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Monday 3 August 2026
Taiwan manufacturing business climate improves in June, headlined by electronics sector
Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research...
Monday 3 August 2026
Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production...

Monday 3 August 2026
Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
Monday 3 August 2026
FICG launches Singapore-Malaysia dual-core strategy
FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
Monday 3 August 2026
Elevated Materials names Jay Wang as chief revenue officer
Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...
Sunday 2 August 2026
AWS chip business passes US$25 billion run rate; CEO Jassy says there is 'real chance' of selling Trainium outside AWS
Amazon's custom silicon business has reached an annual revenue run rate of more than US$25 billion and is growing at triple-digit percentages yearly, CEO Andy Jassy said on the company's...
Saturday 1 August 2026
MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027
MediaTek held an investor conference on July 31, 2026, with CEO Rick Tsai reiterating that ASIC revenue will reach US$2 billion in 2026. He also said the total addressable market for...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
ByteDance merges Lark with Doubao after AI revenue hits US$4B run rate
ByteDance is reorganising Doubao, Lark and Volcengine around a more unified enterprise AI strategy, combining product development, cloud commercialisation and workplace software as...
Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
AUO names current CFO president as Frank Ko steps down

AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...

Friday 31 July 2026
Apple braces for "hundred-year flood" in component costs
Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier...
Friday 31 July 2026
Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook
Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services...
Friday 31 July 2026
UMC raises capex to US$2B, eyes AI SiPh
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...
Friday 31 July 2026
Chang Wah sees broadening demand recovery and higher margins in 2Q26
Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...