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Monday 7 September 2026
Wah Lee sees faster growth in 2027 as supply stays tight
Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
Monday 7 September 2026
AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein
AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...
Monday 7 September 2026
India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments,...

Sunday 6 September 2026
BenQ Materials targets CPO in semiconductor push
BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
Saturday 5 September 2026
Taiwan semiconductor output targets NT$8 trillion
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
Friday 4 September 2026
Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp
Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
Friday 4 September 2026
Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
Friday 4 September 2026
Electroninks, Merck, Qualipoly build advanced packaging ecosystem
Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly...
Thursday 3 September 2026
TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
Thursday 3 September 2026
CPO material race widens as Taiwan eyes key role
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
Thursday 3 September 2026
SK Hynix wafer purchases jump 104% on AI demand
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
Thursday 3 September 2026
LCY Advanced Materials launches wet chemicals for AI chip packaging
LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...
Wednesday 2 September 2026
EU EV battery recycling still lacks a profitable model
The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
Indium CEO: packaging, cooling and power are next AI bottlenecks
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...