As demand for AI computing expands across industries and applications, chipmakers are seeking opportunities beyond conventional data centers, extending into enterprise deployments and personal devices. At the ninth China International Import Expo (CIIE) in 2026, Intel China showcased three AI computing solutions: green computing pods for large data centers and enterprise campuses, integrated AI inference systems for small and medium-sized enterprises (SMEs), and AI Agent PCs for individual users.

Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded. South Korea has also become Taiwan’s largest trade deficit partner, with Taiwan’s deficit reaching US$59.37 billion in the first 10 months of 2026, more than double its US$25.39 billion deficit with Japan.

China is advancing its domestic semiconductor ambitions while continuing to access restricted US AI processors, exposing the limits of Washington's export controls and the challenges facing Beijing's pursuit of technological self-sufficiency.

Samsung Display, BOE Technology Group and Tianma Microelectronics are considering cheaper OLED panels for budget smartphones to boost factory utilization as handset sales decline, ZDNet Korea reported on November 9, citing industry sources.

Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models, ZDNet Korea reported, citing industry sources.

TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and KSDI to build an modular AI data center in Satsumasendai, Kagoshima Prefecture, Japan. TECO will serve as the modular data center contractor, handling design, electromechanical systems integration, and technical guidance, with the first 6.4MW phase scheduled for delivery within nine months.

Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with Samsung memory and storage technologies, according to AMD's November 10 announcement.

SoftBank Group (SBG) posted a JPY768 billion (approximately US$4.85 billion) net loss for the first half of fiscal 2026, from April to September 2026, its first loss in nearly two years after booking a US$3.7 billion impairment on a US data-center project and absorbing the impact of falling global AI valuations.

China’s HKC has again stalled its OLED expansion, with equipment orders for its Gen 6 OLED line in Mianyang, Sichuan, yet to be placed despite plans for deposition equipment to arrive in March 2027. Industry sources attribute the delay to weak OLED demand and technology challenges, warning that the investment could ultimately be canceled.

Kia is considering investing about US$1.5 billion to expand its plant in Andhra Pradesh, India, while South Korean auto-parts makers have pledged follow-on investments. If approved, the project would establish an integrated vehicle manufacturing and parts-supply chain in the state.

“Jensanity” has helped fuel the global artificial intelligence (AI) boom, but reports linking Nvidia CEO Jensen Huang to an alleged extramarital relationship involving a suspected Chinese spy are putting the company’s corporate governance under greater scrutiny. While the controversy could benefit Huawei Technologies and other Chinese competitors, tighter US chip export controls could ultimately inflict greater damage on China’s AI industry.

Moonshot AI reportedly accessed advanced Nvidia chips this summer, according to documents filed with Chinese regulators. The finding shows that advanced US chips continue to make their way into China despite Washington's export restrictions. It also reveals Moonshot's continued reliance on American chips even as Beijing seeks to bolster domestic chipmaking.

Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.