investment-production-growth.html</link>
<description>Hyundai Motor Group plans to invest approximately US$15.5 billion in India from 2026, expanding production, research, and partnerships as it positions the country as a base for domestic growth and exports to emerging markets. The commitment could strengthen India's role in the group's mobility strategy and broaden its manufacturing footprint.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit Hyundai Motor]]></media:description>
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<title>CXMT targets DDR5 RDIMMs by end of 2026; SiCarrier showcases China's advanced chipmaking equipment</title>
<pubDate>Fri, 16 Oct 2026 02:19:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD208/cxmt-sicarrier-ddr5-dram-equipment.html</link>
<description>China's leading DRAM manufacturer CXMT has disclosed progress in its 4F&#38;sup2; DRAM architecture and plans to introduce DDR5 registered dual in-line memory modules (RDIMMs) by the end of 2026, drawing renewed attention to the country's development of next-generation memory technologies.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: WESEMiBAY 2026]]></media:description>
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<title>TSMC details pricing, confirms agentic AI boosts CPU demand</title>
<pubDate>Fri, 16 Oct 2026 02:07:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD219/tsmc-demand-cpu-packaging-capacity.html</link>
<description>TSMC addressed pricing adjustments, CPUs, and advanced packaging at its earnings briefing on October 15, 2026, confirming that demand for CPUs related to agentic AI continues to rise as overall AI demand remains strong.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>DayOne doubles Johor data center financing to MYR30 billion as billings pass 1GW</title>
<pubDate>Fri, 16 Oct 2026 02:01:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL203/data-center-financing-johor-capacity-investment.html</link>
<description>Singapore-based data center developer DayOne has secured an additional MYR15 billion (US$3.67 billion) in financing from a consortium of seven banks to expand hyperscale data center capacity in Johor, Malaysia, Reuters reported on October 13, 2026. Together with MYR15 billion in multicurrency financing secured in 2025, the platform now stands at MYR30 billion, according to a joint statement from the lenders cited by &lt;em&gt;The Business Times&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Tong Yang sees stronger 4Q26 margins, but shipping, costs remain risks</title>
<pubDate>Fri, 16 Oct 2026 01:53:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD209/shipping-capacity-2026-oem-revenue.html</link>
<description>Tong Yang Industry expects capacity utilization to reach 90%&#38;ndash;95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal peak. But tight container capacity and higher raw-material costs could shape performance, deputy general manager San-Liang Huang said, as shipping remains constrained.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI traffic reshapes e-commerce as Shopline GMV rises 20% in 2026</title>
<pubDate>Fri, 16 Oct 2026 01:47:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD203/e-commerce-genai-2026-data-management.html</link>
<description>As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform Shopline said its gross merchandise value (GMV) grew 20% in 2026 from 2025, 2.5 times the market average, highlighting strong performance amid intense retail competition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand &#38;mdash; from advanced-node capacity to Musk's Terafab</title>
<pubDate>Fri, 16 Oct 2026 01:36:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD207/tsmc-capacity-production-earnings-manufacturing.html</link>
<description>TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach 44%. Yet supply chain sources say the earnings call carried a more consequential message: TSMC's increasingly explicit assertion of the bargaining power afforded by its lead in advanced process technology and manufacturing scale.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC chairman C.C. Wei. Credit: DIGITIMES]]></media:description>
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<title>Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking</title>
<pubDate>Fri, 16 Oct 2026 00:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL200/huawei-transistor-equipment-packaging-asml.html</link>
<description>China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms, analysts say, the stakes are different: with US export controls limiting access to the tools needed for leading-edge transistor scaling, stacking and connecting chips more densely has become one of the few routes left to narrow the performance gap, an approach Huawei has framed as its Tau scaling law.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging</title>
<pubDate>Fri, 16 Oct 2026 00:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL201/asml-packaging-2026-wafer-equipment.html</link>
<description>As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be preparing its second move into it. Patent filings analyzed by research firm SemiAnalysis suggest the Dutch lithography leader is building a die-to-wafer (D2W) hybrid bonder, a tool that would pit it against Besi, the current leader, and a growing group of front-end rivals chasing the same market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>AI investment risks rise as China models gain ground</title>
<pubDate>Fri, 16 Oct 2026 00:29:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD204/investment-market-development-business-financing.html</link>
<description>As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion to investment returns and long-term debt-servicing capacity. The AI industry continues to attract capital but must also prove that its business models can generate profits.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear</title>
<pubDate>Fri, 16 Oct 2026 00:23:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016VL202/intel-cpu-israel-plant-loss.html</link>
<description>Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether production at the site, which makes chips on its capacity-constrained Intel 7 process, has been affected.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Thunder Tiger debuts new loitering munition drone at AUSA 2026</title>
<pubDate>Thu, 15 Oct 2026 23:57:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261016PD200/2026-supply-chain-mobile.html</link>
<description>Thunder Tiger showcased its latest defense systems at AUSA 2026, the Association of the United States Army's annual exhibition in the US, marking its fourth consecutive appearance at the event and its largest booth to date. The Taiwan-based company presented three key products in a bid to capture US defense opportunities.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<title>Samsung SDI targets 2027 LFP BBU battery production</title>
<pubDate>Thu, 15 Oct 2026 23:56:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD228/samsung-sdi-production-2027-demand-lithium.html</link>
<description>Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup batteries by a South Korean battery maker. The move expands the company's product portfolio beyond its traditional focus on ternary batteries as AI data centers drive rapidly growing demand for battery backup units (BBUs).</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Samsung SDI]]></media:description>
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<title>AI power crunch drives data center demand for self-generation</title>
<pubDate>Thu, 15 Oct 2026 23:56:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD230/aidc-capacity-equipment-chips-electricity.html</link>
<description>The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity. As power consumption surges at AI data centers (AIDCs), conventional public grids are increasingly facing bottlenecks, and self-generation and improved grid resilience are now requirements in major data center construction projects worldwide.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>MediaTek ASIC deal with ByteDance would expand data center push</title>
<pubDate>Thu, 15 Oct 2026 23:56:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD232/bytedance-mediatek-asic-chips-business.html</link>
<description>ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the matter. A deal would help ByteDance secure critical chip supplies while expanding MediaTek's data center business and intensifying competition with Qualcomm and other chipmakers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Cloud AI absorbs resources as non-AI semiconductors face prolonged downturn</title>
<pubDate>Thu, 15 Oct 2026 23:55:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD234/data-growth-technology-inflation-hbm.html</link>
<description>Investment in AI data centers remains strong, but semiconductor growth is becoming increasingly concentrated in cloud AI, while the long-running decline in consumer technology prices has come to an abrupt halt. At a SEMICON West 2026 industry outlook session, Duncan Meldrum, an economist at Hilltop Economics, warned that the shift is putting additional pressure on the broader semiconductor market.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSEC focuses overseas solar strategy on Japan rooftops</title>
<pubDate>Thu, 15 Oct 2026 23:53:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD235/tsec-solar-market-expansion-taiwan.html</link>
<description>TSEC is focusing its overseas expansion on Japan's rooftop solar market and expects Taiwan's solar installations to recover in 2027 from a market low point. For the Taiwan-based solar manufacturer, building a solar plant in the US remains an important direction, but it is not an immediate priority, as the company monitors the uncertainty around the US Minimum Import Price (MIP) policy.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSMC excludes CPUs from AI accelerator growth forecast</title>
<pubDate>Thu, 15 Oct 2026 23:52:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD251/tsmc-demand-taiwan-accelerator-growth.html</link>
<description>Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI accelerator demand growth. TSMC chairman C.C. Wei said at the company's earnings conference on October 15 that the company is maintaining its original, narrower definition of AI demand, mainly because it is difficult to clearly distinguish whether CPUs are used in traditional servers or AI servers. Actual demand also depends on how customers deploy the technology and configure their products.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Hesai moves beyond lidar as Kosmo targets physical AI's data bottleneck</title>
<pubDate>Thu, 15 Oct 2026 23:52:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL209/hesai-data-robotics-robot.html</link>
<description>As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment &#38;mdash; particularly the extreme variability of physical environments &#38;mdash; are emerging as a subtler configuration challenge in the industry spotlight.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Hesai]]></media:description>
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<title>China's 90%-localized EUV light source debuts at 15W, exposing the gap to commercial chipmaking</title>
<pubDate>Thu, 15 Oct 2026 23:52:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL213/euv-technology-commercial-shanghai-development.html</link>
<description>Chinese semiconductor technology start-up Langdao Silex (Shanghai) Technology has publicly unveiled an extreme ultraviolet (EUV) light source prototype with a claimed 90% localization rate, marking progress in China's efforts to develop domestic lithography technology. However, the system remains three to five years from mass production, with output power and long-term stability posing major engineering challenges.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Langdao Silex]]></media:description>
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<title>Manus returns to China's AI agent race with US$500 million reset</title>
<pubDate>Thu, 15 Oct 2026 23:51:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL217/meta-acquisition-startup-financing-tencent.html?chid=10</link>
<description>As Manus, one of China's more distinctive AI startups, became entangled in the high-profile unwinding of its acquisition by Meta, the startup's failed attempt to capture opportunities beyond China left the industry speculating about its next steps after an abrupt regulatory reversal.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>East Asia</category>
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<media:description type="plain"><![CDATA[Credit: AI-assisted illustration by DIGITIMES created for editorial purposes; not an official company image.]]></media:description>
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<title>China's YMTC targets 9,600 MT/s with 4F&#38;sup2; DRAM design</title>
<pubDate>Thu, 15 Oct 2026 23:51:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL224/dram-ymtc-design-manufacturing-nand-flash.html</link>
<description>China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F&#38;sup2; DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond NAND flash as the company pursues a CNY33 billion (approx. US$4.93 billion) Shanghai initial public offering.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: YMTC]]></media:description>
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<title>Interview: The AI economy needs US$6T in funding &#38;mdash; but from where?</title>
<pubDate>Thu, 15 Oct 2026 23:49:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL227/economy-funding-language.html</link>
<description>AI is clearly making an enormous impact on the global economy, with capabilities extending from language chatbots to agentic teams and the physical realm within just a few years. A new report by consulting firm Bain takes stock of AI's effects on businesses so far and projects how it could shape the near future.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Bain &#38; Company]]></media:description>
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<title>Samsung's Austin chip workforce shrinks 32% as Taylor 2nm fab nears opening</title>
<pubDate>Thu, 15 Oct 2026 23:48:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL228/samsung-texas-workforce-2nm-2025.html</link>
<description>Samsung Electronics' semiconductor workforce in Austin, Texas, shrank 32% in 2025 as local operating expenditures plunged nearly 75%, contrasting with increased activity at its nearby Taylor foundry, which is preparing to begin operations by the end of 2026 and gradually ramp up 2nm chip production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>LG Innotek eyes 2027 chip substrate growth as Big Tech supply talks continue</title>
<pubDate>Thu, 15 Oct 2026 23:44:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL229/lg-innotek-substrate-2027-growth-fc-bga.html</link>
<description>South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares to enter the high-end AI accelerator market. Under this strategy, the company aims to secure customer commitments before expanding production capacity as it seeks to diversify beyond smartphone camera modules.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[LG Innotek's AI accelerator substrate (right) is six times larger than its PC substrate (left). Credit: LG Innotek]]></media:description>
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<title>AI server tracker: Optical suppliers' September revenue jumps 90%</title>
<pubDate>Thu, 15 Oct 2026 23:44:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL230/revenue-taiwan-ai-server-growth-communications.html</link>
<description>Taiwan's optical communications suppliers posted a sharp revenue increase in September 2026, far outpacing major power supply manufacturers in percentage growth as demand for faster data center connectivity continued to expand. The six optical suppliers tracked by DIGITIMES reported combined revenue of NT$3.73 billion (approx. US$116 million), up 90.2% year-over-year and 16.4% from August.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[EZconn's 800G QSFP-DD active optical cable is designed for high-speed data center connectivity and AI computing clusters. Credit: EZconn]]></media:description>
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<title>LINE Taiwan pushes AI services as it marks 15 years and deepens anti-fraud role</title>
<pubDate>Thu, 15 Oct 2026 23:44:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD217/line-taiwan-ai-cybersecurity.html</link>
<description>LINE Taiwan marked its 15th year in the market with a strategy shift that signals broader ambitions beyond messaging. The company is expanding into AI-powered daily services, aiming to connect users, brands, and merchants through agentic AI tools, while also strengthening account security and anti-fraud defenses.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition</title>
<pubDate>Thu, 15 Oct 2026 23:43:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD232/qualcomm-ai-agent-chips-silicon-competition-infrastructure.html</link>
<description>Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data center product line in June 2026, the company expanded its business to include multiple hyperscalers.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Anthropic targets low-conflict sites for Australian data centers</title>
<pubDate>Thu, 15 Oct 2026 15:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD248/anthropic-data-australia-government-capacity.html</link>
<description>Anthropic plans to place new data centers in Australia away from densely populated areas, using renewable energy and previously developed sites to reduce conflicts with residents. The US artificial intelligence company is evaluating proposals from state and local governments competing for its investment, while expanding computing capacity in the country.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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