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NEWS TAGGED DESIGN
Wednesday 9 September 2026
OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
Wednesday 9 September 2026
SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
Wednesday 9 September 2026
Qualcomm to build custom AI inference chips for AWS
Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the company something its data center roadmap has lacked since...
Tuesday 8 September 2026
Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
Tuesday 8 September 2026
Privacy displays become a premium smartphone battleground as Huawei brings one to a foldable

Huawei's Mate XT 2 combines an inward-folding tri-fold design with a built-in hardware privacy display, bringing two concepts already prominent...

Tuesday 8 September 2026
India's IndieSemiC targets 3 to 5 million Wi-Fi camera modules as local CCTV rules spur demand
Indian chip design company IndieSemiC is targeting shipments of 3 to 5 million locally made Wi-Fi modules in FY27-28, betting that security requirements for CCTV equipment will encourage...
Monday 7 September 2026
SK Hynix reportedly ends LG eSSD talks as ASICLAND deal expands
SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES...
Monday 7 September 2026
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
The largest engineering school on the US West Coast by enrollment is training engineers for Taiwan Semiconductor Manufacturing Co. (TSMC) and pioneering advanced 3D packaging desig...
Monday 7 September 2026
Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market
Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...
Monday 7 September 2026
China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D
China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Monday 7 September 2026
SiliconAuto pushes AI chiplets as automotive SoC ties tighten
Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...
Sunday 6 September 2026
Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market
I-Chiun Precision Industry and Taiwan's Industrial Technology Research Institute (ITRI) have established Huizhi Advanced, the country's first startup focused on AI chip thermal design,...
Saturday 5 September 2026
Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...