1785 news items tagged equipment
Semiconductor equipment billings surge 30% in 3Q20, says SEMIThursday 3 December 2020
Global semiconductor equipment billings increased 30% on year and 16% sequentially to US$19.4 billion in the third quarter of 2020, according to SEMI.
TSMC to roll out 3nm Plus process in 2023Wednesday 2 December 2020
TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.
Symtek to sustain strong equipment shipments for semiconductor clientsTuesday 1 December 2020
Taiwan-based automation equipment maker Symtek Automation Asia saw its October revenues shoot up 177.55% on year to NT$307 million (US$10.75 million), thanks to shipments to clients...
Sputtering equipment supplier UVAT lands new orders for panel-level packagingMonday 30 November 2020
Taiwan-based UVAT Technology with its sputtering and etching equipment has obtained new orders for fan-out panel-level packaging, as well as orders for the manufacture of high-end...
C Sun expects advanced IC packaging equipment to drive growthFriday 27 November 2020
Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate),...
O-RAN equipment market revving upFriday 27 November 2020
More Taiwan-based IT companies, including Quanta Cloud Technology, Wistron and Accton Technology, are gearing up to develop network devices and solutions for the emerging 5G open...
Acter posts profit and margin declines in 1Q-3QFriday 20 November 2020
Cleanroom and turnkey equipment provider Acter saw both its gross margin and net profit decline on year in the first three quarters of 2020, due to rising operating expenses and raw...
Semiconductor equipment billings slip in OctoberFriday 20 November 2020
October billings among North American manufacturers of semiconductor production equipment slipped 3.7% sequentially but stayed above US$2 billion, according to SEMI.
Accton AI accelerator card shipments to take off in 2021Friday 20 November 2020
Network device maker Accton Technology has seen shipments of its AI accelerator cards begin to pick up momentum, expecting related revenues to grow by double-digit in 2021.
Wafer capacity by feature size shows strongest growth at sub-10nmWednesday 18 November 2020
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Quanta expands investments in Thailand subsidiaryMonday 16 November 2020
Quanta Computer has announced an investment of THB2 billion (US$70.08 million) in QMB, a subsidiary in Thailand, to fund its purchases of production equipment.
Winbond sees profit fall in 3Q20Monday 16 November 2020
Specialty DRAM and flash memory maker Winbond Electronics has reported net profits fell 53.3% sequentially and 44% on year to NT$331 million (US$11.6 million) in the third quarter...
TSMC places big EUV equipment orders for 2021Friday 13 November 2020
TSMC has already placed EUV lithography equipment orders with ASML for 2021 for at least 13 sets, according to industry sources.
Equipment makers see rising revenue proportions from semiconductor sectorThursday 12 November 2020
Manufacturing equipment makers have seen rising contributions to revenues from wafer foundry and IC packaging/testing service providers.
Driver IC backend firms see clear order visibility through 1H21Tuesday 10 November 2020
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
Zhen Ding enters high-frequency rigid PCB line via acquiring BoardTekThursday 5 November 2020
Taiwan's PCB leader Zhen Ding Technology has completed its acquisition of local peer BoardTek Electronics as a wholly-owned subsidiary, which specializes in high-frequency rigid boards...
EMC to invest CNY800 million to expand capacity in ChinaMonday 2 November 2020
Copper clad laminate (CCL) maker Elite Material (EMC) has disclosed plans to invest about CNY800 million (US$119.6 million) to build additional capacity at its factory site in China's...
MediaTek announces chipmaking equipment purchasesMonday 2 November 2020
Mobile SoC specialist MediaTek has announced over NT$1 billion (US$35 million) worth of fab tools that the fabless chipmaker will spend for its chip production.
PSI, Kinik secure stable orders from TSMCFriday 30 October 2020
Taiwan-based Phoenix Silicon International (PSI) and Kinik, providers of silicon wafer reclaim services, have both obtained orders from TSMC for 5nm and more advanced process manufacturing,...
C Sun aims to raise revenue proportion for IC packaging equipment in 2021Wednesday 28 October 2020
C Sun aims to increase the proportion of consolidated revenues for advanced IC packaging equipment to 30% in 2021, according to company chairman Morris Liang.
NOR flash likely to be in short supply in 2021, says Macronix chairmanTuesday 27 October 2020
The global supply of NOR flash memory will fall short of demand in 2021 if trade tensions between the US and China persist, according to Macronix International chairman Miin Wu.
Samsung reportedly to accelerate advanced foundry technology developmentTuesday 27 October 2020
Samsung Electronics is reportedly looking to advance its partnership with EUV fab tool vendor ASML, aiming to accelerate the development of its advanced 5nm and 3nm foundry process...
North American semi equipment industry billings post another growthMonday 26 October 2020
September billings among North American manufacturers of semiconductor production equipment registered sequential growth for the third consecutive month.
Driver ICs tight supply: Q&A with Chipbond chairman FJ WuMonday 26 October 2020
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
Equipment makers to gain from ABF substrate capacity expansionsFriday 23 October 2020
Taiwan-based equipment makers including Csun Manufacturing and Gallant Precision Machining (GPM) expect strong demand from domestic IC substrates makers now all gearing up to build...
Foxconn green-tunnel datacenter
Photo: Ninelu Tu, DIGITIMES, Friday 11 July 2014
Lantiq GEMINAX XXS V3 chipset
Photo: Company, Wednesday 8 December 2010
FormFactor 300mm full-wafer test solution for DRAM
Photo: Company, Friday 11 December 2009