News tagged HBM at DIGITIMES

NEWS TAGGED HBM

Wednesday 25 March 2026

Global semiconductor market rebounds in 2025 with AI-led expansion

According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above...

Wednesday 25 March 2026

SK Hynix sets sights on US ADR listing to strengthen capital base

SK Hynix is reportedly set to issue new shares and list American Depositary Receipts (ADRs) on the US market. Industry analysts say the company aims to use the proceeds to expand production...

Wednesday 25 March 2026

SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech

SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin...

Tuesday 24 March 2026

Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee

Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...

Tuesday 24 March 2026

SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in...

Monday 23 March 2026

Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreements

Samsung Electronics is reportedly in discussions with Google and Microsoft to establish long-term memory semiconductor supply agreements,...

Monday 23 March 2026

Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers

Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...

Monday 23 March 2026

SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung

SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...

Monday 23 March 2026

At Cheonan, Samsung is rewriting HBM's bonding playbook

Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...

Friday 20 March 2026

Global top-3 memory maker status, 1Q 2026

Introduction

Friday 20 March 2026

Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity

Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...

Friday 20 March 2026

Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting

Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...

Friday 20 March 2026

AI tailwinds and global reach put Topco on track for double-digit growth in 2026

Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...

Friday 20 March 2026

Intel pushes large-area AI packaging to close foundry gap

Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.

Thursday 19 March 2026

The HBM paradox: why Taipei and Seoul can't afford a diplomatic cold war

A diplomatic dispute over administrative nomenclature has escalated into a high-stakes standoff between Taiwan and South Korea, threatening to cast a shadow over one of the world's...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook