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Tuesday 29 September 2026
In global semiconductor race, Singapore bets on critical, mature technologies
Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
Tuesday 29 September 2026
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Monday 28 September 2026
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value...

Monday 28 September 2026
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
China's AI sector is shifting from catch-up to commercialization, with value concentrating in hardware bottlenecks and large platforms rather than independent model labs. Across memory,...
Monday 28 September 2026
China's Micro Han Xin code takes aim at Data Matrix in semiconductor traceability

China is trying to carve out a foothold in semiconductor supply-chain standards with Micro Han Xin, a miniaturized version of its home-grown...

Sunday 27 September 2026
Meta Muse fuels agentic AI demand, tightening CPU supply

Meta's AI assistant Muse is drawing strong market response, and the rise of agentic AI is drawing attention to AI infrastructure shortages...

Friday 25 September 2026
Singapore brands its chip sector as it tries to move up from manufacturing
Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the...
Friday 25 September 2026
Bright LED Electronics rides PCBA rebound to double-digit growth

Bright LED Electronics said its core profit rebounded in the first half of 2026, helped by recovering printed circuit board assembly...

Friday 25 September 2026
From ISM 1.0 to Semicon 2.0—India's chip subsidy overhaul draws early interest, raises the bar for investors
India's new semiconductor incentive regime is putting more capital at risk for manufacturers, but the first wave of investment commitments suggests lower subsidies have not stopped...
Thursday 24 September 2026
Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise
Eternal Materials reported unaudited earnings before taxes (EBT) of NT$269 million (approx. US$8.47 million) in August 2026, up 28.05% from August 2025, with pre-tax earnings per share...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...