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Wednesday 5 August 2026
Everlight files third US patent suit over LED flip chip technology
Everlight Electronics filed a new US patent infringement lawsuit against Nichia on July 30 in the Southern Division of the US District Court for the Eastern District of Michigan. The...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing...

Tuesday 4 August 2026
Taiwan classifies semiconductors, AI as high-energy industries, launches decarbonization project

Taiwan's government has recently begun classifying the semiconductor and AI industries as high-energy consumption industries in recent...

Monday 3 August 2026
Intel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%
Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of...
Monday 3 August 2026
India advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility...

Monday 3 August 2026
Intel EMIB yields hit target, MediaTek eyes 2028 ASIC ramp

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production...

Monday 3 August 2026
India expands chip talent pipeline amid surging global chip demand
India has stepped up efforts to build a larger semiconductor workforce through training, curriculum reform, and industry partnerships. The plan matters beyond India because chip supply...
Monday 3 August 2026
India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
Saturday 1 August 2026
Thintronics wins proposed US CHIPS incentives for advanced substrate technology
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
Saturday 1 August 2026
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...