At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai...
LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
The UK wants to understand how Taiwan built such a successful semiconductor ecosystem, said Andy McLean, CEO of the UK Semiconductor Center, at a forum organized by Taiwan's Ministry...
On the eve of the opening of SEMICON Taiwan 2026, the Ministry of Economic Affairs (MOEA) hosted the Semicon Network Summit, where President Ching-Te Lai said Nvidia invests and procures...
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...
As artificial intelligence demand drives astronomical growth in advanced chip manufacturing, the semiconductor industry is hitting critical resource bottlenecks. Speaking at SEMICON...
