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REALTIME NEWS
Amazon spends US$220B on AI as power delays squeeze cash flow
ICT
9min ago
Analysis: Why Tesla needs to manufacture Optimus robots before its humanoid AI is ready
ICT
11min ago
Amazon to invest over EUR160B in Germany for AI, cloud and logistics
ICT
12min ago
Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges
Semiconductors
15min ago
Apple, Google push PCB supply chain toward net zero amid challenges
Semiconductors
26min ago
Hyundai rethinks AAM strategy as Tesla Roadster sparks flying-car buzz
Electric Vehicles
28min ago
Meta says compute, not demand, now limits Muse; pushes shared standard for AI shopping agents
ICT
33min ago
Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
Tomorrow's Headlines
Oct 21, 19:10
Oct 22, 10:51
Exclusive: Apple raises iPhone Duo shipment target 44% on strong preorders
Oct 22, 10:35
Charts: China's smartphone market bounces back from summer lows on new launches
Oct 22, 10:30
Sibelco to build quartz plant in North Carolina, extending US chip onshoring to raw materials
Oct 22, 09:49
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Oct 22, 09:59
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
LATEST STORIES
7 days news
Tesla's Robotaxi test enters harder phase: turning autonomous miles into transport business
Oct 22, 10:51
ELECTRIC VEHICLES
Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push
Oct 22, 10:45
SEMICONDUCTORS
Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains
Oct 22, 10:27
SEMICONDUCTORS
Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in
Oct 22, 10:15
EAST ASIA
Nvidia's AI factory strategy points to a broader shift in computing, industry
China's IC designers expand into AI server memory interconnects beyond DDR5
Jio's record IPO tests global appetite for India's homegrown telecom stack
SDC supplies over 70% of major laptop brands' OLED panels
iPhone Duo preorders surge, but sales momentum remains uncertain
LG robot unit Bear Robotics expands China outsourcing
Nvidia becomes AI's central bank as cloud startups face mounting pressure
Samsung patent boosts AI server memory efficiency without adding GPUs
Walrus Pump sees slower demand for higher-capacity AI cooling pumps
Memory surge drives phone makers from LTPO to LTPS
Tesla's new Roadster opens two paths for Taiwanese suppliers, from EV components to aerospace
Apple eyes high-end HomeView with robotic arm by 2027
Humanoid robot maker PAL says wheels could handle 80% of the market
Elon Musk expands South Korean supplier network for Terafab
Texas Instruments' analog recovery broadens as 12-inch investment turns into margin
IBM's growth rebounds after a summer stumble, led by software and servers
Meta's advertising engine keeps pace with its AI build-out as legal costs cut into profit
Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin
Tesla's car margins recover, but spending on AI and robotics absorbs the gain
Taiwan's FTC blocks Grab's Foodpanda acquisition over competition concerns
GoldKey Technology posts record 3Q26 profit as industrial share rises
Chief Telecom's CTSP AI data center bookings exceed 50%
TASA satellites reach orbit to test coordinated LEO broadband links
Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration
Taiwan tech supply chain eyes Texas for first US industrial cluster
Samsung's Nvidia HBM bid raises four strategic concerns
More news
BIZ FOCUS
Oct 22, 08:00
HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
Wednesday 21 October 2026
Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
Tuesday 20 October 2026
CES 2027 Welcomes First-Ever Chilean Global Pavilion
Tuesday 20 October 2026
Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Samsung HBM4E wins NVIDIA nod for AI accelerator push
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
4F2 DRAM development
Memory leaders are making progress with the next-generation 4F2 DRAM designs, a part of the industry's move toward vertically stacked 3D architectures to increase performance.
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
AI dividend drives Taiwan's memory makers from trough to transformation
Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles
Wednesday 21 October 2026
CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target
Wednesday 21 October 2026
Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems
Wednesday 21 October 2026
TECH
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface
Tuesday 20 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
Monday 19 October 2026
Charts: YMTC bets on premium eSSDs to take on Samsung
Friday 16 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Wednesday 21 October 2026
China launches state-owned data group as market-facing arm of its AI infrastructure push
Wednesday 21 October 2026
OPINIONS
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Tuesday 20 October 2026
TOPICS
4F2 DRAM DEVELOPMENT
TSMC 3Q26 EARNINGS CALL
5G
HUAWEI
SPECIAL REPORTS
Wednesday 21 October 2026
iPhone Duo finally debuts, but with price increases across models, Apple's 4Q26 shipments will take hit
DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027
DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
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