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    Middle East conflict disrupts auto supply chains, triming low-end models
    7h 9min ago
    China achieves mass production of T1200-grade carbon fiber, advancing semiconductor and robotics materials
    7h 9min ago
    Memory price surge reshaped PC market, hitting Chromebook hardest amid AI boom
    7h 9min ago
    Middle East turmoil impacts South Korean exports and semiconductor supply chain
    7h 9min ago
    US section 337 investigation puts Taiwanese auto parts suppliers on the spot
    7h 9min ago
    Exclusive: Middle East conflict and AI demand drive cost pressures, supply chain shifts procurement risks to clients
    7h 9min ago
    NEWS TAGGED HBM
    Thursday 12 March 2026
    AMD CEO Lisa Su reportedly plans South Korea trip for Samsung, Naver talks during Nvidia GTC

    Reports indicate AMD CEO Lisa Su will visit South Korea in the coming days to discuss cooperation with Samsung Electronics and Naver. Some...

    Wednesday 11 March 2026
    Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
    Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...
    Wednesday 11 March 2026
    Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

    Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for...

    Tuesday 10 March 2026
    Samsung union plans 18-day strike, adding risk to HBM supply chain
    Samsung Electronics' labor union recently announced that employees who do not participate in a planned 18-day general strike from May 21 to June 7, 2026, will face penalties, sparking...
    Monday 9 March 2026
    Industry mulls thicker HBM standards for 20-layer stacks
    Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
    Friday 6 March 2026
    Samsung reports faster-than-expected 2nm yield gains, aims to triple HBM revenue
    Samsung Electronics announced that its 2nm process yield is improving faster than expected, signaling strong progress in semiconductor manufacturing. The company also revealed plans...
    Thursday 5 March 2026
    Persistent DRAM shortage to push prices and capacity investments higher, Nanya says
    DRAM supply-demand tightness and rapid AI-driven demand expansion will drive contract prices up and prompt sustained capacity investment, Nanya Technology (NTC) president Pei-Ing Lee...
    Thursday 5 March 2026
    TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
    TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
    Thursday 5 March 2026
    Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
    Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
    Wednesday 4 March 2026
    Samsung expands AI chip push with Pyeongtaek P5 and Texas foundry ramp

    Samsung Electronics is accelerating the expansion of its Pyeongtaek semiconductor campus in South Korea, aiming to establish the site...

    Tuesday 3 March 2026
    Samsung, SK Hynix expand hiring as HBM, DRAM demand enters supercycle

    With the semiconductor industry entering a supercycle and reporting record earnings, Samsung Electronics and SK Hynix are preparing to launch...

    Tuesday 3 March 2026
    DRAM prices to surge up to 70% in 2Q26; Nvidia GTC 2026 ignites AI memory rally
    AI-driven data centre expansion has pushed the memory market beyond traditional supply-demand cycles, creating a structural shortage that continues to deepen. Industry sources say...
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Thursday 26 February 2026
    SK Hynix and Sandisk move to standardize HBF, shaking up AI memory ecosystem
    SK Hynix and Sandisk have launched a consortium to standardize High Bandwidth Flash (HBF), positioning the technology as a next-generation memory layer for AI inference and heightening...
    Thursday 26 February 2026
    SK hynix, Sandisk Begin Global Standardization of HBF

    Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event...

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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook