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Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 29 October 2025
CPCA Show Plus 2025: China's PCB industry rallies around the AI boom
The CPCA Show Plus 2025, one of Asia's largest printed circuit board (PCB) exhibitions, opened on October 28, 2025, in Shenzhen, drawing hundreds of global electronics manufacturers...
Wednesday 29 October 2025
Samsung reorganizes memory line by accelerating HBM4 production at P4 plant
Samsung Electronics is transforming its Pyeongtaek Campus Line 4 (P4) in South Korea into a manufacturing base focusing on HBM4 production. Analysts indicate that Samsung is increasing...
Tuesday 28 October 2025
Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26
Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
Tuesday 28 October 2025
SK Hynix M15X completion expected by end of 2025
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
Tuesday 28 October 2025
Chunghwa Precision, Yokowo sign investment deal to deepen Taiwan-Japan testing industry ties
Taiwanese semiconductor test interface leader Chunghwa Precision Test Tech (CHPT) announced that it has signed an investment agreement with Japan's Yokowo. Under the agreement, both...
Tuesday 28 October 2025
Winbond boosts memory production capex over fivefold amid tight supply
Taiwan-based memory manufacturer Winbond Electronics Corp. has approved a capex budget of NT$35.509 billion (US$1.16 billion) to restructure its memory production capacity in response...
Monday 27 October 2025
LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
Monday 27 October 2025
Topco accelerates overseas push to align with clients’ new fab investments
Geopolitical tensions are creating turbulence in global trade. According to TSMC founder Morris Chang, globalization is dead. Semiconductor material distributor Topco Scientific also...
Monday 27 October 2025
Samsung and Hanmi thaw ties at SEDEX, eye HBM4 collaboration
Longtime rivals Samsung Electronics and Hanmi Semiconductor may be wiping the slate clean and possibly teaming up after South Korea's 27th Semiconductor Exhibition (SEDEX...
Friday 24 October 2025
TSMC's Hou confident rare earth reserves stable in short term, moves to reduce reliance on China
With the advent of the AI era and the concurrent influence of geopolitical developments, Taiwan's semiconductor industry continues to play a pivotal role in the global supply chain...
Thursday 23 October 2025
China's polarizer push leaves Taiwan rivals fighting for survival
China's Shenzhen Sapo Photoelectric will invest CNY1.334 billion (US$186 million) to build a new LCD and OLED polarizer production line in Shenzhen, worsening an already oversupplied...
Thursday 23 October 2025
Taiwanese firms poised to lead TGV process equipment amid semiconductor-PCB integration
Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...
Thursday 23 October 2025
China's YMTC aims for fully local chip production, but can it deliver?
China's memory chipmaker YMTC has unveiled plans for its Phase III fab with a registered capital of CNY20.72 billion (approx. US$2.91 billion). Market sources say the project targets...
Thursday 23 October 2025
Fortune Electric adapts as US tariffs reshape industry
US tariffs have gradually become internalized as part of corporate order costs amid the ongoing tariff war, according to Ted Hsu, president of heavy electrical equipment maker Fortune...