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Friday 13 November 2026
E Ink targets 2027 revenue from PTFE materials for AI data centers
E Ink Holdings is expanding into materials for AI data centers through a partnership with Taiflex Scientific. The electronic paper maker expects its first revenue from polytetrafluoroethylene...
Friday 13 November 2026
Doosan clears SK Siltron merger reviews; deal could close by end-2026
Doosan Group has completed merger reviews in six countries for its acquisition of SK Siltron within about two months. The deal is valued at KRW2.3 trillion (US$1.73 billion). The key...
Friday 13 November 2026
Sheffield, Taiwan firms target aerospace, defense semiconductor opportunities
Special Melted Products, a UK subsidiary of Taiwan-based wire, cable, and stainless steel manufacturer Walsin Lihwa, is partnering with National Taiwan University (NTU) and the University...
Friday 13 November 2026
Exclusive: Can quantum computers escape the laboratory? Aegiq reimagines computing's industrial future
Inside a refurbished industrial building in Sheffield, a quantum computing laboratory is preparing for a future that could transform how the world develops medicines, advanced materials,...
Friday 13 November 2026
E Ink Holdings' assets hit record NT$127.4B as it targets AI materials
E Ink Holdings, a leading e-paper maker, reported third-quarter 2026 consolidated revenue of NT$9.936 billion (US$301.60 million), down 5% from a year earlier. Net income attributable...
Friday 13 November 2026
LG Chem reportedly developing MR-MUF materials for HBM on top of NCF work
LG Chem is developing materials for the mass reflow-molded underfill (MR-MUF) process used to make high-bandwidth memory (HBM), Korean media outlet ETNews reported, citing...
Thursday 12 November 2026
Aleees makes Tainan plant launchpad for North American LFP expansion
Advanced Lithium Electrochemistry (Aleees), a lithium iron phosphate (LFP) cathode-material maker, signed a memorandum of understanding (MOU) with a North American partner on November...
Thursday 12 November 2026
Sharp sells LCD color filter plant to Nitto Denko for JPY22.2B
Sharp is accelerating efforts to address its loss-making display component business. According to Nikkei, Sharp will sell its Hisai plant in Tsu, Mie Prefecture, Japan, which...
Thursday 12 November 2026
DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers
DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have...
Thursday 12 November 2026
South Korea’s HBM demand drives 54% surge in Taiwan glass fiber exports
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
Thursday 12 November 2026
Mitsubishi Gas Chemical bets on AI packaging with Thailand BT materials line
Mitsubishi Gas Chemical (MGC) announced on November 10 that it will expand manufacturing and shipment-inspection equipment at its Thailand subsidiary to increase capacity for BT (Bismaleimide-Triazine)...
Thursday 12 November 2026
ABF substrate shortage to last through 2028 as Wah Lee targets next-gen products
Demand for AI, high-performance computing (HPC), and semiconductors continued to rise, driving Wah Lee Industrial's 3Q26 profit to record-high levels. Gross profit reached NT$2.06...
Thursday 12 November 2026
Taiwan mobilizes academic R&D to address post-Moore semiconductor equipment gaps
Taiwan is stepping up efforts to develop next-generation semiconductor research equipment, as conventional commercial tools increasingly fall short of emerging R&D requirements...
Wednesday 11 November 2026
Buima battery orders stretch six months as LEO projects advance
Buima Energy reported a slight month-on-month increase but a year-on-year decline in October 2026 revenue, as construction projects entered completion and acceptance phases while battery...
Wednesday 11 November 2026
Asia Electronic Materials advances PTFE Hybrid solution for AI clients
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...