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Tuesday 27 October 2026
China supply-chain price hikes strain domestic demand
China’s semiconductor and electronics supply chains are reporting a wave of price increases, from Goke Microelectronics raising quotes for hybrid-packaged memory products to Hygon considering higher CPU and deep computing unit (DCU) prices...
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Tuesday 27 October 2026
PSMC capacity crunch holds back Jeju Semiconductor's growth
South Korean memory chip designer Jeju Semiconductor is struggling to secure enough wafer capacity from Taiwan's Powerchip Semiconductor Manufacturing (PSMC), limiting its sales growth as strong memory demand drives up prices and manufacturing costs.
Tuesday 27 October 2026
Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia
Samsung Electronics and SK Hynix are targeting the second quarter of 2027 to begin volume shipments of eight-layer HBM4 memory to Nvidia, ZDNet Korea reported on October 26, as the AI chipmaker reassesses its memory strategy for next-generation Rubin Ultra accelerators.
Tuesday 27 October 2026
Fine M-Tec rejects component blame as foldable market outlook remains positive
Fine M-Tec has rejected claims that components it supplied contributed to reported display damage in Apple's first foldable iPhone, saying the issue involves multiple components and precision mechanisms. The dispute could affect perceptions of the South Korean supplier even as analysts forecast growth from expanding foldable device demand ahead.
Tuesday 27 October 2026
Japan sets JPY100 billion push to commercialize perovskite solar cells
Japan plans to provide about JPY100 billion (US$634.1 million) over four years to support mass production of next-generation perovskite solar cells, seeking to establish a domestic manufacturing base before China further widens its lead in the emerging technology, according to Nikkei Asia.
Tuesday 27 October 2026
HCLTech and Rapidus open India centers to support semiconductor engineering
HCLTech and Japan's Rapidus have inaugurated development centers in Bengaluru and Hubli, India, expanding their semiconductor engineering collaboration across Asia. The facilities will support advanced chip work, while a planned talent pipeline could connect Indian engineers with Rapidus' manufacturing ambitions in Japan, highlighting the cross-border partnerships shaping semiconductor supply chains.
Tuesday 27 October 2026
OPTOELEC seeks AI data center orders as Himax advances CPO optics
South Korean optics maker Optoelec is seeing growing interest from AI data center customers as it seeks to expand its wafer-level optics (WLO) business into high-speed optical communications, a market where Taiwanese suppliers are already moving toward commercial production.
Tuesday 27 October 2026
NT1 plans to assemble Chinese delivery vans in Korea in 2027
South Korean autonomous delivery company NT1 plans to begin assembling Chinese-designed delivery vans locally in 2027, gradually adding Korean-made components as it seeks approval to operate the vehicles on public roads.
Tuesday 27 October 2026
Hyundai supplier SL eyes first overseas robot deployment in US
South Korean automotive supplier SL is considering deploying its mobile dual-arm robot at a US factory in 2027 or 2028, potentially marking the system's first overseas deployment, a company representative said in an interview with DIGITIMES at FIX 2026 in Daegu on October 24.
Tuesday 27 October 2026
KAR bets on fleet monitoring as South Korea expands robotaxi trials
South Korean vehicle engineering company KAR plans to develop a monitoring system for the electronic controls it installs in autonomous vehicles, seeking recurring maintenance revenue as the country expands robotaxi trials.
Tuesday 27 October 2026
Samsung Executive Chairman reportedly eyes RX unit visit for humanoid robot push
Samsung Electronics Executive Chairman Lee Jae-Yong is reportedly set to visit the company's Robotics eXperience (RX) business unit in Seoul's Umyeon-dong by the end of October to review humanoid robot development and preparations for CES 2027. If the visit takes place, it will be Lee's first visit since the organization was established, highlighting Samsung's strategy of commercializing robots through manufacturing applications.
Sunday 25 October 2026
China clears DeepSeek, MiniMax for overseas AI deployment
DeepSeek and MiniMax have received approval to deploy their artificial intelligence models overseas, according to a post published October 22 by China Central Television’s Yuyuantantan account. The move signals that Beijing intends to permit Chinese AI companies to pursue global commercialization, even as proposed export controls could raise the threshold for transferring some advanced technologies abroad.
Sunday 25 October 2026
Moonshot's Singapore hiring shows how China's open-model labs plan to get paid abroad
Moonshot AI's first visible overseas sales hire marks a new stage in how Chinese developers of open-weight models compete outside China. They have given away model weights to win developers and earned money through cloud platforms and license terms; Moonshot now appears to be adding staff on the ground to manage partners and large customers.
Friday 23 October 2026
Doosan Robotics targets automakers, chipmakers as Chinese rivals cut prices
Doosan Robotics is focusing its sales efforts on large automotive and semiconductor manufacturers as it develops AI-powered systems capable of handling more complex factory tasks, Hyeonchang Jeon, senior manager of the company's Korea sales team, said in an interview with DIGITIMES at FIX 2026 in Daegu, South Korea.
Friday 23 October 2026
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The move marks the first time the FCC has used a new rule targeting devices whose chipmakers are deemed national security risks.