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Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Panjit upgrades hot swap tech to drive 2H26 growth
AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...

Monday 22 June 2026
Samsung sees ongoing SoC losses drag down System LSI's 2026 performance
In a rare public admission during an internal briefing, Park Yong-In, president of the System LSI Business of the Device Solutions (DS) Division at Samsung Electronics, expressed concern...
Monday 22 June 2026
Weekly news roundup: Micron CEO turns visa rejection into US$1 trillion milestone; Taiwan LED makers look beyond lighting
Below are the most-read DIGITIMES Asia stories from the week of June 15-21, 2026:
Monday 22 June 2026
MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

Monday 22 June 2026
Ma-tek ramps silicon photonics testing investment with first system due in August

Semiconductor testing and analysis service provider Ma-tek held its annual shareholders' meeting on June 18. Chairperson Yong-Fen Hsieh...

Monday 22 June 2026
Tongtai expands aerospace, AI and semiconductor push under new board

Taiwan-based Tongtai Machine & Tool is accelerating its transformation toward high-value manufacturing, leveraging growing opportunities...

Saturday 20 June 2026
US raises alarm over possible EUV machine in China, putting ASML on the defensive
The Trump administration has confronted ASML with concerns that one of the Dutch company's most advanced chip-making machines may have made its way into China in violation of US-led...
Saturday 20 June 2026
Surging AI power demand pushes data centers toward higher-voltage designs

As AI computing continues to scale, power systems are facing sharper load swings, along with rising requirements for power density and...

Friday 19 June 2026
Samsung Foundry to make Claros power-management chips for AI data centers

Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup,...

Friday 19 June 2026
Apple to work with Intel on US chip design and manufacturing, Trump says
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform...