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Wednesday 17 June 2026
China PCB maker DSBJ bets US$1.2 billion on AI optical modules
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing...
Wednesday 17 June 2026
Kaynes' Japan push signals India's bid to become an alternative chip packaging hub

India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold...

Wednesday 17 June 2026
Nexchip reportedly broadens semiconductor ambitions with new design and materials subsidiary

Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its...

Wednesday 17 June 2026
Nvidia highlights role of optical networking as Coherent breaks ground on Texas AI chip facility
AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could...
Wednesday 17 June 2026
Ajinomoto's chip film faces supply test as AI demand climbs

The global appetite for AI chips is putting new strain on materials suppliers, turning one of Ajinomoto's lesser-known products into...

Wednesday 17 June 2026
Huawei raises end-consumer product prices from July
Huawei has notified partners and channel distributors that it will raise end-customer prices across its Intelligent Collaboration product line from July 1 this year, as the AI computing...
Tuesday 16 June 2026
China's Nexchip breaks into foundry top eight after AI demand lifts market to record numbers
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip...
Tuesday 16 June 2026
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility...
Tuesday 16 June 2026
Qualcomm weighs Tenstorrent deal that could reach US$10 billion

Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Information reported, citing a person with direct...

Tuesday 16 June 2026
Huawei's PanguLM comeback hinges on Richard Yu after credibility hit
Huawei is trying to restore the profile of PanguLM at a time when China's large AI model race is entering a tougher phase.
Tuesday 16 June 2026
ByteDance in talks for Iluvatar, Baidu Kunlunxin AI chips as Doubao demand grows

ByteDance is in talks to buy AI chips from Shanghai-based Iluvatar CoreX and is also considering using Baidu's Kunlunxin chips, as...

Tuesday 16 June 2026
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026
Kioxia surpasses Toyota, eyes M&A push in face of AI boom
NAND flash memory supplier Kioxia Holdings has surpassed Toyota Motor in market capitalisation, becoming Japan's most valuable company. The development highlights how the global artificial...
Tuesday 16 June 2026
Samsung reportedly deepens foundry ties with Elon Musk's companies as turnaround timeline pushes toward 2028
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging...
Tuesday 16 June 2026
TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...