Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Tuesday 26 September 2023
Miniaturization trend for Wi-Fi modules remains unchanged; packaging testing suppliers rely on SiP
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Wednesday 13 September 2023
IC backend houses to see demand recovery in 2024
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Monday 11 September 2023
Advanced packaging and testing takes step in four major sectors, showcasing several high-end test interfaces
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
Monday 4 September 2023
Taiwanese chip testing companies see lower-than-expected 3Q23 results
The semiconductor industry is still struggling, and Taiwanese IC testing companies like Chunghwa Precision Test Tech. Co., Ltd. (CHPT) are facing challenges due to their heavy reliance...
Thursday 24 August 2023
GreenTrans' AMR winning semiconductor packaging and testing customers
Taiwan-based GreenTrans Corporation has expanded the application of its automated guided vehicle (AGV) and autonomous mobile robot (AMR) to the semiconductor sector. The company said...
Friday 18 August 2023
Huawei rumored to be testing 5G chip and SoC, targeting flagship handset market
As Huawei's Executive Director and CEO of the Consumer Business Group, Richard Yu, loudly declared in early August that "Huawei's flagship smartphones are making a comeback," the...
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Friday 18 August 2023
Qualcomm rumored to cut staff in Taiwan
Amid continued sluggish market, leading IC design company Qualcomm emphasized further cost control during this quarter's financial report meeting and said that it has presented a...
Tuesday 15 August 2023
Niche IC distributor ANStek sees customers place orders with caution
Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has seen its customers place orders with caution as a result of a slower-than-anticipated...
Tuesday 8 August 2023
Micron launches memory expansion module portfolio to accelerate CXL 2.0 adoption
Micron Technology has announced sample availability of its CZ120 memory expansion modules to customers and partners.
Thursday 3 August 2023
IC testing houses see slight pick-up in fab utilization
IC testing houses Ardentec, King Yuan Electronics (KYEC) and Sigurd Microelectronics have all seen their fab utilization rates pick up slightly in the third quarter, despite the gloomy...
Wednesday 2 August 2023
Bosch opens semiconductor testing center in Malaysia
Bosch is expanding its semiconductor business further. The company has now opened a new testing center for chips and sensors in Penang, Malaysia, at a cost of around EUR65 million,...
Tuesday 1 August 2023
Ardentec sees IDM customers contribute nearly 60% to revenue
Ardentec has seen orders placed by its IDM customers account for nearly 60% of company revenue, allowing the IC testing company to experience stable demand for high-end automotive...
Wednesday 19 July 2023
RAMP-C program on Intel 18A adds 2 strategic defense industrial base customers
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...