The memory buying surge escalated into the fourth quarter of 2025, sparking panic purchases across the supply chain. According to market sources, brands and system vendors such as...
SK Hynix is reportedly set to begin ordering equipment for its 12-layer sixth-generation high-bandwidth memory (HBM4) as early as November 2025. Considering the construction schedule...
The global AI boom is driving up smartphone and tablet production costs, as memory suppliers divert more capacity toward high-bandwidth memory (HBM) for AI accelerators. Samsung Electronics...
Samsung Electronics is poised for a commanding performance in the advanced memory sector, with analysts forecasting the tech giant could seize 40 percent of the lucrative HBM4 market...
Samsung will continue investment in the Phase 4 production line at its Pyeongtaek campus, converting the facility from foundry to 1c DRAM production. The latest monthly capacity is...
The AI boom has caused memory giants to concentrate production on HBM, resulting in a shortage of general-purpose DRAM and high prices. According to Chosun Biz, DRAM prices...
South Korea's semiconductor industry, boosted by AI-driven HBM memory demand, faces challenges as China's CXMT speeds up HBM3 production and Tesla plans to create its own wafer fab...
SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...
The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models...
South Korea's two largest memory chipmakers, SK Hynix and Samsung Electronics, are reportedly finalizing supply agreements with Nvidia for next-generation high-bandwidth memory (HBM4),...
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...
SK Hynix has reportedly increased the price of its sixth-generation high-bandwidth memory (HBM4) supplied to Nvidia by over 50% compared to the previous generation HBM3E. Industry...
Nvidia's evaluation of sixth-generation high-bandwidth memory (HBM4) has sparked a fierce contest among suppliers. ETNews reports that the company plans to finish testing...
Micron Technology is reportedly redesigning its sixth-generation high-bandwidth memory (HBM4) after facing yield and performance issues, a setback that could push back supply until...
