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    NEWS TAGGED HBM
    Friday 2 October 2026
    Micron ramps up HBM capacity at Taiwan's four major sites
    Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than...
    Friday 2 October 2026
    Micron expands global fabs, calls on Taiwanese suppliers to go overseas
    AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India...
    Friday 2 October 2026
    Micron eyes NVHBM profits with TSMC custom HBM push
    Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
    Thursday 1 October 2026
    Charts: Micron earns its best margins from PCs, phones, not AI
    Micron's best margins aren't coming from AI data centers. They come from PCs and smartphones, markets where Micron warns that unit sales could fall.
    Thursday 1 October 2026
    Micron hikes 2027 HBM prices after missing 2026 memory surge on fixed contracts
    Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract...
    Thursday 1 October 2026
    Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
    Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
    Thursday 1 October 2026
    Micron's record quarter rests on pricing power as customers lock in 2027 supply
    Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure...
    Thursday 1 October 2026
    Samsung Foundry gets boost from HBM4 as 2nm push continues
    Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
    Wednesday 30 September 2026
    Netlist challenges Micron, Nvidia, Broadcom, Google over alleged HBM patent use
    Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory...
    Wednesday 30 September 2026
    Column: Memory and logic collide as AI shifts the balance
    As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
    Wednesday 30 September 2026
    Commentary: What risks does China's DRAM capacity face amid tightening market?
    China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
    Tuesday 29 September 2026
    CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
    China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

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    Research_DB
    BIZ FOCUS
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    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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