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NEWS TAGGED SILICON
Wednesday 4 August 2021
GlobalWafers posts record 2Q21 profit
Silicon wafer supplier GlobalWafers has reported net profits increased 16.4% on year and about 47% sequentially to a record high of NT$3.95 billion (US$141.5 million) in the second...
Friday 30 July 2021
Silicon Motion raises sales outlook again
Memory device controller supplier Silicon Motion Technology has raised its revenue growth outlook for 2021 again after delivering better-than-expected revenue for the second quarte...
Thursday 29 July 2021
Silicon wafer shipments reach new high in 2Q21, says SEMI
Worldwide silicon wafer area shipments climbed to a record high for the second consecutive quarter in the second quarter of 2021, according to SEMI.
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Friday 25 June 2021
More China firms looking to develop EV power modules in-house
More China-based companies are looking to follow in the footsteps of BYD, developing IGBT and SiC-base power modules for electric vehicles (EV) in-house, according to industry sources...
Thursday 17 June 2021
Ansys multiphysics solutions achieve certification for TSMC N3 and N4
Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...
Tuesday 8 June 2021
GF, GlobalWafers extend partnership
Globalfoundries has announced that the foundry and silicon wafer supplier GlobalWafers have struck a US$800 million agreement to add 300mm silicon-on-insulator (SOI) wafer manufacturing...
Friday 4 June 2021
TSMC InFO_B packaging gains positive feedback
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Monday 31 May 2021
Rohm to spend JPY400 billion on future expansion
Rohm will inject a total of JPY400 billion (US$3.64 billion) into its expansion through 2025, the Japan-based chip vendor disclosed in its mid-term management plan.
Friday 7 May 2021
Silicon Motion raises sales guidance for 2021
Memory device controller supplier Silicon Motion Technology has raised its revenue outlook this year, after posting record-high revenues for the first quarter.
Wednesday 5 May 2021
GlobalWafers expects silicon wafer demand to stay robust through 2023
Taiwan-based GlobalWafers has reported sequential growths in first-quarter shipments for silicon wafers of all sizes, and expects sales momentum to stay strong through 2023.
Tuesday 4 May 2021
Silicon wafer shipments edge higher in 1Q21 to set new record, SEMI reports
Worldwide silicon wafer area shipments increased 4% sequentially to a record high of 3.337 billion square inches in the first quarter of 2021, according to SEMI.