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Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
Saturday 25 July 2026
Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking
Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract...
Saturday 25 July 2026
South Korea unveils AI cooperation agenda as Nvidia partnerships expand
South Korean President Lee Jae Myung launched an AI-focused visit to Silicon Valley by announcing a "San Francisco AI Declaration" aimed at promoting international cooperation in artificial...
Saturday 25 July 2026
South Korean leaders meet Nvidia as AI partnerships expand
South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry...
Saturday 25 July 2026
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
Friday 24 July 2026
Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor...

Friday 24 July 2026
German chip suppliers deepen ties with Samsung, SK Hynix

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment...

Friday 24 July 2026
India's chip plants face harder test: finding repeat customers
India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
Friday 24 July 2026
TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
Friday 24 July 2026
Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

Friday 24 July 2026
STMicroelectronics lifts data center target as AI optical demand outruns supply, but margin recovery waits on 2027 reshaping
STMicroelectronics raised its cloud AI revenue ambition and guided to a rising gross margin through the second half of 2026, but told analysts on its July 23 second-quarter earnings...
Friday 24 July 2026
Intel reportedly considers SK Hynix for Ohio fab partnership

Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the...

Friday 24 July 2026
Commentary: Wistron's Texas AI factory shows why US manufacturing still needs Taiwan
Wistron's opening of its D1 AI smart factory in Fort Worth, Texas, marks a new milestone for Taiwan's downstream electronics manufacturers. The plant will support...
Friday 24 July 2026
Intel says supply, not demand, is its ceiling as it lifts 2026 capex above US$20 billion
Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts...
Friday 24 July 2026
Intel's blowout quarter wins over the bulls, but analysts stay split on the foundry turnaround
Intel's second-quarter results have shifted the Wall Street debate from whether chief executive Lip-Bu Tan's turnaround is working to how durable the AI-driven compute demand behind...