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Tuesday 23 June 2026
Nippon Sanso raises helium prices over 30% on Middle East instability-driven supply crunch

Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting...

Tuesday 23 June 2026
Intel expands Taiwan chip chain orders, October 2026 talks grow
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Infineon and InnoScience's GaN patent fight hardens market split

Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins...

Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...
Tuesday 23 June 2026
Japan puts robotics at heart of US$2.3 trillion chip revival

Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...

Tuesday 23 June 2026
High-end fiberglass cloth supply tightens; shortages to persist through 2027

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the...

Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Panjit upgrades hot swap tech to drive 2H26 growth
AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...