The global race to build ever-larger AI models is intensifying, and the battle is no longer confined to Nvidia's powerful GPUs. Another crucial, though less visible, component has...
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
SK Hynix is partnering with flash memory manufacturer Sandisk to jointly promote the standardization of High Bandwidth Flash (HBF) technology. The two companies plan to leverage synergies...
The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...
Chunghwa Telecom (CHT) continues to advance its Asia-Pacific broadband network layout. Following the announcement on July 16, 2025, of its investment in the AUG East new submarine...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...
Huawei's CloudMatrix 384 supernode, powered by its Ascend 910 series AI processors, is positioning itself as a viable challenger to Nvidia's newly launched GB200 NVL72, despite trailing...
Nvidia CEO Jensen Huang said the company will no longer include China in its official forecasts, signaling a pivotal shift in how the US chip giant navigates the intensifying tech...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
