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<title>DIGITIMES Asia: News and Insight of the Global Supply Chain</title>
<link>https://www.digitimes.com</link>
<description>A platform bridging customers and suppliers</description>
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<copyright>Copyright 2026 DIGITIMES Inc.</copyright>
<lastBuildDate>Fri, 17 Apr 2026 06:00:07 GMT</lastBuildDate>
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<title>OpenAI reportedly to spend over US$20 billion on Cerebras chips, reducing reliance on Nvidia</title>
<pubDate>Fri, 17 Apr 2026 04:41:50 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL213/openai-cerebras-ai-server-capacity-nvidia.html</link>
<description>&lt;p class="P1" data-start="214" data-end="620"&gt;OpenAI has reportedly entered into a multi-year agreement to pay chip startup Cerebras Systems more than US$20 billion for AI server capacity, according to a report by &lt;em data-start="429" data-end="446"&gt;The Information&lt;/em&gt;. The deal represents an aggressive move by the ChatGPT creator to diversify its hardware supply chain and mitigate its reliance on Nvidia.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Foxconn Industrial Internet surpasses Huawei in 2025 revenue, driven by AI servers</title>
<pubDate>Fri, 17 Apr 2026 04:34:10 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD220/fii-ai-server-industrial-manufacturing-revenue.html</link>
<description>Foxconn's industrial arm, Foxconn Industrial Internet (FII), has ridden the AI server boom to become a revenue leader, illustrating to global manufacturers how advanced production capability and supply&#38;#8209;chain control can translate surging AI demand into market share, influence capacity-location decisions, and strengthen bargaining power across international technology supply chains and investment strategies.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>China outlines AI-led investment push and industrial upgrading under new five-year plan framework</title>
<pubDate>Fri, 17 Apr 2026 04:25:58 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL215/china-ai-infrastructure-investment-industrial-policy.html</link>
<description>China is preparing a new round of large-scale investment and industrial upgrading centered on AI infrastructure, advanced manufacturing, and strategic emerging industries, according to a briefing by the National Development and Reform Commission (NDRC) at a State Council Information Office press conference on April 17.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: China's State Council Information Office]]></media:description>
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<title>China wafer maker NSIG lifts revenue on 300mm momentum</title>
<pubDate>Fri, 17 Apr 2026 04:22:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL209/nsig-300mm-revenue-wafer-growth.html</link>
<description>National Silicon Industry Group (NSIG) reported full-year 2025 revenue growth driven by higher 300mm wafer shipments, though pricing pressure and high fixed costs weighed on margins.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>TSMC remains top choice for European AI chip startups amid capacity scramble</title>
<pubDate>Fri, 17 Apr 2026 04:20:18 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD223/ai-chip-capacity-tsmc-europe-chips.html</link>
<description>European efforts to advance sovereign AI and chip autonomy are gaining momentum, but European AI chip startups say they still primarily rely on TSMC for high-performance computing chips. With the European Semiconductor Manufacturing Company (ESMC) yet to offer advanced process technologies, most high-end chips from Europe are produced within Taiwan's semiconductor ecosystem.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>TSMC revises advanced process and packaging strategy</title>
<pubDate>Fri, 17 Apr 2026 04:11:31 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD218/tsmc-fab-3nm-packaging-production.html</link>
<description>TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue. New 3nm production capacities will come online sequentially in Taiwan, the US, and Japan between 2027 and 2028. Wei also revealed plans for CoPoS for the first time.</description>
<dc:creator>Charlene Chen</dc:creator>
<category>Semiconductors</category>
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<title>Sivers and Jabil partner on 1.6T optics to tackle AI power demands</title>
<pubDate>Fri, 17 Apr 2026 04:10:56 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL210/jabil-optics-transceiver-module-partnership-manufacturing.html</link>
<description>Sivers Semiconductors and Jabil have announced a collaboration to develop a 1.6T optical transceiver module aimed at addressing the growing energy demands of AI data center interconnects. As hyperscale operators face increasing power constraints, the partnership is positioned as a high-efficiency solution for next-generation infrastructure.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Sivers Semiconductors]]></media:description>
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<title>Taiwan's OSAT expansion could tighten global test capacity and raise costs</title>
<pubDate>Fri, 17 Apr 2026 04:04:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD217/taiwan-osat-capacity-2026-expansion.html</link>
<description>Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter advanced-test capacity, higher prices, and accelerated investment as Taiwanese OSATs boost capital spending and capacity, significantly affecting chipmakers and device makers worldwide into 2026 and beyond.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<title>The tumor chip from Taiwan that catches what mouse trials miss</title>
<pubDate>Fri, 17 Apr 2026 04:03:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416VL219/startup-taiwan-mouse.html</link>
<description>A year-old Hsinchu startup is heading to Silicon Valley. Fluidiconic Bio will join four other Taiwanese companies at the Plug and Play Silicon Valley Summit this May, pitching a high-throughput tumor-on-a-chip platform its founders believe can do what decades of animal testing cannot: accurately predict how a cancer drug behaves inside a human tumor.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: FluidIconic]]></media:description>
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<title>Apple highlights record progress in recycled materials across products</title>
<pubDate>Fri, 17 Apr 2026 04:03:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL211/apple-materials-2030-2025-supply-chain.html</link>
<description>Apple has announced what it describes as its highest-ever use of recycled materials across its product lineup, underscoring continued efforts to reduce environmental impact and move toward a carbon-neutral supply chain by 2030, according to its latest newsroom update.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Credit: Apple]]></media:description>
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<title>Intel expands foundry push with Samsung executive hire</title>
<pubDate>Fri, 17 Apr 2026 03:59:55 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL208/intel-samsung-manufacturing-talent.html</link>
<description>Intel, which is working to scale its outsourced chip manufacturing business, has hired Samsung Electronics executive Shawn Han to strengthen its foundry operations and customer engagement strategy, according to reporting from Bloomberg and Oregon Live.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Shawn Han's LinkedIn page]]></media:description>
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<title>Analysis: ASML lifts 2026 guidance on strong EUV demand</title>
<pubDate>Fri, 17 Apr 2026 03:57:44 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD214/asml-2026-demand-euv-guidance.html</link>
<description>ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company announced plans to expand its extreme ultraviolet (EUV) manufacturing capacity to meet strong demand expected in 2027. The updated outlook suggests stronger momentum in the second half of 2026.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>ASML extends Low NA EUV to 2031, ramps up High NA production</title>
<pubDate>Fri, 17 Apr 2026 03:33:02 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD203/asml-euv-production-demand-2026.html</link>
<description>ASML's confirmation that memory-chip demand underpinned its stronger-than-expected results for the first quarter of 2026 &#38;mdash; along with its updated EUV roadmaps &#38;mdash; has broad implications for global chip supply and manufacturing capacity.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Semiconductors</category>
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<media:content url="https://img.digitimes.com/newsshow/20260417pd203_files/2_b.jpg" type="image/jpeg" expression="full">
<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>China automotive AI chipmaker Horizon Robotics targets EV cost cuts with integrated chip</title>
<pubDate>Fri, 17 Apr 2026 03:28:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD219/horizon-robotics-automotive-chips-ddr-cost.html</link>
<description>&lt;p class="P1" data-start="0" data-end="255"&gt;Rising DDR memory prices are increasing cost pressure across automotive electronics, pushing China-based automotive AI chipmaker Horizon Robotics to introduce an integrated chip architecture aimed at reducing system complexity and bill-of-materials costs.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Horizon Robotics]]></media:description>
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<item>
<title>Japan backs Sony image sensor expansion with up to US$380 million subsidy</title>
<pubDate>Fri, 17 Apr 2026 03:15:01 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL207/sony-sensor-government-expansion-automotive.html</link>
<description>Japan has announced government support for Sony's image sensor expansion project in Kumamoto, underscoring the strategic importance of semiconductor supply chains for artificial intelligence (AI) and automotive applications.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: AFP]]></media:description>
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<title>Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand</title>
<pubDate>Fri, 17 Apr 2026 02:51:53 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL205/tongfu-profit-packaging-amd-demand.html</link>
<description>&lt;p class="P1" data-start="138" data-end="343"&gt;Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the global semiconductor packaging supply chain alongside key customer AMD.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Yicai]]></media:description>
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<title>Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift</title>
<pubDate>Fri, 17 Apr 2026 02:34:39 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD218/tesla-intel-partnership-chips-fab-tsmc.html</link>
<description>&lt;p class="P1" data-start="276" data-end="461"&gt;Tesla CEO Elon Musk has aligned his TeraFab megafab initiative with Intel, in a move that had been signaled in recent months.</description>
<dc:creator>Sherri Wang</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: Intel]]></media:description>
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<title>EMS Watch: Lens Technology's earnings shock highlights strain across Apple supply chain</title>
<pubDate>Fri, 17 Apr 2026 02:24:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL203/lens-technology-earnings-apple-supply-chain-electronics-demand.html</link>
<description>&lt;p class="P1" data-start="82" data-end="328"&gt;China's consumer electronics supply chain is facing mounting pressure, as Lens Technology posted a sharp earnings downturn that triggered a market sell-off and raised broader concerns about industry demand and cost dynamics.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Communications</category>
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<media:description type="plain"><![CDATA[Credit: Lens Technology]]></media:description>
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<title>Tesla AI5 reaches tape-out; SK Hynix memory spotted in early sample</title>
<pubDate>Fri, 17 Apr 2026 02:19:29 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417VL202/tesla-ic-design-development-sk-hynix.html</link>
<description>&lt;p class="P1" data-start="129" data-end="407"&gt;Tesla has reached the tape-out stage for its next-generation AI chip, AI5, marking a milestone in its in-house semiconductor development and offering early signals on memory supplier positioning and demand for low-power DRAM.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<media:description type="plain"><![CDATA[Credit: @elonmusk]]></media:description>
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<title>Foxconn shifts US plant from simulation to operation with AI-driven factory setup</title>
<pubDate>Fri, 17 Apr 2026 02:09:25 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD201/foxconn-plant-ai-server-manufacturing-robotics-equipment.html</link>
<description>Foxconn's US AI factories could reshape global electronics supply chains by accelerating US-based AI server production and offering a replicable smart factory model for overseas sites. The company's digital twin and data-driven approach promise faster plant construction, higher yields, and improved equipment and energy efficiency worldwide.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>Nio cuts Nvidia reliance with in-house chips, targets lower EV costs</title>
<pubDate>Fri, 17 Apr 2026 01:56:21 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD212/nio-automotive-chips-self-sufficiency-cost-nvidia.html</link>
<description>&lt;p class="P1" data-start="317" data-end="452"&gt;Rising cost pressure is pushing China's smart EV makers to pivot from scale expansion to efficiency and cost discipline.</description>
<dc:creator>Levi Li</dc:creator>
<category>Electric Vehicles</category>
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<media:description type="plain"><![CDATA[Credit: Nio]]></media:description>
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<title>CPU shortage more acute than memory; industry awaits Intel 18A yield improvement</title>
<pubDate>Fri, 17 Apr 2026 01:51:51 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260417PD200/cpu-intel-pc-amd-industrial.html</link>
<description>A global CPU shortage is disrupting PC and industrial-computing supply chains, as processors are out of stock even at premium prices, while memory is limited but purchasable. The scarcity threatens notebook and industrial PC availability worldwide and may persist for some time until Intel's 18A process yields improve, industry sources warn.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>ICT</category>
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<title>TSMC chairman C.C. Wei denies customer favoritism regarding tight 1Q26 capacity</title>
<pubDate>Fri, 17 Apr 2026 01:34:19 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD245/tsmc-capacity-demand-taiwan.html</link>
<description>TSMC delivered an above-expectations financial performance in the first quarter of 2026 and remains optimistic about continued strong demand for advanced process technologies entering the second quarter. Regarding tight capacity constraints, Chairman C.C. Wei stated that while capacity remains tight, the company is actively expanding new fabs to meet demand. However, he noted that building new facilities takes time, so supply will remain limited in the short term. Still, the company will continue efforts to increase capacity to support customer demand and will not deliberately select or favor any particular customer.</description>
<dc:creator>Eifeh Strom</dc:creator>
<category>Semiconductors</category>
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<title>Meta's Manus deal further exacerbates Chinese startups' exodus to Singapore and US</title>
<pubDate>Thu, 16 Apr 2026 23:46:20 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416VL208/meta-acquisition-startup-2026-technology.html</link>
<description>The US$2 billion acquisition of AI startup Manus by Meta Platforms has sent shockwaves through the Chinese tech ecosystem, exposing the fragility of the "Singapore-washing" strategy that many founders once relied on to sidestep geopolitical crossfires. The deal, which was finalized in early 2026, triggered an aggressive response from Beijing, forcing a sweeping reallocation of resources among startups operating in the gray zone between Chinese origins and global ambitions.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>ICT</category>
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<title>Interview: Semidynamics expands from SoC to rack-level solutions, targeting memory-intensive AI inference</title>
<pubDate>Thu, 16 Apr 2026 23:45:43 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD223/ai-chip-soc-startup-ai-inference.html</link>
<description>Spain-based AI chip startup Semidynamics has recently seen a wave of positive developments. Its first chip, fabricated on TSMC's 3nm process, has successfully completed tape-out, and just weeks ago, the company secured an investment commitment from SK Hynix. Both significantly enhance its operational credibility and global visibility. CEO Roger Espasa stated that the company's proprietary Gazzillion technology is a specialized memory subsystem designed to address one of AI's most pressing challenges today: inefficient memory utilization, which has led to persistent supply constraints.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Visionox starts 8.6G AMOLED tool install, pushes FMM-free OLED</title>
<pubDate>Thu, 16 Apr 2026 23:45:24 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD231/visionox-amoled-display-technology-manufacturing.html</link>
<description>China-based display maker Visionox is stepping up its push into next-generation AMOLED manufacturing, announcing on April 15 a key milestone at its 8.6-generation production line in Hefei. The first lithography system has been moved into the main cleanroom, marking a transition from construction to equipment installation and process integration, and laying the groundwork for initial panel output and mass production.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Displays</category>
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<title>SK Hynix invests in RISC-V chip designer Semidynamics</title>
<pubDate>Thu, 16 Apr 2026 23:44:52 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416VL221/sk-hynix-risc-v-design-investment-efficiency.html</link>
<description>&lt;p class="P1" data-start="285" data-end="453"&gt;SK Hynix has invested in Semidynamics, a Spanish fabless chip designer, as part of a push to expand its presence in the artificial intelligence (AI) semiconductor ecosystem.</description>
<dc:creator>DIGITIMES</dc:creator>
<category>Semiconductors</category>
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<title>Musk's foundry push forces chipmakers to rethink customer relationships</title>
<pubDate>Thu, 16 Apr 2026 23:44:00 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD239/elon-musk-production-tesla-chipmakers-competition.html</link>
<description>Elon Musk has said that the computing demands of Tesla, xAI, and SpaceX will far exceed current semiconductor supply capacity, arguing that existing production can meet only a fraction of future needs.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan's TPK profit jumps more than 20-fold on investment gains and chip exposure</title>
<pubDate>Thu, 16 Apr 2026 23:43:22 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD238/tpk-holding-profit-investment-2026-ilitek.html</link>
<description>TPK Holding reported a sharp rebound in profitability for the first quarter of 2026, driven by new semiconductor investments and favorable one-off gains.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
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<title>With chip limits near, focus shifts to packaging and integration</title>
<pubDate>Thu, 16 Apr 2026 23:42:54 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260415PD220/packaging-materials-performance.html</link>
<description>&lt;p class="P1" data-start="144" data-end="530"&gt;As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental constraint: the slowing of Moore's Law. Increasingly, engineers are turning their attention not just to chip design, but to system integration and advanced packaging, areas now seen as critical to sustaining performance gains.</description>
<dc:creator>Elaine Chen</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan paves the way for stablecoin adoption as landmark law advances amid global trends</title>
<pubDate>Thu, 16 Apr 2026 23:42:08 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260415PD224/taiwan-cryptocurrency-finance.html</link>
<description>Taiwan is edging closer to a regulated stablecoin ecosystem, with policymakers signaling support for fiat-linked digital assets and advancing landmark legislation that could reshape the island's virtual asset industry.</description>
<dc:creator>Willis Ke</dc:creator>
<category>ICT</category>
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<media:description type="plain"><![CDATA[Financial Supervisory Commission chair Jin-lung Peng. Credit: DIGITIMES]]></media:description>
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<title>EU Chips Act 2.0 expected by late May, with stronger domestic focus</title>
<pubDate>Thu, 16 Apr 2026 23:41:47 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD214/eu-eu-chips-act-2025-competition-europe.html</link>
<description>Since early 2025, the European Union (EU) has been actively shaping its next-generation semiconductor strategy. Recent reports indicate that the EU Chips Act 2.0 is set to be officially announced on May 27. During the drafting process, the Catalonia regional government in Spain, along with industry stakeholders, has contributed several recommendations.</description>
<dc:creator>Emily Kuo</dc:creator>
<category>Semiconductors</category>
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<title>Taiwan and Japan solidify lead in transmission component market for humanoid robots</title>
<pubDate>Thu, 16 Apr 2026 23:41:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD212/transmission-component-robot-market-demand.html</link>
<description>The rise of new hardware designs for humanoid robots has created fresh opportunities across the supply chain, with linear actuators &#38;mdash; which act as the muscles of robots that mimic human anatomy &#38;mdash; now becoming key components in this evolution. Amid the ongoing reshuffling in the transmission component supply chain, the consensus among industry players is that Taiwanese and Japanese manufacturers are unlikely to yield their longtime dominant position in the field.</description>
<dc:creator>Kevin Wang</dc:creator>
<category>ICT</category>
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<title>J&#38;amp;V Energy Technology's Greenet to list on OTC in May 2026 as it pursues rapid capacity expansion</title>
<pubDate>Thu, 16 Apr 2026 23:40:42 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD209/green-energy-demand-development-market-2026.html</link>
<description>J&#38;amp;V Energy Technology's Greenet plans to list on the OTC market in May 2026 and is fully booked, signaling a rapid global push into green power as it seeks to scale to 800-850 MW by the end of 2026, secure long-term contracts, and compete in a future 40 billion kWh market.</description>
<dc:creator>Jingyue Hsiao</dc:creator>
<category>Sustainability</category>
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<title>TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last</title>
<pubDate>Thu, 16 Apr 2026 09:21:27 GMT</pubDate>
<link>https://www.digitimes.com/news/a20260416PD243/tsmc-groq-samsung-nvidia-2026.html</link>
<description>TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development &#38;mdash;a remark that stopped short of naming Nvidia&#38;mdash; but that supply chain observers widely read as signaling TSMC's intent to compete for the inference chip business currently manufactured by Samsung.</description>
<dc:creator>Joseph(C) Chen</dc:creator>
<category>Semiconductors</category>
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