Wednesday 17 April 2024
Winbond on track for growth as PC application demand resumes
Winbond Electronics, a maker of specialty DRAM and flash memory, will see its main products be on track for growth, according to industry sources.
Tuesday 9 April 2024
Memory prices to rally through 3Q24, says Adata
Memory prices are expected to rise through the third quarter of 2024, according to memory module house Adata Technology.
Wednesday 3 April 2024
Micron evaluates memory supplies from Taiwan after the earthquake
The 7.4 magnitude earthquake in Taiwan on April 3 is getting attention worldwide for DRAM supplies from Taiwan.
Tuesday 5 March 2024
GenAI drives HBM memory demand
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Wednesday 7 February 2024
Winbond plans transition to 16nm DRAM process
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
Tuesday 9 January 2024
Taiwan memory makers expect a recovery in 2024
According to sources in Taiwan's memory industry, recovery will be underway in 2024, buoying memory unit prices and sales.
Tuesday 2 January 2024
Taiwanese memory vendors embrace GenAI wave with innovative edge-computing solutions
With the generative AI boom in full swing, the supply chain is shifting its focus to developing edge AI device applications. In 2024, AI PCs and smartphones will undergo market sales...
Monday 25 December 2023
Winbond to buy roughly NT$1.3 billion in R&D gear
Winbond Electronics, a Taiwanese maker of specialty DRAM and NOR flash memory, has authorized NT$1.286 billion (US$41.4 million) in capital expenditures. The money will be used to...
Friday 22 December 2023
Taiwan's carbon market flourishes as TCX launches, attracting industry leader Winbond
The Taiwan Carbon Solution Exchange (TCX) has officially started trading, marking a significant moment in carbon exchange activities. Winbond Electronics Corporation (WEC), a total...
Wednesday 20 December 2023
Winbond, PTI team up for 2.5/3D packaging
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
Thursday 30 November 2023
RAM is key in AI PC warmup
The evolution of generative AI from the cloud to edge applications has awakened the PC industry from its long slumber, as AI PCs become the name of the game for leading PC makers...
Thursday 23 November 2023
Taiwan memory IC design houses gearing up for edge AI boom
Taiwan-based memory IC design houses including Etron Technology and AP Memory have stepped up their deployment in the edge AI market segment, which is expected to grow through 2025...
Friday 17 November 2023
NOR flash price drops to slow, says Winbond
Price declines in NOR flash memory will moderate and narrow to less than 10% in 2024, according to Pei-Ming Chen, president of Taiwan-based Winbond Electronics.
Tuesday 14 November 2023
Winbond anticipates surge in demand for HBM amid AI server boom
The Taiwan-based semiconductor manufacturer Winbond is gearing up for a significant uptick in the demand for high-bandwidth memory (HBM), driven by the rise of generative AI. Chen...
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Research Report Database
Summary of Tech Supply Chain News!
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research