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NEWS TAGGED TSMC
Wednesday 16 September 2026
Taiwan, South Korea should stop comparing, says DIGITIMES chairman

As global AI investment continues to expand and US-China geopolitical pressure intensifies, how Taiwan and South Korea can preserve...

Wednesday 16 September 2026
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and...
Wednesday 16 September 2026
Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

Wednesday 16 September 2026
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

Wednesday 16 September 2026
DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
Wednesday 16 September 2026
DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Tuesday 15 September 2026
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
Tuesday 15 September 2026
2nm capacity crunch may keep smartphone SoC makers on split-node strategy through 2027

In 2026, major smartphone system-on-chip (SoC) vendors began moving selected flagship processors to 2nm technology, seeking not only...

Tuesday 15 September 2026
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
"He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
Monday 14 September 2026
Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency,...
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...