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Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

Monday 8 June 2026
Onsemi promotes 800 VDC power architecture for future AI infrastructure
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging...
Monday 8 June 2026
T3EX expands Northeast Asia air freight to serve electronics and chip supply chains
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global...
Sunday 7 June 2026
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to...

Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain...
Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Friday 5 June 2026
OECD data show China-based semiconductor makers receive outsized industrial support
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial...
Friday 5 June 2026
Samsung's biggest union loses majority status after bonus talks
Samsung Electronics is facing a new shift in labor relations after the Samsung Electronics branch of the Samsung Group Super-Enterprise Union reportedly lost its status as a majority...
Friday 5 June 2026
Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge...
Friday 5 June 2026
NXP chief says factories will lead robot adoption globally
Industrial factories are likely to become the first major market for robots at scale, according to Rafael Sotomayor, NXP President and CEO, who said manufacturers want stable systems,...
Friday 5 June 2026
Sambanova challenges GPU dominance in AI inference at Computex
SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall — and to demonstrate,...
Friday 5 June 2026
Huawei's Tau Law stirs debate over China's post-Moore's Law chip path

Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed...

Friday 5 June 2026
Infineon India moves up the value chain as AI data centers boost power-chip demand
Infineon Technologies' India operations are moving beyond traditional engineering support into global ownership roles, as rising demand from AI data centers reshapes the power semiconductor...