OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
ISE Labs, a subsidiary of ASE that provides one-stop semiconductor engineering services, has announced the expansion of its world-class capabilities with the launch of a second US...
Senior executives from key manufacturers, including ASE Technology Holding and Taiwan Semiconductor Manufacturing Company (TSMC), gathered at a summit forum on July 9 to discuss their...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
The rapid growth of Artificial Intelligence (AI) and High-Performance Computing (HPC) is driving an urgent need for performance while grappling with high energy consumption.
Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year...
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
