中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    AI server demand drives sharp MLCC price increases
    8h 24min ago
    Chinese automakers paused price hikes as memory and LFP costs surged
    8h 25min ago
    Taiwanese aftermarket auto parts gain advantage as US tariff relief lifts demand
    8h 25min ago
    TSMC 3nm lead times top one year as Samsung faces Intel in foundry push
    8h 25min ago
    IC design firms widen supplier lists as packaging and testing capacity stays tight
    8h 25min ago
    China accelerates helium bank plan as supply tightens
    8h 25min ago
    NEWS TAGGED EUV
    Wednesday 24 June 2026
    China's chip-equipment push starts to weigh on Japanese suppliers

    China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

    Saturday 20 June 2026
    US raises alarm over possible EUV machine in China, putting ASML on the defensive
    The Trump administration has confronted ASML with concerns that one of the Dutch company's most advanced chip-making machines may have made its way into China in violation of US-led...
    Tuesday 16 June 2026
    ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
    ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
    Thursday 11 June 2026
    Gudeng flags EUV supply constraints as advanced-chip expansion accelerates
    Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building...
    Tuesday 2 June 2026
    South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
    South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used...
    Tuesday 26 May 2026
    ASML expands Taiwan hiring and operations to meet advanced chip demand
    Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV...
    Tuesday 26 May 2026
    Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

    South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

    Monday 25 May 2026
    Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
    Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
    Wednesday 20 May 2026
    ASML to deliver first High-NA chips within months despite cost concerns
    ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
    Friday 8 May 2026
    Big Tech reportedly offers to fund SK Hynix fabs and EUV tools in escalating AI memory race
    Global technology firms are reportedly offering unprecedented investment proposals to secure memory supply from SK Hynix, including funding new production lines and helping pay for...
    Monday 27 April 2026
    TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
    ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
    Friday 24 April 2026
    Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

    Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through...

    Thursday 23 April 2026
    SK Hynix flags persistent HBM shortage as demand outpaces supply
    SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps...
    Thursday 23 April 2026
    TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV
    TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
    Tuesday 21 April 2026
    ASML's memory revenue tops logic in 1Q26, AI-fueled HBM demand surges
    ASML revealed during its first quarter 2026 earnings call that revenue from memory systems has, for the first time, exceeded that of logic chips. Against a backdrop of sustained AI...
    1/38 pages
    TI
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook