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Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Wednesday 30 September 2026
Taiwan backs TSMC's US push but insists core R&D stays home
Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...
Wednesday 30 September 2026
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
Wednesday 30 September 2026
Samsung expects HPC to account for 66% of foundry business by 2029
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
Wednesday 30 September 2026
TSMC reportedly evaluates Texas fabs as US regional competition intensifies
TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The...
Tuesday 29 September 2026
GlobalFoundries eyes GaN expansion to challenge TSMC in AI

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Thursday 24 September 2026
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Thursday 24 September 2026
Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push
Qualcomm is sticking with TSMC for both of its newly launched 2nm Snapdragon flagship processors, extending the Taiwan foundry's hold on Qualcomm's top-tier mobile chips even as Samsung...
Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Tuesday 22 September 2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
Tuesday 22 September 2026
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...