TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...
China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and...
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
LG Display (LGD) has reportedly continued developing microLED technology despite Apple Inc. ending its microLED project, though it has put large-scale mass-production investment on...
A research team at Yale University in the US has found that flowing networks made of water or other fluids can store memory like computer chips, leading to the development of a fluidic...
China is proposing to extend AI technology export controls to chip design, memory technologies, and large-scale computing clusters, introducing specific technical thresholds for ea...
The 2026 OCP Global Summit, held from October 12 to 15 in San Jose, California, highlighted a shift from open server hardware to open AI infrastructure. Rack-scale standardization...
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
Tesla's dealings with Samsung and Taiwan Semiconductor Manufacturing Co. (TSMC) are highlighting tensions between chip designers and foundries as demand for AI processors accelerates...
Malaysia's push to move from assembling chips to owning the designs behind them has reached the point where it must find buyers. On October 16, the government unveiled six semiconductor...
On October 16, Japan's Ministry of Economy, Trade and Industry (METI) approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3nm logic chips at its second...
Samsung Electronics plans to begin construction of its second semiconductor fabrication plant in Taylor, Texas, in November 2026, moving ahead with its US foundry expansion as its...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Two workers have died, and a third remains in serious condition after an explosion at Intel's Kiryat Gat chip plant in southern Israel on October 14. Intel has not yet said whether...
The focus of the global AI race has shifted from securing advanced chips to securing access to electricity, with electrical power now becoming the deciding factor for computing capacity...
