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Thursday 1 October 2026
Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development
Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Thursday 1 October 2026
Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion
Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September...
Thursday 1 October 2026
AWS Trainium 3 shipments stall as supply chain sees turnaround
AWS's latest Trainium 3 shipments appear to be running behind expectations, but the strain reflects broader pressures that global readers will recognize across the AI hardware supply...
Thursday 1 October 2026
Synopsys and OpenAI to share revenue from AI model built to run chip design tools
Synopsys is betting that the surest way to keep generative AI from eroding its electronic design automation (EDA) franchise is to build the model together with the AI developer and...
Wednesday 30 September 2026
Gold Circuit turns Amazon into a shareholder for Trainium servers
Gold Circuit Electronics (GCE) plans to bring in Amazon as a strategic investor through a private placement expected to raise NT$1.59 billion (US$49.88 million), lifting the two companies...
Wednesday 30 September 2026
Samsung SDI targets AI data centers with cylindrical LFP batteries and fire-propagation safeguards
Samsung SDI is accelerating its push into the artificial intelligence (AI) data center battery market, unveiling, for the first time, a cylindrical lithium iron phosphate (LFP) battery...
Wednesday 30 September 2026
Murata begins mass production of world's smallest three-terminal MLCCs
Murata Manufacturing has started mass production of its LLD series, a new class of ultra-compact capacitors that could help device makers worldwide fit more power management into smaller...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
Foxconn links motors, humanoids, smart factories into a vertically integrated robotics strategy
Foxconn has partnered with Chinese automotive design and engineering services provider IAT Automotive Technology to establish Beijing Futekang Intelligent Robot Technology, extending...
Wednesday 30 September 2026
Micro LED smartwatches set back as costs remain a fatal hurdle
Micro LED has reached mass production in several end-market applications in recent years, but it is still facing intense competition from OLED. Garmin's new fenix 9 smartwatch has...
Wednesday 30 September 2026
Apple iPhone Duo revives UDC battle as Samsung weighs trade-offs
Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...
Wednesday 30 September 2026
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit
Qualcomm Technologies held its Snapdragon Summit 2026 in Maui, Hawaii, from September 22 to 24. During the keynote on the second day, Qualcomm president and CEO Cristiano Amon spoke...