<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
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<lastBuildDate>Tue, 25 Aug 2026 01:12:21 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Nvidia Groq 3 LPX enters full production for faster agentic AI inference</title>
<pubDate>Tue, 25 Aug 2026 01:04:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PR202/nvidia-groq-production-rubin-demand.html</link>
<description>&lt;p class="P1" data-start="718" data-end="1036"&gt;Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide for coding, reasoning, and other tasks. The company said the platform is designed to improve responsiveness, lower latency, and support growing demand for real-time AI applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825PR202/nvidia-groq-production-rubin-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825pr202_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale</title>
<pubDate>Tue, 25 Aug 2026 01:02:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PR201/nvidia-data-rubin-infrastructure-cpu.html</link>
<description>&lt;p class="P1" data-start="624" data-end="917"&gt;SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems are built and run worldwide. The partnership also extends toward orbital computing, signaling a broader shift in where future AI infrastructure may be located.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825PR201/nvidia-data-rubin-infrastructure-cpu.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825pr201_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
</media:content></item>
<item>
<title>IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads</title>
<pubDate>Tue, 25 Aug 2026 00:49:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260825PR200/ibm-arm-linux-processor-software.html</link>
<description>&lt;p class="P1" data-start="1031" data-end="1416"&gt;In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could let global enterprises run Arm-native and IBM workloads on the same future systems. The milestone may broaden software choices, accelerate AI adoption, and reshape mission-critical computing for banks, governments, and large cloud operators worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260825PR200/ibm-arm-linux-processor-software.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260825pr200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Broadcom's debt push signals AI compute is becoming Wall Street asset class</title>
<pubDate>Tue, 25 Aug 2026 00:06:48 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL215/broadcom-infrastructure-silicon-financing-demand.html</link>
<description>The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL215/broadcom-infrastructure-silicon-financing-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl215_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
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<title>AIDC eyes 2H26 lift from drones, jets</title>
<pubDate>Tue, 25 Aug 2026 00:06:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD233/aidc-drone-satellite-business-2026-taiwan.html</link>
<description>Aerospace Industrial Development (AIDC) is cautiously optimistic about business momentum in the second half of 2026 as Taiwan's drone policy becomes clearer and defense work stays solid. Senior Vice President Hwai-Sheng King said the company has more than NT$100 billion (approx. US$3.1 billion) in orders on hand across defense, civil aviation, and technology services over the next five years, while it also pushes into the space satellite field, advanced composites, and structural parts.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD233/aidc-drone-satellite-business-2026-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd233_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Zhongji Innolight's 1.6T surge shows AI networking is becoming next hyperscaler bottleneck</title>
<pubDate>Tue, 25 Aug 2026 00:06:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL217/infrastructure-revenue-growth-profit.html</link>
<description>The AI infrastructure boom has long been defined by a race to secure GPUs, memory and power. Yet as cluster sizes continue expanding, another layer of the system is beginning to emerge as an equally decisive constraint: the optical links responsible for moving data fast enough between increasingly dense pools of accelerators.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL217/infrastructure-revenue-growth-profit.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip</title>
<pubDate>Tue, 25 Aug 2026 00:05:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL211/infrastructure-alibaba-hardware-silicon-demand.html</link>
<description>The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL211/infrastructure-alibaba-hardware-silicon-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl211_files/1_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>Samsung Display resumes A7 construction as foldable demand rebounds</title>
<pubDate>Tue, 25 Aug 2026 00:04:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL213/sdc-foldable-demand-2026-market.html</link>
<description>&lt;p class="P1" data-start="1229" data-end="1482"&gt;Samsung Display has resumed construction at its second campus in Asan, South Chungcheong Province, reviving a long-dormant OLED project just as the foldable smartphone market is expected to swing from a weak first half of 2026 to a stronger second half.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL213/sdc-foldable-demand-2026-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl213_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung Display]]></media:description>
</media:content></item>
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<title>Inergy server share hits 47% on cooling, BBU demand</title>
<pubDate>Tue, 25 Aug 2026 00:03:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD232/demand-cooling-inergy-technology-2026-management.html</link>
<description>&lt;p class="P1" data-start="3696" data-end="4105"&gt;Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47% of revenue in the second quarter of 2026, with shipments of system-on-chip (SoC) cooling fan driver ICs set to ramp up in the second half of 2026 and battery backup unit (BBU) demand expected to keep rising as AI moves toward high-voltage direct current power architectures.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD232/demand-cooling-inergy-technology-2026-management.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd232_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>CNFI White Paper outlines solutions as labor, transformation, and energy headline Taiwan's industry hurdles</title>
<pubDate>Tue, 25 Aug 2026 00:03:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD231/taiwan-labor-industrial-policy-government.html</link>
<description>Navigating volatile US tariff policies, escalating geopolitical tensions, and a productivity revolution driven by agentic AI, Taiwan's industrial sector has reached a decisive crossroads.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD231/taiwan-labor-industrial-policy-government.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd231_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Applied Materials executive says data centers set new AI competition standard</title>
<pubDate>Tue, 25 Aug 2026 00:03:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD228/applied-materials-data-competition-packaging-demand.html</link>
<description>&lt;p class="P1" data-start="3645" data-end="3887"&gt;Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of Applied Materials Taiwan, recently shared his perspective by tracing the evolution of industrial revolutions.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD228/applied-materials-data-competition-packaging-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd228_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nvidia memory demand widens the gap between SK Hynix and Samsung</title>
<pubDate>Tue, 25 Aug 2026 00:02:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD227/nvidia-samsung-sk-hynix-revenue-2026.html</link>
<description>&lt;p class="P1" data-start="1567" data-end="1847"&gt;Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to &lt;em data-start="1701" data-end="1713"&gt;Chosun Biz&lt;/em&gt;, Nvidia became SK Hynix's biggest customer in the first half of 2026, while it did not rank among Samsung's top five revenue sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD227/nvidia-samsung-sk-hynix-revenue-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd227_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Hotai and Nan Yang cut Taiwan auto market outlook as risks linger</title>
<pubDate>Mon, 24 Aug 2026 10:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD234/taiwan-market-outlook-2026-cooling.html</link>
<description>Taiwan's new-car market is cooling, with Hotai Motor and Nan Yang Industrial both taking a cautious view of the second half of 2026. The companies cited geopolitical uncertainty, volatile international oil prices, tariff concerns and softer consumer sentiment in revising their outlook for the market.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD234/taiwan-market-outlook-2026-cooling.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd234_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>YouTube offers funding to keep creators from streaming with Netflix</title>
<pubDate>Mon, 24 Aug 2026 10:46:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD235/youtube-netflix-funding-brand-revenue.html</link>
<description>YouTube is preparing offers of millions of dollars in funding and brand revenue sharing to keep major creators from taking simultaneous streaming deals with Netflix, according to &lt;em&gt;Bloomberg&lt;/em&gt;. The move comes as the two platforms compete more directly for top talent and audience attention in the US and beyond.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD235/youtube-netflix-funding-brand-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd235_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving</title>
<pubDate>Mon, 24 Aug 2026 10:08:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL216/xiaomi-autonomous-driving-tsmc-chips-smartphone.html</link>
<description>Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC manufacturing while reducing dependence on external chip suppliers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL216/xiaomi-autonomous-driving-tsmc-chips-smartphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl216_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Xiaomi]]></media:description>
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<title>How Nvidia's whitelist was beaten: 74 B300 servers, Taiwan to China</title>
<pubDate>Mon, 24 Aug 2026 09:07:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL212/taiwan-nvidia-supermicro-sales-high-end.html</link>
<description>Taiwan's Keelung District Prosecutors Office has indicted nine people over the illegal export of high-end AI servers built on Nvidia's B300 GPUs. The indictment lays out, step by step, how a compliance regime designed to track every unit was defeated from the inside.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL212/taiwan-nvidia-supermicro-sales-high-end.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl212_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<title>Etron chair sees memory boom extending to 2028-2030</title>
<pubDate>Mon, 24 Aug 2026 08:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD230/etron-chairman-2027-demand-growth.html</link>
<description>The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD230/etron-chairman-2027-demand-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd230_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp</title>
<pubDate>Mon, 24 Aug 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD229/tpk-holding-plant-2027-semiconductors-production.html</link>
<description>TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August or September. The company is also working with leading outsourced semiconductor assembly and test (OSAT) providers on the project, while its new Thailand production base aims to complete trial runs by year-end and begin volume production in early 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD229/tpk-holding-plant-2027-semiconductors-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials</title>
<pubDate>Mon, 24 Aug 2026 07:56:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD200/materials-applied-materials-demand-equipment-taiwan.html</link>
<description>Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck for the AI sector. Applied Materials group vice president and Taiwan president Eric Yu pointed out that semiconductor technology competition in the AI era can no longer focus solely on performance and transistor counts. How to support more computing with less energy will become the core of the next stage of semiconductor innovation.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD200/materials-applied-materials-demand-equipment-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd200_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials</title>
<pubDate>Mon, 24 Aug 2026 07:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD221/ceramic-substrate-glass-substrate-packaging-materials-hardware-manufacturing.html</link>
<description>As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD221/ceramic-substrate-glass-substrate-packaging-materials-hardware-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd221_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models</title>
<pubDate>Mon, 24 Aug 2026 06:57:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL209/nvidia-licensing-startup-open-source-technology.html</link>
<description>Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's Nemotron models in a bid to compete with China's strength in open-source models, but the deal also puts Nvidia in competition with some of its biggest customers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL209/nvidia-licensing-startup-open-source-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl209_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung's DRAM capacity lead shrinks as SK Hynix expands faster</title>
<pubDate>Mon, 24 Aug 2026 06:56:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL210/samsung-capacity-dram-wafer-2027.html</link>
<description>&lt;p class="P1" data-start="1009" data-end="1252"&gt;Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line conversions rather than aggressive wafer-capacity expansion, according to Omdia data obtained by Chosun Biz.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824VL210/samsung-capacity-dram-wafer-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824vl210_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Taiwan's Iron Force shifts airbag output to Poland, targets AI server component ramp in 2027</title>
<pubDate>Mon, 24 Aug 2026 06:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD218/iron-force-manufacturing-poland-ai-server-taiwan.html</link>
<description>Taiwan-based Iron Force Industrial is reshaping its manufacturing footprint as pressure on its traditional auto-parts business weighs on earnings. The company plans to expand its Poland plant and shift some airbag production from Taiwan, while AI server-related components, now contributing only marginal revenue, are expected to enter mass production in 2027.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD218/iron-force-manufacturing-poland-ai-server-taiwan.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd218_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>UAE weighs investment in 500 MW AI data center plan in Japan</title>
<pubDate>Mon, 24 Aug 2026 06:35:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD225/data-center-uae-investment-offshore-wind.html</link>
<description>The United Arab Emirates is considering backing a proposed 500 MW AI data center in Akita prefecture, Japan, after local officials met with the UAE ambassador on Aug. 19. The project, which could begin operations as early as 2030, is being positioned as one of Japan's largest data center developments if it moves ahead.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260824PD225/data-center-uae-investment-offshore-wind.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260824pd225_files/1_2b.jpg" type="image/jpeg" expression="full">
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<title>Pixel 11 preorder surge lifts Google's Taiwan smartphone share</title>
<pubDate>Mon, 24 Aug 2026 06:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD226/google-smartphone-taiwan-sales-telecom.html</link>
<description>Google's newly launched Pixel 11 series drew a strong preorder response in Taiwan after telecom carriers rolled out expanded promotions and sales plans. The early momentum has renewed attention on whether Google can lift its local smartphone share above 5%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia reportedly weighs Perplexity investment as AI strategy expands beyond chips</title>
<pubDate>Mon, 24 Aug 2026 05:59:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL208/nvidia-investment-chips-software-startup.html</link>
<description>Nvidia is reportedly in discussions to invest in artificial intelligence startup Perplexity as part of a funding round that would value the company at more than US$30 billion, underscoring the chipmaker's increasingly aggressive effort to deepen its influence across the AI software ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>German auto industry hardens stance against Chinese competition</title>
<pubDate>Mon, 24 Aug 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD213/auto-industry-germany-competition-europe-market.html</link>
<description>Germany's top auto industry lobby, the German Association of the Automotive Industry (VDA), is overhauling its strategy as it hardens its stance on China. The group has said China must put forward constructive proposals, quickly stop distorting competition, and avoid using export restrictions on technologies and materials to hinder free-world trade.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Electric Vehicles</category>
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<title>Taiwan semiconductor materials hit golden opportunity</title>
<pubDate>Mon, 24 Aug 2026 05:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD219/taiwan-supply-chain-materials-semi-taiwan-demand.html</link>
<description>Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of Everlight Chemical and Chairman of the Taiwan Chemical Industry Association (TCIA), noted that Taiwan boasts the world's largest tier-one customer demand alongside the most stringent process specifications. This unique position, he stated, presents a "once-in-a-century golden opportunity" for local semiconductor material development.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration</title>
<pubDate>Mon, 24 Aug 2026 04:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD224/hbm-packaging-sk-hynix-bandwidth-intel.html</link>
<description>Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management, power consumption and packaging have emerged as the new bottlenecks. At Hot Chips 2026, SK Hynix laid out its advanced packaging roadmap in detail, moving from hybrid bonding to Intel's EMIB and ultimately toward 3D integration.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Semiconductors</category>
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<title>Europe's struggling auto industry turns to China, drawing US scrutiny</title>
<pubDate>Mon, 24 Aug 2026 04:17:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD223/europe-auto-industry-automakers-capacity-production.html</link>
<description>&lt;p class="P1" data-start="3096" data-end="3714"&gt;European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through the vicious cycle of weak demand, rising costs, and low capacity utilization, as well as difficulties in their transition to electric vehicles (EVs). However, the fact that Europe is utilizing subsidies and collaborative efforts to expand production with Chinese carmakers while confronting overcapacity issues on its home turf is, in the eyes of the US, an absurd situation, and Washington has not ruled out the possibility of further tariffs or import restrictions on European cars.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>Analysis: SK Hynix pushes beyond HBM with HBF and CPO</title>
<pubDate>Mon, 24 Aug 2026 04:08:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD216/sk-hynix-hbm-cpo-capacity-competition.html</link>
<description>SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<title>Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment</title>
<pubDate>Mon, 24 Aug 2026 03:57:05 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL207/rapidus-2nm-investment-production-chips.html</link>
<description>&lt;p class="P1" data-start="1102" data-end="1334"&gt;Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips and data centers providing a stronger-than-expected tailwind, CEO Atsuyoshi Koike told Reuters.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Rapidus' IIM-1 semiconductor plant in Chitose, Hokkaido, Japan. Credit: AFP]]></media:description>
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<title>Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand</title>
<pubDate>Mon, 24 Aug 2026 03:33:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD222/fujifilm-materials-capacity-demand-semiconductors.html</link>
<description>Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising global demand for AI chips. For readers worldwide, the move underscores how chip supply chains are adapting to support data centers, connected devices, and next-generation computing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>India weighs new capital subsidies to build domestic polysilicon capacity</title>
<pubDate>Mon, 24 Aug 2026 03:22:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824VL202/polysilicon-solar-capacity-manufacturing-government.html</link>
<description>India is preparing a new capex-based subsidy scheme to support domestic polysilicon manufacturing, as the government seeks to reduce import dependence and build a more integrated solar supply chain.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Notebook brands shift production back to China as Southeast Asia costs rise</title>
<pubDate>Mon, 24 Aug 2026 03:09:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260824PD217/notebooks-supply-chain-manufacturing-cost-southeast-asia.html</link>
<description>Notebook brands that rushed into Southeast Asia for manufacturing are moving production back to China, as the cost gap remains too wide and the impact of substitute tariffs has proved limited, according to supply chain sources. The shift is expected to affect Taiwan original device manufacturers (ODMs) serving new customer lines in Vietnam and Thailand.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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</channel>
</rss>

