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Thursday 10 September 2026
China's 6G race starts before the first 6G phone as satellite links move into the network core
China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections into future smartphones.
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Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
ProLogium deepens partnership with Kyushu Electric Power through strategic investment

ProLogium said Kyushu Electric Power will make a strategic investment as its long-running collaboration expands from industrial cooperation into capital participation. The move signals growing confidence in next-generation battery technologies, with potential implications for energy security, manufacturing supply chains, and electrification efforts in global markets.

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
Friday 11 September 2026
Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry initiative to develop 12-inch photomasks, according to South Korea's fnnews. The company has separately confirmed both plans.

Friday 11 September 2026
Quantum computer development is more about national security than profits, says expert

Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026. According to Japanese media reports, NEC concluded that the commercialization timeline for a physical quantum computer was too long and that hardware investment would be unlikely to deliver commensurate returns. The decision also reportedly prompted quantum R&D researchers to join Fujitsu.

Thursday 10 September 2026
Gem Terminal rides China plug rule shift for 8.8% sales growth
Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements for plug pins under GB 1002-2024 and by stronger orders and a broader customer base for its specialty copper materials business.
Thursday 10 September 2026
Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs

Chinese AI chipmaker Enflame will list on the STAR Market of the Shanghai Stock Exchange on September 11, 2026, becoming the last of China's "four little GPU dragons" to go public. Enflame is grouped with Moore Threads, MetaX, and Biren Technology as China's "four little GPU dragons," and with Enflame's listing, all four companies will have entered the capital market.

Thursday 10 September 2026
China sets clear limits on payment terms to auto suppliers
China's government is formally imposing rules on long payment terms in the auto supply chain, with the Ministry of Industry and Information Technology (MIIT) and the State Administration for Market Regulation (SAMR) recently issuing a joint notice to standardize automakers' payment deadlines, acceptance procedures, and payment methods to their suppliers.
Thursday 10 September 2026
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
Chinese AI startup DeepSeek has taken a concrete step toward a domestic stock-market debut while continuing to adjust its commercial strategy, including another reduction in API prices for its Flash models.
Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing relationship to 130nm technology as supply conditions tighten across parts of the 8-inch foundry market.

Thursday 10 September 2026
DeepSeek's next AI test is not the model; it's everything around it

DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to a shift from pure model development toward the systems needed to support larger-scale AI services, agents, and computing workloads.

Thursday 10 September 2026
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth within tight power, thermal, and cost limits.
Thursday 10 September 2026
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic GPUs have gone into a 100,000-card core computing cluster at a leading Chinese AI cloud provider. The plan was announced at JD's 2026 Global Technology Explorers Conference in Beijing, according to Yicai.
Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where memory, computing, and advanced packaging are developed as one integrated system, affecting global chip supply chains.