Friday 1 December 2023
Amkor announces US advanced packaging and test facility, Apple to be its first customer
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Friday 1 December 2023
Samsung ramps up 2.5D packaging capacity, eyeing Nvidia AI GPU orders
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through...
Friday 1 December 2023
BIWIN packaging and testing center achieves IATF 16949 recognition
BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a...
Tuesday 28 November 2023
Samsung unveils ambitious 'GDP' semiconductor strategy targeting AI market growth
Samsung Electronics executives have recently disclosed their 2024 semiconductor strategy, named "GDP" (Gate-All-Around, DRAM, and Packaging), at an investors forum, aiming to tap...
Monday 27 November 2023
India's Kaynes SemiCon plans first OSAT line in April, eyes advanced packaging tech partnerships
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
Thursday 23 November 2023
CMOS packaging specialist Tong Hsing expects modest growth in 4Q23
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Monday 20 November 2023
Samsung jumps into AI, set to unveil cutting-edge 3D packaging tech in 2024
With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024,...
Wednesday 15 November 2023
IC packaging material distributors see demand pick up
Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee Industrial, among others, have observed an increase in demand for IC packaging materials and are generally...
Monday 13 November 2023
Taiwanese equipment makers venture into OHT market to serve thriving backend houses
As the material handling in each production process of semiconductor factories is moving toward intelligent transportation, Taiwanese equipment manufacturers have evolved from mature...
Thursday 9 November 2023
Chinese chip packaging leader JCET observes a resurgence in smartphone market
The shipment volume of smartphones in China has been continuously decreasing for ten consecutive quarters. The latest reports from various research institutions, including TechInsights,...
Thursday 9 November 2023
Semco set to complete new plant for advanced chips packaging substrates in May 2024
Samsung Electro-Mechanics (Semco) is poised to strengthen its position in the semiconductor industry with the construction of a new plant at its Sejong manufacturing base in South...
Friday 3 November 2023
TSMC modifies new fab projects in Taiwan, sources say
TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...
Tuesday 31 October 2023
TSMC fab investments buoying STSP revenue
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Tuesday 31 October 2023
JCET sees growth accelerate in 3Q23
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Monday 30 October 2023
Winbond upbeat about 2024 prospects
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...