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NEWS TAGGED 3D
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Friday 20 May 2022
Adoption of QLC SSDs to accelerate in 2023
Chipmakers' entry into the race for 200-plus-layer 3D NAND flash chips will be accelerating the adoption of QLC SSDs particularly in the consumer sector in 2023, according to industry...
Thursday 19 May 2022
Acer announces new PCs and hardware for back-to-school season
Acer has launched new Chromebooks, ultra-thin notebooks, gaming notebooks, all-in-one (AIO) PCs, and monitors for upcoming back-to-school demand.
Wednesday 18 May 2022
3D measurement solutions gaining importance in EV production
As power systems of EVs differ greatly from those of oil-fueled cars, automakers require innovative technologies to manufacture and assemble key system components, leading to a growing...
Tuesday 17 May 2022
BujiBui makes 3D digital twins accessible anywhere
Utilizing 3D digital twins to operate facilities has become common for enterprises. BujiBui, a Canada-based startup, levels up its digital twins by offering mobile access. The company...
Tuesday 17 May 2022
YMTC sampling 192-layer 3D NAND chips
China's Yangtze Memory Technologies (YMTC) has delivered samples of its in-house developed 192-layer 3D NAND flash memory to a few customers recently, according to industry sources...
Friday 13 May 2022
The memory industy (5): Looking for a new biz model that can create new value
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Thursday 12 May 2022
The memory industry (4): Technology diversion between DRAM and 3D NAND flash
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its...
Friday 29 April 2022
MA-tek enjoys robust chip analysis orders for advanced processes
IC analysis and certification lab Material Analysis Technology (MA-tek) continues to enjoy a rapid rise in analysis demand for sub-7nm chips, particularly 3/2nm process now under...
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Monday 18 April 2022
Intel may farm out PC chipsets processing to OSATs in Taiwan
Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Thursday 31 March 2022
YMTC 128-layer NAND memory gains Apple validation
China's Yangtze Memory Technologies (YMTC) has recently cleared Apple's validation for its 128-layer 3D NAND flash memory, with shipments slated to kick off in small volumes in May...