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Monday 7 September 2026
DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia
DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make...
Monday 7 September 2026
China's power battery sector maintains strong growth momentum as global market presence expands
China's power battery industry has reported robust growth through the first seven months of 2026, driven by rising demand across both electric vehicles and stationary energy storage...
Monday 7 September 2026
India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus
HyperVault, a Tata Consultancy Services (TCS) subsidiary, has secured 264 acres in Hyderabad to build a large AI data center campus capable of reaching 1GW of capacity. The project...
Monday 7 September 2026
JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
Monday 7 September 2026
Chicony Power's August revenue dips as AI server and satellite demand strengthens
Chicony Power Technology Co. said its August revenue slipped as a memory shortage hit demand for notebook power supplies. Still, stronger orders for AI server and satellite communications...
Monday 7 September 2026
Foxconn revenue climbs on AI server demand, outlook improves
Foxconn said August sales rose sharply from a year earlier as demand for AI servers and related hardware continued to lift its cloud and networking business. The latest update suggests...
Monday 7 September 2026
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
Monday 7 September 2026
Wah Lee sees faster growth in 2027 as supply stays tight
Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
Monday 7 September 2026
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding...
Monday 7 September 2026
No foundry price relief before 2027 as utilisation nears 90%

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

Monday 7 September 2026
Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
Monday 7 September 2026
AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein
AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...
Monday 7 September 2026
India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments,...

Monday 7 September 2026
Acer hedges memory price shock with local AI, diversification
Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds...
Sunday 6 September 2026
TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...