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Wednesday 1 April 2026
Notebook shipment update, February 2026

Introduction

Wednesday 1 April 2026
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
Wednesday 1 April 2026
China memory chip maker Longsys unveils SPU architecture for edge AI storage systems

As AI shifts from cloud training to edge inference, the memory stack is moving beyond data access toward system-level coordination, reshaping...

Wednesday 1 April 2026
ASUS AI Predictive Maintenance Boosts Linyuan Advanced Carbon Black Manufacturing Resilience

Carbon black is a critical functional material underpinning the performance of tires and industrial rubber products. Its production involves a high-intensity, continuous...

Wednesday 1 April 2026
Samsung's 2nm Exynos 2600 loses to Qualcomm's 3nm on battery and thermals
Samsung's Exynos 2600 application processor (AP), built on the company's 2nm process, lags in battery endurance behind Qualcomm's Snapdragon 8 Elite Gen 5 — a 3nm chip —...
Wednesday 1 April 2026
Top 10 Chart: Taiwan's chip toolmakers re-rated as AI bottlenecks trump scale
The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the...
Monday 30 March 2026
DRAM scaling hits limits as next-generation memory faces delays

The global DRAM industry is approaching a structural inflection point, as traditional scaling methods struggle to deliver the performance...

Monday 30 March 2026
Huawei sees 60% surge in Taiwan earphone sales, targets wearables expansion
Huawei Technologies unveiled its 2026 wearable product lineup at a launch event in Taiwan on the March 27. Yong Hai, general manager of Xunwei Technology, the exclusive distributor...
Sunday 29 March 2026
AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

Saturday 28 March 2026
AI tokens emerge as new workplace metric, reshaping productivity and competition
The rapid rise of artificial intelligence is transforming how companies measure productivity and reward employees, with "tokens" — the units that quantify AI model usage —...
Friday 27 March 2026
In-depth: Google TurboQuant cuts LLM memory 6x, resets AI inference cost curve

Google has introduced TurboQuant, a compression algorithm that reduces large language model (LLM) memory usage by at least 6x while boosting...

Thursday 26 March 2026
AI Expo 2026: Surging costs, memory crunch drive shift toward inference, researcher says

Artificial intelligence is entering a new phase in which inference, rather than training, is becoming the dominant driver of computing...

Thursday 26 March 2026
Universal Microwave Technology ramps up OISL output as LEO delivery deadlines threaten supply chains
SATELLITE 2026, the international satellite industry's premier event, runs from March 23 to 26 in Washington, where Universal Microwave Technology, Inc. will once again engage with...
Thursday 26 March 2026
Automakers face costly software gamble as industry shifts to software-defined vehicles
The shift to software-defined vehicles (SDVs) will affect consumers, suppliers, and investors worldwide: automakers face huge upfront R&D and cloud costs, uncertain software revenue,...
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...