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Monday 9 March 2026
Industry mulls thicker HBM standards for 20-layer stacks
Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
Monday 9 March 2026
US weighs global AI chip export licensing to curb third-country diversion
The White House is reportedly drafting a new regulatory framework that would tighten US oversight of global AI chip exports. This move could reshape how advanced computing power is...
Monday 9 March 2026
Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity...

Monday 9 March 2026
OpenAI, Oracle rethink Texas expansion, though Stargate buildout continues
OpenAI and Oracle's decision to drop a planned expansion at their flagship Texas AI campus highlights the shifting economics and technology cycles of large-scale AI infrastructure...
Sunday 8 March 2026
Applied Materials VP warns AI growth may hit energy, not chip limits
AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
Sunday 8 March 2026
Defense chips, satellite systems now "100% localized," Chinese academics say

As conflict in the Middle East intensifies and geopolitical risks rise, governments worldwide are paying closer attention to the resilience...

Friday 6 March 2026
Nvidia's LPU push could reshape inference economics as OpenAI signals major buy
Nvidia plans to shift the AI compute battleground from training to inference by integrating language processing unit technology and offering multiple inference chips, with OpenAI agreeing...
Friday 6 March 2026
Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
Friday 6 March 2026
Taiwan refocuses nearly US$9.5bn chip program on drone, robotics and LEO satellite chips
US and Israeli strikes on Iran have sharply raised tensions in the Middle East. The operation seeks to weaken Iran's military capability and reshape the regional balance, but with...
Friday 6 March 2026
US considers global licensing regime for AI chips, tying exports to investment pledges
The Trump administration is currently drafting stringent new regulations that would require US approval for virtually all global exports of artificial intelligence accelerators from...
Friday 6 March 2026
China's mature process chip investments alarm Taiwan; government urged to audit local firms' China production
Taiwan's Legislative Yuan has yet to review the 2026 central government budget amid political deadlock, but lawmakers have raised concerns over China's massive subsidies and capacity...
Friday 6 March 2026
Hangzhou signs US$3.7b AI GPU deal: China's multi-vendor chip strategy

On February 28, Hangzhou convened an AI development summit at the Hangzhou Civic Center aimed at positioning the city as China's leading...

Thursday 5 March 2026
PC chip orders pull forward, blurring the 2026 seasonal cycle

In recent weeks, Taiwanese IC design companies have indicated during earnings calls that advance stocking across the IT industry has been...

Thursday 5 March 2026
Broadcom says move into rack shipments won't dent margins, signals deeper customer deals, and supply confidence
Broadcom's pivot to shipping complete AI racks — not just chips — will be a meaningful operational shift but one the company says is already priced into its margins and...
Thursday 5 March 2026
Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia

In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...