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Friday 26 June 2026
AuthenX targets AI data center interconnects with plug-and-play FAU for CPO
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration...
Friday 26 June 2026
Corning weighs South Korea site as chip packaging race turns to glass

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass...

Friday 26 June 2026
AI in Sync: Graser TECHTALKS 2026 Highlights Electronic Design Paradigm

The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and physical applications, with rapidly evolving...

Friday 26 June 2026
China power semiconductor makers raise prices as AI and vehicle demand grows
China's power semiconductor makers are lifting prices again as demand from artificial intelligence (AI) servers and new energy vehicles strengthens. The moves may signal a broader...
Thursday 25 June 2026
Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

Thursday 25 June 2026
Sigurd expands AI testing capacity as demand keeps facilities full
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains...
Thursday 25 June 2026
ASE sees AI demand stretching packaging capacity into 2030
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Thursday 25 June 2026
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
Thursday 25 June 2026
China moves to build helium reserve as Nippon Sanso sets over 30% price hike

Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...

Thursday 25 June 2026
IC design firms race to secure packaging capacity
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...