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Thursday 1 June 2023
Micron intros new PCIe Gen5 SSD and DRAM offerings for high-throughput apps
Micron Technology has introduced the Crucial Pro series, which consists of memory and storage products designed for gamers, content creators, workstation professionals, and anyone...
Monday 29 May 2023
Ayar Labs raises another US$25 million in latest funding round
Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...
Tuesday 16 May 2023
Samsung develops DRAM supporting CXL 2.0
Samsung Electronics has developed what the company claims is the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Intel and Samsung collaborated...
Monday 24 April 2023
Marvell demos 3nm data infrastructure silicon
Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm)...
Friday 24 February 2023
AI chatbots may help shorten DRAM market slump
The emergence of generative AI technologies, such as ChatGPT, may assist the DRAM market in recovering from its slump sooner than expected, according to industry sources.
Monday 13 February 2023
Samsung, SK Hynix eyeing CXL memory solutions for auto applications
Major memory suppliers Samsung Electronics and SK Hynix reportedly are gearing up to develop CXL (compute express link)-based memory solutions, and the integration of CXL technology...
Friday 13 January 2023
South Korean makers urged to develop memory-based logic chips
To sustain their leaderships in the global memory market, South Korean memory makers have to step up the development of new-generation memory technology and memory-based logic chips,...
Tuesday 27 December 2022
Enterprise storage demand to pick up as early as 2Q23
Enterprise SSD and other storage device demand is expected to pick up as early as the second quarter of 2023, according to industry sources.
Thursday 8 December 2022
SK Hynix develops MCR DIMM
SK Hynix has developed working samples of DDR5 multiplexer combined ranks (MCR) dual in-line memory module, which the memory chipmaker claims is the world's fastest server DRAM pro...
Monday 21 November 2022
Nvidia set to launch lower-spec AI GPU for sales to China
Nvidia is expected to advance the rollout of a downgraded version of its AI chips, dubbed AI 800, for shipments to Chinese clients in response to restrictions on its China-bound sales...
Tuesday 15 November 2022
AliCloud commercializes China's first homegrown cloud processor
China's top cloud service provider Alibaba Cloud (AliCloud) has recently announced that its self-developed cloud-native processor Yitian 710 has entered large-scale commercial applications...
Friday 11 November 2022
SK Hynix DDR5 and CXL solutions validated for new AMD EPYC processors
SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.
Monday 19 September 2022
Suppliers set to enter production race for 3D NAND with 200+ layers
Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...
Tuesday 16 August 2022
Taiwan optical fiber devices vendors upbeat about 2H22 sales
Taiwan's suppliers of optical communications devices including Browave, EZconn, APAC Opto Electronics and Apogee Optocom have all posted impressive revenue and profit gains for the...
Wednesday 27 July 2022
Micron kicks off volume production of 232-layer NAND
Micron Technology has kicked off volume production of what the company claims is the world's first 232-layer NAND flash memory.
Tuesday 14 November 2017
Micron 32GB NVDIMM-N
Micron Technology's new 32GB NVDIMM-N offers twice the capacity of existing NVDIMMs, providing system designers with new flexibility to work with larger data sets in fast persistent memory. According to the vendor, the solution is designed to support the increasing performance, energy efficiency and uptime requirements of data analytics and online transaction processing applications. Compared to server configurations using traditional far storage, deploying NVDIMMs can deliver up to 400% performance benefits, Micron claimed.The new innovation in persistent memory offers a solution for near-memory data analysis and addresses rising bandwidth demands of data-rich applications in markets such as finance, medicine, retail, and oil and gas exploration. VMware and Dell are collaborating with Micron to increase the performance for virtualized applications. With virtual persistent memory, customers can now run multiple operating systems in a virtualized environment while reducing overall network traffic.
Monday 24 July 2017
Samsung 8GB HBM2
Samsung Electronics has increased the production volume of its 8GB high bandwidth memory-2 (HBM2) to meet growing market needs across a wide range of applications including AI, high-performance computing (HPC), advanced graphics, network systems and enterprise servers. Samsung's 8GB HBM2 consists of eight 8Gb HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps. With each die containing over 5,000 TSVs, a single Samsung 8GB HBM2 package has over 40,000 TSVs, according to the vendor. The utilization of so many TSVs, including spares, ensures high performance, by enabling data paths to be switched to different TSVs when a delay in data transmission occurs. The HBM2 is also designed to prevent overheating beyond certain temperature to guarantee high reliability. In meeting increasing market demand, Samsung anticipates that its volume production of the 8GB HBM2 will cover more than 50% of its HBM2 production by the first half of 2018.
Wednesday 9 December 2015
Samsung 128GB TSV DDR4 RDIMM
Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules for enterprise servers and data centers. The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20nm-based 8Gb chips assembled with TSV packaging technology. Samsung's 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400Mbps, while cutting power usage by 50%, compared to using the previous highest capacity DRAM modules - 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding. Samsung added the company will continue to introduce TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.
AROUND THE WEB
Samsung and SK Hynix enjoy a rush of orders for new memories
Tuesday 14 February 2023
Jun 2, 09:06
STMicroelectronics introduces automotive inertial module with certified ASIL B software library for a broad range of automotive applications
Friday 2 June 2023
First AI-enhanced smart accelerometers from STMicroelectronics raise performance and efficiency for always-aware applications
Thursday 1 June 2023
STMicroelectronics makes lithium batteries perform better and last longer with high-accuracy BMS controller
Thursday 1 June 2023
Computex 2023 opens with the world's best igniting the AI craze
Qualcomm sees 2024 a big year for its PC processor biz
Nvidia open to partnership with Intel, says CEO
China PMIC makers bearing the brunt as TI cuts price for market shares
Global foundry revenue to drop 9% in 2023, says DIGITIMES Research
Modi's US$24 billion manufacturing push is stuck on the assembly line
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
DIGITIMES Research expects shipments of 2.5–3 million units for upcoming MacBook Air in 2023
China battery makers to enjoy boom in upcoming years thanks to energy-storage demand, says DIGITIMES Research
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