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May 20, 17:56
NEWS TAGGED WINBOND
Thursday 12 May 2022
Winbond to enjoy revenue growth in 2Q22
Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Monday 25 April 2022
IC wafer capacity to climb 8.7% as 10 new fabs enter production
IC wafer capacity is forecast to grow 8.7% in 2022 after rising 8.5% in 2021, thanks to the addition of 10 new 300mm fabs that are scheduled to open this year, according to IC Insi...
Thursday 21 April 2022
Winbond to scale up DDR3 output
Winbond Electronics has disclosed plans to boost its DDR3 chip output, which will climb as a proportion of the company's total DRAM revenue to 50% by 2024 from the current 30%.
Wednesday 30 March 2022
Samsung to stop taking DDR3 orders after 2022
Samsung Electronics has notified customers that the company will take DDR3 chip orders until the end of 2022 and fulfill the orders for deliveries until the end of 2023, according...
Tuesday 22 March 2022
CXMT to deliver 17nm DRAM samples in 2Q22
China-based memory foundry ChangXin Memory Technologies (CXMT) is poised to start delivering samples of DRAM chips built using its in-house developed 17nm process technology, according...
Tuesday 8 March 2022
Taiwan memory makers post strong February sales
Memory module houses, such as Adata Technology, and Taiwan-based memory chipmakers including Nanya Technology, Macronix International and Winbond Electronics saw their February sales...
Wednesday 2 March 2022
Semiconductor industry capex to surge 24% in 2022
After surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of US$190.4 billion, according to IC Insights.
Wednesday 23 February 2022
Macronix, Winbond gaining market share
Macronix International and Winbond Electronics, with their combined share of the global NOR flash market exceeding 55% in the second half of 2021, are both looking to gain more market...
Friday 18 February 2022
Global DRAM output value drops in 4Q21
The global DRAM memory industry posted US$25.03 billion in output value in the fourth quarter of 2021, down 5.8% sequentially, when bit shipments and ASPs both declined on quarter,...
Monday 14 February 2022
Winbond to boost 20nm chip output at new fab in southern Taiwan
Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Thursday 10 February 2022
Taiwan memory chipmakers to enjoy strong 1Q22
With their January revenues all registering on-year increases greater than 20%, Taiwan's memory chipmakers Nanya Technology, Macronix International, and Winbond Electronics are poised...
Tuesday 8 February 2022
Winbond to kick off construction of phase-2 facility at new plant
Specialty DRAM specialist Winbond Electronics plans to advance its second-phase facility construction at its new plant in Kaohsiung, southern Taiwan to ease tight capacity for specialty...
Tuesday 18 January 2022
Winbond starts equipment move-in at new fab in southern Taiwan
Specialty DRAM and flash chipmaker Winbond Electronics has kicked off its equipment move-in at its new 12-inch wafer plant in Kaohsiung, southern Taiwan, and is targeting production...
Friday 7 January 2022
NOR flash suppliers scaling up output for AirPods
Apple has stepped up its chip purchases for the AirPods as sales of the wireless earbuds turned out to be strong at the end of 2021, according to industry sources. Apple is also gearing...
Monday 11 June 2018
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.
Thursday 29 June 2017
Winbond NOR flash for IoT
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin packages, these newest members of the SpiFlash family provide designers with serial flash memories for audio, wearable, IoT and other demanding applications that call for low power in small packages. The 1.2V products cover an operating voltage range from 1.14V to 1.3V, which is ideal for very-low-power designs, Winbond said. The 1.5V devices have a wider operating voltage range, from 1.14V through 1.6V. The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available in samples and will be available in production in the beginning of 2018, according to Winbond. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow.
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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