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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    9h 17min ago
    LB Semicon begins shipments to Qualcomm after two-year partnership
    9h 17min ago
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    9h 18min ago
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    9h 18min ago
    CPO testing shifts upstream as equipment makers vie for integration lead
    9h 18min ago
    NEWS TAGGED IC MANUFACTURING
    Thursday 3 September 2026
    CHPT spans wafer to system-level testing
    Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
    Thursday 3 September 2026
    China chip tool makers expand beyond import substitution at CSEAC 2026

    China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

    Thursday 3 September 2026
    KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid
    Korea Electric Power Corp. (KEPCO) has proposed that Samsung Electronics and SK Hynix prepay as much as KRW25 trillion (approx. US$18 billion) in electricity bills as South Korea looks...
    Thursday 3 September 2026
    Semiconductor sustainability shifts to cost control as fab resource demand surges

    Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

    Thursday 3 September 2026
    Broadcom says CPO fits scale-out better than scale-up
    Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
    Thursday 3 September 2026
    Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
    Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
    Thursday 3 September 2026
    Solomon leverages AI vision and optical tech to tap semiconductor inspection market
    Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies...
    Thursday 3 September 2026
    TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning
    TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...
    Thursday 3 September 2026
    Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
    Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
    Thursday 3 September 2026
    AUO unit eyes TSMC ecosystem as merger benefits emerge
    AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly...
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Thursday 3 September 2026
    AI substrate shortages widen as Unimicron signals capacity support through 2029
    Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
    Thursday 3 September 2026
    Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America
    US Commerce Secretary Howard Lutnick has confirmed that the Trump administration is preparing a new round of semiconductor tariffs built around an exemption for companies that manufacture...
    Thursday 3 September 2026
    CPO material race widens as Taiwan eyes key role
    At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
    Thursday 3 September 2026
    SK Hynix wafer purchases jump 104% on AI demand
    SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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