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Friday 26 July 2024
TSMC Foundry 2.0 illustrates growing importance of IC backend, says ASEH
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
Thursday 25 July 2024
Official data reveals record investments in Kyushu attracted by TSMC
According to data from the Kyushu Bureau of Economy, Trade, and Industry, from April 2021 to June 2024, there have been 100 new semiconductor-related investments announced or reported,...
Thursday 25 July 2024
Nexchip joins Chinese indigenization drive with photomask production, aiming for full-service foundry status
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
Thursday 25 July 2024
Chip giants clash: TSMC's Foundry 2.0 takes on Intel's IDM 2.0
With Taiwan Semiconductor Manufacturing Company (TSMC) proposing its Foundry 2.0 model, some industry experts compare it with Intel's IDM 2.0. However, the challenges Intel faces...
Thursday 25 July 2024
TSMC to break ground for German fab at year-end 2024, sources say
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Thursday 25 July 2024
TSMC fab in Germany faces challenges for profitability
TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.
Wednesday 24 July 2024
Who will benefit from a potential tariff war on chips?
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Wednesday 24 July 2024
FOPLP steps forward as foundries compete for packaging talents
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Wednesday 24 July 2024
Will glass substrate packaging dominate?
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Wednesday 24 July 2024
TSMC sees spike in SHR orders from China
TSMC has witnessed an increase in orders from Chinese customers seeking super hot runs (SHR), for which they are willing to pay a 40% premium, according to industry sources.
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
TSMC stands firm amid high costs and Trump's criticism, global chip mass production on target
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Tuesday 23 July 2024
TSMC outpaces Samsung in HPC revenue growth for 2Q24
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Tuesday 23 July 2024
TSMC braces for potential geopolitical variables
TSMC is believed to have adopted three critical strategies in anticipation of the potential geopolitical influences that may arise from the forthcoming US presidential election.
Tuesday 23 July 2024
Trump's protectionist remarks threaten the global chip boom amid AI surge
US presidential candidate Donald Trump's comments accusing Taiwan's chip industry of stealing American business and demanding protection fees have cast a shadow over the booming global...