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Monday 29 June 2026
SK Hynix sets up new strategy unit as HBM race intensifies
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move...
Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Monday 29 June 2026
Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains
Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:
Monday 29 June 2026
Potens expands into AI cooling and power markets, server revenue share hits double digits

With growing demand for AI server cooling and power management solutions, power semiconductor design company Potens reported that revenue...

Monday 29 June 2026
Hsinchu Science Park draws new semiconductor service investments as chipmaking shifts to advanced nodes

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...

Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
Taiwan electronics sector stays upbeat as AI demand lifts exports
Taiwan's electronics-machinery sector is heading into the second half of 2026 with cautious optimism, as global demand for AI infrastructure, high-end semiconductors, and cloud services...
Monday 29 June 2026
India roundup: Global tech giants deepen India investments
India is attracting fresh technology investment as global companies expand AI, cloud and semiconductor commitments, reinforcing the country's growing role as a strategic manufacturing...
Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...
Monday 29 June 2026
Jih Lin rides AI power demand to clip packaging
Jih Lin is seeing stronger business momentum as higher power consumption per AI server rack drives data-center power management toward 800V high-voltage direct current (HVDC) architectures,...
Monday 29 June 2026
Taiwan water treatment firm rebrands to chase chip-grade purification demand
Hongyi International, an OTC-listed environmental engineering company, has formally rebranded as Tianyi Water & Energy Solutions, marking a strategic shift toward a fully integrated...
Sunday 28 June 2026
2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical...
Sunday 28 June 2026
Trusval reports record 2025 profit, eyes global growth in 2026
Trusval Technology reported record 2025 revenue and profit, signaling stronger demand for semiconductor-related construction and industrial systems that matter to global supply chains...
Saturday 27 June 2026
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...