Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately...
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According...
Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers...
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Infineon said the rapid buildout of AI data centers and emerging Physical AI applications could reshape semiconductor demand worldwide. The shift signals higher infrastructure spending,...
Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense...
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
SB Energy, the data center and power infrastructure company under SoftBank Group, filed for an IPO with the US Securities and Exchange Commission (SEC) on September 1, planning to...
Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such...
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Exhibiting in the AI Technology Zone at Semicon Taiwan 2026, Zhen Ding Technology (ZDT) Group highlights two core product lines: 800G, 1.6T, XPO, and NPO high-end optical transceiver...
