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NEWS TAGGED PACKAGING
Wednesday 4 February 2026
TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand
Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate...
Wednesday 4 February 2026
Samsung, SK Hynix move into HBM4 as yields and policy risks loom
Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...
Tuesday 3 February 2026
AMD and Broadcom back Powertech's FOPLP; monthly revenue to hit NT$3 billion
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
Tuesday 3 February 2026
C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment
Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750...
Tuesday 3 February 2026
Nexperia plans Malaysia expansion in face of geopolitical risks and automotive supply concerns
Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor...
Tuesday 3 February 2026
Sumitomo Bakelite to acquire Kyocera unit, paving way for Chang Wah expansion
Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies'...
Monday 2 February 2026
SMIC reportedly sets up advanced packaging research institute in Shanghai
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
Monday 2 February 2026
ASE ramps advanced packaging in Taiwan as SPIL scales central hub
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
Saturday 31 January 2026
Nvidia CEO tells TSMC to "work harder" as 2026 demand surges; reveals 10-year capacity doubling plan

Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem.

Friday 30 January 2026
KLA: AI-driven process control boom lifts 2026 semiconductor equipment demand

US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth...

Friday 30 January 2026
ABF substrate crunch reshapes market: Unimicron leads and rivals close in

AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight...

Friday 30 January 2026
BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...

Friday 30 January 2026
Lam Research hits US$20.6 billion revenue high, sees 2026 WFE spending at US$135 billion
Lam Research, a leading supplier of semiconductor manufacturing equipment dubbed the "US version of ASML," capped off fiscal 2025 with stellar performance, fueled by surging AI demand...
Friday 30 January 2026
Tex Year Industries eyes strong 1H26 growth on India, Vietnam capacity, and specialty chemicals
Tex Year Industries anticipates returning to growth in 2026 following a slight revenue decline in 2025, driven by expanded production capacity in India and Vietnam and the maturation...
Friday 30 January 2026
Greatek hits full capacity on AI-driven flip chip, QFN packaging demand
Powertech Technology (PTI) and its subsidiary test and assembly firm Greatek jointly held an online investor conference to discuss future operations. Greatek president Yu-Chang Chi...