CONNECT WITH US
Friday 7 August 2026
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation image sensors.
LATEST STORIES
Sunday 9 August 2026
Commentary: From free flow to tight control — how tech talent became a national security asset

Tech talent has moved from being simply a hiring priority to a matter of national security. As major economies increasingly tie talent to competitiveness and national security, control over its cross-border movement is tightening. That shift is visible today: Taiwan's Ministry of Justice Investigation Bureau is probing 17 companies accused of illegally recruiting tech talent in Taiwan, China is preparing to tighten exit controls on key technical workers, and the US continues expanding semiconductor and AI export controls and research security reviews.

Sunday 9 August 2026
Ajinomoto rides advanced packaging boom as ABF demand surges

Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in semiconductor package substrates, highlighting how advanced packaging is shifting more value upstream into specialized materials.

Sunday 9 August 2026
Hanwha Aerospace turns trillion-won profit into AI, unmanned warfare push
South Korea's Hanwha Aerospace posted a second-quarter 2026 operating profit of more than KRW1 trillion (approx. US$704.9 million), highlighting its ability to expand military exports and aerospace operations simultaneously. With earnings momentum strengthening, the company is now positioning unmanned warfare and AI-enabled combat systems as its next major growth drivers.
Saturday 8 August 2026
Commentary: China IC design rules reshape patent battles

China's State Council has released a revised version of the regulations on the protection of IC layout designs, set to take effect on October 15, 2026. It is the first full overhaul since the rules were issued in 2001, adding protection for photonic and quantum IC designs, increasing punitive damages for intentional infringement, and improving systems for layout design registration, licensing, and rights enforcement.

Friday 7 August 2026
Abu Dhabi sovereign wealth fund Mubadala weighs US$6.3B investment in Japan AI data center

The United Arab Emirates is considering investing as much as JPY1 trillion (approx. US$6.3 billion) in a 500MW artificial intelligence data center in Akita Prefecture, according to Bloomberg. Abu Dhabi sovereign wealth fund Mubadala Investment is expected to lead the investment in a project that could become Japan's largest data center.

Friday 7 August 2026
SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1 trillion to a new Cheongju NAND plant, in a move the company frames as securing supply capacity rather than chasing a cycle.
Friday 7 August 2026
South Korea welcomes Trump polysilicon rules as boost to non-China suppliers
US President Donald Trump's new import rules on polysilicon, ingots, wafers, and solar products could ripple through global clean energy and semiconductor markets, affecting pricing, sourcing, and investment decisions far beyond the US. South Korean producers welcomed the measure, while analysts said it targets low-cost Chinese supply and could reshape competition.
Friday 7 August 2026
SK Hynix's Solidigm weighs up to US$7 billion in pre-IPO funding

Solidigm, SK Hynix's US NAND and enterprise storage unit, is weighing a pre-IPO funding round of KRW5 trillion to KRW10 trillion, roughly US$3.5 billion to US$7 billion, ahead of a potential Nasdaq listing, a move that could establish a standalone valuation for the business as enterprise storage demand strengthens.

Friday 7 August 2026
South Korea clears ITU hurdle for world's first SDV standard

A South Korea-backed draft standard for software-defined vehicles (SDVs) has cleared a key milestone at the International Telecommunication Union (ITU), giving automakers and suppliers a common technical reference as the industry shifts toward software-centric vehicle architectures.

Friday 7 August 2026
China's MLCC supply chain ramps up as AI boom drives global component shortage

China's multilayer ceramic capacitor (MLCC) supply chain is accelerating capacity expansion as surging demand from AI servers and automotive electronics fuels one of the industry's strongest growth cycles, with domestic materials suppliers moving quickly to capture opportunities created by tightening global supply.

Friday 7 August 2026
China's surging export numbers shows automakers pivoting from price wars to value wars

China's auto exports climbed sharply in the first half of 2026 as the sector shifted from price-based competition to a focus on product value, according to the China Association of Automotive Manufacturers (CAAM).

Friday 7 August 2026
Analysis: Five years of US polysilicon imports show why Washington set the price floor at US$21
US imports of high-purity polysilicon jumped to US$190 million in 2025. Still, the bigger story is in the volume: 6,791 tonnes, more than five times the 1,286 tonnes imported in 2024, according to UN Comtrade trade data.
Friday 7 August 2026
Analysis: Trump’s polysilicon tariffs split solar industry into winners and losers
US President Donald Trump signed a proclamation on August 6 imposing minimum import prices and a 15% tariff on polysilicon and its derivatives, a move that hands a durable pricing advantage to US and non-Chinese producers while squeezing Chinese manufacturers out of price competitiveness in the American market.
Friday 7 August 2026
Chinese optical suppliers confront FCC threat after US$19.1B sell-off

Chinese optical transceiver suppliers are trying to calm investors after reports that the US Federal Communications Commission (FCC) may restrict new China-made data-center components, threatening a supply chain central to global AI infrastructure.

Friday 7 August 2026
Huawei's Richard Yu warns of smartphone price hikes as memory costs soar
Huawei executive director and Consumer Business Group chairman Richard Yu warned on August 5 that sharply rising memory costs could trigger widespread smartphone price increases, saying handset makers risk losses if they continue selling devices at previous price levels.