TSMC is on track to move 3nm process technology to risk production in 2021 followed by volume production in the second half of 2022, according to the pure-play foundry.

As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...

Semiconductor equipment and materials suppliers of TSMC are poised to embrace a strong first quarter of 2021, and they are also optimistic about their sales prospects this year, according...

IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...

TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...

Everlight Electronics has expanded monthly packaging capacity for IR and UV-C LED devices by 200 million chips, reaching more than one billion chips in total in 2020, and will further...

AMD has been promised more 7nm foundry capacity at TSMC, but actual shipments for its PS5 chips will depend on the production yield rates for ABF substrates needed to make the customized...

Taiwan-based Spirox, which distributes packaging and testing equipment, expects to return to profitability in 2020 with shipments likely to ramp up quarter by quarter in 2021.

The stay-at-home economy induced by the coronavirus outbreak is expected to significantly boost demand for the PlayStation 5 (PS5) and benefit Taiwan's upstream semiconductor companies,...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level...

Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...

Taiwan-based Group Up Industrial (GP), which specializes in PCB dry process and other semiconductor equipment, has seen clear order visibility through the second quarter of 2021 and...

China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...

Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to US$59.6 billion in 2019 and register a new industry...

Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...

Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...

Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...

Demand for IC substrates for processing niche-type memory chips has turned strong since November, with shipment pull-in momentum from clients to last into the first quarter of 2021,...

ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...

Taiwan-based UVAT Technology with its sputtering and etching equipment has obtained new orders for fan-out panel-level packaging, as well as orders for the manufacture of high-end...

Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate),...

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...

Taiwan-based leadframe makers including Jih Lin Technology and SDI have reportedly cut into the supply chain for Tesla's charging piles, and are poised to embrace significant increases...

Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...