CONNECT WITH US
NEWS TAGGED MANUFACTURING
Thursday 22 October 2026
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
Thursday 22 October 2026
Memory surge drives phone makers from LTPO to LTPS
Soaring memory prices are intensifying cost pressure across the display industry, prompting some smartphone manufacturers to downgrade panel specifications. Market estimates indicate...
Thursday 22 October 2026
Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Thursday 22 October 2026
3M calls Largan partnership key step for US$2 billion EBO market
3M Chairman and CEO Bill Brown outlined the latest progress in the company's expanded beam optics (EBO) technology during its third-quarter earnings call, highlighting a contract manufacturing...
Thursday 22 October 2026
Holy Stone targets 50% South Korea revenue growth by 2027
Taiwanese passive-component maker Holy Stone has entered the supply chain of a major South Korean automaker after about two years of market expansion, prompting the company to raise...
Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
Qisda integrates four companies to build scalable rack-scale AI solutions
Qisda Group is targeting rack-scale AI opportunities in data centers by accelerating development of its rack-scale AI solutions. Through in-house design, manufacturing, and cross-domain...
Wednesday 21 October 2026
Murata develops world's smallest NTC thermistor, targets 2027 mass production
Japan's Murata Manufacturing has developed the world's smallest NTC thermistor, the 008004 NCU01 series, measuring 0.25mm × 0.125mm. Compared with Murata's previous smallest...
Wednesday 21 October 2026
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
Wednesday 21 October 2026
Apple expands US iPhone supply ties with Perryman and Qnity
Apple announced new and expanded US supplier partnerships on October 20, 2026, including plans to commit up to US$100 million to titanium producer Perryman Company over three years...