GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor...

Taiwan-based GaAs IC foundries and epitaxial wafer suppliers are set to enjoy strong sales in the fourth quarter of 2019 and beyond, driven by robust demand for VCSEL and PA (power...

US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.

Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Intel has unveiled its second-generation Optane storage-class memory codenamed Barlow Pass that will be launched along with its new-generation Xeon CPUs in 2020. Intel also disclosed...

Testing and measurement solution provider Chroma Ate reportedly has developed inspection tools for examining VCSEL components to be used in backend ToF (time of flight)-based cameras...

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...

The National Center for Research on Earthquake Engineering under government-sponsored the National Applied Research Laboratories (NARLabs) has disclosed it is developing a 3D smart...

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...

GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor...

To reinforce application of AI to the fashion industry, Hong Kong Polytechnic University (PolyU) has developed the world's first FashionAI Dataset in collaboration with e-commerce...

China's Yangtze Memory Technologies (YMTC) has kicked off volume production of 64-layer 256Gb TLC 3D NAND chips, according to indsutry sources.

China's state-owned Tsinghua Unigroup has clinched a deal with the Chongqing municipal government to build its DRAM operations headquarters, R&D and manufacturing facilities in...

Upgrades in smartphone specs and features such as facial recognition, all-screen design and enhanced camera capabilities continue to drive related chip and component demand this year,...

TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly con...

Himax Technologies has announced that the company is teaming up with GTS to allow its structural light 3D sensing solution to be adopted for factory automation.

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

Micron Technology has unveiled a new 12-inch fab at its manufacturing site for NAND flash memory in Singapore, and expects the facility to ramp up production in the second half of...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) has enjoyed a ramp-up in demand for vertical-cavity surface-emitting laser (VCSEL) components for use in smartphones...

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Chipmakers are aggressively improving their new 96-layer 3D NAND process yield rates, looking to have the technology become the mainstream in 2020, according to industry sources.

Apple has reportedly asked its supply chain partner to supply VCSEL components for use in rear ToF camera lens in its mobile devices to be released in 2020, according to supply chain...