During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
Uncertainty surrounding US President Donald Trump's tariff policy has rattled global supply chains and triggered downward revisions in growth forecasts for consumer electronics and...
Nvidia's high-end AI server, the GB200, is facing challenges due to technical bottlenecks and material supply issues. Industry sources report that key materials used for chip substrates...
With consumer electronics in a seasonal downturn and no strong market recovery in sight, ABF substrate leader Unimicron expects first-quarter revenue to dip by a single-digit percentage...
AI-powered applications reshaped the electronics manufacturing landscape in 2024, driving a resurgence for Taiwan’s leading IC substrate makers. Unimicron, Kinsus, and Zhen...
The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...
Major players in the PCB industry are further consolidating their lead over their competition as recent data from the market research firm N.T. Information indicates that Taiwanese...
Major Taiwan-based PCB and IC substrate companies reported brisk sales performance in August 2024, indicating an increase in demand from generative AI and a ramp-up in orders for...
Unimicron, Taiwan's leading ABF carrier board manufacturer, is experiencing a gradual recovery in the semiconductor industry as consumer electronics and PC/NB products return to their...
The Japanese yen's depreciation will provide Japan-based ABF substrate companies with an additional advantage over their Taiwanese counterparts, in addition to technology leadership,...
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
