News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Thursday 30 April 2026

Taiwan launches all-photonic network to strengthen data center resilience and AI computing backup

Taiwan President Lai Ching-te has pledged to transform Taiwan into an "AI island," with a key focus on developing an all-photonic network (APN). The National Science and Technology...

Wednesday 29 April 2026

China memory chip designer Montage lifts profit on DDR5, AI server demand

China-based memory interface chip supplier Montage Technology reported solid first-quarter 2026 results, supported by rising demand for AI servers and accelerating adoption of next-generation...

Monday 27 April 2026

What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure

The CPO market is projected to grow at a 142% CAGR from 2026 to 2030 (excl. ELS). As AI clusters scale and 3.2T data rates push copper to its limits, CPO is emerging as a key solut...

Wednesday 22 April 2026

CXMT HBM3 timeline slips, mass production unlikely in 2026

China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory...

Monday 20 April 2026

LEO satellites set to transform in-flight connectivity

For years, one of the most frustrating aspects of long-haul travel has been expensive, slow, and often unreliable in-flight Wi-Fi. With the rapid rise of low Earth orbit (LEO) satellite...

Monday 20 April 2026

SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs

SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads,...

Thursday 16 April 2026

Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge

Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According...

Thursday 16 April 2026

Kbro enters 10G era with NT$10 billion investment, advocates heterogeneous network backup to replace price wars

Taiwan's Kbro Broadband on April 15 unveiled its next-generation 10G broadband service, backed by a planned NT$10 billion (approx. US$316.45 million) investment to upgrade network...

Thursday 16 April 2026

Renesas reports accelerated MRDIMM adoption in China

As AI servers rapidly increase demand for high bandwidth and large-capacity memory, Renesas Electronics noted that, driven by strong demand in China and expanding capacity, its Memory...

Wednesday 8 April 2026

AI server boom lifts Taiwan's ACES Electronics into the high-speed interconnect race

As AI servers grow more complex and bandwidth demands surge, components once considered peripheral—connectors and high-speed cables—are emerging as critical determinants...

Wednesday 1 April 2026

Micron reportedly developing stacked GDDR to address shifting AI memory demand

Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

Monday 30 March 2026

AI compute shifts to inference, reshaping data center bottlenecks

The focus of artificial intelligence computing is set to shift from training to inference beyond 2025, a transition that will also redefine...

Tuesday 24 March 2026

Huawei's Ascend 950PR debuts with nearly 3x H20 performance, targets China's AI compute gap

Huawei has officially launched its Ascend 950PR processor and introduced the Atlas 350 AI accelerator card equipped with this chip, marking the commercial debut of its next-generation...

Monday 16 March 2026

HyperLight, UMC, and Wavetek form foundry partnership for high-volume TFLN chiplet production

HyperLight Corporation, United Microelectronics Corporation (UMC), and Wavetek Microelectronics Corporation, a wholly owned UMC subsidiary, have announced a strategic manufacturing...

Thursday 12 March 2026

UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers

United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook