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Wednesday 26 August 2026
Trump weighs Apple China chip deal as CXMT runs full
Apple is seeking to diversify its supply chain to ease pressure from rising memory costs and has reportedly sought US government clearance to buy memory from blacklisted Chinese chipmaker...
Wednesday 26 August 2026
Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition
Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...
Wednesday 26 August 2026
Kyocera to ramp up MLCC production for AI servers with JPY60B investment
Japanese components maker Kyocera is making a major push to capture surging AI demand. As part of its mid-term growth strategy toward FY2031, the company plans to begin mass production...
Wednesday 26 August 2026
Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm
Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
Wednesday 26 August 2026
Taiwan maps four AI-led strategies to expand its biotech sector
Taiwan's Ministry of Economic Affairs outlined four strategies to scale up the island's biotech industry at a strategy meeting under the Executive Yuan on August 24. The plan centered...
Wednesday 26 August 2026
Samsung, Intel widen AI chip battle into memory, packaging
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
Wednesday 26 August 2026
China's advanced-chip gap could close well before its lithography gap does
As China enters a near-frenzied state of continuous production-capacity expansion, it is easy to see that the main driver behind these aggressive, purpose-built movements in the domestic...
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...
Tuesday 25 August 2026
Tesla senior chip engineer joins DensityAI as in-house plans face more strain
Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
Tuesday 25 August 2026
Anthropic bets on in-house chips, reshaping ASIC orders
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
Tuesday 25 August 2026
China foundry Nexchip breaks beyond display chips: CIS reaches 25% of revenue
Nexchip Semiconductor reported higher first-half 2026 revenue as broadening demand for CMOS image sensors, power management chips and display drivers diversified its product mix, even...
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
Monday 24 August 2026
Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
Monday 24 August 2026
Nvidia reportedly weighs Perplexity investment as AI strategy expands beyond chips
Nvidia is reportedly in discussions to invest in artificial intelligence startup Perplexity as part of a funding round that would value the company at more than US$30 billion, underscoring...
Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...