As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...

The spotlight has been on industry innovation at the 2026 Taipei International Plastics and Rubber Industry Show (TaipeiPLAS), as Taiwan's...

Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making...

Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn, held FIT Tech Day 2026 on September 16 under the theme "Light at Scale:...

Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion...

Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened...

Japan's Fujifilm plans to set up a greenfield semiconductor materials manufacturing facility in India with a total investment of approximately...

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...