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Monday 27 April 2026
DIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to...

Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
Monday 27 April 2026
TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron
A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment...
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
Monday 27 April 2026
Quanta bets on speed and scale to power next growth wave
Quanta Computer is doubling down on speed, scale, and execution as it heads into 2026, with leadership expressing strong confidence that surging AI server demand will drive another...
Monday 27 April 2026
Denso weighs Rohm bid withdrawal as support stalls

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal...

Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
Monday 27 April 2026
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Monday 27 April 2026
South Korea and Vietnam deepen tech and supply chain cooperation amid global uncertainty
South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi,...
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new...

Monday 27 April 2026
Cerebras files for IPO after AI chip breakthrough, G42 partnership shapes supply chain
Cerebras Systems filed for an initial public offering (IPO) on April 17, 2026, aiming to list on the Nasdaq. The company reversed its fortunes with US$510 million in revenue and a...
Monday 27 April 2026
Tata's India chip fab faces leadership churn and engineering hurdles amid uneven but continuing progress
Tata Electronics' flagship semiconductor fabrication project in Dholera, Gujarat—long viewed as India's most ambitious attempt to build a domestic chip manufacturing ecosystem—continues...
Sunday 26 April 2026
ASML cuts management layers due to restructuring; TSMC stance affects High-NA outlook

ASML is moving to eliminate a wide range of management roles as part of a broader effort to simplify its organization and improve execution,...