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NEWS TAGGED CHIPS
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
Tuesday 1 September 2026
Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs
Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to...
Tuesday 1 September 2026
Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers
Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
Tuesday 1 September 2026
Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning...
Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Tuesday 1 September 2026
Nvidia's MediaTek investment signals broader push to shape AI infrastructure
Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure...
Monday 31 August 2026
Update: SK Hynix breaks silence on Japan expansion rumors
To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Monday 31 August 2026
US weighs limits on China's access to chips in overseas data centers
US restrictions on China's access to advanced computing could expand beyond physical chip shipments to the remote use of computing resources, potentially increasing compliance requirements...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
Musk tackles key AI power bottleneck with in-house turbine foundry
A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
Monday 31 August 2026
AI smart glasses race heats up as MEMS enable wearability
Once mocked as "computers on the nose bridge," AI smart glasses have long suffered from a trade-off between advanced AI capabilities and lightweight comfort. However, this race is...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...