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    SK Hynix reports record-breaking 2025 earnings driven by AI memory boom
    2min ago
    Analysis: Chip inflation is a major supply chain risk in 2026
    39min ago
    China's AI path: Looking back at DeepSeek's one year anniversary
    39min ago
    NEWS TAGGED HBM
    Wednesday 28 January 2026
    Analysis: SK Hynix's exclusive supply to Microsoft reflects HBM3E market consolidation
    Recent reports indicate that SK Hynix has become the exclusive HBM supplier for Microsoft's next-generation AI accelerator, Maia 200, underscoring its competitiveness in the HBM3E...
    Wednesday 28 January 2026
    China's conditional H200 approval rewire Samsung-SK Hynix rivalry
    China has reportedly been conditionally approving corporate purchases of Nvidia's H200, reshaping HBM supply-demand dynamics. According to Seoul Economic Daily and G-enews,...
    Tuesday 27 January 2026
    Micron breaks ground on US$24 billion advanced NAND fab in Singapore
    Micron has started construction on an advanced wafer fabrication facility at its existing NAND manufacturing complex in Singapore, marking a planned investment of approximately US$24...
    Monday 26 January 2026
    Samsung expected to start HBM4 shipments to Nvidia, AMD in February
    Samsung Electronics is expected to begin shipping its sixth-generation high-bandwidth memory chips, known as HBM4, to Nvidia as early as February, Reuters reported, while...
    Friday 23 January 2026
    ASML leads chip equipment charge into advanced packaging
    Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Wednesday 21 January 2026
    Research Insight: High-end fiberglass cloth supply tightens as server demand spotlights Nittobo

    As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM)...

    Wednesday 21 January 2026
    Samsung reportedly exploring ASMPT for TCB supply
    Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
    Wednesday 21 January 2026
    China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
    US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
    Tuesday 20 January 2026
    Samsung Device Solutions eyes 47% bonuses after profit surge

    Samsung Electronics on January 16 announced payout ratios for its 2025 excess profit performance incentive, with the Device Solutions...

    Monday 19 January 2026
    Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp
    With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...
    Monday 19 January 2026
    Advantest ATE lead times remain tight as AI and memory markets expand
    As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
    Sunday 18 January 2026
    SK Hynix accelerates advanced packaging from Korea to Indiana
    SK Hynix plans to invest KRW19 trillion, about US$12.9 billion, to build an advanced semiconductor packaging plant in Cheongju, South Korea, as it moves to secure capacity for AI-driven...
    Saturday 17 January 2026
    Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment

    Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant...

    Saturday 17 January 2026
    Samsung DS rebounds to record KRW20 trillion under new leadership
    Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
    1/55 pages
    NTN special report
    BIZ FOCUS
    Jan 28, 08:00
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers
    Wednesday 28 January 2026
    Seoul Business Agency Hosts Global Innovation Forum Showcasing Startup Ecosystem
    Thursday 22 January 2026
    MOSS Introduces an AI-Assisted DAW Built to Support Human Creativity
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook