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    Analysis: Mythos sparks access fight as AI models become strategic assets
    5min ago
    Trump-Xi meeting leaves InP and CVD export controls unresolved
    May 14, 19:21
    ODMs push consignment deals to defend AI server margins
    May 14, 19:20
    NEWS TAGGED PACKAGING
    Friday 15 May 2026
    Applied Materials scales manufacturing and innovation to meet AI demand
    Following record second-quarter 2026 financial results, Applied Materials has detailed an extensive strategy to scale its global manufacturing capacity and accelerate technology commercialization...
    Friday 15 May 2026
    Hua Hong Semiconductor strategy focuses on AI demand and specialty tech expansion
    Hua Hong Semiconductor is positioning itself to capitalize on the accelerating transformation of the global semiconductor industry, driven primarily by the "unmistakably positive impact...
    Friday 15 May 2026
    Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging
    Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
    Friday 15 May 2026
    Applied Materials posts 25-year margin high as agentic AI drives equipment boom
    Applied Materials delivered record revenue and earnings in its second fiscal quarter of fiscal 2026, signaling a robust expansion in the semiconductor equipment market driven by the...
    Thursday 14 May 2026
    TSMC expands CoWoS and SoIC capacity on AI boom
    TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities...
    Thursday 14 May 2026
    TSMC symposium spotlights AI expansion, advanced packaging demand
    TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data...
    Thursday 14 May 2026
    TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'
    Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior...
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Thursday 14 May 2026
    MediaTek courts Intel as Google pushes for alternatives to CoWoS
    MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
    Thursday 14 May 2026
    Lam Research to hire 1,000-plus engineers in Taiwan on AI chip demand
    Lam Research said it will hire more than 1,000 professional engineers in Taiwan in 2026 as customer demand mounts and the company expands technical support services for foundry, memory...
    Thursday 14 May 2026
    Korea races to narrow chip packaging gap with Taiwan and China

    AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small...

    Thursday 14 May 2026
    AP Memory profit nearly doubles as S-SiCap shipments and IoTRAM ramp drive revenue
    AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor...
    Wednesday 13 May 2026
    Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
    Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
    Wednesday 13 May 2026
    ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
    Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...
    Wednesday 13 May 2026
    SEMI says global semiconductor materials market hit record US$73.2 billion in 2025

    The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest...

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    TechForum0520
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook