AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Shinko Electric Industries announced on September 30 it has signed a purchase agreement to acquire the Mobara Fab from Japan Display (JDI) in Mobara City, Chiba Prefecture. The transaction...
As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
ASE Technology Holding (ASEH) announced on July 30 that it would spend roughly NT$5.67 billion (approx. US$177.97 million) to acquire land and factory buildings in the Zhongli Industrial...
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
