The growths of automotive and industrial applications have boosted demand for IC packaging materials such as leadframes, according to industry sources.
Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according...
China RF front-end module startup Smarter Micro has secured approval to launch an initial public offering (IPO) on the science and technology innovation board (STAR) of China's Shanghai...
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
LED chipmaker Everlight Electronics expects shipments of its miniLED backlight units (BLU) for automotive displays to rise in the second half of 2022, when its Taiwan production capacity...
Fab toolmaker All Ring Tech has landed significant orders from chipmakers, such as TSMC and ASE Technology, which have stepped up their advanced packaging capacity expansions, according...
LED packaging specialist Brightek Optoelectronic has expressed caution about its business prospects for the second quarter, when sales are expected to hit bottom for 2022.
In 1984, Intel decided to exit the DRAM business, which marked the start of technology diversion between memories and logic IC. In hindsight, Intel's decision made sense. Memories...
When the memory industry can no longer leverage Moore's Law to create new value, it has to find new technologies to establish a new business model that can create new economic valu...
Taiwan's MOSFET supplier Force-MOS Technology saw its April revenue hit a record high for the fourth consecutive month, as tight supply of MOSFET chips remains despite a slowdown...
Intel is evaluating a revision to its blueprints for the 14th Gen Core "Meteor Lake" CPUs by turning to TSMC's 5nm process family to manufacture all of the integrated chips, according...
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...