To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making...
Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips,...
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
As SEMICON Taiwan 2025 nears, ASE Technology's COO Tien Wu highlighted the semiconductor industry's decade-long outlook, stressing challenges in reshaping the value chain in the post-AI...
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...
Shenzhen International Semiconductor & IC Exhibition, known as SEMI-e 2025, will take place September 10-12 at the Shenzhen World Exhibition & Convention Center. The event...
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
