Japan IDM Rohm Semiconductor will strengthen sales of power components for industrial and automotive applications in Taiwan through local distribution agents, seeing opportunities...

Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.

US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.

TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...

NAND and NOR flash demand for TWS devices, gaming consoles and smartphones has been rising along with the approaching of traditional shopping seasons, providing significant growth...

Taiwan-based Powertech Technology (PTI) is working closely with Intel and will be engaged in the packaging services for the chip giant's upcoming QLC 3D NAND and heterogeneous chip...

Aggregate home-bound investments by Taiwanese firms operating in China have soared past NT$600 billion (US$19.33 billion) following the government approval of a NT$15.1 billion investment...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...

APCB, after experiencing lackluster revenue and profit performances in the first half of 2019, expects to perform better in the second half on increased shipments of high-end DRAM...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

The Foxconn Group's development direction in the semiconductor industry will primarily focus on vertical integration, aiming to become a solution provider and devoting its investments...

Innolux has teamed up with Taiwan's government-sponsored Industrial Technology Research Institute (ITRI) to develop fan-out panel-level packaging (FOPLP) technology, which will be...

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking...

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP)...

Memory modules specialist Orient Semiconductor Electronics (OSE) is expected to see its September revenues hit an all-time high for the third consecutive month, driven by a pull-in...

Taiwan-based Spirox, a distributor of packaging and testing equipment, has formed a partnership with National Instruments (NI) and expects their cooperation to bear fruit in 2020.

IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables...

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...

For TSMC, Moore's Law is far from being dead. While it has been keen to grow chip density on the transistor level, advancing packaging technology is one of the possible ways TSMC...

TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly con...

The output value of Japan's PCB industry dropped 6.9% from a year earlier to JPY219.79 billion (US$2.06 billion) in the first half of 2019, with that of the flexible PCB sector experiencing...

Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...