Qualcomm is reportedly in talks with Samsung Electronics about contract manufacturing of next-generation 2nm chips, discussions that could support Samsung's efforts to revive its...
China's brain–computer interface (BCI) unicorn BrainCo has completed a funding round of about CNY2 billion (US$286 million), making it the world's second-largest single BCI...
To overcome AI's limits, a bridge must be built between computer science and biology, according to Kea-Tiong Tang, a professor from Taiwan's National Tsing Hua University (NTHU) and...
Chinese authorities have reportedly asked domestic tech companies to halt orders for Nvidia's H200 AI chips, according to Reuters, signaling tighter oversight even as US...
Benefiting from strong demand for artificial intelligence (AI) smartphones and AI servers, IC testing giant Sigurd Microelectronics announced that its December 2025 revenue surpassed...
As China's auto market wrapped up 2025, disclosures from leading carmakers confirmed another milestone year. Vehicle exports are expected to surpass 7 million units, ranking first...
Nvidia has expressed optimism about resuming sales of its H200 AI chips to China, while stressing that any return to the market will proceed quietly, without public announcements...
Lyte, a robotics startup founded by former Apple engineers behind Face ID technology, has secured US$107 million in funding to advance sensing and visual recognition capabilities...
Mobileye, the Israeli autonomous driving technology company, said on January 5, 2026, that it had reached a partnership with a US automaker ranked among the world's top 10 to integrate...
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
TCL's marketing of its entry-level RGB Mini LED television has come under closer industry scrutiny after market research firm Omdia said the product does not fully adopt the RGB backlight...
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
