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Thursday 1 October 2026
Machvision's dual-track strategy enters early growth as semiconductor, substrate visibility reaches 3 years
Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise....
Thursday 1 October 2026
Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Thursday 1 October 2026
Applied Materials and Kioxia team up on AI-era memory tech
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
Thursday 1 October 2026
SG Semiconductor builds brand and talent for Singapore chip industry
Singapore has launched the SG Semiconductor brand to strengthen its semiconductor profile and attract talent, aiming to create a globally recognizable industry identity beyond its...
Thursday 1 October 2026
How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
Wednesday 30 September 2026
China's battery race enters post-scale era: Beijing shifts focus to solid-state and quality
One of the most pronounced factors behind China's ferocious rise in the global technology landscape has been its unparalleled strength in the EV sector, where fierce competition over...
Wednesday 30 September 2026
Tatung pivots to AI infrastructure integration
Amid continued debate over AI, demand for computing power keeps climbing. Tatung Co. on September 30 unveiled its AI infrastructure solution, "TTG AIDC CUBE," at a launch event titled...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Wednesday 30 September 2026
AI boom strains PCB supply chain as materials, equipment shortages persist into 2027
Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...
Wednesday 30 September 2026
Inside China's 3D DRAM push: from lab to fab, and the road ahead
China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
Tuesday 29 September 2026
CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
Tuesday 29 September 2026
In global semiconductor race, Singapore bets on critical, mature technologies
Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
Tuesday 29 September 2026
RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new...