News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Tuesday 1 September 2026

SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...

Tuesday 1 September 2026

Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race

China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...

Tuesday 1 September 2026

Samsung locks 70% of memory output as HBM spot prices soar

Samsung Electronics has reportedly locked up as much as 70% of its memory production capacity under long-term supply agreements (LTAs), as relentless AI infrastructure demand for high...

Tuesday 1 September 2026

Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale

China's leading DRAM maker CXMT has reportedly begun small-volume production of HBM3E, a step that could ease one of the most important hardware constraints on China's domestic AI...

Tuesday 1 September 2026

Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 1 September 2026

Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion

As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...

Tuesday 1 September 2026

Samsung weighs HBM4 bonuses as memory, foundry teams align

Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...

Tuesday 1 September 2026

Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push

Samsung Electronics is reportedly developing an 8-layer version of seventh-generation high-bandwidth memory for Nvidia, matching the chipmaker's requirements for its customized NVHBM...

Tuesday 1 September 2026

SK Hynix explores Intel as second source for HBM base dies

SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...

Monday 31 August 2026

Nvidia demand nearly doubles as supply meets only 70%

Nvidia reported second-quarter revenue for fiscal year 2027 of US$96.22 billion, a 106% year-over-year increase, driven by a 117% surge in data center revenue to US$89 billion. With...

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Monday 31 August 2026

Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff

Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...

Saturday 29 August 2026

Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?

As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...

Saturday 29 August 2026

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

The AI infrastructure race has spent the past few years fixated on high-bandwidth memory as one of the most indispensable building blocks of accelerated compute. Yet as model sizes,...

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Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

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