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NEWS TAGGED SILICON
Thursday 15 January 2026
GlobalWafers' Topsil advances ultra-pure float zone silicon for quantum tech
GlobalWafers stated it is continuing to expand the application landscape of its advanced materials technologies, with its Danish subsidiary Topsil GlobalWafers ramping up investment...
Wednesday 14 January 2026
CPO module output to grow by 137% annually as Taiwan fosters key photonic tech
Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...
Wednesday 14 January 2026
Realtek and Phison compete to enter Nvidia's AI supply chain as memory tech upgrades
An internal structural photo of Nvidia's Quantum-X Photonics silicon photonics (SiPh) switch revealed that its solid-state drive (SSD) controller chip was branded with the iconic Realtek...
Tuesday 13 January 2026
Taiwan pushes silicon photonics frontier R&D to defend semiconductor edge in AI era
Taiwan dominates advanced semiconductor manufacturing, but mounting competition in emerging technologies is exposing structural gaps. To secure its position in the AI and data-center...
Tuesday 13 January 2026
CES 2026: Microip showcases vision tech for transit and drones
Microip, a Taiwan-based chip and system developer, used CES 2026 to highlight its move beyond standalone silicon, presenting a vision-based artificial intelligence platform that combines...
Monday 12 January 2026
Qatar, UAE join US-led Pax Silica supply chain pact
Qatar and the United Arab Emirates are set to join a US-led initiative to secure artificial intelligence and semiconductor supply chains, expanding a framework Washington views as...
Sunday 11 January 2026
Taiwan's Yield Microelectronics rakes in IP royalties, stands as semiconductor outlier
Yield Microelectronics Corp., a Taiwanese designer of embedded nonvolatile memory (eNVM) silicon intellectual property, has quietly established itself as a leader in multi-time programmable...
Friday 9 January 2026
Taiwan targets SiPh CPO-AI ecosystem in 10-year plan
Taiwan's National Science and Technology Council (NSTC) has designated the silicon photonics (SiPh) co-packaged optics (CPO)-AI ecosystem as a core focus for the next decade, aiming...
Friday 9 January 2026
Commentary: How fragile is the China–Japan semiconductor supply chain?
China has intensified pressure on Japan's supply chains. Following curbs on dual-use items and rare earth exports, the Ministry of Commerce has launched an anti-dumping probe into...
Thursday 8 January 2026
China launches fresh anti-dumping probe against Japanese dichlorosilane, following dual-use export curbs

China has launched an anti-dumping investigation into Japanese dichlorosilane imports, marking...

Thursday 8 January 2026
TDK targets AI smartphones and foldables, plans to launch next-gen silicon anode battery
Japanese electronic components manufacturer TDK Electronics announced that it plans to update its industry-leading silicon anode battery technology later in 2026, coinciding with Apple...
Monday 5 January 2026
Taiwan fortifies silicon shield with 2026 push to set global chip agenda
As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
Saturday 3 January 2026
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
Friday 2 January 2026
Budget delays risk sidelining Taiwan in 2026 silicon photonics and CPO takeoff, NSTC warns
Taiwan's National Science and Technology Council (NSTC) has raised concerns that prolonged delays in budget approvals could cause Taiwan to miss the critical 2026 global takeoff for...
Thursday 1 January 2026
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...