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    Insight: Alibaba built a three-layer AI investment strategy around chips, memory and models
    Jul 22, 18:36
    UK opens up more to China as international academic collab shifts
    Jul 22, 18:36
    Commentary: Intel must prove AI demand can turn into deliverable capacity
    Jul 22, 18:35
    Commentary: Why are Chinese automakers finding it so hard to cut dependence on CATL?
    Jul 22, 18:22
    US auto industry races to replace China-linked connected vehicle hardware and software
    Jul 22, 18:18
    NEWS TAGGED BANDWIDTH
    Wednesday 22 July 2026
    Nvidia details Vera CPU for agentic AI workloads
    Nvidia has outlined the design of its Vera CPU, positioning the chip for agentic AI systems that rely heavily on the processor for code execution, tool calls, retrieval, and data handling...
    Wednesday 22 July 2026
    WAIC 2026: Biren's 1,024-GPU NPO super node sharpens China's AI infrastructure race

    Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence...

    Friday 17 July 2026
    China's AI chips hit three walls — and bet on 3D memory to break through
    China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
    Thursday 16 July 2026
    Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
    Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
    Wednesday 15 July 2026
    Huawei to unveil largest Ascend SuperPoD at Xi-opened WAIC , scaling China's AI infrastructure

    Huawei will publicly display its Atlas 950 SuperPoD AI computing system for the first time at the 2026 World Artificial Intelligence...

    Wednesday 15 July 2026
    China's Orient Computing unveils 14nm AI chip designed to bypass HBM constraints

    Shanghai Orient Computing Core Technology has launched the DF1000, a 14-nanometre AI accelerator that uses software-defined computing...

    Tuesday 14 July 2026
    Rambus unveils DDR5 9600 chipset for next-generation AI servers
    Rambus has introduced a new DDR5 9600 server RDIMM chipset aimed at faster, denser data center memory systems. The move matters beyond one supplier because higher bandwidth and better...
    Monday 13 July 2026
    SK Hynix hybrid bonding push signals next phase of HBM packaging race
    SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
    Sunday 5 July 2026
    Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
    Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
    Friday 3 July 2026
    Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
    DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
    Monday 29 June 2026
    Taiwan joins post-HBM memory race with Intel, SoftBank

    Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

    Thursday 25 June 2026
    Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
    Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
    Thursday 25 June 2026
    Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
    Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone...
    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Friday 12 June 2026
    Overcoming the High-Speed Semiconductor Testing Challenge

    As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation...

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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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