Friday 15 September 2023
Mature-process NAND flash memory reportedly in tight supply because of Apple demand
NAND flash memory made using mature processes is reportedly in tight supply as a result of Apple's decision to adopt older generation NAND for its iPhone 15, which caught its memory...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
Smartphone APs likely to adopt 3D chips after 2025
Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off...
Friday 1 September 2023
3D IC still yet to be fully known, says Cadence executive
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Thursday 31 August 2023
Topco Scientific expands product offerings to CoWoS and 3D IC
Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...
Tuesday 29 August 2023
AVC upbeat about 3D vapor chamber demand
Cooling module maker Asia Vital Components (AVC), whose 3D vapor chambers (VC) are reportedly being certified by Nvidia, expressed optimism about 3D VC demand through 2024.
Monday 28 August 2023
Solomon showcases AI and 3D Vision solutions at Automation Taipei 2023
Solomon Technology unveiled a trainable AI system and an AI algorithm software package that can be efficiently downloaded onto mobile devices.
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Thursday 17 August 2023
Samsung said to mass produce over-300-layer 3D NAND chips in 2024 with double-stack process
To solidify its leading position in the NAND flash market, Samsung Electronics reportedly plans to again utilize a double-stack technology for manufacturing 3D NAND over 300 layers,...
Thursday 3 August 2023
AMD to adopt TSMC 3D SoIC tech in gaming notebook processors, say sources
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
Wednesday 2 August 2023
Nvidia, Apple, and Pixar establish 3D content OpenUSD Alliance
Nvidia, together with Apple, Pixar, Adobe, Autodesk, and the Linux Foundation's subsidiary, the Joint Development Foundation (JDF), recently announced the formation of the OpenUSD...
Thursday 27 July 2023
Samsung reportedly investing in R&D for 3D stacking GAA technology
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...
Friday 21 July 2023
Panel tech to become mature for AR/VR and naked eye 3D applications by 2030, says DIGITIMES Research
Panel technologies such as micro OLED, OLED on silicon (OLEDoS), and micro LED are being actively developed for consumer applications, as well as glasses-free 3D technologies. These...
Friday 14 July 2023
TEL sees robust equipment demand for generative AI and datacenter apps
Semiconductor demand is expected to enter a recovery phase in the second half of 2023 while inventory adjustments will remain the key for progress, Toshiki Kawai, president of Japan's...
Monday 10 July 2023
Taiwan enhancing semiconductor ecosystem, expecting IC output to top NT$6 trillion by 2030
Taiwan's annual semiconductor output value is projected to surpass NT$6 trillion (US$191.45 billion) by 2030 from NT$4.2 trillion estimated for 2023 for a double-digit CAGR during...
Global wafer foundry industry analysis and forecast, 2022
DIGITIMES Research Special Report Databases
Global tablet demand stays in stagnation in 2Q23 and 2H23, says DIGITIMES Research
China smartphone AP shipments rise sequentially in 2Q23 and 3Q23, says DIGITIMES Research
Global high-end AI server shipments to soar in 2023, says DIGITIMES Research