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    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    Sep 2, 17:54
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    Sep 2, 17:54
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    Sep 2, 17:54
    AI buildout lifts demand for China high-speed optical module makers
    Sep 2, 17:54
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    Sep 2, 17:54
    NEWS TAGGED CHIPS
    Wednesday 2 September 2026
    TCL CSOT bets on InP laser chips as supply tightens
    Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
    Wednesday 2 September 2026
    AI demand push expands wafer industry's growth outlook
    AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

    Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

    Tuesday 1 September 2026
    Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
    DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
    Tuesday 1 September 2026
    Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs
    Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to...
    Tuesday 1 September 2026
    Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers
    Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
    Tuesday 1 September 2026
    Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll
    Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning...
    Tuesday 1 September 2026
    India expands chip ambitions with full Semicon 2.0 notification
    India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
    Tuesday 1 September 2026
    Taiwan's G2C+ Alliance members target global markets
    Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
    Tuesday 1 September 2026
    Nvidia's MediaTek investment signals broader push to shape AI infrastructure
    Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure...
    Monday 31 August 2026
    Update: SK Hynix breaks silence on Japan expansion rumors
    To capture surging global demand for memory chips driven by artificial intelligence (AI), SK Hynix is actively exploring manufacturing and investment options in Japan.
    Monday 31 August 2026
    ASE: CPO scale-out demands deeper supply-chain coordination for mass production
    SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
    Monday 31 August 2026
    US weighs limits on China's access to chips in overseas data centers
    US restrictions on China's access to advanced computing could expand beyond physical chip shipments to the remote use of computing resources, potentially increasing compliance requirements...
    Monday 31 August 2026
    Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
    On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
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