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Wednesday 5 August 2026
Infineon sees AI demand outpacing supply as customers lock in long-term capacity

Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign...

Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026
Vanguard International Semiconductor sees AI demand lift mature-node prices through 2027
Demand for power management ICs (PMICs) driven by artificial intelligence (AI) servers continues to grow, accelerating the recovery of mature-node processes. Vanguard International...
Wednesday 5 August 2026
Vanguard International Semiconductor lifts 2Q26 profit on AI server chip demand
Vanguard International Semiconductor (VIS) reported stronger second-quarter 2026 results on higher demand for AI server power management ICs, customer restocking and higher average...
Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Manz opens Tainan R&D center for advanced packaging equipment

Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging...

Wednesday 5 August 2026
Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Wednesday 5 August 2026
Powerchip says family succession plan remains unchanged
Powerchip Semiconductor Manufacturing Corporation said on August 4, 2026, that the death of chairman Frank Huang has not changed the group's ownership structure, management team, or...
Wednesday 5 August 2026
South Korea's KRW500B SiC push stalls as low returns deter major companies

South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
PSMC sees stronger 2H, says strategy unchanged after chair's death

Powerchip Semiconductor Manufacturing Corp. (PSMC) will maintain its existing strategy following the sudden death of Chairman Frank...