中文網
Taipei
Tue, Jul 27, 2021
20:14
mostly clear
32°C
CONNECT WITH US
NEWS TAGGED PACKAGING
Tuesday 27 July 2021
Intel unveils technology roadmap to power products through 2025 and beyond
Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.
Monday 26 July 2021
IC materials distributor CWE to transform into manufacturer
Chang Wah Electomaterials (CWE), after building a solid presence in the distribution of semiconductor materials, is on track to transform into a manufacturer of diverse materials...
Friday 23 July 2021
CWTC to embrace five golden years for leadframe sales
Taiwan's leading leadframe maker Chang Wah Technology (CWTC) is set to enjoy five golden years duing which supply will continue to fall short of demand, according to company chairman...
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Thursday 22 July 2021
Backend houses see lead times prolonged notably
Backend houses have seen their delivery lead times for MCUs, audio ICs, USB interface ICs and power management chips extend all the way to as long as two months from the previous...
Tuesday 20 July 2021
China MEMS foundry startup boosts monthly output to 70,000 wafers
Semiconductor Manufacturing Electronics (ShaoXing), a China-based MEMS foundry startup formed by Semiconductor Manufacturing International (SMIC) and the local government, has managed...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Tuesday 13 July 2021
Taiwan 2nd-tier OSATs to embrace bright prospects for 2H21
Taiwan's second-tier IC backend houses are set to embrace brisker business results for the second half of the year thanks to a significant surge in customer orders, after posting...
Tuesday 13 July 2021
IC materials distributors see clear order visibility through 1Q22
Taiwan-based distributors for IC fabrication and packaging materials have all seen their order visibility extended to the first quarter of 2022, bolstered by a persistent booming...
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Thursday 8 July 2021
China OSATs step up deployments in advanced packaging field
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
Friday 2 July 2021
More foundry support to drive 3Q21 revenue gains at MOSFET makers
Taiwan-based MOSFET makers including Advanced Power Electronics, Excelliance MOS, Niko Semiconductor and Sinopower Semiconductor are all expected to enjoy sequential revenue increases...
Tuesday 29 June 2021
MIH may stretch into autonomous driving
MIH Consortium, a Foxconn-led open EV ecosystem, may extend its business tentacle into the self-driving segment as quite a few startups from the segment are now members of the alliance...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...