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NEWS TAGGED HBM
Friday 2 January 2026
Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Friday 2 January 2026
Smartphones and notebook prices could increase as memory lead times extend
Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and...
Friday 2 January 2026
Samsung raises 2025 bonuses for DS division amid memory boom
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
Thursday 1 January 2026
Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
The biggest recent news in AI chip development is Nvidia's non-exclusive technology licensing agreement with Groq. Nvidia invested US$20 billion to acquire Groq's technology license...
Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
YMTC goes full speed toward HBF next
Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology...
Wednesday 31 December 2025
US ITC opens patent probe into advanced memory
The US International Trade Commission (ITC) has formally launched a Section 337 investigation into alleged patent infringement involving advanced memory products, naming Samsung Electronics,...
Monday 29 December 2025
SK Hynix weighs US expansion for advanced chip packaging
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...
Monday 29 December 2025
Nvidia reportedly sets 4Q26 target for 16-high HBM supply
Nvidia has reportedly asked memory suppliers to prepare for the delivery of 16-high high-bandwidth memory by the second half of 2026, according to industry sources cited by South...
Monday 29 December 2025
Nvidia's Groq acquisition reshapes AI memory landscape
Nvidia has reportedly invested US$20 billion to acquire technology licenses from Groq, marking its largest investment to date. The move is drawing significant attention in South Korea...
Friday 26 December 2025
Huawei details Ascend AI chip roadmap built around in-house HBM, massive clusters
Huawei is clarifying how it intends to compete in global AI computing despite being cut off from leading-edge foundries and US-origin GPUs. Instead of chasing rivals on single-chip...
Friday 26 December 2025
Samsung, SK Hynix reportedly accelerate HBM4 production to early 2026
Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...
Friday 26 December 2025
SK Hynix targets February HBM4 ramp-up with TSMC, ships final samples to Nvidia
SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February...
Friday 26 December 2025
Google reportedly fires procurement execs amid HBM supply crunch
Google and Microsoft are stepping up efforts to secure high-bandwidth memory. Production capacity at South Korean chipmakers is approaching its limits. The supply crunch has coincided...