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Friday 18 September 2026
China's AI data center token costs hinge on access to advanced GPUs
China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent Caijing...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
China sees a second chance in VLEO as AI shifts the satellite race from chips to networks
Starlink's massive scale in conventional low-Earth-orbit (LEO) satellites has markedly reinforced the satellite giant's aggressive grip on the commercial space industry for the next...
Thursday 17 September 2026
Trumpf eyes glass as AI demand drives packaging innovation
At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
Thursday 17 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia

Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open...

Thursday 17 September 2026
Apple's AI ambitions are outgrowing the Mac — Nvidia may hold the key
Apple is exploring a return to the enterprise server market with an AI inference system built around future M8 Ultra chips, potentially using Nvidia's NVLink Fusion interconnect te...
Wednesday 16 September 2026
DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a...
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
Commentary: China's US$4.5 trillion electronics target confronts the limits of manufacturing scale

Where will China's electronics manufacturing industry find growth over the next five years? The answer is taking shape in the 15th Five-Year...

Wednesday 16 September 2026
DeepSeek to hire its first CFO as it aims for public listing, expands workforce

DeepSeek is reportedly set to hire Wentao Yan, a partner at venture capital firm GL Ventures, as its first CFO. If the appointment takes...

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Wednesday 16 September 2026
DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...