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Thursday 20 August 2026
Samsung repays 20 trillion won SDC loan early as memory demand surges

Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026,...

Thursday 20 August 2026
Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

Thursday 20 August 2026
Rising demand for CPO, SiPh reshapes semiconductor testing
As chip power consumption, transmission speed and architectural complexity increase, testing has shifted from being a final pre-shipment quality gate to an earlier stage in product...
Thursday 20 August 2026
India's chipmaking push faces its real test after initial wafers: yield
India's semiconductor manufacturing drive will face one of its toughest tests after equipment is installed and production begins: whether new fabs can consistently produce enough working...
Wednesday 19 August 2026
Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based...
Wednesday 19 August 2026
Socionext taps Intel 18A-P process for high-performance compute chiplet development
Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
NSTC's unmanned vehicle revenue tops 40% as semiconductor AOI and CPO fuel growth
Optical imaging technologies company New Smart Technology (NSTC) is moving beyond traditional optical and image inspection into semiconductor high-end automated optical inspection...
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring...

Wednesday 19 August 2026
Modi to inaugurate Semicon India 2026 as government courts global chipmakers
Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi,...
Wednesday 19 August 2026
Rattled supply chains: Over half of Taiwan firms feel the squeeze of US-Iran conflict

More than half of Taiwanese companies surveyed by TAITRA reported being negatively affected by the US-Iran conflict, with rising costs...

Wednesday 19 August 2026
Samsung and SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term...

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Wednesday 19 August 2026
Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed...

Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue

Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to...