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Monday 31 August 2026
SK Hynix explores Japanese expansion to meet global AI chip demand
To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Monday 31 August 2026
US weighs limits on China's access to chips in overseas data centers
US restrictions on China's access to advanced computing could expand beyond physical chip shipments to the remote use of computing resources, potentially increasing compliance requirements...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
Musk tackles key AI power bottleneck with in-house turbine foundry
A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
Monday 31 August 2026
AI smart glasses race heats up as MEMS enable wearability
Once mocked as "computers on the nose bridge," AI smart glasses have long suffered from a trade-off between advanced AI capabilities and lightweight comfort. However, this race is...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
Friday 28 August 2026
Apple's M6 marks a transitional step before wider 2nm adoption
Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
Anthropic sets sights on custom hardware to fuel AI ambitions, reportedly eyed $7B MatX deal
In an effort to accelerate its custom silicon initiative and curb reliance on external hardware suppliers, artificial intelligence developer Anthropic held discussions to acquire AI...
Friday 28 August 2026
Huawei's Ascend 910C sold out in China, but Nvidia's H200 supply gap persists
Huawei's Ascend 910C is already sold out in China, but domestic chips still cannot fully replace Nvidia's H200s. The shortage matters beyond China because AI compute constraints, pricing,...
Friday 28 August 2026
Exemption that shields US$143 billion of US server imports is now on the table
For all the noise Donald Trump has made about taxing semiconductors, the measure that actually took effect in January 2026 barely touched the machines the AI build-out runs on. A 25%...
Friday 28 August 2026
Insight: China's next AI frontier is silicon, not smarter models
For the past two years, China's AI companies have competed on a single axis: whose model performs best. That contest is starting to give way to a harder one — whether those models...
Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...