CONNECT WITH US
NEWS TAGGED PACKAGING
Tuesday 16 September 2025
TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Monday 15 September 2025
China targets CoWoP leapfrog as Taiwan holds tech edge
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
Sunday 14 September 2025
From slides to silicon: India's Suchi Semicon shows progress in chip packaging
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
Saturday 13 September 2025
Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Friday 12 September 2025
Malaysia steps up semiconductor drive as G2 rivalry spurs new investments
Malaysia is emerging as a key beneficiary of the intensifying US-China technology rivalry, attracting billions in foreign investment as it seeks to cement its role as a critical player...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanmi Semiconductor unveils large 2.5D packaging equipment
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
Nitto Denko and IBM collaborate on advanced semiconductor packaging materials
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Thursday 11 September 2025
PTI aims to be first FOPLP supplier in AI server supply chain
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
Thursday 11 September 2025
Taiwan emerges as AI hotspot: Merck highlighting trio of semiconductor development trends
Merck has pointed out that the semiconductor industry's growth curve has reached a combined output value of EUR650 billion (US$760.4 billion) and is expected to surpass EUR1 trillion...
Thursday 11 September 2025
ACM Research courts TSMC as US–China dual-listed chip equipment maker bets on Taiwan expansion
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...
Thursday 11 September 2025
SEMICON Taiwan 2025: Machinery makers Tongtai and Contrel expand into semiconductor sector
The global semiconductor industry is experiencing steady growth, driven by advances in wafer processing and packaging technologies. In line with this trend, Tongtai Machine &...
Thursday 11 September 2025
ACE Solution and Taiwan Nano & Micro-Photonics Showcase Semiconductor and Silicon Photonics Solutions at SEMICON 2025
ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world's most influential semiconductor exhibitions. ACE Solution...
Thursday 11 September 2025
Taiwan showcases breakthroughs in CoWoS and SiC equipment to boost semiconductor self-reliance
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...