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Tuesday 14 July 2026
South Korea exports top US$100B in a month, stoking chip dependence fears

South Korea's exports surpassed US$100 billion in a single month for the first time in June 2026, raising expectations that the country...

Tuesday 14 July 2026
Rambus unveils DDR5 9600 chipset for next-generation AI servers
Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...
Tuesday 14 July 2026
Google reportedly ramps up TPU push to court Nvidia-backed cloud providers

Google is intensifying its effort to expand adoption of its in-house Tensor Processing Units (TPUs), taking direct aim at Nvidia's...

Tuesday 14 July 2026
Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation...

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an...
Tuesday 14 July 2026
UMC pushes into silicon photonics in Singapore to ride AI's connectivity crunch
United Microelectronics Corp (UMC) is moving into silicon photonics, positioning itself to address one of the defining bottlenecks in artificial-intelligence data centers: the speed...
Tuesday 14 July 2026
US chases AI talent abroad as China strengthens its homegrown pipeline

The US can no longer close its artificial-intelligence talent gap with China through visa curbs or export controls alone, a new Hoover...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
Column: Physical AI's rivalry shifts from companies to states

At the Humanoids Summit in Tokyo at the end of May 2026, a conference that had originally focused on technology and commercialization...

Monday 13 July 2026
Nvidia's HVDC shift could reshape data center power chains worldwide
Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift...
Monday 13 July 2026
Egis sells part of iCatch stake as ASMedia becomes largest shareholder
Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was...
Monday 13 July 2026
AI's new gatekeepers: US and China tighten grip on frontier models

The world's most powerful AI models are encountering a new constraint beyond chips, data and engineering talent: governments increasingly...

Sunday 12 July 2026
Taiwan PCB leaders launch fundraising wave for AI data centers

Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates...

Sunday 12 July 2026
InP supply crunch leaves South Korea exposed
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
Saturday 11 July 2026
TV panel prices fall in July as weak demand expected to hit 3Q26

The global LCD TV panel market moved into a down cycle in July after prices held flat in the second quarter of 2026. With pre-build...