Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Taiwan has become the world's top supplier of medical displays and X-ray sensors as AUO and Innolux accelerate expansion in healthcare technologies and boost shipments to global customers...
Trumpf, a key supplier of semiconductor equipment components with close partnerships with industry giants such as ASML Holding and Taiwan Semiconductor Manufacturing Company (TSMC),...
Imagination Technologies made a prominent showing at the 31st ICCAD-Expo 2025 in Chengdu, where strategic partner Xiangdi Xian Computing Technology debuted its next-generation GPU...
China's leading DRAM maker CXMT has unveiled new DDR5 and LPDDR5X chips with performance now viewed as comparable to Samsung Electronics and SK Hynix. The launch has unsettled South...
Taiwan's cloud software provider PenPower Technology reported strong momentum for its flagship product Asteroom during an investor briefing on November 25, 2025, revealing that the...
China has applied disruptive innovation and a fully controllable domestic solution to break through compute bottlenecks, with chip performance now capable of surpassing constraints...
Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
d-Matrix completed a US$275 million Series C round in early November, raising its valuation to US$2 billion, and is speeding up the commercialisation of its 3D In-Memory Compute (3D...
As Taiwan officially enters the era of a super-aged society, the nation's healthcare industry is turning to smart technology to address the growing needs of its elderly population...
Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...
ASML EVP and China head Shen Bo said artificial intelligence is redefining the global semiconductor landscape, pushing chipmakers and equipment suppliers to balance growing computing...
As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang...
ASML has introduced the TWINSCAN XT:260, its first lithography system purpose-built for 3D integration and advanced packaging. The launch marks a major step beyond front-end wafer...
