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Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.
Monday 24 August 2026
Commentary: Robots go to work— highlight of the five robotic trends at WRC 2026
The 2026 World Robot Conference (WRC) opened in Beijing on August 19, and the biggest change on this year's show floor was not the larger number of humanoid robots — it was that robots started working on site. From coffee making and retail service to printed circuit board (PCB) handling, logistics sorting, auto parts loading and unloading, and even home organizing, laundry, and table clearing, robot makers are no longer just showing robots walking, dancing, and boxing.
Friday 21 August 2026
Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the other 26 manufacturers grew more than twice as fast.
Friday 21 August 2026
Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring across company filings.
Friday 21 August 2026
Charts: Foxconn is losing share of Taiwan's EMS revenue as Quanta and Wistron near double
The sub-sector's dominant supplier grew 37.9% year to date and still ranks only seventh of 20, while the other 19 companies grew 56.9% between them.
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending
One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.
Thursday 20 August 2026
Commentary: How iPad Air became a catalyst for IT OLED expansion
Apple kicked off the tablet OLED era in 2024, introducing Tandem OLED in the iPad Pro to overcome bottlenecks in display lifespan and brightness. The iPad mini followed, set to adopt OLED in the second half of 2026, though with annual shipments hovering at just 2 million units, its impact is largely symbolic. Market research firm UBI Research noted that tablet OLED growth has largely stalled through 2024 and 2025, with OLED costs remaining the primary hurdle: panels currently run roughly twice the price of LCD alternatives, and narrowing that gap is widely viewed as the primary prerequisite for expanding OLED adoption in IT applications.
Thursday 20 August 2026
Analysis: Unitree IPO exposes the economics behind China's humanoid robot boom
Unitree Robotics' August 19 debut on Shanghai's STAR Market did more than crown China's first mainland-listed humanoid robot maker. It marked a shift in the industry from competition between robot brands to a harder contest over supply-chain cost, AI capability, and mass production.
Thursday 20 August 2026
Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
Marvell Technology is set to deepen its role in Google's AI infrastructure through an expanded agreement to develop custom chips, in a deal that could generate roughly US$120 billion in revenue for the chipmaker through fiscal 2033 if Google meets purchasing targets tied to the warrant, according to Reuters. The scale of that figure is the story: it reframes Marvell not as a niche supplier, but as a structural bet by Google on custom silicon over merchant GPUs.
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project
Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.
Wednesday 19 August 2026
Charts: Taiwan's materials suppliers split: wafer giants stall, substrate and lead-frame names run
The two largest silicon wafer companies are the sector's slowest growers on a cumulative basis. Everything running fast sits downstream of them.
Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue
Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to DRAM, NOR flash and controller names.
Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
Analysis: China's AI chip ambitions collide with Ajinomoto's 95% grip on ABF film
China's semiconductor self-reliance campaign is moving beyond lithography machines and advanced processors into less visible materials that can be just as difficult to replace. Ajinomoto Build-up Film, or ABF, has become the latest pressure point.
Tuesday 18 August 2026
Commentary: AMD's Taalas acquisition echoing Jensen Huang's Groq strategy
On February 20, 2026, Canadian AI chip startup Taalas unveiled its HC1 inference chip. Taalas said the chip ran the Llama 3.1 8B model at a single-user inference speed of 16,960 tokens per second, roughly 48 times the inference speed of an Nvidia B200 in the company's testing.