ASE Technology Holding (ASEH) expects gross margins in its packaging and testing business to remain above 30% in 2027 as growing demand for AI-related advanced packaging helps the...

KLA Corporation, the US maker of semiconductor inspection and metrology equipment, is evaluating a manufacturing foray in India and is considering one or two applications under the...

As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.

Taiwan's semiconductor rise was built on a powerful division of labor: world-class IC design feeding increasingly advanced foundries, supported by packaging, testing, and an unusually...

Intel's server expansion is drawing equipment and materials suppliers into a capacity push, but the benefits will arrive in stages. Management's October 29 earnings-call comments identified...

Eternal Materials posted earnings before taxes (EBT) of NT$388 million (approx. US$11.92 million) in September 2026, surging 158.28% year-over-year and up 44.47% from August, as revenue...

Intel is cutting manufacturing costs for its newest processors, but the gains are reaching individual products and its foundry business at different speeds. Its October 29 earnings...

ASE Technology Holding reported net profit of NT$26.996 billion (US$831 million) for the third quarter of 2026, a 28% increase from the previous quarter and a 148% gain from a year...

South Korean semiconductor packaging and testing company LB Semicon reportedly plans to invest KRW30 billion (approx. US$22.4 million) to expand its power management IC (PMIC) back-end...

KLA expects global wafer fabrication equipment (WFE) spending to exceed US$200 billion in 2027, as semiconductor manufacturers accelerate investments in advanced logic, DRAM and high-bandwidth...

Rising demand for high-end AI chips is accelerating Powertech's transformation into an advanced packaging strategic partner. Powertech said its utilization rate exceeded 90% in the...

Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...

Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...

China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity...

Silicon Valley venture capital firm Playground Global returned to Taiwan with six portfolio companies spanning memory, power management, optical communications and advanced packaging,...