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Wednesday 11 November 2026
Diamond Foundry says it has grown a 200mm single-crystal diamond
Diamond Foundry has produced what it calls the first-ever single-crystal diamond measuring 200mm in diameter, according to a company blog post published on November 5, 2026. The post...
Wednesday 11 November 2026
Samsung reportedly buys four silicon photonics patents from Rockley
Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US...
Wednesday 11 November 2026
Canon to launch KrF lithography scanner rated at 400 wafers per hour in December
Canon Inc. said on November 10, 2026, that it will launch the FPA-6400ES6a, a krypton fluoride (KrF) scanner for manufacturing memory and logic semiconductors, in early December 2026...
Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Wednesday 11 November 2026
Nexperia's China split raises costly question: what is Wingtech owed?
Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said...
Wednesday 11 November 2026
Infineon says data center orders already exceed target as factory output sets ceiling
Infineon Technologies told analysts that demand is no longer what limits its growth. On a November 10 call to discuss its fiscal 2026 results, the German chipmaker said orders for...
Wednesday 11 November 2026
Ingentec revenue jumps 79% in first 10 months
Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell...
Wednesday 11 November 2026
Intel targets agentic AI with GPUs and Xeon
Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model...
Wednesday 11 November 2026
TSMC unlikely to enter 3D DRAM; CXMT expansion a bigger threat
Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request....
Wednesday 11 November 2026
Infineon's record quarter shows power chips moving from cyclical recovery to AI-led growth
Infineon Technologies ended fiscal 2026 with its strongest quarter ever, and the shape of the result says more than its size: profitability rose much faster than sales, and the German...
Wednesday 11 November 2026
Asia Electronic Materials advances PTFE Hybrid solution for AI clients
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...
Wednesday 11 November 2026
Acer Synergy Tech rides semiconductor demand to record revenue
Acer subsidiary Acer Synergy Tech benefited from sustained semiconductor industry growth, which drove demand for information technology (IT), operational technology (OT), and workforce...
Wednesday 11 November 2026
Nvidia's OOI architecture paves way for optical interconnects in GPUs
DIGITIMES observed that Nvidia is advancing an optics-on-interposer (OOI) architecture that moves the optical engine from an organic substrate to a silicon interposer to increase interconnect...
Wednesday 11 November 2026
Intel expands 18A reach with Wildcat Lake AI PC chips
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
Wednesday 11 November 2026
China's Huaqin looks beyond AI servers with US$150M wafer foundry investment
China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening...