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Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...

Wednesday 23 September 2026
Apple delays 20th-anniversary iPhone display upgrades
Apple has reportedly pushed back plans to add new display technologies to the iPhone model expected in 2027, which marks the product line's 20th anniversary. According to ET News,...
Wednesday 23 September 2026
Acbel targets Europe's fast-charging market with new high-power DC modules
Demand for faster EV charging is rising as markets move from slow AC systems to DC fast charging and ultra-fast networks. The expansion in Poland points to wider global implications...
Tuesday 22 September 2026
Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach
Hermes Testing Solutions began trading on the over-the-counter market on September 22, positioning itself to benefit from rising demand tied to artificial intelligence and high-performance...
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
Microsoft Taiwan to double data centers as AI computing demand exceeds supply

Microsoft is expanding its data center footprint in Taiwan from two facilities to four as global demand for artificial intelligence...

Tuesday 22 September 2026
China's memory race turns inward — CXMT, YMTC head toward patent showdown

Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

Tuesday 22 September 2026
AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities

Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance...

Tuesday 22 September 2026
Macronix Secure Memories Build Hardware Defenses for EU CRA
In the fiercely competitive European and global markets, high-end applications such as automotive electronics, industrial control, networking equipment, and AI data centers face increasingly...
Tuesday 22 September 2026
AirTAC sees pneumatic demand cycle extending through 2027 on China automation growth

AirTAC International Group said demand for pneumatic components in China's automation market has entered a more gradual expansion phase,...

Monday 21 September 2026
Taiwan firms keen on investing in US manufacturing

A recent survey found that 36% of nearly 120 US manufacturers have already reshored or are actively reshoring production, while more than...

Monday 21 September 2026
Samsung builds fab robot team, targets chip equipment maintenance

Samsung Electronics has formed a dedicated organization to develop and deploy robots in its semiconductor fabs, with equipment preventive...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's...
Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...