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NEWS TAGGED HBM
Wednesday 19 November 2025
South Korea risks losing edge to China in all key exports by 2030, survey shows
South Korea's memory chip industry is enjoying its strongest upturn in years, with soaring demand for high-bandwidth memory and AI-related DRAM pushing inventories at Samsung Electronics...
Tuesday 18 November 2025
Samsung set to become Nvidia's leading HBM4 supplier as Micron stumbles
South Korea's KB Securities expects Samsung Electronics to capture as much as 40% of Nvidia's supply share for its next-generation HBM4 high-bandwidth memory by 2026, a shift that...
Tuesday 18 November 2025
Samsung, SK Hynix inventory drop signals AI memory supercycle
South Korea's top memory chip makers are entering what industry executives call a full-scale "supercycle," as Samsung Electronics and SK Hynix report steep inventory reductions through...
Tuesday 18 November 2025
Samsung revives P5 fab construction for memory supercycle
Samsung's P5 plant at the second campus in Pyeongtaek, South Korea, will begin construction, with operations expected to start in 2028. Due to the weak memory market, P5 was previously...
Saturday 15 November 2025
Memory panic buying grips tech industry as shortage extends to 2027
The memory buying surge escalated into the fourth quarter of 2025, sparking panic purchases across the supply chain. According to market sources, brands and system vendors such as...
Friday 14 November 2025
SK Hynix reportedly to order HBM4 equipment, accelerate mass production
SK Hynix is reportedly set to begin ordering equipment for its 12-layer sixth-generation high-bandwidth memory (HBM4) as early as November 2025. Considering the construction schedule...
Friday 14 November 2025
HBM's breakneck rise is draining DRAM supply, repricing the smartphone sector
The global AI boom is driving up smartphone and tablet production costs, as memory suppliers divert more capacity toward high-bandwidth memory (HBM) for AI accelerators. Samsung Electronics...
Friday 14 November 2025
Samsung expected to dominate HBM4 market as prices snap back
Samsung Electronics is poised for a commanding performance in the advanced memory sector, with analysts forecasting the tech giant could seize 40 percent of the lucrative HBM4 market...
Wednesday 12 November 2025
Samsung Pyeongtaek P4 shifts to 1c DRAM production
Samsung will continue investment in the Phase 4 production line at its Pyeongtaek campus, converting the facility from foundry to 1c DRAM production. The latest monthly capacity is...
Wednesday 12 November 2025
SK Hynix targets 70% DRAM profit margin amid supply crunch
The AI boom has caused memory giants to concentrate production on HBM, resulting in a shortage of general-purpose DRAM and high prices. According to Chosun Biz, DRAM prices...
Wednesday 12 November 2025
CXMT and Tesla's chip plans challenge South Korea's semiconductor lead
South Korea's semiconductor industry, boosted by AI-driven HBM memory demand, faces challenges as China's CXMT speeds up HBM3 production and Tesla plans to create its own wafer fab...
Wednesday 12 November 2025
SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance
SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...
Monday 10 November 2025
AI drives shift to memory-centric computing, redefining semiconductor supply chains
The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models...
Sunday 9 November 2025
SK Hynix pushes 1C DRAM for HBM4E as AI memory demand surges
South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4),...
Friday 7 November 2025
CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...