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Wednesday 16 September 2026
Samsung advances jump 70% amid shift to long-term memory deals

Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers...

Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
BizLink's CPO breakthrough hits the hard part: scaling
BizLink has begun small-volume shipments of co-packaged optics (CPO), but chairman Roger Liang said mass deployment remains constrained by fiber array unit (FAU) assembly, thermal...
Wednesday 16 September 2026
AI slowdown calls expose the financial strain of the frontier race
Calls to moderate frontier AI development are exposing a financial dilemma alongside the safety debate: AI labs must fund successive research cycles while securing infrastructure to...
Wednesday 16 September 2026
Soaring memory costs threaten Netronix's e-reader growth, even as new display markets stay on track
Netronix said rapidly rising memory prices are squeezing the consumer electronics supply chain, raising e-book reader costs and slowing some e-paper display projects. Even so, the...
Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Physical AI could reshape industrial computing as Ennoconn sees a long growth cycle

Artificial intelligence is moving beyond software and into physical systems, and Ennoconn Technology says that shift could create a...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
US-based Teradyne opens Bengaluru office to support India's semiconductor push
Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Wednesday 16 September 2026
Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale

Where will China's electronics manufacturing industry find growth over the next five years? The answer is taking shape in the 15th Five-Year...