Thursday 7 December 2023
Taiwan chip foundries' existing China investment not affected by latest core key tech ban
Advanced semiconductor manufacturing technology under 14nm was included in the list of 22 key core technologies to be banned from illegal outflows to foreign adversaries on December...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Tuesday 15 August 2023
Samsung reveals current situation and challenges of BSPDN, a key technology in the 2nm race
As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...
Thursday 27 July 2023
Samsung reportedly investing in R&D for 3D stacking GAA technology
After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...