The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization...
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...
Malaysia's push to move from assembling chips to owning the designs behind them has reached the point where it must find buyers. On October 16, the government unveiled six semiconductor...
On October 16, Japan's Ministry of Economy, Trade and Industry (METI) approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3nm logic chips at its second...
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether...
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the...
Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
