Despite persistent noise in the memory market, leading memory chipmaker Macronix reported a sharp surge in profitability in January 2026. The company posted preliminary pre-tax net...
Blowout earnings from TSMC in 2025 — and an even more bullish outlook for 2026 — have reignited investor enthusiasm across the global semiconductor sector. Attention is...
Taiwan's IC packaging and testing supply chain is accelerating expansion as Sigurd announced it will invest NT$1.54 billion (approx. US$49M) to purchase a factory in the Hukou Industrial...
ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...
The rapid development of AI and high-performance computing (HPC) chips is providing long-term demand support for the semiconductor advanced testing interface supply chain, driving...
Semiconductor test interface component manufacturer Certain Micro Application Technology (CMAT) announced during a media gathering that it will officially begin trading on the Taipei...
Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider...
Taiwan's AI server supply chain started 2026 on firmer footing, according to January revenue data from 14 PCB, CCL, ASIC design, and IC testing firms. Year-over-year growth confirms...
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
Taiwan's Ministry of Transportation and Communications (MOTC) said it will remove longstanding import quantity limits on US-spec vehicles, a move officials frame as aligning trade...
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
At the Singapore Space Summit 2026, MediaTek joined Airbus, Singapore-based technology firm ST Engineering iDirect, and electronic test-and-measurement company Keysight Technologies...
