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Monday 1 June 2026
RoboSense dominates LiDAR for robotics with 1,458.8% YoY shipment surge in 1Q26
RoboSense Technology, an AI-driven robotics technology company, announced a historic first quarter of the year in which the robotics business exceeded 50% of total LiDAR shipments...
Monday 1 June 2026
MediaTek touts One MediaTek strategy, upbeat on ASIC ASPs
MediaTek held a media event ahead of Computex, with several top executives taking part as the company highlighted progress in AI data centers and its broader "One MediaTek" strategy...
Monday 1 June 2026
Actron moves into AI servers and power infrastructure after securing 70%+ global share in auto LLD/ULLD diodes
Taiwan-based Actron Technology expects stronger growth in its automotive semiconductor business as demand for its high-efficiency diode products has exceeded expectations amid tightening...
Monday 1 June 2026
Taiwan Mobile says D2C satellite services not urgent priority as AI drives data-center and power concerns
Taiwan Mobile told shareholders on May 29 that direct-to-cell satellite services are not an urgent need for Taiwan and that the satellite-to-phone business model still requires proof,...
Monday 1 June 2026
LG denies report on sale to Hisense TV as Chinese rivals gain ground
LG Electronics has denied a Korean media report that it discussed a possible sale or restructuring of its TV business with China's Hisense, as intensifying competition from Chinese...
Monday 1 June 2026
Interview: Sharp CEO taps Foxconn ecosystem for brand revival
Sharp President and CEO Tetsuji Kawamura said the company has eased some long-standing management pressures, but its main challenge now is to expand its brand, develop new businesses,...
Monday 1 June 2026
AWSC targets optical comms growth by 2027
AI data centers are driving increased demand for faster transmission worldwide, prompting compound semiconductor foundries to shift toward optical communications. Advanced Wireless...
Sunday 31 May 2026
AUO sees automotive orders setting up revenue gains from 2026
AUO said its automotive business has entered a high-growth phase, with annual orders for in-vehicle products now exceeding current-year revenue. The company expects revenue benefits...
Sunday 31 May 2026
The humanoid race is no longer about the robot — it's about who can deploy at scale
The conversation about humanoid robotics I observed over two days in Sunnyvale had a different quality from what I remembered a year ago. The demos were real. The deployments were...
Sunday 31 May 2026
AI demand and chip investment lift Taiwan exports and business outlook
Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development...
Sunday 31 May 2026
Taiwan Mobile sets sights on NT$1 trillion revenue as AI and enterprise services drive growth
Taiwan Mobile outlined plans to pursue a NT$1 trillion (US$31.88 billion) revenue target as it shifts emphasis to AI, enterprise services, and new technology businesses, executives...
Sunday 31 May 2026
Nan Ya Plastics targets three new business pillars to lift electronic materials to 60% by 2026
Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive...
Saturday 30 May 2026
AUO Micro LED CPO enters sampling stage
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing...
Saturday 30 May 2026
AI server testing firm Wendell prepares IPO for high-power lab unit on surging rack equipment demand

Wendell Industrial Co. held its 2026 annual shareholders' meeting on May 26, where chairman Kao Chih-hung said shareholders approved a proposal...

Saturday 30 May 2026
Innolux turns to packaging, smart cockpits in higher-margin push
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...