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    Google and Meta help drive AI glasses shipments to 17.5 million units in 2026
    8h 41min ago
    SK may pause SK Siltron sale as AI strategy gains priority over financial restructuring
    8h 41min ago
    AI cooling demand keeps booming, lifting suppliers’ outlook through 2029
    8h 41min ago
    Nvidia, Infineon and GIGABYTE back supply chain cooperation to ease AI power bottlenecks
    9h 0min ago
    Micron, Samsung and SK Hynix join Anthropic in a supply chain shift
    9h 0min ago
    Pegatron expands physical AI push with Nvidia partnership and second-gen robot dog
    9h 1min ago
    NEWS TAGGED DESIGN
    Tuesday 2 June 2026
    Chenbro debuts its comprehensive rack solutions for AI at COMPUTEX

    Leading server chassis manufacturer Chenbro makes a formidable appearance at COMPUTEX 2026 (June 2 to June 5). This year, Chenbro's exhibition flow is strategically designed...

    Tuesday 2 June 2026
    PEGATRON Showcases AI Tech Maker Strategy at COMPUTEX 2026

    PEGATRON Corporation ("PEGATRON") returns to COMPUTEX 2026 in Taipei for the second consecutive year. As a Tech Maker, the company integrates R&D, design, and manufacturing...

    Tuesday 2 June 2026
    Power Integrations unveils 1700V GaN auxiliary PSU for AI data centers
    Power Integrations (PI) has announced two ultra-thin, compact auxiliary power supply (PSU) reference designs built for 800VDC AI data centers. PI principal training engineer Jason...
    Tuesday 2 June 2026
    Zhen Ding joins Nvidia MGX ecosystem to supply cable-free PCB technology for AI factories
    PCB manufacturer Zhen Ding announced it had joined Nvidia's MGX ecosystem to support the deployment of the chipmaker's third-generation MGX modular architecture, which uses a PCB-based...
    Tuesday 2 June 2026
    Broadcom, Samsung launch Wi-Fi 8, 5G platform to bring fiber-grade FWA to mass market
    Broadcom and Samsung Electronics have announced a broadband-optimized reference platform for the global fixed wireless access (FWA) market, integrating Broadcom's BCM6776 Wi-Fi 8 system-on-chip...
    Tuesday 2 June 2026
    India's chip startups move from design to pilot production, raising stakes for local semiconductor push
    India's emerging semiconductor startups are entering a crucial phase as companies such as Netrasemi, Mindgrove Technologies, and Agnit Semiconductors move from research into customer...
    Tuesday 2 June 2026
    Huawei's Tau Law faces its hardest test: chip yield, not theory
    Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions...
    Monday 1 June 2026
    Delta Electronics sees AI data center power shift and manufacturing overhaul shaping future competition
    Delta Electronics president and COO Simon Chang said the company's long investment cycle in power technology is positioning it for rising AI data center demand and a broader manufacturing...
    Monday 1 June 2026
    Asus ready to compete as Apple expands into budget laptop market
    Asustek Computer (Asus) chairman Jonney Shih outlined the company's artificial intelligence (AI) strategy roadmap and also commented on whether Apple's entry-level MacBook Neo could...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Saturday 30 May 2026
    E Ink to unveil color e-paper platforms and large-format signage at Computex 2026
    E Ink Holdings said it will showcase multiple color e-paper technologies and complete solutions at Computex 2026, presenting products aimed at outdoor and indoor advertising, smart...
    Saturday 30 May 2026
    Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
    India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
    Saturday 30 May 2026
    Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
    SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
    Friday 29 May 2026
    Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity
    Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge...
    Friday 29 May 2026
    From cloud to factory floor: KETI outlines four directions shaping next-gen physical AI chips
    As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook