CONNECT WITH US
NEWS TAGGED CHIPS
Tuesday 9 June 2026
TSMC capacity crunch pushes Google, Nvidia closer to Intel
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tuesday 9 June 2026
Tencent takes dual-track AI chip route with Canghai V2 and domestic partnerships
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Tuesday 9 June 2026
Cooling parts maker Global PMX wins AI server liquid-cooling supply and expects high-margin shipments in second half
Automotive power and safety parts manufacturer Global PMX said it secured placements in the supply chains of leading AI chip and rack makers and expected a wave of high-margin liquid-cooling...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
HiSilicon chip price hikes put China's AI compute supply chain back in focus
Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after...
Tuesday 9 June 2026
Samsung is already shipping HBM4 for Vera Rubin — and is now negotiating HBM5 and next-gen foundry with Nvidia
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue...
Monday 8 June 2026
China analog IC maker Shanghai Belling raises prices by up to 30%, signaling chip market recovery
Shanghai Belling, a Chinese analog IC supplier, has announced price adjustments for some of its products starting June 9, 2026, with increases ranging from 10% to 30%. The move is...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
Friday 5 June 2026
Nvidia deepens humanoid robotics role with Unitree and Cosmos 3, secures AI chips
Nvidia is moving deeper into humanoid robotics, combining robot hardware, secure computing, world models and developer platforms as AI shifts from digital workloads to physical AI.
Friday 5 June 2026
South Korea finalizes US$520 million on-device AI chip budget amid industry doubts
South Korea has finalized the budget for a state-backed on-device AI chip development project at KRW800.23 billion (US$520 million), about KRW200 billion below an earlier proposal,...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...