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Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development...
Saturday 19 September 2026
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Compal Electronics is buying out the shares of its listed networking arm, Compal Broadband Networks (CBN), in a cash deal that will end CBN's public listing and give Compal full control...
Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...

Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...

Friday 18 September 2026
FCS Group eyes North America layout, as plastics industry turns to material innovation

The spotlight has been on industry innovation at the 2026 Taipei International Plastics and Rubber Industry Show (TaipeiPLAS), as Taiwan's...

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit...

Thursday 17 September 2026
Deloitte Taiwan seminar highlights system integration as Physical AI moves into industrial applications
Taiwan's next opportunity in Physical AI may depend less on individual robot components than on its ability to integrate hardware, software, sensing and control into deployable industrial...
Thursday 17 September 2026
The Trump-Jensen speakerphone diplomacy: how Nvidia turned political pressure into a seat at the table
The relationship between Nvidia CEO Jensen Huang and US President Donald Trump has evolved from policy friction to a strategic alignment. The rapid shift in their dynamic reflects...
Thursday 17 September 2026
AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

Thursday 17 September 2026
Foxconn Interconnect Technology targets the scaling challenge in AI optical interconnects

Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale:...