News tagged design at DIGITIMES

NEWS TAGGED DESIGN

Monday 7 September 2026

China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D

China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.

Monday 7 September 2026

Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law

Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...

Monday 7 September 2026

SiliconAuto pushes AI chiplets as automotive SoC ties tighten

Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...

Sunday 6 September 2026

Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market

I-Chiun Precision Industry and Taiwan's Industrial Technology Research Institute (ITRI) have established Huizhi Advanced, the country's first startup focused on AI chip thermal design,...

Saturday 5 September 2026

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...

Saturday 5 September 2026

Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026

Fusion energy, often referred to as an artificial sun, has become a central focus of global sustainable energy development in recent years. However, despite nearly 70 years of worldwide...

Saturday 5 September 2026

Taiwan satellite ground equipment output grows 13%, nears NT$300B

Taiwan's satellite ground equipment industry posted 13% year-over-year growth in 2025 as local firms push deeper into the low-Earth...

Friday 4 September 2026

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...

Friday 4 September 2026

How agentic AI and 'AI physics' are reshaping chip design

As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...

Friday 4 September 2026

Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains

As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...

Friday 4 September 2026

Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab

The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...

Friday 4 September 2026

Acer unveils IFA lineup with AI, slim notebooks, sustainability

Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...

Thursday 3 September 2026

CHPT spans wafer to system-level testing

Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...

Thursday 3 September 2026

CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

Thursday 3 September 2026

UniVista expands China EDA stack with AI agents, native 3DIC tools

Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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