Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon...
Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...
The global race to build low Earth orbit (LEO) satellite constellations is intensifying, but the massive deployment requirements are straining the aerospace supply chain. As AI data...
Chemical and solvent distributor Yuan Jen Enterprises is actively expanding its electronic materials business. Company chairman Yuan-Jen Hsu stated that Yuan Jen established a dedicated...
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Conflicting signals have emerged regarding the production of Apple's newest iPhone models, particularly the iPhone 18 Pro Max. Media reports on the volume changes appear to reflect...
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Ubiqconn Technology reported September 2026 consolidated revenue of NT$142 million (US$4.4 million), up 32.4% month-on-month and 6.7% year-on-year. Third-quarter revenue rose 9.6%...
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
