Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...

Chang Wah Electromaterials (CWE), a Taiwan-based distributor of packaging material and equipment, has disclosed plans to grow its stake in Tian Zheng International Precision Machinery,...

Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected...

IC backend houses have seen demand pick up recently for processing TV SoCs and chip solutions for set-top boxes (STB) and other household appliances while chip demand for handset...

Formosa Advanced Technologies (FATC), an affiliate of memory maker Na Ya Technology and specializing in memory chips packaging and testing, remains upbeat about backend demand for...

Grand Plastic Technology (GPTC), specializing in wet process facilities, will see equipment orders for TSMC's new advanced packaging plant in Taiwan start generating revenues in 2021,...

Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged...

Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...

Innolux plans to expand its business beyond the current focus of panel manufacturing to include automation equipment and semiconductors leveraging the expertise it has gained from...

Display driver IC backend specialist Chipbond Technology is constructing a new plant designed mainly for processing RF and PA components for use in 5G devices, which will significantly...

New US trade sanctions against Huawei will bring "uncontrollable variables" to the IC market in the second half of 2020, according to Canon Huang, chairman and president for IC packaging...

Demand for power modules and module leadframes used in automotive and industrial control applications is expected to surge in the fourth quarter with shipments in the third quarter...

Yageo has obtained a 5-year syndicated loan of NT$48.5 billion (US$1.6 billion), an amount nearly 60% higher than the company's original expectation, from banks and will use the fund...

Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...

ASRock expects its operating profits and revenues for 2020 to grow by double-digit percentages on year thanks primarily to its growing server business, with the company planning to...

China-based major LED chip makers and packaging service providers, optimistic about demand for mini and micro LEDs, are currently pushing capacity expansions mainly for related applications,...

TSMC's new 5nm Plus node reportedly will be able to enter mass production in the fourth quarter of 2020 with the process...

IC fabrication and backend materials distributors are expected to face a slowdown in shipments starting third-quarter 2020 at the earliest due mainly to impacts of the coronavirus...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...

ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...

It would not be a surprise if Foxconn Technology Group collaborated with TSMC to jointly develop their operations in the US by 2024, given the firm's deployments in fan-out panel-level...

China-based ACM Research, a supplier of advanced wafer-level packaging equipment and other fab tools, has been expanding its product portfolio to satisfy the growing needs of China's...

China's homegrown semiconductor equipment makers are gearing up to develop diverse frontend and backend IC process equipment in line with the government efforts to boost self-sufficiency...

Coronavirus lockdowns in several Southeast Asian countries have disrupted supply of chips and components for notebooks and although the shortages have significantly improved recently...

Taiwan-based Chang Wah Electromaterials, a distributor of packaging materials and equipment, has announced plans to invest in COF packaging specialist Chipbond Technology seeking...