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Tuesday 2 June 2026
Chenbro debuts its comprehensive rack solutions for AI at COMPUTEX

Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed...

Tuesday 2 June 2026
PEGATRON Showcases AI Tech Maker Strategy at COMPUTEX 2026

PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing...

Tuesday 2 June 2026
Power Integrations unveils 1700V GaN auxiliary PSU for AI data centers
Power Integrations (PI) has announced two ultra-thin, compact auxiliary power supply (PSU) reference designs built for 800VDC AI data centers. PI principal training engineer Jason...
Tuesday 2 June 2026
Zhen Ding joins Nvidia MGX ecosystem to supply cable-free PCB technology for AI factories
PCB manufacturer Zhen Ding announced it had joined Nvidia's MGX ecosystem to support the deployment of the chipmaker's third-generation MGX modular architecture, which uses a PCB-based...
Tuesday 2 June 2026
Broadcom, Samsung launch Wi-Fi 8, 5G platform to bring fiber-grade FWA to mass market
Broadcom and Samsung Electronics have announced a broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 system-on-chip...
Tuesday 2 June 2026
India's chip startups move from design to pilot production, raising stakes for local semiconductor push
India's emerging semiconductor startups are entering a crucial phase as companies such as Netrasemi, Mindgrove Technologies, and Agnit Semiconductors move from research into customer...
Tuesday 2 June 2026
Huawei's Tau Law faces its hardest test: chip yield, not theory
Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions...
Monday 1 June 2026
Delta Electronics sees AI data center power shift and manufacturing overhaul shaping future competition
Delta Electronics president and COO Simon Chang said the company's long investment cycle in power technology is positioning it for rising AI data center demand and a broader manufacturing...
Monday 1 June 2026
Asus ready to compete as Apple expands into budget laptop market
Asustek Computer (Asus) chairman Jonney Shih outlined the company's artificial intelligence (AI) strategy roadmap and also commented on whether Apple's entry-level MacBook Neo could...
Monday 1 June 2026
AuthenX targets CPO bottlenecks with detachable metalens FAU
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
Saturday 30 May 2026
E Ink to unveil color e-paper platforms and large-format signage at Computex 2026
E Ink Holdings said it will showcase multiple color e-paper technologies and complete solutions at Computex 2026, presenting products aimed at outdoor and indoor advertising, smart...
Saturday 30 May 2026
Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
Saturday 30 May 2026
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
Friday 29 May 2026
Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge...
Friday 29 May 2026
From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At...