Intel will keep working with Elon Musk on Terafab, according to Bloomberg. Intel CEO Lip-Bu Tan stated that the company will stay involved in Musk's plan to make cutting-edge...
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability,...
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...
The traditional market divide between the third-generation semiconductors gallium nitride (GaN) and silicon carbide (SiC) is seeing greater overlap in 2026, with SiC increasingly encroaching...
India's young chip industry is becoming a contest among the world's largest semiconductor equipment makers, with Canon the latest to declare its interest. The race remains at an early,...
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
TSMC has not officially announced anything, but Taiwan's semiconductor facility engineering supply chain is already rushing to Texas after reports that the company is discussing a...
AMD CEO Lisa Su said the company plans to further increase investment in Taiwan's semiconductor supply chain as demand for CPUs, GPUs, and AI computing continues to outpace available...
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have released the 15th Five-Year Plan for the development of the electronic...
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
The direction of global corporate investment in physical assets is becoming clearer. According to the fDi Report 2026 and an analysis by Visual Capitalist, announced greenfield...
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan...
Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid...
