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Wednesday 10 June 2026
Empowering innovation: Female engineers rise in Taiwan's semiconductor industry

The global semiconductor industry is undergoing profound transformation-not only in process technologies and transistor density, but also in the composition of its workforce...

Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Thursday 28 May 2026
Huawei chip chief says post-Moore race is no longer just about nanometers
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission...
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious...
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...
Monday 25 May 2026
Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect,...
Friday 10 April 2026
Column: Corintis uses algorithms to target chip hotspots for precise cooling
As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
Monday 30 March 2026
SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward
Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.
Monday 30 March 2026
DRAM scaling hits limits as next-generation memory faces delays

The global DRAM industry is approaching a structural inflection point, as traditional scaling methods struggle to deliver the performance...

Thursday 12 March 2026
IBM, Lam Research join forces on sub-1nm logic and High-NA EUV development

IBM and Lam Research have announced a five-year collaboration to develop materials, manufacturing processes, and High-NA EUV lithography...

Wednesday 18 February 2026
Analysis: 2nm shifts chipmaking from scaling to chiplet integration

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance...

Sunday 8 February 2026
GlobalFoundries reinvent wafer services by integrating IP to meet evolving market demands
The traditional wafer foundry model is transforming as leading foundries increasingly incorporate intellectual property (IP) into mature technology nodes to address economic pressures...
Tuesday 30 December 2025
TSMC hits its 2nm milestone on schedule as China flexes military muscle
TSMC today announced that its highly anticipated 2nm (N2) technology began volume production in the fourth quarter of 2025, meeting its roadmap targets precisely on schedule.
Tuesday 30 December 2025
South Korea charts road to 0.2nm chips by 2040
The global semiconductor industry is poised to enter the "angstrom era" by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap...
Saturday 20 December 2025
Samsung reveals sub-10nm DRAM breakthrough targeting 0a, 0b nodes
Samsung Electronics has unveiled a key technology pathway for sub-10nm DRAM, offering a rare public look at how the company plans to push memory scaling beyond current 10nm-class limits...