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    Foxconn deepened manufacturing presence in China with new JV
    Jan 19, 19:20
    AI server power architecture upgrade drives structural growth in power connector industry
    Jan 19, 19:20
    AI power architecture shift opens up new ASIC and HVDC opportunities
    Jan 19, 19:20
    Chinese smartphone makers cut 2026 shipment targets amid memory price surge
    Jan 19, 19:20
    China rare earth prices rose for sixth consecutive time in 1Q26, supply chain brace for impact
    Jan 19, 19:20
    Stable demand for high-end PMICs boosts growth opportunities for Taiwanese firms
    Jan 19, 19:19
    NEWS TAGGED PACKAGING
    Monday 19 January 2026
    Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
    Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
    Monday 19 January 2026
    Taiwan polarizer firms pivot to medical, semiconductor, and niche markets amid China oversupply
    Large-scale capacity expansions in China have led to severe oversupply and price erosion issues in the global polarizer industry, causing Taiwanese firms to struggle as losses mount...
    Sunday 18 January 2026
    SK Hynix accelerates advanced packaging from Korea to Indiana
    SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
    Saturday 17 January 2026
    NIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge
    As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
    Saturday 17 January 2026
    Amkor to close longstanding Japan chip plant as EV demand slows

    Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by...

    Saturday 17 January 2026
    Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands
    During TSMC's first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from...
    Friday 16 January 2026
    Biwin Storage profit jumps 427% as memory cycle turns
    China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices...
    Friday 16 January 2026
    Vietnam to set up national semiconductor chip prototyping center
    Vietnam's Ministry of Science and Technology has decided to establish a national center for semiconductor chip prototyping, a move aimed at developing high-quality human resources...
    Friday 16 January 2026
    Top 10 chart: Regenerated wafers and AI-linked packaging lift Taiwan chip materials sector
    Taiwan's semiconductor materials sector delivered a mixed performance in December 2025, highlighting a widening gap between advanced and mature segments of the supply chain. Upstream...
    Thursday 15 January 2026
    TSMC retains pricing power using Apple and AI dual structure
    Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
    Thursday 15 January 2026
    Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
    Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing...
    Thursday 15 January 2026
    Exclusive: T-Glass shortage ripples through memory and advanced packaging markets

    The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass...

    Thursday 15 January 2026
    Rising memory prices lift Taiwan supply chain earnings

    The global memory industry entered a clear upturn in the second half of 2025 as both spot and contract prices rose sharply, lifting earnings...

    Thursday 15 January 2026
    China's WUS to build US$300m optical-electrical PCB hub for AI systems
    WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
    Wednesday 14 January 2026
    Advanced packaging crunch lifts ASE, KYEC to new highs
    TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues...
    1/40 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook