Introduction
The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...
SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...
Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...
China's leading DRAM maker, CXMT Corporation (CXMT), formerly known as ChangXin Memory Technologies, is reaping a windfall from price...
Samsung Electronics and SK Hynix have rejected a proposal to prepay KRW25 trillion (approx. US$18.7 billion) in electricity bills, highlighting...
Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...
SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers...
SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry...
China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...
Apple's expected first foldable iPhone is set to channel a significant share of its component value to South Korean suppliers, with Samsung...
Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...
