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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Memory shortages deepen as suppliers turn to long-term contracts</title>
<pubDate>Thu, 16 Jul 2026 23:58:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD214/electronics-dram-capacity-ddr4-nand.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:300;113-412"&gt;Memory shortages are rippling through global electronics supply chains, as tightening supply in DRAM and NAND pushes manufacturers to lock in long-term contracts. The squeeze could mean higher prices, longer lead times, and fewer options across servers, industrial systems, and consumer devices.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Capacity reservations and inventory buildup reshape component makers' 3Q26 outlook amid persistent shortages</title>
<pubDate>Thu, 16 Jul 2026 23:58:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD211/investment-infrastructure-price-passive-power-semiconductors.html</link>
<description>Global investment in AI infrastructure continues to accelerate, yet component shortages across the supply chain have not eased as previously expected. Instead, tightening availability across multiple product categories has intensified supply constraints.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>China's AI chips hit three walls &#38;mdash; and bet on 3D memory to break through</title>
<pubDate>Thu, 16 Jul 2026 23:57:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715VL210/3d-chips-technology-ai-chip-performance.html</link>
<description>China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>SOFC gains traction in AI data centers, opening three paths for Taiwan suppliers</title>
<pubDate>Thu, 16 Jul 2026 23:56:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260714PD225/fuel-cell-demand-energy-storage-capacity-taiwan-technology.html</link>
<description>As AI ushers in an era in which computing capacity increasingly translates directly into power demand, energy has become the foundational layer of the "five-layer cake" framework outlined by Nvidia CEO Jensen Huang. While hyperscale cloud providers are accelerating construction of AI data centers, power infrastructure is emerging as a critical factor determining how quickly those facilities can come online.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Volkswagen's cuts lay bare Europe's deeper auto industry crisis</title>
<pubDate>Thu, 16 Jul 2026 23:56:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260713PD236/volkswagen-automakers-production-layoffs-europe.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:157;115-271"&gt;Volkswagen, the world's second-largest automaker, has expanded production cuts and layoffs, drawing scrutiny to the pressures facing Europe's auto industry.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>US EV market steadies after federal tax credits expire as prices and charging remain hurdles</title>
<pubDate>Thu, 16 Jul 2026 23:56:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD209/market-bev-vehicle-capacity-2026.html</link>
<description>The US electric vehicle market showed signs of stabilizing in the second quarter of 2026 after federal clean-vehicle tax credits expired in September 2025, although sales remained well below year-earlier levels.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>KAI and Hyundai target joint AAM development to close South Korea's aircraft body gap</title>
<pubDate>Thu, 16 Jul 2026 23:55:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD207/certification-hyundai-aircraft-development-performance.html</link>
<description>South Korea is accelerating efforts to build an advanced air mobility industry, but the sector is still struggling to produce a workable aircraft body. As US and Chinese rivals move faster toward certification and trial operations, Korea Aerospace Industries (KAI) and Hyundai Motor Group have moved to deepen cooperation on a joint development plan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Aurora Group expands enterprise AI services with 12 workplace use cases</title>
<pubDate>Thu, 16 Jul 2026 23:55:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD205/cloud-business-management-training-ai-applications.html</link>
<description>On July 15, Aurora Group expanded its enterprise AI push, unveiling 12 use cases through Aurora Cloud and GPI for companies looking to match AI tools with specific business problems. The rollout was organized around three themes - smart operations, smart security and sustainable governance - and was designed for enterprises seeking practical deployment scenarios rather than standalone automation.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Memory suppliers push prices higher as Apple and automakers face tighter supply</title>
<pubDate>Thu, 16 Jul 2026 23:54:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD204/apple-automakers-capacity-price-demand.html</link>
<description>Memory suppliers have regained pricing power as AI-driven stockpiling and advance capacity bookings tightened supply for consumer electronics and automotive customers. The shift has become especially visible in the Apple supply chain, where industry sources said the company is now effectively the last major line of defense as vendors push for higher prices and allocate capacity elsewhere.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>AI hardware boom lifts Taiwan's rail and CCL suppliers; optical module tells messier story</title>
<pubDate>Thu, 16 Jul 2026 09:04:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715VL222/taiwan-monthly-tracker-ai-server-supply-chain-ccl-growth.html</link>
<description>Taiwan's technology supply chain delivered another month of strong year-over-year revenue growth in June 2026, led by suppliers tied directly to AI server infrastructure, even as the optical module segment showed the sharpest slowdown of any sector tracked and revealed a widening gap between winners and laggards within its own ranks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers</title>
<pubDate>Thu, 16 Jul 2026 08:43:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL229/tsmc-c.-c.-wei-emib-wafer-packaging-earnings-business.html</link>
<description>TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies threaten TSMC's advanced packaging business, and that the company should be extracting windfall margins from its dominant market position.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC says 2nm has four times as many tape-outs as 3nm at the same stage</title>
<pubDate>Thu, 16 Jul 2026 08:21:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL228/tsmc-3nm-2nm-production-design.html</link>
<description>Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production of its first 2nm process.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan AI server tracker: Rail kits and chassis post fastest revenue growth in June</title>
<pubDate>Thu, 16 Jul 2026 08:10:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715VL230/taiwan-monthly-tracker-ai-server-chassis-revenue-growth.html</link>
<description>Taiwan suppliers linked to the AI server market posted broad revenue growth in June, with rail-kit and server-chassis makers recording the fastest year-over-year gains as demand for rack-scale systems continued to lift mechanical components.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[The Nvidia GB200 NVL72 rack-scale system. Credit: Nvidia]]></media:description>
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<title>AI chips are running hotter &#38;mdash; and Niching is betting its future on keeping them cool</title>
<pubDate>Thu, 16 Jul 2026 07:47:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD231/chips-packaging-niching-hpc-demand.html</link>
<description>As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor materials supplier Niching incorporated heat spreader maker Ming Chun Yuan Micro Precise Technology into the group on July 1, 2026, and analysts expect the merger to lift revenue by 30% and gross margin by 10%.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Taiwan OSATs expand non-China capacity with US and SEA push</title>
<pubDate>Thu, 16 Jul 2026 07:44:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD227/packaging-taiwan-capacity-testing-ase.html</link>
<description>As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China. ASE, SPIL, KYEC, Greatek, and Tong Hsing are all pushing ahead in 2026 to strengthen supply-chain resilience amid geopolitical risk.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>DeepSeek eyes US$70 billion valuation and Shanghai IPO as Apple Intelligence enters China</title>
<pubDate>Thu, 16 Jul 2026 07:44:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL212/deepseek-apple-intelligence-market-fundraising-shanghai.html</link>
<description>&lt;p class="P1" data-start="82" data-end="311"&gt;DeepSeek is preparing a new fundraising round and a possible Shanghai listing as surging computing costs force one of China's best-known artificial intelligence startups to rethink its long-standing resistance to outside capital.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>UMT to acquire majority stake in Dynahz Technologies for NT$1.7 billion</title>
<pubDate>Thu, 16 Jul 2026 07:43:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD233/umt-mmwave-acquisition-development-2026.html</link>
<description>Universal Microwave Technology (UMT), a manufacturer of satellite and millimeter-wave (mmWave) communication components, suspended trading on July 15 and held a material information briefing. The company announced that its board of directors approved the acquisition of more than a 51% stake in high-frequency connector manufacturer Dynahz Technologies for no more than NT$1.7 billion (approx. US$52.8 million).</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Aerospace</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TSMC boosts US investment by US$100B as C.C. Wei outlines long-term capacity planning with customers</title>
<pubDate>Thu, 16 Jul 2026 07:43:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD234/tsmc-capacity-investment-growth-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:199;236-434"&gt;To address structural long-term growth in semiconductor demand, TSMC chairman C.C. Wei said the company works closely with customers &#38;mdash; and its customers' customers &#38;mdash; to jointly plan future capacity.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<item>
<title>Apple Intelligence edges closer to China with Alibaba Qwen integration</title>
<pubDate>Thu, 16 Jul 2026 07:41:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL220/iphone-apple-intelligence-alibaba-qwen.html</link>
<description>Apple Intelligence has passed a key regulatory milestone in China, bringing the iPhone maker closer to launching generative AI features for mainland users after a prolonged delay.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Nfore's Taiwan listing points to rising demand for software-led auto connectivity</title>
<pubDate>Thu, 16 Jul 2026 07:38:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD217/taiwan-demand-software-vehicle-automakers.html</link>
<description>Nfore Technology is set to list on Taiwan's emerging stock board on July 22, betting that demand for connected-car systems, smart cockpits, and vehicle software will keep rising as automakers compress development cycles and look for more integrated suppliers. The company plans to increase software licensing and integration services.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<title>TSMC eyes record quarter: 2nm ramp drives 3Q26 guidance above US$44B</title>
<pubDate>Thu, 16 Jul 2026 07:20:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL227/tsmc-revenue-2nm-guidance-demand.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:248;159-406"&gt;TSMC is projecting its strongest quarter ever, guiding third-quarter 2026 revenue to between US$44.6 billion and US$45.8 billion on the back of accelerating demand for leading-edge chips and the steep ramp-up of its 2-nanometer process technology.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC lifts 2026 revenue growth above 40% on strong AI demand from cloud giants</title>
<pubDate>Thu, 16 Jul 2026 07:19:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD233/tsmc-demand-growth-2026-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:281;125-405"&gt;TSMC expressed strong confidence during its July 16 earnings conference that demand for its advanced process technologies remains robust, with chairman C.C. Wei saying the company's 2nm process has entered volume production and is progressing smoothly through its production ramp.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC chairman C.C. Wei. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Beyond AI: Resilient consumer demand widens semiconductor supply crunch</title>
<pubDate>Thu, 16 Jul 2026 07:06:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD221/demand-market-capacity-supply-chain-cloud-ai.html</link>
<description>Reports of lengthening semiconductor lead times have become increasingly common in recent months, highlighting that the imbalance between chip supply and demand has not eased but is instead spreading across a broader range of end markets. Taiwanese IC design companies believe that while booming cloud AI investment remains the primary driver behind today's capacity constraints across semiconductors and electronic components, resilient demand outside the cloud AI sector has also played an equally important role in keeping the market tight.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<item>
<title>As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore</title>
<pubDate>Thu, 16 Jul 2026 06:59:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL222/samsung-itc-chips-nvidia-investigation.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:318;117-434"&gt;A US trade agency has opened an investigation that could block imports of the DDR5 server memory and high-bandwidth memory (HBM) feeding the AI data center boom, handing a small California patent holder a border lever that runs parallel to President Donald Trump's campaign to force chip production back onto US soil.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue</title>
<pubDate>Thu, 16 Jul 2026 06:32:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL223/tsmc-revenue-profit-demand-2nm.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:222;107-328"&gt;TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations, underscoring sustained demand for AI and high-performance computing (HPC) chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[TSMC chairman C.C. Wei. Credit: AFP]]></media:description>
</media:content></item>
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<title>InP substrates emerge as strategic asset as optical engine supply chain heads for reshuffle</title>
<pubDate>Thu, 16 Jul 2026 06:29:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD223/inp-ai-server-supply-chain-manufacturing-cpo.html</link>
<description>As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese companies may find an opportunity to break into the market by addressing the widening supply gap.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
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<title>CXMT IPO raises fresh capital, but its own prospectus map shows distance still to close</title>
<pubDate>Thu, 16 Jul 2026 06:26:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL221/cxmt-ipo-dram-revenue-market.html</link>
<description>The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry it is entering, including detailed profiles of the three incumbents it must eventually displace, and a frank accounting of how far behind it still sits.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit:AFP]]></media:description>
</media:content></item>
<item>
<title>Groups urge EU interim measures against Broadcom amid VMware antitrust case</title>
<pubDate>Thu, 16 Jul 2026 06:17:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL219/broadcom-eu-antitrust-cloud-europe.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:361;111-471"&gt;A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations in calling for the European Commission to impose interim measures while it processes an antitrust case against Broadcom. The case concerns recent licensing changes made by the chip designer on the virtualization platform VMware.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple lawsuit targets OpenAI's AI hardware ambitions</title>
<pubDate>Thu, 16 Jul 2026 06:12:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD230/apple-openai-hardware-lawsuit-technology.html</link>
<description>Apple has sued OpenAI for allegedly stealing trade secrets, but the real fight is over who controls the entry points of AI. As LLM technology converges, the case shows that competition is shifting back to a fundamental question: on what device, and in what way, will users use AI?</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260715pd230_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>MCU lead times stretch, but industry holds the line against a pandemic-style order rush</title>
<pubDate>Thu, 16 Jul 2026 05:59:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD216/industrial-automation-medical-devices-inventory-mcu-pandemic.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:425;197-621"&gt;Microcontrollers (MCUs), widely used across industrial automation, medical devices, and consumer electronics, are experiencing longer delivery times as both wafer fabrication and semiconductor packaging lead times continue to extend. Industry suppliers said customers accelerated orders and pulled in shipments during the first half of 2026 amid rising prices across the supply chain, with urgent orders also on the rise.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716pd216_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Cadence launches agentic AI platform for PCB and package design</title>
<pubDate>Thu, 16 Jul 2026 05:53:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PR204/cadence-eda-pcb-packaging-design-nvidia.html</link>
<description>Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Baiwei Storage forecasts sharp first-half profit surge on AI memory demand</title>
<pubDate>Thu, 16 Jul 2026 05:48:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL202/shenzhen-demand-revenue-profit-2026.html</link>
<description>Shenzhen Baiwei Storage Technology said its first-half 2026 revenue and profit are likely to rise sharply, highlighting how the global AI boom is reshaping demand for memory chips and related equipment. The company's preliminary figures suggest stronger orders, improved product mix, and a recovering storage market that could matter for investors worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung turns to titanium to reduce screen creases in next foldables</title>
<pubDate>Thu, 16 Jul 2026 05:41:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716VL216/samsung-sdc-foldable-display-galaxy.html</link>
<description>Samsung Electronics unveiled a new titanium-based display structure on July 15, designed to reduce screen crease visibility while improving durability and preserving a slim profile in its next generation of Galaxy foldable devices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716vl216_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Samsungˇ¦s Flex Titanium structure uses a titanium-alloy film and support plate. Credit: Samsung Electronics]]></media:description>
</media:content></item>
<item>
<title>Everlight shifts automotive product production to Thailand, sells Taiwan Tongluo site</title>
<pubDate>Thu, 16 Jul 2026 05:40:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260716PD200/production-led-packaging-taiwan-everlight-automotive.html</link>
<description>&lt;p class=Image&gt;</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20260716pd200_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
</media:content></item>
<item>
<title>Commentary: Xi Jinping elevates Sovereign AI, diplomacy, ecosystems into China's next AI strategy</title>
<pubDate>Thu, 16 Jul 2026 05:38:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260715PD217/2026-xi-jinping-diplomacy-shanghai-supply-chain.html</link>
<description>&lt;p class="P1" data-start="142" data-end="306"&gt;The 2026 World Artificial Intelligence Conference (WAIC) opens in Shanghai on July 17, with Chinese President Xi Jinping set to attend and deliver a keynote speech.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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