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    Commentary: Taiwan's tech giants stuck between Beijing and Taipei's defense push
    5h 27min ago
    Could Nvidia reshuffling of Asia’s AI map weaken Taiwan supply chain's dominance?
    5h 28min ago
    Panel supply chain earnings calls spotlight transformation and new businesses
    5h 28min ago
    LG's 600kW CDU wins Nvidia validation and North American CSP project
    5h 28min ago
    BOE shifting away from low-price competition
    5h 28min ago
    Samsung and SK Hynix seek workarounds as semiconductor equipment lead times double
    5h 28min ago
    NEWS TAGGED DESIGN
    Monday 27 July 2026
    Nvidia's Vera CPU targets go beyond Intel and AMD
    After Nvidia has grown into a global giant on GPUs, why is it suddenly delving into CPUs? At first glance, its Vera is entering the server CPU market, where its rivals are naturally...
    Monday 27 July 2026
    Pegatron unveils AMD EPYC server platform for AI and HPC
    Pegatron unveiled a new server platform powered by AMD's sixth-generation EPYC processors at AMD Advancing AI 2026, targeting enterprise AI, agentic AI, high-performance computing...
    Monday 27 July 2026
    India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub
    India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process...
    Monday 27 July 2026
    IndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem
    Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP)...
    Monday 27 July 2026
    Samsung opens preorders for new foldables as Apple entry expected to reshape market
    Samsung Electronics has opened preorders for its latest Galaxy Z foldable smartphones and Galaxy smartwatches, introducing new devices as the global foldable smartphone market is expected...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Saturday 25 July 2026
    Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking
    Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract...
    Friday 24 July 2026
    SK Hynix seeks US engineers for 3D stacked DRAM push

    SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

    Friday 24 July 2026
    Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp
    SemiAnalysis recently forecast that large-scale deployment of Nvidia's native single-ended 800V high-voltage direct current power architecture could slip from the market's previous...
    Thursday 23 July 2026
    Moonshot AI model challenges EDA moat with 2-day chip design
    China AI startup Moonshot AI has drawn intense attention from the semiconductor industry after unveiling its new large language model Kimi K3, which delivered strong results across...
    Thursday 23 July 2026
    Apple's first foldable iPhone faces production hurdles

    Apple's long-rumored foldable iPhone is drawing fresh attention as supply-chain updates point to a possible debut at the company's...

    Thursday 23 July 2026
    Samsung Fold series debuts wide-screen design in strategic shift
    Samsung Electronics unveiled three new foldable smartphones at its annual Galaxy Unpacked event in London on July 22, 2026, including the Galaxy Z Fold8, Galaxy Z Flip8, and Galaxy...
    Thursday 23 July 2026
    Merck makes 'AI for AI' its new semiconductor materials strategy

    As the global AI race intensifies, Germany's Merck is extending its reach into semiconductor materials research with an "AI for AI"...

    Thursday 23 July 2026
    Samsung unveils new foldables in London as it expands lineup
    Samsung Electronics used its annual Galaxy Unpacked event in London on July 22, 2026, to signal a broader push into foldable smartphones that could influence device trends worldwide...
    Wednesday 22 July 2026
    Foxconn's Jun Seki says L4 adoption will be in 80% of new cars by 2040
    Foxconn group's EV strategy chief Jun Seki said on July 21 in Tokyo that Level 4 (L4) and above autonomous driving will likely be installed in 80% of new cars by 2040, and that the...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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