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Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
Tuesday 20 October 2026
Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
Tuesday 20 October 2026
US firms eye Malaysia to diversify rare earth supply chains
More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to...
Tuesday 20 October 2026
Taiwan anchors US chip revival, SEMICON West spotlights trusted partners
SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting...
Tuesday 20 October 2026
AI servers drive TVS and ESD demand for Yea Shin Tech
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...
Tuesday 20 October 2026
Daeduck Electronics targets 2029 ceramic substrates for AI packaging
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...
Tuesday 20 October 2026
Amkor triples Gwangju investment as AI packaging demand grows
Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...
Tuesday 20 October 2026
TPK targets 2028 TGV mass production with NT$6 billion investment
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Tuesday 20 October 2026
Commentary: Samsung's US 2nm ramp faces no room for error
Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, as Tesla's AI5 chip delivery schedule and...
Tuesday 20 October 2026
Hanmi Semiconductor establishes US hub to support AI packaging customers

Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

Tuesday 20 October 2026
Nvidia seeks Taiwan government affairs director amid deeper local push
Nvidia is actively recruiting for a director of government affairs in Taiwan, as it deepens its presence on the island. The role is responsible for developing and executing government...
Tuesday 20 October 2026
MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...