Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

A Japanese startup originating from Waseda University, Power Diamond Systems (PDS), showcased its diamond-based semiconductors at SEMICON...

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia...

Tokyo-based startup EdgeCortix plans to deliver samples of its next-generation Sakura-X artificial intelligence (AI) processor by the end of 2026,...

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation...

Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated...