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    India's CG Power targets 70% utilization at larger semiconductor packaging plant
    7min ago
    Analysis: Smartwatch demand set to outpace broader hardware market in 2026
    12min ago
    Uber expands ride-hailing reach across Taiwan as trips and local demand rise
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    Yttek's ground equipment supports FORMOSAT-8 first satellite
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    HTSI targets AI chip demand with SiPh, CPO, packaging push
    16min ago
    Anthropic prepares IPO pitch centered on a $30 trillion AI market
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    Proton sales jump 39% as Malaysian automaker expands EV push
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    Ablecom takes control of Jochu to expand AI server rack, liquid cooling business
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    Commentary: Nvidia bets on open models to lift GPU usage
    17min ago
    Taiwan, Germany map AI-led net-zero push for 2026
    18min ago
    Taiwan plans higher power growth to meet AI demand, officials say
    18min ago
    AI data center boom lifts Weltrend fan-control chip sales 64%
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    Xiaomi's Xring O3, O100 and D100 define a three-tier AI chip strategy beyond smartphones
    18min ago
    Nvidia shifts HBM4 mix toward 8-high as memory supply stays tight
    19min ago
    China's foundries have won the mature-node argument, not the self-sufficiency one
    19min ago
    Indian states begins to tighten screws on data centers even as the build-out accelerates
    19min ago
    5G-A low-latency breakthrough paves way for Physical AI, XR
    19min ago
    Ligitek skips 800G, targets 1.6T silicon photonics
    21min ago
    Anthropic reportedly commits US$45 billion to Nscale for AI computing capacity
    22min ago
    Apple, Huawei foldables to collide in September, lifting ultra-thin glass, hinge and cooling demand
    26min ago
    Supply shortages, price hikes fail to slow new phone wave
    28min ago
    Samsung Galaxy A1 DDI packaging shifts to Chipbond
    34min ago
    Lambda eyes US$3B funding ahead of 2027 IPO
    42min ago
    Goldman Sachs AI chief warns of cognitive decline
    46min ago
    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    Aug 26, 19:17
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    Aug 26, 19:17
    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    Aug 26, 19:16
    NEWS TAGGED PACKAGING
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

    Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

    Thursday 27 August 2026
    Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
    Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
    Wednesday 26 August 2026
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
    Wednesday 26 August 2026
    Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
    Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
    Wednesday 26 August 2026
    Eternal Materials reports July revenue gain as advanced packaging demand strengthens
    Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
    Wednesday 26 August 2026
    Samsung, Intel widen AI chip battle into memory, packaging
    Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Tuesday 25 August 2026
    Tesla senior chip engineer joins DensityAI as in-house plans face more strain
    Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
    Tuesday 25 August 2026
    Nexperia China rebuilds 12-inch local supply chain after 330 days
    Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Tuesday 25 August 2026
    Applied Materials executive says data centers set new AI competition standard

    Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of...

    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    SEMI launches alliance to ride semiconductor materials boom
    SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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