SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
Nvidia and Cisco have introduced a new pluggable optics form factor to expand AI infrastructure without sharply increasing power use or network complexity. For global cloud operators,...
AMD has introduced Helion, an open rack architecture designed for agentic AI workloads that could change how data centers allocate compute, power, and cooling. The system targets hyperscale...
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company...
Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services...
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...
China proposed tighter vehicle design and safety requirements that would restrict fully hidden door handles, virtual controls for critical functions and several interior features in...
Microsoft urged organizations to design artificial intelligence systems as observable, controllable infrastructure rather than opaque "black boxes," arguing that people must be able...
Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys,...
DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role...
System integration provider Neweb Information, which is set to list on October 23, reported September 2026 revenue of NT$77.02 million (approx. US$2.41 million), up 33.48% year-over-year,...
Nanya Plastics Corporation is expanding into heavy electrical equipment and power engineering, a move that could ripple beyond Taiwan as global demand for AI data centers, grid upgrades,...
Samsung Electronics' next-generation 12-layer HBM4E product, a type of high-bandwidth memory (HBM), has reportedly cleared customer quality validation from Nvidia and major hyperscale...
