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Friday 7 August 2026
China launches review of Palo Alto Networks as trade tensions with US escalate
China's cyberspace authority said it has begun to scrutinize products sold by US cybersecurity company Palo Alto Networks within the country, citing risks to national security and...
Friday 7 August 2026
LG plans three-tier AI chips for appliances, home robots

LG Electronics plans to develop premium, midrange and entry-level on-device AI chips for products ranging from refrigerators and washing...

Friday 7 August 2026
Nvidia denies report of seeking China AI-RAN partners for 6G networks

Nvidia is seeking Chinese telecom equipment partners to develop 6G AI radio access network base stations for overseas markets, according...

Friday 7 August 2026
V5 July revenue reaches NT$273 million on AI chip demand, packaging expansion
V5 Technologies reported record consolidated revenue of NT$273 million in July 2026, as demand for AI chips and semiconductor packaging capacity expansion lifted orders. Revenue rose...
Thursday 6 August 2026
GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
GlobalFoundries (GF) often presents itself as an essential pillar of US semiconductor sovereignty. That claim is partly true, but requires qualification.
Thursday 6 August 2026
Chunghwa Precision Test posts record July revenue on AI chip demand
Chunghwa Precision Test Tech. reported record monthly revenue in July 2026, as demand for AI and high-performance computing (HPC) testing products rose across data center and cloud...
Thursday 6 August 2026
Anthropic builds in-house chip design team, signaling AI firms' turn to custom silicon

Anthropic is building an in-house team to design custom chips for its Claude AI models, according to Reuters, moving ahead...

Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Wednesday 5 August 2026
Anthropic's scramble for compute is reshaping how AI labs finance their chips

Anthropic's US$10 billion computing agreement with seven-month-old startup Volta Infra Holdings Ltd. is the latest sign that the Claude...

Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026
AMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips
AMD used its second-quarter 2026 results to reinforce a broader argument: that it can replicate in AI accelerators the market-share gains it has already made in server central processing...
Tuesday 4 August 2026
China’s in-house auto chip push could reshape costs, supply chains, and regulatory risks
As Chinese automakers accelerate in-house chip development, the strategy is increasingly about more than smart vehicles. It is also tied to supply chain self-reliance, overseas expansion,...
Monday 3 August 2026
Amazon deepens OpenAI ties with US$50B AWS expansion
Amazon has completed the latest round of its US$50 billion investment in OpenAI, fully funding an originally conditional financing package that gives it about a 5% stake in the company...
Monday 3 August 2026
Research insight: Robotaxis, AI chips and shared platforms accelerate AIDV commercialization
DIGITIMES Intelligence observed at the 2026 World Artificial Intelligence Conference (WAIC) that AI is rapidly reshaping the direction of the automotive industry. Competition in vehicle...
Monday 3 August 2026
xLight bets on EUV light source, eyes ASML deal
The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...