CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Thursday 17 September 2026
Charts: Taiwan's chip packaging growth runs deeper than ASE

Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

Thursday 17 September 2026
TSMC's C.C. Wei says to solve problems, put customers first
TSMC chairman C.C. Wei and co-COO Y.J. Mii joined a forum on September 15, 2026, where Wei shared lessons from school, R&D and corporate management with National Taiwan University...
Thursday 17 September 2026
Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being...

Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory...

Wednesday 16 September 2026
Taiwan, South Korea should stop comparing, says DIGITIMES chairman

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve...

Wednesday 16 September 2026
India's Eastern state clears SiCSem's SiC unit in SEZ
The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and...
Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
US-based Teradyne opens Bengaluru office to support India's semiconductor push
Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
Wednesday 16 September 2026
Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...