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    China reportedly tells firms to pause Nvidia H200 orders to push domestic AI chips
    2min ago
    PentaPro Materials: the new entrant in TSMC's supply chain with NT$3 billion second plant expansion
    Jan 7, 20:09
    Why TSMC is giving old fabs billion-dollar makeovers
    Jan 7, 20:09
    BMW China leads 2026 EV price war with significant discounts
    Jan 7, 20:09
    DRAM prices surge spark speculative stockpiling as demand continue to rise
    Jan 7, 20:09
    China's energy storage price war threatens AI infrastructure safety
    Jan 7, 20:09
    Samsung dethroned: TCL seize CES spotlight
    Jan 7, 20:09
    NEWS TAGGED HBM
    Wednesday 7 January 2026
    Nvidia's Vera Rubin enters full production, igniting Micron's HBM4 capacity bet for 2026
    When Nvidia CEO Jensen Huang confirmed at CES 2026 that its next-generation AI processor, Vera Rubin, had entered full production, the message to the memory industry was immediate...
    Wednesday 7 January 2026
    Global top-3 memory maker status, 4Q25

    Introduction

    Wednesday 7 January 2026
    Nvidia CEO downplays memory supply concerns, highlights exclusive use of HBM4
    Nvidia CEO Jensen Huang addressed concerns regarding recent memory supply shortages during a press conference at CES 2026, stating that Nvidia will be the exclusive consumer of sixth-generation...
    Wednesday 7 January 2026
    Samsung speeds Pyeongtaek P5 fab toward 2028 output

    Samsung Electronics is accelerating construction of its P5 semiconductor line in Pyeongtaek, South Korea, as it moves toward a 2028 production...

    Tuesday 6 January 2026
    CES 2026: SK Hynix showcases next-gen AI memory solutions
    SK Hynix Inc. said it will showcase its next-generation AI memory solutions at CES 2026, where it plans to operate a customer exhibition booth at the Venetian Expo in Las Vegas from...
    Tuesday 6 January 2026
    Samsung to restart construction of Pyeongtaek P5 chip plant

    Samsung Electronics will resume structural construction at its Pyeongtaek P5 semiconductor plant next month. The company halted the project last...

    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026

    Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase...

    Tuesday 6 January 2026
    SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

    SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the...

    Monday 5 January 2026
    Samsung reportedly pitches bundled solutions to Google and AMD
    As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
    Monday 5 January 2026
    ITC launches formal investigation into Samsung and Google over Netlist patent dispute
    The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Saturday 3 January 2026
    Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
    Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
    Friday 2 January 2026
    Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
    Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
    Friday 2 January 2026
    Samsung aims for 2026 HBM4 mass production after customer validation
    Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
    Friday 2 January 2026
    Smartphones and notebook prices could increase as memory lead times extend
    Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...
    1/54 pages
    NTN special report
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    Special Report