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Wednesday 12 August 2026
FocalTech expects demand to improve in the second half of 2026
Touch controller and display driver IC maker FocalTech Systems said it saw revenue regain quarter-on-quarter momentum in the second quarter of 2026 as the 618 shopping festival, new...
Wednesday 12 August 2026
Intel's Israel fab stirs back to life, but case for 14A remains unconfirmed
Intel appears to be restarting work on Fab 38, its long-idle facility in Kiryat Gat, Israel, though how far the project will go — and whether it will ultimately run the company's...
Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic...

Wednesday 12 August 2026
MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027
The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...
Wednesday 12 August 2026
DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity
DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with...
Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
South Korea deepens semiconductor ceramics collaboration amid chip industry expansion

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Wednesday 12 August 2026
Lumentum targets US$2B quarterly run rate as optical capacity expansion accelerates

Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after...

Wednesday 12 August 2026
OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
Tsang Yow's semiconductor parts business drives profit growth in 2Q

Tsang Yow said its semiconductor equipment components business had become a major growth driver in July, as the Taiwan transmission-system...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...