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Tuesday 23 June 2026
Huawei renews Wi-Fi 6 patent push, putting networking equipment makers on alert

Huawei has continued to pursue patent litigation against networking equipment makers in Europe in recent years, with its latest case...

Tuesday 23 June 2026
NYCU, Phison join forces to build AI heterogeneous computing resource management platform
Taiwan's National Yang Ming Chiao Tung University (NYCU) and Phison Electronics are teaming up to build a GPU resource management platform to improve the efficiency of computing resource...
Tuesday 23 June 2026
Chinese Premier Li Qiang puts China's advanced manufacturing agenda on display before Summer Davos
Chinese Premier Li Qiang will attend Summer Davos 2026, to be held from June 23 to 25 in Dalian, Liaoning province. The forum, formally the Annual Meeting of the New Champions, will...
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
LTO Batteries power up industrial electrification: Taiwan and South Korea players widen global deployments
Lithium titanate oxide (LTO) batteries are emerging as a promising solution for industrial electrification and critical energy infrastructure, where safety, rapid charging and long...
Tuesday 23 June 2026
TECO, Billion Watts and Tun Green Power form JV to develop Australia solar and storage projects
TECO Electric & Machinery's Australia unit, Billion Watts, and Tun Green Power announced a strategic partnership to develop the Seaspray solar and battery energy storage project...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
Huawei expands Vietnam footprint through energy, AI, and 5G partnerships
China's Huawei Technologies is deepening its presence in Vietnam through a series of partnerships spanning digital energy, artificial intelligence (AI), telecommunications infrastructure,...
Monday 22 June 2026
MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

Monday 22 June 2026
Robot batteries diverge from EVs as A-PRO backs swap systems
South Korean battery equipment maker A-PRO says robot battery design differs sharply from electric vehicles (EVs), with hot-swap battery replacement, dual-battery setups, and autonomous...
Saturday 20 June 2026
US raises alarm over possible EUV machine in China, putting ASML on the defensive
The Trump administration has confronted ASML with concerns that one of the Dutch company's most advanced chip-making machines may have made its way into China in violation of US-led...
Saturday 20 June 2026
Foreign drone certification rules push Taiwan firms toward JVs

Taiwan's drone exports continue to gain momentum, driving local manufacturers to expand overseas more aggressively. But as they enter...

Friday 19 June 2026
AI test demand drives broad recovery among Taiwan's semiconductor equipment suppliers in May

Taiwan's semiconductor equipment, components, and solutions providers posted robust revenue growth through the first five months of...

Thursday 18 June 2026
Panjit ramps investment in AI and automotive as book-to-bill rises to 1.5

Panjit International announced at its shareholders' meeting on June 18 that it will pursue a "dual-engine" growth strategy focused on automotive...