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NEWS TAGGED 3D
Thursday 14 March 2024
Server air cooling turning to 3D VC solutions for better efficiency, says DIGITIMES Research
With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...
Thursday 1 February 2024
Samsung's 3D DRAM R&D team sets foot in Silicon Valley
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Tuesday 30 January 2024
LG Innotek is rumored to be the exclusive supplier of Vision Pro's 3D sensing module
LG Innotek is rumored to be the exclusive supplier of the 3D sensing module for Apple's Vision Pro.
Friday 26 January 2024
Intel reportedly to integrate Samsung's LPDDR5X in Lunar Lake CPU by 3D packaging
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Tuesday 28 November 2023
SKMP develops high-thickness KrF photoresist to enhance competitiveness of 3D NAND processes
SK Group's KRW40 billion (US$31 million) acquisition of Kumho Petrochemical's electronic material business in 2020 is bearing fruit. SK Materials Performance (SKMP), the new subsidiary...
Tuesday 28 November 2023
Healthcare Expo Taiwan - Wincomm with Brain Navi demo leading 3D brain navigation surgical robot
In 2023, Intel announced a new achievement on AI-empowered advancing precision medicine and Wincomm was invited to demonstrate AI-based brain surgical and GI endoscopy solutions to...
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Wednesday 25 October 2023
Samsung unveils new-gen memory solutions for GenAI applications
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Monday 2 October 2023
Applied Materials cuts into supply chain for Intel glass substrate technology
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Friday 15 September 2023
Mature-process NAND flash memory reportedly in tight supply because of Apple demand
NAND flash memory made using mature processes is reportedly in tight supply as a result of Apple's decision to adopt older generation NAND for its iPhone 15, which caught its memory...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Friday 8 September 2023
Smartphone APs likely to adopt 3D chips after 2025
Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off...
Research Report Database
Summary of Tech Supply Chain News!
NPUs to become new AI accelerator chip option for edge devices, says DIGITIMES Research
Operation O-RAN: The US plan to neutralize Huawei (and why it will work)
DIGITIMES Insight: Nvidia's path to US$100 billion in sales