中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED 3D
    Wednesday 27 May 2026
    Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
    Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Tuesday 26 May 2026
    Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment
    Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...
    Monday 25 May 2026
    Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

    Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

    Wednesday 20 May 2026
    China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks
    China's leading memory chipmakers are accelerating their push into public capital markets, with YMTC Group formally entering IPO guidance on May 19, shortly after domestic DRAM leader...
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Wednesday 13 May 2026
    Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
    Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
    Monday 11 May 2026
    From Basement to Deep Space: How AON3D is Redefining High-Performance 3D Printing

    Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.

    Wednesday 6 May 2026
    Taiwan researchers create non-toxic blue-light material that could enable glasses-free 3D displays
    Researchers at National Yang Ming Chiao Tung University announced a new non-toxic, metal-free light-emitting silicone that produces blue fluorescence when mechanically stressed, a...
    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
    Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical...
    Wednesday 29 April 2026
    Osense develops baseball hawk-eye system to capture US$10 billion sports tech market
    Taiwanese artificial intelligence (AI) software company Osense Technology is targeting the rapidly growing sports technology market — valued at more than US$10 billion —...
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    NEO Semiconductor advances 3D DRAM with POC validation
    Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
    Sunday 26 April 2026
    Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
    Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
    1/7 pages
    Apacer
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook