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Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
Monday 24 August 2026
Europe's struggling auto industry turns to China, drawing US scrutiny

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through...

Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
Nvidia server prices to rise up to 17% as memory costs climb
Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and...
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...
Monday 24 August 2026
Shanghai accepts YMTC's STAR Market listing application
China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises,...
Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
Jeilin shifts upmarket as high-end image SoCs drive margins higher
Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...
Monday 24 August 2026
AI packaging demand exposes supply-chain gaps for Taiwan materials makers
AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...
Monday 24 August 2026
AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...