Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...

Pluggable front-panel optics still own the market, but Arista co-founder Andy Bechtolsheim gave them a deadline at an OCP APAC panel...

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic...

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after...

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...