CONNECT WITH US
NEWS TAGGED DESIGN
Tuesday 13 October 2026
Interview: Microsoft's Maia GM on Maia 300, Taiwan and HBM supply
Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company...
Monday 12 October 2026
Microsoft's Maia 300 rack: 96 accelerators, HBM4, mostly liquid-cooled
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...
Monday 12 October 2026
Microsoft to scale Maia AI chips to multi-gigawatt deployments, unveils TSMC N2P-based Maia 300
Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services...
Monday 12 October 2026
China proposes physical controls and tougher testing for new vehicles
China proposed tighter vehicle design and safety requirements that would restrict fully hidden door handles, virtual controls for critical functions and several interior features in...
Monday 12 October 2026
Microsoft calls for observable AI systems with emergency shutdown controls
Microsoft urged organizations to design artificial intelligence systems as observable, controllable infrastructure rather than opaque "black boxes," arguing that people must be able...
Monday 12 October 2026
Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
Monday 12 October 2026
Memory wall reshapes chip performance as large-capacity SRAM becomes a focal point in autonomous driving SoC design
DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role...
Monday 12 October 2026
India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

Monday 12 October 2026
Neweb Information lifts 2Q26 net profit 118% on IT upgrade demand
System integration provider Neweb Information, which is set to list on October 23, reported September 2026 revenue of NT$77.02 million (approx. US$2.41 million), up 33.48% year-over-year,...
Monday 12 October 2026
Nanya Plastics deepens push into power engineering as AI infrastructure demand rises
Nanya Plastics Corporation is expanding into heavy electrical equipment and power engineering, a move that could ripple beyond Taiwan as global demand for AI data centers, grid upgrades,...
Friday 9 October 2026
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...
Thursday 8 October 2026
Sasken eyes reusable chip IP as India pushes beyond semiconductor design services
India-based engineering firm Sasken Technologies plans to license company-owned semiconductor interconnect intellectual property (IP) to multiple customers, marking an effort to move...
Thursday 8 October 2026
Marvell's custom AI chip upgrade points to a broader fight over peripherals
Marvell's higher long-term target for custom AI chip revenue suggests the market for artificial intelligence hardware is widening beyond accelerators, into management chips, storage,...
Thursday 8 October 2026
27 Samsung, SK Hynix veterans joined China's CXMT, study shows
An investigation by a South Korean lawmaker's office revealed that former Samsung Electronics and SK Hynix personnel who transitioned to Chinese DRAM maker ChangXin Memory Technologies...
Wednesday 7 October 2026
Schneider-PTC deal targets industrial AI across the lifecycle
Schneider Electric's roughly US$22.6 billion acquisition of US industrial software developer PTC is more than a bid to expand its computer-aided design (CAD) and product lifecycle...