Samsung Electronics announced its first triple-folding smartphone, the Galaxy Z TriFold, on December 2, 2025, marking the company's latest attempt to expand its foldable portfolio...

Samsung Electronics and SK Hynix, which control about 70% of the global DRAM market, signalled in recent IR meetings with global investment banks that they will not pursue aggressive...

Samsung Electronics' Device Solutions (DS) division will continue negotiating mobile DRAM supplies on a quarterly basis with its Mobile eXperience (MX) division, despite ongoing memory...

Samsung Display (SDC) is preparing to reposition Vietnam's Bac Ninh Province as a core base for its next-generation OLED business under a plan that shifts the facility from a general...

Apple may resume chip production cooperation with Intel for entry-level M-series chips as early as 2027, contingent on the maturity of Intel's 18A-P process within 18 to 24 months...

India has ordered smartphone makers to pre-install a state-owned cybersecurity app on all new devices and push it to existing phones via software updates. The move is already drawing...

Google's expanding investment in custom AI accelerators is reshaping the high-bandwidth memory market and lifting Samsung Electronics and SK Hynix as demand for tensor processing...

Artificial intelligence (AI) is fueling a DRAM supercycle, prompting South Korean securities firms to continuously raise their forecasts for Samsung Electronics' operating profit...

Samsung Electronics has promoted its Taiwan region president, Jun Yang, to an executive role following outstanding business performance. Samsung highlighted Yang's extensive experience...

Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...

China's memory manufacturer CXMT, backed by government support, shifted to high-end technology development from 2025 and has introduced multiple next-generation DRAM products within...

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance...

Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...

Samsung Electronics is reportedly nearing the final stage of qualification tests for its HBM4 memory chips with Nvidia, with a December decision that could mark one of the company's...