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NEWS TAGGED 3D
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Thursday 27 August 2026
Samsung signals zHBF push as memory race moves beyond HBM
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...
Tuesday 25 August 2026
Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
Monday 17 August 2026
AMD eyes Taalas: will the system ditch HBM, advanced packaging, 3D stacking?
The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...
Thursday 13 August 2026
Yangtze Memory-backed capital expands into FD-SOI specialty process investment

Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor...

Tuesday 11 August 2026
Samsung tackles AI memory wall with zHBM, V10 BV-NAND concepts

Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure...

Monday 10 August 2026
SK Hynix faces US patent fight over HBM, 3D NAND

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation...

Friday 7 August 2026
NEO seeks partner by end-2026 for fivefold-density X-SRAM

AI memory startup NEO Semiconductor has unveiled X-SRAM, a new architecture designed to address the difficulty of scaling conventional...

Thursday 6 August 2026
NEO Semiconductor unveils AI memory platform aimed at easing global bottlenecks
NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory...
Wednesday 5 August 2026
Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global...
Wednesday 5 August 2026
Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...