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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 18 Jun 2026 10:00:05 GMT</lastBuildDate>
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<title>Elon Musk aims for record maximum usable compute per wafer for AI6 chip</title>
<pubDate>Thu, 18 Jun 2026 07:51:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD212/wafer-elon-musk-2026-design-tesla.html</link>
<description>Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6 chip is expected to set a new record for maximum usable computing power per wafer.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Smart glasses race pulls Taiwan and China optical suppliers into waveguide battle</title>
<pubDate>Thu, 18 Jun 2026 07:43:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD211/shipments-taiwan-smart-glasses-growth-gseo.html</link>
<description>Smart glasses shipments are rising steadily, making the category one of the most closely watched consumer electronics growth drivers after notebooks and smartphones. Taiwanese optical suppliers entered the field early, while leading Chinese optical makers are also moving to capture the opportunity.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>AI data center boom drives Taiwan passive component makers to record sales</title>
<pubDate>Thu, 18 Jun 2026 07:38:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD231/yageo-walsin-passive-components-data-center-revenue-taiwan.html</link>
<description>Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill ratios at both companies have risen above 1.3, placing industry conditions near their highest levels in recent years and reinforcing expectations for sequential growth through 2026.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>SiC cuts AI data center costs; 5% efficiency gain saves US$5 billion</title>
<pubDate>Thu, 18 Jun 2026 07:38:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD225/renesas-sic-data-center-efficiency-electricity.html</link>
<description>Power is now compute, and it is becoming a major driver of AI data center build costs. Renesas technical director Mu-Sen Lin said traditional data centers rely on low-voltage AC (LVAC), long wiring runs, and repeated AC-to-DC conversions through uninterruptible power supply (UPS) systems, reducing energy transmission efficiency.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Foxconn chairman maps out Taiwan's global AI and manufacturing expansion strategy</title>
<pubDate>Thu, 18 Jun 2026 07:36:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD230/taiwan-manufacturing-foxconn-chairman-expansion.html</link>
<description>&lt;p class="P1" data-start="0" data-end="488"&gt;Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas industrial parks, AI-driven transformation and next-generation factory automation.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>NIO founder warns China's auto market could shrink by 20% this year</title>
<pubDate>Thu, 18 Jun 2026 07:30:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD233/nio-chairman-bev-vehicle-sales-china-2026.html</link>
<description>Nio founder and chairman William Li warned at the 2026 China Auto Chongqing Summit that China's auto industry has entered its "most brutal final stage," saying 2026 passenger-vehicle retail sales in China could fall 15% to 20% from last year. He urged the industry to prepare early as the Chinese new energy vehicle market enters a more severe phase of competition.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Darwin organ chip joins Nvidia AI medical push</title>
<pubDate>Thu, 18 Jun 2026 07:24:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD226/nvidia-medical-2026-revenue-market.html</link>
<description>Backlight module maker Darwin held its shareholders' meeting on June 17, 2026, and said it remains cautiously optimistic about 2026 revenue as its new businesses continue to gain traction. The company cited fresh commercial display orders in the US market and said organ-chip partner Anivance AI is also listed on an "Nvidia backdrop," adding momentum to its medical technology push.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Panjit ramps investment in AI and automotive as book-to-bill rises to 1.5</title>
<pubDate>Thu, 18 Jun 2026 07:22:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD222/panjit-international-automotive-investment-growth-demand.html</link>
<description>&lt;p class="P1" data-path-to-node="13"&gt;Panjit International announced at its shareholders' meeting on June 18 that it will pursue a "dual-engine" growth strategy focused on automotive and artificial intelligence as demand in both sectors accelerates, backed by a capital investment target of more than NT$10 billion over the next five years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Imec, Sony unveil backside interconnect method for 3D chip stacking</title>
<pubDate>Thu, 18 Jun 2026 07:10:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL207/imec-sony-3d-silicon-tsv-wafer.html</link>
<description>&lt;p class="P1" data-start="1289" data-end="1567"&gt;Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Schematic comparison of conventional via-middle and local-BDI TSV approaches. Credit: imec]]></media:description>
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<title>Tim Cook says Apple price hikes are unavoidable as AI squeezes memory supply</title>
<pubDate>Thu, 18 Jun 2026 07:00:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL203/apple-dram-nand-price-tim-cook.html</link>
<description>&lt;p class="P1" data-start="190" data-end="573"&gt;In an exclusive interview with &lt;em&gt;The Wall Street Journal&lt;/em&gt;, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Japan lasers in on India's Assam state for chip and infrastructure corridor</title>
<pubDate>Thu, 18 Jun 2026 06:56:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD224/infrastructure-investment-market-business-region.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:358;122-479"&gt;Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to &lt;em&gt;Nikkei&lt;/em&gt;, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>China Airlines cuts cargo fuel surcharges after oil prices ease on US-Iran deal</title>
<pubDate>Thu, 18 Jun 2026 06:46:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD223/china-airlines-fuel-taiwan-europe-cost.html</link>
<description>China Airlines will lower cargo fuel surcharges from July 1 after international oil prices eased following a US-Iran memorandum signed June 17 that raised prospects for renewed shipping through the Strait of Hormuz.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>BMW opens Neue Klasse reservations early; car business margin forecast unexpectedly cut in half</title>
<pubDate>Thu, 18 Jun 2026 06:41:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD206/bmw-bev-market-forecast.html</link>
<description>Although BMW's Neue Klasse BEV lineup is receiving strong market feedback and demand, it is also facing challenges due to weakness in the Chinese auto market and the conflict in the Middle East. It has lowered its financial outlook, cutting its automotive business margin forecast from the original 4-6% range to 1-3%.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>AI chip boom strains probe card supply, Taiwan test interface maker weighs prepayment deals</title>
<pubDate>Thu, 18 Jun 2026 05:57:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD208/mpi-ai-chip-probe-card-test-interface-demand.html</link>
<description>MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[MPI Corporation chairman Ko Chang-lin. Credit: DIGITIMES]]></media:description>
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<item>
<title>Unitree IPO tests China's bet on low-cost humanoid robots</title>
<pubDate>Thu, 18 Jun 2026 04:24:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL227/low-cost-shanghai-commercial-business-shanghai-stock-exchange.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:209;95-303"&gt;Unitree Robotics is heading toward a Shanghai listing with a pitch drawing attention well beyond China: humanoid robots can be built cheaply enough, and at enough scale, to begin taking on narrow labor tasks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SpaceX acquires Cursor to bolster xAI and court AI developers</title>
<pubDate>Thu, 18 Jun 2026 04:20:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD207/spacex-xai-data-competition-software.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:453;108-560"&gt;SpaceX has agreed to acquire AI coding tool developer Cursor for US$60 billion, in a deal that underscores how competition in the AI industry is extending beyond foundation models into the application layer and developer ecosystems. The purchase gives SpaceX direct access to enterprise customers, developer communities, and high-value code data instead of rebuilding a product from scratch. Markets see it as a key addition to Elon Musk's AI strategy.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Exclusive: Winbond NOR flash reportedly enters Nvidia supply chain</title>
<pubDate>Thu, 18 Jun 2026 04:14:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD216/flash-winbond-nvidia-supply-chain-demand.html</link>
<description>Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin platform.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>G7 AI talks reveal trust gap behind US model power</title>
<pubDate>Thu, 18 Jun 2026 04:06:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL204/anthropic-openai-policy-technology-europe.html</link>
<description>The world's most powerful AI companies entered the G7 summit in France this week with a message for democratic governments: frontier AI needs global rules, but those rules are increasingly being shaped by US strategic interests.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region</title>
<pubDate>Thu, 18 Jun 2026 03:52:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL226/samsung-sk-hynix-packaging-region-investment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:307;119-425"&gt;Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to &lt;em&gt;The Elec&lt;/em&gt; and &lt;em&gt;Hankyung&lt;/em&gt;, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Mirle Automation names CEO as chair</title>
<pubDate>Thu, 18 Jun 2026 03:16:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD214/mirle-automation-chairman-automation-mirle-equipment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:301;88-388"&gt;Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the automation equipment maker moves to strengthen long-term development and leadership succession. Sun will remain on the board and has also been named honorary chairman.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Clevo PC shipments grow against trends, targeting double-digit on-year growth</title>
<pubDate>Thu, 18 Jun 2026 03:12:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD215/shipments-pc-clevo-2026-2025.html</link>
<description>PC shipments have been affected by shortages and price increases for memory and processors, and market research firms generally expect full-year 2026 shipments to decline by double digits. Clevo, which focuses on niche markets, expects its 2026 shipments to grow compared with 2025, with a possibility of achieving double-digit shipment growth.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan chip makers signal durable upcycle as memory prices and AI demand align</title>
<pubDate>Thu, 18 Jun 2026 02:58:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL225/taiwan-demand-revenue-recovery-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:270;123-392"&gt;Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>FOPLP race heats up as Innolux reportedly teams with TSMC</title>
<pubDate>Thu, 18 Jun 2026 02:46:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD231/foplp-technology-ai-chip-tsmc-innolux.html</link>
<description>As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."&lt;em&gt; DIGITIMES&lt;/em&gt; believes that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP development more favorable.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI glasses race turns into a battle of devices, LLMs, and user interfaces</title>
<pubDate>Thu, 18 Jun 2026 02:35:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD210/market-2026-google-meta-hardware.html</link>
<description>&lt;p class="P1" data-sourcepos="9:1-9:299;311-609"&gt;AI glasses are gaining momentum as Meta, Rokid, RayNeo, Xreal, Viture, HTC, and other vendors step up their efforts, with Google and Samsung Electronics expected to enter the market in the second half of 2026. The category is widely seen as a potential essential mobile device after the smartphone.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label &#38;mdash; but hurdles remain</title>
<pubDate>Thu, 18 Jun 2026 02:27:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260616PD216/technology-manufacturing-asia-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:388;138-525"&gt;The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of Chinese technology and semiconductor companies are adopting a dual-location strategy, establishing corporate entities in Singapore while locating manufacturing operations in Malaysia in an effort to reduce their association with the "Made in China" label.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Nichicon raises e-cap prices as supply tightens, costs increase</title>
<pubDate>Thu, 18 Jun 2026 02:16:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD234/nichicon-aluminum-capacitor-price-capacity-expansion.html</link>
<description>Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The announcement comes amid another round of price increases in the passive components industry.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD234/nichicon-aluminum-capacitor-price-capacity-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd234_files/1_b.jpg" type="image/jpeg" expression="full">
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<item>
<title>SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain</title>
<pubDate>Thu, 18 Jun 2026 02:09:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD204/smic-intel-kirin-huawei-performance.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:322;142-463"&gt;A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260618pd204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Acer founder outlines New WangDao leadership white paper at Tokyo AI forum</title>
<pubDate>Thu, 18 Jun 2026 01:54:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD229/acer.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:495;99-593"&gt;The founder of Acer Group traveled to Tokyo to present a Taiwan-origin leadership framework and release a multilingual white paper on New WangDao at the international AI forum, titled "Global Innovation Reimagined Conference: AI Resilience," on June 17. The white paper was published in Chinese, English and Japanese, and the founder delivered additional briefings to Japanese companies and alumni of Thunderbird School of Global Management on June 18 and June 19, according to event materials.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027</title>
<pubDate>Thu, 18 Jun 2026 01:48:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD203/samsung-dram-production-roadmap-2027.html</link>
<description>Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260618PD203/samsung-dram-production-roadmap-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260618pd203_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>Acer builds inventory to record high; price increases slowing</title>
<pubDate>Thu, 18 Jun 2026 01:47:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD202/acer-price-inventory-pc-jason-chen.html</link>
<description>Acer Chairman Jason Chen said that PC shipments may decline in the second half of 2026. However, as average selling prices (ASP) continue to rise, the overall impact on revenue should remain manageable. He is optimistic that Nvidia's RTX Spark launch could bring momentum into the PC industry and further develop the AI PC market.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260618pd202_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Samsung to offer 2nm prototype runs as South Korea pushes chip design</title>
<pubDate>Thu, 18 Jun 2026 01:07:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL224/samsung-2nm-design-wafer-chips.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:330;107-436"&gt;Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to &lt;em&gt;ZDNet Korea&lt;/em&gt; and &lt;em&gt;iNews24&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617VL224/samsung-2nm-design-wafer-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617vl224_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Samsung Foundryˇ¦s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung]]></media:description>
</media:content></item>
<item>
<title>TSMC, ASML and Imec push 2D transistors toward manufacturing</title>
<pubDate>Thu, 18 Jun 2026 01:06:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260616VL219/tsmc-asml-manufacturing-300mm-materials.html</link>
<description>&lt;p class="P1" data-start="419" data-end="668"&gt;Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260616vl219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit:  Imec]]></media:description>
</media:content></item>
<item>
<title>SK Hynix ships HBM4E samples to customers</title>
<pubDate>Thu, 18 Jun 2026 01:06:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL200/sk-hynix-shipping-hbm4-data-production.html</link>
<description>SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260618vl200_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<item>
<title>AbonMax eyes double-digit drone revenue by end-2026</title>
<pubDate>Wed, 17 Jun 2026 23:55:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD232/2026-abon-commercial-drone-market-revenue-taiwan.html</link>
<description>AbonMax Technology said on June 16 that drone revenue still accounts for only about 7% to 8% of its total sales, but the company expects more visible operating results by the end of 2026 as government procurement orders and overseas expansion begin to take effect.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD232/2026-abon-commercial-drone-market-revenue-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd232_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Samsung pushes vertical transistor design as chip scaling hits limits</title>
<pubDate>Wed, 17 Jun 2026 23:55:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL221/samsung-transistor-3d-chips-materials.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:213;107-319"&gt;Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617vl221_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Taiyo Yuden to boost AI server MLCC capacity, resists price hikes</title>
<pubDate>Wed, 17 Jun 2026 23:54:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL218/taiyo-yuden-mlcc-price-ai-server-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:305;99-403"&gt;Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617vl218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Taiyo Yuden]]></media:description>
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<item>
<title>Samsung said to open fab data to suppliers in AI factory push</title>
<pubDate>Wed, 17 Jun 2026 23:54:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL212/samsung-data-fab-equipment-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:225;103-327"&gt;Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's &lt;em&gt;ETNews&lt;/em&gt;, which cited industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617vl212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Meta puts brakes on AI use as token costs hit tech giants</title>
<pubDate>Wed, 17 Jun 2026 23:54:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD230/meta-ai-cost-business-2026.html</link>
<description>Meta's internal AI costs have spiraled, and a broader pullback in spending by major tech companies is bringing a long-ignored contradiction into focus: the business logic of AI is being undermined by the cost pressure it creates.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD230/meta-ai-cost-business-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan 2026 GDP could top 10%, says Minister of  Economic Affairs</title>
<pubDate>Wed, 17 Jun 2026 23:53:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD228/taiwan-gdp-growth-2026.html</link>
<description>Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may be achieved given current trends. He pointed to stronger-than-expected exports from the AI supply chain and traditional industries such as machinery.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD228/taiwan-gdp-growth-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd228_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>SK Hynix scraps degree rules to court AI chip talent</title>
<pubDate>Wed, 17 Jun 2026 23:52:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD227/sk-hynix-talent-hbm-market-competitiveness.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:400;100-499"&gt;SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD227/sk-hynix-talent-hbm-market-competitiveness.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd227_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>China launches probe into Beidou infrastructure quality scandal</title>
<pubDate>Wed, 17 Jun 2026 23:52:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD225/probe-infrastructure-transportation-equipment-investigation.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:397;115-511"&gt;China has launched a probe into a Beidou high-precision smart monitoring project in Shandong, after reports of severe construction defects at the base sparked public concern over the quality of new infrastructure projects. The project, with a total investment of nearly CNY300 million (US$44.4 million), has drawn scrutiny after its base structures were described as "easy to tear apart by hand."</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD225/probe-infrastructure-transportation-equipment-investigation.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd225_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>SK Group tops KRW2,000 trillion as AI memory demand and Nvidia visit lift valuation</title>
<pubDate>Wed, 17 Jun 2026 23:51:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD224/sk-group-nvidia-demand-market-sk-hynix.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:522;102-623"&gt;SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, &lt;em&gt;ET News&lt;/em&gt; and Yonhap, the group's 19 listed subsidiaries reached a combined market value of KRW2,019.6 trillion, a 2.5% increase from the previous trading day.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617pd224_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>WUS and its subsidiary keep complementary AI partnership</title>
<pubDate>Wed, 17 Jun 2026 23:51:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD221/wus-subsidiary-pcb-ai-server-capex.html</link>
<description>A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD221/wus-subsidiary-pcb-ai-server-capex.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Research Insight: Fukuta deepens EV moat with hub motors and thin silicon steel</title>
<pubDate>Wed, 17 Jun 2026 23:51:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD220/fukuta-vehicle-silicon-market-efficiency.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:312;143-454"&gt;As the global electric vehicle (EV) market enters a correction phase, automakers are demanding more from both cost and efficiency. Fukuta has been steadily extending the design, integration, and manufacturing capabilities it built in automotive multi-in-one power systems into smaller power module applications.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD220/fukuta-vehicle-silicon-market-efficiency.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China Electric targets 40% lighting market share with retail push</title>
<pubDate>Wed, 17 Jun 2026 23:50:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD219/china-electric-lighting-retail-brand-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:939;115-1053"&gt;China Electric, which sells lighting products under the TOA brand, is aiming for a 2026 turnaround by reversing second-quarter losses, activating assets, and leasing existing factories, while also expanding into retail channels and contract manufacturing in the second half of the year.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD219/china-electric-lighting-retail-brand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Handheld device makers shift from scanners to edge AI field hubs</title>
<pubDate>Wed, 17 Jun 2026 23:49:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD215/handheld-smart-applications-management-hardware-data.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:217;109-325"&gt;AI and smart applications are pushing handheld devices beyond barcode scanning and data entry, transforming them into intelligent terminals that combine edge computing, cloud management and vertical applications.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD215/handheld-smart-applications-management-hardware-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles</title>
<pubDate>Wed, 17 Jun 2026 23:49:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD212/ip-manufacturing-silicon-valley-equipment-development.html</link>
<description>Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD212/ip-manufacturing-silicon-valley-equipment-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260617pd212_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Annabelle Shu]]></media:description>
</media:content></item>
<item>
<title>Interview: MicroLED and SiPh eye 3.2T AI data race</title>
<pubDate>Wed, 17 Jun 2026 23:49:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD211/microled-siph-cpo-optical-communications-supply-chain-taiwan.html</link>
<description>The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the competition between photons and electrons. Micro LED's high bandwidth and heat resistance position it as a key technology for the 3.2T-plus optical communications era.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Displays</category>
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<title>Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth</title>
<pubDate>Wed, 17 Jun 2026 23:48:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD210/manufacturing-growth-testing-development-automation.html</link>
<description>Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&#38;amp;D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manager Teo Swee Leng about the region's current development and future prospects.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD210/manufacturing-growth-testing-development-automation.html</guid>
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<title>UC San Diego researchers turn retired Pixel phones into low-cost computing cluster</title>
<pubDate>Wed, 17 Jun 2026 23:48:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD206/google-california-hardware-performance.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:360;136-495"&gt;Backed by Google, researchers at the University of California, San Diego, are repurposing retired Pixel phones into a computing cluster that could lower costs and cut e-waste. The project matters far beyond one campus, as it points to a possible model for affordable, local cloud infrastructure that could interest schools and smaller organizations worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: US delays DeepSeek blacklist, exposing AI export-control dilemma</title>
<pubDate>Wed, 17 Jun 2026 08:11:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL216/deepseek-cxmt-entity-list-security-usa.html</link>
<description>The US has held back from adding Chinese AI startup DeepSeek, memory chipmaker CXMT, and more than 100 other entities to a key trade blacklist, underscoring Washington's struggle to balance national security controls with a broader effort to contain tensions with Beijing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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