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Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer
Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with a petabyte-scale key-value (KV) cache system designed for AI agents and long-context inference.
LATEST STORIES
Thursday 17 September 2026
AMD pivots to China developer ecosystems as Nvidia retreats

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.

Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.
Thursday 17 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia

Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open source, allowing semiconductor manufacturers to use them to develop autonomous driving chips. The company aims to break Nvidia's dominant position in the autonomous driving chip market.

Thursday 17 September 2026
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate that the newly added Galaxy S27 Pro will substantially narrow the specification gap with the Ultra model. Both high-end smartphones are expected to share top-tier features, including 60W wired fast charging, a 200-megapixel main camera, and the latest M16 OLED display. Samsung will continue to use telephoto cameras, screen sizes, battery capacities, and S Pen support to differentiate the models, establishing a new "dual high-end flagship" hierarchy.
Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual accelerators. Huawei said the system is the industry's first supernode to adopt NPO and is designed to support large-scale training and inference for models with up to 10 trillion parameters.
Thursday 17 September 2026
South Korea's medical device city opens physical AI institute, aiming to train 1,400 workers in five years
Wonju, a South Korean city of about 360,000, roughly 90 minutes east of Seoul, opened a government-funded institute on Thursday, September 17, to train more than 1,400 workers in artificial intelligence over five years.
Thursday 17 September 2026
Huawei sees AI agents driving 90% of token traffic by 2035

Huawei expects autonomous AI agents to become the dominant source of AI traffic over the next decade, creating a sharp increase in demand for computing, networking, storage and power infrastructure.

Thursday 17 September 2026
ByteDance's Anew Labs reportedly raises US$290M as AI drug discovery gains momentum

ByteDance has completed a US$290 million funding round for Anew Labs, its AI drug-discovery business spun off from the Chinese technology group, valuing the company at US$1.5 billion, according to Reuters. ByteDance will retain a 56% stake following the fundraising.

Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA) device development path for advanced process nodes below 3nm that does not rely on extreme ultraviolet (EUV) lithography as its core technology.
Thursday 17 September 2026
China's FAW may become GAC's second-largest shareholder, possibly restructuring the Toyota China model

Consolidation chatter within China's automotive industry has reignited following an announcement by Guangzhou Automobile Group (GAC Group). Late on September 14, GAC disclosed that it had entered into a non-binding intent agreement with China First Automobile Group (FAW). Under the proposed transaction, GAC intends to acquire a partial stake in an undisclosed vehicle joint venture held by FAW via the issuance of new GAC shares. Upon completion of the share swap, FAW is expected to emerge as GAC's second-largest shareholder.

Thursday 17 September 2026
Column: China tightens rare earth controls, exposing hidden vulnerabilities in Taiwan's supply chain
China's rare earth export controls are changing the rules governing global critical mineral supply chains. For Taiwan, the real concern is not that China could suddenly halt all exports one day, but that export licensing, end-use reviews, price volatility, longer lead times, and "hidden dependencies" embedded in intermediate materials and components could gradually raise the cost and uncertainty of maintaining normal production.
Thursday 17 September 2026
South Korea's chip boom lifts 2027 corporate tax above KRW200 trillion

South Korea's semiconductor boom is spilling over from corporate profits into government tax revenue. Corporate tax revenue for fiscal 2027 is projected to reach KRW216.7 trillion (about US$160 billion), up 113.9% from the 2026 supplementary budget, topping KRW200 trillion for the first time and, after 15 years, overtaking income tax as the country's largest tax source.

Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and packaging. However, recent sourcing moves suggest those internal links are becoming more selective as individual businesses pursue their own customers, margins and capacity priorities.
Thursday 17 September 2026
Huawei's 3D data center redesign targets the next AI compute density wall
Huawei has unveiled what it calls the world's first 3D data center, introducing a vertically stacked four-layer architecture designed for increasingly dense AI computing clusters and gigawatt-scale infrastructure.
Thursday 17 September 2026
Huawei aims to become 'China's Nvidia,' rules out building satellites or spacecraft

Huawei's internal Heart Voice Community recently published minutes from a discussion between Guo Ping, chairman of Huawei's supervisory board, and newly hired employees, offering a glimpse into the company's ambitions in AI, computing, semiconductors, and future technologies.