
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with the HBM4E generation, a move that could reduce its reliance on TSMC and give the memory maker greater supply and cost flexibility.
Murata Manufacturing is considering a new, potentially larger expansion of multilayer ceramic capacitor (MLCC) capacity beyond its existing investment plans, as demand from AI servers is expected to remain strong through the end of the decade.
AI servers are reshaping the global multilayer ceramic capacitor (MLCC) market. Murata Manufacturing and Samsung Electro-Mechanics (SEMCO) are steering limited capacity toward high-value server components, tightening conventional supply, lifting prices, and creating an opening for Chinese suppliers in PCs.
Unigroup Guoxin Microelectronics plans to acquire WeEn Semiconductors for CNY1.9 billion (≈ US$283 million), giving the Chinese specialty IC supplier in-house wafer manufacturing and a faster route into power semiconductors.
South Korea is updating its artificial intelligence security guidance as companies deploy AI agents capable of operating with limited human supervision, while Microsoft is proposing model-level rules requiring its systems to remain subject to human interruption and shutdown.
BYD is lining up solid-state batteries, faster charging, and higher-level automated driving around 2027, potentially removing several of the remaining barriers separating electric vehicles from gasoline cars.
China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must now combine competitive chips with interconnects, software stacks, and clusters capable of training increasingly large AI models.
Polestar, the Swedish electric vehicle (EV) brand backed by Geely Holding, is facing a major restructuring of its US operations. In its first-half 2026 financial report filed with the US Securities and Exchange Commission (SEC) on September 3, Polestar said the US Department of Commerce's Bureau of Industry and Security (BIS) had denied its application for specific authorization under US connected vehicle regulations.
Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.