China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty...

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology...

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...