中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    Analysis: TSMC's Kumamoto fab unlikely to adopt 2nm process under N-2 export rules
    9min ago
    Analysis: Why China chose multi-accelerator strategy in AI chip development
    9min ago
    China cultivates emerging TPU firms to challenge US AI chips dominance
    9min ago
    South Korea's semiconductor roadmap targets 0.2nm scale by 2040
    9min ago
    Nvidia plans H200 chip delivery to China in 2026 with sixfold performance boost
    9min ago
    Who's on the priority list of supply chains as memory supply shortage squeeze
    9min ago
    NEWS TAGGED PERFORMANCE
    Monday 29 December 2025
    Huawei launches global prize to break memory bottlenecks
    As generative AI and large language models scale rapidly, the computing race is shifting toward a quieter but decisive battleground: how data is stored, accessed, and utilized. According...
    Monday 29 December 2025
    Luna Unveils Luna Band, Voice??Led LifeOS at CES 2026

    Luna, the rapidly rising health-tech company redefining human performance, today unveiled the Luna Band, a groundbreaking new wearable designed to deliver real-time,...

    Monday 29 December 2025
    Global IT and Innovation: Kyrgyz Republic at CES 2026

    The High Technology Park of the Kyrgyz Republic (HTP) will participate in CES 2026, presenting the country's growing strength in artificial intelligence, digital health,...

    Sunday 28 December 2025
    South Korea's AI chips struggle beyond cost advantage
    South Korea's drive to build a domestic artificial intelligence semiconductor industry is hitting a key constraint. Despite gains in power efficiency and pricing, industry executives...
    Sunday 28 December 2025
    TorchTPU collaboration makes software compatibility the new AI hardware battleground
    Google is advancing its TorchTPU initiative to optimize PyTorch performance on its proprietary TPU chips, as reported by Reuters. This effort, undertaken in collaboration...
    Friday 26 December 2025
    Huawei details Ascend AI chip roadmap built around in-house HBM, massive clusters
    Huawei is clarifying how it intends to compete in global AI computing despite being cut off from leading-edge foundries and US-origin GPUs. Instead of chasing rivals on single-chip...
    Friday 26 December 2025
    Samsung, SK Hynix reportedly accelerate HBM4 production to early 2026
    Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...
    Friday 26 December 2025
    SK Hynix targets February HBM4 ramp-up with TSMC, ships final samples to Nvidia
    SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February...
    Wednesday 24 December 2025
    Microsoft CEO reportedly expresses dissatisfaction with Copilot's AI integration with Gmail and Outlook
    Microsoft CEO Satya Nadella has openly criticized the integration performance of the company's AI assistant, Copilot, especially its connection with email platforms such as Gmail...
    Wednesday 24 December 2025
    Taiwan cable maker rides US$3.7 billion grid overhaul wave with orders booked through 2028
    Taiwanese cable giant Ta Tun Electric Wire and Cable (TEWC) held a pre-listing performance briefing on December 23, 2025, revealing that revenue for the first 11 months of 2025 reached...
    Wednesday 24 December 2025
    2D materials: from memory entry to logic's future
    Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable...
    Wednesday 24 December 2025
    AI chips run too hot: Engineers race to reinvent cooling
    The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
    Tuesday 23 December 2025
    Windows handheld gaming device specs and shipments

    Introduction

    Tuesday 23 December 2025
    Moore Threads takes on CUDA with MUSA as China's GPU race shifts to developer ecosystems
    Competition in the GPU industry ultimately comes down to developer ecosystems. Against that backdrop, Moore Threads' inaugural MUSA Developer Conference (MDC 2025) on December 20-21...
    Tuesday 23 December 2025
    Taiwan's motherboard makers balance AI gains with inflation, PC market headwinds in 2025
    Taiwan's leading motherboard manufacturers—AsusTek, GIGABYTE, Micro-Star International (MSI), and ASRock—have navigated a turbulent global economic environment in 2025...
    1/54 pages
    Research Report Database
    BIZ FOCUS
    Dec 24, 08:00
    InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups
    Wednesday 24 December 2025
    Voice AI braille printer Nemonic Dot wins CES 2026 Innovation
    Wednesday 24 December 2025
    How Technology Is Changing How We Game Online
    Wednesday 24 December 2025
    GameSir to Showcase Next-Generation Gaming Hardware at CES 2026
    marketing