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REALTIME NEWS
CXMT targets DDR5 RDIMM mass production by end-2026
Tomorrow's Headlines
10h 32min ago
Nvidia expands China gaming partnerships
Tomorrow's Headlines
10h 32min ago
US promotes AI exports as chip industry flags supplier gaps and reshoring costs
Tomorrow's Headlines
10h 32min ago
Commentary: The methodology behind Lip-Bu Tan’s strategy of vulnerability for Intel
Tomorrow's Headlines
10h 33min ago
Analysis: GF finds high-value outlet for mature capacity through advanced packaging, lessons for China
Tomorrow's Headlines
10h 33min ago
Oct 15, 15:50
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Oct 15, 12:57
Micron opens second Taiwan advanced packaging plant as HBM supply tightens
Oct 15, 16:32
Trump says Taiwan will buy 30% of LNG output from Alaska project; Taipei confirms plans but not final terms
Oct 15, 14:35
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
Oct 15, 16:10
AI server tracker: Taiwanese ODM/EMS players post NT$2.18T in September 2026, up 56% YoY
LATEST STORIES
7 days news
Luxnet posts record 3Q profit as capacity expansion fuels growth
Oct 15, 20:00
ICT
TSMC bars capacity resale, aims to leave no AI money on the table
Oct 15, 17:20
EAST ASIA
TSMC investor conference: TSMC lifts 2026 revenue growth forecast to 44%, 2nm expansion, new 3nm fab
Oct 15, 17:15
SEMICONDUCTORS
AI server tracker: AIC accelerates as Taiwan's connector and chassis suppliers post uneven growth
Oct 15, 16:20
ICT
TSMC CEO says profitability has no ceiling, plans High-NA EUV adoption in 2030
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
Applied Materials CEO says agentic AI drives wafer demand
India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai
TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan
Samsung reportedly completes 4F² DRAM development as China's CXMT targets year-end launch
SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips
US AI data center power shortages drive demand for hybrid solar, natural gas and geothermal systems
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
Column: 3D memory could redraw chip competition, weaken US sanctions on China
Anthropic boosts 3Q26 revenue by 45% and stays profitable as IPO approaches
Delta Electronics targets SOFC pilot production by year-end, partners with Great Taipei Gas on 550kW installation
Analysis: Apple HomeView faces hurdles in smart-home adoption
Synopsys CEO says fully autonomous AI chip design remains out of reach
Samsung, Applied Materials back startup targeting chip packaging warpage
Anthropic targets low-conflict sites for Australian data centers
Japan Mobility Show puts Physical AI and cross-sector partnerships in focus
Toyota targets 1,000 e-Palette sales ahead of 2027 autonomous launch
OpenAI pledges not to use Apple secrets, accuses ex-employee of taking files
EU seeks China deal to lift ASML supplier sanctions amid rare-earth crisis
AI agents in suspected Tencent Cloud sandbox target Alibaba’s Amap mapping service
Aurotek posts record 3Q26 revenue, up 58% on automation demand
FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines
Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Intel says AI 'gold rush' is over, pushes prompt routing across open hardware
More news
BIZ FOCUS
Oct 15, 08:00
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
Wednesday 14 October 2026
Practical Insights & Industry Ideas
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored
MOST-READ
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Chinese memory supply is disruptive to pricing, Acer's Jason Chen says, as shortages ease
ByteDance's China AI chip push hits substrate shortage
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
TSMC, Intel, and Musk's Terafab
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent.
Analysis: Musk keeps Terafab in-house, shifting execution risk onto his own companies
Musk limits TSMC to possible Terafab sublease; Intel says it will stay involved
TSMC Texas-Terafab buzz drives Taiwan contractors to move fast
...More
EV
Wednesday 9 September 2026
Analysis: When 72% of the world's EV batteries are Chinese, one defect travels
BYD targets 40,000 European employees by 2030
Thursday 15 October 2026
Hiroca sees overseas revenue share top 50%, eyes strong pull-in momentum for 4Q26
Thursday 15 October 2026
Yulon Nissan sees Taiwan auto market holding at 420,000 units through 2027 amid EV, import growth
Thursday 15 October 2026
TECH
Thursday 15 October 2026
TSMC eyes US$54.3bn in 4Q26 revenue, but 2nm ramp and overseas fabs pressure margins
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Wednesday 14 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
Tuesday 13 October 2026
TSMC, ASML eye 12-inch photomasks to unlock High-NA EUV's full-field potential
Monday 12 October 2026
ASIA
Thursday 10 September 2026
India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
TSMC bars capacity resale, aims to leave no AI money on the table
Thursday 15 October 2026
EU seeks China deal to lift ASML supplier sanctions amid rare-earth crisis
Thursday 15 October 2026
SK Hynix reportedly ties US NAND fab plan to approval for chip equipment exports to China
Thursday 15 October 2026
OPINIONS
Thursday 15 October 2026
Column: 3D memory could redraw chip competition, weaken US sanctions on China
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
Thursday 15 October 2026
Analysis: Apple HomeView faces hurdles in smart-home adoption
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Thursday 15 October 2026
TOPICS
TSMC UPDATES
GEOWATCH
TRENDS IN INDUSTRIAL COMPUTING
HUAWEI
SPECIAL REPORTS
Monday 12 October 2026
Chinese government and industry make full push into AI glasses development: AR display integration and lightweighting gain traction
DIGITIMES notes that China continued to advance smart glasses policies from the central government to local governments in 2026, driving both enterprise production and consumer purchase subsidies.
Friday 2 October 2026
Global annual AI server shipments, 2025-2026
Continued advances in top-tier LLM capabilities, coupled with the potential for business automation enabled by agentic AI, are prompting major North American cloud providers, Neo Clouds, and leading AI labs to accelerate AI data center buildouts in 2026.
Thursday 1 October 2026
SiC substrate market shows signs of recovery, driven by demand from vehicles, energy and AI infrastructure
DIGITIMES has observed that since Tesla equipped the Model 3 with a traction inverter integrated with SiC power modules in 2018, the application of SiC power devices in the electric vehicle (EV) sector has gradually expanded, prompting suppliers to aggres 8_s.jpg
Thursday 17 September 2026
Physical AI drives autonomous driving upgrade; three efficiency factors lift AI accelerator demand
End-to-end autonomous driving has become the mainstream technology path, and the inference demand created by Physical AI in autonomous driving systems is, in turn, reshaping automotive system-on-chip (SoC) design.
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