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Sunday 26 April 2026
Samsung, Kingston reportedly lift SSD prices by over 10% as supply tightens

Samsung Electronics and Kingston Technology have reportedly notified distributors of price increases of more than 10% across their solid-state...

Sunday 26 April 2026
Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
Friday 24 April 2026
SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting...

Friday 24 April 2026
DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron
SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that...
Thursday 23 April 2026
SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected...

Thursday 23 April 2026
SK Hynix dismisses peak fears, points to structural memory upcycle

SK Hynix said the current strength in memory pricing reflects structural changes in demand, pushing back against concerns that recent...

Thursday 23 April 2026
SK Hynix flags persistent HBM shortage as demand outpaces supply
SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps...
Thursday 23 April 2026
Qualcomm mulls return to Samsung's 2nm as TSMC targets its LPU market
Global semiconductor leaders are accelerating the restructuring of their supply chains. Qualcomm CEO Cristiano Amon recently made a quiet, low-profile visit to South Korea, signaling...
Thursday 23 April 2026
Google debuts TPU 8t and 8i as AI workloads diverge
Google Cloud Next 2026 kicked off on April 22 in Las Vegas, with Google Cloud CEO Thomas Kurian declaring that the experimental phase of artificial intelligence is over. Nearly 75%...
Thursday 23 April 2026
SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication...
Thursday 23 April 2026
SK Hynix hits 72% operating margin in Q1, doubling profit quarter-on-quarter
SK Hynix reported its strongest quarterly results on record in the first quarter of 2026, with revenue of 52.58 trillion won (approximately US$37.9 billion), operating profit of 37.61...
Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product...
Tuesday 21 April 2026
ASML's memory revenue tops logic in 1Q26, AI-fueled HBM demand surges
ASML revealed during its first quarter 2026 earnings call that revenue from memory systems has, for the first time, exceeded that of logic chips. Against a backdrop of sustained AI...
Tuesday 21 April 2026
Samsung's HBM4 yield improves, 4nm PMBIST upgrade receives praise from Nvidia
Samsung Electronics is accelerating its catch-up in the high-bandwidth memory (HBM) market against leader SK Hynix by advancing its sixth-generation HBM4. A key factor is Samsung's...
Friday 17 April 2026
OpenAI's HBM push signals a new AI memory arms race
A recent report by South Korea's Chosun Biz highlights how OpenAI is actively building a dedicated supply line with Samsung Electronics to secure high-bandwidth memory (HBM)...