CONNECT WITH US
NEWS TAGGED EFFICIENCY
Thursday 28 May 2026
Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...
Thursday 28 May 2026
China Airlines rides Taiwan's AI boom to record cargo profits

China Airlines said demand tied to artificial intelligence (AI) infrastructure and semiconductor shipments is helping fuel a strong rebound...

Wednesday 27 May 2026
Humanoid robot mass production hits a thermal wall
As humanoid robots move closer to mass production, thermal management is emerging as a critical bottleneck. Component efficiency, cramped joint architectures, and limited heat-dissipation...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
Saturday 23 May 2026
Tech Forum 2026: Autonomous driving enters commercial validation era, shifting competition to algorithms, chips, and data
As Computex approaches, DIGITIMES hosted a forum where analyst Mark Yee argued that Physical AI is driving autonomous driving into full commercial validation, with implications for...
Friday 22 May 2026
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce...
Friday 22 May 2026
MEAN WELL Showcases Advanced Power Supply Solutions at COMPUTEX 2026

As global electricity demand accelerates - driven by rapid AI computing growth, rising corporate decarbonization commitments, and increasing focus on grid stability -...

Friday 22 May 2026
Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for...
Thursday 21 May 2026
Exclusive: TOPCon faces funding cuts while HJT and BC receive government support
As China's solar market enters a downfall, market sources indicate that China's central government is reshaping the industry landscape through an aggressive dual-track strategy. On...
Wednesday 20 May 2026
Tech Forum 2026: Physical AI poised to accelerate autonomous driving and robotics, analysts say
Physical AI is set to reshape autonomous driving and robotics. At the DIGITIMES Tech Forum 2026, held ahead of COMPUTEX 2026, analysts said advances in perception, decision-making,...
Wednesday 20 May 2026
Gaia Motors rolls out Rapide 3 electric three-wheeler network across Taiwan
Gaia Motors has launched a nationwide channel rollout in Taiwan for its Rapide 3 electric three-wheeler, expanding the vehicle's availability from enterprise fleets to broader commercial...
Monday 18 May 2026
Edge-cloud shift opens new growth runway for Taiwan's chip suppliers
As generative AI proliferates across end devices, a distributed edge-cloud architecture is taking shape — shifting inference workloads from the cloud to local hardware to reduce...
Friday 15 May 2026
Foxconn says AI server mix and consignment model will drive annual shipments to more than double
Foxconn (Hon Hai) held an online investor briefing on May 14, where executives outlined that cloud and networking products accounted for nearly 50% of group revenue in the first quarter...
Thursday 14 May 2026
TSMC symposium spotlights AI expansion, advanced packaging demand
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data...