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Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
US-Mexico trade talks put AI servers in focus as Taiwan ODMs seek common ground

The US is reportedly pressuring Mexico to tighten rules of origin for AI hardware to limit the use of components produced outside North...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...
Sunday 20 September 2026
BYD plans four Europe factories as EU tariff pressure rises

BYD is planning four factories in Europe over the long term as it works to meet local manufacturing rules and expand its customer base...

Sunday 20 September 2026
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign

Wiwynn is introducing collaborative robots (cobots) at its El Paso, Texas, facility and third plant in Mexico, alongside a central heat...

Sunday 20 September 2026
Foxconn joins Quantron, Hongjing Drive in zero-emission commercial vehicle partnership

German commercial vehicle company Quantron and China's Hongjing Drive have formally agreed to establish a joint venture, Quantron China,...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Saturday 19 September 2026
Beyond Volkswagen, XPeng seeks to turn automotive R&D into a global tech enterprise
It has become increasingly evident that one of the factors undermining China's unparalleled competence in the global EV industry is manufacturing scale. But the continued development...
Saturday 19 September 2026
Compal takes Compal Broadband Networks private to fold networking into its edge AI stack
Compal Electronics is buying out the shares of its listed networking arm, Compal Broadband Networks (CBN), in a cash deal that will end CBN's public listing and give Compal full control...
Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Samsung deepens Euclyd ties as startup reportedly reaches test-chip stage

Samsung Electronics is deepening its relationship with Dutch chip startup Euclyd after the company reportedly reached the test-chip...

Friday 18 September 2026
Samsung taps Japan for 3.xD chiplet push as packaging race heats up
Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...