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    Commentaty: Huawei’s Kirin's road to 2027
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    Analysis: What's GlobalFoundries calculus behind its US$2 billion entry into TSMC’s CoWoS ecosystem
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    ProLogium shifts solid-state battery focus to AI and aviation markets
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    NEWS TAGGED MANUFACTURING
    Wednesday 14 October 2026
    300mm fab equipment spending to hit US$227 billion by 2029, SEMI says
    Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
    Wednesday 14 October 2026
    BOE struggles with glass breakage at US$9.4 billion OLED plant as it seeks Apple iPad orders

    China's BOE has spent approximately six months trying to resolve recurring glass substrate breakage at its Gen 8.6 OLED plant in Chengdu, raising...

    Wednesday 14 October 2026
    AI computing demand drives water management integration at Tianyi
    Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
    Wednesday 14 October 2026
    SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
    Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
    Wednesday 14 October 2026
    Hua Hong forges strategic alliances with four Chinese chip equipment giants
    Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
    Wednesday 14 October 2026
    TOK expands Koriyama photoresist capacity as AI chip demand rises
    Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
    Wednesday 14 October 2026
    Applied Materials CEO says AI race hinges on technology and capacity
    The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
    Wednesday 14 October 2026
    Adani and Jabil plan 50:50 JV to make AI data center hardware in India
    A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
    Wednesday 14 October 2026
    CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
    China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
    Wednesday 14 October 2026
    Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
    Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
    Wednesday 14 October 2026
    Apple COO visits Foxconn as iPhone Duo production ramps up
    Days before preorders open for Apple's first foldable smartphone, the iPhone Duo, Apple Chief Operating Officer Sabih Khan visited China to inspect its supply chain. On October 11,...
    Wednesday 14 October 2026
    TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
    GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
    Wednesday 14 October 2026
    Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
    As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
    Wednesday 14 October 2026
    China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
    Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external...
    Wednesday 14 October 2026
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era

    The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...

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    Oct 14, 08:00
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
    Wednesday 14 October 2026
    Practical Insights & Industry Ideas
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored
    Tuesday 13 October 2026
    Chenbro unveils AI rack-level solutions at 2026 OCP Summit