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Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
Friday 31 July 2026
AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026
WAIC 2026 unveils AIDV shift as physical AI gains ground
DIGITIMES Intelligence said its observations at the 2026 World Artificial Intelligence Conference (WAIC) show the automotive industry's transformation moving from software-defined...
Friday 31 July 2026
UMC raises capex to US$2B, eyes AI SiPh
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...
Friday 31 July 2026
Qualcomm, MediaTek set Sept flagship SoC showdown
Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
Qualcomm to supply compute chips for BMW's next-gen vehicles through 2030s
Qualcomm Technologies and BMW Group have signed a long-term agreement under which Qualcomm will supply compute silicon for BMW's next-generation digital cockpit and advanced driver...
Thursday 30 July 2026
Arm's AI-driven data center growth offsets smartphone weakness, but softer handset outlook weighs on shares
Arm Holdings reported stronger-than-expected first-quarter results as demand for AI and data center chips lifted licensing and royalty revenue. However, the company's warning of slower...
Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
Nvidia's Jensen Huang warns US officials about banning Chinese open-weight models

Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official...

Wednesday 29 July 2026
Moonshot AI reportedly eyes more Nvidia Blackwell chips for Kimi K4 despite US export curbs

Chinese AI startup Moonshot AI is planning its next frontier model, Kimi K4, and is seeking additional access to Nvidia's advanced...

Wednesday 29 July 2026
China chip substitution accelerates as chill effect looms
China's semiconductor self-reliance push has notched new gains, with Chinese AI giants expanding purchases of domestic AI chips and facing direct pressure from Beijing to use more...
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget...
Wednesday 29 July 2026
Huawei targets 2027 glass substrate production to gain an edge in AI chips

Huawei is reportedly working through its domestic supply chain to begin mass production of semiconductor glass substrates in 2027,...

Wednesday 29 July 2026
Samsung reveals battery life, durability details for smart glasses coming this fall
Samsung Electronics has shared new details about its upcoming smart glasses, including battery life and durability specifications, as the company moves to get ahead of privacy concerns...