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Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Wednesday 2 September 2026
Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand
Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed...
Wednesday 2 September 2026
Certain Micro targets AI test-interface demand with three Semicon products
As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...
Wednesday 2 September 2026
Energy and water: How to tackle the fab resource crunch
As artificial intelligence demand drives astronomical growth in advanced chip manufacturing, the semiconductor industry is hitting critical resource bottlenecks. Speaking at SEMICON...
Wednesday 2 September 2026
European chip ambitions hinge on more than subsidies, says TSMC
The EU is pressing ahead with the European Chips Act and discussing a second phase, but TSMC says public money alone will not secure a durable semiconductor base. The company argues...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
AI demand push expands wafer industry's growth outlook
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Wednesday 2 September 2026
Taiwan materials makers see new opening in chip packaging shift
Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
Wednesday 2 September 2026
TSMC says Europe chip strategy is shifting from plans to demand creation
The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...
Wednesday 2 September 2026
Dell says enterprise AI customers accelerated even faster than its record orders suggest
Dell Technologies' quarterly results showed record AI server orders and backlog, but executives used the earnings call's question-and-answer session on September 1 to disclose a more...
Wednesday 2 September 2026
UMC targets 12-inch TFLN to break 400G SiPh bottleneck
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Wednesday 2 September 2026
How Taiwan is closing its semiconductor materials gap — three shifts to watch
Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute...
Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...