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Friday 11 September 2026
Taiwan tech minister in Europe to advance semiconductor cooperation
National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe cooperation on advanced semiconductor packaging, silicon photonics (SiPh), and talent exchange, while also strengthening supply chain resilience. The trip included undisclosed government assignments as well as public events.
LATEST STORIES
Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity and technology development.
Monday 14 September 2026
Beijing municipality bans civilian drones from mid-November
China's capital, Beijing, is tightening drone controls further, with the municipal legislature approving revisions to the Beijing Regulations on Unmanned Aircraft Management that will take effect on November 15, 2026. The entire administrative area of Beijing will be designated as controlled airspace for unmanned aircraft, banning drone flights, the possession and storage of drones and their core components, and the transport of such equipment into the city.
Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND core design, VLSI design, and mask design while listing experience in HBM, LPDDR, and GDDR among key qualifications.

Monday 14 September 2026
South Korea broadens espionage law to counter rising tech leaks
South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent organization, as South Korea strengthens protection of semiconductors and other strategic technologies.
Monday 14 September 2026
LG Display's AI transformation turns employees into AI builders, yielding 450+ in-house projects
LG Display announced on September 13 that it is expanding its company-wide artificial intelligence transformation (AX) initiative by scaling up its "AX SQUAD" program. Designed to empower employees across all operational tiers to build their own workflow automation solutions, the initiative bridges frontline operational knowledge with technical software support.
Monday 14 September 2026
Z.ai reloads with US$5 billion for China's AI race

Chinese artificial intelligence developer Z.ai (formerly Zhipu AI) plans to raise about US$5 billion through a Hong Kong share placement and convertible bond sale, which would give the company fresh capital for next-generation model development, computing infrastructure and business expansion.

Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a share of Qualcomm's flagship processor business.
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company announcement.
Monday 14 September 2026
China's OLED expansion narrows South Korea's auto, IT panel lead
China's OLED supply push is gathering pace, with BOE Technology Group (BOE), TCL China Star Optoelectronic Technology and Visionox rapidly expanding production and closing in on South Korean rivals. South Korean companies still hold an edge in OLED for smartphones and TVs, but their room to grow in IT devices and automotive OLEDs is likely to narrow.
Monday 14 September 2026
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC), strengthening the company's position in China's semiconductor foundry market.

Monday 14 September 2026
Renesas readies second price hike amid stronger power-chip demand

Renesas Electronics is reportedly preparing a second product price increase this year, with new pricing set to take effect January 1, 2027, as rising manufacturing costs coincide with stronger demand for power semiconductors used in data centers and other high-growth applications.

Sunday 13 September 2026
China's robot champions can run; now they have to prove they can earn

China's humanoid robot boom is entering a harder phase. After years of headline-grabbing demonstrations and heavy private funding, companies are being pressed to prove something less theatrical but more consequential: that robots can perform reliable work, generate recurring revenue, and justify their valuations.

Sunday 13 September 2026
China auto exports hold above 1 million as new energy shipments surge

China's auto exports stayed above 1 million units for a third straight month in August 2026, reaching 1.01 million vehicles, according to the China Association of Automobile Manufacturers. The increase of 65.3% from a year earlier came as weaker domestic demand pressured the home market and exports became a larger growth driver for Chinese automakers.

Saturday 12 September 2026
Renault sets 2-year car development quality line

Facing an aggressive push by Chinese automakers to launch new models at short intervals and rapidly seize market share, major automakers in Europe, the US, Japan, and South Korea are confronting a new trade-off between R&D speed and quality control. Renault Group CEO Francois Provost said the French automaker will not blindly follow suit at the expense of quality and will not bring a new model to market if its development cycle is under two years.

Saturday 12 September 2026
Apple foldable plans drive new demand for Japanese smartphone parts makers
Apple’s move into foldable smartphones is creating fresh business for Japanese component makers with expertise in thin, lightweight and compact designs. According to Nikkei Asia, suppliers that once helped shape Japan’s feature phone era are seeing renewed interest in foldable display materials, hinges and battery-related parts.