News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Tuesday 18 August 2026

Analysis: China's AI chip ambitions collide with Ajinomoto's 95% grip on ABF film

China's semiconductor self-reliance campaign is moving beyond lithography machines and advanced processors into less visible materials...

Tuesday 18 August 2026

Arm faces capacity squeeze as CPU demand tops US$2 billion

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Monday 17 August 2026

AMD eyes Taalas: will the system ditch HBM, advanced packaging, and 3D stacking?

The AI compute landscape was jolted in February 2026 by Taalas, a Canadian startup founded by former AMD and NVIDIA architect Ljubisa Bajic. Emerging with an unconventional "Model-Based"...

Monday 17 August 2026

Sigurd tops NT$2B in July revenue as AI testing demand surges

Sigurd Microelectronics, an IC testing and packaging company, reported record July 2026 revenue and said demand from AI and AI connectivity markets drove the result. The company said...

Sunday 16 August 2026

AI reshapes semiconductor testing as KYEC pushes four-way model

As AI chip value and integration complexity keep rising, King Yuan Electronics (KYEC) President Gauss Chang said semiconductor testing...

Friday 14 August 2026

SK hynix scouts US memory fab sites as customers seek local supply

SK hynix has spent more than a month studying potential locations in the US and other regions for a front-end memory fab, as American customers press the company to expand wafer production...

Friday 14 August 2026

Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM

Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing...

Friday 14 August 2026

Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination

Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company...

Friday 14 August 2026

Nvidia Feynman pushes TSMC A16 and CPO ramp

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin...

Friday 14 August 2026

Lam Research to spend more than US$3 billion expanding global R&D labs

Lam Research plans to invest more than US$3 billion over the next five years to expand its global research and development lab network, increasing experimental capacity as semiconductor...

Friday 14 August 2026

Applied Materials sets 2028 capacity target as it commits new manufacturing hires

Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...

Friday 14 August 2026

Rapidus targets 8-reticle interposers by 2030

Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...

Friday 14 August 2026

PixArt revenue rises on game-console demand as margin pressure grows

PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

Friday 14 August 2026

Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026

Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

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