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Tuesday 30 June 2026
Taiwan reportedly expands AI server smuggling probe, searches Supermicro and listed firms

Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China,...

Tuesday 30 June 2026
Expected MCU price hike drives early 1H26 pull-ins

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply...

Tuesday 30 June 2026
OpenAI IPO filing exposes US$665bn spending web and Altman conflict risks

OpenAI has confidentially filed for an initial public offering with the US Securities and Exchange Commission (SEC), setting the stage...

Tuesday 30 June 2026
Arm says it tops 50% share in hyperscale cloud as x86 grip slips

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long...

Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026
BYD's 4nm smart-driving chip signals deeper EV supply-chain integration

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's...

Monday 29 June 2026
China's first diamond semiconductor supply chain project lands in Zhengzhou

China is accelerating its push into fourth-generation semiconductors, with the country's first fully integrated industrial project...

Monday 29 June 2026
Musk backs Cook as AI memory crunch drives Apple price hikes

Apple has abruptly raised prices for Mac computers, iPads, and Vision Pro in the US, underscoring how the AI infrastructure boom is...

Monday 29 June 2026
Hsinchu Science Park draws new semiconductor service investments as chipmaking shifts to advanced nodes

Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...

Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...

Saturday 27 June 2026
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving

China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...
Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...