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NEWS TAGGED FOPLP
Thursday 5 June 2025
SpaceX eyes FOPLP as Washington pushes chip packaging reshoring
Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The...
Thursday 29 May 2025
AUO sidesteps risky FOPLP investment, eyes Micro LED breakthrough
While rival Innolux accelerates its push into FOPLP with plans for mass production in late 2025, AUO is taking a more cautious path. CEO and President Frank Ko explained that, despite...
Thursday 8 May 2025
Innolux strengthens leadership as it accelerates transformation beyond display panels

Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

Saturday 3 May 2025
PTI sees operational rebound as memory and AI markets recover in 2025
Memory testing firm expects growth following first-quarter trough, expands advanced packaging capabilities amid semiconductor market recovery
Monday 28 April 2025
FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

Thursday 17 April 2025
Innolux CEO responds to FOPLP delays
Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
Friday 21 March 2025
China steel unit expands semiconductor business, eyes biomedical growth
Thintech Materials, a subsidiary of China Steel Corporation, is ramping up its semiconductor operations with expected significant growth by 2025, driven by target and evaporation...
Monday 17 March 2025
Innolux targets panel packaging mass production among delays
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
Wednesday 19 February 2025
ASE and PTI step up FOPLP investments to tap AI boom
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Friday 10 January 2025
Innolux reports 2.3% revenue growth in 2024, expands into non-display sectors in 2025
Innolux Corporation reported 2024 consolidated revenue of NT$216.5 billion (US$6.58 billion), marking a 2.3% increase from the previous year, underscoring the company's strategic...
Wednesday 25 December 2024
Samsung, TSMC diverge on panel materials for advanced packaging
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
Tuesday 24 December 2024
Innolux charts course into FOPLP amid market headwinds
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
Monday 23 December 2024
Innolux seeks assistance to advance FOPLP technology
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Monday 23 December 2024
Innolux expands semiconductor footprint with FOPLP and silicon photonics
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
Tuesday 17 December 2024
Innolux expects revenue boost from new IAS business unit
Taiwanese panel maker Innolux has established its Intelligent Automation Solutions (IAS) Business Center, which focuses on three major product lines targeting smart manufacturing...