DIGITIMES: News and Insight of the Global Supply Chain

IBM's growth rebounds after a summer stumble, led by software and servers

DIGITIMES — Thu, 22 Oct 2026 00:58:28 GMT

IBM's third quarter went some way towards answering whether the deal slippage that hit its second quarter reflected weaker demand or delayed timing. Revenue rose 5% year on year, or 6% at constant currency, to US$17.1 billion for the quarter ended September 30, 2026, an acceleration after a second quarter that led the company to cut its full-year outlook in July.

Meta's advertising engine keeps pace with its AI build-out as legal costs cut into profit

DIGITIMES — Thu, 22 Oct 2026 00:57:39 GMT

Meta Platforms' third quarter showed that its core advertising business is still growing fast enough to carry one of the largest infrastructure programs in the technology industry. Still, it also showed legal liabilities becoming a material cost line. Revenue rose 26% year on year to US$64.6 billion for the quarter ended September 30, 2026, while the operating margin fell to 20% from 40% a year earlier.

Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin

DIGITIMES — Wed, 21 Oct 2026 23:58:36 GMT

Nvidia used its GTC Berlin keynote on October 21 to argue that AI's bottlenecks now lie in deployment speed, power, and security rather than silicon, unveiling reference designs and software that extend its reach from GPUs to how entire AI factories are built and run.

Tesla's car margins recover, but spending on AI and robotics absorbs the gain

DIGITIMES — Wed, 21 Oct 2026 23:56:23 GMT

Tesla's third quarter showed its vehicle business regaining some per-car profitability even as total sales stalled, while the company's push into AI, robotaxis, and humanoid robots consumed most of the improvement. Revenue was roughly flat year on year at US$28.05 billion for the quarter ended September 30, 2026, and operating income fell 56% to US$718 million, leaving an operating margin of 2.6% against 5.8% a year earlier.

Taiwan's FTC blocks Grab's Foodpanda acquisition over competition concerns

Eifeh Strom — Wed, 21 Oct 2026 23:55:27 GMT

Grab Holdings' proposed acquisition of Delivery Hero's Foodpanda operations in Taiwan has been rejected by Taiwan's Fair Trade Commission (FTC). The commission made the announcement on October 21, blocking the deal on the grounds that it would restrict market competition. Grab issued a statement saying while it was disappointed with the decision, it will continue developing its core businesses in its existing Southeast Asian markets.

GoldKey Technology posts record 3Q26 profit as industrial share rises

Charlene Chen — Wed, 21 Oct 2026 23:53:48 GMT

Memory module maker GoldKey Technology posted record third-quarter 2026 profit, with net income topping NT$1 billion (approx. US$30.9 million) for the first time at NT$1.03 billion, up 6.2% quarter-over-quarter. However, the conversion of convertible bonds increased its share capital, pushing earnings per share down to NT$9.14 from NT$10.17 in the second quarter.

Chief Telecom's CTSP AI data center bookings exceed 50%

Charlene Chen — Wed, 21 Oct 2026 23:53:33 GMT

Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million). Chairman Jerry Shao said the facility's reservation and contract rate has exceeded 50%, with international cloud service providers (CSPs) and fintech companies making up most of the customers.

TASA satellites reach orbit to test coordinated LEO broadband links

DIGITIMES — Wed, 21 Oct 2026 23:53:18 GMT

The Taiwan Space Agency (TASA) said two 8U CubeSats developed by Tron Future Tech successfully reached orbit on October 20 aboard SpaceX's Bandwagon-5 rideshare mission, advancing Taiwan's low Earth orbit (LEO) communications technology program. T.MicroSat-3 and T.MicroSat-4 launched at 7:04 p.m. Taiwan time to a mid-inclination orbit and established initial contact with ground stations in Chile and Azerbaijan before 3 a.m. Taiwan time on October 21, with their systems operating normally and sufficient power available.

Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration

Yunnie Cheng — Wed, 21 Oct 2026 23:52:37 GMT

The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron, STATS ChipPAC, Wistron, and market research firm TechSearch. Covering crucial supply chain segments—including PCBs, IC substrates, OSATs, and EMS providers—the forum addressed pressing technical bottlenecks in AI-driven high-performance computing (HPC).

Taiwan tech supply chain eyes Texas for first US industrial cluster

Yunnie Cheng — Wed, 21 Oct 2026 23:52:03 GMT

As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking shape. Minister of Economic Affairs Ming-Hsin Kung recently revealed in an interview with foreign media that Taiwan plans to collaborate with the Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) to construct multiple US industrial parks. Texas has been selected as the inaugural location to help Taiwanese AI and semiconductor suppliers build a local manufacturing footprint.

Samsung's Nvidia HBM bid raises four strategic concerns

Lily Hess — Wed, 21 Oct 2026 23:51:37 GMT

Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration model to win a place in Nvidia's supply chain. The move could meet customer requirements, but it is raising concerns in South Korea over Samsung Foundry's competitiveness, HBM design control, and the long-term benefits of internal collaboration.

ESMT sees memory price momentum extending through 4Q26, 2027

Charlene Chen — Wed, 21 Oct 2026 23:51:08 GMT

Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%. The company expects tight supply and demand to continue through 2028 or longer, while price increases are set to continue in the fourth quarter of 2026 and support stronger operating performance than in the third quarter.

Syscom, Japan's CIJ sign AI partnership for overseas expansion

Kevin Wang — Wed, 21 Oct 2026 23:50:21 GMT

Syscom Computer Engineering is expanding its portfolio in edge AI and its broader enablement ecosystem, with the company showcasing its latest products at the 2026 AIoT Taiwan exhibition, under the theme "Edge Intelligence Now."

Khgears targets humanoid robot joints, eyes 2027 mass production

DIGITIMES — Wed, 21 Oct 2026 23:49:58 GMT

Precision gearmaker Khgears International is expanding into humanoid robot joint components and expects its newly developed differential reducer to enter mass production in 2027. The company said shipments for new projects should remain strong through the fourth quarter of 2026, after reporting September revenue of NT$336 million (US$10.3 million), up 27.61% year on year.

Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages

Scarlett Yu — Wed, 21 Oct 2026 23:49:14 GMT

Russia is reportedly considering reinstating parallel imports of products from Samsung Electronics and SK Hynix to ease shortages of memory and storage devices used in data centers. However, US export controls on Russia and tight global memory supplies are expected to make it difficult for either company to resume direct shipments to the Russian market or significantly expand local sales.

3M calls Largan partnership key step for US$2 billion EBO market

Charlene Chen — Wed, 21 Oct 2026 23:48:43 GMT

3M Chairman and CEO Bill Brown outlined the latest progress in the company's expanded beam optics (EBO) technology during its third-quarter earnings call, highlighting a contract manufacturing agreement with Taiwan's Largan Precision and the technology's potential US$2 billion market opportunity.

2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B

Charlene Chen — Wed, 21 Oct 2026 23:48:10 GMT

The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in orders as it joins the supply chains supporting leading foundry construction projects in Taiwan and the US. Founded in 2014, the facility engineering integrator is preparing to list on the Taipei Exchange to accelerate its entry into the capital markets.

High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion

Yunnie Cheng — Wed, 21 Oct 2026 23:47:40 GMT

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via (TGV) technology has emerged as a major focal point for the semiconductor industry due to its ability to enable high-density vertical interconnects and mitigate large-area warpage. TPK Holding is collaborating with a Taiwanese semiconductor packaging giant to co-develop TGV solutions; its pilot line has already begun process of record (POR) adjustments for specific customer specifications, with plans to consider expanding factory investments in Taiwan by 2027.

Analysis: Tesla's flying Roadster promises thrills, but can technology outrun the law?

Scarlett Yu — Wed, 21 Oct 2026 23:46:50 GMT

Technology appears capable of almost anything. Tesla's next-generation Roadster electric sports car has brought capabilities once confined to science fiction films into the realm of real-world electric vehicles.

Holy Stone targets 50% South Korea revenue growth by 2027

Lily Hess — Wed, 21 Oct 2026 23:45:44 GMT

Taiwanese passive-component maker Holy Stone has entered the supply chain of a major South Korean automaker after about two years of market expansion, prompting the company to raise its 2027 South Korea revenue-growth target to more than 50%. The company is targeting automotive, safety-certified, and high-end multilayer ceramic capacitors (MLCCs) while expanding Taiwan production to meet AI-driven demand and pursuing semiconductor and timing-component opportunities.

Analysis: Musk combines rocket technology with Roadster 2, leveraging synergies across his business empire

Scarlett Yu — Wed, 21 Oct 2026 23:45:19 GMT

Tesla has unveiled its Roadster 2 rocket-powered sports car, but the significance extends beyond the performance specifications of a single vehicle. The unveiling highlights how CEO Elon Musk is building an interconnected ecosystem across his businesses, enabling technologies to be combined, shared, and reinforced across different industries.

Hyundai revamps lineup as Taiwan's hybrid car market enters two-year battle over powertrain systems

Scarlett Yu — Wed, 21 Oct 2026 23:44:22 GMT

Hybrid vehicles now account for more than 60% of Taiwan's auto market, shifting the focus of competition from whether a vehicle offers hybrid technology to which hybrid system it uses.

TECO targets AI data center cooling as commercial aircon share nears 60%

Lily Hess — Wed, 21 Oct 2026 23:43:43 GMT

TECO Electric and Machinery showcased its transformation from an air-conditioning equipment maker to a systems integrator at the 2026 RHVAC Taiwan on October 20, focusing on AI data center thermal management and refrigerants with low global warming potential (GWP). The company expects commercial air conditioning and AI data center cooling solutions to account for more than 60% of its air conditioning technology business group's revenue in 2027.

Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27

Eifeh Strom — Wed, 21 Oct 2026 11:24:45 GMT

Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation session scheduled for October 22. According to an internal email circulated by employees, Micron will introduce quarterly profit-sharing bonuses based on employee level in fiscal year 2027. The plan will cover employees at the director level and below.

Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers

DIGITIMES — Wed, 21 Oct 2026 09:19:53 GMT

Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The fundraising follows the automaker's recent opening of its in-house technologies to external customers, mirroring similar moves by other Chinese EV companies.

Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI

Scarlett Yu — Wed, 21 Oct 2026 08:56:07 GMT

Market expectations for cloud AI demand have generally remained bullish through 2028-2029, with order visibility extending clearly over the next two to three years. The outlook for 2027 is therefore similarly positive.

Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand

Yunnie Cheng — Wed, 21 Oct 2026 08:18:06 GMT

Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their existing supply partnership from 6-inch to 8-inch substrate technology, positioning both companies to meet future demand across electric vehicles (EVs), renewable energy systems, and AI data center power infrastructure.

Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy

DIGITIMES — Wed, 21 Oct 2026 08:05:02 GMT

Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its imaging-sensor expertise creates synergies between components and creative production, while a partnership with Taiwan Semiconductor Manufacturing Co. (TSMC) will support future manufacturing investment.

Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies

DIGITIMES — Wed, 21 Oct 2026 08:04:56 GMT

Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will primarily support production of HBM base dies, which handle control functions at the bottom of HBM stacks.

Samsung Display accelerates MPO and inkjet OLED development for laptops and monitors

Yunnie Cheng — Wed, 21 Oct 2026 08:03:37 GMT

Samsung Display (SDC) is reportedly advancing both micro-patterned OLED (MPO) and inkjet-printed OLED technologies in parallel, expanding its non-fine metal mask (non-FMM) RGB OLED lineup. SDC is currently validating high-resolution fabrication processes using a 7-inch engineering sample for MPO, while evaluating a pilot line for inkjet printing, with initial commercial targets focused on IT panels such as notebooks and desktop monitors.

HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens

DIGITIMES — Wed, 21 Oct 2026 07:58:30 GMT

HD Hyundai Robotics unveiled a dual-arm robot under development at FIX 2026 in Daegu, South Korea, on October 21, marking its first public showing as the company seeks to expand beyond conventional industrial automation into humanoid systems designed for factory work.

Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance

DIGITIMES — Wed, 21 Oct 2026 07:57:45 GMT

Samsung Electronics and SK Hynix are upgrading their NAND flash factories in China to make chips with more than 200 layers, Reuters reported on October 21, citing four people familiar with the plans. The move would let the South Korean memory makers win back ground lost to Yangtze Memory Technologies Co (YMTC), even though US curbs on upgrading their China operations remain formally in place.

AMD and Intel align PyTorch CPU optimizations around oneDNN

DIGITIMES — Wed, 21 Oct 2026 07:56:00 GMT

AMD and Intel plan to consolidate their PyTorch optimizations for x86 processors in oneDNN, aiming to give AI developers a common path to performance improvements across both companies' CPUs and reduce the work of maintaining separate software paths.

Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved

Levi Li — Wed, 21 Oct 2026 07:53:19 GMT

With a strike by Micron Taiwan employees looming, Micron Technology said Micron Memory Taiwan and the Taichung chapter of the Taiwan Micron Memory Union had reached agreement on several issues after multiple rounds of constructive discussions. The two sides signed a labour-management agreement and agreed to withdraw the mediation scheduled for October 22. Micron will continue talks with its Taoyuan union, which has planned a one-day strike for that date.

Qisda integrates four companies to build scalable rack-scale AI solutions

DIGITIMES — Wed, 21 Oct 2026 07:25:00 GMT

Qisda Group is targeting rack-scale AI opportunities in data centers by accelerating development of its rack-scale AI solutions. Through in-house design, manufacturing, and cross-domain integration, Qisda is bringing together Alpha Networks, Aewin Technologies, Arivor Technologies, and GrAndvance Technology to combine high-speed connectivity, modular computing, and advanced liquid cooling. Together, they are building flexible, scalable AI infrastructure, from individual equipment to complete rack-level systems.