Himax Technologies has announced that the company is teaming up with GTS to allow its structural light 3D sensing solution to be adopted for factory automation.

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

Micron Technology has unveiled a new 12-inch fab at its manufacturing site for NAND flash memory in Singapore, and expects the facility to ramp up production in the second half of...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) has enjoyed a ramp-up in demand for vertical-cavity surface-emitting laser (VCSEL) components for use in smartphones...

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Chipmakers are aggressively improving their new 96-layer 3D NAND process yield rates, looking to have the technology become the mainstream in 2020, according to industry sources.

Apple has reportedly asked its supply chain partner to supply VCSEL components for use in rear ToF camera lens in its mobile devices to be released in 2020, according to supply chain...

ASE Technology Holding, King Yuan Electronics (KYEC) and Lingsen Precision Industries are among the Taiwan-based backend houses looking to benefit from robust demand for MEMS sensors...

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) is expected to see significant revenue increases for the third quarter of 2019 as it has started intensive shipments...

Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...

TSMC is widely expected to adjust downward its revenue and profit guidance for 2019 at its upcoming investor conference set for July 18 due to recent operational hiccups. But the...

Chipmakers have stepped up development of their respective 120/128-layer 3D NAND flash process technologies for cost competitiveness, and are gearing up to have the technology transitions...

NXP Semiconductor's Immersiv3D audio solution for the smart home market is expected to drive the growth in demand for home-use audio equipment thanks to its high cost-efficiency,...

Taiwan-based memory module makers have put increased focus on growing sales of their high-margin niche-market product lines to mitigate the impact of falling DRAM and NAND flash prices...

China's Yangtze Memory Technologies (YMTC) is likely to kick off volume production of 64-layer 3D NAND flash chips ahead of schedule, as it is striving to gain orders from Huawei,...

Toshiba Memory and Western Digital have finalized a formal agreement to jointly invest in the "K1" manufacturing facility that Toshiba Memory is currently constructing in Kitakami...

Etron Technology has started shipping its in-house developed 3D sensing chips since April, with shipments to top 50,000 units in May, according to company chairman Nicky Lu.

Yangtze Memory Technologies plans to introduce the second generation of its in-house developed Xtacking 3D NAND architecture, dubbed Xtacking 2.0, in August 2019, said company co-CTO...

Major memory chip vendors are on track to enter mass production of 90/96-layer 3D NAND products in the second half of 2019, according to industry observers.

Fabless chipmaker Himax Technologies expects to post a revenue increase of 2-7% sequentially in the second quarter following a 14.5% drop in the first quarter. Gross margin is forecast...

Yangtze Memory Technologies (YMTC) is set to enter volume production of 64-layer 3D NAND flash memory chips by the end of 2019, and has been in talks with parent company Tsinghua...

NOR flash memory prices, which experienced a double-digit sequential drop in the first quarter of 2019, will continue to fall but at a slower pace in the second and third quarters,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...