CONNECT WITH US
NEWS TAGGED COOLING
Friday 6 November 2026
Samsung SDS begins construction of 60MW AI data center to support factory robots
Samsung SDS has begun construction of a 60MW AI data center in Gumi, South Korea, to support industrial robots and other AI applications. The project marks the first concrete step...
Friday 6 November 2026
Pluggable optical module forms diverge; rack design emerges as key variable
As switch chips move toward 400G per channel, the gold-finger connectors used in current pluggable modules are approaching their high-frequency limits. The pluggable optics camp introduced...
Friday 6 November 2026
DIGITIMES Insight: Foxconn extends AI strategy to data center system integration, targeting modular computing delivery with DSX POD
At Hon Hai Tech Day 2026 (HHTD 26), Foxconn showcased the Nvidia DSX POD containerized solution. By leveraging factory pre-building, electromechanical integration, and pre-testing,...
Thursday 5 November 2026
NAND prices face pressure as end demand freezes in 4Q26
Memory prices have surged for several consecutive quarters, leaving consumer applications grappling with cooling buying interest and weak demand. Kioxia has taken a more conservative...
Thursday 5 November 2026
Google commits US$15 billion to expand Malaysian data centers in 2027, 2028
Google's plan to invest US$15 billion in Malaysia over 2027 and 2028 deepens its bet on what AFP calls Southeast Asia's fastest-growing data center hub, and ties the expansion to commitments...
Monday 2 November 2026
AI data center boom in Taiwan faces power, high-voltage line hurdles
As AI data centers expand, Taiwan is facing challenges in securing power supply, battery backup, and cooling systems, with the state-run Taiwan Power Company (Taipower) requiring about...
Monday 2 November 2026
Schneider and Foxconn accelerate modular AI factory deployment as token usage surges 60-Fold
The boom in generative AI is rapidly driving demand for data center construction, making power supply, cooling, and energy management central challenges for AI infrastructure. Speaking...
Monday 2 November 2026
Foxconn's FII, FIT join forces to tackle AI data center bottlenecks beyond computing power
Foxconn subsidiaries Foxconn Interconnect Technology (FIT) and Foxconn Industrial Internet (FII) are combining their expertise in computing, connectivity, power delivery and cooling...
Saturday 31 October 2026
TSIA 30: Taiwan builds the AI backbone — but can it capture the AI economy?
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
Saturday 31 October 2026
TSIA 30: AI is breaking the sequential supply chain — Taiwan may be built for what comes next
The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether...
Friday 30 October 2026
Foxconn, TECO showcase factory-built infrastructure for AI data center expansion
Hon Hai (Foxconn) and TECO Electric & Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure...
Thursday 29 October 2026
Kuen Tong debuts on TPEx Emerging Board, riding LEO satellite and AI cooling dual engines
Taiwan's Kuen Tong Technology, a high-end precision metal components maker and major supplier to a US low-Earth orbit (LEO) satellite operator, is set to list on the Taipei Exchange's...
Thursday 29 October 2026
Taiwan's Ministry of Environment deploys digital twin to simulate urban cooling
Taiwan's Ministry of Environment (MOENV) will establish an urban forestry smart governance demonstration site around National Taipei University of Technology and the cultural site...
Thursday 29 October 2026
China's auto supply chain shifts from price wars to value competition
China's cooling auto price war is creating an opportunity for the automotive supply chain to upgrade, as regulators tighten oversight of the new energy vehicle (NEV) industry and curb...
Thursday 29 October 2026
Nvidia's Rubin Ultra cooling: 0.1mm microchannels vs vapor chambers
As Nvidia introduces a new generation of AI chips each year, gains in computing performance are driving increasingly demanding thermal management requirements.