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    Exclusive: CSPs drive BBU demand surge with Samsung SDI and Murata expanding production
    6h 38min ago
    China's semiconductor equipment localization raises concerns for global suppliers
    6h 38min ago
    China ships first nanoimprint lithography system amid EUV export controls
    6h 38min ago
    Commentary: Innoscience faces Infineon patent blow after Nvidia breakthrough amid TSMC's GaN exit
    6h 38min ago
    Samsung's TV market dominance challenged by Chinese brands in first half of 2025
    6h 38min ago
    Is the Samsung-Tesla deal enough to build Korean's own TSMC-Apple alliance?
    6h 38min ago
    NEWS TAGGED HPC
    Friday 1 August 2025
    Horng Terng fully booked with orders amid AI chip cooling demand surge
    Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
    Friday 1 August 2025
    ASE maxes out Taiwan backend capacity on AI, automotive demand
    ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
    Wednesday 30 July 2025
    From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
    As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
    Wednesday 30 July 2025
    UALink makes its case: open AI infrastructure takes the spotlight at OCP APAC
    With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
    Tuesday 29 July 2025
    Samsung reportedly expands 8nm foundry client base from Switch 2 to HPC chips
    Samsung Electronics has reportedly secured new clients for its 8nm wafer foundry services through collaboration with its Design Solution Partners (DSPs). This development is expected...
    Tuesday 22 July 2025
    Tenstorrent pushes RISC-V into AI's fast lane with open chiplet strategy
    The rise of AI and high-performance computing (HPC) is accelerating the adoption of RISC-V, the open-source instruction set architecture that is reshaping the global semiconductor...
    Friday 18 July 2025
    TSMC to step up 2nm deployment to meet AI demand
    High-tech Innovators are all partnering with TSMC thanks to its industry-leading 2nm and A16 process technologies, which offer a crucial competitive edge in meeting the endless demand...
    Thursday 17 July 2025
    Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

    Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

    Wednesday 16 July 2025
    Broadcom launches Tomahawk Ultra AI networking chip built on TSMC's 5nm process to challenge Nvidia
    Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely...
    Tuesday 15 July 2025
    GUC tapes out industry-leading UCIe face-up IP for TSMC SoIC-X
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
    Tuesday 15 July 2025
    China approves Synopsys-Ansys merger, but draws red lines on contracts
    On the afternoon of July 14, 2025, China's State Administration for Market Regulation announced its conditional approval of US-based Synopsys' acquisition of Ansys shares. This deal...
    Friday 11 July 2025
    Niching sees stellar 2Q25 results from AI, HPC, and advanced packaging applications
    Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
    Thursday 10 July 2025
    Jim Keller: US restrictions only accelerate China's chip development
    As the global semiconductor competition intensifies, Silicon Valley chip guru and Tenstorrent CEO Jim Keller has shared exclusive insights on China's chip market, export restrictions,...
    Tuesday 8 July 2025
    EDA tool ban lifted, China's PCB industry seizes strategic opening

    As demand surges for AI, HPC, and high-speed communications, the PCB industry is entering a new phase of advanced innovation. Chinese...

    Wednesday 2 July 2025
    Taiwan govt to leverage AI, semiconductor expertise in growing biomedical industry
    Strong demand for high performance computing (HPC) and generative AI (GenAI) has helped drive a 75% year-over-year revenue increase in the IC sector across Taiwan's science parks...
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