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    Exclusive: AI-driven demand and chip price hikes raise fears of another car chip shortage
    6h 32min ago
    China auto market slumps as exports face rising geopolitical risk
    6h 33min ago
    Exclsuive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027
    6h 33min ago
    Apple price hikes raises questions for device upgrade timing
    6h 33min ago
    Commentary: ASML's race to catch u p shows AI's real bottleneck isn't chips — it's cleanrooms
    6h 33min ago
    China reveals first official commercial space member list, backing mature players and NTN chain
    6h 33min ago
    NEWS TAGGED PACKAGING
    Thursday 16 July 2026
    C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers
    TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...
    Thursday 16 July 2026
    AI chips are running hotter — and Niching is betting its future on keeping them cool
    As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Thursday 16 July 2026
    Cadence launches agentic AI platform for PCB and package design
    Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...
    Thursday 16 July 2026
    Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

    CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

    Thursday 16 July 2026
    Commentary: Chip lead times extend as cloud AI squeezes capacity
    Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched...
    Thursday 16 July 2026
    Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
    Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
    Thursday 16 July 2026
    Column: From K-Semiconductor to AI superpower —How South Korea is taking its next chip leap

    South Korean President Lee Jae-myung unveiled the country's Three Mega Projects for AI and Semiconductors in late June 2026, an ambitious...

    Wednesday 15 July 2026
    AI drives memory shortage through 2027, PSMC lifts 2Q26 margin to 28%
    AI-driven demand for memory, power management chips, and advanced packaging has continued to tighten supply and demand in the foundry market. Powerchip Semiconductor Manufacturing...
    Wednesday 15 July 2026
    Global semiconductor equipment sales set to hit record US$165.9B in 2026
    Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    Tuesday 14 July 2026
    Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
    China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx...
    Tuesday 14 July 2026
    Innolux 1H26 revenue hits 5-year high on auto, advanced packaging
    Taiwanese panel manufacturer Innolux reported unaudited consolidated revenue of NT$21.7 billion (approx. US$675.4 million) for June 2026, up 5.1% from the previous month and 17.25%...
    Tuesday 14 July 2026
    Aurotek posts record first-half revenue on semiconductor automation demand
    Aurotek Corp. said revenue in the second quarter and first half of 2026 reached record highs as demand from semiconductors and smart automation accelerated. The Taiwanese automation...
    Tuesday 14 July 2026
    C Sun sees advanced packaging and PCB demand driving 2026 revenue
    C Sun said its 2026 revenue growth will be led by advanced packaging and advanced printed circuit board equipment as AI infrastructure spending continues to support industrial investment...
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    Research Report Database
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    Jun 1, 08:00
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    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
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    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    AI Summit Seoul