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    NEWS TAGGED TSMC
    Friday 28 August 2026
    Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
    Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
    Friday 28 August 2026
    Exclusive: IC design faces wire bonding bottleneck in 2027
    Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
    Thursday 27 August 2026
    Google, MediaTek embrace advanced packaging diversification
    Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
    Wednesday 26 August 2026
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    Morgan Stanley said TSMC's advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD's CoWoS usage and reduces Nvidia's share. The...
    Wednesday 26 August 2026
    Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition
    Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...
    Wednesday 26 August 2026
    TSMC's 310mm push threatens Samsung's PLP lead
    Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
    Tuesday 25 August 2026
    TSMC suppliers reportedly plan Taiwan plant for critical chipmaking tubing
    Taiwan's semiconductor supply chain is moving to close a gap that turned costly during the industry's last major crunch: the plastic tubing that carries chemicals through chip fabs...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Monday 24 August 2026
    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
    Monday 24 August 2026
    Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
    DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
    Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the...
    Thursday 20 August 2026
    Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

    Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

    Thursday 20 August 2026
    Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

    One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

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