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Monday 20 April 2026
SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads,...
Monday 20 April 2026
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry...
Monday 20 April 2026
Samsung tests domestic EUV masks to cut Japan reliance at 4nm

Samsung Electronics has begun testing domestic EUV blank masks in its 4nm foundry production line, a shift aimed at cutting reliance on...

Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026:
Monday 20 April 2026
Samsung files injunction to prevent union from occupying chip facilities
Samsung Electronics has taken legal action amid escalating labor disputes with its union, filing for an injunction at a South Korean court on April 16, 2026, to prevent the union from...
Saturday 18 April 2026
Samsung launches voluntary retirement amid chip-device earnings gap

Samsung Electronics has initiated a workforce restructuring through a voluntary retirement program as strong semiconductor earnings contrast...

Friday 17 April 2026
OpenAI's HBM push signals a new AI memory arms race
A recent report by South Korea's Chosun Biz highlights how OpenAI is actively building a dedicated supply line with Samsung Electronics to secure high-bandwidth memory (HBM)...
Friday 17 April 2026
Samsung deploys AI across TV lineup to counter Chinese rivals and weather weak demand
On April 15, Samsung Electronics unveiled a broad AI-driven TV strategy at "The First Look Seoul 2026" event in Seoul, signaling an aggressive bid to differentiate its products through...
Friday 17 April 2026
Samsung's VD division reviews China strategy as local rivals gain ground

Rumors of a restructuring of Samsung Electronics's China operations are gaining momentum, with reports suggesting potential scaling back—or...

Friday 17 April 2026
Samsung accelerates Taylor fab ramp-up amid Tesla AI chip deal
Samsung Electronics is moving ahead with the operational ramp-up of its Taylor, Texas, foundry plant, marking a key step in its push to expand advanced semiconductor manufacturing...
Friday 17 April 2026
Intel expands foundry push with Samsung executive hire
Intel, which is working to scale its outsourced chip manufacturing business, has hired Samsung Electronics executive Shawn Han to strengthen its foundry operations and customer engagement...
Friday 17 April 2026
Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift

Tesla CEO Elon Musk has aligned his TeraFab megafab initiative with Intel, in a move that had been signaled in recent months.

Friday 17 April 2026
Tesla AI5 reaches tape-out; SK Hynix memory spotted in early sample

Tesla has reached the tape-out stage for its next-generation AI chip, AI5, marking a milestone in its in-house semiconductor development...

Thursday 16 April 2026
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark...
Thursday 16 April 2026
Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge
Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According...