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Wednesday 28 October 2026
Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan...
Wednesday 28 October 2026
Corning's AI fiber growth puts capacity delivery, customer funding in focus
Corning's third-quarter results show optical networking becoming a larger driver of the materials maker's business as AI infrastructure expands. Stronger sales and profitability support...
Wednesday 28 October 2026
Semiconductor equipment is not AI chip growth's biggest bottleneck
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
Wednesday 28 October 2026
Analysis: 3M's investment in Genius Electronic Optical puts EBO mass production to the test
US materials giant 3M recently entered into a strategic partnership with Taiwanese optical component manufacturer Genius Electronic Optical (GSEO), with plans to acquire a 4.7% stake...
Tuesday 27 October 2026
Fujifilm expands South Korean capacity to meet AI chip demand
Fujifilm Electronic Materials is expanding its advanced semiconductor materials footprint in South Korea by increasing extreme ultraviolet (EUV) photoresist capacity in Pyeongtaek...
Tuesday 27 October 2026
Tamil Nadu adds independent chip subsidy route as Indian states vie for investment
India's semiconductor drive has largely been led by New Delhi, which selects projects for large central incentives while state governments add their own packages of land, infrastructure...
Tuesday 27 October 2026
Cheng Mei develops materials for advanced packaging glass substrates
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges...
Friday 23 October 2026
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

Thursday 22 October 2026
Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B
As the global foundry leader accelerates construction of advanced-process and advanced-packaging facilities in the US, semiconductor facility engineering integrator Chi Yi Hsin Technology...
Thursday 22 October 2026
Why Terafab approached South Korean suppliers first
Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions...
Thursday 22 October 2026
Apple, Google push PCB supply chain toward net zero amid challenges
PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...
Thursday 22 October 2026
Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push
Lam Research is grooming Indian companies to become its suppliers rather than relying only on its global vendor base, a senior executive said, as the US chip equipment maker deepens...
Thursday 22 October 2026
Elon Musk expands South Korean supplier network for Terafab
Elon Musk's Terafab semiconductor production initiative is expanding its supplier outreach in South Korea, with Tesla and SpaceX approaching materials, components, and equipment suppliers...
Thursday 22 October 2026
Chief Telecom's CTSP AI data center bookings exceed 50%
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...