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NEWS TAGGED PACKAGING
Thursday 14 May 2026
MediaTek courts Intel as Google pushes for alternatives to CoWoS
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely...
Thursday 14 May 2026
Lam Research to hire 1,000-plus engineers in Taiwan on AI chip demand
Lam Research said it will hire more than 1,000 professional engineers in Taiwan in 2026 as customer demand mounts and the company expands technical support services for foundry, memory...
Thursday 14 May 2026
Korea races to narrow chip packaging gap with Taiwan and China

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small...

Thursday 14 May 2026
AP Memory profit nearly doubles as S-SiCap shipments and IoTRAM ramp drive revenue
AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor...
Wednesday 13 May 2026
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
Wednesday 13 May 2026
ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...
Wednesday 13 May 2026
SEMI says global semiconductor materials market hit record US$73.2 billion in 2025

The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest...

Wednesday 13 May 2026
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
Wednesday 13 May 2026
Malaysia explores semiconductor listings to strengthen domestic capital markets
Malaysia is exploring ways to encourage more semiconductor-related companies to list on Bursa Malaysia as the government seeks to better align the country's capital markets with its...
Wednesday 13 May 2026
Taiwan's semiconductor supply chain posts broadly positive April; AI demand clearly visible across ecosystem
Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes, 73% (173 companies) posted positive year-on-year revenue growth in April 2026, and...
Wednesday 13 May 2026
Ableprint posts record first-quarter profit as CPO orders set to begin in June
Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process...
Wednesday 13 May 2026
AI server tracker: GUC surges ahead as Faraday and Alchip face slower 2026 start

Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong...

Tuesday 12 May 2026
TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push
TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...
Tuesday 12 May 2026
Intel's revival secret: Suppliers with TSMC's stamp of approval
With TSMC capacity under mounting supply-demand pressure, Intel — once written off by many as a company fighting for survival — is staging a credible comeback.
Tuesday 12 May 2026
Apple, Qualcomm and MediaTek take different paths as TSMC capacity stays tight
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider...