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NEWS TAGGED WINBOND
Friday 26 May 2023
Global DRAM revenue continues slide in 1Q23
Revenue of the global DRAM memory market registered a sequential decline for the third consecutive quarter in the first quarter of 2023, according to TrendForce.
Thursday 11 May 2023
Winbond, Nanya see demand pick up from PC and TV sectors
Taiwan-based memory chipmakers Winbond Electronics and Nanya Technology will likely land more short lead-time orders from PC customers in May-June, boosting their sales performance...
Thursday 11 May 2023
Silicon Island Chronicles interview series: Winbond's Arthur Chiao believes memory market has hit bottom and won't get worse
In an interview for the Silicon Island Chronicles documentary produced as part of DIGITIMES's 25th anniversary, Winbond chairman Arthur Chiao discussed his company's journey...
Monday 8 May 2023
Winbond swings to loss in 1Q23
Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in three years.
Wednesday 19 April 2023
Winbond expects gradual shipment pick-up
Memory chipmaker Winbond Electronics has seen stability in contract pricing and expects a gradual pick-up in shipments starting the second quarter.
Thursday 13 April 2023
Winbond obtains NT$20 billion syndicated loan
Winbond Electronics has signed a seven-year syndicated loan agreement for NT$20 billion (US$656.3 million) with 11 local banks in Taiwan, according to the specialty DRAM and flash...
Thursday 6 April 2023
Memory market to bottom out in 2Q23 with uncertain recovery prospects
The memory industry is expected to reach the bottom of its downturn cycle in the second quarter of 2023 due to continuous falls in DRAM and NAND prices, high inventory levels at supply...
Tuesday 21 March 2023
Nanya, Winbond support Taiwan power price hikes
Commenting on Taiwan's possible industrial power price hike, which may rise over 10% in April, the president of DRAM maker Nanya Technology Lee Pei-ing and Winbond president James...
Tuesday 21 March 2023
Memory prices to bottom out soon
Memory chip prices are expected to bottom out and stop falling soon, with more suppliers optimistic about the market's prospects in the second half of this year, according to industry...
Thursday 9 March 2023
AI boom to boost demand for high-end memory chips
AI advancements will increase demand for high-end memory chips by enabling a wide range of applications, industry sources believe.
Wednesday 22 February 2023
Macronix, Winbond gearing up for new product development and technology transitions
Macronix International and Winbond Electronics have both reduced output in response to the current decline in the memory chip market, but continue to make progress in new product...
Tuesday 21 February 2023
Winbond expects memory prices to hit bottom in 1Q23
Winbond has seen memory prices continue to slip in the first quarter of 2023, but expects them to rebound in the second quarter with the first quarter to be the bottom of the price...
Friday 17 February 2023
Winbond may swing to loss in 1Q23, says report
Specialty DRAM and flash memory chipmaker Winbond Electronics may slide into the red in the first quarter of 2023, due to falling shipments and substantial drops in memory chip prices,...
Thursday 16 February 2023
Winbond joins UCIe Consortium to support high-performance chiplet interface standardisation
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
Friday 10 February 2023
Winbond kickstarts output ramp-up at southern Taiwan fab
Specialty DRAM and flash memory chipmaker Winbond Electronics has kickstarted the output ramp-up at the first-phase facility of its new fab in Kaohsiung, southern Taiwan, with a monthly...
Monday 11 June 2018
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.
Thursday 29 June 2017
Winbond NOR flash for IoT
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin packages, these newest members of the SpiFlash family provide designers with serial flash memories for audio, wearable, IoT and other demanding applications that call for low power in small packages. The 1.2V products cover an operating voltage range from 1.14V to 1.3V, which is ideal for very-low-power designs, Winbond said. The 1.5V devices have a wider operating voltage range, from 1.14V through 1.6V. The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available in samples and will be available in production in the beginning of 2018, according to Winbond. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow.
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
May 15, 16:16
APD showcases innovative medical power supplies at CMEF 2023, garnering market attention
Friday 12 May 2023
Silicon Catalyst announces "Silicon Startups Contest" in partnership with Arm
Tuesday 2 May 2023
iCatch Technology unveils CR3 automotive AI imaging SoC for in-cabin sensing
Friday 28 April 2023
Avalue launching Intel Atom embedded industrial motherboards, EMX-EHLP, with Intel Celeron/Atom SoC BGA processor
Why are Huawei, SMIC taking different approaches against US curbs?
Nvidia sees AI GPU orders ramp up
TSMC wins major AI chip orders
Chinese EDA champion Empyrean can now "fully support" 7nm; sees 1Q23 sales growth
Developing advanced processes at SMIC could become an unrealized dream of co-CEO Liang Mong Song?
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
LLMs to pave way for direct human interaction to enter into home-use robot market, says DIGITIMES Research
Despite market share loss, Japan IC substrate supplier influence on semi industry still strong, says DIGITIMES Research
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