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Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Long-term contracts tie up InP capacity due to data center optics demand
Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...
Friday 28 August 2026
YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
Friday 28 August 2026
Wah Lee targets 2Q27 ODM phase as robotics push moves beyond components
Wah Lee Industrial is targeting the second quarter of 2027 to move its Physical AI push into an ODM development phase, signaling an effort to capture more value beyond supplying materials,...
Friday 28 August 2026
Regulators fast-track lithium battery M&As as China shifts from capacity expansion to consolidation
China's lithium battery industry is shifting from an era of aggressive capacity expansion toward consolidation, as regulators rapidly clear deals aimed at revitalizing existing assets...
Thursday 27 August 2026
Driving measurable sustainability: CIDB Malaysia's blueprint for carbon accountability
At Sustainability Environment Asia Conference 2026, Suhaimi Mansor, deputy chief executive of the Construction Industry Development Board (CIDB) Malaysia, delivered a clear mandate...
Thursday 27 August 2026
Grand Pacific Petrochemical teams up with Japan's AWI to enter Taiwan's semiconductor specialty materials market
Taiwanese petrochemical maker Grand Pacific Petrochemical (GPPC) announced it has joined Japanese industrial gas manufacturer Air Water (AWI) in a capital increase for semiconductor...
Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Thursday 27 August 2026
Nvidia's inventory build shifts upstream as memory costs bite
Nvidia closed its second fiscal quarter with US$31.6 billion of inventory, but the more consequential change is what that inventory now consists of. Work in process and raw materials...
Thursday 27 August 2026
Tri-fold, rollable foldables intensify materials supply chain battle
Samsung Electronics' first tri-fold handset of 2025, the Galaxy Z TriFold, has repeatedly sold out, but with global shipments of only about 30,000 units, it functioned more as a technology...
Thursday 27 August 2026
Apple, Huawei foldables to collide in September, lifting ultra-thin glass, hinge and cooling demand
Huawei and Apple are set to intensify competition in foldable smartphones in September, accelerating demand across a supply chain spanning foldable OLED panels, ultra-thin glass, hinges,...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Wednesday 26 August 2026
Eternal Materials reports July revenue gain as advanced packaging demand strengthens
Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion...
Wednesday 26 August 2026
BOE, 3M expand materials partnership as foldable OLED competition intensifies
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...