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Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...
Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
US-based Teradyne opens Bengaluru office to support India's semiconductor push
Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
Wednesday 16 September 2026
Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Wednesday 16 September 2026
Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era
Taiwan's National Science and Technology Council (NSTC) is accelerating efforts to advance chip manufacturing beyond the 1nm node, targeting key breakthroughs in next-generation materials,...
Wednesday 16 September 2026
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
AI server tracker: BMC, cable, case suppliers post August 2026 gains

Taiwan's AI server supply chain continued to show strong year-over-year growth in August, although performance varied significantly...

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Wednesday 16 September 2026
Chip revenue heads to US$2.4 trillion on price, not volume, Yole says
The semiconductor industry is on track to nearly quadruple in revenue by 2031 while shipping barely more silicon than it does today, a divergence that makes pricing power, not capacity,...
Tuesday 15 September 2026
China's Guoxin Micro buys its way into power-chip manufacturing

Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese...