News tagged design at DIGITIMES

NEWS TAGGED DESIGN

Monday 9 June 2025

Linxens teams up with Dracula Technologies to develop battery-free smart labels for next-gen sustainable IoT

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a...

Monday 9 June 2025

Coincidence? EDA access quietly restored to some Chinese companies following Xi-Trump call

Following a direct high-level phone call between China and the US on the evening of June 5, 2025, Beijing time, subtle shifts have emerged in semiconductor and electronic design automation...

Monday 9 June 2025

Tata-Bharat partnership to advance India's semiconductor and electronics capabilities

Tata Electronics and Bharat Electronics have signed a Memorandum of Understanding to co-develop indigenous semiconductor and electronics solutions. The partnership will explore joint...

Monday 9 June 2025

Weekly news roundup: Arm's rebrand, Huawei's R&D blitz, and Asia's rising AI chip challengers

These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's...

Thursday 5 June 2025

As US EDA ban tightens its grip, China's domestic tools step into the breach

The US has issued new export restrictions targeting leading electronic design automation (EDA) firms—Cadence, Synopsys, and Siemens—prohibiting them from supplying software...

Thursday 5 June 2025

India eases SEZ rules to boost semiconductor, electronics manufacturing

India has eased land and operational norms in Special Economic Zones (SEZs) to lower entry barriers and spur investment in semiconductor and electronic component manufacturing.

Thursday 5 June 2025

China debuts first full-stack EDA suite as free alternative to US tools in offensive move

China's semiconductor sector is bracing for a potential escalation in US export restrictions that could sever access to critical electronic design automation (EDA) software. Responding...

Wednesday 4 June 2025

Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun

Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is...

Wednesday 4 June 2025

Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design

South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster...

Wednesday 4 June 2025

From displays to chips: BOE founder's new bet heads for Hong Kong Listing

Beijing ESWIN Technology Group, a relatively obscure chip design firm, has quietly made a major move that could reshape China's semiconductor...

Wednesday 4 June 2025

Arm retires Cortex brand, teases proprietary chip as RISC-V heat rises

Arm Holdings has announced a major rebranding initiative and confirmed plans to enter the chip design space—a strategic pivot that...

Tuesday 3 June 2025

Famous on the Board intros an AI-assisted PC case design platform to achieve faster design cycles and brand consistency

Companies have begun to incorporate generative AI models with CAD drawings, design specifications, simulation data, and other information in order to improve design efficiency and...

Tuesday 3 June 2025

Huawei's Hubble shifts gears: from chips to AI, robotics

Huawei launched Hubble Technology Investment Co. in response to US sanctions in 2019, a wholly owned subsidiary aimed at accelerating China's push for semiconductor independence....

Tuesday 3 June 2025

US targets EDA exports as Xiaomi’s XRing O1 raises alarm over China’s IC design gains

Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...

Monday 2 June 2025

Xiaomi's XRing O1 stirs 'self-developed' chip debate with Arm DNA and custom AI engines

Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's...

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