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    Beijing reportedly bans ByteDance from using Nvidia GPUs in new data centers
    6min ago
    Taiwan and US companies advance AI, rejecting bubble concerns
    16min ago
    Notebook shipment update, October 2025
    49min ago
    Jtron joins Advantest and TSMC's outsourced test service chain
    3h 38min ago
    Tongtai targets 20% revenue from electronics equipment by 2026
    3h 42min ago
    Contrel eyes 30% semiconductor revenue share by 2026 with PLP, microLED, and TGV
    3h 45min ago
    China's tech giants 'BAT' invest billions to debunk AI bubble claims
    3h 46min ago
    Google's Gemini 3 launch marks founder Brin's return to active AI strategy
    3h 48min ago
    Nan Ya Plastics raises CCL and PP prices by 8% amid raw material cost surge
    3h 48min ago
    Foxconn's AI infrastructure play: from chips to data centers
    3h 53min ago
    Acer Gadget defies sector downturn with 33 months of revenue growth amid AI push
    3h 56min ago
    Inventec gains from Google TPU drive as cloud firms seek Nvidia alternatives
    3h 57min ago
    China sets its strictest power-bank standard yet, triggering industry reset
    3h 59min ago
    US Fed sees low AI bubble risk, warns of economic shifts
    4h ago
    FOCI advances 1.6T SiPh for AI servers, eyes mass production
    4h 2min ago
    India rewires its labour rules—can a friendlier factory floor lure more global manufacturing?
    4h 2min ago
    Sunic's deposition tools clear top rating, enabling BOE's 8.6-gen OLED expansion
    4h 5min ago
    US extends China product exclusions under Section 301 through November 2026
    4h 7min ago
    South Korea's late-night Nuri launch marks leap toward commercial space sector
    4h 11min ago
    TSMC's retired tools spark fierce demand in China, ASEAN
    4h 14min ago
    SK Hynix reportedly to debut industry's fastest 48Gbps GDDR7 memory at ISSCC 2026
    4h 22min ago
    NEWS TAGGED PACKAGING
    Wednesday 26 November 2025
    TEL absent from TSMC annual awards following 2nm leak incident
    Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is...
    Wednesday 26 November 2025
    Kumamoto pushes for third TSMC plant with packaging, R&D focus
    Kumamoto Governor Takashi Kimura visited TSMC's headquarters in Hsinchu on November 24, 2025, as part of a semiconductor investment promotion event in Taipei, saying the chipmaker...
    Wednesday 26 November 2025
    Global data center AI chip packaging market forecast, 2024-2030
    Technological Backbone and Future Platforms
    Tuesday 25 November 2025
    ASE commits US$133 million to new Taiwan packaging plants to meet AI chip demand
    ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
    Tuesday 25 November 2025
    ShunSin builds full-stack optical transceiver modules and pilots CSP AI data centers
    With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...
    Tuesday 25 November 2025
    Semco’s 2026 ABF capacity is fully booked as Big Tech snaps up supply
    Samsung Electro-Mechanics (Semco) has reportedly locked in supply contracts for ABF substrates with major technology companies such as Alphabet, Tesla, Apple, Amazon Web Services,...
    Monday 24 November 2025
    TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push
    Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
    Monday 24 November 2025
    Intel's EMIB becomes potential alternative to TSMC's CoWoS
    TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
    Monday 24 November 2025
    VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...

    Friday 21 November 2025
    Nexperia shockwaves hit auto industry as Europe and Japan slash output

    The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

    Friday 21 November 2025
    ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
    Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
    Friday 21 November 2025
    Eternal reportedly eyes 2026 growth with TSMC supply chain entry
    Eternal is accelerating its push into semiconductor materials, expecting significant contributions by 2026. Its precision equipment shipments surged in the fourth quarter of 2025...
    Friday 21 November 2025
    South Korean tech giants rush into glass substrates despite mounting fears of overinvestment
    South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...
    Thursday 20 November 2025
    Ligitek Electronics to invest in silicon photonics in cleanroom facilities with government support
    Taiwan-based LED manufacturer Ligitek Electronics announced plans to enter the silicon photonics (SiPh) sector, investing tens of millions of New Taiwan dollars in cleanroom equipment...
    Thursday 20 November 2025
    ASML expands into advanced CoWoS packaging with new I-line system
    Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
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