The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and...

South Korea is combining physical AI, domestic semiconductors, AI-RAN networks, and gigawatt-scale data centers to turn intelligent...

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies...

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

TSMC raised its 2026 capital expenditure forecast to US$60–64 billion during its second-quarter earnings conference, with a substantial...

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers...

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June...