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Wednesday 12 August 2026
South Korea deepens semiconductor ceramics collaboration amid chip industry expansion

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Wednesday 12 August 2026
Fudan's single-electron memory breakthrough opens new path for 2D chip scaling
China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device...
Wednesday 12 August 2026
Topco and Wah Lee post record July sales on semiconductor materials demand

Topco Scientific Co. and Wah Lee Industrial Corp. both reported record July revenue as chipmakers ran at full utilization and customers...

Tuesday 11 August 2026
Global supply chains buckle as helium shortages and China's price edge hit Taiwan

Global supply chains are facing a fresh squeeze as helium shipments, electronic components, and industrial raw materials are hit by...

Monday 10 August 2026
Semiconductor material prices surge across silicon wafers, specialty gases and advanced packaging
Demand for advanced processes and packaging continues to rise, while the Middle East conflict is lifting energy and raw-material costs and tighter Chinese controls on strategic-mineral...
Monday 10 August 2026
From fabs to feedstock: Washington moves electronics supply-chain controls upstream

A cluster of measures signed and drafted since late July has shifted the center of gravity in US supply-chain policy away from finished...

Sunday 9 August 2026
Ajinomoto rides advanced packaging boom as ABF demand surges

Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of...

Friday 7 August 2026
Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
Friday 7 August 2026
Wah Hong speeds AI cooling and semiconductor materials push with Taoyuan pilot line

Wah Hong Industrial Co. said that in the first half of 2026, it accelerated development of high-value-added products, new technologies...

Friday 7 August 2026
Taiwan Innotech Expo to showcase application-ready tech research

The government-organized 2026 Taiwan Innotech Expo (TIE) will open in Taipei on September 17, with the National Science and Technology...

Friday 7 August 2026
China's MLCC supply chain ramps up as AI boom drives global component shortage

China's multilayer ceramic capacitor (MLCC) supply chain is accelerating capacity expansion as surging demand from AI servers and automotive...

Thursday 6 August 2026
Ample Electronic posts record July sales as MLCC demand strengthens

Ample Electronic, a supplier of conductive paste materials for passive components, said strong artificial intelligence demand has helped...

Thursday 6 August 2026
Tesla taps Samsung Electro-Mechanics, LG Innotek for Cybercab camera modules, report says

Tesla has reportedly selected Samsung Electro-Mechanics and LG Innotek to supply camera modules for the Cybercab, a move that would give...

Thursday 6 August 2026
US curbs on Chinese data-center optics open orders to non-China suppliers
The US Federal Communications Commission is reportedly considering restrictions on new models of Chinese-made optical transceivers used in data centers, potentially exposing suppliers...
Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...