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NEWS TAGGED HBM
Monday 23 March 2026
Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements,...

Monday 23 March 2026
Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Friday 20 March 2026
Global top-3 memory maker status, 1Q26

Introduction

Friday 20 March 2026
Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
Friday 20 March 2026
Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
Friday 20 March 2026
AI tailwinds and global reach put Topco on track for double-digit growth in 2026
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
Friday 20 March 2026
Intel pushes large-area AI packaging to close foundry gap
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
Thursday 19 March 2026
The HBM paradox: why Taipei and Seoul can't afford a diplomatic cold war
A diplomatic dispute over administrative nomenclature has escalated into a high-stakes standoff between Taiwan and South Korea, threatening to cast a shadow over one of the world's...
Thursday 19 March 2026
SK Hynix presses ahead on HBM4 despite tightening AI memory supply
SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...
Tuesday 17 March 2026
Memory wafer shortage to persist until 2030; SK Group chairman says collaboration with Taiwanese firms is foundation of ecosystem
Addressing the current surge in demand for high-bandwidth memory (HBM) driven by AI-accelerated computing, SK Group chairman Chey Tae-Won stated at Nvidia GTC 2026 on March 16, 2026,...
Tuesday 17 March 2026
HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...
Tuesday 17 March 2026
Samsung cautious on memory expansion amid concerns over 2028 supply glut
Samsung Electronics' semiconductor division is concerned that the current memory supercycle, driven by supply shortages, could last only one to two years before the market turns downward...
Tuesday 17 March 2026
Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...