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    MediaTek invests US$90 million in SiPh startup Ayar Labs
    Mar 2, 18:00
    South Korea enters emergency state, monitoring Middle East tensions
    Mar 2, 18:00
    Getac sees new opportunities from rising defense budgets and digitalization amid Middle East conflict
    Mar 2, 18:00
    Samsung launches Galaxy S26 with Gemini AI agent, signaling next-gen mobile assistant trend
    Mar 2, 18:00
    Tesla Optimus faces off against Nvidia-led alliance in AI robot competition
    Mar 2, 18:00
    Commentary: German chancellor's Unitree visit highlight pressure on European manufacturing
    Mar 2, 18:00
    NEWS TAGGED BANDWIDTH
    Tuesday 3 March 2026
    FIT unveils 102.4T CPO external laser solution for AI data centers at OFC 2026
    As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps...
    Monday 2 March 2026
    Commentary: Nvidia sparks silicon photonics race, yet copper still anchors data centers?
    As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and...
    Monday 2 March 2026
    Nvidia's Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
    Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both...
    Wednesday 18 February 2026
    Samsung advances LPDDR5X-PIM, signaling memory's new role in AI computing

    Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now memory bandwidth,...

    Friday 13 February 2026
    Citi flags post-HBM shift as edge memory, HBF advance
    A Citi analyst said the next phase of artificial intelligence (AI) memory demand will extend beyond high-bandwidth memory (HBM), pointing to emerging opportunities in physical AI devices...
    Friday 13 February 2026
    SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
    SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...
    Saturday 7 February 2026
    Microsoft's Maia 200 chip targets AI inference cost advantage, not Nvidia rivalry
    Microsoft recently unveiled its second-generation custom AI chip, Maia 200, more than two years after its previous generation. The Maia chip's update cycle lags behind the rapid iterations...
    Tuesday 3 February 2026
    SK Hynix achieves major breakthrough in HBM4 quality tests, eyes stable supply for Nvidia Rubin
    SK Hynix has reportedly made significant progress in the quality testing of Nvidia's sixth-generation high-bandwidth memory (HBM4) products, boosting the likelihood that it will become...
    Saturday 31 January 2026
    Intel signals return to memory with new DRAM bonding research
    In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to...
    Wednesday 28 January 2026
    Lightmatter leverages Taiwan ecosystem to bridge the gap between photonics prototypes and production
    Lightmatter is hosting its Tech Day in Taiwan on January 28, 2026, following the announcement of strategic partnerships with Global Unichip Corp. (GUC), Cadence Design Systems, and...
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

    Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

    Tuesday 27 January 2026
    The end of the copper age? Lightmatter builds an alliance to power the optical future

    In a major coordinated push to reshape high-performance computing, Lightmatter has announced strategic collaborations with Global Unichip Corp....

    Tuesday 27 January 2026
    Microsoft launches Maia 200 AI chip, mass production progress draws attention
    Microsoft officially introduced its second-generation AI accelerator, Maia 200, on January 27, marking its continued efforts in chip development since 2019. The new chip emphasizes...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Wednesday 21 January 2026
    China races to catch up with memory chip leaders in LPDDR6
    China's semiconductor supply chain is accelerating plans to bring sixth-generation low-power DRAM, known as LPDDR6, into commercial use in 2026, seeking to close a long-standing technology...
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    Best AI Awards 2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook