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    US ban on Chinese optical modules could disrupt AI supply chain
    6h 59min ago
    Old LCD fabs are being repurposed as AI advanced packaging hubs
    6h 59min ago
    Exclusive: STATS ChipPAC plans broad price hikes in 2H26 as AI demand stays strong
    6h 59min ago
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    7h 0min ago
    Eclusive: Wistron lands Oracle AI server order as it adds Lenovo and HPE
    7h 0min ago
    China auto exports shift from price wars to value wars
    7h 0min ago
    NEWS TAGGED TSMC
    Thursday 6 August 2026
    Apple scrambles to secure DRAM as US$1 billion worth of iPhone 18 chips reportedly await packaging

    Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about...

    Thursday 6 August 2026
    GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
    GlobalFoundries (GF) often presents itself as an essential pillar of US semiconductor sovereignty. That claim is partly true, but requires qualification.
    Thursday 6 August 2026
    TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Wednesday 5 August 2026
    AMD says server CPU market to hit US$220B by 2030

    AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

    Wednesday 5 August 2026
    Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
    Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
    Wednesday 5 August 2026
    Cloud AI chipmakers race to secure capacity with long-term deals
    Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
    Tuesday 4 August 2026
    Nvidia RTX 50 graphics card prices climb as TSMC and memory costs rise
    Nvidia GeForce RTX 50 series graphics card prices in South Korea were set to rise by as much as 30% starting in August 2026 as higher wafer costs at Taiwan Semiconductor Manufacturing...
    Tuesday 4 August 2026
    Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

    TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed...

    Monday 3 August 2026
    TSMC Kumamoto fab faces first major quake test with chip-material supplies secured
    A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant,...
    Monday 3 August 2026
    Apple says advanced-node capacity tightens amid 2nm race

    Apple reported its best-ever third-quarter results for fiscal 2026, but its guidance for the fourth quarter showed much slower growth...

    Monday 3 August 2026
    Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
    US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After...
    Monday 3 August 2026
    Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices
    AI-driven chip shortages, rising memory costs and intensifying foundry competition dominated the technology sector, with Intel reviving DDR4 platforms, Qualcomm raising prices, Samsung...
    Saturday 1 August 2026
    At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

    When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

    Friday 31 July 2026
    Powerchip founder Frank Huang dies at 76; vice chair steps in as acting chief

    Powerchip Semiconductor Manufacturing Corp. (PSMC, TWSE: 6770) said in a material-information filing on July 31 that its chairman,...

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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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