CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Friday 4 September 2026
South Korea taps chip windfall for next tech push
South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia's Vera Rubin computing...
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence...
Friday 4 September 2026
MSScorps August revenue hits new high on silicon photonics gains
MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
Friday 4 September 2026
Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
Friday 4 September 2026
SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology
TAIPEI, Taiwan — The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth...
Friday 4 September 2026
Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027
Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow...
Friday 4 September 2026
K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Friday 4 September 2026
Kyocera completes Nagasaki plant for semiconductor ceramics and packages
Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...
Friday 4 September 2026
Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...
Friday 4 September 2026
Processor, memory boom could push chip supply chain out of sync, says Yole
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
Friday 4 September 2026
Silicon Valley overflow fuels semiconductor boom in California's Capital Region
A surge of multibillion-dollar industrial expansions is quietly transforming California's capital region into a premier domestic semiconductor and advanced technology powerhouse, positioning...
Friday 4 September 2026
Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers
Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers...
Friday 4 September 2026
Silicon photonics testing shift could reshape how CPO suppliers win business
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Friday 4 September 2026
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...