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    Himax launches eDP TDDI for smart cockpit displays
    35min ago
    Nanoimprint tools see a shift from round to square substrates
    Sep 9, 18:45
    Taiwanese chipmakers step up visual sensing and motor drive for future robot market
    Sep 9, 18:45
    Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
    Sep 9, 18:45
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    Sep 9, 18:45
    Analysis: Is China's ASML gambit worth the cost as rivals pull ahead on EUV?
    Sep 9, 18:45
    NEWS TAGGED PACKAGING
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
    Thursday 10 September 2026
    Apple names a 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells
    Apple used its 2026 iPhone launch to do two things it had avoided for years: it named the process node in its flagship chip, and it raised the price of phones already on sale. Both...
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Amkor expands Arizona chip campus with phase 2 plan
    Amkor Technology's latest Arizona expansion underscores how advanced packaging capacity is becoming a strategic issue for the US semiconductor supply chain. The larger campus aims...
    Wednesday 9 September 2026
    SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
    SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
    Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Wednesday 9 September 2026
    LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
    LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
    Tuesday 8 September 2026
    Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
    MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
    After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
    Tuesday 8 September 2026
    Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
    As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
    Tuesday 8 September 2026
    Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
    AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
    Tuesday 8 September 2026
    Taiwan sets out 2027 plan to reinforce AI, chip leadership
    Taiwan plans to deepen its role in global technology supply chains as demand for AI chips, advanced packaging, and memory tightens worldwide. A new policy agenda aims to bolster semiconductor...
    1/71 pages
    BIZ FOCUS
    Sep 9, 08:00
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
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