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Thursday 16 July 2026
CXMT outspends all peers on R&D as a share of revenue, IPO filing shows

Across almost every competitive metric disclosed in its STAR Market IPO prospectus, Changxin Memory Technologies (CXMT) trails the...

Thursday 16 July 2026
Samsung weighs outsourcing Google TPU back-end design as 2nm demand grows

Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported...

Thursday 16 July 2026
CXMT IPO filing reveals Micron and Samsung alumni at heart of China's DRAM push

The IPO prospectus of Changxin Memory Technologies (CXMT), filed ahead of a planned listing on Shanghai's STAR Market, lays bare the...

Thursday 16 July 2026
Samsung may scale back foldable storage upgrades as memory costs rise
Samsung Electronics is reportedly preparing to reduce a long-running preorder perk for its next Galaxy foldables as memory prices climb. According to ChosunBiz, the South...
Thursday 16 July 2026
Samsung, SK hynix race to make Gwangju memory hub operational within four years
Samsung Electronics and SK hynix are set to anchor a KRW800 trillion (US$532.4 billion) semiconductor cluster at the former Gwangju military airport site in South Korea. Industry experts...
Thursday 16 July 2026
Samsung's Honam semiconductor investment faces union pushback as 80% oppose project
As Samsung Electronics pushes ahead with a major semiconductor investment project in South Korea's Honam region, including Gwangju and South Jeolla Province, labor-management relations...
Wednesday 15 July 2026
Samsung has yet to receive HBM4 volume-production order from Nvidia, dealsite reports
Samsung Electronics has yet to receive a volume-production order from Nvidia for HBM4 chips, with its HBM revenue from the AI chipmaker so far limited to paid evaluation samples, Dealsite...
Wednesday 15 July 2026
South Korean court bars former Samsung NAND designers from working for SK Hynix
A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April...
Wednesday 15 July 2026
MediaTek beats Qualcomm and Samsung to secure Pixel 11's modem slot

MediaTek has widened the reach of its 5G modem chips beyond its own smartphone SoC platforms, pushing deeper into overseas sales in...

Wednesday 15 July 2026
CXMT's US$4.3B IPO powers China's HBM challenge to global memory giants

CXMT is preparing China's largest chip-sector IPO of 2026, seeking up to US$4.3 billion to expand DRAM and HBM capacity, deepen vertical...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip...

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...