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NEWS TAGGED MANUFACTURING
Friday 30 July 2021
Intel could challenge TSMC in next 5 years
If Intel is able to advance its process technology on schedule, it could regain its foundry technology leadership that has been taken by TSMC in the next five years, according to...
Thursday 29 July 2021
Nan Ya optimistic about 2H21
Nan Ya Plastics expects to enjoy more robust growth in sales of its copper foil and other electronic materials in the second half of 2021, while seeking more vertical integration...
Wednesday 28 July 2021
TSMC on track for bold overseas manufacturing deployments
Following its move to set up a 5nm chips fabrication plant in the US and expand foundry capacity in China, TSMC has recently confirmed its intentions to build fabs in Japan and Germany...
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Tuesday 27 July 2021
SEMICON Taiwan 2021 to hold online technology forums in September
SEMICON Taiwan 2021 has announced that starting from September, five online technology forums will be held as a prelude to its physical exhibition, which has been rescheduled to December...
Monday 26 July 2021
Manufacturing production index in Taiwan expected to increase 20.20% in June
The industrial production index in Taiwan increased 18.37% in June 2021, compared with the same month in 2020. The annual production index by some major industrial divisions is as...
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Thursday 22 July 2021
China AI, HPC chip developers step up pace of orders
China-based AI and HPC chip developers have quietly stepped up their pace of orders demanding advanced-node manufacturing at TSMC, according to industry sources.
Thursday 22 July 2021
Smartphone AP suppliers begin a new round of competition in 2H21
Brand vendors of 5G smartphones have started building component inventory for their new models for the second half of 2021, but prices of AP solutions are facing difficulties to increase,...
Wednesday 21 July 2021
MCU prices to rise through year-end
MCU prices are poised to rise through the end of 2021, due to the impact of a nationwide lockdown in Malaysia and a cutback in support from China-based foundries, according to industry...
Wednesday 21 July 2021
Compeq keenly exploring PCB for non-CE applications
Taiwan's PCB maker Compeq Manufacturing is guardedly optimistic about its shipment prospects for the second half of the year, and will continue to diversify its target markets to...
Wednesday 21 July 2021
Thailand subsidiary is regional hub for Delta Electronics
Delta Electronics (Thailand), the subsidiary of Taiwan-based Delta Electronics, has become the regional business headquarters and manufacturing center in India and Southeast Asia...
Wednesday 21 July 2021
Vietnam manufacturing hit hard by pandemic resurgence, says report
Factories in Vietnam's industrial zones, export processing zones and high tech parks are suffering from the worsening COVID-19, as workers are being quarantined to prevent further...
Wednesday 21 July 2021
Globalfoundries to build new fab in New York
Globalfoundries (GF) has announced expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments...
Tuesday 20 July 2021
China MEMS foundry startup boosts monthly output to 70,000 wafers
Semiconductor Manufacturing Electronics (ShaoXing), a China-based MEMS foundry startup formed by Semiconductor Manufacturing International (SMIC) and the local government, has managed...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.