Apple is scheduled to launch its new iPad Pro series around March, but shipments are unlikely to peak until after April as their components suppliers are slowly ramping up their output...

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced it is partnering with Inkron, a manufacturer...

TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...

Taiwan-based compound semiconductor components makers are gearing up to fulfill shipments of PA (power amplifier), RF (radio frequency) and VCSEl devices for a new iPhone model, tentatively...

IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...

Taiwan-based LandMark Optoelectronics, dedicated to production of epi-wafer chips for optical communications, is set to kick off volume production of 200G and 400G optical modules...

Yangtze Memory Technology (YMTC), which is headquartered in the hardest-hit city of Wuhan in the wake of China's coronavirus outbreak, has told Digitimes that it has taken necessary...

Taiwan-based Stereotactic surgery navigation solution developer EPED has been tapping overseas markets and expects consolidated revenues for 2020 to exceed NT$100 million (US$3.3...

Memory startup Yangtze Memory Technology (YMTC), in which China's state-owned Tsinghua Unigroup holds a controlling stake, has reiterated plans to transition directly from 64-layer...

Yangtze Memory Technology (YMTC) is ramping up its chip output for applications requiring embedded storage and SSD solutions in 2020, and has built partnerships with companies including...

Dutch startup i-Med Technology, which showcased an a 3D digital surgical head-mounted loupe at CES 2020, develops products based on user-centric and demand-driven innovations, according...

Many China-based 3D printer developers have showcased their latest professional and industrial-level machines at CES 2020, and China, as the leader of worldwide manufacturing, is...

GaAs IC foundry Win Semiconductors and Visual Photonics Epitaxy Company (VPEC), which manufactures epitaxial wafers, both saw revenues increase by over 20% in 2019 and are expected...

SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...

Taiwan startup NADI System, dedicated to smart city solutions, has penetrated its 3D visualization management solutions into Southeast Asia by joining the Taipei Smart City@AMATA...

China's overall IC production capacity will continue to expand in 2020 as both IDMs and foundry houses there have readied expansion plans covering 4-, 6-, 8- and 12-inch wafer fabs...

TSMC's backend antenna-in-package technology, dubbed InFO-AiP, has attracted orders from US-based clients for packaging 5G mmWave devices, with volume production set to kick off next...

Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...

Memory design house Etron Technology has teamed up with US-based FGPA chipmaker Lattice Semiconductor on developing new miniaturized AI+DRAM platform for applications to terminal...

Etron Technology and its affiliate eYs 3D Microelectronics are likely to tap into Japan's AR glass industry supply chain in 2020 with diverse smart 3D sensing solutions, according...

Samsung Electronics and China's Yangtze Memory Technology (YMTC) have both stepped up equipment purchases for building additional new NAND flash fabrication lines since the second...

Robust orders for advanced fabrication and packaging services at TSMC have prompted the foundry to team up with Materials Analysis Technology (MA-tek) and Integrated Service Technology...

Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products...

Driven by the application of sensors, AI, big data and IoT technologies, smart agriculture has developed rapidly in Taiwan, and a spate of latest smart agricultural solutions unveiled...

The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...