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Wednesday 25 March 2026
Taiwan's LinkCom targets growth in silicon photonics and satellite markets
Taiwan-based magnetic components maker LinkCom Manufacturing is positioning itself for its next phase of growth by expanding beyond high-speed networking into emerging applications,...
Wednesday 25 March 2026
Taiwan chipmakers chase drone imaging edge with thermal and AI
Non-China supply chains in the drone sector are emerging as a new battleground for global technology vendors, with Taiwan's chipmakers increasingly expanding into the space. Among...
Wednesday 25 March 2026
Arm unveils AGI CPU aimed at scaling agentic AI, promising higher rack performance and lower data center costs
Arm on March 24, 2026, announced the Arm AGI CPU, its first mass-produced chip product, designed specifically for AI data centers and built on TSMC's 3nm process. The company presented...
Monday 23 March 2026
China's DeepLink unifies heterogeneous chips to boost AI computing power
The Shanghai AI Laboratory recently unveiled its DeepLink hybrid inference solution, emphasizing heterogeneous chip collaborative computing capabilities. This move marks a breakthrough...
Saturday 21 March 2026
SK Hynix targets autonomous fabs by 2030 to tackle AI-driven manufacturing challenges
SK Hynix is targeting the development of autonomous semiconductor fabrication facilities by 2030 as it seeks to address rising AI-driven demand and increasing manufacturing complexity,...
Thursday 19 March 2026
Analysis: GTC 2026 widens US-China AI compute gap
The annual Nvidia GTC conference has become a global barometer for the artificial intelligence (AI) industry. In a nearly two-hour keynote, Nvidia CEO Jensen Huang laid out a clear...
Thursday 19 March 2026
Intel Xeon 6 wins CPU slot in Nvidia DGX Rubin, stakes claim in AI inference stack
Intel's Xeon 6 processors have been selected as the host CPU for Nvidia's DGX Rubin NVL8 system — a move announced at GTC 2026 that gives concrete form to the two companies'...
Thursday 19 March 2026
Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.
Wednesday 18 March 2026
Nvidia GTC 2026: Memory, power, and deployment challenges reshape AI infrastructure
Amid tightening memory supply and surging demand for AI-ready infrastructure, hardware vendors are racing to redesign systems for the next phase of enterprise AI adoption — a...
Tuesday 17 March 2026
Samsung Electronics reports shifts in raw material costs and production output in fiscal 2025
Samsung Electronics has released comprehensive operational data for fiscal 2025, revealing a complex picture of shifting raw material costs and high production efficiency. Despite...
Tuesday 17 March 2026
Chenbro Showcases Next-Generation AI Infrastructure Integration at NVIDIA GTC 2026

As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server...

Sunday 15 March 2026
Think like an octopus: Microchip COO makes the case for distributed edge AI
The AI industry's obsession with bigger, faster, and more powerful models may be solving the wrong problem — at least when it comes to the billions of devices operating at the...
Friday 13 March 2026
Acerpure expands in India with new AC line aimed at hot, energy-conscious market
Acerpure has introduced a new range of air conditioners in New Delhi as it moves to deepen its presence in India's home appliance sector, riding rising demand driven by soaring summer...
Friday 13 March 2026
IT services provider Wistron ITS expects AI-driven growth in 2026
Wistron ITS (WITS) chairman and CEO Ching Hsiao said the company expects continued growth in 2026. While AI may disrupt some industries, it is also driving demand for IT services and...
Friday 13 March 2026
Samsung targets 2nm process for HBM4E base die to boost AI chip edge
Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...