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Wednesday 7 January 2026
China's auto market in 2025: million-unit clubs and a reshaped race
As China's auto market wrapped up 2025, disclosures from leading carmakers confirmed another milestone year. Vehicle exports are expected to surpass 7 million units, ranking first...
Wednesday 7 January 2026
H200 shipments to China set to start with low-profile approach, says CEO Jensen Huang
Nvidia has expressed optimism about resuming sales of its H200 AI chips to China, while stressing that any return to the market will proceed quietly, without public announcements...
Wednesday 7 January 2026
Apple Face ID veterans' startup Lyte secures US$107 million, wins CES robotics award
Lyte, a robotics startup founded by former Apple engineers behind Face ID technology, has secured US$107 million in funding to advance sensing and visual recognition capabilities...
Wednesday 7 January 2026
Mobileye strikes deal with top US automaker for next-gen ADAS chips
Mobileye, the Israeli autonomous driving technology company, said on January 5, 2026, that it had reached a partnership with a US automaker ranked among the world's top 10 to integrate...
Tuesday 6 January 2026
CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
Tuesday 6 January 2026
TCL's RGB mini LED claims on Q9M TV draw industry scrutiny
TCL's marketing of its entry-level RGB Mini LED television has come under closer industry scrutiny after market research firm Omdia said the product does not fully adopt the RGB backlight...
Monday 5 January 2026
TSMC kicks off 2nm production with Samsung in hot pursuit
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...
Monday 5 January 2026
Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Monday 5 January 2026
Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
Saturday 3 January 2026
Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
Saturday 3 January 2026
Analysis: Chip boom squeezes device makers as surging component costs threaten margins
The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
Friday 2 January 2026
Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO
Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...
Friday 2 January 2026
Taiwan networking firms expect 2026 growth as AI drives switch upgrades and Wi‑Fi 7 adoption
Taiwanese networking companies are broadly optimistic about returning to growth in 2026 as an AI-driven expansion moves beyond chips and servers into network transmission layers,...
Friday 2 January 2026
Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition
Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...