中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    China moves to rein in booming energy storage and lithium battery overcapacity
    3h 6min ago
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    3h 6min ago
    Apple's iPhone Duo may lift foldables, but Taiwanese suppliers seek new growth
    3h 6min ago
    How Huawei, Xiaomi and Apple diverge in foldable phones
    3h 6min ago
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    3h 6min ago
    NEWS TAGGED HBM
    Thursday 10 September 2026
    From cHBM to 3D Stacked SRAM, AI inference drives AI accelerators toward memory architecture innovation

    Introduction

    Thursday 10 September 2026
    China's Nvidia rivals raise prices as HBM shortage bites
    Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom
    As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers Technology, which maintains a strategic partnership with...
    Tuesday 8 September 2026
    US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans
    South Korea and the US are discussing semiconductor investments in the US as part of broader bilateral negotiations, bringing US chip tariff policy closer to the investment decisions...
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Tuesday 8 September 2026
    ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows
    After several years away from SEMICON Taiwan, Malaysia-based inspection equipment maker ViTrox returned to the show this year and has already confirmed plans to exhibit again next...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
    SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
    Monday 7 September 2026
    Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
    AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
    Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
    Friday 4 September 2026
    AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

    The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

    1/40 pages
    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Semicon_TW