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Tuesday 8 September 2026
TSMC, ASML target 12-inch photomask pilot line by 2031, production by 2033
TSMC and ASML have formed an industry-wide initiative to move extreme ultraviolet lithography from 6-inch photomasks to 12-inch formats, with a pilot mask line targeted for 2031 and...
Tuesday 8 September 2026
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...
Tuesday 8 September 2026
CIOE 2026 opens in Shenzhen: 5,000 exhibitors chase the AI-driven optics boom
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions...
Tuesday 8 September 2026
Tungsten hexafluoride supply chain alerts as Peric expands
Explosive capacity expansions by memory giants across South Korea, the United States, and China are driving surging demand for tungsten hexafluoride (WF6), a specialty electronic gas...
Tuesday 8 September 2026
Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR)...
Tuesday 8 September 2026
TSMC's co-COO left ITRI in 1987 for a startup foundry — ITRI just named him a laureate
TSMC Executive Vice President and Co-Chief Operating Officer Y.P. Chin was named an Industrial Technology Research Institute (ITRI) Laureate on September 7, marking another milestone...
Tuesday 8 September 2026
Infineon COO leaves a US fab open, says GlobalFoundries and ESMC already cover it
Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In...
Tuesday 8 September 2026
SK Hynix weighs Gwangju investment as Yongin buildout continues
SK Hynix is considering accelerating investment in South Korea's planned Gwangju semiconductor cluster so that development proceeds alongside its ongoing Yongin buildout, rather than...
Tuesday 8 September 2026
Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
Tuesday 8 September 2026
Taiwan and Saxony start building the talent pipeline behind TSMC's German fab
TSMC's investment in a fab in Germany's Free State of Saxony has drawn close attention from across Europe. Eva Ins Obergfell, Rector of Leipzig University, one of Germany's leading...
Tuesday 8 September 2026
Interview: California companies highlight synergy between the state and Taiwan
This year's SEMICON Taiwan saw companies worldwide flock to Taipei to learn new industry developments and score potential business opportunities. Many came from elsewhere in Asia,...
Tuesday 8 September 2026
Black Sesame, Horizon Robotics unveil China's smart driving chip race

China's intelligent driving market continues to surge, with Black Sesame Technologies and Horizon Robotics both reporting solid top-line...

Tuesday 8 September 2026
Taiwan sets out 2027 plan to reinforce AI, chip leadership
Taiwan plans to deepen its role in global technology supply chains as demand for AI chips, advanced packaging, and memory tightens worldwide. A new policy agenda aims to bolster semiconductor...
Monday 7 September 2026
How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis
As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to...
Monday 7 September 2026
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...