NAND flash memory made using mature processes is reportedly in tight supply as a result of Apple's decision to adopt older generation NAND for its iPhone 15, which caught its memory...

Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...

Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off...

3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...

Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...

Cooling module maker Asia Vital Components (AVC), whose 3D vapor chambers (VC) are reportedly being certified by Nvidia, expressed optimism about 3D VC demand through 2024.

Solomon Technology unveiled a trainable AI system and an AI algorithm software package that can be efficiently downloaded onto mobile devices.

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

To solidify its leading position in the NAND flash market, Samsung Electronics reportedly plans to again utilize a double-stack technology for manufacturing 3D NAND over 300 layers,...

AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...

Nvidia, together with Apple, Pixar, Adobe, Autodesk, and the Linux Foundation's subsidiary, the Joint Development Foundation (JDF), recently announced the formation of the OpenUSD...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...

Panel technologies such as micro OLED, OLED on silicon (OLEDoS), and micro LED are being actively developed for consumer applications, as well as glasses-free 3D technologies. These...

Semiconductor demand is expected to enter a recovery phase in the second half of 2023 while inventory adjustments will remain the key for progress, Toshiki Kawai, president of Japan's...

Taiwan's annual semiconductor output value is projected to surpass NT$6 trillion (US$191.45 billion) by 2030 from NT$4.2 trillion estimated for 2023 for a double-digit CAGR during...