Samsung Electronics, the leader in NAND flash, has reportedly entered the high-bandwidth flash (HBF) memory market, signaling a potential shift in the competitive landscape of next-generation...
At Huawei Connect 2025, Huawei rolled out its Ascend 950, 960, and 970 AI chips with a three-year roadmap, headlined by the Ascend 950's new "P/D separation" design. The architecture...
South Korean startup HyperAccel—an IC design firm focusing on AI semiconductors for large language models (LLM)—will launch a language processing unit (LPU) AI chip using...
The AI memory market is taking shape rapidly. China's Longsys has launched enterprise SOCAMM2 modules built on LPDDR5/5X, aiming to seize early opportunities in next-generation AI...
China is moving aggressively into the high-performance DRAM market dominated by Samsung Electronics and SK Hynix, with its sights set on customized high-bandwidth memory (HBM). The...
Despite previously facing overheating issues, Samsung Electronics is preparing to supply its fifth-generation high bandwidth memory (HBM3E) to Nvidia. However, opinions within the...
At Huawei Connect 2025 in Shanghai, Huawei introduced the Atlas 950 SuperPoD and debuted UnifiedBus 2.0 (UB 2.0), its optical interconnect protocol that will be opened to industry...
Samsung Electronics has reportedly passed Nvidia's quality testing for 12-layer fifth-generation high bandwidth memory (HBM3E) and is set to begin shipments, according to multiple...
Nvidia has launched its latest Rubin CPX GPU aimed at applications in the era of large-scale inference for AI. According to research firm SemiAnalysis, the launch represents a new...
US export controls have capped the performance of Nvidia's "China-only" GPUs, opening the door for domestic chipmakers to compete. Huawei's Ascend roadmap, announced at its 2025 Connect...
Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend...
Huawei is pressing ahead with its in-house chip and AI infrastructure strategy despite escalating US–China tech tensions. At Huawei Connect 2025 in Shanghai, deputy and rotating...
Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context...
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
