Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator,...

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

China began approving a new batch of indium phosphide (InP) substrate exports in late May 2026, but optical communications supply chain...

Taiwan-based Tongtai Machine & Tool is accelerating its transformation toward high-value manufacturing, leveraging growing opportunities...

Taiwan's memory chip designers are heading into a sharply stronger 2026 as rising memory prices and a wave of AI-driven demand push the...

General Biologicals (GBC) held its shareholders' meeting on the 17th, saying the group is moving from restructuring into scaled, international...