PGC (Progate Group Corporation) has recently teamed up with North American strategic allies to meet the growing demand for advanced process technologies in AI, high-performance computing...
Hewlett Packard Enterprise (HPE) has rolled out a new portfolio anchored by the HPE Cray Supercomputing EX system, debuting the industry's first fully fanless direct liquid cooling...
Semiconductor testing interface leader WinWay has achieved record-breaking performance, driven by robust demand for AI, HPC applications, and AI smartphones. The company's AI and...
Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...
Memory intellectual property (IP) firm AP Memory Technology has seen AI drive an uptick in sales, even as its IoT business has yet to rebound. With quarterly gross margin back on...
Chunghwa Precision Test Tech. (CHPT) expects consistent quarterly growth, with fourth-quarter revenue set to benefit from new high-performance computing (HPC) test board orders and...
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
The government-operated Southern Taiwan Science Park (STSP) has capitalized on the global AI surge and the thriving semiconductor sector, generating a record revenue of NT$1.31 trillion...
As power management and heat dissipation become increasingly important with the high-performance computing required for generative AI, a trend is emerging in the field of power supplies:...
TSMC has disclosed that its third-quarter revenue and margins surpassed the guidance it provided three months ago. The pure-play foundry anticipates a 13% sequential increase in revenue...
The ongoing surge in generative AI is propelling demand for advanced testing technologies, with leading testing interface providers Winway and MPI reporting impressive financial results...
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
TSMC will hold an investor meeting on October 17 to review the company's business and market projections, as well as updates on its capital expenditure strategy for the current yea...
Boosted by short-term orders in the electronics supply chain and shipments of AI and high-performance computing (HPC) chips, Taiwan's wafer foundry industry posted better-than-expected...
China's domestically produced HPC processors have advanced; yet, they still struggle to be the preferred option for local cloud and AI companies, according to industry sources.