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Tuesday 11 August 2026
TSMC nears AI packaging demand after years of doubling capacity:'CoWoS guy' Jun He

TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than...

Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
Tuesday 11 August 2026
Gudeng posts record seven-month revenue on EUV Pod orders and global demand
Gudeng Precision Industrial reported record revenue for the first seven months of 2026, supported by stronger EUV pod orders and rising purchases from overseas customers for advanced...
Tuesday 11 August 2026
Yesiang posts record revenue for third straight month on advanced process demand
Yesiang Enterprise, a major maker of advanced-process microcontamination control filters, reported strong first-half 2026 results and said July consolidated revenue reached NT$305...
Tuesday 11 August 2026
Trusval posts record profit on semiconductor fab and memory project demand
Trusval Technology posted record profit in the second quarter and first half of 2026 as demand from global semiconductor fabs, memory makers, and AI data centers drove orders for capacity...
Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor...

Tuesday 11 August 2026
MA-tek reports record July revenue on glass-substrate testing demand
Materials Analysis Technology, or MA-tek, said its first-half 2026 results reached record levels and July revenue set a monthly record for a fifth straight month, while demand grew...
Tuesday 11 August 2026
China's AMIES lands repeat orders for 350nm lithography system

Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography...

Monday 10 August 2026
SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...

Monday 10 August 2026
Samsung HBM4 yield nears 80% as production race with SK Hynix heats up

Samsung Electronics has reportedly pushed the production yield of its sixth-generation high-bandwidth memory (HBM4) close to 80%, marking...

Monday 10 August 2026
Semiconductor material prices surge across silicon wafers, specialty gases and advanced packaging
Demand for advanced processes and packaging continues to rise, while the Middle East conflict is lifting energy and raw-material costs and tighter Chinese controls on strategic-mineral...
Monday 10 August 2026
Interview: Nvidia sees Taiwan as more than an assembler — an engineering partner

Taiwan's role in the global AI supply chain is shifting from manufacturing toward engineering, Nvidia networking senior vice president...

Monday 10 August 2026
Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
Monday 10 August 2026
India roundup: Chip push broadens as localization and capacity remain works in progress
India is accelerating its bid to build a broader semiconductor and electronics ecosystem, combining new packaging capacity, longer-term tax incentives and deeper localization with...
Monday 10 August 2026
Aurotek profit jumps on embodied AI and semiconductor automation demand
Aurotek Corporation reported stronger second-quarter and first-half 2026 results on August 6 as demand rose for embodied AI solutions, semiconductor foundry and advanced packaging...