Global interconnect solutions provider BizLink Group opened a new facility in Tainan on June 26, underscoring its focus on localized R&D and production. Chairman Roger Liang said...
Taiwan is accelerating its shift from a manufacturing base to a tech innovation hub, driven by advances in high-performance computing (HPC) and artificial intelligence (AI). On June...
Aurona Industries, a PCB substrate manufacturer, reported a 1.2% revenue growth in May, driven by higher orders from the electronics industry following a temporary US tariff grace...
Taiwan's export orders for January-May 2024 rose 15% year on year to reach US$263.8 billion, with electronics products recording an over 25% annual growth to break the US$100 billion...
Semiconductor inspection leader MAtek reported consolidated revenue of NT$429 million (US$14.3 million) in May 2025, marking a 1.89% increase from the previous year despite a 2.75%...
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Despite fresh uncertainty under Trump's second term, Taiwan's technology and trade sectors are showing surprising resilience and even growth. While his unpredictable tariff policies...
China's Dawning Information Industry Company (Sugon) and Hygon Information Technology announced plans for a strategic merger on May 25 to consolidate the country's computing power...
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to...
As the global automotive industry rapidly advances toward next-generation electronic and electrical (E/E) architectures, the combined use of domain controllers and zonal controllers...
With the escalating global trade tensions and fresh US tariffs rattling the semiconductor sector, the underlying momentum in high-performance computing (HPC) and AI applications remains...
Foxconn Interconnect Technology has reaffirmed its commitment to supporting Broadcom's co-packaged optics (CPO) initiatives, a transformative technology aimed at reducing signal loss...
Chunghwa Precision Test (CHPT) expects steady demand for high-performance computing (HPC) orders in the second quarter and is seeing increased momentum in automotive applications...
Soaring demand for AI servers has propelled Taiwan's ABF substrate leaders—Unimicron Technology, Kinsus Interconnect Technology, and Nan Ya PCB—to double-digit annual...
