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    Samsung signs five-year memory deals as chip shortage stretches to 2028
    5min ago
    South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand
    8min ago
    NEWS TAGGED MATERIALS
    Thursday 30 July 2026
    Italy, US to sign Pax Silica pact on AI, chip supply chains

    Italy and the US are set to sign a cooperation agreement tied to the US-led Pax Silica initiative on July 31, as Rome expands efforts...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
    Tuesday 28 July 2026
    TCC launches Europe listing plan as revenue from the region reaches 44%
    Taiwan Cement Corp. (TCC) formally launched its Europe listing plan, Project Arcadia, on July 27 after holding a video meeting with its first group of international investment banks...
    Tuesday 28 July 2026
    Qualcomm chip price hike to squeeze China's Android makers on two fronts
    China's smartphone brands are bracing for a new round of cost pressure after Qualcomm reportedly notified customers of double-digit percentage price increases on products shipped from...
    Tuesday 28 July 2026
    Panel makers reject 10% polarizer price increase as China suppliers retreat
    Rising upstream material prices are continuing to pressure the polarizer industry. During the second quarter, polarizer suppliers in China and Taiwan sought price increases of about...
    Tuesday 28 July 2026
    AI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing
    Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's...
    Tuesday 28 July 2026
    Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
    Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and app...
    Monday 27 July 2026
    IBM agrees to acquire HRL Laboratories to expand quantum computing capabilities
    IBM has signed a definitive agreement to acquire HRL Laboratories, a US research and development company known for its work in quantum technologies, to strengthen its long-term quantum...
    Monday 27 July 2026
    CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
    China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...
    Monday 27 July 2026
    Taiwan's AIDC is turning a decade of AI manufacturing know-how into a business model

    Taiwan's Aerospace Industrial Development Corporation (AIDC) has spent nearly a decade pushing AI adoption, moving from smart manufacturing...

    Sunday 26 July 2026
    KKR plans gradual exit as LCY Group accelerates semiconductor materials expansion
    TSMC supplier LCY Group President Bowei Lee said private equity firm KKR & Co. plans to gradually divest its holdings in businesses affiliated with the Taiwanese chemical group,...
    Sunday 26 July 2026
    Russia adopts low-cost navigation workaround for Molniya attack drones
    Russia has equipped low-cost Molniya attack drones with a civilian compass and camera-based reading system to keep them on course when satellite navigation is jammed or unavailable,...
    Saturday 25 July 2026
    Taiwan scholars see rising pressures in joint civilian-military research

    Tsu-Jae Liu, president of the National Academy of Engineering and academician of Academia Sinica, has highlighted the increasing pressure...

    Saturday 25 July 2026
    SuperAlloy expands recycled aluminum push as semiconductor business nears revenue contribution
    SuperAlloy Industrial is broadening its business beyond forged aluminum wheels, with recycled aluminum and semiconductor parts emerging as new growth drivers. The shift could matter...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    AI Summit Seoul