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    Kinsus boosts spending as global IC substrate supply stays tight
    29min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    Aug 3, 18:57
    NEWS TAGGED MATERIALS
    Tuesday 4 August 2026
    Key material shortages prompt suppliers to prioritize three customer groups
    Taiwanese research institute Chung-Hua Institution for Economic Research (CIER) released Taiwan's manufacturing purchasing managers' index (PMI) for July 2026 on August 3. The seasonally...
    Tuesday 4 August 2026
    Interview: Topco Scientific expands to Fukuoka signaling chip regionalization

    Topco Scientific is expanding in Japan and other markets to support a global semiconductor buildout that is reshaping supply chains...

    Tuesday 4 August 2026
    L&F Plus ships trial samples from South Korea’s first LFP cathode line
    South Korean cathode materials maker L&F said its subsidiary L&F Plus has shipped the first trial-production samples from South Korea’s first lithium iron phosphate (LFP)...
    Tuesday 4 August 2026
    Interview: Rising material costs and FOUP shortages threaten semiconductor supply chains
    AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO...
    Monday 3 August 2026
    CSCC opens Pingtung R&D center to target battery, semiconductor supply chains
    China Steel Chemical Corporation has opened a new research and development center at its Pingtung plant as it expands into lithium battery anode materials, advanced carbon materials,...
    Monday 3 August 2026
    TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
    A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...
    Monday 3 August 2026
    Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
    Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
    Monday 3 August 2026
    Elevated Materials names Jay Wang as chief revenue officer
    Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...
    Saturday 1 August 2026
    Elite Material posts record 2Q result on strong AI-related demand
    Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...
    Saturday 1 August 2026
    Thintronics wins proposed US CHIPS incentives for advanced substrate technology
    Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
    Friday 31 July 2026
    Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

    China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Friday 31 July 2026
    CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
    China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
    Thursday 30 July 2026
    Italy, US to sign Pax Silica pact on AI, chip supply chains

    Italy and the US are set to sign a cooperation agreement tied to the US-led Pax Silica initiative on July 31, as Rome expands efforts...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
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    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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