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Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Thursday 9 September 2021
Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP
As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide)...
Thursday 9 September 2021
Compound semiconductors to play crucial role in emerging applications
Compound semiconductors including third-generation ones GaN and SiC will play a crucial part in the emerging 6G, car-use or mobile LiDAR, and biometrics device applications, according...
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Thursday 26 August 2021
GaN, SiC devices in growing demand, benefiting material analysis labs
As the application market for third-generation semiconductors GaN and SiC devices is on track for rapid expansion, international IDMs including Cree, Infineon, SMT Microelectronics...
Tuesday 24 August 2021
Tong Hsing to open new plant in 2022 for processing car CIS, SiC chips
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Monday 9 August 2021
SiC, GaN devices to see production costs fall in next 5 years, says Infineon
Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...
Tuesday 27 July 2021
Taiwan compound semiconductor output value surges 26% in 1H21
The output value of Taiwan's compound semiconductor industry grew 26.4% on year to NT$36 billion (US$1.28 billion) in the first half of 2021, according to statistics compiled by the...
Monday 12 July 2021
TSMC gearing up for advanced process leadership for automotive
TSMC is gearing up for a bigger presence in the automotive IC foundry market segment, with its newly-developed N5A process set to be available in the third quarter of 2022, according...
Friday 25 June 2021
Huawei to run foundry biz
Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.
Thursday 17 June 2021
China CE brands promoting GaN fast chargers
China brand vendors such as Xiaomi and Anker have rolled out their GaN-based fast charging devices for consumer technology products, which will be stimulating demand for GaN-on-Si...
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Friday 9 April 2021
Nexperia, UAES agree partnership for gallium nitride
Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems (UAES). The program will focus...