News tagged bandwidth at DIGITIMES

NEWS TAGGED BANDWIDTH

Thursday 27 November 2025

SK Hynix reportedly to debut industry's fastest 48Gbps GDDR7 memory at ISSCC 2026

SK Hynix is reportedly set to unveil the fastest graphics double data rate 7 (GDDR7) memory with a data rate of 48 gigabits per second (Gbps), aiming to boost its competitiveness...

Wednesday 26 November 2025

Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation

The manufacturing industry is facing major changes with the rapid development of artificial intelligence (AI) technology, which has made computing power and AI application...

Tuesday 18 November 2025

PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys' Next-Generation Interface and Memory IP on Advanced Nodes

As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...

Friday 14 November 2025

Baidu sets a new Kunlun chip trajectory as chair questions the AI boom

Baidu used its World 2025 conference on November 13, 2025, to reset its long-term AI strategy, with founder and chairman Robin Li and EVP Shen Dou detailing how the company plans...

Wednesday 12 November 2025

AMD's latest product roadmap revealed, Zen 7 debuts

AMD unveiled its latest CPU and GPU product roadmap during investor day, confirming the launch of the Zen 6 architecture built on TSMC's 2nm process in 2026. The next-generation Zen...

Monday 10 November 2025

AI drives shift to memory-centric computing, redefining semiconductor supply chains

The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models...

Tuesday 4 November 2025

Cisco unveils AI cloud network solutions to optimize enterprise management

As AI applications expand from data centers to various enterprise work environments, demands for network bandwidth, low latency, and intelligent management are rising. Cisco has introduced...

Friday 31 October 2025

UMC and Samsung present advanced packaging trends at APDC 2025

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...

Friday 17 October 2025

Apple releases M5 chip with 30% higher memory bandwidth and enhanced NPU

Apple quietly launched new MacBook, iPad, and Vision Pro products equipped with its latest M5 chip on the evening of October 15, 2025, in Taiwan, generating considerable public attention...

Friday 17 October 2025

Samsung targets 3TB/s HBM4E as Nvidia pushes bandwidth race

Samsung Electronics revealed it is developing its seventh-generation high-bandwidth memory (HBM4E), with a target bandwidth of over 3TB per second. The announcement comes as Nvidia...

Tuesday 14 October 2025

OCP Summit: BizLink's strategic play for AI infrastructure leadership

At the 2025 OCP Global Summit, Taiwan-based interconnect solutions provider BizLink unveiled a full suite of high-speed connectivity and AI-ready data center solutions, showcasing...

Wednesday 8 October 2025

Samsung joins HBF development race, leveraging NAND dominance to reshape market

Samsung Electronics, the leader in NAND flash, has reportedly entered the high-bandwidth flash (HBF) memory market, signaling a potential shift in the competitive landscape of next-generation...

Saturday 27 September 2025

When LLMs outgrow the chip: Huawei's P/D separation redefines design choices

At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture...

Friday 26 September 2025

South Korean startup to launch Samsung 4nm-process LPU chip, at one-tenth cost of Nvidia's H100

South Korean startup HyperAccel—an IC design firm focusing on AI semiconductors for large language models (LLM)—will launch a language processing unit (LPU) AI chip using...

Wednesday 24 September 2025

China-based Longsys jumps on SOCAMM2 as Nvidia skips first-gen spec

The AI memory market is taking shape rapidly. China's Longsys has launched enterprise SOCAMM2 modules built on LPDDR5/5X, aiming to seize early opportunities in next-generation AI...

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