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    KLA executives outline growth strategy amid accelerating AI infrastructure demand
    3min ago
    Joby and Virgin Atlantic plan UK air taxi service by late 2026
    4min ago
    Compal launches Employee Stock Ownership Trust to boost talent retention
    15min ago
    KLA raises wafer equipment market outlook as AI investment drives record quarterly revenue
    19min ago
    Kbro lifts broadband investment as 10G service expands across Taiwan
    19min ago
    AI shift to inference boosts CPU server demand across the supply chain
    26min ago
    NXP posts strong 2Q as investors remain cautious on chip outlook
    34min ago
    Huawei targets 2027 glass substrate production to gain an edge in AI chips
    34min ago
    Column: Taiwan suppliers map entry into the US Space Force supply chain
    Jul 28, 18:30
    Samsung plans 2 nm GAA base die for HBM5 to boost AI memory speed
    Jul 28, 18:30
    AI demand squeezes memory supply, pressuring PC and TV markets
    Jul 28, 18:30
    China's GenAI race shifts to open source ecosystems
    Jul 28, 18:30
    NEWS TAGGED PACKAGING
    Wednesday 29 July 2026
    From Silicon Valley to Sicily: Samsung, SK chiefs take Korea's AI supply-chain pitch to Google Camp

    A high-level technology gathering in Sicily, reportedly to be attended by the leaders of two of South Korea's largest semiconductor...

    Monday 27 July 2026
    India's Paras Defense semiconductor unit to invest in Madhya Pradesh OSAT facility
    Indian defense engineering company Paras Defense and Space Technologies said its semiconductor subsidiary, Paras Semiconductors, will invest INR62 billion (approx. US$643.79 million)...
    Monday 27 July 2026
    Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

    Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion...

    Monday 27 July 2026
    CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
    China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...
    Sunday 26 July 2026
    Podcast: TSMC, SK Hynix, Intel face AI chip and cash flow inflection
    This excerpt of DIGITIMES analyst Luke Lin's podcast looks at two major themes: SK Hynix's openness to building in the US and the logic behind TSMC's extra US$100 billion investment...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Saturday 25 July 2026
    Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
    Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
    Friday 24 July 2026
    India's chip plants face harder test: finding repeat customers
    India's first major semiconductor customers are likely to come through existing global supply chains rather than domestic electronics brands immediately replacing imported components,...
    Friday 24 July 2026
    TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
    Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
    Friday 24 July 2026
    Rapidus expands Hokkaido chip hub with packaging and analysis

    Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

    Friday 24 July 2026
    TGV still faces technical barriers; CoPoS commercialization not likely until 2030

    Introduction

    Friday 24 July 2026
    Amkor, Nvidia widen AI packaging partnership as US capacity expands
    Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...
    Friday 24 July 2026
    Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
    Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting...
    Thursday 23 July 2026
    SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion
    SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    AI Summit Seoul