Taiwan's IC packaging materials suppliers, including Niching Technology and Chang Wah Technology (CWTC), have seen their order visibility improve significantly, according to industry...

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...

Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...

Japan-based leadframe vendors have reportedly raised quotes for part of their products by about 15% to reflect rising material costs, but their peers in Taiwan have no intentions...

GaAs foundry Win Semiconductors and other Taiwan-based III-V semiconductor players are ramping up their output for new smartphones, with order visibility for the fourth quarter strengthened,...

Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has been stepping up its deployment in the...

Merck has announced a plan to expand investments in Taiwan, seeking to turn its plant in Kaohsiung, southern Taiwan into a new R&D hub for deposition materials.

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...

Backend houses have seen smooth progress in packaging customized SoCs for Sony's PS5 and yield rates at the foundry partner are also steady, with shipment goal set by the vendor for...

CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...

TSMC and Samsung Electronics have seen their competition significantly heat up in advanced packaging technologies beyond foundry processes, which could eventually dent business opportunities...

Everlight Electronics, viewing that demand for ultraviolet (UV) and infrared (IR) LED devices remains strong, has expanded monthly packaging capacity for the related chips to 6.8-7.0...

Micron Technology has claimed its GDDR6X is the world's first to power system bandwidth up to one terabyte per second (TB/s). Working with Nvidia, Micron debuted GDDR6X in the new...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

Taiwan-based All Ring Tech has disclosed it sees robust orders for mainly advanced packaging and passive component manufacturing.

Ansys has achieved certification of its advanced semiconductor design solution for TSMC's CoWoS with silicon interposer (CoWoS-S) and InFO with RDL interconnect (InFO-R) advanced...

TSMC has introduced 3DFabric as its comprehensive family of 3D silicon stacking and advanced packaging technologies. 3DFabric complements the foundry's advanced semiconductor techn...

SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...

TSMC has been devoting a lot of efforts to developing packaging technology in line with its efforts to extend the validity of Moore's Law. The foundry house's packaging...

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...

MediaTek is expected to enter volume production of its mmWave 5G AiP (antenna in package) modules in 2021, and ASE Technology will provide backend support with its FC-AiP packaging...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.