CONNECT WITH US
NEWS TAGGED PACKAGING
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...
Wednesday 14 October 2026
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Tuesday 13 October 2026
Malaysian states team up to back homegrown chip firms
The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Tuesday 13 October 2026
India's Kaynes Semicon seeks foreign partners as its Gujarat chip plant ramps up
Kaynes Semicon, the chip packaging arm of Indian electronics maker Kaynes Technology, is calling for foreign semiconductor companies to form joint ventures in India, as its executives...
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Monday 12 October 2026
How 'Filter Moore's Law' is doubling revenue for a Taiwan chip filter maker
Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially...
Monday 12 October 2026
Sumitomo Bakelite expands packaging material production across Singapore, China
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...
Monday 12 October 2026
Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
Monday 12 October 2026
Sigurd, Winstek align optical testing push as AI demand shifts toward connectivity
Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
Monday 12 October 2026
Former iPhone display plant in Japan reportedly to enter AI chip supply chain
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
Monday 12 October 2026
Weekly news roundup: Musk's Terafab faces reality check; Samsung HBM4E clears quality validation
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
Monday 12 October 2026
India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...