News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Monday 7 September 2026

Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV

China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...

Monday 7 September 2026

JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion

JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...

Monday 7 September 2026

India says it cannot build electronics without China and has started easing the rules to prove it

India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built...

Monday 7 September 2026

Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens

AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...

Monday 7 September 2026

Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports

As the world's most powerful enterprise data centers undergo a massive migration to liquid cooling to support high-power artificial intelligence processors, a Silicon Valley chipmaker...

Monday 7 September 2026

China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

Monday 7 September 2026

No foundry price relief before 2027 as utilisation nears 90%

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

Monday 7 September 2026

Experts say subsidies can't buy semiconductor competitiveness

At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC...

Monday 7 September 2026

AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein

AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...

Monday 7 September 2026

India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments,...

Sunday 6 September 2026

BenQ Materials targets CPO in semiconductor push

BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...

Sunday 6 September 2026

TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy

Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...

Sunday 6 September 2026

Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...

Sunday 6 September 2026

Tongtai doubles semiconductor orders on AI data-center demand

Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...

Sunday 6 September 2026

Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem

In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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