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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Thu, 18 Jun 2026 05:00:03 GMT</lastBuildDate>
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<title>Unitree IPO tests China's bet on low-cost humanoid robots</title>
<pubDate>Thu, 18 Jun 2026 04:24:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL227/low-cost-shanghai-commercial-business-shanghai-stock-exchange.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:209;95-303"&gt;Unitree Robotics is heading toward a Shanghai listing with a pitch drawing attention well beyond China: humanoid robots can be built cheaply enough, and at enough scale, to begin taking on narrow labor tasks.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>SpaceX acquires Cursor to bolster xAI and court AI developers</title>
<pubDate>Thu, 18 Jun 2026 04:20:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD207/spacex-xai-data-competition-software.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:453;108-560"&gt;SpaceX has agreed to acquire AI coding tool developer Cursor for US$60 billion, in a deal that underscores how competition in the AI industry is extending beyond foundation models into the application layer and developer ecosystems. The purchase gives SpaceX direct access to enterprise customers, developer communities, and high-value code data instead of rebuilding a product from scratch. Markets see it as a key addition to Elon Musk's AI strategy.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Exclusive: Winbond NOR flash reportedly enters Nvidia supply chain</title>
<pubDate>Thu, 18 Jun 2026 04:14:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD216/flash-winbond-nvidia-supply-chain-demand.html</link>
<description>Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin platform.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>G7 AI talks reveal trust gap behind US model power</title>
<pubDate>Thu, 18 Jun 2026 04:06:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL204/anthropic-openai-policy-technology-europe.html</link>
<description>The world's most powerful AI companies entered the G7 summit in France this week with a message for democratic governments: frontier AI needs global rules, but those rules are increasingly being shaped by US strategic interests.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region</title>
<pubDate>Thu, 18 Jun 2026 03:52:49 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL226/samsung-sk-hynix-packaging-region-investment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:307;119-425"&gt;Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to &lt;em&gt;The Elec&lt;/em&gt; and &lt;em&gt;Hankyung&lt;/em&gt;, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Mirle Automation names CEO as chair</title>
<pubDate>Thu, 18 Jun 2026 03:16:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD214/mirle-automation-chairman-automation-mirle-equipment.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:301;88-388"&gt;Mirle Automation announced that chairman Houng Sun will step down and hand the role to chief executive officer Shih-Tung Lin, as the automation equipment maker moves to strengthen long-term development and leadership succession. Sun will remain on the board and has also been named honorary chairman.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Clevo PC shipments grow against trends, targeting double-digit on-year growth</title>
<pubDate>Thu, 18 Jun 2026 03:12:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD215/shipments-pc-clevo-2026-2025.html</link>
<description>PC shipments have been affected by shortages and price increases for memory and processors, and market research firms generally expect full-year 2026 shipments to decline by double digits. Clevo, which focuses on niche markets, expects its 2026 shipments to grow compared with 2025, with a possibility of achieving double-digit shipment growth.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Taiwan chip makers signal durable upcycle as memory prices and AI demand align</title>
<pubDate>Thu, 18 Jun 2026 02:58:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL225/taiwan-demand-revenue-recovery-growth.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:270;123-392"&gt;Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>FOPLP race heats up as Innolux reportedly teams with TSMC</title>
<pubDate>Thu, 18 Jun 2026 02:46:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD231/foplp-technology-ai-chip-tsmc-innolux.html</link>
<description>As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."&lt;em&gt; DIGITIMES&lt;/em&gt; believes that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP development more favorable.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<item>
<title>AI glasses race turns into a battle of devices, LLMs, and user interfaces</title>
<pubDate>Thu, 18 Jun 2026 02:35:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD210/market-2026-google-meta-hardware.html</link>
<description>&lt;p class="P1" data-sourcepos="9:1-9:299;311-609"&gt;AI glasses are gaining momentum as Meta, Rokid, RayNeo, Xreal, Viture, HTC, and other vendors step up their efforts, with Google and Samsung Electronics expected to enter the market in the second half of 2026. The category is widely seen as a potential essential mobile device after the smartphone.</description>
<dc:creator>Levi Li</dc:creator>
<category>Communications</category>
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<title>Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label &#38;mdash; but hurdles remain</title>
<pubDate>Thu, 18 Jun 2026 02:27:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260616PD216/technology-manufacturing-asia-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:388;138-525"&gt;The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of Chinese technology and semiconductor companies are adopting a dual-location strategy, establishing corporate entities in Singapore while locating manufacturing operations in Malaysia in an effort to reduce their association with the "Made in China" label.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<item>
<title>Nichicon raises e-cap prices as supply tightens, costs increase</title>
<pubDate>Thu, 18 Jun 2026 02:16:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD234/nichicon-aluminum-capacitor-price-capacity-expansion.html</link>
<description>Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The announcement comes amid another round of price increases in the passive components industry.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain</title>
<pubDate>Thu, 18 Jun 2026 02:09:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD204/smic-intel-kirin-huawei-performance.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:322;142-463"&gt;A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Acer founder outlines New WangDao leadership white paper at Tokyo AI forum</title>
<pubDate>Thu, 18 Jun 2026 01:54:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD229/acer.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:495;99-593"&gt;The founder of Acer Group traveled to Tokyo to present a Taiwan-origin leadership framework and release a multilingual white paper on New WangDao at the international AI forum, titled "Global Innovation Reimagined Conference: AI Resilience," on June 17. The white paper was published in Chinese, English and Japanese, and the founder delivered additional briefings to Japanese companies and alumni of Thunderbird School of Global Management on June 18 and June 19, according to event materials.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027</title>
<pubDate>Thu, 18 Jun 2026 01:48:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD203/samsung-dram-production-roadmap-2027.html</link>
<description>Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<item>
<title>Acer builds inventory to record high; price increases slowing</title>
<pubDate>Thu, 18 Jun 2026 01:47:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618PD202/acer-price-inventory-pc-jason-chen.html</link>
<description>Acer Chairman Jason Chen said that PC shipments may decline in the second half of 2026. However, as average selling prices (ASP) continue to rise, the overall impact on revenue should remain manageable. He is optimistic that Nvidia's RTX Spark launch could bring momentum into the PC industry and further develop the AI PC market.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung to offer 2nm prototype runs as South Korea pushes chip design</title>
<pubDate>Thu, 18 Jun 2026 01:07:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL224/samsung-2nm-design-wafer-chips.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:330;107-436"&gt;Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to &lt;em&gt;ZDNet Korea&lt;/em&gt; and &lt;em&gt;iNews24&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Samsung Foundryˇ¦s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung]]></media:description>
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<title>TSMC, ASML and Imec push 2D transistors toward manufacturing</title>
<pubDate>Thu, 18 Jun 2026 01:06:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260616VL219/tsmc-asml-manufacturing-300mm-materials.html</link>
<description>&lt;p class="P1" data-start="419" data-end="668"&gt;Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit:  Imec]]></media:description>
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<item>
<title>SK Hynix ships HBM4E samples to customers</title>
<pubDate>Thu, 18 Jun 2026 01:06:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260618VL200/sk-hynix-shipping-hbm4-data-production.html</link>
<description>SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Digitimes]]></media:description>
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<title>AbonMax eyes double-digit drone revenue by end-2026</title>
<pubDate>Wed, 17 Jun 2026 23:55:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD232/2026-abon-commercial-drone-market-revenue-taiwan.html</link>
<description>AbonMax Technology said on June 16 that drone revenue still accounts for only about 7% to 8% of its total sales, but the company expects more visible operating results by the end of 2026 as government procurement orders and overseas expansion begin to take effect.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Aerospace</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617pd232_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>Samsung pushes vertical transistor design as chip scaling hits limits</title>
<pubDate>Wed, 17 Jun 2026 23:55:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL221/samsung-transistor-3d-chips-materials.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:213;107-319"&gt;Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260617vl221_files/4_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Taiyo Yuden to boost AI server MLCC capacity, resists price hikes</title>
<pubDate>Wed, 17 Jun 2026 23:54:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL218/taiyo-yuden-mlcc-price-ai-server-production.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:305;99-403"&gt;Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Taiyo Yuden]]></media:description>
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<title>Samsung said to open fab data to suppliers in AI factory push</title>
<pubDate>Wed, 17 Jun 2026 23:54:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL212/samsung-data-fab-equipment-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:225;103-327"&gt;Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's &lt;em&gt;ETNews&lt;/em&gt;, which cited industry sources.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Samsung]]></media:description>
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<title>Meta puts brakes on AI use as token costs hit tech giants</title>
<pubDate>Wed, 17 Jun 2026 23:54:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD230/meta-ai-cost-business-2026.html</link>
<description>Meta's internal AI costs have spiraled, and a broader pullback in spending by major tech companies is bringing a long-ignored contradiction into focus: the business logic of AI is being undermined by the cost pressure it creates.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>Taiwan 2026 GDP could top 10%, says Minister of  Economic Affairs</title>
<pubDate>Wed, 17 Jun 2026 23:53:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD228/taiwan-gdp-growth-2026.html</link>
<description>Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may be achieved given current trends. He pointed to stronger-than-expected exports from the AI supply chain and traditional industries such as machinery.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>SK Hynix scraps degree rules to court AI chip talent</title>
<pubDate>Wed, 17 Jun 2026 23:52:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD227/sk-hynix-talent-hbm-market-competitiveness.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:400;100-499"&gt;SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>China launches probe into Beidou infrastructure quality scandal</title>
<pubDate>Wed, 17 Jun 2026 23:52:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD225/probe-infrastructure-transportation-equipment-investigation.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:397;115-511"&gt;China has launched a probe into a Beidou high-precision smart monitoring project in Shandong, after reports of severe construction defects at the base sparked public concern over the quality of new infrastructure projects. The project, with a total investment of nearly CNY300 million (US$44.4 million), has drawn scrutiny after its base structures were described as "easy to tear apart by hand."</description>
<dc:creator>Lily Hess</dc:creator>
<category>Communications</category>
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<title>SK Group tops KRW2,000 trillion as AI memory demand and Nvidia visit lift valuation</title>
<pubDate>Wed, 17 Jun 2026 23:51:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD224/sk-group-nvidia-demand-market-sk-hynix.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:522;102-623"&gt;SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, &lt;em&gt;ET News&lt;/em&gt; and Yonhap, the group's 19 listed subsidiaries reached a combined market value of KRW2,019.6 trillion, a 2.5% increase from the previous trading day.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>WUS and its subsidiary keep complementary AI partnership</title>
<pubDate>Wed, 17 Jun 2026 23:51:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD221/wus-subsidiary-pcb-ai-server-capex.html</link>
<description>A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in the capital market. This has once drawn industry attention to the current business cooperation between WUS and its subsidiary in China, WUS Printed Circuit Kunshan.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Research Insight: Fukuta deepens EV moat with hub motors and thin silicon steel</title>
<pubDate>Wed, 17 Jun 2026 23:51:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD220/fukuta-vehicle-silicon-market-efficiency.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:312;143-454"&gt;As the global electric vehicle (EV) market enters a correction phase, automakers are demanding more from both cost and efficiency. Fukuta has been steadily extending the design, integration, and manufacturing capabilities it built in automotive multi-in-one power systems into smaller power module applications.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Electric Vehicles</category>
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<title>China Electric targets 40% lighting market share with retail push</title>
<pubDate>Wed, 17 Jun 2026 23:50:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD219/china-electric-lighting-retail-brand-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:939;115-1053"&gt;China Electric, which sells lighting products under the TOA brand, is aiming for a 2026 turnaround by reversing second-quarter losses, activating assets, and leasing existing factories, while also expanding into retail channels and contract manufacturing in the second half of the year.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD219/china-electric-lighting-retail-brand-2026.html</guid>
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<title>Handheld device makers shift from scanners to edge AI field hubs</title>
<pubDate>Wed, 17 Jun 2026 23:49:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD215/handheld-smart-applications-management-hardware-data.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:217;109-325"&gt;AI and smart applications are pushing handheld devices beyond barcode scanning and data entry, transforming them into intelligent terminals that combine edge computing, cloud management and vertical applications.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles</title>
<pubDate>Wed, 17 Jun 2026 23:49:33 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD212/ip-manufacturing-silicon-valley-equipment-development.html</link>
<description>Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>Interview: MicroLED and SiPh eye 3.2T AI data race</title>
<pubDate>Wed, 17 Jun 2026 23:49:17 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD211/microled-siph-cpo-optical-communications-supply-chain-taiwan.html</link>
<description>The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away from the price wars of the consumer market, Nvidia's push to upgrade AI transmission standards to 1.6T, 3.2T, and beyond is exposing the physical limits of copper wiring, making scale-up the first battlefield in the competition between photons and electrons. Micro LED's high bandwidth and heat resistance position it as a key technology for the 3.2T-plus optical communications era.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Displays</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD211/microled-siph-cpo-optical-communications-supply-chain-taiwan.html</guid>
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<title>Exclusive: Galatek sees Penang facility driving semiconductor, life sciences ecosystem growth</title>
<pubDate>Wed, 17 Jun 2026 23:48:32 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD210/manufacturing-growth-testing-development-automation.html</link>
<description>Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&#38;amp;D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manager Teo Swee Leng about the region's current development and future prospects.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260617PD210/manufacturing-growth-testing-development-automation.html</guid>
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<title>UC San Diego researchers turn retired Pixel phones into low-cost computing cluster</title>
<pubDate>Wed, 17 Jun 2026 23:48:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617PD206/google-california-hardware-performance.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:360;136-495"&gt;Backed by Google, researchers at the University of California, San Diego, are repurposing retired Pixel phones into a computing cluster that could lower costs and cut e-waste. The project matters far beyond one campus, as it points to a possible model for affordable, local cloud infrastructure that could interest schools and smaller organizations worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Commentary: US delays DeepSeek blacklist, exposing AI export-control dilemma</title>
<pubDate>Wed, 17 Jun 2026 08:11:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260617VL216/deepseek-cxmt-entity-list-security-usa.html</link>
<description>The US has held back from adding Chinese AI startup DeepSeek, memory chipmaker CXMT, and more than 100 other entities to a key trade blacklist, underscoring Washington's struggle to balance national security controls with a broader effort to contain tensions with Beijing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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