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Friday 11 September 2026
Taiwan tech minister in Europe to advance semiconductor cooperation
National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe cooperation on advanced semiconductor packaging, silicon photonics (SiPh), and talent exchange, while also strengthening supply chain resilience. The trip included undisclosed government assignments as well as public events.
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Saturday 12 September 2026
Renault sets 2-year car development quality line

Facing an aggressive push by Chinese automakers to launch new models at short intervals and rapidly seize market share, major automakers in Europe, the US, Japan, and South Korea are confronting a new trade-off between R&D speed and quality control. Renault Group CEO Francois Provost said the French automaker will not blindly follow suit at the expense of quality and will not bring a new model to market if its development cycle is under two years.

Saturday 12 September 2026
Apple foldable plans drive new demand for Japanese smartphone parts makers
Apple’s move into foldable smartphones is creating fresh business for Japanese component makers with expertise in thin, lightweight and compact designs. According to Nikkei Asia, suppliers that once helped shape Japan’s feature phone era are seeing renewed interest in foldable display materials, hinges and battery-related parts.
Saturday 12 September 2026
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for semiconductor materials Hidenori Abe told DIGITIMES that the company sees five major materials challenges: warpage, plating, coating, bonding, and polishing.
Saturday 12 September 2026
Luxshare eyes AR glasses breakthrough through car HUD model

At the 2026 China International Optoelectronic Exposition (CIOE), Luxshare and its lens module unit Luxvisions jointly showcased multiple optical and sensing technologies, including automotive camera modules, robot vision modules for autonomous guided vehicles (AGVs) and autonomous mobile robots (AMRs), as well as tracking modules and waveguide display components for augmented reality (AR), virtual reality (VR), and extended reality (XR) wearables. The display underscored the group's push for vertical integration in optics.

Friday 11 September 2026
Why Chinese automakers' aggressive push only further tightens CATL's grip
Supply diversification has long been a recurring — and difficult — issue confronting the high-tech manufacturing ecosystem. But efforts to diversify component and materials sourcing have proved particularly challenging for automakers, which remain tied to a relatively concentrated upstream battery market.
Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
Friday 11 September 2026
Memory makers gain the upper hand as Apple's iPhones pay the price
Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
Friday 11 September 2026
Enflame enters public markets with Nvidia alternatives in its sights

Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above the IPO price after raising CNY6.12 billion (US$912 million). The listing gives the Tencent-backed company fresh capital to fund its next generations of AI processors and large-scale computing systems, while sharpening attention on China's effort to build alternatives to Nvidia.

Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging optical-interconnect standards as AI clusters strain the limits of copper connectivity.
Friday 11 September 2026
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from copper to fiber, according to Bai Qiang, deputy director for the automotive market at Xiamen UX IC Co. (UXIC).
Friday 11 September 2026
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
China's energy storage industry has expanded at breakneck speed since the launch of the 14th Five-Year Plan, growing 50-fold in just five years. The government is now applying the brakes, as local government support has helped spawn large numbers of speculative "energy storage cockroaches"—companies that secure project rights without actually building the projects—causing planned capacity on paper to soar while actual construction lags far behind.
Friday 11 September 2026
Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities
Anthropic has disrupted a series of operations in which Chinese AI companies allegedly used its Claude models to extract capabilities for their own AI systems, highlighting growing tensions over AI model distillation and data security.
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
ProLogium deepens partnership with Kyushu Electric Power through strategic investment

ProLogium said Kyushu Electric Power will make a strategic investment as its long-running collaboration expands from industrial cooperation into capital participation. The move signals growing confidence in next-generation battery technologies, with potential implications for energy security, manufacturing supply chains, and electrification efforts in global markets.