Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...

Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...

ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all seen their order visibility extend into 2021, thanks to continued robust...

A recent fire that broke out at one of Nittobo's plants in Fukushima, Japan is expected to impact the already-tight supply of ABF substrates worldwide and push up quotes for them,...

Taiwan-based IC substrate makers including Unimicron Technology and Kinsus Interconnect Technology have seen a ramp-up in BT substrate orders for MediaTek's 5G SoCs as the chipmaker...

Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected...

Shipments of mmWave-enabled 5G iPhones slated for launch later this year are estimated to reach only 15-20 million units in 2020 compared to a previous supply chain estimate of 30-40...

Group Up Industrial (GP) has clear order visibility through the third quarter of 2020, thanks to growing demand from its PCB and IC substrate clients looking to ramp up their offerings...

China-based panel maker BOE reportedly will become an OLED panel supplier for Apple's 5G iPhones in addition to Samsung Display and LG Display, giving Taiwan-based PCB makers a chance...

The coronavirus pandemic may force many Taiwan-based PCB makers to slow down their capacity expansion plans in the short term due to uncertain market prospects, but Zhen Ding Technology...

Taiwan-based passive component makers have landed mostly short lead time orders recently from clients seeking to replenish their inventory, with order visibility clear just one month...

Passive components maker Yageo has seen its inventory for MLCCs and chip resistors hit the lowest levels in nearly 10 years and will properly raise prices to reflect increased costs,...

Prices for MLCCs and chip resistors are expected to rise through the fourth quarter of 2020 as supply will increasingly fall short of demand for 5G applications while fallouts of...

Taiwan's PCB makers are facing higher risks from the coronavirus outbreak thanks to relatively heavier production deployments in China than their peers in Japan and South Korea, prompting...

The supply of MLCC and resistor chips is getting increasingly tight with delivery lead time stretching significantly, which may soon push up quotes as major makers including Yageo...

Samsung Electronics reportedly will place more orders with its existing suppliers DAP and Korea Circuit, rather than their Taiwanese peers, after the withdrawal of its PCB supply...

Samsung Electro-Mechanics (Semco), following the footsteps of LG Innotek, has announced quitting the HDI market, officially closing its plant in Kunshan, China to focus on production...

Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected...

Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...

LCD driver IC backend specialist Chipbond Technology has reported net profit surged 76.2% from a year earlier to NT$1.98 billion (US$63.2 million) in the first half of 2019. EPS for...

Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...

Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.

COF substrate makers plan to adjust upward quotes for the second quarter by 8-15% sequentially to reflect their tight supplies, according to market sources.

Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...

Samsung Electro-Mechanics (SEMCO) has recently kicked off volume production at its PCB plant in Kunshan, eastern China, raising concerns that the Korea-based company may pose a threat...