News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 27 August 2026

HBM hybrid bonding delayed by 300°C heat and CMP dishing

As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...

Thursday 27 August 2026

SK Hynix questions PIM as thermal, packaging limits constrain HBM

South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...

Thursday 27 August 2026

AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp

Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...

Thursday 27 August 2026

Google, MediaTek embrace advanced packaging diversification

Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...

Thursday 27 August 2026

India's CG Power targets 70% utilization at larger semiconductor packaging plant

CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...

Thursday 27 August 2026

HTSI targets AI chip demand with SiPh, CPO, packaging push

Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...

Thursday 27 August 2026

Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026

Samsung Galaxy A1 DDI packaging shifts to Chipbond

Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...

Thursday 27 August 2026

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

Thursday 27 August 2026

Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging

Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...

Thursday 27 August 2026

AI glass substrate race shifts toward reliability and mass production

The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...

Wednesday 26 August 2026

TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation

Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...

Wednesday 26 August 2026

Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role

Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...

Wednesday 26 August 2026

Eternal Materials reports July revenue gain as advanced packaging demand strengthens

Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...

Wednesday 26 August 2026

Samsung, Intel widen AI chip battle into memory, packaging

Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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