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    AI memory shortage may lift smartphone prices in 2H26
    Jul 20, 18:25
    Zeiss claims China cannot bypass EUV with advanced packaging
    Jul 20, 18:25
    Samsung reportedly bets on Wide Fold as Apple’s foldable iPhone nears
    Jul 20, 18:25
    Taiwan PCB makers expand into Southeast Asia on supply chain shifts and AI demand
    Jul 20, 18:25
    China's solar industry has posted losses for three straight years amid excess capacity
    Jul 20, 18:25
    NEWS TAGGED PACKAGING
    Monday 20 July 2026
    Rapidus taps Cadence AI agents to speed 2nm chip design
    Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...
    Monday 20 July 2026
    Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

    Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

    Monday 20 July 2026
    Merck ramps up AI semiconductor materials push as Level Up nears completion

    AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

    Monday 20 July 2026
    Huahsu expands capacity to tap AI and advanced packaging demand
    Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...
    Saturday 18 July 2026
    As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
    Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
    Saturday 18 July 2026
    JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
    As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
    Friday 17 July 2026
    TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

    During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

    Friday 17 July 2026
    Laser Tek says AI demand is driving orders, but parts shortages are delaying shipments
    Taiwanese laser processing equipment maker Laser Tek said that artificial intelligence(AI)-led investment in advanced packaging, testing, and passive components is boosting orders...
    Friday 17 July 2026
    Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

    Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

    Friday 17 July 2026
    TSMC welcomes EMIB relief as MediaTek pressure eases

    TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

    Friday 17 July 2026
    TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

    TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

    Friday 17 July 2026
    TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead
    Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...
    Friday 17 July 2026
    China's AI chips hit three walls — and bet on 3D memory to break through
    China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
    Thursday 16 July 2026
    C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers
    TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...
    Thursday 16 July 2026
    AI chips are running hotter — and Niching is betting its future on keeping them cool
    As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    AI Summit Seoul