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<title>DIGITIMES: News and Insight of the Global Supply Chain</title>
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<description>A platform bridging customers and suppliers</description>
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<title>Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war</title>
<pubDate>Fri, 31 Jul 2026 03:59:11 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD214/samsung-sk-hynix-hbm-talent-salary.html</link>
<description>Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco, highlighting the deepening ties among the companies driving the global AI supply chain.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Semiconductors</category>
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<title>AWS backlog reaches US$496 billion; Amazon to double power capacity by end-2027</title>
<pubDate>Fri, 31 Jul 2026 03:29:23 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL208/amazon-aws-capacity-revenue-cost.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:210;103-312"&gt;Amazon disclosed a US$496 billion AWS backlog growing at triple-digit rates in the second quarter, and CEO Andy Jassy used the call to lay out unusually specific unit economics defending the capital behind it.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Analysis: Behind Microsoft's AI strategy to sharpen platform edge</title>
<pubDate>Fri, 31 Jul 2026 03:28:12 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD204/microsoft-openai-anthropic-earnings-2026.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:287;123-409"&gt;Microsoft is no longer framing artificial intelligence as a race to build the single best model. Instead, it is positioning itself as the platform where customers can choose among many models. This shift could broaden its enterprise reach while reducing dependence on any one AI leader.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Tokyo Electron raises outlook as AI data center spending lifts memory demand</title>
<pubDate>Fri, 31 Jul 2026 03:25:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD224/tokyo-electron-outlook-2026-operating-profit-demand.html</link>
<description>Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending. The Japanese equipment maker said demand for memory chips and advanced-process tools remained solid as major customers expanded capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Powertech bets on AMD FOPLP mass production in 2027</title>
<pubDate>Fri, 31 Jul 2026 03:23:03 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260729PD228/foplp-powertech-production-amd-growth.html</link>
<description>Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to enter mass production by mid-2027. The company also said it has teamed with Broadcom in Singapore on FOPLP RDL development and is moving into optical communications, with &#38;mu;-Bump-based optical engine samples expected to enter small-scale production by year-end.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Amazon Leo nears 400 satellites, initial service to begin this year</title>
<pubDate>Fri, 31 Jul 2026 03:22:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL209/amazon-leo-satellite-launch-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:227;102-328"&gt;Amazon's low-Earth-orbit (LEO) satellite network is approaching 400 satellites in orbit, enough to begin initial commercial internet service before the end of 2026, CEO Andy Jassy said on the company's second-quarter earnings call.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
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<title>Auto chip demand recovers, but restocking remains elusive</title>
<pubDate>Fri, 31 Jul 2026 03:15:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD203/demand-sales-europe-automotive-inventory.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:317;104-420"&gt;Automotive chip sales are improving across Europe and the US, but major suppliers say global carmakers and their suppliers are still buying largely for immediate needs. A fuller inventory rebuild &#38;mdash; one that could affect prices and supply globally &#38;mdash; has yet to begin, leaving the recovery more cautious than expected.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<item>
<title>EU launches AI Gigafactories call to boost Europe's computing capacity</title>
<pubDate>Fri, 31 Jul 2026 03:05:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PR200/eu-europe-computing-power-capacity-data-development.html</link>
<description>The EU has opened a tender to build up to seven AI Gigafactories, a move that could reshape access to advanced computing for companies, researchers, and governments worldwide. The plan aims to expand Europe's AI capacity, attract private capital, and set standards for the development and use of frontier AI systems.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Rising smartphone prices are reshaping purchase plans in India</title>
<pubDate>Fri, 31 Jul 2026 03:03:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PR202/smartphone-financing-price-component-worldwide.html</link>
<description>Rising smartphone prices in India are changing how consumers plan purchases, with wider implications for brands, retailers, and buyers worldwide. Counterpoint said many shoppers are willing to adjust budgets, delay upgrades, or seek financing as component and manufacturing costs push up device prices.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Memory shortages deepen as prices climb into the second half of 2026</title>
<pubDate>Fri, 31 Jul 2026 03:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD211/2026-supply-chain-dram-demand-market.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:322;108-429"&gt;Memory shortages are tightening across the supply chain, and higher contract prices are set to ripple through global electronics markets. With DRAM lead times stretching and suppliers holding firm, buyers of servers, PCs, and mobile devices may face more cost pressure, even as end-market demand remains uneven worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices</title>
<pubDate>Fri, 31 Jul 2026 02:49:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL205/amazon-2026-capex-cost-component.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:137;115-251"&gt;Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: memory.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals</title>
<pubDate>Fri, 31 Jul 2026 02:43:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD213/equipment-duv-huawei-shanghai-smee.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:205;138-342"&gt;China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed immersion deep ultraviolet (DUV) system has entered mass production.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
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<item>
<title>Kioxia begins sampling 1TB 3D flash memory for AI devices</title>
<pubDate>Fri, 31 Jul 2026 02:38:57 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PR201/kioxia-technology-flash-3d-performance.html</link>
<description>Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage options for AI-enabled PCs and smartphones, while also underscoring broader supply-chain developments that may shape device performance for users worldwide.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>TSMC reportedly develops EMIB-like packaging to counter Intel</title>
<pubDate>Fri, 31 Jul 2026 02:31:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL207/tsmc-packaging-intel-competition-ai-chip.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:468;134-601"&gt;TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB), signaling that competition in AI semiconductor packaging is becoming as critical as chip manufacturing itself. The project, internally described as "EMIB-like," is being developed with Taiwanese substrate supplier Kinsus Interconnect Technology as TSMC seeks to broaden its packaging portfolio and address growing customer demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<item>
<title>AIT reassures Taiwan-US auto ties remain strong amid ongoing tariff debate</title>
<pubDate>Fri, 31 Jul 2026 02:22:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD210/taiwan-revenue-vehicle-supply-chain-policy.html</link>
<description>&lt;p class="P1" data-sourcepos="7:1-7:353;168-520"&gt;Taiwan and the US are deepening auto trade ties that could influence consumer choice, supply-chain resilience, and tariff policy beyond the island's borders. The latest comments from the American Institute in Taiwan come as Taiwan weighs lower car import duties, a move that could affect prices, jobs, tax revenue, and trade dynamics worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Electric Vehicles</category>
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<item>
<title>India's first telecom manufacturing zone to land in Madhya Pradesh</title>
<pubDate>Fri, 31 Jul 2026 02:17:14 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PR203/telecom-manufacturing-technology-industrial-testing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:317;106-422"&gt;India has moved to build a major telecom manufacturing hub in Gwalior, a step that could reshape supply chains, investment flows, and technology production for global markets. The project aims to reduce import dependence, support exports, and build an integrated base for telecom hardware, research, and development.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<item>
<title>Microsoft Windows price hikes add to PC cost pressure in 2026</title>
<pubDate>Fri, 31 Jul 2026 02:15:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD202/microsoft-windows-pc-price-processor-2026.html</link>
<description>PC makers are facing higher costs in 2026 as memory and processor prices rise and Microsoft lifts Windows operating system prices. Vendors said the latest Windows increase averaged in the double digits, depending on the processor, making it one of the larger annual adjustments in years.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AUO names current CFO president as Frank Ko steps down</title>
<pubDate>Fri, 31 Jul 2026 02:14:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD209/auo-management-president-business-development.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:227;103-329"&gt;AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's new president, following Frank Ko's resignation as president for personal reasons.</description>
<dc:creator>Scarlett Yu</dc:creator>
<category>Displays</category>
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<title>LG Electronics' strong 2Q26 underscores push into robotics and AI infrastructure</title>
<pubDate>Fri, 31 Jul 2026 02:13:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL202/lg-electronics-robotics-infrastructure-lg-sales.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:369;134-502"&gt;LG Electronics reported a strong second quarter, supported by record sales and one-time gains, while accelerating a shift toward robotics and artificial intelligence infrastructure. The company is increasingly framing its future around physical AI, even as it continues to rely on premium appliances, televisions, and vehicle electronics to support near-term earnings.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>AI server boom reshapes MLCC pricing as capacity shifts upmarket</title>
<pubDate>Fri, 31 Jul 2026 02:11:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL235/mlcc-ai-server-capacity-infrastructure-expansion.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:336;102-437"&gt;The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring demand for high-end multilayer ceramic capacitors (MLCCs) is prompting suppliers to reallocate production capacity and driving a new round of price increases that extend beyond AI-specific products.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>CHPT raises 2026 capex to NT$500M</title>
<pubDate>Fri, 31 Jul 2026 02:10:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD228/chpt-2026-capacity-demand-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:302;85-386"&gt;Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second quarter of 2026 was driven mainly by demand for AI and high-performance computing (HPC) applications. HPC-related products also jumped from 45.1% to 56.3% of revenue.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>ICT</category>
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<title>Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging</title>
<pubDate>Fri, 31 Jul 2026 02:10:38 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL227/semco-materials-glass-substrate-ai-chip-partnership.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:316;145-460"&gt;Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate etchants to include copper plating chemicals and chemical mechanical polishing (CMP) slurries, as the companies race to secure key materials for next-generation AI chip packaging.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Delta Electronics raises 2026 capex to NT$70B, sees AI-related sales topping 25% of total</title>
<pubDate>Fri, 31 Jul 2026 02:10:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD236/delta-electronics-2026-demand-infrastructure-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:196;149-344"&gt;Delta Electronics expects capital spending to rise to roughly NT$70 billion in 2026 from NT$46.1 billion in 2025, driven by growing demand from AI data centers and energy infrastructure projects.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>ICT</category>
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<item>
<title>Intel's rare Atom IP deal gives RosaicLabs a shortcut to custom x86 chips</title>
<pubDate>Fri, 31 Jul 2026 02:10:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL222/intel-atom-x86-ip-startup.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:219;107-325"&gt;Intel has granted stealth chip startup RosaicLabs access to parts of its Atom processor technology, potentially including register-transfer level code that would allow the company to develop customised x86-based chips.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260730vl222_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Intel CEO Lip-Bu Tan. Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply</title>
<pubDate>Fri, 31 Jul 2026 02:06:28 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD205/capacity-packaging-demand-tsmc-price.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:204;143-346"&gt;AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers raising prices as supply constraints spread across the industry.</description>
<dc:creator>Levi Li</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD205/capacity-packaging-demand-tsmc-price.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd205_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>China smartphone market and industry, 2Q 2026</title>
<pubDate>Fri, 31 Jul 2026 01:48:59 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260728RS400/china-smartphone-shipments-digitimes-2026.html?chid=2</link>
<description>China smartphone market and industry, 2Q 2026: 2H26 shipments to drop by over 30% YoY</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Personal Computing</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260728RS400/china-smartphone-shipments-digitimes-2026.html?chid=2</guid>
<media:content url="https://img.digitimes.com/newsshow/20260728rs400_files/21_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Apple targets AI subscription revenue as Cook exits and Ternus inherits next growth strategy</title>
<pubDate>Fri, 31 Jul 2026 01:31:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL204/apple-growth-revenue-manufacturing-apple-intelligence.html</link>
<description>Apple is positioning AI as the foundation of its next growth phase, combining a privacy-focused AI strategy with expanded US semiconductor sourcing to support future products and services. However, regulatory barriers in Europe and China could determine the pace at which the company monetizes its AI ecosystem globally.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:content url="https://img.digitimes.com/newsshow/20260731vl204_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple braces for "hundred-year flood" in component costs</title>
<pubDate>Fri, 31 Jul 2026 01:15:04 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL203/apple-flood-growth-hardware-business.html</link>
<description>Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier AI investment could squeeze margins in the coming quarter. The company said demand remains strong, even as costs and constraints intensify.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731VL203/apple-flood-growth-hardware-business.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731vl203_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook</title>
<pubDate>Fri, 31 Jul 2026 01:07:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL201/amazon-growth-investment-revenue-outlook.html</link>
<description>Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services. While the company lifted its capex forecast and projected third-quarter revenue slightly below market expectations, management said expanding infrastructure remains necessary to address sustained AI demand.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731VL201/amazon-growth-investment-revenue-outlook.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731vl201_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Apple beats quarterly estimates, but softer outlook and supply constraints temper optimism</title>
<pubDate>Fri, 31 Jul 2026 01:00:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731VL200/apple-revenue-iphone-growth-sales.html</link>
<description>Apple reported stronger-than-expected fiscal third-quarter results, driven by robust iPhone and Mac demand, but warned that supply constraints and rising memory costs would weigh on growth in the current quarter. The company forecast September-quarter revenue growth of 9%-11%, below Wall Street expectations, sending its shares lower in after-hours trading despite record June-quarter revenue and profit.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731VL200/apple-revenue-iphone-growth-sales.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731vl200_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy</title>
<pubDate>Fri, 31 Jul 2026 00:56:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL237/samsung-tsmc-hbm4-intel-earnings.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:458;117-574"&gt;The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single number. It was the shape of the customer list: cloud service providers, AI/HPC designers, an LPU maker ramping at 4nm, and talks with Broadcom. This is not the mobile-centric foundry business Samsung has run for a decade. It is the profile of a fab catching overflow from a leading-edge market that has run out of capacity.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730VL237/samsung-tsmc-hbm4-intel-earnings.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730vl237_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>German joint ventures in China fall below 50% utilization as imports weaken</title>
<pubDate>Fri, 31 Jul 2026 00:52:46 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260731PD200/2025-2026-market-capacity-vehicle.html</link>
<description>German auto joint ventures in China slipped below 50% capacity utilization in 2025 as weaker imported-car demand and the rapid rise of local brands reshaped the market. Mobility Global said the trend reflected broader pressure on German and Chinese automotive supply chains, with Chinese manufacturers also accelerating overseas expansion.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260731PD200/2025-2026-market-capacity-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260731pd200_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>WAIC 2026 unveils AIDV shift as physical AI gains ground</title>
<pubDate>Fri, 31 Jul 2026 00:02:41 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD229/2026-digitimes-waic-automotive-industry-chips.html</link>
<description>DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined vehicles (SDV) toward AI-defined vehicles (AIDV). This shows that physical AI is becoming the key driver of change as carmakers shift from adding functions to building full AI capabilities.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD229/2026-digitimes-waic-automotive-industry-chips.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry</title>
<pubDate>Fri, 31 Jul 2026 00:02:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD212/packaging-cowos-unimicron-tsmc-production.html</link>
<description>TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD212/packaging-cowos-unimicron-tsmc-production.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd212_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26</title>
<pubDate>Fri, 31 Jul 2026 00:01:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD215/ctsp-investment-spil-packaging-water.html</link>
<description>The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026, signaling a potential turning point for a development that has struggled for nearly two decades to establish an industrial foothold.</description>
<dc:creator>Willis Ke</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD215/ctsp-investment-spil-packaging-water.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd215_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>UMC raises capex to US$2B, eyes AI SiPh</title>
<pubDate>Fri, 31 Jul 2026 00:01:07 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD223/umc-capex-siph-demand-2026.html</link>
<description>UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed its first AI business target, forecasting AI-related revenue of about US$300 million in 2026 and aiming to reach US$1 billion within the next three years.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD223/umc-capex-siph-demand-2026.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd223_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>ams OSRAM's Micro LED links trade speed for scale in AI data centres</title>
<pubDate>Fri, 31 Jul 2026 00:00:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD226/data-copper-technology-performance-automotive.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:316;115-430"&gt;ams OSRAM is developing Micro LED-based optical data links for AI data centres, positioning the technology as a high-density, scalable alternative to copper interconnects. To support adoption, the company has built a high-precision simulation platform that evaluates Micro LED optical links under real AI workloads.</description>
<dc:creator>Levi Li</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD226/data-copper-technology-performance-automotive.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd226_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>TAIONE foundation launches with NT$300 million to build Taiwan's open source AI push</title>
<pubDate>Fri, 31 Jul 2026 00:00:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD233/taiwan-open-source-talent-governance-technology.html</link>
<description>The TAIONE Open Source Foundation was officially launched on the 30th and said it will deploy NT$300 million in private-sector resources over the next three years to advance open-source AI engineering, talent development, sovereign AI, and enterprise adoption. The move was framed as a way to fill a gap in Taiwan's AI strategy as global competition shifts from chips and compute into models, toolchains, software ecosystems, and standards.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD233/taiwan-open-source-talent-governance-technology.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd233_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Shield AI and Thunder Tiger demo autonomous USV swarm in Taiwan</title>
<pubDate>Thu, 30 Jul 2026 23:59:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD218/taiwan-maritime-vehicle.html</link>
<description>Shield AI and Thunder Tiger Group completed their first autonomous maritime unmanned vehicle swarm demonstration in Taiwan, combining Shield AI's Hivemind AI system with Thunder Tiger's SeaShark unmanned surface vehicles. The test, conducted in Pingtung, showed multiple boats carrying out coordinated intelligence, surveillance, and reconnaissance (ISR) missions without direct human control.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD218/taiwan-maritime-vehicle.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd218_files/4_r.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: Shield AI]]></media:description>
</media:content></item>
<item>
<title>US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%</title>
<pubDate>Thu, 30 Jul 2026 23:59:36 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD222/tsmc-chairman-taiwan-electronics-manufacturing.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:458;134-591"&gt;TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's existing US$165 billion investment in the country. The announcement has sparked widespread speculation, with some viewing the move as bowing to pressure from the US government, while others see it as a carefully weighted decision balancing customer demand in the US with Taiwan's national security concerns.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD222/tsmc-chairman-taiwan-electronics-manufacturing.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd222_files/2_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Qualcomm, MediaTek set Sept flagship SoC showdown</title>
<pubDate>Thu, 30 Jul 2026 23:59:16 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD231/qualcomm-mediatek-flagship-soc-smartphone.html</link>
<description>Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and upgraded chips at the same time to meet different customer needs. Supply chain sources say the two chipmakers will no longer rely on a single product for flagship phones in 2026, but instead offer two separate specifications.</description>
<dc:creator>Lily Hess</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD231/qualcomm-mediatek-flagship-soc-smartphone.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd231_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Chang Wah sees broadening demand recovery and higher margins in 2Q26</title>
<pubDate>Thu, 30 Jul 2026 23:58:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD225/cwtc-recovery-business-demand-revenue.html</link>
<description>Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening for global customers. The Taiwan-based lead-frame maker also expects third-quarter sales to keep rising, underscoring improved momentum in semiconductors and related end markets.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD225/cwtc-recovery-business-demand-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd225_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout</title>
<pubDate>Thu, 30 Jul 2026 23:58:30 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD227/demand-ai-server-capacity-dynapack-revenue.html</link>
<description>&lt;p class="P1" data-sourcepos="5:1-5:177;124-300"&gt;Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according to Dynapack president Chang Chung-hsing.</description>
<dc:creator>Levi Li</dc:creator>
<category>Sustainability</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD227/demand-ai-server-capacity-dynapack-revenue.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd227_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Coretronic drone unit shifts to four fronts amid procurement delay</title>
<pubDate>Thu, 30 Jul 2026 23:57:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260729PD229/coretronic-circ-drone-development.html</link>
<description>Coretronic said its robotics subsidiary, Coretronic Intelligent Robotics (CIRC), is focusing on four development priorities as a large domestic government drone procurement plan remains unapproved, leaving suppliers facing a demand gap. The company said the strategy is designed to reduce the impact of uncertainty over the government buying schedule on its drone business.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Aerospace</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260729PD229/coretronic-circ-drone-development.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260729pd229_files/1_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Automakers shift to larger in-car displays as smaller center screens decline</title>
<pubDate>Thu, 30 Jul 2026 23:56:40 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD203/automakers-demand-2026-technology-display.html</link>
<description>Global automakers are moving toward larger, more integrated cockpit displays as in-car screens become the main interface between drivers, passengers, and vehicles. According to &lt;em&gt;Counterpoint Research&lt;/em&gt;, center stacks, rear-seat entertainment systems, and head-up displays are all expanding, while traditional sub-9-inch center displays continue to lose ground.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Electric Vehicles</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD203/automakers-demand-2026-technology-display.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd203_files/1_2b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines</title>
<pubDate>Thu, 30 Jul 2026 23:56:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD202/samsung-dram-capacity-fab-nand.html</link>
<description>Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site. By the end of 2026, general-purpose DRAM capacity is expected to rise about 15%.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD202/samsung-dram-capacity-fab-nand.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd202_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
</media:content></item>
<item>
<title>CSCC develops SiC crucibles to strengthen Taiwan&#38;rsquo;s AI data center supply chain</title>
<pubDate>Thu, 30 Jul 2026 23:56:06 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD201/csc-taiwan-sic-graphite-12-inch.html</link>
<description>China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce Taiwan manufacturers&#38;rsquo; reliance on overseas suppliers. The effort comes as demand rises for 800V data center power management and power devices tied to AI infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD201/csc-taiwan-sic-graphite-12-inch.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd201_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
</media:content></item>
<item>
<title>Roborock sees AI and niche features driving robot vacuum growth</title>
<pubDate>Thu, 30 Jul 2026 23:55:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730PD200/robot-growth-market-niche-europe.html</link>
<description>Roborock said the robot vacuum market still had room to expand as competition intensified across China, Europe, the US and Southeast Asia. The company outlined two main growth paths for the category as adoption rose and market penetration remained relatively low in many regions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
<guid isPermaLink="true">https://www.digitimes.com/news/a20260730PD200/robot-growth-market-niche-europe.html</guid>
<media:content url="https://img.digitimes.com/newsshow/20260730pd200_files/3_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: DIGITIMES]]></media:description>
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<item>
<title>OpenAI's ChatGPT about to reach 1B weekly users as AI rivalry heats up</title>
<pubDate>Thu, 30 Jul 2026 09:41:45 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260730VL228/openai-chatgpt-growth-claude-revenue.html</link>
<description>OpenAI's chatbot is about to reach a new milestone of 1 billion weekly users, according to internal company data. Although this target was intended to be hit by the end of 2025, it nevertheless remains among the fastest-growing online applications to hit that many users in the short time since the startup was founded.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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