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NEWS TAGGED PACKAGING
Thursday 27 August 2026
ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Thursday 27 August 2026
AI glass substrate race shifts toward reliability and mass production
The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
Wednesday 26 August 2026
TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
Wednesday 26 August 2026
Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
Wednesday 26 August 2026
Eternal Materials reports July revenue gain as advanced packaging demand strengthens
Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
Wednesday 26 August 2026
Samsung, Intel widen AI chip battle into memory, packaging
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
Tuesday 25 August 2026
Tesla senior chip engineer joins DensityAI as in-house plans face more strain
Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
Tuesday 25 August 2026
Nexperia China rebuilds 12-inch local supply chain after 330 days
Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...
Tuesday 25 August 2026
Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
Tuesday 25 August 2026
Applied Materials executive says data centers set new AI competition standard

Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of...

Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...