China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...
As the high power density of AI data centers (AIDCs) becomes an increasingly pressing issue, industry experts are highlighting the importance of power management and power usage effectiveness...
Japan is stepping up its push into physical AI, with major technology companies and research institutions showcasing advances in autonomous robot learning, motion sensing, and agricultural...
Japan's automakers are presenting autonomous-driving systems that connect vehicles with road infrastructure as a route toward deployment, highlighting a strategic choice beyond vehicle-only...
As GenAI accelerates, e-commerce is shifting from traditional traffic management toward AI-assisted shopping and intelligent operations. Software-as-a-service (SaaS) e-commerce platform...
As interest rates fluctuate, bond yields rise, and Chinese AI models intensify competition, market attention is shifting from technological development and infrastructure expansion...
Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup...
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
Investment in AI data centers remains strong, but semiconductor growth is becoming increasingly concentrated in cloud AI, while the long-running decline in consumer technology prices...
As artificial intelligence increasingly blurs the boundary between the digital and physical worlds, complications associated with real-world deployment — particularly the extreme...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Anthropic plans to place new data centers in Australia away from densely populated areas, using renewable energy and previously developed sites to reduce conflicts with residents....
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
