Samsung Electronics has significantly improved yields for its latest DRAM technologies used in high-bandwidth memory (HBM), according to IT Chosun, underscoring the intensifying...
Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI...
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior...
TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...
A planned 18-day strike at Samsung Electronics is shifting investor attention from labor negotiations to the risk of memory-output disruption, as estimates from Korean media point...
Micron's senior vice president, Jeremy Werner, told The Circuit Podcast that memory has become a strategic bottleneck for data-center inference, warning that insufficient memory can...
AI-driven demand and new product cycles are accelerating competition among major memory makers, creating pressure across storage and component supply chains. Production is running...
Samsung Electronics is reportedly moving up construction of the final production line at its Pyeongtaek semiconductor campus, accelerating one of its largest capacity-expansion projects...
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather...
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
