959 news items tagged packaging
TSMC on track to move 3nm process to risk production in 2021
Friday 15 January 2021TSMC is on track to move 3nm process technology to risk production in 2021 followed by volume production in the second half of 2022, according to the pure-play foundry.
Equipment makers eyeing strong demand from Taiwan OSAT firms
Tuesday 12 January 2021As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
TSMC equipment and materials suppliers to embrace strong 2021
Friday 8 January 2021Semiconductor equipment and materials suppliers of TSMC are poised to embrace a strong first quarter of 2021, and they are also optimistic about their sales prospects this year, according...
Backend house Winstek to enjoy 10% sales growth in 2021
Tuesday 5 January 2021IC backend service provider Winstek Semiconductor is expected to post an about 10% revenue increase in 2021, driven by demand for AI chips for handset and blockchain applications,...
Development of 3nm process challenging TSMC, Samsung
Thursday 31 December 2020TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
Everlight expanding IR, UV-C LED packaging capacity
Tuesday 29 December 2020Everlight Electronics has expanded monthly packaging capacity for IR and UV-C LED devices by 200 million chips, reaching more than one billion chips in total in 2020, and will further...
ABF substrate yield rate to affect PS5 chip shipments
Monday 28 December 2020AMD has been promised more 7nm foundry capacity at TSMC, but actual shipments for its PS5 chips will depend on the production yield rates for ABF substrates needed to make the customized...
IC equipment distributor Spirox returning to profitability in 2020
Thursday 24 December 2020Taiwan-based Spirox, which distributes packaging and testing equipment, expects to return to profitability in 2020 with shipments likely to ramp up quarter by quarter in 2021.
Taiwan semiconductor firms to benefit from robust PS5 orders
Wednesday 23 December 2020The stay-at-home economy induced by the coronavirus outbreak is expected to significantly boost demand for the PlayStation 5 (PS5) and benefit Taiwan's upstream semiconductor companies,...
Innolux to enter IC packaging field with FOPLP process
Wednesday 23 December 2020Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level...
Taiwan OSAT firms see clear order visibility through mid-2021
Tuesday 22 December 2020Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...
IC equipment maker GP optimistic about 2021
Friday 18 December 2020Taiwan-based Group Up Industrial (GP), which specializes in PCB dry process and other semiconductor equipment, has seen clear order visibility through the second quarter of 2021 and...
SMIC struggling to obtain EUV litho equipment
Thursday 17 December 2020China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
Growth ahead for semiconductor equipment market
Tuesday 15 December 2020Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to US$59.6 billion in 2019 and register a new industry...
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Monday 14 December 2020Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Xintec, ShunSin see robust backend orders
Tuesday 8 December 2020Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...
Taiwan backend houses see orders boom
Monday 7 December 2020Taiwan backend houses will continue to embrace orders shifted by chipmakers from Chinese peers, as "risk control" has become a major concern among global chipmakers now that the US...
Memory chips packaging materials see clear order visibility till 1Q21
Monday 7 December 2020Demand for IC substrates for processing niche-type memory chips has turned strong since November, with shipment pull-in momentum from clients to last into the first quarter of 2021,...
ASE obtains FC packaging orders for new Qualcomm 5G SoC
Thursday 3 December 2020ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
Sputtering equipment supplier UVAT lands new orders for panel-level packaging
Monday 30 November 2020Taiwan-based UVAT Technology with its sputtering and etching equipment has obtained new orders for fan-out panel-level packaging, as well as orders for the manufacture of high-end...
C Sun expects advanced IC packaging equipment to drive growth
Friday 27 November 2020Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate),...
ASE, Greatek see QFN wire bonding run at full capacity for PMICs
Friday 27 November 2020IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...
Taiwan leadframe makers join Tesla supply chain for EV chargers
Friday 27 November 2020Taiwan-based leadframe makers including Jih Lin Technology and SDI have reportedly cut into the supply chain for Tesla's charging piles, and are poised to embrace significant increases...
GUC D2D total solution opening the new era of flagship SoC
Tuesday 17 November 2020Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...
ASE quietly enhancing CIS backend capability
Monday 16 November 2020ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...