Samsung Electronics has announced its new 5G mobile processor series - Exynos 2100 - built using 5nm extreme ultra-violet (EUV) process technology.

Samsung Electronics has kicked off volume production of 16Gb LPDDR5 chips using EUV-based 1znm process technology at its Pyeongtaek fab, while SK Hynix plans to install EUV exposure...

Fab toolmaker Marketech International has seen its backlog of orders reach a record NT$25.6 billion (US$908.8 million), according to industry sources.

Many international semiconductor equipment and materials suppliers have been stepping up investments or strengthening deployments in Taiwan seeking to better serve TSMC's ecosystem...

Cooling solution providers are expected to see orders grow from the server sector as Intel's new 10nm Ice Lake processors and AMD's Milan EPYC CPUs made using 7nm EUV process are...

China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...

TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.

The combined memory output value of South Korean vendors Samsung Electronics and SK Hynix are expected to register a sequential decrease of 9.5% in fourth-quarter 2020 after falling...

Entegris has announced it has agreed to settle patent litigation and disputes with Gudeng Precision related to reticle pod technology for both conventional and EUV lithography. The...

TSMC has been fast expanding advanced node manufacturing capacity, requiring strong support from ASML for EUV litho equipment. The world's top pure-play foundry house has already...

TSMC has already placed EUV lithography equipment orders with ASML for 2021 for at least 13 sets, according to industry sources.

Samsung Electronics expects profit to decline in the fourth quarter amid weakening memory chip demand from server customers and intensifying competition in mobile phones and consumer...

Samsung Electronics is reportedly looking to advance its partnership with EUV fab tool vendor ASML, aiming to accelerate the development of its advanced 5nm and 3nm foundry process...

The development of China's homegrown semiconductor industry is taking shape, according to Charles Kau, who has just resigned as executive VP of global operations for Tsinghua Unigr...

With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...

In addition to process technology which enhances the performance of semiconductor devices by scaling, 3D and heterogeneous integration has led to the development of various new structures...

TSMC is expected to cumulatively purchase about 55 sets of EUV lithography equipment by the end of 2021, as the foundry is stepping up its EUV process manufacturing development, according...

TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...

The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.

Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.

TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.

ASML has unveild its Global EUV Training Center in Tainan, southern Taiwan to serve its customers in Asia.

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

ASML has announced it will set up an EUV technology training center at Southern Taiwan Science Park (STSP), giving a boost to the EUV technology cluster headed by TSMC.