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NEWS TAGGED TSMC
Friday 3 July 2026
Intel takes aim at TSMC's CoWoS lead with EMIB-T
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...
Friday 3 July 2026
How TSMC quietly turned its supply chain into a 'second fleet'

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term...

Friday 3 July 2026
Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia

Anthropic is exploring a custom AI chip and has held talks with Samsung Electronics as a potential manufacturing partner, joining OpenAI,...

Friday 3 July 2026
TSMC wins approval for US$20 billion Arizona expansion
Taiwan's Department of Investment Review (DIR) under the Ministry of Economic Affairs (MOEA) has approved Taiwan Semiconductor Manufacturing Company's (TSMC) US$20 billion capital...
Friday 3 July 2026
Seoul seeks Kumamoto's chip playbook, but Japan's model isn't easy to copy

As South Korea moves to accelerate a new semiconductor cluster in the country's southwest, ruling-party officials have returned to...

Thursday 2 July 2026
LG Electronics moves into ASIC design services as TSMC ties draw attention
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company...
Thursday 2 July 2026
Socionext to develop TSMC A14 chiplet for AI data center SoCs

Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project...

Thursday 2 July 2026
Cloud AI squeezes 2nm capacity, pressuring mobile SoCs

Mobile system-on-chip (SoC) vendors are collectively upgrading flagship platforms to 2nm in 2026. Beyond the need for better specifications,...

Tuesday 30 June 2026
TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026
AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Monday 29 June 2026
AI demand drives Foundry 2.0 market revenue up 23% in 1Q26, says Counterpoint
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators...
Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Saturday 27 June 2026
ShunSin sees CPO potential, adds TSMC veterans as independents
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...
Friday 26 June 2026
Analysis: Why Apple can't wait out this memory shortage
Apple raised prices across its Mac and iPad lineup on June 25, and the timing wasn't a choice so much as a deadline.