At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...

Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...

Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...

The semiconductor industry is still struggling, and Taiwanese IC testing companies like Chunghwa Precision Test Tech. Co., Ltd. (CHPT) are facing challenges due to their heavy reliance...

Taiwan-based GreenTrans Corporation has expanded the application of its automated guided vehicle (AGV) and autonomous mobile robot (AMR) to the semiconductor sector. The company said...

As Huawei's Executive Director and CEO of the Consumer Business Group, Richard Yu, loudly declared in early August that "Huawei's flagship smartphones are making a comeback," the...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

Amid continued sluggish market, leading IC design company Qualcomm emphasized further cost control during this quarter's financial report meeting and said that it has presented a...

Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has seen its customers place orders with caution as a result of a slower-than-anticipated...

Micron Technology has announced sample availability of its CZ120 memory expansion modules to customers and partners.

IC testing houses Ardentec, King Yuan Electronics (KYEC) and Sigurd Microelectronics have all seen their fab utilization rates pick up slightly in the third quarter, despite the gloomy...

Bosch is expanding its semiconductor business further. The company has now opened a new testing center for chips and sensors in Penang, Malaysia, at a cost of around EUR65 million,...

Ardentec has seen orders placed by its IDM customers account for nearly 60% of company revenue, allowing the IC testing company to experience stable demand for high-end automotive...

According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...