CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Thursday 24 September 2026
LG sharpens focus on data centers, robotics, chip materials

LG Group is sharpening its focus on data centers, robotics, semiconductor materials, and enterprise AI as the South Korean conglomerate...

Thursday 24 September 2026
AI drives Episil GeSi, PMIC growth

Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth...

Thursday 24 September 2026
Chinese foundry CanSemi seeks US$918M ChiNext listing
Guangzhou-based wafer foundry CanSemi Technology has set its initial public offering (IPO) price at CNY12.01 per share on Shenzhen's ChiNext board. The company aims to raise CNY6.16...
Thursday 24 September 2026
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Thursday 24 September 2026
ASML system sales in Europe remain at zero as EU debates Chips Act 2.0

European Union industry ministers are set to debate the proposed Chips Act 2.0 in Brussels on September 24, days after a senior ASML...

Thursday 24 September 2026
South Korea chip, panel lines stay on as AI, iPhone demand surges

South Korea's major semiconductor, display, and electronics parts factories are staying open through the Chuseok holiday as AI-driven...

Thursday 24 September 2026
Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push
Qualcomm is sticking with TSMC for both of its newly launched 2nm Snapdragon flagship processors, extending the Taiwan foundry's hold on Qualcomm's top-tier mobile chips even as Samsung...
Thursday 24 September 2026
Xi-Trump summit masks AI rift as Chinese AI leaders stay away
Chinese President Xi Jinping is set to make his first state visit to the US since 2015, with the Trump administration rolling out high-level welcoming ceremonies, a state dinner and...
Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Thursday 24 September 2026
Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise
Eternal Materials reported unaudited earnings before taxes (EBT) of NT$269 million (approx. US$8.47 million) in August 2026, up 28.05% from August 2025, with pre-tax earnings per share...
Thursday 24 September 2026
Powertech targets quarterly growth in 2026, eyes record high

Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end...

Thursday 24 September 2026
Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use

Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity...

Thursday 24 September 2026
LSTC links with Rapidus to revive Japan's advanced chipmaking

Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans...

Wednesday 23 September 2026
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement...
Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...