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Tuesday 27 October 2026
Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk
In its preliminary IPO registration statement filed with the US Securities and Exchange Commission, Anthropic describes how much of its capacity depends on a small group of chip and...
Tuesday 27 October 2026
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Tuesday 27 October 2026
Amkor turns to customer prepayments as global packaging investment accelerates
Amkor Technology is using customer prepayments and longer-term commitments to support an expanding manufacturing network across the US, South Korea, and Vietnam, as demand for advanced...
Tuesday 27 October 2026
Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness
Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted...
Tuesday 27 October 2026
Cheng Mei develops materials for advanced packaging glass substrates
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
Monday 26 October 2026
Taiwan wafer-testing supplier Hermes Testing Solutions commits more than US$215 million to advanced chip testing expansion
Hermes Testing Solutions Inc. (HTSI), a semiconductor wafer-testing solutions provider, is expanding its Taiwan operations. Its board approved budget authorisations on October 22 for...
Monday 26 October 2026
Podcast highlights: TSMC's 3nm demand story, Samsung HBM shift, and A14 ramp
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market...
Monday 26 October 2026
India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line
India's tech push opens markets unevenly: foreign suppliers get first crack at Tata's fab, Lam courts local vendors, Jio's IPO tests its 5G pitch, and CleanMax powers AI data cente...
Sunday 25 October 2026
Texas Instruments sees up to $1,000 in chip content per humanoid robot as analog supply tightens
Texas Instruments (TI) held its latest earnings call this week, projecting fourth-quarter 2026 revenue of US$5.8 billion to US$6.3 billion. The midpoint of its guidance is broadly...
Sunday 25 October 2026
Tesla-SpaceX merger tests whether Musk's technology empire is worth more together
Since Elon Musk publicly confirmed that Tesla and SpaceX are evaluating a potential merger, the prospect has stirred widespread speculation over what could become the largest corporate...
Friday 23 October 2026
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Japan's Leading-edge Semiconductor Technology Center (LSTC), Hokkaido University, Fujifilm Corporation, GE HealthCare Japan, and imec announced a joint initiative in Tokyo on October...
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The...
Friday 23 October 2026
Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap
Samsung Electronics has ordered additional equipment to fill the remaining space at its first foundry fab in Taylor, Texas, a move that would lift the plant's 2nm capacity to 20,000...
Friday 23 October 2026
TSMC advances CoPoS packaging at Taoyuan Longtan site
TSMC's Longtan Science Park Phase 3 in Taoyuan is restarting after nearly three years of delays, with Taiwan's National Development Council approving its development plan on September...
Friday 23 October 2026
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a...