993 news items tagged packaging
Global semiconductor equipment sales hit record high in 2020, says SEMIWednesday 14 April 2021
Worldwide sales of semiconductor manufacturing equipment surged 19% from US$59.8 billion in 2019 to a new all-time high of US$71.2 billion in 2020, according to SEMI.
IC packaging equipment in severely tight supplyWednesday 14 April 2021
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened...
Taiwan chipmaking material distributors to embrace strong 2021Wednesday 14 April 2021
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Lijing Microelectronics to expand miniLED packaging capacity ahead of scheduleFriday 9 April 2021
China-based Lijing Microelectronics Technology (Jiangsu) will expand monthly miniLED packaging capacity to 800 million chips by the end of May 2021, seven months ahead of schedule,...
IC packaging, PCB material prices riseWednesday 7 April 2021
Materials for PCBs and IC packaging have seen prices rising and the upward trend is set to continue in the second quarter, according to industry sources in Taiwan.
Backend firms to see robust demand for specialty DRAM through 3Q21Tuesday 6 April 2021
Backend houses including Powertech Technology (PTI) and ChipMOS Technologies have seen demand for specialty DRAM chips surge in the last 1-2 months, and are expected to enjoy robust...
PTI lands major SMT testing orders for Intel CPUsTuesday 6 April 2021
Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...
Foundries likely to raise quotes againTuesday 6 April 2021
Pure-play foundries have raised their quotes starting the second quarter of 2021 to reflect tight capacity, and are likely to adjust upward the prices again in the third quarter,...
Tape COF substrate supply to become tight for processing OLED DDIWednesday 31 March 2021
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Prices for epoxy molding compounds to rise 10% in AprilWednesday 31 March 2021
Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...
Leadframe supplier CWTC sees clear order visibility through April 2022Tuesday 30 March 2021
Leadframe supplier Chang Wah Technology (CWTC) has seen clear order visibility through April 2022, in line with wire-bonding process capacity at backend houses already booked by chipmakers...
Taiwan OSATs not expecting much business from Intel new foundry strategyTuesday 30 March 2021
Taiwan-based OSAT providers are not expecting much business opportunity to be coming from Intel's new manufacturing strategy, dubbed IDM 2.0.
ASE starts optical sensors production for next-generation AirPodsFriday 26 March 2021
Backend house ASE Technology has kicked off optical sensors production for the next-generation AirPods slated for launch in the third quarter of 2021, according to industry sources...
Semiconductor suppliers prepare for Intel WhitleyFriday 26 March 2021
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
Global semiconductor materials market sets new high in 2020, says SEMIThursday 25 March 2021
The global semiconductor materials market grew 4.9% in 2020 to US$55.3 billion in revenue, surpassing the previous market high of US$52.9 billion set in 2018, according to SEMI.
Wire-bonding capacity to sustain full utilization throughout 2021Wednesday 24 March 2021
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
ASE, ShunSin gearing up for optical module shipment boomTuesday 23 March 2021
Backend houses ASE Technology and ShunSin Technology are both expected to enjoy a surge in orders for optical communication modules for 5G device applications starting the second...
Globalfoundries, Bosch team up for next-gen automotive radar technologyTuesday 16 March 2021
Globalfoundries has announced it is partnering with Bosch to develop and manufacture next-generation automotive radar technology, according to the companies.
IC and material distributors to embrace strong 2Q21Tuesday 16 March 2021
Taiwan-based distributors of ICs and materials continue to see strong influx of orders, which will buoy their sales performance through the second quarter, according to industry so...
Scientech to post double-digit revenue growth in 2021Friday 12 March 2021
Scientech, a provider of silicon wafer reclaim services and chipmaking equipment, is expected to post a double-digit revenue increase in 2021, according to market sources.
Packaging materials vendors gaining from strong DDI demandWednesday 10 March 2021
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Taiwan OSATs post revenue increases in FebruaryWednesday 10 March 2021
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Holtek to raise MCU prices by 15%Monday 8 March 2021
Holtek Semiconductor is poised to hike quotes for all its MCU lineups by about 15%, with the new prices to be effective starting April 1, according to company president Gordon Gau...
BGA packaging for memory controller ICs hits snag on ABF substrate shortagesWednesday 3 March 2021
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
IC design houses passing on rising production costs to clientsWednesday 3 March 2021
Rising foundry and backend quotes are prompting IC design houses to make efforts to pass on higher production costs to customers, according to industry sources in Taiwan.
Samsung 128GB TSV DDR4 RDIMM
Photo: Company, Wednesday 9 December 2015
IMEC EUV sensor dies
Photo: Company, Thursday 13 October 2011
Applied Producer InVia dielectric deposition system
Photo: Company, Wednesday 31 March 2010