ByteDance is in talks to buy AI chips from Shanghai-based Iluvatar CoreX and is also considering using Baidu's Kunlunxin chips, as...
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...
Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand...
Nvidia has begun telling Chinese clients that its new Vera central processing unit (CPU) could be available as soon as August and that...
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point...
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...
