To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing...
The annual SEMICON West relocated for the first time to Phoenix in 2025, the new hub of US chip manufacturing. Compared to previous years, the event saw a 45% increase in exhibitors,...
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
SEMICON West 2025, one of the major semiconductor exhibitions, is being held in Phoenix, Arizona. Topco Scientific is participating alongside fourteen partners from Japan and Taiwan,...
LG Electronics is accelerating its deployment in the HBM equipment business after reportedly investing in hybrid bonding development. With Hanmi Semiconductor dominating the market...
Taiwan's semiconductor and panel industries were once two of the government-favored sectors with technological advantages. However, China's rapid rise in the panel industry, driven...
The launch for the next-generation optical communication infrastructure, IOWN (Innovative Optical and Wireless Network), led by Japanese telecom group NTT, is scheduled for 2026....
Japan will expand export controls to cover general-purpose machine tools, integrated circuits, drones, radar, navigation, and testing equipment, requiring companies to verify potential...
PlayNitride is positioning its mass transfer process equipment as a key "microLED 3D printer" to accelerate mass production and expand applications beyond current panel customers...
ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
OpenAI has entered into a strategic cooperation agreement with Hitachi, focusing on power distribution and cooling technologies for artificial intelligence (AI) data centers. The...
With progress in visa negotiations between the South Korean and the US governments, LG Energy Solution (LGES) is poised to accelerate construction and operations at its US factory.
Huatie announced the termination of a CNY3.69 billion(US$518.3 million) five-year GPU cloud computing service contract with an undisclosed Hangzhou company after zero deliveries in...
US sanctions are taking a toll on one of China's top chipmakers, Yangtze Memory Technologies (YMTC), as its share of the global NAND flash memory market has slipped below 5%.
