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Mar 18
Foxconn highlights five growth pillars for 2024
Foxconn (Hon Hai) will see its revenue growth momentum for 2024 come from five main development axes – namely AI servers, three major smart platforms, Electrical Vehicles (EVs), IC design, and Low-Earth Orbit (LEO) satellites – as unveiled by chairman Young Liu at the company's recent investors conference.
Arm has unveiled a significant expansion of its presence in automotive electronics, introducing server-grade automotive enhanced processor IP alongside software development platforms and computing subsystem roadmaps. This move has attracted nearly all traditional IDMs and IC design giants in the automotive field, to join Arm's automotive system IP ecosystem.
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Qualcomm recently reaffirmed its focus on the IoT field.
HiSilicon (Shanghai) Technologies showcased new chip and terminal device solutions for smart homes, displays, and the Internet of Things (IoT) at the recent Appliance & Electronics World Expo (AWE) in Shanghai.
Qualcomm introduces new SoC for AI smartphones
Mar 19, 10:19
Qualcomm has revealed the Snapdragon 8s Gen 3 mobile SoC for AI smartphones, which will be used by key OEMs such as Honor, iQOO, Realme, Redmi, and Xiaomi. The first handset is likely to be announced in March.
KLA to exit FPD business by 2024
Mar 19, 09:52
KLA decided to exit the Flat Panel Display business (FPD) by the end of 2024 and will continue to provide services to the installed base.
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Nvidia GTC 2024 to feature TSMC
Mar 19, 09:36
As a proud sponsor, TSMC will be featured at Nvidia's 2024 GPU Technology Conference (GTC).
South Korean Flexible Printed Circuit Board (FPCB) manufacturer Siflex is set to join Apple's supply chain. Along with BH, it will supply Samsung Display (SDC) with Rigid flexible PCBs (RFPCB) for iPhone 16 OLED.
Just as Qualcomm is poised to unveil an updated Snapdragon 8 Gen 3, leaked benchmark scores for the Snapdragon 8 Gen 4, a 3nm flagship SoC slated for the second half of 2024, have emerged, surpassing even Apple's forthcoming SoC. This signals a rare instance of Android's mobile SoC outperforming Apple's.
In the midst of the global Low Earth Orbit (LEO) satellite fervour, Taiwan's PCB industry is emerging as a pivotal player, mirroring the supply chains seen in the mobile phone and laptop sectors. As international satellite operators drive demand, Taiwan's leading component manufacturers are leveraging their expertise to enter the supply chain for satellite-to-ground services.