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Friday 14 August 2026
South Korea's memory-chip exports surge 277% as system chips slip

South Korea's semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over...

Friday 14 August 2026
Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...
Friday 14 August 2026
Nvidia Feynman pushes TSMC A16 and CPO ramp

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin...

Friday 14 August 2026
Lam Research to spend more than US$3 billion expanding global R&D labs
Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor...
Friday 14 August 2026
Taiwan machine tool exports return to growth in July

Driven by sustained momentum in AI and semiconductor demand, Taiwan's machinery exports continued their upward trajectory in July,...

Friday 14 August 2026
Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...
Friday 14 August 2026
China PCB makers pour billions into AI server, HPC, optical markets
Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
Friday 14 August 2026
ABF substrate boom lifts Eternal Precision prices 20%

Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

Friday 14 August 2026
Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
Thursday 13 August 2026
Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Thursday 13 August 2026
LSE Semiconductor wins strategic investment from TIS

Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...