Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has...

Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit...

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...