Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades...
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break...
Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now,...
The global silicon carbide (SiC) market stands at a critical juncture of industrial scaling, driven by rising demand across the automotive, AI data center, and renewable energy sec...
IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...
Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor...
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...
Infineon Technologies has lined up 8-inch silicon carbide (SiC) wafers from Wolfspeed under an expanded and extended long-term supply agreement. The deal gives the German chipmaker...
This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...
