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Tuesday 20 October 2026
IT panel market struggles to pass on costs: monitors hold flat, notebooks slide
Sluggish end-market recovery, cautious procurement by brand customers, and persistently high upstream material costs are frustrating panel makers' efforts to implement price hikes...
Tuesday 20 October 2026
OCP 2026 shifts AI competition from chips to rack-scale systems
The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization...
Monday 19 October 2026
Canon Taiwan sees strong global camera demand in 2026 and 2027
Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate...
Monday 19 October 2026
Taiwan launches first proof-of-concept project for green-power time shifting
Taiwan has launched its first proof-of-concept project for shifting renewable electricity through energy storage, a move that could give companies worldwide a model for managing mismatches...
Monday 19 October 2026
Terafab exposes Tesla's growing tensions with Samsung and TSMC
Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...
Monday 19 October 2026
Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027
Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor...
Monday 19 October 2026
Shipments of high-end cloud AI accelerators, 2027

Introduction

Monday 19 October 2026
Taiwan plans 25 gas-fired units to secure power for 10 years
Taiwan's Ministry of Economic Affairs plans to add 25 gas-fired power units with a combined capacity of 26GW to meet rising electricity demand from the semiconductor industry and AI...
Monday 19 October 2026
Memory giants lock in up to 70% of capacity under long-term deals as AI demand reshapes industry cycles
AI-driven memory demand is growing exponentially, pushing the industry into a structural supply shortage. As supply tightens and contract prices surge in 2026, major AI companies and...
Monday 19 October 2026
CXMT eyes nearly US$20 billion profit as AI-driven DRAM shortages fuel earnings turnaround
China's leading DRAM manufacturer, ChangXin Memory Technologies (CXMT), expects to report net profit of CNY131 billion to CNY132.5 billion (≈ US$19.58 billion to US$19.8 billion)...
Monday 19 October 2026
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
Monday 19 October 2026
TECO shifts toward integrated solutions as AI drives demand for power, infrastructure
TECO Electric & Machinery is shifting from a motor-focused manufacturer to a platform-based provider of integrated power, energy, drive-system, and AI infrastructure solutions,...
Monday 19 October 2026
Memory squeeze leaves Brightek short on chips; Chinese automakers line up for Nantong plant
LED packaging manufacturer Brightek Optoelectronic expects its automotive revenue share to exceed 60%, up from around 50%, following the opening of its Nantong plant and higher shipments...
Monday 19 October 2026
AI memory demand lifts Samsung, SK Hynix 2027 outlook
AI data center investment continues to expand, keeping the global memory market undersupplied in the fourth quarter of 2026. Rising DRAM and NAND Flash contract prices are boosting...
Monday 19 October 2026
TECO's modular data center validation nears completion
TECO Electric and Machinery chairman Morris Li said the company has entered the final stage of testing its modular data center (MDC) solution. The company is targeting opportunities...