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Friday 22 May 2026
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
Friday 22 May 2026
Memory shortage reaches smartphone OLED market as shipments fall 12%

A global memory shortage is spreading into the smartphone OLED market, cutting handset production and adding pressure on display makers...

Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Thursday 21 May 2026
Tokyo Electron Taiwan drops appeal after court fines unit and jails ex-engineer in TSMC trade secrets case
Tokyo Electron's Taiwan unit said on May 21 that it respected judicial proceedings and would not appeal following a ruling in a trade secrets case involving TSMC. The decision came...
Thursday 21 May 2026
SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

China's semiconductor self-sufficiency drive has taken another step forward, with SMIC and Hua Hong Group jointly establishing Shanghai...

Wednesday 20 May 2026
U-leam to rely on LEO satellite business while building quantum and medical pipelines
U-leam said LEO satellites will remain its primary growth engine for the next few years, while quantum computing, medical devices, robotics, and drones will form the company's second...
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Tuesday 19 May 2026
TDK expands bonding equipment investment, launches first mass production of nanocomposite materials
Japanese electronic components manufacturer TDK will make its largest-ever capital investment in fiscal 2026, running from April 2026 to March 2027, to address surging demand related...
Tuesday 19 May 2026
Samsung, SK Hynix face chipmaking chemical squeeze as China feedstock costs surge
Prices for semiconductor-grade hydrogen fluoride supplied to Samsung Electronics and SK Hynix are expected to rise sharply between late June and July, as higher costs for a key China-sourced...
Tuesday 19 May 2026
China's display boom fuels push for materials independence
As China cements its position as the world's largest producer of display panels, the country is now pushing deeper into one of the industry's most strategically sensitive areas: substrate...
Monday 18 May 2026
Swancor and RobiChip partner to bring advanced packaging into robots and drones
Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots,...
Saturday 16 May 2026
Taiwan semiconductor materials, April 2026— One sector, two races
Among the 19 Taiwan-listed semiconductor materials companies tracked by Digitimes, 10 (53%) grew month-on-month in April, 12 (63%) posted positive year-on-year growth, and...
Friday 15 May 2026
China keeps tight InP export controls despite Trump-Xi talks
As the US and China continue to clash over geopolitics and critical materials supply, industry sources say China's restrictions on indium phosphide (InP) substrates for optical communications...