Tuesday 18 July 2023
BB ratio for MLCCs rises
The book-to-bill ratio for multi-layer ceramic capacitors (MLCC) has risen to 0.91 on average from 0.84 in April, as orders from ODM customers have resumed, according to sources at...
Wednesday 28 June 2023
Nichidenbo upbeat about revenue growth in 2024
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), expects strong...
Monday 5 June 2023
Samsung's Semco successfully develops automotive MLCC with largest battery capacity
Samsung Electro-Mechanics (Semco) is strengthening its high-temperature and high-voltage automotive product portfolio based on the ultra-small size and ultra-large capacity technical...
Friday 17 March 2023
SEMCO's next hit product: automotive components
Samsung Electro-Mechanics (Semco) has decided to restructure and expand its R&D division for its automotive and related electronic component products. The company aims to accelerate...
Wednesday 1 March 2023
Semco develops FC-BGA substrates for autonomous driving
Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive...
Thursday 23 February 2023
LG Innotek set to mass produce ABF substrates in October
LG Innotek, a leading South Korean supplier of diverse electronics components and materials, is slated to begin first-phase volume production of ABF substrates - its new product line...
Wednesday 31 August 2022
Chinese MLCC industry counts on market size and structural change to challenge Japanese dominance
China's fast-growing multilayer ceramic capacitor (MLCC) market will see the country account for 43.5% of global MLCC demand by 2025, making it the largest, according to the Chinese...
Wednesday 24 August 2022
IC substrate and automotive PCB demand promising
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...
Monday 4 July 2022
Semco to spend more on FCBGA substrate production
Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam.
Wednesday 8 June 2022
ASE, Unimicron to provide packaging, related substrates for new Apple M2 chip
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Thursday 5 May 2022
Semco gearing up for server package substrate production
Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Tuesday 22 March 2022
Semco boosts investment in ABF substrate production
Samsung Electro-Mechanics (Semco) on March 21 announced that it will expand its ABF substrate production capacity at its Busan plant, bringing its total investment in the segment...
Tuesday 22 March 2022
ABF substrate makers continue to see clients queue up for capacity
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Thursday 17 March 2022
Zhen Ding looks to rank among world's top-5 IC substrate suppliers by 2030
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...