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Tuesday 5 May 2026
Tesla AI5 dual sourcing may not mean equal weight for Samsung
Tesla CEO Elon Musk has confirmed that the company's in-house AI5 chip has completed design tape-out and entered a critical pre-production validation stage. The move has drawn renewed...
Tuesday 5 May 2026
Ardentec's Longtan plant to start AI ASIC testing in 3Q26
Ardentec's Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the semiconductor testing provider moves to capture spillover demand from...
Tuesday 5 May 2026
Another Qualcomm exec joins Intel to lead PC and physical AI unit
Intel has announced that it has appointed Alex Katouzian as head of its Client Computing and Physical AI Division. With this hire, Intel seeks to align its consumer PC business with...
Tuesday 5 May 2026
As Nvidia goes to zero in China, Beijing races to fill the void
Nvidia CEO Jensen Huang said the company's share of China's data-center computing market has dropped to zero. The admission underscores how US export controls are reshaping the country's...
Tuesday 5 May 2026
SEMICON SEA 2026: the trillion-dollar chip era is already here
The global semiconductor industry is entering a "multi-trillion-dollar" growth cycle sooner than expected, SEMI President and CEO Ajit Manocha said, urging Southeast Asian countries...
Tuesday 5 May 2026
Apple reportedly explores Intel and Samsung chip production to reshape advanced manufacturing strategy
Apple is exploring a significant shift in its semiconductor supply chain, holding early discussions with Intel and Samsung Electronics to produce the main processors used in its devices,...
Tuesday 5 May 2026
Intel PC chip roadmap takes shape as Razor Lake, Titan Lake stay on track
Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve,...
Tuesday 5 May 2026
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...
Tuesday 5 May 2026
Onsemi says China remains a strong market despite softer passenger vehicle volumes
Onsemi told investors during its first-quarter 2026 earnings call, held on May 4, that China remains a key growth market for its automotive power products, even as China's passenger...
Tuesday 5 May 2026
Onsemi sees AI data center and Treo driving revenue and margin recovery
During an earnings call on May 4, Onsemi portrayed its artificial intelligence data center business and new Treo platform as central to a recovery that began in the first quarter,...
Tuesday 5 May 2026
Lattice Semiconductor strikes US$1.65B deal for AMI as AI data center demand drives record growth
Lattice Semiconductor has signed a definitive agreement to acquire AMI, a leading provider of platform firmware and infrastructure manageability software, for US$1.65 billion. The...
Tuesday 5 May 2026
Onsemi signals early recovery as AI demand strengthens but profitability remains volatile
Onsemi reported a mixed but generally improving set of first-quarter 2026 results, signaling early signs of recovery in key end markets while highlighting ongoing volatility in pro...
Tuesday 5 May 2026
Intel's revival runs on politics and promises — but supply bottlenecks tell a different story
Intel's share price has hit historic highs as the semiconductor industry draws significant investor attention. But is this hype justified? DIGITIMES analyst Luke Lin took a deep dive...
Tuesday 5 May 2026
Samsung reportedly eyes SiC foundry reboot, targets 2028 mass production
Samsung Electronics is reportedly restarting its silicon carbide (SiC) wafer foundry business, aiming to tap into the fast-growing next-generation power semiconductor market, reinforce...
Tuesday 5 May 2026
Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver?
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...