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Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
Foxconn builds integrated semiconductor ecosystem spanning IC design, SiC, and advanced packaging

Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early...

Thursday 9 July 2026
Interview: UK courts Taiwan suppliers for AI hardware buildout

The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers as AI demand shifts from models to...

Wednesday 8 July 2026
France-Taiwan tech ties move from talks to factory floor

France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

Wednesday 8 July 2026
TSMC earnings call could signal how long the AI boom can keep lifting its outlook

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...
Wednesday 8 July 2026
Onsemi sells two fabs to cut costs and sharpen power chip focus

Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network...

Wednesday 8 July 2026
WinWay's record June revenue driven by full AI test interface orders
WinWay Technologies said that its June revenue rose to a record NT$1.5 billion (US$454.8 million), supported by demand from AI, high performance computing, ASICs, GPUs, CPUs, and other...
Tuesday 7 July 2026
AI server demand tightens power device supply as lead times stretch to 270 days

AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer...

Tuesday 7 July 2026
Huawei's Mate 90 to debut Kirin 2026 processor built on Tau Law

Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according...

Tuesday 7 July 2026
TSMC's AI bottleneck spills demand across the semiconductor supply chain

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Tuesday 7 July 2026
6G base stations to become AI computing nodes, boosting advanced packaging demand
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
Tuesday 7 July 2026
Interview: Corning's GlassBridge points to longer-term packaging shifts, not an immediate FAU replacement

Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...