CONNECT WITH US
NEWS TAGGED HBM
Friday 27 March 2026
SK Hynix CEO expected to meet Microsoft executive on memory supply

SK Hynix CEO Kwak Noh-jung is expected to meet Scott Guthrie, executive vice president of Cloud and AI at Microsoft, in Seoul this week...

Friday 27 March 2026
SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence...

Friday 27 March 2026
Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment
AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...
Friday 27 March 2026
SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
Friday 27 March 2026
Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

Thursday 26 March 2026
Tescan Opens Korea Demo Lab for APAC Semiconductor and Academia

Tescan  announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo...

Wednesday 25 March 2026
Global semiconductor market rebounds in 2025 with AI-led expansion
According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above...
Wednesday 25 March 2026
SK Hynix sets sights on US ADR listing to strengthen capital base
SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production...
Wednesday 25 March 2026
SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin...
Tuesday 24 March 2026
Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee
Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...
Tuesday 24 March 2026
SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in...

Monday 23 March 2026
Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements,...

Monday 23 March 2026
Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...