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    Motorola and Google drove 28% growth in North American foldable smartphone shipments in 2025
    Mar 26, 18:32
    2AM's Lim Seul-ong highlights untapped AI potential in entertainment experience economy at AI Expo 2026
    Mar 26, 18:32
    Analysis: OpenAI shifts focus to compete with Anthropic; Gemini targets consumers with Apple's collaboration
    Mar 26, 18:32
    AI computing power to drive semiconductor revenues to US$1.8 trillion by 2030
    Mar 26, 18:12
    TSMC prioritizes 3nm capacity supply for cloud AI and loyal clients
    Mar 26, 18:09
    DIGITIMES chairman and Acer founder praise Taiwan's important role in AI industry
    Mar 26, 18:05
    NEWS TAGGED HBM
    Friday 27 March 2026
    Samsung and SK Hynix expand microscope procurement to boost HBM yield
    As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
    Friday 27 March 2026
    Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

    Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

    Thursday 26 March 2026
    Tescan Opens Korea Demo Lab for APAC Semiconductor and Academia

    Tescan  announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo...

    Wednesday 25 March 2026
    Global semiconductor market rebounds in 2025 with AI-led expansion
    According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above...
    Wednesday 25 March 2026
    SK Hynix sets sights on US ADR listing to strengthen capital base
    SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production...
    Wednesday 25 March 2026
    SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
    SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin...
    Tuesday 24 March 2026
    Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee
    Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...
    Tuesday 24 March 2026
    SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

    SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in...

    Monday 23 March 2026
    Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

    Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements,...

    Monday 23 March 2026
    Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
    Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
    Monday 23 March 2026
    SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
    SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
    Monday 23 March 2026
    At Cheonan, Samsung is rewriting HBM's bonding playbook
    Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
    Friday 20 March 2026
    Global top-3 memory maker status, 1Q 2026

    Introduction

    Friday 20 March 2026
    Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
    Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
    Friday 20 March 2026
    Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
    Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
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    New Power WorldWide 2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook