<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Wed, 26 Aug 2026 10:00:04 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO</title>
<pubDate>Wed, 26 Aug 2026 09:53:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL222/ymtc-nand-2027-ipo-shipments.html</link>
<description>Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5 billion Shanghai listing to fund production upgrades and research.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL222/ymtc-nand-2027-ipo-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl222_files/8_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: YMTC]]></media:description>
</media:content></item>
<item>
<title>Record mid-2026 growth for WUS Printed Circuit and China's pivot to ultra-high-layer PCBs</title>
<pubDate>Wed, 26 Aug 2026 09:49:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL219/growth-wus-hardware-supply-chain-pcb.html</link>
<description>The global hardware supply chain is undergoing a structural transformation, driven by an unprecedented surge in artificial intelligence infrastructure investment. "This shift has brought unprecedented market opportunities to the industry," noted WUS Printed Circuit (Kunshan). The major supplier of high-end printed circuit boards (PCBs) reported explosive growth in its mid-2026 financial results.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL219/growth-wus-hardware-supply-chain-pcb.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl219_files/5_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: WUS Printed Circuits]]></media:description>
</media:content></item>
<item>
<title>TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation</title>
<pubDate>Wed, 26 Aug 2026 09:43:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD243/amd-cowos-tsmc-nvidia-demand.html</link>
<description>Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The report, cited by &lt;em&gt;Wccftech&lt;/em&gt;, attributed the shift to TSMC's rising capacity amid expanding industry-wide demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD243/amd-cowos-tsmc-nvidia-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd243_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Southeast Asia mobility shifts put GATE 2026 in focus</title>
<pubDate>Wed, 26 Aug 2026 09:28:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD229/malaysia-ev-expo-growth-2026.html</link>
<description>The 2026 Global Automotive and Technology Expo (GATE 2026) will take place August 26-28 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, as Southeast Asia's auto market enters a new phase of slower overall growth but faster EV adoption.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD229/malaysia-ev-expo-growth-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Malaysia mobility sector embraces Chinese firms as investment catalyst</title>
<pubDate>Wed, 26 Aug 2026 09:18:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD232/investment-technology-automakers-development-2026.html</link>
<description>&lt;p class=P2&gt;Malaysia's mobility industry is welcoming a larger role for Chinese automakers, with investment, technology exchange and supplier development emerging as key themes at GATE 2026. Malaysia Automotive, Robotics and IoT Institute (MARii) chairman Aminar Rashid bin Salleh said the growing presence of Chinese car brands is adding new momentum to the country's mobility sector.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD232/investment-technology-automakers-development-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd232_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Silicon Optronics advances high-end BSI products as memory shortage splits CIS demand</title>
<pubDate>Wed, 26 Aug 2026 09:07:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD229/soi-cis-sensor-demand.html</link>
<description>CMOS image sensor (CIS) manufacturer Silicon Optronics (SOI) president Bob Chen pointed out during an earnings call on August 25 that artificial intelligence (AI) demand has caused price hikes and shortages for memory since the fourth quarter of 2025. With market supply remaining tight and showing no signs of easing, this has led to a clear polarization in the security camera market. Going forward, the company will continue accelerating its development of higher-end back-side illumination (BSI) products to improve its overall product mix.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825PD229/soi-cis-sensor-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Bioteq lifts Yilan plant output as it shifts production and eyes 2027 growth</title>
<pubDate>Wed, 26 Aug 2026 08:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD212/plant-2027-production-growth-equipment.html</link>
<description>Bioteq is increasing output at its Yilan Science Park plant, a move that could affect supply chains across Asia, Africa, and the Americas. As the company shifts more products and upgrades equipment, it is aiming to improve efficiency, manage geopolitics, and support demand in developing markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD212/plant-2027-production-growth-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd212_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Bioteq]]></media:description>
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<title>Foxconn shifts China manufacturing from expansion to upgrade</title>
<pubDate>Wed, 26 Aug 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD231/foxconn-manufacturing-expansion-investment-equipment.html</link>
<description>Foxconn is accelerating the geographic diversification of its global manufacturing capacity as AI server demand surges and supply-chain regionalization continues, with 2026 capex expected to rise more than 30% year on year. In China, however, the company is not mounting large-scale capacity expansion in step with the U.S., Mexico, India, and Vietnam. Instead, it is shifting investment toward equipment restructuring, precision manufacturing upgrades, and higher-end production capabilities at existing plants.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD231/foxconn-manufacturing-expansion-investment-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd231_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>South Korea, US clash over reactor choice in US$350B nuclear deal</title>
<pubDate>Wed, 26 Aug 2026 08:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD228/nuclear-investment-design-cost-westinghouse.html</link>
<description>South Korea and the United States are at odds over which reactor design to build &#38;mdash; and who runs the project &#38;mdash; in the nuclear power component of Seoul's US investment package, according to industry sources cited by Korean outlet &lt;em&gt;Edaily&lt;/em&gt;.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD228/nuclear-investment-design-cost-westinghouse.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd228_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit:DIGITIMES]]></media:description>
</media:content></item>
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<title>China's chip-tool makers are winning share and paying for it in margins</title>
<pubDate>Wed, 26 Aug 2026 08:23:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL213/revenue-2026-equipment-profit-amec.html</link>
<description>The first-half 2026 accounts now on file from China's listed semiconductor equipment makers describe an industry that has largely settled the question of whether domestic tools can be built and has moved on to a harder one: whether they can be built profitably. Nine of the ten grew revenue by between 13.9% and 49.1% year on year. Gross margins mostly did not follow, and the two largest reported profit jumps turn out, on inspection, to rest heavily on items unrelated to selling equipment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL213/revenue-2026-equipment-profit-amec.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl213_files/6_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China fusion consortium targets 25T superconducting magnet prototype by 2030</title>
<pubDate>Wed, 26 Aug 2026 08:22:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD230/2030-shanghai-nuclear-fusion-supply-chain-technology.html</link>
<description>China's nuclear fusion supply chain is stepping up work on high-temperature superconducting magnet technology. At the 2026 Fusion Energy Conference on August 25, China Fusion Energy Co. (CFEC) joined Shanghai Superconductor, Eastern Superconducting, Shanghai Jiao Tong University (SJTU), Shanghai Electric Nuclear Power Group, Chaomagnet New Energy, Energy Singularity Energy Technology, Hangzhou Oxygen Plant Group, and Shanghai Yixi Tech to form a Yangtze River Delta innovation consortium focused on China Circulation No. 4 and the development and engineering of high-temperature superconducting high-field tokamak magnets.</description>
<dc:creator>Levi Li</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD230/2030-shanghai-nuclear-fusion-supply-chain-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: CCTV]]></media:description>
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<title>Hot Chips 2026: Nvidia pushes deeper into server CPUs with Vera</title>
<pubDate>Wed, 26 Aug 2026 08:18:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL218/nvidia-2026-cpu-processor-amd.html</link>
<description>Nvidia used Hot Chips 2026 to disclose more details about Vera, its next-generation data-center CPU, as the company pushes deeper into the standalone server processor market long dominated by Intel and AMD.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL218/nvidia-2026-cpu-processor-amd.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl218_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Hot Chips]]></media:description>
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<title>Driving the future: Malaysia's strategic automotive evolution at GATE 2026</title>
<pubDate>Wed, 26 Aug 2026 08:12:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL217/2026-automotive-expo-market-vehicle.html</link>
<description>The Global Automotive and Technology Expo 2026 (GATE 2026) officially opened on August 26, spotlighting efforts to deepen Malaysia's local supply chain, accelerate technology adoption and position the country as ASEAN's leading automotive and smart mobility hub. Cooperation between China, Malaysia and other ASEAN countries drew particular attention at the event.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL217/2026-automotive-expo-market-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl217_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Charlene Chen, DIGITIMES]]></media:description>
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<title>Huawei and HP sign multiyear global patent deal covering Wi-Fi tech</title>
<pubDate>Wed, 26 Aug 2026 07:43:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL206/huawei-hp-patent-wi-fi-technology.html</link>
<description>Huawei Technologies and HP Inc. have signed a multiyear global patent cross-licensing agreement that includes a license for HP to use certain Huawei Wi-Fi patents, the Chinese technology company said Wednesday.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL206/huawei-hp-patent-wi-fi-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl206_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>GATE 2026 opens with Sino-ASEAN auto cooperation in focus</title>
<pubDate>Wed, 26 Aug 2026 07:41:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD233/2026-technology-expo-asean-investment.html</link>
<description>The Global Automotive and Technology Expo 2026 (GATE 2026) officially opened on August 26, spotlighting efforts to deepen Malaysia's local supply chain, accelerate technology adoption and position the country as ASEAN's leading automotive and smart mobility hub. Cooperation between China, Malaysia and other ASEAN countries drew particular attention at the event.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD233/2026-technology-expo-asean-investment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd233_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>China chip equipment maker Naura posts 25% revenue growth, but R&#38;amp;D and margins squeeze profit</title>
<pubDate>Wed, 26 Aug 2026 06:55:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL215/naura-technology-ic-manufacturing-equipment-growth-revenue-profit.html</link>
<description>Naura Technology Group posted faster revenue growth than profit in the first half of 2026, with stronger semiconductor equipment sales offset by heavier R&#38;amp;D spending, higher sales costs and weaker gross margins.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL215/naura-technology-ic-manufacturing-equipment-growth-revenue-profit.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl215_files/2_b.jpg" type="image/jpeg" expression="full">
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<title>India's AI buildout accelerates as Vera Rubin demand meets data center expansion</title>
<pubDate>Wed, 26 Aug 2026 06:54:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL203/data-center-demand-rubin-infrastructure-expansion.html</link>
<description>India's AI infrastructure push is gaining pace, with implications that extend far beyond the country's borders. According to &lt;em&gt;Bloomberg&lt;/em&gt;, AM Intelligence has ordered 9,000 Nvidia Vera Rubin systems as global demand for advanced computing continues to strain supply, underscoring how power, data centers, and chip access are becoming strategic priorities worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL203/data-center-demand-rubin-infrastructure-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl203_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount</title>
<pubDate>Wed, 26 Aug 2026 06:49:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL212/samsung-2026-hbm-dram-silicon.html</link>
<description>At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device for AI inference alongside working silicon, performance data and a design intended to minimize changes to existing memory systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL212/samsung-2026-hbm-dram-silicon.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl212_files/7_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Deloitte Taiwan sees slow physical AI adoption despite high expectations</title>
<pubDate>Wed, 26 Aug 2026 06:16:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD214/deloitte-taiwan-adoption-talent-manufacturing.html</link>
<description>Deloitte Taiwan said global companies are rushing to discuss physical AI, but only a small share have embedded it into day-to-day operations, highlighting a widening gap between ambition and deployment. For readers worldwide, the finding signals that industrial AI's next phase may advance unevenly, shaped by costs, talent, safety, and integration.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD214/deloitte-taiwan-adoption-talent-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd214_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>LGES weighs US drone battery push against brand risk</title>
<pubDate>Wed, 26 Aug 2026 06:09:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD210/lges-brand-lg-market-supply-chain.html</link>
<description>LG Energy Solution (LGES) is weighing whether to expand into the US defense supply chain as the EV market remains sluggish and the company broadens into energy storage systems (ESS). The possible move has drawn attention because LG Group has long stayed away from defense businesses since its split with LIG Group.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD210/lges-brand-lg-market-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd210_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>Data center leader leaves OpenAI, latest in wave of high-level departures</title>
<pubDate>Wed, 26 Aug 2026 05:55:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL211/openai-data-center-infrastructure-talent-ipo.html</link>
<description>A key figure responsible for OpenAI's data center plans left the company last week, the latest in a string of departures just as it invests heavily in its AI infrastructure build-out and prepares for an IPO next year. This also illustrates the challenges the industry faces in retaining talent, even among top companies offering large pay packages.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL211/openai-data-center-infrastructure-talent-ipo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl211_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>Cook's parting shot: Apple takes AI compute out of data centers</title>
<pubDate>Wed, 26 Aug 2026 05:09:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL210/apple-mac-mini-ai-hardware-training.html</link>
<description>Apple took pre-orders on August 25 for a new Mac mini and Mac Studio. Both will ship on September 22. Prices of the Mac mini start at US$899 with the M6 chip, or $1,699 with the M5 Pro. Mac Studio starts at $2,499 with M5 Max and $5,499 with M5 Ultra. The 512GB memory version comes in late October.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL210/apple-mac-mini-ai-hardware-training.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl210_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components</title>
<pubDate>Wed, 26 Aug 2026 04:56:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260817RS401/satellite-communications-leo-gan-demand.html?chid=2</link>
<description>DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>More Topics</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260817RS401/satellite-communications-leo-gan-demand.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260817rs401_files/2_2b.jpg" type="image/jpeg" expression="full">
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<title>Star Trade to highlight power services for chips and AI at Semicon Taiwan 2026</title>
<pubDate>Wed, 26 Aug 2026 04:08:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD213/hd-renewable-semicon-taiwan-2026-data-center-electricity-solar.html</link>
<description>Star Trade, a unit of HD Renewable Energy, is set to debut at Semicon Taiwan 2026 next week, offering power trading and energy management services for semiconductor and AI infrastructure. The move underscores how global chipmaking and data center growth is increasing pressure on grids, renewable integration, and electricity pricing.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD213/hd-renewable-semicon-taiwan-2026-data-center-electricity-solar.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd213_files/1_b.jpg" type="image/jpeg" expression="full">
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<title>SK hynix production union rejects stock-heavy pay deal by 25 votes</title>
<pubDate>Wed, 26 Aug 2026 03:58:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL208/production-2026-price.html</link>
<description>SK hynix's production-worker union has rejected the company's tentative 2026 wage and collective bargaining agreement by just 25 votes, sending the two sides back to the negotiating table as production workers push back against a proposed shift from cash-heavy profit sharing toward stock-based compensation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260826vl208_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan Photon Source boosts domestic accelerator supply chain, challenges cutting-edge technology limits</title>
<pubDate>Wed, 26 Aug 2026 03:53:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD200/taiwan-accelerator-technology-nstc-development.html</link>
<description>The Taiwan-based National Synchrotron Radiation Research Center (NSRRC), supported by top scientists including Nobel chemistry laureate Yuan-tseh Lee, held a celebration event on August 25 to mark the 10th anniversary of the Taiwan Photon Source (TPS).</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD200/taiwan-accelerator-technology-nstc-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[NSTC Minister Cheng-wen Wu. Credit: NSTC]]></media:description>
</media:content></item>
<item>
<title>US-Canada trade talks collapse as auto tariffs threaten North American supply chain</title>
<pubDate>Wed, 26 Aug 2026 03:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD211/supply-chain-automakers-production-auto-industry-vehicle.html</link>
<description>The collapse of US-Canada trade talks has put global automakers and suppliers on alert, as tariff disputes now threaten production costs, vehicle prices, and cross-border parts flows. The breakdown underscores how deeply integrated the North American auto industry remains. Disruption is likely to ripple well beyond the two countries.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD211/supply-chain-automakers-production-auto-industry-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd211_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung's 3-year shareholder returns seen topping KRW600T</title>
<pubDate>Wed, 26 Aug 2026 03:36:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD209/samsung-2026-earnings-cash-flow-policy.html</link>
<description>AI memory excess profits are beginning to change Samsung Electronics' capital-allocation logic. The company recently said that, under its current 2024-2026 shareholder return policy, the remaining funds available for shareholder returns in 2026 are estimated at about KRW90 trillion-KRW110 trillion (about US$65 billion-US$79 billion), a record high, while the market has already started looking to the next three-year period.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260826pd209_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TCL, Asus drop China OLED as LGD gains edge</title>
<pubDate>Wed, 26 Aug 2026 03:31:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD208/tcl-lg-display-asus-boe-panel.html</link>
<description>TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted use of BOE Technology Group (BOE) OLED panels after about one month. The moves underscore a growing gap in high-end OLED technology led by South Korean panel makers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD208/tcl-lg-display-asus-boe-panel.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd208_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Trump weighs Apple China chip deal as CXMT runs full</title>
<pubDate>Wed, 26 Aug 2026 03:25:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD207/apple-cxmt-capacity-supply-chain-chips.html</link>
<description>Apple is seeking to diversify its supply chain to ease pressure from rising memory costs and has reportedly sought US government clearance to buy memory from blacklisted Chinese chipmaker CXMT. The request has quickly become entangled in US-China geopolitics, but even if it receives political approval, CXMT&#38;rsquo;s long-running capacity constraints could still keep Apple from getting what it wants.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD207/apple-cxmt-capacity-supply-chain-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd207_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Nvidia earnings hinge on Rubin ramp and Vera CPU</title>
<pubDate>Wed, 26 Aug 2026 03:24:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD221/rubin-cpu-earnings-2027-revenue.html</link>
<description>Nvidia will release its fiscal second-quarter 2027 financial results on August 26, US time. Given Nvidia's performance pattern in recent quarters, Wall Street has come to expect a "beat and raise" outcome. Ahead of the print, multiple investment firms released preview reports focusing on whether the Rubin platform can smoothly succeed Blackwell and whether AI demand continues to significantly outstrip supply.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD221/rubin-cpu-earnings-2027-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd221_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China GPU race, Part 2: Moore Threads, MetaX, Biren and Enflame pursue four formulas for breaking Nvidia's grip</title>
<pubDate>Wed, 26 Aug 2026 03:02:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL202/gpu-nvidia-moore-threads-biren-metax.html</link>
<description>Enflame's planned US$893 million STAR Market IPO, examined in Part 1 of this series, highlights both the opportunity and the financial strain facing China's emerging AI chip suppliers, but profitability is only one part of the competition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL202/gpu-nvidia-moore-threads-biren-metax.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl202_files/7_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SCMP]]></media:description>
</media:content></item>
<item>
<title>LandSpace eyes Zhuque-3 refly within 6 months</title>
<pubDate>Wed, 26 Aug 2026 02:47:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD215/commercial-recovery-data.html</link>
<description>Chinese commercial rocket maker LandSpace plans to relaunch its reusable Zhuque-3 booster within six months, after the vehicle successfully completed a vertical landing on land in its second test flight last week. The company said the milestone marks not only a technical breakthrough but also the starting point for building a system for inspection, maintenance and reuse, as China's reusable rocket sector accelerates commercialization.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD215/commercial-recovery-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd215_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition</title>
<pubDate>Wed, 26 Aug 2026 02:36:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL204/apple-2nm-tsmc-iphone-performance.html</link>
<description>Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers. The more consequential detail is that M6 is Apple's first 2-nanometer part &#38;mdash; putting a Mac, not an iPhone, at the front of the node transition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260826vl204_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
</media:content></item>
<item>
<title>China GPU race, Part 1: Enflame IPO spotlights Tencent ties, deep losses and AI chip ambitions</title>
<pubDate>Wed, 26 Aug 2026 02:27:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL201/china-ai-chip-gpu-ipo-revenue-tencent.html</link>
<description>Enflame Technology is preparing to become the latest of China's leading AI chip developers to tap public markets, with a CNY6 billion (approx. US$893 million) Shanghai STAR Market listing that puts its rapid revenue growth, persistent losses and heavy reliance on Tencent under closer scrutiny.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL201/china-ai-chip-gpu-ipo-revenue-tencent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl201_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Enflame Technology. Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role</title>
<pubDate>Wed, 26 Aug 2026 02:23:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD218/google-mediatek-tpu-supply-chain-design.html</link>
<description>Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders impacted.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD218/google-mediatek-tpu-supply-chain-design.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd218_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan AI Cloud flags four demands for AI from POC to production</title>
<pubDate>Wed, 26 Aug 2026 02:17:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD204/cloud-data-production-taiwan-management.html</link>
<description>Taiwan AI Cloud General Manager Han-chang Wu said at the 2026 Taiwan Sustainability Summit on August 25 that as open-source models mature, computing power becomes easier to access, and generative AI becomes more widespread, the barriers to enterprises launching AI proof-of-concept (POC) projects have fallen sharply. But moving AI from a demo to formal deployment is not just about model capability; it is about whether it can support core enterprise workflows.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD204/cloud-data-production-taiwan-management.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd204_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>MOEA says circular economy output tops NT$1T</title>
<pubDate>Wed, 26 Aug 2026 02:11:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD203/circular-economy-taiwan-moea-recycling-2026.html</link>
<description>Taiwan's circular economy has entered a new stage as the Ministry of Economic Affairs (MOEA) said the sector's output has surpassed NT$1 trillion (US$31.4 billion), while calling for AI and related technologies to help narrow the pay and working-conditions gap with the semiconductor industry. The ministry made the remarks on August 25 at a joint press conference for the 2026 Taiwan Circular Economy Week with the Ministry of Environment, Ministry of Agriculture, Ministry of the Interior, and the Public Construction Commission.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD203/circular-economy-taiwan-moea-recycling-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd203_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>India chip manufacturing push exposes production-test skills gap, NI says</title>
<pubDate>Wed, 26 Aug 2026 01:58:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL224/india-ic-manufacturing-testing-expansion-talent.html</link>
<description>India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT plants and fabs move toward manufacturing, executives at Emerson's NI test and measurement business said.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825VL224/india-ic-manufacturing-testing-expansion-talent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825vl224_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Baskar Ceri, Managing Director, and Srinivasa Prasad, India R&#38;D Site Head &#38; Sr Director, NI India, Emerson. Credit: Emerson.]]></media:description>
</media:content></item>
<item>
<title>Eternal Materials reports July revenue gain as advanced packaging demand strengthens</title>
<pubDate>Wed, 26 Aug 2026 01:56:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD202/eternal-materials-lcy-revenue-demand-packaging.html</link>
<description>Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion (US$128.5 million). That was up 23.86% from a year earlier and 6.82% from June, as demand from the electronics supply chain continued to support sales.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD202/eternal-materials-lcy-revenue-demand-packaging.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan listed firms report 1H26 pretax profit surge on AI server demand</title>
<pubDate>Wed, 26 Aug 2026 01:49:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD201/taiwan-profit-demand-2026-earnings.html</link>
<description>Taiwan's Financial Supervisory Commission said on August 25 that strong global demand for Taiwan-made AI servers and high-performance computing lifted corporate earnings in the first half of 2026. The agency said pretax profits at listed and OTC companies reached their highest first-half level in 10 years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD201/taiwan-profit-demand-2026-earnings.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Kyocera to ramp up MLCC production for AI servers with JPY60B investment</title>
<pubDate>Wed, 26 Aug 2026 01:46:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL222/kyocera-production-mlcc-demand-manufacturing.html</link>
<description>Japanese components maker Kyocera is making a major push to capture surging AI demand. As part of its mid-term growth strategy toward FY2031, the company plans to begin mass production of next-generation multi-layer ceramic capacitors (MLCCs) for AI servers by the end of March 2027. Production will take place at its Kokubu Block within the newly renamed Kagoshima Kirishima Plant in Kagoshima Prefecture.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825VL222/kyocera-production-mlcc-demand-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825vl222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market</title>
<pubDate>Wed, 26 Aug 2026 01:42:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD216/ymtc-apple-cxmt-market-capacity.html</link>
<description>The memory industry is entering a powerful growth cycle, with Apple seeking to add Chinese suppliers CXMT and YMTC to its memory supply chain. With a meeting between US President Donald Trump and Chinese President Xi Jinping expected on September 24, 2026, sources say Washington, previously opposed to such sourcing, could allow the purchases to proceed.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PD216/ymtc-apple-cxmt-market-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pd216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>BOE, 3M expand materials partnership as foldable OLED competition intensifies</title>
<pubDate>Wed, 26 Aug 2026 01:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL213/boe-3m-materials-foldable-partnership.html</link>
<description>BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development for LCD, OLED and MLED panels &#38;mdash; turning what has been a roughly two-decade partnership into a shared development platform.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825VL213/boe-3m-materials-foldable-partnership.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825vl213_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[BOE and 3M have established a joint laboratory in Beijing focused on display materials and advanced panel development. Credit: 3M]]></media:description>
</media:content></item>
<item>
<title>Nvidia unveils Jetson Orin Nano 2 for edge AI robots and drones</title>
<pubDate>Wed, 26 Aug 2026 01:23:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PR201/nvidia-robotics-pc-performance.html</link>
<description>Nvidia has introduced Jetson Orin Nano 2, a compact robotics computer aimed at entry-level edge AI, with implications for developers building autonomous machines worldwide. The system promises faster, more efficient on-device intelligence for robots, drones, and vision systems as physical AI adoption expands across industries and markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PR201/nvidia-robotics-pc-performance.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pr201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>OpenAI says Jalape&#38;ntilde;o cuts latency up to 3.6x, targeting the bottleneck that slows agents</title>
<pubDate>Wed, 26 Aug 2026 00:51:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PR200/openai-efficiency-design-performance-infrastructure.html</link>
<description>OpenAI said its first custom inference chip, Jalape&#38;ntilde;o, delivered faster responses and better power efficiency than competing systems in tests across several large language models. The findings could matter for global users, as cheaper, lower-latency AI infrastructure may help expand access, improve reliability, and support more capable agents worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826PR200/openai-efficiency-design-performance-infrastructure.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826pr200_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: OpenAI]]></media:description>
</media:content></item>
<item>
<title>Apple ships M6 Mac mini and M5 Ultra Mac Studio &#38;mdash; and hands Ternus a memory bill</title>
<pubDate>Wed, 26 Aug 2026 00:50:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826VL200/apple-launch-tim-cook-mac-mini-gpu.html</link>
<description>Apple unveiled new Mac mini and Mac Studio desktops on August 25 in what &lt;em&gt;Reuters&lt;/em&gt; called "likely the final product launch of Tim Cook's tenure as CEO." The machines read less like a farewell than like a handover note. Cook becomes executive chairman on September 1, when John Ternus, senior vice president of hardware engineering, becomes chief executive under a succession Apple announced in April.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260826VL200/apple-launch-tim-cook-mac-mini-gpu.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260826vl200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
</media:content></item>
<item>
<title>Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm</title>
<pubDate>Wed, 26 Aug 2026 00:47:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD221/xiaomi-soc-mediatek-qualcomm-market.html</link>
<description>Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as an AI flagship SoC.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825PD221/xiaomi-soc-mediatek-qualcomm-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825pd221_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan maps four AI-led strategies to expand its biotech sector</title>
<pubDate>Wed, 26 Aug 2026 00:47:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD223/taiwan-biotech-manufacturing-market-chips.html</link>
<description>Taiwan's Ministry of Economic Affairs outlined four strategies to scale up the island's biotech industry at a strategy meeting under the Executive Yuan on August 24. The plan centered on artificial intelligence integration, stronger critical-drug supply chains, broader clinical validation, and deeper global market ties.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260825pd223_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>Samsung, Intel widen AI chip battle into memory, packaging</title>
<pubDate>Wed, 26 Aug 2026 00:47:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD224/samsung-intel-packaging-hbm-business.html</link>
<description>Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports cited by &lt;em&gt;Counterpoint Research&lt;/em&gt; said Samsung is using high-bandwidth memory (HBM) to strengthen its foundry business, while Intel is expanding from logic chips and foundry services into memory through advanced packaging and system-level technologies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung Display boosts OLED sales as Galaxy Z panel orders triple</title>
<pubDate>Wed, 26 Aug 2026 00:46:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD225/market-sales-sdc-shipments-panel.html</link>
<description>The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display, however, outperformed the market on stronger shipments of foldable phone panels.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon</title>
<pubDate>Wed, 26 Aug 2026 00:46:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL204/robotaxi-waymo-silicon-samsung-expansion.html</link>
<description>As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize have raised industry expectations for the economic viability of full autonomy.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China's EV giants redraw their boundaries as physical AI becomes its own business</title>
<pubDate>Wed, 26 Aug 2026 00:46:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL211/business-robotics-technology-xpeng-supply-chain.html</link>
<description>The surprising convergence at the intersection of two fundamental applications of embodied AI &#38;mdash; EVs and robotics &#38;mdash; has given rise to an intensifying trend across both sectors. The supply chain is witnessing a major power imbalance unfold, alongside increasingly blurred lines in product lifecycles and, ultimately, an economic restructuring of broader supply-chain dynamics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>China has plenty of indium but not enough InP wafers for AI data centers</title>
<pubDate>Wed, 26 Aug 2026 00:46:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL217/inp-capacity-substrate-wafer-6-inch.html</link>
<description>China accounts for more than 70% of the world's primary indium output but only about 10% of finished indium phosphide substrates, leaving a gap between its strength in raw materials and the qualified wafer capacity increasingly needed for AI data-center optics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[InP substrates used in optical communications. Credit: JX Advanced Metals]]></media:description>
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<title>China's advanced-chip gap could close well before its lithography gap does</title>
<pubDate>Wed, 26 Aug 2026 00:45:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL218/capacity-equipment-expansion-demand-2026.html</link>
<description>As China enters a near-frenzied state of continuous production-capacity expansion, it is easy to see that the main driver behind these aggressive, purpose-built movements in the domestic chip-manufacturing space is rooted in a national need to maintain sovereign control over critical process nodes, where access to the surrounding supply chain has proved increasingly constrained.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC's 310mm push threatens Samsung's PLP lead</title>
<pubDate>Wed, 26 Aug 2026 00:44:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL220/samsung-tsmc-packaging-panel-equipment.html</link>
<description>Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and high-performance computing. But the next phase of PLP competition may depend less on who moved first than on which rectangular panel format equipment makers, materials suppliers and OSATs ultimately build around, and activity around 310&#38;times;310mm is growing in Taiwan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung steps up Taylor Fab 2 preparations as foundry capacity tightens</title>
<pubDate>Wed, 26 Aug 2026 00:44:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL221/samsung-capacity-equipment-fab-demand.html</link>
<description>Samsung Electronics has begun asking semiconductor equipment suppliers to complete safety-compliance groundwork for a second foundry fab in Taylor, Texas, months before construction is scheduled to begin, according to &lt;em&gt;ZDNet Korea&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>SK hynix adds second major customer as Nvidia misses Samsung's top five</title>
<pubDate>Wed, 26 Aug 2026 00:44:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825VL223/sk-hynix-samsung-hbm4-revenue-sales-nvidia.html</link>
<description>SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting the contrast in how the two Korean memory makers are exposed to the AI accelerator leader.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Samsung, LG ramp up India for AI cooling and appliances</title>
<pubDate>Wed, 26 Aug 2026 00:28:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD206/samsung-lg-cooling-production-data-center.html</link>
<description>India is emerging as a new battleground for South Korea's two electronics giants, with Samsung Electronics using the country as a production and supply-chain base for AI data center cooling equipment and LG Electronics investing hundreds of billions of won to build a third home appliance plant. But whether India's fast growth and huge population will translate into real earnings remains the biggest test.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>India mmWave opportunity emerges; Gemtek moves early</title>
<pubDate>Wed, 26 Aug 2026 00:25:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260826PD205/gemtek-market-communications-equipment-infrastructure.html</link>
<description>India has continued to push next-generation communications infrastructure, and the Telecommunication Engineering Centre (TEC) under the Department of Telecommunications (DoT) has officially released a Provisional Generic Requirement for Wi-Fi technology in the licensed 26 GHz (n258) band, opening the door for manufacturers and telecom operators to conduct field trials in real-world environments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Eva Air green transport pact to cut Microsoft freight emissions by 15,000 tonnes</title>
<pubDate>Tue, 25 Aug 2026 11:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PD227/microsoft-fuel-taiwan-launch-demand.html</link>
<description>Eva Air and AIT Worldwide Logistics have signed a memorandum of understanding to launch a green transport program that will use sustainable aviation fuel from Formosa Petrochemical for Microsoft cloud equipment shipments. The Taiwan-based collaboration is expected to reduce Microsoft's Scope 3 emissions by 15,000 tonnes in its first year.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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</channel>
</rss>

