CONNECT WITH US
NEWS TAGGED PACKAGING
Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Saturday 11 July 2026
Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Friday 10 July 2026
Wolfspeed challenges Navitas over GaN and SiC patent boundaries

Wolfspeed's patent lawsuit against Navitas Semiconductor has opened a new front in the wide-bandgap power chip race, extending the legal...

Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
E&R Engineering advances glass substrate pilot production to 2H27
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...
Friday 10 July 2026
LG Innotek expands Vietnam footprint with new IC substrate plant
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to...
Friday 10 July 2026
Out of the shadows, India's Northeast stakes its claim in electronics

For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the...

Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
Foxconn builds integrated semiconductor ecosystem spanning IC design, SiC, and advanced packaging

Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early...