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NEWS TAGGED DESIGN
Thursday 26 May 2022
IDMs, IC designers gearing up for AIoT market boom
Eyeing promising demand for AIoT device applications, IDMs and IC design houses are entering long-term cooperation to grow related ecosystems highlighting AI-based edge computing...
Friday 20 May 2022
IC design houses bracing for cutback in orders from China handset brands
Taiwan-based IC design houses particularly LCD driver IC firms continue to see their China-based handset clients decelerate their pace of orders, bracing for a potential cutback in...
Thursday 19 May 2022
The rise of top 10 IC design companies in China
China, the world's leading consumer of semiconductors, is undergoing a third semiconductor shift in tandem with the development of 5G, consumer electronics, and AI. Owing to the shift...
Thursday 19 May 2022
Macroblock expects 2-digit sales growth in 2Q22
LED driver IC design house Macroblock expects to post a double-digit sequential revenue increase with high gross margin in the second quarter of 2022, driven by robust demand for...
Tuesday 17 May 2022
Brand notebook vendors cut orders for 2022
Brand notebook vendors have cut back orders with suppliers in 2022, particularly orders for Chromebooks, and have also revised downward annual shipment targets, according to sources...
Thursday 12 May 2022
IC design houses under pressure to drop prices
IC design houses, particularly those specializing in chips for handsets and other mass-market device applications, are under pressure to lower their prices amid sluggish end-market...
Wednesday 11 May 2022
MediaTek posts revenue decline in April
Lockdown restrictions in major Chinese cities have made an adverse impact on end-market demand and also supply chains involving mobile SoC specialist MediaTek, which saw its April...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Chenbro, a pioneer in the design and manufacturing of rackmount systems, announced that its innovative RM25324 2U 24 Bay high-density storage server chassis has won the iF Design...
Friday 29 April 2022
Macroblock expects double-digit revenue growth in 2022
LED driver IC design house Macroblock will be striving to boost its shipments for high-end and niche-market device applications in 2022, when the company expects to post a double-digit...
Thursday 28 April 2022
Korea looks to future cars for restoring IC design
South Korea's industry is calling for more efforts to nurture IC designers amid the rising demand for automotive chips. It is believed that small-scaled IC designers will be able...
Tuesday 26 April 2022
IC design houses keen on incorporating AI into edge computing solutions
With edge computing gaining importance in the proliferating of 5G and AIoT applications, IC design houses in Taiwan are incorporating AI algorithms into chip solutions for all edge...
Thursday 21 April 2022
Wi-Fi SoC shortages improving
Wi-Fi core chip suppliers have obtained more available fab capacities at foundries, which are experiencing cutbacks in orders from other areas, and therefore are seeing their tight...
Tuesday 19 April 2022
Chromebook chip demand falling
Chip demand for Chromebooks has been falling rapidly, whereas demand for business notebooks is relatively stable, according to sources at Taiwan-based IC design houses.
Tuesday 19 April 2022
IC design houses see more order cutbacks from China phone brands
Chinese brand mobile phone vendors have further cut chip orders for the second quarter, casting a shadow over the demand prospects for the second half of the year, according to sources...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.