As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
India's outsourced semiconductor assembly and test (OSAT) sector has moved from inaugurations to its first export shipments. The challenge now is scale. The new plants are small, still...
Malaysia's plan to climb the semiconductor value chain is colliding with two constraints: a shortage of land in Penang, the heart of its chip industry, and mounting pressure to pick...
Towa plans to build a new factory in Kyoto Prefecture to produce assembly and packaging equipment for advanced semiconductors used in artificial intelligence applications.
Taiwan-Asia Semiconductor Corporation (TASC) expects a stronger second half of 2026 as new Apple Watch demand lifts sensor orders. The company said weak consumer electronics demand...
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's...
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
AMD CEO Lisa Su said the company plans to further increase investment in Taiwan's semiconductor supply chain as demand for CPUs, GPUs, and AI computing continues to outpace available...
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
AI data center plans and computing demand are expanding far faster than physical infrastructure can be built, creating a widening gap between planned and actually deployed compute...
