Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15...
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory...
Taiwanese power management IC (PMIC) vendors reported their September and third-quarter 2026 revenue, with results diverging as PC exposure widened the performance gap. Global Mixed-mode...
Memory prices have surged 4–5x in recent years, and smartphone brands' efforts to pass those costs on to consumers have already hurt sales of new devices in 2026. With large-scale...
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance...
As custom AI silicon proliferates alongside growing demand for heterogeneous compute, the ability to move and optimize workloads across different accelerators is becoming an increasingly...
The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...
Entering the fourth quarter of 2026, panel makers face pressure from rising component costs and weakening demand. However, price hikes and production cuts led by Chinese panel manufacturers...
Taiwan's Energy Management Act is undergoing its first major revision in nearly a decade, driving businesses to reassess self-generation and energy storage systems (ESS) as the market...
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
Advanced Micro-Fabrication Equipment (AMEC) chairman and general manager Gerald Yin has warned of a potential AI investment bubble, cautioning that surging demand for chipmaking equipment...
