As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Despite fresh uncertainty under Trump's second term, Taiwan's technology and trade sectors are showing surprising resilience and even growth. While his unpredictable tariff policies...
China's Dawning Information Industry Company (Sugon) and Hygon Information Technology announced plans for a strategic merger on May 25 to consolidate the country's computing power...
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to...
As the global automotive industry rapidly advances toward next-generation electronic and electrical (E/E) architectures, the combined use of domain controllers and zonal controllers...
With the escalating global trade tensions and fresh US tariffs rattling the semiconductor sector, the underlying momentum in high-performance computing (HPC) and AI applications remains...
Foxconn Interconnect Technology has reaffirmed its commitment to supporting Broadcom's co-packaged optics (CPO) initiatives, a transformative technology aimed at reducing signal loss...
Chunghwa Precision Test (CHPT) expects steady demand for high-performance computing (HPC) orders in the second quarter and is seeing increased momentum in automotive applications...
Soaring demand for AI servers has propelled Taiwan's ABF substrate leaders—Unimicron Technology, Kinsus Interconnect Technology, and Nan Ya PCB—to double-digit annual...
Taiwan's export orders jumped in March 2025, fueled by rising global demand for AI and high-performance computing (HPC) chips, according to data from Taiwan's Ministry of Economic...
The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
Taiwan Semiconductor Manufacturing Company (TSMC) reported better-than-expected revenue for March and the first quarter of 2025, easing earlier market concerns about earthquake disruptions...
At the 2025 ZGC Forum, Chinese chipmaker Loongson introduced the 3C6000/D—its first dual-socket 2U server fully designed and manufactured in-house. The launch highlights China's...
Taiwan's Ministry of Economic Affairs (MOEA) Department of Statistics reported on March 21 that February export orders hit US$49.45 billion, rising 5.3% from January and surging 31.1%...
