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Saturday 31 October 2026
TSIA 30: The manpower problem behind Taiwan's semiconductor resilience
Taiwan's semiconductor industry has earned its reputation for chip dominance through decades of sustained investment in solving some of the world's hardest technological challenges...
Saturday 31 October 2026
TSIA 30: Taiwan builds the AI backbone — but can it capture the AI economy?
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
Saturday 31 October 2026
TSIA 30: AI is breaking the sequential supply chain — Taiwan may be built for what comes next
The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether...
Saturday 31 October 2026
Infineon's 300mm GaN push turns Europe's power-chip strength into an AI infrastructure bet

The aggressive deployment of infrastructure-scale AI projects is rapidly driving up compute demand as chip architectures continue to scale across...

Saturday 31 October 2026
DIGITIMES Insight: Arm extends from IP licensing to server CPU products, with strong growth potential in China
Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI)...
Friday 30 October 2026
Foxconn, Nvidia target eight-week AI factory deployment as Vera Rubin pushes infrastructure complexity
Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled...
Friday 30 October 2026
Google, Foxconn aims to cut AI infrastructure deployment to six months
Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional...
Friday 30 October 2026
Foxconn argues it is more than a box mover in AI hardware
Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image...
Friday 30 October 2026
Jinpao targets power cabinets, BBUs in AI-related expansion
Thailand-based precision sheet-metal manufacturer Jinpao Precision has entered the supply chain of a leading Thailand-based power-management company on the strength of its resilient...
Friday 30 October 2026
KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers
KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the...
Friday 30 October 2026
Delta Electronics approves Penang manufacturing base to expand global capacity
Delta Electronics approved plans on October 28 to establish a large manufacturing base in Penang, Malaysia, as the power and thermal management company expands overseas production...
Friday 30 October 2026
Intel's server surge faces a supply setback as PC weakness persists
Intel's growing server business is strengthening its operating recovery, but a factory disruption and a prolonged PC downturn threaten its ability to convert demand into near-term...
Friday 30 October 2026
Doosan Enerbility expands AI power push with US gas turbine orders, next-gen nuclear
Doosan Enerbility is strengthening its position in the AI-driven power infrastructure market, backed by 12 gas turbine orders in the US and an expanding nuclear energy portfolio. At...
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
Friday 30 October 2026
HBM4 cycle faces squeeze as capacity, specs become critical
AI chipmakers' rising memory performance requirements are accelerating the shift from sixth-generation high-bandwidth memory (HBM4) to HBM4E, according to analysis of the South Korean...