Etron Technology has started shipping its in-house developed 3D sensing chips since April, with shipments to top 50,000 units in May, according to company chairman Nicky Lu.

Yangtze Memory Technologies plans to introduce the second generation of its in-house developed Xtacking 3D NAND architecture, dubbed Xtacking 2.0, in August 2019, said company co-CTO...

Major memory chip vendors are on track to enter mass production of 90/96-layer 3D NAND products in the second half of 2019, according to industry observers.

Fabless chipmaker Himax Technologies expects to post a revenue increase of 2-7% sequentially in the second quarter following a 14.5% drop in the first quarter. Gross margin is forecast...

Yangtze Memory Technologies (YMTC) is set to enter volume production of 64-layer 3D NAND flash memory chips by the end of 2019, and has been in talks with parent company Tsinghua...

NOR flash memory prices, which experienced a double-digit sequential drop in the first quarter of 2019, will continue to fall but at a slower pace in the second and third quarters,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...

Industrial Technology Research Institute (ITRI), Kaohsiung Veterans General Hospital and dental implant maker Alliance Global Technology will cooperate to establish a diagnosis platform...

Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...

China's Yangtze Memory Technology (YMTC) is set to kick off volume production of 64-layer 3D NAND flash chips by the end of 2019 as scheduled, despite prices for such memory products...

SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.

Largan Precision is striving for orders for in-panel optical fingerprint-recognition lens modules and 3D sensing lenses from the non-Apple camp as a move to diversify its customer...

Toshiba Memory has announced the availability of its XD5-series NVMe SSD platform in a 2.5-inch, 7mm low-profile form factor that is optimized for low-latency and performance consistency...

The global output of 96-layer 3D NAND flash memory is set to expand starting the second quarter of 2019, which may bring more variables to the market and prices this year, according...

Memxpro, a leading DRAM module and SSD solution provider for defense, industrial, in-vehicle, and enterprise markets, announces the release of a new industrial TLC SSD series at the...

Himax Technologies expects to post a revenue decline of 14-19% sequentially in the first quarter of 2019, when the fabless chipmaker expects its LCD driver IC sales generated from...

Brand smartphone vendors may see their profits fall significantly in 2019 as they are investing heavily in upgrading their models despite sluggish terminal market demand, according...

Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...

Taiwan startup Osense Technology has launched a smart baseball stadium app integrating all related O2O (online to offline) services, which can be simultaneously utilized by a large...

GaAs IC foundry Win Semiconductors expects robust demand for 3D sensing and 5G related applications to drive its mid- and long-term business growth.

Shipments of Android-based smartphones featuring 3D sensing technology are set to boom in 2019, propelled by the increasing adoption of back-end time-of-flight (ToF) sensor solutions,...

Macronix International has been engaged in 3D NAND technology R&D, and plans to offer 48- and 96-layer processes to deliver 128Gb and 256Gb products, according to company president...

A variety of favorable factors are driving the advancements and popularize the applications of 3D printing technologies, including upgrades in printing precision and speed, availability...

Japan-based Toshiba Memory Corp (TMC), now the world's No. 2 supplier of NAND flash memory chips with nearly 20% market share, is striving at full throttles to rival top supplier...