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Thursday 4 June 2026
TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and...
Thursday 4 June 2026
Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom
Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026,...
Thursday 4 June 2026
TSMC sees no sign of capex slowdown as demand stays strong
TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US,...
Thursday 4 June 2026
Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

Thursday 4 June 2026
EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Thursday 4 June 2026
Exclusive: How China's subsidized SiC boom is driving global prices to the floor
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
Thursday 4 June 2026
SK and TSMC deepen HBM, advanced packaging tie-up
SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
Thursday 4 June 2026
BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed...
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs...

Thursday 4 June 2026
Taiwan courts the world's AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its...
Thursday 4 June 2026
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of...
Thursday 4 June 2026
Taiwan's Walsin Technology gains pricing power from AI demand

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will...

Wednesday 3 June 2026
MIPS CEO makes the case for RISC-V in physical AI at Computex forum
Sameer Wasson, CEO of MIPS by GlobalFoundries, spoke at the MIPS Forum at Computex 2026 on June 3 in Taipei, held at the Taipei Courtyard by Marriott Nangang — one day after...