News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 5 January 2026

Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026

Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...

Monday 5 January 2026

Samsung reportedly pitches bundled solutions to Google and AMD

As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...

Monday 5 January 2026

TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...

Saturday 3 January 2026

Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing

Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...

Saturday 3 January 2026

Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...

Saturday 3 January 2026

Chang Wah accelerates Asia expansion as chip packaging booms

Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...

Friday 2 January 2026

Vietnam urges Intel to boost semiconductor backend capacity

The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global...

Thursday 1 January 2026

Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks

Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical...

Thursday 1 January 2026

Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways

The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...

Thursday 1 January 2026

Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

Wednesday 31 December 2025

Taiwan OSATs boost spending as CoWoS supply tightens

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

Tuesday 30 December 2025

AI infrastructure demand boosts Taiwan exports, while visibility beyond 2025 stays limited

As 2025 concludes, Taiwan's information and communication technology (ICT) and electronics sectors have experienced significant export growth driven by AI-related demand, particularly...

Monday 29 December 2025

SK Hynix weighs US expansion for advanced chip packaging

According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...

Monday 29 December 2025

Move over, Malaysia? India's emerging OSAT sector claims price parity in legacy packaging

India's first wave of OSAT facilities is moving from capacity announcements to competitive positioning, with some domestic players now benchmarking themselves against established...

Monday 29 December 2025

Foundry 2.0 market hits US$85 billion in 3Q25: TSMC, AI packaging lead growth

The global semiconductor industry's transition into the "Foundry 2.0" era is now measurable in revenue, utilization, and competitive positioning. The expanded foundry ecosystem generated...

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Dec 24, 08:00

InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups

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