Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan's fab engineering firms face tougher labor shortages, regulations,...
Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly...
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...
The European Union is pushing to strengthen domestic second-life battery production and recycling loops, but EV battery recycling still faces a contradiction: the technology is maturing,...
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
