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Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
Samsung delays High-NA EUV adoption until 1nm production in 2030
Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
Thursday 13 August 2026
Foxconn broadens beyond AI servers with EVs, robotics and Japan chip fab above 90% utilisation
Foxconn used its second-quarter 2026 earnings conference on August 12 to detail progress beyond its fast-growing AI server business, spanning cloud and data centre solutions, electric...
Thursday 13 August 2026
Samsung SDI-GM battery reset shows how ESS is reshaping the US EV supply chain

Samsung SDI is ending its battery manufacturing partnership with General Motors (GM) in Indiana, terminating a major EV joint venture...

Thursday 13 August 2026
LG Chem reportedly wins cathode supply deal for Hyundai-LG Energy Solution's US battery venture
LG Chem has been selected as a cathode material supplier for HL-GA Battery Company, the US battery manufacturing joint venture between Hyundai Motor Group and LG Energy Solution, according...
Thursday 13 August 2026
ITTS reports first-half growth as ERP and AI projects gain traction
Information Technology Total Services (ITTS) said its business recovered in the first half of 2026 as enterprise resource planning (ERP) implementation work advanced and data governance...
Thursday 13 August 2026
GaAs gains ground in short-reach AI optics as InP constraints mount
As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance...
Thursday 13 August 2026
India's state of Odisha sweetens chips, renewable energy incentives to court ISM projects

Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support...

Thursday 13 August 2026
Commentary: Shut out of Nvidia and AMD, Compal charts a different path to AI servers

Compal chairman Ray Chen said the company was still a newcomer to AI servers two years ago but has now moved into the middle tier and...

Thursday 13 August 2026
NXP expands Malaysia factory to bolster global chip supply resilience

NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor...

Thursday 13 August 2026
Taiwan manufacturers call for faster nuclear restart to keep pace with AI, chip growth

The Chinese National Federation of Industries (CNFI), a major industrial and manufacturing association in Taiwan, called for the government...

Thursday 13 August 2026
Exclusive: US makers accelerate sodium battery plans as shared lithium-ion lines draw investment
US battery makers are moving more quickly into sodium-ion technology to gain production flexibility, fresh capital, and reduced exposure to lithium supply shocks. Industry sources...
Thursday 13 August 2026
Yangtze Memory-backed capital expands into FD-SOI specialty process investment

Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin...

Thursday 13 August 2026
LSE Semiconductor wins strategic investment from TIS

Lithography Semiconductor Equipment Co. (LSE) officially announced on August 11 that TECO Image Systems Co. (TIS) had completed a strategic...