CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Monday 31 August 2026
Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row
Gudeng Precision Industrial chairman Bill Chiu said on August 31, 2026, that trust is the core foundation of Taiwan's place in the global supply chain, as he commented on sensitive...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
South Korea risks 'HBM 2.0' trap in emerging CPO market
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Monday 31 August 2026
China's silicon wafer makers report profit gains of varying quality
Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...
Monday 31 August 2026
Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace
Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
Monday 31 August 2026
Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
Monday 31 August 2026
France draws Taiwanese investment projects worth EUR7.5 billion
Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...
Monday 31 August 2026
India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
Saturday 29 August 2026
Inside TSMC's 238-page sustainability report: nine things that matter more than they look
Buried in 238 pages of targets and inventories are the things nobody puts in a press release: a formal corporate policy on shoe soles, a fish that lives in a fab, a lizard evacuation...
Friday 28 August 2026
ASIC makers see CSP orders stay strong through 2028
The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...