Huawei continues its relentless journey towards chip self-sufficiency, showcasing signs of China's further advancements in advanced manufacturing processes.
SK Hynix has announced plans to expand production capacity for next-generation DRAM, including HBM, a critical component of AI infrastructure. This decision is in response to the...
The continuous surge in generative AI applications is driving strong demand for High Bandwidth Memory (HBM), significantly benefiting Japanese suppliers of materials and equipment...
Supreme Electronics, an IC distributor specializing in memory chips, is targeting the Indian and Southeast Asian markets for electric scooter demand opportunities.
Nvidia is arguably the biggest "beneficiary" of Artificial Intelligence (AI) so far, but the recent 10% plunge in Nvidia's stock price and the evaporation of its market capitalization...
American memory chip giant Micron Technology, which has not built a new fab in the US for 20 years, is expected to step up its construction of new manufacturing facilities in New...
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation...
Samsung Electronics' top executives, led by co-CEO Kyung Kye-Hyun, recently visited Taiwan to meet with local suppliers such as Silicon Motion Technology, a major manufacturer of...
Kye Hyun Kyung, head of Samsung Electronics Device Solutions (DS) division, has visited Quanta Cloud Technology (QCT) during his stay in Taiwan, with his itinerary reportedly covering...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
In recent years, due to the development of the High Bandwidth Memory (HBM) market, the thermal compression (TC) bonder equipment produced by Hanmi Semiconductor has attracted attention...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
