Following recent reports of significant management changes at Turvo International Co., Ltd, President Steven Tsai addressed investors...

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Enterprise software company SAP announced on July 2 that it has appointed Verena Siow as president of the Asia-Pacific (APAC) region,...

Meta's reported plan to expand into cloud services is drawing fresh scrutiny from global investors and chip suppliers. The move could...

Renesas Electronics has completed the sale of its timing device business to US fabless semiconductor specialist SiTime, tightening its...

Cheng Mei Materials is expanding into semiconductor materials to support supply chain adjustments for outsourced chip assembly and...

Samsung Electronics used its annual foundry ecosystem event on July 1 to signal that its contract chipmaking business is regaining momentum,...