<?xml version="1.0" encoding="UTF-8" ?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom" xmlns:media="http://search.yahoo.com/mrss/">
<channel>
<atom:link href="https://www.digitimes.com/rss/daily.xml" rel="self" type="application/rss+xml" />
<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
<language>en-us</language>
<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 15 Oct 2026 21:00:03 GMT</lastBuildDate>
<ttl>240</ttl>
<image>
<title>DIGITIMES</title>
<width>131</width>
<height>62</height>
<link>https://www.digitimes.com</link>
<url>https://www.digitimes.com/images/rss_logo.jpg</url>
</image>
<item>
<title>Anthropic targets low-conflict sites for Australian data centers</title>
<pubDate>Thu, 15 Oct 2026 15:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD248/anthropic-data-australia-government-capacity.html</link>
<description>Anthropic plans to place new data centers in Australia away from densely populated areas, using renewable energy and previously developed sites to reduce conflicts with residents. The US artificial intelligence company is evaluating proposals from state and local governments competing for its investment, while expanding computing capacity in the country.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD248/anthropic-data-australia-government-capacity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd248_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Japan Mobility Show puts Physical AI and cross-sector partnerships in focus</title>
<pubDate>Thu, 15 Oct 2026 14:24:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD249/physical-ai-2026-toyota-robot-robotics.html</link>
<description>Japan Mobility Show Bizweek 2026 showcased Physical AI applications, including Toyota's basketball-playing robot and an air-ground inspection system, as automakers and startups explored new business opportunities beyond traditional vehicles. The business-focused exhibition, held in Japan, sought to demonstrate how robotics, artificial intelligence and mobility technologies could address industrial challenges through collaboration across sectors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD249/physical-ai-2026-toyota-robot-robotics.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd249_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Toyota targets 1,000 e-Palette sales ahead of 2027 autonomous launch</title>
<pubDate>Thu, 15 Oct 2026 12:23:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD250/toyota-2027-sales-vehicle-autonomous-driving.html</link>
<description>Toyota Motor Corp. plans to sell 1,000 units of its compact electric bus, the e-Palette, within five to six years as it prepares to introduce a Level 4 autonomous driving version in fiscal 2027, which runs from April 2027 through March 2028. The target is more than 10 times the vehicle's current sales, positioning the e-Palette for broader use in mobility services across Japan.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD250/toyota-2027-sales-vehicle-autonomous-driving.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd250_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Luxnet posts record 3Q profit as capacity expansion fuels growth</title>
<pubDate>Thu, 15 Oct 2026 12:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD236/profit-2026-communications-capacity-expansion-growth.html</link>
<description>Optical communications maker Luxnet reported a September 2026 net profit attributable to parent-company owners of NT$103 million (US$3.21 million), up 110.2% year-over-year, with earnings per share (EPS) of NT$0.72. September EPS exceeded half of the second-quarter 2026 EPS of NT$1.29, signaling strong momentum in the second half of the year.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD236/profit-2026-communications-capacity-expansion-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd236_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TSMC bars capacity resale, aims to leave no AI money on the table</title>
<pubDate>Thu, 15 Oct 2026 09:20:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD244/tsmc-capacity-demand-wafer-technology.html</link>
<description>TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still far outstripping supply, Wei said TSMC intends to leave no food on the table, making as much as it can, as fast as it can.</description>
<dc:creator>Joseph Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD244/tsmc-capacity-demand-wafer-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd244_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TSMC investor conference: TSMC lifts 2026 revenue growth forecast to 44%, 2nm expansion, new 3nm fab</title>
<pubDate>Thu, 15 Oct 2026 09:15:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD243/tsmc-growth-3nm-2026-fab.html</link>
<description>TSMC Chairman and CEO C.C. Wei announced that, driven by relentless AI momentum and strong demand for advanced process technologies, the company has raised its full-year 2026 US dollar revenue growth guidance to approximately 44%. AI and leading-edge nodes continue to serve as the core growth pillars for the foundry's operations.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD243/tsmc-growth-3nm-2026-fab.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd243_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>OpenAI pledges not to use Apple secrets, accuses ex-employee of taking files</title>
<pubDate>Thu, 15 Oct 2026 09:13:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD247/apple-openai-lawsuit-hardware-investigation.html</link>
<description>Apple's trade-secret lawsuit against OpenAI went to a hearing, where OpenAI pledged not to use confidential information that Apple claims was stolen. OpenAI also accused a former employee of taking more than 100 documents related to unreleased products when joining Apple.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD247/apple-openai-lawsuit-hardware-investigation.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd247_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>EU seeks China deal to lift ASML supplier sanctions amid rare-earth crisis</title>
<pubDate>Thu, 15 Oct 2026 09:11:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD246/eu-asml-russia-business-beijing.html</link>
<description>The European Union (EU) is negotiating with China to lift sanctions on Sindlhauser Materials GmbH, a small German business that is part of ASML's supply chain, according to people familiar with the matter. In exchange, the EU would remove trade restrictions on a Chinese company previously accused of assisting Russia's war against Ukraine.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD246/eu-asml-russia-business-beijing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd246_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI agents in suspected Tencent Cloud sandbox target Alibaba&#38;rsquo;s Amap mapping service</title>
<pubDate>Thu, 15 Oct 2026 09:09:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD245/cloud-tencent-alibaba-infrastructure-cybersecurity.html</link>
<description>An international AI research team has detected a fleet of more than a dozen AI agents operating in a suspected Tencent Cloud infrastructure sandbox and repeatedly attempting to penetrate Amap, the mapping service owned by Alibaba Group Holding Ltd.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD245/cloud-tencent-alibaba-infrastructure-cybersecurity.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd245_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Aurotek posts record 3Q26 revenue, up 58% on automation demand</title>
<pubDate>Thu, 15 Oct 2026 08:40:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD241/revenue-demand-automation-growth-equipment.html</link>
<description>Aurotek Corp. reported record consolidated revenue of NT$1.113 billion (US$34.7 million) in the third quarter of 2026, up 57.93% from a year earlier. Orders from semiconductor, high-end artificial intelligence (AI) server and electronics manufacturing customers drove demand for the company's automation equipment and subsystems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD241/revenue-demand-automation-growth-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd241_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines</title>
<pubDate>Thu, 15 Oct 2026 08:39:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD242/smt-plant-production-johor-manufacturing.html</link>
<description>FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia. The Johor Bahru site is designed to support global customers with 800G, 1.6T, 3.2T and 6.4T optical communication modules as demand grows across artificial intelligence, high-performance computing, data centers and semiconductor applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD242/smt-plant-production-johor-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd242_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Trump says Taiwan will buy 30% of LNG output from Alaska project; Taipei confirms plans but not final terms</title>
<pubDate>Thu, 15 Oct 2026 08:32:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL223/taiwan-donald-trump-government-investment-commercial.html</link>
<description>US President Donald Trump said at a Republican rally in Alaska on Tuesday that Taiwan had agreed to buy 30% of liquefied natural gas (LNG) from a planned Alaska pipeline project over 20 years, according to &lt;em&gt;Reuters.&lt;/em&gt; Commerce Secretary Howard Lutnick, who also spoke at the rally, said Taiwan had committed to investing US$4.4 billion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL223/taiwan-donald-trump-government-investment-commercial.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl223_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows</title>
<pubDate>Thu, 15 Oct 2026 08:25:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD237/2027-touch-taiwan-packaging-siph-expo.html</link>
<description>Touch Taiwan 2027 will take place on April 21&#38;ndash;23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging &#38;amp; Testing Expo and the Silicon Photonics Technology Applications Expo. Spurred by surging demand for AI, high-performance computing (HPC), and high-speed data transmission, the new additions will run alongside the established Smart Manufacturing and Smart Display exhibitions, creating a unified platform spanning semiconductor technologies, optical communications, intelligent manufacturing, and end applications.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD237/2027-touch-taiwan-packaging-siph-expo.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd237_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>AI server tracker: AIC accelerates as Taiwan's connector and chassis suppliers post uneven growth</title>
<pubDate>Thu, 15 Oct 2026 08:20:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL219/taiwan-revenue-connector-aic-growth.html</link>
<description>Taiwan's connector and server-chassis suppliers posted broadly higher September revenue, although their growth trajectories differed. Seven of eight tracked companies recorded annual gains for both September and January&#38;ndash;September 2026. BizLink, AIC and Chenbro had already exceeded their full-year 2025 revenue, while Argosy remained below last year's levels.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261014VL219/taiwan-revenue-connector-aic-growth.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261014vl219_files/4_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
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<title>TSMC CEO says profitability has no ceiling, plans High-NA EUV adoption in 2030</title>
<pubDate>Thu, 15 Oct 2026 08:14:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD240/tsmc-high-na-euv-adoption-2030.html</link>
<description>TSMC chairman and CEO C.C. Wei said on October 15 that the chipmaker sees no ceiling on its profitability as demand for AI accelerators continues to outpace supply. Wei also said AI-related growth could exceed the company's long-term forecast and outlined plans to adopt high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography in 2030.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD240/tsmc-high-na-euv-adoption-2030.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd240_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China</title>
<pubDate>Thu, 15 Oct 2026 08:11:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL222/sk-hynix-equipment-nand-exports-solidigm.html</link>
<description>SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new US factory, Reuters reported on October 15, citing two people familiar with the matter.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL222/sk-hynix-equipment-nand-exports-solidigm.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl222_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: SK Hynix]]></media:description>
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<title>AI server tracker: Taiwanese ODM/EMS players post NT$2.18T in September 2026, up 56% YoY</title>
<pubDate>Thu, 15 Oct 2026 08:10:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL220/2026-revenue-demand-gross-margin-earnings.html</link>
<description>Six Taiwanese server and networking contract manufacturers booked combined revenue of NT$2.18 trillion (US$67.3 billion) in September 2026, up 55.9% year-over-year and 4.9% month-over-month, as demand for AI servers stayed strong. Nine-month revenue of NT$15.5 trillion already exceeds the group's full-year 2025 total of NT$14.3 trillion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL220/2026-revenue-demand-gross-margin-earnings.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl220_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Applied Materials CEO says agentic AI drives wafer demand</title>
<pubDate>Thu, 15 Oct 2026 08:02:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD231/applied-materials-demand-wafer-ceo-equipment.html</link>
<description>Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven by the rise of AI computing. Speaking at a global investor conference, he said the company expects revenue from related businesses to grow by more than 20% over the next several years.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD231/applied-materials-demand-wafer-ceo-equipment.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd231_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai</title>
<pubDate>Thu, 15 Oct 2026 07:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL217/rrp-electronics-mumbai-packaging-chairman-testing.html</link>
<description>India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to &lt;em&gt;Dalal Street Investment Journal&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261014VL217/rrp-electronics-mumbai-packaging-chairman-testing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261014vl217_files/1_2b.jpg" type="image/jpeg" expression="full">
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</media:content></item>
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<title>TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable</title>
<pubDate>Thu, 15 Oct 2026 07:50:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD239/tsmc-elon-musk-terafab-capacity-expansion.html</link>
<description>TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of talks between the two sides.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD239/tsmc-elon-musk-terafab-capacity-expansion.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd239_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
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<title>TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins</title>
<pubDate>Thu, 15 Oct 2026 07:31:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL221/tsmc-revenue-2nm-demand-2026.html</link>
<description>&lt;p class="P1" data-pm-slice="1 1 []"&gt;TSMC expects fourth-quarter 2026 revenue to reach US$52.3 billion to US$54.3 billion, potentially rising as much as 61% year-over-year, with sustained demand for advanced semiconductor manufacturing and accelerating 2nm production supporting its year-end outlook.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL221/tsmc-revenue-2nm-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl221_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[TSMC CFO Wendell Huang. Credit: DIGITIMES]]></media:description>
</media:content></item>
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<title>China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&#38;amp;D plan</title>
<pubDate>Thu, 15 Oct 2026 07:24:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL211/equipment-amec-high-end-market-manufacturing.html</link>
<description>Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (&#38;asymp; US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition, advanced packaging, inspection and other semiconductor manufacturing processes.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL211/equipment-amec-high-end-market-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl211_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[AMEC SVP Hai Cong. Credit: WESEMiBAY 2026]]></media:description>
</media:content></item>
<item>
<title>Samsung reportedly completes 4F&#38;sup2; DRAM development as China's CXMT targets year-end launch</title>
<pubDate>Thu, 15 Oct 2026 07:16:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL219/samsung-dram-development-cxmt.html</link>
<description>Samsung Electronics has reportedly completed development of next-generation 4F&#38;sup2; DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin Memory Technologies (CXMT) prepares to introduce server memory using the architecture by the end of 2026. The competing timelines have raised questions about whether China's memory industry is closing the technology gap with South Korean manufacturers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL219/samsung-dram-development-cxmt.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl219_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
</media:content></item>
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<title>SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips</title>
<pubDate>Thu, 15 Oct 2026 06:46:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD218/sk-hynix-dram-ai-inference-capacity-2027.html</link>
<description>SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference systems. The South Korean chipmaker is also exploring ways to stack DRAM directly on AI processors to improve performance and energy efficiency.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix CDO Ahn Hyun delivers a keynote address at SEDEX 2026 in Seoul. Credit: Daniel Chiang]]></media:description>
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<title>US AI data center power shortages drive demand for hybrid solar, natural gas and geothermal systems</title>
<pubDate>Thu, 15 Oct 2026 06:36:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD241/data-center-geothermal-solar-demand-expansion.html</link>
<description>The rapid expansion of AI data centers in the US is placing growing pressure on conventional power grids, as their substantial and highly variable electricity requirements strain available supply in certain regions. Power shortages have even delayed the construction of some AI data center projects.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins</title>
<pubDate>Thu, 15 Oct 2026 06:35:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL218/tsmc-profit-2nm-revenue-2026.html</link>
<description>On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6 billion), exceeding market expectations on sustained demand for advanced semiconductors used in artificial intelligence (AI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Commentary: Huawei's 2027 Kirin roadmap &#38;mdash; can LogicFolding overcome chipmaking constraints?</title>
<pubDate>Thu, 15 Oct 2026 06:03:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD206/huawei-kirin-chips-roadmap-2027.html</link>
<description>On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Huawei]]></media:description>
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<title>Column: 3D memory could redraw chip competition, weaken US sanctions on China</title>
<pubDate>Thu, 15 Oct 2026 05:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD245/3d-2022-nand-dram-competition.html</link>
<description>In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D NAND with 128 layers or more, and restrictions on support provided by US persons.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Anthropic boosts 3Q26 revenue by 45% and stays profitable as IPO approaches</title>
<pubDate>Thu, 15 Oct 2026 05:55:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL214/anthropic-ipo-ai-business-revenue.html</link>
<description>Anthropic's third-quarter revenue surged 45% from the previous quarter and has been profitable on an adjusted basis for the last two quarters, the AI lab told prospective investors. As the company nears a record-setting IPO, it is also serving as a gauge of whether the frontier lab business model of heavy compute spending preceding profitability can be successful.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Delta Electronics targets SOFC pilot production by year-end, partners with Great Taipei Gas on 550kW installation</title>
<pubDate>Thu, 15 Oct 2026 05:03:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD222/delta-electronics-production-taipei-technology-electricity.html</link>
<description>Delta Electronics showcased its on-site solid oxide fuel cell (SOFC) power generation solution at Energy Taiwan 2026, alongside its first physical solid-state transformer (SST) product.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Micron opens second Taiwan advanced packaging plant as HBM supply tightens</title>
<pubDate>Thu, 15 Oct 2026 04:57:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL216/micron-taiwan-hbm-packaging-plant.html</link>
<description>Micron Technology on October 15 opened Micron Advanced Assembly and Test Taiwan 2 (AATT2) in Taichung, its second advanced assembly and test facility in Taiwan. The plant expands the company's packaging and testing capacity for high-bandwidth memory (HBM) as AI demand grows.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl216_files/5_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[From left: Micron President and Chief Operating Officer Manish Bhatia; Donghui Lu, head of Micron Taiwan; and Taiwan President Lai Ching-te.]]></media:description>
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<item>
<title>Analysis: Apple HomeView faces hurdles in smart-home adoption</title>
<pubDate>Thu, 15 Oct 2026 04:41:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD204/apple-smart-home-siri.html</link>
<description>Apple launched the HomeView smart display at its "Welcome Home" event on October 13, priced at US$299. It's scheduled to debut in eight countries: the US, the UK, Canada, Australia, New Zealand, India, Singapore, and South Africa, on November 13. Featuring a 7-inch square display and an A18 chip, the device comes in desktop and wall-mounted versions and centers on a new Siri AI that Apple positions as a smart voice-control hub for the home.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Synopsys CEO says fully autonomous AI chip design remains out of reach</title>
<pubDate>Thu, 15 Oct 2026 04:29:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD229/synopsys-ceo-design-development-chips.html</link>
<description>Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering to models that coordinate more than 40 task agents. He made these comments during the CEO Summit at SEMICON West 2026, adding that AI-era chip development requires co-optimization across physics, materials, processes, architectures, software, and models.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung, Applied Materials back startup targeting chip packaging warpage</title>
<pubDate>Thu, 15 Oct 2026 04:27:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL215/samsung-applied-materials-packaging-venture-capital-technology.html</link>
<description>Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The investment comes as increasingly complex AI chips create new challenges in managing thermal stress, warpage, and manufacturing yields.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl215_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Applied Materials]]></media:description>
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<title>Intel says AI 'gold rush' is over, pushes prompt routing across open hardware</title>
<pubDate>Thu, 15 Oct 2026 04:07:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL212/intel-hardware-gold-data.html</link>
<description>Intel used the Open Compute Project (OCP) Global Summit in San Jose to argue that AI is moving away from giant models in centralized data centers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem</title>
<pubDate>Thu, 15 Oct 2026 04:00:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD220/tsmc-globalfoundries-cowos-manufacturing-silicon.html</link>
<description>GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem. The agreement is expected to be worth US$2 billion over an initial five-year term.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd220_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AUO-backed Star Shining Energy targets 2028 IPO with shift from solar assets to energy technology</title>
<pubDate>Thu, 15 Oct 2026 03:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD214/solar-technology-2028-electricity-business.html</link>
<description>Star Shining Energy Holdings (SSEH) acquired Star Shining Enetek Corporation (Enetek), a spin-off of AUO's energy business, on October 1, 2026, combining power generation assets with engineering and technology capabilities. The acquisition extends SSEH's business beyond solar into geothermal power, industrial waste heat recovery, energy storage and corporate self-generation.</description>
<dc:creator>Levi Li</dc:creator>
<category>Sustainability</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd214_files/2_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Star Shining Energy Holdings chairman TY Lin (first from left). Credit: DIGITIMES]]></media:description>
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<title>Taiwan Perovskite Solar Corp. deploys AI to optimize R&#38;amp;D, explore smart energy applications</title>
<pubDate>Thu, 15 Oct 2026 03:24:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD226/taiwan-technology-materials-2026-development.html</link>
<description>Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology. In this paradigm, AI accelerates perovskite material and process development, while perovskite technology meets the AI era's demand for distributed green power, smart sensing, and site-specific energy solutions.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Delta Electronics' 13.8kV SST gains traction in China, with US cloud giant testing AI data centre microgrids</title>
<pubDate>Thu, 15 Oct 2026 03:22:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD210/delta-electronics-data-testing-efficiency-2026.html</link>
<description>Delta Electronics unveiled its prefabricated solid-state transformer (SST) DC power solution at Energy Taiwan 2026 on October 14, targeting power efficiency, deployment speed and supply resilience in AI data centres, AI factories and energy-intensive manufacturing. The system integrates SSTs, DC/DC converters and control technology.</description>
<dc:creator>Levi Li</dc:creator>
<category>Sustainability</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd210_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>OCP-recognized infrastructure spending forecast to hit US$800 billion by 2029, nearly triple prior estimate</title>
<pubDate>Thu, 15 Oct 2026 03:14:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL210/idc-infrastructure-forecast-equipment-worldwide.html</link>
<description>IDC now expects worldwide spending on IT equipment recognized by the Open Compute Project (OCP) to reach about US$800 billion in 2029.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl210_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: OCP]]></media:description>
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<title>Iridium and Altair team up to extend IoT connectivity beyond cellular networks</title>
<pubDate>Thu, 15 Oct 2026 03:14:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PR201/iot-chipset-logistics-mobile-president.html</link>
<description>Iridium Communications and Altair Semiconductor are joining forces to help IoT devices stay connected outside terrestrial coverage, a move that could affect industries from logistics to wearables worldwide. The partnership aims to give manufacturers a simpler path to global satellite-enabled connectivity, without adding separate satellite hardware to existing designs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Genius Electronic Optical secures US$150 million 3M investment for optical communications</title>
<pubDate>Thu, 15 Oct 2026 03:09:34 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD223/largan-precision-3m-communications-partnership-investment.html</link>
<description>Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a global technology and innovation giant, to jointly advance the development, manufacturing, and capacity expansion of optical communications solutions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd223_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>2026 Net-Zero Taiwan: Linde LienHwa highlights oxygen combustion, hydrogen solutions for industrial decarbonization</title>
<pubDate>Thu, 15 Oct 2026 03:08:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD225/taiwan-industrial-2026-electricity-production.html</link>
<description>Rising carbon-fee pressure is accelerating efforts to decarbonize Taiwan's energy-intensive industries, prompting Linde LienHwa Industrial Gases Group to promote oxygen-enriched and pure oxygen combustion technologies that can substantially reduce fuel consumption and emissions. At the 2026 Net-Zero Taiwan and Energy Taiwan exhibitions, held October 14&#38;ndash;16 at the Taipei Nangang Exhibition Center, the company is also highlighting hydrogen applications and energy management solutions to support industrial efficiency and energy resilience.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD225/taiwan-industrial-2026-electricity-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd225_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>LX Semicon puts SiC patents up for sale as Novatek gains ground</title>
<pubDate>Thu, 15 Oct 2026 03:07:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL207/lx-semicon-sic-ddi-display-2026.html</link>
<description>South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance on display driver ICs (DDIs). The retreat comes as Taiwan's Novatek gains ground in the company's core display chip market, increasing pressure on LX Semicon to develop new revenue sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl207_files/4_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: LX Semicon]]></media:description>
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<title>Intel Israel fab explosion kills 1, seriously injures 2 workers</title>
<pubDate>Thu, 15 Oct 2026 03:05:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD224/intel-israel-fab-fire-wafer.html</link>
<description>An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities deployed eight firefighting and rescue teams, including a hazardous-materials unit, to investigate the cause and assess the risk of a chemical leak involving nitrogen trifluoride (NF3).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd224_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Memory crisis drives global smartphone shipments down 20%, deepening premium-budget divide</title>
<pubDate>Thu, 15 Oct 2026 03:00:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL208/shipments-smartphone-global-smartphone-apple-demand.html</link>
<description>Global smartphone shipments fell 20% year-on-year in the third quarter of 2026, their lowest 3Q level since 2012, as persistent DRAM and NAND shortages inflated production costs, constrained supply, and weakened demand. Samsung led with a 23% market share, while Apple reached a record third-quarter share of 22%, highlighting a widening divide between premium and price-sensitive segments.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl208_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Analysis: Elon Musk's Terafab chases 10 chip iterations a year &#38;mdash; can it rival TSMC?</title>
<pubDate>Thu, 15 Oct 2026 02:57:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD215/design-tesla-elon-musk-manufacturing-development.html</link>
<description>Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be clear, I don't know how to make chips." He immediately followed it with a declaration: "We'll figure it out."</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD215/design-tesla-elon-musk-manufacturing-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd215_files/3_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Onsemi and Sungrow deepen battery storage tie-up as demand rises for grid power</title>
<pubDate>Thu, 15 Oct 2026 02:55:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PR200/onsemi-demand-efficiency-performance-design.html</link>
<description>Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density, and reliability in utility-scale battery systems. For global power markets, the deal highlights how small gains in conversion efficiency are becoming more important as AI, electrification, and renewable energy drive electricity demand higher.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Taiwanese chipmaker TASC targets 2027 growth with InP optical chips, glucose sensors nearing mass production</title>
<pubDate>Thu, 15 Oct 2026 02:48:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD219/chips-2027-inp-taiwan-asia-semiconductor-production.html</link>
<description>Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has also lifted orders for passive and protection components, while its indium phosphide (InP) optical communication chips have entered customer validation. TASC remains cautiously optimistic about 2027.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd219_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[TASC chairman Patrick Li. Credit: DIGITIMES]]></media:description>
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<title>Premium PC demand fuels tandem OLED race between Samsung Display, LG Display</title>
<pubDate>Thu, 15 Oct 2026 02:45:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD221/pc-market-lg-display-sdc-technology.html</link>
<description>Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display technology. Tandem OLED, which combines higher brightness, longer lifespan, and lower power consumption, is emerging as a key technology for premium PCs, sharpening competition between South Korea's two leading panel makers, Samsung Display (SDC) and LG Display (LGD).</description>
<dc:creator>Levi Li</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: SDC]]></media:description>
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<title>US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders</title>
<pubDate>Thu, 15 Oct 2026 02:44:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD209/semicon-west-chips-act-subsidies-semiconductors-investment-usa.html</link>
<description>Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West 2026, outlining the latest developments in the US-Taiwan US$500 billion investment agreement and calling on corporate executives and boards to prioritize American semiconductor manufacturing capacity.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Jay Liu]]></media:description>
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<title>Taiwan urged to recruit more from overseas to address talent shortage</title>
<pubDate>Thu, 15 Oct 2026 02:43:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD216/taiwan-pegatron-talent-chairman-topco.html</link>
<description>Pegatron chairman T.H. Tung and Topco Scientific founder J.W. Kuo called for Taiwan to recruit talent from overseas as the country faces intensifying industrial challenges. Speaking at a forum organized by the Global Views-Commonwealth Publishing Group on October 14, the two said talent shortages are more urgent than water or power shortages and urged companies to combine overseas hiring with AI and automation.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>ICT</category>
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<title>Vietnam's FPT courts Toyota Tsusho unit to sell its power chips in Southeast Asia, India</title>
<pubDate>Thu, 15 Oct 2026 02:37:37 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL205/toyota-chips-asia-technology-semiconductors.html</link>
<description>Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond Japan and into Southeast Asian and Indian markets through a Toyota Group trading network.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>ASML holds back 2029-2030 orders and confirms first price increases as EUV shortage deepens</title>
<pubDate>Thu, 15 Oct 2026 02:32:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL200/asml-euv-price-capacity-supplier.html</link>
<description>ASML, the sole supplier of extreme ultraviolet (EUV) lithography tools, has shifted from taking orders to allocating them. On its third-quarter 2026 earnings call on October 14, the Dutch company said customers want to place orders as far out as 2029 and 2030, but that it will not accept them until it has weighed total demand against its own capacity. It also confirmed, for the first time, that customers have agreed to pay more for its most critical machines.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Apple hits historic $5 trillion valuation, defying market headwinds in China</title>
<pubDate>Thu, 15 Oct 2026 02:31:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL206/apple-market-market-capitalization-iphone-hardware.html</link>
<description>Apple reached a historic financial milestone by closing above a US$5 trillion market capitalization for the first time, ending the trading session at US$5.005 trillion (US$342.96 per share). Driven by investor optimism surrounding its hardware ecosystem, Apple joins Nvidia in this elite valuation territory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Vogue Taiwan]]></media:description>
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<item>
<title>StarSeeds, Kaga Electronics target December 2026 AI server production in Japan</title>
<pubDate>Thu, 15 Oct 2026 02:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD208/production-manufacturing-ai-server-2026-infrastructure.html</link>
<description>Kaga Electronics and AI infrastructure provider StarSeeds have signed a basic contract manufacturing agreement to produce AI servers at a partner facility in Japan, targeting mass production in December 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>AI chip complexity is widening opportunities for semiconductor equipment makers</title>
<pubDate>Thu, 15 Oct 2026 02:26:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD212/equipment-chips-performance-applied-materials-market.html</link>
<description>AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts, denser interconnects, and more advanced memory architectures are expanding demand across logic, DRAM, and high-bandwidth memory (HBM) manufacturing.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Applied Materials targets US$5 billion advanced packaging revenue</title>
<pubDate>Thu, 15 Oct 2026 02:23:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD211/applied-materials-packaging-revenue-growth-equipment.html</link>
<description>Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years. The forecast underscores how hybrid bonding, metrology, and services are becoming central to competition in semiconductor equipment.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance</title>
<pubDate>Thu, 15 Oct 2026 02:17:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD213/inspection-equipment-mlcc-delta-electronics-component.html</link>
<description>South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary of Taiwan's Delta Electronics Group.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd213_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Hanwool Semiconductor Instagram]]></media:description>
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<item>
<title>IBM, MeitY Startup Hub sign pact to boost India's deep tech startups</title>
<pubDate>Thu, 15 Oct 2026 02:12:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PR202/ibm-technology-mou-startup-development.html?chid=10</link>
<description>IBM and MeitY Startup Hub, an initiative of India's Ministry of Electronics and Information Technology (MeitY), have signed a memorandum of understanding (MoU) to support India's deep tech startups with enterprise technology, mentorship, and market access. The deal could help founders build products for domestic needs while also improving their chances of scaling into global markets and ecosystems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>South Asia</category>
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<item>
<title>ASML hints at new 'T'-titled customer for 2029-2030 as Musk's Terafab lines up EUV tools</title>
<pubDate>Thu, 15 Oct 2026 02:09:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL202/asml-euv-chipmakers-demand-2030.html</link>
<description>ASML has signaled that a new customer whose name may begin with "T" is among the chipmakers seeking lithography tools for 2029 and 2030.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>BYD targets 40,000 European employees by 2030</title>
<pubDate>Thu, 15 Oct 2026 02:07:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD207/byd-2030-europe-launch-region.html</link>
<description>BYD plans to launch a large-scale hiring drive in Europe, aiming to increase its local workforce to about 40,000 by 2030 as it seeks to become a leading automaker in the region. Stella Li, BYD's executive vice president for overseas operations, told Bloomberg Television at the Paris Motor Show on October 12 that the company's commitment to Europe is firm and long term.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
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<item>
<title>Semiconductors to consume 30% of Taiwan's power by 2035</title>
<pubDate>Thu, 15 Oct 2026 02:03:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD217/demand-taiwan-2035-wafer-taiwan-power-company.html</link>
<description>Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that the domestic semiconductor industry will consume approximately 52 billion kWh in 2026, rising to around 80 billion kWh in 2030 and 110 billion kWh in 2035, when it will account for about 30% of Taiwan's total electricity use.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<item>
<title>LEO satellite boom strains supply chain amid AI data-center demand</title>
<pubDate>Thu, 15 Oct 2026 02:00:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD205/leo-supply-chain-data-materials-capacity.html</link>
<description>The global race to build low Earth orbit (LEO) satellite constellations is intensifying, but the massive deployment requirements are straining the aerospace supply chain. As AI data centers expand at the same time, the space industry faces shortages of specialized components and critical materials while competing with well-funded AI companies for power-equipment capacity, raising the risk of higher costs and deployment delays for some mega-constellation projects.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015pd205_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Nvidia showcases French AI deployments from orbit to quantum ahead of GTC Berlin</title>
<pubDate>Thu, 15 Oct 2026 01:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PR203/nvidia-gtc-france-ai-agent.html</link>
<description>France's artificial intelligence (AI) ecosystem is putting agentic computing into production on Nvidia hardware and open models, according to an Nvidia blog post published on October 12, 2026, listing projects spanning satellites, public-sector software, banking, cosmetics research, and quantum computing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261014pr203_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<item>
<title>ProLogium targets AI data centers, aviation with solid-state batteries</title>
<pubDate>Thu, 15 Oct 2026 01:55:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD203/prologium-data-development-market-automotive.html</link>
<description>ProLogium Technology is accelerating the development of non-automotive markets for its all-solid-state batteries, targeting AI data centers, aviation, and humanoid robots as electric vehicle (EV) market growth slows, according to &lt;em&gt;Nikkei Asia&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Bloomberg]]></media:description>
</media:content></item>
<item>
<title>Yuan Jen targets semiconductor shift with focus on packaging, specialty wire materials</title>
<pubDate>Thu, 15 Oct 2026 01:54:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD231/materials-packaging-business-growth-profit.html</link>
<description>Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated Electronic Materials Division in September 2025 to focus on semiconductor peripheral materials. Alongside its existing portfolio of electronic-grade hydrogen peroxide, electronic-grade isopropyl alcohol (IPA), and acetone, the company is actively seeking opportunities in next-generation semiconductor materials, prioritizing advanced packaging and specialty wiring materials as its main growth vectors.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261014PD231/materials-packaging-business-growth-profit.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261014pd231_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Auden expects stronger growth in 2027, sees satellite industry taking another 2&#38;ndash;3 years to gain momentum</title>
<pubDate>Thu, 15 Oct 2026 01:53:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD244/growth-antenna-2027-communications-technology.html</link>
<description>RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&#38;amp;D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's growth in 2026 will continue to be driven primarily by antenna modules and testing instruments for NB and bioelectromagnetic applications.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Communications</category>
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<media:content url="https://img.digitimes.com/newsshow/20261014pd244_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
</media:content></item>
<item>
<title>Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns</title>
<pubDate>Thu, 15 Oct 2026 01:53:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD252/sia-fab-equipment-materials-production.html</link>
<description>The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine US fab investments. In a report and accompanying briefing, the group also called for stronger supply-chain cooperation with allied countries because domestic production currently supplies only 21% of the materials and equipment used by the US semiconductor industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261014PD252/sia-fab-equipment-materials-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261014pd252_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>United Renewable Energy targets 2x US revenue by 2027 as solar module prices double</title>
<pubDate>Thu, 15 Oct 2026 01:52:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD202/taiwan-energy-transition-revenue-2027-solar-module.html</link>
<description>Amid the global energy transition, localized supply chains, and rising demand for non-China supply chains, United Renewable Energy is working with Sino-American Silicon Products to accelerate its market expansion in Taiwan and overseas. CEO Richard Chang said the company will build on Taiwan's stable rooftop solar market while ramping up its planned 1,000MW US module plant, targeting a doubling of US revenue by 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015PD202/taiwan-energy-transition-revenue-2027-solar-module.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015pd202_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Nvidia pledges US$250M in AI safety research to UK, CEO defends industry's approach</title>
<pubDate>Thu, 15 Oct 2026 01:41:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL204/nvidia-uk-ceo-investment-technology.html</link>
<description>Nvidia will provide the UK with US$250 million worth of computing resources over five years to support AI safety research, as CEO Jensen Huang defended the industry's ability to manage risks posed by increasingly powerful AI systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20261015vl204_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Korean memory makers accept ASML parts price hike, leaving TSMC as the open question</title>
<pubDate>Thu, 15 Oct 2026 01:38:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL201/asml-tsmc-price-chipmakers-euv.html</link>
<description>Memory chipmakers have become the fastest-growing source of demand for ASML, and the two largest of them have reportedly accepted higher replacement-part prices from the Dutch company. Attention now turns to TSMC, ASML's largest customer and, according to earlier reports, an opponent of price increases, as the lithography supplier prepares to charge more for its most critical tools.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20261015VL201/asml-tsmc-price-chipmakers-euv.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20261015vl201_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Samsung, SK Hynix stand to benefit as humanoid robot DRAM demand is forecast to jump 20-fold by 2030</title>
<pubDate>Thu, 15 Oct 2026 01:34:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL221/dram-demand-robot-2030-samsung.html</link>
<description>Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new growth market for Samsung Electronics and SK Hynix beyond high-bandwidth memory (HBM) used in AI data centers.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift</title>
<pubDate>Thu, 15 Oct 2026 01:32:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL224/nvidia-hbm4-rubin-hbm-dram.html</link>
<description>Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics and SK hynix to increase supplies of 8-layer products. The differing assessments suggest that changes in memory configurations do not necessarily signal weaker HBM demand, as manufacturing constraints and supply shortages are expected to support memory prices in 2027.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Nvidia]]></media:description>
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<title>Energy Taiwan 2026: Delta unveils breakthrough SST-based DC power system and SOFC solution</title>
<pubDate>Thu, 15 Oct 2026 01:31:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL225/2026-taiwan-management-infrastructure-efficiency.html</link>
<description>Delta, a global leader in power management and smart green solutions, unveiled its comprehensive microgrid and power infrastructure solutions for AI factories and high-density computing at Energy Taiwan 2026 under the theme "Resilient Energy, Powering the AI Future." Marking its 55th anniversary, the company debuted the world's first physical, production-ready containerized Solid-State Transformer (SST)-based DC power system alongside its Solid Oxide Fuel Cell (SOFC) distributed generation system.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Charlene Chen, DIGITIMES]]></media:description>
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<title>Changing iPhone 18 Pro supplier orders show shift to higher-end models</title>
<pubDate>Thu, 15 Oct 2026 01:19:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL220/apple-iphone-production-supplier-demand.html</link>
<description>Conflicting signals have emerged regarding the production of Apple's newest iPhone models, particularly the iPhone 18 Pro Max. Media reports on the volume changes appear to reflect an entrenchment of the company's premium segment during a year of rising component costs and sliding smartphone sales across the sector.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<title>Taiwan&#38;rsquo;s second-generation leaders rebuild family firms, from semiconductor filters to sushi</title>
<pubDate>Thu, 15 Oct 2026 01:04:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD221/sme-business-chairman-taiwan-chimei.html</link>
<description>First-generation Taiwanese entrepreneurs are retiring or leaving their businesses, driving a clear rise in second- and third-generation succession in recent years. At Chimei, for example, Chia-Chang Shi has become chairman of the company his father, Wen-Long Shi, had founded. Similar transitions are becoming increasingly common among small- to medium-sized enterprises (SMEs).</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: PwC]]></media:description>
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<title>GlobalFoundries wins US$21 billion US-Japan deal to build, operate two New York fabs</title>
<pubDate>Thu, 15 Oct 2026 00:58:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015VL203/globalfoundries-taiwan-capacity-fab-government.html</link>
<description>GlobalFoundries' selection to run two Japan-funded chip plants in New York tests a new way of paying for American fabs: governments own the factory and its tools, and the chipmaker is paid to build and run it. For GlobalFoundries, the arrangement adds capacity without the capital bill. For Japan, it turns part of its US$550 billion US investment pledge into supply for Japanese chipmakers and work for Japanese toolmakers. For Taiwan's mature-node foundries, it puts a large, state-backed source of capacity on US soil in the segment where they have been tipped to gain from customers' supply-chain diversification.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Lite-On unveils 800 VDC power and liquid cooling for AI data centers</title>
<pubDate>Thu, 15 Oct 2026 00:15:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD251/lite-on-data-liquid-cooling-efficiency-power-supply.html</link>
<description>Lite-On Technology is showcasing an 800 VDC power architecture, NVIDIA Vera Rubin-compatible power racks and integrated liquid-cooling systems at the 2026 Open Compute Project (OCP) Global Summit. The portfolio is designed to help data-center operators improve power efficiency, manage rising AI rack densities and integrate backup power with thermal management.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Commentary: AI power demand pushes Taiwan's energy industry toward integrated systems</title>
<pubDate>Thu, 15 Oct 2026 00:15:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL226/taiwan-2026-electricity-demand-solar.html</link>
<description>Energy Taiwan 2026 showcases an energy industry increasingly focused on integration, flexibility, and real-world deployment, as Taiwan balances its net-zero ambitions with rising electricity demand from artificial intelligence (AI), high-performance computing, and advanced manufacturing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Energy Taiwan 2026]]></media:description>
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<item>
<title>AI server tracker: Rail-kit growth turns uneven as cooling suppliers sustain expansion</title>
<pubDate>Thu, 15 Oct 2026 00:14:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL223/growth-revenue-taiwan-expansion-cooling.html</link>
<description>Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked companies grew both monthly and January&#38;ndash;September revenue from a year earlier, while four recorded declines from August. The results suggest that platform transitions and component availability continue to influence how AI infrastructure demand translates into revenue.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth</title>
<pubDate>Thu, 15 Oct 2026 00:13:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD256/applied-materials-capacity-equipment-cleanroom-growth.html</link>
<description>Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom construction and supply chain capacity. The company added more than 10 projects in each quarter, indicating that global fab development and future cleanroom availability were still expanding.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Applied Materials targets AI-driven semiconductor equipment growth through 2030</title>
<pubDate>Thu, 15 Oct 2026 00:13:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD255/applied-materials-2030-equipment-growth-manufacturing.html</link>
<description>Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030. The semiconductor equipment maker expects advanced logic, DRAM and advanced packaging to generate about 75% of wafer fab equipment (WFE) market growth from 2025 to 2030. By 2030, it is also targeting more than 2pp of additional WFE market share, along with non-GAAP gross and operating margins of approximately 54% and 40%, respectively.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Fujifilm to expand Arizona semiconductor materials output</title>
<pubDate>Thu, 15 Oct 2026 00:12:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PR201/fujifilm-materials-arizona-production-manufacturing.html</link>
<description>Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to strengthen supply for makers in the US and beyond, while supporting new packaging technologies and faster commercialization worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>HiSilicon expands DDI push across all display sizes</title>
<pubDate>Thu, 15 Oct 2026 00:12:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD254/hisilicon-ddi-display-huawei.html</link>
<description>&lt;p class="P1" data-path-to-node="4"&gt;Huawei subsidiary HiSilicon is actively expanding its display chip footprint, with its display driver IC (DDIC) development once again capturing market attention. Kun Luo, CEO of HiSilicon Display, recently disclosed key milestones for its DDR-free display solution. Developed through co-optimization across chip architectures, panel designs, and algorithms, the solution increased panel effective light-transmission area by nearly 25%, enabling two collaborative products to reach million-unit shipments a year ahead of schedule.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<title>Pegatron chair opposes Taipei airport relocation for AI park, proposes alternative</title>
<pubDate>Thu, 15 Oct 2026 00:12:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD253/pegatron-taipei-tung-tzu-hsien-industrial-development.html</link>
<description>Pegatron Chairman Tung Tzu-Hsien expressed opposition to a proposal to relocate Taipei Songshan Airport and redevelop the site into an AI industrial park, arguing that major capital cities should retain smaller airports to support regional air travel and business connectivity.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Michael Lee]]></media:description>
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<title>UMC declines expedited Samsung order for Galaxy Z Fold8; GF eyed as backup DDI foundry</title>
<pubDate>Thu, 15 Oct 2026 00:11:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD250/samsung-galaxy-ddi-demand-umc-globalfoundries.html</link>
<description>Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that was ultimately turned down. As a result, Samsung scaled back its September 2026 component production volume by 10%. Amid persistent capacity tightness at mature process nodes, Samsung is now evaluating GlobalFoundries (GF) as a secondary foundry partner for its OLED smartphone DDIs, with potential adoption set for late 2027 at the earliest.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Communications</category>
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<title>SEMI sees glass substrates entering market by 2028</title>
<pubDate>Thu, 15 Oct 2026 00:11:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD242/semi-market-2028-expansion-adoption.html</link>
<description>The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two years earlier than she previously expected. Beth Keser, SEMI's vice president of technology coalitions, said package dimensions are growing too quickly for the industry to wait until around 2030, her earlier forecast.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan solar manufacturers turn to US market as domestic approvals stall, low-cost imports intensify</title>
<pubDate>Thu, 15 Oct 2026 00:10:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD237/solar-taiwan-market-low-cost-manufacturing.html</link>
<description>Taiwan's solar manufacturers are increasingly looking to the US market as slowing approvals for large-scale domestic solar projects, limited rooftop installation capacity, and competition from low-cost imports threaten the industry's long-term prospects.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<title>Topco eyes Idaho base as North American chip expansion accelerates</title>
<pubDate>Thu, 15 Oct 2026 00:10:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD249/topco-expansion-manufacturing-technology-micron.html</link>
<description>Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company already operates service bases in Phoenix, Arizona, and Dallas, Texas, and plans to strengthen its local technology, engineering, and supply chain capabilities to pursue memory and advanced-process opportunities.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>US solar import price floor faces four challenges as December deadline approaches</title>
<pubDate>Thu, 15 Oct 2026 00:08:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD243/solar-price-competitiveness-market-investment.html</link>
<description>The US is seeking to improve the competitiveness of domestic solar manufacturers and attract overseas investment through minimum import price requirements for solar products. However, supply chain sources cautioned that frequent changes in US policies and regulations could complicate implementation.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Sustainability</category>
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<title>Taiwan suppliers target OCP power, cooling, 1.6T integration</title>
<pubDate>Thu, 15 Oct 2026 00:07:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD238/cooling-taiwan-2026-liquid-cooling-infrastructure.html</link>
<description>The Open Compute Project (OCP) Global Summit 2026 recently took place in San Jose, California, as Taiwan suppliers joined the global AI infrastructure race with offerings spanning power systems, servers, connectors, networking, and optical communications. The event highlighted a shift from standalone server performance to integrated systems focused on 800VDC power, liquid cooling, and 1.6T networking.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Hiroca sees overseas revenue share top 50%, eyes strong pull-in momentum for 4Q26</title>
<pubDate>Thu, 15 Oct 2026 00:06:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD235/hiroca-revenue-2026-automakers-supplier.html</link>
<description>Automotive parts supplier Hiroca saw an increase in overseas contributions for the first three quarters of 2026, with international markets accounting for more than 50% of the company's revenue during the period, up from the roughly 45% in the same period of 2025. This offset weakness in the auto industry resulting from the traditional third-quarter off-peak season, as well as a volatile baseline for September. The company continues to expand operations in Dongguan, China, and its overseas bases in North America, Mexico, Japan, and South Korea, which will bring sustained mid- to long-term growth momentum. Moreover, the company expects performance in the second half of 2026 to outpace the first half, as automakers ramp up orders for the traditional peak season in the fourth quarter.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>Electric Vehicles</category>
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<title>Sluggish demand keeps smartphone panel prices under pressure</title>
<pubDate>Thu, 15 Oct 2026 00:06:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD228/demand-smartphone-panel-prices-panel-amoled.html</link>
<description>As the fourth quarter begins, smartphone panel demand remains sluggish, with purchasing momentum from end-market brands showing no clear signs of recovery. Market activity throughout October remains at a low ebb.</description>
<dc:creator>Yunnie Cheng</dc:creator>
<category>Displays</category>
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<title>Murata eyes earlier MLCC expansion as AI server demand surges</title>
<pubDate>Thu, 15 Oct 2026 00:05:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD224/murata-expansion-demand-mlcc-investment.html</link>
<description>Murata Manufacturing is considering additional investment and an earlier expansion of multilayer ceramic capacitor (MLCC) capacity as demand from AI servers accelerates. The company plans to finalize the investment amount, expansion sites, and schedule before releasing its midterm financial results in late October.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Dell CEO urges AI growth without sacrificing safety</title>
<pubDate>Thu, 15 Oct 2026 00:03:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD223/dell-investment-ceo-growth-demand.html</link>
<description>As AI investment continues to expand, concerns are mounting over whether capital spending can translate into real revenue and whether data center construction is becoming excessive. Dell Technologies CEO Michael Dell said AI development should not hit the brakes over safety disputes or bubble concerns, arguing that businesses and governments should build safeguards together while managing risks and maintaining technological competitiveness.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Yulon Nissan sees Taiwan auto market holding at 420,000 units through 2027 amid EV, import growth</title>
<pubDate>Thu, 15 Oct 2026 00:02:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014PD222/yulon-nissan-market-president-taiwan.html</link>
<description>Yulon Nissan Motor president Chen-hsiang Yao expects Taiwan's auto market to remain at approximately 420,000 vehicles in 2026, excluding heavy vehicles, supported by growing demand for luxury cars and new energy vehicles (NEVs). While market saturation and shifting consumer preferences pose challenges, a potential resolution of US tariff issues could provide additional momentum.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Star Asia Vision targets digital out-of-home market with new products, Nichia partnership</title>
<pubDate>Thu, 15 Oct 2026 00:00:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261015PD200/asia-nichia-display-market-partnership.html</link>
<description>Star Asia Vision (SAVC), a display and systems integrator under Taiwan-Asia Semiconductor, is focusing on growth in the digital out-of-home (DOOH) advertising market by expanding software-hardware integration and high-end customization, while deepening its strategic partnership with global LED materials leader Nichia. The company is optimistic about growth momentum across its three main product lines and expects project expansions in 2027 to drive operating growth.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Displays</category>
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<media:description type="plain"><![CDATA[Credit: DIGIITMES]]></media:description>
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<title>Energy Taiwan 2026 opens with record international participation</title>
<pubDate>Wed, 14 Oct 2026 15:59:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20261014VL222/taiwan-2026-electricity-government-demand.html</link>
<description>Energy Taiwan 2026 opened on October 14, bringing together more than 430 exhibitors across nearly 1,400 booths as the island seeks to strengthen energy resilience and accelerate decarbonization amid rising electricity demand from artificial intelligence (AI).</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<media:description type="plain"><![CDATA[Credit: Energy Taiwan 2026]]></media:description>
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</channel>
</rss>

