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NEWS TAGGED HBM
Tuesday 14 July 2026
Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Monday 13 July 2026
SK Hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
SK Hynix reportedly starts Nvidia HBM4 shipments ahead of September ramp

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...
Friday 10 July 2026
HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Thursday 9 July 2026
CXMT seeks US$4.1bn in China's biggest 2026 IPO for DDR5, HBM

CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade...

Thursday 9 July 2026
CXMT IPO leaves HBM off the funding list, tempering China AI memory hype

CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into...

Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
Samsung, SK Hynix rethink hybrid bonding timeline for next-gen HBM

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...