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NEWS TAGGED COOLING
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Thursday 1 October 2026
Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking
Jabil's plan for fiscal 2027 puts a price tag on its move from building servers to building the power, cooling, and networking systems around them. The company expects about US$17.5...
Thursday 1 October 2026
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Wednesday 30 September 2026
Tatung pivots to AI infrastructure integration
Amid continued debate over AI, demand for computing power keeps climbing. Tatung Co. on September 30 unveiled its AI infrastructure solution, "TTG AIDC CUBE," at a launch event titled...
Wednesday 30 September 2026
Tatung targets 180-day AI data center deployment
To showcase its competitiveness in AI infrastructure, Tatung Group on September 30 held the "Power Ready for AI" forum and unveiled a modular AI data center (AIDC) built around the...
Tuesday 29 September 2026
LG expands AI data center cooling ties with Microsoft, SK Enmove
LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...
Tuesday 29 September 2026
Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need...
Thursday 24 September 2026
LG sharpens focus on data centers, robotics, chip materials

LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate...

Thursday 24 September 2026
Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks
Supermicro has begun shipping Nvidia's next-generation Vera Rubin NVL72 systems, moving the rack-scale platform from product demonstrations into customer deployments as AI infrastructure...
Wednesday 23 September 2026
LG Electronics, Microsoft enter partnership on AI data centers, physical AI
LG Electronics entered a partnership with Microsoft to cooperate on a range of AI initiatives. The two firms agreed to work together on AI data centers, LG Electronics' AI data transformation,...
Monday 21 September 2026
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

Monday 21 September 2026
HEC Compucase AI server products drive 2026 revenue growth

HEC Compucase's AI server-related rollout continues to gain traction as AI racks, cooling modules, and high-end power supplies move...

Sunday 20 September 2026
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign

Wiwynn is introducing collaborative robots (cobots) at its El Paso, Texas, facility and third plant in Mexico, alongside a central heat...

Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...