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Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond...

Wednesday 24 June 2026
Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...
Wednesday 24 June 2026
China's chip-equipment push starts to weigh on Japanese suppliers

China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

Wednesday 24 June 2026
AI server VRM shifts drive power shortages and stretch lead times past 6 months
The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads...
Wednesday 24 June 2026
China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
Wednesday 24 June 2026
Samsung's Texas fab gains momentum with the arrival of ASML engineers

Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
Nippon Sanso raises helium prices over 30% on Middle East instability-driven supply crunch

Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting...

Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Infineon and InnoScience's GaN patent fight hardens market split

Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins...

Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...