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Thursday 17 September 2026
Taiwan machine tool makers target aerospace, semiconductor boom at major trade shows
Taiwanese machine tool manufacturers are taking part in two major manufacturing trade shows in Europe and the US this September. The participation reflects a shift in Taiwan's machine...
Thursday 17 September 2026
Arcadyan expects third-quarter strength as Wi-Fi 7 upgrade cycle builds

Arcadyan Technology expects stronger revenue in the third quarter of 2026 as the network communications market enters its seasonal peak,...

Thursday 17 September 2026
BizLink's expansion strategy signals a wider shift toward localized, risk-aware global supply chains

BizLink chairman Roger Liang said customer demand, market access, supply chain resilience, and local service needs have driven the company's...

Thursday 17 September 2026
SK Hynix shifts supply chain planning for AI capex boom

AI-driven capacity expansion is pushing up demand for semiconductor equipment, and SK Hynix is strengthening supply chain management...

Thursday 17 September 2026
Intel CEO warns of 2027 memory crunch and tighter CPU supply
AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
Thursday 17 September 2026
Samsung looks to outside suppliers as HBM boom shifts priorities
Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
Thursday 17 September 2026
DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
Wednesday 16 September 2026
Samsung advances jump 70% amid shift to long-term memory deals

Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers...

Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
AI slowdown calls expose the financial strain of the frontier race
Calls to moderate frontier AI development are exposing a financial dilemma alongside the safety debate: AI labs must fund successive research cycles while securing infrastructure to...
Wednesday 16 September 2026
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the...
Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...