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Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026
BYD's 4nm smart-driving chip signals deeper EV supply-chain integration

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's...

Monday 29 June 2026
China's first diamond semiconductor supply chain project lands in Zhengzhou

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project...

Monday 29 June 2026
Musk backs Cook as AI memory crunch drives Apple price hikes

Apple has abruptly raised prices for Mac computers, iPads, and Vision Pro in the US, underscoring how the AI infrastructure boom is...

Monday 29 June 2026
Hsinchu Science Park draws new semiconductor service investments as chipmaking shifts to advanced nodes

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...

Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...

Saturday 27 June 2026
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...
Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Friday 26 June 2026
Academia Sinica readies Taiwan-made quantum chip for engineering push
Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...
Friday 26 June 2026
Apple reportedly revamps Mac chip roadmap to accelerate AI push
Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...
Friday 26 June 2026
Academia Sinica targets quantum chip manufacturing scale with Taiwan's semiconductor tool base
Academia Sinica's Center for Quantum Computer is focusing only on hardware, not algorithms or applications, and executive director Chii-Dong Chen said that approach is similar to the...
Friday 26 June 2026
Qualcomm's Dragonfly push highlights shift from mobile chips toward cloud AI
Qualcomm used its Investor Day to formally launch Dragonfly, a new data center product line aimed at cloud AI, and set out an ambitious revenue path that would shrink its dependence...