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    US expands China lab ban, testing orders shift to Taiwan
    2min ago
    MAtek sees record March revenue as AI and silicon photonics boost testing demand
    15min ago
    South Korea targets 2035 i-SMR commercialization, Doosan Enerbility eyes global contract manufacturing lead
    17min ago
    E Ink's trade-show shift spotlights rivalry and could accelerate ChLCD commercialization
    17min ago
    Analysis: Agent computers target next PC role, push AI compute to the edge
    18min ago
    GlobalWafers' 12-inch line to run full in 2Q26 as wafer utilization rises
    18min ago
    Asustek posts record March and 1Q26 revenue on strong AI server demand
    24min ago
    Taiwan accelerates SiPh and materials breakthroughs for next-gen AI computing
    38min ago
    SK Hynix M15X reportedly ramps early production
    47min ago
    NEWS TAGGED IC MANUFACTURING
    Friday 10 April 2026
    Merck's material and equipment push could speed CPO and advanced packaging adoption
    Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...
    Friday 10 April 2026
    MPI posts record 1Q26 revenue, invests NT$2B in Hsinchu plant expansion
    Semiconductor test interface leader MPI reported a new quarterly revenue high in the first quarter of 2026, driven by strong demand for AI-related chip testing and signaling sustained...
    Friday 10 April 2026
    China's export controls spark 140x yttrium price surge, fueling chip equipment fears
    Yttrium, a critical rare earth element used in semiconductor manufacturing equipment, has seen its global supply tighten sharply due to China's export restrictions, driving prices...
    Friday 10 April 2026
    TSMC smashes records with massive 45% revenue surge in March

    Tech giant TSMC has released a blockbuster revenue report for March 2026, signaling an extraordinary acceleration in the semiconductor sector.

    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Friday 10 April 2026
    MetaOptics bets on Taiwan to scale metalens for AI, next-gen optics
    MetaOptics, a Singapore-based metalens developer, is partnering with Taiwan's Pin-Jye Nano Technologies to scale production of next-generation optical components as the technology...
    Friday 10 April 2026
    Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
    In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology...
    Friday 10 April 2026
    Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
    Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
    Friday 10 April 2026
    Column: Corintis uses algorithms to target chip hotspots for precise cooling
    As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
    Friday 10 April 2026
    Intel–Google alliance reframes AI infrastructure around CPUs
    A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...
    Friday 10 April 2026
    MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
    In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer...
    Friday 10 April 2026
    CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
    Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...
    Friday 10 April 2026
    Exclusive: Samsung weighs Vietnam semiconductor testing facility

    According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

    Friday 10 April 2026
    Samsung and SK Hynix reportedly secure long-term helium contracts with US firms

    Industry sources report that the recent supply concerns over semiconductor-grade helium triggered by the US-Iran conflict have eased,...

    Friday 10 April 2026
    Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
    As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook