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NEWS TAGGED PACKAGING
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Thursday 14 March 2024
Taiwanese IC distributors to capitalize on handset and PC inventory shrinkage, AI chip boom in 2024
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...
Thursday 14 March 2024
APT upbeat about orders for advanced packaging
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...
Thursday 7 March 2024
VCSEL component maker TrueLight attracts investment from Taiwan Mask
Photomask specialist Taiwan Mask Corporation has announced plans to participate in optical components supplier TrueLight's private placement, with a total investment of around NT$410...
Thursday 7 March 2024
CG-Renesas ATMP project in India to commence construction in mid-2024
In a recently announced chipmaking project in India in partnership with India and Thailand-based companies, Renesas expressed cautiousness about the investments by starting with ATMP...
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Tuesday 5 March 2024
Taiwan CIS earnings calls show light at the end of the tunnel
Earning calls from Taiwan's CIS supply chain promise an uptick in demand in 2024.
Tuesday 5 March 2024
China sees withdrawals from foreign firms in chip packaging and testing business
Amid the global geopolitical tension and an indigenization endeavor, China has seen an outflow of investments in the chip packaging and test industry when a series of Taiwan-based...
Tuesday 5 March 2024
GenAI drives HBM memory demand
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Tuesday 27 February 2024
Back-end houses divided on whether to build Japanese facilities like TSMC
According to industry sources in Taiwan, IC back-end houses are divided as to whether they will establish facilities in Japan similar to Taiwan Semiconductor Manufacturing Company...
Monday 26 February 2024
ASE expands overseas production with acquisition of Infineon's backend plants in Philippines and South Korea
Taiwanese OSAT leader Advanced Semiconductor Engineering (ASE) has recently announced its plan to bolster overseas production by acquiring Infineon's backend assembly and testing...
Friday 23 February 2024
Foxconn adopts the 'system foundry' business model
Hon Hai Technology (Foxconn) is transitioning to a "solutions" provider rather than an electronics and semiconductor manufacturer. The firm said it is moving toward a "system foundry"...
Thursday 22 February 2024
Intel to adopt high-NA EUV in 14A process manufacturing
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more...
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Friday 16 February 2024
Applied Materials sees faster recovery in semiconductors, to benefit from HBM and GAA equipment
Applied Materials reported an 18% growth in its profit and expected the semiconductor industry to recover faster than the macroeconomy. The company said it will likely benefit from...
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