News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Thursday 19 March 2026

The HBM paradox: why Taipei and Seoul can't afford a diplomatic cold war

A diplomatic dispute over administrative nomenclature has escalated into a high-stakes standoff between Taiwan and South Korea, threatening to cast a shadow over one of the world's...

Thursday 19 March 2026

SK Hynix presses ahead on HBM4 despite tightening AI memory supply

SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...

Tuesday 17 March 2026

Memory wafer shortage to persist until 2030; SK Group chairman says collaboration with Taiwanese firms is foundation of ecosystem

Addressing the current surge in demand for high-bandwidth memory (HBM) driven by AI-accelerated computing, SK Group chairman Chey Tae-Won stated at Nvidia GTC 2026 on March 16, 2026,...

Tuesday 17 March 2026

HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy

The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...

Tuesday 17 March 2026

Samsung cautious on memory expansion amid concerns over 2028 supply glut

Samsung Electronics' semiconductor division is concerned that the current memory supercycle, driven by supply shortages, could last only one to two years before the market turns downward...

Tuesday 17 March 2026

Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms

At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...

Tuesday 17 March 2026

Taiwan's exports to US hit record highs as FedEx and UPS expand cargo hubs

Driven by growing demand for AI servers and high-performance computing (HPC) applications, Taiwan's exports to the US surged 83% in the first two months of 2026, marking a strong performance...

Monday 16 March 2026

DRAM prices surge 180% as HBM competition shifts to profitability

DRAM and NAND flash prices have soared by as much as 180% since the Lunar New Year, amid worsening memory chip supply shortages that are expected to persist at least until late 2027...

Saturday 14 March 2026

DRAM maker Nanya's custom AI memory gains traction with 10+ clients

AI-driven demand for high-bandwidth memory (HBM) is pushing Taiwanese memory suppliers toward lower-power, high-bandwidth alternatives. Nanya Technology Corp. (NTC) said its Ultra...

Friday 13 March 2026

Samsung targets 2nm process for HBM4E base die to boost AI chip edge

Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...

Thursday 12 March 2026

AMD CEO Lisa Su reportedly plans South Korea trip for Samsung, Naver talks during Nvidia GTC

Reports indicate AMD CEO Lisa Su will visit South Korea in the coming days to discuss cooperation with Samsung Electronics and Naver. Some...

Wednesday 11 March 2026

Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says

Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...

Wednesday 11 March 2026

Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for...

Tuesday 10 March 2026

Samsung union plans 18-day strike, adding risk to HBM supply chain

Samsung Electronics' labor union recently announced that employees who do not participate in a planned 18-day general strike from May 21 to June 7, 2026, will face penalties, sparking...

Monday 9 March 2026

Industry mulls thicker HBM standards for 20-layer stacks

Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...

1/60 pages

BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

MOST-READ
7 DAYS NEWS

Full list

RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook