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NEWS TAGGED DESIGN
Friday 2 June 2023
Honor fuels IC design speculations with new Shanghai R&D center
The in-house chip development programs of leading Chinese smartphone makers has been under spotlight. On May 31st, Huawei-spinoff smartphone brand Honor set up a wholly-owned subsidiary...
Thursday 1 June 2023
Micron intros new PCIe Gen5 SSD and DRAM offerings for high-throughput apps
Micron Technology has introduced the Crucial Pro series, which consists of memory and storage products designed for gamers, content creators, workstation professionals, and anyone...
Monday 29 May 2023
New Nvidia generative AI chip employs TSMC CoWoS
Nvidia has announced the launch of a new class of large-memory AI supercomputer, the Nvidia DGX, powered by Nvidia's GH200 Grace Hopper superchips and the Nvidia NVLink Switch System,...
Monday 29 May 2023
Taiwan IC design houses deepening deployments for ePaper market boom
Taiwan's IC designers including MediaTek and many other peers are all keen to develop diverse chips solutions for ePaper technology applications that are poised to regain fast growth...
Friday 26 May 2023
BCG sees the world at the brink of an AI industrial revolution, even disrupting chip design
The Boston Consulting Group (BCG)'s recent announcement of a strategic collaboration with Intel to deliver "enterprise-grade, secure AI" is an example of how industry leaders have...
Friday 26 May 2023
ESMT ramping up wafer starts at foundries
Niche-market memory IC design house Elite Semiconductor Memory Technology (ESMT) has seen an influx of short lead-time orders, ramping up wafer starts at its foundry partners in Ma...
Wednesday 24 May 2023
Quit the geopolitical conspiracy theory on Oppo's chip design flop
Chinese smartphone maker Oppo disbanded its chip design house Zeku in May, stimulating commentary on Zeku being the latest victim of the US-China chip war among the media in China...
Wednesday 24 May 2023
Marvell to set up semiconductor design center in Vietnam
Marvell Technology has announced plans to establish a world-class design center in Ho Chi Minh City. The facility will house advanced semiconductor engineering and will be a top technology...
Wednesday 24 May 2023
Re-engage and regain competitiveness: Q&A with Intel CEO Pat Gelsinger
Intel CEO Pat Gelsinger is in Taiwan for the Intel Vision event, which is aimed at high-level executives and managers from customers and ecosystem partners. In a Q&A with the...
Wednesday 24 May 2023
Vietnam could be the next IC design hub
Boasting favorable government policies, lower overall labor costs, burgeoning local semiconductor actors such as Viettel, Vingroup, and FPT, Vietnam is garnering more than mere attention...
Tuesday 23 May 2023
IC design houses see no demand momentum until 2024
Most IC design houses are generally uncertain about the prospects for the second half of 2023, as many end-market brand vendors and channel operators of consumer electronics products...
Monday 22 May 2023
Talent pool of Oppo's disbanded IC design arm attractive to Chinese peers
Since Oppo IC design arm Zeku Technology was disbanded on May 12, its huge talent pool has immediately become a hot target for midrange and high-end talent sought by Chinese IC design...
Friday 19 May 2023
Driver IC demand for EPD apps unlikely to pick up until end-2023
Driver IC demand for electrophoretic display (EPD) and electronic shelf labels (ESL) applications is unlikely to pick up until the end of this year, according to sources at IC design...
Friday 19 May 2023
Chipmakers see replenishment demand for gaming devices
Although most Taiwan-based IC design houses are conservative about their business prospects for the second half of 2023, they have landed rush chip orders for gaming device applications,...
Thursday 18 May 2023
IC design houses may see flat performance for peak season this year
Most IC design houses and even the entire semiconductor supply chain previously expected business performances to improve quarter by quarter after hitting the bottom in first-quarter...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.