News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Friday 19 September 2025

Imec CEO calls CMOS 2.0 the anchor for AI’s future

Dr. Luc Van den hove, president and CEO of Belgian research institute imec, used his keynote at SEMICON Taiwan 2025 to call for a global...

Friday 19 September 2025

Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory...

Friday 19 September 2025

Analysis: After Nvidia invests in Intel, who's next?

Intel has secured another high-profile backer. Following earlier commitments from SoftBank and the U.S. government, Nvidia has announced...

Friday 19 September 2025

Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry

NVIDIA has announced it will invest US$5 billion in Intel, purchasing shares at US$23.28 each. The move surprised no one in the semiconductor...

Thursday 18 September 2025

Nvidia invests US$5 b in Intel CPU-GPU pact, viewed as TSMC positive, says DIGITIMES analyst

Nvidia and Intel announced a wide-ranging collaboration to jointly develop data center and personal computing products that integrate both companies' technologies. The agreement centers...

Thursday 18 September 2025

Taiwan bets big on silicon photonics to capture US$100 billion global market

Taiwan is racing to advance its silicon photonics capabilities, aiming to develop high-efficiency 400Gbps optical modules within one to two years, according to the Ministry of Economic...

Thursday 18 September 2025

CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands

Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...

Thursday 18 September 2025

FPT eyes leadership in Vietnam's semiconductor packaging and testing sector

Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in...

Thursday 18 September 2025

Commentary: China's tech industry eyes global expansion at homegrown expos

A pair of major technology expositions in China has concluded, offering a look into the country's tech supply chain, which is navigating US trade tensions with a firm commitment to...

Thursday 18 September 2025

Baidu's Kunlun chip nab China Mobile contract, but still trails Huawei Ascend ecosystem

Baidu, one of China's leading internet companies, has cultivated its in-house Kunlun chip for years and recently secured a significant contract with China Mobile, marking the first...

Thursday 18 September 2025

White House taps Samsung for health tech initiative, sidelining Chinese rivals

Samsung Electronics is the only South Korean tech company invited to a new US government initiative focused on modernizing the nation's healthcare system. The program, dubbed "Make...

Thursday 18 September 2025

EU and Japan plan joint rare earth development in Greenland to reduce reliance on G2 supply

Amid uncertainties posed by major powers such as the US and China, Japan and Europe are strengthening their ties. The scope of Japan-EU cooperation could potentially expand to include...

Thursday 18 September 2025

Taiwan's Transcom deepens investment in defense and satellite communications

Transcom, a specialist in high-power amplifiers, is making bold strides into the dual frontiers of national defense and space communications...

Thursday 18 September 2025

Nvidia, TSMC face antitrust scrutiny as US-China tensions spotlight market power

Just as Washington and Beijing are preparing to resume trade talks, China's State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused...

Thursday 18 September 2025

Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4

Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment...

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