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    TSMC doubles CoWoS capacity for 2025, Nvidia takes the lion’s share
    Apr 29, 18:40
    AI boom puts colocation to the test
    Apr 29, 18:39
    China pushes EV fast charging to match fuel vehicle refueling speeds
    Apr 29, 18:39
    South Korea presidential hopeful pledges special law to boost chip industry
    Apr 29, 18:38
    Gogoro applies for Nasdaq transfer amid challenges, hopeful for 2025
    Apr 29, 18:38
    Chinese automakers face tariff and carbon emission challenges in Europe
    Apr 29, 18:38
    Pegatron chair warns US tariffs risk supply chaos
    Apr 29, 18:38
    Spain and Portugal blackout highlights Taiwan's 2025 nuclear free challenges
    Apr 29, 18:38
    China AI giants face off with new large language models
    Apr 29, 18:37
    Shanghai auto show 2025: LG and MediaTek unveil new IVI solution
    Apr 29, 18:36
    NEWS TAGGED PACKAGING
    Wednesday 30 April 2025
    K&S partners with Taiwanese semiconductor leaders in advanced packaging push

    Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's...

    Tuesday 29 April 2025
    Taiwan semiconductor supplier Chang Wah sees recovery despite Trump tariff uncertainty
    Chang Wah Electromaterials (CWE) founder Canon Huang described Donald Trump's tariff policies as highly unpredictable but expressed confidence that market conditions for CWE and its...
    Tuesday 29 April 2025
    Amkor sees no major tariff-driven pull-ins; new Apple SiP socket order may lift outlook
    Amkor Technology reported falling net sales for the first quarter, driven by weakness in its communications and automotive sectors. The company said its expansion plans in Arizona...
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Friday 25 April 2025
    Gold surge squeezes chip packaging margins
    Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the semiconductor packaging industry. The gold bumping process—essential...
    Thursday 24 April 2025
    TSMC's global expansion faces critical workforce challenge
    TSMC is struggling with workforce constraints as it builds 24 new fabrication plants globally, potentially threatening its ambitious expansion timeline, Chairman C.C. Wei revealed...
    Thursday 24 April 2025
    What TSMC revealed at 2025 Symposium
    At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
    Monday 21 April 2025
    AI gold rush or policy trap? Taiwan IC firms weigh Nvidia's US lure
    Taiwanese IC packaging and testing firms express a mix of opportunity and caution as Nvidia's US$500B AI push unfolds. While Nvidia's US-centric AI supply chain creates demand for...
    Monday 21 April 2025
    Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

    As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

    Friday 18 April 2025
    C Sun poised to join US semiconductor expansion wave
    C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
    Friday 18 April 2025
    Manz bolsters CoPoS innovation in Taiwan, eyes US expansion
    Manz, a pioneering company in semiconductor equipment, is ramping up its efforts to advance Chip-on-Panel-on-Substrate (CoPoS) technology, aiming for commercialization and broader...
    Thursday 17 April 2025
    Innolux CEO responds to FOPLP delays
    Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
    Tuesday 15 April 2025
    Taiwan IC packaging firms report strong 1Q25, but US tariff uncertainty casts shadow
    Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter...
    Monday 14 April 2025
    Silicon photonics nears maturity, eyes full ecosystem by late 2025
    Silicon photonics (SiPh), hailed as a transformative technology for AI development, data centers, and 5G networks, is rapidly converging toward standardized parameters and specific...
    Wednesday 9 April 2025
    Micron lifts HBM market forecast as Nvidia B300 shipments loom
    At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power...
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