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    Motorola launches Razr fold in Taiwan as foldable market gains momentum
    1min ago
    Taiwan smartphone shipments fell nearly 4% in April as component costs push prices higher
    8min ago
    Column: Quantum-classical computing's promise meets its hardware limits
    11min ago
    Covestro highlights material solutions for AI data centers and embodied intelligence at COMPUTEX 2026
    11min ago
    Xiaomi outlines AI-first roadmap as MiMo tokens and Miclaw shape product strategy
    17min ago
    Aixtron wins orders from Lumentum for G10-AsP systems to expand InP production
    29min ago
    Acer sees CPU shortages worse than memory as 2H24 PC market weakens
    May 26, 18:10
    Grab bets on agentic AI to reshape Taiwan's food delivery market with foodpanda acquisition
    May 26, 18:10
    Huawei’sTau Law breath new air into China's advanced packaging
    May 26, 17:50
    Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
    May 26, 17:50
    CSP capex surge fuels hot AI server demand and tight supply in 2026
    May 26, 17:50
    Google and Blackstone form AI cloud venture to commercialize TPU capacity
    May 26, 17:50
    Taiwan's SAS breaks out of China's low-price solar trap with space, drone, and marine applications
    May 26, 17:50
    Intel 18A yield gains raise pressure on Samsung foundry
    May 26, 17:50
    NEWS TAGGED HBM
    Wednesday 27 May 2026
    SK Hynix seeks to embed cooling inside HBM to beat the heat
    SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
    Tuesday 26 May 2026
    Samsung's P4 HBM push could worsen DRAM crunch in 2027

    Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

    Tuesday 26 May 2026
    Intel's Rio Rancho fab becomes test case for AI-era chip packaging
    Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...
    Tuesday 26 May 2026
    SK hynix unveils 'iHBM' thermal solution to boost AI performance

    SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs) within the high-bandwidth...

    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Monday 25 May 2026
    Samsung Electro-Mechanics secures large silicon capacitor supply contract
    Samsung Electro-Mechanics (Semco)'s KRW1.5 trillion (approx. US$990 million) silicon capacitor supply contract with a major global company could reshape component supply for AI servers,...
    Saturday 23 May 2026
    SK Hynix weighs opening Seoul office at SK Group headquarters

    SK Hynix is reportedly considering opening a Seoul office and sales operation inside SK Group's Seorin Building in Jongno, Seoul, a symbolic...

    Thursday 21 May 2026
    AI chip boom strains ABF substrate supply chain
    AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...
    Thursday 21 May 2026
    SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push
    SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...
    Monday 18 May 2026
    Samsung reportedly boosts 1b DRAM yields as Korean memory rivalry heats up
    Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying...
    Monday 18 May 2026
    TSMC CoWoS yields top 98% as capacity expands
    Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
    Sunday 17 May 2026
    Taiwan chipmakers quietly fill gaps left by Korea's HBM push
    Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
    Thursday 14 May 2026
    TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'
    Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior...
    Thursday 14 May 2026
    Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
    Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...
    Thursday 14 May 2026
    Samsung and SK Hynix rush to expand capacity as AI memory demand soars
    The artificial intelligence(AI) boom is triggering an unprecedented expansion race among the world's largest memory chipmakers.
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    AsiaCPO
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook