China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?

As warnings about catastrophic AI risks intensify, Nvidia CEO Jensen Huang is making a different case: AI safety should be treated as an engineering challenge, not a justification...

Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...

CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.

Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...

AT&T and Corning have agreed to a multi-year deal worth more than US$3 billion to expand US fiber networks. The agreement underscores how rising internet use, streaming, and artificial...

TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...

Taiwan-based server original design manufacturers (ODMs) have long been key partners for cloud service providers (CSPs) through the ODM-direct model, but the model's share is declining...

Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...

Taiwan's auto market has faced plenty of challenges in recent years, from broader industry headwinds to continued scrutiny of domestic car production. Against that backdrop, Foxconn-backed...

Cerebras Systems is expanding its push into AI inference infrastructure through a collaboration with Gimlet Labs, as demand grows for computing systems capable of delivering faster...

Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...

SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation...

High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...

LG Electronics has expanded its push into the AI data center cooling market through cooperation with Microsoft, SK Enmove, and overseas heating, ventilation, and air conditioning (HVAC)...