South Korea and the United States are at odds over which reactor design to build — and who runs the project — in the nuclear power component of Seoul's US investment package,...
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
Kaynes Technology India and BOSGAME have signed a strategic memorandum of understanding to support BOSGAME's entry and expansion in India. The deal highlights how global hardware brands...
As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
