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Monday 27 July 2026
GIGAIPC eyes retail, manufacturing and healthcare as edge AI adoption accelerates
GIGAIPC, an edge AI and industrial computing subsidiary of Gigabyte Technology, is set to begin trading on Taiwan's Emerging Stock Market on July 27. The company plans to deepen its...
Monday 27 July 2026
Samsung Electro-Mechanics starts pilot production of camera modules for humanoid robots in Vietnam, report says
Samsung Electro-Mechanics (Semco) has begun pilot production of camera modules for humanoid robots at its manufacturing base in Vietnam, Maeil Business Newspaper reported,...
Monday 27 July 2026
India roundup: India accelerates electronics and space ambitions as manufacturing and market shifts reshape its tech ecosystem

India expanded manufacturing incentives, entered private orbital launches, attracted new investment,...

Monday 27 July 2026
Taiwan's AIDC is turning a decade of AI manufacturing know-how into a business model

Taiwan's Aerospace Industrial Development Corporation (AIDC) has spent nearly a decade pushing AI adoption, moving from smart manufacturing...

Sunday 26 July 2026
Samsung and Hyundai target Silicon Valley AI roundtable
Samsung Electronics chairman Lee Jae-Yong and Hyundai Motor chairman Chung Eui-Sun are reportedly moving to join the advisory network of the global AI leaders' gathering "Silicon Valley...
Sunday 26 July 2026
Pantheon Electric expands copper platform as AI and grid demand tighten supply
Pantheon Electric said it has completed the acquisition of four manufacturers and built an integrated power infrastructure platform across 21 factories in North America and Europe...
Sunday 26 July 2026
Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...
Saturday 25 July 2026
89 fabs by 2030, 50 more by 2035: chip industry spreads risk through global collab

AI infrastructure investment is reaching unprecedented levels, with estimates showing it will lift global semiconductor output past...

Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
Saturday 25 July 2026
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
Friday 24 July 2026
Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor...

Friday 24 July 2026
German chip suppliers deepen ties with Samsung, SK Hynix

Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment...

Friday 24 July 2026
India's chip plants face harder test: finding repeat customers
India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
Friday 24 July 2026
Rapidus expands Hokkaido chip hub with packaging and analysis

Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...