News tagged FOPLP at DIGITIMES

NEWS TAGGED FOPLP

Friday 28 August 2026

Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production

Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...

Thursday 27 August 2026

AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp

Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...

Saturday 22 August 2026

Manz Asia says yield is key to glass core mass production

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...

Friday 21 August 2026

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Thursday 20 August 2026

Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

Wednesday 19 August 2026

PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips

As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...

Friday 7 August 2026

Panel makers turn old fabs into AI-advanced packaging hubs

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate...

Thursday 6 August 2026

FOPLP leads production as CoPoS advances glass packaging

AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...

Wednesday 5 August 2026

Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Friday 31 July 2026

Powertech bets on AMD FOPLP mass production in 2027

Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...

Friday 24 July 2026

TGV still faces technical barriers; CoPoS commercialization not likely until 2030

Introduction

Friday 17 July 2026

Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Wednesday 8 July 2026

ThinTech Materials Technology eyes FOPLP gains, BNCT growth through 2028

ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates...

Wednesday 24 June 2026

Global market for advanced chip packaging set for rapid expansion

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...

Thursday 18 June 2026

FOPLP race heats up as Innolux reportedly teams with TSMC

As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...

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Aug 27, 08:00

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

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