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NEWS TAGGED CHIPS
Friday 16 October 2026
Samsung to break ground on second Texas chip fab in November
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
Friday 16 October 2026
Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Friday 16 October 2026
Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear
Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether...
Friday 16 October 2026
AI power crunch drives data center demand for self-generation
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
Friday 16 October 2026
MediaTek ASIC deal with ByteDance would expand data center push
ByteDance is in advanced talks with MediaTek to purchase custom data center chips, with the companies potentially reaching an agreement soon, according to people familiar with the...
Friday 16 October 2026
Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition
Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...
Thursday 15 October 2026
TSMC bars capacity resale, aims to leave no AI money on the table
TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still...
Thursday 15 October 2026
Applied Materials CEO says agentic AI drives wafer demand
Applied Materials CEO Gary Dickerson said customer demand to produce more good dies per wafer and rapidly expand wafer output has reached levels unprecedented in his career, driven...
Thursday 15 October 2026
Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Thursday 15 October 2026
Synopsys CEO says fully autonomous AI chip design remains out of reach
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
Taiwanese chipmaker TASC targets 2027 growth with InP optical chips, glucose sensors nearing mass production
Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has...
Thursday 15 October 2026
Vietnam's FPT courts Toyota Tsusho unit to sell its power chips in Southeast Asia, India
Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond...
Thursday 15 October 2026
AI chip complexity is widening opportunities for semiconductor equipment makers
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
Thursday 15 October 2026
Applied Materials targets US$5 billion advanced packaging revenue
Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the...