Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with National Instruments (NI) under which Spirox will sell NI's STS (semiconductor...

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

Taiwan-based Spirox, which distributes packaging and testing equipment, expects sales to hit bottom for 2019 in the second quarter.

The global IC packaging and testing market had a scale of US$28 billion in 2018 with the top-10 players commanding a combined 84% share. Three of the top-10 players are based in China...

PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...

Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.

IC backend house ASE Technology Holding's newly-developed fan-out panel-level packaging (FOPLP) technology has obtained orders from HiSilicon, according to sources familiar with the...

IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship...

TSMC has certified Ansys' solutions for its SoIC (system-on-integrated chips) 3D chip-stacking technology, according to Ansys, an engineering simulation software provider.

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...

With the crypto mining fever subsiding, many Taiwan backend houses have seen their FC-CSP machines dedicated to packaging mining ASICs stay idle since late 2018, forcing them into...

ASE Technology has landed more customized SiP (system-in-package) backend orders than expected earlier this year thanks to growing demand for heterogeneous integration of 5G chips,...

Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk...

Major Taiwan-based backend houses ASE Technology Holding and Powertech Technology (PTI) have both reported sequential decreases of 22.1% and 13.2%, respectively, in consolidated revenues...

GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...

Backend houses have seen orders for handset-use TDDI (touch and display driver integration) chips ramp up significantly, prompting them to allocate part of their COF (chip on film)...

The global semiconductor materials market grew 10.6% in 2018, propelling semiconductor materials revenues to US$51.9 billion to eclipse the previous high of US$47.1 billion set in...

COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film)...

Taiwan-based IC designers, MCU suppliers and back-end packaging and testing service providers are all optimistic about the business opportunity brought by true wireless stereo (TWS)...

IC-packaging material and equipment supplier Chang Wah Electromaterials (CWE) has announced the signing of a NT$7.2 billion (US$233.7 million) syndicated loan agreement with 13 local...

Taiwan-based Keystone Mircrotech, a supplier of high-frequency and high-speed IC testing solutions, is optimistic about a double-digit revenue growth for 2019 as it is stepping up...

Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...

Taiwan-based chipmakers are mostly engaged in the non-memory semiconductor market, where demand is expected to start recovering gradually in the second quarter of 2019, according...

Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...