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    NEWS TAGGED IC MANUFACTURING
    Tuesday 25 August 2026
    Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
    Nexperia China is accelerating its separation from the Dutch chipmaker's traditional European manufacturing network, raising the prospect that one of the world's largest suppliers...
    Tuesday 25 August 2026
    Nexperia China rebuilds 12-inch local supply chain after 330 days
    Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
    Tuesday 25 August 2026
    China foundry Nexchip breaks beyond display chips: CIS reaches 25% of revenue
    Nexchip Semiconductor reported higher first-half 2026 revenue as broadening demand for CMOS image sensors, power management chips and display drivers diversified its product mix, even...
    Tuesday 25 August 2026
    Samsung Foundry sees higher 4nm volumes as Nvidia ramps Groq 3
    Nvidia's Groq 3 ramp is adding meaningful 4nm volume to Samsung Electronics' foundry business, with monthly wafer input estimated at about 10,000 and expected to rise above 15,000...
    Tuesday 25 August 2026
    China power chip makers CRM, Silan post sharp 1H profit gains
    China Resources Microelectronics (CRM) and Hangzhou Silan Microelectronics (Silan), two of China's leading integrated device manufacturers, reported strong first-half 2026 results...
    Tuesday 25 August 2026
    TSMC suppliers reportedly plan Taiwan plant for critical chipmaking tubing
    Taiwan's semiconductor supply chain is moving to close a gap that turned costly during the industry's last major crunch: the plastic tubing that carries chemicals through chip fabs...
    Tuesday 25 August 2026
    Kulicke and Soffa names Raj Talluri as CEO
    Kulicke and Soffa Industries has appointed Raj Talluri as president and chief executive officer, a leadership change that may influence the company's strategy in semiconductor equipment...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

    Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders...

    Tuesday 25 August 2026
    Broadcom's debt push signals AI compute is becoming Wall Street asset class
    The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Tuesday 25 August 2026
    Inergy server share hits 47% on cooling, BBU demand

    Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

    Tuesday 25 August 2026
    Applied Materials executive says data centers set new AI competition standard

    Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of...

    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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