Worldwide sales of semiconductor manufacturing equipment surged 19% from US$59.8 billion in 2019 to a new all-time high of US$71.2 billion in 2020, according to SEMI.

The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...

Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...

China-based Lijing Microelectronics Technology (Jiangsu) will expand monthly miniLED packaging capacity to 800 million chips by the end of May 2021, seven months ahead of schedule,...

Materials for PCBs and IC packaging have seen prices rising and the upward trend is set to continue in the second quarter, according to industry sources in Taiwan.

Backend houses including Powertech Technology (PTI) and ChipMOS Technologies have seen demand for specialty DRAM chips surge in the last 1-2 months, and are expected to enjoy robust...

Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...

Pure-play foundries have raised their quotes starting the second quarter of 2021 to reflect tight capacity, and are likely to adjust upward the prices again in the third quarter,...

The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...

Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...

Leadframe supplier Chang Wah Technology (CWTC) has seen clear order visibility through April 2022, in line with wire-bonding process capacity at backend houses already booked by chipmakers...

Taiwan-based OSAT providers are not expecting much business opportunity to be coming from Intel's new manufacturing strategy, dubbed IDM 2.0.

Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...

Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.

The global semiconductor materials market grew 4.9% in 2020 to US$55.3 billion in revenue, surpassing the previous market high of US$52.9 billion set in 2018, according to SEMI.

IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...

Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second...

Globalfoundries has announced it is partnering with Bosch to develop and manufacture next-generation automotive radar technology, according to the companies.

Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...

Scientech, a provider of silicon wafer reclaim services and chipmaking equipment, is expected to post a double-digit revenue increase in 2021, according to market sources.

Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...

Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...

Holtek Semiconductor is poised to hike quotes for all its MCU lineups by about 15%, with the new prices to be effective starting April 1, according to company president Gordon Gau...

Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...

Rising foundry and backend quotes are prompting IC design houses to make efforts to pass on higher production costs to customers, according to industry sources in Taiwan.