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    NEWS TAGGED HPC
    Friday 19 June 2026
    Cornelis-powered Lynx supercomputer enters service at LLNL, expanding NNSA computing capacity

    Cornelis Networks has announced the successful deployment of the Lynx supercomputing cluster at the US Department of Energy's Lawrence...

    Wednesday 17 June 2026
    WinWay buys California property to support US expansion in AI and HPC
    WinWay Technologies has bought real estate in California for US$2.28 million to create a local manufacturing and office base, a move that underscores how Asian suppliers are expanding...
    Friday 12 June 2026
    Taiwan OSAT firms gain from AI chip demand and foundry spillover
    The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
    Wednesday 10 June 2026
    WinWay revenue rises on AI and HPC demand
    WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Friday 29 May 2026
    Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
    Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
    Monday 25 May 2026
    Embedded substrates draw AI chip interest as packaging turns strategic
    Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...
    Friday 22 May 2026
    Lam Research launches PLP Center of Excellence, replacing wafers with panels
    Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
    Thursday 7 May 2026
    WinWay April revenue hits second-highest on AI, HPC demand
    WinWay said April 2026 revenue fell nearly 20% from the previous month due to its customer mix and product profile, but still rose more than 50% from a year earlier as orders for AI...
    Tuesday 5 May 2026
    Machvision sales hit a record high on strengthening AOI demand
    Machvision reported consolidated revenue of about NT$343 million (US$10.84 million) for April 2026, up 1.4% from the previous month and 3.75% from a year earlier, marking another monthly...
    Tuesday 5 May 2026
    CHPT posts record April revenue on AI-driven HPC demand
    Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor...
    Monday 4 May 2026
    ADT lands US AI chip deal using Samsung 4nm
    ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
    Thursday 30 April 2026
    Chunghwa Precision Test raises capex as HPC probe card orders hit 30% of sales
    Chunghwa Precision Test Tech reported that strong demand from high-performance computing chip customers drove first-quarter 2026 revenue to NT$1.357 billion (US$43 million) and operating...
    Wednesday 29 April 2026
    Chroma Paper Award: Boosting AI Innovation and Industry-Academia Ties

    Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration...

    Friday 24 April 2026
    SMIC returns to advanced packaging, scales team to boost AI chip strategy

    China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

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    TI
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook