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Tuesday 30 June 2026
TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026
Fulltech Fiber Glass to lift cloth prices as much as 30% from July

Fulltech Fiber Glass is raising prices for its glass fiber cloth lines amid higher raw material, energy, transportation, and manufacturing...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Tuesday 30 June 2026
Samsung, SK Hynix step up CO₂ buying as supplies tighten
South Korea's inventories of high-purity carbon dioxide, a critical material used in advanced semiconductor manufacturing, have fallen below normal buffer levels, raising procurement...
Monday 29 June 2026
China's first diamond semiconductor supply chain project lands in Zhengzhou

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project...

Monday 29 June 2026
Rising lithium battery material prices trigger widespread inflation; Chinese battery makers forced to take action
China's electric vehicle (EV) and energy storage supply chains are undergoing a profound structural shift. Over the past year, prices of upstream battery materials have continued to...
Monday 29 June 2026
Hsinchu Science Park draws new semiconductor service investments as chipmaking shifts to advanced nodes

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...

Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...

Friday 26 June 2026
Samsung SDI targets US battery supply chains with US$20M Forge Nano investment
Samsung SDI, a battery and electronic materials manufacturer, has entered an agreement to help US-based Forge Nano build a 3 GWh per year battery manufacturing site in Morrisville,...
Friday 26 June 2026
AIDC showcases advanced composite materials for next-gen aircraft, drones
To meet the aerospace industry's push for lighter, more environmentally sustainable next-generation aircraft, Taiwan's Aerospace Industrial Development Corporation (AIDC) has stepped...
Friday 26 June 2026
Corning weighs South Korea site as chip packaging race turns to glass

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass...

Friday 26 June 2026
Academia Sinica readies Taiwan-made quantum chip for engineering push
Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...