Baidu used its World 2025 conference on November 13, 2025, to reset its long-term AI strategy, with founder and chairman Robin Li and EVP Shen Dou detailing how the company plans...
AMD unveiled its latest CPU and GPU product roadmap during investor day, confirming the launch of the Zen 6 architecture built on TSMC's 2nm process in 2026. The next-generation Zen...
The evolution of artificial intelligence (AI) is transforming the semiconductor industry, shifting the focus from sheer compute power to memory-centric architectures. As AI models...
As AI applications expand from data centers to various enterprise work environments, demands for network bandwidth, low latency, and intelligent management are rising. Cisco has introduced...
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
Apple quietly launched new MacBook, iPad, and Vision Pro products equipped with its latest M5 chip on the evening of October 15, 2025, in Taiwan, generating considerable public attention...
Samsung Electronics revealed it is developing its seventh-generation high-bandwidth memory (HBM4E), with a target bandwidth of over 3TB per second. The announcement comes as Nvidia...
At the 2025 OCP Global Summit, Taiwan-based interconnect solutions provider BizLink unveiled a full suite of high-speed connectivity and AI-ready data center solutions, showcasing...
Samsung Electronics, the leader in NAND flash, has reportedly entered the high-bandwidth flash (HBF) memory market, signaling a potential shift in the competitive landscape of next-generation...
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture...
South Korean startup HyperAccel—an IC design firm focusing on AI semiconductors for large language models (LLM)—will launch a language processing unit (LPU) AI chip using...
The AI memory market is taking shape rapidly. China's Longsys has launched enterprise SOCAMM2 modules built on LPDDR5/5X, aiming to seize early opportunities in next-generation AI...
China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The...
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the...
At Huawei Connect 2025 in Shanghai, Huawei introduced the Atlas 950 SuperPoD and debuted UnifiedBus 2.0 (UB 2.0), its optical interconnect protocol that will be opened to industry...
