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Tuesday 23 July 2024
YMTC head expects explosive chip demand in China amid US restrictions
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...
Tuesday 23 July 2024
Chinese NAND flash maker YMTC sues Micron in US over alleged patent infringement
Yangtze Memory Technologies (YMTC) has filed a lawsuit against Micron Technology in the US, accusing the American memory vendor of infringing its 3D NAND patents in a range of prod...
Friday 19 July 2024
Samsung memory goes full throttle, advances 3D and LLW DRAM
As the AI era unfolds, the demand for memory solutions that maximize performance while minimizing power consumption is growing exponentially. Samsung Electronics is reportedly developing...
Friday 19 July 2024
GTOC sales driven by automotive glass applications
Glass processing service provider G-Tech Optoelectronics (GTOC) has reported strong sales growth for the second quarter of 2024, driven by automotive applications.
Thursday 18 July 2024
Intel builds brand-new interactive experience to showcase AI at Paris Olympics
Intel is set to launch a new initiative at the 2024 Paris Olympics and Paralympics that will introduce innovative AI applications built on Intel's hardware and software into the two...
Wednesday 10 July 2024
Applied Materials unveils material breakthroughs for chip miniaturization and energy-efficient computing
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
Wednesday 10 July 2024
Rain Technology to revolutionize AR/VR displays with brightness and FOV breakthroughs
US-based Rain Technology has accumulated more than two decades of experience in consumer display technologies, with ventures into LCD, OLED, e-privacy, and automotive fields. The...
Wednesday 10 July 2024
Samsung reportedly adopts Mo in 3D NAND, to reshape memory industry
Samsung Electronics is reportedly adopting Molybdenum (Mo) for the metal wiring process in its ninth-generation 3D NAND (V9 NAND) technology.
Tuesday 9 July 2024
Taiwanese firms keen to join Nvidia's Omniverse ecosystem to stay competitive in AI era
As generative AI accelerates digital transformation across various industries, experts agree that future market competition will be defined by speed.
Tuesday 25 June 2024
CCI to begin mass production of 3D VC cooling for customers in 2H24
Amid the hype for liquid cooling in the server industry, Nidec Chaun-Choung Technology (CCI) chairman Junichi Nagai notes that the company will release liquid cooling solutions for...
Tuesday 28 May 2024
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material
Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers...
Tuesday 28 May 2024
Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
Tuesday 14 May 2024
Samsung said to skip 300+ layers and directly target 400+ to reclaim 3D NAND leadership
With the rise of Artificial Intelligence (AI), the NAND flash market is experiencing significant growth. This has reignited the competition between Samsung Electronics and SK Hynix...
Friday 3 May 2024
Macronix sees orders regain momentum
ROM and flash memory maker Macronix International stayed in the red in the first quarter of 2024 with net losses amounting to NT$1.08 billion (US$33.2 million). Nevertheless, the...
Tuesday 30 April 2024
Innolux takes significant strides in 3D chip packaging
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...