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    CXMT valuation gap highlights uncertainty over China’s DRAM push
    Aug 3, 18:58
    Interview: Memory makers’ expansion drives up material costs and exposes FOUP shortages
    Aug 3, 18:57
    BYD accelerates in-house chip push with 4nm Xuanji A3
    Aug 3, 18:57
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    Aug 3, 18:57
    L&F Plus ships first samples from South Korea’s first LFP cathode mass-production line
    Aug 3, 18:56
    NEWS TAGGED BUSINESS
    Tuesday 4 August 2026
    Unitree sees 1H26 revenue rise over 35% on humanoid robot demand

    China's leading humanoid robot maker Unitree Technology expects first-half 2026 revenue to reach roughly CNY1.1 billion (US$155.8 million),...

    Tuesday 4 August 2026
    Reliability gaps keep just 5% of firms scaling AI agents, Chunghwa Telecom says

    As generative AI moves from personal productivity tools into enterprise operations, most companies are discovering that scaling AI...

    Monday 3 August 2026
    Coretronic's OLED and auto-display gains point to steadier growth as NB weakens
    Coretronic said its OLED monitor business is gaining traction as new production lines ramp up, while car displays continue to expand. The company expects full-year OLED monitor shipments...
    Monday 3 August 2026
    German carmakers turn defensive in China as sales and margins fall
    Germany's three biggest automakers have taken a cautious stance on China after reporting second-quarter 2026 results, as the market that once generated outsized profits becomes harder...
    Monday 3 August 2026
    Taiwan manufacturing business climate improves in June, headlined by electronics sector
    Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research...
    Monday 3 August 2026
    Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

    MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production...

    Monday 3 August 2026
    Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
    Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
    Monday 3 August 2026
    FICG launches Singapore-Malaysia dual-core strategy
    FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
    Monday 3 August 2026
    Elevated Materials names Jay Wang as chief revenue officer
    Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...
    Sunday 2 August 2026
    AWS chip business passes US$25 billion run rate; CEO Jassy says there is 'real chance' of selling Trainium outside AWS
    Amazon's custom silicon business has reached an annual revenue run rate of more than US$25 billion and is growing at triple-digit percentages yearly, CEO Andy Jassy said on the company's...
    Saturday 1 August 2026
    MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027
    MediaTek held an investor conference on July 31, 2026, with CEO Rick Tsai reiterating that ASIC revenue will reach US$2 billion in 2026. He also said the total addressable market for...
    Friday 31 July 2026
    ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

    Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

    Friday 31 July 2026
    ByteDance merges Lark with Doubao after AI revenue hits US$4B run rate
    ByteDance is reorganising Doubao, Lark and Volcengine around a more unified enterprise AI strategy, combining product development, cloud commercialisation and workplace software as...
    Friday 31 July 2026
    TSMC reportedly develops EMIB-like packaging to counter Intel

    TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

    Friday 31 July 2026
    AUO names current CFO president as Frank Ko steps down

    AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...

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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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