Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor...
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation...
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design...
Huawei reported that cumulative global shipments of its Watch Fit series had topped 24 million units as of April 2026, signaling accelerating momentum for the vendor's smart wearables...
Synopsys raised its fiscal 2026 revenue target after reporting a 42% year-over-year rise in second-quarter sales, driven by continued demand for AI-related chip design tools and verification...
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for...
Motorola launched its Razr foldable in Taiwan on April 26, after first unveiling the device at MWC 2026 in Barcelona in March 2026, and introduced new accessories, including wireless...
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Kian-Shen Industrial, a unit of Yulon Motor, reported on May 26 that 2025 consolidated revenue fell to NT$1.246 billion, a 15% decrease from the prior year, as customer labor shortages,...
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...