Chinese artificial intelligence (AI) startup DeepSeek has raised about US$15 billion in its latest private funding round, giving it substantially more financial firepower as it prepares for a potential initial public offering (IPO) and intensifies its challenge to leading US AI developers.
SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.
