Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...
AI has propelled the global semiconductor market to record highs, but growth remains concentrated in memory, advanced logic and advanced packaging, areas in which Europe has limited...
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Applied Materials' record fourth-quarter revenue and operating income highlight how investment in AI infrastructure is translating into demand for wafer-fabrication equipment. Growth...
Sharp is accelerating efforts to address its loss-making display component business. According to Nikkei, Sharp will sell its Hisai plant in Tsu, Mie Prefecture, Japan, which...
Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising...
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine)...
A semiconductor chip no thicker than a fraction of a human hair might seem insignificant beside the powerful silicon processors driving the world's AI revolution. Yet at Pragmatic...
Faced with sluggish end-user demand, chronic overcapacity, and intensifying market competition, global display manufacturers are under pressure to reinvent themselves. In Taiwan, leading...
TSMC is facing unprecedented demand for its advanced chips as artificial intelligence (AI) infrastructure investment accelerates, with advanced packaging and emerging physical AI applications...
The National Science and Technology Council's Department of Engineering and Technologies recently issued a call for proposals encouraging academia to modify expensive semiconductor...
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
