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    Analysis: Chip inflation is a major supply chain risk in 2026
    1h 14min ago
    China's AI path: Looking back at DeepSeek's one year anniversary
    1h 14min ago
    NEWS TAGGED PACKAGING
    Wednesday 28 January 2026
    Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
    In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
    Wednesday 28 January 2026
    Powertech posts 4Q25 profit high, eyes growth momentum into 2026
    Memory testing and packaging firm Powertech Technology (PTI) reported that its revenue and earnings met expectations in the fourth quarter of 2025. Quarterly revenue reached NT$21.41...
    Wednesday 28 January 2026
    Exclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategy
    TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
    Wednesday 28 January 2026
    KGD joins memory price rally with China vendor raising prices by up to 80%
    A fresh wave of memory price hikes is sweeping across the semiconductor supply chain, spreading from AI memory products into manufacturing, packaging, and testing, and upstream materials...
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

    Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

    Tuesday 27 January 2026
    TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
    With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
    Tuesday 27 January 2026
    Column: From black-and-white TVs to AI chips, Taiwan's export leadership continues
    Taiwan's information and communications technology (ICT) sector—dominated by the semiconductor industry and Electronics Manufacturing Services (EMS)—accounted for 65.2%...
    Tuesday 27 January 2026
    China reportedly enters semiconductor glass substrate market
    China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
    Tuesday 27 January 2026
    Micron breaks ground on US$24 billion advanced NAND fab in Singapore
    Micron has started construction on an advanced wafer fabrication facility at its existing NAND manufacturing complex in Singapore, marking a planned investment of approximately US$24...
    Monday 26 January 2026
    India roundup: India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
    With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's semiconductor push is gaining firmer footing. However, despite its...
    Saturday 24 January 2026
    China advances T1000 carbon fiber supply chain for semiconductor materials
    As the global semiconductor industry pushes forward with advanced processes, heterogeneous integration, and cutting-edge packaging, competition now extends beyond process nodes to...
    Saturday 24 January 2026
    Energy limits AI growth; geopolitical stakes in rare earths, new packaging innovations reshape global supply chains
    The Global Electronics Association's latest "2026 Electronics Industry Trend Forecast" highlights critical challenges and shifts that will impact the sector over the next few years...
    Friday 23 January 2026
    ASML leads chip equipment charge into advanced packaging
    Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
    Friday 23 January 2026
    Analysis: How Howard Lutnick is redrawing the memory-chip map

    US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

    Friday 23 January 2026
    TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
    TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
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    Research Report Database
    BIZ FOCUS
    Jan 28, 08:00
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers
    Wednesday 28 January 2026
    Seoul Business Agency Hosts Global Innovation Forum Showcasing Startup Ecosystem
    Thursday 22 January 2026
    MOSS Introduces an AI-Assisted DAW Built to Support Human Creativity
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook