DIGITIMES: News and Insight of the Global Supply Chain

AWS, Google challenge CUDA as AMD, Intel cut AI switch costs

DIGITIMES — Tue, 27 Oct 2026 02:53:47 GMT

AWS has launched the open-source TorchNeuron tool, allowing developers to port PyTorch artificial intelligence (AI) applications to its custom Trainium chips without rewriting code. Google has followed with TorchTPU, while AMD and Intel are integrating AI software optimizations as chipmakers challenge Nvidia's market advantage built on the CUDA ecosystem.

Inside SKT’s push to turn SK Hynix’s fabs into an AI business

DIGITIMES — Tue, 27 Oct 2026 02:51:28 GMT

South Korean telecommunications provider SK Telecom (SKT) has reportedly established Hy-TF, a task force dedicated to AI collaboration with SK Hynix, to upgrade its digital-twin and data-platform businesses and develop new B2B services.

China supply-chain price hikes strain domestic demand

DIGITIMES — Tue, 27 Oct 2026 02:42:01 GMT

China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to Hygon considering higher CPU and deep computing unit (DCU) prices. The moves reflect rising costs for raw materials, components, and upstream supplies, but whether they can help China escape deflationary pressure remains uncertain.

Vietnam's first fab reportedly faces doubts over 2027 target

DIGITIMES — Tue, 27 Oct 2026 02:40:56 GMT

Vietnam's first wafer fab may miss its 2027 trial-production target, Reuters reported on October 26, citing concerns about project execution and equipment procurement. Developer Viettel, however, says the project remains on schedule.

Fine M-Tec rejects component blame as foldable market outlook remains positive

Jingyue Hsiao — Tue, 27 Oct 2026 02:31:24 GMT

Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and precision mechanisms. The dispute could affect perceptions of the South Korean supplier even as analysts forecast growth from expanding foldable device demand ahead.

DRAM price gains fall short as supply shrinks up to 50%

Lily Hess — Tue, 27 Oct 2026 02:30:03 GMT

DRAM price growth has slowed sharply in the fourth quarter of 2026, but severe supply shortages are intensifying as manufacturers continue to restrict shipments. Industry sources expect DRAM supply from leading manufacturers to shrink by 30% to 50% for the next two to three quarters, widening the supply gap in 2027.

AI data center boom risks squeezing power chip supplies for auto, electronics

Sherri Wang — Tue, 27 Oct 2026 02:29:51 GMT

The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more chips but also more efficient power delivery systems. Power plants and electrical grids outside data centers are also under pressure to close supply gaps, potentially tightening power semiconductor supplies and spreading shortages to other applications.

Weekly news roundup: iPhone Duo shipment target revised upward amid display issues

DIGITIMES — Tue, 27 Oct 2026 02:20:13 GMT

This week's coverage highlights shifting technology supply chains and rising demand across foldable smartphones, memory, energy storage, robotics, and AI infrastructure. Apple lifted its iPhone Duo shipment target after strong preorders, while memory makers faced conflicting forecasts over Chinese capacity and sustained AI demand. Taiwan advanced industrial microgrids and saw its first semiconductor strike, as Texas Instruments reported tightening analog supply. Chinese energy storage suppliers reportedly retreated from the US amid reciprocal technology and ownership restrictions.

Japan sets JPY100 billion push to commercialize perovskite solar cells

DIGITIMES — Tue, 27 Oct 2026 02:19:55 GMT

Japan plans to provide about JPY100 billion (US$634.1 million) over four years to support mass production of next-generation perovskite solar cells, seeking to establish a domestic manufacturing base before China further widens its lead in the emerging technology, according to Nikkei Asia.

HCLTech and Rapidus open India centers to support semiconductor engineering

DIGITIMES — Tue, 27 Oct 2026 02:18:17 GMT

HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities will support advanced chip work, while a planned talent pipeline could connect Indian engineers with Rapidus' manufacturing ambitions in Japan, highlighting the cross-border partnerships shaping semiconductor supply chains.

India's smartphone shipments hit a decade low in 3Q26 amid rising prices

DIGITIMES — Tue, 27 Oct 2026 02:18:10 GMT

India's smartphone shipments fell 20% year over year in the third quarter of 2026, reaching a decade low as higher memory costs pushed device prices up. The downturn highlights affordability pressures for consumers and could prompt manufacturers to raise prices, reshape portfolios, and rely on premium segments globally.

As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge

DIGITIMES — Tue, 27 Oct 2026 02:14:43 GMT

Days after the launch of Apple's US$2,000 iPhone Duo, a wave of reports regarding broken inner screens has surfaced across Reddit, TechCrunch, and Forbes. Early buyers reported hearing a loud crunching noise before severe cracking appeared along the hinge. Others experienced complete display malfunctions or "big fat creases down the middle" after just hours or days of use.

Intel to acquire quantum computing software firm Classiq

DIGITIMES — Tue, 27 Oct 2026 02:09:37 GMT

Intel has entered into a definitive agreement to acquire Classiq, a quantum computing software company, in a move aimed at combining Classiq's quantum algorithm synthesis platform with Intel's silicon-based quantum hardware and semiconductor manufacturing capabilities.

Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk

DIGITIMES — Tue, 27 Oct 2026 02:03:36 GMT

In its preliminary IPO registration statement filed with the US Securities and Exchange Commission, Anthropic describes how much of its capacity depends on a small group of chip and memory suppliers, most of them in East Asia.

Tamil Nadu adds independent chip subsidy route as Indian states vie for investment

DIGITIMES — Tue, 27 Oct 2026 01:55:21 GMT

India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure and financial support. Tamil Nadu is now giving semiconductor investors another route.

OPTOELEC seeks AI data center orders as Himax advances CPO optics

DIGITIMES — Tue, 27 Oct 2026 01:52:39 GMT

South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications, a market where Taiwanese suppliers are already moving toward commercial production.

NT1 plans to assemble Chinese delivery vans in Korea in 2027

DIGITIMES — Tue, 27 Oct 2026 01:46:21 GMT

South Korean autonomous delivery company NT1 plans to begin assembling Chinese-designed delivery vans locally in 2027, gradually adding Korean-made components as it seeks approval to operate the vehicles on public roads.

Hyundai supplier SL eyes first overseas robot deployment in US

DIGITIMES — Tue, 27 Oct 2026 01:38:21 GMT

South Korean automotive supplier SL is considering deploying its mobile dual-arm robot at a US factory in 2027 or 2028, potentially marking the system's first overseas deployment, a company representative said in an interview with DIGITIMES at FIX 2026 in Daegu on October 24.

Tata Communications plans up to US$450 million fibre network linking India's AI hubs

DIGITIMES — Tue, 27 Oct 2026 01:33:44 GMT

Tata Communications announced on October 26 that it plans to invest US$400-450 million in approximately 10,000 kilometers of long-haul fiber across India, linking data centers and AI hubs as it expands its connectivity business. The network will connect domestic corridors with its global backbone.

KAR bets on fleet monitoring as South Korea expands robotaxi trials

DIGITIMES — Tue, 27 Oct 2026 01:32:41 GMT

South Korean vehicle engineering company KAR plans to develop a monitoring system for the electronic controls it installs in autonomous vehicles, seeking recurring maintenance revenue as the country expands robotaxi trials.

ByteDance denies AI micro-dramas consume over half of China's AI computing power

Eifeh Strom — Tue, 27 Oct 2026 01:23:58 GMT

The claim that more than half of China's artificial intelligence (AI) computing power is being used to produce micro-dramas has reignited debate in China's technology sector over whether the country is directing too much of its AI computing resources to entertainment content while neglecting productivity applications.

Amkor turns to customer prepayments as global packaging investment accelerates

DIGITIMES — Tue, 27 Oct 2026 01:20:32 GMT

Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced packaging outpaces the consumer electronics recovery. Management said those arrangements provide greater visibility for investments that will keep capital spending elevated for several years.

Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI

DIGITIMES — Tue, 27 Oct 2026 01:12:20 GMT

Cadence Design Systems is betting that chipmakers will want AI models trained on its own design tools and run wherever customers choose. That puts it on a different route from rival Synopsys, which is building its specialized model with OpenAI on OpenAI-hosted infrastructure. On October 26, alongside its third-quarter results, Cadence introduced Maestro, a portfolio of domain-specialized AI models that power its AI super agents for chip and system design.

Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets

DIGITIMES — Tue, 27 Oct 2026 01:07:13 GMT

Cadence Design Systems used its third-quarter earnings call to argue that demand for chip design tools is no longer tied only to the AI hardware buildout. It pointed to analog and memory chipmakers, system companies, and new entrants such as space and finance firms designing their own silicon. Analysts on the October 26 call pressed two questions that will shape the coming year: how much growth comes from agentic AI rather than hardware, and whether Cadence can match the long-term targets rival Synopsys set a month earlier.

India sets October 2028 target for homegrown smartphone brand

DIGITIMES — Tue, 27 Oct 2026 00:46:13 GMT

India's electronics and IT minister, Ashwini Vaishnaw, has set October 23, 2028, as the date by which the country will have mobile phones that are designed, manufactured, and branded domestically, as New Delhi seeks to move beyond assembling devices for foreign brands.

Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion

DIGITIMES — Tue, 27 Oct 2026 00:44:23 GMT

Celestica's latest results suggest that its next challenge will be expanding production fast enough to serve AI infrastructure customers while keeping cash requirements under control. The company forecast US$40 billion in revenue for 2027, putting manufacturing capacity and growth financing at the center of its outlook.

Cadence raises 2026 outlook as AI design demand drives record backlog

DIGITIMES — Tue, 27 Oct 2026 00:42:07 GMT

Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying growth is hurting profitability. Revenue for the three months ended September 30, 2026, rose 22% from a year earlier, the company said on October 26, but operating income barely moved.

Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness

DIGITIMES — Tue, 27 Oct 2026 00:41:58 GMT

Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted the value of the company's production mix, while smartphone and consumer electronics headwinds kept the revenue recovery uneven.

Samsung Executive Chairman reportedly eyes RX unit visit for humanoid robot push

Charlene Chen — Mon, 26 Oct 2026 23:51:05 GMT

Samsung Electronics Executive Chairman Lee Jae-Yong is reportedly set to visit the company's Robotics eXperience (RX) business unit in Seoul's Umyeon-dong by the end of October to review humanoid robot development and preparations for CES 2027. If the visit takes place, it will be Lee's first visit since the organization was established, highlighting Samsung's strategy of commercializing robots through manufacturing applications.

DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses

Scarlett Yu — Mon, 26 Oct 2026 23:50:48 GMT

AI server power architectures are evolving toward high-voltage distribution and point-of-load voltage conversion, according to DIGITIMES Intelligence.

Cheng Mei develops materials for advanced packaging glass substrates

Lily Hess — Mon, 26 Oct 2026 23:50:23 GMT

As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film and heat-resistant tape remain in development.

Sunic System wins overseas OLEDoS equipment order

DIGITIMES — Mon, 26 Oct 2026 23:50:01 GMT

As AI expands into wearable devices, South Korean OLED deposition equipment maker Sunic System has secured another overseas order for OLEDoS (OLED on Silicon) deposition equipment, targeting growth in extended reality (XR) and smart glasses.

Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware

Yunnie Cheng — Mon, 26 Oct 2026 02:59:13 GMT

In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association, AI server motherboards have become the largest, thickest, and most structurally complex PCBs ever manufactured, drawing substrate and PCB makers, which historically reacted to decisions made by chipmakers and packaging clients, into the heart of AI hardware development.

Meta prioritizes high-margin AI inference as Wiwynn, Quanta eye CPU server demand

Scarlett Yu — Mon, 26 Oct 2026 02:58:50 GMT

Meta has become the first of the four major US hyperscale cloud providers to report its latest earnings, with supply chain players closely monitoring changes in the company's capital expenditure plans and investment priorities.

Taiwan wafer-testing supplier Hermes Testing Solutions commits more than US$215 million to advanced chip testing expansion

Levi Li — Mon, 26 Oct 2026 02:58:19 GMT

Hermes Testing Solutions Inc. (HTSI), a semiconductor wafer-testing solutions provider, is expanding its Taiwan operations. Its board approved budget authorisations on October 22 for a new R&D centre in Hsinchu and a manufacturing centre in south-central Taiwan, with total investment expected to exceed NT$7 billion (approx. US$215 million).