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Wednesday 7 October 2026
Low-cost terahertz SoC takes shape as Taiwan advances next-generation communications
As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become...
Wednesday 7 October 2026
Hua Yang, Zeiss launch COSMA-M for chip metrology
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
Tuesday 6 October 2026
ITRI sees hardware, AI, sensing drive quadruped robot rollout
As AI advances rapidly, the robotics industry is evolving from traditional automation equipment into a productivity tool for every industry, Taiwan's Industrial Technology Research...
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Thursday 1 October 2026
MG Taiwan details recall after MG ZS scores zero stars in TNCAP test
The Taiwan New Car Assessment Program (TNCAP) on September 30 released its third-quarter ratings, publishing the MG ZS assessment under its second-edition protocol, which gave the...
Thursday 1 October 2026
GPS-free indoor drones target high-rack inspection as smart warehouses expand
The drone market is expanding beyond military applications as commercial demand gains momentum. Following the rollout of drone logistics services for Taiwan's outlying islands, industry...
Wednesday 30 September 2026
CATL starts cell trial production at Hungary plant
Contemporary Amperex Technology Ltd. (CATL) said its new battery plant in Debrecen, Hungary, began cell trial production on September 22, with the first two cell production lines entering...
Tuesday 29 September 2026
Taiwan breaks ground on aerospace and drone hub, targeting 2028 completion
Taiwan's National Chung-Shan Institute of Science and Technology (NCSIST) broke ground on the Minxiong Aerospace and Drone Industrial Park on September 28, aiming to provide critical...
Wednesday 23 September 2026
Taiwan uses AI to close drone thermal imaging gap
As drones, smart vehicles, and autonomous platforms advance, the ability to accurately identify people, vehicles and heat sources in darkness and low-visibility conditions has become...
Tuesday 22 September 2026
AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities

Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance...

Saturday 12 September 2026
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Friday 11 September 2026
ASE to buy AOI, AVI equipment from Machvision for NT$334M
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
Friday 11 September 2026
Innolux factory shift could reshape InnoCare's supply chain and growth mix
InnoCare Optoelectronics is preparing for a major supply-chain adjustment as Innolux Corporation restructures its factories, with the parent company's second plant scheduled to close...
Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...