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NEWS TAGGED IC MANUFACTURING
Wednesday 2 September 2026
Indium CEO: packaging, cooling and power are next AI bottlenecks
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
Wednesday 2 September 2026
TSMC moves into Baipu Industrial Park, boosts advanced packaging
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
Wednesday 2 September 2026
TSMC reportedly asks suppliers to develop 5μm HBM microbumps
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Wednesday 2 September 2026
Certain Micro targets AI test-interface demand with three Semicon products
As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...
Wednesday 2 September 2026
Energy and water: How to tackle the fab resource crunch
As artificial intelligence demand drives astronomical growth in advanced chip manufacturing, the semiconductor industry is hitting critical resource bottlenecks. Speaking at SEMICON...
Wednesday 2 September 2026
IBM's quantum pitch to chip audience: bottleneck is now manufacturing
IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...
Wednesday 2 September 2026
MediaTek pushes advanced packaging and supply chain to keep pace with AI
Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
Wednesday 2 September 2026
Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
Wednesday 2 September 2026
Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
Wednesday 2 September 2026
European chip ambitions hinge on more than subsidies, says TSMC
The EU is pressing ahead with the European Chips Act and discussing a second phase, but TSMC says public money alone will not secure a durable semiconductor base. The company argues...
Wednesday 2 September 2026
Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout
Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp...
Wednesday 2 September 2026
Taiwan doesn't just want a quantum lab — it wants a quantum fab
Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...
Wednesday 2 September 2026
AI demand push expands wafer industry's growth outlook
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Wednesday 2 September 2026
Taiwan materials makers see new opening in chip packaging shift
Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
Wednesday 2 September 2026
TSMC says Europe chip strategy is shifting from plans to demand creation
The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...