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Wednesday 14 October 2026
Ubiqconn satellite revenue jumps 175% as 3Q26 operations recover
Ubiqconn Technology reported September 2026 consolidated revenue of NT$142 million (US$4.4 million), up 32.4% month-on-month and 6.7% year-on-year. Third-quarter revenue rose 9.6%...
Wednesday 14 October 2026
Broadcom executive says chipmakers must tackle packaging, power limits together
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Wednesday 14 October 2026
TOK expands Koriyama photoresist capacity as AI chip demand rises
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
Wednesday 14 October 2026
Qualcomm says edge AI faces power, cost, and scale hurdles
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Wednesday 14 October 2026
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Tuesday 13 October 2026
Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Tuesday 13 October 2026
South Korea's YMT targets fivefold rise in glass-substrate plating capacity
South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
Tuesday 13 October 2026
Korea Alcohol Group speeds up pivot into semiconductors
Korea Alcohol Group is accelerating its shift toward semiconductor materials with a KRW450 billion (US$337 million) production base at Yesan County in South Korea's South Chungcheong...
Tuesday 13 October 2026
U-Best Innovative posts record September, third-quarter, nine-month revenue
U-Best Innovative posted record revenue for September, the third quarter, and the first nine months of 2026, as demand for footwear materials strengthened and the company pursued emerging...
Tuesday 13 October 2026
India's Kaynes Semicon seeks foreign partners as its Gujarat chip plant ramps up
Kaynes Semicon, the chip packaging arm of Indian electronics maker Kaynes Technology, is calling for foreign semiconductor companies to form joint ventures in India, as its executives...
Tuesday 13 October 2026
Applied Materials opens R&D center to speed chipmaking for the AI era
Applied Materials has opened its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, positioning the Silicon Valley site as a new hub for...
Tuesday 13 October 2026
China's Jinai Tech backed by state, targets 2027 advanced process pilot-line launch with ambition laid upon SEA
China's 15th Five-Year Plan and the Ministry of Industry and Information Technology's strong chip project are accelerating the domestic replacement of semiconductor equipment and materials...
Tuesday 13 October 2026
Nan Pao sees breakthroughs in adhesives for semiconductors, foldable displays
Nan Pao Resins Chemical reported September revenue of NT$2.308 billion (US$72.35 million), up 16.5% year-over-year and a record for the same period, as it continued to develop new...
Monday 12 October 2026
Sumitomo Bakelite expands packaging material production across Singapore, China
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...