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    Exclusive: AI-driven demand and chip price hikes raise fears of another car chip shortage
    1h 17min ago
    China auto market slumps as exports face rising geopolitical risk
    1h 17min ago
    Exclsuive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
    1h 17min ago
    Apple price hikes raises questions for device upgrade timing
    1h 17min ago
    Commentary: ASML's race to catch u p shows AI's real bottleneck isn't chips — it's cleanrooms
    1h 17min ago
    China reveals first official commercial space member list, backing mature players and NTN chain
    1h 17min ago
    NEWS TAGGED ASE
    Thursday 16 July 2026
    AI chips are running hotter — and Niching is betting its future on keeping them cool
    As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Monday 13 July 2026
    Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

    AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

    Friday 10 July 2026
    ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

    ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

    Friday 10 July 2026
    TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

    TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

    Wednesday 8 July 2026
    ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
    South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
    Thursday 25 June 2026
    ASE sees AI demand stretching packaging capacity into 2030
    ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
    Thursday 25 June 2026
    TSMC-Amkor alliance jolts packaging map as ASE races to expand
    The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
    Friday 12 June 2026
    Taiwan OSAT firms gain from AI chip demand and foundry spillover
    The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
    Thursday 11 June 2026
    Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
    Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure...
    Tuesday 2 June 2026
    ASE CEO says Taiwan's semiconductor ecosystem took 40 years to build — and will take years to replicate
    When Marvell CEO Matt Murphy asked ASE Group CEO Tien Wu what makes Taiwan's technology ecosystem unique — and why it is so hard to replicate elsewhere — the answer was...
    Sunday 31 May 2026
    WinWay to double test capacity with NT$3.5B southern Taiwan plant
    WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
    Thursday 28 May 2026
    ASE launches first automated PLP line, eyes 1H27 production
    Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
    Friday 22 May 2026
    AMD deepens Taiwan supply chain ties with US$10B-plus push
    AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
    Sunday 17 May 2026
    Taiwan chipmakers quietly fill gaps left by Korea's HBM push
    Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
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