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Monday 15 June 2026
Google's TPU diversification challenges MediaTek and other ASIC partners
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...
Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Monday 15 June 2026
The great chip bazaar: India's fragmented fight to build a tech empire
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology...
Sunday 14 June 2026
Chunghwa Leading Photonics targets SWIR testing demand in advanced packaging

Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has...

Saturday 13 June 2026
Linkotech: FOPLP rollout is gaining early traction

Linkotech said its fan-out panel-level packaging rollout is showing early momentum, with certification from a North American low-Earth-orbit...

Friday 12 June 2026
Samsung's packaging gap clouds chip comeback as TSMC, Intel push ahead

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...

Friday 12 June 2026
Sigurd revenue hits record as AI and chip demand lift operations

Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...

Friday 12 June 2026
PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing...
Friday 12 June 2026
Taiwan OSAT firms gain from AI chip demand and foundry spillover
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Thursday 11 June 2026
Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production...
Wednesday 10 June 2026
TSMC's May revenue grows 30% as AI demand and tight capacity support outlook
TSMC reported consolidated net revenue of about NT$416.98 billion (approx. US$13.2 billion) in May 2026, up 1.5% from April and 30.1% from a year earlier. The figure set a new monthly...
Wednesday 10 June 2026
Samsung weighs Gwangju packaging plant as power strains Seoul-area chip expansion

Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that...

Wednesday 10 June 2026
Chang Wah says semiconductor inventory correction has ended, sees 2026 sales growth
Chang Wah Technology has declared that the global semiconductor inventory correction has ended, with demand recovering in industrial control, networking, and AI data center power management...