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    China's AI computing plan targets sixfold growth and 100,000-card clusters
    6min ago
    China's OLED capacity expansion threatens South Korea's auto and IT panel lead
    Sep 8, 17:29
    Exclusive: European automakers reportedly expand China software teams despite layoffs
    Sep 8, 17:29
    Analysis: Huawei and Xiaomi push China’s chipmaking race into a new phase
    Sep 8, 17:29
    NEWS TAGGED PACKAGING
    Wednesday 9 September 2026
    Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

    WG Tech (Jiangxi) Group is accelerating its shift from display glass into semiconductor applications, targeting through-glass via (TGV)...

    Wednesday 9 September 2026
    Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage
    Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Wednesday 9 September 2026
    LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers
    LCD panel supply could tighten around 2028 as Taiwan manufacturers exit the segment faster than expected, while China uses profits from LCD to ramp OLED investment. The shift is being...
    Tuesday 8 September 2026
    Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027
    MA-tek, a semiconductor testing and analysis company, reported August revenue of NT$565 million, up 17.78% from a year earlier and marking a record high for the sixth straight month...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
    After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
    Tuesday 8 September 2026
    Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
    As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...
    Tuesday 8 September 2026
    Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
    AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
    Tuesday 8 September 2026
    Taiwan sets out 2027 plan to reinforce AI, chip leadership
    Taiwan plans to deepen its role in global technology supply chains as demand for AI chips, advanced packaging, and memory tightens worldwide. A new policy agenda aims to bolster semiconductor...
    Monday 7 September 2026
    Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
    The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...
    Monday 7 September 2026
    India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it
    India's most senior semiconductor policymakers came to Taipei with an argument aimed squarely at the Taiwanese supply chain: the country's chip program is meant to add redundancy to...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Monday 7 September 2026
    Wah Lee sees faster growth in 2027 as supply stays tight
    Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

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    BIZ FOCUS
    Sep 9, 08:00
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
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