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    China accelerates brain-computer interface industry with full chip-to-clinical integration
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    NEWS TAGGED FOPLP
    Monday 30 June 2025
    With SpaceX pulling back, TTMC retools its strategy for the chip supply chain
    ThinTech Materials Technology (TTMC), a subsidiary of China Steel Corporation, experienced conservative shipment momentum in the first quarter of 2025 due to delays in customer verification...
    Thursday 26 June 2025
    TSMC, ASE close ranks on PLP, 310x310mm emerges as the format to watch
    Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...
    Thursday 5 June 2025
    SpaceX eyes FOPLP as Washington pushes chip packaging reshoring
    Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The...
    Thursday 29 May 2025
    AUO sidesteps risky FOPLP investment, eyes Micro LED breakthrough
    While rival Innolux accelerates its push into FOPLP with plans for mass production in late 2025, AUO is taking a more cautious path. CEO and President Frank Ko explained that, despite...
    Thursday 8 May 2025
    Innolux strengthens leadership as it accelerates transformation beyond display panels

    Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

    Saturday 3 May 2025
    PTI sees operational rebound as memory and AI markets recover in 2025
    Memory testing firm expects growth following first-quarter trough, expands advanced packaging capabilities amid semiconductor market recovery
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Thursday 17 April 2025
    Innolux CEO responds to FOPLP delays
    Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
    Friday 21 March 2025
    China steel unit expands semiconductor business, eyes biomedical growth
    Thintech Materials, a subsidiary of China Steel Corporation, is ramping up its semiconductor operations with expected significant growth by 2025, driven by target and evaporation...
    Monday 17 March 2025
    Innolux targets panel packaging mass production among delays
    Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
    Wednesday 19 February 2025
    ASE and PTI step up FOPLP investments to tap AI boom
    ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
    Friday 10 January 2025
    Innolux reports 2.3% revenue growth in 2024, expands into non-display sectors in 2025
    Innolux Corporation reported 2024 consolidated revenue of NT$216.5 billion (US$6.58 billion), marking a 2.3% increase from the previous year, underscoring the company's strategic...
    Wednesday 25 December 2024
    Samsung, TSMC diverge on panel materials for advanced packaging
    Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
    Tuesday 24 December 2024
    Innolux charts course into FOPLP amid market headwinds
    Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
    Monday 23 December 2024
    Innolux seeks assistance to advance FOPLP technology
    Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
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    Research Report Database
    BIZ FOCUS
    Jun 30, 16:14
    Vietnam's new crypto law sets global standard for token regulation and licensing
    Monday 30 June 2025
    Why age verification online is facing more scrutiny in 2025
    Monday 30 June 2025
    How technology powers cross-border digital entertainment platforms
    Friday 27 June 2025
    Hyundai Exter: Why this micro-SUV perfect choice for city driving
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES