Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory...

Meta Platforms' second-quarter results showed a widening gap between its fast-growing advertising business and the cost of building...