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NEWS TAGGED 3D
Friday 26 June 2026
IBM breaks sub-1nm barrier with 3D nanostack transistor platform
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Monday 22 June 2026
YMTC NAND share rises to 13%, alarming South Korean rivals
China's memory makers are moving from technology catch-up to capital-market expansion, with ChangXin Memory Technologies' (CXMT) parent and Yangtze Memory Technology (YMTC) both preparing...
Thursday 18 June 2026
Imec, Sony unveil backside interconnect method for 3D chip stacking

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Wednesday 17 June 2026
PSMC buys NT$1.04 billion in Lam Research equipment to support capacity growth
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research...
Tuesday 16 June 2026
Murata and Synopsys deepen simulation integration as electronics design complexity grows

Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible...

Tuesday 16 June 2026
AI chip race sends WF6 prices soaring after Japan supply shock
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used...
Friday 12 June 2026
SK Hynix readies 375-layer NAND as US listing plan advances

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead...

Thursday 4 June 2026
Tripo AI raises nearly US$200 million to expand 3D and world model research
Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Wednesday 3 June 2026
COMPUTEX 2026 highlights spatial AI for homes and turnkey enterprise edge solutions
At COMPUTEX 2026 in Taipei, HOMEE AI, Osense Technology, and Senao International unveiled new AI products aimed at shifting deployment from cloud training to real-world inference and...
Wednesday 3 June 2026
oToBrite and Turing Drive partner on visual AI for autonomous vehicles
oToBrite and Turing Drive announced a technology collaboration on June 2 to develop real-world autonomous vehicle applications using vehicle-grade vision AI, which combines oToBrite's...
Monday 1 June 2026
Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...