Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing relationship to 130nm technology as supply conditions tighten across parts of the 8-inch foundry market.
DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to a shift from pure model development toward the systems needed to support larger-scale AI services, agents, and computing workloads.
Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the world's first SiC superjunction MOSFET product. Project leader Hao Yue said it is among the first globally to complete product validation, positioning the company for emerging demand from AI server power supplies and high-voltage direct-current data center architectures.
Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a commercialization schedule that had already shifted into 2028.
China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.
China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections into future smartphones.
