Taiwan's semiconductor equipment industry made a strong impression at this year's SEMICON Southeast Asia, as the Innovative Technology and Product Launch, jointly organized by the...
ASE Holdings, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has transitioned its core IT infrastructure to AMD platforms, deploying EPYC processors...
Contrel, a Taiwanese equipment manufacturer, announced during its shareholders' meeting on June 5, 2025 that all proposals had passed. The company emphasized strong growth momentum...
These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's...
Amid ongoing scrutiny over delays in its advanced process nodes and yield challenges, Intel is set to host its annual Intel Supplier Summit on June 11. According to industry sources,...
As Nvidia tightens its near-monopoly grip on the AI GPU market, tech giants and chipmakers are accelerating efforts to develop and mass-produce ASICs, signaling a brewing showdown...
Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just...
Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The...
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
