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Tuesday 1 September 2026
Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 18 August 2026
MicroLED still lacks key LTPO TFT tech

MicroLED remains a promising next-generation display technology, but industry analysts say its commercial breakthrough still hinges...

Saturday 8 August 2026
Taiwan team builds high-performance MoS2 transistor to ease 2D semiconductor limits
Taiwan researchers announced on August 6 that they had developed a high-performance monolayer molybdenum disulfide (MoS2) top-gate transistor designed to address a long-standing interface...
Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Tuesday 21 July 2026
Huawei Kirin 9030 shows SMIC's 7nm gains and ongoing efficiency gap
A teardown of Huawei's Kirin 9030 flagship processor — built on SMIC's 7nm-class N+3 process — reveals continued density progress from China's leading chipmaker, but a...
Friday 10 July 2026
TSMC, ASML, and Imec target 2D chip mass production in Taiwan within five years

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor...

Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...

Friday 3 July 2026
Intel takes aim at TSMC's CoWoS lead with EMIB-T
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...
Thursday 2 July 2026
Samsung showcases 3D stacked transistor breakthrough for next-gen chips

Samsung Electronics has unveiled new research on a three-dimensional transistor architecture that it says could help extend logic chip...

Thursday 2 July 2026
IBM's 0.7nm chip claim revives debate over semiconductor node naming

As semiconductor manufacturing enters the 2nm era, conventional transistor scaling is approaching its physical limits. On June 25,...

Friday 26 June 2026
IBM breaks sub-1nm barrier with 3D nanostack transistor platform
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Tuesday 16 June 2026
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
Wednesday 10 June 2026
Empowering innovation: Female engineers rise in Taiwan's semiconductor industry

The global semiconductor industry is undergoing profound transformation-not only in process technologies and transistor density, but also in the composition of its workforce...