Micron Technology and China's CXMT have taken sharply different approaches to next-generation DRAM scaling, exposing a divide over the commercial viability of 4F-squared memory-cell...
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms,...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan...
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Huawei's Kirin 9050 Pro is the first commercial test of its Tau Scaling Law, with the company claiming a 55% increase in transistor density at the same process node while cutting NPU,...
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
