News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Wednesday 17 June 2026

Poland turns to Taiwan to build up chips as Foxconn seals EV assembly deal

Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains...

Wednesday 17 June 2026

EssilorLuxottica, Applied Materials team up on smart eyewear technology

EssilorLuxottica and Applied Materials have agreed to a long-term partnership to speed development of intelligent optical systems for augmented reality and AI-powered smart eyewear,...

Wednesday 17 June 2026

PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth

Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...

Wednesday 17 June 2026

Amkor alone cheers 10-year TSMC packaging deal in Arizona

Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move...

Wednesday 17 June 2026

Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Wednesday 17 June 2026

Huawei raises end-consumer product prices from July

Huawei has notified partners and channel distributors that it will raise end-customer prices across its Intelligent Collaboration product line from July 1 this year, as the AI computing...

Tuesday 16 June 2026

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...

Tuesday 16 June 2026

AI chip race sends semiconductor equipment sales to record US$36.55 billion

Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...

Tuesday 16 June 2026

China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026

China's Nexchip breaks into foundry top eight after AI demand lifts market to record numbers

AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip...

Tuesday 16 June 2026

TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P

Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...

Tuesday 16 June 2026

Samsung reportedly deepens foundry ties with Elon Musk's companies as turnaround timeline pushes toward 2028

Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging...

Tuesday 16 June 2026

South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors

South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according...

Tuesday 16 June 2026

Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

Tuesday 16 June 2026

TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

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