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Wednesday 23 September 2026
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement...
Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...

Wednesday 23 September 2026
Hermes-Epitek eyes CPO test revenue in 2027

Archie Hwang, the founder and chairman of Hermes-Epitek, appeared before the media alongside Hermes Testing Solutions Inc. (HTSI) executives...

Wednesday 23 September 2026
Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

Nexperia China is accelerating production on its domestic 12-inch wafer platform as it rebuilds a locally controlled semiconductor supply...

Wednesday 23 September 2026
Episil says AI demand marks structural shift in semiconductor epitaxy
Episil Precision said AI-related demand is reshaping semiconductor epitaxy for the long term, with effects reaching global power and optical supply chains. The Taiwan-based maker is...
Wednesday 23 September 2026
Taiwan's August export orders top US$100 billion as overseas production edges up

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month,...

Wednesday 23 September 2026
Taiwan courts Indian IIT chief in bid to boost chip talent ties
Taiwan is stepping up outreach to India's engineering sector as global competition for chip and artificial intelligence talent intensifies. The planned cooperation could affect supply...
Wednesday 23 September 2026
Win Semiconductors expands optical communications capacity with DUV tools
Optical communications capacity is in short supply as surging computing demand from AI data centers turns transmission into a bottleneck for AI infrastructure. The market is shifting...
Tuesday 22 September 2026
Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach
Hermes Testing Solutions began trading on the over-the-counter market on September 22, positioning itself to benefit from rising demand tied to artificial intelligence and high-performance...
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the...

Tuesday 22 September 2026
Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

The labor dispute at Micron Taiwan continues to escalate after Micron and the Taiwan Taoyuan Union failed to reach agreement at a second...

Tuesday 22 September 2026
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group...
Tuesday 22 September 2026
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...

Tuesday 22 September 2026
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...