Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...

While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes, semiconductor firms,...

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, is expected to see revenues and profits hit the year's highs in September and October, bolstered by robust...

Taiwan's top backend house Advanced Semiconductor Engineering (ASE) has decided to purchase a new factory building in Kaohsiung, southern Taiwan to provide more space for warehousing...

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...

Taiwan-based Spirox, which distributes IC packaging and testing equipment, has newly signed a distribution agency contract with Osai Automation Systems, allowing it to sell the Italy-based...

Despite suffering hiccups in obtaining advanced 5G base stations chips from US suppliers, Huawei is still aggressively taking a three-pronged approach in carrying out its 5G deployments,...

Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...

ASE Technology Holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is gearing up to tap business opportunities in...

Taiwan-based Spirox, which distributes IC packaging and testing equipment, stands to benefit from the US-China trade war as it has seen a fast pickup in orders from China semiconductor...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Siliconware Precision Industries (SPIL) has achieved satisfactory results from applying AI to detect defects on packaging lines following nine months of efforts, according to KH Wan,...

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties...

Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...

Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...

Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...

Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...

COF packaging demand for automotive OLED displays has emerged, which may further tighten market supply as capacity expansion will remain quite limited in the short term, according...

Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with National Instruments (NI) under which Spirox will sell NI's STS (semiconductor...

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...