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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    4h 15min ago
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    4h 15min ago
    Google readies Pixel 11 lineup, market breakthrough still under question
    4h 15min ago
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    4h 16min ago
    China auto brand slump pushes parts makers toward North America, Japan
    4h 16min ago
    Taiwan producer prices surge as non-China supply chains face rising pressure
    4h 16min ago
    NEWS TAGGED HPC
    Monday 10 August 2026
    Samsung unveils 200MP image sensor as Oppo targets first adoption

    Samsung Electronics has launched its next-generation 200-megapixel CMOS image sensor, the ISOCELL HPC, and reports said Oppo is set...

    Wednesday 5 August 2026
    Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging

    Introduction

    Tuesday 4 August 2026
    Taiwan specialty chemical firm expands Taiwan, China capacity on AI materials boom, eyes 20% revenue gain in 2026
    Taiwan-based specialty chemicals supplier Johnson Fine Chemical expects robust growth in electronic materials demand driven by AI, high-performance computing (HPC) and advanced communications...
    Monday 3 August 2026
    Taiwan manufacturing business climate improves in June, headlined by electronics sector
    Taiwan's manufacturing climate improved in June 2026, with the electronics sector once again showing the clearest visibility, according to the Taiwan Institute of Economic Research...
    Monday 27 July 2026
    Pegatron unveils AMD EPYC server platform for AI and HPC
    Pegatron unveiled a new server platform powered by AMD's sixth-generation EPYC processors at AMD Advancing AI 2026, targeting enterprise AI, agentic AI, high-performance computing...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Tuesday 21 July 2026
    AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
    Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer...
    Friday 17 July 2026
    AI server tracker: Taiwan's testing and design service leaders surge on global chip demand

    The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June...

    Thursday 16 July 2026
    AI chips are running hotter — and Niching is betting its future on keeping them cool
    As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
    Thursday 16 July 2026
    TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue

    TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations,...

    Wednesday 15 July 2026
    China's 1H26 IC exports jump 96% on AI hardware demand
    China's IC exports surged in the first half of 2026, underscoring strong demand for AI, data center, and HPC hardware that lifted electronics supply-chain momentum. The General Administration...
    Monday 13 July 2026
    Trans-Sun Materials posts record revenue on AI server and HPC demand

    Trans-Sun Materials Technology posted record revenue for June, the second quarter and the first half of 2026, supported by rising demand...

    Saturday 11 July 2026
    Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

    As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

    Tuesday 7 July 2026
    Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
    As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos...
    Monday 6 July 2026
    Kingboard raises CCL prices again as AI demand tightens PCB material supply
    Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.
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    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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