中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Qualcomm takes Arm to trial again, with billions in royalties at stake
    24min ago
    China’s 15th five-year plan elevates PCB role in AI supply chains
    Oct 5, 18:10
    Huawei’s Kirin 9050 Pro reveals new logic folding chip design
    Oct 5, 18:10
    Huawei says 381 tau chips are already in mass production
    Oct 5, 18:10
    Samsung accelerates HBM thermal management push as AI packaging scales up
    Oct 5, 18:10
    South Korean PCB exports ride AI demand, set to surpass 2022 peak in 2026
    Oct 5, 18:10
    NEWS TAGGED COOLING
    Tuesday 6 October 2026
    Schneider Electric's deal to buy PTC is the next step in its software push
    Schneider Electric has agreed to purchase software company PTC in a deal valuing its equity at around US$22.6 billion. The all-cash acquisition marks the French energy and tech company's...
    Monday 5 October 2026
    DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
    As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
    Friday 2 October 2026
    LG Electronics, LS Electric target AI data center bottlenecks with US cooling capacity, 345kV power deals
    South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing:...
    Thursday 1 October 2026
    Qualcomm, Samsung redesign chip packaging as heat limits phone performance
    Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
    Thursday 1 October 2026
    Jabil targets US$17.5 billion in data center revenue as it builds out power, cooling, and networking
    Jabil's plan for fiscal 2027 puts a price tag on its move from building servers to building the power, cooling, and networking systems around them. The company expects about US$17.5...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 30 September 2026
    Tatung pivots to AI infrastructure integration
    Amid continued debate over AI, demand for computing power keeps climbing. Tatung Co. on September 30 unveiled its AI infrastructure solution, "TTG AIDC CUBE," at a launch event titled...
    Wednesday 30 September 2026
    Tatung targets 180-day AI data center deployment
    To showcase its competitiveness in AI infrastructure, Tatung Group on September 30 held the "Power Ready for AI" forum and unveiled a modular AI data center (AIDC) built around the...
    Tuesday 29 September 2026
    LG expands AI data center cooling ties with Microsoft, SK Enmove
    LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...
    Tuesday 29 September 2026
    Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
    Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need...
    Thursday 24 September 2026
    LG sharpens focus on data centers, robotics, chip materials

    LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate...

    Thursday 24 September 2026
    Supermicro begins shipping Nvidia Vera Rubin NVL72 AI racks
    Supermicro has begun shipping Nvidia's next-generation Vera Rubin NVL72 systems, moving the rack-scale platform from product demonstrations into customer deployments as AI infrastructure...
    Wednesday 23 September 2026
    LG Electronics, Microsoft enter partnership on AI data centers, physical AI
    LG Electronics entered a partnership with Microsoft to cooperate on a range of AI initiatives. The two firms agreed to work together on AI data centers, LG Electronics' AI data transformation,...
    Monday 21 September 2026
    Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

    AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

    1/48 pages
    API
    BIZ FOCUS
    Oct 6, 08:07
    Singapore Launches SG Semiconductor to Boost its Global Chip Role
    Tuesday 6 October 2026
    Hackathon Team Builds Trusted AI Agent for Smarter Investment Decisions
    Monday 5 October 2026
    AI Family Digital Twins Bridge Elder Care Gaps
    Friday 2 October 2026
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'