South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor,...
As Apple marks the 20th anniversary of the iPhone in 2025, the tech giant is preparing for sweeping technological upgrades to its flagship product—some of which may not fully...
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
The two major South Korean DRAM manufacturers are each preparing to discontinue their older DDR4 production lines. Following Samsung Electronics' early April announcement of its end-of-life...
A brewing conflict between SK Hynix and its long-time supplier, Hanmi Semiconductor, over thermal compression bonder (TC Bonder; TCB) equipment has intensified, potentially reshuffling...
Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and operating profit of KRW6.7 trillion. However, its Device...
Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
Taiwan's electronics manufacturing services (EMS) providers are accelerating their North American production plans in response to tariff threats, but component shortages and capacity...
Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders...
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...
