News tagged TSMC at DIGITIMES

NEWS TAGGED TSMC

Monday 22 June 2026

TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026

Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation

TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...

Monday 22 June 2026

Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...

Saturday 20 June 2026

FPGA firm Efinix lines up TSMC Japan fab as edge AI business grows

Efinix, a Cupertino-based FPGA startup founded in 2012, is making a push into edge AI with its newly launched Titanium Edge series — a family of chips the company says addresses...

Friday 19 June 2026

Apple to work with Intel on US chip design and manufacturing, Trump says

US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform...

Thursday 18 June 2026

FOPLP race heats up as Innolux reportedly teams with TSMC

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...

Thursday 18 June 2026

SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026

TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Wednesday 17 June 2026

Chip supply chains shift: TSMC's capacity crunch reportedly pushes Google, Tesla, BYD toward Samsung

Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain...

Tuesday 16 June 2026

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...

Tuesday 16 June 2026

Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

Tuesday 16 June 2026

TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P

Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...

Tuesday 16 June 2026

TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026

TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Monday 15 June 2026

CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

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