China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to Hygon considering higher CPU and deep computing unit (DCU) prices...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion for BT substrates used in memory packaging remains limited. With BT substrate supply tightening and demand for low-power SOCAMM memory modules rising, South Korea's Simmtech could benefit from its business in both memory package substrates and module PCBs.
Chinese AI chipmaker Cambricon Technologies reported a 131.49% increase in net profit attributable to shareholders for the first nine months of 2026, while revenue more than doubled. Third-quarter net profit rose nearly 150% from a year earlier.
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands SOCAMM2 production and builds capacity to retain its position in the high-end memory module substrate market.
Samsung Electronics' Device eXperience (DX) division has established its first overseas research and development site for manufacturing technology in Suzhou, China, leveraging the city's robotics and automation ecosystem to develop technologies for Samsung's global factories.
China's CXMT has reportedly declined Apple's inquiry about purchasing DRAM, prioritizing supply to domestic customers instead. As global memory supplies tighten and prices rise, the Chinese memory maker's capacity allocation and companies' efforts to secure supply have drawn attention.
South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth as strong memory demand drives up prices and manufacturing costs.
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26, as the AI chipmaker reassesses its memory strategy for next-generation Rubin Ultra accelerators.
Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and precision mechanisms. The dispute could affect perceptions of the South Korean supplier even as analysts forecast growth from expanding foldable device demand ahead.
Japan plans to provide about JPY100 billion (US$634.1 million) over four years to support mass production of next-generation perovskite solar cells, seeking to establish a domestic manufacturing base before China further widens its lead in the emerging technology, according to Nikkei Asia.
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities will support advanced chip work, while a planned talent pipeline could connect Indian engineers with Rapidus' manufacturing ambitions in Japan, highlighting the cross-border partnerships shaping semiconductor supply chains.
South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications, a market where Taiwanese suppliers are already moving toward commercial production.
South Korean autonomous delivery company NT1 plans to begin assembling Chinese-designed delivery vans locally in 2027, gradually adding Korean-made components as it seeks approval to operate the vehicles on public roads.
South Korean automotive supplier SL is considering deploying its mobile dual-arm robot at a US factory in 2027 or 2028, potentially marking the system's first overseas deployment, a company representative said in an interview with DIGITIMES at FIX 2026 in Daegu on October 24.
South Korean vehicle engineering company KAR plans to develop a monitoring system for the electronic controls it installs in autonomous vehicles, seeking recurring maintenance revenue as the country expands robotaxi trials.
Samsung Electronics Executive Chairman Lee Jae-Yong is reportedly set to visit the company's Robotics eXperience (RX) business unit in Seoul's Umyeon-dong by the end of October to review humanoid robot development and preparations for CES 2027. If the visit takes place, it will be Lee's first visit since the organization was established, highlighting Samsung's strategy of commercializing robots through manufacturing applications.