Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
Due to low production efficiency and intense price competition, major panel makers like AUO, Innolux, and LG Display are selling older LCD factories. Semiconductor companies such as...
Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026,...
The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...
The microcontroller unit (MCU) sector has emerged from inventory destocking in 2025, with the easing of US-China tariff tensions signaling a market recovery. Industry insiders expect...
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Tongtai Machine & Tool has launched a transformation to shift from traditional equipment manufacturing to providing integrated process and system solutions, targeting AI server,...
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
AUO is overhauling its business model to make Vertical Solution and Mobility Solution the dominant revenue sources, targeting a combined 70% share of sales by 2030 while expanding...
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
