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Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...
Tuesday 1 September 2026
OpenAI compresses Jalapeno design to 9 months
OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...
Tuesday 1 September 2026
Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push
Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...
Tuesday 1 September 2026
SK Hynix explores Intel as second source for HBM base dies
SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
Monday 31 August 2026
Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
Monday 31 August 2026
Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
Monday 31 August 2026
India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Thursday 27 August 2026
Synopsys lifts 3QFY26 sales, raises full-year outlook
Synopsys, a leading electronic design automation (EDA) company, reported stronger-than-expected fiscal third-quarter results for the 2026 fiscal year (3QFY26) as the AI boom drove...