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NEWS TAGGED HBM
Tuesday 17 March 2026
Taiwan's exports to US hit record highs as FedEx and UPS expand cargo hubs
Driven by growing demand for AI servers and high-performance computing (HPC) applications, Taiwan's exports to the US surged 83% in the first two months of 2026, marking a strong performance...
Monday 16 March 2026
DRAM prices surge 180% as HBM competition shifts to profitability
DRAM and NAND flash prices have soared by as much as 180% since the Lunar New Year, amid worsening memory chip supply shortages that are expected to persist at least until late 2027...
Saturday 14 March 2026
DRAM maker Nanya's custom AI memory gains traction with 10+ clients
AI-driven demand for high-bandwidth memory (HBM) is pushing Taiwanese memory suppliers toward lower-power, high-bandwidth alternatives. Nanya Technology Corp. (NTC) said its Ultra...
Friday 13 March 2026
Samsung targets 2nm process for HBM4E base die to boost AI chip edge
Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
Thursday 12 March 2026
AMD CEO Lisa Su reportedly plans South Korea trip for Samsung, Naver talks during Nvidia GTC

Reports indicate AMD CEO Lisa Su will visit South Korea in the coming days to discuss cooperation with Samsung Electronics and Naver. Some...

Wednesday 11 March 2026
Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...
Wednesday 11 March 2026
Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for...

Tuesday 10 March 2026
Samsung union plans 18-day strike, adding risk to HBM supply chain
Samsung Electronics' labor union recently announced that employees who do not participate in a planned 18-day general strike from May 21 to June 7, 2026, will face penalties, sparking...
Monday 9 March 2026
Industry mulls thicker HBM standards for 20-layer stacks
Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
Friday 6 March 2026
Samsung reports faster-than-expected 2nm yield gains, aims to triple HBM revenue
Samsung Electronics announced that its 2nm process yield is improving faster than expected, signaling strong progress in semiconductor manufacturing. The company also revealed plans...
Thursday 5 March 2026
Persistent DRAM shortage to push prices and capacity investments higher, Nanya says
DRAM supply-demand tightness and rapid AI-driven demand expansion will drive contract prices up and prompt sustained capacity investment, Nanya Technology (NTC) president Pei-Ing Lee...
Thursday 5 March 2026
TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
Thursday 5 March 2026
Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
Wednesday 4 March 2026
Samsung expands AI chip push with Pyeongtaek P5 and Texas foundry ramp

Samsung Electronics is accelerating the expansion of its Pyeongtaek semiconductor campus in South Korea, aiming to establish the site...

Tuesday 3 March 2026
Samsung, SK Hynix expand hiring as HBM, DRAM demand enters supercycle

With the semiconductor industry entering a supercycle and reporting record earnings, Samsung Electronics and SK Hynix are preparing to launch...