Intel is grappling with an operational crisis as its IDM 2.0 transformation plan has yet to yield results, casting doubt on when its foundry business might finally become profitable. This raises the question of whether Intel should consider abandoning its IDM model and separating its product design and manufacturing divisions—a move with both potential advantages and drawbacks. Industry leaders, including former board members, are offering advice in hopes of helping Intel find a viable path forward. However, the conflicting nature of their advice highlights the complexity of the company's dilemma
OpenAI began testing ads within ChatGPT in the US shortly after Google reaffirmed no ad plans for its Gemini AI, highlighting differing strategies amid generative AI competition. OpenAI aims to offset high infrastructure costs, whereas Google focuses on balancing user experience and commercial interests
While global political and economic elites were still exchanging remarks at the World Economic Forum (WEF) in Davos, Nvidia CEO Jensen Huang exited and flew straight to Shanghai
TSMC's recently announced capex surpassed market expectations by US$6 billion to US$8 billion, driven by factors that analysts had previously overlooked, DIGITIMES analyst Luke Lin said in a podcast episode. This development signals structural changes in the semiconductor production landscape and has broader implications for global industry competition and US-Taiwan trade relations
Alibaba is rumored to be evaluating a plan to spin off T-Head Semiconductor for a potential listing. T-Head may still appear to be a young company, but to the semiconductor industry, this Chinese IC design company's roots span more than twenty years of transformation and arduous progress. Its predecessor, C-Sky Microsystems, also plays an important role in China's development of the RISC-V architecture. In review of its evolution, the reason why Alibaba chose this critical moment to push this team onto center stage has become clear
Beyond the closely watched rivalry between Samsung Electronics and Huawei in foldable smartphones—and the shifting balance of market share—another question drawing market attention is whether Apple will launch its first foldable iPhone, tentatively dubbed the iPhone Fold, on schedule in 2026
When US President Donald Trump erected a high wall of tariffs—and repeatedly adjusted its height—the stated goal was to protect the US industry. The unintended consequence, however, is that they have pushed some of the US's closest allies closer to China
ASIC servers are emerging as the most closely watched segment of the server supply chain heading into 2026. Nvidia remains the dominant force in AI servers and continues to ship the largest volumes of GPU-based systems. However, as Nvidia tightens its control over the supply chain through high server prices and increasingly standardized specifications, gross margins across the ecosystem are coming under pressure. Competition for ASIC server orders is intensifying as suppliers seek to protect and improve profitability
US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive analysis from DIGITIMES analyst Luke Lin, the administration has shifted its pressure campaign away from advanced logic chips and toward memory, delivering a blunt ultimatum to South Korea's two dominant producers: build wafer fabs in the US or face tariffs of up to 100%
Sony Corporation and TCL Technology have signed a memorandum of understanding to form a joint venture that will take over Sony's home entertainment business, including TV and audio product R&D, manufacturing, operations, and after-sales services. The new entity is expected to begin operations as early as April 2027, effectively placing the future of the Bravia brand under TCL's operational control
Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond simple capacity dispersion and entering a new phase marked by the geographic redistribution of engineering capabilities. Recent market reports that Google plans to relocate portions of new product introduction (NPI) work for select high-end smartphone models to Vietnam starting in 2026 have drawn close attention across the industry
CES 2026 made it clear that Chinese brands are entering the global consumer electronics industry through concrete operating results. Its leaders are no longer stopping at exposure but are beginning to pursue deeper brand building and market management. From TCL Electronics' plans to form a joint venture with Sony, to Lenovo operating CES almost on par with top-tier international brands, what these moves reflect is not simply an effort to amplify marketing presence. It is a test of whether companies have the product strength, supply chains, and long-term investment capacity required to support global expansion
On January 16, 2026, Taiwan and the US finalized a trade agreement that cuts tariffs on Taiwanese exports to the US to 15% without stacking. The US also pledged most-favored-nation status and duty-free quotas for Taiwan under Section 232 semiconductor-related tariffs regardless of future rate changes. This outcome reflects Taiwan's technological strength and raises questions about whether Taiwanese firms investing in China and Vietnam will now consider reshoring amid improved US-Taiwan trade terms
As Taiwan and the US reached a consensus in their tariff negotiations, a long-standing cloud hanging over Taiwan's automotive aftermarket industry began to lift. Securing the most favorable treatment under Section 232—capping tariffs at 15%—was not only a trade victory but a psychological turning point for Taiwan's vehicle-parts supply chain. The agreement has injected new confidence into the sector, allowing manufacturers to shift from a posture of defensive caution to one of proactive expansion
After months of trade negotiations, Taiwan and the US have finalized a reciprocal tariff agreement that lowers rates to 15% without stacking most-favored-nation (MFN) tariffs. The deal grants semiconductor products under Section 232 preferential treatment, expands supply chain investment cooperation, and establishes a credit guarantee fund totaling US$500 billion
