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NEWS TAGGED PACKAGING
Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
E&R Engineering advances glass substrate pilot production to 2H27
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...
Friday 10 July 2026
LG Innotek expands Vietnam footprint with new IC substrate plant
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to...
Friday 10 July 2026
Out of the shadows, India's Northeast stakes its claim in electronics

For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the...

Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
Foxconn builds integrated semiconductor ecosystem spanning IC design, SiC, and advanced packaging

Foxconn Chairman Young Liu recently revealed that one of the group's IC design subsidiaries is preparing for a Taiwan listing as early...

Thursday 9 July 2026
Interview: UK courts Taiwan suppliers as AI hardware race shifts to chips and power
The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers, seeking to turn its AI infrastructure push into a market and investment opportunity...
Wednesday 8 July 2026
France-Taiwan tech ties move from talks to factory floor

France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

Wednesday 8 July 2026
TSMC earnings call could signal how long the AI boom can keep lifting its outlook

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...
Wednesday 8 July 2026
Onsemi sells two fabs to cut costs and sharpen power chip focus

Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network...