ASML EVP and China head Shen Bo said artificial intelligence is redefining the global semiconductor landscape, pushing chipmakers and equipment suppliers to balance growing computing...
TSMC posted record consolidated revenue of NT$367.47 billion (US$11.87 billion) in October 2025, up 11.0% from September and 16.9% from a year earlier. The result highlights the company's...
Ableprint, a supplier of advanced semiconductor packaging bubble-removal equipment, reported record-high revenue in the third quarter of 2025, underscoring its strong position in...
AI-related products have become a key growth engine for Taiwan's economy, being a major driver of Taiwan's exports in 2024 and boosting investment in 2025. However, as companies continue...
As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang...
The global semiconductor industry is undergoing a structural shift as the AI era fully unfolds. Foxconn board member and former TSMC co-COO Shang-Yi Chiang stated that with Moore's...
Memory design IC firm AP Memory reported consolidated revenue of NT$1.495 billion (US$48.3 million) in the third quarter of 2025, up 17.3% year-over-year, driven by multiple interposers...
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations...
ASML has introduced the TWINSCAN XT:260, its first lithography system purpose-built for 3D integration and advanced packaging. The launch marks a major step beyond front-end wafer...
A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks...
CXMT has released its LPDDR5X products on its official website to coincide with rising global memory prices. Many major companies, such as Samsung, SK Hynix, and Micron, are benefitting...
Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...
Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...
