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Monday 25 May 2026
Lam Research CEO: New fabs alone will not solve chip bottlenecks
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
Monday 25 May 2026
Nan Pao joint venture nears full capacity as semiconductor demand rises

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced...

Monday 25 May 2026
Huawei targets AI optical networking with InP chip startup investment
Huawei is expanding deeper into AI optical networking and silicon photonics (SiPh) through a new investment in an indium phosphide (InP) optical chip startup, as rising AI data center...
Monday 25 May 2026
BenQ Materials secures US$190M loan to fund shift into medical, semiconductor and display materials
BenQ Materials, part of the BenQ Qisda Group, announced on May 22 that it completed a five-year syndicated loan of NT$6 billion (US$190.4 million) led by E.SUN Bank to refinance debt...
Saturday 23 May 2026
CXMT IPO puts China's DRAM supply-chain push in focus

CXMT's planned Shanghai listing is becoming more than a test of investor appetite for China's top DRAM maker. It is also putting a spotlight...

Friday 22 May 2026
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
Friday 22 May 2026
Memory shortage reaches smartphone OLED market as shipments fall 12%

A global memory shortage is spreading into the smartphone OLED market, cutting handset production and adding pressure on display makers...

Friday 22 May 2026
TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026
BOE, Corning target glass substrates for AI chip packaging

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the...

Thursday 21 May 2026
Tokyo Electron Taiwan drops appeal after court fines unit and jails ex-engineer in TSMC trade secrets case
Tokyo Electron's Taiwan unit said on May 21 that it respected judicial proceedings and would not appeal following a ruling in a trade secrets case involving TSMC. The decision came...
Thursday 21 May 2026
SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US

China's semiconductor self-sufficiency drive has taken another step forward, with SMIC and Hua Hong Group jointly establishing Shanghai...

Wednesday 20 May 2026
U-leam to rely on LEO satellite business while building quantum and medical pipelines
U-leam said LEO satellites will remain its primary growth engine for the next few years, while quantum computing, medical devices, robotics, and drones will form the company's second...
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Tuesday 19 May 2026
TDK expands bonding equipment investment, launches first mass production of nanocomposite materials
Japanese electronic components manufacturer TDK will make its largest-ever capital investment in fiscal 2026, running from April 2026 to March 2027, to address surging demand related...