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Tuesday 1 September 2026
SEMI lifts 2028 wafer fab equipment forecast to US$220 billion
SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
Tuesday 1 September 2026
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
A Chinese court has ordered the freezing of more than CNY2.14 billion (approx. US$318 million) in domestic assets belonging to Dutch semiconductor manufacturer Nexperia and its equipment...
Tuesday 1 September 2026
Imec maps chip scaling to 2040, says AI's next gains need full-stack integration
Imec has extended its advanced semiconductor roadmap into the early 2040s, arguing that sustained AI scaling will depend on closer integration across logic, memory, interconnects and...
Tuesday 1 September 2026
TSMC delays CoWoS orders as CoPoS plans take shape
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Tuesday 1 September 2026
JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts
JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
Tuesday 1 September 2026
South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain
A South Korean-Indian joint venture has completed a semiconductor materials plant in South Korea, aiming to strengthen regional supply chains for photoresist materials and reduce reliance...
Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Tuesday 1 September 2026
SEMICON Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
SEMICON Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Tuesday 1 September 2026
Samsung weighs HBM4 bonuses as memory, foundry teams align
Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
Tuesday 1 September 2026
Luxnet eyes orders through 2028, DCI revenue set to double in 2027
AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming...
Tuesday 1 September 2026
Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story
Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
Tuesday 1 September 2026
China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
Monday 31 August 2026
Gudeng sees double-digit advanced packaging growth from 2027
Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...