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Sunday 31 May 2026
AUO sees automotive orders setting up revenue gains from 2026
AUO said its automotive business has entered a high-growth phase, with annual orders for in-vehicle products now exceeding current-year revenue. The company expects revenue benefits...
Sunday 31 May 2026
The humanoid race is no longer about the robot — it's about who can deploy at scale
The conversation about humanoid robotics I observed over two days in Sunnyvale had a different quality from what I remembered a year ago. The demos were real. The deployments were...
Sunday 31 May 2026
AI demand and chip investment lift Taiwan exports and business outlook
Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development...
Sunday 31 May 2026
Taiwan Mobile sets sights on NT$1 trillion revenue as AI and enterprise services drive growth
Taiwan Mobile outlined plans to pursue a NT$1 trillion (US$31.88 billion) revenue target as it shifts emphasis to AI, enterprise services, and new technology businesses, executives...
Sunday 31 May 2026
Nan Ya Plastics targets three new business pillars to lift electronic materials to 60% by 2026
Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive...
Saturday 30 May 2026
AUO Micro LED CPO enters sampling stage
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing...
Saturday 30 May 2026
AI server testing firm Wendell prepares IPO for high-power lab unit on surging rack equipment demand

Wendell Industrial Co. held its 2026 annual shareholders' meeting on May 26, where chairman Kao Chih-hung said shareholders approved a proposal...

Saturday 30 May 2026
Innolux turns to packaging, smart cockpits in higher-margin push
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...
Saturday 30 May 2026
TSMC's test arm Xintec ramps wafer testing capacity for 2H26 growth
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...
Friday 29 May 2026
Compal accelerates server push with Texas plant and aims for 40% non-PC revenue
Compal Electronics said it was scaling up its server business and expects server revenue to reach 8-10% of total sales in 2026 as AI server rack-scale systems ramp and a new Texas...
Friday 29 May 2026
CPO to become the next major growth driver, says GSEO; future volumes could rival smartphone lenses
Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89...
Friday 29 May 2026
Foxconn says its quantum computing unit aims for commercial takeoff around 2030
Foxconn has said its quantum computing work is drawing international attention, but the main challenge remains turning research into a commercial business. The company's quantum efforts...
Friday 29 May 2026
Delta Electronics looks to micro grids as auto slugs through EV slowdown
Delta Electronics is leaning on artificial intelligence demand to sustain growth while preparing for longer-term opportunities in micro grids and higher-end automotive systems, even...
Friday 29 May 2026
Anthropic reaches US$965B valuation, placing it ahead of OpenAI
Anthropic's post-money valuation has reached US$965 billion after its newest funding round, more than doubling its value since February 2026 and putting it past its rival ChatGPT as...
Friday 29 May 2026
Intel's foundry comeback hinges on advanced packaging
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...