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Tuesday 30 June 2026
Networking demand stays resilient in 3Q26, but component shortages and price hikes cloud outlook
The networking industry is entering its traditional third-quarter peak season, with demand remaining robust in 2026 as AI infrastructure upgrades and the adoption of Wi-Fi 7 continue...
Tuesday 30 June 2026
China's third-largest pure-play foundry's HK filing shows growth, but also rising risks

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position...

Tuesday 30 June 2026
Taiwan optics sector heads into peak season as Apple demand, camera orders rise

Taiwan's optics industry is entering its traditional peak period, with global smartphone demand, Apple's new-device cycle, and rising...

Tuesday 30 June 2026
Nvidia, Firmus partner on Indonesia AI infrastructure project

A new partnership between Nvidia and Firmus aims to expand access to advanced AI computing for customers worldwide, including AI-native...

Tuesday 30 June 2026
PlayNitride expects 2H26 to outperform 1H26, driven by displays and AI glasses
PlayNitride reported revenue of NT$238 million (approx. US$7.5 million) in the first five months of 2026, down 41% year-over-year. The microLED company said stronger custom design...
Monday 29 June 2026
Chengxi approved for Taipei Exchange listing as AI reshapes customer service

Chengxi Information said on June 26 that the Taipei Exchange board approved its listing application, with Mega Securities serving as...

Monday 29 June 2026
AI demand drives Foundry 2.0 market revenue up 23% in 1Q26, says Counterpoint
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators...
Monday 29 June 2026
Wistron expands US production to meet AI server demand

Wistron is stepping up factory spending in the US, Taiwan, and Southeast Asia to meet rising demand for AI servers. The expansion signals...

Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Monday 29 June 2026
Potens expands into AI cooling and power markets, server revenue share hits double digits

With growing demand for AI server cooling and power management solutions, power semiconductor design company Potens reported that revenue...

Monday 29 June 2026
Analysis: Micron gains pricing power as Trump-backed US manufacturing widens margins

Micron's latest earnings point to a shift in the AI hardware boom that could matter far beyond the US. The memory maker's surging revenue...

Monday 29 June 2026
AIC sees double-digit growth as AI infrastructure shifts to rack-level systems
AIC said the global shift from single-server AI computing to rack- and system-level integration is driving coordinated storage, compute, and networking design as a key trend in AI...
Monday 29 June 2026
Niching targets higher margins as heat spreader orders extend through year-end
Advanced packaging is driving demand for heat spreaders, and semiconductor packaging and testing materials supplier Niching Industrial said its acquisition of Ming Chun Yuan Micro...
Monday 29 June 2026
As SpaceX plans more launches, Eson seeks to scale satellite parts business
The global low-Earth orbit satellite industry is moving from buildout to volume growth, with the pace of launches accelerating and supply-chain demand expanding. Eson Precision Industries,...
Monday 29 June 2026
LinkCom leans into AI networking and high-power power modules to drive growth
LinkCom Manufacturing held its 2026 annual general meeting and said rapid AI adoption is driving demand for its magnetic components in high-speed networking, AI data-center power,...