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NEWS TAGGED PACKAGING
Tuesday 30 May 2023
Advanced packaging demand for AI and HPC processors to rise
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Friday 26 May 2023
LED firm Ledtech returns to profitability
LED packaging service provider Ledtech Electronics swung back to profitability in April, buoyed by a pick-up in demand for low-temperature lighting devices.
Wednesday 24 May 2023
Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia...
Wednesday 24 May 2023
SEMI: global semiconductor packaging materials market to reach US$29.8b by 2027
Semiconductor Equipment and Materials International (SEMI), TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May...
Tuesday 23 May 2023
Bright LED, Harvatek still see customers adjust inventory
LED packaging houses Bright LED Electronics and Harvatek continue to see customers adjusting their inventories in the second quarter, putting pressure on their operations. The firms...
Tuesday 23 May 2023
Micron could lose US$3 billion in revenue injection from China
Micron Technology could lose an estimated US$3 billion in revenue from China as a result of the country's ban on Chinese enterprises working on critical infrastructure projects procuring...
Monday 22 May 2023
AUO Digitech transforms semiconductor assembly and packaging plants with smart upgrades
The semiconductor assembly and packaging industry has long struggled with labor-intensive processes. AUO Digitech (a subsidiary of AUO), specializing in smart industrial services,...
Monday 22 May 2023
Leadframe supplier CWTC opens new factory in southern Taiwan
Chang Wah Technology (CWTC) has inaugurated a new facility in Kaohsiung, southern Taiwan, where it will manufacture leadframes for advanced quad flat no-lead (aQFN) packaging, third-generation...
Tuesday 16 May 2023
China LED packagers raise quotes by 10%
China-based LED packaging houses, including MLS and DSBJ, have raised their contract quotes by up to 10% starting May, according to industry sources.
Tuesday 16 May 2023
Backend firms see slow adoption of FC packaging among handset APs
The adoption of advanced fan-out packaging among handset application processors has been sluggish, according to sources at backend houses.
Friday 12 May 2023
LED firm Edison Opto steps up deployment in automotive segment
LED module and packaging service provider Edison Opto has stepped up its deployment in the automotive segment, with plans to add a new LED automotive lighting product line in June,...
Thursday 11 May 2023
Nvidia places additional orders requiring TSMC CoWoS
Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.
Wednesday 10 May 2023
Samsung reportedly to move FOWLP to volume production in 4Q23
Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...
Wednesday 10 May 2023
Utilization rates for COF packaging rise
Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources.
Monday 8 May 2023
Nvidia's new mid-end gaming series to be mild boost to peripheral IC packaging & testing
The global consumer electronics market has faced sluggish end demand since the beginning of 2023. Sources anticipates suppliers to buoy the market with new product series this year,...