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NEWS TAGGED TSMC
Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
TSMC-Sony image sensor venture pushes Japan chip investment to JPY6 trillion

TSMC said on August 11 that it will invest in CMOS image sensor development and mass production with Sony Group in Kumamoto Prefecture,...

Thursday 13 August 2026
Progate posts record profit on TSMC, Synopsys ecosystem gains
Progate Group Corporation posted record second-quarter and first-half 2026 revenue and profit, as stronger operations and deeper ties with the TSMC, Synopsys, and ASE ecosystems boosted...
Wednesday 12 August 2026
DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity
DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with...
Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Tuesday 11 August 2026
TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
Microsoft seeks expanded Maia 300 production to tap into demand for cheaper compute
Microsoft plans to unveil its new Maia 300 accelerator chip this fall, with a public announcement possible as early as next month, according to The Information. Although Microsoft...
Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
Monday 10 August 2026
Sony, TSMC to spend US$6.3 billion on Japan image sensor venture, Nikkei says

Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) plan to invest around JPY1 trillion (approx. US$6.3 billion) in a joint...

Monday 10 August 2026
TSMC July revenue jumps 44.7% to record US$14.5B, 2026 growth forecast tops 40%

Taiwan Semiconductor Manufacturing Company (TSMC) reported record monthly revenue of NT$467.58 billion (approx. US$14.5 billion) for July...