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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    9h 34min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    9h 34min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    9h 34min ago
    AI buildout lifts demand for China high-speed optical module makers
    9h 34min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    9h 34min ago
    NEWS TAGGED SILICON
    Thursday 3 September 2026
    Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
    Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    IBM's quantum pitch to chip audience: bottleneck is now manufacturing
    IBM's case for quantum computing no longer rests on physics. At Semicon Taiwan 2026 on September 1, the company's argument was that AI has outrun what silicon can supply, that no amount...
    Wednesday 2 September 2026
    Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
    Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
    Wednesday 2 September 2026
    AI demand push expands wafer industry's growth outlook
    AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
    Wednesday 2 September 2026
    UMC targets 12-inch TFLN to break 400G SiPh bottleneck
    As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
    Wednesday 2 September 2026
    SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026

    At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading...

    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains

    As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

    Wednesday 2 September 2026
    Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
    China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
    Tuesday 1 September 2026
    AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform
    Apple's AI hardware momentum is forcing an enterprise question it did not plan for. Mac mini and Mac Studio are increasingly being used as local AI infrastructure, but Apple's business...
    Tuesday 1 September 2026
    China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics
    Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
    Monday 31 August 2026
    Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
    MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
    Monday 31 August 2026
    TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration
    TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
    Monday 31 August 2026
    China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

    Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

    Monday 31 August 2026
    Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace
    Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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