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Wednesday 20 October 2021
Taiwan IC substrate makers cut into supply chain for new-gen Mac chips
Taiwan-based IC substrate suppliers, such as Unimicron Technology, have reportedly cut into the supply chain for Apple's custom-built silicon powering the next generation Macs, and...
Tuesday 31 August 2021
TSMC launches advanced packaging for silicon photonics applications
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Tuesday 31 August 2021
GUC announces ultra-high bandwidth and power efficient die-to-die (GLink 2.0) total solution
Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed that its second-generation GLink 2.0 (GUC multi-die interLink) interface, using TSMC 5nm process and TSMC advanced...
Friday 23 July 2021
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
The highly anticipated 5G telecommunication technology has features such as high bandwidth, broad data connection, and low latency. Since its advent in 2019, 5G has been viewed as...
Tuesday 6 July 2021
NXP and Jio Platforms collaborate for 5G in India
NXP Semiconductors and Jio Platforms (JPL), a subsidiary of Reliance, have announced a collaboration to implement a 5G NR O-RAN small cell solution that incorporates NXP's Layerscape...
Monday 10 May 2021
Chief Telecom to build new datacenter in Taiwan
Taiwan-based telecom solution provider Chief Telecom will establish its fourth datacenter in northern Taiwan with the construction to begin in the second half of the year, according...
Tuesday 27 April 2021
Taiwan 1Q21 international Internet bandwidth over 4,840Gbps
Taiwan's direct Internet connection with 15 countries/regions (including Hong Kong and Macau) reached total bandwidth of 4,840.613Gbps as of the end of first-quarter 2021, increasing...
Tuesday 23 February 2021
Samsung develops high bandwidth memory with built-in AI processing
Samsung Electronics has developed high bandwidth memory (HBM) integrated with artificial intelligence (AI) processing power, dubbed HBM-PIM, according to the company. The new processing-in-memory...
Friday 18 December 2020
CHT revving up for international communication business
Chunghwa Telecom (CHT) has shifted the focus of its international communication business to information security, hybrid cloud, AIoT, big data and CDN (content delivery network) applications,...
Monday 7 December 2020
Chief Telecom expects over 10% growth in 2021 profits
Taiwan-based Chief Telecom expects its profitability to see a double-digit growth on year in 2021 as the pandemic-driven demand for stay-at-home applications will persist, according...
Wednesday 11 November 2020
MediaTek announces new Chromebook chips
MediaTek has unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks, with the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium models.
Monday 26 October 2020
TSMC may move 6th-gen CoWoS to production in 2023
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
Wednesday 21 October 2020
Micron uMCP5 ready for mass production
Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.
Thursday 15 October 2020
ASE provides SiP packaging for Apple-designed UWB chip
Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...