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Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
Thursday 17 September 2026
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
Humanoid robots could reshape MEMS demand as physical AI advances
Humanoid robots have not yet reached mass adoption, but their sensor needs are already reshaping supply-chain expectations worldwide. Analysts and industry players say the next wave...
Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...

Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
Thursday 17 September 2026
South Korea's medical device city opens physical AI institute, aiming to train 1,400 workers in five years
Wonju, a South Korean city of about 360,000, roughly 90 minutes east of Seoul, opened a government-funded institute on Thursday, September 17, to train more than 1,400 workers in artificial...
Thursday 17 September 2026
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...
Thursday 17 September 2026
Physical AI targets factory assembly pain points

Deloitte Taiwan has warned that only 3% of companies have broadly integrated physical AI into operations, while just 5% say it has already...

Thursday 17 September 2026
DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and...
Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
Astera says customers are rethinking HBM needs for AI accelerators

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...

Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...