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    Taiwanese suppliers expand China capacity with AI components in focus
    11h 46min ago
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    11h 46min ago
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    11h 46min ago
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
    11h 46min ago
    Tactical drone market shifts as startups and incumbents compete and cooperate
    11h 47min ago
    NEWS TAGGED CHIPS
    Monday 24 August 2026
    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
    Monday 24 August 2026
    Nvidia reportedly weighs Perplexity investment as AI strategy expands beyond chips
    Nvidia is reportedly in discussions to invest in artificial intelligence startup Perplexity as part of a funding round that would value the company at more than US$30 billion, underscoring...
    Monday 24 August 2026
    Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

    Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

    Monday 24 August 2026
    MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
    Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
    Monday 24 August 2026
    Jeilin shifts upmarket as high-end image SoCs drive margins higher
    Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

    Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

    Monday 24 August 2026
    AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
    Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
    Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
    Friday 21 August 2026
    Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

    Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

    Friday 21 August 2026
    Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

    At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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