中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Yesiang’s regenerated filters begin shipments as 2nm demand ramps
    6h 35min ago
    LG and Nvidia deepen cooperation across robotics, AI factories and autonomous driving
    6h 35min ago
    Analysis: How Nvidia turned Computex into its own annual coronation
    6h 35min ago
    Taiwan suppliers race to build physical AI robot computing platforms
    6h 36min ago
    Huawei developer conference spotlights AI agents as hype cools and real-world testing begins
    6h 36min ago
    Tencent pursues self-developed AI chips and external partnerships in parallel
    6h 36min ago
    NEWS TAGGED PACKAGING
    Monday 8 June 2026
    Apple M5 Pro teardown points to chiplet strategy shift
    Apple's M5 Pro signals a broader shift in laptop processors, with implications for global device makers, developers, and AI users. A teardown suggests Apple is combining chiplet-style...
    Monday 8 June 2026
    Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
    Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
    Monday 8 June 2026
    LG Innotek expands Vietnam operations for AI packaging boom
    LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
    Monday 8 June 2026
    India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

    Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

    Monday 8 June 2026
    Largan posts 43% year-on-year May revenue rise
    argan Technology reported consolidated May revenue of NT$4.593 billion on June 5, a 14% decline from April and a 43% increase from May 2025. First five-month revenue reached NT$25.495...
    Sunday 7 June 2026
    JCET opens 3D packaging plant to target AI power modules, CPO demand
    JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
    Sunday 7 June 2026
    BOE says glass-based packaging substrate pilot line has yet to reach mass-production yield

    BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker...

    Friday 5 June 2026
    AI demand strains PCB supply chains, lead times stretch past 20 weeks
    Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
    Friday 5 June 2026
    US targets China's PCB grip as AI and defense supply risks mount
    As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
    Friday 5 June 2026
    Marvell says SerDes and packaging are key hurdles in switch chip development
    Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
    Friday 5 June 2026
    Commentary: Memory boom driven by DRAM now, but HBM will decide future
    AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...
    Thursday 4 June 2026
    TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus
    TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year...
    Thursday 4 June 2026
    LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

    LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

    Thursday 4 June 2026
    HBM4 supply in focus as SK's Chey meets TSMC's Wei
    SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
    Thursday 4 June 2026
    Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

    Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

    1/55 pages
    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook