LG Electronics has signed a long-term agreement to supply chillers for data center projects totaling more than 5GW of capacity in the US and Canada, giving the South Korean company...
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
Schneider Electric has agreed to purchase software company PTC in a deal valuing its equity at around US$22.6 billion. The all-cash acquisition marks the French energy and tech company's...
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
South Korea's LG Electronics and LS Electric are expanding deeper into AI data center infrastructure, targeting two of the fastest-growing bottlenecks around high-density computing:...
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Jabil's plan for fiscal 2027 puts a price tag on its move from building servers to building the power, cooling, and networking systems around them. The company expects about US$17.5...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Amid continued debate over AI, demand for computing power keeps climbing. Tatung Co. on September 30 unveiled its AI infrastructure solution, "TTG AIDC CUBE," at a launch event titled...
To showcase its competitiveness in AI infrastructure, Tatung Group on September 30 held the "Power Ready for AI" forum and unveiled a modular AI data center (AIDC) built around the...
LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...
Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need...
Supermicro has begun shipping Nvidia's next-generation Vera Rubin NVL72 systems, moving the rack-scale platform from product demonstrations into customer deployments as AI infrastructure...
