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Thursday 14 May 2026
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
Thursday 14 May 2026
Analysis: Samsung labor standoff underscores diverging Taiwan-Korea semiconductor workforce models
The ongoing Samsung Electronics labor dispute highlights sharply different labor models in South Korea and Taiwan, where firms such as TSMC operate with minimal union presence and...
Thursday 14 May 2026
ASMedia reports record profit as it expands beyond PC chips into AI and automotive
Despite weakness in the personal computer market, surging DDR5 memory prices, and tight CPU supply, ASMedia Technology posted record results in the first quarter of 2026, underscoring...
Thursday 14 May 2026
Samsung and SK Hynix rush to expand capacity as AI memory demand soars
The artificial intelligence(AI) boom is triggering an unprecedented expansion race among the world's largest memory chipmakers.
Thursday 14 May 2026
MediaTek courts Intel as Google pushes for alternatives to CoWoS
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
Thursday 14 May 2026
Lam Research to hire 1,000-plus engineers in Taiwan on AI chip demand
Lam Research said it will hire more than 1,000 professional engineers in Taiwan in 2026 as customer demand mounts and the company expands technical support services for foundry, memory...
Thursday 14 May 2026
China's semiconductor godfather warns against 2nm fixation
While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply...
Thursday 14 May 2026
Korea races to narrow chip packaging gap with Taiwan and China

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small...

Thursday 14 May 2026
GlobalWafers gains SBTi approval for 1.5°C-aligned emissions cuts and net-zero plan
GlobalWafers announced that its greenhouse gas reduction targets passed review by the Science Based Targets initiative, signaling the wafer maker has aligned its decarbonization pathway...
Wednesday 13 May 2026
Intel's preliminary Apple deal puts Samsung's foundry ambitions under pressure

Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker...

Wednesday 13 May 2026
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
Wednesday 13 May 2026
ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...
Wednesday 13 May 2026
SEMI says global semiconductor materials market hit record US$73.2 billion in 2025

The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest...

Wednesday 13 May 2026
Samsung labor talks collapse as bonus dispute threatens chip output
Samsung Electronics and its largest labor union failed to reach a pay deal following government-mediated talks, raising the risk of an 18-day strike beginning May 21, 2026, that could...
Wednesday 13 May 2026
Samsung Foundry comeback takes shape—AI chips, HBM4 lift 4nm demand
Samsung Electronics' foundry business is showing signs of recovery after a prolonged downturn, as AI chip projects and HBM4-related demand begin to raise utilization at its advanced-process...