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NEWS TAGGED 3D
Sunday 29 March 2026
SK Hynix and Kioxia targeted in US ITC memory chip probe
On March 27, the US International Trade Commission (ITC) launched an investigation into memory chip imports by SK Hynix Inc. and KIOXIA Holdings Corporation following a patent complaint...
Thursday 26 March 2026
Alibaba‑backed Tripo AI draws investor confidence, led by exec from Minimax
Tripo AI, founded in 2023, is rapidly emerging in AI-driven 3D content creation, turning text prompts or 2D images into production-ready 3D models in seconds. Backed by major investors...
Thursday 26 March 2026
China's Naura and AMEC lead China's push into advanced chip packaging
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Friday 20 March 2026
As NAND makers move on, MLC memory nears the end of the line

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

Tuesday 17 March 2026
Mech-Mind Robotics champions eyes and brains for embodied AI industry

Mech-Mind Robotics, a leading provider of 3D vision systems and software for industrial robots, laid out its plans at Automation World (AW) 2026...

Tuesday 17 March 2026
eMMC shortage sends NAND prices soaring, with further gains ahead
Supply disruptions in low-capacity eMMC are driving sharp price increases for SLC and MLC NAND as major global memory manufacturers exit older production nodes. Contract prices for...
Sunday 8 March 2026
Applied Materials VP warns AI growth may hit energy, not chip limits
AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
Friday 6 March 2026
South Korean Academia: NAND scaling nears ceiling; China seen closing gap
The rapid expansion of artificial intelligence is driving strong growth in the memory market. Compared with DRAM, which still has room for structural innovation, NAND flash has largely...
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

Thursday 26 February 2026
Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fab
Samsung Electronics will halt 2D NAND flash production at its Hwaseong Line 12 and convert the facility into a 1c DRAM end fab, formally exiting planar NAND manufacturing and reallocating...
Thursday 26 February 2026
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
Monday 23 February 2026
PSMC shifts beyond mature nodes to power next wave of AI memory innovation
Powerchip Semiconductor Manufacturing Corp. (PSMC) is emerging as a central manufacturing partner in a new initiative to develop next-generation AI memory, marking a strategic shift...
Thursday 12 February 2026
TSMC spillover lifts Xintec testing orders, 2026 growth in sight
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Monday 9 February 2026
512Gb NAND wafer shortage triggers forced upgrades, narrows gap with 1Tb

The supply landscape for 3D NAND wafers is being structurally reshaped as major manufacturers shift capacity aggressively toward enterprise...

Thursday 5 February 2026
Dassault Systemes expands AI virtual assistant lineup with industry world models
Dassault Systemes unveiled a major expansion of its AI virtual assistant portfolio during 3DEXPERIENCE World 2026 held February 3-5, 2026, in Houston, emphasizing its new technology...