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Thursday 19 March 2026
Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership
OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices.
Wednesday 18 March 2026
Nvidia GTC 2026: Memory, power, and deployment challenges reshape AI infrastructure
Amid tightening memory supply and surging demand for AI-ready infrastructure, hardware vendors are racing to redesign systems for the next phase of enterprise AI adoption — a...
Tuesday 17 March 2026
Samsung Electronics reports shifts in raw material costs and production output in fiscal 2025
Samsung Electronics has released comprehensive operational data for fiscal 2025, revealing a complex picture of shifting raw material costs and high production efficiency. Despite...
Tuesday 17 March 2026
Chenbro Showcases Next-Generation AI Infrastructure Integration at NVIDIA GTC 2026

As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server...

Sunday 15 March 2026
Think like an octopus: Microchip COO makes the case for distributed edge AI
The AI industry's obsession with bigger, faster, and more powerful models may be solving the wrong problem — at least when it comes to the billions of devices operating at the...
Friday 13 March 2026
Acerpure expands in India with new AC line aimed at hot, energy-conscious market
Acerpure has introduced a new range of air conditioners in New Delhi as it moves to deepen its presence in India's home appliance sector, riding rising demand driven by soaring summer...
Friday 13 March 2026
IT services provider Wistron ITS expects AI-driven growth in 2026
Wistron ITS (WITS) chairman and CEO Ching Hsiao said the company expects continued growth in 2026. While AI may disrupt some industries, it is also driving demand for IT services and...
Friday 13 March 2026
Samsung targets 2nm process for HBM4E base die to boost AI chip edge
Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
Wednesday 11 March 2026
ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion
ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...
Sunday 8 March 2026
Applied Materials VP warns AI growth may hit energy, not chip limits
AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
Sunday 8 March 2026
SpaceX shifts from GaAs as scalable silicon and perovskite solar technologies advance
In early 2026, Tesla CEO Elon Musk visited China to inspect its solar supply chain, focusing on back-contact, heterojunction, and perovskite technologies. This move suggests a reevaluation...
Saturday 7 March 2026
Largan avoids low-margin orders as optical industry enters slow season
Adam Lin, chairman of optical lens and optoelectronics maker Largan Precision, emphasized the company's strategic focus on avoiding orders with low profit margins that could reduce...
Saturday 7 March 2026
TienPin eyes stable growth in 2026 as AI server liquid-cooling cleaning demand heats up
TienPin United Enterprise has been benefiting from a rapid surge in the artificial intelligence (AI) server liquid-cooling cleaning business since the second half of 2025, with its...
Friday 6 March 2026
South Korean OLED materials firm Lordin plans India expansion amid Chinese competition
South Korean OLED materials developer Lordin plans to seek a technology-special listing in the first half of 2027, with a US$25 million fundraising round targeted for completion in...
Thursday 5 March 2026
Hanmi Semiconductor strengthens ties with India amid Micron facility launch
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...