After the early pull-forward effect from customers began to fade, Taiwan's panel makers have started to show signs of slower operating momentum. Weaker demand for consumer electronics...

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...

Unlike AUO, which remained in the red in the first quarter of 2026, Innolux returned to operating profitability, posting net income of NT$1.79 billion (approx. US$56.9 million) for...

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level...

Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...

Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...

AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...

The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...

Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.

Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.

After the Lunar New Year, LCD TV panel prices have continued to climb, driven by inventory buildup for sports events and rising costs. This momentum pushed February's LCD TV panel...

AblePrint Technology (APT) reported a consolidated revenue of NT$2.302 billion (US$72.4 million) in 2025, up 27.91% year-over-year, driven by robust shipments of pneumatic and thermal...

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...

Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...

Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...