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    NEWS TAGGED TSMC
    Thursday 1 October 2026
    Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move
    As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
    Thursday 1 October 2026
    China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up
    As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...
    Thursday 1 October 2026
    MediaTek TPU orders rise as chip capacity war intensifies
    MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Thursday 1 October 2026
    Lip-Bu Tan calls TSMC a partner rather than a rival
    Intel CEO Lip-Bu Tan stated that Intel's relationship with TSMC is built on partnership rather than rivalry. He noted that a collaborative mindset guides key industry leaders, including...
    Thursday 1 October 2026
    How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
    Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 30 September 2026
    Taiwan backs TSMC's US push but insists core R&D stays home
    Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Wednesday 30 September 2026
    Samsung expects HPC to account for 66% of foundry business by 2029
    Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
    Wednesday 30 September 2026
    TSMC reportedly evaluates Texas fabs as US regional competition intensifies
    TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The...
    Tuesday 29 September 2026
    GlobalFoundries eyes GaN expansion to challenge TSMC in AI

    GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

    Tuesday 29 September 2026
    TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
    VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
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    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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