News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 1 January 2026

Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks

Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical...

Thursday 1 January 2026

Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways

The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...

Thursday 1 January 2026

Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

Wednesday 31 December 2025

Taiwan OSATs boost spending as CoWoS supply tightens

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

Tuesday 30 December 2025

AI infrastructure demand boosts Taiwan exports, while visibility beyond 2025 stays limited

As 2025 concludes, Taiwan's information and communication technology (ICT) and electronics sectors have experienced significant export growth driven by AI-related demand, particularly...

Monday 29 December 2025

SK Hynix weighs US expansion for advanced chip packaging

According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...

Monday 29 December 2025

Move over, Malaysia? India's emerging OSAT sector claims price parity in legacy packaging

India's first wave of OSAT facilities is moving from capacity announcements to competitive positioning, with some domestic players now benchmarking themselves against established...

Monday 29 December 2025

Foundry 2.0 market hits US$85 billion in 3Q25: TSMC, AI packaging lead growth

The global semiconductor industry's transition into the "Foundry 2.0" era is now measurable in revenue, utilization, and competitive positioning. The expanded foundry ecosystem generated...

Saturday 27 December 2025

Chipbond finds new growth engine in silicon photonics

With panel industry demand remaining weak, display driver IC testing and packaging specialist Chipbond is pursuing a second growth engine and has formally entered the silicon photonics...

Friday 26 December 2025

Samsung, SK Hynix reportedly accelerate HBM4 production to early 2026

Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...

Wednesday 24 December 2025

Innolux shifts FOPLP from volume to validation as US client drives orders, plant closures loom

Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in 2026, shifting its focus to redistribution layer (RDL) and...

Wednesday 24 December 2025

Malaysia's semiconductor packaging and testing industry gains momentum with Taiwanese investments

Malaysia's semiconductor packaging and testing sector is experiencing rapid growth driven by Taiwanese and other foreign investments, according to PwC Taiwan. The firm highlights...

Wednesday 24 December 2025

AI chips run too hot: Engineers race to reinvent cooling

The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...

Tuesday 23 December 2025

Rohm, Tata Electronics form partnership to manufacture power semiconductors in India

Rohm and Tata Electronics said they have entered into a strategic partnership to establish semiconductor manufacturing operations in India, targeting both domestic and overseas markets,...

Tuesday 23 December 2025

TRI's 2025 operations hit record highs, with advanced packaging opportunities to further drive growth

Optical and electrical inspection equipment supplier Test Research Inc. (TRI) held an online investor conference on December 16, 2025, stating that, benefiting from continued strong...

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Dec 24, 08:00

InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups

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