Amazon plans about US$220 billion in capital expenditure in 2026, mainly for cloud and AI infrastructure, but delays in data center power and construction are causing server racks...
Intel is accelerating work on its long-delayed US semiconductor manufacturing projects, with equipment installation underway at its Fab 62 facility in Arizona and construction progressing...
PCB makers are expanding sustainability efforts as artificial intelligence (AI) and high-performance computing (HPC) drive demand for higher-performance boards. Still, the industry...
Apple Inc.'s first foldable phone, the iPhone Duo, has exceeded sales expectations since preorders opened on October 16, 2026. Supply constraints have extended delivery times to January...
Apple has raised its iPhone Duo shipment target by 44%, from 9.7 million to 14 million units over 12 months, as strong consumer demand for its first foldable iPhone prompts the company...
As Nvidia expands its chip business beyond technology giants into emerging AI markets such as new cloud providers, it has become a "central bank" helping these companies expand by...
Rapid growth in AI-driven demand is placing new pressure on the printed circuit board (PCB) supply chain, with equipment constraints, shorter product...
Liquid cooling is becoming mainstream in AI servers, prompting data-center customers to assess pumps that can move 100 metric tons of water per hour as chip heat rises. Taiwan pump...
China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips...
Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and that the company's multi-year build-out of 12-inch wafer...
IBM's third quarter went some way towards answering whether the deal slippage that hit its second quarter reflected weaker demand or delayed timing. Revenue rose 5% year on year, or...
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...
Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%...
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
