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NEWS TAGGED HBM
Monday 5 January 2026
Samsung reportedly pitches bundled solutions to Google and AMD
As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
Monday 5 January 2026
ITC launches formal investigation into Samsung and Google over Netlist patent dispute
The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Saturday 3 January 2026
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
Friday 2 January 2026
Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Friday 2 January 2026
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...
Friday 2 January 2026
Samsung raises 2025 bonuses for DS division amid memory boom
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
Thursday 1 January 2026
Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...
Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
YMTC goes full speed toward HBF next
Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology...
Wednesday 31 December 2025
US ITC opens patent probe into advanced memory
The US International Trade Commission (ITC) has formally launched a Section 337 investigation into alleged patent infringement involving advanced memory products, naming Samsung Electronics,...
Monday 29 December 2025
SK Hynix weighs US expansion for advanced chip packaging
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...
Monday 29 December 2025
Nvidia reportedly sets 4Q26 target for 16-high HBM supply
Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South...
Monday 29 December 2025
Nvidia's Groq acquisition reshapes AI memory landscape
Nvidia has reportedly invested US$20 billion to acquire technology licenses from Groq, marking its largest investment to date. The move is drawing significant attention in South Korea...