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NEWS TAGGED MANUFACTURING
Wednesday 20 October 2021
Taiwan PCB equipment suppliers busy fulfilling orders
With PCB and IC substrate suppliers looking to expand capacity, related equipment suppliers will be busy fulfilling orders that will be ramping up substantially through 2022, according...
Wednesday 20 October 2021
Silicon wafer shipments to log robust growth through 2024, says SEMI
Global silicon wafer area shipments will register robust growth through 2024, when about 16 billion square inches are forecast to be shipped, according to SEMI.
Tuesday 19 October 2021
Economists warn spillover effect of China economic slowdown
China's third-quarter economic growth numbers slowed more than expected to 4.9% from the same period last year, falling short of the 5.2% forecasted by a Reuters poll, but the growth...
Friday 15 October 2021
Will foundry expansions lead to capacity glut?
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
Friday 15 October 2021
TSMC sees fab capacity stay tight, mulls new fab in Japan
TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
Thursday 14 October 2021
China power restrictions to challenge supply chains in the long term
Supply chains are moving to cope with China's power reductions in one way or another, with the prospect the restrictions may become a long-term policy and will inevitably drive up...
Wednesday 13 October 2021
HDI PCB makers to embrace strong 4Q21
HDI PCB manufacturers including Compeq Manufacturing and Tripod Technology are expected to sustain strong shipment momentum in the fourth quarter of the year after posting record...
Tuesday 12 October 2021
Will Samsung beat TSMC in GAA process segment?
Samsung Electronics has outlined plans to move its 3nm GAA process to volume production in the first half of 2022, which could allow the South Korea-based foundry to beat TSMC in...
Friday 8 October 2021
Global notebook shipment forecast, 2022 and beyond
Global notebook shipments are expected to come to 236 million units in 2021, once again setting a new record in history. However, the year-over-year growth will fall short of the...
Friday 8 October 2021
Foxconn enters US EV market after announcing acquisition of Lordstown's factory
Granted access to the local EV market in the US by acquiring Lordstown Motors' Ohio factory, Foxconn will be producing Lordstown's Endurance electric truck and will be able to provide...
Friday 8 October 2021
Samsung reportedly to build additional ABF substrate capacity
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Friday 8 October 2021
Rich nickel resources make Indonesia a potential manufacturing hub for EV battery
Indonesia is poised to become the top electric vehicle (EV) battery supply base among all Southeast Asian countries, thanks to abundant mineral reserves and incoming foreign investment...
Wednesday 6 October 2021
Kunshan plants hit by power cuts, but Nan Ya ABF substrate fab unaffected
Taiwan-based makers with factory operations in Kunshan of China's Jiangsu provinces were notified on October 5 by the local government about immediate power cuts, and have expressed...
Wednesday 6 October 2021
TSMC to expand 7nm and 28nm fab capacities
TSMC is poised to comprehensively expand production capacities for both its 7nm and 28nm process technologies, in addition to its planned 5nm process expansion, which may prompt the...
Tuesday 5 October 2021
China power cuts may ease inventory cost pressure on component makers
China's government-led electricity restrictions may help ease inventory cost pressure on makers of components that are not in short supply, as they can take the opportunity to raise...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.