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NEWS TAGGED MANUFACTURING
Friday 27 May 2022
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Wintel, a partnership between Intel and Microsoft, has been strongly driving the development of PCs and NBs. Recent years, digital transformation has been one of the key elements...
Friday 27 May 2022
Qualcomm, MediaTek cut back 5G smartphone chip orders for 2H22
Qualcomm and MediaTek have both scaled back 5G smartphone chip orders with their manufacturing partners for the second half of 2022, according to industry sources.
Thursday 26 May 2022
UMC makes progress in new fab establishment
Pure-play foundry United Microelectronics (UMC) is making progress in the establishment of new 12-inch fabs at its manufacturing sites in southern Taiwan and Singapore, according...
Wednesday 25 May 2022
NOR flash prices to trend downward in 2H22
NOR flash memory contract prices will likely trend downward in the second half of 2022, according to industry sources. Prices for low-density chips have started to drop in the second...
Thursday 19 May 2022
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
Renesas Electronics has announced plans to reopen its Kofu factory located in Kai City, Yamanashi Prefecture as a 300mm wafer fab capable of manufacturing power semiconductors. The...
Wednesday 18 May 2022
IPC makers start inventory adjustments
Taiwan-based industrial PC makers have moved to adjust their inventory levels amid the easing of chip and component shortages, according to industry sources.
Tuesday 17 May 2022
Actron, Eris eyeing IDM-like operations for car, industrial power devices
Taiwan-based power semiconductor suppliers including Actron Technology and Eris Technology are aggressively utilizing manufacturing and supply-chain resources from their affiliated...
Tuesday 17 May 2022
YMTC sampling 192-layer 3D NAND chips
China's Yangtze Memory Technologies (YMTC) has delivered samples of its in-house developed 192-layer 3D NAND flash memory to a few customers recently, according to industry sources...
Monday 16 May 2022
SMIC no longer discloses revenue by process nodes
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has reported first-quater 2022 sales, but omitted a revenue breakdown by manufacturing process nodes...
Friday 13 May 2022
ASMedia transitions to 28nm process for part of chip production
ASMedia Technology, an affiliate of Asustek Computer specializing in high-speed transmission chips, has transitioned to 28nm process manufacturing for part of its chip solutions while...
Thursday 12 May 2022
Wistron NeWeb expects chip shortage to persist through 1Q23
Networking device assembler Wistron NeWeb expects the shortage of MCUs, MOSFETs, power management ICs (PWM IC) and other chips demanding mature process manufacturing to persist and...
Thursday 12 May 2022
PWM IC firms expect more available 8-inch fab capacities in 2023
With their bigger peers transitioning to 12-inch wafer manufacturing, Taiwan-based power management IC (PWM IC) suppliers expect more 8-inch fab capacities to be available to satisfy...
Wednesday 11 May 2022
PSMC to fully utilize fab capacity over next 2 quarters
Powerchip Semiconductor Manufacturing (PSMC) will be running its 12- and 8-inch fabs at full capacity utilization in the next couple of quarters, according to the pure-play foundry...
Wednesday 11 May 2022
TSMC plans 5-9% price hike starting in 2023
TSMC has notified clients of a 5-9% price hike for both its advanced and mature processes, and the new prices are set to go into effect in January 2023, according to industry sourc...
Tuesday 10 May 2022
The memory industry (2): The era of makers utilizing manufacturing processes and equipment for both DRAM and 2D NAND flash
NAND flash was invented by Toshiba in 1989 and entered commercial mass production in the early 2000s. Since NAND flash has much faster access speed than mechanical hard drives, and...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.