Nvidia's fanless Vera Rubin AI server racks, slated for mass production in the second half of 2026, are expected to accelerate global adoption of liquid cooling across server components,...
Digital cameras staged a notable market comeback as demand for retro aesthetics and high-resolution imaging rose, reviving production lines and lifting secondhand prices, industry...
Arm was notified by the US Federal Trade Commission in early 2026 that it was the subject of an antitrust investigation after the chip designer said it would begin engineering its...
Asus is accelerating its push into the server market in South Korea, leveraging its manufacturing prowess, long-term ties with major memory makers, and flexible design and supply strategies...
Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
Taiwan's optical supply chain is moving into smart snow goggles as companies race to combine augmented reality (AR) displays with large-curvature protective lenses. To overcome the...
As AI server prices rise, original design manufacturers (ODMs) are hitting record revenue, but also coming under pressure on their gross margins. To defend profitability, manufacturers...
Market fears over Nvidia's next-generation Vera Rubin platform have eased after supply-chain sources said design issues tied to a cooling architecture change have largely been resolved...
Auras Technology reported record first-quarter results and said it expects revenue and profit to grow quarter by quarter in 2026, dismissing market talk that a design tweak on Nvidia's...
United Microelectronics Corp. (UMC) has released a 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, marking a new step in the foundry's process roadmap...
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
The global mobile standards race has moved into the 6G prelude, with Ericsson saying the first fully implementable 6G specification is expected as early as March 2029. In an exclusive...
