The Advanced Electronic Packaging Technology (ADEPT) committee under the Global Electronics Association continues to expand its presence in Taiwan.

U-Power, Taiwan's ultra-fast electric vehicle (EV) charging operator, has applied to list on the Taipei Exchange as the country's expanding EV population supports expectations for...

As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology...

Taiwan's aerospace components maker Aero Win Technology is positioning itself for a new growth cycle, capitalizing on robust aircraft engine demand while expanding its role in next-generation...

Motor manufacturer Racing Electric Instrument (REI) is expanding from propulsion systems into electro-optical/infrared (EO/IR) payloads and inertial navigation for drones, targeting...

Liquid cooling is becoming mainstream in AI servers, prompting data-center customers to assess pumps that can move 100 metric tons of water per hour as chip heat rises. Taiwan pump...

Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...

Grab Holdings' proposed acquisition of Delivery Hero's Foodpanda operations in Taiwan has been rejected by Taiwan's Fair Trade Commission (FTC). The commission made the announcement...

Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...

The Taiwan Space Agency (TASA) said two 8U CubeSats developed by Tron Future Tech successfully reached orbit on October 20 aboard SpaceX's Bandwagon-5 rideshare mission, advancing...

As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking...

Syscom Computer Engineering is expanding its portfolio in edge AI and its broader enablement ecosystem, with the company showcasing its latest products at the 2026 AIoT Taiwan exhibition,...

The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...