DIGITIMES news archive

Total: 2,054 items

Commentary: How TSMC anchors Taiwan's semiconductor supply chain from within

Wednesday 29 April 2026

As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international...

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Commentary: China's chip-model strategy pressures Nvidia's AI economics

Wednesday 29 April 2026

The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to...

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AI cost DeepSeek Nvidia Huawei Ascend

Commentary: At Beijing Auto Show, hardware takes the wheel

Wednesday 29 April 2026

For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded reality came into focus: without...

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software hardware Beijing auto industry vehicle

Texas Instruments VP makes the case for 800V power and GaN in AI data centers

Wednesday 29 April 2026

Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives...

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Texas Instruments GaN data data center 2026

Analysis: Taiwan's two major panel makers enter semiconductor packaging; CPO and FOPLP become key

Wednesday 29 April 2026

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing...

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CPO FOPLP packaging AUO Innolux panel Taiwan

Analysis: Why Tokyo Electron's China problem goes deeper than a data breach

Tuesday 28 April 2026

Amid growing geopolitical tensions over the global semiconductor supply chain, what initially appeared to be an internal personnel matter is evolving into a broader case study of the operational risks that foreign...

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Tokyo Electron supply chain equipment governance investment

Commentary: Tim Cook's sole omission during 15-year tenor

Tuesday 28 April 2026

On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in ceremony for TSMC's first Arizona...

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Apple Tim Cook John Ternus Taiwan TSMC

DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron

Friday 24 April 2026

SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth...

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HBM Micron SK Hynix packaging DIGITIMES

Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges

Thursday 23 April 2026

Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims to shift Epson from a traditional...

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Seiko Epson investment manufacturing inkjet printer technology

Analysis: Tesla's chip ambitions drive a wedge between Samsung and Intel

Wednesday 22 April 2026

Tesla's Terafab project is accelerating, with the company targeting substantial in-house chip production to support autonomous driving, robotaxis, humanoid robots, and AI infrastructure. The push is already forcing a...

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Tesla Samsung Intel production manufacturing

Commentary: Spain's IC design ecosystem revives as EU chip sovereignty demand grows

Monday 20 April 2026

Amid rising geopolitical tensions linked to semiconductors, European countries and industries are increasingly anxious about semiconductor autonomy. This concern has empowered many European chip startups to believe that...

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Spain IC design semiconductors EU

Analysis: ASML lifts 2026 guidance on strong EUV demand

Friday 17 April 2026

ASML delivered first-quarter 2026 results that exceeded expectations, prompting management to raise its full-year guidance despite a cautious outlook for the second quarter. The company announced plans to expand its...

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ASML 2026 demand EUV guidance

Analysis: Intel, Musk advance TeraFab partnership, echoing Apple's TSMC shift

Friday 17 April 2026

Tesla CEO Elon Musk has aligned his TeraFab megafab initiative with Intel, in a move that had been signaled in recent months.

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Tesla Intel partnership chips fab TSMC

Column: Corintis uses algorithms to target chip hotspots for precise cooling

Friday 10 April 2026

As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual, evenly distributed heating, modern...

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cooling HPC performance transistor design

Commentary: US MATCH Act tightens chip tool controls as China builds local supply chain

Wednesday 8 April 2026

At SEMICON China 2026, Applied Materials and ASML kept a low profile under tightening US export controls, while domestic Chinese suppliers dominated visibility and floor presence.

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2026 SEMICON China equipment Applied Materials ASML

Commentary: China's AI chip dilemma revisits a familiar semiconductor fork in the road

Wednesday 8 April 2026

The global AI race is no longer just about who builds the fastest chip. Increasingly, it is about who writes the rules.

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Tsinghua University TSMC UMC AI chip development

Analysis: NVLink licensing reshapes semiconductor alliance; potential Broadcom truce

Tuesday 7 April 2026

In September 2025, Nvidia CEO Jensen Huang made a rare joint livestream appearance with Intel CEO Pat Gelsinger to announce a US$5 billion equity investment in Intel. In March 2026, Nvidia followed up with a US$2...

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Nvidia AI Intel Broadcom 2025

Commentary: AI efficiency shock rattles memory stocks, tests chip demand narrative

Wednesday 1 April 2026

On March 30, US tech stocks fell sharply, with the Philadelphia Semiconductor Index down 4.2%. Memory stocks led the losses: Micron Technology dropped 9.88%, Western Digital fell 8.6%, while SanDisk and Seagate...

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demand efficiency Micron SanDisk HBM

Commentary: AI drives global tech layoffs, but Intel, QNAP, and Realtek tell different stories

Tuesday 31 March 2026

Generative AI is moving from concept to commercial deployment, reshaping the global technology supply chain. It is shifting from a productivity tool to a core enterprise...

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GenAI layoffs Intel QNAP Realtek

Analysis: Terafab's scale raises market doubts; is Elon Musk aiming to dominate chip supply chain?

Monday 30 March 2026

Elon Musk recently announced the launch of the "Terafab" project, aiming to expand compute production capacity to 1 TW per year, which is about 50 times the current global compute supply of around 20 GW. He plans to...

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Elon Musk wafer fab IC manufacturing

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