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Thursday 3 September 2026
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
Thursday 3 September 2026
JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
Thursday 3 September 2026
SB Energy eyes US listing as Nvidia commits US$1.5 billion
SB Energy, the data center and power infrastructure company under SoftBank Group, filed for an IPO with the US Securities and Exchange Commission (SEC) on September 1, planning to...
Thursday 3 September 2026
Thailand AiPASS unlocks premium AI after lessons
Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such...
Wednesday 2 September 2026
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Wednesday 2 September 2026
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
Wednesday 2 September 2026
Lam Research exec says automated preventive maintenance key to fabs of the future
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand
Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver...
Wednesday 2 September 2026
MediaTek pushes advanced packaging and supply chain to keep pace with AI
Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
Wednesday 2 September 2026
Operations shake-up: how SpaceX is reengineering its AI data center strategy
Elon Musk has restructured the SpaceX leadership team tasked with constructing the company's AI data centers, replacing several leaders with executives drawn from SpaceX's rocket and...
Wednesday 2 September 2026
Manus resumes independent operations after Meta deal collapses
Manus has resumed independent operations under its founding team, closing a turbulent chapter that began with Meta Platforms' multibillion-dollar acquisition of the AI agent startup...
Wednesday 2 September 2026
TCL CSOT bets on InP laser chips as supply tightens
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Wednesday 2 September 2026
Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%
Anthropic has released Claude Fable 5.1 and Claude Mythos 5.1, betting that cheaper agentic-AI economics and early scientific-research results will differentiate its latest models...
Wednesday 2 September 2026
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...