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NEWS TAGGED HBM
Tuesday 10 December 2024
SK Hynix restructures CIS organization seemingly to replicate HBM success model
Despite the low profitability of SK Hynix's CMOS image sensor (CIS) business, the company has decided to retain this segment and reorganize its CIS development team under the Future...
Tuesday 10 December 2024
Japanese intervention reportedly keeps China's CXMT off US entity list
Japan reportedly played a crucial role in keeping Chinese memory maker ChangXin Memory Technologies (CXMT) off the recently updated US Entity List, according to sources from China's...
Monday 9 December 2024
SK Hynix restructures organization, appoints new CDO to strengthen AI memory leadership
SK Hynix has announced a major organizational restructuring and executive appointments, highlighted by the creation of a new chief development officer (CDO) position to oversee DRAM...
Friday 6 December 2024
South Korea downplays the impact of US' HBM export control
The South Korean government has assured that the Biden administration's latest semiconductor control measures against China, including restrictions on high bandwidth memory (HBM)...
Wednesday 4 December 2024
China to accelerate HBM self-sufficiency leaving DDR5 with turbulence
The latest wave of export restrictions from the US on High Bandwidth Memory (HBM), particularly targeting advanced technologies such as HBM2 and above, is set to compel China's memory...
Wednesday 4 December 2024
Why CXMT escapes new series of US sanctions
The new US export restrictions on China do not include ChangXin Memory Technologies (CXMT), which has sparked discussions among industry observers regarding how the key Chinese memory...
Wednesday 4 December 2024
Samsung and SK Hynix collaborate to promote LPDDR6-PIM standardization
Samsung Electronics and SK Hynix, while competing in memory development for artificial intelligence (AI), have agreed to collaborate on accelerating technology standardization.
Tuesday 3 December 2024
Chinese foundries, memory firms face US export curbs
The upcoming US ban targets the Chinese semiconductor industry in what is expected to be the third significant crackdown in three years. However, the number of companies affected...
Tuesday 3 December 2024
Biden's final chip salvo hits China: TSMC steady, UMC-VIS gain
The US government is preparing to expand restrictions on semiconductor equipment and related chip sales to China, particularly targeting AI and High Bandwidth Memory (HBM) products...
Friday 29 November 2024
China's semiconductor industry makes significant strides, putting pressure on South Korean firms
China's largest foundry operator, SMIC, surpassed the US$2 billion revenue mark for the first time in the third quarter of 2024. Meanwhile, companies like CXMT and JHICC are aggressively...
Friday 29 November 2024
Micron targets Samsung's home turf with 'on-the-spot hiring' to attract talent
Micron has intensified its recruitment efforts in South Korea, targeting university campuses with "on-the-spot hiring" initiatives. Previously focused on hiring experienced engineers...
Wednesday 27 November 2024
Samsung's challenges mount: Nvidia Jensen Huang urge HBM3E swift approval
Nvidia is currently conducting high bandwidth memory (HBM) verification tests with Samsung Electronics (Samsung), with industry attention focused on the validation timeline and potential...
Wednesday 27 November 2024
US sanctions threaten to snuff out China's nascent HBM development
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
Wednesday 27 November 2024
US ban expansion may stifle China's AI chip ambitions
Market speculation suggests that the US may impose stricter restrictions on China. On November 28, it is anticipated that 200 Chinese semiconductor companies will be added to a trade...
Wednesday 27 November 2024
Samsung, SK Hynix trim DRAM output while Chinese rivals expand
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
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