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Friday 19 June 2026
Research Insight: Fukuta expands small power modules as drones and robot dogs drive growth
As global EV market growth slows, motor makers that once relied on EV power systems are moving faster to find new growth engines. Fukuta has extended its accumulated design, integration, and manufacturing capabilities in automotive all-in-one power systems into miniaturized power module applications such as drones and quadruped robot dogs, reflecting a broader shift in resource allocation amid cooling EV growth.
Thursday 18 June 2026
Research Insight: Fukuta deepens EV moat with hub motors and thin silicon steel
As the global electric vehicle (EV) market enters a correction phase, automakers are demanding more from both cost and efficiency. Fukuta has been steadily extending the design, integration, and manufacturing capabilities it built in automotive multi-in-one power systems into smaller power module applications.
Wednesday 17 June 2026
Research Insight: Japanese automakers pivot to HEV profits, AI, and SDV
Toyota, Honda, and Nissan are accelerating strategy shifts as Chinese automakers rise rapidly, global EV competition intensifies, and software-defined vehicles (SDV) and AI advance, according to DIGITIMES Research. The research firm noted that Japanese automakers are moving away from scale expansion and toward profitability and smart-vehicle development, with hybrid electric vehicles (HEV) remaining the near-term growth anchor.
Thursday 11 June 2026
DIGITIMES Insight: Power, not chips, is now the binding constraint for AI data centers
During COMPUTEX 2026 and Nvidia GTC Taipei, energy once again dominated the AI data center conversation — only this time the question was not whether enough electricity existed, but whether it could arrive on time, arrive clean, and sustain 24/7 carbon-free operations.
Monday 18 May 2026
DIGITIMES Insight: Intel and AMD diverge as TSMC prepares price hikes
Global server markets may shift as DIGITIMES analyst Luke Lin says Intel's revenue gains stem largely from price rises while AMD posts stronger shipment-led growth. TSMC plans another price increase as customers prioritize capacity over cost, developments that could affect cloud providers, vendors, and data center economics worldwide.
Tuesday 12 May 2026
Research insight: Taiwan's auto tech pushes beyond components into autonomous systems
A DIGITIMES Research observation at the 2026 Taipei International Auto Electronics Show found that Taiwan's automotive electronics industry is steadily shifting from supplying individual components toward integrated systems spanning autonomous driving sensors, in-cabin safety, autonomous logistics vehicles, and localized supply-chain integration.
Monday 11 May 2026
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test
DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook.
Thursday 7 May 2026
Research Insight: AI memory boom squeezes automotive supply, driving costs higher
Autonomous driving and smart cockpit technologies are pushing vehicles to demand far more computing power and data processing. Memory has become a critical component in automotive system performance. But as demand surges, AI applications are reshaping the global memory supply chain — reallocating capacity and creating structural pressures that are tightening supply and driving up prices.
Monday 4 May 2026
Research Insight: Beijing auto show signals shift from vehicle launches to AI-driven supply chains
The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and integrated supply chain collaborations, DIGITIMES Research observed. The event showcased both domestic and foreign manufacturers alongside key automotive intelligence suppliers.
Monday 27 April 2026
DIGITIMES Insight: Will TSMC's 3nm expansion put Samsung's 2nm bid on the back foot?
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth memory supply and reshape competition with Micron Technology Inc.
Monday 23 March 2026
Research insight: F1's 2026 regulations reshape powertrain competition and accelerate low-carbon transition
With the 2026 Formula One (F1) season opener in Australia, the first competitive validation of the sport's new regulatory framework has already highlighted the impact of a fundamental powertrain shift. Mercedes-AMG secured a dominant one-two finish, underpinned by a clear performance gap. In qualifying, the team achieved a pole position lap time approximately 0.8 seconds ahead of the third-place competitor, while extending a lead of more than 15 seconds over Ferrari during the race.
Friday 20 March 2026
Research Insight: AI reshapes Taiwan's PCB industry around high-end capacity and materials
DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan's PCB industry is undergoing a structural shift in its growth model. The traditional cyclical, recovery-driven growth is giving way to competition centered on high-end capacity deployment, control of critical materials, and global expansion capabilities.
Monday 9 March 2026
Research Insight: Global EV charging stations to surpass 9 million by 2026 as China, Europe expand
Global public electric vehicle (EV) charging infrastructure is projected to reach 9.01 million stations worldwide by 2026, according to DIGITIMES Research. The market is expected to show increasing regional divergence as China and Europe maintain steady expansion, while momentum in the US softens.
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia
Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform to Japan's Fujitsu, marking a concrete step from roadmap promise to commercial deployment in the AI infrastructure race.