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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
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<title>Techman Robot lifts SI mix to 20% as server-heavier builds spur robot demand</title>
<pubDate>Thu, 20 Aug 2026 00:18:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD233/techman-demand-robot-2026-taipei.html</link>
<description>Techman Robot said on August 19 at Automation Taipei 2026 that it remains cautiously optimistic about the second half of 2026, expecting business to outperform the first half on continued strength in semiconductors and system integration (SI). The company also said server manufacturing's shift toward larger, heavier builds is creating new demand for high-payload robots.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Samsung repays 20 trillion won SDC loan early as memory demand surges</title>
<pubDate>Thu, 20 Aug 2026 00:17:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD229/samsung-loan-demand-2026-sdc.html</link>
<description>&lt;p class="P1" data-start="2083" data-end="2446"&gt;Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026, according to South Korean publication &lt;em data-start="2256" data-end="2269"&gt;ZDNet Korea&lt;/em&gt; and filings in the Financial Supervisory Service's DART system. The early repayment came as AI-related demand lifted memory prices and strengthened the company's cash position.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AI server market CAGR nears 40%; rack power density surging 100-fold poses grid strain</title>
<pubDate>Thu, 20 Aug 2026 00:16:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD228/ai-server-power-supply-taiwan-2026.html</link>
<description>Speaking at the 2026 Taiwan AI Academy Annual Conference held on August 18 at Academia Sinica's Social Sciences building, Neo Yao, CEO of Foxconn's Visionbay.ai, and Huang-Jen Chiu, CTO of Delta Power and Systems Business Group, delivered keynote addresses emphasizing a stark reality: AI server shipment growth is severely outstripping power supply capabilities. Both executives urged that sustainable industry growth cannot rely solely on hardware expansion, calling for a stronger focus on software ecosystems and application development to build a balanced value chain.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>YMTC parent advances IPO as NAND share hits 14% and AI storage scales</title>
<pubDate>Thu, 20 Aug 2026 00:15:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL211/ymtc-ipo-nand-flash-market.html</link>
<description>Yangtze Memory Technologies Holding, the parent of Chinese NAND flash maker YMTC, has completed a key stage of its pre-IPO process just as the memory maker gains global market share, expands enterprise storage products and prepares another round of capacity growth.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Gamers pivot to high-margin peripherals as PC price pressures drive double-digit growth in gaming monitors</title>
<pubDate>Thu, 20 Aug 2026 00:15:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PR203/pc-hardware-gaming-growth-sales.html</link>
<description>&lt;p class="P1" data-start="1081" data-end="1349"&gt;High PC hardware prices are pushing gamers to delay full-system replacements and redirect their budgets toward targeted upgrades, driving strong demand for high-margin peripherals and gaming monitors, according to the latest data from market intelligence firm CONTEXT.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties</title>
<pubDate>Thu, 20 Aug 2026 00:14:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD221/innolux-packaging-foplp-panel-capacity.html</link>
<description>&lt;p class="P1" data-start="1920" data-end="2369"&gt;Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185% sequentially to NT$0.57. After disposing of Fab 2, Fab 5, and a small module plant, chairman Jim Hung said the company had reached an optimal stage in external asset sales and would now focus on repurposing existing production space for semiconductor processes, particularly fan-out panel-level packaging (FOPLP).</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Innolux chairman Jim Hung. Credit: DIGITIMES]]></media:description>
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<title>WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale</title>
<pubDate>Thu, 20 Aug 2026 00:14:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD220/wpg-demand-ic-distributor-2027-convertible-bond.html</link>
<description>&lt;p class="P1" data-start="1391" data-end="1632"&gt;Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across both advanced and mature process nodes, even as rising memory prices weigh on smartphone and PC shipments.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>High-end PCB supply tightens as CCL expansions face delays</title>
<pubDate>Thu, 20 Aug 2026 00:13:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD217/ccl-demand-ai-applications-data-pcb.html</link>
<description>As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift is creating a supply gap, prompting suppliers in Taiwan, Japan, South Korea and China to race to add capacity for higher-margin materials.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Sunplus expects automotive orders to rise in 3Q26 as memory costs threaten demand</title>
<pubDate>Thu, 20 Aug 2026 00:13:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD213/automotive-sunplus-demand-ic-design-business.html</link>
<description>&lt;p class="P1" data-start="2033" data-end="2297"&gt;Taiwanese IC design house Sunplus Technology expects its automotive orders to strengthen further in the third quarter of 2026, but warned that rising memory and component costs could weigh on overall market demand and dampen customers' willingness to place orders.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Rising demand for CPO, SiPh reshapes semiconductor testing</title>
<pubDate>Thu, 20 Aug 2026 00:12:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD211/testing-demand-cpo-siph-transmission.html</link>
<description>As chip power consumption, transmission speed and architectural complexity increase, testing has shifted from being a final pre-shipment quality gate to an earlier stage in product development and ramp-to-volume, according to KPMG managing director Jesse Chen, who previously worked at IBM and in venture capital. That shift is making testing a critical factor in product verification, yield ramp and supply chain stability.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<title>Xiaomi's AI-EV Pivot gains momentum as memory costs pressure Q226 smartphone business</title>
<pubDate>Thu, 20 Aug 2026 00:12:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL219/xiaomi-smartphone-business-revenue-electronics.html</link>
<description>Xiaomi is accelerating its transition from a smartphone-focused electronics manufacturer toward a broader technology ecosystem company, as artificial intelligence (AI), electric vehicles (EVs) and smart connected devices become increasingly important growth drivers while its core smartphone business faces rising component costs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>India's chipmaking push faces its real test after initial wafers: yield</title>
<pubDate>Thu, 20 Aug 2026 00:11:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL221/india-ic-manufacturing-yield-rate-wafer-fab-equipment.html</link>
<description>India's semiconductor manufacturing drive will face one of its toughest tests after equipment is installed and production begins: whether new fabs can consistently produce enough working chips to compete with established plants.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>AI chip strategies echo &lt;em&gt;StarCraft&lt;/em&gt; factions as memory bottleneck reshapes the race</title>
<pubDate>Thu, 20 Aug 2026 00:10:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD210/ai-chip-hardware-capacity-performance-chips.html</link>
<description>&lt;p class="P1" data-start="1912" data-end="2260"&gt;The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained by memory availability. At the same time, capacity at the world's leading advanced chipmakers has been fully booked, turning packaging capacity and memory allocation into major challenges for the broader AI market.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>AI models show softer responses on authoritarian leaders, report finds</title>
<pubDate>Thu, 20 Aug 2026 00:09:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD201/claude-meta-data-gemini-anthropic.html</link>
<description>U.S.-based AI models were found to avoid direct criticism of authoritarian leaders more often than democratic ones, according to a July report from the Meta-funded Oversight Board. The findings raised concerns for enterprise users and AI developers because the pattern also appeared more often in Chinese-language prompts, where models were more likely to return pro-China responses.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Manz Asia targets PLP demand with three lines and three sizes</title>
<pubDate>Wed, 19 Aug 2026 09:22:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD225/manz-asia-equipment-packaging-technology.html</link>
<description>Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than 50 panel-level electrochemical deposition (ECD) systems cumulatively from 2016 to 2026, covering sizes from 310mm to 700mm and spanning both R&#38;amp;D and production equipment.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix to cancel record KRW40tn in shares, signalling confidence in a long AI memory cycle</title>
<pubDate>Wed, 19 Aug 2026 08:09:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL214/hbm-earnings-cash-flow.html</link>
<description>&lt;p class="P1" data-start="2783" data-end="3022"&gt;SK hynix said on August 19 that its board had approved a plan to repurchase and cancel KRW40 trillion (roughly US$29 billion) of its own shares, the largest share buyback and cancellation ever undertaken by a company listed in South Korea.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China accelerates Microsoft Windows 10 exit from state systems</title>
<pubDate>Wed, 19 Aug 2026 07:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL205/microsoft-windows-10-software-technology-security.html</link>
<description>China is accelerating efforts to remove foreign technology from sensitive state-linked systems, ordering some government-affiliated entities to uninstall a customised version of Microsoft Windows 10 months ahead of schedule.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<title>Nvidia H200 chips reach China as imports remain limited</title>
<pubDate>Wed, 19 Aug 2026 07:03:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL212/nvidia-bytedance-chips-tencent-beijing.html</link>
<description>ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the &lt;em&gt;Financial Times&lt;/em&gt; reported, marking the clearest sign yet that Beijing's import reviews are translating into meaningful deliveries after months of regulatory uncertainty.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Vietnam eyes city upgrades for Samsung hub Bac Ninh and Quang Ninh</title>
<pubDate>Wed, 19 Aug 2026 06:40:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL210/samsung-vietnam-electronics-manufacturing-logistics.html</link>
<description>Vietnam is considering plans to turn Bac Ninh, a major Samsung Electronics manufacturing hub, and Quang Ninh into centrally administered cities as the country builds out its northern electronics, semiconductor and logistics base.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Samsung Electronics Vietnam's SEV manufacturing complex in Bac Ninh, Vietnam. Credit: Samsung]]></media:description>
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<title>TAITRA Chair: Taiwan's economy relies on AI capex; warns of weak ROI risk</title>
<pubDate>Wed, 19 Aug 2026 06:37:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD218/taiwan-taitra-2026-economy-capex.html</link>
<description>Speaking at the opening of the 2026 Taiwan Artificial Intelligence Conference on August 18, Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang urged engineering experts to adopt a broader, more humanistic perspective when re-evaluating the transformations brought by AI.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<title>Samsung Display restarts Asan OLED plant to meet foldable and IT demand</title>
<pubDate>Wed, 19 Aug 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD205/sdc-foldable-plant-demand-galaxy.html</link>
<description>Samsung Display Co. is reported to be restarting construction of a new OLED plant in Asan, South Korea, after a five-year pause as demand rises for foldable phones and OLED panels used in notebooks and tablets. South Korean media reported that the move followed approval of the main structural work for the A7 factory at Asan's second campus.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Taiwan seeks shift from drone supplier to strategic partner in entering US market</title>
<pubDate>Wed, 19 Aug 2026 05:39:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL209/taiwan-supplier-market-supply-chain-manufacturing.html</link>
<description>Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond its traditional role as a components supplier and become a strategic partner in the global drone supply chain. The discussion takes place at a time when drones have become the frontier of warfare, and countries such as the US are looking to build non-China drone supply chains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>GigaDevice profit surges 1,092% on memory upcycle, niche DRAM and NAND gains</title>
<pubDate>Wed, 19 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL207/gigadevice-nand-dram-niche-profit.html</link>
<description>GigaDevice Semiconductor posted record first-half 2026 results, with tight memory supply and rising prices across niche products lifting earnings well beyond its full-year 2025 level.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: ICsmart]]></media:description>
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<title>Taiwan Mobile sees Systex deal as AI-driven expansion play, targets 14% ICT market share</title>
<pubDate>Wed, 19 Aug 2026 04:50:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD222/twm-systex-market-share-taiwan.html</link>
<description>Taiwan Mobile (TWM) recently announced a tender offer for Systex, setting a goal of doubling its share of Taiwan's information services market from 7% to 14% within six years. TWM Chief Enterprise Business Officer Shing Chu stressed that the target is not about taking existing business away from competitors, but about capturing a larger share of a market that is expected to expand as AI drives enterprise demand for IT services.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<title>Tatung to complete self-built AI data center PoC by September, secures edge AI order</title>
<pubDate>Wed, 19 Aug 2026 04:26:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260818PD233/tatung-ai-data-center-business-earnings.html</link>
<description>Taiwan's Tatung held an earnings call on August 18, during which company president Sung-pin Chang stated that the group's self-built artificial intelligence (AI) data center proof of concept (PoC) has entered the manufacturing stage, with units being sent to project sites for testing starting this month. The overall build is expected to be completed in September 2026, with further results related to its AIDC revealed at a later time. The group also announced it has successfully secured an order from an edge AI customer.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Tatung president Sung-pin Chang. Credit: DIGITIMES]]></media:description>
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<title>Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3</title>
<pubDate>Wed, 19 Aug 2026 04:11:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL208/cerebras-wafer-accelerator.html</link>
<description>Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based alternatives on a tokens-per-second-per-user basis.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Socionext taps Intel 18A-P process for high-performance compute chiplet development</title>
<pubDate>Wed, 19 Aug 2026 04:02:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PR201/socionext-soc-intel-intel-foundry-silicon.html</link>
<description>Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips</title>
<pubDate>Wed, 19 Aug 2026 04:00:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD219/packaging-copos-foplp-chips-panel-cost.html</link>
<description>As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and CoPoS have emerged as the two hottest keywords, while glass-based technologies remain further ahead on the roadmap.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>EU tightens recycled-content rules as material traceability becomes a new battery market barrier</title>
<pubDate>Wed, 19 Aug 2026 03:49:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD216/eu-recycling-materials-market-manufacturing.html</link>
<description>The European Union is moving to tighten recycling requirements for rechargeable batteries, including electric vehicle batteries, industrial energy storage batteries, and automotive starting batteries.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
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<title>Google and AMD target post-GPU era with Frozen v2 and Taalas</title>
<pubDate>Wed, 19 Aug 2026 03:39:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD214/google-amd-ai-inference-acquisition-gpu.html</link>
<description>Advanced Micro Devices (AMD) recently announced its acquisition of Canadian AI chip startup Taalas to sharpen its competitive edge in AI inference. Taalas' core technology bakes model weights directly onto the silicon rather than relying on traditional high-bandwidth memory (HBM).</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>NSTC's unmanned vehicle revenue tops 40% as semiconductor AOI and CPO fuel growth</title>
<pubDate>Wed, 19 Aug 2026 03:27:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD200/nstc-aoi-cpo-revenue-growth.html</link>
<description>Optical imaging technologies company New Smart Technology (NSTC) is moving beyond traditional optical and image inspection into semiconductor high-end automated optical inspection (AOI), co-packaged optics (CPO) optoelectronic modules, and unmanned vehicle vision systems, with a clear change in its revenue structure, according to chairman Stone Shih and president Phil Chen.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Baidu's AI business drives growth as robotaxi expansion accelerates</title>
<pubDate>Wed, 19 Aug 2026 03:20:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL203/baidu-ai-business-growth-demand-revenue.html</link>
<description>Baidu is deepening its shift toward an AI-first business, with AI-powered operations accounting for half of its general business revenue in the second quarter as demand for computing infrastructure and AI applications continued to grow.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Google to move all Pixel production out of China in 2027, Nikkei Asia says</title>
<pubDate>Wed, 19 Aug 2026 03:19:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819VL204/google-production-2027-asia-nikkei.html</link>
<description>Google has told suppliers it plans to move all production of Pixel smartphones, smartwatches and wireless earbuds out of China starting in 2027, after making progress developing and producing high-end Pixel phones in Vietnam this year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project</title>
<pubDate>Wed, 19 Aug 2026 02:58:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD215/tsinghua-unigroup-dongguan-expansion-investment-bankruptcy.html</link>
<description>&lt;p class="P1" data-start="3006" data-end="3331"&gt;Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Tech giants' AI commitments reach US$3 trillion beyond balance sheets</title>
<pubDate>Wed, 19 Aug 2026 02:29:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260819PD203/alphabet-meta-amazon-microsoft-nvidia.html</link>
<description>Alphabet, Meta, Amazon, Microsoft and other major technology companies have accumulated as much as US$3 trillion in off-balance-sheet commitments tied to AI infrastructure, according to an analysis cited by &lt;em&gt;The Wall Street Journal&lt;/em&gt;. The figures illustrate how quickly the financial burden of the AI buildout is expanding beyond what is visible on standard balance sheets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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