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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Sat, 25 Apr 2026 14:00:05 GMT</lastBuildDate>
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<title>LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand</title>
<pubDate>Sat, 25 Apr 2026 06:00:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD225/siph-demand-equipment-6-inch-photonics.html</link>
<description>Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare early for second-half 2027 demand, and aims to introduce semiconductor-grade equipment for processes involving substrates larger than 6 inches, targeting a new expansion phase starting in 2028.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>The Taiwan startup that Qualcomm helped build the agentic OS for edge AI</title>
<pubDate>Sat, 25 Apr 2026 02:11:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL211/pepper-hardware-staff-taiwan.html</link>
<description>When the avocado has two hours left, the AI takes over.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>China's Horizon Robotics aims at Tesla with new self-driving platform</title>
<pubDate>Sat, 25 Apr 2026 01:57:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD237/tesla-competition-horizon-robotics-autonomous-driving-chips.html</link>
<description>&lt;p class="P1" data-start="51" data-end="348"&gt;As competition in intelligent electric vehicles shifts from incremental feature upgrades to full system-level redesign, China's Horizon Robotics is mounting an ambitious strategic push &#38;mdash; one that places it in more direct competition with Tesla.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's industrial production surges on AI infrastructure demand</title>
<pubDate>Sat, 25 Apr 2026 01:56:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD240/taiwan-production-industrial-moea-infrastructure.html</link>
<description>Data released by Taiwan's Ministry of Economic Affairs (MOEA) on April 23 showed that major global cloud service providers continue to expand procurement of artificial intelligence (AI) hardware as countries worldwide build out AI infrastructure. As a result, industrial production of computer, electronic, and optical products &#38;mdash; primarily AI servers &#38;mdash; surged 146.32% in March 2026. Cumulatively, output from January to March rose 131.77% compared with the same period in 2025.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>ICT</category>
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<title>India's solar growth faces policy tension between local manufacturing push and rapid capacity expansion</title>
<pubDate>Sat, 25 Apr 2026 01:56:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423VL218/solar-manufacturing-policy-growth-capacity-expansion.html</link>
<description>India's push to localize solar manufacturing while rapidly expanding capacity is creating a structural bottleneck, as stricter domestic sourcing rules risk constraining supply just as renewable deployment accelerates. Industry groups warn that the mismatch between solar cell production and demand could delay projects, even as the government accelerates its clean energy transition.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Sustainability</category>
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<title>Chinese AI firms push into deployment, shift focus to inference at GITEX Asia</title>
<pubDate>Sat, 25 Apr 2026 01:55:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423VL223/asia-gitex-training-demand-infrastructure.html</link>
<description>&lt;p class="P1" data-start="404" data-end="591"&gt;Chinese artificial intelligence companies are reshaping global AI deployment strategies, accelerating a shift toward inference-driven, commercially viable applications at GITEX Asia 2026.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Sherri Wang]]></media:description>
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<title>Hon Hai and Mitsubishi Electric sign MOU on joint automotive equipment venture</title>
<pubDate>Fri, 24 Apr 2026 10:50:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL220/mitsubishi-electric-foxconn-automotive-equipment-industrial.html</link>
<description>Foxconn eyes 50% stake in Mitsubishi Electric Mobility as it deepens push into EV-related hardware.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Foxconn]]></media:description>
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<title>Chipmakers face higher cost pressure as packaging outpaces foundry price hikes</title>
<pubDate>Fri, 24 Apr 2026 08:58:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD229/chipmakers-packaging-price-capacity-osat.html</link>
<description>In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers. These moves aim to pass on steadily rising manufacturing costs across the supply chain as outsourced semiconductor assembly and test (OSAT) costs surge faster than even foundry price increases.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure</title>
<pubDate>Fri, 24 Apr 2026 08:33:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD205/google-cloud-google-tpu-training-chips.html</link>
<description>At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for training and the TPU v8i for inference. The move is intended to boost performance and energy efficiency by optimizing each chip for its specific role.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Google]]></media:description>
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<title>M31 and TSMC complete eUSB2V2 tapeout on N2P process</title>
<pubDate>Fri, 24 Apr 2026 08:15:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD228/m31-tsmc-ip-2nm-design.html</link>
<description>IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely with the manufacturing platform to boost design efficiency and accelerate time-to-market.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Memory price surge reshapes global notebook competition in 2026</title>
<pubDate>Fri, 24 Apr 2026 08:10:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260422PD213/notebook-panel-competition-price-shipments-2026.html</link>
<description>The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities as the core of competition. Memory supply chain control has emerged as a key indicator of brand competitiveness, directly impacting shipment volumes and operational performance.</description>
<dc:creator>Lily Hess</dc:creator>
<category>ICT</category>
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<title>DeepSeek previews V4 models with Huawei integration, signaling shift in China's AI stack</title>
<pubDate>Fri, 24 Apr 2026 08:09:15 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL216/deepseek-huawei-startup-development-competition.html</link>
<description>Chinese artificial intelligence startup DeepSeek has released preview versions of its latest models &#38;mdash; DeepSeek-V4-Pro and V4-Flash &#38;mdash; marking a closer integration with domestic chipmaker Huawei and intensifying competition with US developers, including OpenAI and Google.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow</title>
<pubDate>Fri, 24 Apr 2026 07:57:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL214/euv-photoresist-materials-middle-east-disruption-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="267"&gt;Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through the global semiconductor supply chain, threatening shortages of a critical chipmaking material: photoresists.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Shin-Etsu Chemical]]></media:description>
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<title>STMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027</title>
<pubDate>Fri, 24 Apr 2026 07:50:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL215/stmicroelectronics-revenue-data-center-guidance-2026.html</link>
<description>STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics and computing helped offset continued softness in automotive and industrial markets.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker</title>
<pubDate>Fri, 24 Apr 2026 07:46:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD215/tsmc-equipment-packaging-taiwan-ase.html</link>
<description>The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate (CoWoS) and chip-on-panel-on-substrate (CoPoS) advanced packaging equipment orders. Industry sources indicate that ASE Technology Holding's equipment orders may also be affected as the supply chain undergoes potential realignment.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
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<title>Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset</title>
<pubDate>Fri, 24 Apr 2026 07:19:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD225/lite-on-edge-ai-demand-startup-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="368"&gt;Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing human-machine co-creation and real-world industrial deployment.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Liteon]]></media:description>
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<title>EU targets Android access rules, putting Gemini integration edge at risk</title>
<pubDate>Fri, 24 Apr 2026 06:58:26 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD227/eu-google-gemini-android.html</link>
<description>European regulators are preparing to push Google to open up core Android operating system functions, potentially allowing rival AI assistants such as ChatGPT and Claude to access the platform on the same terms as Gemini, according to people familiar with the matter.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Microsoft and Meta announce workforce reductions amid heavy AI investment</title>
<pubDate>Fri, 24 Apr 2026 06:01:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL213/meta-microsoft-staff-layoffs-ai-2025.html</link>
<description>Microsoft and Meta have recently announced job cuts or buyouts impacting possibly 23,000 jobs. The staff reductions come as the tech giants funnel massive resources into building out their AI capacity, a trade-off that has become common across the industry in recent months.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Heran's three-brand strategy targets all appliance segments, with Yamada brand driving 2026 growth</title>
<pubDate>Fri, 24 Apr 2026 04:29:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD206/home-appliance-market-growth-price-2026.html</link>
<description>Taiwan-based appliance maker Heran's shift to a multi-brand, multi-product strategy signals that mature appliance markets can still expand by segmenting price tiers; global consumers and competitors may see stronger low-end volume, steady air-conditioner demand, and measured pricing pressure from raw-material and currency volatility, as well as market responses.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Tesla's hidden US$2 billion AI hardware deal points to deeper chip, compute ambitions</title>
<pubDate>Fri, 24 Apr 2026 04:14:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL209/tesla-ai-acquisition-fsd-robotaxi-2026.html</link>
<description>&lt;p class="P1" data-start="0" data-end="244"&gt;Tesla has quietly taken a significant step deeper into artificial intelligence (AI), disclosing a US$2 billion acquisition of an unnamed AI hardware company in a single sentence buried in its latest regulatory filing.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>White House accuses China of 'industrial-scale' AI theft, signals crackdown</title>
<pubDate>Fri, 24 Apr 2026 04:08:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL210/development-technology-deepseek.html</link>
<description>The White House has accused China of conducting "industrial-scale" theft of US artificial intelligence intellectual property, a development that could escalate tensions in the ongoing technology rivalry between the two countries, according to the &lt;em&gt;Financial Times&lt;/em&gt;, &lt;em&gt;Reuters,&lt;/em&gt; and &lt;em&gt;CNN&lt;/em&gt;.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>FSET eyes local battery recycling and storage by 2027</title>
<pubDate>Fri, 24 Apr 2026 03:45:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD207/demand-recycling-formosa-smart-energy-tech-electricity-2027.html</link>
<description>Amid rising electricity demand driven by geopolitical tensions and AI growth, Formosa Smart Energy Tech (FSET) is advancing its battery recycling and energy storage strategy to build a localized circular supply chain. The company plans to establish Taiwan's first waste battery recycling line in Changhua County, targeting completion by the fourth quarter of 2027 with an initial capacity of 720 tons.</description>
<dc:creator>Rodney Chan</dc:creator>
<category>Sustainability</category>
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<title>Commentary: DeepSeek rethinks funding strategy under talent drain and AI race</title>
<pubDate>Fri, 24 Apr 2026 03:35:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD211/deepseek-funding-talent-tencent-2025.html</link>
<description>The trajectory of DeepSeek has drawn scrutiny, but its latest move marks a clear inflection point. According to a report by &lt;em&gt;The Information&lt;/em&gt;, the company is seeking external funding for the first time, triggering strong interest from China's major tech groups. Four sources familiar with the matter said Tencent and Alibaba are in discussions to invest.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
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<title>SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration</title>
<pubDate>Fri, 24 Apr 2026 03:25:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL208/sk-hynix-tsmc-hbm4-dram.html</link>
<description>&lt;p class="P1" data-start="146" data-end="400"&gt;SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting closer collaboration with the foundry and outlining a strategy focused on integrating memory and logic.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[SK Hynix Chief Development Officer (CDO) Ahn Hyun delivering the keynote address. Credit: SK Hynix]]></media:description>
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<title>Texas Instruments eyes further price hikes amid strong data center, industrial chip demand</title>
<pubDate>Fri, 24 Apr 2026 03:13:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD223/texas-instruments-price-industrial-data-center-demand.html</link>
<description>Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications. TI stressed that while industrial demand has yet to reach its previous peak, the current recovery trend is positive, signaling continued growth prospects ahead.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<title>AI PCB supply crunch squeezes margins on rising materials and energy costs</title>
<pubDate>Fri, 24 Apr 2026 03:07:13 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD218/materials-pcb-high-end-capacity-ccl.html</link>
<description>A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from T-glass fiberglass cloth for IC substrates to longer lead times for copper-clad laminates (CCL), with prices for multiple upstream inputs rising in tandem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Zhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity</title>
<pubDate>Fri, 24 Apr 2026 02:59:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD213/zhen-ding-pcb-high-end-capacity-china-hd.html</link>
<description>&lt;p class="P1" data-start="98" data-end="327"&gt;Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand high-end printed circuit board (PCB) capacity targeting artificial intelligence (AI) applications.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Zhen Ding holds a groundbreaking ceremony for its HD campus in Huai¡Šan, with chairman Charles Shen (center) at a pre-event blessing.Credit: Flora Wang]]></media:description>
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<title>Huawei invests CNY18 billion in smart driving while European legacy brands struggle for relevance</title>
<pubDate>Fri, 24 Apr 2026 02:56:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424VL207/huawei-sales-investment-development-vehicle.html</link>
<description>Huawei has committed a CNY18 billion (US$2.63 billion) investment plan dedicated to research and development in smart driving technologies, in an aggressive push to dominate the foundational layer of the electric vehicle (EV) industry. According to &lt;em&gt;Reuters&lt;/em&gt;, Huawei is allocating CNY10 billion specifically for computing power to train AI models, with plans to scale that infrastructure spending to between CNY70 billion and CNY80 billion over the next five years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
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<title>MCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth</title>
<pubDate>Fri, 24 Apr 2026 02:44:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD220/mcu-supplier-growth-revenue-capacity.html</link>
<description>&lt;p class="P1" data-start="0" data-end="340"&gt;Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated revenue of NT$653 million (approx. US$20.1 million), a record high for a single quarter. Full-year revenue is projected to grow by up to 60%, driven by a combination of new product launches and expanded demand from existing customers.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<title>Texas Instruments says edge AI opportunities extend beyond robots</title>
<pubDate>Fri, 24 Apr 2026 02:32:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD210/texas-instruments-edge-ai-robotics-demand-silicon-labs.html</link>
<description>In an April 23 interview, Amichai Ron of Texas Instruments (TI) warned that edge AI will reshape devices worldwide, extending far beyond robotics and driving greater semiconductor demand as AI integrates into long-lived products, implying that global markets must prepare for increased connectivity, sensorization, and chip requirements, along with regulatory and logistical adjustments.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: TI]]></media:description>
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<title>E Ink and Netronix eye e-reader growth despite DRAM headwinds</title>
<pubDate>Fri, 24 Apr 2026 02:30:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD209/growth-2026-netronix-dram-price.html</link>
<description>As color electronic paper technology matures, the e-reader market is entering a new growth phase&#38;mdash;one that could reshape global reading habits and retail channels. Consumers worldwide may see broader access to color devices, evolving purchase patterns in convenience retail, and sustained demand for monochrome readers that support diverse market segmentation.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Displays</category>
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<title>MODA encourages Taiwanese firms to invest in computing power; Foxconn submits project proposal</title>
<pubDate>Fri, 24 Apr 2026 02:20:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD200/taiwan-moda-investment-computing-power-infrastructure-foxconn.html</link>
<description>The government has included AI computing infrastructure within the scope of major digital public construction projects, using tax incentives to boost private-sector investment. Minister of Digital Affairs (MODA) Yen-nun Huang stated that applications will close at 5 pm on May 14, and Foxconn has already expressed interest and maintained close communication with the ministry.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Communications</category>
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<title>German automakers lose share as EV incentives lift Chinese rivals</title>
<pubDate>Fri, 24 Apr 2026 02:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260423PD226/automakers-germany-2026-demand-market.html</link>
<description>Germany's EV subsidy program is set to open for applications in May, with retroactive eligibility for vehicles purchased as early as January. But while the policy is intended to bolster the country's domestic EV industry, early results suggest that much of the benefit is flowing to foreign automakers &#38;mdash; particularly Chinese brands &#38;mdash; adding competitive pressure on German manufacturers at home.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Exclusive: Google ramps new TPU servers, Taiwan suppliers gain share</title>
<pubDate>Fri, 24 Apr 2026 02:10:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD212/google-tpu-asic-supply-chain-taiwan-2026.html</link>
<description>&lt;p class="P1" data-start="378" data-end="675"&gt;Google's unveiling of its eighth-generation tensor processing unit (TPU) at Cloud Next 2026 is expected to drive the next wave of growth in the application-specific integrated circuit (ASIC) server supply chain, with Taiwanese manufacturers expanding their role, according to supply chain sources.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<title>SMIC returns to advanced packaging, scales team to boost AI chip strategy</title>
<pubDate>Fri, 24 Apr 2026 02:04:09 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260424PD204/smic-ai-chip-wafer-advanced-packaging-hpc.html</link>
<description>&lt;p class="P1" data-start="70" data-end="290"&gt;China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing to accelerate investments in advanced packaging.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: SMIC]]></media:description>
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