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NEWS TAGGED PACKAGING
Monday 19 May 2025
The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
Monday 19 May 2025
ART confirms normal operations after hacker attack, no confidential data compromised
Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
Monday 19 May 2025
Chipmakers seek edge beyond Moore's Law as computing power race escalates
The semiconductor industry's decades-long strategy of shrinking transistors faces diminishing returns, forcing companies to explore alternative technologies for competitive advantage...
Monday 19 May 2025
Made in America, finished in Taiwan: TSMC’s expansion highlights a lingering gap
In the surging global demand for AI applications, TSMC has announced a sweeping expansion of its advanced process and packaging capacity. In its latest disclosure, TSMC revealed plans...
Friday 16 May 2025
ASE maintains semiconductor packaging dominance despite Chinese surge
Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face...
Thursday 15 May 2025
ASE to acquire AMPI in strategic bid to restructure 6-inch foundry ops, tap AI chip demand
ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic...
Thursday 15 May 2025
TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant
At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company's accelerated fab expansion...
Thursday 15 May 2025
TM Robot expands North American presence with smart manufacturing push
As the global leader in AI collaborative robotics, Taiwan's Techman Robot (TM Robot) is celebrating its 10th anniversary by unveiling a suite of next-generation smart automation solutions...
Wednesday 14 May 2025
AI and advanced chipmaking drive robust growth in semiconductor materials
With the escalating global trade tensions and fresh US tariffs rattling the semiconductor sector, the underlying momentum in high-performance computing (HPC) and AI applications remains...
Tuesday 13 May 2025
CT Semiconductor expands Vietnam's first fully locally owned IC backend facility
CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips annually by 2027. As the country's first fully locally...
Friday 9 May 2025
Chiplets technology gains ground as global semiconductor giants invest in modular chip future
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional...
Friday 9 May 2025
Innostar targets AI chip testing surge with advanced packaging push
Taiwanese equipment maker Innostar Service is positioning itself to capture growth in artificial intelligence (AI) and high-performance computing chip testing by expanding into semiconductor...
Thursday 8 May 2025
Ex-SK Hynix employee charged in South Korea for leaking chip tech to HiSilicon

A former employee surnamed Kim at the Chinese division of South Korean chipmaker SK Hynix has been indicted on charges of leaking confidential...