UMC announced on December 8, 2025, that it has signed a technology licensing agreement with Belgium-based Imec to acquire the Imec iSiPP300 silicon photonics (SiPh) process. This...
Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memo...
The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
Cica-Huntek Chemical Technology, a joint venture between Japan's Kanto Chemical and Huntek Systems, has entered the TSMC supply chain. The company has benefited from Kanto Chemical's...
The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia,...
Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects...
Navitas Semiconductor and Cyient Semiconductors have announced a strategic, long-term partnership aimed at advancing gallium nitride (GaN) technology adoption in India and establishing...
SK Hynix and battery subsidiaries within SK Group received approval for 68 core patents in China in November 2025. Many of these patents relate to highly integrated memory designs...
Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the...
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack...
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
