China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty...
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...
Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...
