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NEWS TAGGED CHIPS
Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

Friday 24 April 2026
Taiwan aims to close drone supply chain gaps by 2027
Taiwan-made drones have been exported to Poland, the Czech Republic, the US, and Austria, yet four core technology modules still rely on foreign suppliers, raising questions over whether...
Friday 24 April 2026
CPUs regain central role in AI as Intel highlights growing importance alongside rising ASIC demand
Intel executives are placing renewed emphasis on the central role of CPUs in artificial intelligence (AI), arguing that shifting workloads are elevating their importance even as specialized...
Friday 24 April 2026
GMI pursues vertical integration amid surging AI leasing demand
GMI Technology is transitioning from its role as an electronics distributor into an AI technology integration and application company, building vertically integrated capabilities from...
Friday 24 April 2026
PC chipmakers warn CPU shortages cloud 2026 shipment outlook
CPU shortages in the PC sector have emerged as a new concern for shipments this year, in addition to ongoing memory supply issues. Industry players supplying PC peripheral chips observe...
Friday 24 April 2026
China chipmaker scales beyond security ICs into AI, automotive

Unigroup Guoxin Microelectronics reported steady growth in 2025, reinforcing its position across specialty ICs and security chips while...

Thursday 23 April 2026
SK Hynix to shift over half of NAND output to 321-layer chips
SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.
Thursday 23 April 2026
Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
Thursday 23 April 2026
Google debuts TPU 8t and 8i as AI workloads diverge
Google Cloud Next 2026 kicked off on April 22 in Las Vegas, with Google Cloud CEO Thomas Kurian declaring that the experimental phase of artificial intelligence is over. Nearly 75%...
Wednesday 22 April 2026
How MediaTek will supply Marvell's next three generations of TPUs
Recent market reports indicate that Marvell is in discussions with Google regarding the development of application-specific integrated circuit (ASIC) products, including memory processing...
Wednesday 22 April 2026
Applied Materials announces Advantest as innovation partner for EPIC platform in Silicon Valley
Leading materials engineering in the semiconductor industry, Applied Materials, announced today that Advantest Corporation, a leading semiconductor test equipment supplier, will join...
Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product...
Wednesday 22 April 2026
ASM International reports 16% growth in 1Q26 revenue driven by booming AI market
ASM International reported a high revenue in the first quarter of 2026, driven by surging AI demand and its need for advanced...
Wednesday 22 April 2026
Apple taps duo behind Apple Silicon success to navigate software-hardware balance in AI era

Apple said on April 20 that Tim Cook would step down as CEO and hand over the role to John Ternus, the company's senior vice president...

Wednesday 22 April 2026
SJSemi's blockbuster IPO reorders China's chip packaging landscape
Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...