News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 28 April 2025

FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

Friday 25 April 2025

Gold surge squeezes chip packaging margins

Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the semiconductor packaging industry. The gold bumping process—essential...

Thursday 24 April 2025

TSMC's global expansion faces critical workforce challenge

TSMC is struggling with workforce constraints as it builds 24 new fabrication plants globally, potentially threatening its ambitious expansion timeline, Chairman C.C. Wei revealed...

Thursday 24 April 2025

What TSMC revealed at 2025 Symposium

At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...

Monday 21 April 2025

AI gold rush or policy trap? Taiwan IC firms weigh Nvidia's US lure

Taiwanese IC packaging and testing firms express a mix of opportunity and caution as Nvidia's US$500B AI push unfolds. While Nvidia's US-centric AI supply chain creates demand for...

Monday 21 April 2025

Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

Friday 18 April 2025

C Sun poised to join US semiconductor expansion wave

C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...

Friday 18 April 2025

Manz bolsters CoPoS innovation in Taiwan, eyes US expansion

Manz, a pioneering company in semiconductor equipment, is ramping up its efforts to advance Chip-on-Panel-on-Substrate (CoPoS) technology, aiming for commercialization and broader...

Thursday 17 April 2025

Innolux CEO responds to FOPLP delays

Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...

Tuesday 15 April 2025

Taiwan IC packaging firms report strong 1Q25, but US tariff uncertainty casts shadow

Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter...

Monday 14 April 2025

Silicon photonics nears maturity, eyes full ecosystem by late 2025

Silicon photonics (SiPh), hailed as a transformative technology for AI development, data centers, and 5G networks, is rapidly converging toward standardized parameters and specific...

Wednesday 9 April 2025

Micron lifts HBM market forecast as Nvidia B300 shipments loom

At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power...

Tuesday 8 April 2025

Tariff impact minimal: Hye Technology reports no direct sales to the US

In response to the announcement by the US government on April 2, 2025, regarding reciprocal tariffs, Hye Technology stated that it does not directly sell automation and semiconductor...

Tuesday 8 April 2025

India's CDIL and Infineon team up to tackle local chip market needs

CDIL Semiconductors, one of India's oldest semiconductor firms, is teaming up with Infineon Technologies to bring localized power discrete solutions to the Indian market.

Monday 7 April 2025

Etron's Nicky Lu on TSMC's global playbook and Taiwan's AI-memory pivot: no bottlenecks, no backpedaling

Generative AI is redrawing the tech landscape—from cloud to edge—while geopolitical tensions push countries to rethink their...

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