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NEWS TAGGED PACKAGING
Monday 2 November 2026
Samsung chairman Lee Jae-yong turns to Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...
Monday 2 November 2026
Dixon maps AI hardware expansion through Inventec, Gemtek, prospective packaging partners
Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing,...
Monday 2 November 2026
Exclusive: Metal adhesion poses challenge for aluminum nitride in AI optics
As AI and large-scale data center buildouts drive up data transmission speeds, heat is becoming increasingly concentrated in key components. This has drawn attention to ceramic substrates...
Sunday 1 November 2026
Six decades in the making: Why the world can't easily copy Taiwan's chip ecosystem
Taiwan's semiconductor strength is often described today through leading-edge process nodes, advanced packaging capacity, or its pivotal role in the global AI supply chain. At the...
Saturday 31 October 2026
TSIA 30: Taiwan builds the AI backbone — but can it capture the AI economy?
Taiwan already manufactures much of the physical infrastructure on which the AI boom depends. Advanced logic, packaging, substrates, testing, power delivery, cooling, and server assembly...
Saturday 31 October 2026
AUO targets major revenue contribution from optical engines, glass core substrates within 2 to 3 years
AUO is accelerating its strategic push into optical communications and advanced semiconductor packaging, establishing optical engines and glass core substrates (GCS) as its two primary...
Saturday 31 October 2026
TSIA 30: AI is breaking the sequential supply chain — Taiwan may be built for what comes next
The AI hardware race is usually measured in nanometers, memory bandwidth, and accelerator performance. But another constraint is emerging much earlier in the development process: whether...
Saturday 31 October 2026
Ibiden expands AI packaging substrate capacity for Intel from 2029
Ibiden on October 29 raised its fiscal 2026 forecast, projecting consolidated net profit to rise 40% year-over-year to JPY89 billion (US$563 million) and revenue to increase 36% to...
Friday 30 October 2026
C Sun Mfg invests in Nemstek to expand advanced packaging equipment
C Sun Mfg announced on October 30 that it would subscribe for 1,900 lots of Nemstek's privately placed common shares as a strategic investor, giving it an expected stake of approximately...
Friday 30 October 2026
Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030
Nvidia has begun securing advanced substrate capacity in Taiwan, Japan and South Korea, using capacity reservation agreements and upfront payments to support supplier expansion as...
Friday 30 October 2026
ASE expects packaging and testing margins to stay above 30%
ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the...
Friday 30 October 2026
KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers
KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the...
Friday 30 October 2026
ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%
As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.
Friday 30 October 2026
Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level
Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually...
Friday 30 October 2026
Intel increases equipment orders as server demand exceeds supply
Intel's server expansion is drawing equipment and materials suppliers into a capacity push, but the benefits will arrive in stages. Management's October 29 earnings-call comments identified...