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Friday 22 May 2026
AMD deepens Taiwan supply chain ties with US$10B-plus push
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Thursday 21 May 2026
AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
Thursday 21 May 2026
AI chip boom strains ABF substrate supply chain
AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
Thursday 21 May 2026
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
Thursday 21 May 2026
OSE targets AI server SMT growth as memory demand lifts outlook
Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
Foundry, test costs push PMIC price hikes toward 12-inch wafers
Rising manufacturing costs at upstream foundries and back-end packaging and testing are pushing power management IC (PMIC) makers toward price increases, with global implications for...
Tuesday 19 May 2026
India inaugurates Rajasthan's first semiconductor plant as local chip push expands
India inaugurated Rajasthan's first semiconductor plant on May 15, marking a significant step in the country's push to expand domestic electronics and chip manufacturing under its...
Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Monday 18 May 2026
Swancor and RobiChip partner to bring advanced packaging into robots and drones
Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots,...
Monday 18 May 2026
As AI redraws chip industry, TSMC faces its first real rivals
The global map of semiconductor manufacturing is beginning to shift. For years, the market for advanced chip production was dominated almost entirely by TSMC. But the rise of artificial...
Sunday 17 May 2026
Taiwan chipmakers quietly fill gaps left by Korea's HBM push
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
Sunday 17 May 2026
Galatek targets advanced packaging market, eyes Taiwan foundries
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing...