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    NEWS TAGGED IC MANUFACTURING
    Monday 2 November 2026
    India roundup: India accelerates semiconductor push as states, chipmakers and equipment suppliers expand investment

    India's semiconductor ambitions are gathering momentum as states launch new subsidies, chipmakers weigh fabs, global suppliers consider manufacturing,...

    Monday 2 November 2026
    Analysis: Samsung's own memory unit pushes its foundry toward a 2027 capacity crunch
    Samsung Electronics' contract chipmaking business spent years struggling to fill its factories. On its third-quarter earnings call, the company said that by 2027, demand will exceed...
    Sunday 1 November 2026
    The 20% problem: why Taiwan's imported equipment parts still carry 70% of the cost
    Taiwan can manufacture some of the world's most advanced chips, package them into increasingly complex AI systems, and connect much of the surrounding electronics supply chain within...
    Sunday 1 November 2026
    The pioneer behind TSMC's FinFET leap: a personal look at Chenming Hu
    In 2008, I accompanied a graduate student delegation sponsored by Applied Materials to visit the University of California, Berkeley. The trip was arranged with hopes of meeting Dr...
    Sunday 1 November 2026
    Six decades in the making: Why the world can't easily copy Taiwan's chip ecosystem
    Taiwan's semiconductor strength is often described today through leading-edge process nodes, advanced packaging capacity, or its pivotal role in the global AI supply chain. At the...
    Saturday 31 October 2026
    TSIA 30: The manpower problem behind Taiwan's semiconductor resilience
    Taiwan's semiconductor industry has earned its reputation for chip dominance through decades of sustained investment in solving some of the world's hardest technological challenges...
    Saturday 31 October 2026
    TSIA 30: Taiwan builds the AI backbone — but can it capture the AI economy?
    Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
    Saturday 31 October 2026
    Radiant targets next-gen CPO above 6.4T, eyes 2028 mass production
    Radiant Opto-Electronics, a major backlight module maker, is expanding into new businesses and targeting next-generation optical communications architecture, particularly co-packaged...
    Saturday 31 October 2026
    AUO targets major revenue contribution from optical engines, glass core substrates within 2 to 3 years
    AUO is accelerating its strategic push into optical communications and advanced semiconductor packaging, establishing optical engines and glass core substrates (GCS) as its two primary...
    Saturday 31 October 2026
    TSIA 30: AI is breaking the sequential supply chain — Taiwan may be built for what comes next
    The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether...
    Saturday 31 October 2026
    Ibiden expands AI packaging substrate capacity for Intel from 2029
    Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to...
    Saturday 31 October 2026
    Infineon's 300mm GaN push turns Europe's power-chip strength into an AI infrastructure bet

    The aggressive deployment of infrastructure-scale AI projects is rapidly driving up compute demand as chip architectures continue to scale across...

    Friday 30 October 2026
    Taiwan's economic indicator signals 'booming' for 10th straight month on AI-driven shipments
    Taiwan's economy has stayed in "booming" territory for a record 10th consecutive month, according to the monitoring indicator compiled by the National Development Council (NDC), the...
    Friday 30 October 2026
    C Sun Mfg invests in Nemstek to expand advanced packaging equipment
    C Sun Mfg announced on October 30 that it would subscribe for 1,900 lots of Nemstek's privately placed common shares as a strategic investor, giving it an expected stake of approximately...
    Friday 30 October 2026
    ASE expects packaging and testing margins to stay above 30%
    ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the...
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    BIZ FOCUS
    Oct 30, 08:00
    Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026
    Thursday 29 October 2026
    STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO
    Wednesday 28 October 2026
    SK hynix Announces 3Q26 Financial Results
    Wednesday 28 October 2026
    CES Asia Unveiled Expands to Hong Kong for CES 2027