35 news items tagged Semco
AiP substrates in growing demand for new mmWave iPhones in 2021
Friday 9 April 2021IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
Japan, Korea PCB makers shifting production focus to IC substrates
Friday 19 March 2021PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Chipmakers placing extra orders for BT substrates amid tight supply
Monday 22 February 2021As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...
Tape COF substrate demand picking up
Friday 19 February 2021Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Taiwan IC substrate suppliers gearing up for mmWave AiP modules
Wednesday 25 November 2020Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...
Concerns rising over tight BT substrate supply for handset SoCs
Friday 20 November 2020Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...
Semco reportedly to exit rigid-flex PCB segment
Thursday 19 November 2020Samsung Electro-Mechanics (Semco) reportedly will phase out its rigid-flex PCB (RFPCB) business in 2021 amid unfavorable factors on both the supply and demand sides, according to...
Taiwan makers poised to scale up AiP substrate shipments in 2021
Thursday 27 August 2020Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Daeduck to expand ABF substrate capacity for Samsung demand
Tuesday 18 August 2020Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...
ABF substrate suppliers see clear order visibility through 2021
Friday 24 July 2020ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all seen their order visibility extend into 2021, thanks to continued robust...
Nittobo plant fire may disrupt global ABF substrate supply
Wednesday 22 July 2020A recent fire that broke out at one of Nittobo's plants in Fukushima, Japan is expected to impact the already-tight supply of ABF substrates worldwide and push up quotes for them,...
Taiwan IC substrate makers land more MediaTek orders for 5G chips
Wednesday 15 July 2020Taiwan-based IC substrate makers including Unimicron Technology and Kinsus Interconnect Technology have seen a ramp-up in BT substrate orders for MediaTek's 5G SoCs as the chipmaker...
Taiwan makers revving up to boost FC-AiP substrate yield rates
Wednesday 1 July 2020Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected...
5G iPhone shipments may be much weaker than expected in 2020, say sources
Tuesday 30 June 2020Shipments of mmWave-enabled 5G iPhones slated for launch later this year are estimated to reach only 15-20 million units in 2020 compared to a previous supply chain estimate of 30-40...
IC equipment maker Group Up upbeat about 3Q20
Monday 29 June 2020Group Up Industrial (GP) has clear order visibility through the third quarter of 2020, thanks to growing demand from its PCB and IC substrate clients looking to ramp up their offerings...
Taiwan PCB makers may penetrate into iPhone supply chain via BOE
Thursday 4 June 2020China-based panel maker BOE reportedly will become an OLED panel supplier for Apple's 5G iPhones in addition to Samsung Display and LG Display, giving Taiwan-based PCB makers a chance...
The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...
Taiwan MLCC, resistor makers see mostly orders with short lead time
Tuesday 7 April 2020Taiwan-based passive component makers have landed mostly short lead time orders recently from clients seeking to replenish their inventory, with order visibility clear just one month...
Yageo sees MLCC, chip resistor inventory hit 10-year low
Thursday 27 February 2020Passive components maker Yageo has seen its inventory for MLCCs and chip resistors hit the lowest levels in nearly 10 years and will properly raise prices to reflect increased costs,...
MLCC, chip resistor prices set to rise through 2020
Tuesday 25 February 2020Prices for MLCCs and chip resistors are expected to rise through the fourth quarter of 2020 as supply will increasingly fall short of demand for 5G applications while fallouts of...
Taiwan PCB makers urged to accelerate capacity relocation amid outbreak
Monday 24 February 2020Taiwan's PCB makers are facing higher risks from the coronavirus outbreak thanks to relatively heavier production deployments in China than their peers in Japan and South Korea, prompting...
MLCC, resistor lead time significantly extended on tight supply
Wednesday 5 February 2020The supply of MLCC and resistor chips is getting increasingly tight with delivery lead time stretching significantly, which may soon push up quotes as major makers including Yageo...
Samsung to source more HDI PCBs from Korea suppliers
Wednesday 25 December 2019Samsung Electronics reportedly will place more orders with its existing suppliers DAP and Korea Circuit, rather than their Taiwanese peers, after the withdrawal of its PCB supply...
Semco quits HDI market to focus on IC substrates
Tuesday 17 December 2019Samsung Electro-Mechanics (Semco), following the footsteps of LG Innotek, has announced quitting the HDI market, officially closing its plant in Kunshan, China to focus on production...
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Tuesday 19 November 2019Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected...