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NEWS TAGGED IC MANUFACTURING
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Friday 2 October 2026
UNEEC shifts ODM focus to racks as L11 rises to 18%
Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth...
Friday 2 October 2026
TSMC mulls multi-fab Texas campus beyond Arizona, with Singapore also in talks
TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production...
Friday 2 October 2026
Taiwan government backs 7 semiconductor schools to upgrade equipment
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...
Friday 2 October 2026
JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Friday 2 October 2026
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
Friday 2 October 2026
Micron expands global fabs, calls on Taiwanese suppliers to go overseas
AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India...
Friday 2 October 2026
Micron eyes NVHBM profits with TSMC custom HBM push
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
Friday 2 October 2026
TSMC, NTU deepen R&D ties through nearly 50 projects a year
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
Friday 2 October 2026
Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
Friday 2 October 2026
Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle
Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule,...
Friday 2 October 2026
Southern Taiwan Science Park approves three new companies, pushing 2026 investment over NT$100 billion
The Southern Taiwan Science Park (STSP) has approved the entry of three new companies—Fangsco, Nanya Technology, and South Korea's Hansol Chemical—pushing the park's cumulative...
Friday 2 October 2026
Onsemi revises Synaptics takeover deal after rival bid
Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...
Friday 2 October 2026
Machvision expands early to chase NT$10B revenue
Machvision is expanding capacity earlier than planned to meet rising demand from semiconductors, substrates, and optical modules, while tight computer numerical control (CNC) and machining...
Thursday 1 October 2026
Topco opens Fukuoka office to link Japan chip hubs
Topco Scientific said its Japanese subsidiary, Shunkawa, officially opened its Fukuoka office on October 1, making it the company’s third base in Japan alongside its Tokyo headquarters...