<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 23 Oct 2026 01:00:03 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Why is TSMC suddenly looking at Texas?</title>
<pubDate>Fri, 23 Oct 2026 00:50:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261023PD211/tsmc-texas-expansion-development-supply-chain.html</link>
<description>TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess expansion opportunities. TSMC is also discussing cooperation with Elon Musk's Terafab, on the condition that it keeps operational control. Together, the moves could shift TSMC's US strategy from expanding existing sites to choosing new locations and exploring capacity partnerships.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261023PD211/tsmc-texas-expansion-development-supply-chain.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261023pd211_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Interview: TI sees liquid cooling shift to tray-level control in AI data centers</title>
<pubDate>Fri, 23 Oct 2026 00:45:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD215/data-cooling-liquid-cooling-texas-instruments-market.html</link>
<description>Liquid cooling in AI data centers is moving toward more granular control architectures. Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), told &lt;em&gt;DIGITIMES&lt;/em&gt; that as next-generation GPU computing power and rack power continue to rise, thermal management will shift from centralized control by a CDU to independent control for each server tray, a shift that will increase the use of sensors, drivers, MCUs, and other components within each rack.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD215/data-cooling-liquid-cooling-texas-instruments-market.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd215_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI) Credit: TI]]></media:description>
</media:content></item>
<item>
<title>India's CleanMax partners with Apple, Meta to supply green power for AI data centers</title>
<pubDate>Fri, 23 Oct 2026 00:45:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD221/apple-meta-data-center-demand-technology.html</link>
<description>CleanMax's partnerships with Apple, Meta, and other technology companies highlight how artificial intelligence (AI) data centers are intensifying global demand for renewable power.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD221/apple-meta-data-center-demand-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd221_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Elan targets drone market with solutions contributing revenue in 2026 and 2027</title>
<pubDate>Fri, 23 Oct 2026 00:44:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD227/elan-market-2026-revenue-2027.html</link>
<description>Elan Microelectronics is pursuing drone opportunities across multiple applications, showcasing a broad range of solutions at the 2026 TAITRONICS expo. Solutions developed with Taiwanese drone maker Thunder Tiger stood out at the company's exhibition area, with several offerings expected to begin contributing to revenue in 2026 and 2027.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD227/elan-market-2026-revenue-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd227_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing</title>
<pubDate>Fri, 23 Oct 2026 00:44:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD228/lg-electronics-home-appliance-gpu-chips-startup.html</link>
<description>LG Electronics is expanding its artificial intelligence (AI) footprint on two fronts: in-house appliance chips and GPU compute services. On one hand, the company is scaling up the deployment of custom AI chips in its home appliances to boost product differentiation. On the other hand, PADO, a startup incubated and spun off by LG NOVA (LG's North American Innovation Center), is entering the GPU compute leasing and brokerage market to explore data center opportunities.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD228/lg-electronics-home-appliance-gpu-chips-startup.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd228_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Salesforce Taiwan targets double-digit growth as AI adoption accelerates</title>
<pubDate>Fri, 23 Oct 2026 00:43:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD236/taiwan-growth-revenue-business-data.html</link>
<description>Salesforce has seen sustained growth in both revenue and new customer count, as the company's Taiwan office approaches its first anniversary. According to Salesforce Taiwan general manager Chia-shen Hsu, Agentforce and Data 360 deployments account for roughly 40% of newly signed deals, showing that local companies are moving from evaluating AI technology to applying it in real business scenarios.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD236/taiwan-growth-revenue-business-data.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>CHT launches AI imaging unit, targets IPO</title>
<pubDate>Fri, 23 Oct 2026 00:38:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD237/cht-ipo-security-technology-government.html</link>
<description>Chunghwa Telecom (CHT) has established Chunghwa Yaocih Technology to expand into AI and intelligent imaging, holding its inauguration and unveiling ceremony on October 22. The new company will focus on AI, image recognition, and smart security as CHT deepens its digital transformation services for businesses and government agencies.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD237/cht-ipo-security-technology-government.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd237_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles</title>
<pubDate>Fri, 23 Oct 2026 00:37:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD239/tesla-vehicle-certification-aircraft-rocket.html</link>
<description>Tesla's three new Roadster variants could face different regulatory pathways before they are allowed on public roads&#38;mdash;or take to the skies.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD239/tesla-vehicle-certification-aircraft-rocket.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd239_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung Foundry targets automotive, edge AI chips with 8LPU+</title>
<pubDate>Fri, 23 Oct 2026 00:37:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD240/samsung-automotive-chips-samsung-foundry-business.html</link>
<description>Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform in 2026. The move targets demand for automotive electronics, robots, and edge AI chips while leveraging existing deep ultraviolet (DUV) production lines to control wafer costs.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD240/samsung-automotive-chips-samsung-foundry-business.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd240_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AUO reshapes businesses with 'quasi-holding company' model</title>
<pubDate>Fri, 23 Oct 2026 00:36:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD242/auo-paul-peng-display-capacity.html</link>
<description>AUO is entering the next chapter of its transformation as Chairman and CEO Paul Peng establishes a "quasi-holding company" model, turning its three major operating pillars into separate corporate entities to sharpen performance evaluations and resource allocation while distinguishing core from noncore businesses.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD242/auo-paul-peng-display-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd242_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging</title>
<pubDate>Fri, 23 Oct 2026 00:36:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD244/umc-ap-memory-silicon-packaging-technology.html</link>
<description>UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench capacitor (DTC) technology and wafer manufacturing capabilities with AP Memory's silicon capacitor design and system integration expertise. The collaboration comes as rising power consumption in AI and high-performance computing (HPC) chips accelerates the shift towards near-chip power delivery and advanced packaging integration.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD244/umc-ap-memory-silicon-packaging-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd244_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Courtesy of the company]]></media:description>
</media:content></item>
<item>
<title>Oppo targets premium smartphone growth with global Find X10 launch</title>
<pubDate>Fri, 23 Oct 2026 00:36:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD245/oppo-smartphone-launch-demand-shipments.html</link>
<description>Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move marked the company's latest effort to strengthen premium smartphone shipments as competition intensifies and overall demand remains under pressure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD245/oppo-smartphone-launch-demand-shipments.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd245_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Oppo]]></media:description>
</media:content></item>
<item>
<title>Taiwan, UK expand offshore wind, CCUS energy cooperation</title>
<pubDate>Fri, 23 Oct 2026 00:36:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD246/taiwan-offshore-wind-uk-security-policy.html</link>
<description>Taiwan and the UK deepened cooperation on offshore wind, carbon capture, and energy security at two bilateral meetings held recently in Taipei. The 21st Taiwan-UK Renewable Energy Exchange Conference brought together about 80 government, industry, and research representatives to discuss energy policy, technical practices, and collaboration on low-carbon technologies. The eighth Taiwan-UK Energy Dialogue Conference followed that afternoon.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD246/taiwan-offshore-wind-uk-security-policy.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd246_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: British Office Taipei]]></media:description>
</media:content></item>
<item>
<title>Lam Research sees WFE topping US$200 billion in 2027</title>
<pubDate>Fri, 23 Oct 2026 00:35:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD247/lam-research-revenue-2026-2027-equipment.html</link>
<description>Lam Research reported third-quarter 2026 revenue of US$8.2 billion, up 22% quarter-over-quarter, and forecast fourth-quarter revenue of US$8.6 billion, plus or minus US$400 million. The semiconductor equipment maker expects the wafer fabrication equipment (WFE) market to reach the mid-US$150 billion range in 2026 and initially forecasts more than US$200 billion in 2027, with percentage growth led by DRAM.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD247/lam-research-revenue-2026-2027-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd247_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion</title>
<pubDate>Fri, 23 Oct 2026 00:32:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD249/psmc-3d-taiwan-production-revenue.html</link>
<description>Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business and evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint ventures with customers. Its product portfolio includes integrated passive devices (IPDs), interposers, wafer-on-wafer (WoW) technology, and post-wafer finish (PWF) services, with demand for IPDs expected to remain visible through 2028 as AI server power consumption rises.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD249/psmc-3d-taiwan-production-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd249_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Compal and Verda expand AI cloud infrastructure partnership</title>
<pubDate>Fri, 23 Oct 2026 00:32:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD250/compal-infrastructure-partnership-capacity-manufacturing.html</link>
<description>Verda and Compal Electronics have expanded their partnership to support Verda's rapidly growing AI infrastructure footprint, combining Verda's AI cloud expertise with Compal's expanding global manufacturing network and advanced AI server engineering capabilities. The companies showcased the results of their collaboration at GTC Berlin 2026 as demand for AI computing continues to rise across Europe and global markets.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD250/compal-infrastructure-partnership-capacity-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd250_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Midea's Clivet targets AI cooling market with compressor redesign</title>
<pubDate>Fri, 23 Oct 2026 00:31:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL207/cooling-market-data-center-equipment-manufacturing.html</link>
<description>Clivet, the Italian climate-control company owned by Midea, is applying its refrigeration expertise to the AI data center market, introducing a redesigned compressor as part of a broader cooling portfolio. The push builds on established air-conditioning technologies while addressing demands for efficient operation and uninterrupted cooling in high-density computing facilities.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL207/cooling-market-data-center-equipment-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl207_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Clivet]]></media:description>
</media:content></item>
<item>
<title>SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production</title>
<pubDate>Fri, 23 Oct 2026 00:31:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL218/sk-hynix-cooling-production-materials-equipment.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL218/sk-hynix-cooling-production-materials-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl218_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking</title>
<pubDate>Fri, 23 Oct 2026 00:26:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL221/amec-3d-etching-wafer-manufacturing-equipment.html</link>
<description>China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research and manufacturing customer, marking a step forward in China's efforts to develop indigenous equipment for next-generation 3D chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL221/amec-3d-etching-wafer-manufacturing-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl221_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AMEC]]></media:description>
</media:content></item>
<item>
<title>Micron overhauls pay in Taiwan as unions push for profit sharing</title>
<pubDate>Thu, 22 Oct 2026 12:59:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL223/micron-taiwan-labor-staff-samsung.html</link>
<description>Micron is overhauling how it pays employees, promising quarterly profit-sharing bonuses and better pay and benefits for its Taiwan staff. The changes follow a labor dispute with the company's unions in Taiwan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL223/micron-taiwan-labor-staff-samsung.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl223_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>PSMC raises mature-node prices again, targets 20% increase in 2027</title>
<pubDate>Thu, 22 Oct 2026 10:28:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD248/psmc-2027-capacity-2026-demand.html</link>
<description>Powerchip Semiconductor Manufacturing (PSMC) reported third-quarter 2026 revenue of NT$21.3 billion (US$654.3 million), up 23% quarter-over-quarter, as higher foundry prices, a stronger average selling price (ASP) and improved capacity utilization lifted gross margin from 28% to 48% and drove net profit to NT$6.5 billion. With AI servers fueling demand for memory, power-management ICs and advanced packaging, PSMC expects double-digit revenue growth in the fourth quarter and has indicated that foundry prices will rise another 10% to 20% in 2027.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD248/psmc-2027-capacity-2026-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd248_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Taiwan-France semiconductor alliance strengthens with CPU pact between SiPearl and Egis Group</title>
<pubDate>Thu, 22 Oct 2026 10:26:35 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL222/alliance-industrial-taiwan-europe-cpu.html</link>
<description>Highlighting the deepening industrial synergies between Europe and Asia, the Egis Group TechDay Taiwan-France Strategic CPU Partnership Signing Ceremony hosted the official signing between Egis Group and SiPearl. The landmark ceremony unveiled a joint initiative to build a Mobius 100 CPU and UCIe chiplet-based marketplace, establishing a cooperative framework for sovereign AI and high-performance computing (HPC) data center infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL222/alliance-industrial-taiwan-europe-cpu.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Yunnie Cheng]]></media:description>
</media:content></item>
<item>
<title>ADEPT Taiwan holds inaugural in-person meeting as PLP and substrate standardization efforts gain momentum</title>
<pubDate>Thu, 22 Oct 2026 08:36:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD241/taiwan-substrate-packaging-hpc-development.html</link>
<description>The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD241/taiwan-substrate-packaging-hpc-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd241_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shihmin Fu]]></media:description>
</media:content></item>
<item>
<title>U-Power listing highlights Taiwan's growing need for high-speed EV charging</title>
<pubDate>Thu, 22 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD217/taiwan-vehicle-2026-sales-revenue.html</link>
<description>U-Power, Taiwan's ultra-fast electric vehicle (EV) charging operator, has applied to list on the Taipei Exchange as the country's expanding EV population supports expectations for sustained charging demand. The company, which plans an emerging-stock listing in early November, reported higher first-half revenue but remained unprofitable as it continues investing in infrastructure.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD217/taiwan-vehicle-2026-sales-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd217_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>MIPI expands beyond smartphones into AR glasses and humanoid robots</title>
<pubDate>Thu, 22 Oct 2026 07:39:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD243/ar-glasses-taipei-display-camera-industrial.html</link>
<description>The MIPI Alliance held this year's MIPI Demo Day Taipei at the Grand Hyatt Taipei this week, where 16 member companies demonstrated working products to more than 200 developers and engineers. Founded in 2003 to standardize camera and display interfaces for smartphones, the alliance now serves automotive, IoT, industrial, medical, and PC applications, with AI driving its next expansion into AR glasses and humanoid robots.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD243/ar-glasses-taipei-display-camera-industrial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd243_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: MIPI]]></media:description>
</media:content></item>
<item>
<title>Infineon, Nvidia push gallium nitride power for 800-volt AI data centers</title>
<pubDate>Thu, 22 Oct 2026 07:26:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL220/infineon-data-gallium-gan-2025.html</link>
<description>Infineon Technologies is expanding its work with Nvidia on 800-volt direct current power architectures for AI data centers, with a focus on gallium nitride (GaN) chips in the intermediate bus converter (IBC), the company said on October 21.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL220/infineon-data-gallium-gan-2025.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl220_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit:DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B</title>
<pubDate>Thu, 22 Oct 2026 07:19:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD235/fab-arizona-revenue-materials-equipment.html</link>
<description>As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology is expanding its role in Arizona, from core facility systems and equipment hook-up to materials supply. Chi Yi Hsin Technology said its backlog reached NT$4.476 billion (US$137.5 million) as of the end of September 2026, with projects scheduled for execution through around 2028 and overall order visibility extending to 2030.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD235/fab-arizona-revenue-materials-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd235_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Apex Science &#38;amp; Engineering expands automotive and medical display push</title>
<pubDate>Thu, 22 Oct 2026 07:19:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD223/apex-display-medical-automotive-optoelectronics.html</link>
<description>Apex Science &#38;amp; Engineering is expanding its optoelectronics business in automotive and medical markets, with booked but undelivered orders worth approximately NT$105.7 million (US$3.24 million). Exports have accounted for 73% of the division's sales since the start of 2026, highlighting its exposure to international demand as it develops display modules for industrial, consumer, and public-sector applications worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD223/apex-display-medical-automotive-optoelectronics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Analysis: Musk's thrusting Roadster takes off, but questions remain up in the air</title>
<pubDate>Thu, 22 Oct 2026 07:15:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD238/tesla-production-vehicle-2028-spacex.html</link>
<description>Tesla unveiled its new Roadster, equipped with rocket-style thrusters, on October 15 and announced plans to begin production in 2028, more than a decade after the second-generation prototype was first showcased.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD238/tesla-production-vehicle-2028-spacex.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd238_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Tesla's Megapack boom meets AI power crunch, but margin gains raise questions</title>
<pubDate>Thu, 22 Oct 2026 06:20:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL215/tesla-electricity-infrastructure-transportation-demand-capacity.html</link>
<description>While Tesla is expanding its ambitions in autonomous transportation and embodied AI, developments in its energy-storage business are drawing attention following a mixed set of financial results in the company's third-quarter 2026 earnings report.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL215/tesla-electricity-infrastructure-transportation-demand-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl215_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Tesla]]></media:description>
</media:content></item>
<item>
<title>Texas Instruments posts rising Q3 sales across data centers, cars, industry</title>
<pubDate>Thu, 22 Oct 2026 05:59:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL219/texas-instruments-sales-data-growth-revenue.html</link>
<description>Texas Instruments reported strong revenue growth in its third-quarter earnings call due to strong demand across its industrial, automotive, and data center businesses. The company said it is facing a tight supply environment for its chips, but brought up its ramping of production and testing capacity, including through its new Malaysia back-end facility.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL219/texas-instruments-sales-data-growth-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Samsung reportedly overhauls DRAM, NAND R&#38;amp;D incentives to retain talent and accelerate next-gen memory chips</title>
<pubDate>Thu, 22 Oct 2026 05:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL214/samsung-dram-incentives-nand-talent.html</link>
<description>Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development, bringing researchers and production teams closer together while addressing concerns over incentives and talent retention.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL214/samsung-dram-incentives-nand-talent.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl214_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Taiwan's Aero Win expands role in next-gen engine programs amid global aircraft backlog</title>
<pubDate>Thu, 22 Oct 2026 05:53:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD230/taiwan-aircraft-production-development-demand.html</link>
<description>Taiwan's aerospace components maker Aero Win Technology is positioning itself for a new growth cycle, capitalizing on robust aircraft engine demand while expanding its role in next-generation development programs. With global aircraft production struggling to keep pace with orders, the company's gross margin reached a record 26% in the first half of 2026, up 8pp year-over-year.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD230/taiwan-aircraft-production-development-demand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd230_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: CFM]]></media:description>
</media:content></item>
<item>
<title>China's L3 autonomous driving adoption tipped to top 35% by 2030, raising stakes for automakers</title>
<pubDate>Thu, 22 Oct 2026 04:27:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022VL217/autonomous-driving-2030-automakers-2026-vehicle.html</link>
<description>Level 3 (L3) autonomous driving penetration in China is forecast to exceed 35% by 2030, supported by falling sensor costs, advances in AI models, and tighter safety regulations. The forecast comes as the country expands autonomous driving trials and prepares for wider commercial deployment.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022VL217/autonomous-driving-2030-automakers-2026-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022vl217_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Xinhua]]></media:description>
</media:content></item>
<item>
<title>Samsung DX division postpones meeting amid bonus tensions</title>
<pubDate>Thu, 22 Oct 2026 04:07:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261022PD220/samsung-labor-union-communications-2027.html</link>
<description>According to reports from &lt;em&gt;Financial News&lt;/em&gt;, &lt;em&gt;ETNews&lt;/em&gt;, &lt;em&gt;News1&lt;/em&gt; and &lt;em&gt;Yonhap&lt;/em&gt;, Samsung Electronics' postponement of an event has intensified scrutiny of internal communications, bonus disparities, and preparations for 2027 wage talks as DX employees challenge compensation arrangements favoring the memory-focused DS division, while unions contest who should represent workers in negotiations expected to begin integrating demands in December.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261022PD220/samsung-labor-union-communications-2027.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261022pd220_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
</channel>
</rss>

