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Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung faces delays securing 2nm customers as 4nm capacity reaches full utilization
Samsung Electronics' foundry business has yet to finalize contracts with major global technology companies for its 2nm process, while demand has pushed its 4nm production lines close...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Wednesday 21 October 2026
Taiwan's September export orders jump 62.4% on AI demand
Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
Wednesday 21 October 2026
Foreign suppliers stand to gain first as India's chemical makers chase Tata's chip fab
India's first commercial chip fab is opening a long-awaited new market for the country's chemical makers, but the companies best placed to profit in the near term are Japanese, South...
Wednesday 21 October 2026
Japan plans JPY400 billion boost for Rapidus 2nm push
Japan plans to provide an additional JPY400 billion (US$2.5 billion) to support Rapidus' advanced semiconductor production between fiscal 2027 and fiscal 2029, as the government seeks...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
Tuesday 20 October 2026
Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...
Tuesday 20 October 2026
US firms eye Malaysia to diversify rare earth supply chains
More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to...
Tuesday 20 October 2026
Taiwan anchors US chip revival, SEMICON West spotlights trusted partners
SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting...
Tuesday 20 October 2026
AI servers drive TVS and ESD demand for Yea Shin Tech
AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...
Tuesday 20 October 2026
Daeduck Electronics targets 2029 ceramic substrates for AI packaging
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...