中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    Taiwan's automotive lens market looks promising, but hurdles from China remain
    33min ago
    Lens Technology 1H earnings jump on smartphone demand; robotics, EVs, AR in the pipeline
    40min ago
    How did Germany's automotive AI adoption lagged behind US and China?
    Aug 25, 18:53
    NEWS TAGGED HPC
    Friday 22 August 2025
    Samsung boosts 2nm chip competitiveness with Hyper Cell tech
    Samsung Electronics' foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip...
    Monday 18 August 2025
    YS Tech cautiously optimistic for 2H25; bets on auto, HPC growth
    Yen Sun Technology (YS Tech), a manufacturer of automotive electronics and technology systems, is optimistic that customer orders will return to normal once the US tariff situation...
    Monday 18 August 2025
    Strong AI and HPC demand drives Daxin Materials' dual growth engines, ready to expand capacity
    Daxin Materials reported solid operational performance in the first half of 2025, with expectations for continued growth in the semiconductor and display materials sectors in the...
    Thursday 14 August 2025
    Topoint races to meet surging drill bit demand as AI and HPC boom

    As artificial intelligence (AI) and high-performance computing (HPC) drive explosive growth in demand for advanced printed circuit boards...

    Thursday 7 August 2025
    Giga Storage expands into AI cooling and industrial park development
    Giga Storage announced a partnership with electric bus manufacturer Tron-e on August 5, 2025, to co-develop the Xinpu Tron-e Smart Industrial Park. This initiative marks Giga Storage's...
    Friday 1 August 2025
    Horng Terng fully booked with orders amid AI chip cooling demand surge
    Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
    Friday 1 August 2025
    ASE maxes out Taiwan backend capacity on AI, automotive demand
    ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
    Wednesday 30 July 2025
    From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
    As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
    Wednesday 30 July 2025
    UALink makes its case: open AI infrastructure takes the spotlight at OCP APAC
    With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
    Tuesday 29 July 2025
    Samsung reportedly expands 8nm foundry client base from Switch 2 to HPC chips
    Samsung Electronics has reportedly secured new clients for its 8nm wafer foundry services through collaboration with its Design Solution Partners (DSPs). This development is expected...
    Tuesday 22 July 2025
    Tenstorrent pushes RISC-V into AI's fast lane with open chiplet strategy
    The rise of AI and high-performance computing (HPC) is accelerating the adoption of RISC-V, the open-source instruction set architecture that is reshaping the global semiconductor...
    Friday 18 July 2025
    TSMC to step up 2nm deployment to meet AI demand
    High-tech Innovators are all partnering with TSMC thanks to its industry-leading 2nm and A16 process technologies, which offer a crucial competitive edge in meeting the endless demand...
    Thursday 17 July 2025
    Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

    Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

    Wednesday 16 July 2025
    Broadcom launches Tomahawk Ultra AI networking chip built on TSMC's 5nm process to challenge Nvidia
    Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely...
    Tuesday 15 July 2025
    GUC tapes out industry-leading UCIe face-up IP for TSMC SoIC-X
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
    1/48 pages
    RELATED PHOTOS
    Monday 24 July 2017
    Samsung 8GB HBM2
    Veeam Q3
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES