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Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Thursday 5 May 2022
Silicon Labs working closely with Taiwan foundries, OSATs
Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
Friday 22 April 2022
TSMC sets timetable to commercialize 2nm GAA process in 2025
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Wednesday 20 April 2022
ASE gearing up for HPC chip boom
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Thursday 14 April 2022
Micron shipping 16Gb GDDR6X for new Nvidia graphics card
Micron Technology has announced the volume production of its new 16Gb GDDR6X memory, which is now shipping in the Nvidia GeForce RTX 3090 Ti graphics card.
Friday 11 March 2022
Ayar Labs announces additional traction for silicon photonics
Ayar Labs has announced it is partnering with Lumentum, the largest manufacturer of optical and photonics products, to deliver CW-WDM MSA compliant external laser sources in high...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Thursday 30 December 2021
Nanya to break ground for new DRAM plant in 1H22
Nanya Technology plans to break ground for a new DRAM plant in the first half of 2022 in an effort to meet growing market demand, and expects to invest a total of NT$300 billion (US$10.86...
Tuesday 14 December 2021
5G private networks expected to go online in Taiwan in 2022
The government in Taiwan is expected to issue operating licenses for 5G private networks to qualified enterprise applicants in 2022, and related players are stepping up preparations...
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Wednesday 24 November 2021
Metaverse applications to bring new opportunities for memory supply chain
Looming metaverse applications are expected to generate massive data drastically triggering storage demand, which will generate new business opportunities for memory vendors and backend...
Tuesday 23 November 2021
MediaTek validates Micron LPDDR5X for flagship 5G smartphone SoC
MediaTek has validated Micron Technology's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 flagship chipset for 5G smartphones, according to Micron.
Friday 19 November 2021
AMD, MediaTek teaming up
AMD and MediaTek have jointly announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 series Wi-Fi 6E modules containing MediaTek's...
Tuesday 14 November 2017
Micron 32GB NVDIMM-N
Micron Technology's new 32GB NVDIMM-N offers twice the capacity of existing NVDIMMs, providing system designers with new flexibility to work with larger data sets in fast persistent memory. According to the vendor, the solution is designed to support the increasing performance, energy efficiency and uptime requirements of data analytics and online transaction processing applications. Compared to server configurations using traditional far storage, deploying NVDIMMs can deliver up to 400% performance benefits, Micron claimed.The new innovation in persistent memory offers a solution for near-memory data analysis and addresses rising bandwidth demands of data-rich applications in markets such as finance, medicine, retail, and oil and gas exploration. VMware and Dell are collaborating with Micron to increase the performance for virtualized applications. With virtual persistent memory, customers can now run multiple operating systems in a virtualized environment while reducing overall network traffic.
Monday 24 July 2017
Samsung 8GB HBM2
Samsung Electronics has increased the production volume of its 8GB high bandwidth memory-2 (HBM2) to meet growing market needs across a wide range of applications including AI, high-performance computing (HPC), advanced graphics, network systems and enterprise servers. Samsung's 8GB HBM2 consists of eight 8Gb HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps. With each die containing over 5,000 TSVs, a single Samsung 8GB HBM2 package has over 40,000 TSVs, according to the vendor. The utilization of so many TSVs, including spares, ensures high performance, by enabling data paths to be switched to different TSVs when a delay in data transmission occurs. The HBM2 is also designed to prevent overheating beyond certain temperature to guarantee high reliability. In meeting increasing market demand, Samsung anticipates that its volume production of the 8GB HBM2 will cover more than 50% of its HBM2 production by the first half of 2018.
Wednesday 9 December 2015
Samsung 128GB TSV DDR4 RDIMM
Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules for enterprise servers and data centers. The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20nm-based 8Gb chips assembled with TSV packaging technology. Samsung's 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400Mbps, while cutting power usage by 50%, compared to using the previous highest capacity DRAM modules - 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding. Samsung added the company will continue to introduce TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.
May 27, 10:24
Empower manufacturing with AI: Into new era of smart manufacturing with collective wisdom
Tuesday 24 May 2022
MSI unveils new lineup at Computex 2022 Online
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Thursday 19 May 2022
Computex Focus: DataVan to showcase new retail solutions for new normal
Renesas to reopen Kofu factory as 300mm wafer fab dedicated for power semiconductors
IC design houses bracing for cutback in orders from China handset brands
TSMC to move CoWoS-L technology to commercial production in 2 years
Intel makes key investments to advance datacenter sustainability
Concerns rising over potential foundry overcapacity in 2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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