Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...
Chunghwa Telecom (CHT) continues to advance its Asia-Pacific broadband network layout. Following the announcement on July 16, 2025, of its investment in the AUG East new submarine...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...
Huawei's CloudMatrix 384 supernode, powered by its Ascend 910 series AI processors, is positioning itself as a viable challenger to Nvidia's newly launched GB200 NVL72, despite trailing...
Nvidia CEO Jensen Huang said the company will no longer include China in its official forecasts, signaling a pivotal shift in how the US chip giant navigates the intensifying tech...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Chunghwa Telecom has announced a collaboration with Asus subsidiary Askey Computer to strengthen its enterprise private network solutions with homegrown Wi-Fi technology. The project...
Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered...
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is...
Chunghwa Telecom (CHT) is intensifying its international network infrastructure investments as it approaches its 30th anniversary in 2025, focusing on a resilient connectivity strategy...
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
