South Korea is combining physical AI, domestic semiconductors, AI-RAN networks, and gigawatt-scale data centers to turn intelligent...

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies...

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June...

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed...